Light irradiation device

Abstract

To provide a beam radiation device which is thin, light-weight, and excellent in heat radiation performance.SOLUTION: A beam radiation device includes: substrates 80 in each of which a radiation element 88 is mounted on a mounting surface 80L; and a housing 11 which has a translucent part 52 which transmits light emitted from the radiation elements 88 to the outside and houses the substrates 80 therein. The housing 11 is provided with a heat radiation part 50 which is formed of a metal material and exposed to the interior and the exterior of the housing 11. Each substrate 80 is attached so that the substrate 80 contacts with a portion, located at the inner side of the housing 11, of the heat radiation part 50.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a light irradiation device. [Background technology]

[0002] Conventionally, an illumination device for emitting light has been known, for example, as described in Patent Document 1. This device comprises a housing having a bottom cover with an illumination hole and an upper shell, and a board on which an LED facing the illumination hole is mounted and locked within the housing. A heat sink pad (cooling means) is arranged within the housing, and the back surface of the board is connected to this heat sink pad, allowing heat emitted from the LED to be dissipated. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-238748 Summary of the Invention [Problem to be solved by the invention]

[0004] When using short-wavelength ultraviolet light as a light source, the output is higher than that of conventional visible light irradiation devices or long-wavelength ultraviolet irradiation devices, and therefore there is a demand for improved heat dissipation than before. However, in a configuration in which a cooling means is installed inside a housing, as in the configuration of Patent Document 1 mentioned above, the thickness of the housing increases. Furthermore, the provision of a cooling means increases the weight. If the thickness of the cooling means is reduced to solve this problem, sufficient heat dissipation cannot be obtained.

[0005] The technology disclosed in this specification has been made in consideration of the above circumstances, and aims to provide a light irradiation device that is thin, lightweight, and has excellent heat dissipation properties. [Means for solving the problem]

[0006] The technology disclosed in this specification for solving the above problems is a light irradiation device comprising: a substrate having an irradiation element mounted on a mounting surface; and a housing that contains the substrate and has a light-transmitting portion that transmits light emitted from the irradiation element to the outside, wherein the housing is provided with a heat dissipation portion made of a metal material and exposed inside and outside the housing, and the substrate is attached in a manner that makes contact with a portion of the heat dissipation portion that is located inside the housing.

[0007] According to the above configuration, the heat of the substrate heated by the heat generated by the irradiation element is easily transferred to the heat dissipation section of the housing and easily dissipated to the outside, thereby making it possible to provide a light irradiation device with excellent heat dissipation properties. Furthermore, by configuring the heat dissipation section to be exposed to the inside and outside of the housing, it is possible to make the light irradiation device thinner and lighter than conventional configurations in which the heat dissipation section is provided inside the housing.

[0008] The substrate may be fastened to the heat dissipation unit by a fastening member. In a configuration in which the substrate and the heat dissipation unit are simply overlapped or integrated with an adhesive, there is a risk of a gap occurring between the substrate and the heat dissipation unit, and if a gap occurs, cooling efficiency will decrease. With the above configuration, the substrate can be reliably brought into contact with the heat dissipation unit, thereby improving heat dissipation performance.

[0009] The substrate is accommodated within the housing with the mounting surface facing the heat dissipation portion, and the heat dissipation portion has a fastening portion that rises toward the substrate and to which a fastening member is fastened, and a standing wall that rises toward the substrate and has a contact surface that extends along the mounting surface, and when the substrate is fastened to the fastening portion by the fastening member, the mounting surface may be in contact with the contact surface.

[0010] According to the above configuration, the heat dissipation portion made of a metal material is disposed in the portion of the housing that is hit by the light emitted from the irradiation element, thereby preventing deterioration of the housing. Furthermore, even if a gap is formed between the board and the surface of the heat dissipation portion facing the board, the board and the heat dissipation portion are configured to be in contact not only at the fastening portion but also at the mounting surface of the board and the contact surface of the vertical wall, thereby ensuring a sufficient contact area between them and thereby improving heat dissipation.

[0011] Cooling fans for cooling the board may be housed in the housing in a state where they are arranged side by side in a direction along the surface of the board, and the board may be located in an exhaust path from the air outlet of the cooling fan to an exhaust outlet provided in the housing.

[0012] According to the above configuration, since the substrate and the cooling fan are arranged side by side, the light irradiation device can be made thinner than a configuration in which the substrate and the cooling fan are arranged overlapping each other. Furthermore, the substrate can be cooled efficiently not only by the heat dissipation part but also by the wind from the cooling fan.

[0013] The substrate may mount the first and second irradiation elements, and may have a first portion that mounts the first irradiation element and a second portion that mounts the second irradiation element, and the first portion and the second portion may extend in directions that intersect with each other.

