Wiring board and mounting structure

Abstract

A wiring board according to the present disclosure includes: an insulating layer; a conductor layer that includes a signal conductor, a ground conductor, and a power conductor; a plurality of via-hole conductors; and a via-hole conductor connection part. A portion of the signal conductor includes a first wiring group having a plurality of wirings extending to a region between a first connection part and a second connection part, and a second wiring group having a plurality of wirings extending to a region between the second connection part and a third connection part. The first wiring group includes a first portion extending from a region between the second connection part and a fifth connection part across a region between the fifth connection part and a sixth connection part, and a second portion extending to a region between a fourth connection part and the fifth connection part. The second wiring group has a third portion extending to a region between the fifth connection part and the sixth connection part, and a fourth portion extending to a region between the third connection part and the sixth connection part.

Description

[Technical Field]

[0001] The present invention relates to a wiring board and a mounting structure. [Background technology]

[0002] In a conventional wiring board such as that described in Patent Document 1, a signal conductor that transmits an electrical signal between an electronic component and the wiring board is connected to a signal pad, one of the pads that electrically connects the electronic component and the wiring board, via a signal via hole conductor located directly below the signal pad.

[0003] In such conventional wiring boards, signal conductors are typically routed from the inside of the board to the outside and connected to pads located inside and outside the board. However, for pads located inside the board, such as those located at the corners of the mounted device, the routed signal conductors tend to be densely packed and overlap, making it impossible to route all of the signal conductors. To route all of the signal conductors, some of the signal conductors must be routed down to lower layers via via conductors before being routed. As a result, the number of layers in the wiring board increases, which can increase the inductance of the signal conductors and degrade signal transmission characteristics. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 10-335532 Summary of the Invention [Means for solving the problem]

[0005] A wiring board according to the present disclosure includes an insulating layer having a first surface and a second surface opposite the first surface, a conductor layer including a plurality of signal conductors, ground conductors, and power conductors located on the first surface, a plurality of via-hole conductors penetrating the insulating layer and located from the first surface to the second surface, and a via-hole conductor connection portion located on the first surface and connecting some of the plurality of via-hole conductors to at least one of the ground conductors and the power conductors. The plurality of signal conductors are elongated conductors having first and second ends. The first surface of the insulating layer includes a first region where the via-hole conductor connection portion is located, a second region where the first ends of the plurality of signal conductors located in the first region are located, and a third region where the second ends of the plurality of signal conductors located in the first region are located. In a plan view, the first region is located between the second region and the third region, and in the first region, the via-hole conductor connection portions are arranged in a grid pattern in a first direction along the longitudinal direction in which the first ends of the multiple signal conductors in the second region are aligned, and in a second direction intersecting the first direction. Some of the via-hole conductor connection portions include a first connection portion, a second connection portion adjacent to the first connection portion in the first direction, a third connection portion adjacent to the second connection portion in the first direction, a fourth connection portion adjacent to the first connection portion in the second direction, a fifth connection portion adjacent to the fourth connection portion in the first direction, and a sixth connection portion adjacent to the fifth connection portion in the first direction. Some of the signal conductors include a first wiring group having multiple wirings extending in a region between the first connection portion and the second connection portion, and a second wiring group having multiple wirings extending in a region between the second connection portion and the third connection portion. The first wiring group has a first portion extending from the region between the second connection portion and the fifth connection portion to the region between the fifth connection portion and the sixth connection portion, and a second portion extending to the region between the fourth connection portion and the fifth connection portion. The second wiring group has a third portion extending to the region between the fifth connection portion and the sixth connection portion, and a fourth portion extending to the region between the third connection portion and the sixth connection portion. The first surface of the insulating layer has a rectangular fourth region that overlaps the mounting region in a planar perspective view, and the second region has a corner portion located at a corner of the fourth region and a side portion located along a side of the fourth region. The multiple signal conductors include first signal conductors having a first end located at the corner portion and a second end located in a third region near the corner of the first surface, and second signal conductors having a first end located at the side portion, and by reducing the length of the first signal conductors, the number of turning points at which the first signal conductor changes its extension direction is fewer than the number of turning points at which the second signal conductor changes its extension direction.

