Wiring components, modules, devices, and module manufacturing methods

Abstract

To improve the convenience of a wiring component.SOLUTION: A wiring component 100 includes a wiring part 1101 having a plurality of wirings 103 aligned in a direction Da, a wiring part 1102 having a plurality of wirings 103 aligned in a direction Db, and a connection part 1071 connecting the wiring part 1101 and the wiring part 1102. An angle formed by the direction Da and the direction Db can be changed by deforming the connection part 1071.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present embodiment relates to a wiring component. [Background technology]

[0002] Wiring components that connect multiple wiring boards between multiple wiring boards are useful in increasing packaging density.

[0003] Patent Document 1 discloses an electronic component mounting multilayer board having a multilayer structure in which mounting boards are stacked with interlayer wiring members sandwiched therebetween and the mounting boards are electrically connected by the interlayer wiring members.

[0004] Patent Document 2 discloses a wireless circuit module in which a double-sided connection board is arranged on one surface of a multilayer board so as to surround each of the four side surfaces of a wireless circuit device. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2001-111232 [Patent Document 2] Japanese Patent Application Laid-Open No. 2005-183410 Summary of the Invention [Problem to be solved by the invention]

[0006] The technology of Patent Document 1 has problems with the versatility of interlayer wiring members and problems with the reliability of multilayer boards mounted with electronic components.The technology of Patent Document 2 has problems with the handling of double-sided boards for connection and problems with the reliability of wireless circuit modules.

[0007] SUMMARY OF THE INVENTION It is therefore an object of the present invention to improve the convenience of wiring components. [Means for solving the problem]

[0008] A wiring component for solving the above problem comprises a first wiring section having a plurality of wires aligned in a first direction, a second wiring section having a plurality of wires aligned in a second direction, and a connecting section connecting the first wiring section and the second wiring section, and is characterized in that the angle formed between the first direction and the second direction can be changed by deformation of the connecting section. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a technique that is advantageous in improving the convenience of wiring components. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 2 is a schematic diagram illustrating a wiring component. [Figure 2] FIG. 2 is a schematic diagram illustrating a wiring component. [Figure 3] FIG. 2 is a schematic diagram illustrating a wiring component. [Figure 4] Schematic diagrams illustrating a method for manufacturing a module. [Figure 5] FIG. 2 is a schematic diagram illustrating a module. [Figure 6] FIG. 2 is a schematic diagram illustrating a wiring component. [Figure 7] FIG. 2 is a schematic diagram illustrating a wiring component. [Figure 8] FIG. 2 is a schematic diagram illustrating a wiring component. [Figure 9] FIG. 2 is a schematic diagram illustrating a wiring component. [Figure 10] Schematic diagrams illustrating a method for manufacturing a module. [Figure 11] FIG. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the following description and drawings, common components are designated by common reference numerals. Therefore, common components will be described with reference to multiple drawings, and descriptions of components designated by common reference numerals will be omitted as appropriate. Coordinate axes are shown in each drawing as necessary. The X, Y, and X directions are mutually orthogonal. A direction along a certain direction is a direction whose angle with another direction is between 0 and 30 degrees. The angle between two directions is defined only within the range between 0 and 90 degrees. An angle of 180 degrees between two directions is considered to be the same as an angle of 0 degrees between the two directions. An angle of 135 degrees between two directions is considered to be the same as an angle of 45 degrees between the two directions.

[0012] First Embodiment A wiring component 100 according to a first embodiment will be described with reference to Fig. 1. Fig. 1(a) is a side view of the wiring component 100, and Figs. 1(b) and 1(c) are top and bottom views of the wiring component 100.

[0013] The wiring component 100 includes a wiring portion 1101, a wiring portion 1102, and a connecting portion 1071. Hereinafter, the multiple wiring portions 1101 and 1102 provided in one wiring component 100 will be collectively referred to as a wiring portion 110. Furthermore, at least one connecting portion 11071 provided in one wiring component 100 will be collectively referred to as a connecting portion 107. The wiring portion 1101 includes multiple wirings 103 aligned in a direction Da. The wiring portion 1102 includes multiple wirings 103 aligned in a direction Db. In FIGS. 1(a) and 1(b), the directions Da and Db are illustrated as directions along the X direction. The wiring portion 1101 includes an insulating member 1021 that supports the multiple wirings 103 of the wiring portion 1101. The wiring portion 1102 includes an insulating member 1022 that supports the multiple wirings 103 of the wiring portion 1102. Insulating members 1021 and 1022 that support multiple wirings 103 in each of multiple wiring sections 110 provided in one wiring component 100 are collectively referred to as insulating member 102. Connecting section 1071 connects wiring section 1101 and wiring section 1102. Connecting section 1071 is provided between wiring section 1101 and wiring section 1102.

[0014] Each of the multiple wires 103 of the wiring section 1101 and the multiple wires 103 of the wiring section 1102 has a pair of terminals (a bottom terminal 1031 and a top terminal 1032) arranged along the Z direction intersecting the direction Da and the direction Db. The wires 103 include a path 1033 connecting the pair of terminals (the bottom terminal 1031 and the top terminal 1032). The bottom terminal 1031 is a portion of the wire 103 that is exposed on the bottom surface of the wiring section 110, and the top terminal 1032 is a portion of the wire 103 that is exposed on the top surface of the wiring section 110. In this example, the path 1033 is not exposed on the side surface of the wiring section 110, but the path 1033 may be exposed on the side surface of the wiring section 110.

[0015] 1(b) and 1(c) show the deformation of the wiring component 100. In FIG. 1(c), the wiring section 1102 has multiple wirings 103 aligned in a direction Db indicated by a solid arrow. Note that the direction Db indicated by a dotted line in FIG. 1(c) is the direction Db in FIG. 1(b) and is shown for reference. In FIG. 1(c), the direction Db indicated by a solid arrow is illustrated as a direction along the Y direction. In the wiring component 100 of this embodiment, the direction in which the multiple wirings 103 of the wiring section 1101 and the direction in which the multiple wirings 103 of the wiring section 1102 are aligned can be changed by deformation of the connecting section 1071. The wiring component 100 shown in FIG. 1(c) is bent at the connecting section 1071. The difference between the angle formed by the direction Da and the direction Db before the deformation of the connecting portion 107 and the angle formed by the direction Da and the direction Db after the deformation of the connecting portion 107 is preferably 30 degrees or more. The difference between the angle formed by the direction Da and the direction Db before the deformation of the connecting portion 107 and the angle formed by the direction Da and the direction Db after the deformation of the connecting portion 107 is more preferably 45 degrees or more, and even more preferably 60 degrees or more. In FIG. 1(b), the angle formed by the direction Da and the direction Db is, for example, 0 degrees, and in FIG. 1(c), the angle formed by the direction Da and the direction Db is, for example, 90 degrees.

[0016] Wiring portion 1101 and wiring portion 1102 are structured to be less susceptible to deformation than connecting portion 1071. In other words, connecting portion 1071 is structured to be more susceptible to deformation than wiring portion 1101 and wiring portion 1102. The deformation of connecting portion 1071 may be elastic deformation, but is preferably plastic deformation. If connecting portion 1071 is structured to be less susceptible to deformation, attempting to forcibly bend wiring component 100 with excessive force will destroy connecting portion 1071, causing wiring component 100 to break and losing its connection. The hardness of connecting portion 1071 may be appropriately set so that connecting portion 1071 will not be destroyed during normal use of wiring component 100.

[0017] Compared to a configuration in which wiring portion 1101 and wiring portion 1102 are separate components and not connected, wiring component 100 is easier to handle because wiring portion 1101 is connected by connecting portion 1071. Furthermore, compared to a configuration in which wiring portion 1101 and wiring portion 1102 are rigidly fixed, connecting portion 1071 is deformable, allowing wiring portions 1101 and 1102 to be positioned according to the user's wishes, improving versatility. In this way, providing deformable connecting portion 1071 improves the convenience of wiring component 100.

[0018] Second Embodiment A wiring component 100 according to a second embodiment will be described with reference to Fig. 2. Descriptions of features common to the first embodiment will be omitted. Fig. 2(a) is a side view of the wiring component 100, and Figs. 2(b) and 2(c) are top and bottom views of the wiring component 100.

