Thermal processing device and thermal processing method

Abstract

To provide a thermal processing device which enables simplification of work when a liquid is used during processing, and to provide a thermal processing method.SOLUTION: A container 1 supports a work object WO and is able to store a transmission inhibition liquid LI. An air blow nozzle 11 blows a gas onto the work object WO supported by the container 1. A drive mechanism 25 moves the air blow nozzle 11. A controller 50 controls the drive mechanism 25 such that a movement trajectory MT of the air blow nozzle 11 formed when the gas is blown onto the work object WO by the air blow nozzle 11 is limited to within a planar shape of the work object WO.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to thermal processing apparatus and methods. [Background technology]

[0002] Conventionally, thermal processing devices such as laser processing devices using laser light and plasma processing devices using plasma have been known. Laser processing devices using water have also been disclosed, for example, in Japanese Patent Laid-Open No. 8-132270 (Patent Document 1) and Japanese Patent Laid-Open No. 62-168692 (Patent Document 2).

[0003] In Patent Document 1, laser processing is performed with the lower part of the workpiece immersed in cooling water in a water tank on the processing table. This allows the entire workpiece to be cooled from below, enabling stable processing.

[0004] In Patent Document 2, a workpiece supported by a pin holder is laser-cut with water placed in a mounting box for the pin holder. The water in the water tank cools the workpiece during laser cutting and prevents dust from scattering. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 8-132270 [Patent Document 2] Japanese Patent Application Laid-Open No. 62-168692 Summary of the Invention [Problem to be solved by the invention]

[0006] When a liquid such as water is used during processing in thermal processing equipment, the workpiece may become wet with the liquid. If the workpiece is to be shipped as a product, it will look unsightly if it remains wet with the liquid. Furthermore, when the liquid dries, the dirt contained in the liquid will remain on the workpiece as stains, making the dirt more noticeable. Furthermore, even if a rust inhibitor is added to the liquid, the workpiece is more likely to rust if it becomes wet with the liquid. For this reason, if the workpiece becomes wet with the liquid, it will be necessary to wipe off the liquid on the surface of the workpiece with a mop or rag when sorting the workpiece after processing.

[0007] An object of the present disclosure is to provide a thermal processing apparatus and a thermal processing method that can simplify operations even when a liquid is used during processing. [Means for solving the problem]

[0008] The thermal processing apparatus disclosed herein processes a workpiece using laser light or plasma, and includes a container, an air blow nozzle, a drive mechanism, and a controller. The container supports the workpiece and is capable of storing a liquid. The air blow nozzle blows gas onto the workpiece supported in the container. The drive mechanism moves the air blow nozzle. The controller controls the drive mechanism so as to limit the movement trajectory of the air blow nozzle when blowing gas onto the workpiece with the air blow nozzle to within the planar shape of the workpiece.

[0009] The thermal processing method of the present disclosure comprises the following steps. A workpiece supported in a container containing a liquid is processed using laser light or plasma. After the workpiece is processed, an air blow nozzle blows gas onto the workpiece. The movement trajectory of the air blow nozzle when blowing gas onto the workpiece is limited to the planar shape of the workpiece. [Effects of the Invention]

[0010] According to the present disclosure, it is possible to realize a thermal processing apparatus and a thermal processing method that can simplify operations even when a liquid is used during processing. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a perspective view showing a configuration of a laser processing apparatus according to an embodiment; [Figure 2] 2 is a cross-sectional perspective view showing the internal configuration of a container used in the laser processing apparatus of FIG. 1. FIG. [Figure 3] 2 is a cross-sectional view showing the configuration of a processing head used in the laser processing device of FIG. 1. [Figure 4] 2 is a cross-sectional view showing the configuration of a laser beam blocking member used in the laser processing apparatus of FIG. 1. [Figure 5] 2 is a cross-sectional view showing the configuration of a liquid level adjusting mechanism and the like used in the laser processing apparatus of FIG. 1. [Figure 6] FIG. 6 is a functional block diagram of the controller shown in FIG. 5. [Figure 7] 1A is a plan view for explaining the generation of a movement trajectory of an air blow nozzle and the alignment with a workpiece (B). FIG. [Figure 8] FIG. 1 is a flow chart showing a laser processing method according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the specification and drawings, the same or corresponding components are designated by the same reference numerals, and redundant explanations will not be repeated. In addition, in the drawings, configurations may be omitted or simplified for the sake of convenience.

[0013] In the following description, a plan view refers to a view seen from a direction perpendicular to the plane on which the plurality of mounting portions 2c are located. Also, a planar shape refers to a shape in a planar view.

[0014] <Configuration of laser processing equipment> The configuration of the laser processing device in this embodiment will be described with reference to FIGS.

[0015] Fig. 1 is a perspective view showing the configuration of a laser processing apparatus in one embodiment. Fig. 2 is a cross-sectional perspective view showing the internal configuration of a container used in the laser processing apparatus of Fig. 1. Figs. 3, 4, and 5 are cross-sectional views showing the configuration of a processing head, a laser beam blocking member, a liquid level adjustment mechanism, and the like used in the laser processing apparatus of Fig. 1, respectively.

