Sensors with addressable depth range and / or field of view and computing devices having such sensors

Abstract

To provide: sensors with an addressable depth range and / or field of view; and computing devices with such sensors.SOLUTION: A sensor may include multiple output couplers that are positioned at different distances from a receiver. Through selective enabling of the output couplers, light or other radiation generated by a transmitter may be directed toward the output couplers and selectively emitted from the sensor at different distances from the transmitter. Such selective emitting may adjust a depth range and / or field of view of the sensor. A computing device may include a single sensor that is used across applications and / or processes having different needs with regard to the depth range and / or field of view.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001]

[0001] Consumer electronic devices such as smartphones can include Lidar modules and / or other sensor modules that enable such consumer electronic devices to generate or sense 3D scans of regions of space. [Background technology]

[0002] The consumer electronic device may use such 3D scan data as part of a facial recognition process, a biometric authentication process, an augmented reality process, an autofocus process, and / or another process. The effectiveness of such processes may depend on the designed scanning or sensing range of the lidar module and / or other sensor modules. Furthermore, one scanning range may not be sufficient for all processes in which the consumer electronic device intends to utilize the captured 3D scan data. Therefore, the consumer electronic device may include multiple lidar modules and / or other sensor modules to provide the scanning ranges required by the various processes. Summary of the Invention

[0003]

[0002] A sensor having an addressable depth range and / or field of view, and a computing device having such a sensor, are shown and / or described in connection with at least one of the figures and more thoroughly described in the claims.

[0004]

[0003] These and other advantages, aspects, and novel features of the above disclosure, as well as details of exemplary embodiments of the present disclosure, will be more thoroughly understood from the following description and drawings.

[0004] The various features and advantages of the present disclosure will be more readily understood by reference to the following detailed description taken in conjunction with the accompanying drawings, in which like reference numerals refer to similar structural elements. [Brief explanation of the drawings]

[0005] [Figure 1]

[0005] FIG. 1 is a block diagram of a computing device having a sensor with addressable depth range and / or field of view per an aspect of the present disclosure. [Figure 2A]

[0006] FIG. 2A illustrates an embodiment of the sensor and / or further features of the sensor shown in FIG. [Figure 2B] FIG. 2B illustrates an embodiment of the sensor and / or further features of the sensor shown in FIG. [Figure 2C] FIG. 2C illustrates an embodiment of the sensor and / or further features of the sensor shown in FIG. [Figure 3]

[0007] FIG. 2D illustrates the depth ranges associated with the output couplers of FIGS. 2A-2C. [Figure 4]

[0008] 2D is a flow diagram of a process for generating 3D scan data using the sensor of FIGS. 2A-2C. [Figure 5]

[0009] 2A-2C illustrate another embodiment of the sensor and / or further features of the sensor shown in FIG. 1. [Figure 6]

[0010] 2A-2C illustrate further embodiments of the sensor and / or further features of the sensor shown in FIG. 1. DETAILED DESCRIPTION OF THE INVENTION

[0006]

[0011] The following discussion provides various examples of sensors and computing devices. Such examples are non-limiting, and the scope of the appended claims should not be limited to the particular examples disclosed. In the following discussion, the terms "example" and "for example" are non-limiting.

[0007]

[0012] These figures show general structural patterns, and descriptions and details of well-known features and techniques may be omitted to avoid unnecessarily obscuring the present disclosure. Additionally, elements in the figures are not necessarily drawn to scale. For example, the dimensions of some of the elements in these figures may be exaggerated relative to other elements to help improve understanding of the examples discussed in this disclosure. The same reference numbers in different figures refer to the same elements.

[0008]

[0013] The term "or" means any one or more of the items in the list connected by "or." As an example, "x or y" means any element of the three-element set {(x),(y),(x,y)}. As another example, "x, y, or z" means any element of the seven-element set {(x),(y),(z),(x,y),(x,z),(y,z),(x,y,z)}.

[0009]

[0014] The terms "comprises," "comprising," "includes," and / or "including" are "open-ended" terms that specify the presence of stated features but do not exclude the presence or addition of one or more other features.

[0010]

[0015] Terms such as "first," "second," and the like may be used herein to describe various elements, and these elements should not be limited by these terms. These terms are used only to distinguish one element from another. Thus, For example, a first element discussed in this disclosure could be termed a second element without departing from the teachings of the disclosure.