[0014] According to the above configuration, the area of ​​the substrate can be increased compared to a configuration in which the first and second portions are arranged flat, thereby improving cooling efficiency. Furthermore, since the first and second portions extend in the intersecting direction, the first and second irradiation elements are arranged to face in different directions. In other words, according to the above configuration, the irradiation range in the height direction can be expanded compared to a configuration in which the two irradiation elements face only in one direction.

[0015] The substrate may have an extension portion provided on the peripheral edge thereof, the extension portion extending outward from the heat dissipation portion within the housing. With this configuration, the extension portion functions as a heat dissipation fin, and can dissipate heat from the substrate.

[0016] The heat dissipation portion may be made of aluminum. The substrate may also be made of aluminum. Because aluminum has high thermal conductivity, this configuration improves cooling efficiency. [Effects of the Invention]

[0017] According to the technology disclosed in this specification, it is possible to obtain a light irradiation device that is thin, lightweight, and has excellent heat dissipation properties. [Brief explanation of the drawings]

[0018] [Figure 1] 1 is a perspective view of the top side of a deep ultraviolet irradiation device according to an embodiment of the present invention; [Figure 2] A perspective view of the bottom side of the deep ultraviolet irradiation device [Figure 3] Exploded perspective view of deep ultraviolet irradiation device [Figure 4] A perspective view of the inside of a deep ultraviolet irradiation device [Figure 5] Partially enlarged perspective view of the inside of the deep ultraviolet irradiation device [Figure 6] Partially enlarged plan view of the inside of the deep ultraviolet irradiation device [Figure 7] Partially enlarged plan view of deep ultraviolet irradiation equipment [Figure 8] Partially enlarged vertical cross-sectional view of the deep ultraviolet irradiation device (cross-sectional view II in Figure 1) [Figure 9] Partially enlarged vertical cross-sectional view of the deep ultraviolet irradiation device (II-II cross-sectional view in Figure 1) [Figure 10] Cross-sectional view of deep ultraviolet irradiation equipment (III-III cross-section in Figure 1) [Figure 11] Cross-sectional view of deep ultraviolet irradiation equipment (IV-IV cross-section in Figure 1) [Figure 12] A perspective view of a heat dissipation member [Figure 13] Plan view of the heat dissipation member [Figure 14]Front view of the heat dissipation member DETAILED DESCRIPTION OF THE INVENTION

[0019] An embodiment in which the light irradiation device disclosed in this specification is applied to a deep ultraviolet irradiation device 10 capable of sterilizing the interior of a vehicle will be described with reference to FIGS. 1 to 14. Each drawing shows an X-axis, a Y-axis, and a Z-axis, and each axis direction is drawn so that it is a common direction in each drawing. Hereinafter, the X-axis direction will be described as the right direction or width direction, the Y-axis direction as the forward direction, and the Z-axis direction as the upward direction, but the directions are not limited to this embodiment. Furthermore, for multiple identical components, a reference symbol may be assigned to one component and the reference symbols for the other components may be omitted.

[0020] The deep ultraviolet irradiation device 10 is configured to include an LED substrate (an example of a substrate) 80 on which an LED (an example of an irradiation element) 88 is mounted, and a housing 11 that is generally flat and box-shaped and that houses the LED substrate 80 inside.

[0021] 3, the housing 11 is made of resin and is composed of two covers 12, 22 that cover the front and back (top and bottom) of the plate surface of a substantially rectangular holding member 30. In detail, the holding member 30 includes a substantially rectangular plate-shaped holding plate portion 31 and a frame-shaped portion 32 that rises in the vertical direction from the peripheral edge of the holding plate portion 31. The housing 11 is composed of two covers: an upper cover 12 that is shallow and dish-shaped as a whole and covers the top surface of the holding plate portion 31 and is fitted inside the frame-shaped portion 32, and a plate-shaped lower cover 22 that covers the bottom surface of the holding plate portion 31 and is fitted inside the frame-shaped portion 32.

[0022] 8 and 9, the ceiling wall 13 of the upper cover 12 of the housing 11, which is disposed opposite the upper surface of the holding plate 31, is composed of a front ceiling wall 14 that is inclined rearward and upward from its front end and covers approximately one-third of the front portion of the holding plate 31, and a rear ceiling wall 15 that extends horizontally from the front ceiling wall 14 and covers approximately two-thirds of the rear portion of the holding plate 31 in a state parallel to the holding plate 31. The inclination angle of the front ceiling wall 14 is set at an angle of approximately 15 degrees relative to the holding plate 31.

[0023] 10 and 11, a cover-side peripheral wall 16 that rises downward and outward is provided on the peripheral edge of the ceiling wall 13 of the upper cover 12. The outer circumferential dimension of the tip (lower end) of this cover-side peripheral wall 16 in the rising direction is set to a dimension that allows it to be fitted inside the frame-shaped portion 32 of the holding member 30 described above.