[0016] 1 and 2, a laser processing apparatus 20 of this embodiment processes a workpiece made of, for example, steel using a laser beam. The laser processing apparatus 20 mainly includes a container 1, a cutting pallet 2 (support member), a sludge tray 3, a liquid level adjustment tank 4, a processing head 10, a drive mechanism 25, and an operation panel 30.

[0017] As shown in Fig. 2, the container 1 has a rectangular bottom wall 1a and four side walls 1b rising from the four sides of the bottom wall 1a. The container 1 has a cylindrical shape with a bottom that is open at the top. The container 1 has an opening at the top end and an internal space that extends from the opening into the interior of the container 1.

[0018] The container 1 is configured so that a liquid (permeation suppression liquid LI: FIG. 4) can be stored inside. A pallet support portion 1c is provided on the side wall 1b. The pallet support portion 1c protrudes laterally from the wall surface of the side wall 1b toward the internal space of the container 1.

[0019] The level adjustment tank 4 is disposed within the internal space of the vessel 1. The level adjustment tank 4 has a box shape with an opening at the bottom end. The internal space of the level adjustment tank 4 is connected to the internal space of the vessel 1 through this opening.

[0020] The level adjustment tank 4 is configured so that gas can be stored in the internal space of the level adjustment tank 4. It is possible to supply gas to or discharge gas from the internal space of the level adjustment tank 4. By supplying gas to the internal space of the level adjustment tank 4, the permeation inhibitor liquid LI in the level adjustment tank 4 can be pushed out of the level adjustment tank 4. Furthermore, by discharging gas from the internal space of the level adjustment tank 4, it is possible to introduce the permeation inhibitor liquid LI from the outside to the inside of the level adjustment tank 4. This makes it possible to adjust the liquid level in the container 1.

[0021] The sludge tray 3 is placed above the level adjustment tank 4. The sludge tray 3 has a box shape with an opening at the top end. The sludge tray 3 is capable of storing sludge generated when the workpiece WO (Fig. 5) is cut by laser processing. The sludge generated during laser processing falls from the workpiece WO and is stored inside the sludge tray 3 through the opening at the top end of the sludge tray 3.

[0022] The cutting pallet 2 is supported on the container 1 by the pallet support part 1c. The cutting pallet 2 is located within the internal space of the container 1, above the sludge tray 3. The cutting pallet 2 has a plurality of first support plates 2a and a plurality of second support plates 2b. The plurality of first support plates 2a and the plurality of second support plates 2b are arranged vertically and horizontally to form a lattice pattern.

[0023] The cutting pallet 2 has a mounting portion 2c that supports the underside of the workpiece WO (FIG. 5). The mounting portion 2c of the cutting pallet 2 is formed, for example, by the upper ends of each of the multiple second support plates 2b. The mounting portion 2c is located lower than the upper end of the container 1 (the upper end of the side wall 1b). The upper end of the container 1 is located higher than the upper surface of the workpiece WO when the workpiece WO is placed on the mounting portion 2c. This allows the liquid level of the permeation suppression liquid LI to be higher than the upper surface of the workpiece WO when the container 1 is filled with the permeation suppression liquid LI with the workpiece WO placed on the mounting portion 2c.

[0024] 1, the drive mechanism 25 moves the processing head 10 in the X direction (the longitudinal direction of the container 1), the Y direction (the lateral direction of the container 1), and the Z direction (the up-down direction). The drive mechanism 25 mainly includes a pair of left and right support bases 21, an X-direction movable base 22, a Y-direction movable base 23, and the processing head 10.

[0025] The pair of left and right support bases 21 are arranged to sandwich the container 1 in the Y direction. The pair of left and right support bases 21 extend in the X direction. The X-direction movable base 22 extends in the Y direction and is arranged to straddle the pair of left and right support bases 21. The X-direction movable base 22 is driven in the X direction along the support bases 21 by an X-axis motor (not shown).

[0026] The Y-direction movable table 23 is supported by, for example, a rack and pinion mechanism so as to be movable in the Y direction relative to the X-direction movable table 22. The Y-direction movable table 23 is driven in the Y direction by a Y-axis motor (not shown).

[0027] The processing head 10 is supported by, for example, a rack and pinion mechanism so as to be movable in the Z direction relative to the Y-direction movable table 23. The processing head 10 is driven in the Z direction by a Z-axis motor (not shown).

[0028] The operation panel 30 accepts input of processing conditions such as the shape, material, and processing speed of the workpiece WO. The operation panel 30 has a display, switches, an alarm, etc. The display shows a screen for inputting processing conditions, a screen showing the operating status of the laser processing device 20, etc.

[0029] As shown in Fig. 3, the processing head 10 has a laser head 5 and an air blow nozzle 11. When the drive mechanism 25 (Fig. 1) moves the processing head 10, the laser head 5 and the air blow nozzle 11 move together. This allows each of the laser head 5 and the air blow nozzle 11 to move in the X direction, Y direction, and Z direction relative to the workpiece WO supported on the cutting pallet 2 of the container 1.

