Stage device, substrate processing device, information processing device, information processing method, program, and article manufacturing method

By adjusting movement profiles during non-exposure periods, the stage device optimizes X and Y velocities independently, addressing speed limitations and reducing drive time for improved throughput.

JP7778762B2Active Publication Date: 2025-12-02CANON KK
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Patent Information

Application Number
JP2023182845
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2023-10-24
Publication Date
2025-12-02
Estimated Expiration
2043-10-24

AI Technical Summary

Technical Problem

The stage device is limited by hardware configuration in achieving maximum speed in both orthogonal directions, preventing simultaneous movement at optimal speeds in X and Y axes, thus prolonging drive time.

Method used

A control unit adjusts the movement profile during non-exposure periods by varying the timing and parameters of movement in X and Y directions based on a first parameter related to the longer movement distance, ensuring the combined speed does not exceed the limit, allowing independent optimization of X and Y velocities.

Benefits of technology

This approach reduces drive time and improves throughput by enabling the stage device to operate closer to its maximum speed in both directions, enhancing productivity.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a stage device capable of shortening a driving time.SOLUTION: A stage device has: a movable stage that holds a substrate; and a control unit that controls the movement of the stage on the basis of a drive profile. The drive profile is determined on the basis of a first parameter which is a parameter related to the movement of the stage in a first direction and a second parameter which is a parameter related to the movement of the stage in a second direction determined on the basis of the first parameter. A distance of the movement of the stage in the first direction is longer than a distance of the movement thereof in the second direction.SELECTED DRAWING: Figure 4
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Description

[Technical Field]

[0001] The present invention relates to a stage device, a substrate processing apparatus, an information processing apparatus, an information processing method, a program, and a method for manufacturing an article. [Background technology]

[0002] Stage devices are used to move substrates to desired positions in manufacturing processes for semiconductor devices, liquid crystal display devices, etc. Patent Document 1 describes a method of calculating three target trajectories for the stage to move from the end of exposure to the start of the next exposure, and then using the target trajectory that is feasible and minimizes the stage drive time among the calculated target trajectories. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-216326 Summary of the Invention [Problem to be solved by the invention]

[0004] Here, the stage is driven in two orthogonal directions (X-axis and Y-axis) on the surface holding the substrate to move the substrate to the desired position, but when driven in these two directions simultaneously, the stage speed is the combined speed of the speeds in each of the two directions. The maximum value of this combined speed (speed limit) is determined by the hardware configuration, so this limitation may prevent the stage from being driven at the maximum speed in each of the two directions.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a stage device that can reduce the drive time. [Means for solving the problem]

[0006] In order to achieve the above object, one aspect of the present invention provides a stage device comprising: a stage that can move while holding a substrate; and a control unit that controls movement of the stage during a non-exposure period in which exposure light is not irradiated onto the substrate, based on a drive profile for the non-exposure period; During the non-exposure period, a movement distance of the stage in a first direction is longer than a movement distance in a second direction different from the first direction; The drive profile is The aforementioned a first parameter which is a parameter relating to the moving speed of the stage in a first direction; Record number and a second parameter which is a parameter related to the movement of the stage in two directions, the second parameter being a timing at which the stage starts to move in the second direction, or an acceleration when the stage moves in the second direction, or a maximum speed when the stage moves in the second direction, and the second parameter is determined based on the first parameter and a limit speed of a combined speed of the movement speed of the stage in the first direction and the movement speed of the stage in the second direction. Ruko It is characterized by the following.

[0007] Further objects and other aspects of the present invention will become apparent from the following description of the embodiments with reference to the accompanying drawings. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a stage device that can reduce the drive time. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic view showing a configuration of a substrate processing apparatus according to a first embodiment. [Figure 2] FIG. 1 is a schematic diagram illustrating scanning exposure of a substrate. [Figure 3] FIG. 10 is a diagram showing a conventional driving profile of the substrate stage when the 84th shot area and the 85th shot area are exposed. [Figure 4]FIG. 10 is a diagram showing a drive profile of the substrate stage when the 84th shot area and the 85th shot area are exposed in the first embodiment. [Figure 5] FIG. 4 is a flowchart showing a process for determining a drive profile in the first embodiment. [Figure 6] FIG. 10 is a diagram showing a drive profile of the substrate stage when the 84th shot area and the 85th shot area are exposed in the second embodiment. [Figure 7] FIG. 11 is a diagram showing a drive profile of the substrate stage when the 84th shot area and the 85th shot area are exposed in the third embodiment. [Figure 8] FIG. 10 is a diagram showing a conventional driving profile of a substrate stage when the 87th shot area is moved to a target position and then the 8th shot area is moved. [Figure 9] FIG. 13 is a diagram showing a driving profile of the substrate stage when the 87th shot area is moved to a target position and then the 8th shot area is moved in the fourth embodiment. [Figure 10] FIG. 10 is a flowchart showing a method for manufacturing an article according to a fifth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the following embodiments do not limit the invention according to the claims. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0011] In addition, in this specification and drawings, directions are basically shown using an XYZ coordinate system in which the vertical direction is the Z axis and the horizontal plane perpendicular to the vertical direction is the XY plane, and the axes are mutually orthogonal. However, if an XYZ coordinate system is shown in each drawing, that coordinate system takes precedence.

[0012] Specific configurations of each embodiment will be described below.

[0013] First Embodiment FIG. 1 is a schematic diagram showing the configuration of a substrate processing apparatus 1 according to this embodiment. In this embodiment, the substrate processing apparatus 1 is a projection exposure apparatus that exposes a pattern of an original (mask, reticle) onto a substrate via a projection optical system using a step-and-scan method. However, the substrate processing apparatus 1 is not limited to a projection exposure apparatus. For example, the substrate processing apparatus 1 may be a step-and-repeat projection exposure apparatus. Alternatively, the substrate processing apparatus 1 may be a lithography apparatus that forms a pattern on a substrate by using an electron beam or ion beam. The substrate processing apparatus 1 may also be another lithography apparatus (substrate exposure apparatus), such as an imprint apparatus that forms a pattern on a substrate by molding an imprint material on the substrate using a mold. Alternatively, the substrate processing apparatus 1 may be another apparatus for processing substrates such as semiconductor wafers and glass plates, such as an ion implantation apparatus, a development apparatus, an etching apparatus, a film formation apparatus, an annealing apparatus, a sputtering apparatus, or a deposition apparatus. The substrate processing apparatus 1 may also be a planarization apparatus that flattens a composition on a substrate using a flat plate.

