electronic machinery

Abstract

To realize an electronic apparatus capable of accommodating an arrangement of one imaging device using one board.SOLUTION: An electronic apparatus comprises: a second housing including a first housing plane and a second housing plane that are disposed and spaced apart in a first direction; and a board configured such that an imaging device can be mounted. The board is located midway in a first direction Z inside the second housing and extends along an imaginary plane intersecting the first direction Z. The second housing includes a first arrangement part and a second arrangement part. The first arrangement part is configured such that the board can be disposed in a first state in which the mounted imaging device can be exposed from the first housing plane. The second arrangement part is configured such that the board can be disposed in a second state in which the mounted imaging device can be exposed from the second housing plane.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present disclosure relates to electronic devices. [Background technology]

[0002] Patent Document 1 discloses an electronic device in which a front camera and a rear camera are housed inside an upper housing. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] WO2017-022554 Summary of the Invention [Problem to be solved by the invention]

[0004] The electronic device of Patent Document 1 has room for improvement in terms of changing the camera arrangement to meet the user's needs.

[0005] An object of the present disclosure is to provide an electronic device that can accommodate the arrangement of two imaging devices on a single board. [Means for solving the problem]

[0006] An electronic device according to one aspect of the present disclosure includes: a housing including a first housing surface and a second housing surface spaced apart in a first direction; a substrate configured to be able to mount an imaging device, positioned midway in the first direction inside the housing, and extending along an imaginary plane intersecting the first direction; Equipped with The housing is a first arrangement portion capable of arranging the board in a first state in which the mounted imaging device can be exposed from the first housing surface; a second arrangement section in which the board can be arranged in a second state in which the mounted imaging device can be exposed from the second housing surface; and Includes. [Effects of the Invention]

[0007] According to the present disclosure, it is possible to realize an electronic device that can accommodate the arrangement of two imaging devices on a single board. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a perspective view showing an electronic device according to an embodiment of the present disclosure, including a board in a first state. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 10 is a perspective view showing an electronic device according to an embodiment of the present disclosure, including a board in a second state. [Figure 5] 5 is a cross-sectional view taken along line VV in FIG. 4. [Figure 6] 6 is a cross-sectional view taken along line VI-VI in FIG. 4. [Figure 7] FIG. 2 is a perspective view showing a circuit board of the electronic device of FIG. [Figure 8] Schematic cross-sectional view taken along line VIII-VIII in Figure 1. DETAILED DESCRIPTION OF THE INVENTION

[0009] For example, when changing the placement of the cameras from being exposed from the front of the housing to being exposed from the back of the housing, it may not be possible to accommodate the placement of two cameras on one board due to placement constraints such as the thickness of the housing and the placement of other components inside the housing, etc. In this case, there is a possibility that disadvantages will arise, such as having to prepare different boards depending on the camera placement.

[0010] The present inventors have discovered a configuration for an electronic device that can accommodate the arrangement of two imaging devices on a single board, and have arrived at the following invention.

[0011] The electronic device according to the first aspect of the present disclosure includes: a housing including a first housing surface and a second housing surface spaced apart in a first direction; a substrate configured to be able to mount an imaging device, positioned midway in the first direction inside the housing, and extending along an imaginary plane intersecting the first direction; Equipped with The housing is a first arrangement portion capable of arranging the board in a first state in which the mounted imaging device can be exposed from the first housing surface; a second arrangement section in which the board can be arranged in a second state in which the mounted imaging device can be exposed from the second housing surface; and Includes.

[0012] An electronic device according to a second aspect of the present disclosure is the electronic device according to the first aspect, The imaging device mounted on the board in the first state and the imaging device mounted on the board in the second state are positioned symmetrically with respect to the imaginary plane.

[0013] An electronic device according to a third aspect of the present disclosure is the electronic device according to the first or second aspect, The housing is a first mounting portion, a second mounting portion, and a third mounting portion that are spaced apart from one another along a second direction that intersects the first direction; the second mounting portion and the third mounting portion are positioned symmetrically with respect to the first mounting portion, the first arrangement portion includes the first mounting portion and the second mounting portion, The second arrangement portion includes the first mounting portion and the third mounting portion.