[0030] However, the air blow nozzle 11 may be provided separately from the processing head 10. In this case, the air blow nozzle 11 moves independently of the laser head 5 in each of the X direction, Y direction, and Z direction.

[0031] The laser head 5 mainly includes a head body BO and a condenser lens 6a. The head body BO includes a main body portion 5a.

[0032] The main body 5a has a hollow cylindrical shape. The condenser lens 6a is housed inside the main body 5a. The condenser lens 6a condenses the laser light RL onto the workpiece WO. The laser light RL condensed by the condenser lens 6a is emitted from a laser emission port 5aa of the main body 5a toward the workpiece WO.

[0033] The laser light RL used in the laser processing apparatus 20 of this embodiment has a wavelength of any of visible light, near-infrared light, mid-infrared light, and far-infrared light, and has a wavelength of 0.7 μm or more and 10 μm or less. This laser light RL is laser light whose light source is, for example, a fiber laser, or may be laser light whose light source is a solid-state laser containing YAG (Yttrium Aluminum Garnet). A fiber laser is a type of solid-state laser that uses an optical fiber as an amplification medium. In a fiber laser, the core at the center of the optical fiber is doped with the rare earth element Yb (ytterbium). The laser light RL emitted from a fiber laser is near-infrared light having a wavelength of approximately 1.06 μm. Fiber lasers have lower running and maintenance costs than carbon dioxide lasers.

[0034] The main body 5a has a gas outlet 5aa and a gas supply unit 5ab. Assist gas is supplied from the gas supply unit 5ab into the main body 5a. The assist gas supplied into the main body 5a is blown out from the gas outlet 5aa toward the workpiece WO. The gas outlet 5aa also serves as a laser emission outlet 5aa.

[0035] The head main body BO may further include an outer nozzle 5b. The outer nozzle 5b is attached to the main body 5a so as to surround the periphery of the gas outlet 5aa of the main body 5a. A clearance space is provided between the inner circumferential surface of the outer nozzle 5b and the outer circumferential surface of the main body 5a.

[0036] The outer nozzle 5b has a gas outlet 5ba and a gas supply unit 5bb. The gas outlet 5ba and the gas supply unit 5bb are each connected to the gap space. The gas outlet 5ba is disposed on the outer periphery of the gas outlet 5aa and has a circular ring shape.

[0037] A secondary gas (shield gas) is supplied from the gas supply unit 5bb to the gap space between the main body 5a and the outer nozzle 5b. The secondary gas supplied into the gap space is blown out from the gas outlet 5ba toward the workpiece WO. As a result, the secondary gas is blown out from the gas outlet 5ba on the outer circumferential side of the assist gas blown out from the gas outlet 5aa.

[0038] As described above, the laser head 5 has gas outlets 5aa and 5ba. The gas outlets 5aa and 5ba may include a gas outlet 5aa that blows out an assist gas and a gas outlet 5ba that blows out a secondary gas. The gas outlets 5aa and 5ba form a double nozzle structure.

[0039] The air blow nozzle 11 blows gas onto the upper surface of the workpiece WO supported by the cutting pallet 2 of the container 1. When the air blow nozzle 11 blows gas onto the upper surface of the workpiece WO, the permeation suppression liquid LI (liquid) on the upper surface of the workpiece WO is blown off from the upper surface of the workpiece WO. This makes it possible to remove the permeation suppression liquid LI adhering to the upper surface of the workpiece WO.

[0040] The air blow nozzle 11 is inclined at an angle θ with respect to the upper surface of the workpiece WO. This allows the air blow nozzle 11 to blow gas obliquely toward the upper surface of the workpiece WO. The gas blown out from the air blow nozzle 11 is, for example, compressed air, but it may also be a compressed inert gas or the like.

[0041] As shown in FIG. 4, the laser head 5 has a light-shielding cover 7. The light-shielding cover 7 surrounds the periphery of the laser emission port 5aa (gas outlet 5aa). The light-shielding cover 7 is made of, for example, a rubber sheet. The light-shielding cover 7 has a peripheral wall portion 7a, a first upper plate 7b, and a second upper plate 7c. The peripheral wall portion 7a has a cylindrical shape that surrounds the outer periphery of the head main body BO.

[0042] A first upper plate 7b and a second upper plate 7c are attached to the upper part of the peripheral wall portion 7a. One or more first holes 7ba are formed in the first upper plate 7b. The second upper plate 7c is disposed above the first upper plate 7b with a gap 7d therebetween.

[0043] The second upper plate 7c is provided with one or more second holes 7ca. The internal space 7e of the peripheral wall portion 7a located below the first upper plate 7b is connected to the external space of the light-shielding cover 7 through the first hole 7ba and the second hole 7ca. Therefore, even if the liquid level of the permeation suppressing liquid LI reaches a position higher than the lower end 7L of the peripheral wall portion 7a of the light-shielding cover 7 during laser processing, this structure allows gas in the internal space 7e of the light-shielding cover 7 to escape to the outside of the light-shielding cover 7 through the first hole 7ba and the second hole 7ca.