[0006] A mounting structure according to the present disclosure includes the above-described wiring board and an electronic component located in a mounting area of ​​the wiring board. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a plan view showing a main part of a conductor layer located on a first surface of an insulating layer in a wiring board according to an embodiment of the present disclosure. [Figure 2] 3 is a schematic diagram showing a state in which a conductor layer is laminated on a first surface of an insulating layer. FIG. [Figure 3] 2 is an enlarged explanatory view for explaining an area X shown in FIG. 1. FIG. [Figure 4] 10 is a plan view showing a main part of a conductor layer located on a first surface of an insulating layer in a wiring board according to another embodiment of the present disclosure. FIG. [Figure 5] 10 is a plan view showing a main part of a conductor layer located on a first surface of an insulating layer in a wiring board according to still another embodiment of the present disclosure. FIG. [Figure 6] 1 is a cross-sectional view showing a mounting structure according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0008] In conventional wiring boards such as those described in Patent Document 1, signal conductors are generally routed from the inside of the board to the outside and connected to pads located inside and outside the board. However, for pads located inside the board, such as those located at the corners of a mounted device, the routed signal conductors are densely packed and overlap, making it impossible to route all of the signal conductors. To route all of the signal conductors, some of the signal conductors must be routed to lower layers via via conductors before being routed. As a result, the number of layers in the wiring board increases, which may increase the inductance of the signal conductors and degrade signal transmission characteristics. Therefore, there is a need for a wiring board that allows signal conductors to be routed without increasing the number of layers and that can reduce the inductance of the signal conductors.

[0009] In the wiring board according to the present disclosure, the signal conductors are drawn out without increasing the number of layers, and the inductance of the signal conductors is small. Therefore, in the wiring board according to the present disclosure, the signal waveform is less likely to deviate from a rectangular shape. Furthermore, since the wiring board according to the present disclosure can maintain the signal waveform as a rectangular shape, the quality of the signal waveform is high, and malfunction of the mounted elements can be reduced.

[0010] The mounting structure according to the present disclosure has high quality signal waveforms and can reduce malfunctions of electronic components such as mounted elements.

[0011] A wiring board according to an embodiment of the present disclosure will be described with reference to FIGS. 1 to 3. FIG. 1 is a plan view showing a main part of a conductor layer located on a first surface of an insulating layer in a wiring board A according to an embodiment of the present disclosure. Specifically, FIG. 1 shows one of four equal parts divided so as to include the corners of the wiring board A, and in the drawing, the upper left corresponds to the corner of the wiring board A, and the lower right corresponds to the center of the wiring board A. FIG. 2 shows a plan view of a main part of a conductor layer located on a first surface of an insulating layer in a wiring board A according to an embodiment of the present disclosure. 1 Page 1 of 11 Conductor layer 2 1 is a schematic diagram showing a state in which via-hole conductors that are originally provided are stacked. That is, FIG. 1 is a plan view seen from the direction of arrow Z in FIG. 2. In FIG. 2, 3a , second side 12 Structures located on the side (e.g., conductor layers) 2 or other insulating layers 1 (Insulating layer for core, etc.) are omitted.

[0012] As shown in FIG. 2, a wiring board A according to one embodiment includes an insulating layer 1 and a conductor layer 2 located on a first surface 11 of the insulating layer 1. The insulating layer 1 is not particularly limited as long as it is made of an insulating material. Examples of insulating materials include resins such as epoxy resin, bismaleimide-triazine resin, polyimide resin, and polyphenylene ether resin. Two or more of these resins may be mixed. The thickness of the insulating layer 1 is not particularly limited, and is, for example, 5 μm to 100 μm in the case of a package substrate and 50 μm to 300 μm in the case of a board substrate.

[0013] The insulating layer 1 may contain a reinforcing material. Examples of the reinforcing material include insulating fabric materials such as glass fiber, glass nonwoven fabric, aramid nonwoven fabric, aramid fiber, and polyester fiber. Two or more types of reinforcing materials may be used in combination. Furthermore, the insulating layer 1 may contain dispersed inorganic insulating fillers such as silica, barium sulfate, talc, clay, glass, calcium carbonate, and titanium oxide.

[0014] Although not shown in FIG. 2, the insulating layer 1 has a plurality of via-hole conductors that penetrate the insulating layer 1 and are located from the first surface 11 to the second surface 12. 3a (figure 1) The via-hole conductor 3a is located in a via hole that penetrates from the first surface 11 to the second surface 12 of the insulating layer 1. The via-hole conductor 3a is formed of a conductor made of metal plating such as copper plating. The via-hole conductor 3a is connected to the conductor layer 2 that is located on the first surface 11 and the second surface 12 of the insulating layer 1. The via-hole conductor 3a may be located only on the inner wall surface of the via hole, or may fill the via hole.

