Induction heating soldering automation equipment

Abstract

The present invention relates to an automated induction heating soldering equipment, and in particular, the equipment comprises a fixture unit for fixing a board on which electronic elements are mounted, a first conveyor for transporting the fixture unit, an induction heating unit installed above the fixture unit so as to be movable in the x-axis, y-axis and z-axis directions and including a magnetic induction coil for inductively heating the board mounted on the fixture unit to solder the electronic elements, and a controller for controlling the first conveyor and the induction heating unit, and the equipment is capable of locally heating continuously supplied molded interconnected devices (MIDs), printed circuit boards (PCBs) or flexible printed circuit boards (FPCBs) by a non-contact induction heating method, thereby automatically soldering electronic elements while minimizing thermal damage.

Description

[Technical Field]

[0001] The present invention relates to an automated induction heating soldering device, and more particularly to an automated induction heating soldering device that can continuously and automatically solder electronic components by induction heating molded interconnected devices (MIDs, more precisely, plastic injection molded products with electrical wiring circuits that have mechanical and electrical functions) or printed circuit boards (PCBs) on which continuously supplied electronic components are mounted. [Background technology]

[0002] Currently, electrical circuits are essential components in a wide range of industrial fields, performing functions such as connecting components, controlling components, and sensing.

[0003] Conventional methods for realizing circuits include soldering elements to a printed circuit board (PCB) or a flexible printed circuit board (FPCB) or assembling a wire harness.

[0004] In the case of PCBs, this is the most common method of electrical circuitry, where the required electronic components are soldered to the two-dimensional (2D) electrical circuitry. This method is the most widely used in most industrial fields, and involves creating a pattern on the board using a photoresist, applying solder paste using a metal mask or dispensing, and then mounting the electronic components and reflowing to create a completed board.

[0005] Recently, circuit components with a molded interconnect device (MID) structure that uses laser direct structuring (LDS) and microscopic integrated processing technology (MIPTEC) have been introduced. In the case of MIDs, circuits can be realized in three-dimensional (3D) shapes because the circuits are realized directly on the plastic base, which has the advantage of being extremely advantageous in terms of space limitations and installation.

[0006] However, when MID soldering is performed using the reflow method, the entire MID passes through a heating path that provides high-temperature heat, which can cause thermal damage to the materials, resulting in limitations in that only limited materials can be used. In addition, due to spatial restrictions in the heating path, there are limitations to its application to MID-structured circuitry that has planes with different heights (2.5D) or three-dimensional (3D) shapes.

[0007] Due to the limitations mentioned above, despite the merit of MIDs being an extremely revolutionary solution that makes 3D circuits possible, the current situation is that they are not being widely used in the industrial field due to the limitations of soldering. Summary of the Invention [Problem to be solved by the invention]

[0008] The present invention has been made to solve the above-mentioned problems of the prior art, and its object is to provide an automated induction heating soldering equipment that can locally heat continuously supplied MIDs (Molded Interconnected Devices) or PCBs using a non-contact induction heating method, and automatically solder electronic components to the MIDs or PCBs while minimizing thermal damage.

[0009] Another object of the present invention is to provide an automated induction heating soldering device that can automatically solder a large number of objects to be soldered with uniform quality. [Means for solving the problem]

[0010] In order to solve the above problems, the automated induction heating soldering equipment of the present invention comprises a jig unit for fixing a board on which electronic components are mounted, a first conveyor for transporting the jig unit, an induction heating unit installed above the jig unit so as to be movable in the x-axis, y-axis, and z-axis directions and equipped with a magnetic induction coil for induction heating the board mounted on the jig unit and soldering the electronic components, and a controller for controlling the first conveyor and the induction heating unit.

[0011] The automated induction heating soldering equipment further comprises a pick-up robot that picks up the jig unit transported by the first conveyor and moves it to the soldering stage.

[0012] In this case, a plurality of soldering devices each including an induction heating unit, a pick-up robot, and a controller may be arranged along the first conveyor.

[0013] Here, a second conveyor for transporting the jig unit may be further installed next to the first conveyor.

[0014] In addition, a manual stage is provided on one side of the first conveyor, on which the jig unit is manually carried in and out.

[0015] Here, the soldering stage, the waiting area of ​​the first conveyor, the unloading area of ​​the second conveyor, and the manual stage are arranged in a straight line along the x-axis direction on the base of the soldering equipment, and the pickup robot moves above each of these areas along the x-axis direction, loading and unloading the jig unit into and from each area.

[0016] Here, the induction heating movement module that moves the induction heating unit in the three axes of x, y, and z is composed of a y-axis unit supported on the base side of the soldering equipment, an x-axis unit supported on the y-axis unit side, and a z-axis unit supported on the x-axis unit side, and each unit includes a unit body with guide rails, a drive unit connected to one end of the unit body in the longitudinal direction, and a slider that is transported on the guide rails by the drive of the drive unit.

