Semiconductor module and manufacturing method thereof

Abstract

To suppress variations of intervals between a first connection terminal and a second connection terminal.SOLUTION: A first connection terminal 15 and a second connection terminal 16 are formed into plate shapes and are stacked at a predetermined interval, extend in one direction in a surface direction and project from a resin mold part 19, a second connection terminal 16 projects from a predetermined surface 191c in the resin mold part, the first connection terminal 15 has an internal terminal 15a which is exposed so that an opening 193 is formed on a surface 191b different from the predetermined surface in the resin mold part 19, and an external terminal 15b which is connected to the internal terminal 15a in the opening 193 and projects from the resin mold part 19, and the internal terminal 15a has a tie bar remainder 15c which extends in a stacking direction of the internal terminal 15a and the second connection terminal 16, and a direction crossing the extension direction of the first connection terminal 15 and projects from the resin mold part 19, and is connected to the internal terminal 15a.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a semiconductor module and a method for manufacturing the same. [Background technology]

[0002] Conventionally, a semiconductor module has been proposed that includes a semiconductor element, first and second connection terminals connected to the semiconductor element, and a resin molded portion that seals the semiconductor element and the first and second connection terminals so that portions of the first and second connection terminals are exposed (see, for example, Patent Document 1).The first and second connection terminals in this semiconductor module are plate-shaped and are arranged in a stacked manner so as to reduce wiring inductance.

[0003] Such a semiconductor module is manufactured as follows. First, a component is prepared in which a semiconductor element and first and second connection terminals are connected. Then, a mold is prepared in which a cavity is formed inside by fitting a first mold and a second mold together. After the component is placed in the mold cavity, molten resin is poured into the cavity and solidified, thereby forming a resin molded portion that integrally seals the semiconductor element and the first and second connection terminals. This completes the semiconductor module. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2019-186403 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the semiconductor module, the first and second connection terminals are stacked, making it difficult to sandwich both the first and second connection terminals between the first and second types, which makes the spacing between the first and second connection terminals prone to variation.

[0006] In view of the above, an object of the present invention is to provide a semiconductor module that can suppress variations in the distance between the first connection terminal and the second connection terminal, and a method for manufacturing the same. [Means for solving the problem]

[0007] Claim 1 for achieving the above object is a semiconductor module comprising: a semiconductor chip (10); a resin molded portion (19) for resin-sealing the semiconductor chip; a first connection terminal (15) and a second connection terminal (16) electrically connected to the semiconductor chip and having portions protruding from the resin molded portion; and a control terminal (14) electrically connected to the semiconductor chip, wherein the first connection terminal and the second connection terminal are plate-shaped and stacked at a predetermined interval, and extend in one direction in the surface direction and protrude from the resin molded portion; The second connection terminal protrudes from a predetermined surface (191c) of the resin molded portion, and the first connection terminal has an internal terminal (15a) exposed by an opening (193) formed in a surface (191b) of the resin molded portion different from the predetermined surface, and an external terminal (15b) connected to the internal terminal at the opening and protruding from the resin molded portion, and the internal terminal has a tie bar remainder (15c) extending in a direction intersecting the stacking direction of the internal terminal and the second connection terminal and the extending direction of the first connection terminal, protruding from the resin molded portion and connected to the internal terminal. The opening is formed so as to expose a portion of the internal terminal that is closer to the predetermined surface in the extension direction of the first connection terminal, and the resin molded portion seals the portion of the internal terminal that is closest to the predetermined surface with resin. .

[0008] This has a tie bar remainder connected to the internal terminal and protruding from the resin molded portion. Therefore, when forming the resin molded portion, the second connection terminal can be sandwiched between the first and second molds while the tie bar that becomes the tie bar remainder can be sandwiched between the first and second molds. This makes it possible to prevent changes in the distance between the internal terminal and the second connection terminal in the first connection terminal.

[0009] Claim 7 is a method for manufacturing a semiconductor module according to claim 1, comprising the steps of: preparing a terminal component (200) in which an internal terminal and a control terminal are integrated via a tie bar (210); electrically connecting the second connection terminal to a semiconductor chip so that the internal terminal and the second connection terminal are stacked, and electrically connecting the internal terminal and the control terminal in the terminal component to the semiconductor chip to form a component (300); preparing a mold (400) in which a cavity (400a) is formed inside by fitting a first mold (410) and a second mold (420) together; arranging the component in the cavity; forming a resin molded portion by pouring molten resin into the mold and solidifying it; cutting the tie bar to form a tie bar remnant that is connected to the internal terminal and protrudes from the resin molded portion; and arranging the component in the cavity so that the second connection terminal is sandwiched between the first mold and the second mold, and the tie bar is sandwiched between the first mold and the second mold.

[0010] According to this, when forming the resin molded portion, the second connection terminal can be sandwiched between the first and second dies while the tie bar can be sandwiched between the first and second dies. Therefore, it is possible to manufacture a semiconductor module in which changes in the distance between the internal terminal of the first connection terminal and the second connection terminal are suppressed.