[0019] The wiring component 100 includes a wiring portion 1103 and a connecting portion 1072. The wiring portion 1103 has multiple wirings 103 aligned in direction Dc. In FIGS. 2(a) and 2(b), direction Dc is illustrated as the X direction. The wiring portion 1103 includes an insulating member 1023 that supports the multiple wirings 103 of the wiring portion 1103. The connecting portion 1072 connects the wiring portion 1102 and the wiring portion 1103. The connecting portion 1072 is provided between the wiring portion 1102 and the wiring portion 1103.

[0020] The wiring component 100 includes a wiring portion 1104 and a connecting portion 1073. The wiring portion 1104 has a plurality of wirings 103 arranged in a direction Dd. In Figures 2(a) and 2(b), the direction Dd is illustrated as the X direction. The wiring portion 1104 includes an insulating member 1024 that supports the plurality of wirings 103 of the wiring portion 1104.

[0021] The connecting portion 1073 connects the wiring portion 1103 and the wiring portion 1104. The connecting portion 1073 is provided between the wiring portion 1103 and the wiring portion 1104.

[0022] Hereinafter, the multiple connecting portions 1071, 1072, and 1073 provided on one wiring component 100 will be collectively referred to as connecting portion 107. The number of connecting portions 107 provided on one wiring component 100 may be four or more.

[0023] The plurality of wirings 103 of the wiring portions 1103 and 1104 have a pair of terminals (a lower surface terminal 1031 and an upper surface terminal 1032) arranged along the Z direction intersecting the directions Da, Db, Dc, and Dd.

[0024] The dimension of the connecting portion 1071 in the Z direction intersecting the directions Da and Db in which the wirings 103 are arranged is defined as height Hb. The dimension of the wiring 103 of the wiring portion 110 (wiring portions 1101 and 1102) in the Z direction intersecting the directions Da and Db in which the wirings 103 are arranged is defined as height Ha. The wiring 103 for which height Ha is defined is one of the multiple wirings 103, and preferably, each of the multiple wirings 103 has the same height Ha. The height Ha is the distance between the outer surface of the bottom terminal 1031 and the outer surface of the top terminal 1032 of one wiring 103. The height Ha is the distance between the outer surface of the bottom terminal 1031 and the outer surface of the top terminal 1032 of one wiring 103. The height Hb can be greater than or equal to height Ha (Hb≧Ha). In this example, the dimension (height Hb) of the connecting portion 107 (connecting portion 1071) in the Z direction intersecting the direction in which the wirings 103 are arranged is equal to the dimension (height Ha) of the wiring 103 of the wiring portion 110 (wiring portions 1101, 1102) in the Z direction intersecting the direction in which the wirings 103 are arranged (Ha = Hb).

[0025] Typically, the lower surface or upper surface of the insulating member 102 and the outer surfaces of the lower surface terminal 1031 and the upper surface terminal 1032 may be on the same plane. In that case, the height Ha may be equal to the dimension (height Ha’) of the insulating member 102 (insulating members 1021, 1022, 1023, 1024) in the Z direction intersecting the directions Da and Db in which the wirings 103 are arranged (Ha = Ha’). However, the height Ha of the wiring 103 may be different from the height Ha’ of the insulating member 102. That is, if the lower surface terminal 1031 and the upper surface terminal 1032 are recessed (concavely provided) with respect to the lower surface or upper surface of the insulating member 102, the height Ha of the wiring 103 may be smaller than the height Ha’ of the insulating member 102 (Ha < Ha’). If the lower surface terminal 1031 and the upper surface terminal 1032 are protruding (convexly provided) with respect to the lower surface or upper surface of the insulating member 102, the height Ha of the wiring 103 may be larger than the height Ha’ of the insulating member 102 (Ha > Ha’). The height Hb may be greater than or equal to the dimension (height Ha’) of the insulating member 102 (insulating members 1021, 1022, 1023, 1024) in the Z direction intersecting the directions Da and Db in which the wirings 103 are arranged. That is, the height Hb of the base 101 may be greater than or equal to the height Ha’ of the insulating member 102.

[0026] Also, the distance (interval G) between the wiring portion 1101 and the wiring portion 1102 is preferably smaller than the dimension (thickness T) of the wiring portion 110 (wiring portions 1101, 1102) in the Y direction orthogonal to the directions Da and Db in which the wirings 103 are arranged. Further, the distance (interval G) between the wiring portion 1101 and the wiring portion 1102 is preferably smaller than the dimension (thickness T) of the wiring portion 110 (wiring portions 1101, 1102) in the Y direction orthogonal to the Z direction intersecting the directions Da and Db in which the wirings 103 are arranged.

[0027] 2(b) and 2(c) show the deformation of the wiring component 100. In FIG. 2(c), the wiring section 1103 has multiple wires 103 aligned in a direction Dc. In FIG. 2(c), the direction Dc is illustrated as being diagonal to the X and Y directions. In the wiring component 100 of this embodiment, the deformation of the connecting section 1072 allows the direction Db in which the multiple wires 103 of the wiring section 1102 are aligned to change from the direction Dc in which the multiple wires 103 of the wiring section 1103 are aligned to the direction Dc in which the multiple wires 103 of the wiring section 1103 are aligned. In addition, the deformation of the connecting section 1073 allows the deformation of the wiring component 100 of this embodiment allows the direction Dc in which the multiple wires 103 of the wiring section 1103 are aligned to change from the direction Dd in which the multiple wires 103 of the wiring section 1104 are aligned. In Fig. 2(b), the angle formed by the direction Db and the direction Dc is, for example, 0 degrees, and in Fig. 2(c), the angle formed by the direction Db and the direction Dc is, for example, 45 degrees. In Fig. 2(b), the angle formed by the direction Dc and the direction Dd is, for example, 0 degrees, and in Fig. 2(c), the angle formed by the direction Dc and the direction Dd is, for example, 45 degrees. Not limited to the example in Fig. 2(c), the direction in which the wires 103 of the wiring section 110 are arranged can be set arbitrarily within the range of 0 to 90 degrees.

[0028] Wiring component 100 of the second embodiment includes base 101 provided across wiring portion 1101 and wiring portion 1102. Base 101 is further provided across wiring portion 1103 and wiring portion 1104. Multiple wiring portions 110 (wiring portions 1101, 1102, 1103, 1104) include base 101. Multiple connecting portions 107 (1071, 1072, 1073) also include base 101. Deformation of connecting portion 107 is brought about by deformation of base 101.

[0029] The deformation of base 101 may be elastic deformation, but is preferably plastic deformation. Wiring portions 1102 and 1103 are structured to be less susceptible to deformation than connecting portion 1072. Wiring portions 1103 and 1104 are structured to be less susceptible to deformation than connecting portion 1073. In other words, connecting portions 1071, 1072, and 1703 are structured to be more susceptible to deformation than wiring portions 1101, 1102, 1103, and 1104.

[0030] It is preferable that base 101 has a configuration that is less susceptible to deformation than insulating member 102. For example, a rigid substrate may be used for insulating member 102, and a flexible substrate may be used for base 101. Connecting portion 107 may have different degrees of deformability before and after deformation. For example, connecting portion 107 may be more easily deformed before bending, and less easily deformed after bending.

[0031] The base 101 may be made of a thermosetting resin, and configured to be easily plastically deformed before the base 101 is thermally cured, and configured to be less susceptible to plastic deformation (elastically deformed) after the base 101 is thermally cured. The base 101 may be made of a thermoplastic resin, and configured to be softened and easily plastically deformed when heated, and hardened and less susceptible to plastic deformation (elastically deformed) when cooled.

[0032] The connecting portion 107 can be made of only an insulator, or can be made of only a conductor. A metal plate or a metal tape can be used as the base 101. A shape memory alloy can be used for the base 101, and the base 101 can be made to memorize a shape so that it assumes a certain posture (for example, a straight shape) at a certain temperature and a different posture (for example, a curved shape) at a different temperature. The connecting portion 107 can also be made of a composite member of an insulator and a conductor. For example, the base 101 can be made of a member in which a conductor film is formed on an insulating substrate.

