Photosensitive composition and its uses

Abstract

To provide a photosensitive composition that can be used to produce a cured film which offers a superior pattern shape and exhibits superior solvent resistance and high-temperature high-humidity resistance even after low-temperature post-baking.SOLUTION: The above problem is cleared by a photosensitive composition containing a near-infrared absorbing pigment (A), an alkali-soluble resin (B), a polymerizable compound (C), and a photopolymerization initiator (D), the polymerizable compound (C) containing a polymerizable compound (C1) having two (meth)acryloyl groups and a ring structure.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a photosensitive composition containing a near-infrared absorbing dye. [Background technology]

[0002] Video cameras, digital cameras, smartphones, and the like use solid-state imaging devices for color images, such as CCDs (charge-coupled devices) and CMOSs ​​(complementary metal-oxide semiconductors). The light-receiving sections of these solid-state imaging devices use silicon photodiodes that are sensitive to infrared light, so luminosity correction is required, and an infrared cut filter or the like is provided. The infrared cut filter is manufactured using, for example, a composition containing a near-infrared absorbing dye.

[0003] Conventionally, infrared cut filters have been used as flat films, but in recent years, it has been considered to form patterns of infrared cut filters using photolithography. In photolithography, a pattern can be formed by applying a photosensitive composition to a glass substrate and drying the coating to remove the solvent, irradiating the coating with active energy rays (such as i-rays) through a photomask having a desired pattern shape and curing it (hereinafter referred to as exposure), then washing and removing the unexposed areas (hereinafter referred to as development), and then performing a heat treatment (hereinafter referred to as post-baking) to sufficiently harden the cured film.

[0004] Post-baking is typically performed at a temperature of 200 to 250°C for 10 to 60 minutes to accelerate curing and improve the resistance of the cured film. However, near-infrared absorbing dyes have low heat resistance and tend to lose their near-infrared absorption ability during post-baking, so post-baking is performed at a low temperature. This can lead to insufficient curing of the film, which can cause problems such as reduced solvent resistance and resistance to high-temperature, high-humidity environments.

[0005] Methods that have been investigated to obtain sufficient resistance even to low-temperature post-baking include, for example, increasing the amount of active radicals generated, i.e., using or increasing the amount of a highly sensitive photopolymerization initiator, increasing the exposure dose, etc. However, these methods have the problem that the reaction continues to the area covered by the mask, resulting in a thicker line width of the pattern and making it impossible to obtain a pattern of the desired size. Furthermore, heat sagging is unlikely to occur during post-baking at low temperatures, and the cross-sectional shape of the pattern is likely to deteriorate. In particular, compositions containing near-infrared absorbing dyes have the problem that it is difficult to obtain a desired pattern shape because they are prone to transmit actinic energy rays.

[0006] Patent Document 1 discloses an invention for forming a fine pattern using a photosensitive composition containing a phthalocyanine compound having an absorption maximum wavelength in the near-infrared region, a binder resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent. Patent Document 2 discloses an invention for a pattern-forming composition containing an infrared-absorbing dye and a resin having a glass transition temperature of 150 to 300°C. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-160380 [Patent Document 2] International Publication No. 2019 / 058882 Summary of the Invention [Problem to be solved by the invention]

[0008] However, with the compositions described in Patent Documents 1 and 2, it is difficult to obtain a good pattern shape, and the resistance of the cured film cannot be satisfied with low-temperature post-baking.

[0009] An object of the present invention is to provide a photosensitive composition capable of forming a cured film that has excellent pattern shape, and that has excellent solvent resistance and high-temperature and high-humidity resistance even after low-temperature post-baking. [Means for solving the problem]

[0010] The present invention provides a photosensitive composition comprising a near-infrared absorbing dye (A), an alkali-soluble resin (B), a polymerizable compound (C), and a photopolymerization initiator (D), The present invention relates to a photosensitive composition in which the polymerizable compound (C) comprises a polymerizable compound (C1) having two (meth)acryloyl groups and a ring structure. [Effects of the Invention]

[0011] According to the present invention, there is provided a photosensitive composition capable of forming a cured film having an excellent pattern shape and excellent solvent resistance and high-temperature and high-humidity resistance even after low-temperature post-baking. The present invention also provides a cured film, an optical filter, an image display device, a solid-state imaging device, and an infrared sensor. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a schematic cross-sectional view of an image display device provided with the cured film of the present invention. [Figure 2] FIG. 2 is a schematic cross-sectional view of a solid-state imaging device provided with the cured film of the present invention. [Figure 3] FIG. 3 shows a schematic cross-sectional view of an infrared sensor provided with the cured film of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments for carrying out the photosensitive composition of the present invention will be described in detail. Note that the present invention is not limited to the following embodiments, and can be modified and carried out within a range that can solve the problems.

[0014] In the present invention, unless otherwise specified, "(meth)acryloyl," "(meth)acrylic," "(meth)acrylic acid," "(meth)acrylate," or "(meth)acrylamide" means "acryloyl and / or methacryloyl," "acrylic and / or methacrylic," "acrylic acid and / or methacrylic acid," "acrylate and / or methacrylate," or "acrylamide and / or methacrylamide," respectively. Furthermore, "CI" refers to the Color Index (CI; published by The Society of Dyers and Colourists). The polymerizable unsaturated group is an ethylenically unsaturated double bond. The molecular weight of the compound in the present invention is a calculated value or a molecular weight measured by ESI-MS (electrospray ionization mass spectrometry) for low molecular weight compounds whose molecular weight can be specified, and is a polystyrene-equivalent weight average molecular weight measured by gel permeation chromatography using tetrahydrofuran as a solvent for compounds having a molecular weight distribution. A monomer is a compound that polymerizes to form a resin. A monomer is in an unreacted state, and a monomer unit is a monomer that forms a resin after polymerization. The polymerizable compound is a compound that forms a coating by polymerization. A fused ring structure refers to a structure in which two or more rings share a side in a one-to-one relationship. A structure in which at least one ring is an aromatic ring is called an aromatic fused ring structure, and a structure in which all rings are aliphatic rings is called an aliphatic fused ring structure.

[0015] <Photosensitive composition> The photosensitive composition of the present invention is a photosensitive composition comprising a near-infrared absorbing dye (A), an alkali-soluble resin (B), a polymerizable compound (C), and a photopolymerization initiator (D), The polymerizable compound (C) is characterized in that it contains a polymerizable compound (C1) having two (meth)acryloyl groups and a ring structure.

[0016] The mechanism by which the photosensitive composition having the above-described configuration can solve the problems of the present invention is unclear, but is speculated as follows. Compared to the penta- or hexafunctional (meth)acrylates that have been widely used in forming patterns by conventional photolithography, the polymerizable compound (C1) having two (meth)acryloyl groups and a ring structure has fewer crosslinking sites and a milder reaction rate. Therefore, even if a highly sensitive photopolymerization initiator is used or the exposure dose is increased, the reaction is unlikely to proceed to areas covered by a mask, resulting in a pattern of the desired width. Furthermore, because the crosslink density in the cured film is low, it is likely to soften due to heat, and thermal sagging occurs even after post-baking at low temperatures, resulting in a good cross-sectional shape of the pattern. Furthermore, because the compound has a ring structure, it is speculated that a rigid structure is formed despite the low crosslink density, resulting in a highly resistant cured film.

[0017] [Near-infrared absorbing dye (A)] The photosensitive composition of the present invention contains a near-infrared absorbing dye (A).

[0018] The near-infrared absorbing colorant (A) is a compound having a maximum absorption in a wavelength range of 700 to 2,000 nm, and may be a pigment (also called a near-infrared absorbing pigment) or a dye (also called a near-infrared absorbing dye). A near-infrared absorbing pigment and a near-infrared absorbing dye may also be used in combination. From the viewpoint of heat resistance, a near-infrared absorbing pigment is preferred. In the present invention, the near-infrared absorbing pigment preferably has a solubility in 100 g of propylene glycol monomethyl ether acetate at 25° C. of less than 2 g, more preferably less than 1 g, and particularly preferably 0.5 g or less.

[0019] Examples of the near-infrared absorbing dye (A) include cyanine compounds, phthalocyanine compounds, naphthalocyanine compounds, indigo compounds, immonium compounds, anthraquinone compounds, pyrrolopyrrole compounds, squarylium compounds, croconium compounds, etc. Among these, from the viewpoints of near-infrared absorbing ability and heat resistance, one or more compounds selected from the group consisting of naphthalocyanine compounds, pyrrolopyrrole compounds, squarylium compounds, and indigo compounds are preferred, and indigo compounds and naphthalocyanine compounds are more preferred.

[0020] Cyanine compounds are disclosed in WO 2006 / 006573, WO 2010 / 073857, JP 2013-241598, JP 2016-113501, JP 2016-113504, etc.; phthalocyanine compounds are disclosed in JP 4-23868, JP 06-192584, JP 2000-63691, WO 2014 / 208514, etc. Naphthalocyanine compounds are disclosed in JP-A-11-152414, JP-A-2000-86919, JP-A-2009-29955, WO 2018 / 186490, etc.; indigo compounds are disclosed in JP-A-2012-224593, JP-A-2013-87233, JP-A-2013-230412, etc.; immonium compounds are disclosed in JP-A-2005-336150, JP-A-20 Anthraquinone compounds are disclosed in JP-A-62-903 and JP-A-1-172458, etc.; pyrrolopyrrole compounds are disclosed in JP-A-2009-263614, JP-A-2010-90313, JP-A-2011-068731, JP-A-2014-130348, WO 2015 / 166873, etc.; squari Examples of sodium compounds include those described in JP 2011-132361 A, JP 2016-142891 A, WO 2017 / 135359 A, WO 2018 / 225837 A, JP 2019-001987 A, WO 2020 / 054718 A, WO 2021 / 029195 A, and the like; examples of croconium compounds include those described in WO 2019 / 021767 A, and the like.

[0021] (Squarylium compounds) The squarylium compound is preferably a compound represented by the following general formula (1). General formula (1) [ka]

[0022] In general formula (1), R 1 ~R 4 each independently represents a hydrogen atom, a halogen atom, a cyano group, a nitro group, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, an aralkyl group, -OR 10 , -COR 11 , -COOR 12 , -OCOR 13 , -NR 14 R 15 , -NHCOR 16 , -CONR 17 R 18 , -NHCONR 19 R 20 , -NHCOOR 21 , -SR 22 , -SO2R 23 , -SO2OR 24 , -NHSO2R 25 , -SO2NR 26 R 27 , -B(OR 28 )2, and -NHBR 29 R 30 Represents R 10 ~R 30 each independently represents a hydrogen atom, an alkyl group which may have a substituent, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, or an aralkyl group. 12 R 12 When -SO2OR is a hydrogen atom (i.e., a carboxyl group), the hydrogen atom may dissociate (i.e., a carbonate group) or may be in the form of a salt. 24 R 24 When R is a hydrogen atom (i.e., a sulfo group), the hydrogen atom may be dissociated (i.e., a sulfonate group) or may be in the form of a salt. 1 and R2 , R 3 and R 4 may be bonded to each other to form a ring.

[0023] The "substituent" may be a halogen atom, a cyano group, a nitro group, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, an aralkyl group, -OR 100 , -COR 101 , -COOR 102 , -OCOR 103 , -NR 104 R 105 , -NHCOR 106 , -CONR 107 R 108 , -NHCONR 109 R 110 , -NHCOOR 111 , -SR 112 , -SO2R 113 , -SO2OR 114 , -NHSO2R 115 or -SO2NR 116 R 117 Examples include: R 100 ~R 117 each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, or an aralkyl group. 102 R 102 When -SO2OR is a hydrogen atom (i.e., a carboxyl group), the hydrogen atom may dissociate (i.e., a carbonate group) or may be in the form of a salt. 114 R 114 When is a hydrogen atom (ie, a sulfo group), the hydrogen atom may be dissociated (ie, a sulfonate group) or may be in the form of a salt.

[0024] Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. The number of carbon atoms in the alkyl group is preferably 1 to 20, more preferably 1 to 12, and particularly preferably 1 to 8. The alkyl group may be linear, branched, or cyclic. The number of carbon atoms in the alkenyl group is preferably 2 to 20, more preferably 2 to 12, and particularly preferably 2 to 8. The alkenyl group may be linear, branched, or cyclic. The number of carbon atoms in the alkynyl group is preferably 2 to 20, more preferably 2 to 12, and particularly preferably 2 to 8. The alkynyl group may be linear, branched, or cyclic. The aryl group preferably has 6 to 25 carbon atoms, more preferably 6 to 15 carbon atoms, and particularly preferably 6 to 10 carbon atoms. The alkyl portion of the aralkyl group is the same as the alkyl group described above. The aryl portion of the aralkyl group is the same as the aryl group described above. The aralkyl group preferably has 7 to 40 carbon atoms, more preferably 7 to 30 carbon atoms, and particularly preferably 7 to 25 carbon atoms. The heteroaryl group is preferably a monocyclic ring or a fused ring, more preferably a monocyclic ring or a fused ring having 2 to 8 rings, and particularly preferably a monocyclic ring or a fused ring having 2 to 4 rings. The number of heteroatoms constituting the ring of the heteroaryl group is preferably 1 to 3. The heteroatoms constituting the ring of the heteroaryl group are preferably nitrogen atoms, oxygen atoms, or sulfur atoms. The heteroaryl group is preferably a 5-membered or 6-membered ring. The number of carbon atoms constituting the ring of the heteroaryl group is preferably 3 to 30, more preferably 3 to 18, and particularly preferably 3 to 12. The alkyl group, alkenyl group, alkynyl group, aryl group, heteroaryl group, and aralkyl group may have a substituent or may be unsubstituted. Examples of the substituent include the "substituents" described above.

[0025] From the viewpoint of light resistance and heat resistance, the squarylium compound is more preferably a compound represented by the following general formula (2).

[0026] General formula (2) [ka]

[0027] In general formula (2), R 5 ~R 8each independently represents a hydrogen atom, a halogen atom, a cyano group, a nitro group, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, an aralkyl group, -OR 50 , -COR 51 , -COOR 52 , -OCOR 53 , -NR 54 R 55 , -NHCOR 56 , -CONR 57 R 58 , -NHCONR 59 R 60 , -NHCOOR 61 , -SR 62 , -SO2R 63 , -SO2OR 64 , -NHSO2R 65 or -SO2NR 66 R 67 , -B(OR 68 )2, and -NHBR 69 R 70 Represents R 50 ~R 70 each independently represents a hydrogen atom, an alkyl group which may have a substituent, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, or an aralkyl group. 52 R 52 When -SO2OR is hydrogen (i.e., a carboxyl group), the hydrogen atom may dissociate (i.e., a carbonate group) or may be in the form of a salt. 64 R 64 When R is a hydrogen atom (i.e., a sulfo group), the hydrogen atom may be dissociated (i.e., a sulfonate group) or may be in the form of a salt. 5 and R 6 , R 7 and R 8 may be bonded to each other to form a ring.

[0028] The "substituent" has the same meaning as the "substituent" described above.

[0029] Specific examples of squarylium compounds are shown below, but the present invention is not limited to these.

[0030] [ka]

[0031] [ka]

[0032] (Pyrrolopyrrole compounds) The pyrrolopyrrole compound is preferably a compound represented by the following general formula (3).

[0033] General formula (3) [ka]

[0034] In general formula (3), R 1x and R 1y each independently represents an alkyl group, an aryl group, or a heteroaryl group; R 2 and R 3 each independently represents a hydrogen atom or a substituent, R 2 and R 3 may be bonded to each other to form a ring, R 4 represents a hydrogen atom, an alkyl group, an aryl group, a heteroaryl group, -BR 4x R 4y or a metal atom, R 4 is R 1x , R 1y and R 3 may be covalently or coordinately bonded to at least one selected from the group consisting of R 4x R 4y each independently represents a substituent. General formula (3) is described in, for example, JP-A Nos. 2009-263614, 2011-68731, and WO 2015 / 166873.

[0035] R 1x and R 1yare each independently preferably an aryl group or a heteroaryl group, more preferably an aryl group. 1x and R 1y The alkyl group, aryl group, and heteroaryl group represented by may have a substituent or may be unsubstituted. Examples of the substituent include an alkoxy group, a hydroxy group, a halogen atom, a cyano group, a nitro group, -OCOR 11 , -SOR 12 , -SO2R 13 etc. R 11 ~R 13 each independently represents a hydrocarbon group or a heteroaryl group. Examples of the substituent include those described in paragraphs 0020 to 0022 of JP-A No. 2009-263614. Among them, examples of the substituent include an alkoxy group, a hydroxy group, a halogen atom, a cyano group, a nitro group, -OCOR 11 , -SOR 12 , -SO2R 13 is preferred. 1x and R 1y The group represented by the formula: is an alkoxy group having a branched alkyl group, or -OCOR 11 An aryl group having as a substituent a group represented by the following formula: embedded image is preferred. The branched alkyl group preferably has 3 to 30 carbon atoms, more preferably 3 to 20 carbon atoms.

[0036] R 2 and R 3 At least one of R is preferably an electron-withdrawing group. 2 represents an electron-withdrawing group, and R 3 represents a heteroaryl group. The heteroaryl group is preferably a 5-membered or 6-membered ring. The heteroaryl group is preferably a monocyclic or fused ring, preferably a monocyclic or fused ring having 2 to 8 rings, more preferably a monocyclic or fused ring having 2 to 4 rings. The number of heteroatoms constituting the heteroaryl group is preferably 1 to 3, more preferably 1 or 2. Examples of heteroatoms include nitrogen atoms, oxygen atoms, and sulfur atoms. The heteroaryl group preferably has one or more nitrogen atoms. The two R in general formula (3) 2 In addition, the two R3 They may be the same or different.

[0037] R 4 represents a hydrogen atom, an alkyl group, an aryl group, a heteroaryl group, or -BR 4x R 4y is preferably a hydrogen atom, an alkyl group, an aryl group, or a group represented by -BR 4x R 4y A group represented by -BR 4x R 4y Particularly preferred is a group represented by R 4x R 4y The substituent represented by is preferably a halogen atom, an alkyl group, an alkoxy group, an aryl group, or a heteroaryl group, more preferably an alkyl group, an aryl group, or a heteroaryl group, and particularly preferably an aryl group. These groups may further have a substituent. 4 They may be the same or different.

[0038] Specific examples of pyrrolopyrrole compounds are shown below. In the following structural formulas, Me represents a methyl group, and Ph represents a phenyl group. Examples of pyrrolopyrrole compounds include the compounds described in paragraphs 0016 to 0058 of JP 2009-263614 A, paragraphs 0037 to 0052 of JP 2011-68731 A, paragraphs 0014 to 0027 of JP 2014-130343 A, and paragraphs 0010 to 0033 of WO 2015 / 166873 A. However, the present invention is not limited thereto.

[0039] [ka]

[0040] (Naphthalocyanine compounds) The naphthalocyanine compound is preferably a compound represented by the following general formula (4).

[0041] General formula (4) [ka]

[0042] In general formula (4), X1~X8, Y l Each of Y8 independently represents a hydrogen atom, a halogen atom, a nitro group, a sulfonic acid group, an alkyl group which may have a substituent, an aryl group which may have a substituent, a cycloalkyl group which may have a substituent, a heterocyclic group which may have a substituent, an alkoxyl group which may have a substituent, an aryloxy group which may have a substituent, an alkylthio group which may have a substituent, an arylthio group which may have a substituent, a phthalimidomethyl group which may have a substituent, or a sulfamoyl group which may have a substituent. X1 to X8 may also be bonded to each other to form an aromatic ring which may have a substituent. However, any one or more of X1 and X2, X3 and X4, X5 and X6, and X7 and X8 may be bonded to each other to form an aromatic ring which may have a substituent. Z is a polymer moiety containing a monomer unit represented by the following general formula (5) or a phosphorus compound moiety represented by the following general formula (6), and * is a bond to Al.

[0043] Examples of the "alkyl group" in the alkyl group which may have a substituent include a straight-chain or branched alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, a neopentyl group, an n-hexyl group, an n-octyl group, a stearyl group, a 2-ethylhexyl group, etc. Examples of the "alkyl group having a substituent" include a trichloromethyl group, a trifluoromethyl group, a 2,2,2-trifluoroethyl group, a 2,2-dibromoethyl group, a 2,2,3,3-tetrafluoropropyl group, a 2-ethoxyethyl group, a 2-butoxyethyl group, a 2-nitropropyl group, a benzyl group, a 4-methylbenzyl group, a 4-tert-butylbenzyl group, a 4-methoxybenzyl group, a 4-nitrobenzyl group, a 2,4-dichlorobenzyl group, etc.

[0044] Examples of the "aryl group" of the aryl group which may have a substituent include a phenyl group, a naphthyl group, an anthryl group, and the like. Examples of the "substituted aryl group" include a p-methylphenyl group, a p-bromophenyl group, a p-nitrophenyl group, a p-methoxyphenyl group, a 2,4-dichlorophenyl group, a pentafluorophenyl group, a 2-aminophenyl group, a 2-methyl-4-chlorophenyl group, a 4-hydroxy-1-naphthyl group, a 6-methyl-2-naphthyl group, a 4,5,8-trichloro-2-naphthyl group, an anthraquinonyl group, and a 2-aminoanthraquinonyl group.