[0014] The substrate processing apparatus 1 includes an illumination optical system 2 that irradiates light, a projection optical system 3, a reticle stage 6 that holds a reticle 4, a substrate stage 7 that can be driven (moved) in the X and Y directions while holding a substrate 5, and a main control unit (information processing unit) 8. Note that the substrate stage 7 may be driven (moved) not only in the X and Y directions but also in the Z direction. Furthermore, the substrate stage 7 may include a six-axis drive system that can be driven in the X-axis direction, the Y-axis direction, the Z-axis direction, and around the X-axis, the Y-axis, and the Z-axis. The substrate stage 7 also includes a stage control unit 9.

[0015] The position of the substrate stage 7 in the Y-axis direction is measured by a bar mirror 10 provided on the substrate stage 7 to extend along the X-axis direction, and a laser interferometer 11. The position of the substrate stage 7 in the X-axis direction is also measured by a bar mirror (not shown) provided on the substrate stage 7 to extend along the Y-axis direction, and a laser interferometer (not shown). Note that multiple laser interferometers 11 for measuring the position of the substrate stage 7 in the Y-axis direction and multiple laser interferometers for measuring the position of the substrate stage 7 in the X-axis direction may be provided. With this configuration, it is possible to measure not only the positions of the substrate stage 7 in the X-axis direction and the Y-axis direction, but also the amounts of deviation in the rotational directions around the X-axis, the Y-axis, and the Z-axis. Note that although an example in which the position of the substrate stage 7 is measured by an interferometer system has been shown in this embodiment, the position of the substrate stage 7 may also be measured by other means, such as an encoder.

[0016] The position of the reticle stage 6 in the Y-axis direction is measured by a bar mirror 12 that is provided on the reticle stage 6 to extend along the X-axis direction, and a laser interferometer 13. In addition, the position of the reticle stage 6 in the X-axis direction is measured by a bar mirror (not shown) that is provided on the reticle stage 6 to extend along the Y-axis direction, and a laser interferometer (not shown).

[0017] The reticle 4 is, for example, an original plate on which a pattern to be transferred (e.g., a circuit pattern) is formed with chromium on the surface of quartz glass. The substrate 5 is, for example, single-crystal silicon. If the substrate processing apparatus 1 is an exposure apparatus, the substrate 5 transported to the substrate processing apparatus 1 has a photosensitive material (resist) coated on its surface. Here, the illumination optical system 2 is a pattern forming unit that forms a pattern on the substrate 5. Note that in this embodiment, an example of a lithography apparatus is shown in which a pattern is formed using light, and the pattern forming unit is the illumination optical system 2. However, the lithography apparatus may also be one that uses heat to harden a thermosetting material onto which a pattern has been transferred. In this case, the pattern forming unit is, for example, a heating unit that heats the thermosetting material. The part of the substrate processing apparatus 1 that processes the substrate is a substrate processing unit. For example, if the substrate processing apparatus 1 is a projection exposure apparatus, the illumination optical system and the projection optical system are included in the substrate processing unit. If the substrate processing apparatus 1 is an imprint apparatus or a planarization apparatus, the illumination optical system and the heating unit for hardening the imprint material or composition are included in the substrate processing unit.

[0018] The main control unit 8 controls each part within the substrate processing apparatus 1, and the stage control unit 9 controls the driving (movement) of the substrate stage 7. The main control unit 8 is also an information processing device that adjusts (determines) the driving profile of the substrate stage 7 using a method described below. The main control unit 8 transmits the adjusted (determined) driving profile to the stage control unit 9. The stage control unit 9 controls the driving (movement) of the substrate stage 7 based on the driving profile transmitted from the main control unit 8 and the position of the substrate stage 7 obtained by the bar mirror and laser interferometer described above, and moves the substrate 5 to the desired position.

[0019] The main control unit 8 and the stage control unit 9 include a processing unit, a bus, a ROM, a RAM, and a storage device, and each component functions according to a program. The processing unit is a processing device that performs control calculations according to the program and controls each component connected to the bus. The processing unit can be configured as a CPU, a PLD such as an FPGA, an ASIC, a computer with a built-in program, or a combination of all or part of these. The ROM is a memory for reading data only and stores programs and data. The RAM is a memory for reading and writing data and is used to store programs and data. The RAM is used for temporary storage of data such as the results of CPU calculations. The storage device is also used to store programs and data. The storage device is also used as a temporary storage area for the operating system (OS) programs and data of the main control unit 8 and the stage control unit 9. The storage device has slower data input / output speed than RAM, but is capable of storing large amounts of data. The storage device is preferably a non-volatile storage device that can store data as permanent data so that the data can be referenced for a long period of time. The storage device is mainly composed of a magnetic storage device (HDD), but may also be a device that reads and writes data by loading external media such as CDs, DVDs, and memory cards.

[0020] In the substrate processing apparatus 1, exposure light from a light source (not shown) passes through an illumination optical system 2 and illuminates a reticle 4 held on a reticle stage 6. The light that passes through the reticle 4 passes through a projection optical system 3 and is irradiated onto a substrate 5. At this time, light from a pattern formed on the reticle 4 forms an image on the surface of the substrate 5, and the substrate 5 (photosensitive material) is exposed to the pattern image. The substrate processing apparatus 1 exposes a shot area on the substrate 5 in this way, and performs similar exposure on each of the multiple shot areas.

[0021] Fig. 2 is a schematic diagram when scanning and exposing a substrate 5. Fig. 2(a) shows the shot layout of multiple shot areas on the substrate 5, and in this embodiment, 98 shot areas are provided on the substrate 5. The numbers in each shot area indicate the order in which each shot area is scanned and exposed, and the multiple shot areas on the substrate 5 are scanned and exposed in order as shown by the dotted lines. The arrows written in each shot area indicate the direction in which each shot area is scanned and exposed.