[0033] The wiring portion 1101 includes an insulating member 1021 that supports the plurality of wirings 103 of the wiring portion 1101, and the insulating member 1021 is adhered to the base 101 via an adhesive. The wiring portion 1102 includes an insulating member 1022 that supports the plurality of wirings 103 of the wiring portion 1102, and the insulating member 1022 is adhered to the base 101 via an adhesive. In this way, in the wiring portion 110, the plurality of insulating members 102 (insulating members 1021, 1022, 1023, 1024) that support the plurality of wirings 103 of the wiring portion 110 can be adhered to the base 101 via an adhesive. Note that the adhesive is a member that bonds two members together by adhesion, and can be a double-sided adhesive tape or a cured (solidified) liquid adhesive.

[0034] Third Embodiment A wiring component 100 according to a third embodiment will be described with reference to Fig. 3. Descriptions of features common to the first and second embodiments will be omitted. Fig. 3(a) is a side view of the wiring component 100, and Fig. 3(b) is a top view or bottom view of the wiring component 100.

[0035] In the third embodiment, the wiring section 1101 has a first group of wirings 103 and a fifth group of wirings 103. A base 101 is located between the first group of wirings 103 and the fifth group of wirings 103. The wiring section 1101 includes an insulating member 1021 that supports the first group of wirings 103, and an insulating member 1026 that supports the fifth group of wirings 103. The base 101 is located between the insulating member 1021 and the insulating member 1026.

[0036] The wiring portion 1102 has a second group of wirings 103 and a sixth group of wirings 103. A base 101 is located between the second group of wirings 103 and the sixth group of wirings 103. The wiring portion 1102 includes an insulating member 1022 that supports the second group of wirings 103 and an insulating member 1027 that supports the sixth group of wirings 103. The base 101 is located between the insulating member 1022 and the insulating member 1027. The wiring portion 1102 has a third group of wirings 103 and a seventh group of wirings 103. The base 101 is located between the third group of wirings 103 and the seventh group of wirings 103. The wiring portion 1103 includes an insulating member 1023 that supports the third group of wirings 103 and an insulating member 1028 that supports the seventh group of wirings 103. The base 101 is located between the insulating member 1023 and the insulating member 1028. The wiring section 1101 has a fourth group of wirings 103 and an eighth group of wirings 103. The base 101 is located between the fourth group of wirings 103 and the eighth group of wirings 103. The wiring section 1104 includes an insulating member 1024 that supports the fourth group of wirings 103, and an insulating member 1029 that supports the eighth group of wirings 103. The base 101 is located between the insulating member 1024 and the insulating member 1029.

[0037] In this way, the number of wires can be increased by arranging the wires 103 on both sides of the base 101. In addition, in this example, the path 1033 is exposed on the side surface of the wiring portion 110, but the path 1033 does not have to be exposed on the side surface of the wiring portion 110.

[0038] <Fourth embodiment> A method for manufacturing a module using wiring component 100 will be described with reference to Figure 4. In Figures 4(a) to 4(f), the left side is a cross-sectional view, and the right side is a plan view.

[0039] 4(a), a wiring board 1002 having electrodes 220 is prepared. Solder paste 221 is placed on electrodes 220. Electronic component 106 is also placed on wiring board 1002. Electronic component 106 may already be fixed to wiring board 1002 at the stage of step Sb, or pre-heated solder paste may be provided between electronic component 106 and wiring board 1002 at the stage of step Sb.

[0040] 4(b), a wiring component 100 described in any of the first to third embodiments (in this example, the wiring component 100 described in the second embodiment) is prepared. The wiring component 100 includes a base 101 that constitutes connecting portions 1071, 1072, and 1073. The base 101 has a portion included in a wiring portion 1101, a portion included in a wiring portion 1102, a portion included in a wiring portion 1103, and a portion included in a wiring portion 1104.

[0041] The wiring component 100 is deformed into an appropriate shape. In the wiring component 100 before deformation, the angle formed between the direction in which the wires 103 of the wiring portion 1101 are arranged and the direction in which the wires 103 of the wiring portion 1102 are arranged is defined as θa. In the wiring component 100 after deformation, the angle formed between the direction in which the wires 103 of the wiring portion 1101 are arranged and the direction in which the wires 103 of the wiring portion 1102 are arranged is defined as θb. Typically, the angle θb is greater than the angle θa. For example, in the wiring component 100 before deformation, the multiple wiring portions 110 are either arranged straight or folded, and the angle θa is less than 45 degrees, e.g., 0 degrees. On the other hand, in the wiring component 100 after deformation, the angle θb becomes 45 degrees or greater, e.g., 90 degrees, by bending the straight wiring component 100 or bending the folded wiring component 100.

[0042] Similarly, in the wiring component 100 before deformation, the angle formed between the direction in which the wires 103 of the wiring section 1102 are arranged and the direction in which the wires 103 of the wiring section 1103 are arranged is defined as θc. In the wiring component 100 after deformation, the angle formed between the direction in which the wires 103 of the wiring section 1102 are arranged and the direction in which the wires 103 of the wiring section 1102 are arranged is defined as θd. Typically, the angle θd is larger than the angle θc. Furthermore, in the wiring component 100 before deformation, the angle formed between the direction in which the wires 103 of the wiring section 1103 are arranged and the direction in which the wires 103 of the wiring section 1104 are arranged is defined as θe. In the wiring component 100 after deformation, the angle formed between the direction in which the wires 103 of the wiring section 1103 are arranged and the direction in which the wires 103 of the wiring section 1104 are arranged is defined as θf. Typically, the angle θf is larger than the angle θe. In wiring component 100 before deformation, the angle formed between the direction in which wires 103 of wiring section 1104 are arranged and the direction in which wires 103 of wiring section 1101 are arranged is defined as θg. In wiring component 100 after deformation, the angle formed between the direction in which wires 103 of wiring section 1104 are arranged and the direction in which wires 103 of wiring section 1101 are arranged is defined as θh. Typically, angle θh is larger than angle θg.

[0043] In this example, due to the deformation, a portion of base 101 included in wiring portion 1101 and a portion of base 101 included in wiring portion 1103 may be positioned between the plurality of wirings 103 included in wiring portion 1101 and the plurality of wirings 103 included in wiring portion 1103. Furthermore, a portion of base 101 included in wiring portion 1102 and a portion of base 101 included in wiring portion 1104 may be positioned between the plurality of wirings 103 included in wiring portion 1102 and the plurality of wirings 103 included in wiring portion 1104. In other words, wiring component 100 is deformed so that the plurality of wirings 103 surround base 101.

[0044] In another example, due to the deformation, the plurality of wires 103 included in wiring portion 1101 and the plurality of wires 103 included in wiring portion 1103 may be positioned between a portion of base 101 included in wiring portion 1101 and a portion of base 101 included in wiring portion 1103. Furthermore, the plurality of wires 103 included in wiring portion 1102 and the plurality of wires 103 included in wiring portion 1104 may be positioned between a portion of base 101 included in wiring portion 1102 and a portion of base 101 included in wiring portion 1104. In other words, wiring component 100 is deformed so that base 101 surrounds the plurality of wires 103.

[0045] When wiring 103 is provided on only one side of base 101 as in the second embodiment, arranging multiple wirings 103 so that they surround base 101 allows for more wiring 103 to be arranged than when base 101 surrounds multiple wirings 103. This is because bending wiring component 100 with wiring 103 on the inside of base 101 narrows the spacing between wiring portions 110, whereas bending wiring component 100 with wiring 103 on the outside of base 101 widens the spacing between wiring portions 110. Therefore, bending wiring component 100 with wiring 103 on the outside of base 101 reduces the effect of mechanical interference between adjacent wiring portions 110 compared to bending wiring component 100 with wiring 103 on the inside of base 101. To bend wiring component 100 with wiring 103 inside base 101, the length of connecting portion 107 should be at least twice the thickness T of wiring portion 110. However, if wiring component 100 is bent with wiring 103 outside base 101, it is possible to set spacing G between wiring portions 110 to less than one time the thickness T of wiring portion 110. By reducing spacing G between wiring portions 110 and increasing the length of wiring portion 110, the number of wirings 103 can be increased.