[0017] The pickup robot also has a pair of robot arms at its lower end that move along the jig transport rail in the x-axis direction and move toward or away from each other on the y-axis line to grasp or release the jig unit, and the robot arms may be moved in the z-axis direction using hydraulic or pneumatic pressure.

[0018] Here, the substrate may be made of a printed circuit board (PCB), a flexible printed circuit board (FPCB) or a molded integrated circuit (MID) extrusion.

[0019] On the other hand, the jig unit comprises a bottom plate, a pair of guide plates installed on both sides of the upper surface of the bottom plate so as to face each other and having guide holes formed therein, first and second support plates installed on both sides of the upper surface of the bottom plate so as to face each other, a top plate disposed on the upper ends of the pair of guide plates and the first and second support plates and having fitting holes formed therein, a spring installed on the first support plate, a pressing plate that receives elastic force from the spring and moves by having guide protrusions installed on both ends fitted into the guide holes, and a fixing member that is arranged between the second support plate and the pressing plate through the fitting holes of the top plate and fixes the substrate.

[0020] Here, the fixing member comprises a number of fixing panels arranged in large numbers between the second support plate and the pressing plate, which create spaces in which the MID or PCB is arranged, and a finishing panel installed at the end of one side of the fixing panels and contacting the second support plate.

[0021] The induction heating unit includes a magnetic induction coil stacked spirally upward, one or more magnetic cores erected at the center of the magnetic induction coil, a coil fixing body having a core fitting hole into which the magnetic core is fitted and a coil fitting hole into which the magnetic induction coil is fitted formed on its outer surface, a body jig in which the coil fixing body is built, and a front jig and a base jig installed at the front and rear of the body jig, respectively.

[0022] A distance measuring device is installed on the front jig and the base jig, and emits a laser beam through the body jig and the coil fixing body toward the jig unit.

[0023] In addition, a magnetic core is installed in a portion of the jig unit facing the magnetic core. [Effects of the Invention]

[0024] The automated induction heating soldering equipment of the present invention having the above-mentioned configuration can locally heat the MID injection molded article or PCB on which electronic components are mounted in a non-contact manner, thereby automating the process of soldering electronic components to the MID injection molded article or PCB, thereby advantageously producing a large number of soldered products with uniform quality.

[0025] Another advantage is that it solves the problems of MID injection and thermal damage to PCBs that could not be solved by conventional reflow soldering, making it possible to produce products that are free from thermal damage.

[0026] Furthermore, immediately after soldering, there is only a level of radiant heat that allows the MID injection product or PCB substrate to be touched, so there is no need for a cooling period to reduce the temperature after soldering.

[0027] Furthermore, since it is possible to solder MID injection parts made of plastic resins with low heat resistance, a wide range of injection material can be selected.

[0028] Furthermore, the automated induction heating soldering equipment according to the present invention has the advantages of requiring a much smaller installation space than reflow equipment and consuming much less electricity. [Brief explanation of the drawings]

[0029] [Figure 1] 1 is a diagram showing the entire induction heating soldering automation equipment according to an embodiment of the present invention; [Figure 2] FIG. 2 is a diagram showing the internal structure of the automated equipment located at the frontmost position in FIG. 1. [Figure 3] 3 is a diagram showing an operation state of a pick-up robot in the induction heating soldering automation equipment according to an embodiment of the present invention; FIG. [Figure 4] 1 is a diagram showing an induction heating transfer module in an induction heating soldering automation equipment according to an embodiment of the present invention; [Figure 5]5 is a diagram showing a y-axis unit in the induction heating transfer module shown in FIG. 4. [Figure 6] 1 is a flowchart showing the overall operation of an automated induction heating soldering device according to an embodiment of the present invention; [Figure 7] FIG. 2 shows an induction heating unit and a fixture unit together according to an embodiment of the present invention. [Figure 8] FIG. 2 shows an induction heating unit and a fixture unit together according to an embodiment of the present invention. [Figure 9] FIG. 2 is a diagram showing a jig unit according to an embodiment of the present invention. [Figure 10] FIG. 2 is an exploded view of the induction heating unit according to the embodiment of the present invention. [Figure 11] FIG. 11 is an exploded view of the magnetic induction coil and the coil fixing body shown in FIG. 10. [Figure 12] 3A and 3B are diagrams showing a magnetic core and a lower magnetic core in the induction heating unit and the jig unit according to the embodiment of the present invention; [Figure 13] 1 is a diagram showing a fixed panel and a substrate (for example, an outer case of a smartphone) in a jig unit according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0030] In order to solve the above problems, the automated induction heating soldering equipment of the present invention comprises a jig unit for fixing a board on which electronic components are mounted, a first conveyor for transporting the jig unit, an induction heating unit installed above the jig unit so as to be movable in the x-axis, y-axis, and z-axis directions and equipped with a magnetic induction coil for induction heating the board mounted on the jig unit and soldering the electronic components, and a controller for controlling the first conveyor and the induction heating unit.