[0044] The first hole 7ba, the gap 7d, and the second hole 7ca form a labyrinth structure for the laser light. Specifically, as shown by the solid arrow in Figure 4, the laser light emitted from the laser emission port 5aa of the laser head 5 and reflected by the workpiece WO passes through the first hole 7ba and then travels linearly through the gap 7d, but does not reach the second hole 7ca. The second hole 7ca is located, for example, more inward than the first hole 7ba in the radial direction from the laser head 5.

[0045] The laser light that passes through the first hole 7ba and enters the gap 7d is repeatedly reflected (multiple-reflected) between the first upper plate 7b and the second upper plate 7c and is absorbed by the light-shielding cover 7. This prevents the laser light from leaking from the inside of the light-shielding cover 7 to the outside.

[0046] As shown in Fig. 5, a supply pipe 36 is provided to supply the permeation suppression liquid LI (Fig. 4) to the interior of the container 1. A supply valve 31 is attached to the supply pipe 36. Opening the supply valve 31 starts the supply of the permeation suppression liquid LI to the internal space of the container 1, and closing the supply valve 31 stops the supply of the permeation suppression liquid LI to the internal space of the container 1.

[0047] A gas pipe 37 is connected to the level adjustment tank 4 from the outside of the container 1. A pressurization valve 32 and a decompression valve 33 are attached to the gas pipe 37. Opening the pressurization valve 32 supplies gas into the level adjustment tank 4, and closing the pressurization valve 32 stops the supply of gas into the level adjustment tank 4. Opening the decompression valve 33 discharges gas from the level adjustment tank 4 to the outside, and closing the decompression valve 33 stops the discharge of gas from the level adjustment tank 4. The level adjustment tank 4, gas pipe 37, pressurization valve 32, and decompression valve 33 are included in a level adjustment mechanism 47. As described below, the level adjustment mechanism 47 adjusts the level of the permeation inhibitor liquid LI in the container 1 based on the detection results of the liquid level detection sensor 41.

[0048] An overflow pipe 38 is attached to the container 1. When the liquid level of the permeation suppression liquid LI in the container 1 reaches or exceeds a predetermined level, the permeation suppression liquid LI in the container 1 is discharged through the overflow pipe 38 into the liquid storage tank 35. The liquid storage tank 35 is disposed outside the container 1.

[0049] A liquid discharge pipe 39 is attached to the container 1. A discharge valve 34 is attached to the liquid discharge pipe 39. By opening the discharge valve 34, the permeation inhibitor liquid LI in the container 1 is discharged into a liquid storage tank 35, and by closing the discharge valve 34, the discharge of the permeation inhibitor liquid LI from the container 1 is stopped.

[0050] The container 1 is configured to be able to store the permeation suppression liquid LI at least up to a height HL of the mounting portion 2c. The container 1 is also able to store the permeation suppression liquid LI up to a position PL that is higher than the top surface of the workpiece WO placed on the mounting portion 2c.

[0051] The transmission suppression liquid LI stored in the container 1 absorbs light and suppresses the transmission of laser light. The transmission suppression liquid LI suppresses the transmission of light having a wavelength of, for example, 0.7 μm or more and 10 μm or less.

[0052] The transmittance of the transmission suppression liquid LI in the wavelength range of 0.7 μm to 10 μm is, for example, 10% / cm or less. Furthermore, the transmittance of the transmission suppression liquid LI in the wavelength range of 0.7 μm to 10 μm is preferably, for example, 5% / cm or less. Furthermore, the transmittance of the transmission suppression liquid LI in the wavelength range of 0.7 μm to 10 μm is more preferably, for example, 3% / cm or less.

[0053] The transmission suppression liquid LI contains an additive that absorbs or scatters light in the wavelength range of 0.7 μm to 10 μm in order to suppress the transmission of light in the wavelength range of 0.7 μm to 10 μm. This additive contains, for example, carbon. The additive is preferably black. The transmission suppression liquid LI is, for example, an aqueous solution in which carbon is added to water. The transmission suppression liquid LI is, for example, an aqueous solution in which 0.1 volume % of India ink is added to water. In this specification, water may be tap water or pure water. The India ink is prepared by dispersing carbon black in an aqueous solution of glue or other water-soluble resin, and the carbon black content is 4.0 to 20.0 wt %, preferably 5.0 to 10.0 wt %, of the total amount. The India ink is, for example, the commercially available "Kuretake Koinoku Ink Drop BA7-18."

[0054] The permeation suppression liquid LI preferably contains a rust inhibitor. The rust inhibitor is a corrosion inhibitor that suppresses corrosion of steel materials and the like. The rust inhibitor is, for example, water-soluble. Examples of the rust inhibitor that may be used include a precipitated film-type inhibitor, a passive inhibitor, and an oxygen-scavenging inhibitor.