[0046] The spacing G of the wiring portions 110 (for example, the distance between the wiring portions 1101 and 1102) is preferably smaller than the dimension (thickness T) of the wiring portions 110 (wiring portions 1101, 1102) in the direction (Y direction) perpendicular to the directions Da and Db in which the wirings 103 are arranged. The spacing G of the wiring portions 110 (for example, the distance between the wiring portions 1101 and 1102) is preferably smaller than the dimension (thickness T) of the wiring portions 110 (wiring portions 1101, 1102) in the direction (Y direction) perpendicular to the Z direction in which the wirings 103 extend.

[0047] If wirings 103 are provided on both sides of base 101 as in the third embodiment, the outer wirings 103 surround base 101, and base 101 surrounds the inner wirings 103. In the third embodiment, spacing g between insulating members 1026, 1027, 1028, and 1029 is greater than spacing G between insulating members 1021, 1022, 1023, and 1024. It is preferable to arrange wiring component 100 so that insulating members 1026, 1027, 1028, and 1029 surround base 101, and base 101 surrounds insulating members 1021, 1022, 1023, and 1024. This is because spacing g between wiring portions 110 can be made smaller on the outside, where the effect of mechanical interference between adjacent wiring portions 110 is smaller, allowing the length of wiring portion 110 to be increased.

[0048] Wiring component 100 thus deformed is placed on wiring board 1002. Wiring component 100 and wiring board 1002 are aligned. For example, alignment is performed so that bottom surface terminals 1031 and electrodes 220 face each other.

[0049] 4(c), wiring component 100 is placed on wiring board 1002. One of a pair of terminals of wiring component 100 (lower surface terminal 1031) is then connected to electrode 220 of wiring board 1002. For example, solder paste 221 is melted in a reflow furnace and then cooled, whereby conductive member 210 (solder) obtained from solder paste 221 electrically connects lower surface terminal 1031 of wiring component 100 to electrode 220 of wiring board 1002.

[0050] 4(d), a wiring board 1001 having electrodes 222 is prepared. Solder paste 212 is placed on electrodes 222. Furthermore, electronic component 240 is placed on wiring board 1001. Electronic component 240 may already be fixed to wiring board 1001 at the stage of step Sd, or pre-heated solder paste may be provided between electronic component 240 and wiring board 1001 at the stage of step Sd.

[0051] Furthermore, in step Sd, wiring component 100, wiring board 1002, and wiring board 1001 are arranged so that wiring component 100 is located between wiring board 1002 and wiring board 1001. Then, wiring component 100 and wiring board 1001 are aligned. For example, the alignment is performed so that top surface terminal 1032 and electrode 222 face each other.

[0052] 4(e), the other of the pair of terminals of wiring component 100 (top terminal 1032) is connected to electrode 222 of wiring board 1001. For example, solder paste 212 is melted in a reflow furnace and then cooled, whereby top terminal 1032 of wiring component 100 and electrode 222 of wiring board 1001 are electrically connected by conductive member 213 (solder) obtained from solder paste 212.

[0053] Electronic component 106 is mounted on wiring board 1002 at some stage. Wiring board 1001 and electronic component 106 may be fixed to each other before wiring board 1002 and wiring component 100 are fixed to each other in process Sc. Alternatively, wiring board 1001 and electronic component 106 may be fixed to each other at the same time as wiring board 1002 and wiring component 100 are fixed to each other in process Sc. In this case, printing and reflowing of solder paste for fixing wiring component 100 to wiring board 1002 may be performed simultaneously with printing and reflowing of solder paste for fixing electronic component 106 to wiring board 1002. Wiring board 1001 and electronic component 106 may be fixed to each other after wiring board 1002 and wiring component 100 are fixed to each other in process Sc; however, wiring component 100 may interfere with the placement of electronic component 106. In this example, electronic component 106 is mounted on the wiring component 100 side (wiring board 1001 side) of wiring board 1002. If electronic component 106 is mounted on the opposite side of wiring board 1002 from wiring component 100, wiring component 100 is unlikely to interfere with the placement of electronic component 106. Electronic components can also be mounted on both sides of wiring board 1002.

[0054] Electronic component 240 is mounted on wiring board 1001 at some stage. Wiring board 1001 and electronic component 240 may be fixed to each other before wiring board 1001 and wiring component 100 are fixed to each other in step Se. Alternatively, wiring board 1001 and electronic component 240 may be fixed to each other at the same time as wiring board 1001 and wiring component 100 are fixed to each other in step Sd. In this case, printing and reflowing of solder paste for fixing wiring component 100 to wiring board 1001 may be performed simultaneously with printing and reflowing of solder paste for fixing electronic component 240 to wiring board 1001. Wiring board 1001 and electronic component 106 may be fixed to each other after wiring board 1002 and wiring component 100 are fixed to each other in step Sc; however, wiring component 100 may interfere with the placement of electronic component 106.

[0055] In this example, electronic component 240 is mounted on the wiring component 100 side (wiring board 1002 side) of wiring board 1001. If electronic component 240 is mounted on the opposite side of wiring board 1001 from wiring component 100, wiring component 100 is less likely to interfere with the placement of electronic component 240. In other words, electronic component 240 can be mounted on wiring board 1001 so that wiring board 1001 is positioned between wiring board 1002 and electronic component 240. Electronic components can also be mounted on both sides of wiring board 1001.

[0056] The electronic component 106 and the electronic component 240 may be electrically connected via the wiring component 100. One of the electronic component 106 and the electronic component 240 may supply a signal or power to the other of the electronic component 106 and the electronic component 240 via the wiring component 100.

[0057] The dimension (height Hb) of base 101 (connecting portion 107) in the Z direction intersecting with the directions Da, Db in which wirings 103 are arranged can be equal to or greater than the dimension (height Ha) of wiring 103 of wiring portion 110 (wiring portions 1101, 1102) in the Z direction intersecting with the directions Da, Db in which wirings 103 are arranged. By doing so, it is possible to reduce the gap between base 101 (connecting portion 107) and wiring board 1001 and the gap between base 101 (connecting portion 107) and wiring board 1002.

[0058] Module 300 manufactured in this manner includes wiring board 1002, wiring board 1001 overlapping wiring board 1002, and wiring component 100. Wiring component 100 is disposed between wiring boards 1002 and 1001. One (bottom surface terminal 1031) of a pair of terminals (bottom surface terminal 1031 and top surface terminal 1032) of wiring component 100 is connected to electrode 220 of wiring board 1002. The other (top surface terminal 1032) of the pair of terminals (bottom surface terminal 1031 and top surface terminal 1032) of wiring component 100 is connected to electrode 222 of wiring board 1001.

[0059] In such module 300, coupling portion 107 is provided between wiring portions 110, thereby preventing foreign matter from entering the space between wiring board 1002 and wiring board 1001 (the space surrounded by wiring component 100). Furthermore, coupling portion 107 is deformable, thereby alleviating stress that may be generated by thermal expansion of wiring boards 1001 and 1002. For these reasons, the reliability of module 300 can be improved. Furthermore, by using a conductor for at least a portion of coupling portion 107, coupling portion 107 can function as an electromagnetic shield for electronic components between wiring board 1001 and wiring board 1002.

[0060] Such a module 300 can be mounted in various devices. The device may include a module and a housing that houses the module. Since wiring board 1001 and wiring board 1002 can be densely mounted in a housing of limited size, the performance of the device can be improved and the device can be made more compact. Devices to which this embodiment is applied may include electronic devices such as cameras, smartphones, tablets, and personal computers. They may also include office equipment such as copiers and printers. They may also include medical equipment such as CT scanners, X-ray scanners, and endoscopes. They may also include industrial equipment such as robots and semiconductor manufacturing equipment.

[0061] Imaging devices, such as digital cameras and smartphones with built-in cameras, which are examples of electronic devices, include circuit boards and imaging modules on which electronic components such as image sensors are mounted. As imaging devices become smaller and their image quality and performance improve, the electronic components are also becoming smaller and more powerful. Imaging modules are becoming increasingly densely mounted on wiring boards, with relatively large and tall (thick) semiconductor components and numerous electronic components. Meanwhile, imaging devices are becoming larger, such as APSC size and full size, as the resolution increases.

[0062] Accordingly, there is a demand for wiring boards with high-density packaging structures for electronic components. One known high-density packaging structure is a laminated circuit board in which wiring boards on which semiconductor devices, electronic components, etc. are mounted are stacked in multiple layers and electrically connected.