[0022] FIG. 2(b) shows an example of the trajectory of the position of the projection optical system 3 relative to the substrate stage 7 when a shot area is exposed. In this embodiment, the Y-axis direction is the scanning direction. In reality, scanning exposure is performed by changing the relative position of the projection optical system 3 and the substrate stage 7 as the substrate stage 7 moves relative to the fixed projection optical system 3. However, for convenience of explanation, the trajectory of the position of the projection optical system 3 relative to the substrate stage 7 will be described. FIG. 2(b) shows the 84th and 85th shot areas to be exposed among the shot areas shown in FIG. 2(a). First, exposure of the 84th shot area starts from position A, and exposure of the 84th shot area ends when the projection optical system 3 reaches position B. Then, to expose the 85th shot area, the substrate stage 7 moves in the +X direction and then in the -Y direction, and the projection optical system 3 reaches position C. Then, the substrate stage 7 moves in the -Y direction so that the projection optical system 3 reaches position D, at which the velocity of the substrate stage 7 is 0. Next, as the substrate stage 7 moves in the +Y direction, the projection optical system 3 reaches position E, which is the exposure start position for the 85th shot area, and starts exposure of the 85th shot area from position E. As the substrate stage 7 moves in the +Y direction, the projection optical system 3 reaches position F, which is the exposure end position for the 85th shot area.

[0023] The 85th shot area is positioned differently in the Y-axis direction (scanning direction) on the substrate from the 84th shot area, and the movement of the substrate stage 7 between shot areas with such a positional relationship is sometimes referred to as "starting a new line." When starting a new line, the movement distance of the substrate stage 7 in the Y-axis direction is particularly longer than the movement distance of the substrate stage 7 in the X-axis direction, as shown in Figure 2(b).

[0024] Fig. 3 is a diagram showing a conventional drive profile of the substrate stage 7 when the 84th shot area and the 85th shot area are exposed. The upper graph in Fig. 3 shows the drive speed of the substrate stage 7 in the X-axis direction (hereinafter sometimes referred to as X speed), and the middle graph shows the drive speed of the substrate stage 7 in the Y-axis direction (hereinafter sometimes referred to as Y speed). The lower graph shows the drive speed of the substrate stage 7 obtained by combining the drive speed of the substrate stage 7 in the X-axis direction and the drive speed of the substrate stage 7 in the Y-axis direction (hereinafter sometimes referred to as combined speed). Note that in this embodiment, the drive speed of the substrate stage 7 is sometimes referred to as the movement speed of the substrate stage 7.

[0025] Using the example of Figure 3, between positions A and B, scanning exposure is in progress and there is no movement in the X-axis direction, so the X velocity is 0, and the Y velocity is a constant -Vy. When the projection optical system 3 reaches position B, the X velocity begins to increase and continues to increase until it reaches Vx. Meanwhile, the Y velocity remains -Vy. Then, by position C, the X velocity decreases from Vx to 0, completing movement in the X-axis direction. Furthermore, between positions C and D, the Y velocity approaches 0, and at position D, the Y velocity is 0. Next, between positions D and E, movement in the X-axis direction is complete, so the X velocity is 0, and the Y velocity increases to Vy. Then, between positions E and F, scanning exposure is in progress and there is no movement in the X-axis direction, so the X velocity is 0, and the Y velocity is a constant Vy.

[0026] The maximum combined speed of the substrate stage 7 (hereinafter sometimes referred to as the limiting speed) is determined by the hardware configuration. This limiting speed is the maximum speed within the allowable range at which the substrate stage 7 can perform normal operations multiple times without any problems. In other words, the limiting speed of the combined speed is the limit value of the combined speed. For example, the substrate stage 7 may include a coarse movement stage and a fine movement stage that moves together with the coarse movement stage without contact with the coarse movement stage using an electromagnetic actuator or the like. In this case, the limiting speed of the combined speed is defined, for example, as the limiting speed at which a fine movement stage without a brake mechanism will not collide with the coarse movement stage even when the coarse movement stage stops at the limiting speed. In other words, the limiting speed of the combined speed is defined as the limiting speed at which a collision between the coarse movement stage and the fine movement stage can be prevented by an electromagnetic actuator. Alternatively, the limiting speed of the combined speed is defined as the limiting speed at which components included in the substrate stage 7 (e.g., a fine movement top plate) will not be damaged if they collide with a shock absorber (impact absorbing device) or the like, provided that the combined speed is below the limiting speed. In addition, the limit speed of the combined speed may be determined based on the specifications of the drive mechanism (e.g., linear motor) included in the substrate stage 7. The limit speed of the combined speed may also be variable. For example, the limit speed of the combined speed may be determined depending on the drive direction or drive start position of the substrate stage 7.

[0027] The main control unit 8 determines the X velocity and Y velocity so that the combined velocity is equal to or less than the limit velocity Vmax, and determines the drive profile of the substrate stage 7. In other words, the main control unit 8 determines the X velocity (Vx) and Y velocity (Vy) so that the formula (1) is satisfied, and determines the drive profile of the substrate stage 7.

[0028]

number

[0029] 3, the timing when the absolute value of the X velocity is maximum (Vx) and the timing when the absolute value of the Y velocity is maximum (-Vy) overlap, so the X velocity and the Y velocity are mutually limited. Furthermore, if the Y velocity is limited (the Y velocity becomes slower), the drive time of the substrate stage 7 becomes longer, and throughput (productivity) decreases.

[0030] Therefore, in this embodiment, the substrate stage 7 determines (adjusts) the timing of movement in the X-axis direction during the non-exposure period. This makes the timing at which the absolute value of the X velocity becomes maximum and the timing at which the absolute value of the Y velocity becomes maximum different from each other, reducing the mutual limitation of the X velocity and the Y velocity. This makes it possible to improve the Y velocity and shorten the drive time of the substrate stage 7. Note that in this embodiment, the parameter in the X-axis direction is determined based on the Y velocity in the Y-axis direction, but the other parameter may be determined based on the velocity in the direction in which the movement distance of the substrate stage 7 is long, in other words, the direction that is likely to be rate-determining. Note that in this embodiment, time may be referred to as timing.

