Printed circuit board and air conditioning device having the same

Abstract

To prevent lead breakage of mounted components due to vibration of heavy components on a substrate.SOLUTION: A printed circuit board 100 has a first component 10, which is a heavy component that stores electrical or inductive energy, a second component 20, which is a power device with a plurality of leads 200, and a substrate 30 on which the first component 10 and second component 20 are mounted. In the substrate 30, a slit 30a is provided between the first component 10 and the second component 20, and the lead of the second component 20 is soldered to the substrate. In the printed circuit board 100, the slit 30a suppresses the propagation of vibration from the heavy first component 10 to the second component 20, thus preventing vibration-induced breakage of the lead 200.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] Regarding printed circuit boards. [Background technology]

[0002] In some cases, slits are provided around components mounted on a board to mitigate the effects on the board when the components are subjected to shock or vibration. For example, in the printed circuit board described in Patent Document 1 (Japanese Utility Model Laid-Open Publication No. 4-107875), discontinuous slits are provided around the mounting portion of a transformer, a heavy component, to prevent cracks from expanding. Summary of the Invention [Problem to be solved by the invention]

[0003] When vibrations are repeatedly applied to the board, the vibrations of a heavy component can be transmitted to components that are far away from the heavy component, causing the leads of those components to break.

[0004] However, Patent Document 1 does not take any measures to prevent vibrations caused by heavy components from causing lead breakage in mounted components. [Means for solving the problem]

[0005] A printed circuit board according to a first aspect includes a first component, a second component, and a substrate. The first component is a heavy component that stores electrical energy or inductive energy. The second component is a power device having multiple leads. The first and second components are mounted on the substrate, which has a slit between the first and second components and to which the leads of the second component are soldered.

[0006] In this printed circuit board, the slits prevent vibrations from the heavy first component from being transmitted to the second component, thereby preventing lead breakage caused by vibrations.

[0007] A printed circuit board according to a second aspect is the printed circuit board according to the first aspect, wherein the leads include a first lead closest to a first component, and a slit is provided between the first component and the first lead.

[0008] In this printed circuit board, the slits prevent vibrations from the heavy first component from being transmitted to the second component, thereby preventing the first lead, which is closest to the first component, from breaking.

[0009] A printed circuit board according to a third aspect is the printed circuit board according to the second aspect, in which, when vibration is applied in a direction perpendicular to the board, the stress on the first lead by the first component is greater than the stress on the other components.

[0010] A printed circuit board according to a fourth aspect is the printed circuit board according to any one of the first to third aspects, wherein a plurality of first components are mounted on the board. The plurality of first components includes a first heavy component. The first heavy component is a heavy component that exerts the greatest stress on its leads when vibration is applied in a direction perpendicular to the board. A slit is provided between the first heavy component and the second component.

[0011] A printed circuit board according to a fifth aspect is the printed circuit board according to any one of the first aspect to the fourth aspect, in which the first component is any one of an electrolytic capacitor, a reactor, and a coil.

[0012] A printed circuit board according to a sixth aspect is the printed circuit board according to any one of the first to fifth aspects, in which the second component is any one of an intelligent power module, an active filter module, an insulated gate bipolar transistor, a MOSFET, a diode, a thyristor, and a triac.

[0013] A printed circuit board according to a seventh aspect is the printed circuit board according to any one of the first to sixth aspects, in which the first component is mounted in the center of the board.

[0014] In this printed circuit board, the first component is located in the center of the board, which makes the board susceptible to distortion due to vibration, and therefore forming slits in the board is highly effective.

[0015] The printed circuit board of an eighth aspect is the printed circuit board of any one of the first aspect to the seventh aspect, wherein a slit penetrates the board.

[0016] A printed circuit board according to a ninth aspect is the printed circuit board according to any one of the first to eighth aspects, wherein the width of the slit is within the range of 1.0 to 4.0 mm.

[0017] This printed circuit board satisfies both the requirements for ease of slit formation and the requirement for prevention of vibration propagation.