[0011] The reference symbols in parentheses attached to each component indicate an example of the correspondence between the component and the specific components described in the embodiments described below. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a circuit diagram of a three-phase inverter circuit configured using semiconductor modules according to a first embodiment. [Figure 2] FIG. 2 is a diagram showing the internal structure of a semiconductor module. [Figure 3] FIG. 2 is a plan view of the semiconductor module as viewed from one surface side of the resin mold portion. [Figure 4] 10 is a plan view of the semiconductor module before the external terminals are joined, viewed from the other surface side of the resin molded portion. FIG. [Figure 5] 10 is a plan view of the semiconductor module after the external terminals are joined, viewed from the other surface side of the resin mold portion. FIG. [Figure 6] FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. [Figure 7] FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. 5. [Figure 8] FIG. 2 is a side view of the semiconductor module. [Figure 9] FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. [Figure 10] 1A to 1C are plan views showing a manufacturing process of a semiconductor module. [Figure 11] FIG. 2 is a cross-sectional view of the components when they are placed in a mold. [Figure 12] FIG. 2 is a cross-sectional view of the components when they are placed in a mold. [Figure 13] 10A and 10B are plan views showing manufacturing steps after the resin molded portion is formed. [Figure 14] FIG. 10 is a cross-sectional view of a semiconductor module according to a second embodiment. [Figure 15] 10A and 10B are diagrams illustrating resin flow when forming a resin molded portion. [Figure 16] FIG. 10 is a diagram showing the relationship between the spacing ratio and entrapped voids. [Figure 17] FIG. 10 is a plan view of a semiconductor module according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the following embodiments, parts that are identical or equivalent to each other will be denoted by the same reference numerals.

[0014] (First embodiment) A first embodiment will be described with reference to the drawings. In this embodiment, a semiconductor module that constitutes a three-phase inverter circuit that drives a three-phase AC motor will be described.

[0015] First, a three-phase inverter circuit will be described with reference to Fig. 1. The three-phase inverter circuit 1 drives a load 3, which is a three-phase AC motor, using a DC power supply 2. A smoothing capacitor 4 is connected in parallel to the three-phase inverter circuit 1 of this embodiment, which reduces ripples during switching and suppresses the effects of noise, enabling the generation of a constant power supply voltage.

[0016] The three-phase inverter circuit 1 is configured such that upper and lower arms 51 to 56 connected in series are connected in parallel for three phases. The three-phase inverter circuit 1 applies intermediate potentials between the upper arms 51, 53, and 55 and the lower arms 52, 54, and 56 to the U-phase, V-phase, and W-phase of a three-phase AC motor serving as the load 3, in that order.

[0017] Specifically, the upper and lower arms 51 to 56 include semiconductor switching elements 51a to 56a such as IGBTs or MOSFETs, and rectifying elements 51b to 56b for the purpose of reflux, such as FWDs. The three-phase inverter circuit 1 supplies three-phase AC currents with different periods to the load 3 by controlling the on / off of the semiconductor switching elements 51a to 56a of the upper and lower arms 51 to 56 of each phase. IGBT stands for Insulated Gate Bipolar Transistor. MOSFET stands for Metal Oxide Semiconductor Field Effect Transistor. FWD stands for Free Wheeling Diode.

[0018] In this embodiment, semiconductor chips on which semiconductor switching elements 51a to 56a and rectifying elements 51b to 56b that constitute the three-phase inverter circuit 1 are formed are modularized and integrated. In other words, the three-phase inverter circuit 1 is configured using a semiconductor module with a 6-in-1 structure in which six arms are integrated.

[0019] 2 to 8, the detailed structure of the semiconductor module 6 of this embodiment will be described below. The semiconductor module 6 of this embodiment includes a semiconductor chip 10, first and second lead frames 11 and 12, an output terminal 13, a control terminal 14, first and second connection terminals 15 and 16, and first and second heat sinks 17 and 18. The semiconductor module 6 also includes a resin molded portion 19 that integrally seals these components.

[0020] The resin molded portion 19 has a generally rectangular parallelepiped shape with a substantially rectangular planar shape, and includes one surface 19a and another surface 19b, and first to fourth side surfaces 19c to 19f connecting the first surface 19a and the other surface 19b. For example, the resin molded portion 19 shown in FIG. 2 has two opposing surfaces extending in the left-right direction of the drawing as the first side surface 19c and the third side surface 19e, and two opposing surfaces extending in the up-down direction of the drawing as the second side surface 19d and the fourth side surface 19f. In this embodiment, the third side surface 19e has a protrusion 191 protruding in a direction normal to the third side surface 19e. The protrusion 191 is located in a portion where the first and second connection terminals 15 and 16 are disposed, as will be described in detail later. In this embodiment, if the portion that seals the first and second lead frames 11, 12 etc. is defined as the main portion 192, the protruding portion 191 is thinner than the main portion 192.

[0021] Six semiconductor chips 10 are provided corresponding to the upper and lower arms 51 to 56. In the following description, the semiconductor chips 10 constituting the upper and lower arms 51 to 56 will be referred to as semiconductor chips 101 to 106, respectively.

[0022] 2, the six semiconductor chips 10 are arranged in three rows. Specifically, the semiconductor chips 101, 103, and 105 constituting the upper arms 51, 53, and 55 are arranged in the order of 101, 103, and 105 along one direction parallel to one surface 19a of the resin molded portion 19. The semiconductor chips 102, 104, and 106 are arranged in the order of 102, 104, and 106 along the arrangement of the semiconductor chips 101, 103, and 105.