[0031] (Mode for carrying out the invention) Since the present invention can be modified in various ways and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the present invention to the specific embodiments, and it should be understood that the present invention includes all modifications, equivalents, and alternatives within the spirit and technical scope of the present invention. In addition, when describing the present invention, if it is recognized that a detailed description of related known technology may obscure the gist of the present invention, the detailed description will be omitted.

[0032] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of an automated induction heating soldering apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

[0033] FIG. 1 is a diagram showing the entire induction heating soldering automation equipment according to one embodiment of the present invention, FIG. 2 is a diagram showing the internal structure of the automation equipment located at the front end in FIG. 1, FIG. 3 is a diagram showing the operating state of a pick-up robot in the induction heating soldering automation equipment according to one embodiment of the present invention, and FIG. 4 is a diagram showing an induction heating transfer module in the induction heating soldering automation equipment according to one embodiment of the present invention.

[0034] The automated induction soldering equipment of the present invention can continuously and automatically perform mold direct mount (MDM) of electronic components onto a molded interconnect device (MID) mounted directly on an extrusion, as well as a traditional PCB or FPCB, by induction soldering the electronic components onto the extrusion. The extrusion may have a wavy or curved region or a three-dimensional structure. In the following description, the PCB, FPCB, or MID extrusion on which the electronic components are mounted will be collectively referred to as "substrate A."

[0035] To explain the overall outline of the present invention in more detail, the present invention allows the induction heating unit that solders the boards to move automatically in the x-, y-, and z-axis directions above the soldering stage while soldering, thereby enabling large-scale soldering with uniform quality. In particular, by using a multi-type layout for loading and unloading boards centered around the soldering area (soldering stage), it is possible to solder different types of lots. Furthermore, by arranging multiple soldering equipment units in succession along the board transport line, it is possible to significantly improve the soldering yield.

[0036] To this end, as shown in FIGS. 1 to 4, an automated induction heating soldering equipment according to an embodiment of the present invention includes a jig unit 100 for fixing a board A on which an electronic component B is mounted, a first conveyor 200 for transporting the jig unit 100, a pickup robot 300 for gripping the jig unit 100 transported by the first conveyor 200 and moving along a jig transport rail 600 to pick up and transport the jig unit 100 to a soldering area (soldering stage: C), an induction heating unit 400 having a magnetic induction coil 410 for induction heating the board A mounted on the jig unit 100 transported by the pickup robot 300 and soldering the electronic component B, and a controller 500 for controlling the first conveyor 200, the pickup robot 300, and the induction heating unit 400.

[0037] The jig unit 100 is disposed below the induction heating unit 400 and fixes the substrate A to be induction heated in a non-contact manner. Details of the jig unit 100 will be described later.

[0038] The first conveyor 200 is disposed long in the front-rear direction, and transports the jig unit 100, on which the substrate A on which the electronic element B is mounted is fixed, from the front to the rear.

[0039] A second conveyor 800 for transporting the jig unit 100 may be further disposed next to the first conveyor 200. Accordingly, the board A, which requires soldering of the electronic component B, can be carried into the equipment via the first conveyor 200, and the completed product after soldering can be carried out of the equipment via the second conveyor 800. This will be described in more detail later.

[0040] 3, the pickup robot 300 moves along a jig transport rail 600 that is arranged in an elongated manner in the x-axis direction (left-right direction) between two post structures that stand upright on a base 900 of an automated equipment, and after grasping the jig unit 100, transports the jig unit 100 to the soldering stage C. A drive unit (not shown) that moves the pickup robot 300 in the x-axis direction is incorporated in the jig transport rail 600.

[0041] The pickup robot 300 is configured to have a shape including a cylinder (not shown) with multiple rods, and includes at its lower end a pair of robot arms 310 that move toward or away from each other on the y-axis to grip or release the jig unit 100. The pickup robot 300 moves the robot arms 310 in the z-axis direction using hydraulic or pneumatic pressure.

[0042] More specifically, the pickup robot 300, which has been moving along the jig transport rail 600, applies hydraulic or pneumatic pressure to the inside of the cylinder body so that the cylinder rod (not shown) advances downward in order to grasp the jig unit 100 that has been transported by the first conveyor 200 and is waiting in the waiting area D or the jig unit 100 placed on the manual stage F. Then, the pair of robot arms 310 attached to the lower ends of the rods approach each other on the y-axis, and the robot arms 310 are fitted under the top plate 150 of the jig unit 100. In this state, hydraulic or pneumatic pressure is again applied to the inside of the cylinder body of the transport head 300 so that the cylinder rod advances into the cylinder body, thereby lifting the jig unit 100 in the z-axis direction. After this, the pickup robot 300 transports the jig unit 100 along the jig transport rail 600 to the soldering stage C, and then lowers the jig unit 100 in the z-axis direction, thereby lowering the jig unit 100 onto the soldering stage C.

[0043] On the other hand, once soldering of the substrate A placed on the jig unit 100 is completed, the pickup robot 300 picks up the jig unit 100 and then lowers it into the discharge area E of the second conveyor 800 or the manual stage F.