[0024] A front wall 17 of the cover-side peripheral wall 16, which extends contiguous to the front end of the front ceiling wall 14, is provided with a plurality of vertically extending slit-shaped exhaust ports 18 that straddle the front ceiling wall 14 (see FIG. 1). Also, a rear wall of the cover-side peripheral wall 16, which extends contiguous to the rear end of the rear ceiling wall 15, is provided with a plurality of vertically extending slit-shaped intake ports (not shown).

[0025] The upper cover 12 is fixed to the holding member 30 by fastening bolts B to a plurality of cylindrical upper cover fastening portions 36 (described later) that rise from the holding plate portion 31 of the holding member 30. When the upper cover 12 is fixed to the holding member 30, a space is formed between the upper cover 12 and the holding plate portion 31. Hereinafter, within the internal space of this housing 11, the space below the front ceiling wall 14 will be referred to as a front space R1, and the space below the rear ceiling wall 15 will be referred to as a rear space R2.

[0026] On the other hand, the lower cover 22 of the housing 11 is a generally rectangular plate that is slightly curved overall so that the central portion bulges slightly downward. The outer circumferential dimensions of the lower cover 22 are set to allow it to be fitted inside the frame portion 32 of the holding member 30 described above (see FIGS. 10 and 11).

[0027] 3, locking portions 23 protrude outward slightly inside the center of each of the four sides (edges) of lower cover 22. Lower cover 22 is fixed to holding member 30 by locking these locking portions 23 into stepped portions within locking holes 41 provided in holding plate portion 31 of holding member 30 described above.

[0028] A rectangular housing-side opening 25 that is elongated in the width direction (left-right direction) and penetrates the plate surface is provided in a portion of the lower cover 22 that corresponds to the front ceiling wall 14 of the upper cover 12 (a portion of the portion that corresponds to the front space R1). The housing-side opening 25 is closed by a heat dissipation member 50, which will be described later.

[0029] As described above, the holding member 30 includes the rectangular plate-shaped holding plate portion 31 and the frame-shaped portion 32 that rises up and down from the peripheral edge of the holding plate portion 31. The holding plate portion 31 has a holding member-side opening 35 that penetrates the plate surface at a position that faces the housing-side opening 25 when the lower cover 22 is attached (see FIGS. 9 and 11). The holding member-side opening 35 is formed to be slightly larger than the housing-side opening 25 in a plan view. In other words, when the lower cover 22 is attached to the holding member 30, the opening edge of the housing-side opening 25 is exposed inside the holding member-side opening 35.

[0030] A partition wall 33 that rises upward and extends in the left-right direction is provided at the rear opening edge of the holding member-side opening 35. The partition wall 33 is located at the boundary between the front space R1 and the rear space R2 described above when the upper cover 12 is assembled. The partition wall 33 is provided at the center in the width direction of the holding plate portion 31, and its width dimension (left-right dimension) is slightly smaller than the width dimension of the holding member-side opening 35. The spaces to the sides of the partition wall 33 are open in the front-rear direction. A notch 34 that is cut out in a flat rectangular shape facing downward is formed at the center of the upper end of the partition wall 33, and an air outlet 92 of a cooling fan 90 (described later) is adapted to be fitted into this notch 34.

[0031] On either side (left and right sides) of the holding member side opening 35, two columnar upper cover fastening portions 36 that rise upward from the holding plate portion 31, and two plate-shaped positioning wall portions 37 that rise upward from the holding plate portion 31 and have plate surfaces facing each other, are arranged side by side in the front-to-back direction, sandwiching the holding member side opening 35 between them.

[0032] Furthermore, a cylindrical central positioning first protrusion 38 that rises upward is provided at the center of the opening edge on the front side of the holding member side opening 35. Furthermore, a square pillar-shaped central positioning second protrusion 39 that protrudes inward of the holding member side opening 35 and rises upward is provided at the center of the opening edge on the rear side of the holding member side opening 35. The back surface of the central positioning second protrusion 39 is integral with the partition wall 33.

[0033] When the lower cover 22 and the holding member 30 are assembled, the housing-side opening 25 and the holding member-side opening 35 are in communication in the vertical direction. A portion of a heat dissipation member 50 (an example of a heat dissipation portion) is fitted into these openings 25, 35. The lower surface of the heat dissipation member 50 is exposed to the outside of the housing 11, and the upper surface is exposed to the inside of the housing 11 (inside the front space R1).

[0034] 12 and 13, the heat dissipation member 50 is made of aluminum or an aluminum alloy and includes a main body 51 that is rectangular in plan view, and four positioning pieces 71, 71, 73, and 75 (described below) that extend outward from four sides of the main body 51 in plan view. The heat dissipation member 50 is bilaterally symmetrical.