[0023] The first and second lead frames 11 and 12 are made of a conductive material such as copper or iron and form a substantially rectangular mounting portion. In plan view, the first lead frame 11 is disposed so as to be located on the first side surface 19c side, and the second lead frame 12 is disposed so as to be located on the third side surface 19e side.

[0024] The semiconductor chips 101, 103, and 105 of the upper arms 51, 53, and 55 are mounted on the front surface side of the first lead frame 11, and the semiconductor chips 102, 104, and 106 of the lower arms 52, 54, and 56 are mounted on the back surface side of the second lead frame 12. Note that the front surface side of the first lead frame 11 refers to the surface on the side of one surface 19a of the resin molded portion 19. The back surface side of the second lead frame 12 refers to the surface on the side of the other surface 19b of the resin molded portion 19.

[0025] Furthermore, the semiconductor chips 101, 103, and 105 are connected to the output terminal 13 via the first lead frame 11. The semiconductor chips 102, 104, and 106 are connected to the output terminal 13 via the second lead frame 12, a wiring layer (not shown), and the first lead frame 11.

[0026] The semiconductor module 6 has three output terminals 13. The three output terminals 13 are connected to the U phase, V phase, and W phase of the load 3, respectively. In this embodiment, the output terminals 13 are made of a plate-shaped conductive member and protrude from the first side surface 19c of the resin molded portion 19.

[0027] Each of the semiconductor chips 101 to 106 is connected to a control terminal 14. The control terminal 14 is a terminal connected to a gate electrode or the like formed on each of the semiconductor chips 101 to 106. The control terminal 14 is made of a rod-shaped conductive member, one end of which is connected to the semiconductor chips 101 to 106, and the other end of which protrudes from the first side surface 19c or the third side surface 19e of the resin molded portion 19. The portion of the control terminal 14 exposed from the resin molded portion 19 is bent so as to protrude toward the one surface 19a of the resin molded portion 19.

[0028] Specifically, a control terminal 14 is provided for each of the semiconductor chips 101 to 106. The control terminals 14 connected to the semiconductor chips 101, 103, and 105 of the upper arms 51, 53, and 55 protrude from the first side surface 19c of the resin molded portion 19, which is the same as the output terminals 13. The control terminals 14 connected to the semiconductor chips 102, 104, and 106 of the lower arms 52, 54, and 56 protrude from the third side surface 19e of the resin molded portion 19, which is the side opposite to the output terminals 13.

[0029] The first and second connection terminals 15 and 16 connect the semiconductor chip 10 to the smoothing capacitor 4. The first and second connection terminals 15 and 16 are plate-shaped and, as shown in FIGS. 6 to 8, are stacked on top of each other and protrude from the third side surface 19e of the resin molded portion 19. That is, the first and second connection terminals 15 and 16 protrude from the same third side surface 19e as the control terminals 14 connected to the semiconductor chips 102, 104, and 106 of the lower arms 52, 54, and 56. Here, in the protruding portion 191, the surface on the side of the one surface 19a of the resin molded portion 19 is referred to as the first surface 191a, the surface on the side of the other surface 19b is referred to as the other surface 191b, the surface opposite the main portion 192 is referred to as the tip surface 191c, and the surfaces connected to the tip surface 191c are referred to as the first and second side surfaces 191d and 191e. The tip surface 191c can also be said to be the surface located on the tip side in the protruding direction of the convex portion 191. In this embodiment, the first and second connection terminals 15, 16 are stacked in the portion arranged on the convex portion 191 such that the first connection terminal 15 is located on the one surface 191a side and the second connection terminal 16 is located on the other surface 191b side.

[0030] The first and second connection terminals 15, 16 are stacked at a predetermined distance, and are electrically insulated by a resin molded portion 19 disposed between them. The first and second connection terminals 15, 16 are also disposed at a predetermined distance from the control terminal 14 connected to the semiconductor chips 102, 104, 106 of the lower arms 52, 54, 56. For example, the distance between the control terminal 14 and the first and second connection terminals 15, 16 is designed to be longer than the distance at which insulation between the control terminal 14 and the first and second connection terminals 15, 16 is ensured when a predetermined impulse voltage is applied.

[0031] The first connection terminal 15 is a terminal that connects the semiconductor chips 101, 103, and 105 to the positive electrode of the DC power supply 2 via the smoothing capacitor 4. The second connection terminal 16 is a terminal that connects the semiconductor chips 102, 104, and 106 to the negative electrode of the DC power supply 2 via the smoothing capacitor 4.

[0032] The first connection terminal 15 of this embodiment has an internal terminal 15a sealed in the resin molded portion 19 and an external terminal 15b arranged outside the resin molded portion 19. The internal terminal 15a is made of a plate-shaped conductive material and is connected to the semiconductor chips 101, 103, and 105 of the upper arms 51, 53, and 55 via the first lead frame 11.

