Substrate processing apparatus, processing liquid supply method, and computer storage medium

Abstract

To suppress residence of a process liquid in a process liquid supply line, and improve a cleanliness of the process liquid.SOLUTION: A substrate processing apparatus comprises: a substrate holding part that holds and rotates a substrate; a discharge part that discharges a process liquid to the substrate; and a liquid supply device. The liquid supply device includes: a process liquid supply part that supplies the process liquid to the discharge part; a process liquid collection part that collects the process liquid discharged from the discharge part; and a control part that controls the process liquid supply part and the process liquid collection part. The process liquid supply part includes: a process liquid supply source; a first pipe that guides the process liquid to the discharge part from the process liquid supply source; a first liquid feeding mechanism that makes the discharge part continuously discharge the process liquid; and a first filter that is provided in the first pipe. The process liquid collection part has a construction of feeding the process liquid discharged from the discharge part to between the process liquid supply source in the first pipe and the first filter.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a substrate processing apparatus, a processing liquid supply method, and a computer storage medium. [Background technology]

[0002] Patent Document 1 discloses a processing liquid supply device that supplies a processing liquid to a processing object through a processing liquid supply channel and a nozzle using a liquid delivery mechanism. This processing liquid supply device includes an on-off valve provided in the processing liquid supply channel, a flow path adjustment unit provided in the processing liquid supply channel between the on-off valve and the nozzle for adjusting the volume by changing the cross-sectional area of ​​a portion of the processing liquid supply channel, and a control unit. The control unit outputs a control signal to the flow path adjustment unit to temporarily stop the discharge of the processing liquid from the nozzle so as to change the volume of the portion of the processing liquid supply channel from a first volume to a second volume that is smaller than the first volume and greater than zero, and outputs a control signal to the on-off valve so as to close the processing liquid supply channel after the volume of the portion of the processing liquid supply channel has been adjusted to the second volume and before the flow of the processing liquid whose discharge has been stopped is resumed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-139665 Summary of the Invention [Problem to be solved by the invention]

[0004] The technology according to the present disclosure prevents the processing liquid from stagnating in the processing liquid supply pipe line, thereby improving the cleanliness of the processing liquid. [Means for solving the problem]

[0005] One aspect of the present disclosure is a substrate processing apparatus including a substrate holding unit that holds and rotates a substrate, a discharge unit that discharges a processing liquid onto the substrate, and a liquid supply device, wherein the liquid supply device includes a processing liquid supply unit that supplies the processing liquid to the discharge unit, a processing liquid recovery unit that recovers the processing liquid discharged from the discharge unit, and a control unit that controls the processing liquid supply unit and the processing liquid recovery unit, wherein the processing liquid supply unit includes a processing liquid supply source, a first pipeline that guides the processing liquid from the processing liquid supply source to the discharge unit, a first liquid delivery mechanism that continuously discharges the processing liquid from the discharge unit, and a first filter provided in the first pipeline, and the processing liquid recovery unit is configured to deliver the processing liquid discharged from the discharge unit to a position between the processing liquid supply source and the first filter in the first pipeline. the processing liquid recovery unit further comprises a liquid receiving unit that receives the processing liquid discharged from the discharge unit, a second conduit that guides the processing liquid received in the liquid receiving unit to the first conduit, a second liquid delivery mechanism that continuously delivers the processing liquid toward the first conduit, and a second filter provided in the second conduit, the second conduit being connected to the first conduit between the processing liquid supply source and the first filter, and the processing liquid recovery unit further comprises a drain conduit branching from the second conduit, and a first conduit side detection unit that detects foreign matter in the processing liquid, the first conduit being between the first filter and the discharge unit. . [Effects of the Invention]

[0006] According to the present disclosure, it is possible to suppress the accumulation of the processing liquid in the processing liquid supply pipe line and improve the cleanliness of the processing liquid. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a longitudinal sectional view showing an outline of the configuration of a resist coating apparatus according to an embodiment of the present invention. [Figure 2] 1 is a cross-sectional view showing an outline of the configuration of a resist coating apparatus according to an embodiment of the present invention. [Figure 3] 1 is an explanatory diagram showing an outline of the configuration of a liquid supply device according to an embodiment of the present invention; [Figure 4] 10 is a diagram showing a state of the liquid supply device until a predetermined amount of resist liquid is stored in the second tank in a pre-dispense process. FIG. [Figure 5] 10 is a diagram showing a state of the liquid supply device when liquid is sent from the second tank to the second foreign matter detection sensor in the pre-dispense process. FIG. [Figure 6] FIG. 10 is a diagram showing the state of the liquid supply device when liquid is sent from the second pipeline to the first pipeline in a pre-dispense step. [Figure 7]FIG. 10 is a diagram showing the state of the liquid supply device when the resist liquid is circulated and filtered in the pre-dispense process. [Figure 8] FIG. 10 is a diagram showing the state of the liquid supply device when the resist liquid is discharged outside the system in the pre-dispense step. [Figure 9] FIG. 2 is an explanatory diagram showing an example of the configuration of a resist liquid recovery unit. [Figure 10] FIG. 10 is a diagram showing the state of the liquid supply device when the resist liquid is discharged outside the system in the pre-dispense step. [Figure 11] FIG. 2 is an explanatory diagram showing an example of the configuration of a resist liquid recovery unit. [Figure 12] FIG. 2 is an explanatory diagram showing an example of the configuration of a resist liquid recovery unit. DETAILED DESCRIPTION OF THE INVENTION

[0008] In the photolithography process in the manufacturing process of semiconductor devices, etc., a series of processes is performed to form a predetermined resist pattern on a substrate such as a semiconductor wafer (hereinafter referred to as "wafer"). This series of processes includes, for example, a resist coating process in which a resist solution is supplied onto the substrate to form a resist film, an exposure process in which the resist film is exposed to light, and a development process in which a developer is supplied to the exposed resist film and developed.