[0018] A printed circuit board according to a tenth aspect is the printed circuit board according to any one of the first to ninth aspects, in which the board is fixed to an object via a connecting member and a second component.

[0019] In this printed circuit board, the leads of the second component also function as connecting members, and are therefore more susceptible to repeated fatigue due to vibration than the other mounted components. Therefore, by providing a slit between the first and second components, vibration propagation is blocked and the leads are protected from repeated fatigue.

[0020] An air conditioner according to an eleventh aspect includes the printed circuit board according to any one of the first to tenth aspects. [Brief explanation of the drawings]

[0021] [Figure 1] 1 is a perspective view of an air conditioning device having a printed circuit board according to the present disclosure; [Figure 2] 1 is a circuit diagram of a power conversion circuit configured on a printed circuit board according to the present disclosure. [Figure 3] 3 is a perspective view of the interior of the electrical component box when viewed from a direction in which a first surface of a printed circuit board faces the front. FIG. [Figure 4]4 is an external view of the printed circuit board shown in FIG. 3 when viewed from a direction in which a first surface faces forward. [Figure 5] 4 is an external view of the printed circuit board shown in FIG. 3 when viewed from a direction in which the second surface is the front. FIG. [Figure 6] 4 is a schematic cross-sectional view of an electrical component box accommodating the printed circuit board of FIG. 3. [Figure 7] 6 is an external view of the printed circuit board in FIG. 5 in which the shape of the slit is modified, when viewed from a direction in which the second surface is the front. FIG. [Figure 8] 8 is an external view of the printed circuit board of FIG. 7 in which the number of slits is changed, when viewed from a direction in which the second surface is the front. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0022] (1) Configuration of the printed circuit board 100 Fig. 1 is a perspective view of an air conditioner 1 having a printed circuit board 100 according to the present disclosure. In Fig. 1, the air conditioner 1 includes an indoor unit 4 and an outdoor unit 5. The indoor unit 4 and the outdoor unit 5 are connected by a refrigerant communication pipe 6.

[0023] The indoor unit 4, the outdoor unit 5, and the refrigerant communication pipe 6 constitute a refrigerant circuit. In the refrigerant circuit, a vapor compression refrigeration cycle is repeated during, for example, cooling operation, heating operation, and dehumidifying operation.

[0024] The indoor unit 4 is attached to a wall inside the room, but is not limited to this and may be installed on the ceiling or floor.

[0025] The outdoor unit 5 is installed outdoors and functions as a heat source unit that supplies thermal energy to the indoor unit 4.

[0026] An electrical component box is mounted on the indoor unit 4 and the outdoor unit 5, and a printed circuit board is housed in the electrical component box. Here, the printed circuit board 100 of the outdoor unit 5 will be described as an example.

[0027] FIG. 2 is a circuit diagram of a power conversion circuit 110 configured on a printed circuit board 100 according to the present disclosure.

[0028] 2, a power conversion circuit 110 rectifies AC power to DC power, converts the DC power to AC power of a predetermined frequency, and supplies it to a motor M. The motor M drives, for example, a compressor provided in a refrigerant circuit of the air conditioner 1.

[0029] (1-1) Rectifier diode module 20a The rectifier diode module 20a configures a bridge circuit with four diodes D1a, D1b, D2a, and D2b. Specifically, the diodes D1a and D1b are connected in series, and the diodes D2a and D2b are connected in series.

[0030] The junction point of the diodes D1a and D1b is connected to one pole of the AC power supply AC, and the junction point of the diodes D2a and D2b is connected to the other pole of the AC power supply AC.

[0031] The rectifying diode module 20a rectifies AC power output from an AC power source AC to generate DC power, which is supplied to the first to third electrolytic capacitors 10a to 10c.

[0032] (1-2) First to third electrolytic capacitors 10a to 10c The first to third electrolytic capacitors 10a to 10c smooth the voltage rectified by the rectifying diode module 20a.

[0033] The second electrolytic capacitor 10b and the third electrolytic capacitor 10c are connected in series to smooth and double the voltage, and together with the diode bridge rectifier circuit of the rectifier diode module 20a, form a voltage doubler rectifier circuit.