[0063] Methods for electrically connecting laminated circuit boards include connection using solder balls and connection using solder to wiring components that have been wired.

[0064] In the future, it is expected that wiring components will be taller and have higher density and narrower pitches for lamination of wiring boards. There is also a demand for wiring components that are precise and easy to assemble on wiring boards.

[0065] However, it has become difficult to hold tall insulating substrates cut into rectangular shapes and position them with precision. Furthermore, while integrated frame-shaped wiring components are easy to assemble, they are formed from substrates that are larger than the outer dimensions of the integrated frame, which means that the substrates inside the frame must be discarded, which tends to increase the environmental impact.

[0066] According to this embodiment, it is possible to provide a wiring component that has high density, narrow pitch wiring and is tall, and that can be easily manufactured with little environmental impact, and a method for manufacturing the same.

[0067] Fifth Embodiment 5A and 5B are schematic diagrams of an imaging module as an example of a module 300 using the wiring component 100 of the fifth embodiment, where FIG. 5A is a projected view seen through from the top, and FIG. 5B is a cross-sectional view taken along line AA' in FIG. 5A.

[0068] The module 300 includes a unit 105 in which an image sensor (imaging element) 240, a frame 230, and a cover 250 are mounted on a wiring board 1001, a wiring board 1002 on which tall components such as electronic components 106 are mounted, and wiring components 100.

[0069] Wiring component 100 has wiring portion 1101 attached to base 101, which has bendable connecting portion 107, with adhesive 108. Four wiring portions 1101 are arranged to surround two electronic components 106. In this example, electronic components 106 are memories such as DRAM memory or flash memory, but may also be power supply ICs, DSPs (Digital Signal Processors), controllers, etc.

[0070] Electrode 220 of wiring board 1001 , electrode 222 of wiring board 1002 , and wiring 103 of wiring portion 1101 of wiring component 100 are electrically and mechanically connected via solder 210 .

[0071] Electrodes 220, 222 are electrodes formed of a conductive metal, such as copper, and are, for example, signal electrodes, power electrodes, ground electrodes, or dummy electrodes. Wiring boards 1001, 1002 are rigid substrates formed of an insulating material such as glass fiber-containing epoxy resin, but they may also be flexible substrates. Wiring boards 1001, 1002 may be printed wiring boards, but the method of forming the wiring on wiring boards 1001, 1002 is not limited to printing and may also be photolithography. Wiring boards 1001, 1002 may also be ceramic substrates or glass substrates.

[0072] 6A and 6B are schematic diagrams of the wiring component of this embodiment, in which FIG. 6A is a top view of an example of the structure of the wiring component, FIG. 6B is a front view of FIG. 6A, and FIG. 6C is a side view of FIG. 6A.

[0073] Wiring component 100 is formed by bonding wiring portion 1101 to base 101 having bendable connecting portion 107 with adhesive 108. Base 101 of wiring component 100 is fixed at base termination portion 1111 to connecting member 111 at the corner with adhesive 108, or by a fitting method, etc.

[0074] The base 101 may be made of a conductive material such as metal, or an insulating material such as Teflon (registered trademark) or polyimide. The bendable connecting portion 107 may be made of the same material and have the same shape as the base 101, as long as it is bendable. In addition, the bendable connecting portion 107 is made bendable by forming grooves, slits, or the like in the base 101 in advance.

[0075] The height Hb of the base 101 is equal to or greater than the height Ha of the wiring 103 of the wiring portion 1101. The material of the base 101 is preferably hard enough to define the height of the solder on the base 101 when the solder melts during the flow process. Since the height of a normal solder is about 0.05 mm to 0.5 mm, the difference between the height Hb of the base 101 and the height Ha of the wiring 103 is preferably 1 mm or less.

[0076] Although it depends on the material, a thinner thickness is preferable to ensure as large a mounting area as possible, but taking into consideration the hardness that allows for the height of the solder to be regulated, a thickness of about 1 mm or less is preferable, so the thickness of the base 101 is preferably 0.5 mm or less.

[0077] Wiring portion 1101 is disposed at a position where electrodes 222 of wiring board 1002 other than bendable connecting portion 107 and wiring 103 of wiring component 100 are electrically and mechanically connected via solder 210 .

[0078] Wiring section 1101 is formed by bonding surfaces 200 and 201, insulating member 102-1 having wiring 103-1, and insulating member 102-2 having wiring 103-2, which are bonded together with insulating adhesive 109. Wiring 103 is connected from bonding surface 200 to 201. Insulating member 102 is a rigid substrate formed from an insulating material such as epoxy resin containing glass fiber. In consideration of increasing the density of mounted components and ensuring a sufficient mounting area, the thickness of the wiring section is preferably about 5 mm or less, and therefore the thickness of the insulating substrate is preferably 2.5 mm or less.

[0079] The wiring section 1101 may be a rectangular strip cut into a rectangular shape. The size is designed appropriately according to the substrate size of the wiring board 1001 and the wiring board 1002 and each electrode, etc. It can be formed from a large substrate like an integrated frame-shaped wiring component, and multiple wiring sections 1101 can be produced from a large substrate without discarding the substrate inside the frame. The main waste is the cutting chips generated when cutting into rectangular shapes, which can greatly reduce the environmental impact. By thinning the width of the blade of the dicing device used for cutting, cutting chips can be further reduced, thereby reducing the environmental impact.

[0080] The wiring 103 may be formed by metal wire embedded in a crimped metal foil or a groove (not shown), by metal plating a through-hole machined with a drill or the like, or by applying a conductive paste with a dispenser or the like and baking it. The shape of the wiring may be round or angular. The material of the wiring 103 may be inorganic, such as copper, silver, or aluminum, or organic, such as conductive rubber.

[0081] The wiring 103 of the wiring section also has a portion where it is connected to the ground wiring of the wiring boards 1001 and 1002. Ground wiring requires lower resistance wiring because it carries a larger current than wiring such as signal lines. To enable the wiring 103 of the wiring section where it is connected to the ground wiring of the wiring boards 1001 and 1002 to handle a larger current, a different conductive material with lower resistance or a thicker wire may be disposed. The width and thickness of the wiring 103 are determined depending on the application such as ground wiring or signal line, but are preferably 0.01 mm or more and 2 mm or less. Considering high-density wiring, a thickness of 0.5 mm or less is more preferable.

[0082] The outer periphery of the wiring component is made smaller than the outer periphery of wiring boards 1001 and 1002. The width is preferably as thin as possible, since this increases the area of ​​components that can be mounted on the wiring board.

[0083] The height of wiring section 1101 is set to be higher than the tallest component, such as electronic component 106. For example, if a component with a height of 1.6 mm is mounted, height H of the wiring component is preferably 1.6 mm or greater. The number of wires and pitch P of the wiring component depend on the number and pitch of electrodes (not shown) on wiring boards 1001 and 1002 to be connected. Wiring component 100 and wiring boards 1001 and 1002 are connected by solder 210 between wires on bonding surface 200 of wiring component 100 and electrodes 220 on wiring board 1001. Similarly, wires on bonding surface 201 of wiring component 100 and electrodes 222 on wiring board 1002 are connected by solder 210.

[0084] Sixth Embodiment 7(a) to 7(e) are schematic diagrams showing an embodiment of a method for manufacturing a wiring component. (a)-1 to (e)-1 are top views of the wiring component. (a)-2 to (e)-2 are side views of the wiring component.

[0085] FIG. 7(a) shows four insulating members 102 (1021, 1022, 1023, 1024), with (a)-1 being a top view and (a)-2 being a side view. The insulating members 102 are rigid substrates made of an insulating material such as epoxy resin. The insulating members 102 have a structure in which an insulating substrate supporting multiple wirings 103-(a) and an insulating substrate supporting multiple wirings 103-(b) are bonded together with an insulating adhesive 109. In this example, the height Ha' of the insulating members 102 is equal to the height Ha of the wirings 103 (Ha = Ha'). FIG. 7(b) is a diagram showing a process of applying an insulating adhesive 108 to the surface of the insulating members 102 by printing or using a dispenser. The insulating adhesive 108 may be any insulating adhesive such as epoxy or silicone. A sheet-like adhesive may also be used.