[0009] A processing liquid such as a resist liquid or a developer liquid is discharged onto a substrate through a discharge nozzle. The processing liquid is supplied to the discharge nozzle by a liquid supply device. The liquid supply device has a processing liquid supply line for guiding the processing liquid from a processing liquid supply source to the discharge nozzle. The processing liquid supply line is provided with a pump and a filter.

[0010] It is desirable that the processing liquid applied to the wafer has as high a degree of cleanliness as possible to prevent defects in the product due to foreign matter. However, if the processing liquid remains in the processing liquid supply line, there is a concern that defective components may leach out from parts such as pumps and filters installed in the processing liquid supply line. Therefore, when the processing liquid is not being discharged from the discharge nozzle, such as when products are not being produced, measures are needed to prevent the processing liquid from remaining in the processing liquid supply line for a long period of time.

[0011] As a countermeasure, it is known to periodically perform a so-called pre-dispense, in which the processing liquid in the processing liquid supply pipeline is discharged to a predetermined discharge location. However, there is a short period of time between the end of the pre-dispense and the start of the next pre-dispense, during which the processing liquid remains. Therefore, conventional liquid supply devices have room for improvement in terms of further improving cleanliness.

[0012] Therefore, the technology according to the present disclosure prevents the processing liquid from stagnating in the processing liquid supply pipe line, thereby improving the cleanliness of the processing liquid.

[0013] Hereinafter, a substrate processing apparatus and a processing liquid supply method according to the present embodiment will be described with reference to the drawings. In this specification and the drawings, elements having substantially the same functional configurations are designated by the same reference numerals, and redundant description will be omitted.

[0014] <Resist coating equipment> A resist coating apparatus as a substrate processing apparatus according to this embodiment will be described with reference to Figures 1 and 2. Figures 1 and 2 are a longitudinal sectional view and a transverse sectional view, respectively, showing the outline of the configuration of the resist coating apparatus.

[0015] 1, the resist coating apparatus 1 has a processing vessel 10 whose interior can be closed. A loading / unloading port (not shown) for a wafer W serving as a substrate is formed on the side of the processing vessel 10, and an opening / closing shutter (not shown) is provided at the loading / unloading port.

[0016] A spin chuck 20 is provided in the center of the processing vessel 10 as a rotary holder that holds and rotates the wafer W. The spin chuck 20 has a horizontal upper surface, and the upper surface is provided with, for example, a suction port (not shown) that sucks the wafer W. The wafer W can be sucked and held on the spin chuck 20 by suction from the suction port.

[0017] The spin chuck 20 has a chuck drive mechanism 21 equipped with, for example, a motor or the like, and can rotate at a predetermined speed by the chuck drive mechanism 21. The chuck drive mechanism 21 is also provided with an elevation drive source such as a cylinder, and the spin chuck 20 can move up and down.

[0018] A cup 30 is provided around the spin chuck 20 to receive and collect liquid that splashes or drops from the wafer W. A discharge pipe 31 for discharging the collected liquid and an exhaust pipe 32 for exhausting the atmosphere inside the cup 30 are connected to the bottom surface of the cup 30.

[0019] As shown in Fig. 2, a rail 40 extending in the Y direction (left and right direction in Fig. 2) is formed on the negative X direction side (downward direction in Fig. 2) of the cup 30. The rail 40 is formed, for example, from the outside of the negative Y direction side (left direction in Fig. 2) of the cup 30 to the outside of the positive Y direction side (right direction in Fig. 2). An arm 41 is attached to the rail 40.

[0020] A discharge nozzle 42 serving as a discharge unit for discharging a resist liquid as a processing liquid is supported on the arm 41. The arm 41 is movable on the rail 40 by a nozzle driving unit 43. This allows the discharge nozzle 42 to move from a waiting unit 44 installed outside the cup 30 on the positive Y-direction side to above the center of the wafer W in the cup 30, and further to move radially over the surface of the wafer W. The arm 41 is also movable up and down by the nozzle driving unit 43, allowing the height of the discharge nozzle 42 to be adjusted. The discharge nozzle 42 is connected to a liquid supply device 100 serving as a processing liquid supply device for supplying the resist liquid, as shown in FIG. 1.

[0021] <Liquid supply device> Next, an example of the configuration of the liquid supplying device 100 will be described with reference to Fig. 3. Fig. 3 is an explanatory diagram showing an outline of the configuration of the liquid supplying device 100 according to this embodiment.

[0022] The liquid supplying device 100 has a resist liquid supplying unit 110 as a processing liquid supplying unit that supplies a resist liquid to the discharge nozzle .

[0023] (Resist liquid supply unit) The resist solution supply unit 110 has a bottle 111 as a processing solution supply source. The bottle 111 stores the resist solution and is replaceable. The resist solution supply unit 110 has a first pipe 120 that guides the resist solution stored in the bottle 111 to the discharge nozzle 42.

[0024] A gas supply path 130 is connected to the top of the bottle 111. The gas supply path 130 is connected to a gas supply source 131 and supplies a gas such as an inert gas to the bottle 111. An on-off valve V1 that opens and closes the gas supply path 130 is provided in the gas supply path 130. An electropneumatic regulator 132 for adjusting pressure is provided upstream of the on-off valve V1 in the gas supply path 130.