[0055] The permeation suppression liquid LI preferably contains a water displacement agent (water-removing agent). The water displacement agent improves the water-removal properties of the workpiece WO. The water displacement agent is a solvent for removing a liquid, such as water, from the surface of a substance that has been wetted with the liquid. The water displacement agent may act to repel liquids, such as water, by forming a monomolecular thin film on the surface of the substance, for example.

[0056] The laser processing device 20 further includes a liquid level detection sensor 41 , a controller 50 , and a processing start switch 60 .

[0057] The liquid level detection sensor 41 is installed in the container 1 and has the function of detecting the liquid level of the permeation inhibitor liquid LI stored in the container 1. The liquid level detection sensor 41 is, for example, a guide pulse type level sensor.

[0058] The processing start switch 60 is operated externally by, for example, an operator to issue a command to start laser processing by the laser processing device 20. The processing start switch 60 may be provided on the operation panel 30. The processing start switch 60 may be a touch panel provided on the operation panel 30.

[0059] The controller 50 controls the opening and closing of the supply valve 31, the pressurization valve 32, the decompression valve 33, and the exhaust valve 34. Note that the line connecting the controller 50 and the exhaust valve 34 is not shown in FIG. 5 for the sake of simplicity. The controller 50 controls the drive mechanism 25 so that the processing head 10 moves in the X, Y, and Z directions. The controller 50 controls the laser emission from the laser head 5.

[0060] The controller 50 receives a signal indicating the liquid level of the permeation suppression liquid LI in the container 1 detected by the liquid level detection sensor 41. The controller 50 receives a signal indicating a command from the processing start switch 60 to start processing.

[0061] The controller 50 controls the opening and closing of the pressurization valve 32 or the decompression valve 33 based on the detection result of the liquid level detection sensor 41. This adjusts the amount of gas stored in the liquid level adjustment tank 4, and thereby adjusts the liquid level of the permeation inhibitor liquid LI stored in the container 1. As the controller 50 controls the opening and closing of the pressurization valve 32 or the decompression valve 33 in this way, the liquid level adjustment mechanism 47 (liquid level adjustment tank 4, gas piping 37, pressurization valve 32, and decompression valve 33) adjusts the liquid level of the permeation inhibitor liquid LI stored in the container 1.

[0062] The controller 50 controls the liquid level adjustment mechanism 47 and the laser oscillation by the laser head 5. As a result, the controller 50 causes the liquid level adjustment mechanism 47 to raise the liquid level of the permeation suppression liquid LI stored in the container 1 above the upper surface of the workpiece WO (after the workpiece WO is immersed in the permeation suppression liquid LI), and then emits laser light from the laser head 5 onto the workpiece WO.

[0063] The controller 50 controls the laser head 5 and the drive mechanism 25. As a result, the controller 50 moves the laser head 5 along a preset movement trajectory during laser processing (when laser light is emitted from the laser head 5).

[0064] The controller 50 controls the opening and closing of the valve 12. The opening and closing of the valve 12 controls the blowing of gas from the air blow nozzle 11. Specifically, opening the valve 12 causes the air blow nozzle 11 to blow out gas, and closing the valve 12 stops the blowing of gas from the air blow nozzle 11. The air blow nozzle 11 blows out gas in order to blow off the permeation suppression liquid LI adhering to the upper surface of the workpiece WO after laser processing is completed.

[0065] The controller 50 controls the liquid level adjustment mechanism 47 and the valve 12. As a result, the controller 50 causes the liquid level adjustment mechanism 47 to lower the liquid level of the permeation inhibition liquid LI stored in the container 1 below the upper surface of the workpiece WO, and then causes the air blow nozzle 11 to blow gas onto the workpiece WO.

[0066] The controller 50 controls the valve 12 and the drive mechanism 25. As a result, when the air blow nozzle 11 blows gas onto the workpiece WO, the controller 50 limits the movement trajectory of the air blow nozzle 11 to within the planar shape of the workpiece WO.

[0067] The controller 50 is, for example, a processor, and may be a CPU (Central Processing Unit).

[0068] <Controller function block> Next, the functional blocks of the controller 50 shown in FIG. 5 will be described with reference to FIGS.

[0069] Fig. 6 is a functional block diagram of the controller shown in Fig. 5. Fig. 7 is a plan view for explaining (A) generation of a movement trajectory of the air blow nozzle and (B) alignment with the workpiece.

[0070] As shown in Figure 6, the controller 50 has a memory unit 51, an execution program calculation unit 52, a liquid level control unit 53, a processing head movement control unit 54, a laser oscillator control unit 55, and an air blow ON / OFF control unit 56.

[0071] The storage unit 51 stores and saves an execution program generated by a CAD (Computer Aided Design) / CAM (Computer Aided Manufacturing) device 43 upon input. The CAD / CAM device 43 is, for example, a personal computer.

[0072] The execution program includes processing data and air blow data. The processing data includes data on the movement trajectory of the laser head 5 or plasma torch 5 (e.g., product shape) and data on processing conditions (processing speed, laser output / plasma output, etc.). The air blow data includes data on the movement trajectory of the air blow nozzle 11 and data on the outer shape of the workpiece WO.

