Dual interface card and manufacturing method thereof

Abstract

To improve reliability of electrical connection between an IC module and an antenna of a dual interface card and mechanical connection between the IC module and a card body, to improve manufacturing efficiency.SOLUTION: A dual interface card 1 includes a card body 2, an antenna 8 having a plurality of ends 81, 82 and an IC module 7 having an IC chip and a plurality of terminals 73a, 73b. The IC module 7 is arranged in a recess 9 of the card body 2 so that the terminals and the ends are electrically connected to each other. The ends each have a repeated folding structure with an antenna line 83 from a circumference of the recess 9 toward the center, which is exposed partially. The recess 9 includes a first recess 91, a second recess 92a, and a third recess 93 formed on the center. The ends 81 are exposed in the second recess 92a. The second recess 92a is deeper than the first recess 91. The third recess 93 is deeper than the second recess 92a.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a dual interface card capable of contact and non-contact communication with an external device. [Background technology]

[0002] Conventional IC cards include contact IC cards, which input and output electrical signals through an external connection terminal on the card surface, and contactless IC cards, which input and output electrical signals via an antenna using electromagnetic induction or other methods. In addition to these, dual-interface cards, which combine the functions of both contact and contactless IC cards with a single IC chip, are also in use. Dual-interface cards can be used as contact IC cards, which are effective in preventing external leakage of input and output data during financial transactions, and as highly convenient contactless IC cards, which allow data to be exchanged in close proximity when entering and exiting a room or using a ticket gate at a station. For this reason, dual-interface cards are becoming increasingly popular in the market.

[0003] A dual interface card is manufactured as follows. First, as described in Patent Document 1, a card substrate including one or more core sheets is formed, and an area for embedding an IC module is cut from the surface of the card substrate. The IC module is then embedded in the area. Conductive wires are arranged on one of the one or more core sheets, and the conductive wires form a wound antenna for providing the contactless communication function and contact terminals that are in electrical contact with terminals of the IC module. The contact terminals are, for example, arranged in a meandering shape.

[0004] Here, the intended embedding area is cut to include a first recess, a second recess, and a contact opening in the first recess. The first recess is for accommodating the substrate portion of the IC module and is cut to a depth that does not expose the contact terminals of the conductors present inside the card substrate. The second recess is for accommodating the sealing portion of the IC module and is cut to a depth that penetrates the contact terminals of the conductors present inside the card substrate. Meanwhile, the contact opening in the first recess is cut deeper than the first recess until the contact terminals are exposed. By filling the contact opening with a conductive adhesive, the contact terminals are electrically connected to terminals on the back side of the substrate portion of the IC module via the conductive adhesive. Furthermore, by adhering adhesive tape to the back side of the substrate portion of the IC module, the IC module is fixed in the first recess of the intended embedding area. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2019-219732 Summary of the Invention [Problem to be solved by the invention]

[0006] To improve the efficiency of dual interface card manufacturing, it is desirable to use the same adhesive material for both the electrical connection between the IC module and the antenna and the mechanical connection between the IC module and the card base. However, depending on the material and properties of the adhesive layer, the adhesive conditions required for achieving the electrical connection between the IC module and the antenna often differ from the adhesive conditions required for achieving the mechanical connection between the IC module and the card base. In particular, the distance between non-adhered parts is thought to have a significant impact on adhesive strength.

[0007] The present disclosure has been made in consideration of these circumstances, and aims to provide a dual interface card and a method for manufacturing the same that improve the reliability of both the electrical connection between the IC module and the antenna and the mechanical connection between the IC module and the card base, thereby achieving efficient manufacturing. [Means for solving the problem]

[0008] According to this embodiment, a dual interface card capable of contact communication and contactless communication with an external device comprises a card base, an antenna having multiple ends disposed inside the card base, and an IC module having an IC chip and multiple terminals electrically connected to the IC chip. The IC module is disposed in a recess provided in the card base so that the opposing terminals and the multiple ends are electrically connected to each other. The multiple ends are formed by a repeated folding structure from the outer periphery of the recess toward the center by an antenna wire constituting the antenna, and a portion of the folding structure is exposed in the recess. The recess is composed of a first recess that includes a portion of the outer periphery and is separated from each other, a second recess that includes another portion of the outer periphery and is separated from each other, and a third recess that is adjacent to all of the first recess and the second recess and is formed more centrally than these, and at least a portion of the multiple ends is exposed in the second recess. The second recess is formed deeper than the first recess, and the third recess is formed deeper than the second recess.

[0009] In addition, in a dual interface card according to another embodiment of the present invention, the second recess may continuously expose a repeated folding structure from the outer periphery of the recess toward the center, formed by the antenna wires that constitute the antennas at the multiple ends.

[0010] In addition, in a dual interface card according to another embodiment of the present invention, the first recess may have at least the bent portion of the folded structure of the antenna overlapping the repeated folded structure of the antenna wires constituting the antennas at the multiple ends from the outer periphery of the recess toward the center without being exposed, and the second recess may have portions other than the bent portion exposed.

[0011] In a dual interface card according to another embodiment of the present invention, the IC module may have the plurality of terminals and the plurality of end portions that face each other electrically connected to each other via an anisotropic conductive film.

[0012] In a dual interface card according to another embodiment of the present invention, the anisotropic conductive film may be disposed so as to overlap the first recess and the second recess.

[0013] In addition, in a dual interface card according to another embodiment of the present invention, the outer periphery may be a substantially rectangular shape having sides that are substantially parallel to the short and long sides of the card base, and the multiple ends may be configured by a repeated folding structure extending from the outer periphery, which is a side of the recess that is substantially parallel to the short sides of the card base, toward the center by an antenna wire that constitutes the antenna.

[0014] In a dual interface card according to another embodiment of the present invention, a portion of the antenna other than the bent portion of the folded structure may be inclined with respect to a straight line along the outer periphery.

[0015] In addition, in a dual interface card according to another embodiment of the present invention, the recess may include a portion of the outer periphery and further include a fourth recess adjacent to the third recess, the fourth recess being deeper than the first recess and shallower than the third recess, and a convex portion of a smaller area than the fourth recess may be formed on the surface of the IC module facing the fourth recess.

[0016] According to another embodiment of the present invention, a method for manufacturing a dual interface card capable of contact communication and contactless communication with an external device includes an antenna forming step of embedding an antenna wire in a first substrate while applying heat and pressure to form an antenna having a plurality of ends on one surface of the first substrate, a laminating step of laminating a second substrate on the first substrate on which the antenna has been formed so as to sandwich the antenna, a punching step of punching the laminate of the first substrate and the second substrate into a card-sized card base, a recess forming step of forming a recess in the card base for embedding an IC module, an IC module preparing step of preparing an IC module having an IC chip and a plurality of terminals electrically connected to the IC chip, and a card forming step of punching the plurality of terminals and the plurality of ends facing each other. and an IC module bonding process of bonding the IC module to the recess of the card base via a conductive adhesive layer so that the IC module is electrically connected to the recess, and the multiple ends are formed by a repeated folding structure from the outer periphery of the recess toward the center by an antenna wire that constitutes the antenna, and a portion of the folding structure is exposed in the recess, and the recess is composed of a first recess that includes a portion of the outer periphery and is separated from each other, a second recess that includes another portion of the outer periphery and is separated from each other, and a third recess that is adjacent to all of the first recess and the second recess and is formed more centrally than these, and at least a portion of the multiple ends is exposed in the second recess, and the second recess is formed deeper than the first recess and the third recess is formed deeper than the second recess. [Effects of the Invention]

[0017] According to this embodiment, it is possible to provide a dual interface card and a manufacturing method thereof that improves the reliability of both the electrical connection between the IC module and the antenna and the mechanical connection between the IC module and the card base, thereby achieving efficient manufacturing. [Brief explanation of the drawings]

[0018] [Figure 1] FIG. 2 is a plan view illustrating the structure of the dual interface card according to the first embodiment. [Figure 2] FIG. 2 is a cross-sectional view showing a cross section taken along line AA in FIG. [Figure 3] FIG. 2 is a cross-sectional view showing a cross section taken along line BB in FIG. [Figure 4] 1A and 1B are diagrams illustrating an IC module and a connection between the IC module and an antenna. [Figure 5] FIG. 1(b) is a plan view illustrating the structure of a dual interface card according to a second embodiment of the present invention. [Figure 6] 6 is a cross-sectional view taken along line DD in FIG. 5, corresponding to FIG. 3. FIG. [Figure 7] FIG. 1(b) is a plan view illustrating the structure of a dual interface card according to a third embodiment of the present invention. [Figure 8] FIG. 1(b) is a plan view illustrating the structure of a dual interface card according to a fourth embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0019] An example of a dual interface card according to the present disclosure will be described below with reference to the drawings, etc. However, the dual interface card according to the present disclosure is not limited to the embodiments and examples described below.

[0020] The figures shown below are schematic illustrations. Therefore, the size and shape of each part are appropriately exaggerated to facilitate understanding. Furthermore, hatching indicating the cross section of a member is omitted as appropriate in each figure. The numerical values ​​such as dimensions of each member and the names of materials described in this specification are examples of embodiments and are not limited to these, and may be selected and used as appropriate. In this specification, terms specifying shapes or geometric conditions, such as parallel, orthogonal, and perpendicular, are intended to include not only their strict meanings but also substantially the same state.

[0021] 1. First embodiment An example of a first embodiment of a dual interface card according to the present disclosure will now be described. For ease of explanation, an XYZ coordinate system will be established for the dual interface card 1. First, as shown in FIGS. 1(a) and 2(b), the Z axis is defined as the normal direction to the main surface of the dual interface card 1. The direction from the main surface on which the external connection terminals 71 of the IC module 7 are not arranged to the main surface on which the external connection terminals 71 are arranged is defined as the +Z direction or upward in the thickness direction, and the opposite direction is defined as the -Z direction or downward in the thickness direction.