[0034] The voltage smoothed by the first to third electrolytic capacitors 10a to 10c is supplied to the intelligent power module 20b.

[0035] (1-3) Reactor 10d 2, the reactor 10d is provided in the AC power supply line, with one end connected to the input side (coil 10e) of the AC power supply AC and the other end connected to the diode bridge rectifier circuit of the rectifier diode module 20a. The functions of the reactor 10d are to improve the power factor and suppress harmonics.

[0036] (1-4) Coil 10e The coil 10e is connected between the AC power supply AC and the reactor 10d and is a common mode choke coil that removes common mode noise.

[0037] (1-5) Intelligent Power Module 20b The intelligent power module 20b is a single package that incorporates a switching circuit 25 and a control circuit 26. Hereinafter, the intelligent power module 20b will be referred to as "IPM20b."

[0038] (1-5-1) Switching circuit 25 The switching circuit 25 has three upper and lower arms corresponding to the U-phase, V-phase and W-phase drive coils Lu, Lv and Lw of the motor M, which are connected in parallel to each other to the output side of the first electrolytic capacitor 10a.

[0039] In FIG. 2, switching circuit 25 includes a plurality of IGBTs (insulated gate bipolar transistors, hereinafter simply referred to as transistors) Q3a, Q3b, Q4a, Q4b, Q5a, and Q5b and a plurality of freewheeling diodes D3a, D3b, D4a, D4b, D5a, and D5b.

[0040] Transistors Q3a and Q3b, Q4a and Q4b, and Q5a and Q5b are connected in series to form upper and lower arms, respectively, and output lines extend from the connection points NU, NV, and NW formed thereby to the drive coils Lu, Lv, and Lw of the corresponding phases.

[0041] The diodes D3a to D5b are connected in parallel to the transistors Q3a to Q5b such that the collector terminal of the transistor is connected to the cathode terminal of the diode, and the emitter terminal of the transistor is connected to the anode terminal of the diode.

[0042] A DC voltage is applied to the switching circuit 25, and the transistors Q3a to Q5b are turned on and off at timings instructed by the control circuit 26, thereby generating a drive voltage for driving the motor M. This drive voltage is output to the drive coils Lu, Lv, and Lw of the motor M from the connection points NU, NV, and NW between the transistors Q3a and Q3b, Q4a and Q4b, and Q5a and Q5b, respectively.

[0043] (1-5-2) Control circuit 26 The control circuit 26 changes the on / off state of each of the transistors Q3a to Q5b of the switching circuit 25 based on a command voltage from the inverter microcomputer 35.

[0044] Specifically, the control circuit 26 generates gate control voltages Gu, Gx, Gv, Gy, Gw, and Gz so that pulsed drive voltages having any duty ratio are output from the switching circuit 25 to the motor M. The duty ratio is determined by the inverter microcomputer 35.

[0045] The generated gate control voltages Gu, Gx, Gv, Gy, Gw, and Gz are applied to the gate terminals of the respective transistors Q3a to Q5b.

[0046] (1-6) Inverter microcomputer 35 The inverter microcomputer 35 is connected to the voltage detection unit 32, the current detection unit 33, and the control circuit 26. The inverter microcomputer 35 also monitors the detection value of the voltage detection unit 32, and performs protection control to turn off the transistors Q3a to Q5b when the detection value of the voltage detection unit 32 exceeds a predetermined threshold value.

[0047] (2) Component layout on the printed circuit board 100 FIG. 3 is a perspective view of the inside of the electrical component box 70 when viewed from a direction in which the first surface 301 of the printed circuit board 100 faces forward.

[0048] 4 is an external view of printed circuit board 100 shown in FIG. 3 when viewed from a direction in which first surface 301 faces forward.

[0049] 3 and 4, substrate 30 is a printed wiring board. Substrate 30 has first surface 301, which serves as a mounting surface for components, on its front surface. Substrate 30 also has second surface 302, which serves as a mounting surface for components, on its back surface.