[0033] The semiconductor module 6 of this embodiment includes two first connection terminals 15. The two first connection terminals 15 are arranged to sandwich the semiconductor chips 103 and 104 arranged in the center row of the six semiconductor chips 10 arranged in three rows. Specifically, the internal terminal 15a of one of the first connection terminals 15 is arranged to pass between the semiconductor chips 101 and 103 and between the semiconductor chips 102 and 104. The internal terminal 15a of the other first connection terminal 15 is arranged to pass between the semiconductor chips 103 and 105 and between the semiconductor chips 104 and 106.

[0034] One longitudinal end of the internal terminal 15a is connected to the semiconductor chips 101, 103, and 105 via the first lead frame 11, and the other end is covered by the protrusion 191. The internal terminal 15a is exposed from an opening 193 formed in the other surface 191b of the protrusion 191.

[0035] The external terminal 15b is made of a plate-like conductive material and is bent to form a generally crank-like shape when viewed from the side. One of the ends of the external terminal 15b sandwiching the bent portion is connected to the internal terminal 15a exposed from the opening 193 by ultrasonic bonding, brazing, or the like. The other end of the external terminal 15b sandwiching the bent portion protrudes along the other surface 191b of the protruding portion 191 while being spaced apart from the other surface 191b of the protruding portion 191. Although not particularly limited, the distance between the other end of the external terminal 15b and the protruding portion 191 is set to, for example, 0.1 mm or more and 2 mm or less to prevent foreign matter from getting caught. The protruding portion of the external terminal 15b is connected to the smoothing capacitor 4.

[0036] Furthermore, the first connection terminal 15 of this embodiment has tie-bar remnants 15c protruding from the first and second side surfaces 191d, 191e of the protrusion 191. As described below, these tie-bar remnants 15c are what remain when the tie-bar 210 connecting the internal terminal 15a and the control terminal 14 is cut. In this embodiment, two tie-bar remnants 15c are provided, one on either side of the internal terminal 15a, and each is connected to the internal terminal 15a. The tie-bar remnants 15c extend in a direction intersecting the extension direction of the internal terminal 15a and protrude from the first and second side surfaces 191d, 191e. In other words, the tie-bar remnants 15c extend in a direction intersecting the stacking direction of the internal terminal 15a and the second connection terminal 16 and the protruding direction of the protrusion 191, and protrude from the first and second side surfaces 191d, 191e. Furthermore, as will be described later, before the semiconductor module 6 is constructed, the internal terminal 15a and the control terminal 14 are connected by a tie bar 210. Therefore, the control terminal 14, the internal terminal 15a, and the remaining tie bar portion 15c are located on the same plane.

[0037] The second connection terminals 16 are made of a plate-like conductive material and are connected to the semiconductor chips 102, 104, and 106 of the lower arms 52, 54, and 56 via the second lead frame 12. One longitudinal end of the second connection terminals 16 is connected to the semiconductor chips 102, 104, and 106 via the second lead frame 12, and the other end protrudes from the third side surface 19e of the resin molded portion 19 in the same direction as the protruding direction of the external terminals 15b. Specifically, the second connection terminals 16 are arranged on the protruding portions 191 provided on the third side surface 19e so as to protrude from a tip surface 191c of the protruding portion 191. In this embodiment, the tip surface 191c corresponds to the predetermined surface.

[0038] The semiconductor module 6 has two second connection terminals 16. As described above, the semiconductor module 6 also has two first connection terminals 15. The first and second connection terminals 15, 16 are arranged in a stacked configuration.

[0039] Furthermore, in this embodiment, the creepage distance along the resin molded portion 19 between the second connection terminal 16 and the portion of the tie bar remaining portion 15c that protrudes from the convex portion 191 in plan view is adjusted so that the insulation resistance can be maintained. Although not particularly limited, in this embodiment, the creepage distance is set to 4 mm or more. In other words, the location where the tie bar remaining portion 15c is disposed is adjusted so that the creepage distance along the resin molded portion 19 between the second connection terminal 16 and the tie bar remaining portion 15c is a desired distance in plan view so that the insulation resistance can be maintained.

[0040] The external terminal 15b has a surface with the stacking direction of the internal terminals 15a and the second connection terminal 16 as its normal, which has the same shape as the second connection terminal 16. In this embodiment, the tip portions of the external terminal 15b and the second connection terminal 16 protruding from the convex portion 191 have shapes corresponding to fastening members such as bolts so that they can be connected to the smoothing capacitor 4. Specifically, the tip portions of the external terminal 15b and the second connection terminal 16 protruding from the convex portion 191 have a roughly U-shape separated into two. The U-shaped portions of the external terminal 15b and the second connection terminal 16 have the same or approximately the same shape, and the protruding length of the external terminal 15b and the second connection terminal 16 in the protruding direction of the external terminal 15b and the second connection terminal 16 is the same or approximately the same.

[0041] The first and second heat sinks 17 and 18 correspond to heat sinks, and one surface thereof faces the semiconductor chip 10. The semiconductor chips 101 to 106 are connected to the first and second heat sinks 17 and 18 via the first and second lead frames 11 and 12, and the surfaces of the first and second heat sinks 17 and 18 opposite the first and second lead frames 11 and 12 are exposed from the resin molded portion 19. In this manner, the semiconductor chips 101 to 106 are sandwiched between the first and second heat sinks 17 and 18, and the semiconductor module 6 is sandwiched between cooling devices (not shown) on both sides in the thickness direction, and is used to drive the load 3 while dissipating heat.