[0031] 4 is a diagram showing the drive profile of the substrate stage 7 when exposing the 84th shot area and the 85th shot area in this embodiment. The upper graph in FIG. 4 shows the X velocity of the substrate stage 7, and the middle graph shows the Y velocity of the substrate stage 7. The lower graph shows the combined velocity of the substrate stage 7.

[0032] In this embodiment, the timing at which the substrate stage 7 starts moving in the X-axis direction is shifted by time t3. Specifically, the timing at which the substrate stage 7 starts moving in the X-axis direction is determined (adjusted) based on the first parameter (Y velocity). This prevents the timing at which the absolute value of the X velocity becomes maximum from overlapping with the timing at which the absolute value of the Y velocity becomes maximum, thereby improving the Y velocity.

[0033] The main control unit 8 first determines ±V2y, which is the Y speed that satisfies the desired throughput and production conditions (for example, the scanning speed in exposure), as the Y speed (first parameter). This determination is made based on, for example, the shot layout, the order in which multiple shot areas are exposed, and the specifications of the product to be manufactured. The Y speed (first parameter) may also be set by the user through an input device (not shown). The absolute value of this ±V2y can be set to a value greater than the absolute value of the conventional ±Vy, and is, for example, a value that satisfies equation (2). |±V y |<|±V2 y |···Formula (2)

[0034] Next, the main control unit 8 calculates the X velocities ±V2x that satisfy the formulas (3) and (4) based on the determined Y velocities ±V2y. |±V x |>|±V2 x |···Formula (3)

[0035]

number

[0036] Next, the main control unit 8 calculates the time t1 required for the substrate stage 7 to reach the calculated X velocity ±V2x after it starts moving in the X-axis direction. Then, using equation (5), it calculates time t3 (second parameter) from the time t1 and the time t2 from the end of exposure of the previous shot until the Y velocity changes from -V2y (maximum velocity) (the time during which the absolute value of the Y velocity remains maximum after the end of exposure of the previous shot). t3=t2-t1...Equation (5)

[0037] The main control unit 8 determines a drive profile in which the timing at which the substrate stage 7 starts moving in the X-axis direction is shifted by the calculated time t3. As a result, the absolute value of the X velocity becomes maximum (|±V x |) and the absolute value of the Y velocity is maximum (|±V2 y Therefore, the maximum value of the absolute value of the Y velocity in this embodiment (|±V2y |) is the maximum absolute value of the conventional Y velocity (|±V y |), which can improve throughput.

[0038] FIG. 5 is a flowchart showing the process of determining a drive profile in this embodiment. The main controller 8 determines a second parameter, which is a parameter related to the movement of the substrate stage 7 in a second direction (X-axis direction), based on a first parameter, which is a parameter related to the movement of the substrate stage 7 in a first direction (Y-axis direction) (S110, first determination step). Here, the movement distance of the substrate stage 7 in the first direction is longer than the movement distance in the second direction. The movement distance in each direction can be determined based on the shot layout, the order in which multiple shot areas are exposed, and the like. The first determination step in this embodiment is a step of determining the time t3 at which movement in the X-axis direction, which is the second parameter, starts, based on the Y velocity, which is the first parameter. Next, the main controller 8 determines a drive profile for controlling the movement of the substrate stage 7 based on the first parameter and the second parameter determined in the first determination step (S120, second determination step). In other words, the drive profile is determined based on the first parameter and the second parameter determined in the first determination step. Then, the main control unit 8 transmits the drive profile determined in the second determination step to the stage control unit 9 (S130, transmission step). Note that determining a drive profile includes both generating a drive profile and adjusting the drive profile. Steps S110 to S130 are an information processing method executed by the main control unit (information processing device) 8 in accordance with a program stored inside.

[0039] In this embodiment, the driving profile of the substrate stage 7 when the 84th shot area and the 85th shot area are exposed has been described as an example, but it can also be applied to other shot areas.

[0040] When delaying the timing to start movement in the X-axis direction, it is preferable to consider the relationship between the time when movement in the X-axis direction ends and the time when exposure of the next shot area begins. First, movement in the X-axis direction must be completed by the time when exposure of the next shot area begins. Furthermore, if the time when movement in the X-axis direction ends is too close to the time when exposure of the next shot area begins, the exposure accuracy of the next shot area may deteriorate due to the effects of vibrations caused by movement, etc. It is preferable to determine the time t3 by which the timing to start movement in the X-axis direction is shifted, taking these factors into consideration.

[0041] In the present embodiment, an example has been shown in which the main control unit 8 determines the drive profile of the substrate stage 7 as an information processing device, but the drive profile may also be determined by the stage control unit 9, or by an information processing device external to the substrate processing apparatus 1. If the stage control unit 9 determines the drive profile, the transmission step does not need to be performed. If an information processing device external to the substrate processing apparatus 1 determines the drive profile, the drive profile determined in the second determination step may be transmitted from the information processing device to the stage control unit 9 in the transmission step, or may be transmitted to the main control unit 8 that controls the substrate processing apparatus 1.

[0042] In this embodiment, an example has been shown in which a second parameter is determined based on a first parameter, and a drive profile is determined. This drive profile may include a first drive profile used to control movement of the substrate stage 7 in the Y-axis direction (first direction), and a second drive profile used to control movement of the substrate stage 7 in the X-axis direction (second direction). In other words, drive profiles may be managed and determined separately for each direction. In this case, the drive profile in the Y-axis direction (first drive profile) is determined based on the first parameter, and the drive profile in the X-axis direction (second drive profile) is determined based on the second parameter.