[0011]

[0016] Unless otherwise specified, the term "coupled" can be used to describe two elements in direct contact with each other, or two elements that are indirectly connected by one or more other elements. For example, if element A is said to be coupled to element B, element A can be in direct contact with element B, or it can be indirectly connected to element B by an intervening element C. Similarly, the terms "over" or "on" can be used to describe two elements in direct contact with each other, or two elements that are indirectly connected by one or more other elements.

[0012]

[0017] In general, aspects of the present disclosure are directed to a sensor having an addressable depth range and / or field of view. Further aspects of the present disclosure are directed to a computing device having such a sensor. To this end, the sensor may include multiple output couplers positioned at different distances from the receiver. By selectively enabling the output couplers, light or other radiation generated by the transmitter can be directed toward the output couplers and selectively emitted from the sensor at different distances from the transmitter. Such selective emission can adjust the depth range and / or field of view of the sensor. In this manner, the computing device may include a single sensor that can be utilized across applications and / or processes having different needs for depth range and / or field of view.

[0013]

[0018] Referring to FIG. 1, a block diagram of a computing device 100 is shown. 1, computing device 100 includes a sensor 140 having an addressable depth range and / or field of view. In particular, computing device 100 may include one or more processors 110, one or more storage devices 120, a display device 130, sensors 140, and various input / output (I / O) devices 150. Computing device 100 may further include a bus and / or other interconnects that operatively couple processor 110, storage device 120, display device 130, sensors 140, and I / O device 150 to one another. Processor 110 may be configured to execute instructions, manipulate data, and control the operation of other components of computing device 100 as a result of executing such instructions. To this end, processor 110 may include a general-purpose processor, such as, for example, an x86 processor, an ARM processor, etc., available from various vendors. However, processor 110 may also be implemented using application-specific processors and / or other analog and / or digital logic circuitry.

[0014]

[0019] Storage device 120 may include one or more volatile storage devices and / or one or more non-volatile storage devices. Generally, storage device 120 may store software and / or firmware instructions that may be executed by processor 110. Storage device 120 may further store various types of data that may be accessed, modified, and / or otherwise manipulated in response to processor 110 executing instructions. As such, storage device 120 may include random access memory (RAM) devices, read-only memory (ROM) devices, solid-state drive (SSD) drives, flash memory devices, etc. In some embodiments, one or more devices of storage device 120 may be integrated with one or more processors 110.

[0015]

[0020] Display device 130 may present visual output resulting from execution of instructions of processor 110. To this end, display device 130 may include one or more liquid crystal display (LCD) devices, liquid crystal on silicon (LCoS) devices, light emitting diode (LED) devices, organic light emitting diode (OLED) devices, quantum dot devices, interferometric modulator devices, or some other display device.

[0016]

[0021] As described in more detail below, sensor 140 may include a transmitter and receiver that cooperate to generate a 3D scan of a spatial region within its addressable depth range and / or field of view. Computing device 100 may use the generated 3D scan data as part of a facial recognition process, a biometric authentication process, an augmented reality process, an autofocus process, and / or another process. In particular, processor 110 may execute instructions of an operating system, a device driver, an application, and / or some other software and / or firmware module to generate control signals that adjust the depth range and / or field of view of sensor 140.

[0017]

[0022] Other I / O devices 150 may provide devices that enable a user or another device (e.g., another computing device, a networking device, etc.) to interact with computing device 100. For example, I / O devices 150 may include buttons, a touch screen, a keyboard, a microphone, an audio speaker, etc., through which an individual may interact with computing device 100. I / O devices 150 may also include a network interface that enables computing device 100 to communicate with other computing and / or networking devices. To this end, the networking interface may be an Ethernet (IEEE 802.3) interface or a network interface. The networking interface may include a wired networking interface such as a WiFi (IEEE 802.11) interface, a wireless networking interface such as a BlueTooth (IEEE 802.15.1) interface, a wireless or mobile interface such as a cellular interface (GSM, CDMA, LTE, etc.), and / or any other type of networking interface capable of providing a communications link between computing device 100 and another computing and / or networking device.

[0018]

[0023] The above describes aspects of computing device 100. However, there may be considerable variation in the actual implementation of computing device 100. For example, a smartphone implementation of computing device 100 may use significantly different components and have a significantly different architecture than a laptop implementation of computing device 100. Despite such differences, a computing device still generally includes a processor that executes software and / or firmware instructions to implement various functions. Accordingly, the foregoing aspects of computing device 100 have been presented generally from an illustrative point of view, and not from a limiting point of view.