[0022] When dual interface card 1 is viewed from the +Z direction, the line perpendicular to both short sides of dual interface card 1 and the Z axis is defined as the X axis, the direction from one short side closer to external connection terminal 71 toward the other short side is defined as the +X direction or rightward direction, and the opposite direction is defined as the -X direction or leftward direction. Furthermore, the axis perpendicular to the X and Z axes is defined as the Y axis, the direction from one long side farther from external connection terminal 71 toward the other long side is defined as the +Y direction or upward direction, and the opposite direction is defined as the -Y direction or downward direction.

[0023] FIG. 1(a) is a plan view of the dual interface card 1 as viewed from the +Z direction, and FIG. 1(b) is an enlarged view of the dual interface card 1 of FIG. 1(a) near the external connection terminal 71 to explain the arrangement of the antenna 8. To facilitate understanding of the configuration of the antenna 8, the IC module 7 is removed. FIG. 2(a) is a cross-sectional view of the dual interface card 1 of FIG. 1(b) taken along line AA as viewed from the -Y direction. FIG. 2(a) is a view without the IC module 7, and FIG. 2(b) is a view of the dual interface card 1 of FIG. 2(a) with the IC module 7 installed. FIG. 3(a) is a cross-sectional view of the dual interface card 1 of FIG. 1(b) taken along line BB as viewed from the -X direction. FIG. 3(a) is a view without the IC module 7, and FIG. 3(b) is a view of the dual interface card 1 of FIG. 3(a) with the IC module 7 installed.

[0024] As shown in FIG. 1(a), dual interface card 1 has the form of a generally rectangular thin plate with rounded corners when viewed from the +Z direction. Furthermore, on the surface of the dual interface card on the +Z direction side, an IC module 7 including external connection terminals 71 can be seen slightly to the upper left of the center, i.e., toward the -X direction and toward the +Y direction from the center. As shown in FIGS. 2(a) and 2(b), IC module 7 is embedded in a recess 9 formed in card base 2, and is positioned so that the surface of external connection terminals 71 on the +Z direction side is generally flush with the surface of card base 2 on the +Z direction side. This form of dual interface card 1 complies with ISO / IEC 7816, the international IC card standard.

[0025] As shown in Figure 2(a), the card base 2 that constitutes the card body of the dual interface card 1 is formed by laminating and integrating, in order from the -Z direction, an over-sheet layer 6, a core layer 5, a core layer 4, and an over-sheet layer 3. Typically, the over-sheet layers 6 and 3 are transparent substrates, and the core layers 5 and 4 are white substrates, but this is not limited thereto. In addition, an antenna wire 83 that constitutes the antenna 8 is disposed between the core layers 5 and 4 so as to be sandwiched between them.

[0026] The antenna wire 83 constituting the antenna 8 is partially exposed in a region of the bottom surface 92p of the second recess 92a, which is formed relatively shallow within the recess 9, and is completely buried inside the card base 2 in the rest of the region. In other words, the antenna wire 83 is buried inside the card base 2, but in the process of cutting the card base 2 to form the recess 9, a portion of the antenna wire 83 is cut along with the recess 9 to an extent that does not cause breakage, and the cut surface of the antenna wire 83 is exposed at the bottom surface 92p of the second recess 92a. The recess 9 further includes a first recess 91 formed along the outer periphery 97 side and shallower than the second recess 92a, and a third recess 93 formed closer to the center of the recess 9 than the second recess 92a and deeper than the second recess 92a.

[0027] As shown in FIG. 2( b), the IC module 7 is embedded such that the external connection terminals 71 and the substrate 72 supporting the external connection terminals 71 are placed on the bottom surface 92p of the second recess 92a of the recess 9, and the substrate 72 is mechanically joined to the bottom surface 92p of the second recess 92a of the card base 2 via a conductive adhesive layer 11. Incidentally, the third recess 93 houses an IC chip body 74, which is a protruding portion of the IC module 7. Furthermore, a terminal 73a electrically connected to an IC chip provided inside the IC module 7 is provided on the surface of the substrate 72 opposite the external connection terminals 71. At this time, due to the effect of heat and pressure when embedding the IC module 7 in the recess 9 of the card base 2, the antenna wire 83 exposed on the bottom surface 92p and the terminal 73a are electrically connected via the conductive adhesive layer 11.

[0028] Here, both ends of the antenna wire 83 of the antenna 8, which is mostly embedded inside the card base 2 and partially exposed from the second recesses 92a and 92b, have shapes as shown by the first end 81 and the second end 82 in FIG. 1(b). The first end 81 and the second end 82 are arranged in parallel on the left and right sides along the X axis, sandwiching the third recess 93 located at the center of the recess 9. The first end 81 and the second end 82, which are both ends of the antenna 8, are each configured by the antenna wire 83 repeatedly folding back from the outer periphery 97 of the second recesses 92a and 92b toward the center of the recess 9. In other words, the first end 81 and the second end 82 are formed to have a structure known as a zigzag, meander, or bellows shape. In this way, by increasing the exposed area of ​​the antenna wire 83 per unit area exposed in the recess 9, the reliability of the electrical connection between the terminal 73a of the IC module 7 and the antenna 8 can be improved.

[0029] Furthermore, among the regions where the first end 81 and the second end 82 are disposed, the first exposed portion 86 and the second exposed portion 87, which are regions where the antenna wire 83 is exposed toward the +Z direction, are formed within the ranges of the second recesses 92a and 92b of the recess 9, respectively. Furthermore, the first recess 91, which is separated on the +Y direction side and the −Y direction side, is formed in the portion of the recess 9 excluding the third recess 93 and the second recesses 92a and 92b. Here, the second recesses 92a and 92b have approximately the same depth, and each is formed deeper than the first recess 91. For ease of understanding, in FIG. 1(b), the region of the first recess 91 is represented by a horizontal line pattern, and the regions of the second recesses 92a and 92b are represented by a dotted pattern. This also applies to FIGS. 5, 7(a), and 8(a), which will be described later.

[0030] 3(a) and 3(b), the recess 9 of the card base 2 has two recesses of different depths, a first recess 91 and second recesses 92a and 92b, at the location where the substrate 72 of the IC module 7 is embedded. Therefore, the distance of the gap between the substrate 72 and the card base 2 varies depending on the location, and as a result, the thickness of the conductive adhesive layer 11 sandwiched between them after bonding varies. That is, the depth of the recess 9 of the card base 2 facing the region of the substrate 72 where the terminal 73a is formed differs from the depth of the recess 9 of the card base 2 facing the region separated from the terminal 73a in the X direction. The second recess 92a faces the former region, and the first recess 91, which is shallower than the second recess 92a, faces the latter region.

[0031] Here, the terminals 73a are layers formed of copper foil or the like with a predetermined thickness, and therefore extend a predetermined thickness further in the same direction from the surface on the -Z direction side of the substrate 72. Therefore, the depth of the second recess 92a is determined so that when the IC module 7 is pressed against the card base 2 by applying heat and pressure, the distance between the terminals 73a via the conductive adhesive layer 11 and the antenna wire 83 exposed at the bottom surface 92p of the second recess 92a falls within an appropriate range. In other words, good conduction between the terminals 73a and the antenna wire 83 can be obtained at that distance.

[0032] However, in the region of the substrate 72 that is spaced apart from the terminal 73a along the Y-axis direction, even if the gap between the substrate 72 and the card body 2 is the above-mentioned distance, it is not necessarily possible to achieve a good mechanical connection between the IC module 7 and the card body 2. In other words, the gap conditions for achieving a good electrical connection between the terminal 73a and the antenna wire 83 and the gap conditions for achieving a good mechanical connection between the IC module 7 and the card body 2 are generally different.

[0033] In contrast, in this embodiment, in a region of the substrate 72 spaced from the terminal 73a along the Y-axis, the depth of the recess 9 in the card base 2 is changed so that the gap between the substrate 72 and the card base 2 improves the adhesive strength between the IC module 7 and the card base 2 and improves the mechanical connection between them. Specifically, the recess 9 in this region is a first recess 91 that is shallower than the second recess 92a. This is because the depth of the second recess 92a is determined in consideration of the electrical connection between the terminal 73a extending from the substrate 72 in the -Z direction and the antenna wire 83. Therefore, if the depth of the recess 9 in the card base 2 is the same as that of the second recess 92a in a region where the terminal 73a is not present, the gap between the substrate 72 and the card base 2 would be too long, and the conductive adhesive layer 11 would not be sufficiently compressed, resulting in an insufficient adhesive strength.

[0034] Therefore, the dual interface card 1 of this embodiment can improve the reliability of both the electrical connection between the IC module 7 and the antenna 8 and the mechanical connection between the IC module 7 and the card base 2. Specifically, for the same conductive adhesive layer 11, the depth of the second recesses 92a and 92b, which improve the electrical connection between the IC module 7 and the antenna 8, is different from the depth of the first recess 91, which improves the mechanical connection between the IC module 7 and the card base 2. That is, the second recesses 92a and 92b are formed deeper than the first recess 91. Furthermore, by configuring the first recess 91 and the second recesses 92a and 92b in this manner, the electrical connection between the IC module 7 and the antenna 8 and the mechanical connection between the IC module 7 and the card base 2 can be achieved using the same conductive adhesive layer 11. This improves the efficiency of manufacturing the dual interface card 1.

[0035] The configuration of the dual interface card 1 of this embodiment and the manufacturing method thereof will be described in detail below.

[0036] (a) Card base The card base 2 refers to the card body excluding the IC module 7 that constitutes the dual interface card 1. As described above, the card base 2 typically has a configuration in which an over-sheet layer 6, a core layer 5, a core layer 4, and an over-sheet layer 3 are laminated in this order from one end of the card base 2 in the -Z direction in the thickness direction. Between the core layers 5 and 4, an antenna 8 wound in a loop shape and formed from a coated conductor wire or the like is disposed. The card base 2 may refer to both the card before the recess 9 is formed and the card after the recess 9 is formed, and may refer to both the card without the antenna 8 and the card with the antenna 8. The first end 81 and the second end 82, which are either the starting point or the ending point of the antenna 8, are formed by processing the antenna wire 83 into a predetermined shape, as described above.