[0050] (2-1) First component 10 mounted on first surface 301 In FIG. 4, first to third electrolytic capacitors 10a to 10c and a coil 10e are mounted as the first component 10 on a first surface 301 of a substrate 30.

[0051] Here, the first electrolytic capacitor 10a is located approximately in the center of the substrate 30, and the second electrolytic capacitor 10b and the third electrolytic capacitor 10c are arranged counterclockwise.

[0052] The first to third electrolytic capacitors 10a to 10c store electrical energy when a voltage is applied between their terminals, and the coil 10e stores inductive energy when a current flows through it.

[0053] The weight of each of the first to third electrolytic capacitors 10a to 10c and the coil 10e is greater than that of the other components mounted on the first surface 301 of the substrate 30, and they are generally known as heavy components.

[0054] Therefore, the first component 10 is defined as a heavy component that stores electrical energy or inductive energy. In addition to electrolytic capacitors and coils, reactors and transformers also fall under the category of the first component 10. The reactor 10d shown in the circuit diagram of FIG. 2 is not shown in FIG. 4 because it is not on the substrate 30, but it is also a heavy component that stores inductive energy.

[0055] (2-2) Second component 20 mounted on second surface 302 FIG. 5 is an external view of printed circuit board 100 shown in FIG. 3 when viewed from a direction in which second surface 302 faces forward.

[0056] 5, three circles drawn with two-dot chain lines indicate the positions of the first to third electrolytic capacitors 10a to 10c mounted on the first surface 301. Also, a rectangular frame drawn with two-dot chain lines indicates the position of the coil 10e mounted on the first surface 301.

[0057] A rectifier diode module 20 a and an IPM 20 b are mounted as second components 20 on a second surface 302 of the substrate 30 .

[0058] The rectifier diode module 20a and the IPM 20b have multiple leads. For example, the IPM 20b has a package portion 150 and multiple leads 200 protruding from the package portion 150, as shown in FIG.

[0059] The rectifier diode module 20a and the IPM 20b are semiconductor elements used for power supply, and are generally known as power devices.

[0060] Therefore, the second component 20 is defined as a power device having multiple leads. In addition to rectifier diode modules and IPMs, active filter modules, insulated gate bipolar transistors, thyristors, and triacs also fall under the category of the second component 20.

[0061] 4 and 5, slits 30a are provided between the first to third electrolytic capacitors 10a to 10c and the IPM 20b on the substrate 30. The function of the slits 30a will be described later in the section "(4) Function of the Slits."

[0062] (3) Fixing the printed circuit board 100 to the electrical component box 70 Fig. 6 is a schematic cross-sectional view of an electrical component box 70 that houses the printed circuit board 100 of Fig. 3. In Fig. 6, the first component 10 corresponds to the first electrolytic capacitor 10a, and the second component 20 corresponds to the IPM 20b.

[0063] 6 , printed circuit board 100 is fixed with second surface 302 facing wall 60 of electrical component box 70 and second surface 302 spaced a predetermined distance from the surface of wall 60. The predetermined distance is set so that components mounted on second surface 302 and metal members protruding from first surface 301 through second surface 302 do not interfere with wall 60.

[0064] (3-1) Connecting member 40 In order to maintain the predetermined distance between the printed circuit board 100 and the wall 60 of the electrical component box 70, connecting members 40 are attached to the corners of the printed circuit board 100. The connecting members 40 are made of resin. The connecting members 40 are rod-shaped and have a head 401, a body 402, a positioning portion 403, a slip-out prevention portion 404, and a groove 405.

[0065] The connecting member 40 is driven from the outside to the inside of the wall 60 of the electrical component box 70 until the head 401 contacts the outer surface of the wall 60. The positioning portion 403 protrudes radially from the outer periphery of the body portion 402.

[0066] The slip-out prevention portion 404 is substantially conical and is located at the end of the body portion 402. The groove portion 405 is formed from the tip of the slip-out prevention portion 404 toward the positioning portion 403. The distance between the positioning portion 403 and the slip-out prevention portion 404 is slightly larger than the thickness of the substrate 30.