[0015] The conductor layer 2 is located on the first surface 11 of the insulating layer 1. As shown in Fig. 1, the conductor layer 2 includes signal conductors 2s, ground conductors 2g, and power conductors 2p. The thickness of the conductor layer 2 is not particularly limited, and is, for example, 3 µm or more and 30 µm or less in the case of a package substrate, and 10 µm or more and 50 µm or less in the case of a board substrate.

[0016] The signal conductor 2s has a function of transmitting a signal. A The impedance values ​​are adjusted to be as consistent as possible throughout the entire conductor, thereby reducing loss when a signal is transmitted through the signal conductor 2s.

[0017] The signal conductor 2s is located in a first region 21, which will be described later, and both ends are located in regions other than the first region 21. That is, both ends (a first end 2s1 and a second end 2s2) of the signal conductor 2s are located apart from each other with the first region 21 in between. In this specification, the ends of the signal conductor 2s that are located on the wiring board A The end portion closer to the center of the wiring board is defined as a first end 2s1. A The end closest to the outside of the signal conductor 2s is referred to as the second end 2s2. The first end 2s1 and the second end 2s2 are connected to lands that are part of the conductor layer 2 and are located in a second region 22 and a third region 23, which will be described later. The region on the first surface 11 of the insulating layer 1 where the first end 2s1 of the signal conductor 2s is located is referred to as the second region 2s2. 22 The region where the second end 2s2 of the signal conductor 2s is located is defined as a third region. 23 Let's say.

[0018] The ground conductor 2g functions to match the impedance of the signal conductor 2s and reduce noise interference with the signal conductor 2s. The power conductor 2p functions as a charge supply path. For this reason, it is advantageous to place the power conductor 2p directly below and around the mounting area close to the electronic components, as this reduces electrical resistance. In FIG. 2, the ground conductor 2g and the power conductor 2p are shown in specific positions for convenience's sake. In FIG. 2, the power conductor 2p may be located at the location indicated by the ground conductor 2g, or the ground conductor 2g may be located at the location indicated by the power conductor 2p. In the conductor layer 2, the conductor other than the signal conductor 2s is at least one of the ground conductor 2g and the power conductor 2p.

[0019] A portion of the via-hole conductor 3a is connected to at least one of the ground conductor 2g and the power conductor 2p. As shown in Fig. 1, via-hole conductor connections 3, which are connections between a portion of the via-hole conductor 3a and at least one of the ground conductor 2g and the power conductor 2p, are arranged in a grid pattern along the first surface 11. The region of the first surface 11 of the insulating layer 1 where the via-hole conductor connections 3 are located is referred to as a first region 21.

[0020] In the first region 21, the signal conductors 2s and the via-hole conductor connection portions 3 are positioned so as not to overlap. That is, the signal conductors 2s are drawn from the first end 2s1 to the second end 2s2 so as to pass between the via-hole conductor connection portions 3 positioned in a lattice pattern. A portion of the via-hole conductor connection portion 3 may be surrounded by multiple signal conductors 2s. This is advantageous in that the via-hole conductor connection portion 3 can be arranged in a narrow region. The signal conductors 2s may include paired wirings. In the portion where paired wirings are used as the signal conductors 2s, it is advantageous in that the via-hole conductor connection portions 3 are not interposed between the wires constituting the paired wiring, as this improves the signal characteristics.

[0021] In the signal conductor 2s, the pitch of the first ends 2s1 may be smaller than the pitch of the second ends 2s2. If the pitch of the first ends 2s1 is smaller than the pitch of the second ends 2s2, it is advantageous in that it can accommodate elements having higher density electrodes, for example, when elements are mounted near the top of the second region 22 where the first ends 2s1 are arranged.

[0022] In the wiring board A according to one embodiment, there is a portion in which a part of the via-hole conductor connection portion 3 and a part of the signal conductor 2s have the following structure. As shown in Fig. 3, the part of the via-hole conductor connection portion 3 is composed of a first connection portion 31, a second connection portion 32, a third connection portion 33, a fourth connection portion 34, a fifth connection portion 35, and a sixth connection portion 36. Fig. 3 is an enlarged explanatory view for explaining region X shown in Fig. 1.