[0045] Examples of the "cycloalkyl group" of the cycloalkyl group which may have a substituent include a cyclopentyl group, a cyclohexyl group, an adamantyl group, and the like. Examples of the "substituted cycloalkyl group" include a 2,5-dimethylcyclopentyl group, a 4-tert-butylcyclohexyl group, and the like.

[0046] Examples of the "heterocyclic group" of the heterocyclic group which may have a substituent include a pyridyl group, a pyrazyl group, a piperidino group, a pyranyl group, a morpholino group, an acridinyl group, etc. Examples of the "heterocyclic group having a substituent" include a 3-methylpyridyl group, an N-methylpiperidyl group, an N-methylpyrrolyl group, etc.

[0047] Examples of the "alkoxyl group" in the alkoxyl group which may have a substituent include linear or branched alkoxyl groups such as a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, an n-butoxy group, an isobutoxy group, a tert-butoxy group, a neopentyloxy group, a 2,3-dimethyl-3-pentyloxy group, an n-hexyloxy group, an n-octyloxy group, a stearyloxy group, and a 2-ethylhexyloxy group. Examples of the "substituted alkoxyl group" include a trichloromethoxy group, a trifluoromethoxy group, a 2,2,2-trifluoroethoxy group, a 2,2,3,3-tetrafluoropropoxy group, a 2,2-ditrifluoromethylpropoxy group, a 2-ethoxyethoxy group, a 2-butoxyethoxy group, a 2-nitropropoxy group, and a benzyloxy group.

[0048] Examples of the "aryloxy group" of the aryloxy group which may have a substituent include a phenoxy group, a naphthoxy group, an anthryloxy group, etc. Examples of the "substituted aryloxy group" include a p-methylphenoxy group, a p-nitrophenoxy group, a p-methoxyphenoxy group, a 2,4-dichlorophenoxy group, a pentafluorophenoxy group, and a 2-methyl-4-chlorophenoxy group.

[0049] Examples of the "alkylthio group" of the alkylthio group which may have a substituent include a methylthio group, an ethylthio group, a propylthio group, a butylthio group, a pentylthio group, a hexylthio group, an octylthio group, a decylthio group, a dodecylthio group, and an octadecylthio group. Examples of the "substituted alkylthio group" include a methoxyethylthio group, an aminoethylthio group, a benzylaminoethylthio group, a methylcarbonylaminoethylthio group, and a phenylcarbonylaminoethylthio group.

[0050] Examples of the "arylthio group" of the arylthio group which may have a substituent include a phenylthio group, a 1-naphthylthio group, a 2-naphthylthio group, and a 9-anthrylthio group. Examples of the "substituted arylthio group" include a chlorophenylthio group, a trifluoromethylphenylthio group, a cyanophenylthio group, a nitrophenylthio group, a 2-aminophenylthio group, and a 2-hydroxyphenylthio group.

[0051] Examples of the substituent on the aromatic ring which may have a substituent include a halogen atom, a nitro group, a nitrile group, a carboxyl group, a sulfone group, an alkyl group which may have a substituent, an aryl group which may have a substituent, a cycloalkyl group which may have a substituent, an alkoxyl group which may have a substituent, an aryloxy group which may have a substituent, an alkylthio group which may have a substituent, and an arylthio group which may have a substituent.

[0052] General formula (5) [ka]

[0053] In the general formula (5), X is -CONH-R 25 -,-COO-R 26 -, -CONH-R 27 -O-, -COO-R 28 -O-. R 25 ~R 28 represents an alkylene group or an arylene group in which carbon atoms may be linked by -O-, -CO-, -COO-, -OCO-, -CONH-, or -NHCO-. 31 represents hydrogen or a methyl group.

[0054] Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, and a butylene group. Examples of the arylene group include a phenylene group, a naphthylene group, a biphenylene group, a terphenylene group, and an anthrylene group.

[0055] The monomer unit represented by general formula (5) can be obtained by polymerizing a monomer such as (2-(meth)acryloyloxyethyl) acid phosphate, (2-(meth)acryloyloxypropyl) acid phosphate, (2-(meth)acryloyloxyisopropyl) acid phosphate, etc. Alternatively, it can be obtained by copolymerizing a monomer other than these monomers (hereinafter also referred to as other monomers) in combination.

[0056] Examples of other monomers include (meth)acrylic acid esters, crotonate esters, vinyl esters, maleic acid diesters, fumaric acid diesters, itaconic acid diesters, (meth)acrylamides, vinyl ethers, vinyl alcohol esters, styrenes, (meth)acrylonitrile, acid group-containing monomers, and thermally crosslinkable group-containing monomers.

[0057] The weight average molecular weight of the polymer portion is preferably 5,000 to 20,000, and more preferably 8,000 to 15,000. Having an appropriate molecular weight improves the optical properties and heat resistance.

[0058] The glass transition temperature (Tg) of the polymer portion is preferably from −50 to 150° C., more preferably from 20 to 80° C. An appropriate Tg improves the optical properties.

[0059] General formula (6) [ka]

[0060] In general formula (6), R 29 and R 30 each independently represents a hydroxyl group, an alkyl group which may have a substituent, an aryl group which may have a substituent, an alkoxyl group which may have a substituent, or an aryloxy group which may have a substituent; R 29 and R 30 may be bonded to each other to form a ring.

[0061] Examples of the "alkyl group" of an alkyl group which may have a substituent, the "aryl group" of an aryl group which may have a substituent, the "alkoxyl group" of an alkoxyl group which may have a substituent, and the "aryloxy group" of an aryloxy group which may have a substituent are the same as those exemplified in the explanation of general formula (4) above.

[0062] General formula (6) is R 29 and R 30 At least one of R is preferably an aryl group which may have a substituent or an aryloxy group which may have a substituent, 29 and R 30 are more preferably an aryl group or an aryloxy group, and R 29 and R 30 However, it is more preferable that both are a phenyl group or a phenoxy group.

[0063] The naphthalocyanine compound is more preferably a compound represented by the following general formula (7).

[0064] General formula (7) [ka]

[0065] In general formula (7), Y9~Y 16 , R8~R 21 each independently represents a hydrogen atom, a halogen atom, a nitro group, a sulfone group, an alkyl group which may have a substituent, an aryl group which may have a substituent, a cycloalkyl group which may have a substituent, a heterocyclic group which may have a substituent, an alkoxyl group which may have a substituent, an aryloxy group which may have a substituent, an alkylthio group which may have a substituent, an arylthio group which may have a substituent, a phthalimidomethyl group which may have a substituent, or a sulfamoyl group which may have a substituent. Z is a polymer moiety containing a monomer unit represented by general formula (5) or a phosphorus compound moiety represented by general formula (6), and * is a bond to Al.

[0066] The alkyl group which may have a substituent, the aryl group which may have a substituent, the cycloalkyl group which may have a substituent, the heterocyclic group which may have a substituent, the alkoxy group which may have a substituent, the aryloxy group which may have a substituent, the alkylthio group which may have a substituent, the arylthio group which may have a substituent, the phthalimidomethyl group which may have a substituent, and the sulfamoyl group which may have a substituent are as explained above in relation to general formula (4).

[0067] In general formula (7), Y9~Y 16 , R8~R 21 From the viewpoint of dispersibility and color properties, is preferably a hydrogen atom, a halogen atom, or an alkoxyl group which may have a substituent.

[0068] Specific examples of naphthalocyanine compounds are shown below, but the present invention is not limited to these.

[0069] [ka] [ka] [ka]

[0070] (indigo compounds) The indigo compound is preferably a compound represented by the following general formula (8) and / or general formula (9).

[0071] General formula (8) General formula (9) [ka]

[0072] In the general formula (8) and the general formula (9), X1 to X 40 each independently represents a hydrogen atom, an optionally substituted alkyl group, an optionally substituted aryl group, an optionally substituted alkoxyl group, an optionally substituted aryloxy group, an optionally substituted arylalkyl group, an optionally substituted cycloalkyl group, an optionally substituted alkylthio group, an optionally substituted arylthio group, an amino group, an optionally substituted alkylamino group, an optionally substituted arylamino group, a cyano group, a halogen atom, a nitro group, a hydroxyl group, -SO3H; -COOH; and monovalent to trivalent metal salts of these acidic groups; and alkylammonium salts. M represents a metal atom.

[0073] Examples of the "alkyl group" in the alkyl group which may have a substituent include a straight-chain or branched alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, a neopentyl group, an n-hexyl group, an n-octyl group, a stearyl group, a 2-ethylhexyl group, etc. Examples of the "alkyl group having a substituent" include a trichloromethyl group, a trifluoromethyl group, a 2,2,2-trifluoroethyl group, a 2,2-dibromoethyl group, a 2,2,3,3-tetrafluoropropyl group, a 2-ethoxyethyl group, a 2-butoxyethyl group, a 2-nitropropyl group, a benzyl group, a 4-methylbenzyl group, a 4-tert-butylbenzyl group, a 4-methoxybenzyl group, a 4-nitrobenzyl group, a 2,4-dichlorobenzyl group, etc.

[0074] Examples of the "aryl group" of the aryl group which may have a substituent include a phenyl group, a naphthyl group, an anthryl group, and the like. Examples of the "substituted aryl group" include a p-methylphenyl group, a p-bromophenyl group, a p-nitrophenyl group, a p-methoxyphenyl group, a 2,4-dichlorophenyl group, a pentafluorophenyl group, a 2-aminophenyl group, a 2-methyl-4-chlorophenyl group, a 4-hydroxy-1-naphthyl group, a 6-methyl-2-naphthyl group, a 4,5,8-trichloro-2-naphthyl group, an anthraquinonyl group, and a 2-aminoanthraquinonyl group.

[0075] Examples of the "alkoxyl group" in the alkoxyl group which may have a substituent include linear or branched alkoxyl groups such as a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, an n-butoxy group, an isobutoxy group, a tert-butoxy group, a neopentyloxy group, a 2,3-dimethyl-3-pentyloxy group, an n-hexyloxy group, an n-octyloxy group, a stearyloxy group, and a 2-ethylhexyloxy group. Examples of the "substituted alkoxyl group" include a trichloromethoxy group, a trifluoromethoxy group, a 2,2,2-trifluoroethoxy group, a 2,2,3,3-tetrafluoropropoxy group, a 2,2-ditrifluoromethylpropoxy group, a 2-ethoxyethoxy group, a 2-butoxyethoxy group, a 2-nitropropoxy group, and a benzyloxy group.

[0076] Examples of the "aryloxy group" of the aryloxy group which may have a substituent include a phenoxy group, a naphthoxy group, an anthryloxy group, etc., and examples of the "aryloxy group having a substituent" include a p-methylphenoxy group, a p-nitrophenoxy group, a p-methoxyphenoxy group, a 2,4-dichlorophenoxy group, a pentafluorophenoxy group, a 2-methyl-4-chlorophenoxy group, etc.

[0077] Examples of the "arylalkyl group which may have a substituent" include a benzyl group, a 2-phenylpropan-yl group, a styryl group, a diphenylmethyl group, and a triphenylmethyl group.

[0078] Examples of the "cycloalkyl group" of the cycloalkyl group which may have a substituent include a cyclopentyl group, a cyclohexyl group, an adamantyl group, etc. Examples of the "cycloalkyl group having a substituent" include a 2,5-dimethylcyclopentyl group, a 4-tert-butylcyclohexyl group, etc.

[0079] Examples of the "alkylthio group" of the alkylthio group which may have a substituent include a methylthio group, an ethylthio group, a propylthio group, a butylthio group, a pentylthio group, a hexylthio group, an octylthio group, a decylthio group, a dodecylthio group, and an octadecylthio group. Examples of the "substituted alkylthio group" include a methoxyethylthio group, an aminoethylthio group, a benzylaminoethylthio group, a methylcarbonylaminoethylthio group, and a phenylcarbonylaminoethylthio group.

[0080] Examples of the "arylthio group" of the arylthio group which may have a substituent include a phenylthio group, a 1-naphthylthio group, a 2-naphthylthio group, and a 9-anthrylthio group. Examples of the "substituted arylthio group" include a chlorophenylthio group, a trifluoromethylphenylthio group, a cyanophenylthio group, a nitrophenylthio group, a 2-aminophenylthio group, and a 2-hydroxyphenylthio group.

[0081] Examples of the "alkylamino group" in the alkylamino group optionally having a substituent include a methylamino group, an ethylamino group, a propylamino group, a butylamino group, a pentylamino group, a hexylamino group, a heptylamino group, an octylamino group, a nonylamino group, a decylamino group, a dodecylamino group, an octadecylamino group, an isopropylamino group, an isopentylamino group, a sec-butylamino group, a tert-butylamino group, a sec-pentylamino group, a tert-pentylamino group, a tert-octylamino group, a neopentylamino group, a cyclopropylamino group, a cyclobutylamino group, a cyclopentylamino group, a cyclohexylamino group, a cycloheptylamino group, a cyclooctylamino group, a cyclododecylamino group, a 1-adamantamino group, and a 2-adamantamino group.

[0082] Examples of the "arylamino group" of the arylamino group which may have a substituent include an anilino group, a 1-naphthylamino group, a 2-naphthylamino group, an o-toluidino group, a m-toluidino group, a p-toluidino group, a 2-biphenylamino group, a 3-biphenylamino group, a 4-biphenylamino group, a 1-fluoreneamino group, a 2-fluoreneamino group, a 2-thiazoleamino group, and a p-terphenylamino group.

[0083] Examples of halogen atoms include fluorine, chlorine, bromine, and iodine.

[0084] Examples of the acidic group include -SO3H and -COOH, and examples of monovalent to trivalent metal salts of these acidic groups include sodium salts, potassium salts, magnesium salts, calcium salts, iron salts, aluminum salts, etc. Examples of alkylammonium salts of acidic groups include ammonium salts of long-chain monoalkylamines such as octylamine, laurylamine, and stearylamine, and quaternary alkylammonium salts such as palmityltrimethylammonium, lauryltrimethylammonium, dilauryldimethylammonium, and distearyldimethylammonium salts.

[0085] Among the above substituents, X1 to X 40 Preferred substituents for include a hydrogen atom, a methyl group, a methoxy group, a fluorine atom, a chlorine atom, a bromine atom, and -SO3H.

[0086] M represents a metal atom. Examples of the metal atom include Zn, Co, Ni, Ru, Pt, Mn, Sn, Ti, and Ba. Among these, divalent metal atoms are preferred, and Zn, Co, and Ni are more preferred.

[0087] Specific examples of indigo compounds are shown below, but the present invention is not limited to these.

[0088] [ka]

[0089] [ka]

[0090] [ka]

[0091] [ka]

[0092] The near-infrared absorbing dye (A) can be used alone or in combination of two or more. When two or more types are used in combination, it is preferable to use at least two compounds with different maximum absorption wavelengths. This broadens the absorption spectrum waveform compared to when a single near-infrared absorbing dye (A) is used, allowing near-infrared light to be absorbed over a wide wavelength range.

[0093] From the viewpoint of near-infrared absorbing properties, the content of the near-infrared absorbing dye (A) is preferably from 0.5 to 70 mass %, more preferably from 1 to 50 mass %, based on 100 mass % of the nonvolatile content of the photosensitive composition.

[0094] [Other near-infrared absorbing compounds] The photosensitive composition of the present invention may contain a compound having near-infrared absorbing ability other than the near-infrared absorbing dye (A) (hereinafter also referred to as other near-infrared absorbing compounds). Examples of other near-infrared absorbing compounds include indium tin oxide, antimony tin oxide, zinc oxide, Al-doped zinc oxide, fluorine-doped tin dioxide, niobium-doped titanium dioxide, cesium tungsten oxide, and metal oxide or metal particles such as copper, nickel, silver, and gold.

[0095] [Alkali-soluble resin (B)] The photosensitive composition of the present invention contains an alkali-soluble resin (B).

[0096] The alkali-soluble resin (B) may be any resin that dissolves in an alkali developer, and known resins can be used, such as (meth)acrylic resins, styrene resins, styrene / acrylic resins, α-olefin / maleic anhydride copolymers, styrene / styrene sulfonic acid copolymers, ethylene / (meth)acrylic acid copolymers, epoxy resins, urethane resins, polycarbonate resins, polyester resins, polyether resins, polyimide resins, polyamide-imide resins, and cyclic olefin resins.

[0097] From the viewpoint of developability, the weight average molecular weight (Mw) of the alkali-soluble resin (B) is preferably 4,000 to 40,000, more preferably 5,000 to 35,000. The value of Mw / Mn (number average molecular weight) is preferably 10 or less. An appropriate weight average molecular weight (Mw) improves adhesion to the substrate and solubility in development.

[0098] The acid value of the alkali-soluble resin (B) is preferably from 30 to 200 mgKOH / g, more preferably from 40 to 180 mgKOH / g. A suitable acid value improves adhesion to a substrate and solubility in development.

[0099] The content of the alkali-soluble resin (B) is preferably from 1 to 80 mass %, more preferably from 5 to 60 mass %, based on 100 mass % of the nonvolatile content of the photosensitive composition.

[0100] The alkali-soluble resin (B) can be used alone or in combination of two or more kinds.

[0101] From the viewpoints of pattern shape and resistance to low-temperature post-baking, the alkali-soluble resin (B) preferably contains a resin having a blocked isocyanate group-containing monomer unit (b1) and an acidic group-containing monomer unit (b2), which allows curing to proceed even in low-temperature post-baking and improves the resistance of the cured film.

[0102] The alkali-soluble resin having the blocked isocyanate group-containing monomer unit (b1) and the acidic group-containing monomer unit (b2) can be obtained by copolymerizing the blocked isocyanate group-containing monomer, the acidic group-containing monomer, and optionally other monomers copolymerizable therewith.

[0103] [Blocked isocyanate group-containing monomer unit (b1)] A blocked isocyanate group-containing monomer is a monomer in which the isocyanate group of an isocyanate group-containing monomer is protected with a compound that is released by heat (hereinafter also referred to as a blocking agent).

[0104] Examples of isocyanate group-containing monomers include 2-isocyanatoethyl (meth)acrylate, 2-isocyanatopropyl (meth)acrylate, 3-isocyanatopropyl (meth)acrylate, 2-isocyanato-1-methylethyl (meth)acrylate, 2-isocyanato-1,1-dimethylethyl (meth)acrylate, 4-isocyanatocyclohexyl (meth)acrylate, and methacryloyl isocyanate. Equimolar reaction products of 2-hydroxyalkyl (meth)acrylate and diisocyanate compounds can also be used. Among these, 2-isocyanatoethyl (meth)acrylate and 2-isocyanatopropyl (meth)acrylate are preferred.

[0105] Examples of the blocking agent include oxime compounds, lactam compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, pyrazole compounds, mercaptan compounds, imidazole compounds, imide compounds, urea compounds, imine compounds, and bisulfite compounds.

[0106] Examples of the oxime compound include formaldoxime, acetaldoxime, acetoxime, methyl ethyl ketoxime, methyl isobutyl ketoxime, cyclohexanone oxime, and benzophenone oxime, with methyl ethyl ketoxime being preferred. Examples of lactam compounds include ε-caprolactam, δ-valerolactam, γ-butyrolactam, and β-propiolactam. Examples of phenolic compounds include phenol, cresol, 2,6-xylenol, 3,5-xylenol, ethylphenol, p-tert-butylphenol, nonylphenol, methyl 2-hydroxybenzoate, methyl 4-hydroxybenzoate, p-naphthol, and p-nitrophenol, with 3,5-xylenol, methyl 2-hydroxybenzoate, and methyl 4-hydroxybenzoate being preferred. Examples of the alcohol compound include methanol, ethanol, propanol, butanol, ethylene glycol, methyl cellosolve, butyl cellosolve, methyl carbitol, benzyl alcohol, phenyl cellosolve, and furfuryl alcohol. Examples of the amine compound include diphenylamine, phenylnaphthylamine, aniline, and carbazole. Examples of the active methylene compound include dimethyl malonate, diethyl malonate, methyl acetoacetate, ethyl acetoacetate, and acetylacetone, with diethyl malonate being preferred. Examples of the pyrazole compound include pyrazole, methylpyrazole, and 3,5-dimethylpyrazole, with 3,5-dimethylpyrazole being preferred. Examples of the mercaptan compound include butyl mercaptan, thiophenol, and tert-dodecyl mercaptan. Examples of the imidazole compound include imidazole, 2-methylimidazole, 2-ethylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, and 1-benzyl-2-phenylimidazole. Examples of the imide compound include succinimide, maleimide, maleimide, and phthalimide. Examples of the urea compound include urea, thiourea, and ethylene urea. Examples of the imine compound include ethyleneimine and polyethyleneimine. Examples of bisulfite compounds include sodium bisulfite, potassium bisulfite, etc. These blocking agents can be used alone or in combination of two or more.

[0107] The blocking agent is preferably at least one selected from the group consisting of oxime compounds, lactam compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, pyrazole compounds, mercaptan compounds, imidazole compounds, and imide compounds, and from the viewpoint of the protection reaction and the deprotection reaction, more preferably at least one selected from the group consisting of oxime compounds, phenol compounds, active methylene compounds, and pyrazole compounds.