[0044] The pickup robot 300 according to the present invention repeats this process to transport the jig unit 100 loaded onto the first conveyor 200 or the jig unit 100 loaded onto the manual stage F into and out of the soldering work area and the unloading area.

[0045] 4, the induction heating unit 400 is moved in the x-, y-, and z-axis directions by the induction heating movement module 700 to inductively heat the substrate A placed on the jig unit 100 and solder the electronic component B to the substrate A. The induction heating unit 400 will be described in detail later.

[0046] The induction heating movement module 700 is a means for moving the position of the induction heating unit 400 in accordance with the shape of the substrate and the position of the electronic element, and is capable of movement along three axes: the x-axis, y-axis, and z-axis.

[0047] For this purpose, the induction heating moving module 700 is composed of a combination of three units, for example, a y-axis unit 710 supported on the base 900 side while being arranged horizontally in the front-to-back direction of the base 900, an x-axis unit 720 supported on the y-axis unit 710 side while being arranged horizontally in the left-to-right direction of the base 900, and a z-axis unit 730 supported on the x-axis unit 720 side while being arranged vertically in the upward direction of the base 900.

[0048] As a result, when the y-axis unit 710 is operated, the entire induction heating unit 400, z-axis unit 730, and x-axis unit 720 can move in the front-to-back direction (y-axis) of the base 900, when the x-axis unit 720 is operated, the induction heating unit 400 and z-axis unit 730 can move in the left-to-right direction (x-axis) of the base 900, and when the z-axis unit 730 is operated, the induction heating unit 400 can move in the up-and-down direction (z-axis) of the base 900.

[0049] As shown in Figure 5, each of the units 710, 720, 730 is composed of a unit body 712 with a guide rail 711, a drive unit 713 (e.g., a servo motor) connected to one longitudinal end of the unit body 712, and a slider 714 that moves along the guide rail 711 of the unit body 712 while being linked to the drive unit 713.Each unit is capable of moving in each direction together with the slider by connecting and supporting its own unit body to the slider side.

[0050] For example, the slider of the y-axis unit 710 is coupled to the unit body of the x-axis unit 720, the slider of the x-axis unit 720 is coupled to the unit body of the z-axis unit 730, and the slider of the z-axis unit 730 is coupled to the body of the induction heating unit 400. Here, it is preferable that the z-axis unit 730 is coupled to the slider of the x-axis unit 720 via a separate bracket.

[0051] As a result, induction heating unit 400 can move in the xyz directions to a desired location to perform soldering as each unit is transported in the three axes of x, y, and z.

[0052] Meanwhile, the above-mentioned soldering stage C, waiting area D for the jig unit 100, unloading area E for the jig unit 100, and manual stage F will be described in more detail with reference to FIGS.

[0053] As shown in Figures 2 and 3, inside the soldering equipment 10, along the x-axis direction, there are defined, in this order, a soldering area (soldering stage: C), a waiting area for the jig unit 100 (D: an area of ​​the first conveyor), an unloading area (E: an area of ​​the second conveyor), and a manual area (manual stage: F), and along the y-axis direction, the first conveyor 200 and the second conveyor 800 are arranged in parallel and in a long shape.

[0054] Here, the first conveyor 200 is a means for transporting the substrate A placed on the jig unit 100 into the interior of the equipment, and when the first conveyor 100 is stopped, it provides a waiting area D where the substrate A transported into the interior of the equipment is immediately before being transferred to the soldering stage C.

[0055] On the other hand, the second conveyor 800 is a means for transporting the soldered board A outside the equipment while it is placed on the jig unit 100, and when the second conveyor 800 is stopped, it provides an unloading area E just before the soldered board A is transported outside the equipment.

[0056] The manual stage F provides an area where an operator can manually load and unload the jig unit 100 on which the substrate A is mounted. Such a manual stage F makes it possible to more flexibly handle soldering of a wide variety of products in small quantities.

[0057] The above-mentioned soldering stage C, waiting area D of the first conveyor 200, unloading area E of the second conveyor 800, and manual stage F are arranged in a straight line along the x-axis direction on the base 900. At this time, the pick-up robot 300 moves above each of these areas along the x-axis direction, carrying the jig unit 100 into each of areas C, D, E, and F, and carrying the jig unit 100 out of each of areas C, D, E, and F.

[0058] Here, the soldering stage C and manual stage F are formed by mounting tables 910 fixedly supported on both sides of the upper surface of a base 900 placed on the floor of the soldering equipment 10. The jig unit 100 is mounted on these mounting tables 910. Meanwhile, the first and second conveyors 200, 800 are fixedly supported on the upper surface of the base 900 using brackets or the like, passing above the base 900 between the welding and manual stages C, F.

[0059] The controller 500 controls the positions of the pickup robot 300 and the induction heating unit 400 and the travel of the first and second conveyors 200, 800. The controller 500 is connected to an input means for inputting various data such as soldering conditions such as the shape of the board, material, soldering position, soldering speed, and high frequency generation output, as well as soldering objectives such as emphasis on precision, emphasis on speed, and emphasis on energy saving, and a liquid crystal display (LCD) touch panel as a display means for displaying various data.