[0014] An electronic device according to a fourth aspect of the present disclosure is the electronic device according to the third aspect, a first fastening member and a second fastening member that fasten the board to the housing; The first mounting portion is a first positioning pin capable of positioning the board relative to the housing; a first fastening hole that is disposed on a first imaginary line that extends along the second direction and passes through the first positioning pin, with a gap between the first positioning pin and the first fastening member in the second direction; and Each of the second mounting portion and the third mounting portion is a second positioning pin that is located on the first virtual line and that can position the board relative to the housing together with the first positioning pin; a second fastening hole that is disposed on a second imaginary line that extends along a third direction intersecting the first direction and the second direction and passes through the second positioning pin, the second fastening hole being spaced apart from the second positioning pin in the third direction, and that can be coupled to the second fastening member; and The substrate is a first through hole and a second through hole capable of accommodating the first positioning pin, respectively; a third through hole capable of accommodating the first fastening member; a fourth through hole capable of accommodating the second positioning pin; a fifth through hole capable of accommodating the second fastening member; and In the first state, the first positioning pin is accommodated in the first through hole, and the second positioning pin of the second mounting portion is accommodated in the fourth through hole, In the second state, the first positioning pin is housed in the second through hole, and the second positioning pin of the third mounting portion is housed in the fourth through hole.

[0015] An electronic device according to a fifth aspect of the present disclosure is the electronic device according to any one of the first to fourth aspects, The linear distance in the first direction from a first substrate surface of the substrate that is closest to the first housing surface to the inner surface of the housing that faces the first substrate surface, and the linear distance in the first direction from a second substrate surface of the substrate to the inner surface of the housing that faces the second substrate surface, are each 1.2 mm or more and 1.7 mm or less.

[0016] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. The following description does not limit the present disclosure, but is essentially merely illustrative, and appropriate modifications can be made without departing from the spirit of the present disclosure. The drawings are schematic, and the ratios of dimensions and the like do not necessarily correspond to reality.

[0017] 1, an electronic device 1 according to an embodiment of the present disclosure is, for example, a notebook personal computer (in other words, a laptop PC). The electronic device 1 includes a first housing 10, a second housing 20, and a hinge portion 30 that connects the first housing 10 and the second housing 20.

[0018] The electronic device 1 includes a central processing unit (CPU), a volatile storage device (RAM), a nonvolatile storage device (ROM, SSD, etc.), a battery, etc. The nonvolatile storage device (ROM, SSD, etc.) stores an operating system (OS), various application programs, various data, etc. The central processing unit (CPU) is configured to be able to realize various functions by reading the OS, application programs, and various data and executing arithmetic processing.

[0019] 1, the first housing 10 has a display unit 11. The display unit 11 includes, for example, a touch panel liquid crystal display that can receive touch operations from the user.

[0020] 1 and 2, the second housing 20 includes a first housing surface 201 and a second housing surface 202 that are spaced apart in a first direction (for example, the Z direction). An input unit 21 is provided on the first housing surface 201. The input unit 21 includes, for example, a keyboard, and is configured to allow the user to perform input processing.

[0021] 2, the electronic device 1 includes a substrate 40 located inside the second housing 20. The substrate 40 is configured to be able to mount an imaging device 22. The imaging device 22 is configured, for example, by a camera module including a lens 221, an imaging element, a lens driving unit, and the like.

[0022] The electronic device 1 is configured to be able to change the arrangement of the imaging device 22 by changing the arrangement of the board 40 to either a first state A1 shown in Figures 1 to 3 or a second state A2 shown in Figures 4 to 6 in accordance with user requests, etc. The first state A1 is an arrangement state of the board 40 in which the mounted imaging device 22 (e.g., lens 221) is arranged so as to be exposed from the first housing surface 201, and the second state A21 is an arrangement state of the board 40 in which the mounted imaging device 22 (e.g., lens 221) is arranged so as to be exposed from the second housing surface 202.

[0023] More specifically, the electronic device 1 includes a first fastening member 71 and a second fastening member 72 for fixing the board 40 to the second housing 20, and the second housing 20 includes a first arrangement portion 51 and a second arrangement portion 52. The first fastening member 71 and the second fastening member 72 are formed, for example, by screws. The first arrangement portion 51 is configured to be able to arrange the board 40 in a first state A1 as shown in FIG. 3. The second arrangement portion 52 is configured to be able to arrange the board 40 in a second state A2 as shown in FIG. 6.