[0108] Examples of the blocked isocyanate group-containing monomer include the following compounds, but the present invention is not limited to these.

[0109] [ka]

[0110] Commercially available blocked isocyanate group-containing monomers include, for example, Karenz MOI-DEM (blocking agent desorption temperature: 85 to 95°C), MOI-BP (blocking agent desorption temperature: 105 to 115°C), and MOI-BM (blocking agent desorption temperature: 125 to 135°C) manufactured by Showa Denko K.K.

[0111] From the viewpoint of resistance to low-temperature post-baking, the content of the blocked isocyanate group-containing monomer unit (b1) is preferably 1 to 50 mol %, more preferably 5 to 40 mol %, of all the constituent units of the alkali-soluble resin.

[0112] [Acidic group-containing monomer unit (b2)] Examples of the acidic group of the acidic group-containing monomer include a carboxyl group, a sulfonic acid group, a phosphoric acid group, etc. Among these, a carboxyl group is preferred.

[0113] Examples of the acidic group-containing monomer include (meth)acrylic acid, crotonic acid, propiolic acid, cinnamic acid, itaconic acid, itaconic anhydride, maleic acid, monomethyl maleate, monoethyl maleate, monoisopropyl maleate, maleic anhydride, fumaric acid, 2-methacryloyloxyethyl succinic acid, 2-acryloyloxyethyl phthalic acid, 2-acryloyloxyethylhexylhydrophthalic acid, p-styrenesulfonic acid, vinylsulfonic acid, 2-acrylamido-2-methylpropanesulfonic acid, tert-butylacrylamidosulfonic acid, and 2-(meth)acryloyloxyethyl acid phosphate.

[0114] From the viewpoint of pattern shape, the content of the acidic group-containing monomer unit (b2) is preferably from 1 to 50 mol %, more preferably from 5 to 40 mol %, of all the constituent units of the alkali-soluble resin.

[0115] The alkali-soluble resin having the blocked isocyanate group-containing monomer unit (b1) and the acidic group-containing monomer unit (b2) may contain a monomer unit other than the blocked isocyanate group-containing monomer unit (b1) and the acidic group-containing monomer unit (b2). Examples of such a monomer unit include a hydroxyl group-containing monomer unit (b3), an aliphatic fused ring structure-containing monomer unit (b4), an epoxy group-containing monomer unit (b5), a polymerizable unsaturated group-containing monomer unit (b6), and other monomer units (b7). Among these, from the viewpoint of resistance to low-temperature post-baking, the hydroxyl group-containing monomer unit (b3) and the aliphatic fused ring structure-containing monomer unit (b4) are preferred. It is presumed that the inclusion of the hydroxyl group-containing monomer unit (b3) promotes the elimination of the blocking agent from the blocked isocyanate group-containing monomer unit (b1), making it easier to cure at low temperatures. It is also presumed that the isocyanate group from which the blocking agent has been eliminated reacts with the hydroxyl group, further improving resistance. It is presumed that the inclusion of the aliphatic fused ring structure-containing monomer unit (b4) allows the formation of a rigid cured film, resulting in further improved durability.

[0116] [Hydroxyl group-containing monomer unit (b3)] Examples of hydroxyl group-containing monomers include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 2,3-dihydroxypropyl (meth)acrylate, glycerol mono(meth)acrylate, cyclohexanedimethanol mono(meth)acrylate, 2-hydroxy-3-phenoxypropyl acrylate, and 2-acryloyloxyethyl-2-hydroxyethyl phthalate.

[0117] The ratio of the blocked isocyanate group-containing monomer unit (b1) to the hydroxyl group-containing monomer unit (b3) is preferably from 10:90 to 50:50, more preferably from 15:85 to 45:55, from the viewpoint of resistance to low-temperature post-baking.

[0118] [Aliphatic fused ring structure-containing monomer unit (b4)] Examples of the aliphatic fused ring structure-containing monomer include dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentanyloxyethyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, adamantyl (meth)acrylate, etc. Among these, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, and dicyclopentanyloxyethyl (meth)acrylate are preferred.

[0119] [Epoxy group-containing monomer unit (b5)] Examples of epoxy group-containing monomers include oxiranyl(meth)acrylate, glycidyl(meth)acrylate, 2-methylglycidyl(meth)acrylate, 2-ethylglycidyl(meth)acrylate, 2-oxiranylethyl(meth)acrylate, 2-glycidyloxyethyl(meth)acrylate, 3,4-epoxycyclohexyl(meth)acrylate, 3,4-epoxycyclohexylmethyl(meth)acrylate, 2-(3,4-epoxycyclohexyl)ethyl(meth)acrylate, 2-(3,4-epoxycyclohexylmethyloxy)ethyl(meth)acrylate, and 3-(3,4-epoxycyclohexylmethyloxy)propyl(meth)acrylate.

[0120] [Polymerizable unsaturated group-containing monomer unit (b6)] Examples of the polymerizable unsaturated group-containing monomer unit (b6) include units introduced by the following methods (i) to (iii).

[0121] <Method (i)> There is a method (i) in which the above-mentioned epoxy group-containing monomer is added to the acid group of the acid group-containing monomer unit (b2).

[0122] <Method (ii)> There is a method (ii) in which the above-mentioned acidic group-containing monomer is added to the epoxy group of a resin having an epoxy group-containing monomer unit (b5).

[0123] Furthermore, units obtained by further reacting an acid anhydride with the hydroxyl group generated by the reaction of the methods (i) and (ii) are also preferred as the polymerizable unsaturated group-containing monomer unit (b6).

[0124] Examples of the acid anhydride include tetrahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride, succinic anhydride, and maleic anhydride.

[0125] <Method (iii)> There is a method (iii) in which the hydroxyl group of a resin having a hydroxyl group-containing monomer unit (b3) is reacted with the isocyanate group of an isocyanate group-containing monomer.

[0126] Examples of the isocyanate group-containing monomer include 2-(meth)acryloylethyl isocyanate, 2-(meth)acryloyloxyethyl isocyanate, and 1,1-bis[methacryloyloxy]ethyl isocyanate.

[0127] [Other monomer units (b7)] Other monomers include, for example, methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, isobornyl (meth)acrylate, cyclohexyl (meth)acrylate, acrylate, benzyl (meth)acrylate, phenoxyethyl (meth)acrylate, phenoxydiethylene glycol (meth)acrylate, ethylene oxide (EO)-modified (meth)acrylate of phenol, EO- or propylene oxide (PO)-modified (meth)acrylate of nonylphenol, EO- or PO-modified (meth)acrylate of paracumylphenol, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, and other acrylic esters; Aromatic vinyl compounds such as styrene, α-methylstyrene, p-vinyltoluene, p-chlorostyrene, and vinylnaphthalene; (meth)acrylamides such as (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N-isopropyl(meth)acrylamide, diacetone(meth)acrylamide, or acryloylmorpholine; vinyl ethers such as ethyl vinyl ether, n-propyl vinyl ether, isopropyl vinyl ether, n-butyl vinyl ether, or isobutyl vinyl ether; vinyl fatty acid vinyl compounds such as vinyl acetate or vinyl propionate; Phenylmaleimide, methylmaleimide, ethylmaleimide, 1,2-bismaleimidoethane, 1,6-bismaleimidohexane, 3-maleimidopropionic acid, 6,7-methylenedioxy-4-methyl-3-maleimidocoumarin, 4,4'-bismaleimidodiphenylmethane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, N,N'-1,3-phenylenedimaleimide, N,N'-1,4-phenylenedimaleimide, N-(1-pyrenyl)maleimide, N-(2,4,6-trichlorophenyl)maleimide N-substituted maleimides such as N-(4-aminophenyl)maleimide, N-(4-nitrophenyl)maleimide, N-benzylmaleimide, N-bromomethyl-2,3-dichloromaleimide, N-succinimidyl-3-maleimidobenzoate, N-succinimidyl-3-maleimidopropionate, N-succinimidyl-4-maleimidobutyrate, N-succinimidyl-6-maleimidohexanoate, N-[4-(2-benzimidazolyl)phenyl]maleimide, and 9-maleimidoacridine; Examples include dimethyl-2,2'-[oxybis(methylene)]bis-2-propenoate, diethyl-2,2'-[oxybis(methylene)]bis-2-propenoate, di(n-propyl)-2,2'-[oxybis(methylene)]bis-2-propenoate, di(isopropyl)-2,2'-[oxybis(methylene)]bis-2-propenoate, di(2-ethylhexyl)-2,2'-[oxybis(methylene)]bis-2-propenoate, etc. These monomers can be used alone or in combination of two or more.

[0128] [Polymerizable compound (C)] (Polymerizable Compound (C1) Having Two (Meth)acryloyl Groups and a Ring Structure) The photosensitive composition of the present invention contains, as the polymerizable compound (C), a polymerizable compound (C1) having two (meth)acryloyl groups and a ring structure (hereinafter also simply referred to as polymerizable compound (C1)).

[0129] The ring structure may be any of an aromatic ring structure, a heterocyclic structure, and a fused ring structure, but from the viewpoint of pattern shape and resistance to low-temperature post-baking, a fused ring structure is preferred. The fused ring structure is preferably an aliphatic fused ring structure in which all rings are aliphatic rings.

[0130] From the viewpoint of the pattern shape, the molecular weight of the polymerizable compound (C1) is preferably 500 or less, more preferably 200 or more and 500 or less. The molecular weight is a formula weight or a weight average molecular weight.

[0131] From the viewpoint of pattern shape, the content of the polymerizable compound (C1) is preferably 50% by mass or more, more preferably 50 to 100% by mass, and particularly preferably 60 to 100% by mass, based on 100% by mass of the polymerizable compound (C).

[0132] The polymerizable compound (C1) may be suitably synthesized or may be a commercially available product.

[0133] Examples of the polymerizable compound (C1) include polymerizable compounds having a condensed ring structure, such as tricyclodecane dimethanol diacrylate (molecular weight 304), tricyclodecane dimethanol dimethacrylate (molecular weight 332), 1,3-adamantanediol diacrylate (molecular weight 276), 1,3-adamantanediol dimethacrylate (molecular weight 304), and 9,9-bis[4-(2-acryloyloxyethoxy)phenyl]fluorene (molecular weight 546); Polymerizable compounds having a heterocyclic structure, such as dioxyglycol diacrylate (molecular weight 326), dioxyglycol dimethacrylate (molecular weight 354), and two EO-modified isocyanuric acid diacrylate (molecular weight 369); Examples of polymerizable compounds having an aromatic ring structure include bisphenol A diacrylate (molecular weight 380) with 3 EO modifications, bisphenol A diacrylate (molecular weight 394) with 3 PO modifications, bisphenol A diacrylate (molecular weight 512) with 4 EO modifications, and bisphenol A diacrylate (molecular weight 776) with 10 EO modifications. Among these, tricyclodecane dimethanol diacrylate (molecular weight 304) and tricyclodecane dimethanol dimethacrylate (molecular weight 332) with a fused aliphatic ring structure are preferred.

[0134] Examples of commercially available polymerizable compounds (C1) include NK Ester A-DCP, DCP, A-DOG, ABE-300, A-BPE-4, A-BPE-10, A-BPP-3, and A-BPEF manufactured by Shin-Nakamura Chemical Co., Ltd., OGSOL EA-0200, EA-0300, GA-5060P, and GA-2800 manufactured by Osaka Gas Chemicals Co., Ltd., and Miramer HR6060, HR6100, and HR6200 manufactured by Miwon Specialty Chemical Co., Ltd.

[0135] (Polymerizable compound (C2)) The photosensitive composition of the present invention may contain, as the polymerizable compound (C), a polymerizable compound (C2) (hereinafter also simply referred to as polymerizable compound (C2)) other than the polymerizable compound (C1) as long as the effects of the present invention are not impaired.

[0136] Examples of the polymerizable compound (C2) include polymerizable compounds having one (meth)acryloyl group, such as methyl (meth)acrylate, ethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, cyclohexyl (meth)acrylate, phenol EO-modified (meth)acrylate, 2-ethylhexyl EO-modified (meth)acrylate, N-acryloyloxyethyl hexahydrophthalimide, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, dicyclopentanyl (meth)acrylate, benzyl (meth)acrylate, phenoxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, and monohydroxyethyl phthalate (meth)acrylate; Polymerizable compounds having two (meth)acryloyl groups, such as 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, and polypropylene glycol di(meth)acrylate; Polymerizable compounds having three (meth)acryloyl groups, such as trimethylolpropane tri(meth)acrylate, trimethylolpropane EO-modified tri(meth)acrylate, trimethylolpropane PO-modified tri(meth)acrylate, pentaerythritol tri(meth)acrylate, and isocyanuric acid EO-modified tri(meth)acrylate; Polymerizable compounds having four (meth)acryloyl groups, such as ditrimethylolpropane tetra(meth)acrylate and pentaerythritol tetra(meth)acrylate; Polymerizable compounds having five (meth)acryloyl groups, such as dipentaerythritol penta(meth)acrylate; Examples include polymerizable compounds having six (meth)acryloyl groups, such as dipentaerythritol hexa(meth)acrylate. Other examples include polymerizable compounds having an acidic group, polymerizable compounds having a urethane bond, polymerizable compounds having a dendrimer structure or a hyperbranched structure, and lactone-modified polymerizable compounds.

[0137] The polymerizable compound (C) can be used alone or in combination of two or more kinds.

[0138] The content of the polymerizable compound (C) is preferably from 5 to 70 mass %, more preferably from 10 to 60 mass %, based on 100 mass % of the nonvolatile content of the photosensitive composition.

[0139] [Photopolymerization initiator (D)] The photosensitive composition of the present invention contains a photopolymerization initiator (D), which allows the photosensitive composition to be cured by irradiation with active energy rays to form a cured film.

[0140] Examples of the photopolymerization initiator (D) include acetophenone-based compounds such as 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, diethoxyacetophenone, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-(dimethylamino)-1-[4-(4-morpholino)phenyl]-2-(phenylmethyl)-1-butanone, and 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone; triazine-based compounds such as 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-piperonyl-4,6-bis(trichloromethyl)-s-triazine, 2,4-bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxy-naphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2,4-trichloromethyl-(piperonyl)-6-triazine, or 2,4-trichloromethyl-(4'-methoxystyryl)-6-triazine; Oxime compounds such as 1,2-octanedione, 1-[4-(phenylthio)phenyl-, 2-(O-benzoyloxime)], or ethanol, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(O-acetyloxime); acylphosphine compounds such as bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide or diphenyl-2,4,6-trimethylbenzoylphosphine oxide; Examples of the compound include quinone compounds such as 9,10-phenanthrenequinone, camphorquinone, and ethylanthraquinone; borate compounds; carbazole compounds; imidazole compounds; and titanocene compounds.

[0141] Commercially available products include Omnirad 907, 369E, and 379EG manufactured by IGM Resins as acetophenone compounds, Omnirad 819 and TPO manufactured by IGM Resins as acylphosphine compounds, IRGACURE OXE-01, 02, 03, and 04 manufactured by BASF, N-1919, NCI-730, 831, and 930 manufactured by ADEKA, TRONLY TR-PBG-301, 304, 305, 309, 314, 345, 358, 380, 365, 610, 3054, and 3057 manufactured by Changzhou Strong New Materials Co., Ltd., and IGM Examples include Omnirad 1312, 1314, and 1316 manufactured by Resins Co., Ltd., SPI-02, 03, 04, 05, 06, and 07 manufactured by Samyang Corporation, and DFI-020, 306, and EOX-01 manufactured by Daito Chemiks Co., Ltd. Further examples include acetophenone compounds described in JP-T-2019-507108, JP-T-2019-528331, etc., and oxime compounds described in JP-A-2007-210991, JP-A-2009-179619, JP-A-2010-037223, JP-A-2010-215575, JP-A-2011-020998, WO 2015 / 036910, WO 2021 / 175855, etc.

[0142] When the photosensitive composition of the present invention contains a colorant (F) described below, it preferably contains an oxime compound as the photopolymerization initiator (D).

[0143] Preferred oxime compounds include, for example, the following compounds, but the present invention is not limited to these.

[0144] [ka]

[0145] Chemical formula (16) [ka]

[0146] The method for producing the compounds of chemical formulas (10) to (16) is not particularly limited, and known methods can be used. For example, methods described in JP-T-2004-534797, JP-A-2008-80068, JP-T-2012-526185, WO 2015 / 036910, WO 2015 / 152153, JP-T-2016-504270, JP-T-2017-512886, JP-T-2017-523465, JP-A-2021-011486, etc. can be mentioned.

[0147] From the viewpoint of resistance to low-temperature post-bake, the oxime compound is more preferably one or more selected from the group consisting of compounds of chemical formulas (10) to (16), and particularly preferably one or more selected from the group consisting of compounds of chemical formulas (12) to (14).

[0148] The photopolymerization initiator (D) can be used alone or in combination of two or more kinds.

[0149] The content of the photopolymerization initiator (D) is preferably from 0.5 to 20 parts by mass, more preferably from 1 to 15 parts by mass, relative to 100 parts by mass of the near-infrared absorbing dye (A).

[0150] [Thiol-based chain transfer agent (E)] From the viewpoints of pattern shape and resistance to low-temperature post-baking, the photosensitive composition of the present invention preferably contains a thiol-based chain transfer agent (E). When the thiol-based chain transfer agent (E) is used in combination with the photopolymerization initiator (D), it generates thiyl radicals that are resistant to polymerization inhibition by oxygen during radical polymerization after irradiation with active energy rays, thereby accelerating curing.

[0151] The thiol chain transfer agent (E) is preferably a polyfunctional thiol having two or more thiol groups (SH groups), more preferably a polyfunctional thiol having four or more thiol groups. As the number of functional groups increases, photocuring becomes easier from the surface to the deepest part of the film.

[0152] Examples of polyfunctional thiols include hexanedithiol, decanedithiol, 1,4-butanediol bisthiopropionate, 1,4-butanediol bisthioglycolate, ethylene glycol bisthioglycolate, ethylene glycol bisthiopropionate, trimethylolpropane tristhioglycolate, trimethylolpropane tristhiopropionate, trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakisthioglycolate, pentaerythritol tetrakisthioglycolate, Examples of the thiopropionate include erythritol tetrakisthiopropionate, trimercaptopropionic acid tris(2-hydroxyethyl)isocyanurate, 1,4-dimethylmercaptobenzene, 2,4,6-trimercapto-s-triazine, and 2-(N,N-dibutylamino)-4,6-dimercapto-s-triazine. Preferred examples include ethylene glycol bisthiopropionate, trimethylolpropane tristhiopropionate, and pentaerythritol tetrakisthiopropionate.

[0153] The thiol chain transfer agent (E) can be used alone or in combination of two or more kinds.

[0154] From the viewpoints of pattern shape and resistance to low-temperature post-baking, the content of the thiol chain transfer agent (E) is preferably 0.1 to 1.0 mass %, more preferably 0.2 to 0.8 mass %, based on 100 mass % of the nonvolatile content of the photosensitive composition.

[0155] Colorant (F) The photosensitive composition of the present invention may contain a colorant (F), which makes it possible to control the transmittance of the cured film in each wavelength region, thereby improving color separation and shielding properties.

[0156] The colorant (F) may be either a pigment or a dye, and these may be used in combination.

[0157] (pigment) The pigment is preferably a compound classified as a pigment in the Color Index. Red pigments include, for example, CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 37, 38, 41, 47, 48, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 50:1, 52:1, 52:2, 53, 53:1, 53:2, 53:3, 57, 57:1, 57:2, 58:4, 60, 63, 63:1, 63:2, 64, 64:1, 68, 69, 81, 81:1, 81:2, 81:3, 81:4, 83, 88, 90:1, 101, 101:1, 104, 108, 108:1, 109, 112, 113, 114, 122, 123, 144, 146, 147, 149, 151, 166, 168, 169, 170, 172, 173, 174, 175, 176, 177, 178, 179 ,181,184,185,187,188,190,193,194,200,202,206,207,208,209,210,214,216,220,221,224,230,231,232,233,235,236,237,238,239,242,243,245,247,249,250,251,253,254,255,256,257,258,259, 260, 262, 263, 264, 265, 266, 267, 268, 269, 270, 271, 272, 273, 274, 275, 276, 277, 278, 279, 280, 281, 282, 283, 284, 285, 286, 287, 291, 295, 296, JP 2014-134712 A, and the pigments described in Japanese Patent No. 6368844. Among these, from the viewpoints of heat resistance, light fastness, and transmittance, CI Pigment Red 48:1,122,177,224,242,269,254,291,295,296, the pigments described in JP-A-2014-134712, and the pigments described in Japanese Patent No. 6368844 are preferred, and CI Pigment Red 177,254,291,295,296, the pigments described in JP-A-2014-134712, and the pigments described in Japanese Patent No. 6368844 are more preferred.

[0158] Examples of orange pigments include CI Pigment Orange 36, 38, 43, 64, 71, and 73.