[0073] The execution program calculation unit 52 outputs control signals to each of the liquid level control unit 53, the processing head movement control unit 54, the laser oscillator control unit 55, and the air blow ON / OFF control unit 56 based on the execution program stored in the memory unit 51. Furthermore, if the air blow data included in the execution program does not include movement trajectory data of the air blow nozzle 11, the execution program calculation unit 52 generates movement trajectory data of the air blow nozzle 11.

[0074] The movement trajectory data for the air blow nozzle 11 is generated based on the external shape data of the workpiece WO, the tilt angle θ of the air blow nozzle 11 (FIG. 3), and the like. Specifically, as shown in FIG. 7(A), the movement trajectory MT of the air blow nozzle 11 when blowing gas onto the workpiece WO is generated so as to be limited within the planar shape of the workpiece WO in a planar view. In this case, the tilt angle θ of the air blow nozzle 11 is also taken into consideration as described above, and the movement trajectory MT of the air blow nozzle 11 is generated so that the gas blown from the air blow nozzle 11 does not directly hit the permeation suppression liquid LI stored in the container 1.

[0075] The movement locus MT of the air blow nozzle 11 in the above means the movement locus of the point where the gas blown out from the air blow nozzle 11 hits the top surface of the workpiece WO. Furthermore, the movement locus MT of the air blow nozzle 11 being limited within the planar shape of the workpiece WO means that the movement locus MT of the air blow nozzle 11 is limited within the range of the planar shape of the workpiece WO in a planar view and does not go outside the planar shape of the workpiece WO.

[0076] Furthermore, the movement trajectory MT of the air blow nozzle 11 is generated so that the gas blown from the air blow nozzle 11 directly hits the workpiece WO and does not directly hit the permeation suppression liquid LI located below the top surface of the workpiece WO outside the planar shape of the workpiece WO. The air blow nozzle 11 blows gas at an angle relative to the top surface of the workpiece WO, as shown in Figure 3. Therefore, even in this case, the movement trajectory MT of the air blow nozzle 11 is generated so that the gas blown from the air blow nozzle 11 directly hits the workpiece WO and does not directly hit the permeation suppression liquid LI stored in the container 1.

[0077] 6, the liquid level control unit 53 outputs a control signal to the liquid level adjustment mechanism 47 based on a control signal from the execution program calculation unit 52. Specifically, the liquid level control unit 53 outputs a signal to control the opening and closing of each of the pressurizing valve 32 and the decompressing valve 33.

[0078] The machining head movement control unit 54 outputs a control signal to the drive mechanism 25 based on the control signal from the execution program calculation unit 52. Specifically, the machining head movement control unit 54 outputs signals that control the driving of each of the X-axis motor, Y-axis motor, and Z-axis motor of the drive mechanism 25. This controls the movement of the machining head 10 in the X-, Y-, and Z-directions.

[0079] The laser oscillator control unit 55 outputs a control signal to the laser oscillator 44 based on a control signal from the execution program calculation unit 52. Specifically, the laser oscillator control unit 55 outputs a signal that controls ON / OFF of laser light oscillation by the laser oscillator 44. When laser light oscillation by the laser oscillator 44 is turned ON, laser light is oscillated from the laser oscillator 44 and emitted to the workpiece WO through the laser head 5. In this way, the workpiece WO is processed.

[0080] The air blow ON / OFF control unit 56 outputs a signal to control the opening and closing of the valve 12 based on a control signal from the execution program calculation unit 52. By controlling the valve 12 to be in an open state, gas is supplied from the air supply source 46 to the air blow nozzle 11. This causes gas to be blown from the air blow nozzle 11 onto the top surface of the workpiece WO. By controlling the valve 12 to be in a closed state, the supply of gas from the air supply source 46 to the air blow nozzle 11 is stopped. This causes the air blow nozzle 11 to stop blowing gas onto the top surface of the workpiece WO.

[0081] When the air blow nozzle 11 blows gas onto the workpiece WO, the controller 50 controls the drive mechanism 25 so as to restrict the movement trajectory of the air blow nozzle 11 to within the planar shape of the workpiece WO. Specifically, the controller 50 controls the air blow nozzle 11 to blow gas onto the workpiece WO as follows.

[0082] The execution program calculation unit 52 determines the position information of the workpiece WO carried into the laser processing device 20 on the cutting pallet 2. As shown in Fig. 7(B), for example, one side of the workpiece WO having a rectangular planar shape may be tilted at an angle α with respect to the X direction of the thermal processing device 20. In this case, the execution program calculation unit 52 determines the tilted position of the workpiece WO.

[0083] Thereafter, the execution program calculation unit 52 aligns the position of the generated movement trajectory MT of the air blow nozzle 11 with the determined position of the workpiece WO. Specifically, the execution program calculation unit 52 aligns the position and inclination of the generated movement trajectory MT of the air blow nozzle 11 with the position and inclination of the tilted workpiece WO. By this alignment, even if the workpiece WO is placed tilted on the cutting pallet 2, the movement trajectory MT of the air blow nozzle 11 during gas blowing is limited to within the planar shape of the workpiece WO.