[0024] In this embodiment, the first arrangement portion 51 includes a first mounting portion 61 and a second mounting portion 62 as shown in Fig. 3, and the second arrangement portion 52 includes a first mounting portion 61 and a third mounting portion 63 as shown in Fig. 6. The first mounting portion 61, the second mounting portion 62, and the third mounting portion 63 are provided on the second housing 20 and positioned at intervals from each other along a second direction (e.g., the Y direction) intersecting the first direction Z. The second mounting portion 62 and the third mounting portion 63 are positioned symmetrically with respect to the first mounting portion 61 in the second direction Y.

[0025] The first mounting portion 61 has a first positioning pin 611 and a first fastening hole 612. The first positioning pin 611 is configured to be able to position the board 40 with respect to the second housing 20. As an example, as shown in FIGS. 2 and 3 , the first positioning pin 611 has a substantially cylindrical shape and protrudes from a first wall portion 23 that constitutes the first housing surface 201 of the second housing 20 toward a second wall portion 24 that constitutes the second housing surface 202. The first fastening hole 612 is configured to be able to couple a first fastening member 71. The first fastening hole 612 is located on a first imaginary straight line L1 that extends along the second direction Y and passes through the first positioning pin 611, and is spaced apart from the first positioning pin 611 in the second direction Y. As an example, the first fastening hole 612 is composed of a first hole 251 provided in a boss portion 25 extending from the first wall portion 23 toward the second wall portion 24, and a second hole 261 provided in a boss portion 26 extending from the second wall portion 24 toward the first wall portion 23. A gap is formed between the two boss portions 25, 26 in the first direction Z, and the substrate 40 is located in this gap. The first hole 251, the second hole 261, and the third through hole 43 are arranged coaxially.

[0026] Each of the second mounting portion 62 and the third mounting portion 63 has a second positioning pin 621 and a second fastening hole 622. The second positioning pin 621 is located on a first imaginary line L1 and is configured to be able to position the substrate 40 relative to the second housing 20 together with the first positioning pin 611. For example, the second positioning pin 621 has the same configuration as the first positioning pin 611. The second fastening hole 622 is configured to be able to couple a second fastening member 72. The second fastening hole 622 is arranged on a second imaginary line L2 that extends along a third direction (e.g., the X direction) intersecting the first direction Z and the second direction Y and passes through the second positioning pin 621, and is spaced apart from the second positioning pin 621 in the third direction X. For example, the second fastening hole 622 is provided in a boss portion 27 that extends from the first wall portion 23 toward the second wall portion 24. 3 and 6, the second imaginary straight line L2 on the second mounting portion 62 side is indicated by "L2(1)", and the second imaginary straight line L2 on the third mounting portion 63 side is indicated by "L2(2)".

[0027] The substrate 40 is configured to be able to mount the imaging device 22, is located at the middle of the second housing 20 in the first direction Z, and extends along an imaginary plane P that intersects with the first direction Z, as shown in FIGS. 2 and 5. In this embodiment, the imaginary plane P is an XY plane located approximately at the center of the first wall portion 23 and the second wall portion 24 of the second housing 20. As shown in FIG. 7, for example, the substrate 40 has a substantially rectangular plate shape that extends along the second direction Y when attached to the second housing 20. A first through hole 41, a second through hole 42, and a third through hole 43 are provided at one end of the substrate 40 in the second direction Y, and a fourth through hole 44 and a fifth through hole 45 are provided at the other end of the substrate 40 in the second direction Y.

[0028] The first through hole 41, the second through hole 42, the third through hole 43, the fourth through hole 44, and the fifth through hole 45 each penetrate the substrate 40 in the first direction Z. When viewed along the first direction Z, the first through hole 41, the second through hole 42, the third through hole 43, and the fourth through hole 44 are located on a first imaginary line L1, and the fourth through hole 44 and the fifth through hole 45 are located on a second imaginary line L2 extending along a third direction (e.g., the X direction) that intersects the first direction Z and the second direction Y. When the substrate 40 is arranged in the first state A1, the fourth through hole 44 and the fifth through hole 45 are located on a second imaginary line L2(1) on the second mounting portion 62 side, as shown in FIG. When the substrate 40 is arranged in the second state A2, the fourth through hole 44 and the fifth through hole 45 are located on the second imaginary line L2(2) on the third mounting portion 63 side, as shown in FIG. 3. The third through hole 43 is located between the first through hole 41 and the second through hole 42, and the first through hole 41 is located between the third through hole 43 and the fourth through hole 44. The first through hole 41 and the second through hole 42 are located symmetrically with respect to the third through hole 43. A mounting portion 46 on which the imaging device 22 can be mounted is provided between the first through hole 41 and the fourth through hole 44 and the fifth through hole 45 of the substrate 40.