[0025] In the first pipeline 120, a first tank 112, a first rotary pump 113, a dilatation pump 114, a first filter 115, and a first foreign matter detection sensor 116 are provided in this order from the upstream side (bottle 111 side) to the downstream side (discharge nozzle 42 side). The first pipeline 120 also has a plurality of pipes 121-125.

[0026] The first tank 112 is an example of a first processing liquid storage unit, and stores the resist liquid supplied from the bottle 111. The first tank 112 and the bottle 111 are connected by a pipe 121, and an on-off valve V2 is provided on the pipe 121. The resist liquid is supplied from the bottle 111 to the first tank 112 by opening the on-off valves V1 and V2 and pressure-feeding gas from the gas supply path 130.

[0027] The first rotary pump 113 is a pump that can continuously deliver the resist liquid. While the first rotary pump 113 is operating, the resist liquid is continuously (non-intermittently) delivered toward the downstream side of the first rotary pump 113. The first rotary pump 113 and the first tank 112 are connected by a pipe 122.

[0028] The fram pump 114 is an example of a metering pump. When the fram pump 114 is operated, a fixed amount of resist liquid is sent downstream. The resist liquid sent out by the fram pump 114 is stored in a storage chamber (not shown) of the fram pump 114. The fram pump 114 and the first rotary pump 113 are connected by a pipe 123.

[0029] In the resist solution supply unit 110, the above-mentioned first rotary pump 113 and dilatation pump 114 constitute a first solution delivery mechanism that supplies the resist solution to the discharge nozzle 42. This first solution delivery mechanism has the first rotary pump 113, and therefore can continuously deliver the solution toward the discharge nozzle 42. That is, this first solution delivery mechanism makes it possible to continuously discharge the resist solution from the discharge nozzle 42.

[0030] It should be noted that the first liquid delivery mechanism that continuously discharges the resist liquid from the discharge nozzle 42 is not limited to the configuration described in this embodiment. For example, the first rotary pump 113 may be provided downstream of the fram pump 114 instead of upstream. Alternatively, for example, without providing the first rotary pump 113, the resist liquid may be continuously discharged from the discharge nozzle 42 by continuing to pressure-feed gas from the gas supply path 130 connected to the bottle 111 or a gas supply path (not shown) connected to the first tank 112.

[0031] The first filter 115 captures and removes foreign matter from the resist liquid. The first filter 115 is provided downstream of the dip pump 114, and the first filter 115 and the dip pump 114 are connected by a pipe 124.

[0032] The first foreign matter detection sensor 116 is an example of a first conduit side detector that detects foreign matter in the resist liquid in the first conduit 120. The first foreign matter detection sensor 116 is provided in a pipe 125 that is connected to the first filter 115 and the discharge nozzle 42, and detects foreign matter in the resist liquid that has passed through the first filter 115. As the first foreign matter detection sensor 116, for example, a sensor that can detect the number of foreign matter per unit volumetric flow rate is used. An on-off valve V3 is provided in the pipe 125 downstream of the first foreign matter detection sensor 116.

[0033] The resist liquid supply unit 110 configured as described above supplies the resist liquid to the discharge nozzle 42. The liquid supply device 100 also has a resist liquid recovery unit 140 that recovers the resist liquid discharged from the discharge nozzle 42 when performing a pre-dispense.

[0034] (Resist liquid recovery section) The resist liquid recovery unit 140 has a dummy dispense port 141 as a liquid receiving unit. The dummy dispense port 141 is provided in the standby unit 44 shown in Figures 1 and 2, and receives the resist liquid discharged from the discharge nozzle 42. The resist liquid recovery unit 140 also has a second pipeline 150 that guides the resist liquid discharged into the dummy dispense port 141 to the first pipeline 120.

[0035] In second pipeline 150, a second tank 142, a second rotary pump 143, a second filter 144, and a second foreign object detection sensor 145 are provided in this order from upstream to downstream. Second pipeline 150 has a plurality of pipes 151-154.

[0036] The second tank 142 is an example of a second processing liquid storage unit, and stores the resist liquid received by the dummy dispense port 141. The second tank 142 and the dummy dispense port 141 are connected by a pipe 151. The second tank 142 is also provided with, for example, a liquid level sensor (not shown), which outputs a signal to a control unit M described below when the liquid level of the resist liquid in the second tank 142 reaches a predetermined height.

[0037] The second rotary pump 143 is a pump that can continuously deliver the resist liquid. While the second rotary pump 143 is operating, the resist liquid is continuously (non-intermittently) delivered toward the downstream side of the second rotary pump 143. The second rotary pump 143 and the second tank 142 are connected by a pipe 152.

[0038] In the resist liquid recovery unit 140, the second rotary pump 143 described above constitutes a second liquid supply mechanism that continuously supplies the resist liquid to the first pipeline 120. Note that the second liquid supply mechanism is not limited to the configuration described in this embodiment as long as it is configured to be capable of continuous liquid supply.

[0039] The second filter 144 collects and removes foreign matter from the resist liquid. The second filter 144 is provided downstream of the second rotary pump 143, and the second filter 144 and the second rotary pump 143 are connected by a pipe 153. Note that, since the resist liquid that has passed through the flow path in the dummy dispense port 141 is likely to be contaminated with foreign matter adhering to the inner wall surface of the flow path, it is preferable to provide the second filter 144.