[0035] The main body 51 has two circular light-transmitting holes (one example of a light-transmitting portion) 52 arranged side by side in the left-right direction, for transmitting light emitted from two LEDs 88 arranged inside the housing 11 to the outside of the housing 11, as will be described later. On the underside of the heat dissipation member 50, i.e., on the outer surface side of the housing 11, the periphery of each light-transmitting hole 52 is formed as an expanded diameter portion 53 that widens obliquely downward. In other words, the main body 51 has two generally bowl-shaped portions that narrow upward when viewed from the underside (see FIGS. 2, 9, and 11). The light emitted from the LEDs 88 and transmitted through the light-transmitting holes 52 can be diffused along the underside of the expanded diameter portion 53.

[0036] The two enlarged diameter portions 53 arranged side by side in the left-right direction are in contact with each other, and the two enlarged diameter portions 53 connected together are surrounded by a peripheral wall 54 that is generally rectangular in plan view. The peripheral wall 54 has a two-step shape. Specifically, as shown in FIG. 14 , the outer diameter of the portion of the peripheral wall 54 located on the lower side (the outer surface side of the housing 11) is a housing insertion portion 55 that is equal to the inner diameter of the housing-side opening 25. On the other hand, the outer diameter of the portion of the peripheral wall 54 located on the upper side (the inner surface side of the housing 11) is a holding member insertion portion 57 that is larger than the outer diameter of the housing insertion portion 55 and slightly smaller than the inner diameter of the holding member-side opening 35. The housing insertion portion 55 and the holding member insertion portion 57 are connected via a step portion 56 that projects outward from the housing insertion portion 55. With this configuration, the heat dissipation member 50 is configured so that the housing insertion portion 55 is inserted into the housing side opening 25 and the step portion 56 is placed on the peripheral portion of the upper surface of the housing side opening 25, and the holding member insertion portion 57 is inserted into the holding member side opening 35 (see Figures 8, 9, and 11).

[0037] Two cylindrical board fastening portions 61 that rise upward are provided on the upper surface of the expanded diameter portion 53, on the left and right sides of the two light-transmitting holes 52 and inside the peripheral wall 54. As shown in FIG. 11 , the two board fastening portions 61 are slightly inclined so that their tips approach each other. The board fastening portions 61 are configured to include a large-diameter portion 62 located on the base side and a small-diameter portion 63 located on the tip side and having a smaller diameter than the large-diameter portion 62. The axial length of the small-diameter portion 63 is set to be equal to the thickness of the LED board 80, which will be described later.

[0038] Furthermore, of the peripheral wall 54, two front and rear lateral walls 58 extending in the left-right direction are provided with vertical walls 64 that rise upward. The upper ends of the vertical walls 64 are inclined outward (left-right) and upward from the left-right center of the lateral walls 58. In other words, the vertical walls 64 rise from the lateral walls 58 in the form of two flat right-angled triangles lined up in the left-right direction as a whole, and the upper ends form a flat V-shape when viewed from the front. The inclination angle of the upper ends of the vertical walls 64 is set to an angle that is perpendicular to the extension direction of the axis of the board fastening portion 61. Furthermore, the upper ends of the vertical walls 64 and the upper ends of the large-diameter portions 62 of the board fastening portion 61 are arranged on the same imaginary plane.

[0039] A vertical reinforcing wall 66 that protrudes upward and extends in the front-to-rear direction is provided in the left-to-right central portion of the main body 51, i.e., the portion where the two enlarged diameter portions 53 contact each other (the boundary portion between the two enlarged diameter portions 53). Furthermore, horizontal reinforcing walls 67 that protrude upward from the upper end of the peripheral wall 54 of the main body 51 and extend in the left-to-right direction are provided at the front and rear ends of the main body 51 in the left-to-right central portion of the main body 51. The vertical reinforcing wall 66 and the two horizontal reinforcing walls 67 are connected to each other, and the reinforcing walls as a whole form an H-shape in plan view.

[0040] The main body 51 is provided with lateral positioning pieces 71 extending outward in the left-right direction, continuing from the upright wall 64 (referred to as the front upright wall 64F) disposed at the front. The lateral positioning pieces 71 are provided at their tips with positioning holes 72 penetrating in the up-down direction, and the positioning holes 72 are adapted to be fitted onto the upper cover fastened portions 36 of the holding member 30 described above (see FIGS. 4 to 6).

[0041] Furthermore, a front positioning piece 73 extends forward from the front lateral reinforcing wall 67F, which is disposed at the front of the two lateral reinforcing walls 67 of the main body 51. The front positioning piece 73 is provided with a positioning hole 74 into which the above-described first central positioning protrusion 38 of the holding member 30 is fitted.

[0042] Furthermore, a rear positioning piece 75 extends rearward from the rear lateral reinforcing wall 67R, which is disposed at the rear of the two lateral reinforcing walls 67 of the main body 51. The rear positioning piece 75 has a recess 76 cut out from its rear end toward the front, into which the above-mentioned second central positioning protrusion 39 of the holding member 30 is fitted.