[0037] However, the layer configuration of the card base 2 is not limited to this, and may be a three-layer configuration of an over-sheet layer, a core layer, and an over-sheet layer, a two-layer configuration of a core layer and a core layer, or a five-layer configuration of an over-sheet layer, a core layer, a core layer with an antenna formed thereon, a core layer, and an over-sheet layer, etc. Furthermore, printing or an embedded magnetic stripe may be applied to the surface of the over-sheet layer 3 or 6 of the card base 2 opposite to the core layer 4 or 5, or printing may be applied to the surface of the core layer 4 or 5 adjacent to the over-sheet layer 3 or 6.

[0038] From the standpoint of conforming to standards such as ISO / IEC 7816, the thickness of the card base 2 is preferably 0.76 mm or more and 0.84 mm or less, but may be outside this range.

[0039] (i) Core layer A wide variety of white or colored plastic sheets can be used for the core layers 4 and 5, including the following single films or composite films: polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, polystyrene, ABS, polyacrylic ester, polypropylene, polyethylene, polyurethane, etc. The thickness of the core sheet can be selected appropriately taking into account the overall thickness of the card, but can be, for example, approximately 0.25 mm or more and 0.38 mm or less. As described below, antenna 8 must be positioned on the surface of either core layer 4 or 5 so that it is sandwiched between the two core layers.

[0040] (ii) Oversheet layer The over-sheet layers 3 and 6 are usually made of the same material as the core layer, but are often made of a transparent material with a thickness of about 0.05 mm to 0.10 mm. From the viewpoint of preventing curling when the laminate of the core layer and the over-sheet layer is integrated by heat pressing or the like, it is preferable that the over-sheet layers 3 and 6 have the same thickness, but they do not necessarily have to be the same.

[0041] The material for the over-sheet layer may be any material that is adhesive when heated, but even if the over-sheet layer itself is not adhesive when heated, the core layer and over-sheet layer can be integrated by additionally forming a layer of a known adhesive that generates adhesive force when heated between them. Furthermore, when dual interface card 1 is used as a magnetic card, magnetic tape may be embedded in advance by thermal transfer or the like into one or both of over-sheet layers 3 and 6 on the main surface opposite core layers 4 and 5.

[0042] (iii) Antenna sheet In this embodiment, as will be described later, an antenna 8 is formed on one surface of the core layer 5, and a first end 81 and a second end 82, which are ends of an antenna wire 83 that constitute the antenna 8, are each processed into a predetermined shape and arranged. The formation of the antenna 8 on the core layer 5 is performed by applying a predetermined heat and pressure to the antenna wire 83, thereby embedding the antenna wire 83 in the core layer 5 while melting the core layer 5 and the coating of the antenna wire 83. The intermediate product in which the antenna 8 is embedded in the core layer 5 is sometimes referred to as an antenna sheet 12. The antenna sheet 12 can be distributed on the market by itself as a component for manufacturing the dual interface card 1, or a commercial model in which a sheet material such as the core layer 5 is supplied to a processor, who processes it into an antenna sheet 12 and delivers it to the supplier.

[0043] The method for forming the antenna sheet 12 will be described in detail later, but can be summarized as follows: First, a coated conductor coated with an insulating member is embedded into the surface of the core layer 5 using a wire winding machine, starting from either the first end 81 or the second end 82 and ending at the other. That is, while applying a predetermined heat and pressure to the core layer 5, an antenna supply head is drawn into a loop shape as shown in FIG. 1(a), and the antenna wire 83 supplied from the antenna supply head is sequentially embedded into the core layer 5.

[0044] Here, the first end 81 and the second end 82, which are either the start point or the end point of the antenna wire 83, are aligned in the left-right direction of the intended mounting position of the IC module 7 to form a predetermined shape described below, and are arranged so that parts of them overlap with the terminals 73a and 73b of the IC module 7. Then, the winding forming machine cuts the antenna wire 83 after forming either the first end 81 or the second end 82, which are the end points of the antenna 8. In this way, the antenna sheet 12 is completed.

[0045] (iv) Antenna Terminals 73a and 73b of the IC module 7 are electrically connected to a first end 81 and a second end 82 of the antenna 8 formed on the core layer 5, respectively, so that the IC chip of the IC module 7 and the antenna 8 form a communication circuit for contactless communication. The communication circuit may be one that performs close-proximity communication using, for example, the 13.56 MHz HF frequency band specified in ISO / IEC 18092 or ISO / IEC 144443. Alternatively, the communication circuit may be one that performs communication using other frequency bands, such as the 920 MHz UHF frequency band, the 125 kHz LF frequency band, or the 2.45 GHz microwave frequency band.

[0046] When dual interface card 1 is held over an external device such as a reader / writer, a current is generated in the communication circuit due to the magnetic field generated by the reader / writer, and power is supplied to the IC chip. This enables the IC chip to be driven, enabling contactless transmission and reception of information with the reader / writer and reading and rewriting of information from the memory.

[0047] The antenna wire 83 constituting the antenna 8 is typically formed of a coated conductor wire in which the periphery of a copper wire is coated with an insulating material. Alternatively, copper alloy wires such as Cu-Ni, Cu-Cr, Cu-Zn, Cu-Sn, and Cu-Be, or various metal wires and metal alloy wires such as iron, stainless steel, and aluminum can also be selected. By using coated conductor wire, the dual interface card 1 can be manufactured more inexpensively than, for example, copper foil etching methods. .

[0048] The diameter of the antenna wire 83 is not particularly limited as long as it can ensure the characteristics as a contactless communication circuit, but it can be, for example, 0.03 mm or more and 0.30 mm or less, and preferably 0.05 mm or more and 0.15 mm or less. By setting the diameter in the latter range, durability against heat pressure during embedding and external forces due to cutting can be improved, and good communication characteristics can be ensured.

[0049] Next, the configurations of the first end 81 and the second end 82 will be described in detail. In FIG. 1(b), one end of the antenna wire 83 extending from the -X direction toward the +X direction subsequently forms the first end 81, which has a structure that is repeatedly folded back from the outer periphery 97 toward the center, near the -X direction side of the third recess 93 of the recess 9. Similarly, one end of the antenna wire 83 extending from the +X direction toward the -X direction subsequently forms the second end 82, which has a structure that is repeatedly folded back from the outer periphery 97 toward the center, near the +X direction side of the recess 9. The antenna wire 83 extends so that the folded structure is repeated multiple times.

[0050] The folded structure has substantially arc-shaped bent portions at the ends on the +Y direction side and the -Y direction side, i.e., the upper and lower ends, and the portion other than the bent portion connecting the bent portion at the upper end and the bent portion at the lower end is substantially straight or curved. However, from the viewpoint of the efficiency of the process of embedding the antenna wire 83 in the core layer 5 and the saving of material for the antenna wire 83, it is preferable to form the portion other than the bent portion as substantially straight as possible.

[0051] In this embodiment, the outer periphery 97 is a substantially rectangular shape with sides substantially parallel to the short and long sides of the card body 2. The first end 81 and the second end 82 are formed by a structure in which the antenna wire 83 constituting the antenna 8 repeatedly folds back from sides 97a and 97b of the outer periphery 97, which are sides of the recess 9 substantially parallel to the short sides of the card body 2, toward the center.

[0052] Furthermore, the portion of first end 81 other than the bent portion of the folded structure extends along a straight line parallel to the Y axis along side 97a of outer periphery 97 of recess 9, and the center-to-center distance of zigzag-shaped antenna wires 83 between adjacent portions other than the bent portions, i.e., the pitch, is substantially constant. Furthermore, the width of the entire first end 81 and first exposed portion 86 in the direction along the Y axis is W12, and the width of the exposed portion of antenna wire 83 in the direction along the X axis is substantially the same as the width of second recess 92a, so that the antenna wires are arranged along the outline of a rectangle. The distance from the end on the +Y direction side to the end on the -Y direction side of the folded structure, i.e., the length from the upper end to the lower end, is substantially the same length.

[0053] In this embodiment, the first exposed portion 86 of the first end 81, which is the region where the antenna wire 83 is actually exposed from the card base 2, includes a continuous section of the antenna wire 83 extending from the −X-direction end of the second recess 92a to the +X-direction end of the second recess 92a. That is, the entire antenna wire 83, including both the bent portion of the folded structure and the remaining portion, is exposed in the second recess 92a. The conductor is not covered by the card base 2 or a covering material, and the width W11 of the second recess 92a along the Y-axis is longer than the width W12 of the first end 81 along the Y-axis. The above description of the first end also applies to the second end 82 by replacing the side 97a of the recess 9 with the side 97b, the second recess 92a with the side 92b, and the first exposed portion 86 with the second exposed portion 87, respectively.

[0054] The pitch of the antenna wire 83 described above depends on factors such as the capacity of the winding machine and the quality of the antenna sheet 12 after the antenna wire 83 is embedded in the core layer 5, but is preferably 0.50 mm or less, and more preferably 0.25 mm or less. When the pitch is in the former range, the exposed area of ​​the antenna wire 83 per unit area at the first end 81 can be increased, and the area of ​​electrical connection with the terminal 73a of the IC module 7 can be expanded. This improves the reliability of the electrical connection and reduces the electrical resistance of the contact area between the antenna wire 83 and the terminal 73a. Furthermore, when the pitch is in the latter range, the above-mentioned effects can be further enhanced.

[0055] In this embodiment, the +X direction end of the region of first end 81 along the X axis is located approximately at the boundary between second recess 92a and third recess 93, and the -X direction end is located closer to the -X direction than the end of second recess 92a, which is the outer periphery 97 of recess 9. In this way, when the +X direction end of first end 81 is located approximately at the boundary between second recess 92a and third recess 93 or located closer to the -X direction than the boundary, it is possible to not cut antenna wire 83 when cutting third recess 93, or to reduce the amount of cutting of antenna wire 83. This makes it possible to suppress branching of antenna wire 83, i.e., the occurrence of whiskers, which are more likely to occur as cutting depth increases.