[0040] The second foreign matter detection sensor 145 is an example of a second conduit side detection unit that detects foreign matter in the resist liquid in the second conduit 150. The second foreign matter detection sensor 145 is provided in a pipe 154 connected downstream of the second filter 144, and detects foreign matter in the resist liquid that has passed through the second filter 144. As the second foreign matter detection sensor 145, for example, a sensor that can detect the number of foreign matter per unit volume flow rate is used.

[0041] A pipe 154 connected to the second foreign matter detection sensor 145 is connected to the upper part of the first tank 112 of the resist solution supply unit 110. An on-off valve V5 is provided in this pipe 154 between the second foreign matter detection sensor 145 and the first tank 112.

[0042] A drainage pipe 160 is connected to the pipe 154 between the second foreign object detection sensor 145 and the on-off valve V5. The drainage pipe 160 is a flow path branched off from the second pipe 150, and is provided to discharge the resist liquid in the second pipe 150 to the outside of the system. The drainage pipe 160 is provided with an on-off valve V6.

[0043] Furthermore, a circulation line 170 branching off from the second line 150 is provided upstream of the connection between the second line 150 and the drainage line 160. The circulation line 170 is a flow path for transporting the resist liquid that has passed through the second foreign matter detection sensor 145 from the downstream side to the upstream side of the second line 150. One end of the circulation line 170 is connected to a pipe 153 in the second line 150 between the second rotary pump 143 and the second filter 144. The other end of the circulation line 170 is connected to a pipe 154 in the second line 150 downstream of the second foreign matter detection sensor 145 and upstream of the connection with the drainage line 160. An on-off valve V7 is provided in the circulation line 170.

[0044] In the resist solution supply unit 110 and the resist solution recovery unit 140 described above, drain pipes and other on-off valves (not shown) are appropriately provided.

[0045] The resist coating apparatus 1 and the liquid supply apparatus 100 are controlled by a control unit M. The control unit M is a computer equipped with a processor such as a CPU, a memory, and the like, and has a program storage unit (not shown). The program storage unit stores a program that controls the processing in the resist coating apparatus 1 and the liquid supply apparatus 100. The program may be recorded on a computer-readable storage medium H and installed from the storage medium H into the control unit M. The storage medium H may be temporary or non-temporary. Furthermore, part or all of the program may be realized by dedicated hardware (circuit board).

[0046] Each of the on-off valves V1 to V7 provided in the liquid supplying device 100 is an electromagnetic valve or an air-operated valve that can be controlled by the control unit M, and each of the on-off valves V1 to V7 is electrically connected to the control unit M. The control unit M is also electrically connected to each of the pumps 113, 114, and 143. With this configuration, a series of processes in the liquid supplying device 100 can be performed automatically under the control of the control unit M.

[0047] <Operation of the liquid supply device 100> Next, an example of the operation of the liquid supplying device 100 will be described.

[0048] 1, in the process of applying a resist liquid to a wafer W, a discharge nozzle 42 moves to the center of the wafer W held by a spin chuck 20. Thereafter, in the liquid supply device 100 shown in FIG. 3, the on-off valves V1 to V3 are opened, and the dilatation pump 114 is operated, thereby sending a fixed amount of resist liquid toward the discharge nozzle 42. At this time, the first rotary pump 113 is in a state where it can pass liquid but is not driven, and the supply of the resist liquid from the first tank 112 to the dilatation pump 114 is not hindered.

[0049] By the above-described liquid transfer, the resist liquid is discharged from the discharge nozzle 42 to the center of the wafer W. Then, the spin chuck 20 rotates, and the resist liquid is applied to the entire surface of the wafer W. Thereafter, as shown in FIG. 2, the discharge nozzle 42 moves to the waiting section 44, and a dummy dispense is performed.

[0050] An example of the operation of liquid supply apparatus 100 in a dummy dispensing step (a step in which the resist liquid is received in the resist liquid recovery section) will be described below with reference to Figures 4 to 8. In Figures 4 to 8 and Figure 10 described later, valves in an open state are shown in white, valves in a closed state are shown in black, and pipes through which the resist liquid flows are shown in thick lines, and descriptions of the open and closed states of other valves will be omitted as appropriate.

[0051] 4, in the pre-dispense step, first, the on-off valves V1 to V3 are opened, and the on-off valve V4 is closed, and the first rotary pump 113 is driven. At this time, the dilatation pump 114 is in a state where it can pass liquid, but is not driven. In this way, by using the first rotary pump 113, which is capable of continuous liquid delivery, rather than the dilatation pump 114, which is capable of constant liquid delivery, to deliver the liquid, the liquid is delivered continuously toward the discharge nozzle 42, and the resist liquid is constantly discharged from the discharge nozzle 42. Note that the resist liquid delivered to the discharge nozzle 42 is subjected to foreign matter detection by the first foreign matter detection sensor 116, and information on the detected amount of foreign matter (detection value) is output to the control unit M.

[0052] The resist liquid discharged into the dummy dispense port 141 is stored in the second tank 142 via the pipe 151. When a predetermined amount of resist liquid is stored in the second tank 142, the on-off valve V4 is opened as shown in Fig. 5. At this time, the on-off valves V5 to V7 are closed. Subsequently, the second rotary pump 143 is driven, and the resist liquid in the second tank 142 is continuously sent to the downstream side of the second rotary pump 143.

[0053] Thereafter, foreign matter in the resist liquid is detected by the second foreign matter detection sensor 145. Information on the amount of foreign matter detected here (detection value) is output to the control unit M, and the control unit M compares the amount of foreign matter A detected by the first foreign matter detection sensor 116 with the amount of foreign matter B detected by the second foreign matter detection sensor 145. Then, based on the fluctuation value of the amount of foreign matter B relative to the amount of foreign matter A (for example, the value of B / A or A / B), the liquid transfer path of the resist liquid in the second pipeline 150 is switched. Note that, since foreign matter adhering to the flow path in the dummy dispense port 141 is likely to be mixed into the resist liquid in the second pipeline 150, the amount of foreign matter B is usually greater than the amount of foreign matter A.