[0159] Yellow pigments include, for example, CI Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 12, 13, 14, 15, 16, 17, 18, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 126, 127, 128, 129, 138, 139, 147, 150, 151, 152, 153, 154, 155, 156, 157, 158, 159, 160, 161, 162, 163, 164, 165, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 178, 179, 180, 181, 182, 183, 184, 185, 186, 187, 188, 189, 190, 1,152, 153,154,155,156,161,162,164,166,167,168,169,170,171,172,173,174,175,176,177,179,180,181,182,185,187,188,192,193,194,196,198,199,213,214,231,233, JP 2012-226110 A, JP 2017-171912 A, JP 2017-171913 A, JP 2017-171914 A, JP 2017-171915 A, and the like. Among these, CI Pigment Yellows 138, 139, 150, 185, 231, and 233, and the pigments described in JP-A-2012-226110 are preferred.

[0160] Examples of green pigments include CI Pigment Green 1, 2, 4, 7, 8, 10, 13, 14, 15, 17, 18, 19, 26, 36, 37, 45, 48, 50, 51, 54, 55, 58, 59, 62, and 63. Among these, CI Pigment Green 36, 58, 59, 62, and 63 are preferred.

[0161] Examples of blue pigments include CI Pigment Blue 1, 1:2, 9, 14, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 17, 19, 25, 27, 28, 29, 33, 35, 36, 56, 56:1, 60, 61, 61:1, 62, 63, 66, 67, 68, 71, 72, 73, 74, 75, 76, 78, and 79. Among these, CI Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, and 15:6 are preferred.

[0162] Examples of purple pigments include CI Pigment Violet 1, 1:1, 2, 2:2, 3, 3:1, 3:3, 5, 5:1, 14, 15, 16, 19, 23, 25, 27, 29, 31, 32, 37, 39, 42, 44, 47, 49, and 50. Among these, CI Pigment Violet 19 and 23 are preferred.

[0163] Examples of black pigments include CI Pigment Black 1, 6, 7, 12, 20, 21, 31, 32, 33, and 34. Other examples include compounds described in JP-A Nos. 2010-534726, 2012-515233, and 2012-515234, JP-A Nos. 1-170601, and 2-34664.

[0164] When the photosensitive composition of the present invention is used in an infrared transmission filter, it preferably contains, as colorant (F), two or more pigments selected from the group consisting of red pigments, yellow pigments, blue pigments, green pigments and violet pigments, and exhibits a black color.

[0165] Examples of combinations that produce a black color include the following: (1) Contains yellow pigment and purple pigment. (2) Contains red pigment, yellow pigment, and purple pigment. (3) Contains red pigment, yellow pigment, and blue pigment. (4) Contains red pigment, yellow pigment, and green pigment. (5) Contains yellow pigment, blue pigment, and purple pigment. (6) Contains red pigment, yellow pigment, blue pigment, and purple pigment. (7) Contains yellow pigment, blue pigment, green pigment, and purple pigment.

[0166] An example of the above embodiment (1) is an embodiment in which the yellow pigment contains at least one selected from CI Pigment Yellow 139, 185, 231, and 233, and the purple pigment contains CI Pigment Violet 23. An example of the above embodiment (2) is an embodiment in which the red pigment contains at least one selected from CI Pigment Red 177, 254, 291, 295, and 296, the yellow pigment contains at least one selected from CI Pigment Yellow 139, 185, 231, and 233, and the purple pigment contains CI Pigment Violet 23. An example of the above embodiment (3) is an embodiment in which the red pigment contains at least one selected from CI Pigment Red 177, 254, 291, 295, and 296, the yellow pigment contains at least one selected from CI Pigment Yellow 139, 185, 231, and 233, and the blue pigment contains at least one selected from CI Pigment Blue 15:3, 15:4, and 15:6. An example of the embodiment (4) above is an embodiment in which the red pigment contains at least one selected from CI Pigment Red 177, 254, 291, 295, and 296; the yellow pigment contains at least one selected from CI Pigment Yellow 139, 185, 231, and 233; and the green pigment contains at least one selected from CI Pigment Green 7, 36, 58, 59, and 63. An example of the above embodiment (5) is an embodiment in which the yellow pigment contains at least one selected from CI Pigment Yellow 139, 185, 231, and 233, the blue pigment contains at least one selected from CI Pigment Blue 15:3, 15:4, and 15:6, and the purple pigment contains CI Pigment Violet 23. An example of the above embodiment (6) is an embodiment in which the red pigment contains at least one selected from CI Pigment Red 177, 254, 291, 295, and 296; the yellow pigment contains at least one selected from CI Pigment Yellow 139, 185, 231, and 233; the blue pigment contains at least one selected from CI Pigment Blue 15:3, 15:4, and 15:6; and the purple pigment contains CI Pigment Violet 23. An example of the above embodiment (7) is an embodiment in which the yellow pigment contains at least one selected from CI Pigment Yellow 139, 185, 231, and 233; the blue pigment contains at least one selected from CI Pigment Blue 15:3, 15:4, and 15:6; the green pigment contains at least one selected from CI Pigment Green 7, 36, 58, 59, and 63; and the purple pigment contains CI Pigment Violet 23.

[0167] Table 1 shows the preferred mass ratio (mass %) of each pigment in each embodiment.

[0168] [Table 1]

[0169] Among the pigments, examples of inorganic pigments include titanium oxide, barium sulfate, zinc oxide, lead sulfate, yellow lead, zinc yellow, red iron oxide (red iron (III) oxide), cadmium red, ultramarine, iron blue, chromium oxide green, cobalt green, umber, and synthetic iron black.

[0170] (dye) Examples of dyes include acid dyes, direct dyes, basic dyes, salt-forming dyes, oil-soluble dyes, disperse dyes, reactive dyes, mordant dyes, vat dyes, sulfur dyes, etc. Also included are derivatives of these dyes and lake pigments obtained by converting dyes into lakes.

[0171] The acid dye preferably has an acidic group such as a sulfonic acid or carboxylic acid. Also preferred are salt-forming compounds that are salts of an acid dye with a nitrogen-containing compound such as a quaternary ammonium salt compound, a tertiary amine compound, a secondary amine compound, or a primary amine compound. Also preferred are salt-forming compounds that are salts of an acid dye with a resin component having these functional groups. Furthermore, the salt-forming compounds can be sulfonamidated to modify them into sulfonic acid amide compounds, which makes it easier to obtain photosensitive compositions with excellent resistance (light resistance, solvent resistance). In addition, a salt-forming compound of an acid dye and a compound having an onium salt group is also preferred because it has excellent resistance (light resistance, solvent resistance). The compound having an onium salt group is preferably a resin having a cationic group.

[0172] Although basic dyes can be used as they are, salt-forming compounds that form salts with organic acids, perchloric acid, or metal salts thereof are preferred. Salt-forming compounds of basic dyes are preferred because they have excellent resistance (lightfastness, solvent resistance) and affinity with pigments. Furthermore, in the salt-forming compounds of basic dyes, the anion component that acts as a counterion is preferably an organic sulfonic acid, organic sulfuric acid, a fluorine-containing phosphorus anion compound, a fluorine-containing boron anion compound, a cyano-containing nitrogen anion compound, an anion compound having a conjugate base of an organic acid with a halogenated hydrocarbon group, or a salt-forming compound formed with an acid dye. Furthermore, the resistance of salt-forming compounds is further improved when the salt-forming compound contains a polymerizable unsaturated group in the molecule.

[0173] The chemical structure of the dye may be, for example, azo dyes, disazo dyes, azomethine dyes (indoaniline dyes, indophenol dyes, etc.), dipyrromethene dyes, quinone dyes (benzoquinone dyes, naphthoquinone dyes, anthraquinone dyes, anthrapyridone dyes, etc.), carbonium dyes (diphenylmethane dyes, triphenylmethane dyes, xanthene dyes, acridine dyes, etc.), quinoneimine dyes (oxazine dyes, thiazine dyes, etc.), azido dyes, ... Examples of the dye structure include dyes derived from dyes selected from the group consisting of quinone dyes, polymethine dyes (oxonol dyes, merocyanine dyes, arylidene dyes, styryl dyes, cyanine dyes, squarylium dyes, croconium dyes, etc.), quinophthalone dyes, phthalocyanine dyes, subphthalocyanine dyes, perinone dyes, indigo dyes, thioindigo dyes, quinoline dyes, nitro dyes, nitroso dyes, rhodamine dyes, and metal complex dyes thereof.

[0174] Among these, from the viewpoint of color properties such as hue, color separation ability, and color unevenness, a dye structure derived from a dye selected from azo dyes, xanthene dyes, cyanine dyes, triphenylmethane dyes, anthraquinone dyes, dipyrromethene dyes, squarylium dyes, quinophthalone dyes, phthalocyanine dyes, and subphthalocyanine dyes is preferred, and a dye structure derived from a dye selected from xanthene dyes, cyanine dyes, triphenylmethane dyes, anthraquinone dyes, dipyrromethene dyes, and phthalocyanine dyes is more preferred.

[0175] The colorant (F) can be used alone or in combination of two or more kinds.

[0176] The content of the colorant (F) is preferably from 5 to 70 mass %, more preferably from 10 to 60 mass %, based on 100 mass % of the nonvolatile content of the photosensitive composition.

[0177] (Fine pigments) The pigment is preferably micronized before use. The micronization method is not particularly limited, and for example, wet milling, dry milling, or solution precipitation can be used. Among these, salt milling treatment using a kneader method, which is a type of wet milling, is preferred. The average primary particle diameter of the micronized pigment determined by TEM (transmission electron microscope) is preferably 5 to 90 nm. From the viewpoints of dispersibility and contrast ratio, the average primary particle diameter is more preferably 10 to 70 nm.

[0178] Salt milling is a process in which a mixture of a pigment, a water-soluble inorganic salt, and a water-soluble organic solvent is mechanically kneaded under heat using a kneader, two-roll mill, three-roll mill, ball mill, attritor, sand mill, or other kneading machine, and then the water-soluble inorganic salt and water-soluble organic solvent are removed by washing with water. The water-soluble inorganic salt acts as a crushing aid, and the high hardness of the inorganic salt is used to crush the pigment during salt milling. Optimizing the conditions for salt milling a pigment can produce a pigment with an extremely fine primary particle size, a narrow distribution, and a sharp particle size distribution.

[0179] Examples of water-soluble inorganic salts include sodium chloride, potassium chloride, and sodium sulfate, with sodium chloride (table salt) being preferred from the standpoint of cost. From the standpoint of both treatment efficiency and production efficiency, the amount of water-soluble inorganic salt used is preferably 50 to 2,000 parts by mass, and more preferably 300 to 1,000 parts by mass, per 100 parts by mass of the pigment.

[0180] The water-soluble organic solvent functions to moisten the pigment and water-soluble inorganic salt. It is not particularly limited as long as it is soluble (miscible) in water and does not substantially dissolve the inorganic salt used. However, since the temperature rises during salt milling and the solvent becomes prone to evaporation, a high-boiling solvent with a boiling point of 120°C or higher is preferred for safety reasons. Examples of water-soluble organic solvents that can be used include 2-methoxyethanol, 2-butoxyethanol, 2-(isopentyloxy)ethanol, 2-(hexyloxy)ethanol, diethylene glycol, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol, triethylene glycol monomethyl ether, liquid polyethylene glycol, 1-methoxy-2-propanol, 1-ethoxy-2-propanol, dipropylene glycol, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, and liquid polypropylene glycol. The amount of water-soluble organic solvent used is preferably 5 to 1,000 parts by weight, more preferably 50 to 500 parts by weight, per 100 parts by weight of the pigment.

[0181] A resin may be added to the salt milling treatment as needed. The type of resin is not particularly limited, and examples include natural resins, modified natural resins, synthetic resins, and synthetic resins modified with natural resins. Among these, resins that are solid at room temperature, insoluble in water, and partially soluble in the organic solvents are preferred. The amount of resin added is preferably 2 to 200 parts by mass per 100 parts by mass of the pigment.

[0182] [Dispersion resin (G)] The photosensitive composition of the present invention may contain a dispersing resin (G). The dispersing resin (G) is used for the purpose of stably dispersing the near-infrared absorbing dye (A) and the colorant (F) in the photosensitive composition.

[0183] The dispersing resin (G) is preferably a resin having an adsorption group that has high affinity for the near-infrared absorbing dye (A) and the colorant (F). The adsorption group preferably has at least one of a basic group and an acidic group.

[0184] Examples of the basic group include a primary amino group, a secondary amino group, a tertiary amino group, a quaternary ammonium base, and a group containing a nitrogen atom such as a nitrogen-containing heterocycle.

[0185] Examples of the acidic group include a carboxyl group, a phosphoric acid group, and a sulfonic acid group.

[0186] Examples of resin types for the dispersing resin (G) include urethane resins, polycarboxylic acid esters such as polyacrylates, unsaturated polyamides, polycarboxylic acids, polycarboxylic acid (partial) amine salts, polycarboxylic acid ammonium salts, polycarboxylic acid alkylamine salts, polysiloxanes, long-chain polyaminoamide phosphate salts, hydroxyl group-containing polycarboxylic acid esters, and modified products thereof, amides formed by the reaction of poly(lower alkylene imines) with polyesters having free carboxyl groups, and salts thereof, water-soluble resins and water-soluble polymer compounds such as (meth)acrylic acid-styrene copolymers, (meth)acrylic acid-(meth)acrylic acid ester copolymers, styrene-maleic acid copolymers, polyvinyl alcohol, and polyvinylpyrrolidone, polyesters, modified polyacrylates, ethylene oxide / propylene oxide adducts, and phosphate esters.

[0187] Examples of the structure of the dispersing resin (G) include a random structure, a block structure, a graft structure, a comb structure, and a star structure. Among these, the block structure or the comb structure is preferred from the viewpoint of dispersion stability.

[0188] Commercially available dispersion resins (G) include, for example, Disperbyk-101, 103, 107, 108, 110, 111, 116, 130, 140, 154, 161, 162, 163, 164, 165, 166, 167, 168, 170, 171, 174, 180, 181, 182, 183, 184, 185, 190, 2000, 2001, 2009, 2010, 2020, 2025, 2050, 2070, 2095, 2150, 2155, 2163, and 2164 manufactured by BYK-Chemie Japan, or Anti-Terra-U203 and 204, or BYK-P 104, P104S, 220S, or Lactimon, Lactimon-WS, or Bykumen, etc.; SOLSPERSE-3000, 9000, 13000, 13240, 13650, 13940, 16000, 17000, 18000, 20000, 21000, 24000, 26000, 27000, 28000, 31845, 32000, 32500, 32550, 33500, 32600, 34750, 35100, 36600, 38500, 41000, 41090, 53095, 55000, 56000 manufactured by Lubrizol Japan ,76500, etc., EFKA-46, 47, 48, 452, 4008, 4009, 4010, 4015, 4020, 4047, 4050, 4055, 4060, 4080, 4400, 4401, 4402, 4403, 4406, 4408, 4300, 4310, 4320, 4330, 4340, 450, 451, 453, 4540, 4550, 4560, 4800, 5010, 5065, 5066, 5070, 7500, 7554, 1101, 120, 150, 1501, 1502, 1503, etc. manufactured by BASF Japan, and Ajisu manufactured by Ajinomoto Fine-Techno Co., Ltd. Examples include resins described in JP-A-2008-029901, JP-A-2009-155406, JP-A-2010-185934, JP-A-2011-157416, WO 2008 / 007776, JP-A-2008-029901, JP-A-2009-155406, JP-A-2010-185934, JP-A-2011-157416, JP-A-2009-251481, JP-A-2007-23195, JP-A-1996-143651, and the like.

[0189] The dispersing resin (G) can be used alone or in combination of two or more kinds.

[0190] From the viewpoint of dispersion stability, the content of the dispersing resin (G) is preferably from 3 to 200 parts by mass, more preferably from 5 to 100 parts by mass, relative to 100 parts by mass of the near-infrared absorbing dye (A).

[0191] [Dye derivative (H)] The photosensitive composition of the present invention may contain a dye derivative (H).

[0192] The dye derivative (H) is not particularly limited, and examples thereof include dye derivatives having an acidic group, a basic group, a neutral group, etc. in the organic dye residue. Examples of the dye derivative (H) include compounds having an acidic substituent such as a sulfo group, a carboxy group, or a phosphate group, and amine salts thereof, compounds having a basic substituent such as a sulfonamide group or a terminal tertiary amino group, and compounds having a neutral substituent such as a phenyl group or a phthalimidoalkyl group. Examples of organic dyes include diketopyrrolopyrrole compounds, anthraquinone compounds, quinacridone compounds, dioxazine compounds, perinone compounds, perylene compounds, thiazine indigo compounds, triazine compounds, benzimidazolone compounds, indole compounds such as benzoisoindole, isoindoline compounds, isoindolinone compounds, quinophthalone compounds, naphthol compounds, threne compounds, metal complex compounds, azo compounds such as azo, disazo, and polyazo, squarylium compounds, and phthalocyanine compounds.

[0193] Specifically, diketopyrrolopyrrole dye derivatives are described, for example, in JP 2001-220520 A, WO 2009 / 081930 A, WO 2011 / 052617 A, WO 2012 / 102399 A, and JP 2017-156397 A; phthalocyanine dye derivatives are described, for example, in JP 2007-226161 A, WO 2016 / 163351 A, JP 2017-165820 A, and Japanese Patent No. 5753266 A; anthraquinone dye derivatives are described, for example, in JP 2001-220520 A, WO 2009 / 081930 A, WO 2011 / 052617 A, WO 2012 / 102399 A, and JP 2017-156397 A; Examples of the quinacridone dye derivatives are disclosed in JP-A-63-264674, JP-A-09-272812, JP-A-10-245501, JP-A-10-265697, JP-A-2007-079094, and WO 2009 / 025325; examples of the quinacridone dye derivatives are disclosed in JP-A-48-54128, JP-A-03-9961, and JP-A-2000-273383; examples of the dioxazine dye derivatives are disclosed in JP-A-2011-162662, and examples of the thiadiazine dye derivatives are disclosed in JP-A-2011-162662. Indigo dye derivatives are described, for example, in JP-A-2007-314785; triazine dye derivatives are described, for example, in JP-A-61-246261, JP-A-11-199796, JP-A-2003-165922, JP-A-2003-168208, JP-A-2004-217842, and JP-A-2007-314681; benzoisoindole dye derivatives are described, for example, in JP-A-2009-57478; and quinophthalone dye derivatives are described, for example, in JP-A-2009-57478. Examples of naphthol-based dye derivatives include those described in JP-A-03-167112, JP-A-2006-291194, JP-A-2008-31281, and JP-A-2012-226110. Examples of naphthol-based dye derivatives include those described in JP-A-2012-208329 and JP-A-2014-5439. Examples of azo-based dye derivatives include those described in JP-A-2001-172520 and JP-A-2012-172092. Examples of squarylium-based dye derivatives include those described in WO 2020 / 054718. Note that these documents may refer to dye derivatives as derivatives, pigment derivatives, dispersants, pigment dispersants, or simply compounds, but the compounds having substituents such as acidic groups, basic groups, and neutral groups on the organic dye residues are synonymous with dye derivatives.

[0194] The dye derivative (H) can be used alone or in combination of two or more kinds.

[0195] The content of the dye derivative (H) is preferably from 1 to 20 parts by mass, more preferably from 2 to 10 parts by mass, relative to 100 parts by mass of the near-infrared absorbing dye (A).

[0196] [Sensitizer (I)] The photosensitive composition of the present invention may contain a sensitizer (I).

[0197] Examples of the sensitizer (I) include polymethine dyes such as chalcone compounds, unsaturated ketones typified by dibenzalacetone, 1,2-diketone compounds typified by benzil and camphorquinone, benzoin compounds, fluorene compounds, naphthoquinone compounds, anthraquinone compounds, xanthene compounds, thioxanthene compounds, xanthone compounds, thioxanthone compounds, coumarin compounds, ketocoumarin compounds, cyanine compounds, merocyanine compounds, and oxonol compounds, acridine compounds, azine compounds, thiazine compounds, oxazine compounds, indoline compounds, azulene compounds, and azulenium compounds. Examples of suitable compounds include compounds such as phthalocyanine compounds, squarylium compounds, porphyrin compounds, tetraphenylporphyrin compounds, triarylmethane compounds, tetrabenzoporphyrin compounds, tetrapyrazinoporphyrazine compounds, phthalocyanine compounds, tetraazaporphyrazine compounds, tetraquinoxalylporphyrazine compounds, naphthalocyanine compounds, subphthalocyanine compounds, pyrylium compounds, thiopyrylium compounds, tetraphyrin compounds, annulene compounds, spiropyran compounds, spirooxazine compounds, thiospiropyran compounds, metal arene complexes, organic ruthenium complexes, and benzophenone compounds. Among these, thioxanthone compounds and benzophenone compounds are preferred from the viewpoint of pattern formation.

[0198] (Thioxanthone compounds) Examples of thioxanthone compounds include 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-dichlorothioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 1-chloro-4-propoxythioxanthone, etc. Among these, 2,4-diethylthioxanthone is preferred.

[0199] (benzophenone compounds) Examples of benzophenone compounds include 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 2-aminobenzophenone, etc. Among these, 4,4'-bis(diethylamino)benzophenone is preferred.