[0056] Furthermore, the -X direction end of the region of first end 81 along the X direction is located closer to the -X direction than the end of second recess 92a, which is the outer periphery 97 of recess 9. This ensures that the densely packed region of antenna wire 83 remains uninterrupted even if there is a misalignment of antenna 8 with respect to core layer 5 or a misalignment of the formation position of recess 9. This ensures a reliable electrical connection with terminal 73a of IC module 7. However, the +X direction end of the region of first end 81 along the X direction may be located closer to the +X direction than the boundary between the second recess 92a and third recess 93, or the -X direction end may be located closer to the +X direction than the end of second recess 92a, which is the outer periphery 97 of recess 9.

[0057] The above description is about the relationship between the first end 81 of the antenna 8 and the terminal 73a of the IC module 7 that is electrically connected thereto, but the same relationship also holds between the second end 82 and the terminal 73b that is electrically connected thereto. Also, in this embodiment, the description is based on the premise that the antenna 8 has two ends, the first end 81 and the second end 82, for electrically connecting with the IC module 7, but the antenna 8 may have three or more ends, and the IC module 7 may have the same number of corresponding terminals.

[0058] (b) IC module Next, each of the main components of the IC module 7 will be described mainly with reference to FIGS. 2(b) and 4. FIG. 4(a) is a view of the external connection terminal 71 of the IC module 7 viewed from the +Z direction, similar to FIG. 1(a). FIG. 4(b) is a view of the IC module 7 viewed from the -Z direction, opposite to FIG. 4(a). Most of the molded portion 74b of the IC chip body 74 is omitted here to allow a see-through view of the interior. FIG. 4(c) is an enlarged cross-sectional view of portion C near the terminal 73a in FIG. 2(b).

[0059] The IC module 7 is embedded in a recess 9 formed in the card base 2, and terminals 73a and 73b of the IC module 7 are electrically connected to a first end 81 and a second end 82 of the antenna 8, respectively, thereby forming a communication circuit for contactless communication. Furthermore, contact communication with a contact-type reader / writer or the like can be performed through an external connection terminal 71 provided on the IC module 7.

[0060] Substrate 72 is formed by bonding copper foil to the front and back of a flexible resin film, such as glass epoxy resin or polyimide resin, with an adhesive, and leaving the copper foil on the front and back of the resin film so as to form a predetermined pattern. Specifically, a photosensitive material is applied, a film plate with a predetermined pattern is placed, exposed, and the non-photosensitive portion is etched away to form external connection terminal 71 on one copper foil surface of the resin film and terminals 73a and 73b on the other copper foil surface. This sequential process forms substrate 72, with copper foil remaining in the predetermined pattern on the front and back of the resin film. Substrate 72 also has a plurality of bonding holes 76, which are through-holes for wire bonding to external connection terminal 71, pre-formed in the substrate.

[0061] There is no particular limit to the thickness of the substrate 72, but taking into consideration that it can follow the bending of the card base 2 to some extent, it can be, for example, 0.03 mm or more and 0.50 mm or less, and preferably 0.07 mm or more and 0.20 mm or less.

[0062] As shown in Fig. 4(a), the external connection terminal 71 has sections defined for the external terminal as defined by the ISO / IEC 7816-2 standard. As shown in Fig. 4(b), these sections are connected to the IC chip 74a by wires 75 such as gold wires through the bonding holes 76 provided in the substrate 72. Similarly, the terminals 73a and 73b are connected to the IC chip 74a by wires 75. These bonding holes 76 and wires 75 are covered and protected by the molded portion 74b.

[0063] An IC chip body 74 is disposed on the surface of the substrate 72 opposite to the surface on which the external connection terminals 71 are formed. The IC chip body 74 is composed of an IC chip 74a adhered and fixed to the substrate 72 with an adhesive, bonding wires 75 for connection, and a molded portion 74b made of sealing resin for protecting these. The IC chip 74a includes a CPU for controlling both contact and contactless communication operations, storage devices such as RAM, ROM, EEPROM, and flash memory, and various circuits such as an interface circuit for decoding input signals and generating output signals for contact and contactless communication, and a power generation circuit. Note that these various circuits may be provided as elements separate from the IC chip 74a.

[0064] The molded portion 74b is provided as a protruding portion that covers the IC chip 74a and the wires 75 to protect them from external force loads and environmental loads. The molded portion 74b is made of an ultraviolet curable resin, a thermosetting resin, or the like.

[0065] The thickness of the IC chip body 74 depends on the thickness of the IC chip 74a provided therein and the shape of the bonded wires, but can be, for example, 0.45 mm to 0.75 mm. The total thickness of the IC module 7 can be, for example, 0.35 mm to 1.0 mm, and preferably 0.40 mm to 0.65 mm. The latter range allows the depth of the third recess 93 to be 0.7 mm or less, and the overall thickness of the dual interface card 1 to be kept below the 0.84 mm specified in the ISO / IEC 7816 standard.

[0066] (c) Conductive adhesive layer After forming a recess 9 for embedding the IC module 7 in the card base 2 by cutting using an end mill or the like, the conductive adhesive layer 11 is described below, which embeds and fixes the IC module 7 in the recess 9 and electrically and mechanically connects it to the recess 9. As shown in Fig. 4(c), the conductive adhesive layer 11 is a liquid or tape-like member that is disposed so as to be sandwiched between the core layer 5 in the portion where the antenna wire 83 is partially cut away and exposed on the bottom surface 92p, and the substrate 72 of the IC module 7 that is embedded and disposed above it and the terminal 73a formed on the substrate 72.

[0067] The conductive adhesive layer 11 may be applied or attached in advance to the surface of the substrate 72 of the IC module 7 opposite the external connection terminal 71, or may be applied or attached to the bottom surface 92p of the recess 9 of the card base 2 after cutting.

[0068] A typical conductive adhesive layer 11 also serves to mechanically connect the IC module 7 and the cut card base 2, and may be applied or attached to the entire back surface of the substrate 72 or to portions of the recess 9 that correspond to the first recess 91 and second recesses 92a, 92b that are arranged along the outer periphery 97 of the recess 9. In this way, the same type of conductive adhesive layer 11 can be used to electrically connect the IC chip 74a and the antenna 8 and to mechanically connect the IC module 7 and the card base 2, which contributes to simplification of the process.

[0069] However, the conductive adhesive layer 11 may be applied and stuck to the rear surface of the substrate 72 so as to cover only the areas of the terminals 73a and 73b, and another adhesive that is not conductive may be applied and stuck to the rest of the rear surface of the substrate 72. This is because the other adhesive does not need to be considered in terms of conductivity, making it easier to select an adhesive that is more advantageous for mechanical connection.

[0070] As the conductive adhesive layer 11, which can be used for both electrical and mechanical connection, anisotropic conductive film (ACF) or anisotropic conductive paste (ACP) can be used. Other materials that can be used include conductive paste, which is epoxy resin with silver particles dispersed as a filler. Among these, ACF can be used to easily establish electrical connection between the IC chip 74a and the antenna 8 by thermally laminating the ACF over the entire back surface of the substrate 72 of the IC module 7, embedding the IC module 7 in the recess 9 of the card base 2 that has already been cut, and then heat-pressing the resulting structure at a predetermined temperature and load. Furthermore, because mechanical connection of the IC module 7 to the card base 2 can be achieved at the same time, the process of mounting the IC module 7 on the card base 2 can be simplified.

[0071] The electrical connection between the IC chip 74a and the antenna 8 and the mechanical connection between the IC module 7 and the card base 2 when an ACF is used as the conductive adhesive layer 11 can be explained as follows, based on Figure 4(c). The conductive adhesive layer 11 has a configuration in which conductive particles 11a, each consisting of spherical resin or metal spheres surrounded by a metal film, are dispersed in an adhesive 11b, which is a binder containing an adhesive component. Here, thermal pressure is applied to the substrate 72 from the +Z direction to the -Z direction so that the conductive adhesive layer 11, which is arranged so as to be sandwiched between the core layer 5 from which a portion of the antenna wire 83 is exposed, the substrate 72 of the IC module 7, and the terminals 73a formed on the substrate 72, is compressed.

[0072] As a result, strong thermal pressure is applied to the narrow portion of the conductive adhesive layer 11, sandwiched between the core layer 5 and the terminal 73a. The conductive particles 11a of the conductive adhesive layer 11 in this portion are pressed against the exposed antenna wire 83 and terminal 73a of the core layer 5 along the thickness direction of the conductive adhesive layer 11. Furthermore, when the conductive particles 11a are small, the conductive particles 11a overlap in a daisy-chain fashion from the antenna wire 83 to the terminal 73a along the thickness direction of the conductive adhesive layer 11. In other words, the exposed antenna wire 83 and the terminal 73a are electrically connected via the conductive particles 11a. Meanwhile, between the core layer 5 and the substrate 72 in the region where the terminal 73a is not present, the conductive particles 11a are not compressed to the extent that they are pressed against the antenna wire 83 and terminal 73a along the thickness direction of the conductive adhesive layer 11, or that they overlap in a daisy-chain fashion. However, the adhesive force of the adhesive 11b generated by the thermal pressure mechanically connects the core layer 5 and the substrate 72.

[0073] As described above, the IC module 7 has the opposing terminals 73a and 73b and the first end 81 and second end 82 electrically connected via, for example, an ACF. The ACF is arranged in a region along the outer periphery 97 of the recess 9 so as to overlap the first recess 91 and the second recesses 92a and 92b in a plan view along the Z-axis direction.