[0054] In this embodiment, for example, when the fluctuation value (B / A) of the foreign matter amount B relative to the foreign matter amount A is less than the first threshold value, the on-off valve V5 of the pipe 154 is opened as shown in Fig. 6. As a result, the resist liquid in the second pipe 150 is sent to the first tank 112 provided in the first pipe 120 via the pipe 154 and is reused as the resist liquid to be discharged from the discharge nozzle 42.

[0055] On the other hand, when the fluctuation value (B / A) of the foreign matter amount B relative to the foreign matter amount A is equal to or greater than the first threshold value and less than the second threshold value, as shown in Fig. 7, the on-off valve V5 is closed and the on-off valve V7 is open. As a result, the resist liquid that has passed through the second foreign matter detection sensor 145 flows into the circulation pipe 170 and is sent to the pipe 153 upstream of the second filter 144. This resist liquid then passes through the second filter 144 again, reducing the amount of foreign matter in the liquid. Thereafter, the second foreign matter detection sensor 145 again detects foreign matter in the liquid, and the resist liquid is repeatedly filtered until the fluctuation value (B / A) becomes less than the first threshold value.

[0056] When the fluctuation value (B / A) becomes less than the first threshold value due to such circulating filtration of the resist liquid, the on-off valve V5 is opened and the on-off valve V7 is closed as shown in FIG. 6, and the resist liquid is sent to the first pipeline 120.

[0057] On the other hand, when the fluctuation value (B / A) of the amount of foreign matter B relative to the amount of foreign matter A is equal to or greater than the second threshold, as shown in FIG. 8, the on-off valves V5 and V7 are closed and the on-off valve V6 is open. As a result, the resist solution that has passed through the second foreign matter detection sensor 145 is discharged to the outside of the system via the drainage pipe 160. In this way, when the amount of foreign matter in the resist solution that has passed through the second filter 144 is excessive, it takes time to sufficiently reduce the amount of foreign matter even if circulating filtration via the circulation pipe 170 is performed, so draining the resist solution is preferable. Furthermore, repeatedly passing resist solution with a large amount of foreign matter through the second filter 144 shortens the life of the second filter 144 and increases the frequency of maintenance such as replacement. From this perspective as well, draining the resist solution is preferable.

[0058] 8 is performed for a certain period of time, and when the fluctuation value (B / A) of the subsequent resist liquid becomes less than the second threshold, the on-off valve V6 is closed and the draining ends. Then, the circulating filtration of the resist liquid shown in FIG. 7 or the sending of the resist liquid to the first pipe 120 shown in FIG. 6 starts.

[0059] The first and second thresholds are set arbitrarily according to the cleanliness of the resist liquid required based on the product specifications. In this embodiment, the sending of the resist liquid to the first pipeline 120, the circulation filtration, and the drainage are switched based on the comparison between the amount of foreign matter A and the amount of foreign matter B, but the switching may also be based only on information on the amount of foreign matter B. In this case, the first and second thresholds are set to values ​​indicating the number of foreign matters per unit volume flow rate, for example, and the sending of the resist liquid to the first pipeline 120, the circulation filtration, and the drainage can be switched based on the relationship between the amount of foreign matter B and the first and second thresholds.

[0060] <Major Effects> As described above, the liquid supply device 100 has the resist liquid supply unit 110 capable of continuous liquid supply, and therefore, when performing a pre-dispense of the resist liquid, the resist liquid can be continuously supplied to the discharge nozzle 42. This allows the resist liquid in the first pipeline 120 to be constantly discharged from the discharge nozzle 42, and the resist liquid does not stagnate in the first pipeline 120. This makes it possible to suppress the elution of defective components from parts such as pumps and filters, which are caused by the stagnation of the resist liquid, and improves the cleanliness of the resist liquid.

[0061] Furthermore, the liquid supplying device 100 has a resist liquid recovery section 140 that recovers the resist liquid discharged from the discharge nozzle 42 and sends it to the resist liquid supplying section 110. This allows the resist liquid that is constantly discharged to be reused, which not only provides the effect of suppressing the accumulation of the resist liquid as described above, but also makes it possible to reduce the amount of resist liquid used.

[0062] In particular, in the liquid supplying apparatus 100 according to this embodiment, a second filter 144 is provided in the second pipe 150 in order to prevent foreign matter from flowing from the second pipe 150 into the first pipe 120. For the same purpose, the liquid supplying apparatus 100 has a configuration that can perform circulation filtration or drainage depending on the amount of foreign matter in the resist liquid in the second pipe 150. This prevents a decrease in the cleanliness of the resist liquid in the first pipe 120, and makes it easier to reuse the resist liquid recovered in the resist liquid recovery unit 140.

[0063] <Modification> In the above example, when the resist liquid is circulated and filtered through the circulation pipe 170, the resist liquid may accumulate in the pipe 154 from the connection between the second pipe 150 and the circulation pipe 170 downstream of the second foreign matter detection sensor 145 to the on-off valve V5. Even if the resist liquid accumulates in the pipe 154 in this way, the cleanliness of the resist liquid is less likely to decrease, unlike when the resist liquid accumulates in a pump or filter, which have many parts, or when the resist liquid accumulates at the tip of the discharge nozzle 42, which is exposed to the external atmosphere. On the other hand, from the viewpoint of further increasing the cleanliness of the resist liquid sent to the first pipe 120, a drain pipe 160 may be provided downstream of the on-off valve V5, as shown in FIG.