[0023] The second connection portion 32 is located at a position closer to the first connection portion 31 than the first connection portion 31. 31The third connection portion 33 is adjacent to the second connection portion 32 in the first direction. The fourth connection portion 34 is adjacent to the first connection portion 31 in the second direction. The fifth connection portion 35 is adjacent to the fourth connection portion 34 in the first direction. The sixth connection portion 36 is adjacent to the fifth connection portion 35 in the first direction. That is, the first connection portion 31, the second connection portion 32, the third connection portion 33, the fourth connection portion 34, the fifth connection portion 35 and the sixth connection portion 36 are arranged in two rows of three in the longitudinal direction in which the first ends 2s1 of the signal conductors 2s are arranged, and the via hole conductor connection portion 3 closest to the corner of the first surface 11 is the sixth connection portion 36, the first connection portion 31 is located diagonally from the sixth connection portion 36, the fourth connection portion 34 is located opposite the first connection portion 31, the third connection portion 33 is located opposite the sixth connection portion 36, the second connection portion 32 is located between the first connection portion 31 and the third connection portion 33, and the fifth connection portion 35 is located opposite the second connection portion 32.

[0024] Here, the first direction is a direction along the longitudinal direction in which the first ends 2s1 located adjacent to the via-hole conductor connection portions 3 are aligned, and the second direction is a direction intersecting with the first direction. In other words, the first direction is a direction along the longitudinal direction of the side portions 22b of the second region 22 described later. The wiring board A according to the present disclosure has at least 2nd area 22 In the first region 21 sandwiched between the first region 21 and the third region 23, the first to sixth connection portions 31, 32, 33, 34, 35, and 36 may be arranged in the above-described order in the first and second directions. While Fig. 3 shows an example in which the first and second directions are orthogonal to each other, the angle between the first and second directions may be, for example, 45° or 60°.

[0025] 3, a portion of the signal conductor 2s is composed of a first wiring group 21s and a second wiring group 22s. The first wiring group 21s is composed of a plurality of wirings (signal conductors 2s) located between the first connection portion 31 and the second connection portion 32. The second wiring group 22s is composed of a plurality of wirings (signal conductors 2s) located between the second connection portion 32 and the third connection portion 33.

[0026] As shown in Figure 3, some of the signal conductors 2s that make up the first wiring group 21s include a first portion P1 that extends into the area between the second connection portion 32 and the fifth connection portion 35 and the area between the fifth connection portion 35 and the sixth connection portion 36, and a second portion P2 that extends into the area between the fourth connection portion 34 and the fifth connection portion 35.

[0027] As shown in Figure 3, some of the signal conductors 2s constituting the second wiring group 22s include a third portion P3 extending into the area between the fifth connection portion 35 and the sixth connection portion 36, and a fourth portion P4 extending into the area between the third connection portion 33 and the sixth connection portion 36.

[0028] 1, a quadrangular region on the first surface 11 of the insulating layer 1 that overlaps with a region where electronic components such as elements are mounted in a planar perspective view is defined as a fourth region 24. The second region 22 is a region sandwiched between the first region 21 and the fourth region 24. The second region 22 includes at least one of a corner portion 22a located adjacent to a corner of the fourth region 24 and a side portion 22b located along a side of the fourth region 24. The corner of the corner portion 22a of the second region 22 is a region facing a corner of the fourth region 24, and is a wiring board. A The size is determined appropriately depending on the size of the fourth region 24. Examples of the element include semiconductor elements such as semiconductor integrated circuit elements and optoelectronic elements.

[0029] Among the lands located in the second region 22 of the wiring board A, the signal conductor 2s is preferentially drawn from the land located at the corner 22a in a direction of 45° toward the corner K of the wiring board A and connected to the land located in the third region 23 close to the corner K of the wiring board A.

[0030] Among the lands located in the second region 22 of the wiring board A, the signal conductor 2s is drawn out from the land located in the side portion 22b toward the outer edge of the wiring board A, and the wiring board AThe signal conductors 2s having their first ends 2s1 on the side 22b include the first wiring group 21s and the second wiring group 22s having the above-described structures. In the first region 21, the signal conductors 2s having their first ends 2s1 on the side 22b are preferably as straight as possible and positioned so as not to overlap with the via-hole conductor connection portions 3, from the viewpoint of transmission efficiency.