[0074] (d) Recess The recess 9 formed in the card base 2 for embedding the IC module 7 includes a portion of the outer periphery 97 and has a first recess 91 that is separated from each other. The recess 9 also includes another portion of the outer periphery 97 and has second recesses 92a and 92b that are separated from each other, and a third recess 93 that is adjacent to the first recess 91 and the second recesses 92a and 92b and is formed closer to the center than these recesses. In this embodiment, as shown in FIG. 1(b), the second recesses 92a and 92b are approximately rectangular regions in a plan view along the Z axis, respectively, located on both sides of the central third recess 93 along the X axis. As described above, the first end 81 and the second end 82 of the antenna 8 overlap the second recesses 92a and 92b, respectively, and the overlapping regions form the first exposed portion 86 and the second exposed portion 87, which are exposed portions of the antenna wire 83.

[0075] On the other hand, the first recess 91 is adjacent to each of the second recesses 92a and 92b, and is a region divided and arranged on both sides along the Y axis with the central third recess 93 in between. In this embodiment, the first recess 91 does not overlap with the first end 81 and the second end 82 in a plan view along the Z axis. The second recesses 92a and 92b have approximately the same depth, but are formed deeper than the first recess 91, and the third recess 93 is formed deeper than the second recesses 92a and 92b.

[0076] 3(a) and 3(b), the depth d1 of the first recess 91 and the depth d2 of the second recesses 92a and 92b can be independently set as optimal depths for different purposes. That is, the depth d1 of the first recess 91 can be determined in consideration of achieving a good mechanical connection between the IC module 7 and the card base 2. The depth d2 of the second recesses 92a and 92b can be determined independently of the depth d1 of the first recess 91 in consideration of achieving a good electrical connection between the terminals 73a and 73b of the IC module 7 and the exposed antenna wire 83.

[0077] First, the depth d1 of the first recess 91 can be considered as follows. For example, let the thickness of the substrate 72 be Tp1, the thickness of the conductive adhesive layer 11 be Tacf1, the shrinkage amount in the thickness direction of the conductive adhesive layer 11 when a predetermined thermal pressure is applied be Δacf1, and the shrinkage amount in the thickness direction of the card substrate 2 be Δcb1. At this time, if the surface of the external connection terminal 71 of the IC module 7 is made substantially the same as the surface of the card substrate 2, the depth d1 of the first recess 91 is d1 = Tp1 + Tacf1 - Δacf1 - Δcb1. Here, by obtaining the thermal pressure conditions such as load, temperature, and time under which the adhesive force between the IC module 7 and the card substrate 2 is maximized, and Δacf1 and Δcb1 at that time, the optimal d1 can be determined.

[0078] Next, the depth d2 of the second recesses 92a and 92b can be considered as follows. For example, let the thickness of the terminal 73a extending in the -Z direction from the substrate 72 be Tp2, and the above definitions be applied to other dimensions. At this time, the depth d2 of the second recess 92a is d2 = Tp1 + Tp2 + Tacf1 - Δacf1 - Δcb1. Here, by obtaining the thermal pressure conditions under which the electrical connection between the terminal 73a of the IC module 7 and the exposed antenna wire 83 is the best, and Δacf1 and Δcb1 at that time, the optimal d2 can be determined.

[0079] Here, consider using the same conductive adhesive layer 11 for both the mechanical connection between the IC module 7 and the card substrate 2 and the electrical connection between the terminal 73a of the IC module 7 and the antenna wire 83. In this case, the thermal pressure conditions applied to the IC module 7 described above are the same for the first recess 91 and the second recesses 92a and 92b. When the conductive adhesive layer 11 is an ACF and the average particle diameter of its conductive particles is dc1, generally, Tacf1 > dc1, and in order to achieve an appropriate electrical connection, it is preferable that Tacf1 - Δacf1 = dc1 or Tacf1 - Δacf1 < dc1.

[0080] At this time, the conductive particles contained in the ACF filling the gap between the terminal 73a and the antenna wire 83 contact both the terminal 73a and the antenna wire 83 either in that state or compressed, ensuring a reliable electrical connection. However, if the value of Tacf1-Δacf1 is made extremely small, the conductive particles in the ACF may be destroyed, preventing a good electrical connection. To prevent such destruction of the conductive particles, it is preferable that Tacf1-Δacf1>dc1 / 2, for example.

[0081] On the other hand, when the conductive adhesive layer 11 is an ACF, the appropriate value of Δacf1 for improving the mechanical connection between the IC module 7 and the card base 2 is considered to be the same as or in a range close to the above-mentioned conditions for achieving the appropriate electrical connection. This is because when the ACF is in a state that allows for optimal electrical connection, the adhesive force that mechanically fixes and maintains the terminal 73a and the antenna wire 83 is also considered to be strong. If the conditions for improving the mechanical connection and the conditions for improving the electrical connection are the same, the depth d2 of the second recess 92a needs to be deeper than the depth d1 of the first recess 91 by an amount that approximates the thickness Tp2 of the terminal 73a.

[0082] For example, the depth of the first recess 91 is, for example, approximately 0.1 mm to 0.4 mm, and the depth of the second recesses 92a and 92b is, for example, approximately 0.12 mm to 0.5 mm. When the thickness of the terminals 73a and 73b is 0.015 mm to 0.15 mm, the difference between the depth of the second recesses 92a and 92b and the depth of the first recess 91 is preferably approximately 0.005 mm to 0.2 mm. Furthermore, it is more preferable that this difference be 40% to 120% of the thickness Tp2 of the terminals 73a and 73b. In particular, in the latter case, when the conductive adhesive layer 11 is an ACF, the thickness of the conductive adhesive layer 11 can be adjusted by heat and pressure so as to achieve optimal conditions for the electrical connection between the IC module 7 and the antenna 8 and the mechanical connection between the IC module 7 and the card base 2.

[0083] 3(a) and 3(b) show the cross section after the IC module 7 is mounted in the recess 9 of the card base 2. That is, the thickness of the conductive adhesive layer 11 in the first recess 91 is d11, and the thickness of the conductive adhesive layer 11 in the second recess 92a is d22 in the area other than the terminal 73a and d3 in the area of ​​the terminal 73a. When the above-mentioned conditions for improving the mechanical connection and the conditions for improving the electrical connection are the same, d11=d3.

[0084] The specific cutting order for forming such recesses 9 in the card base 2 can be determined arbitrarily according to the milling program for the cutting process. An exemplary cutting order determined from the perspective of improving processing time efficiency and ensuring cutting quality is as follows: first, in FIG. 1(b), the area common to the first recess 91 and the second recesses 92a, 92b is cut along the outer periphery 97 at the depth of the first recess 91 while moving the milling tool counterclockwise or clockwise. Next, the central areas of these recesses are cut at the depth of the third recess 93, which is deeper than the first recess 91, while moving the milling tool counterclockwise or clockwise in the same manner.

[0085] Finally, the region common to the second recesses 92a, 92b is cut while moving the milling tool to a depth deeper than the first recess 91 and shallower than the third recess 93. The second recesses 92a, 92b may be cut by first cutting only the second recess 92a while moving the milling tool counterclockwise or clockwise, and then cutting only the second recess 92b in the same manner. Alternatively, the milling tool may be moved left and right across the second recesses 92a, 92b, and cut continuously while being sequentially shifted from top to bottom, thereby simultaneously forming the second recesses 92a, 92b.

[0086] (e) Dual interface card manufacturing method Next, an example of a method for manufacturing the dual interface card 1 using the card base 2, IC module 7, and conductive adhesive layer 11 described above will be described.

[0087] First, a coated conductor wire coated with an insulating member is embedded as an antenna wire 83 using a winding former, starting from either the first end 81 or the second end 82 and ending at the other, on the surface of either the core layer 5 or 4 on the side not adjacent to the over-sheet layer 6 or 3. Specifically, for example, while applying a predetermined heat and pressure to the core layer 5, an antenna supply head is drawn into a loop shape as shown in FIG. 1(a), and the antenna wire 83 supplied from the antenna supply head is successively embedded in the core layer 5.

[0088] Here, antenna wire 83 is arranged at predetermined positions on the left and right of the planned mounting position of IC module 7 so that first end 81 and second end 82 are aligned in the left-right direction, and antenna wire 83 is cut at its end point. The movement of the winding machine is changed to adjust the arrangement position of antenna wire 83 so that first end 81 and second end 82 are formed by the antenna wire 83 constituting antenna 8 having a repeated folded structure extending from the outer periphery 97 toward the center of recess 9. Furthermore, antenna 8 is formed by being embedded in core layer 5 so that the portion of antenna wire 83 other than the bent portion of the folded structure is aligned along a straight line along the Y-axis, which is a straight line along the outer periphery 97, and so that first end 81 and second end 82 each follow the outline of a rectangle.

[0089] Next, using core layer 5, which is antenna sheet 12 on which antenna 8 is formed, over-sheet layer 6, core layer 5, core layer 4, and over-sheet layer 3 are stacked in this order from the bottom in the thickness direction, as shown in Figure 2(a). After that, each large-sized sheet laminate in which cards are arranged in multiple rows and columns is sandwiched between stainless steel plates from above and below in the thickness direction, and heat and pressure are applied to the laminate via the stainless steel plates.

[0090] By undergoing such a heat pressing process, a card base consisting of large sheets in which the layers of the laminate are integrated can be obtained. If either the oversheet layer or the core layer has heat resistance such that they do not heat-seal at a predetermined temperature, an adhesive sheet that heat-seals at a predetermined temperature can be sandwiched between the layers, or an adhesive can be applied, and then the resulting mixture can be subjected to the heat pressing process to obtain a card base consisting of large sheets in which the layers are integrated.

[0091] The large-sized card substrate obtained as described above, on which cards are arranged in a multi-faced array, is punched out by a punching machine into card substrates 2 that meet the ISO / IEC 7816 card size. Furthermore, recesses 9 for embedding IC modules 7 are formed in the card substrate 2 by cutting using an end mill. This results in the cut card substrate 2. As described above, recesses 9 are made up of a total of three stages: first recess 91 and second recesses 92a, 92b for accommodating the flat substrate 72 of the IC module 7, and third recess 93 for accommodating the convex IC chip body 74.