[0200] The sensitizer (I) can be used alone or in combination of two or more kinds.

[0201] The content of the sensitizer (I) is preferably from 5 to 400 parts by mass, more preferably from 10 to 300 parts by mass, relative to 100 parts by mass of the photopolymerization initiator (D).

[0202] [Thermosetting compound (J)] The photosensitive composition of the present invention preferably contains a thermosetting compound (J), which crosslinks the thermosetting compound (J) during post-baking, thereby suppressing the generation of aggregated foreign matter of the near-infrared absorbing dye (A), which is likely to occur in a high-temperature, high-humidity environment.

[0203] The thermosetting compound (J) may be a low molecular weight compound or a high molecular weight compound such as a resin. Examples of the thermosetting compound (J) include epoxy compounds, oxetane compounds, benzoguanamine compounds, rosin-modified maleic acid compounds, rosin-modified fumaric acid compounds, melamine compounds, urea compounds, and phenol compounds. Among these, from the viewpoint of suppressing foreign matter, epoxy compounds and oxetane compounds are preferred, and epoxy compounds are more preferred.

[0204] (epoxy compounds) The epoxy compound preferably has a structure having an aromatic ring and / or an aliphatic ring, and more preferably has a structure having an aliphatic ring from the viewpoint of suppressing the generation of foreign matter. The epoxy group is preferably bonded to the aromatic ring and / or the aliphatic ring via a single bond or a linking group. Examples of the linking group include an alkylene group, an arylene group, -O-, -NR- (wherein R represents a hydrogen atom, an optionally substituted alkyl group, or an optionally substituted aryl group), -SO2-, -CO-, -O-, and -S-. In the case of a structure having an aliphatic ring, it is more preferable that the epoxy group is bonded to the aliphatic ring via a single bond.

[0205] The number of epoxy groups in the epoxy compound is preferably 2 to 50, more preferably 5 to 50, and particularly preferably 10 to 30 in the molecule, from the viewpoint of suppressing foreign matter.

[0206] The epoxy equivalent of the epoxy compound is preferably 50 to 400 g / eg, more preferably 100 to 200 g / eg. The epoxy equivalent is defined as the mass of an epoxy compound containing one equivalent of epoxy groups.

[0207] Examples of epoxy compounds include polycondensates of bisphenols (bisphenol A, bisphenol F, bisphenol S, biphenol, bisphenol AD, etc.), phenols (phenol, alkyl-substituted phenol, aromatic-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, alkyl-substituted dihydroxybenzene, dihydroxynaphthalene, etc.) and various aldehydes (formaldehyde, acetaldehyde, alkyl aldehyde, benzaldehyde, alkyl-substituted benzaldehyde, hydroxybenzaldehyde, naphthaldehyde, glutaraldehyde, phthalaldehyde, crotonaldehyde, cinnamaldehyde, etc.), polycondensates of phenols and various diene compounds (dicyclopentadiene, terpenes, vinylcyclohexene, norbornadiene, vinylnorbornene, tetrahydroindene, divinylbenzene, Examples of suitable epoxy resins include polymers of phenols and ketones (acetone, methyl ethyl ketone, methyl isobutyl ketone, acetophenone, benzophenone, etc.), polycondensates of phenols and aromatic dimethanols (benzenedimethanol, α,α,α',α'-benzenedimethanol, biphenyldimethanol, α,α,α',α'-biphenyldimethanol, etc.), polycondensates of phenols and aromatic dichloromethyls (α,α'-dichloroxylene, bischloromethylbiphenyl, etc.), polycondensates of bisphenols and various aldehydes, glycidyl ether epoxy resins obtained by glycidylating alcohols, alicyclic epoxy resins, heterocyclic epoxy resins, aliphatic epoxy resins, glycidylamine epoxy resins, and glycidyl ester epoxy resins.

[0208] Commercially available products include, for example, Epicoat 807, 815, 825, 827, 828, 190P, and 191P manufactured by Yuka Shell Epoxy Co., Ltd., and TECHMORE manufactured by Mitsui Chemicals, Inc. VG3101L, EPPN-201, 501H, 502H, EOCN-102S, 103S, 104S, 1020 manufactured by Nippon Kayaku Co., Ltd., Epicoat 1004, 1256, JER1032H60, 157S65, 157S70, 152, 154 manufactured by Japan Epoxy Resins Co., Ltd., Celloxide 2021, EHPE-3150 manufactured by Daicel Chemical Industries, Ltd., Denacol EX-211, 212, 252, 313, 314, 321, 411, 421, 512, 521, 611, 612, 614, 614B, 622, 711, 721 manufactured by Nagase ChemteX Corporation, TEPIC-L, H, S manufactured by Nissan Chemical Industries, Ltd., and EPICLON manufactured by DIC Corporation. Examples include 830, 840, 850, 860, 1050, 3050, 4050, N-660, N-670, N-740, N-770, N865, HP-7200, HP-4700, HP-4770, HP-5000, HP-6000, and HP-9500.

[0209] From the viewpoint of suppressing foreign matter, the content of the epoxy compound is preferably from 0.5 to 20 mass %, more preferably from 1 to 10 mass %, based on 100 mass % of the nonvolatile content of the photosensitive composition.

[0210] (Oxetane compounds) The oxetane compound is a known compound having an oxetane group, and examples of the oxetane compound include monofunctional oxetane compounds, bifunctional oxetane compounds, and trifunctional or higher functional oxetane compounds.

[0211] Examples of monofunctional oxetane compounds include (3-ethyloxetan-3-yl)methyl acrylate, (3-ethyloxetan-3-yl)methyl methacrylate, 3-ethyl-3-hydroxymethyloxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(phenoxymethyl)oxetane, 3-ethyl-3-(2-methacryloxymethyl)oxetane, and 3-ethyl-3-{[3-(triethoxysilyl)propoxy]methyl}oxetane.

[0212] Examples of commercially available products include OXE-10,30 manufactured by Osaka Organic Chemical Industry Co., Ltd. and OXT-101,212 manufactured by Toagosei Co., Ltd.

[0213] Examples of the bifunctional oxetane compound include 4,4'-bis[(3-ethyl-3-oxetanyl)methoxymethyl]biphenyl), 1,4-bis[(3-ethyl-3-oxetanyl)methoxymethyl]benzene, 1,4-bis{[(3-ethyl-3-oxetanyl)methoxy]methyl}benzene, di[1-ethyl(3-oxetanyl)]methyl ether, di[1-ethyl(3-oxetanyl)]methyl ether 3-ethyl-3-hydroxymethyloxetane, 3- Ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(2-phenoxymethyl)oxetane, 3,7-bis(3-oxetanyl)-5-oxa-nonane, 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl]ethane, 1,3-bis[(3-ethyl-3-oxetanylmethoxy)methyl]propane, ethyleneglycol bis(3-ethyl-3-oxetanylmethyl)ether, dicyclopentenylbis(3-ethyl- 3-oxetanylmethyl) ether, triethylene glycol bis(3-ethyl-3-oxetanylmethyl) ether, tetraethylene glycol bis(3-ethyl-3-oxetanylmethyl) ether, 1,4-bis(3-ethyl-3-oxetanylmethoxy)butane, 1,6-bis(3-ethyl-3-oxetanylmethoxy)hexane, polyethylene glycol bis(3-ethyl-3-oxetanylmethyl) ether, ethylene oxide (EO)-modified bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, propylene oxide (PO)-modified bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, EO-modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, PO-modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanylmethyl) ether, EO-modified bisphenol F(3-ethyl-3-oxetanylmethyl) ether, and the like.

[0214] Examples of commercially available products include OXBP and OXTP manufactured by Ube Industries, Ltd., and OXT-121 and 221 manufactured by Toagosei Co., Ltd.

[0215] Examples of trifunctional or higher oxetane compounds include pentaerythritol tris(3-ethyl-3-oxetanylmethyl) ether, pentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol hexa(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, and caprolactone-modified dipentaerythritol. Examples of such polymers include erythritol hexa(3-ethyl-3-oxetanylmethyl) ether, caprolactone-modified dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether, ditrimethylolpropane tetrakis(3-ethyl-3-oxetanylmethyl) ether, resins containing an oxetane group (for example, the oxetane-modified phenol novolac resin described in Japanese Patent No. 3783462), and polymers obtained by radical polymerization of (meth)acrylic monomers such as the above-mentioned OXE-30.

[0216] From the viewpoint of suppressing foreign matter, the content of the oxetane compound is preferably from 0.5 to 20% by mass, more preferably from 1 to 10% by mass, based on 100% by mass of the nonvolatile content of the photosensitive composition.

[0217] The thermosetting compound (J) can be used alone or in combination of two or more kinds.

[0218] [Curing agent (curing accelerator)] The photosensitive composition of the present invention can be used in combination with a curing agent (curing accelerator) to aid in the curing of the thermosetting compound (J). Examples of the curing agent include amine compounds, acid anhydrides, active esters, carboxylic acid compounds, and sulfonic acid compounds. Examples of the curing agent include amine compounds (e.g., dicyandiamide, benzyldimethylamine, 4-(dimethylamino)-N,N-dimethylbenzylamine, 4-methoxy-N,N-dimethylbenzylamine, 4-methyl-N,N-dimethylbenzylamine, etc.), quaternary ammonium salt compounds (e.g., triethylbenzylammonium chloride, etc.), blocked isocyanate compounds (e.g., dimethylamine, etc.), imidazole derivative bicyclic amidine compounds and their salts (e.g., imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, Examples of suitable amines include 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole, etc., phosphorus compounds (e.g., triphenylphosphine, etc.), and S-triazine derivatives (e.g., 2,4-diamino-6-methacryloyloxyethyl-S-triazine, 2-vinyl-2,4-diamino-S-triazine, 2-vinyl-4,6-diamino-S-triazine-isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-S-triazine-isocyanuric acid adduct, etc.).

[0219] The curing agents can be used alone or in combination of two or more.

[0220] The content of the curing agent is preferably 0.01 to 15 parts by mass relative to 100 parts by mass of the thermosetting compound (J).

[0221] [Polymerization inhibitor (K)] The photosensitive composition of the present invention may contain a polymerization inhibitor (K).

[0222] Examples of the polymerization inhibitor (K) include alkyl catechol compounds such as catechol, resorcinol, 1,4-hydroquinone, 2-methyl catechol, 3-methyl catechol, 4-methyl catechol, 2-ethyl catechol, 3-ethyl catechol, 4-ethyl catechol, 2-propyl catechol, 3-propyl catechol, 4-propyl catechol, 2-n-butyl catechol, 3-n-butyl catechol, 4-n-butyl catechol, 2-t-butyl catechol, 3-t-butyl catechol, 4-t-butyl catechol, and 3,5-di-t-butyl catechol; 2-methyl resorcinol, 4-methyl resorcinol, 2-ethyl resorcinol, 4-ethyl resorcinol, 2-propyl resorcinol, 4-propyl resorcinol; alkylresorcinol compounds such as 4-n-butylresorcinol, 4-n-butylresorcinol, 2-t-butylresorcinol, and 4-t-butylresorcinol; alkylhydroquinone compounds such as methylhydroquinone, ethylhydroquinone, propylhydroquinone, t-butylhydroquinone, and 2,5-di-t-butylhydroquinone; phosphine compounds such as tributylphosphine, trioctylphosphine, tricyclohexylphosphine, triphenylphosphine, and tribenzylphosphine; phosphine oxide compounds such as trioctylphosphine oxide and triphenylphosphine oxide; phosphite compounds such as triphenylphosphite and trisnonylphenylphosphite; pyrogallol; and phloroglucin.

[0223] The content of the polymerization inhibitor (K) is preferably 0.01 to 0.4% by mass relative to 100% by mass of the nonvolatile content of the photosensitive composition.

[0224] [Ultraviolet absorber (L)] The photosensitive composition of the present invention may contain an ultraviolet absorber (L).

[0225] The ultraviolet absorber (L) is an organic compound having an ultraviolet absorbing function, and examples thereof include benzotriazole-based organic compounds, triazine-based organic compounds, benzophenone-based organic compounds, salicylic acid ester-based organic compounds, cyanoacrylate-based organic compounds, and salicylate-based organic compounds.

[0226] Examples of benzotriazole compounds include 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(2-hydroxy-5-t-butylphenyl)-2H-benzotriazole, 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, 2-(3-t-butyl-5-methyl-2-hydroxyphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-5'-t-octylphenyl)benzotriazole, and 5% 2- A mixture of methoxy-1-methylethyl acetate and 95% benzenepropanoic acid, 3-(2H-benzotriazol-2-yl)-(1,1-dimethylethyl)-4-hydroxy, C7-9 branched and linear alkyl esters, 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol, methyl 3-(3-(2H-benzotriazol-2-yl)-5-t-butyl-4-hydroxyphenyl)propionate / polyethylene glycol 300 reaction products, 2-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol, 2,2'-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol], 2-(2H-benzotriazol-2-yl)-p-cresol, 2-(5-chloro-2H-benzotriazol-2-yl)-6-t-butyl octyl-4-methylphenol, 2-(3,5-di-t-amyl-2-hydroxyphenyl)benzotriazole, 2-[2-hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl]-2H-benzotriazole, octyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate, and 2-ethylhexyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate.

[0227] Examples of commercially available products include TINUVIN P, PS, 234, 326, 329, 384-2, 900, 928, 99-2, and 1130 manufactured by BASF Japan Ltd., ADK STAB LA-29, LA-31RG, LA-32, and LA-36 manufactured by ADEKA Corporation, KEMISORB71, 73, 74, 79, and 279 manufactured by Chemipro Chemical Co., Ltd., and RUVA-93 manufactured by Otsuka Chemical Co., Ltd.

[0228] Examples of triazine compounds include 2,4-bis(2,4-dimethylphenyl)-6-(2-hydroxy-4-n-octyloxyphenyl)-1,3,5-triazine, 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol, and the reaction product of 2-(2,4-dihydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine with (2-ethylhexyl)-glycidic acid ester. Examples of such compounds include 2,4-bis[2-hydroxy-4-butoxyphenyl]-6-(2,4-dibutoxyphenyl)-1,3,5-triazine, 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-(hexyloxy)phenol, 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-[2-(2-ethylhexanoyloxy)ethoxy]phenol, and 2,4,6-tris(2-hydroxy-4-hexyloxy-3-methylphenyl)-1,3,5-triazine.

[0229] Examples of commercially available products include KEMISORB 102 manufactured by Chemipro Chemicals, TINUVIN 400, 405, 460, 477, 479, and 1577ED manufactured by BASF Japan, Adekastab LA-46 and LA-F70 manufactured by ADEKA, and CYASORB UV-1164 manufactured by Sun Chemical.

[0230] Examples of benzophenone compounds include 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxybenzophenone-5-sulfonic acid-3-oxide, 2-hydroxy-4-n-octoxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 4-dodecyloxy-2-hydroxybenzophenone, 2-hydroxy-4-octadecyloxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,2',4,4'-tetrahydroxybenzophenone, and 2-hydroxy-4-methoxy-2'-carboxybenzophenone.

[0231] Examples of commercially available products include KEMISORB 10, 11, 11S, 12, and 111 manufactured by Chemipro Chemicals, SEESORB 101 and 107 manufactured by Shipro Chemicals, Adekastab 1413 manufactured by ADEKA, and UV-12 manufactured by Sun Chemical.

[0232] Examples of salicylate compounds include phenyl salicylate, p-octylphenyl salicylate, and p-tert-butylphenyl salicylate.

[0233] The content of the ultraviolet absorber (L) is preferably 5 to 70% by mass relative to 100% by mass of the total of the photopolymerization initiator (D) and the ultraviolet absorber (L).

[0234] [Antioxidant (M)] The photosensitive composition of the present invention may contain an antioxidant (M). The antioxidant (M) prevents the photopolymerization initiator (D) and thermosetting compound (J) in the photosensitive coloring composition from being oxidized and yellowed by the thermal steps of thermal curing and ITO annealing.

[0235] Examples of the antioxidant (M) include hindered phenol-based, hindered amine-based, phosphorus-based, sulfur-based, and hydroxylamine-based compounds, etc. Among these, hindered phenol-based antioxidants, hindered amine-based antioxidants, phosphorus-based antioxidants, and sulfur-based antioxidants are preferred.

[0236] Examples of hindered phenol antioxidants include 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 1,1,3-tris-(2'-methyl-4'-hydroxy-5'-t-butylphenyl)-butane, 4,4'-butylidene-bis-(2-t-butyl-5-methylphenol), 3-(3,5-di-t-butyl-4-hydroxyphenyl)stearyl propionate, pentaerythritol tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 3,9-bis[2-[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionyloxy]-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5.5]undecane, 1,3,5-tris(3,5-di-t-butyl-4-hydroxyphenylmethyl)-2,4,6-trimethylbenzene, 1,3,5-tris(3-hydroxy-4-t-butyl-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,2'-methylenebis(6-t-butyl-4-ethylphenol), 2,2'-thiodiethylbis-(3,5-di -t-butyl-4-hydroxyphenyl)-propionate, N,N-hexamethylenebis(3,5-di-t-butyl-4-hydroxy-hydrocinnamamide), i-octyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 4,6-bis(dodecylthiomethyl)-o-cresol, calcium salt of 3,5-di-t-butyl-4-hydroxybenzylphosphonic acid monoethyl ester, 4 ,6-bis(octylthiomethyl)-o-cresol, bis[3-(3-methyl-4-hydroxy-5-t-butylphenyl)propionic acid]ethylenebisoxybisethylene, 1,6-hexanediol bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 2,4-bis-(n-octylthio)-6-(4-hydroxy-3,5-di-t-butylanilino)-1,3,5-triazine, Examples include 2,2'-thio-bis-(6-t-butyl-4-methylphenol), 2,5-di-t-amyl-hydroquinone, 2,6-di-t-butyl-4-nonylphenol, 2,2'-isobutylidene-bis-(4,6-dimethyl-phenol), 2,2'-methylene-bis-(6-(1-methyl-cyclohexyl)-p-cresol), and 2,4-dimethyl-6-(1-methyl-cyclohexyl)-phenol.

[0237] Examples of commercially available products include ADK STAB AO-20, AO-30, AO-40, AO-50, AO-60, AO-80, and AO-330 manufactured by ADEKA Corporation, KEMINOX 101, 179, 76, and 9425 manufactured by Chemipro Corporation, IRGANOX 1010, 1035, 1076, 1098, 1135, 1330, 1726, 1425WL, 1520L, 245, 259, 3114, 5057, and 565 manufactured by BASF Japan Ltd., and Cyanox CY-1790 and CY-2777 manufactured by Sun Chemical Company.

[0238] Examples of the hindered amine antioxidant include tetrakis(1,2,2,6,6-pentamethyl-4-piperidyl)-1,2,3,4-butanetetracarboxylate, tetrakis(2,2,6,6-tetramethyl-4-piperidyl)1,2,3,4-butanetetracarboxylate, bis(1,2,2,6,6-pentamethyl-4-piperidyl)sebacate, bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, bis(1-undecanoxy-2,2,6,6-tetramethylpiperidin-4-yl)carbonate, 1,2,2,6,6-pentamethyl-4-piperidyl tetramethyl-4-piperidyl methacrylate, 2,2,6,6-tetramethyl-4-piperidyl methacrylate, polycondensate of dimethyl succinate and 1-(2-hydroxyethyl)-4-hydroxy-2,2,6,6-tetramethylpiperidine, poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-s-triazine-2,4-diyl]-[(2,2,6,6-tetramethyl-4-piperidyl)imino]-hexamethylene-[(2,2,6,6-tetramethyl-4-piperidyl)imino]], 4-hydroxy-2,2,6,6-tetramethyl-1- Ester of piperidineethanol and 3,5,5-trimethylhexanoic acid, N,N'-4,7-tetrakis[4,6-bis{N-butyl-N-(1,2,2,6,6-pentamethyl-4-piperidyl)amino}-1,3,5-triazin-2-yl]-4,7-diazadecane-1,10-diamine, decanedioic acid bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-piperidinyl) ester, reaction products of 1,1-dimethylethyl hydroperoxide with octane, bis(1,2,2,6,6-pentamethyl-4-pyridyl)[[3,5-bi N,N'-bis(2,2,6,6-tetramethyl-4-piperidyl)-1,2,6,6-tetramethyl-4-piperidyl-C12-21 and C18 unsaturated fatty acid esters, N,N'-bis(2,2,6,6-tetramethyl-4-piperidyl)-1,2,6,6-tetramethyl-4-piperidyl ...Examples include 6-hexamethylenediamine and 2-methyl-2-(2,2,6,6-tetramethyl-4-piperidyl)amino-N-(2,2,6,6-tetramethyl-4-piperidyl)propionamide.

[0239] Examples of commercially available products include ADK STAB LA-52, LA-57, LA-63P, LA-68, LA-72, LA-77Y, LA-77G, LA-81, LA-82, LA-87, LA-402F, and LA-502XP manufactured by ADEKA CORPORATION; KAMISTAB 29, 62, 77, and 94 manufactured by Chemipro Chemicals; Tinuvin 111FDL, 123, 144, 249, 292, and 5100 manufactured by BASF Japan; and Cyasorb UV-3346, UV-3529, and UV-3853 manufactured by Sun Chemical Company.