[0067] At the four corners of the printed circuit board 100, retaining holes 310 are provided in advance for inserting the slip-out prevention portions 404 of the connecting members 40 thereinto.

[0068] The retaining hole 310 is placed so as to overlap the tip of the fall-out prevention portion 404, and the printed circuit board 100 is pushed toward the positioning portion 403. At this time, the tip of the fall-out prevention portion 404 bends in a direction that narrows the width of the groove portion 405, and the periphery of the retaining hole 310 fits between the positioning portion 403 and the fall-out prevention portion 404. As a result, the printed circuit board 100 is fixed to the electrical component box 70.

[0069] (3-2) Heat sink 50 However, not all four corners of the printed circuit board 100 are fixed to the electrical component box 70 via the connecting members 40 .

[0070] Since the second component 20 such as the IPM 20b generates a larger amount of heat than other mounted components, a heat sink 50 for heat dissipation is attached with screws 90 to the surface that does not face the second surface 302, as shown in FIG.

[0071] Furthermore, since the second component 20 is located closer to the corner of the second surface 302 than the other mounted components, the second component 20 with the heat sink 50 is used as a member for positioning and connecting the board 30 to the electrical component box 70.

[0072] The heat sink 50 attached to the second component 20 is fixed to the electrical component box 70 in a state in which it penetrates the electrical component box 70. However, the heat sink 50 is not fixed directly to the electrical component box 70, but an insulator 56 is sandwiched between the heat sink 50 and the electrical component box 70.

[0073] The insulator 56 is made of resin. A hole 70a is provided in the wall 60 of the electrical component box 70, through which the insulator 56 is inserted. The insulator 56 is formed in a ring shape so as to cover the edge of the hole 70a from the inside of the hole 70a.

[0074] The annular insulator 56 is provided with a hole 56a through which the heat sink 50 is inserted. The heat sink 50 passes through the hole 56a and is exposed to the outside of the electrical component box 70. The heat sink 50 and the insulator 56 are fastened together with screws 90.

[0075] As described above, the second component 20 and the heat sink 50 function as connecting members that fix the printed circuit board 100 to the electrical component box 70 .

[0076] (4) Function of the slit As described above, in the IPM 20b serving as the second component 20, the leads 200 are soldered to the substrate 30, and the package portion 150 is fixed to the electrical component box 70 via the heat sink 50. Therefore, the IPM 20b is unlikely to be displaced relative to both the substrate 30 and the electrical component box 70.

[0077] For example, when vibration is applied to the substrate 30 in a direction perpendicular to the substrate 30 (thickness direction), and the first component 10, which is a heavy component, vibrates, the vibration propagates to other components mounted on the substrate 30.

[0078] The IPM 20b is less susceptible to displacement relative to both the substrate 30 and the electrical component box 70, and therefore is subjected to repeated stress greater than that of other mounted components. In particular, the leads 200 are weaker than the package section 150 and may therefore break.

[0079] 4 to 6, in this embodiment, a slit 30a is provided between the first component 10 and the second component 20 of the substrate 30. The slit 30a suppresses the propagation of vibration from the heavy first component 10 to the second component 20, thereby preventing breakage of the leads 200 due to vibration.

[0080] Specifically, as shown in FIG. 5, when the lead closest to the first component 10, that is, the first to third electrolytic capacitors 10a to 10c, of the multiple leads 200 of the IPM 20a is defined as the first lead 201, a slit 30a is provided between the first lead 201 and the first to third electrolytic capacitors 10a to 10c.

[0081] The width of the slit 30a is preferably within the range of 1.0 mm to 4.0 mm, taking into consideration both workability and prevention of vibration propagation.

[0082] Furthermore, it is preferable that the slits 30a penetrate the substrate 30. In this case, the vibration propagation from the first component 10 is blocked by the penetrating slits 30a, and propagation to the second component 20 is suppressed.