[0086] 7(c) is a diagram showing a process of bonding the wiring portion 1101 to the base 101 having the bendable connecting portion 107 by aligning with an alignment device (not shown) or the like. The alignment may be performed using a pre-formed alignment mark (not shown). Furthermore, when bonding, a height regulation member (not shown) may be placed in the adhesive 108 so that the thickness of the adhesive 108 is uniform, and bonding may be performed while controlling the thickness of the adhesive to be uniform.

[0087] FIG. 7(d) is a diagram showing a process of bending the base 101 at the bendable connecting portions 107 to form a frame shape. The bending positions may be determined in advance using markers (not shown). When the material of the base 101 is relatively hard and difficult to bend, the bendable connecting portions 107 may be formed in advance with grooves or slits. Alternatively, grooves and slits may be formed at regular intervals in the longitudinal direction on at least one entire surface of the base to allow bending at any location. In this example, the height Hb of the base 101 (connecting portions 107) is greater than the height Ha of the wiring 103 and the height Ha' of the insulating member 102 (Hb>Ha, Hb>Ha').

[0088] FIG. 7( e) shows a process of fixing the base tip end 1111-1 and the base end end 1111-2 with corner connection members 111 to which insulating adhesive 108 has been applied in advance. The base tip end 1111-1 and the base end end 1111-2 may be pre-processed so that they can be fitted together and fixed. The corner connection members 111 may be made of the same material as the base 101, a conductive material such as metal, or an insulating material such as epoxy resin, Teflon, or polyimide, as long as they can fix the base tip end 1111-1 and the base end end 1111-2. Furthermore, screw holes may be formed in the corner connection members 111 so that they can be fixed to the wiring board 1001 or the wiring board 1002 with screws. The size is preferably small to ensure as large a mounting area as possible, but a size of several mm square is necessary to fix the base tip 1111-1 and base end 1111-2, and a size of 2 mm square or less is preferable.

[0089] By using the above process, it is possible to manufacture wiring components and their manufacturing method that have high density, narrow pitch wiring and are tall, and can be easily manufactured with little environmental impact.

[0090] 10(a) to 10(f) are schematic diagrams showing one embodiment of a method for manufacturing an imaging module.

[0091] FIG. 10(a) is a diagram showing a wiring board 1002 before solder paste is applied. The wiring board 1002 has a plurality of electrodes 220. The electrodes 220 are electrodes formed of a conductive metal, such as copper, and are, for example, signal electrodes, power electrodes, ground electrodes, or dummy electrodes. The wiring board 1002 is a rigid substrate formed of an insulating material such as epoxy resin. A solder resist film (not shown) may be provided on the wiring board 1002. In this case, openings are formed in the solder resist film at positions corresponding to the electrodes 220. The shape of the electrodes 220 may be rectangular or round, and the relationship with the solder resist may be so-called SMD or NSMD.

[0092] 10(b) is a diagram showing a process of placing solder paste 211 containing solder powder and flux on electrode 220. Solder paste 211 can be applied by screen printing or a dispenser, for example. It may be applied so as to completely cover electrode 220 as shown in FIG. 10(b), or it may be applied so as to partially cover electrode 220 as in so-called offset printing.

[0093] 10(c) is a diagram showing a process of placing electronic components 106, wiring components 100, and chip components (not shown) on wiring board 1002. Electronic components 106, wiring portions 1101 of wiring components 100, chip components (not shown), etc. are placed on predetermined electrodes 220 using a mounter or the like.

[0094] 10(d) is a diagram showing the process of heating solder paste 211 to a temperature equal to or higher than the melting point of the solder powder, melting and agglomerating the solder powder, and then cooling below the melting point of the solder powder to solidify. When the solder solidifies, electronic components 106, wiring components 100, and chip components (not shown) are electrically and mechanically joined to wiring board 1002. The solder paste heating and cooling processes can be performed, for example, in a reflow furnace.

[0095] In wiring component 100, individual wiring sections 1101 are formed integrally with base 101 into a frame shape, so wiring sections 1101 are unlikely to shift or fall over due to vibrations during handling or reflow after mounting wiring sections 1101. In particular, wiring sections will not fall over even if they are as thin as 1 mm or less in width and 2 mm or more in height.

[0096] When wiring portions 1101 that do not use base 101 are arranged, the wiring portions 1101 may shift or fall over due to vibrations during handling or reflow after mounting the wiring portions 1101. In particular, when the wiring portions are thin, with a width of 1 mm or less, and have a height of 2 mm or more, the risk of falling over increases.

[0097] FIG. 10(e) shows a process of placing solder paste 211 containing solder powder and flux on electrodes 222 of wiring board 1001 on which units 105 are mounted, and then mounting the wiring board 1002 on wiring component 100. Solder paste 211 can be applied by screen printing or a dispenser, for example. It may be applied so as to completely cover electrodes 222 as shown in FIG. 10(e), or it may be applied so as to partially cover electrodes 222, as in so-called offset printing. Wiring board 1001 on which units 105 are mounted is mounted using a mounter or the like so that the wires 103 of the wiring component are positioned on electrodes 222 of wiring board 1001.

[0098] Electrode 222 is an electrode made of a conductive metal, such as copper, and is, for example, a signal electrode, a power electrode, a ground electrode, or a dummy electrode. Wiring board 1001 is a rigid substrate made of an insulating material such as ceramics or epoxy resin. A solder resist film (not shown) may be provided on wiring board 1001. In this case, openings are formed in the solder resist film at positions corresponding to electrodes 222. Note that electrode 222 may be rectangular or round, and its relationship to the solder resist may be so-called SMD or NSMD.

[0099] 10(f) is a diagram showing the process of heating solder paste 211 to a temperature equal to or higher than the melting point of the solder powder, melting and agglomerating the solder powder, and then cooling below the melting point of the solder powder to solidify. When the solder solidifies, wiring board 1001, wiring component 100, and chip component (not shown) are electrically and mechanically joined to wiring board 1001. The heating and cooling process of the solder paste can be performed, for example, in a reflow furnace.

[0100] The module 300 can be manufactured through the above steps.

[0101] Example 1 The wiring component shown in Fig. 6 was manufactured using the manufacturing method described with reference to Fig. 7. In Fig. 7(a), the wiring portion 1101 is a strip with a length L of 41.0 mm, a thickness of the adhesive 109 of 0.085 mm, a thickness T of 1.085 mm, and a height Ha of 1.8 mm. The wiring 103 is densely wired with a copper wiring diameter of 0.2 mm, 140 copper wirings, and a nearest-neighbor pitch P of 0.4 mm. The insulating member 102 is made of FR-4 and has an external size of approximately 41.0 mm x 1.8 mm and a thickness of 0.5 mm.

[0102] Next, as shown in FIG. 7(b), an insulating epoxy adhesive 108 was applied to one surface of the insulating member 102 by squeegee printing to a thickness of about 0.2 mm.

[0103] Next, as shown in FIG. 7(c), four units of wiring part 1101 were attached to a 0.1 mm thick copper plate base 101, with their centers aligned vertically and aligned with markers (not shown) horizontally.

[0104] The length of the base 101 is 172 mm, and the height Hb is 2.0 mm.

[0105] Next, as shown in Figure 7(d), the base 101 was bent at right angles at the center of the bendable connecting portion 107 so that the base tip portion 1111-1 and the base terminal portion 1111-2 were in contact when viewed from above. A scribed line was formed in advance at the center of the bendable connecting portion 107.

[0106] Next, as shown in Figure 7(e), the base tip 1111-1 and base end 1111-2 were fixed to the corner connection members 111 with insulating adhesive 108. The corner connection members 111 were 1 mm square and 1.8 mm high. They were made of the same insulating material as the wiring board material, such as glass fiber epoxy resin.

[0107] As a result of the above, four rectangular wiring portions 1101 were fabricated, each with a length L of 41.0 mm, adhesive 109 thickness of 0.085 mm, thickness T of 1.085 mm, and height of 2.0 mm. A high-density wiring component 100 was then fabricated, with 140 copper wires and a nearest pitch P of 0.4 mm. The ratio of the height of the fabricated wiring component to the nearest pitch of the wires was 5:1 (2:0.4). The wiring density was 3.15 wires / mm2 (140 wires / (41 mm * 1.085 mm)).