[0240] Examples of phosphorus-based antioxidants include di(2,6-di-t-butyl-4-methylphenyl)pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, 2,2'-methylenebis(4,6-di-t-butylphenyl)2-ethylhexyl phosphite, tris(2,4-di-t-butylphenyl)phosphite, tris(nonylphenyl)phosphite, tetra(C12 to C15 alkyl)-4,4'-isopropylidene diphenyl diphosphite, diphenyl mono (2-ethylhexyl) phosphite, diphenyl isodecyl phosphite, tris(isodecyl) phosphite, triphenyl phosphite, tetrakis(2,4-di-t-butylphenyl)-4,4-biphenyl diphosphonate, tris(tridecyl) phosphite, phenyl isooctyl phosphite, phenyl isodecyl phosphite, phenyl di(tridecyl) phosphite, diphenyl isooctyl phosphite, diphenyl tridecyl phosphite, 4,4'-isopropylidene Diphenyl alkyl phosphite, trisnonylphenyl phosphite, trisdinonylphenyl phosphite, tris(biphenyl) phosphite, di(2,4-di-t-butylphenyl)pentaerythritol diphosphite, di(nonylphenyl)pentaerythritol diphosphite, phenyl bisphenol A pentaerythritol diphosphite, tetratridecyl 4,4'-butylidenebis(3-methyl-6-t-butylphenol) diphosphite, hexatridecyl Examples include 1,1,3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane triphosphite, 3,5-di-t-butyl-4-hydroxybenzyl phosphite diethyl ester, sodium bis(4-t-butylphenyl)phosphite, sodium-2,2-methylene-bis(4,6-di-t-butylphenyl)-phosphite, 1,3-bis(diphenoxyphosphonyloxy)-benzene, and ethyl bis(2,4-di-t-butyl-6-methylphenyl)phosphite.

[0241] Examples of commercially available products include Adeka Stab PEP-36, PEP-8, HP-10, 2112, 1178, 1500, C, 135A, 3010, and TPP manufactured by ADEKA Corporation, IRGAFOS168 manufactured by BASF Japan, and HostanoxP-EPQ manufactured by Clariant Chemicals.

[0242] Examples of sulfur-based antioxidants include 2,2-bis{[3-(dodecylthio)-1-oxopropoxy]methyl}propane-1,3-diylbis[3-(dodecylthio)propionate], ditridecyl 3,3'-thiobispropionate, 2,2-thio-diethylenebis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 2,4-bis[(octylthio)methyl]-o-cresol, and 2,4-bis[(laurylthio)methyl]-o-cresol.

[0243] Examples of commercially available products include Adekastab AO-412S and AO-503 manufactured by ADEKA Corporation, and KEMINOXPLS manufactured by Chemipro Chemicals.

[0244] The antioxidant (M) can be used alone or in combination of two or more kinds.

[0245] The content of the antioxidant (M) is preferably 0.5 to 5.0% by mass relative to 100% by mass of the nonvolatile content of the photosensitive composition. When an appropriate amount is contained, the transmittance and spectral characteristics are improved.

[0246] [Leveling Agent (N)] The photosensitive composition of the present invention can contain a leveling agent (N). This further improves the wettability to the substrate during application and the drying property. Examples of the leveling agent (N) include silicone surfactants, fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and amphoteric surfactants.

[0247] Examples of silicone surfactants include linear polymers formed from siloxane bonds and modified siloxane polymers in which organic groups have been introduced into the side chains or terminals.

[0248] Commercially available products include, for example, BYK-300, 306, 310, 313, 315N, 320, 322, 323, 330, 331, 333, 342, 345, 346, 347, 348, 349, 370, 377, 378, 3455, UV3510, and 3570 manufactured by BYK-Chemie Co., Ltd., and FZ-7002 and 211 manufactured by Dow Corning Toray Co., Ltd. 0, 2122, 2123, 2191, 5609, and X-22-4952, X-22-4272, X-22-6266, KF-351A, KF-354L, KF-355A, KF-945, KF-640, KF-642, KF-643, X-22-4515, KF-6004, and KP-341 manufactured by Shin-Etsu Chemical Co., Ltd.

[0249] Examples of the fluorine-based surfactant include a surfactant or leveling agent having a fluorocarbon chain.

[0250] Examples of commercially available products include Surflon S-242, 243, 420, 611, 651, and 386 manufactured by AGC Seimi Chemical Co., Ltd.; Megafac F-253, 477, 551, 552, 555, 558, 560, 570, 575, and 576, R-40-LM, R-41, RS-72-K, and DS-21 manufactured by DIC Corporation; FC-4430 and 4432 manufactured by Sumitomo 3M Limited; EF-PP31N09, EF-PP33G1, and EF-PP32C1 manufactured by Mitsubishi Materials Electronic Chemicals Co., Ltd.; and Futergent 602A manufactured by Neos Corporation.

[0251] Examples of nonionic surfactants include polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene alkyl ether, polyoxyethylene myrister ether, polyoxyethylene octyldodecyl ether, polyoxyalkylene alkyl ether, polyoxyphenylenedistyrenated phenyl ether, polyoxyethylene tribenzyl phenyl ether, polyoxyethylene polyoxypropylene glycol, polyoxyalkylene alkenyl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene alkyl ether phosphate ester, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan distearate, and sorbitan tristearate. sorbitan monooleate, sorbitan trioleate, sorbitan sesquioleate, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan tristearate, polyoxyethylene sorbitan monooleate, polyoxyethylene sorbitan triisostearate, polyoxyethylene sorbitan tetraoleate, glycerol monostearate, glycerol monooleate, polyethylene glycol monolaurate, polyethylene glycol monostearate, polyethylene glycol distearate, polyethylene glycol monooleate, polyoxyethylene hydrogenated castor oil, polyoxyethylene alkylamine, alkyl alkanolamide, alkyl imidazoline, and the like.

[0252] Commercially available products include, for example, Emulgen 103, 104P, 106, 108, 109P, 120, 123P, 130K, 147, 150, 210P, 220, 306P, 320P, 350, 404, 408, 409PV, 420, 430, 705, 707, 709, 1108, 1118S-70, 1135S-70, 1150S-60, 2020G-HA, 2025G, LS-106, and L manufactured by Kao Corporation. S-110, LS-114, MS-110, A-60, A-90, B-66, PP-290, Latemul PD-420, PD-430, PD-430S, PD-450, Leodor SP-L10, SP-P10, SP-S10V, SP-S20, SP-S30V, SP-O10V, SP-O30V, Super SP-L10, AS-10V, AO-10V, AO-15V, TW-L120, TW- L106, TW-P120, TW-S120V, TW-S320V, TW-O120V, TW-O106V, TW-IS399C, Super TW-L120, 430V, 440V, 460V, MS-50, MS-60, MO-60, MS-165V, Emanon 1112, 3199V, 3299V, 3299RV, 4110, CH-25, CH-40, CH-60(K), Amit 102, 105, 105A, 302, 320, Aminone PK-02S, L-02, Homogenol L-95, ADEKA Pluronic (registered trademark) L-23, 31, 44, 61, 62, 64, 71, 72, 101, 121, TR-701, 702, 704, 913R manufactured by ADEKA Corporation, and (meth)acrylic acid (co)polymer Polyflow No. 75, No. 90, No. 95 manufactured by Kyoeisha Chemical Co., Ltd.

[0253] Examples of cationic surfactants include alkylamine salts, alkyl quaternary ammonium salts such as lauryltrimethylammonium chloride, stearyltrimethylammonium chloride, and cetyltrimethylammonium chloride, and ethylene oxide adducts thereof.

[0254] Examples of commercially available products include Acetamine 24, Cortamine 24P, 60W, and 86P Concentrate, manufactured by Kao Corporation.

[0255] Examples of anionic surfactants include polyoxyethylene alkyl ether sulfates, sodium dodecylbenzenesulfonate, alkali salts of styrene-acrylic acid copolymers, sodium alkylnaphthalenesulfonate, sodium alkyldiphenyletherdisulfonate, monoethanolamine lauryl sulfate, triethanolamine lauryl sulfate, ammonium lauryl sulfate, monoethanolamine stearate, sodium stearate, sodium lauryl sulfate, monoethanolamine styrene-acrylic acid copolymers, and polyoxyethylene alkyl ether phosphates.

[0256] Examples of commercially available products include Futergent 100 and 150 manufactured by Neos Corporation, and Adeka Hope YES-25, Adekacol TS-230E, PS-440E, and EC-8600 manufactured by ADEKA Corporation.

[0257] Examples of amphoteric surfactants include alkyl betaines such as lauric acid amidopropyl betaine, lauryl betaine, cocamidopropyl betaine, stearyl betaine, and alkyldimethylaminoacetic acid betaine; and alkylamine oxides such as lauryldimethylamine oxide.

[0258] Commercially available products include Anhithol 20AB, 20BS, 24B, 55AB, 86B, 20Y-B, ​​and 20N manufactured by Kao Corporation.

[0259] The leveling agent (N) can be used alone or in combination of two or more kinds.

[0260] The content of the leveling agent (N) is preferably 0.001 to 2.0 mass%, more preferably 0.005 to 1.0 mass%, based on 100 mass% of the nonvolatile content of the photosensitive composition. When an appropriate amount is contained, the balance between the coatability and adhesion of the photosensitive composition is further improved.

[0261] [Storage stabilizer (O)] The photosensitive composition of the present invention may contain a storage stabilizer (O). This stabilizes the viscosity of the photosensitive composition over time. Examples of the storage stabilizer (O) include quaternary ammonium chlorides such as benzyl trimethyl chloride and diethylhydroxyamine, organic acids such as lactic acid and oxalic acid and their methyl ethers, organic phosphines such as t-butylpyrocatechol, tetraethylphosphine and tetraphenylphosphine, and phosphites.

[0262] The content of the storage stabilizer (O) is preferably 0.1 to 10 parts by mass relative to 100 parts by mass of the near-infrared absorbing dye (A).

[0263] [Adhesion improver (P)] The photosensitive composition of the present invention may contain an adhesion promoter (P), which improves the adhesion between the cured film and the substrate and also makes it easier to form narrow patterns by photolithography.

[0264] Examples of the adhesion improver (P) include silane coupling agents. Examples of the silane coupling agent include vinyl silanes such as vinyltrimethoxysilane and vinyltriethoxysilane, (meth)acrylic silanes such as 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, and 3-acryloxypropyltrimethoxysilane, epoxy silanes such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 3-glycidoxypropyltriethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl) silane coupling agents such as aminosilanes such as 3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylidene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, and N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride; mercapto compounds such as 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane; styryl compounds such as p-styryltrimethoxysilane; ureido compounds such as 3-ureidopropyltriethoxysilane; sulfides such as bis(triethoxysilylpropyl)tetrasulfide; and isocyanates such as 3-isocyanatepropyltriethoxysilane.

[0265] The adhesion improver (P) can be used alone or in combination of two or more kinds.

[0266] The content of the adhesion improver (P) is preferably from 0.01 to 10 parts by mass, more preferably from 0.05 to 5 parts by mass, relative to 100 parts by mass of the near-infrared absorbing dye (A).

[0267] [Organic solvent (Q)] The photosensitive composition of the present invention may contain an organic solvent (Q).

[0268] Examples of the organic solvent (Q) include 1,2,3-trichloropropane, 1-methoxy-2-propanol, ethyl lactate, 1,3-butanediol, 1,3-butylene glycol, 1,3-butylene glycol diacetate, 1,4-dioxane, 2-heptanone, 2-methyl-1,3-propanediol, 3,5,5-trimethyl-2-cyclohexene-1-one, 3,3,5-trimethylcyclohexanone, ethyl 3-ethoxypropionate, 3-methyl-1,3-butanediol, 3-methoxy-3-methyl-1-butanol, 3-methoxy-3-methylbutanol, and 1,4-dioxanediol. ethyl acetate, 3-methoxybutanol, 3-methoxybutyl acetate, 4-heptanone, m-xylene, m-diethylbenzene, m-dichlorobenzene, N,N-dimethylacetamide, N,N-dimethylformamide, n-butyl alcohol, n-butylbenzene, n-propyl acetate, N-methylpyrrolidone, o-xylene, o-chlorotoluene, o-diethylbenzene, o-dichlorobenzene, p-chlorotoluene, p-diethylbenzene, sec-butylbenzene, tert-butylbenzene, γ-butyrolactone, isobutyl alcohol ethanol, isophorone, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monoethyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monotertiary butyl ether, ethylene glycol monobutyl ether, ethylene glycol monobutyl ether acetate, ethylene glycol monopropyl ether, ethylene glycol monohexyl ether, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, diisobutyl ketone, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol monomethyl ether, cyclohexanol, cyclohexanol acetate, cyclohexanone, dipropylene glycol dimethyl ether, dipropylene glycol methyl ether acetate,Examples of the alkyl esters include dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monomethyl ether, diacetone alcohol, triacetin, tripropylene glycol monobutyl ether, tripropylene glycol monomethyl ether, propylene glycol diacetate, propylene glycol phenyl ether, propylene glycol monoethyl ether, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether, propylene glycol monopropyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether propionate, benzyl alcohol, methyl isobutyl ketone, methylcyclohexanol, n-amyl acetate, n-butyl acetate, isoamyl acetate, isobutyl acetate, propyl acetate, and dibasic acid esters. Among these, from the viewpoints of pigment dispersibility and alkali-soluble resin solubility, glycol acetates such as ethyl lactate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethylene glycol monomethyl ether acetate, and ethylene glycol monoethyl ether acetate, alcohols such as diacetone alcohol, and ketones such as cyclohexanone are preferred.

[0269] From an environmental viewpoint, the photosensitive composition of the present invention preferably does not substantially contain organic solvents that are aromatic hydrocarbons (toluene, xylene, benzene, chlorobenzene, etc.) "Substantially not containing" means that the content of such organic solvents in the photosensitive composition is 100 ppm by mass or less, preferably 50 ppm by mass or less, and more preferably 10 ppm by mass or less.

[0270] The organic solvent (Q) can be used alone or in combination of two or more kinds.

[0271] [Specific metal element content] The photosensitive composition of the present invention preferably contains 500 mass ppm or less of Li, Na, K, Mg, Ca, Fe, and Cr (hereinafter also referred to as specific metal elements) in total.

[0272] When the total amount of the specific metal elements in the photosensitive composition is within the above range, the composition exhibits excellent dispersion stability and sensitivity even after storage over time. Furthermore, a cured product prepared using the photosensitive composition having the total amount of the specific metal elements within the above range exhibits excellent heat resistance and generates little foreign matter even when heated.

[0273] The total amount of the specific metal elements contained in the photosensitive composition is more preferably 300 ppm by mass or less, particularly preferably 200 ppm by mass or less. The lower limit of the total amount of the specific metal elements is not particularly limited, but is preferably 1 ppm by mass or more, more preferably 5 ppm by mass or more.

[0274] The content of specific metal elements can be measured by inductively coupled plasma emission spectrometry (ICP).

[0275] From the viewpoints of storage stability and suppression of generation of foreign matter, it is preferable that the content of metal elements other than the specific metal elements is also reduced in the photosensitive composition of the present invention. Examples of metals other than the specific metal elements include Mn, Cs, Ti, Co, Ni, Si, and Pd.

[0276] [Water content] The photosensitive composition of the present invention preferably contains water in an amount of 2.0% by mass or less.

[0277] When the water content of the photosensitive composition is within the above range, the composition exhibits excellent dispersion stability and sensitivity even after storage over time.

[0278] The water content in the photosensitive composition is more preferably 1.8% by mass or less, particularly preferably 1.6% by mass or less. The lower limit of the water content is preferably as low as possible, and there is no particular restriction. Within the above range, the dispersion stability and sensitivity are excellent even after storage.

[0279] The water content can be measured by a known method such as the Karl Fischer method.

[0280] [Method for producing photosensitive composition] The photosensitive composition of the present invention can be produced by, for example, adding a near-infrared absorbing dye (A), a dispersing resin (G), an organic solvent (Q), and the like and dispersing the mixture. The composition can then be mixed with an alkali-soluble resin (B), a polymerizable compound (C), a photopolymerization initiator (D), and the like. The timing of mixing the various materials is not critical. The dispersion process can also be performed multiple times.

[0281] Examples of dispersing machines for carrying out the dispersion treatment include a two-roll mill, a three-roll mill, a ball mill, a horizontal sand mill, a vertical sand mill, an annular bead mill, and an attritor.

[0282] The average dispersed particle size (secondary particle size) of the near-infrared absorbing dye (A) in the dispersion is preferably 30 to 200 nm, more preferably 40 to 200 nm. A suitable particle size makes it easier to obtain a photosensitive composition with high dispersion stability.

[0283] The average dispersed particle size (secondary particle size) is measured using, for example, Nikkiso's Microtrac UPA-EX150, which employs dynamic light scattering (FFT power spectrum method), with particle permeability set to absorption mode, particle shape set to non-spherical, and the D50 particle size set to the average size. The dilution solvent used for measurement is the same organic solvent used for dispersion, and it is preferable to measure samples treated with ultrasound immediately after sample preparation, as this tends to provide results with little variation.

[0284] The photosensitive composition is preferably subjected to removal of coarse particles of 5 μm or larger, preferably coarse particles of 1 μm or larger, and more preferably coarse particles of 0.5 μm or larger, as well as any dust particles that have been mixed in, by means of centrifugation, filtration through a sintered filter or membrane filter, etc. The photosensitive composition of the present invention preferably contains substantially no particles of 0.5 μm or larger, and more preferably contains no particles of 0.3 μm or smaller.

[0285] <Cured film> The cured film of the present invention is a cured product of the photosensitive composition of the present invention. Curing is carried out by subjecting the film formed by coating to a treatment such as exposure to light.

[0286] [Method of manufacturing cured film] The method for producing the cured film is not particularly limited, and can be, for example, by carrying out the following steps: (1) applying a photosensitive composition to a substrate to form a composition layer; (2) exposing the layer to light through a mask in a pattern; (3) developing the unexposed portions with an alkali to form a patterned cured film; and (4) heat-treating (post-baking) the pattern. In the present invention, the cured film is preferably produced at a temperature of 150°C or less throughout all steps.

[0287] The method for producing the cured film will be described in detail below.

[0288] (Process (1)) In the step (1) of forming a composition layer, the photosensitive composition is applied to a substrate by, for example, rotary coating, roll coating, slit coating, casting coating, or inkjet coating, and then dried (prebaked) at a temperature of 50 to 100°C for 10 to 120 seconds using an oven, a hot plate, or the like, as needed. Examples of the substrate include a glass substrate, a resin substrate, and a silicon substrate. Examples of the resin substrate include a polycarbonate substrate, a polyester substrate, an aromatic polyamide substrate, a polyamideimide substrate, and a polyimide substrate. An organic light-emitting layer may be formed on these substrates. For example, an imaging element such as a CCD or a CMOS may be formed on the surface of the silicon substrate. If necessary, an undercoat layer may be provided on the substrate to improve adhesion with upper layers, prevent diffusion of substances, and flatten the substrate surface. The thickness of the layer is preferably 0.05 to 10.0 μm, more preferably 0.3 to 5.0 μm.

[0289] (Process (2)) In the exposure step, the layer obtained in step (1) is exposed to light in a specific pattern through a mask using an exposure device such as a stepper, thereby obtaining a cured film. Examples of active energy rays used for exposure include ultraviolet rays such as g-rays (wavelength 436 nm), h-rays (wavelength 405 nm), and i-rays (wavelength 365 nm). Light with a wavelength of 300 nm or less can also be used. Examples of light with a wavelength of 300 nm or less include KrF rays (wavelength 248 nm) and ArF rays (wavelength 193 nm). Furthermore, the exposure may be performed by continuous irradiation with light, or by repeating irradiation and pauses of light in short cycles (for example, milliseconds or less) (pulse exposure).

[0290] (Step (3)) The cured film obtained in step (2) is subjected to an alkali development treatment, whereby the composition layer in the unexposed areas is dissolved in an alkaline aqueous solution, leaving only the cured areas, thereby obtaining a patterned cured film. Examples of the developer include alkaline compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, aqueous ammonia, ethylamine, diethylamine, dimethylethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, choline, pyrrole, piperidine, and 1,8-diazabicyclo-[5.4.0]-7-undecene. The concentration of the developer is preferably from 0.001 to 10% by mass, more preferably from 0.01 to 1% by mass. The pH of the alkaline developer is preferably 11 to 13, more preferably 11.5 to 12.5. When used at an appropriate pH, it suppresses pattern roughening and peeling, and improves the remaining film rate after development.

[0291] Examples of the developing method include a dipping method, a spraying method, a puddling method, etc. The developing temperature is preferably 15 to 40° C. After the alkaline development, it is preferable to wash with pure water.

[0292] (Step (4)) In the heat treatment (post-baking), the patterned cured film obtained in step (3) is heated to sufficiently cure. The heating temperature for post-baking is preferably 150°C or lower. There is no particular lower limit to the heating temperature as long as it can promote curing, but a temperature of 50°C or higher is preferred. The heating time is preferably 5 minutes to 2 hours.