[0043] In the present embodiment, the description has focused on an example in which a drive profile is determined. However, a drive profile stored in a storage device may also be adjusted. For example, if a storage device (storage unit) stores a first drive profile and a second drive profile, the second drive profile stored in the storage device may be adjusted based on a second parameter. Furthermore, instead of adjusting the second drive profile, the first drive profile may be adjusted based on the first and second parameters. This adjustment may be performed multiple times. Furthermore, in the present embodiment, the drive of the substrate stage 7 in the X-axis direction is determined based on the drive of the substrate stage 7 in the Y-axis direction. However, if the movement distance of the substrate stage 7 in the X-axis direction is longer than the movement distance of the substrate stage 7 in the Y-axis direction, the drive of the substrate stage 7 in the Y-axis direction may be determined (adjusted) based on the drive of the substrate stage 7 in the X-axis direction.

[0044] In other words, the adjustment in this embodiment involves adjusting at least one of the first drive profile and the second drive profile based on a combined speed obtained by combining the movement speed of the substrate stage 7 in the first direction and the movement speed of the substrate stage 7 in the second direction. Specifically, the timing at which the substrate stage 7 starts moving is adjusted in at least one of the first drive profile and the second drive profile. The movement speed of the substrate stage 7 in the first direction can be obtained from the first drive profile, and the movement speed of the substrate stage 7 in the second direction can be obtained from the second drive profile.

[0045] In addition, in this embodiment, an example has been shown in which the maximum Y speed during the exposure period is the same as the maximum Y speed during the non-exposure period, but the maximum Y speed during the exposure period may be different from the maximum Y speed during the non-exposure period. For example, during the exposure period, the Y speed (scanning speed) may be based on the specifications of the product (chip, etc.) to be manufactured, and during the non-exposure period, the Y speed may be faster than the scanning speed in order to improve throughput.

[0046] In this embodiment, the time (second parameter) at which the substrate stage 7 starts moving in the X-axis direction (second direction), whose moving distance is shorter than that in the Y-axis direction, is determined based on the moving speed (Y speed, first parameter) of the substrate stage 7 in the Y-axis direction (first direction). As a result, the absolute value of the X speed is maximized (|±V x |) and the timing when the absolute value of the Y velocity is maximum (|±V2 y Therefore, the driving time of the substrate stage 7 is shorter than before, and throughput (productivity) can be improved.

[0047] Second Embodiment This embodiment differs from the first embodiment in the method of determining (adjusting) the drive profile so that the timing at which the absolute value of the X velocity becomes maximum and the timing at which the absolute value of the Y velocity becomes maximum do not overlap. In this embodiment, the acceleration of the movement of the substrate stage 7 in the X-axis direction during the non-exposure period is changed so that the timing at which the absolute value of the X velocity becomes maximum and the timing at which the absolute value of the Y velocity becomes maximum are made different from each other.

[0048] FIG. 6 is a diagram showing the drive profile of the substrate stage 7 when the 84th shot area and the 85th shot area are exposed in this embodiment.

[0049] The main control unit 8 calculates the X velocity ±V2x based on the determined Y velocity (first parameter), as in the first embodiment. In this embodiment, the time t2 from the end of exposure of the previous shot until the Y velocity changes from -V2y (the time during which the absolute value of the Y velocity remains at its maximum after the end of exposure of the previous shot) and the time t2 from the end of exposure of the previous shot until the absolute value of the X velocity becomes |±V2 x Specifically, the absolute value of the X velocity is |±V2 x The acceleration (second parameter) when changing to | is made small so that the X velocity increases gradually. This allows the absolute value of the X velocity to be at most |±V x | and the absolute value of the Y velocity is maximum (|±V2 yTherefore, the maximum value of the absolute value of the Y velocity in this embodiment (|±V2 y |) is the maximum absolute value of the conventional Y velocity (|±V y |), which can improve throughput.

[0050] In this embodiment, as in the first embodiment, when the movement distance of the substrate stage 7 in the X-axis direction is longer than the movement distance of the substrate stage 7 in the Y-axis direction, the drive of the substrate stage 7 in the Y-axis direction may be determined (adjusted) based on the drive of the substrate stage 7 in the X-axis direction. In other words, in the adjustment of this embodiment, as in the first embodiment, at least one of the first drive profile and the second drive profile is adjusted based on a combined speed that combines the movement speed of the substrate stage 7 in the first direction and the movement speed of the substrate stage 7 in the second direction. Specifically, the acceleration of the substrate stage 7 is adjusted in at least one of the first drive profile and the second drive profile.

[0051] In this embodiment, the driving profile of the substrate stage 7 when exposing the 84th shot area and the 85th shot area has been described as an example, but it can also be applied to other shot areas. Furthermore, the determination (adjustment) of the acceleration in the X-axis direction in this embodiment and the determination (adjustment) of the timing to start movement in the X-axis direction in the first embodiment may be performed together.

[0052] <Third embodiment> This embodiment differs from the first and second embodiments in the method of determining (adjusting) the drive profile. Fig. 7 is a diagram showing the drive profile of the substrate stage 7 when the 84th shot area and the 85th shot area are exposed in this embodiment.

[0053] The main control unit 8 calculates the X velocity ±V2x (second parameter) based on the determined Y velocity (first parameter), as in the first embodiment. In this embodiment, the absolute value of the maximum X velocity during the non-exposure period is calculated as |±V2 xThis allows the Y velocity to be set to the maximum absolute value of the conventional Y velocity (|±V y The maximum absolute value of the Y velocity (|±2V y |), which can improve throughput.

[0054] The absolute value of the maximum X speed is |±V2 x When setting | (when reducing the absolute value of the maximum X speed), it is preferable to consider the relationship between the time when movement in the X axis direction ends and the time when exposure of the next shot area begins. First, movement in the X axis direction must be completed by the time when exposure of the next shot area begins. Also, if the time when movement in the X axis direction ends is too close to the time when exposure of the next shot area begins, there is a possibility that the exposure accuracy of the next shot area will deteriorate due to the effects of vibrations caused by movement. Taking these things into consideration, the absolute value of the maximum X speed, |±V2 x |It is recommended to decide.

[0055] In this embodiment, the maximum X velocity is +V2x, but the maximum absolute value of the Y velocity (|±V2 y If it is necessary to move further in the X-axis direction at the timing when | is no longer the case, the X speed may be increased from +V2x to an extent that does not affect the Y speed.