[0043] The heat dissipation member 50 is positioned relative to the holding member 30 by fitting the positioning holes 72 of the lateral positioning pieces 71 onto the upper cover fastened portions 36 of the holding member 30, fitting the first central positioning protrusions 38 into the positioning holes 74 of the front positioning pieces 73, and further fitting the second central positioning protrusions 39 into the recesses 76 of the rear positioning pieces 75. In this positioned state, as described above, the housing insertion portions 55 of the peripheral wall 54 of the heat dissipation member 50 are inserted into the housing-side opening 25 of the lower cover 22, the stepped portions 56 are placed on the peripheral edge of the housing-side opening 25, and the holding member insertion portions 57 are inserted into the holding member-side opening 35 of the holding member 30.

[0044] Two LED substrates 80 (an example of a substrate, a first portion, and a second portion) are attached to the heat dissipation member 50, which is positioned relative to the holding member 30. As shown in Figs. 10 and 11, the two LED substrates 80 are attached to the heat dissipation member 50 side by side in the left-right direction, crossing each other so as to form a flat V-shape when viewed from the front. The two LED substrates 80 are symmetrical to each other.

[0045] The LED substrate 80 will now be described in detail. The LED substrate 80 is made of aluminum or an aluminum alloy, and as shown in FIG. 5, has a rectangular substrate main body 81. A fastening hole 82, through which the substrate fastened portion 61 of the heat dissipation member 50 described above passes, is formed in the center of the substrate main body 81 and penetrates the plate surface. The fastening hole 82 has an inner diameter that is smaller than the large diameter portion 62 of the substrate fastened portion 61 and is equal to or slightly larger than the small diameter portion 63. The LED substrate 80 is attached to the heat dissipation member 50 by fastening a bolt B with the small diameter portion 63 of the substrate fastened portion 61 passing through the fastening hole 82.

[0046] The front-rear dimension of the board main body 81 is slightly larger than the front-rear dimension of the peripheral wall 54 of the heat dissipation member 50. When the LED board 80 is attached to the heat dissipation member 50, the front end of the board main body 81 extends forward from the front standing wall 64F of the heat dissipation member 50 and comes into contact with an upper surface (an example of a contact surface) 65F of the front standing wall 64F, thereby being supported from below (see FIGS. 9 and 10). In addition, the rear end of the board main body 81 extends slightly rearward from the rear standing wall 64R and comes into contact with an upper surface (an example of a contact surface) 65R of the rear standing wall 64R, thereby being supported from below (see FIG. 9).

[0047] 5 and 6, when attached to the heat dissipation member 50, the LED substrate 80 includes an inner extending portion 83 extending from the substrate main body portion 81 toward the center of the heat dissipation member 50 in the left-right direction, and an outer extending portion (an example of an extending portion) 85 extending from the substrate main body portion 81 toward the opposite side of the inner extending portion 83 (outside the heat dissipation member 50). The inner extending portion 83 has a dimension slightly smaller than the front-rear dimension of the substrate main body portion 81, and extends to a position slightly rearward from the center of the substrate main body portion 81 in the front-rear direction. The outer extending portion 85 has a dimension approximately half the front-rear dimension of the substrate main body portion 81, and extends toward the rear end of the substrate main body portion 81 in the front-rear direction.

[0048] When the LED board 80 is attached to the heat dissipation member 50, the inner extending portion 83 is fitted between the front lateral reinforcing wall 67F and the rear lateral reinforcing wall 67R of the heat dissipation member 50. A groove-shaped positioning groove 84 is formed in the center of the tip end of the inner extending portion 83 in the extension direction, and a positioning rib 77 that protrudes in the left-right direction from the center in the front-to-rear direction of the vertical reinforcing portion of the heat dissipation member 50 is fitted into the positioning groove 84, thereby positioning the heat dissipation member 50 in the front-to-rear direction.

[0049] Furthermore, when the LED board 80 is attached to the heat dissipation member 50, the outer extending portions 85 extend in the left-right direction (outward) and diagonally upward from the ends of the main body portion 51 of the heat dissipation member 50. That is, the outer extending portions 85 extend in a direction away from the main body portion 51 and along the plate surface of the main body portion 51. When the LED board 80 is accommodated in the housing 11, the tips of the outer extending portions 85 are in contact with or close to the two positioning wall portions 37 of the holding member 30.

[0050] When the LED substrates 80 are attached to the heat dissipation member 50, the LEDs 88 are mounted on the lower surface (an example of a mounting surface) 80L of the substrate main body 81 at positions facing the light-transmitting holes 52 of the heat dissipation member 50 (see FIG. 11). As described above, the two LED substrates 80 are arranged crossing each other to form a flat V-shape when viewed from the front, and therefore the top surfaces of the LEDs 88 are oriented slightly outward (left and right) from below.