[0031] In this way, by preferentially drawing the signal conductors 2s linearly from the corners 22a of the second region 22 toward the corners K of the wiring board A and drawing the signal conductors 2s including the first wiring groups 21s and the second wiring groups 22s having the above-described structure from the sides 22b of the second region 22, the signal conductors 2s do not overlap with each other in the densely packed portions of the signal conductors 2s. As shown in Fig. 1, if the signal conductors 2s located closer to the center of the wiring board A have a longer region along the second direction, it is easy to arrange the ground conductors 2g, for example, at equal intervals between the signal conductors 2s, which is advantageous in terms of electrical properties.

[0032] The number of turning points at which the extending direction changes in a signal conductor 2s (first signal conductor) whose first end 2s1 is located at a corner 22a of the second region 22 may be fewer than the number of turning points at which the extending direction changes in a signal conductor 2s (second signal conductor) whose first end 2s1 is located at a side 22b of the second region 22. With this configuration, the length of the signal conductor 2s, which is arranged between the corner 22a and the corner of the first surface 11 and tends to have a long signal length, can be reduced, thereby improving the transmission characteristics.

[0033] In the first region 21, the portion consisting of the first wiring group 21s and the second wiring group 22s and the portion consisting of the first connection portion 31, the second connection portion 32, the third connection portion 33, the fourth connection portion 34, the fifth connection portion 35, and the sixth connection portion 36 have the specific structure described above, so that all of the signal conductors 2s present on the same conductor layer 2 can be extracted without increasing the number of layers. Since the signal conductors 2s constituting the first wiring group 21s and the second wiring group 22s do not increase the number of layers, the inductance of the signal conductors 2s can be reduced. Therefore, the wiring board according to one embodiment A Since the signal waveform can be easily maintained, the quality of the signal waveform is high and malfunction of the mounted element can be reduced.

[0034] The wiring board of the present disclosure is the wiring board according to the embodiment described above. A The wiring board according to an embodiment of the present invention is not limited to the above. A In the wiring board according to another embodiment of the present disclosure, the number of portions having the specific structure as described above is minimized. However, the wiring board according to the present disclosure may have more portions having the specific structure as described above, as shown in FIG. 4. This structure is expected to have the effect of, for example, aligning the signal line lengths between a plurality of signal conductors 2s to reduce the difference in signal transmission time. FIG. 4 shows a wiring board according to another embodiment of the present disclosure, in which the conductor layer 2s located on the first surface of the insulating layer 2 FIG.

[0035] The number of portions having the above-described specific structure may be increased. For example, as shown in Figure 5, the specific structure may be provided regularly so that it increases as it approaches the corners of the wiring board. With such a structure, for example, the power supply conductor near the center of the wiring board may be 2p or ground conductor 2g 5 is a diagram showing a wiring board according to a further embodiment of the present disclosure, in which a conductor layer disposed on a first surface of an insulating layer is formed. 2 FIG.

[0036] Next, a mounting structure 100 according to one embodiment will be described with reference to Figure 6, in which a first electronic component S1 and a second electronic component S2 are mounted on the above-mentioned wiring board A. The wiring board A has, for example, a first mounting area R1 on its upper surface and a second mounting area R2 on its lower surface. A plurality of first electrodes 40 are located in the first mounting area R1. A plurality of second electrodes 50 are located in the second mounting area R2. A plurality of third electrodes 60, which are connected to, for example, an external circuit board, are located in an area on the lower surface of the wiring board A other than the second mounting area R2.

[0037] The first electronic component S1 may be, for example, an ASIC (Application Specific Integrated Circuit), a semiconductor integrated circuit device, an optoelectronic device, or other semiconductor device. The first electronic component S1 is connected to the first electrode 40 by solder. The second electronic component S2 may be, for example, a memory. The second electronic component S2 is connected to the second electrode 50 by solder.

[0038] The mounting structure 100 according to the present disclosure has, for example, a first electronic component S1 and a second electronic component S2 mounted on a wiring board A having the above-described structure. As a result, for example, the quality of signal waveforms between the first electronic component S1 and the second electronic component S2 and between the first electronic component S1 and an external circuit board is high, and malfunctions of mounted elements such as ASICs can be reduced. In the mounting structure 100 according to the present disclosure, an example has been shown in which one electronic component is mounted on each of the top and bottom surfaces of the wiring board A. However, multiple electronic components may also be mounted.