[0056] In this embodiment, as in the first embodiment, when the movement distance of the substrate stage 7 in the X-axis direction is longer than the movement distance of the substrate stage 7 in the Y-axis direction, the drive of the substrate stage 7 in the Y-axis direction may be determined (adjusted) based on the drive of the substrate stage 7 in the X-axis direction. In other words, in the adjustment of this embodiment, as in the first embodiment, at least one of the first drive profile and the second drive profile is adjusted based on a combined speed that combines the movement speed of the substrate stage 7 in the first direction and the movement speed of the substrate stage 7 in the second direction. Specifically, the maximum speed (in a predetermined direction) of the substrate stage 7 is adjusted in at least one of the first drive profile and the second drive profile.

[0057] This embodiment may be implemented in combination with either or both of the first and second embodiments. That is, in at least one of the first and second drive profiles, at least one of the timing at which the substrate stage 7 moves, the acceleration of the substrate stage 7, and the maximum speed of the substrate stage is adjusted.

[0058] In this embodiment, the driving profile of the substrate stage 7 when the 84th shot area and the 85th shot area are exposed has been described as an example, but it can also be applied to other shot areas.

[0059] <Fourth embodiment> This embodiment differs from the previously described embodiment in the method of determining (adjusting) the drive profile. For example, in order to detect each of the alignment marks formed in multiple sample shot areas, the substrate stage 7 may continuously move each of two shot areas located at discrete positions to a target position (e.g., alignment mark detection position). To give a specific example, let us assume that the 87th shot area and the 8th shot area are sample shot areas among the multiple shot areas on the substrate 5 shown in FIG. 2(a). In this case, the substrate stage 7 first moves so that the 87th shot area moves to the target position, and the alignment mark of the 87th shot area is detected. Next, the substrate stage 7 moves so that the 8th shot area moves to the target position, and the alignment mark of the 87th shot area is detected.

[0060] FIG. 8 is a diagram showing a conventional driving profile of the substrate stage 7 when the 87th shot area is moved to the target position and then the 8th shot area is moved. 8 shows the X velocity of the substrate stage 7, and the middle graph shows the Y velocity of the substrate stage 7. The bottom graph shows the combined velocity of the substrate stage 7.

[0061] As shown in Figure 8, conventionally, movement in the X-axis direction and movement in the Y-axis direction started simultaneously, so the X and Y velocities were mutually limited. The main control unit 8 calculated the X velocity Vx and Y velocity Vy that satisfied equation (1), and the stage control unit 9 controlled the movement of the substrate stage 7 at a constant velocity of Vx in the X-axis direction and at a constant velocity of Vy in the Y-axis direction. As a result, the substrate stage 7 was moved at X and Y velocities that were mutually limited, which resulted in a long drive time for the substrate stage 7.

[0062] 9 is a diagram showing the drive profile of the substrate stage 7 when the 87th shot area is moved to the target position and then the 8th shot area is moved in this embodiment. The upper graph in FIG. 9 shows the X velocity of the substrate stage 7, and the middle graph shows the Y velocity of the substrate stage 7. The lower graph shows the combined velocity of the substrate stage 7.

[0063] When moving the substrate stage 7 from a state in which the 87th shot area is at the target position to a state in which the 8th shot area is at the target position, the main control unit 8 determines a drive profile so that the substrate stage 7 initially moves only in the Y-axis direction with the Y velocity set to the limit velocity Vmax. The main control unit 8 then determines a drive profile so that the X velocity increases from the timing (first parameter) at which the Y velocity changes from the limit velocity Vmax (maximum velocity) and the X velocity reaches the limit velocity Vmax when the Y velocity becomes 0. In other words, the main control unit 8 determines a drive profile so that the timing (second parameter) at which the substrate stage 7 starts moving in the X-axis direction is shifted to time t4, which is the timing at which the Y velocity changes from the limit velocity Vmax. In other words, the main control unit 8 determines (adjusts) the timing at which the substrate stage 7 starts moving in the X-axis direction (second parameter) based on the first parameter.

[0064] By determining the drive profile in this way, the X speed and Y speed are not restricted by each other, and each can be set to the limit speed Vmax, thereby shortening the drive time of the substrate stage 7.

[0065] In this embodiment, the drive profile of the substrate stage 7 when moving the 87th shot area to a target position and then moving the 8th shot area is described as an example, but it can also be applied to other shot areas. Also, in this embodiment, an example is shown in which the substrate stage 7 is first driven in the Y-axis direction and then in the X-axis direction, and a parameter in the X-axis direction is determined based on a parameter in the Y-axis direction. However, the other parameter can be determined based on the speed in the direction in which the substrate stage 7 moves the longest distance, in other words, the direction that is likely to be rate-determining, and is not particularly limited to the example of this embodiment.

[0066] Similar to the first embodiment, this embodiment may also be realized by adjusting the drive profile stored in the storage unit. In other words, this adjustment involves adjusting at least one of the first drive profile and the second drive profile based on a combined speed obtained by combining the movement speed of the substrate stage 7 in the first direction and the movement speed of the substrate stage 7 in the second direction.

[0067] Fifth Embodiment This embodiment is characterized in that the substrate stage 7 is moved according to the drive profile described above to manufacture an article.

[0068] 10 is a flowchart of a method for manufacturing an article according to this embodiment. The main control unit (information processing device) 8 determines a second parameter, which is a parameter related to the movement of the substrate stage 7 in a second direction, based on a first parameter, which is a parameter related to the movement of the substrate stage 7 in a first direction (S210, first determination step). Here, the movement distance of the substrate stage 7 in the first direction is longer than the movement distance in the second direction. Next, the main control unit 8 determines a drive profile for controlling the movement of the substrate stage 7 based on the first parameter and the second parameter determined in the first determination step (S220, second determination step). Then, a formation step (S230) is performed in which a pattern is formed on a substrate while controlling the movement of the substrate stage 7 that holds the substrate based on the drive profile determined in the second determination step. Next, a manufacturing step (S240) is performed in which an article is manufactured from the substrate on which the pattern has been formed in the formation step.