[0051] The LEDs 88 of this embodiment are deep ultraviolet LEDs 88 that irradiate deep ultraviolet light (100 to 280 nm), which has a short wavelength among ultraviolet light. The wavelength of the deep ultraviolet light irradiated by these LEDs 88 is preferably within a range of 200 to 280 nm. Note that the LED substrate 80 may be equipped with a visible light LED that emits visible light together with the deep ultraviolet LEDs 88.

[0052] The LEDs 88 of this embodiment are top-illuminated LEDs 88 that, when mounted on the LED substrate 80, emit light from the end face (top face) opposite the LED substrate 80. The beam angle of these LEDs 88 is within a range of 120 degrees centered on an axis perpendicular to the top face.

[0053] A cooling fan 90 is accommodated in the rear space R2 of the housing 11. The cooling fan 90 is fastened to the holding member 30 by a bolt B in a state where it is arranged side by side with respect to the LED substrate 80 in a direction along the ceiling wall 13. Note that "side by side" refers to an arrangement in which the plate surface of the LED substrate 80 and the cooling fan 90 do not overlap when the deep ultraviolet irradiation device 10 is viewed from above, and also includes a case in which the heights in the vertical direction are misaligned. In this embodiment, the cooling fan 90 is arranged slightly above the LED substrate 80.

[0054] The cooling fan 90 includes a fan main body 91 that is generally flat and cylindrical. The fan main body 91 is disposed in the rear space R2 of the housing 11 with a pair of bottom surfaces facing up and down, and its upper bottom surface (top surface) abuts against the rear ceiling wall 15 via a cushioning material (not shown) (see FIGS. 9 and 10). The cooling fan 90 is configured to suck air from below and blow it forward, and includes an air outlet 92 that protrudes forward in the shape of a flat rectangular tube. The air outlet 92 protrudes forward from the upper portion of the fan main body 91 so that its upper surface is flush with the upper surface of the fan main body 91. In other words, the upper surface of the air outlet 92 also abuts against the rear ceiling wall 15 via a cushioning material (not shown).

[0055] The air outlet 92 has a width dimension equal to the width dimension of the cutout 34 of the partition wall 33 described above, and a height dimension equal to the height dimension of the cutout 34, with its tip portion fitted into the cutout 34. As shown in Figures 8 and 9, the air outlet 92 is disposed at a position spaced above the upper surfaces (one example of the opposite surfaces) 80U of the two LED boards 80. With this configuration, the space between the upper surfaces 80U of the LED boards 80 and the ceiling surface 13L of the housing 11 forms an exhaust path 45 from the air outlet 92 of the cooling fan 90 to the exhaust port 18 of the housing 11.

[0056] In addition, a recessed portion 19 extends widthwise from the rear toward the front at a portion closer to the rear of the front ceiling wall 14. The recessed portion 19 is recessed downward at an angle greater than the angle of inclination of the front ceiling wall 14, and guides the air blown out from the air outlet 92 of the cooling fan 90 and blows it toward the upper surface 80U of the LED board 80. In this embodiment, the angle of inclination of the recessed portion 19 is set to an angle of approximately 35 degrees with respect to the holding plate portion 31.

[0057] A portion of the air drawn into the rear space R2 of the housing 11 through the air intake port is drawn into the cooling fan 90. The air then passes through the cooling fan 90 and is discharged forward from the air outlet 92 of the cooling fan 90, and is blown onto the upper surfaces 80U of the two LED substrates 80 along the lower surfaces of the recessed portions 19, the front side of which is inclined downward. The air then passes through the upper surfaces 80U (exhaust path 45) of the LED substrates 80 and is exhausted to the outside of the housing 11 through the exhaust port 18.

[0058] Furthermore, a portion of the air drawn into the rear space R2 of the housing 11 through the air intake port flows forward along the inner wall (cover-side peripheral wall 16) of the housing 11, into the front space R1, and is exhausted to the outside of the housing 11 through the exhaust port 18. The outer extension portion 85 of the LED substrate 80 described above extends outward beyond both left-right ends of the partition wall 33, and is cooled by the air that flows from the rear space R2 along the inner wall of the housing 11 into the front space R1.

[0059] The deep ultraviolet irradiation device 10 of the present embodiment described above can be used, for example, for the purpose of sterilizing the passenger compartment (one example of an interior space) of a vehicle such as a taxi. When the deep ultraviolet irradiation device 10 of the present embodiment is attached to the ceiling of the passenger compartment (rear seat) of a vehicle such as a taxi, the two LEDs 88 are tilted at an angle of 15 degrees from the horizontal toward the outside, so that sterilization can be performed by irradiating up to a high position on the side of the vehicle compartment. Such irradiation of deep ultraviolet rays can be performed, for example, in a hangar after operation, or, if a separator with a deep ultraviolet cut film is installed between the front and rear seats, during operation, while waiting for passengers, or while the vehicle is being driven.