[0060] Meanwhile, a plurality of (e.g., three) soldering equipments 10 each including a jig unit 100, a pick-up robot 300, an induction heating unit 400, a controller 500, and an induction heating transfer module 700 are provided in isolation along the first conveyor 200. Therefore, various types of soldered products can be produced simultaneously.

[0061] Operations such as loading and unloading of the jig unit and soldering processes using the automated induction heating soldering equipment of the present invention having the above-described configuration will be described with reference to FIGS. 2 and 6. FIG.

[0062] As shown in FIGS. 2 and 6, in the present invention, the passage through which the jig unit is carried into the soldering equipment mainly includes the first conveyor and the manual stage.

[0063] First, the process of loading jig units onto the first conveyor, soldering them, and then unloading them will be described. A large number of jig units 100 are loaded onto the first conveyor 200 at regular intervals and loaded into the soldering equipment 10 (step S10). At this time, the first conveyor 200 transports and stops one step at a time, sequentially loading the jig units 100 into the waiting area D of the soldering equipment 10 (step S20). When a jig unit 100 is located in the waiting area D, the pickup robot 300 moves along the jig transport rail 600 to the waiting area D, picks up the jig unit 100, and transfers it to the soldering stage C (step S30). After this, the induction heating unit 400 receives information such as soldering positions corresponding to the board shape and electronic component arrangement structure input into the controller 500, and moves it in the x, y, and z directions on the soldering stage C to the desired soldering location and performs soldering. Here, when multiple boards A are loaded on the jig unit 100 or when multiple electronic components B are to be soldered to one board A, the controller 500 moves continuously in the x, y, and z directions according to control logic pre-stored in the controller 500, and solders all of the electronic components B on the boards A on the jig unit 100 all at once (step S40). Once the soldering process for all electronic components on the jig unit 100 has been completed, the pickup robot 300 receives a signal from the controller 500, loads the jig unit 100 on the soldering stage C, and then moves the jig unit 100 to the unloading area E of the second conveyor 800 (step S50). The second conveyor 800 carries the soldered jig unit 100 out of the equipment 10 (step S60). This completes one cycle of the process in which the jig unit 100 is carried in by the first conveyor 200, soldered, and then carried out.

[0064] In relation to this, when soldering is performed using a single soldering device, the first conveyor alone can be used without the second conveyor. That is, while a jig unit is picked up from the waiting area of ​​the first conveyor and soldered on the soldering stage (area C), the first conveyor continues to wait with its transport stopped. When the soldered jig unit is moved to the waiting area (area D) where the first conveyor was originally located, it moves only one step to continuously carry out loading, soldering, and unloading. In this case, the induction heating unit 400 can also directly solder a board mounted on a jig unit in the waiting area (area D) of the first conveyor. That is, instead of moving the jig unit to the soldering stage (area C), the induction heating unit 400 can move to the waiting area (area D) inline with the first conveyor to perform soldering.

[0065] Next, the process of loading the jig unit onto the manual stage, soldering it, and then unloading it will be described. The operator places the jig unit 100 on the manual stage F. Then, the pickup robot 300 transfers the jig unit 100 from the manual stage F to the soldering stage C, where the induction heating unit 400 performs the soldering process. This is the same process as steps S30 and S40 described above. At this time, the operator must set new information about the board being loaded onto the manual stage and new soldering logic via a display linked to the controller 500. Once the soldering process for all electronic elements in the jig unit 100 is completed based on the new information from the controller 500, the pickup robot 300 receives a signal from the controller 500 and loads the jig unit 100 from the soldering stage C, and then transfers it back to the manual stage F (step S51). Then, the operator unloads the jig unit from the manual stage F to the outside of the equipment (step S61). This completes one cycle of the process of loading the component onto the manual stage, soldering it, and then unloading it.

[0066] This soldering process using a manual stage is used when soldering of a small number of products is required while soldering of a large number of products using the first conveyor is being performed. In other words, when urgent soldering of a small number of products is required, it is possible to flexibly respond without having to dismantle all of the jig units on the first conveyor line. In this way, the present invention has the advantage of being able to simultaneously handle both high-volume welding of a small number of products and low-volume welding of a wide variety of products using a single soldering device.

[0067] Next, a soldering process using the second or third soldering equipment will be described. The jig units are mounted on the first conveyor 200 across the second or third soldering equipment 10. At this time, the jig units 100 mounted on the first conveyor 200 are loaded with boards A before soldering. When these jig units 100 are positioned in the waiting area D of the second or third soldering equipment (step S21), the above-mentioned steps S20 to S60 are performed in the same process. When soldering is performed using multiple soldering equipment, it is necessary to use the first conveyor 200 and the second conveyor 800 simultaneously. Here, the first conveyor 200 is used as a means for transporting the jig units into the equipment before soldering, and the second conveyor 800 is used as a means for transporting the jig units out of the equipment after soldering.