[0019]

[0024] Certain aspects of the present disclosure may be particularly useful for computing devices implemented as mobile consumer electronic devices (e.g., smartphones, tablets, laptops, etc.). However, the present disclosure contemplates aspects having utility across a myriad of different computing devices and / or computing platforms, and the intention is not to limit the scope of the present disclosure to any particular computing device and / or computing platform beyond any such limitations that may be found in the appended claims.

[0020]

[0025] 2A-2C, block diagrams of sensor 200 are shown that may implement sensor 140 of Figure 1. In particular, Figure 2A shows sensor 200 configured to provide a first depth range, Figure 2B shows sensor 200 configured to provide a second depth range that is greater than the first depth range, and Figure 2C shows sensor 200 configured to provide a third depth range that is greater than the second depth range.

[0021]

[0026] As shown, sensor 200 may include a guide 210 (e.g., a light guide or waveguide), an integrated circuit device 220, a transmitter 230, a receiver 240, an input coupler 250, a first output coupler 260, a second output coupler 270, and a third output coupler 280. In various embodiments, sensor 200 may provide an infrared (IR)-based 3D scanning hardware solution for consumer electronics, lidar modules, and / or other 3D scanning environments. In response to control signals, sensor 200 may selectively enable or activate individual ones of couplers 260, 270, 280, which dynamically configure sensor 200 to provide a desired addressable depth range and / or field of view.

[0022]

[0027] In particular embodiments, guide 210 may be disposed above display device 130 (e.g., an OLED screen) of computing device 100. As shown, guide 210 may be positioned or formed above the top surface of integrated circuit device 220, such that the bottom surface of guide 210 is the top surface of integrated circuit device 220. Guide 210 may include an input coupler 250 above transmitter 230 along the bottom surface of guide 210. Guide 210 may further include output couplers 260, 270, 280 along the top surface of guide 210. Input coupler 250 may couple the output of transmitter 230 to guide 210, such that guide 210 couples the output of transmitter 230 can be guided or directed towards the output couplers 260, 270, 280.

[0023]

[0028] Integrated circuit device 220 may include transmitter 230. In various embodiments, integrated circuit device 220 may include additional circuitry and / or components directed to the operation and / or other functionality of sensor 200. Additionally, in various embodiments, transmitter 230 may be implemented as a separate device from integrated circuit device 220.

[0024]

[0029] The transmitter 230 can generate a beam 231 of light and / or other radiation based on a control signal received by the sensor 200. In various embodiments, the transmitter 230 can generate a beam 231 of infrared (IR) light that is emitted by the sensor 200 through selected output couplers 260, 270, 280 to perform an IR scan of a spatial region for each selected addressable depth range. To this end, the transmitter 230 can include a vertical cavity surface emitting laser (VCSEL) array, a light emitting diode (LED), and / or another infrared source. In various embodiments, the sensor 200 can generate a 3D scan of a spatial region using a beam of infrared light, while the transmitter 230 can generate a beam of other forms of radiation, and the guide 210 can be fabricated to guide such beam to the output couplers 260, 270, 280 and generate 3D scan data using such guided beam.

[0025]

[0030] Receiver 240 may be positioned to receive, capture, and / or detect beam 231 of transmitter 230 after such beam 231 is emitted from sensor 200 and reflected by an object within the scan or depth range of sensor 200. To this end, receiver 240 may include an image sensor, such as a charge-coupled device (CCD) image sensor, a complementary metal-oxide semiconductor (CMOS) image sensor, or any other image sensor or camera suitable for receiving beam 231 emitted by transmitter 230. Thus, receiver 240 may be separate from integrated circuit device 220. However, in various embodiments, receiver 240 may be integrated with integrated circuit device 220 and transmitter 230.