[0060] Next, the effects will be described. The deep ultraviolet irradiation device 10 of this embodiment includes an LED substrate 80 having LEDs 88 mounted on a lower surface 80L thereof, and a housing 11 having light-transmitting holes 52 for transmitting light emitted from the LEDs 88 to the outside and accommodating the LED substrate 80 therein. The housing 11 is provided with a heat dissipation member 50 made of aluminum (metal material) and exposed to the inside and outside of the housing 11. The LED substrate 80 is attached in contact with a portion of the heat dissipation member 50 located inside the housing 11.

[0061] According to the above configuration, the heat of the LED substrate 80, which has been heated by the heat generated by the LEDs 88, is easily transferred quickly to the heat dissipation member 50 of the housing 11 and is easily dissipated to the outside, so that the deep ultraviolet irradiation device 10 has excellent heat dissipation properties. Furthermore, by configuring the heat dissipation member 50 to be exposed to the inside and outside of the housing 11, the deep ultraviolet irradiation device 10 can be made thinner and lighter than a conventional configuration in which the heat dissipation member is provided inside the housing.

[0062] The LED substrate 80 is fastened to the heat dissipation member 50 by bolts B (fastening members). With this configuration, the LED substrate 80 can be reliably brought into direct contact with the heat dissipation member 50, thereby improving heat dissipation.

[0063] The LED substrate 80 is accommodated in the housing 11 with its lower surface 80L facing the heat dissipation member 50, and the heat dissipation member 50 has a substrate fastening portion 61 that rises toward the LED substrate 80 and to which a bolt B is fastened, and a standing wall 64 that rises toward the LED substrate 80 and has a contact surface 65 that extends along the lower surface 80L of the LED substrate 80, and when the LED substrate 80 is fastened to the substrate fastening portion 61 by the bolt B, the lower surface 80L of the LED substrate 80 is in contact with the contact surface 65.

[0064] With this configuration, the heat dissipation member 50 made of a metal material is disposed in the portion of the housing 11 that is hit by light emitted from the LEDs 88, thereby preventing deterioration of the housing 11. Furthermore, even if a gap is formed between the LED board 80 and the surface of the heat dissipation member 50 that faces the LED board 80, the LED board 80 and the heat dissipation member 50 are configured to be in contact not only at the fastening portion but also between the underside 80L of the LED board 80 and the contact surface 65 of the standing wall 64, so that the contact area between them can be secured, thereby improving heat dissipation.

[0065] Cooling fans 90 for cooling the LED substrate 80 are housed in the housing 11 in a state of being arranged side by side in a direction along the plate surface of the LED substrate 80, and the upper surface 80U of the LED substrate 80 is located in an exhaust path 45 from an air outlet 92 of the cooling fan 90 to an exhaust outlet 18 provided in the housing 11.

[0066] According to this configuration, the LED substrate 80 and the cooling fan 90 are arranged side by side, and therefore the deep ultraviolet irradiation device 10 can be made thinner than a configuration in which the LED substrate 80 and the cooling fan 90 are arranged so as to overlap each other. Moreover, not only can the heat of the LED substrate 80 be dissipated from the lower surface 80L side by the heat dissipation member 50, but also the LED substrate 80 can be efficiently cooled from the upper surface 80U side by the wind of the cooling fan 90.

[0067] The device includes two LED substrates 80 on which LEDs 88 are mounted, and these two LED substrates 80 extend in directions that intersect with each other. With this configuration, the area of ​​the LED substrates 80 can be increased compared to a configuration in which the LED substrates 80 are arranged flat, thereby improving cooling efficiency. Furthermore, the two LEDs 88 can be arranged to face in different directions. In other words, with the above configuration, the illumination range in the height direction can be expanded compared to a configuration in which the two LEDs 88 face only in one direction.

[0068] An outer extension 85 is provided on the periphery of the LED substrate 80, extending radially outward from the heat dissipation member 50 inside the housing 11. With this configuration, the outer extension 85 functions as a heat dissipation fin, and can dissipate heat from the LED substrate 80.

[0069] The heat dissipation member 50 and the LED substrate 80 are made of aluminum. Because aluminum has high thermal conductivity, this configuration improves cooling efficiency.

[0070] <Other embodiments> The technology disclosed in this specification is not limited to the embodiments described above and illustrated in the drawings, and the following embodiments, for example, are also included in the technical scope.

[0071] (1) In the above embodiment, a heat dissipation section is provided by assembling an aluminum heat dissipation member 50 to a resin housing 11, but the entire housing may be formed from metal, or a metal heat dissipation section may be integrally formed with the housing by insert molding.

[0072] (2) In the above embodiment, the LED substrate 80 is attached to the heat dissipation member 50 by fastening bolt B, but the substrate may also be attached to the heat dissipation portion by adhesive or by pressing it with an elastic member such as a leaf spring.