[0068] The jig unit 100 and the induction heating unit 400 constituting the automated induction heating soldering equipment of the present invention will be described in more detail below with reference to the drawings.

[0069] 7 and 8 are views showing an induction heating unit and a jig unit according to one embodiment of the present invention, FIG. 9 is a view showing a jig unit according to one embodiment of the present invention, FIG. 10 is an exploded view of an induction heating unit according to one embodiment of the present invention, FIG. 11 is an exploded view of the magnetic induction coil and coil fixing body shown in FIG. 10, FIG. 12 is a view showing a magnetic core and a lower magnetic core in an induction heating unit and a jig unit according to one embodiment of the present invention, and FIG. 13 is a view showing a fixing panel and a substrate (e.g., an outer case of a smartphone) in a jig unit according to one embodiment of the present invention.

[0070] 7 to 9 and 13, the jig unit 100 is described in more detail. The jig unit 100 comprises a bottom plate 110, a pair of guide plates 120 installed facing each other on both ends of the upper surface of the bottom plate 110, first and second support plates 130 and 140 installed facing each other on both ends of the upper surface of the bottom plate 110 where the guide plates 120 are not installed, a top plate 150 installed on the upper ends of the pair of guide plates 120 and the first and second support plates 130 and 140, a spring 160 installed on the first support plate 130, a pressing plate 170 connected to the spring 160 to receive elastic force, and a fixing member 180 for fixing the substrate A.

[0071] The guide plate 120 is formed with an elongated guide hole 121 .

[0072] The first support plate 130, the second support plate 140 and the pair of guide plates 120 are respectively installed on the side edges of the peripheral portion of the bottom plate 110, thereby forming a square shape.

[0073] The top plate 150 has a fitting hole 151 formed therein.

[0074] The spring 160 has one end connected to the first support plate 130 and the other end connected to the pressing plate 170, and applies elastic force in a direction that presses the pressing plate 170 toward the second support plate 140.

[0075] The pressing plate 170 has guide protrusions 171 at both ends, and the guide protrusions 171 are fitted into the guide holes 121 of the guide plate 120 to move forward and backward.

[0076] The fixing member 180 is disposed between the second support plate 140 and the pressing plate 170 through the fitting hole 151 of the top plate 150. The fixing member 180 is composed of a number of fixing panels 181 and a finishing panel 182 installed on the edge of one side of the fixing panels 181.

[0077] At least one magnetic core 181 a is installed on the fixed panel 181 , and a large number of such fixed panels 181 are arranged between the second support plate 140 and the pressing plate 170 .

[0078] On the other hand, when multiple fixed panels 181 are stacked horizontally, gaps are formed between the fixed panels 181, and one substrate A is placed in each gap. The first fixed panel 181 of the multiple fixed panels 181 described above comes into contact with the pressing plate 170.

[0079] The finishing panel 182 is installed next to the last-placed fixed panel 181 among the multiple fixed panels 181 stacked horizontally. A substrate A is also installed between the finishing panel 182 and the fixed panel 181. The finishing panel 182 contacts the second support plate 140.

[0080] On the other hand, a large number of magnets 181b are installed on the fixed panels 181, so that adjacent fixed panels 181 are attached to each other by magnetic force. Needless to say, it is also possible to install magnets on the finishing panel 182 so that adjacent fixed panels 181 are attached to each other by magnetic force.

[0081] 7 and 8 and 10 to 12, the induction heating unit 100 will be described in more detail. The induction heating unit 400 includes a magnetic induction coil 410, a magnetic core 420 installed at the center of the magnetic induction coil 410, a coil fixing body 430 in which the magnetic induction coil 410 and the magnetic core 420 are installed, a body jig 440 in which the coil fixing body 430 is installed, and a front jig 450 and a base jig 460 installed at the front and rear of the body jig 440, respectively.

[0082] The magnetic induction coil 410 is connected to a high frequency power supply 480 to convert electrical energy into thermal energy by electromagnetic induction, and locally heats the area requiring soldering at a certain distance above the substrate A in a non-contact manner to solder the electronic element B.

[0083] Such magnetic induction coil 410 is spirally wound and stacked in multiple layers upwards. As the magnetic induction coil is spirally wound in this way, an internal space 410a is formed in the center.

[0084] The magnetic core 420 is made of a magnetic material, preferably ferrite, and is installed in the internal space 410a of the magnetic induction coil 410 to concentrate the magnetic flux and concentrate the heat source at the soldered portion.

[0085] On the other hand, as described above, a magnetic core 181a is also installed in the fixed panel 181 of the fixed member 180, but from the viewpoint of concentrating the magnetic flux, it is preferable that the magnetic core 420 installed in the magnetic induction coil 410 and the magnetic core 151a installed in the fixed panel 181 are installed so as to face each other.

[0086] The coil fixing body 430 is formed in a shape similar to a rectangle that is long in one direction, and has at least one core fitting hole 431 formed on its outer surface into which the magnetic core 420 is fitted, and a coil fitting hole 432 formed on its outer surface into which the magnetic induction coil 410 is fitted.