[0039] For example, in a planar perspective view, the outer edge of at least one of the first mounting area R1 and the second mounting area R2 may be located along the first direction (the longitudinal direction in which the first ends 2s1 located adjacent to the via-hole conductor connection portions 3 are aligned). This makes it easier to reduce the wiring connection length between the electronic components mounted on the wiring board A and the first ends 2s1 of the signal conductors 2s, which is advantageous for improving the quality of the signal waveform. [Explanation of symbols]

[0040] 1. Insulation layer 11 Page 1 12 Side 2 2 Conductor layer 2s signal conductor 2s1 1st end 2s2 2nd end 2g Ground conductor 2p power conductor 21 First area 22 Second area 23 Third area 24 4th area 21s 1st wiring group 22s 2nd wiring group 3 Via hole conductor connection 3a Via hole conductor 31 First connection part 32 Second connection part 33 Third connection part 34 Fourth connection part 35 5th connection 36 6th Connection P1 Part 1 P2 2nd part P3 3rd part P4 Part 4

Claims

1. an insulating layer having a first surface and a second surface opposite the first surface; a conductor layer located on the first surface and including a plurality of signal conductors, ground conductors, and power conductors; a plurality of via-hole conductors that penetrate the insulating layer and are located from the first surface to the second surface; a via-hole conductor connection portion located on the first surface and connecting some of the via-hole conductors to at least one of the ground conductor and the power conductor; Including, the plurality of signal conductors are elongated conductors having a first end and a second end; The first surface of the insulating layer a first region in which the via-hole conductor connection portion is located; a second region in which the first ends of the plurality of signal conductors located in the first region are located; a third region in which the second ends of the plurality of signal conductors located in the first region are located; Including, In plan view, the first region is located between the second region and the third region, In the first region, the via-hole conductor connection portions are arranged in a grid pattern in a first direction along a longitudinal direction in which the first ends of the plurality of signal conductors in the second region are arranged, and in a second direction intersecting the first direction, A part of the via-hole conductor connection portion is A first connection portion; a second connection portion adjacent to the first connection portion in the first direction; a third connection portion adjacent to the second connection portion in the first direction; a fourth connection portion adjacent to the first connection portion in the second direction; a fifth connection portion adjacent to the fourth connection portion in the first direction; a sixth connection portion adjacent to the fifth connection portion in the first direction; Including, A portion of the signal conductor is a first wiring group including a plurality of wirings extending in a region between the first connection portion and the second connection portion; a second wiring group including a plurality of wirings extending in a region between the second connection portion and the third connection portion; Including, The first wiring group includes: a first portion extending from a region between the second connection portion and the fifth connection portion to a region between the fifth connection portion and the sixth connection portion; a second portion extending in a region between the fourth connection portion and the fifth connection portion, The second wiring group is a third portion extending in a region between the fifth connection portion and the sixth connection portion; a fourth portion extending in a region between the third connection portion and the sixth connection portion, the first surface of the insulating layer has a quadrangular fourth region overlapping the mounting region in a planar perspective view, and the second region has corner portions located at corners of the fourth region and side portions located along sides of the fourth region; the plurality of signal conductors include first signal conductors having the first end located at the corner portion and the second end located in the third region near the corner of the first surface, and second signal conductors having the first end located at the side portion, and by reducing the length of the first signal conductors, the number of turning points at which the first signal conductors change their extension direction is fewer than the number of turning points at which the second signal conductors change their extension direction; Wiring board.

2. The wiring board according to claim 1 , wherein the first direction and the second direction are orthogonal to each other.

3. 2. The wiring board according to claim 1, wherein the plurality of signal conductors include a plurality of paired wirings, and the via-hole conductor connection portion is not interposed between the wirings constituting the paired wirings.

4. 2. The wiring board according to claim 1, wherein the pitch between the signal conductors at the first end is smaller than the pitch between the signal conductors at the second end.

5. A wiring board according to any one of claims 1 to 4, an electronic component located in a mounting area of ​​the wiring board; A mounting structure having:

6. The mounting structure according to claim 5 , wherein an outer edge of the mounting area is positioned along the first direction in a planar perspective view.

Images