[0083] (4-1) Slit length The slit does not necessarily have to be long enough to cover the space between the second component 20 and all of the first components (the first to third electrolytic capacitors 10a to 10c and the coil 10e).

[0084] FIG. 7 is an external view of second surface 302 of printed circuit board 100 in which the length of the slit in FIG. 5 has been changed.

[0085] 7, a slit 30b is provided between a first electrolytic capacitor 10a located in the center of a substrate 30 and a first lead 201, which is the lead closest to the first electrolytic capacitor 10a. Therefore, the length of the slit 30b is shorter than the slit 30a shown in FIG. 5, and is set to a length that only suppresses the propagation of vibrations from the first electrolytic capacitor 10a.

[0086] Experiments conducted by the applicant have shown that slit 30b provides the same effect as slit 30a shown in Figure 5. Since the vibration amplitude of the first component 10 (first electrolytic capacitor 10a) located at the center of substrate 30 is the largest, it is believed that the greatest effect is achieved by suppressing vibration propagation from first electrolytic capacitor 10a. The length of the slit is preferably 15 to 30 mm.

[0087] (4-2) Number and position of slits FIG. 8 is an external view of second surface 302 of printed circuit board 100 in FIG. 7, in which the number of slits is changed.

[0088] In FIG. 8, a slit 30c is added between the coil 10e, which is the first component 10 farthest from the IPM 20b, and the first lead 201 of the IPM 20b, and in the vicinity of the coil 10e.

[0089] Experiments conducted by the applicant have shown that vibration propagation from coil 10e, which is farthest from IPM 20b, can be greater than that from first electrolytic capacitor 10a, which is located in the center of substrate 30 and has the largest vibration amplitude.

[0090] This is presumably due to the influence of the weight balance between the coil 10e and the first to third electrolytic capacitors 10a to 10c. In such a case, by providing the slit 30c close to the coil 10e, which is the vibration source, it is possible to effectively suppress the propagation of vibration from the coil 10e.

[0091] (5) Features (5-1) The printed circuit board 100 includes a first component 10, which is a heavy component that stores electrical energy or inductive energy; a second component 20, which is a power device having a plurality of leads 200; and a substrate 30 on which the first component 10 and the second component 20 are mounted. The substrate 30 has slits (30a, 30b, 30c) formed between the first component 10 and the second component 20, and the leads 200 of the second component 20 are soldered to the slits. In the printed circuit board 100, the slits (30a, 30b, 30c) prevent vibrations from the heavy first component 10 from propagating to the second component 20, thereby preventing breakage of the leads 200 due to vibrations.

[0092] (5-2) Between the first component 10 and a first lead 201 that is closest to the first component 10 among the multiple leads 200 of the second component 20, slits (30a, 30b, 30c) are provided.

[0093] (5-3) When vibration is applied to the substrate 30 in a direction perpendicular to the substrate 30, the stress on the first lead 201 caused by the first component 10 is greater than the stress on the other components.

[0094] (5-4) Slits (30a, 30b, 30c) are provided between the first component 10 and the second component 20, which have the greatest stress on the leads 200 when vibration is applied in a direction perpendicular to the substrate 30 among the plurality of first components 10.

[0095] (5-5) The first component 10 is any one of an electrolytic capacitor, a reactor, and a coil.

[0096] (5-6) The second component 20 is one of an intelligent power module, an active filter module, an insulated gate bipolar transistor, a thyristor, and a triac.

[0097] (5-7) In the printed circuit board 100, the first component 10 is located in the center of the substrate 30, which makes the substrate 30 prone to distortion due to vibration, and therefore forming slits (30a, 30b) in the substrate 30 is highly effective.

[0098] (5-8) The slits 30 a , 30 b , and 30 c penetrate the substrate 30 .

[0099] (5-9) If the width of the slits 30a, 30b, 30c is within the range of 1.0 to 4.0 mm, both the workability and the prevention of vibration propagation can be satisfied.