[0029] The first through hole 41 and the second through hole 42 are each configured to be able to accommodate a first positioning pin 611. The third through hole 43 is configured to be able to accommodate a first fastening member 71. The fourth through hole 44 is configured to be able to accommodate a second positioning pin 621. The fifth through hole 45 is configured to be able to accommodate a second fastening member 72.

[0030] When the substrate 40 is placed in the first state A1, in the first direction Z, the first through hole 41 faces the first positioning pin 611, and the fourth through hole 44 faces the second positioning pin 621 of the second mounting portion 62. The first positioning pin 611 is accommodated in the first through hole 41, and the second positioning pin 621 of the second mounting portion 62 is accommodated in the fourth through hole 44. The third through hole 43 is positioned approximately coaxially with the first fastening hole 612, and the fifth through hole 45 is positioned approximately coaxially with the second fastening hole 622 of the second mounting portion 62.

[0031] When the substrate 40 is placed in the second state A2, in the first direction Z, the second through hole 42 faces the first positioning pin 611, and the fourth through hole 44 faces the second positioning pin 621 of the third mounting portion 63. The first positioning pin 611 is accommodated in the second through hole 42, and the second positioning pin 621 of the third mounting portion 63 is accommodated in the fourth through hole 44. The third through hole 43 is positioned approximately coaxially with the first fastening hole 612, and the fifth through hole 45 is positioned approximately coaxially with the second fastening hole 622 of the third mounting portion 63.

[0032] 8, the imaging device 22 mounted on the board 40 in the first state A1 and the imaging device 22 mounted on the board 40 in the second state A2 are positioned symmetrically with respect to the virtual plane P. The imaging device 22 mounted on the board 40 in the second state A2 is positioned closer to the center in the second direction Y than the imaging device 22 mounted on the board 40 in the first state A1. This prevents the user's hand from covering the imaging device 22 and appearing in a captured image when the user holds the electronic device 1 with the board 40 arranged in the second state A1.

[0033] A gap is formed between the substrate 40 and the second housing 20 in the first direction Z. The width of the gap 205 on the first housing surface 201 side is defined as a "first linear distance D1," and the width of the gap 206 on the second housing surface 202 side is defined as a "second linear distance D2." The gaps 205, 206 are configured such that the first linear distance D1 and the second linear distance D2 are 1.2 mm or more and 1.7 mm or less. The first linear distance D1, in other words, is the linear distance between the first substrate surface 401 of the substrate 40, which is closer to the first housing surface 201, and the inner surface 203 of the second housing 20 that faces the first substrate surface 401 in the first direction Z. The second linear distance D2, in other words, is the linear distance between the second substrate surface 402 of the substrate 40 and the inner surface 204 of the second housing 20 that faces the second substrate surface 402 in the first direction Z.

[0034] The hinge unit 30 rotatably connects the first housing 10 and the second housing 20 to each other. The hinge unit 30 is configured to be able to hold the first housing 10 at any angle relative to the second housing 20, or the second housing 20 at any angle relative to the first housing 10.

[0035] The electronic device 1 can achieve the following effects.

[0036] The electronic device 1 includes a second housing 20 including a first housing surface 201 and a second housing surface 202 spaced apart in the first direction Z, and a board 40 configured to be able to mount an imaging device 22. The board 40 is located midway in the first direction Z inside the second housing 20 and extends along an imaginary plane P intersecting the first direction Z. The second housing 20 includes a first arrangement section 51 and a second arrangement section 52. The first arrangement section 51 is configured to be able to arrange the board 40 in a first state A1 in which the mounted imaging device 22 is exposed from the first housing surface 201. The second arrangement section 52 is configured to be able to arrange the board 40 in a second state A2 in which the mounted imaging device 22 is exposed from the second housing surface 202. This configuration makes it possible to realize an electronic device 1 that can accommodate the arrangement of multiple imaging devices 22 on a single board 40.