[0092] Here, the depth of the first recess 91 is determined taking into consideration that the IC module 7 is embedded and bonded to the card body 2, and that the surface of the external connection terminal 71 is approximately flush with the surface of the non-cut region of the card body 2. The depths of the second recesses 92a and 92b correspond to the embedding depths of the first end 81 and the second end 82 of the antenna 8. In other words, when the second recesses 92a and 92b are formed by cutting, portions of the antenna wires 83 of the first end 81 and the second end 82 are exposed at the bottom surfaces 92p of the second recesses 92a and 92b.

[0093] In other words, let the depth from the exposed surface of the external connection terminal 71 of the card substrate 2 to the bottom surfaces 92p of the second recesses 92a and 92b be d2. Also, let the distance from the surface to the upper end of the antenna wire 83 of either the first end 81 or the second end 82 be d201, and let the distance from the surface to the lower end of the antenna wire 83 of the said one be d202. At this time, for the respective values of d2, d201, and d202, d201 < d2 < d202 holds. This is because if this is not satisfied, the antenna wire 83 will be disconnected or a defect will occur where it does not expose from the bottom surface 92p due to cutting.

[0094] On the other hand, separately from the manufacturing of the card substrate 2 and the cutting for forming the recess 9, the conductive adhesive layer 11 is attached to the IC module 7. As the IC module 7, usually, a module tape in which the IC module 7 is formed continuously in a long tape in a single row or two rows is used. An ACF in tape form is pasted onto the surface of the substrate 72 on the side opposite to the formation surface of the external connection terminal 71 of this module tape while applying a constant thermal pressure. Thereafter, the module tape onto which the ACF has been pasted is punched out with a punching machine as a substantially rectangular IC module 7 having rounded corners to obtain individual IC modules 7 to which the conductive adhesive layer 11 has been attached.

[0095] Thereafter, the IC module 7 to which the conductive adhesive layer 11 has been attached is embedded in the card substrate 2 in which the recess 9 has been formed, a predetermined heat block is pressed against the external connection terminal 71, and a predetermined thermal pressure is applied toward the card substrate 2 side for a predetermined time. Thereby, by melting the conductive adhesive layer 11 composed of ACF, an electrical connection between the terminals 73a and 73b of the IC module 7 and the first end 81 and the second end 82 of the antenna 8 is achieved, and a mechanical connection between the IC module 7 and the card substrate 2 is achieved. Although there are differences in the thermal pressure conditions depending on the type and composition of the ACF, as an example, the time can be 0.5 seconds or more and 10.0 seconds or less, the temperature can be 150°C or more and 250°C or less, and the pressure can be 20 MPa or more and 100 MPa or less. 。

[0096] (f) Dual Interface Card of the First Embodiment In summary, the dual interface card 1 of the first embodiment includes a card base 2 and an antenna 8 disposed inside the card base 2 and having at least a plurality of ends, namely, a first end 81 and a second end 82. The dual interface card 1 further includes an IC module 7 having an IC chip 74a and a plurality of terminals 73a and 73b electrically connected to the IC chip 74a. The IC module 7 is disposed in a recess 9 provided in the card base 2 so that the plurality of terminals 73a and 73b facing each other and the plurality of first ends 81 and second ends 82 are electrically connected to each other. .

[0097] The multiple ends, namely, first end 81 and second end 82, are configured by a structure in which antenna wire 83 constituting antenna 8 is repeatedly folded back from the outer periphery 97 of recess 9 toward the center, and a portion of the folded back structure is exposed in recess 9, i.e., second recesses 92a and 92b. This increases the exposed area of ​​antenna wire 83 per unit area exposed in recess 9, and improves the reliability of the electrical connection between terminals 73a and 73b of IC module 7 and antenna 8.

[0098] The second recesses 92a and 92b are formed deeper than the first recess 91, and the third recess 93 is formed deeper than the second recesses 92a and 92b.

[0099] As a result, when the IC module 7 is pressed against the card base 2 by applying heat and pressure, the depth of the second recess 92a can be determined as follows. That is, the depth is determined so that the distance between the terminal 73a, which protrudes in a convex shape from the substrate 72 via the conductive adhesive layer 11, and the antenna wire 83 exposed at the bottom surface 92p of the second recess 92a is within an appropriate range for electrical connection. Furthermore, in a region of the substrate 72 spaced apart from the terminal 73a along the Y-axis, the depth of the first recess 91 can be determined independently of the depths of the second recesses 92a and 92b so that the distance between the substrate 72 and the card base 2 is within an appropriate range for mechanical connection. However, the depth of the first recess 91 can be adjusted to be shallower than the depths of the second recesses 92a and 92b, taking into account at least the thickness of the terminal 73a.

[0100] Therefore, the dual interface card 1 of this embodiment can improve the reliability of both the electrical connection between the IC module 7 and the antenna 8 and the mechanical connection between the IC module 7 and the card base 2. Furthermore, even when the same conductive adhesive layer 11 is used, it is possible to achieve both the electrical connection between the IC module 7 and the antenna 8 and the mechanical connection between the IC module 7 and the card base 2. Therefore, the dual interface card 1 of this embodiment can improve the reliability of both the electrical connection between the IC module and the antenna and the mechanical connection between the IC module and the card base, and can improve manufacturing efficiency.

[0101] 2. Second embodiment Next, a dual interface card according to a second embodiment of the present disclosure will be described.

[0102] 5 is a diagram showing the configuration of the first end 81 and the second end 82 of the antenna 8 in the dual interface card 1a of the second embodiment, corresponding to FIG. 1(b). In the dual interface card 1a of this embodiment, the first exposed portions 86a and 87a of the first end 81 and the second end 82, which are the areas where the antenna wire 83 is actually exposed from the card base 2, are configured so that multiple sections of the antenna wire 83 are exposed discontinuously.

[0103] That is, the portions of antenna wire 83 constituting first end 81 and second end 82 other than the bent portions of the folded structure are exposed in second recesses 94a and 94b. However, the bent portions of the folded structure, which are the ends on the +Y and -Y sides, overlap with first recess 91 in a plan view along the Z axis, and are embedded in card base 2 on the -Z side of the bottom surface of first recess 91. This is different from dual interface card 1 of the first embodiment.

[0104] In the first recess 91, at least the bent portions of the folded structure of the antenna 8, of the repeated folded structure from the outer periphery 97 of the recess 9 toward the center by the antenna wire 83 that constitutes the antenna 8 at the first end 81 and the second end 82, overlap without being exposed. Furthermore, in the second recesses 94a and 94b, the portions other than the bent portions are exposed. Note that the exposed portions other than the bent portions are lined up intermittently with each other.

[0105] In first end 81, covered region 84a, where the bent portion of the folded structure of antenna wire 83 is not exposed and overlaps first recess 91, is formed on the +Y direction side of first exposed portion 86a formed in second recess 94a. In addition, covered region 84b, where the bent portion is not exposed and overlaps first recess 91, is formed on the -Y direction side of first exposed portion 86a. Similarly, covered regions 85a and 85b, where the bent portion is not exposed and overlaps first recess 91, are formed on the +Y direction side and -Y direction side of second exposed portion 87a in second end 82.

[0106] In this embodiment, as in the first embodiment, the recess 9 formed in the card base 2 for embedding the IC module 7 includes a first recess 91, second recesses 94a and 94b, and a third recess 93. Here, Fig. 6(a) is a cross-sectional view of the dual interface card 1a in Fig. 5 taken along line DD as viewed from the -X direction, Fig. 6(a) shows a diagram with the IC module 7 omitted, and Fig. 6(b) shows a state in which the IC module 7 is mounted in Fig. 6(a).

[0107] As shown in Figures 6(a) and 6(b), the first recess 91 of the recess 9 of the card base 2 is formed to overlap the end portions of the first end 81 of the antenna wire 83 on the -Y and +Y directions in a plan view along the Z axis. The overlapping portions are covered regions 84a and 84b in which the bent portion of the folded structure of the antenna wire 83 is covered with the core layer 5. Meanwhile, in the second recess 94a of the recess 9, which is deeper than the first recess 91, the portion of the folded structure of the first end 81 of the antenna wire 83 other than the bent portion is exposed at the bottom surface 94p. In other words, the bare conductor is exposed without the core layer 5 or the covering of the coated conductor.

[0108] As shown in FIG. 5 , the exposed portion of the first end 81 other than the bent portion disposed in the first exposed portion 86a of the folded structure extends along a straight line parallel to the Y-axis along the side 97a of the outer periphery 97 of the recess 9. The center-to-center distance, i.e., the pitch, of the zigzag-shaped antenna wire 83 between adjacent portions excluding a portion of the bent portion is substantially constant. The width of the entire first end 81 along the Y-axis is defined as W22, and the width of the second recess 92a, which overlaps with a portion of the first end 81 in a plan view along the Z-axis, in the Y-axis direction, is defined as W21. In this case, W22 is longer than W21. In other words, the value of W22 is greater than the value of W21 by the sum of the lengths of the covered regions 84a and 84b of the first end 81 along the Y-axis. The above also applies to the second exposed portion 87a and the covered regions 85a and 85b in the second end portion 82.

[0109] In this embodiment, the dual interface card 1a can be manufactured using the same procedure as in the first embodiment. When the second recesses 94a and 94b are formed by cutting using a milling tool, the folded-back bent portions formed at the ends of the antenna wire 83 on the −Y and +Y sides are covered by the core layer 5 without exposing the entire first end 81 or the entire second end 82 from the bottom surface 94p. As described in the first embodiment, the antenna wire 83 is embedded in the core layer 5 while being subjected to heat and pressure by a winding machine. However, in the exposed region of the antenna wire 83, only about half of the cross section of the antenna wire 83 is embedded in the core layer 5. In this case, the adhesive strength between the antenna wire 83 and the core layer 5 is weaker than in a region where the entire antenna wire 83 is embedded in the core layer 5.