[0087] The core fitting hole 431 is a hole into which the magnetic core 420 standing upright is fitted in the internal space 410a of the magnetic induction coil 410. A core cover 433 is installed at the upper end of the inside of the core fitting hole 431 to prevent the magnetic core 420 from slipping out.

[0088] A spirally wound magnetic induction coil 410 is fitted into the coil fitting hole 432 .

[0089] Meanwhile, the coil fixing body 430 has a number of communication holes 434 formed therein, which connect the magnetic core 420 and the magnetic induction coil 410 to each other.

[0090] The communication hole 434 is formed to communicate the core fitting hole 431, into which the magnetic core 420 is fitted, with the outer surface of the coil fixing body 430. Air flows through the communication hole 434, thereby cooling the magnetic core 420 and the magnetic induction coil 410.

[0091] Meanwhile, a heat dissipation sheet 435 may be installed in the communication hole 434. Therefore, the inner surface of the heat dissipation sheet 435 contacts the outer surface of the magnetic core 420, and the outer surface of the heat dissipation sheet 435 contacts the magnetic induction coil 410, thereby promoting cooling of the magnetic core 420 and the magnetic induction coil 410.

[0092] The body jig 440 includes a coil fixing body 430 in which a magnetic core 420 and a magnetic induction coil 410 are installed.

[0093] The front jig 450 and the base jig 460 are respectively installed on both side ends of the body jig 440. When the body jig 440, the front jig 450, and the base jig 460 are connected in this manner, an empty space is formed between them, and the distance measuring device 470 is installed in this empty space.

[0094] The distance measuring device 470 has both ends installed on the front jig 450 and the base jig 460 , respectively, and irradiates a laser beam toward the jig unit 100 through the body jig 440 and the coil fixing body 430 .

[0095] The distance measuring device 470 emits a laser toward the jig unit 100 to measure the distance between the magnetic core 420 and the electronic element B mounted on the board A. Therefore, the distance measuring device 470 is used to position the magnetic core 420 and the electronic element B at optimal positions for uniform, high-quality soldering.

[0096] As described above, the laser passing holes 436 and 441 through which the laser emitted from the distance measuring device 470 passes are formed in the coil fixing body 430 and the body jig 440 so as to be connected to each other.

[0097] The induction heating soldering equipment according to the present invention can perform the soldering process of electronic components by performing separate induction heating, thereby improving precision and stability, and significantly reducing the time and power consumption required for soldering the entire board.

[0098] Furthermore, because the induction heating unit moves adjacent to the electronic component while soldering, the process of heating the entire substrate and then cooling it can be omitted. In this regard, conventional reflow soldering equipment requires a process of heating the entire substrate and then cooling it again, which involves heating the entire substrate at a low temperature for a long period of time to uniformly melt the solder paste located throughout the substrate while preventing thermal damage to the molded circuit components and other components. This has limitations, such as a long soldering time. Furthermore, a heating chamber and oven are required, and space must be secured for the entire substrate to move and perform each process. Furthermore, a separate cooling process is required, which requires a moving device and cooling equipment for the cooling process, further increasing the cooling time. However, the automated soldering equipment according to the present invention can solve all of these problems.

[0099] Each embodiment of the present invention has been described above with reference to the drawings. However, these terms are merely used to clearly describe the present invention, and it should be understood that a person having ordinary knowledge in the art can modify and change the present invention in various ways without departing from the spirit and scope of the present invention as set forth in the claims.

[0100] In one embodiment of the present invention, the soldering target is an outer case of a mobile phone, which is an MID product, but the electronic device of various embodiments of the present invention is not limited thereto and can be applied to any type of electronic device requiring a soldering process. For example, the electronic device may be a wearable device such as a smart watch or anti-reflective (AR) glass, a display device, a home appliance, a vehicle component, a light-emitting diode (LED) lamp, a touch panel, an antenna module, etc. [Industrial Applicability]

[0101] The present invention relates to an automated induction heating soldering equipment, and can be widely used in the electronics / electrical industry and the mechanical industry, where elements are soldered to PCBs for connecting components, controlling, sensing, etc.

Claims

1. A jig unit (100) for fixing a substrate (A) on which an electronic element (B) is mounted; a first conveyor (200) for transporting the jig unit (100); an induction heating unit (400) provided with a magnetic induction coil (410) that is installed above the jig unit (100) so as to be movable in the x-axis, y-axis, and z-axis directions and that inductively heats the substrate (A) attached to the jig unit (100) to solder the electronic element (B); a controller (500) for controlling the first conveyor (200) and the induction heating unit (400); a pick-up robot (300) that picks up the jig unit (100) transported by the first conveyor (200) and moves it to a soldering stage (C); A plurality of soldering equipments each including an induction heating unit (400), a pick-up robot (300) and a controller (500) are arranged along the first conveyor (200), A second conveyor (800) for transporting the jig unit (100) is further installed next to the first conveyor (200), The soldering stage (C), the waiting area (D) of the first conveyor (200), and the unloading area (E) of the second conveyor (800) are arranged in a straight line along the x-axis direction on the base (900) of the soldering equipment (10), and the pickup robot (300) moves along the x-axis direction above each of these areas (C), (D), and (E) to load the jig unit (100) into each area (C), (D), and (E) and unload the jig unit (100) from each area (C), (D), and (E).