[0084] The execution program calculation unit 52 controls the drive mechanism 25 via the processing head movement control unit 54 so that the processing head 10 moves according to the movement trajectory MT of the air blow nozzle 11. When the air blow nozzle 11 reaches the gas blowing start point S on the movement trajectory MT, the execution program calculation unit 52 controls the valve 12 to open via the air blow ON / OFF control unit 56. This causes the air blow nozzle 11 to start blowing gas onto the workpiece WO.

[0085] Thereafter, the execution program calculation unit 52 controls the drive mechanism 25 so that the air blow nozzle 11 moves along the movement trajectory MT within the planar shape of the workpiece WO in a planar view while keeping the valve 12 open. When the air blow nozzle 11 reaches the gas blowing end point F on the movement trajectory MT, the execution program calculation unit 52 controls the valve 12 to close via the air blow ON / OFF control unit 56. This stops the air blow nozzle 11 from blowing gas onto the workpiece WO.

[0086] As described above, the controller 50 has a function of controlling the blowing of gas onto the workpiece WO by the air blow nozzle 11. Note that the determination of the position information on the cutting pallet 2 of the workpiece WO carried into the laser processing device 20 and the alignment of the determined position of the workpiece WO with the movement trajectory MT may be performed by the CAD / CAM device 43.

[0087] <Laser processing method> Next, a laser processing method using the laser processing device 20 in this embodiment will be described with reference to FIGS.

[0088] FIG. 8 is a flow diagram showing a laser processing method according to one embodiment. As shown in FIG. 5, the permeation suppression liquid LI is supplied into the container 1 of the laser processing apparatus 20. At this time, the controller 50 controls the supply valve 31 to open. This allows the permeation suppression liquid LI to be supplied into the container 1 from the supply pipe 36. At this time, the controller 50 detects the level of the permeation suppression liquid LI in the container 1 using the liquid level detection sensor 41. When the controller 50 determines, based on the detection result of the liquid level detection sensor 41, that the level of the permeation suppression liquid LI in the container 1 has reached the desired level SL, it controls the supply valve 31 to close. At this time, the permeation suppression liquid LI is supplied, for example, to a position SL that is lower than the height position HL of the mounting portion 2c of the cutting pallet 2.

[0089] As shown in Fig. 6, an execution program is generated in the CAD / CAM device 43. The execution program includes the processing data and air blow data as described above. The execution program generated by the CAD / CAM device 43 is input and saved in the memory unit 51 in the controller 50 of the thermal processing apparatus 20 (step S1: Fig. 8).

[0090] 5, the workpiece WO is then carried into the thermal processing device 20 (step S2: FIG. 8). By carrying the workpiece WO into the thermal processing device 20, the workpiece WO is placed on the placement portion 2c of the cutting pallet 2.

[0091] With the workpiece WO placed on the placement section 2c, position information of the workpiece WO in the thermal processing device 20 is determined (step S3: FIG. 8). The position of the workpiece WO in the thermal processing device 20 is determined, for example, by the coordinates of three points on the outer shape of the workpiece WO and the planar shape of the workpiece WO.

[0092] The coordinates of three points on the outer shape of the workpiece WO placed on the cutting pallet 2 are obtained by scanning with, for example, a laser pointer. Alternatively, the coordinates of three points on the outer shape of the workpiece WO placed on the cutting pallet 2 may be obtained from an image captured by, for example, a CCD (Charge Coupled Device) camera.

[0093] 6, the execution program calculation unit 52 of the controller 50 determines the position information of the workpiece WO in the thermal processing device 20 based on the acquired coordinates of three points on the outer shape of the workpiece WO and the outer shape data of the workpiece WO stored in the memory unit 51. In this state, the laser processing operation by the laser processing device 20 is started.

[0094] 5, the laser processing operation in the laser processing device 20 is started, for example, by operating the processing start switch 60. When the laser processing operation is started, the controller 50 raises the liquid level of the permeation inhibition liquid LI stored in the container 1 to the target liquid level PL based on the detection result of the liquid level detection sensor 41 (step S4: FIG. 8).

[0095] The target liquid level PL of the permeation suppression liquid LI is equal to or higher than the height position HL of the mounting portion 2c. In this embodiment, the target liquid level PL of the permeation suppression liquid LI is adjusted to a position PL higher than the top surface of the workpiece WO, for example. As a result, the entire workpiece WO is submerged (immersed) in the permeation suppression liquid LI.

[0096] When raising the level of the permeation inhibition liquid LI to the target liquid level PL, the execution program calculation unit 52 controls the liquid level adjustment mechanism 47 via the liquid level control unit 53, as shown in Fig. 6. Specifically, as shown in Fig. 5, the controller 50 controls the pressure valve 32 to open, for example. This supplies gas into the liquid level adjustment tank 4, and the liquid level of the permeation inhibition liquid LI stored in the container 1 is adjusted to rise to the target liquid level PL.