[0293] <Optical filters> The cured film of the present invention can be used for an optical filter. The optical filter is preferably, for example, an infrared cut filter or an infrared transmission filter. The optical filter of the present invention can be produced by the same method as for the cured film described above.

[0294] <Image display device> The cured film of the present invention can be used in image display devices. Examples of image display devices include liquid crystal display devices and organic electroluminescence (EL) display devices. The form in which the cured film is used in an image display device is not particularly limited, and the film can be used as a color filter, a black matrix, a light-shielding filter, or an infrared cut filter. Examples of the black matrix include a black border provided on the periphery of an image display device such as a solid-state imaging device or a liquid crystal display device, a grid-like and / or stripe-like black portion between red, blue, and green pixels, and a dot-like and / or linear black pattern for TFT light shielding.

[0295] An example of an image display device of the present invention will be described. The image display device comprises the cured film of the present invention and a light source. Examples of light sources include cold cathode fluorescent lamps (CCFL) and white LEDs, but in the present invention, it is preferable to use white LEDs because they broaden the red reproduction range. FIG. 1 is a schematic cross-sectional view showing an example of the configuration of an image display device comprising the cured film of the present invention. The image display device 10 shown in FIG. 1 comprises a pair of transparent substrates 11 and 21 arranged at a distance from each other, with a liquid crystal LC sealed between them.

[0296] A TFT (thin film transistor) array 12 is formed on the inner surface of the first transparent substrate 11, and a transparent electrode layer 13 made of, for example, ITO is formed thereon. An alignment layer 14 is provided on the transparent electrode layer 13. A polarizing plate 15 is formed on the outer surface of the transparent substrate 11.

[0297] On the other hand, a color filter 22 is formed on the inner surface of the second transparent substrate 21. Red, green, and blue filter segments that constitute the color filter 22 are separated by a black matrix (not shown).

[0298] A transparent protective film (not shown) is formed as needed to cover the color filter 22, and a transparent electrode layer 23 made of, for example, ITO is formed on top of that, and an alignment layer 24 is provided to cover the transparent electrode layer 23.

[0299] A polarizing plate 25 is formed on the outer surface of the transparent substrate 21. Below the polarizing plate 25, a backlight unit 30 is provided.

[0300] The liquid crystal LC is aligned according to a driving mode such as TN (Twisted Nematic), STN (Super Twisted Nematic), IPS (In-Plane Switching), VA (Vertical Alignment), or OCB (Optically Compensated Birefringence). A TFT (Thin Film Transistor) array 12 is formed on the inner surface of the first transparent substrate 11, and a transparent electrode layer 13 made of, for example, ITO is formed thereon. An alignment layer 14 is provided on the transparent electrode layer 13. A polarizer 15 is formed on the outer surface of the transparent substrate 11.

[0301] On the other hand, a color filter 22 is formed on the inner surface of the second transparent substrate 21. Red, green, and blue filter segments that constitute the color filter 22 are separated by a black matrix (not shown).

[0302] A transparent protective film (not shown) is formed as needed to cover the color filter 22, and a transparent electrode layer 23 made of, for example, ITO is formed on top of that, and an alignment layer 24 is provided to cover the transparent electrode layer 23.

[0303] A polarizing plate 25 is formed on the outer surface of the transparent substrate 21. Below the polarizing plate 25, a backlight unit 30 is provided.

[0304] The white LED light source includes a blue LED with a fluorescent filter formed on the surface, and a blue LED with a fluorescent material contained in the resin package, and has a wavelength (λ3) in the range of 430 nm to 485 nm at which the emission intensity becomes maximum, a wavelength (λ4) in the range of 530 nm to 580 nm at which the emission intensity becomes maximum, and a wavelength (λ5) in the range of 600 nm to 650 nm at which the emission intensity becomes maximum, and the ratio (I4 / I3) of the emission intensity I3 at wavelength λ3 to the emission intensity I4 at wavelength λ4 is 0.2 or more and 0.4 or less. Therefore, a white LED light source (LED1) having spectral characteristics in which the ratio (I5 / I3) of the emission intensity I3 at wavelength λ3 to the emission intensity I5 at wavelength λ5 is 0.1 or more and 1.3 or less, or a white LED light source (LED2) having a wavelength (λ1) at which the emission intensity is maximum in the range of 430 nm to 485 nm, a peak wavelength (λ2) of the second emission intensity in the range of 530 nm to 580 nm, and a ratio (I2 / I1) of the emission intensity I1 at wavelength λ1 to the emission intensity I2 at wavelength λ2 is 0.2 or more and 0.7 or less is preferred.

[0305] Specific examples of the LED 1 include NSSW306D-HG-V1 (manufactured by Nichia Corporation) and NSSW304D-HG-V1 (manufactured by Nichia Corporation).

[0306] Specific examples of the LED 2 include NSSW440 (manufactured by Nichia Chemical Industries), NSSW304D (manufactured by Nichia Chemical Industries), and the like.

[0307] <Solid-state imaging element> The cured film of the present invention can be used in a solid-state imaging device. The form of the solid-state imaging device used is not particularly limited, but examples include a substrate having a plurality of photodiodes constituting the light-receiving area of ​​the solid-state imaging device (such as a CCD image sensor, a CMOS image sensor, or an organic CMOS image sensor) and a light-receiving element made of polysilicon or the like, and the cured film of the present invention on the side where the light-receiving element is formed or on the side opposite to the side where the light-receiving element is formed. Figure 2 is a schematic cross-sectional view showing an example of the configuration of a solid-state imaging device provided with the cured film of the present invention.

[0308] As shown in FIG. 2, the solid-state imaging device 200 includes a rectangular solid-state imaging element 201 and a transparent cover glass 203 that is held above the solid-state imaging element 201 and seals the solid-state imaging element 201. Furthermore, a lens layer 211 is provided on the cover glass 203 via a spacer 104. The lens layer 211 is composed of a support 213 and a lens material 212. When stray light enters the peripheral region of the lens layer 211, the light diffusion weakens the light-collecting effect of the lens material 212, thereby reducing the amount of light that reaches the imaging unit 202. Furthermore, noise due to the stray light also occurs. Therefore, the peripheral region of the lens layer 211 is provided with a cured film 214 of the present invention to shield it from light.

[0309] The solid-state imaging element 201 photoelectrically converts an optical image formed on an imaging section 202, which serves as its light-receiving surface, and outputs the converted image signal. The solid-state imaging element 201 includes a laminated substrate 205 formed by laminating two substrates. The laminated substrate 205 is made up of a rectangular chip substrate 206 and a circuit substrate 207 of the same size, with the circuit substrate 207 laminated on the back surface of the chip substrate 206.

[0310] An imaging unit 202 is provided in the center of the surface of the chip substrate 206. Furthermore, if stray light is incident on the peripheral region of the imaging unit 202, a dark current (noise) is generated from the circuit in this peripheral region, and therefore, this peripheral region is provided with the cured film 215 of the present invention to block light.

[0311] A plurality of electrode pads 208 are provided on the edge of the surface of the chip substrate 206. The electrode pads 208 are electrically connected to the imaging unit 202 via signal lines (not shown) provided on the surface of the chip substrate 206.

[0312] External connection terminals 209 are provided on the rear surface of the circuit board 207 at positions approximately below the electrode pads 208. Each external connection terminal 209 is connected to each electrode pad 208 via a through electrode 210 that vertically penetrates the laminated substrate 205. Each external connection terminal 209 is also connected via wiring (not shown) to a control circuit that controls the driving of the solid-state imaging element 201, an image processing circuit that performs image processing on an imaging signal output from the solid-state imaging element 201, and the like.

[0313] <Infrared sensor> The cured film of the present invention can be used in an infrared sensor. Fig. 3 is a schematic cross-sectional view showing an example of the configuration of an infrared sensor including the cured film of the present invention. The infrared sensor 300 shown in Fig. 3 includes a solid-state imaging element 310.

[0314] The imaging area provided on the solid-state imaging device 310 is configured by combining an infrared cut filter 311 and a color filter 312 . The infrared cut filter 311 transmits light in the visible light range (for example, light with a wavelength of 400 to 700 nm) and blocks light in the infrared range (for example, light with a wavelength of 800 to 1300 nm). The color filter 312 is a color filter formed with pixels that transmit and absorb light of specific wavelengths in the visible light range, and for example, a color filter formed with red (R), green (G), and blue (B) pixels is used.

[0315] Between the infrared transmission filter 313 and the solid-state imaging element 310, a resin film 314 that is capable of transmitting light of the wavelength that has passed through the infrared transmission filter 313 is disposed. The infrared transmission filter 313 is a filter that has visible light blocking properties and transmits infrared light of a specific wavelength, and can use the cured film of the present invention that contains the near-infrared absorbing dye (A) described above and two or more pigments selected from the group consisting of red pigments, yellow pigments, blue pigments, green pigments, and violet pigments as the colorant (F). The infrared transmission filter 113 preferably blocks light with a wavelength of 400 to 830 nm and transmits light with a wavelength of 900 to 1,300 nm, for example.

[0316] A microlens 315 is disposed on the incident light side of the color filter 312 and the infrared transmission filter 313. A planarization film 316 is formed so as to cover the microlens 315.

[0317] In the embodiment shown in FIG. 3, the resin film 314 is disposed, but instead of the resin film 314, an infrared transmission filter 313 may be formed.

[0318] The cured film of the present invention can be used as a light-shielding film for the edge and / or side surfaces of the surface of the infrared cut filter 311, and when used on the inner wall of an infrared sensor, it can prevent internal reflection and / or the incidence of unwanted light into the light-receiving section, thereby improving sensitivity.

[0319] This infrared sensor can simultaneously capture image information, enabling motion sensing that recognizes the movement of an object. Furthermore, this infrared sensor can also acquire distance information, making it possible to capture images that include 3D information. Furthermore, this infrared sensor can also be used as a biometric authentication sensor.

[0320] The cured film of the present invention can also be used as a colored spacer. For example, when a spacer is used in a TFT-type LCD, light incident on the TFT may cause the TFT to malfunction as a switching element, and the colored spacer is used to prevent this. The colored spacer can be formed in the same manner as the black matrix described above, except that a mask for the colored spacer is used.

[0321] The cured film of the present invention can also be used in applications such as micro LEDs (Light Emitting Diodes) and micro OLEDs (Organic Light Emitting Diodes). Although not particularly limited, the cured film can be suitably used for optical filters and optical films used in micro LEDs and micro OLEDs, as well as for members that impart light-blocking and anti-reflection properties. Examples of micro LEDs and micro OLEDs include those described in JP-A-2015-500562 and JP-A-2014-533890.

[0322] The cured film of the present invention can also be used in applications such as quantum dot displays. Although not particularly limited, it can be suitably used for optical filters and optical films used in quantum dot displays, as well as for members that impart light-blocking properties and anti-reflection properties. [Example]

[0323] The present invention will be described in more detail below with reference to examples. However, the present invention is not limited to these examples. Note that "parts" means "parts by mass" and "%" means "% by mass." In the present invention, the nonvolatile content or nonvolatile content concentration refers to the mass remaining after leaving the sample to stand in an oven at 230°C for 30 minutes.

[0324] Before describing the examples, each measurement method will be explained.

[0325] The weight average molecular weight (Mw), number average molecular weight (Mn), acid value (mgKOH / g), and amine value (mgKOH / g) of the resin are measured as follows.

[0326] (average molecular weight of resin) The number-average molecular weight (Mn) and weight-average molecular weight (Mw) of the resin were measured by gel permeation chromatography (GPC) equipped with an RI detector. The instrument used was an HLC-8220GPC (Tosoh Corporation). Two separation columns were connected in series, with both columns packed with TSK-GEL SUPER HZM-N. Measurements were performed at an oven temperature of 40°C, a tetrahydrofuran (THF) solution as the eluent, and a flow rate of 0.35 ml / min. The sample was dissolved in a solvent consisting of 1 wt% of the above eluent, and 20 microliters was injected. The molecular weight is expressed in terms of polystyrene.

[0327] (resin acid value) 80 ml of acetone and 10 ml of water were added to 0.5 to 1 g of resin solution, and the mixture was stirred to dissolve uniformly. The solution was titrated using an automatic titrator ("COM-555" manufactured by Hiranuma Sangyo Co., Ltd.) with a 0.1 mol / L KOH aqueous solution as the titrant to measure the acid value (mg KOH / g). The acid value per unit of nonvolatile content of the resin was calculated from the acid value of the resin solution and the concentration of nonvolatile content of the resin solution.

[0328] (Amine value of resin) The amine value of the resin is the total amine value (mgKOH / g) measured in accordance with the method of ASTM D 2074 and converted into nonvolatile content.

[0329] <Production of near-infrared absorbing dye (A)> (Near-infrared absorbing dye (A-1)) 400 parts of toluene were mixed with 40.0 parts of 1,8-diaminonaphthalene, 32.2 parts of 3,5-dimethylcyclohexanone, and 0.087 parts of p-toluenesulfonic acid monohydrate, and the mixture was heated and stirred under a nitrogen gas atmosphere and refluxed for 3 hours. Water generated during the reaction was removed from the reaction system by azeotropic distillation. After the reaction was completed, the toluene was distilled to obtain a dark brown solid, which was extracted with acetone and purified by recrystallization from a mixed solvent of acetone and ethanol. The resulting brown solid was dissolved in a mixed solvent of 240 parts of toluene and 160 parts of n-butanol, and 13.8 parts of 3,4-dihydroxy-3-cyclobutene-1,2-dione was added. The mixture was heated and stirred under a nitrogen gas atmosphere and refluxed for 8 hours. Water generated during the reaction was removed from the reaction system by azeotropic distillation. After the reaction was completed, the solvent was distilled off, and 200 parts of hexane was added to the resulting reaction mixture while stirring. The resulting black-brown precipitate was filtered off, washed successively with hexane, ethanol, and acetone, and dried under reduced pressure to obtain near-infrared absorbing dye (A-1) represented by the following chemical formula (17). 50 parts of the resulting near-infrared absorbing dye (A-1), 500 parts of sodium chloride, and 60 parts of diethylene glycol were placed in a stainless steel gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded at 60°C for 12 hours. The kneaded mixture was then poured into warm water and stirred for 1 hour while heated to approximately 80°C to form a slurry. The mixture was then filtered and washed with water to remove the sodium chloride and diethylene glycol, and then dried overnight at 80°C and pulverized to obtain a finely divided near-infrared absorbing dye (A-1).

[0330] Chemical formula (17) [ka]

[0331] (Near-infrared absorbing dye (A-2)) 400 parts of toluene were mixed with 40.0 parts of 1,8-diaminonaphthalene, 50.1 parts of 2-hydroxy-9-fluorenone, and 0.087 parts of p-toluenesulfonic acid monohydrate, and the mixture was heated and stirred under a nitrogen gas atmosphere and refluxed for 3 hours. Water generated during the reaction was removed from the system by azeotropic distillation. After the reaction was completed, the toluene was distilled to give a dark brown solid, which was extracted with acetone and purified by recrystallization from a mixed solvent of acetone and ethanol. The resulting brown solid was dissolved in a mixed solvent of 240 parts of toluene and 160 parts of n-butanol, to which 13.8 parts of 3,4-dihydroxy-3-cyclobutene-1,2-dione was added. The mixture was heated and stirred under a nitrogen gas atmosphere and refluxed for 8 hours. Water generated during the reaction was removed from the system by azeotropic distillation. After the reaction was completed, the solvent was distilled, and the resulting reaction mixture was stirred and 200 parts of hexane was added. The resulting black-brown precipitate was filtered off, washed successively with hexane, ethanol, and acetone, and dried under reduced pressure to obtain a near-infrared absorbing dye (A-2) represented by the following chemical formula (18). A finely divided near-infrared absorbing dye (A-2) was obtained in the same manner as in the near-infrared absorbing dye (A-1).

[0332] Chemical formula (18) [ka]

[0333] (Near-infrared absorbing dye (A-3)) In a reaction vessel, 26 parts of phthalonitrile, 143 parts of 2,3-dicyanonaphthalene, 890 parts of n-amyl alcohol, 137 parts of DBU (1,8-Diazabicyclo[5.4.0]undec-7-ene), and 34 parts of aluminum trichloride were mixed and stirred, and the mixture was heated and refluxed at 136°C for 5 hours. The reaction solution was cooled to 30°C while stirring, and poured into a mixed solvent consisting of 5,000 parts of methanol and 10,000 parts of ion-exchanged water while stirring, yielding a blue slurry. This slurry was filtered, washed with a mixed solvent consisting of 2,000 parts of methanol and 4,000 parts of ion-exchanged water, and dried to obtain compound a. Next, in a reaction vessel, 140 parts of compound a was added to 1,500 parts of concentrated sulfuric acid in an ice bath, and the mixture was stirred for 1 hour. Subsequently, this sulfuric acid solution was poured into 1,000 parts of cold water at 3°C, and the resulting precipitate was filtered, washed with water, washed with a 2.5% aqueous sodium hydroxide solution, and washed with water again, and then dried to obtain compound b. Five parts of diphenyl phosphate were added to 200 parts of N-methylpyrrolidone, thoroughly stirred, and then heated to 50°C. 10 parts of compound b were gradually added to this solution, followed by stirring at 90°C for 120 minutes. The end point of the reaction was confirmed, for example, by dropping the reaction solution onto filter paper and determining the time when no bleeding occurred. Subsequently, this reaction solution was poured into 2,000 parts of water, and the resulting precipitate was filtered, washed with water, and dried to obtain a near-infrared absorbing dye (A-3), which is a mixture of compounds represented by the following chemical formula (19) (mixing ratio: n1:n2:n3:n4=7:19:59:15). A finely divided near-infrared absorbing dye (A-3) was obtained in the same manner as in the near-infrared absorbing dye (A-1).

[0334] Chemical formula (19) [ka]

[0335] (Near-infrared absorbing dye (A-4)) According to the description in WO 2019 / 058882, a near-infrared absorbing dye (A-4) represented by the following chemical formula (20) was obtained. A finely divided near-infrared absorbing dye (A-4) was obtained in the same manner as in the near-infrared absorbing dye (A-1).

[0336] Chemical formula (20) [ka]

[0337] (Near-infrared absorbing dye (A-5)) In a reaction vessel, 10.7 parts of aniline, 120 parts of bromobenzene, and 25.7 parts of diazabicyclooctane were added and stirred. Then, 95.2 parts of a 1 mol / L toluene solution of titanium tetrachloride was added dropwise. After the dropwise addition, 10.0 parts of indigo was added and refluxed for 10 hours. After the reaction was completed, methanol was added and the mixture was filtered to obtain a green powder. This was separated with dichloromethane and water, and the organic layer was concentrated to obtain 14.6 parts of compound c. In a reaction vessel, 13.5 parts of compound c, 9.0 parts of bis(2,4-pentanedionato)zinc(II), and 120 parts of tetrahydrofuran were mixed and stirred, and the mixture was heated to 40°C and stirred for 5 hours. The reaction solution was cooled to 30°C while still stirring, and then poured into 500 parts of methanol with stirring to obtain a blue slurry. This slurry was filtered, washed with 500 parts of methanol, then washed with 500 parts of water, and dried to obtain near-infrared absorbing dye (A-5), which is a mixture of compounds represented by the following chemical formula (21) (mixing ratio: dimer: trimer: tetramer = 81:17:2). A finely divided near-infrared absorbing dye (A-5) was obtained in the same manner as in the near-infrared absorbing dye (A-1).

[0338] Chemical formula (21) [ka]

[0339] <Production of alkali-soluble resin (B)> (Alkali-soluble resin (B-1) solution) 100 parts of propylene glycol monomethyl ether acetate (hereinafter referred to as PGMAc) was placed in a flask equipped with a stirrer, a dropping funnel, a condenser, a thermometer, and a gas inlet tube, and the mixture was stirred while replacing the atmosphere with nitrogen and heated to 78°C. Next, a mixture of 25.2 parts of Karenz MOI-DEM (2-[[[[(2-methyl-1-oxo-2-propenyl)oxy]ethyl]amino]carbonyl]-1,3-diethyl ester malonate, a blocked isocyanate group-containing monomer manufactured by Showa Denko K.K.), 20.7 parts of methacrylic acid, a hydroxyl group-containing monomer, 31.2 parts of 2-hydroxyethyl methacrylate, a hydroxyl group-containing monomer, 37.5 parts of dicyclopentanyl methacrylate, a fused ring structure-containing monomer, and 27.0 parts of methyl methacrylate, a monomer unit, and 12.0 parts of 2,2'-azobis(2,4-dimethylvaleronitrile) (polymerization initiator) dissolved in 50 parts of PGMAc was added dropwise from the dropping funnel to the flask. After the addition was completed, the mixture was stirred at 78 ° C for 3 hours. Thereafter, PGMAc was added so that the nonvolatile content became 40% by mass, thereby preparing an alkali-soluble resin (B-1) solution. The alkali-soluble resin (B-1) had an acid value of 74 mg KOH / g and a weight-average molecular weight of 8,000.