[0026]

[0031] The processor 110 can generate control signals that dynamically control the material properties of the output couplers 260, 270, 280. In this manner, the processor 110 can selectively configure each output coupler 260, 270, 280 between a total internal reflection (TIR) ​​state, in which the respective coupler 260, 270, 280 confines the beam 231 to the guide 210, and an outcoupling state, in which the respective coupler 260, 270, 280 allows the beam 231 to escape the guide 210 via the respective coupler 260, 270, 280. In particular, the processor 110, as a result of executing system-level software, can generate voltage, current, differential, and / or other control signals that selectively alter the properties of the output couplers 260, 270, 280 to place the respective output couplers 260, 270, 280 in the TIR state or the outcoupling state. By generating such control signals, the sensor 200 can be configured to illuminate a depth range and / or field of view of interest.

[0027]

[0032] The confinement within the guide 210 can be achieved by a reflective coating along the top and bottom surfaces of the guide 210. The reflective coating can have high reflectivity at grazing angles and low reflectivity near normal angles. The reflective coating can be selectively removed from areas where the beam should be outcoupled via output couplers 260, 270, 280.

[0028]

[0033] The output couplers 260, 270, 280 may be prisms, diffraction, or metasurfaces. The output couplers 260, 270, 280 can be implemented based on their properties. In particular, the output couplers 260, 270, 280 can be disposed within the guide 210 by being embedded or etched into the guide 210 or by being attached to the top surface of the guide 210. In certain embodiments, the output couplers 260, 270, 280 can comprise active materials and metasurface optical elements (MOEs) designed for the specific material refractive index in the grooves of the output couplers 260, 270, 280. In other embodiments, the output couplers 260, 270, 280 can comprise an active layer on the top surface of the guide 210. In such embodiments, the guide 210 can comprise a silicon layer, and the active layer of the output couplers 260, 270, 280 can comprise a liquid crystal on silicon (LCOS) layer. In still other embodiments, the guide 210 itself can comprise the active layer, and the output couplers 260, 270, 280 can be formed within the bulk of the active layer. In such an embodiment, the output couplers 260, 270, 280 may use regions of the active layer of the guide 210 that do not need to maintain a strict index of refraction.

[0029]

[0034] As described, the sensor 200 can be configured to provide a desired scan or depth range. As shown in FIGS. 2A-2C, each output coupler 260, 270, 280 can be positioned at a different distance from the receiver 240. The processor 110 can enable the output coupler 260 to emit the beam 231 from the receiver 240 to a first baseline distance b1. See, for example, FIG. 2A. Similarly, the processor 110 can enable the output coupler 270 to emit the beam 231 from the receiver 240 to a second baseline distance b2, where the second baseline distance b2 is longer than the first baseline distance b1. See, for example, FIG. 2B. Additionally, the processor 110 can enable the output coupler 280 to emit the beam 231 from the receiver 240 to a third baseline distance b3, where the third baseline distance b3 is longer than the second baseline distance b2. See, for example, FIG. 2C.

[0030]

[0035] The depth range or scanning range z of the sensor 200 is proportional to the baseline distance b between the emitted beam 231 and the receiver 240 and can be expressed as:

[0031]

number

[0032] where z corresponds to the depth or scan range, f corresponds to the focal length of the emitted beam 231, b corresponds to the baseline distance, and d corresponds to the difference between the focal length f and the location of the scanned object. By varying the baseline distance (i.e., the distance between the receiver 240 and the emitted beam 231), the processor 110 can configure the sensor for different depth ranges and thus generate 3D scans of objects at different distances z from the sensor 200.

[0033]

[0036] 3 and 4, an exemplary process 400 for generating 3D scan data is shown. In various embodiments, the sensor 200 can be designed such that the depth ranges associated with the output couplers 260, 270, 280 overlap. See, for example, FIG. 3. For such embodiments, the process 400 can perform multiple scans of the object over time, each scan using a different output coupler 260, 270, 280. 0, 280, and therefore use different depth ranges z. Process 400 can utilize data received for the same region from multiple scans, and in some cases, such redundant data can be used to improve the accuracy of the resulting 3D scan data.

[0034]

[0037] To this end, processor 110 may generate 410 control signals to configure sensor 200 for a first depth range. For example, processor 110 may enable output coupler 260 and disable output couplers 270, 280 such that beam 231 is emitted from output coupler 260 at a first baseline distance b1. At time T1, receiver 240 may receive beam 231 emitted at the first baseline distance b1 when beam 231 is reflected by the scanned object. Processor 110 may receive 420 scan data from receiver 240 generated from beam 231 emitted at the first baseline distance b1.