[0037] In the electronic device 1, the imaging device 22 mounted on the board 40 in the first state A1 and the imaging device 22 mounted on the board 40 in the second state A2 are positioned symmetrically with respect to the virtual plane P. With this configuration, it is possible to more reliably realize an electronic device 1 that can accommodate the arrangement of multiple imaging devices 22 on a single board 40.

[0038] In the electronic device 1, the second housing 20 includes a first mounting portion 61, a second mounting portion 62, and a third mounting portion 63 that are spaced apart from one another along the second direction Y. The second mounting portion 62 and the third mounting portion 63 are positioned symmetrically with respect to the first mounting portion 61. The first arrangement portion 51 includes the first mounting portion 61 and the second mounting portion 62, and the second arrangement portion 52 includes the first mounting portion 61 and the third mounting portion 63. This configuration more reliably realizes an electronic device 1 that can accommodate the arrangement of multiple imaging devices 22 on a single board 40.

[0039] The electronic device 1 includes a first fastening member 71 and a second fastening member 72 that fix the board 40 to the second housing 20. The first mounting portion 61 has a first positioning pin 611 that can position the board 40 with respect to the second housing 20 and a first fastening hole 612 that can couple the first fastening member 71. The first fastening hole 612 is disposed on a first imaginary line L1 that extends along the second direction Y and passes through the first positioning pin 611, and is spaced apart from the first positioning pin 611 in the second direction Y. The second mounting portion 62 and the third mounting portion 63 each have a second positioning pin 621 that is located on the first imaginary line L1 and that can, together with the first positioning pin 611, position the board 40 with respect to the second housing 20, and a second fastening hole 622 that can couple the second fastening member 72. The second fastening hole 622 is disposed on a second imaginary line L2 that extends along the third direction X and passes through the second positioning pin 621, and is spaced apart from the second positioning pin 621 in the third direction X. The substrate 40 has a first through hole 41 and a second through hole 42 that can each accommodate the first positioning pin 611, a third through hole 43 that can accommodate the first fastening member 71, a fourth through hole 44 that can accommodate the second positioning pin 621, and a fifth through hole 45 that can accommodate the second fastening member 72. In the first state A1, the first positioning pin 611 is accommodated in the first through hole 41, and the second positioning pin 621 of the second mounting portion 62 is accommodated in the fourth through hole 44. In the second state A2, the first positioning pin 611 is accommodated in the second through hole 42, and the second positioning pin 621 of the third mounting portion 63 is accommodated in the fourth through hole 44. With this configuration, it is possible to more reliably realize an electronic device 1 that can accommodate the arrangement of a plurality of imaging devices 22 on a single board 40.

[0040] The linear distance in the first direction Z between the first substrate surface 401 of the substrate 40 closest to the first housing surface 201 and the inner surface 203 of the second housing 20 facing the first substrate surface 401 is defined as a first linear distance D1. The linear distance in the first direction Z between the second substrate surface 402 of the substrate 40 and the inner surface 204 of the second housing 20 facing the second substrate surface 402 is defined as a second linear distance D2. The first linear distance D1 and the second linear distance D2 are equal to or greater than 1.2 mm and equal to or less than 1.7 mm. This configuration more reliably realizes an electronic device 1 that can accommodate the arrangement of multiple imaging devices 22 on a single substrate 40.

[0041] The electronic device 1 can also be configured as follows.

[0042] The imaging device 22 mounted on the substrate 40 in the first state A1 and the imaging device 22 mounted on the substrate 40 in the second state A2 may not necessarily be positioned symmetrically with respect to the virtual plane P, but may also be positioned asymmetrically with respect to the virtual plane P.

[0043] The first arrangement section 51 is not limited to including the first mounting section 61 and the second mounting section 62, and the second arrangement section 52 is not limited to including the first mounting section 61 and the third mounting section 63. The first arrangement section 51 and the second arrangement section 52 may adopt any configuration that can realize the arrangement of the substrate 40 in both the first state A1 and the second state A2.

[0044] The first mounting portion 61 is not limited to having the first positioning pin 611 and the first fastening hole 612. For example, the first positioning pin 611 may be omitted. Furthermore, if a configuration is adopted in which the first fastening member 71 is not used to mount the substrate 40 to the second housing 20, the first fastening hole 612 may be changed to another configuration or may be omitted if possible. The same applies to the second mounting portion 62 and the third mounting portion 63.