[0064] In the liquid supply apparatus 100 shown in Fig. 9, when the resist liquid starts to be sent to the first pipeline 120 after circulation and filtration, as shown in Fig. 10, first, the on-off valves V5 and V6 are opened and the on-off valves V7 and V8 are closed for a predetermined time. As a result, the resist liquid in the second pipeline 150 is discharged to the outside of the system through the drainage pipeline 160. The above-mentioned predetermined time is, for example, the time it takes for the resist liquid passing through the second foreign matter detection sensor 145 to reach the on-off valve V6. Thereafter, the on-off valve V6 is closed and the on-off valve V8 is opened, and the liquid starts to be sent to the first pipeline 120.

[0065] In this way, according to the liquid supplying device 100 shown in Figures 9 and 10, the resist liquid that has accumulated in the piping 154 can be drained during the circulating filtration of the resist liquid, so that a cleaner resist liquid can be sent to the first pipeline 120.

[0066] Furthermore, although the above example has a circulation conduit 170, it is not necessary to provide the circulation conduit 170, as shown in Fig. 11. In the liquid supplying device 100 of Fig. 11, the liquid supply from the second conduit 150 to the first conduit 120 and the liquid drainage from the drainage conduit 160 are switched based on, for example, the foreign object detection result by the first foreign object detection sensor 116, the foreign object detection result by the second foreign object detection sensor 145, or both of these results.

[0067] For example, if the amount of foreign matter A detected by the first foreign matter detection sensor 116 is less than a predetermined threshold, the liquid may be sent to the first pipeline 120, and if the amount of foreign matter A is equal to or greater than the predetermined threshold, the liquid may be drained. Alternatively, if the amount of foreign matter B detected by the second foreign matter detection sensor 145 is less than a predetermined threshold, the liquid may be sent to the first pipeline 120, and if the amount of foreign matter B is equal to or greater than the predetermined threshold, the liquid may be drained. The predetermined threshold described here is set arbitrarily depending on the cleanliness of the resist liquid required based on the product specifications.

[0068] On the other hand, if it is expected that the cleanliness of the resist liquid flowing through the second pipeline 150 will not be excessively reduced, it is not necessary to provide the drainage pipeline 160, as shown in Fig. 12. In the liquid supplying device 100 of Fig. 12, switching is performed between sending the liquid from the second pipeline 150 to the first pipeline 120 and circulating and filtering the liquid via the circulation pipeline 170, for example, based on the foreign matter detection result by the second foreign matter detection sensor 145, or based on the foreign matter detection result by the first foreign matter detection sensor 116 and the foreign matter detection result by the second foreign matter detection sensor 145.

[0069] For example, if the amount of foreign matter B detected by the second foreign matter detection sensor 145 is less than a predetermined threshold, the liquid may be sent to the first pipeline 120, and if the amount of foreign matter B is equal to or greater than the predetermined threshold, circulating and filtering may be performed. Alternatively, if the variation (B / A) of the amount of foreign matter B detected by the second foreign matter detection sensor 145 relative to the amount of foreign matter A detected by the first foreign matter detection sensor 116 is less than a predetermined threshold, the liquid may be sent to the first pipeline 120, and if the variation (B / A) is equal to or greater than the predetermined threshold, circulating and filtering may be performed. The predetermined threshold described here is set arbitrarily depending on the cleanliness of the resist liquid required based on the product specifications.

[0070] Furthermore, from the viewpoint of suppressing the accumulation of resist liquid in the first pipeline 120 and realizing the reuse of the resist liquid discharged from the discharge nozzle 42, neither the drain pipeline 160 nor the circulation pipeline 170 is an essential component. From the same viewpoint, the first tank 112 and the second tank 142 are also not essential components. In other words, as long as the resist liquid supply unit 110 can constantly discharge the resist liquid from the discharge nozzle 42 and the resist liquid recovery unit 140 can send the recovered resist liquid to the first pipeline 120, the configuration of the liquid supply device 100 is not particularly limited.

[0071] The substrate processing apparatus according to the present disclosure can also be applied to processing substrates other than semiconductor wafers, such as FPD (flat panel display) substrates.

[0072] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive, and the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0073] 1. Resist coating device 20 Spin Chuck 42 Discharge nozzle 100 Liquid supply device 110 Resist liquid supply unit 111 bottles 113 First rotary pump 115 First Filter 120 1st pipeline 140 Resist liquid recovery section H storage medium M control section W wafer

Claims

1. A substrate processing apparatus, a substrate holder that holds and rotates the substrate; a discharge unit that discharges a processing liquid onto the substrate; a liquid supply device; The liquid supply device is a treatment liquid supply unit that supplies a treatment liquid to the discharge unit; a treatment liquid recovery unit that recovers the treatment liquid discharged from the discharge unit; a control unit that controls the processing liquid supply unit and the processing liquid recovery unit, The processing liquid supply unit a processing liquid source; a first pipeline that guides the treatment liquid from the treatment liquid supply source to the discharge portion; a first liquid delivery mechanism that continuously discharges the treatment liquid from the discharge portion; a first filter provided in the first pipe, the treatment liquid recovery unit has a configuration that sends the treatment liquid discharged from the discharge unit to a portion of the first pipeline between the treatment liquid supply source and the first filter, Furthermore, the treatment liquid recovery unit a liquid receiving portion that receives the treatment liquid discharged from the discharge portion; a second pipeline that guides the treatment liquid received in the liquid receiving portion to the first pipeline; a second liquid delivery mechanism that continuously delivers the treatment liquid toward the first pipeline; a second filter provided in the second pipe, the second pipe is connected to the first pipe between the treatment liquid supply source and the first filter; Furthermore, the treatment liquid recovery unit has a drainage pipe branched from the second pipe, The substrate processing apparatus, wherein the processing liquid supply unit has a first pipe line side detector that detects foreign matter in the processing liquid, the first pipe line being located between the first filter and the discharge unit.