[0100] (5-10) The substrate 30 is fixed to an object via a connecting member 40 and a second component 20. Because the leads 200 of the second component 20 also function as a connecting member, the second component 20 is more susceptible to repeated fatigue due to vibration than the other mounted components. Therefore, by providing slits (30a, 30b, 30c) between the first component 10 and the second component 20, it is possible to block vibration propagation and protect the leads 200 from repeated fatigue.

[0101] Although the embodiments of the present disclosure have been described above, it will be understood that various changes in form and details can be made without departing from the spirit and scope of the present disclosure as defined in the claims. [Industrial Applicability]

[0102] The slits according to the present disclosure are not limited to printed circuit boards mounted on outdoor units, but can also be applied to printed circuit boards mounted on indoor units of air conditioners, printed circuit boards mounted on refrigeration devices other than air conditioners, and printed circuit boards mounted on electrical equipment. [Explanation of symbols]

[0103] 1. Air conditioning equipment 10 First Part 10a 1st electrolytic capacitor (1st part) 10b Second electrolytic capacitor (first part) 10c Third electrolytic capacitor (first part) 10d Reactor (first part) 10e Coil 10e (first part) 20 Second part 20A Rectifier Diode Module (2nd Component) 20b Intelligent Power Module (IPM; second component) 30 boards 30a slit 30b slit 30c slit 40 Connecting member 70 Electrical equipment box (object) 100 printed circuit board 200 leads 201 1st Lead [Prior art documents] [Patent documents]

[0104] [Patent Document 1] Japanese Utility Model Application Publication No. 4-107875

Claims

1. a first component (10) that is a heavy component that stores electrical energy or inductive energy, and a predetermined weight component that is a component other than the first component (10) that belongs to the heavy components; one or more second components (20) that are power devices having a plurality of leads (200); a substrate (30) on which the first component (10), the component of a predetermined weight, and the second component (20) are mounted, a slit (30a, 30b, 30c) is provided between the first component (10) and at least one specified component (20b) of the second components (20), and the lead (200) of the second component (20) is soldered; Equipped with The first component (10) and the component of the predetermined weight are mounted on a first surface (301) on one side of the front or rear of the substrate (30), and the specified component (20b) is mounted on a second surface (302) on the other side of the front or rear of the substrate (30); The substrate (30) is fixed to an object (70) on the second surface (302) side, With respect to the specified component (20b) in which the slit is provided between the specified component (20b) and the first component (10), when viewed from a direction in which the second surface (302) of the substrate (30) is the front, the leads (200) of the specified component (20b) are arranged so as not to overlap either the first component (10) or the component of predetermined weight with the substrate (30) interposed therebetween; the second component (20) includes an intelligent power module; the identified component is the intelligent power module; A printed circuit board (100).

2. The plurality of leads (200) includes a first lead (201) closest to the first component (10); The slits (30a, 30b, 30c) are provided between the first component (10) and the first lead (201). The printed circuit board (100) of claim 1.

3. When vibration is applied in a direction perpendicular to the substrate (30), the stress on the first lead (201) caused by the first component (10) is greater than the stress on other components. The printed circuit board (100) of claim 2.

4. The first component (10) is any one of an electrolytic capacitor, a reactor, and a coil. The printed circuit board (100) of claim 1 or claim 2.

5. The second component (20) is an active filter module or a component used in power conversion, and further includes any one of an insulated gate bipolar transistor, a MOSFET, a diode, a thyristor, and a triac. The printed circuit board (100) of claim 1.

6. The first component (10) is mounted in the center of the substrate (30). The printed circuit board (100) of claim 1 or claim 2.

7. The slits (30a, 30b, 30c) penetrate the substrate (30). The printed circuit board (100) of claim 1 or claim 2.

8. The width of the slits (30a, 30b, 30c) is within the range of 1.0 to 4.0 mm. The printed circuit board (100) of claim 1 or claim 2.

9. The substrate (30) is fixed to the object (70) via a connecting member (40) and the second part (20). The printed circuit board (100) of claim 1 or claim 2.

10. A printed circuit board (100) according to claim 1 or claim 2. Air conditioning device (1).

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