[0035]

[0038] After receiving data for the first baseline distance b1, processor 110 can generate 430 control signals to configure sensor 200 for a second depth range. For example, processor 110 can enable output coupler 270 and disable output couplers 260, 280 such that beam 231 is emitted from output coupler 270 at a second baseline distance b2. At time T2, receiver 240 can receive beam 231 emitted at the second baseline distance b2 when beam 231 is reflected by the scanned object. Processor 110 can receive 440 scan data generated from beam 231 emitted at the second baseline distance b2 from receiver 240.

[0036]

[0039] After receiving data for the second baseline distance b2, processor 110 can generate 450 control signals to configure sensor 200 for a third depth range. For example, processor 110 can enable output coupler 280 and disable output couplers 260, 270 such that beam 231 is emitted from output coupler 280 at third baseline distance b3. At time T3, receiver 240 can receive beam 231 emitted at third baseline distance b3 when beam 231 is reflected by the scanned object. Processor 110 can receive 460 scan data generated from beam 231 emitted at third baseline distance b3 from receiver 240.

[0037]

[0040] At 470, processor 110 can generate 3D scan data based on the data received for each of the baseline distances. In particular, processor 110 can utilize various interpolation techniques to improve the accuracy of the 3D scan data, especially for scan sections where the depth ranges overlap. Generally, depth errors are lowest at the center of the scanned depth range. As a result of the overlapping sections, processor 110 receives multiple data points for portions at the boundaries of the depth range. Through interpolation techniques (e.g., point-wise averaging, windowed averaging, etc.), processor 110 can utilize these multiple or redundant data points to improve depth sensing accuracy and reduce depth errors in the generated 3D scan data.

[0038]

[0041] At 480, the processor 110 can utilize the generated 3D scan data. In particular, the processor 110 can use the generated 3D scan data as part of a facial recognition process, a biometric authentication process, an augmented reality process, autofocus, and / or another process.

[0039]

[0042] 5, a sensor 200' having an addressable field of view is shown. In particular, output couplers 260, 270, 280 can each be implemented with a diffraction grating having a different period (e.g., a different distance between repeating grating structures). Because of the different grating periods, each output coupler 260, 270, 280 can address a different field of view. In FIG. 5 , the output couplers 260, 270, and 280 are all shown as out-coupled to indicate that the angle of the emitted beam 231 is different for each of the output couplers 260, 270, and 280, and each of the output couplers 260, 270, and 280 can provide a different field of view. Thus, the processor 110 can enable a single output coupler 260, 270, and 280 to configure the sensor 200′ for a desired field of view. For example, a single output coupler 260, 270, and 280 can be selected to illuminate a portion of the field of interest. The field of view can be selected based on where the scanned object is identified by a camera, such as another sensor (not shown). Furthermore, a single field of view can be illuminated with a higher output power while still maintaining the output power at a level within eye-safety limits.

[0040]

[0043] Referring now to FIG. 6 , the sensor 200″ is shown having additional optical structures 290, 295 between the transmitter 230 and one or more of the output couplers 260, 270, 280. In various embodiments, the optical structures 290, 295 are added via respective structural patterns on or near the reflective surface of the guide 210 and positioned in front of the respective output couplers 270, 280. Although not shown, the sensor 200″ can, in some embodiments, further include an optical structure between the transmitter 230 and the output coupler 260. Each optical structure 290, 295 can comprise, in front of the respective output coupler 260, 270, 280, a lens or diffractive optical element (DOE) to focus the beam 231, a collimator to collimate the beam 231, a polarizing filter to polarize the beam 231, a wavelength filter to reduce specific wavelengths of the beam 231, a diffuser to scatter the beam 231, etc. By adding optical structures 290, 295, the beam 231 can be focused / reshaped for specific applications (eg, far-field applications).

[0041]

[0044] The guide 210 can also provide optical structures on the top surface or on each output coupler 260, 270, 280. For example, the guide 210 can provide a diffractive optical element (DOE) for the output coupler 260, a diffuser for the output coupler 270, and a focusing lens for the output coupler 280. Other embodiments can pair such optical structures differently with the output couplers 260, 270, 280 and / or combine optical structures for a single output coupler of the output couplers 260, 270, 280. Such flexibility in mixing and matching optical structures for each output coupler 260, 270, 280, and such selectivity as to which of the output couplers 260, 270, 280 to place in an outcoupling state, can enable the use of a single transmitter 230 (e.g., a single IR source, a single VCSEL array, etc.) to accommodate multiple IR-based applications such as structured light, illumination, proximity sensing, etc. Optical structures can also be formed within the guide 210.