[0110] In the dual interface card 1a of this embodiment, when forming the recess 9, the antenna wire 83 at the first end 81 or the second end 82 is not entirely exposed, and at least the bent portions of the antenna wire 83 at the first end 81 or the second end 82 are covered by the core layer 5. This prevents the exposed portions of the antenna wire 83 from peeling off from the core layer 5 during the cutting process used to form the recess 9. Furthermore, the covered regions 84a, 84b, 85a, and 85b of the antenna wire 83 at the first end 81 or the second end 82, where the antenna wire 83 is covered by the core layer 5, are limited to narrow regions corresponding to the bent portions of the first end 81 or the second end 82. This ensures sufficient areas for the first exposed portions 86a and 87a for electrical connection with the terminals 73a and 73b of the IC module 7, ensuring good electrical connection between the IC module 7 and the antenna 8.

[0111] If the covered regions 84a and 84b corresponding to the first end 81 are provided with equal sizes, and the length of each of the covered regions 84a and 84b along the Y axis is Wc2, then Wc2 = (W22 - W21) / 2. The value of Wc2 is preferably 2% to 20% of the value of W22, and more preferably 5% to 15%.

[0112] By setting the thickness in the former range, peeling of the exposed antenna wire 83 from the core layer 5 during cutting can be suppressed, while maintaining a good electrical connection between the IC module 7 and the antenna 8 even when the cutting position of the second recesses 94a, 94b is shifted or the mounting position of the IC module 7 is misaligned. Furthermore, by setting the thickness in the latter range, peeling of the antenna wire 83 from the core layer 5 can be further suppressed and the effect of absorbing misalignment in processing and mounting position can be further improved, and costs can be reduced by suppressing unnecessary wiring of the antenna wire 83 that is not involved in the electrical connection.

[0113] 3. Third embodiment Next, a dual interface card according to a third embodiment of the present disclosure will be described.

[0114] 7(a) is a diagram showing the configuration of the first end 81a and the second end 82a of the antenna 8 in a dual interface card 1b of the third embodiment, corresponding to FIG. 1(b). FIG. 7(b) is a diagram extracting the configuration of the antenna wire 83 in the vicinity of the first end 81a from FIG. 7(a). In the dual interface card 1b of this embodiment, the first end 81a and the second end 82a are configured by the antenna wire 83 constituting the antenna 8, which is repeatedly folded back from the outer periphery 97 of the recess 9 toward the center. Furthermore, a portion of the folded back portion is exposed in the recess 9, and the portion of the antenna 8 other than the bent portion of the folded back structure is inclined with respect to a straight line along the outer periphery 97.

[0115] In the first end 81a and the second end 82a, the regions of the bent portion of the folded structure where the antenna wire 83 is exposed are first exposed portion 86b and second exposed portion 87b, which overlap with second recesses 95a and 95b in a plan view along the Z axis direction. On the other hand, the regions other than the bent portion where the antenna wire 83 is covered by the core layer 5 are covered regions 84c, 84d, and 85c, 85d, which overlap with first recess 91 in a plan view. The covered regions 84c and 84d are located on the +Y direction side and the −Y direction side of the first exposed portion 86b, and the covered regions 85c and 85d are located on the +Y direction side and the −Y direction side of the second exposed portion 87b. That is, the first end 81a and the second end 82a are similar to the second embodiment in that they include covered regions 84c, 84d, and 85c, 85d.

[0116] At the first end 81a and the second end 82a of the antenna wire 83, portions other than the bent portions at the upper and lower ends of the folded structure are inclined obliquely with respect to straight lines m1 and m2 parallel to sides 97a and 97b along the outer periphery 97 of the first recess 91 and the second recesses 95a and 95b, respectively, i.e., straight lines parallel to the Y axis. Furthermore, the first end 81a and the second end 82a are formed so as to follow the outline of a rectangle whose width along the X axis direction is W31 and whose width along the Y axis direction is W22.

[0117] Here, when forming recess 9 by cutting, the outer periphery of which is substantially rectangular and substantially the same as that of IC module 7, the method of cutting and forming second recesses 95a and 95b while exposing antenna wire 83 is as described above. That is, only second recess 95a may be cut by moving the milling tool counterclockwise or clockwise, and then only second recess 95b may be cut in the same manner. Alternatively, second recesses 95a and 95b may be simultaneously formed by moving the milling tool left and right across second recesses 95a and 95b and successively cutting while shifting it from top to bottom.

[0118] Here, when the former method is adopted, the milling tool cuts either the second recess 92a or 92b while moving in the direction along the X axis and the direction along the Y axis. At this time, if the wiring direction of the antenna wire 83 and the moving direction of the milling tool are approximately parallel, cutting the antenna wire 83 at a midpoint may cause a part of the antenna wire 83 to branch off and unintentionally branch, which may result in the generation of so-called whiskers. However, in this embodiment, the portions other than the bent portions at the upper and lower ends of the folded structure of the first end 81a and the second end 82a are inclined, thereby suppressing the above-mentioned problem. .

[0119] Furthermore, at the first end 81a, the portion other than the bent portion of the folded structure is inclined clockwise by a predetermined angle θ with respect to the Y axis, which is a straight line along the side 97a of the outer periphery 97 of the recess 9. Here, the inclination angle θ is preferably 2 degrees or more and 20 degrees or less, and more preferably 5 degrees or more and 15 degrees or less. Furthermore, the inclination angle θ does not need to be strictly the same for all portions other than the bent portion of the folded structure, and may vary within the above-mentioned range. When the inclination angle θ is in the former range, the antenna wire 83 is inclined with respect to the direction along the X axis or Y axis, which is the movement direction of the end mill when cutting the recess 9, thereby preventing the antenna wire 83 from unintentionally branching.

[0120] On the other hand, by setting the inclination angle θ in the latter range, it is possible to further suppress the occurrence of whiskers, which are branches of the antenna wire 83. Furthermore, even if the end of the first end 81a on the +X direction side is located on the +X direction side of the boundary between the first recess 91 and the second recess 95a and the third recess 93, it is possible to further reduce the region of disconnection of the antenna wire 83 caused by cutting the antenna wire 83 when cutting the third recess 93. This further improves the reliability of the electrical connection between the antenna 8 and the terminal 73a of the IC module 7.

[0121] In this embodiment, in the region of first end 81a along the X-axis direction, the end on the +X direction side is substantially coincident with the boundary between second recess 95a and third recess 93, and the end on the −X direction side is located closer to the −X direction than the end of second recess 95a, which is the outer periphery 97 of recess 9. In this way, when the end on the +X direction side of first end 81a is substantially coincident with the boundary between second recess 95a and third recess 93 or is located closer to the −X direction than this, it is possible to not cut antenna wire 83 when cutting third recess 93, or to reduce the amount of cutting of antenna wire 83. This makes it possible to suppress branching of antenna wire 83, i.e., the occurrence of whiskers, which are more likely to occur as the cutting depth increases.

[0122] Furthermore, if the end of the first end 81a on the +X direction side is located closer to the +X direction than the boundary between the first recess 91 and the second recess 95a and the third recess 93, the antenna wire 83 will be cut when the third recess 93 is cut, and will break along the way. However, if the inclination angle θ is within the above-mentioned range, the broken area of ​​the antenna wire 83 can be reduced, and a reliable electrical connection can be achieved between the antenna 8 and the terminal 73a of the IC module 7. Furthermore, if the end of the first end 81a on the +X direction side is located closer to the +X direction than the boundary between the first recess 91 and the second recess 95a and the third recess 93, this area will include the bent portion of the antenna wire 83 with a folded structure, and the portion other than the bent portion will break along the way. In this way, when cutting the third recess 93, the antenna wire 83 is less likely to branch from the bent portion that is at a large angle from the direction along the Y-axis, which is the movement direction of the end mill, and this ultimately contributes to improved quality.

[0123] In addition, at the second end 82a, the portion other than the bent portion of the folded structure is inclined counterclockwise, opposite to the first end 81a, by a predetermined angle θ with respect to the Y axis, which is a straight line along the side 97b of the outer periphery 97 of the recess 9. Here, the range of the inclination angle θ is the same as that of the first end 81a, except that the direction is reversed. The inclination of the portion other than the bent portion of the first end 81a with respect to the straight line along the outer periphery 97 and the inclination of the portion other than the bent portion of the second end 82a with respect to the straight line along the outer periphery 97 are formed line-symmetrically with each other. In other words, the first end 81a and the second end 82a, including the inclination of the portion other than the bent portion of the antenna wire 83, are arranged symmetrically with respect to an axis along the Y axis as a whole.

[0124] In this way, the inclination of the portion other than the bent portion at the first end 81a and the inclination of the portion other than the bent portion at the second end 82a are arranged in a line-symmetrical relationship with each other, which allows distortions and internal stresses of the core layer 5 to be offset and dispersed when the antenna wire 83 is embedded in the core layer 5 to form the antenna sheet 12, making it possible to obtain an antenna sheet 12 with less distortion and uniform internal stress.

[0125] Furthermore, when the IC module 7 is embedded in the recess 9, the heat pressure conditions applied between the first end 81a and the terminal 73a and the heat pressure conditions applied between the second end 82a and the terminal 73b are symmetrical to each other. This prevents imbalance in the heat pressure conditions, stabilizing the electrical connection between the IC module 7 and the antenna 8 and the mechanical connection between the IC module 7 and the card base 2. .

[0126] However, the inclination of the portion of the first end 81a other than the bent portion relative to the line along the outer periphery 97 and the inclination of the portion of the second end 82a other than the bent portion relative to the line along the outer periphery 97 may be the same, rather than being line-symmetrical. That is, the configuration of the antenna wire 83 at the second end 82a may be substantially the same as the configuration of the antenna wire 83 at the first end 81a, but shifted in parallel in the +X direction. In this case, the effects and advantages of the configuration of the first end 81a described above also apply to the second end 82a.

[0127] 4. Fourth embodiment Next, a dual interface card according to a fourth embodiment of the present disclosure will be described.