[0108] Example 2 8 shows a schematic diagram of the wiring component and its manufacturing method according to Example 2. Figures 8(a)-1 to 8(d)-1 are top views of the wiring component, and Figures 8(a)-2 to 8(e)-2 are side views of the wiring component.

[0109] 8(a), a Teflon-coated copper substrate 101 having a thickness of 0.1 mm is used, which has slits 0.05 mm deep and 0.1 mm wide to form flexible connecting portions 107. In addition, mating portions 0.5 mm long, 0.4 mm wide, and 0.8 mm pitch are formed at the substrate tip 1111-1 and substrate end 1111-2.

[0110] The length of the base 101 is 172 mm, and the height Hb is 2.0 mm.

[0111] Next, as shown in FIG. 8(b), the base 101 was bent at right angles at the bendable connecting portions 107, and the base leading end 1111-1 and the base terminal end 1111-2 were fitted together and fixed when viewed from above.

[0112] Next, as shown in FIG. 7(c), an insulating epoxy adhesive 108 was applied to one surface of the wiring portion 1101 by squeegee printing to a thickness of about 0.2 mm.

[0113] The wiring section 1101 uses FR-4 for the insulating member 102, and copper wiring 103 is formed on both sides of the insulating member 102 with a copper foil thickness of 0.015 mm, and the opening width of the solder resist 104 is 0.2 mm, with a pitch of 0.4 mm. The thickness of the solder resist 104 is 0.02 mm. The wiring section 1101 is a strip with a length L of 41.0 mm, a width W of 0.8 mm, and a height Ha of 1.8 mm, and is highly densely wired with 140 copper wirings and a nearest pitch P of 0.4 mm.

[0114] Next, as shown in FIG. 7(d), four units of wiring section 1101 were attached to base 101, with their centers aligned vertically and aligned with markers (not shown) horizontally. This resulted in four rectangular wiring sections 110, each with a length L of 41.0 mm, an adhesive 109 thickness of 0.085 mm, a thickness T of 0.8 mm, and a height of 2.0 mm. Finally, a high-density wiring component 100 was fabricated, with 140 copper wires and a nearest pitch P of 0.4 mm. The ratio of the height of the fabricated wiring component to the nearest pitch of the wires was 5:1 (2:0.4). The wiring density was 3.15 wires / mm² (140 wires / (41 mm x 1.085 mm)).

[0115] Example 3 Third Embodiment The third embodiment is another embodiment, and top views thereof are shown in FIGS. 9(a), (b), (c), and (d). 9(a), as the wiring portion, through holes of 0.5 mm diameter were drilled in a 2 mm thick insulating member 102 at a nearest pitch P of 0.6 mm, and wiring 103 was formed in the through holes by Au / Ni electroless plating. Except for this, wiring component 100 was produced in the same manner as in Example 1.

[0116] 9(b), the insulating member 102 is made of FR-4, and copper wiring 103 is formed on one side of the insulating member 102, with a copper foil thickness of 0.015 mm, solder resist 104 with an opening width of 0.2 mm, and a pitch of 0.4 mm. The wiring member 1101 is a strip with a length L of 41.0 mm, a thickness T of 0.4 mm, and a height Ha of 1.8 mm, and is densely wired with 140 copper wirings and a nearest pitch P of 0.4 mm. The wiring member 1101 was attached to both sides of the base 101, and the base leading end 1111-1 and the base trailing end 1111-2 were fixed outside the frame using connecting members 111 at the corners, thereby producing the wiring component 100.

[0117] FIG. 9(c) is a diagram showing a base 101 on which a large number of bendable connecting portions 107 are formed. FIG. 9(c)-1 is a top view of the base. FIG. 9(c)-2 is a side view of the base. The base 101 was produced by forming grooves with a depth of 0.2 mm and a width of 0.2 mm at a pitch of 0.4 mm on both sides of a copper plate with a length of 172 mm, a height of 2.0 mm, and a thickness of 0.45 mm. The areas where the wiring portion is not bonded function as bendable connecting portions 107, and can be bent at any location and formed into a frame shape. A wiring component 100 (not shown) was produced in the same manner as in Example 1, except that this base 101 was used.

[0118] As a result of the above, a rectangular wiring component 100 was fabricated with a length L of 41.0 mm, adhesive 109 thickness of 0.085 mm, thickness T of 1.655 mm, and height of 2.0 mm. The number of copper wires was 280, and the nearest pitch P was 0.4 mm. The ratio of the height of the fabricated wiring component to the nearest pitch of the wires was 5:1 (2:0.4). The wiring density was 4.12 wires / mm2 (280 wires / (41 mm * 1.655 mm)).

[0119] Example 4 Using the manufacturing method described with reference to FIG. 10, the module 300 shown in FIG. 5 was manufactured using the wiring component manufactured in Example 1.

[0120] 10(a), second electrodes 220 are formed on wiring board 1002 to which electronic component 106 and wiring component 100 are connected. A solder resist (not shown) is formed on the upper surface of wiring board 1002, partially covering second electrodes 220. Connection openings for connecting electronic component 106 and wiring component 100 to be mounted are provided in the solder resist, each located above second electrodes 220, and second electrodes 220 are exposed in the connection openings.

[0121] Wiring board 1002 uses FR-4 for insulating member 102 and has an external size of approximately 50.0 mm × 50.0 mm. Second electrodes 220 are made of copper, have a diameter of 0.2 mm, and are arranged in a staggered pattern with a 0.4 mm pitch between adjacent electrodes. The solder resist is approximately 0.02 mm thick. Solder balls are pre-mounted on the backside of electronic component 106, and second electrodes 220 are arranged at positions corresponding to the solder balls to connect to electronic component 106. Electronic components such as capacitors and resistors (not shown) are pre-mounted on the backside of wiring board 1002. Electronic component 106 has an external size of approximately 16.0 mm × 16.0 mm and a height of 1.6 mm.

[0122] 10(b), solder paste 211 was screen-printed to cover second electrodes 220 of wiring board 1002. A printing plate with a thickness of 0.02 mm was used for the screen printing.

[0123] The solder paste 211 contains SnAgCu solder powder and flux. The alloy composition of the solder powder is tin-balance silver-3 copper-3 with a melting point of 220°C, and the average particle size of the powder is 40 μm.

[0124] Next, as shown in FIG. 10( c), a mounter was used to mount electronic components 106, wiring components 100, and chip components (not shown) on wiring board 1002 to which solder paste 211 had been applied. The mounting was performed so that the wiring 103 on the bonding surface 201 of wiring portion 1101 of wiring component 100 corresponded to the second electrode 220 of wiring board 1002. Electronic component 106 was mounted so that the solder balls (not shown) of electronic component 106 corresponded to the second electrode 220 of wiring board 1002. Wiring component 100 had a thickness T of 1.085 mm, and after being mounted on wiring board 1001, it stood on its own without any holding mechanism. Five wiring components 100 were arranged to surround two electronic components 106.

[0125] 10(d), the board was placed in a reflow furnace, and the solder paste 211 was heated to a temperature equal to or higher than the melting point of the solder powder, causing the solder powder to melt and agglomerate to form solder 210. The solder 210 electrically and mechanically joined the electronic component 106, the wiring component 100, and the chip component (not shown) to the wiring board 1002.

[0126] 10(e), first electrodes 222 of wiring board 1001, on which solder paste 211 has been screen-printed, are mounted on wiring board 1002 in positions corresponding to wiring 103 on bonding surface 200 of wiring component 100. Unit 105 is configured by mounting image sensor (imaging element) 240, frame 230, and glass lid 250 on wiring board 1001. A solder resist (not shown) is formed on the back surface of wiring board 1001, partially covering first electrodes 222. Connection openings to which wiring component 100 is connected are provided in the solder resist, each positioned above first electrodes 222, and first electrodes 222 are exposed in the connection openings.

[0127] Wiring board 1001 uses a low thermal expansion coefficient wiring substrate for insulating member 102, and has an external size of approximately 52.0 mm × 52.0 mm. First electrodes 222 are made of copper, and first electrodes 222 connected to wiring 103 of wiring portion 1101 of wiring component 100 have a diameter of 0.2 mm and are arranged in a staggered pattern with a nearest neighbor pitch of 0.4 mm.