[0073] (3) In the above embodiment, a configuration was shown in which the mounting surface (lower surface 80L) of the LED substrate 80 was arranged in a direction facing the heat dissipation member 50, but a configuration in which the opposite surface of the substrate faces the heat dissipation section is also included in the technical scope.

[0074] (4) In the above embodiment, the cooling fan 90 is accommodated in the housing 11 in a state where it is arranged horizontally along the surface of the LED board 80, but the cooling fan can also be configured to overlap the board.

[0075] (5) In the above embodiment, a configuration was shown in which two LED substrates 80 were arranged side by side so as to intersect with each other, but the substrates may be a single flat substrate or a single bent substrate.

[0076] (6) In the above embodiment, the deep ultraviolet irradiation device 10 was shown as an example of a light irradiation device, but the technology disclosed in this specification can also be applied to devices that irradiate light other than deep ultraviolet light, such as visible light.

[0077] (7) The light irradiation device is not limited to being installed on the ceiling of a vehicle, but can be installed at any position, such as on a side wall, on a floor, or inside a building.

[0078] (8) In the above embodiment, the LED substrate 80 and the heat dissipation member 50 are made of aluminum, but the substrate and the heat dissipation member may be made of a metal other than aluminum. Also, the substrate may be made of a material other than metal. [Explanation of symbols]

[0079] 10: deep ultraviolet irradiation device (light irradiation device), 11: housing, 12: upper cover (housing), 18: exhaust port, 22: lower cover (housing), 30: holding member, 45: exhaust path, 50: heat dissipation member (heat dissipation portion), 52: light-transmitting hole (light-transmitting portion), 61: board fastening portion (fastening portion), 64: standing wall, 65: upper surface (contact surface), 80: LED board (board), 80L: lower surface (mounting surface), 80U: upper surface (opposite surface), 82: fastening hole, 85: outer extension portion (extension portion), 88: deep ultraviolet LED, 90: cooling fan, 92: air outlet

Claims

1. a substrate having an irradiation element mounted on a mounting surface; a housing having a light-transmitting portion that transmits light emitted from the illumination element to the outside and that accommodates the substrate therein; The housing is provided with a heat dissipation portion made of a metal material and exposed to the inside and outside of the housing, The substrate is attached to a portion of the heat dissipation unit located inside the housing in such a manner that the mounting surface faces and contacts the heat dissipation unit.

2. a substrate having an irradiation element mounted on a mounting surface; a housing having a light-transmitting portion that transmits light emitted from the illumination element to the outside and that accommodates the substrate therein; The housing is provided with a heat dissipation portion made of a metal material and exposed to the inside and outside of the housing, the substrate is attached in contact with a portion of the heat dissipation unit located inside the housing, the substrate is fastened to the heat dissipation portion by a fastening member, the substrate is accommodated in the housing with the mounting surface facing the heat dissipation portion, the heat dissipation portion has a fastening portion that rises toward the board and to which a fastening member is fastened, and a standing wall that rises toward the board and has a contact surface that extends along the mounting surface, A light irradiation device in which, when the substrate is fastened to the fastened portion by the fastening member, the mounting surface is in contact with the contact surface.

3. a substrate having an irradiation element mounted on a mounting surface; a housing having a light-transmitting portion that transmits light emitted from the illumination element to the outside and that accommodates the substrate therein; The housing is provided with a heat dissipation portion made of a metal material and exposed to the inside and outside of the housing, the substrate is attached in contact with a portion of the heat dissipation unit located inside the housing, cooling fans for cooling the board are accommodated in the housing and arranged side by side in a direction along the board surface, The substrate is located in an exhaust path from an air outlet of the cooling fan to an exhaust port provided in the housing.

4. a substrate having an irradiation element mounted on a mounting surface; a housing having a light-transmitting portion that transmits light emitted from the illumination element to the outside and that accommodates the substrate therein; The housing is provided with a heat dissipation portion made of a metal material and exposed to the inside and outside of the housing, the substrate is attached in contact with a portion of the heat dissipation unit located inside the housing, the substrate mounts the first and second illumination elements and includes a first portion that mounts the first illumination element and a second portion that mounts the second illumination element; The light irradiation device, wherein the first portion and the second portion extend in directions intersecting each other.

5. a substrate having an irradiation element mounted on a mounting surface; a housing having a light-transmitting portion that transmits light emitted from the illumination element to the outside and that accommodates the substrate therein; The housing is provided with a heat dissipation portion made of a metal material and exposed to the inside and outside of the housing, the substrate is attached in contact with a portion of the heat dissipation unit located inside the housing, The light irradiation device has an extension provided on the peripheral edge of the substrate, the extension extending outside the heat dissipation unit inside the housing.

6. The light irradiation device according to claim 1 , wherein the heat dissipation portion is made of aluminum.

7. The light irradiation device according to claim 1 , wherein the substrate is made of aluminum.

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