[0069] Products manufactured by this manufacturing method include, for example, semiconductor IC elements, liquid crystal display elements, color filters, MEMS, and the like.

[0070] In the forming step, for example, a substrate (silicon wafer, glass plate, etc.) coated with a photosensitive material is exposed by an exposure apparatus (lithography apparatus) to form a pattern on the substrate.

[0071] The manufacturing process includes, for example, developing a substrate (photosensitive material) on which a pattern has been formed, etching the developed substrate, removing the resist, dicing, bonding, and packaging. This manufacturing method enables the manufacture of articles with a higher throughput than conventional methods.

[0072] The disclosure of this specification includes the following stage apparatus, substrate processing apparatus, information processing apparatus, information processing method, program, and method for manufacturing an article.

[0073] [Item 1] a stage that can hold and move the substrate; a control unit that controls the movement of the stage based on a drive profile, the drive profile is determined based on a first parameter which is a parameter related to movement of the stage in a first direction, and a second parameter which is a parameter related to movement of the stage in a second direction determined based on the first parameter; The moving distance of the stage in the first direction is longer than the moving distance in the second direction. A stage apparatus characterized by:

[0074] [Item 2] 2. The stage device according to item 1, wherein the second parameter is determined based on the first parameter and a limit speed of a combined speed of the movement speed of the stage in the first direction and the movement speed of the stage in the second direction.

[0075] [Item 3] 3. The stage device according to item 1 or 2, wherein the first parameter is a speed at which the stage moves in the first direction, and the second parameter is a time at which the stage starts moving in the second direction, or an acceleration at which the stage moves in the second direction, or a maximum speed at which the stage moves in the second direction.

[0076] [Item 4] 3. The stage device according to item 1 or 2, characterized in that the first parameter is the time at which the speed of movement of the stage in the first direction changes from a maximum speed, and the second parameter is the time at which the stage starts moving in the second direction.

[0077] [Item 5] The stage device described in any one of items 1 to 4, characterized in that the speed at which the stage moves in the first direction and the speed at which the stage moves in the second direction reach their maximum speeds at different times.

[0078] [Item 6] 6. The stage device according to any one of items 1 to 5, wherein the first direction is a scanning direction when scanning exposure is performed on the substrate, and the second direction is a direction perpendicular to the first direction.

[0079] [Item 7] the drive profile includes a first drive profile used to control movement of the stage in the first direction and a second drive profile used to control movement of the stage in the second direction; 7. The stage device according to any one of items 1 to 6, wherein the first drive profile is determined based on the first parameter, and the second drive profile is determined based on the second parameter.

[0080] [Item 8] a storage unit that stores a second drive profile used to control the movement of the stage in the second direction; 8. The stage device according to any one of items 1 to 7, wherein the second drive profile stored in the storage unit is adjusted based on the second parameter.

[0081] [Item 9] the storage unit stores a first drive profile used to control movement of the stage in the first direction; 9. The stage apparatus according to item 8, wherein the first drive profile is adjusted based on the first parameter and the second parameter.

[0082] [Item 10] 10. The stage device according to any one of items 1 to 9, wherein the drive profile is used to control movement of the stage during a non-exposure period.

[0083] [Item 11] 11. The stage device according to any one of items 1 to 10, wherein the drive profile is used when the stage moves between shot areas that are different in position in the scanning direction of the stage.

[0084] [Item 12] a stage capable of holding and driving a substrate; a control unit that controls the driving of the stage based on a driving profile, the drive profile includes a first drive profile used to drive the stage in a first direction and a second drive profile used to drive the stage in a second direction; the control unit controls driving of the stage using the drive profile obtained by adjusting at least one of the first drive profile and the second drive profile based on a combined speed of the movement speed of the stage in the first direction and the movement speed of the stage in the second direction. A stage apparatus characterized by:

[0085] [Item 13] Item 13. The stage device described in item 12, wherein the drive profile is such that at least one of the time when the stage starts moving, the acceleration of the stage, and the maximum speed of the stage is adjusted in at least one of the first drive profile and the second drive profile.

[0086] [Item 14] a stage that can hold and move the substrate; a control unit that controls the movement of the stage based on a drive profile; a substrate processing unit that processes the substrate held by the stage; and the drive profile is determined based on a first parameter which is a parameter related to movement of the stage in a first direction, and a second parameter which is a parameter related to movement of the stage in a second direction determined based on the first parameter; The moving distance of the stage in the first direction is longer than the moving distance in the second direction. A substrate processing apparatus characterized by:

[0087] [Item 15] an information processing unit that determines a drive profile used to control the movement of a movable stage that holds a substrate; The information processing unit determining, based on a first parameter that is a parameter related to movement of the stage in a first direction, a second parameter that is a parameter related to movement of the stage in a second direction having a movement distance shorter than the movement distance in the first direction; determining the drive profile based on the first parameter and the second parameter; 1. An information processing device comprising:

[0088] [Item 16] 1. An information processing method for determining a drive profile used to control movement of a movable stage holding a substrate, comprising: a first determination step of determining, based on a first parameter that is a parameter related to movement of the stage in a first direction, a second parameter that is a parameter related to movement of the stage in a second direction whose movement distance is shorter than the movement distance in the first direction; a second determination step of determining the drive profile based on the first parameter and the second parameter; a transmitting step of transmitting the drive profile determined in the second determining step. An information processing method comprising:

[0089] [Item 17] Item 17. A program for causing a computer to execute the information processing method according to Item 16.

[0090] [Item 18] a first determination step of determining, based on a first parameter that is a parameter related to movement of a stage that is movable while holding a substrate in a first direction, a second parameter that is a parameter related to movement of the stage in a second direction that is shorter than the movement distance in the first direction; a second determination step of determining a drive profile used to control the movement of the stage based on the first parameter and the second parameter; a forming step of forming a pattern on the substrate held by the stage while controlling the movement of the stage based on the drive profile determined in the second determination step; a manufacturing process for manufacturing an article from the substrate on which the pattern has been formed in the forming process, A method for manufacturing an article.