[0042] The above is the configuration of the semiconductor module 6 in this embodiment. Although details will be omitted, this semiconductor module 6 is used with the first and second connection terminals 15, 16 connected to the smoothing capacitor 4 and the output terminal 13 connected to the load 3.

[0043] Next, a method for manufacturing the semiconductor module 6 will be described with reference to Figures 10 to 13. Figures 10 and 13 are plan views seen from the first connection terminal 15 side.

[0044] First, the semiconductor chips 101 to 106 are mounted on the first and second lead frames 11 and 12. Then, the output terminals 13 and the second connection terminals 16 are electrically connected to the semiconductor chips 101 to 106. Furthermore, as shown in FIG. 10 , a terminal component 200 is prepared in which the internal terminals 15a of the first connection terminals 15 and the control terminals 14 are integrally connected by tie bars 210. Then, the internal terminals 15a and the control terminals 14 are electrically connected to the semiconductor chips 101 to 106. Furthermore, the first and second heat sinks 17 and 18 are arranged. In this manner, a component 300 is prepared in which the internal terminals 15a and the second connection terminals 16 are connected to the semiconductor chips 101 to 106.

[0045] 11 and 12, the component 300 is placed in a mold 400 in which a first die 410 and a second die 420 are fitted together to form a cavity 400a. Specifically, as shown in FIG. 11, the component 300 is placed so that the portion of the second connection terminal 16 exposed from the protrusion 191 of the resin molded portion 19 is sandwiched between the first die 410 and the second die 420. Also, as shown in FIG. 12, the component 300 is placed so that the portion of the tie bar 210 and the control terminal 14 exposed from the resin molded portion 19 is sandwiched between the first die 410 and the second die 420. In other words, because the internal terminal 15a is connected to the tie bar 210, the component 300 is placed so that the internal terminal 15a is fixed at a predetermined position within the mold 400. In this embodiment, different portions of the internal terminal 15a and the second connection terminal 16 are sandwiched between the first mold 410 and the second mold 420 in the stacking direction.

[0046] The component 300 shown in Fig. 11 corresponds to a cross-sectional view taken along line XI-XI in Fig. 10. The component 300 shown in Fig. 12 corresponds to a cross-sectional view taken along line XII-XII in Fig. 10.

[0047] In this embodiment, the first die 410 is brought into contact with the portions of the internal terminals 15a exposed through the openings 193 via the buffer material 430. In other words, the buffer material 430 is disposed between the first die 410 and the portions of the internal terminals 15a exposed through the openings 193. This makes it possible to prevent damage to the portions of the internal terminals 15a exposed through the openings 193. The buffer material 430 is made of a material softer than the mold 400, such as fluororesin, fluororubber, or silicone rubber.

[0048] Next, although not shown, molten resin is poured into a mold 400 and solidified to form the resin molded portion 19 having the opening 193. In this case, in this embodiment, the internal terminal 15a and the second connection terminal 16 are each fixed by the mold 400. This makes it possible to suppress variations in the distance between the internal terminal 15a and the second connection terminal 16, and thus to suppress changes in inductance.

[0049] 13, the tie bars 210 connecting the control terminals 14 and the internal terminals 15a are cut, thereby forming tie bar remaining portions 15c that are connected to the internal terminals 15a and protrude from the first and second side surfaces 191d, 191e of the protrusion 191. After that, although not shown, the external terminals 15b are connected to the internal terminals 15a and the control terminals 14 are bent, thereby manufacturing the semiconductor module 6.

[0050] The semiconductor module 6 of the present embodiment described above has the tie bar remainder 15c connected to the internal terminal 15a and protruding from the resin molded portion 19. Therefore, when forming the resin molded portion 19, the second connection terminal 16 is sandwiched between the first mold 410 and the second mold 420, and the tie bar 210 that becomes the tie bar remainder 15c can be sandwiched between the first mold 410 and the second mold 420. This prevents the spacing between the internal terminal 15a and the second connection terminal 16 in the first connection terminal 15 from changing. This prevents the spacing between the internal terminal 15a and the second connection terminal 16 from becoming too narrow, which would result in a decrease in insulation, or the spacing between the internal terminal 15a and the second connection terminal 16 from becoming too wide, which would result in an increase in inductance.

[0051] (1) In this embodiment, the control terminals 14, the internal terminals 15a, and the tie-bar remaining portions 15c are arranged on the same plane. Therefore, the semiconductor module 6 can be manufactured by preparing the terminal component 200 in which the control terminals 14, the internal terminals 15a, and the tie-bar remaining portions 15c are integrated, thereby simplifying the manufacturing process.

[0052] (Second embodiment) A second embodiment will be described. In this embodiment, the thickness of the convex portion 191 is specified, in contrast to the first embodiment. As the rest is the same as the first embodiment, a description thereof will be omitted here.

[0053] The semiconductor module 6 of this embodiment has a basic configuration similar to that of the first embodiment. However, the thickness of the protrusion 191 of the resin molded portion 19 of this embodiment is specified. Here, as shown in Fig. 14, in the resin molded portion 19, the distance between the first connection terminal 15 (i.e., the internal terminal 15a) and the second connection terminal 16 and the first side surface 191d or the second side surface 191e is defined as distance d1. Also, the distance between the first connection terminal 15 (i.e., the internal terminal 15a) and the second connection terminal 16 is defined as d2.