[0042]

[0045] In various applications, it may be desirable for the processor 110 to enable multiple couplers 260, 270, 280 simultaneously. Thus, the processor 110 and / or the sensors 200, 200′, 200″ are not limited to outcoupling via only a single output coupler 260, 270, 280. Conversely, the processor 110 and / or the sensors 200, 200′, 200″ may enable outcoupling via various combinations of the output couplers 260, 270, 280. Furthermore, although the sensors 200, 200′, 200″ are shown having three output couplers, other embodiments of the sensors 200, 200′, 200″ may include fewer output couplers, and some embodiments of the sensors 200, 200′, 200″ may include a greater number of output couplers.

[0043]

[0046] Although the present disclosure includes reference to particular examples, those skilled in the art will understand that various modifications may be made and equivalents may be substituted without departing from the scope of the present disclosure. Additionally, modifications may be made to the disclosed examples without departing from the scope of the present disclosure. Accordingly, the present disclosure is not limited to the disclosed examples, but rather is intended to include all examples that fall within the scope of the appended claims. [Explanation of symbols]

[0044] 100 computing devices 110 processors 120 Storage Devices 130 Display Devices 140 sensors 150 Input / Output (I / O) Devices 200 sensors 200' sensor 200" sensor 210 Guide 220 Integrated Circuit Devices 230 Transmitter 231 Beam 240 Receiver 250 Input Combiner 260 first output coupler 270 Second Output Coupler 280 Third Output Coupler 290 Optical structure 295 Optical structure

Claims

1. emitting a beam from a transmitter into a guide; placing a first output coupler associated with a first depth range in an outcoupling state, the first output coupler being selectively operable, based on a control signal, between the outcoupling state causing the first output coupler to emit the beam from the guide and an internal reflection state confining the beam to the guide; receiving first data for the first depth range based on the beam emitted from the first output coupler; placing a second output coupler associated with a second depth range that overlaps with a portion of the first depth range in an outcoupling state, the second output coupler being selectively operable, based on a control signal, between the outcoupling state that causes the second output coupler to emit the beam from the guide and an internal reflection state that confines the beam to the guide; receiving second data for the second depth range based on the beam emitted from the second output coupler; generating 3D scan data based on the first data for the first depth range and the second data for the second depth range; A method comprising:

2. 2. The method of claim 1, wherein generating the 3D scan data comprises interpolating data for the overlapping portion of the 3D scan data based on data from the first data and data from the second data corresponding to the overlapping portion.

3. 2. The method of claim 1, wherein the step of placing the first output coupler in the outcoupling state occurs before the step of placing the second output coupler in the outcoupling state, whereby the first output coupler emits the beam before the second output coupler emits the beam.

4. 10. The method of claim 1, receiving first data for the first depth range includes receiving the beam with a receiver, the receiver being at a first baseline distance from the first output coupler; receiving second data for the second depth range includes receiving the beam with the receiver, the receiver being at a second baseline distance from the second output coupler; method.

5. The method of claim 4 , wherein the second baseline distance is greater than the first baseline distance.

6. 10. The method of claim 1, the first output coupler provides a first field of view; the second output coupler provides a second field of view different from the first field of view. method.

7. 7. The method of claim 6, passing the beam through a first diffraction grating of the first output coupler, the first diffraction grating including a first diffractive structure having a first period; passing the beam through a second diffraction grating of the second output coupler, the second diffraction grating including a second diffractive structure having a second period different from the first period; A method comprising:

8. 10. The method of claim 1, passing the beam through a first optical structure before the beam is emitted from the first output coupler; passing the beam through a second optical structure before the beam is emitted from the second output coupler; A method comprising:

9. 9. The method of claim 8, wherein the first optical structure and the second optical structure each include a lens, a diffractive optical element, a collimator, a polarizing filter, a wavelength filter, or a diffuser.

10. 2. The method of claim 1, wherein placing the first output coupler in the outcoupling state causes the first output coupler to emit the beam through a first optical structure.

11. The method of claim 10 , wherein the first optical structure comprises a lens, a diffractive optical element, a collimator, a polarizing filter, a wavelength filter, or a diffuser.

Images