2. A substrate processing apparatus, a substrate holder that holds and rotates the substrate; a discharge unit that discharges a processing liquid onto the substrate; a liquid supply device; The liquid supply device is a treatment liquid supply unit that supplies a treatment liquid to the discharge unit; a treatment liquid recovery unit that recovers the treatment liquid discharged from the discharge unit; a control unit that controls the processing liquid supply unit and the processing liquid recovery unit, The processing liquid supply unit a processing liquid source; a first pipeline that guides the treatment liquid from the treatment liquid supply source to the discharge portion; a first liquid delivery mechanism that continuously discharges the treatment liquid from the discharge portion; a first filter provided in the first pipe, the treatment liquid recovery unit has a configuration that sends the treatment liquid discharged from the discharge unit to a portion of the first pipeline between the treatment liquid supply source and the first filter, Furthermore, the treatment liquid recovery unit a liquid receiving portion that receives the treatment liquid discharged from the discharge portion; a second pipeline that guides the treatment liquid received in the liquid receiving portion to the first pipeline; a second liquid delivery mechanism that continuously delivers the treatment liquid toward the first pipeline; a second filter provided in the second pipe, the second pipe is connected to the first pipe between the treatment liquid supply source and the first filter; Furthermore, the treatment liquid recovery unit a circulation pipe branching from the second pipe; a second pipeline side detector that is provided in the second pipeline between the second filter and the first pipeline and that detects foreign matter in the treatment liquid, The circulation pipeline has one end connected between the liquid receiving section and the second filter, and the other end connected between the second pipeline side detection section and the first pipeline.

3. A substrate processing apparatus, a substrate holder that holds and rotates the substrate; a discharge unit that discharges a processing liquid onto the substrate; a liquid supply device; The liquid supply device is a treatment liquid supply unit that supplies a treatment liquid to the discharge unit; a treatment liquid recovery unit that recovers the treatment liquid discharged from the discharge unit; a control unit that controls the processing liquid supply unit and the processing liquid recovery unit, The processing liquid supply unit a processing liquid source; a first pipeline that guides the treatment liquid from the treatment liquid supply source to the discharge portion; a first liquid delivery mechanism that continuously discharges the treatment liquid from the discharge portion; a first filter provided in the first pipe, the treatment liquid recovery unit has a configuration that sends the treatment liquid discharged from the discharge unit to a portion of the first pipeline between the treatment liquid supply source and the first filter, Furthermore, the treatment liquid recovery unit a liquid receiving portion that receives the treatment liquid discharged from the discharge portion; a second pipeline that guides the treatment liquid received in the liquid receiving portion to the first pipeline; a second liquid delivery mechanism that continuously delivers the treatment liquid toward the first pipeline; a second filter provided in the second pipe, the second pipe is connected to the first pipe between the treatment liquid supply source and the first filter; Furthermore, the treatment liquid recovery unit has a drainage pipe branched from the second pipe, a second pipeline side detector for detecting foreign matter in the processing liquid between the second filter and the first pipeline in the second pipeline; The substrate processing apparatus, wherein the drainage pipeline is provided between the second pipeline side detector and the first pipeline.

4. the first liquid supply mechanism includes a rotary pump and a metering pump disposed in the first pipeline between the treatment liquid supply source and the first filter; 3. The substrate processing apparatus according to claim 1, wherein the second pipeline is connected to the first pipeline between the processing liquid supply source and the rotary pump.

5. the processing liquid recovery unit includes a second pipeline side detection unit that detects foreign matter in the processing liquid between the second filter and the first pipeline in the second pipeline, The substrate processing apparatus according to claim 1 , wherein the drainage pipeline is provided between the second pipeline side detector and the first pipeline.

6. 3 . The substrate processing apparatus according to claim 2 , wherein the processing liquid supply unit includes a first pipe line side detector for detecting foreign matter in the processing liquid, the first pipe line being disposed between the first filter and the discharge unit.

7. the treatment liquid recovery unit has a drainage pipe branched from the second pipe, The substrate processing apparatus according to claim 6 , wherein the drainage pipeline is provided between the second pipeline side detector and the first pipeline.

8. The control unit Based on the amount of foreign matter detected by the first pipe side detector, The substrate processing apparatus according to claim 1 , further comprising: a control section configured to switch between sending the processing liquid in the second pipeline to the first pipeline and discharging the processing liquid from the drain pipeline.

9. The control unit Based on the amount of foreign matter detected by the second pipe line side detector, The substrate processing apparatus according to claim 5 , further comprising a control unit configured to switch between sending the processing liquid in the second pipeline to the first pipeline and discharging the processing liquid from the drain pipeline.

10. The control unit Based on the amount of foreign matter detected by the second pipe line side detector, 3. The substrate processing apparatus according to claim 2, configured to execute control to switch between sending the processing liquid in the second pipeline to the first pipeline or sending the processing liquid from the downstream side of the second filter to the upstream side via the circulation pipeline.