[0054] If the portion of the resin molded portion 19 that is located between the internal terminal 15a and the second connecting terminal 16 and the first side surface 191d or the second side surface 191e is defined as a side wall portion 194, the distance d1 can also be considered to be the thickness of the side wall portion 194. The first and second side surfaces 191d and 191e can also be considered to be surfaces along the stacking direction of the internal terminal 15a and the second connecting terminal 16. FIG. 14 corresponds to a cross-sectional view taken along line XIV-XIV in FIG. 3.

[0055] In this embodiment, the ratio d1 / d2 of the distance d1 to the distance d2 is set to be 1.0 or more and 2.5 or less, and the distance d2 is set to be 0.2 mm or more and 0.5 mm or less.

[0056] Next, a method for manufacturing the semiconductor module 6 will be described.

[0057] Similar to the first embodiment, the semiconductor module 6 of this embodiment is manufactured by placing the components 300 in a mold 400 and then pouring molten resin into the mold 400. At this time, the placement locations of the components 300 are adjusted so that the spacing ratio d1 / d2 is 1.0 or more and 2.5 or less. The placement locations of the components 300 are also adjusted so that the spacing d2 is 0.2 mm or more and 0.5 mm or less. The spacing ratio d1 / d2 and the spacing d2 will be described below.

[0058] 15, when forming the protrusion 191 of the resin molded part 19, the molten resin flows into the part that will become the side wall part 194 as shown by arrow A, and also flows between the internal terminal 15a and the second connection terminal 16 as shown by arrow B. In this case, the flow speed of the molten resin is proportional to the thickness of the part that will become the flow path, and increases as the thickness increases. In other words, the flow speed of the molten resin in the part that will become the side wall part 194 increases as the distance d1 increases.

[0059] Therefore, if the spacing ratio d1 / d2 becomes too large, the resin flow in the portion that becomes the side wall portion 194 becomes too fast, and the molten resin flows between the first connection terminal 15 (i.e., the internal terminal 15a) and the second connection terminal 16, creating voids. If voids are formed between the first connection terminal 15 and the second connection terminal 16, the insulation between the first connection terminal 15 and the second connection terminal 16 will be reduced. According to the study by the inventors, as shown in FIG. 16, it was confirmed that no entrapment voids occur when the spacing ratio d1 / d2 is 2.5 or less, but that entrapment voids occur when the spacing ratio d1 / d2 is 2.7 or more. For this reason, in this embodiment, the spacing ratio d1 / d2 is set to 2.5 or less.

[0060] Furthermore, in the semiconductor module 6 described above, the inventors have confirmed that, in order to improve the impact resistance of the side wall portion 194 against external forces, it is preferable that the distance d1 be equal to or greater than the distance d2. For these reasons, in this embodiment, the distance ratio d1 / d2 is set to 1.0 or greater and 2.5 or less.

[0061] Furthermore, the first connection terminal 15 (i.e., the internal terminal 15a) and the second connection terminal 16 are stacked and arranged to reduce inductance. In this case, the narrower the distance d2, the more the inductance can be reduced, but variations in manufacturing may cause a decrease in insulation. For this reason, the inventors have studied the distance d2. They have confirmed that if the distance d2 is 0.2 mm or more and 0.5 mm or less, the inductance can be sufficiently reduced and insulation is unlikely to be reduced even if variations in manufacturing occur. Therefore, the distance d2 is set to 0.2 mm or more and 0.5 mm or less.

[0062] According to the present embodiment described above, since the tie bar remaining portion 15c protruding from the resin molded portion 19 is provided, the same effects as those of the first embodiment can be obtained.

[0063] (1) In this embodiment, the spacing ratio d1 / d2 is set to be equal to or greater than 1.0 and equal to or less than 2.5. This makes it possible to prevent the occurrence of entrained voids while also preventing the impact resistance from becoming too low.

[0064] (2) In this embodiment, the distance d2 is set to be equal to or greater than 0.2 mm and equal to or less than 0.5 mm, which reduces the inductance between the first connection terminal 15 and the second connection terminal 16 and prevents the insulation from deteriorating.

[0065] (Third embodiment) A third embodiment will be described. In this embodiment, the thickness of the convex portion 191 is specified, in contrast to the second embodiment. As the rest is the same as the second embodiment, a description thereof will be omitted here.

[0066] The semiconductor module 6 of this embodiment has a basic configuration similar to that of the first embodiment. In this embodiment, as shown in Fig. 17, the distance between the internal terminal 15a and the front end surface 191c is defined as a distance d3. If the portion located between the internal terminal 15a and the front end surface 191c is defined as a front end portion 195, the distance d3 can also be said to be the thickness of the front end portion 195.

[0067] In this embodiment, similarly to the second embodiment, the spacing ratio d3 / d2 of the spacing d3 to the spacing d2 is set to be equal to or greater than 1.0 and equal to or less than 2.5.