[0128] 10(f), the assembly is placed in a reflow furnace, where solder paste 211 is heated to a temperature above the melting point of the solder powder, causing the solder powder to melt and agglomerate to form solder 210. Solder 210 electrically and mechanically joins wiring board 1001 and wiring component 100. As a result, electrode 220 of wiring board 1001, electrode 222 of wiring board 1002, and wiring 103 of wiring portion 1101 of wiring component 100 are electrically and mechanically connected via solder 210.

[0129] Through the above-described process, module 300 using the wiring component of this example can be manufactured. The imaging module had no peeling at the bonding surface of the wiring component, no solder joint defects, and the optical performance of the built-in CMOS image sensor was fully guaranteed.

[0130] Similarly, an imaging module was fabricated by laminating wiring board 1001 carrying an imaging element and wiring board 1002 carrying electronic components, a power supply, etc., using the wiring components manufactured in Examples 2 and 3. There was no peeling at the bonding surface of the wiring portion, and the imaging module had no solder joint defects, and the optical performance of the built-in CMOS image sensor could be fully guaranteed.

[0131] (Comparative Example) In the comparative example, wiring part 1101 of Examples 1 to 3 was used freestanding without being attached to a base, and other points and processes were the same as those of Example 4, and a full-size image sensor was used for unit 105, and an imaging module was formed by laminating wiring board 1001 and wiring board 1002 on which electronic components, a power supply, etc. were mounted. After the wiring components were mounted, they fell over before or during reflow.

[0132] The imaging modules had many solder joint defects such as shorts, opens, and solder balls, making it impossible to fully guarantee the optical performance of the built-in CMOS image sensor. Even in imaging modules with no solder joint defects, open joints and other solder joint defects occurred during drop tests, making it impossible to fully guarantee the optical performance of the built-in CMOS image sensor.

[0133] FIG. 11 is an explanatory diagram of a digital camera 600, which is an electronic device as an example of the device of this embodiment.

[0134] Digital camera 600, an electronic device, is an interchangeable-lens digital camera and includes a camera body 601. A lens unit (lens barrel) 602 including a lens is detachable. Camera body 601 includes a housing 611, a module 300 disposed within the housing, and a circuit board 700. Module 300 and circuit board 700 are electrically connected by a cable 950.

[0135] Module 300 has wiring board 1001 on which unit 105 is mounted, wiring board 1002 on which tall components such as electronic component 106 are mounted, and wiring component 100. Unit 105 has wiring board 1001, which includes electronic component 240, which is an image sensor (imaging element), and lid 250, and wiring board 1002, which are electrically connected via wiring component 100. Circuit board 700 has image processing device 800, which is an example of an electronic component, and wiring board 900 on which image processing device 800 is mounted.

[0136] The image sensor (imaging element) is, for example, a complementary metal oxide semiconductor (CMOS) image sensor or a charge coupled device (CCD) image sensor. The image sensor has a function of converting light incident via the lens unit 602 into an electrical signal.

[0137] The image processing device 800 is, for example, a digital signal processor, and has the function of acquiring an electric signal from an image sensor, correcting the acquired electric signal, and generating image data.

[0138] The embodiments described above can be modified as appropriate without departing from the technical concept. For example, multiple embodiments can be combined. Furthermore, some features of at least one embodiment can be deleted or replaced. Furthermore, new features can be added to at least one embodiment.

[0139] The disclosure of this specification includes not only what is explicitly described in this specification, but also all matters that can be understood from this specification and the drawings attached hereto. Furthermore, the disclosure of this specification includes the complement of the individual concepts described in this specification. For example, if this specification states that "A is greater than B," it can be said that this specification discloses that "A is not greater than B," even if it omits the statement that "A is not greater than B." This is because when "A is greater than B," it is assumed that the case in which "A is not greater than B" is taken into consideration. [Explanation of symbols]

[0140] 100 Wiring parts 110, 1101, 1102 Wiring section 107, 1071 Connection part 103 Wiring

Claims

1. a first wiring section having a plurality of wirings arranged in a first direction; a second wiring section having a plurality of wirings arranged in a second direction; a connecting portion that connects the first wiring portion and the second wiring portion, the first wiring section includes a first insulating member that supports a group of wires in the first wiring section; the second wiring section includes a second insulating member that supports a group of wires in the second wiring section, a base provided across the first wiring portion, the connecting portion, and the second wiring portion; the first insulating member is bonded to the base via an adhesive; the second insulating member is bonded to the base via an adhesive; The wiring component is capable of changing the angle between the first direction and the second direction by deformation of the base at the connecting portion.

2. the connecting portion connecting the first wiring portion and the second wiring portion is a first connecting portion, a third wiring section having a plurality of wirings arranged in a third direction; a second connecting portion that connects the second wiring portion and the third wiring portion, the base is provided across the second wiring portion, the second connecting portion, and the third wiring portion, The wiring component according to claim 1 , wherein the angle between the second direction and the third direction is changeable by deformation of the base at the second connecting portion.

3. a fourth wiring section having a plurality of wirings arranged in a fourth direction; a third connection portion that connects the third wiring portion and the fourth wiring portion, the base is provided across the third wiring portion, the third connecting portion, and the fourth wiring portion, The wiring component according to claim 2 , wherein the angle between the third direction and the fourth direction is changeable by deformation of the base at the third connecting portion.

4. The wiring component according to claim 1 , wherein the deformation is plastic deformation.

5. 5. The wiring component according to claim 1, wherein the material of the substrate is polyimide.

6. The wiring component according to claim 1 , wherein the first insulating member and the second insulating member are made of an epoxy resin.

7. the first wiring section includes a third insulating member that supports a group of wires in the first wiring section; the second wiring section includes a fourth insulating member that supports a group of wires in the second wiring section, The wiring component according to claim 1 , wherein the base is located between the first insulating member and the third insulating member and between the second insulating member and the fourth insulating member.

8. A first step of preparing the wiring component according to any one of claims 1 to 7; a second step of connecting one of the plurality of wires of the wiring component to a first electrode of a first wiring board; a third step of connecting one of the plurality of wirings of the wiring component to a second electrode of a second wiring board; A method for manufacturing a module, comprising:

9. 9. The manufacturing method according to claim 8, wherein in the third step, the wiring component is positioned between the first wiring board and the second wiring board.

10. 10. The manufacturing method according to claim 8, wherein a first electronic component is mounted on the first wiring board, and a second electronic component is mounted on the second wiring board.

11. The manufacturing method according to claim 10 , wherein the first electronic component and the second electronic component are electrically connected via the wiring component.

12. The manufacturing method according to claim 10 or 11, wherein the second wiring board is located between the first wiring board and the second electronic component.

13. a first step of preparing the wiring component according to claim 2 or 3; a second step of placing the wiring component on a wiring board, the wiring component includes a base body that configures the first connecting portion and the second connecting portion and has a first portion included in the first wiring portion, a second portion included in the second wiring portion, and a third portion included in the third wiring portion; A method for manufacturing a module, characterized in that in the second step, the wiring component is arranged on the wiring board so that the first portion and the third portion are positioned between the plurality of wirings included in the first wiring section and the plurality of wirings included in the third wiring section.

14. a first step of preparing the wiring component according to claim 2 or 3; a second step of placing the wiring component on a wiring board, the wiring component includes a base body that configures the first connecting portion and the second connecting portion and has a first portion included in the first wiring portion, a second portion included in the second wiring portion, and a third portion included in the third wiring portion; A method for manufacturing a module, characterized in that in the second step, the wiring component is arranged on the wiring board so that the plurality of wirings included in the first wiring section and the plurality of wirings included in the third wiring section are positioned between the first part and the third part.

15. 14. The manufacturing method according to claim 8, wherein a first angle formed between the first direction and the second direction in the first step is smaller than a second angle formed between the first direction and the second direction in the second step.

16. a first wiring board; a second wiring board overlapping the first wiring board; The wiring component according to any one of claims 1 to 7, the wiring component is disposed between the first wiring board and the second wiring board, one of the plurality of wirings of the wiring component is connected to a first electrode of the first wiring board; a module, wherein one of the plurality of wirings of the wiring component is connected to a second electrode of the second wiring board;

17. A module according to claim 16; a housing that houses the module; Equipment comprising:

Images