2. 2. The induction heating soldering automation equipment according to claim 1, wherein a manual stage (F) is provided on one side of the first conveyor (200) for manually loading and unloading the jig unit (100).

3. The manual stage (F), together with the soldering stage (C), the waiting area (D) of the first conveyor (200), and the unloading area (E) of the second conveyor (800), are arranged in a straight line along the x-axis direction on the base (900) of the soldering equipment (10); 3. The induction heating soldering automation equipment according to claim 2, wherein the pickup robot (300) moves along the x-axis direction above each area (C), (D), (E), and (F) of the jig unit (100), including the manual stage (F), to carry the jig unit (100) into and out of each area (C), (D), (E), and (F).

4. The induction heating movement module (700) for moving the induction heating unit (400) in three axes directions of x, y, and z is composed of a y-axis unit (710) supported on the base (900) of the soldering equipment (10), an x-axis unit (720) supported on the y-axis unit (710) side, and a z-axis unit (730) supported on the x-axis unit (720) side.

2. The automated induction heating soldering equipment according to claim 1, wherein each of the units (710), (720), and (730) comprises a unit body (712) with a guide rail (711), a drive unit (713) coupled to one longitudinal end of the unit body (712), and a slider (714) that is driven by the drive unit (713) to move along the guide rail (711).

5. 5. The automated induction heating soldering equipment according to claim 4, wherein the pickup robot (300) has a pair of robot arms (310) at its lower end that move along the jig transport rail (600) in the x-axis direction and move toward or away from each other on the y-axis to grip or release the jig unit (100), and the robot arms (310) are moved in the z-axis direction by hydraulic or pneumatic pressure.

6. 2. The induction heating soldering automation equipment according to claim 1, wherein the substrate (A) is a printed circuit board (PCB), a flexible printed circuit board (FPCB) or a molded integrated circuit device (MID) injection molding.

7. A jig unit (100) for fixing a substrate (A) on which an electronic element (B) is mounted; a first conveyor (200) for transporting the jig unit (100); an induction heating unit (400) provided with a magnetic induction coil (410) that is installed above the jig unit (100) so as to be movable in the x-axis, y-axis, and z-axis directions and that inductively heats the substrate (A) attached to the jig unit (100) to solder the electronic element (B); a controller (500) for controlling the first conveyor (200) and the induction heating unit (400); The jig unit (100) is provided with a pressing plate (170) connected to a spring (160) on one side thereof to press and fix a plurality of substrates.

8. The jig unit (100) comprises: a bottom plate (110); a pair of guide plates (120) disposed on both sides of the upper surface of the bottom plate (110) so as to face each other and each having a guide hole (121); First and second support plates (130) and (140) are installed on both sides of the upper surface of the bottom plate (110) so as to face each other; a top plate (150) disposed on the upper ends of the pair of guide plates (120) and the first and second support plates (130) and (140), and having a fitting hole (151) formed therein; a spring (160) mounted on the first support plate (130); a pressing plate (170) that receives elastic force from the spring (160) and moves with guide protrusions (171) provided at both ends fitted into the guide holes (121); a fixing member (180) that is disposed between the second support plate (140) and the pressing plate (170) through a fitting hole (151) of the top plate (150) and fixes the substrate (A); 8. The automated induction heating soldering equipment according to claim 7, comprising:

9. The fixing member (180) is arranged between the second support plate (140) and the pressing plate (170), and includes a number of fixing panels (181) that create a gap for the substrate (A) to be placed between them; a finishing panel (182) installed at one end of the fixed panel (181) and in contact with the second support plate (140); The induction heating soldering automation equipment according to claim 8, further comprising:

10. The induction heating unit (400) comprises a magnetic induction coil (410) stacked spirally upward; One or more magnetic cores (420) erected at the center of the magnetic induction coil (410); a coil fixing body (430) having a core fitting hole (431) into which the magnetic core (420) is fitted and a coil fitting hole (432) into which the magnetic induction coil (410) is fitted formed on its outer surface; a body jig (440) in which the coil fixing body (430) is built; a front jig (450) and a base jig (460) installed in front and rear of the body jig (440), respectively; 10. The automated induction heating soldering equipment according to claim 1 or 7, comprising:

11. 11. The induction heating soldering automation equipment according to claim 10, wherein the front jig (450) and the base jig (460) are provided with a distance measuring device (470) that irradiates a laser toward the jig unit (100) by penetrating the body jig (440) and the coil fixing body (430).

12. 11. The automated induction heating soldering equipment according to claim 10, wherein a magnetic core (181a) is installed in a portion of the jig unit (100) facing the magnetic core (420).

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