[0091] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention.

Claims

1. a stage that can hold and move the substrate; a control unit that controls movement of the stage during a non-exposure period based on a drive profile for the non-exposure period in which the substrate is not irradiated with exposure light, During the non-exposure period, a movement distance of the stage in a first direction is longer than a movement distance in a second direction different from the first direction; the drive profile is determined based on a first parameter which is a parameter related to a moving speed of the stage in the first direction, and a second parameter which is a parameter related to the movement of the stage in the second direction determined based on the first parameter; the second parameter is a timing at which the stage starts moving in the second direction, an acceleration when the stage moves in the second direction, or a maximum speed when the stage moves in the second direction, the second parameter is determined based on the first parameter and a limit speed of a combined speed of the moving speed of the stage in the first direction and the moving speed of the stage in the second direction. A stage apparatus characterized by:

2. 2. The stage device according to claim 1, wherein the stage is a stage that is moved by a linear motor.

3. 2. The stage device according to claim 1, wherein the first parameter is the time at which the speed of movement of the stage in the first direction changes from a maximum speed, and the second parameter is the timing at which the stage starts moving in the second direction.

4. 2. The stage device according to claim 1, wherein the speed at which the stage moves in the first direction and the speed at which the stage moves in the second direction reach their maximum speeds at different times.

5. 2. A stage device according to claim 1, wherein the first direction is a scanning direction when scanning exposure is performed on the substrate, and the second direction is a direction perpendicular to the first direction.

6. the drive profile includes a first drive profile used to control movement of the stage in the first direction and a second drive profile used to control movement of the stage in the second direction; 2. The stage apparatus according to claim 1, wherein the first drive profile is determined based on the first parameter, and the second drive profile is determined based on the second parameter.

7. a storage unit that stores a second drive profile used to control the movement of the stage in the second direction; 2. The stage apparatus according to claim 1, wherein the second drive profile stored in the storage unit is adjusted based on the second parameter.

8. the storage unit stores a first drive profile used to control movement of the stage in the first direction; 8. The stage apparatus according to claim 7, wherein the first drive profile is adjusted based on the first parameter and the second parameter.

9. 2. The stage device according to claim 1, wherein the non-exposure period is a period between a first shot area where exposure is performed and a second shot area where exposure is performed after the first shot area.

10. 2. The stage device according to claim 1, wherein the drive profile is used when the stage moves between shot areas that are different in position in the scanning direction of the stage.

11. a stage that can hold and move the substrate; a control unit that controls movement of the stage during a non-exposure period based on a drive profile for the non-exposure period during which the substrate is not irradiated with exposure light; a substrate processing unit that processes the substrate held by the stage; and During the non-exposure period, a movement distance of the stage in a first direction is longer than a movement distance in a second direction different from the first direction; the drive profile is determined based on a first parameter which is a parameter related to a moving speed of the stage in the first direction, and a second parameter which is a parameter related to the movement of the stage in the second direction determined based on the first parameter; the second parameter is a timing at which the stage starts moving in the second direction, an acceleration when the stage moves in the second direction, or a maximum speed when the stage moves in the second direction, the second parameter is determined based on the first parameter and a limit speed of a combined speed of the moving speed of the stage in the first direction and the moving speed of the stage in the second direction. An exposure apparatus characterized by:

12. an information processing unit that determines a drive profile used to control the movement of a movable stage that holds a substrate; during a non-exposure period in which the substrate is not irradiated with exposure light, a movement distance of the stage in a first direction is longer than a movement distance in a second direction different from the first direction; The information processing unit determining a second parameter that is a parameter related to the movement of the stage in the second direction based on a first parameter that is a parameter related to the movement speed of the stage in the first direction; the second parameter is a timing at which the stage starts moving in the second direction, an acceleration when the stage moves in the second direction, or a maximum speed when the stage moves in the second direction, the second parameter is determined based on the first parameter and a limit speed of a combined speed of the moving speed of the stage in the first direction and the moving speed of the stage in the second direction; determining the drive profile for the non-exposure period based on the first parameter and the second parameter; 1. An information processing device comprising:

13. 1. An information processing method for determining a drive profile used to control movement of a movable stage holding a substrate, comprising: during a non-exposure period in which the substrate is not irradiated with exposure light, a movement distance of the stage in a first direction is longer than a movement distance in a second direction different from the first direction; a first determination step of determining a second parameter, which is a parameter related to the movement of the stage in the second direction, based on a first parameter, which is a parameter related to the movement speed of the stage in the first direction; a second determination step of determining the drive profile for the non-exposure period based on the first parameter and the second parameter; a transmitting step of transmitting the drive profile determined in the second determining step, the second parameter is a timing at which the stage starts moving in the second direction, an acceleration when the stage moves in the second direction, or a maximum speed when the stage moves in the second direction, the second parameter is determined based on the first parameter and a limit speed of a combined speed of the moving speed of the stage in the first direction and the moving speed of the stage in the second direction. An information processing method comprising:

14. A program for causing a computer to execute the information processing method according to claim 13.

15. A method for manufacturing an article by controlling movement of a movable stage that holds a substrate, the method comprising: during a non-exposure period in which the substrate is not irradiated with exposure light, a movement distance of the stage in a first direction is longer than a movement distance in a second direction different from the first direction; a first determination step of determining a second parameter, which is a parameter related to the movement of the stage in the second direction, based on a first parameter, which is a parameter related to the movement speed of the stage in the first direction; a second determination step of determining a drive profile to be used for controlling movement of the stage during the non-exposure period based on the first parameter and the second parameter; a forming step of forming a pattern on the substrate held by the stage while controlling the movement of the stage based on the drive profile determined in the second determining step; a manufacturing step of manufacturing an article from the substrate on which the pattern has been formed in the forming step, the second parameter is a timing at which the stage starts moving in the second direction, an acceleration when the stage moves in the second direction, or a maximum speed when the stage moves in the second direction, the second parameter is determined based on the first parameter and a limit speed of a combined speed of the moving speed of the stage in the first direction and the moving speed of the stage in the second direction. A method for manufacturing an article.

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