[0045] The first linear distance D1 and the second linear distance D2 are not limited to being equal to or greater than 1.2 mm and equal to or less than 1.7 mm, and can be changed arbitrarily depending on the design of the electronic device 1 and the like.

[0046] The components constituting the electronic device 1 are not limited to those in the illustrated embodiment, and any shape and configuration may be adopted as long as they do not deviate from the scope of the present disclosure.

[0047] Any of the various embodiments or modifications described above can be combined appropriately to achieve the effects of each. Combinations of embodiments, combinations of examples, or combinations of embodiments and examples are possible, and combinations of features from different embodiments or examples are also possible.

[0048] Although the present disclosure has been described in connection with preferred embodiments with reference to the accompanying drawings, various changes and modifications will be apparent to those skilled in the art. Such changes and modifications are to be understood as included within the scope of the present disclosure as defined by the appended claims unless they depart therefrom. [Industrial Applicability]

[0049] The present disclosure is broadly applicable to electronic devices, including notebook computers. [Explanation of symbols]

[0050] 1 Electronic equipment 10 First cabinet 11 Display section 20 Second cabinet 21 Input section 22 Imaging device 221 Lens 23 1st wall section 24 2nd wall section 25, 26, 27 Boss section 251 First Hole 261 Second Hole 30 Hinge part 40 boards 41 First through hole 42 Second through hole 43 Third through hole 44 4th through hole 45 5th through hole 46 Mounting section 51 1st placement part 52 2nd placement part 61 First mounting part 62 Second mounting part 63 Third mounting part 71 First fastening member 72 Second fastening member 201 First cabinet surface 202 Second cabinet surface 202 Second board surface 203, 204 Inner surface 205, 206 gap 401 First board surface 402 Second board surface 611 First positioning pin 612 First fastening hole 621 Second positioning pin 622 Second fastening hole

Claims

1. a housing including a first housing surface and a second housing surface spaced apart in a first direction; a substrate configured to be able to mount an imaging device and housed inside the housing; Equipped with the substrate is located at a midpoint in the first direction inside the housing and extends along an imaginary plane that intersects with the first direction; The housing is a first arrangement portion capable of arranging the board in a first state in which the mounted imaging device can be exposed from the first housing surface; a second arrangement section capable of arranging the board in a second state in which the mounted imaging device can be exposed from the second housing surface; Electronic devices, including:

2. The housing is a first mounting portion, a second mounting portion, and a third mounting portion that are spaced apart from one another along a second direction that intersects the first direction; the second mounting portion and the third mounting portion are positioned symmetrically with respect to the first mounting portion, the first arrangement portion includes the first mounting portion and the second mounting portion, The electronic device according to claim 1 , wherein the second arrangement portion includes the first mounting portion and the third mounting portion.

3. a first fastening member and a second fastening member that fasten the board to the housing; The first mounting portion is a first positioning pin capable of positioning the board relative to the housing; a first fastening hole that is disposed on a first imaginary line that extends along the second direction and passes through the first positioning pin, with a gap between the first positioning pin and the first fastening member in the second direction; and Each of the second mounting portion and the third mounting portion is a second positioning pin located on the first imaginary line and capable of positioning the board relative to the housing together with the first positioning pin; a second fastening hole that is disposed on a second imaginary line that extends along a third direction intersecting the first direction and the second direction and passes through the second positioning pin, the second fastening hole being spaced apart from the second positioning pin in the third direction, and that can be coupled to the second fastening member; and The substrate is a first through hole and a second through hole each capable of accommodating the first positioning pin; a third through hole capable of accommodating the first fastening member; a fourth through hole capable of accommodating the second positioning pin; a fifth through hole capable of accommodating the second fastening member; and In the first state, the first positioning pin is accommodated in the first through hole, and the second positioning pin of the second mounting portion is accommodated in the fourth through hole, The electronic device according to claim 2 , wherein in the second state, the first positioning pin is housed in the second through hole, and the second positioning pin of the third attachment portion is housed in the fourth through hole.

4. 2. The electronic device of claim 1, wherein the first straight-line distance is the straight-line distance between a first substrate surface of the substrate closest to the first housing surface in the first direction and an inner surface of the housing facing the first substrate surface, and the second straight-line distance is the straight-line distance between a second substrate surface of the substrate in the first direction and an inner surface of the housing facing the second substrate surface, and the first straight-line distance and the second straight-line distance are 1.2 mm or more and 1.7 mm or less.

Images