[0128] Fig. 8(a) is a diagram showing the configuration of a dual interface card 1c according to the fourth embodiment, in the vicinity of a first end 81 and a second end 82 of an antenna 8, corresponding to Fig. 1(b). Fig. 8(b) is a cross-sectional view of the dual interface card 1c of Fig. 8(a) taken along the EE line, viewed from the -Y direction. Fig. 8(c) is a diagram showing the IC module 7a as viewed from the side of the substrate 72 opposite the external connection terminals 71.

[0129] In dual interface card 1c of the present embodiment, first recesses located on the +Y and -Y sides of recess 9 of dual interface card 1 of the first embodiment are also divided along the X axis. Recess 9 also includes new fourth recesses 96a and 96b, which are deeper than the first recesses, located approximately in the center along the X axis. This is a difference from the first embodiment.

[0130] The recess 9 includes a part of the outer periphery 97 and has first recesses 91a, 91b, 91c, and 91d that are separated and arranged at four positions on the +Y direction side and the -X direction side, the +Y direction side and the +X direction side, the -Y direction side and the -X direction side, and the -Y direction side and the +X direction side. The recess 9 also includes another part of the outer periphery 97 and has second recesses 92a and 92b that are separated from each other, and a third recess 93 that is adjacent to all of the first recesses 91a, 91b, 91c, and 91d and the second recesses 92a and 92b and is formed closer to the center than these.

[0131] In addition, recess 9 further includes fourth recesses 96a and 96b that include part of the outer periphery 97 and are arranged separately on the +Y direction side and the -Y direction side adjacent to third recess 93. Fourth recess 96a is formed at a position sandwiched between first recesses 91a and 91b, and fourth recess 96b is formed at a position sandwiched between first recesses 91c and 91d. Fourth recesses 96a and 96b are formed deeper than first recesses 91a, 91b, 91c, and 91d, and shallower than third recess 93.

[0132] Meanwhile, a convex portion having an area smaller than the area of ​​the fourth concave portions 96a and 96b when viewed in a plan view along the Z-axis direction is formed at a predetermined position on the surface of the substrate 72 of the IC module 7a that faces the fourth concave portions 96a and 96b when mounted. This is the lead portion 77 shown in Figures 8(b) and 8(c). The lead portion 77 is used to plate the copper foil surfaces of terminals 73a, 73b, etc., formed on the surface of the substrate 72 opposite the external connection terminal 71 of the IC module 7a with nickel or gold to improve durability and environmental resistance, and also functions as a lead wire for passing current during inspection.

[0133] As described above, the IC modules 7a are typically formed as a module tape, which is a continuous, long tape with one or two rows of IC modules 7. The lead wires are routed across the IC modules 7a to electrically connect the terminals 73a and 73b of the IC modules 7a. Therefore, lead portions 77 remain as traces of the lead wires at the +Y and -Y ends of each individual IC module 7a that has been punched out.

[0134] The lead portions 77 are usually made of copper foil or the like, and thus have a certain degree of thickness, similar to the terminals 73a and 73b. Therefore, if the depth of the recesses 9 facing the substrate 72 in the areas where the lead portions 77 are present is uniformly the same, the conductive adhesive layer 11 will be compressed by heat and pressure in accordance with the gap between the lead portions 77 and the card base 2. However, the gap between the substrate 72 and the card base 2 in areas where the lead portions 77 are not present will be too large by the amount of the absence of the lead portions 77, and there is a possibility that a good mechanical connection between the IC module 7a and the card base 2 will not be achieved in these areas.

[0135] 8(b), in this embodiment, a fourth recess 96a that is deeper than the first recess 91a and other recesses is formed in the area of ​​the card base 2 facing the lead 77. This allows the gap between the IC module 7 and the card base 2 in the area where the lead 77 is present and the gap between the IC module 7 and the card base 2 in the area where the lead 77 is not present to be optimized. As a result, a stable mechanical connection can be achieved overall while suppressing a decrease in adhesive strength in specific locations between the IC module 7 and the card base 2. The same applies to the fourth recess 96b.

[0136] When the thickness of the lead portion 77 is 0.015 mm or more and 0.15 mm or less, the difference between the depth of the fourth recesses 96a, 96b and the depth of the first recesses 91a, 91b, 91c, 91d is preferably approximately 0.005 mm or more and 0.2 mm or less. Furthermore, it is even more preferable that this difference be 40% or more and 120% or less of the thickness of the lead portion 77. This range further enhances the above-mentioned effects.

[0137] In this embodiment, the lead portions 77 are described as being provided at two locations along the Y-axis, i.e., in the vertical direction, on the surface of the substrate 72 opposite the external connection terminals 71 of the IC module 7a. However, the arrangement of the lead portions 77 is not limited to this, and the lead portions 77 may be provided at two locations along the X-axis, i.e., in the horizontal direction, on the surface of the substrate 72 opposite the external connection terminals 71 of the IC module 7a. Furthermore, any number of lead portions may be provided at any location along the outer periphery 97 of the IC module 7a. This is because the above-mentioned effects can be obtained by providing the necessary fourth recesses in the card base 2 according to the arrangement and number of lead portions 77 provided on these IC modules 7a.

[0138] As described above, the embodiments and variations described in this disclosure can be implemented in part or in whole in combination with each other, provided that no contradictions arise, and the contents of such combinations are naturally included in this disclosure. [Explanation of symbols]

[0139] 1, 1a, 1b, 1c dual interface card 2 Card Base 3, 6 oversheet layers 4, 5 Core layer 7, 7a IC module 8 Antennas 9 Recess 11 Conductive adhesive layer 11a Conductive particles 11b Adhesive 12 Antenna sheet 71 External connection terminal 72 PCB 73a, 73b terminal 74 IC chip body 74a IC chip 74b molded part 74p Pad 75 wire 76 Bonding Hole 77 Lead section 81, 81a First end 82, 82a 2nd end 83 Antenna Wire 84a, 84b, 84c, 84d, 85a, 85b, 85c, 85d Coverage area 86, 86a, 86b 1st exposed part 87, 87a, 87b 2nd exposed part 91, 91a, 91b, 91c, 91d First recess 92a, 92b, 94a, 94b, 95a, 95b Second recess 92p, 94p bottom 93 Third recess 96a, 96b Fourth recess 97 Outer circumference Around 97a and 97b

Claims

1. A dual interface card capable of contact communication and contactless communication with an external device, A card base; an antenna having a plurality of ends disposed within the card base; an IC module having an IC chip and a plurality of terminals electrically connected to the IC chip; the IC module is disposed in a recess provided in the card base so that the plurality of terminals and the plurality of end portions facing each other are electrically connected, the plurality of ends are formed by a structure in which an antenna wire constituting the antenna is repeatedly folded back from the outer periphery toward the center of the recess, and a part of the ends is exposed in the recess; The recess includes a first recess including a part of the outer periphery; a second recess including another part of the outer periphery; a third recess formed closer to the center of the recess than the first recess and the second recess, At least a portion of the plurality of ends is exposed in the second recess, A dual interface card, wherein the second recess is formed deeper than the first recess.

2. A dual interface card as described in claim 1, wherein the second recess has a continuously exposed repeated folding structure from the outer periphery of the recess toward the center, formed by antenna wires that constitute the antennas at the multiple ends.

3. In the first recess, at least the bent portions of the folded structures of the antennas are overlapped without being exposed, among the repeated folded structures from the outer periphery of the recess toward the center by the antenna wires constituting the antennas at the multiple ends, The dual interface card according to claim 1 , wherein a portion other than the bent portion is exposed in the second recess.

4. The IC module is a dual interface card described in any one of claims 1 to 3, wherein the multiple terminals and multiple ends facing each other are electrically connected to each other via an anisotropic conductive film.

5. A dual interface card as described in Claim 4, wherein the anisotropic conductive film is arranged to overlap the first recess and the second recess.

6. A dual interface card as described in any one of claims 1 to 5, wherein the outer periphery is an approximately rectangular shape having sides that are approximately parallel to the short and long sides of the card base, and the multiple ends are formed by a repeated folding structure from the outer periphery, which is a side of the recess that is approximately parallel to the short sides of the card base, toward the center by an antenna wire that constitutes the antenna.

7. A dual interface card described in any one of claims 1 to 6, wherein the portion of the folded structure of the antenna other than the bent portion is inclined with respect to a straight line along the outer periphery.

8. The recess includes a part of the outer periphery and further includes a fourth recess adjacent to the third recess; The third recess is formed deeper than the second recess, the fourth recess is formed deeper than the first recess and shallower than the third recess; 8. The dual interface card according to claim 1, wherein a convex portion having an area smaller than the fourth recess is formed on a surface of the IC module facing the fourth recess.

9. A dual interface card described in any one of claims 1 to 8, wherein the difference between the depth of the second recess and the depth of the first recess is 0.005 mm or more and 0.2 mm or less.

10. A method for manufacturing a dual interface card capable of contact communication and contactless communication with an external device, comprising: an antenna forming step of embedding an antenna wire into a first base material while applying heat and pressure to form an antenna having a plurality of ends on one surface of the first base material; a lamination step of laminating a second base material on the first base material on which the antenna is formed so as to sandwich the antenna; a punching step of punching a laminate obtained by stacking the first base material and the second base material into a card-sized card base; a recess forming step of forming a recess in the card base for embedding an IC module; an IC module preparation step of preparing an IC module having an IC chip and a plurality of terminals electrically connected to the IC chip; an IC module adhering step of adhering the IC module to the recess of the card base via a conductive adhesive layer so that the plurality of terminals and the plurality of end portions facing each other are electrically connected, the plurality of ends are formed by a structure in which an antenna wire constituting the antenna is repeatedly folded back from the outer periphery toward the center of the recess, and a part of the ends is exposed in the recess; The recess includes a first recess including a part of the outer periphery; a second recess including another part of the outer periphery; a third recess formed closer to the center of the recess than the first recess and the second recess, At least a portion of the plurality of ends is exposed in the second recess, A method for manufacturing a dual interface card, wherein the second recess is formed deeper than the first recess.

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