[0340] (Alkali-soluble resin (B-2) and (B-3) solutions) Alkali-soluble resins (B-2) and (B-3) were synthesized by varying the blending types and amounts to achieve the composition / mol % ratios shown in Table 2, and PGMAc was added to adjust the nonvolatile content to 40 mass %.

[0341] [Table 2]

[0342] <Production of Colorant (F)> (Finely divided green pigment (F-1)) 100 parts of CI Pigment Green 58, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded for 6 hours at 70° C. This kneaded mixture was poured into 3,000 parts of warm water, and stirred for 1 hour with a high-speed mixer while heated to 70° C. to form a slurry. The slurry was filtered and washed with water repeatedly to remove the sodium chloride and diethylene glycol, then dried overnight at 80° C. and pulverized to obtain a finely divided green pigment (F-1).

[0343] (Finely divided red pigment (F-2)) 100 parts of CI Pigment Red 254, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded for 6 hours at 60°C. Next, the kneaded mixture was poured into warm water, and while heated to approximately 80°C, it was stirred for 1 hour using a high-speed mixer to form a slurry, which was then filtered and washed with water to remove the sodium chloride and diethylene glycol. After that, it was dried overnight at 80°C and pulverized to obtain a finely divided red pigment (F-2).

[0344] (Finely divided blue pigment (F-3)) 100 parts of CI Pigment Blue 15:6, 1,000 parts of sodium chloride, and 100 parts of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded for 12 hours at 50° C. This mixture was poured into 3,000 parts of warm water, and stirred for about 1 hour with a high-speed mixer while heated to about 70° C. to form a slurry. After repeated filtration and washing with water to remove the sodium chloride and diethylene glycol, the slurry was dried overnight at 80° C. and pulverized to obtain a finely divided blue pigment (F-3).

[0345] (Finely divided yellow pigment (F-4)) 100 parts of CI Pigment Yellow 138, 800 parts of sodium chloride, and 100 parts of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded for 12 hours at 70° C. This mixture was poured into 3,000 parts of warm water, and stirred for about 1 hour with a high-speed mixer while heated to about 70° C. to form a slurry. The slurry was filtered and washed with water repeatedly to remove the sodium chloride and diethylene glycol, then dried overnight at 80° C. and pulverized to obtain a finely divided yellow pigment (F-4).

[0346] (Finely divided purple pigment (F-5)) 100 parts of CI Pigment Violet 23, 800 parts of sodium chloride, and 100 parts of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded for 12 hours at 70° C. This mixture was poured into 3,000 parts of warm water, and stirred for about 1 hour with a high-speed mixer while heated to about 70° C. to form a slurry. The slurry was filtered and washed with water repeatedly to remove the sodium chloride and diethylene glycol, then dried overnight at 80° C. and pulverized to obtain a finely divided purple pigment (F-5).

[0347] <Production of Dispersion Resin (G)> (Dispersion resin (G-1) solution) A reactor equipped with a gas inlet tube, condenser, stirring blade, and thermometer was charged with 40 parts of methyl methacrylate, 10 parts of n-butyl methacrylate, and 13.2 parts of tetramethylethylenediamine as a catalyst. The mixture was stirred at 50 °C for 1 hour under a nitrogen stream, and the system was then purged with nitrogen. Next, 9.3 parts of ethyl bromoisobutyrate as an initiator, 5.6 parts of cuprous chloride as a catalyst, and 100 parts of PGMAc were charged. The temperature was raised to 110 °C under a nitrogen stream to initiate polymerization of the first block (B block). After 4 hours of polymerization, a sample was taken of the polymerization solution and the nonvolatile content was measured. Based on the nonvolatile content, it was confirmed that the polymerization conversion was 98% or higher. Next, 50 parts of PGMAc, 40 parts of dimethylaminoethyl methacrylate as a second block (A block) monomer, and 10 parts of methacryloyloxyethyl benzyl dimethyl ammonium chloride were added to the reactor. The reaction was continued at 110 °C under a nitrogen atmosphere with stirring. Two hours after addition, the polymerization solution was sampled and the nonvolatile content was measured. After confirming that the polymerization conversion rate of the second block (A block) was 98% or higher based on the nonvolatile content, the reaction solution was cooled to room temperature to terminate the polymerization, and a dispersion resin (G-1) with an amine value per nonvolatile content of 169.8 mg KOH / g was obtained. After cooling to room temperature, approximately 2 g was sampled and heated and dried at 180 ° C for 20 minutes to measure the nonvolatile content. PGMAc was added so that the nonvolatile content became 30% by mass, and a dispersion resin (G-1) solution of AB block polymer was prepared.

[0348] (Dispersed resin (G-2) solution) A reactor equipped with a gas inlet tube, condenser, stirring blade, and thermometer was charged with 30 parts of methyl methacrylate, 30 parts of n-butyl methacrylate, 20 parts of hydroxyethyl methacrylate, and 13.2 parts of tetramethylethylenediamine. The mixture was stirred at 50°C for 1 hour while flowing nitrogen, and the system was purged with nitrogen. Next, 9.3 parts of ethyl bromoisobutyrate, 5.6 parts of cuprous chloride, and 133 parts of PGMAc were charged, and the temperature was raised to 110°C under a nitrogen stream to initiate polymerization of the first block (B block). After 4 hours of polymerization, a sample of the polymerization solution was taken and the nonvolatile content was measured. Based on the nonvolatile content, it was confirmed that the polymerization conversion was 98% or higher. Next, 61 parts of PGMAc and 20 parts of 1,2,2,6,6-pentamethylpiperidyl methacrylate (Hitachi Chemical Co., Ltd., Fancryl FA-711MM) as the second block (A block) monomer were added to the reactor, and the reaction was continued with stirring at 110 °C under a nitrogen atmosphere. Two hours after the addition of 1,2,2,6,6-pentamethylpiperidyl methacrylate, a sample of the polymerization solution was taken and the nonvolatile content was measured. After confirming that the polymerization conversion rate of the second block (A block) was 98% or higher based on the nonvolatile content, the reaction solution was cooled to room temperature to terminate the polymerization, yielding a dispersion resin (G-2) with an amine value of 57 mg KOH / g per nonvolatile content. The solution was diluted with PGMAc to a nonvolatile content of 30% by mass, yielding a dispersion resin (G-2) of the AB block polymer.

[0349] (Dispersion resin (G-3) solution) A reaction vessel equipped with a gas inlet tube, thermostat, condenser, and stirrer was charged with 10 parts methacrylic acid, 100 parts methyl methacrylate, 70 parts i-butyl methacrylate, 20 parts benzyl methacrylate, and 50 parts PGMAc, and the atmosphere was purged with nitrogen gas. The reaction vessel was heated to 50°C with stirring, and 12 parts 3-mercapto-1,2-propanediol was added. The temperature was raised to 90°C, and a solution of 0.1 parts 2,2'-azobisisobutyronitrile and 90 parts PGMAc was added while the reaction was continued for 7 hours. Measurement of the nonvolatile content confirmed that 95% reaction had occurred. 19 parts pyromellitic anhydride, 50 parts PGMAc, 50 parts cyclohexanone, and 0.4 parts 1,8-diazabicyclo-[5.4.0]-7-undecene as a catalyst were added, and the reaction was continued for 7 hours at 100°C. After confirming that 98% or more of the acid anhydride had been half-esterified by measuring the acid value, the reaction solution was cooled to room temperature to terminate the polymerization, and a dispersion resin (G-3) with an acid value per nonvolatile content of 70 mg KOH / g was obtained. PGMAc was added to dilute the solution so that the nonvolatile content was 30% by mass, and a dispersion resin (G-3) solution was obtained.

[0350] <Preparation of Dispersion> (Dispersion 1) The following raw materials were mixed and stirred until uniform, then dispersed in an Eiger mill (Eiger Japan, "Mini Model M-250 MKII") using zirconia beads with a diameter of 0.5 mm for 3 hours, and then filtered through a filter with a pore size of 1.0 μm to produce Dispersion 1. The organic solvent (Q-1) was PGMAc. Near-infrared absorbing dye (A-1): 15.0 parts Dispersion resin (G-1) solution: 20.0 parts Organic solvent (Q-1): 65.0 parts

[0351] (Dispersion 2~10) Dispersions 2 to 10 were prepared in the same manner as Dispersion 1, except that the raw materials and amounts shown in Table 3 were changed.

[0352] [Table 3]

[0353] <Production of Photosensitive Composition> [Example 1] (Photosensitive composition 1) The following raw materials were mixed and stirred, and then filtered through a filter with a pore size of 1.0 μm to obtain Photosensitive Composition 1. Dispersion 1: 15.0 parts Dispersion 3: 20.0 parts Alkali-soluble resin (B-1) solution: 8.0 parts Polymerizable compound (C1-1): 6.0 parts Photopolymerization initiator (D-1): 0.2 parts Photopolymerization initiator (D-2): 0.1 parts Thiol chain transfer agent (E-1): 0.05 parts Thermosetting compound (J-1): 0.7 part Leveling agent (N): 1.0 part Organic solvent (Q): 48.95 parts

[0354] [Examples 2 to 27, Comparative Examples 1 and 2] (Photosensitive compositions 2-29) Photosensitive compositions 2 to 29 were prepared in the same manner as in Example 1, except that the raw materials and amounts of photosensitive composition 1 in Example 1 were changed to those shown in Tables 4-1 to 4-3.

[0355] [Table 4-1]

[0356] [Table 4-2]

[0357] [Table 4-3]

[0358] The raw materials listed in Tables 4-1 to 4-3 are as follows:

[0359] [Polymerizable compound (C)] (Polymerizable compound (C1)) C1-1: Tricyclodecane dimethanol diacrylate (molecular weight 304, aliphatic fused ring structure) C1-2: 1,3-adamantanediol diacrylate (molecular weight 276, aliphatic fused ring structure) C1-3: 9,9-bis[4-(2-acryloyloxyethoxy)phenyl]fluorene (molecular weight 546, aromatic fused ring structure) C1-4: Bisphenol A diacrylate with three EO modifications (molecular weight 380, aromatic ring structure) C1-5: bisphenol A diacrylate with four EO modifications (molecular weight 512, aromatic ring structure)

[0360] (Polymerizable compound (C2)) C2-1: Neopentyl glycol diacrylate C2-2: A mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate C2-3: Mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate

[0361] [Photopolymerization initiator (D)] D-1: Compound of the above chemical formula (12) D-2: Omnirad907 (IGM Resins, acetophenone-based compound)

[0362] [Thiol-based chain transfer agent (E)] E-1: Pentaerythritol tetrakis(3-mercaptopropionate)

[0363] [Thermosetting compound (J)] J-1: EHPE-3150 (manufactured by Daicel Corporation, a compound having an aliphatic ring with approximately 15 epoxy groups)

[0364] [Leveling Agent (N)] N-1: BYK-330 (BYK-Chemie) N-2: Megafac F-554 (DIC) One part each of (N-1) and (N-2) was mixed and dissolved in 98 parts of PGMAc to prepare a mixed solution, which was used as a leveling agent (N).

[0365] [Organic solvent (Q)] Q-1: Propylene glycol monomethyl ether acetate 30 parts Q-2: 30 parts cyclohexanone Q-3: 10 parts of ethyl 3-ethoxypropionate Q-4: Propylene glycol monomethyl ether 10 parts Q-5: Cyclohexanol acetate 10 parts Q-6: Dipropylene glycol methyl ether acetate 10 parts The above (Q-1) to (Q-6) were mixed in the above-mentioned parts by mass to obtain organic solvent (Q).

[0366] <Evaluation of Photosensitive Composition> The obtained photosensitive compositions 1 to 29 (Examples 1 to 27 and Comparative Examples 1 and 2) were evaluated as follows. The evaluation results are shown in Table 5.

[0367] [Adhesion evaluation] The obtained photosensitive composition was applied by spin coating to a glass substrate (Corning Eagle 2000) measuring 100 mm in length, 100 mm in width, and 0.7 mm in thickness so that the dried film thickness would be 2.0 μm, and then dried on a hot plate at 70°C for 1 minute. Next, after cooling the substrate to room temperature, a high-pressure mercury lamp was used to apply a stripe pattern of 5 to 25 μm widths at 5 μm intervals to the substrate at an illumination intensity of 30 mW / cm. 2 , 50 mJ / cm 2 The substrate was then spray-developed using an aqueous developer containing 0.12% of a nonionic surfactant and 0.04% of potassium hydroxide at 23°C, then washed with ion-exchanged water, and air-dried. The coating of each photosensitive composition was developed for the shortest time possible to form a pattern without leaving any residual development residue. The resulting patterns on the substrates, each having a width of 5, 10, 15, 20, and 25 μm, were observed under an optical microscope to confirm the minimum line width of the remaining pattern. The evaluation criteria are as follows, with a score of 3 or higher being considered practical. 5: Fine lines of 10 μm or less remain. 4: Fine lines of 15 μm or more remain. 3: Fine lines of 20 μm or more remain. 2: 25 μm fine lines remain. 1: No fine lines remain.

[0368] [Line width evaluation] The photosensitive composition thus obtained was applied by spin coating to a glass substrate (Corning Eagle 2000) measuring 100 mm in length, 100 mm in width, and 0.7 mm in thickness so that the dried film thickness would be 2.0 μm, and then dried on a hot plate at 70° C. for 1 minute. After cooling the substrate to room temperature, the substrate was irradiated with a high-pressure mercury lamp at an illuminance of 30 mW / cm. 2 , exposure dose 50mJ / cm 2 and 100 mJ / cm 2The substrate was exposed to light through a photomask with a 100 μm wide stripe pattern at two levels. The substrate was then spray-developed using an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide at 23°C, then washed with ion-exchanged water, and air-dried. The resulting substrate was post-baked in a clean oven at 150°C for 60 minutes to obtain a substrate for evaluation. The obtained evaluation substrate was subjected to an exposure of 50 mJ / cm using a Nikon ECLIPSE LV100POL Model optical microscope. 2 Line width (CD 50 ) and 100mJ / cm 2 Line width (CD 100 The difference in line width (ΔCD) due to the difference in exposure dose was calculated using the following formula (1). The evaluation criteria are as follows, with a score of 3 or higher being considered practical. Equation (1): ΔCD = CD 100 -CD 50 5: ΔCD is less than 2 μm 4: ΔCD is 2 μm or more and less than 3 μm 3: ΔCD is 3 μm or more and less than 5 μm 2: ΔCD is 5 μm or more and less than 6 μm 1: ΔCD is 6 μm or more

[0369] [Cross-sectional shape evaluation] The photosensitive composition thus obtained was applied by spin coating to a glass substrate (Corning Eagle 2000) measuring 100 mm in length, 100 mm in width, and 0.7 mm in thickness so that the dried film thickness would be 2.0 μm, and then dried on a hot plate at 70° C. for 1 minute. After cooling the substrate to room temperature, the substrate was irradiated with a high-pressure mercury lamp at an illuminance of 30 mW / cm through a photomask with a 100 μm-wide stripe pattern. 2 , 50 mJ / cm 2 The substrate was then spray-developed using an aqueous developer containing 0.12% by mass of a nonionic surfactant and 0.04% by mass of potassium hydroxide at 23°C, washed with ion-exchanged water, and air-dried. The resulting substrate was post-baked in a clean oven at 150°C for 60 minutes to obtain a substrate for evaluation. The spray development was carried out for the shortest time possible to form a pattern without leaving any residual development for each of the photosensitive compositions. The cross-sectional shape of the pattern was confirmed using a scanning electron microscope (Hitachi High-Tech "S-3000H"). Evaluation was performed by capturing an SEM image of the cross section of a 100 μm wide stripe pattern and measuring the taper angle between the substrate and the edge of the pattern cross section. The evaluation criteria are as follows, with a score of 3 or higher being considered practical. 5: Taper angle is between 30 degrees and 50 degrees 4: Taper angle between 50 degrees and 60 degrees 3: Taper angle between 30 degrees and 40 degrees, or between 60 degrees and 70 degrees 2: Taper angle is between 20 degrees and 30 degrees, or between 70 degrees and 90 degrees 1: Taper angle less than 20 degrees or more than 90 degrees

[0370] [Solvent resistance evaluation] The photosensitive composition thus obtained was applied by spin coating to a glass substrate (Corning Eagle 2000) measuring 100 mm in length, 100 mm in width, and 0.7 mm in thickness so that the dried film thickness would be 2.0 μm, and then dried on a hot plate at 70° C. for 1 minute. After cooling the substrate to room temperature, the substrate was irradiated with a high-pressure mercury lamp at an illuminance of 30 mW / cm. 2 , 50 mJ / cm 2 The substrate was exposed to ultraviolet light through a photomask with a 100 μm wide stripe pattern. After cooling to room temperature, the substrate was spray-developed using an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide at 23°C, then washed with ion-exchanged water and air-dried. The substrate was then post-baked in a clean oven at 150°C for 60 minutes to obtain a substrate for evaluation. The obtained evaluation substrate was immersed in propylene glycol monomethyl ether acetate at room temperature for 15 minutes, then washed with ion-exchanged water and air-dried, and the 100 μm wide stripe pattern was observed using an optical microscope. The evaluation criteria are as follows, with a score of 3 or higher being considered practical. 5: No change in appearance or color. 4: Slight wrinkles, etc., occur, but there is no change in color. 3: Some wrinkles or other imperfections occur, but there is no change in color. 2: Wrinkles and other imperfections appear all over the surface, and the color fades slightly. 1: Peeling and fading occur.

[0371] [High temperature and humidity resistance evaluation] The obtained photosensitive composition was applied to a glass substrate (Corning Eagle 2000) measuring 100 mm in length, 100 mm in width, and 0.7 mm in thickness using a spin coater so that the dry film thickness was 2.0 μm, and then dried on a hot plate at 70° C. for 1 minute. Then, an ultra-high pressure mercury lamp was used to apply the coating with an illuminance of 30 mW / cm. 2 , 50 mJ / cm 2 The substrate was exposed to ultraviolet light through a photomask with a 100 μm wide stripe pattern. After cooling to room temperature, the substrate was spray-developed using an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide at 23°C, washed with ion-exchanged water, and air-dried. The resulting substrate was post-baked in a clean oven at 150°C for 60 minutes to obtain a substrate for evaluation. The obtained substrate was stored for 200 hours under conditions of a temperature of 85°C and a humidity of 85%. After storage, the number of foreign particles on the pattern was counted using an optical microscope. The evaluation criteria are as follows, with 3 or more being practical. 5: Fewer than 5 foreign objects 4: 5 or more but less than 10 foreign objects 3: 10 or more but less than 15 foreign objects 2: The number of foreign objects is 15 or more but less than 20 1: 20 or more foreign objects

[0372] [Table 5] [Explanation of symbols]

[0373] 10 Image display device 11 Transparent substrate 12 TFT array 13 Transparent electrode layer 14 Alignment layer 15 Polarizing plate 21 Transparent substrate 22 Color Filter 23 Transparent electrode layer 24 Alignment layer 25 Polarizing Plate 30 Backlight unit 31 White LED light source LC liquid crystal 200 Solid-state imaging device 201 Solid-state imaging device 202 Imaging unit 203 Cover Glass 204 Spacer 205 Laminated Board 206 Chip Substrate 207 Circuit Board 208 Electrode Pads 209 External connection terminal 210 Through electrode 211 Lens Layer 212 Lens material 213 Support 214 Cured film 215 Cured film 300 Infrared Sensor 310 Solid-state imaging device 311 Infrared cut filter 312 Color Filter 313 Infrared transmission filter 314 Resin Film 315 Microlens 316 Flat membrane

Claims

1. A photosensitive composition comprising a near-infrared absorbing dye (A), an alkali-soluble resin (B), a polymerizable compound (C), and a photopolymerization initiator (D), the alkali-soluble resin (B) comprises an alkali-soluble resin having a blocked isocyanate group-containing monomer unit (b1), an acidic group-containing monomer unit (b2), and a hydroxyl group-containing monomer unit (b3); the molar ratio of the blocked isocyanate group-containing monomer unit (b1) to the hydroxyl group-containing monomer unit (b3) is 10:90 to 50:50; The photosensitive composition, wherein the polymerizable compound (C) comprises a polymerizable compound (C1) having two (meth)acryloyl groups and a ring structure.

2. 2. The photosensitive composition according to claim 1, wherein the polymerizable compound (C1) having two (meth)acryloyl groups and a ring structure has a molecular weight of 500 or less.

3. 3. The photosensitive composition according to claim 1, wherein the ring structure is a fused ring structure.

4. 4. The photosensitive composition according to claim 1, wherein the content of the polymerizable compound (C1) having two (meth)acryloyl groups and a ring structure is 50% by mass or more in 100% by mass of the polymerizable compound (C).

5. The photosensitive composition according to any one of claims 1 to 4, further comprising a thiol-based chain transfer agent (E).

6. The photosensitive composition according to any one of claims 1 to 5, further comprising a colorant (F).

7. A cured film which is a cured product of the photosensitive composition according to any one of claims 1 to 6.

8. An optical filter comprising the cured film according to claim 7 .

9. An image display device comprising the cured film according to claim 7.

10. A solid-state imaging device comprising the cured film according to claim 7 .

11. An infrared sensor comprising the cured film according to claim 7.

Images