[0068] According to the present embodiment described above, since the tie bar remaining portion 15c protruding from the resin molded portion 19 is provided, the same effects as those of the first embodiment can be obtained.

[0069] (1) In this embodiment, the spacing ratio d3 / d2 is set to be equal to or greater than 1.0 and equal to or less than 2.5. Therefore, similar to the second embodiment, it is possible to suppress the occurrence of entrained voids while suppressing an excessive decrease in impact resistance.

[0070] (Other embodiments) Although the present disclosure has been described with reference to the embodiments, it is understood that the present disclosure is not limited to the embodiments or structures. The present disclosure also encompasses various modifications and equivalent modifications. In addition, various combinations and forms, including only one element, more than one element, or less than one element, are also within the scope and spirit of the present disclosure.

[0071] For example, the semiconductor module 6 of each of the above embodiments may be applied to construct a circuit other than a three-phase inverter circuit. In addition, the number of semiconductor chips 10 sealed in the resin mold portion 19 can also be changed as appropriate.

[0072] In each of the above embodiments, as long as the semiconductor chips 101 to 106 and the first and second connection terminals 15, 16 are stacked inside the resin molded portion 19, the connection method can be changed as appropriate.

[0073] Furthermore, in each of the above embodiments, the resin molded portion 19 does not necessarily have to be provided with the protrusion 191. For example, the semiconductor module 6 may be configured so that the second connection terminal 16 protrudes from the third side surface 19e of the resin molded portion 19 and the internal terminal 15a is exposed from the other surface 19b of the resin molded portion 19.

[0074] In each of the above embodiments, the control terminal 14 does not have to be disposed on the same plane as the internal terminal 15a.

[0075] The above embodiments may also be combined. For example, the second embodiment may be combined with the third embodiment, and the spacing ratio d1 / d2 and the spacing ratio d3 / d2 may be set to 1.0 or more and 2.5 or less.

[0076] (Features of the present invention) [Claim 1] A semiconductor module, A semiconductor chip (10); a resin mold portion (19) for resin-sealing the semiconductor chip; a first connection terminal (15) and a second connection terminal (16) electrically connected to the semiconductor chip and having portions protruding from the resin mold portion; a control terminal (14) electrically connected to the semiconductor chip; the first connection terminal and the second connection terminal are plate-shaped, stacked at a predetermined interval, and extend in one direction in a planar direction to protrude from the resin molded portion; The second connection terminal protrudes from a predetermined surface (191c) of the resin molded portion, the first connection terminal has an internal terminal (15a) exposed by an opening (193) formed in a surface (191b) of the resin molded portion different from the predetermined surface, and an external terminal (15b) connected to the internal terminal at the opening and protruding from the resin molded portion; The semiconductor module has a tie bar remainder (15c) in which the internal terminal extends in a direction intersecting the stacking direction of the internal terminal and the second connection terminal and the extension direction of the first connection terminal, protruding from the resin molded portion and connected to the internal terminal. [Claim 2] 2. The semiconductor module according to claim 1, wherein the internal terminal and the tie bar remainder are arranged on the same plane as the control terminal. [Claim 3] 3. The semiconductor module of claim 1, wherein the spacing ratio, which is the spacing (d1) between the internal terminal and the second connection terminal and the side (191d, 191e) of the resin molded portion along the stacking direction of the internal terminal and the second connection terminal, to the spacing (d2) between the internal terminal and the second connection terminal, is 1.0 or more and 2.5 or less. [Claim 4] A semiconductor module as described in any one of claims 1 to 3, wherein the spacing ratio indicated by the spacing (d3) between the internal terminal and the specified surface in the resin molded portion to the spacing (d2) between the internal terminal and the second connection terminal is 1.0 or more and 2.5 or less. [Claim 5] 5. The semiconductor module according to claim 1, wherein a distance (d2) between the internal terminal and the second connection terminal is set to be equal to or greater than 0.2 mm and equal to or less than 0.5 mm. [Claim 6] A semiconductor chip (10); a resin mold portion (19) for resin-sealing the semiconductor chip; a first connection terminal (15) and a second connection terminal (16) electrically connected to the semiconductor chip and having portions protruding from the resin mold portion; a control terminal (14) electrically connected to the semiconductor chip; the first connection terminal and the second connection terminal are plate-shaped, stacked at a predetermined interval, and extend in one direction in a planar direction to protrude from the resin molded portion; The second connection terminal protrudes from a predetermined surface (191c) of the resin molded portion, the first connection terminal has an internal terminal (15a) exposed by an opening (193) formed in a surface (191b) of the resin molded portion different from the predetermined surface, and an external terminal (15b) connected to the internal terminal at the opening and protruding from the resin molded portion; a method for manufacturing a semiconductor module, wherein the internal terminal has a tie bar remainder (15c) that extends in a direction intersecting a stacking direction of the internal terminal and the second connection terminal and an extending direction of the first connection terminal, protrudes from the resin molded portion, and is connected to the internal terminal, preparing a terminal component (200) in which the internal terminal and the control terminal are integrated via a tie bar (210); electrically connecting the second connection terminal to the semiconductor chip so that the internal terminal and the second connection terminal are stacked, and electrically connecting the internal terminal and the control terminal of the terminal component to the semiconductor chip to form a component (300); preparing a mold (400) in which a cavity (400a) is formed by fitting a first mold (410) and a second mold (420) together, and placing the component in the cavity; pouring molten resin into the mold and solidifying it to form the resin molded portion; cutting the tie bar to form a tie bar remainder that is connected to the internal terminal and protrudes from the resin molded portion; A method for manufacturing a semiconductor module, in which the component is arranged in the cavity so that the second connection terminal is sandwiched between the first mold and the second mold, and the tie bar is sandwiched between the first mold and the second mold. [Explanation of symbols]