11. The control unit based on a fluctuation value of the amount of foreign matter detected by the second pipe line side detector relative to the amount of foreign matter detected by the first pipe line side detector, 7. The substrate processing apparatus according to claim 6, configured to execute control to switch between sending the processing liquid in the second pipeline to the first pipeline or sending the processing liquid from the downstream side of the second filter to the upstream side via the circulation pipeline.

12. The control unit based on a fluctuation value of the amount of foreign matter detected by the second pipe line side detector relative to the amount of foreign matter detected by the first pipe line side detector, 8. The substrate processing apparatus according to claim 7, configured to execute control to switch between sending the processing liquid in the second pipeline to the first pipeline, sending the processing liquid from the downstream side of the second filter to the upstream side via the circulation pipeline, or discharging it from the drainage pipeline.

13. A substrate processing apparatus as described in claim 3, wherein the processing liquid is a resist liquid.

14. A processing liquid supply method, comprising: a step of discharging the treatment liquid supplied to the discharge part via the treatment liquid supply part onto the substrate held by the substrate holder that holds and rotates the substrate; receiving the treatment liquid discharged from the discharge part in a treatment liquid recovery part, The processing liquid supply unit a first pipeline for guiding the treatment liquid from a treatment liquid supply source to the discharge portion; a first filter provided in the first pipe, In the step of receiving the treatment liquid in the treatment liquid recovery unit, The treatment liquid is continuously discharged from the discharge portion, recovering the discharged treatment liquid and sending it between the treatment liquid supply source and the first filter in the first pipeline; The processing liquid recovery unit includes: a liquid receiving portion that receives the treatment liquid discharged from the discharge portion; a second pipeline that guides the treatment liquid received in the liquid receiving portion to the first pipeline; a second filter provided in the second pipe; a circulation pipe branching from the second pipe, one end of the circulation pipe is connected to the second pipe upstream of the second filter, and the other end is connected to the second pipe downstream of the second filter; In the step of receiving the treatment liquid in the treatment liquid recovery unit, detecting foreign matter in the treatment liquid downstream of the second filter and upstream of a connection between the second pipeline and the circulation pipeline; A processing liquid supply method in which, based on the detected amount of foreign matter, switching is performed between sending the processing liquid in the second pipeline to the first pipeline or sending the processing liquid from the downstream side of the second filter to the upstream side via the circulation pipeline.

15. A processing liquid supply method, comprising: a step of discharging the treatment liquid supplied to the discharge part via the treatment liquid supply part onto the substrate held by the substrate holder that holds and rotates the substrate; receiving the treatment liquid discharged from the discharge part in a treatment liquid recovery part, The processing liquid supply unit a first pipeline for guiding the treatment liquid from a treatment liquid supply source to the discharge portion; a first filter provided in the first pipe, In the step of receiving the treatment liquid in the treatment liquid recovery unit, The treatment liquid is continuously discharged from the discharge portion, recovering the discharged treatment liquid and sending it between the treatment liquid supply source and the first filter in the first pipeline; The processing liquid recovery unit includes: a liquid receiving portion that receives the treatment liquid discharged from the discharge portion; a second pipeline that guides the treatment liquid received in the liquid receiving portion to the first pipeline; a second filter provided in the second pipe; a drainage line branching from the second line; a circulation pipe branching from the second pipe, the drainage pipe is provided between the second filter and the first pipe, one end of the circulation pipe is connected to the second pipe upstream of the second filter, and the other end is connected to the second pipe downstream of the second filter; In the step of receiving the treatment liquid in the treatment liquid recovery unit, detecting foreign matter in the processing liquid in the first pipeline downstream of the first filter; detecting foreign matter in the processing liquid in the second pipeline downstream of the second filter; A processing liquid supply method, which switches between sending the processing liquid in the second pipeline to the first pipeline, sending the processing liquid from the downstream side of the second filter to the upstream side via the circulation pipeline, or discharging the processing liquid from the drain pipeline based on a fluctuation value of the amount of foreign matter detected in the second pipeline relative to the amount of foreign matter detected in the first pipeline.

16. A processing liquid supply method, comprising: a step of discharging the treatment liquid supplied to the discharge part via the treatment liquid supply part onto the substrate held by the substrate holder that holds and rotates the substrate; receiving the treatment liquid discharged from the discharge part in a treatment liquid recovery part, The processing liquid supply unit a first pipeline for guiding the treatment liquid from a treatment liquid supply source to the discharge portion; a first filter provided in the first pipe, In the step of receiving the treatment liquid in the treatment liquid recovery unit, The treatment liquid is continuously discharged from the discharge portion, recovering the discharged treatment liquid and sending it between the treatment liquid supply source and the first filter in the first pipeline; The processing liquid recovery unit includes: a liquid receiving portion that receives the treatment liquid discharged from the discharge portion; a second pipeline that guides the treatment liquid received in the liquid receiving portion to the first pipeline; a second filter provided in the second pipe; a drainage line branching from the second line, the drainage pipe is provided between the second filter and the first pipe, In the step of receiving the treatment liquid in the treatment liquid recovery unit, detecting foreign matter in the processing liquid in the second pipeline downstream of the second filter; Based on the amount of foreign matter detected, The processing liquid supply method includes switching between sending the processing liquid in the second pipeline to the first pipeline and discharging the processing liquid from the drain pipeline.

17. The processing liquid supply method according to claim 16, wherein the processing liquid is a resist liquid.

18. A readable computer storage medium storing a program that runs on a computer of a control unit that controls a liquid supplying device so as to cause the liquid supplying device to execute the processing liquid supplying method according to any one of claims 14 to 17.

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