[0077] 10 Semiconductor chips 14 Control terminal 15 First connection terminal 15a internal terminal 15b External terminal 15c Tie bar remainder 16 Second connection terminal 19 Resin molded part 191 Convex 191c Tip surface 193 Opening

Claims

1. A semiconductor module, A semiconductor chip (10); a resin mold portion (19) for resin-sealing the semiconductor chip; a first connection terminal (15) and a second connection terminal (16) electrically connected to the semiconductor chip and having portions protruding from the resin mold portion; a control terminal (14) electrically connected to the semiconductor chip; the first connection terminal and the second connection terminal are plate-shaped, stacked at a predetermined interval, and extend in one direction in a surface direction to protrude from the resin molded portion; The second connection terminal protrudes from a predetermined surface (191c) of the resin molded portion, The first connection terminal has an internal terminal (15a) exposed by an opening (193) formed in a surface (191b) of the resin molded portion different from the predetermined surface, and an external terminal (15b) connected to the internal terminal at the opening and protruding from the resin molded portion, the internal terminal has a tie-bar remainder (15c) extending in a direction intersecting a stacking direction of the internal terminal and the second connection terminal and an extending direction of the first connection terminal, protruding from the resin molded portion, and connected to the internal terminal; the opening is formed to expose a portion of the internal terminal that is more inward in an extension direction of the first connection terminal than a portion of the internal terminal that is closest to the predetermined surface, The resin molded portion is a semiconductor module in which the portion of the internal terminal closest to the predetermined surface is sealed with resin.

2. A semiconductor module as described in Claim 1, wherein the remaining portion of the tie bar protrudes from a surface (191d, 191e) of the resin molded portion that is different from the specified surface.

3. 3. The semiconductor module according to claim 1, wherein the internal terminals and the remaining tie-bar portions are arranged on the same plane as the control terminals.

4. 3. The semiconductor module of claim 1, wherein the spacing ratio, which is the spacing (d1) between the internal terminal and the second connection terminal and the side (191d, 191e) of the resin molded portion along the stacking direction of the internal terminal and the second connection terminal, to the spacing (d2) between the internal terminal and the second connection terminal, is 1.0 or more and 2.5 or less.

5. 3. A semiconductor module as described in claim 1 or 2, wherein the spacing ratio indicated by the spacing (d3) between the internal terminal and the specified surface in the resin molded portion to the spacing (d2) between the internal terminal and the second connection terminal is 1.0 or more and 2.5 or less.

6. 3. The semiconductor module according to claim 1, wherein the distance between the internal terminal and the second connection terminal is 0.2 mm or more and 0.5 mm or less.

7. A semiconductor chip (10); a resin mold portion (19) for resin-sealing the semiconductor chip; a first connection terminal (15) and a second connection terminal (16) electrically connected to the semiconductor chip and having portions protruding from the resin mold portion; a control terminal (14) electrically connected to the semiconductor chip; the first connection terminal and the second connection terminal are plate-shaped, stacked at a predetermined interval, and extend in one direction in a surface direction to protrude from the resin molded portion; The second connection terminal protrudes from a predetermined surface (191c) of the resin molded portion, The first connection terminal has an internal terminal (15a) exposed by an opening (193) formed in a surface (191b) of the resin molded portion different from the predetermined surface, and an external terminal (15b) connected to the internal terminal at the opening and protruding from the resin molded portion, the internal terminal has a tie-bar remainder (15c) extending in a direction intersecting a stacking direction of the internal terminal and the second connection terminal and an extending direction of the first connection terminal, protruding from the resin molded portion, and connected to the internal terminal; the opening is formed to expose a portion of the internal terminal that is more inward in an extension direction of the first connection terminal than a portion of the internal terminal that is closest to the predetermined surface, a method for manufacturing a semiconductor module, wherein the resin molded portion is a portion of the internal terminal closest to the predetermined surface side that is sealed with resin, preparing a terminal component (200) in which the internal terminal and the control terminal are integrated via a tie bar (210); electrically connecting the second connection terminal to the semiconductor chip so that the internal terminal and the second connection terminal are stacked, and electrically connecting the internal terminal and the control terminal of the terminal component to the semiconductor chip to form a component (300); preparing a mold (400) in which a cavity (400a) is formed by fitting a first mold (410) and a second mold (420) together, and placing the component in the cavity; pouring molten resin into the mold and solidifying it to form the resin molded portion; cutting the tie bar to form a tie bar remainder that is connected to the internal terminal and protrudes from the resin molded portion; A method for manufacturing a semiconductor module, in which the component is arranged in the cavity so that the second connection terminal is sandwiched between the first mold and the second mold, and the tie bar is sandwiched between the first mold and the second mold.

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