[0097] When the liquid level detection sensor 41 detects that the liquid level of the permeation suppression liquid LI has reached the target liquid level PL, processing of the workpiece WO begins (step S5: FIG. 8). When processing the workpiece WO, the execution program calculation unit 52 controls the laser oscillator 44 through the laser oscillator control unit 55, as shown in FIG. 6. This causes laser light to be emitted from the laser head 5.

[0098] 6, the execution program calculation unit 52 controls the drive mechanism 25 through the processing head movement control unit 54. This causes the laser head 5 to move along the movement trajectory of the laser head 5 (for example, the product shape) stored in the memory unit 51.

[0099] 3, during laser processing, a laser beam is irradiated onto a workpiece WO from a laser head 5. An assist gas is also blown out from the laser head 5 toward the workpiece WO.

[0100] 4, the blowing force of the assist gas pushes away the permeation suppression liquid LI at the processing point of the workpiece WO, thereby exposing the upper surface of the workpiece WO from the permeation suppression liquid LI at the processing point of the workpiece WO.

[0101] A laser beam is irradiated onto the upper surface of the workpiece WO exposed from the permeation suppression liquid LI. The workpiece WO is processed by this irradiation of the laser beam. As a result, the workpiece WO is cut, for example. The laser beam that penetrates the workpiece WO by cutting it is incident on the permeation suppression liquid LI stored below the workpiece WO.

[0102] During laser processing, the liquid level of the permeation suppression liquid LI is higher than the lower end 7L of the light-shielding cover 7. Therefore, the assist gas blown out from the laser head 5 is blocked by the permeation suppression liquid LI and does not escape to the outside of the light-shielding cover 7 through the gap between the lower end 7L of the light-shielding cover 7 and the upper surface of the workpiece WO. However, the assist gas blown out from the laser head 5 escapes from the inside to the outside of the light-shielding cover 7 through the first hole 7ba in the first upper plate 7b and the second hole 7ca in the second upper plate 7c. Therefore, the blowing out of the assist gas prevents the gas pressure inside the light-shielding cover 7 from increasing.

[0103] The sludge generated when cutting the workpiece WO by laser processing sinks in the permeation suppression liquid LI and accumulates in the sludge tray 3 (Figure 5). Sludge is, for example, particles of iron oxide formed when molten iron solidifies. By performing laser processing while the workpiece WO is immersed in the permeation suppression liquid LI in this way, the sludge generated during processing is prevented from scattering around.

[0104] 5, when the above laser processing is completed, the controller 50 lowers the liquid level of the permeation suppression liquid LI stored in the container 1 to a position lower than the bottom surface of the workpiece WO based on the detection result of the liquid level detection sensor 41 (step S6: FIG. 8). As a result, the entire workpiece WO is exposed from the permeation suppression liquid LI.

[0105] When the level of the permeation inhibition liquid LI is lowered to a position lower than the bottom surface of the workpiece WO, the execution program calculation unit 52 controls the liquid level adjustment mechanism 47 via the liquid level control unit 53, as shown in FIG. 6. Specifically, as shown in FIG. 5, after detecting the end of laser processing, the controller 50 controls, for example, the pressure reducing valve 33 to open. This reduces the amount of gas stored in the level adjustment tank 4, causing the permeation inhibition liquid LI to flow into the level adjustment tank 4. As a result, the level of the permeation inhibition liquid LI in the container 1 drops. At this time, the controller 50 detects the level of the permeation inhibition liquid LI in the container 1 using the liquid level detection sensor 41. When the controller 50 determines that the level of the permeation inhibition liquid LI in the container 1 has reached the desired level SL, it controls the pressure reducing valve 33 to close.

[0106] Thereafter, the air blow nozzle 11 blows gas onto the workpiece WO (step S7: FIG. 8). Before the gas is blown, as shown in FIG. 7(B), the movement trajectory MT of the air blow nozzle 11 is aligned with the determined position of the workpiece WO on the cutting pallet 2. This alignment is performed by the execution program calculation unit 52 shown in FIG. 6. After performing the above alignment, the execution program calculation unit 52 controls the drive mechanism 25 via the processing head movement control unit 54. As a result, the air blow nozzle 11 moves along the movement trajectory MT specified by a command from the controller 50. This movement trajectory MT is limited within the planar shape of the workpiece WO.

[0107] In the gas blowing described above, compressed air is blown onto the upper surface of the workpiece WO from the air blow nozzle 11. As a result, the liquid adhering to the upper surface of the workpiece WO is blown off by the compressed air and removed from the upper surface of the workpiece WO.

[0108] After the gas blowing is completed, the workpiece WO is carried out from the thermal processing device 20 (step S8: FIG. 8). During this carrying out, the workpiece WO is sorted into products and remaining frames. This carrying out may be performed by an operator attracting the workpiece WO to a magnet.

[0109] If necessary, the cutting pallet 2 and the sludge tray 3 are removed from the container 1. After this, the sludge in the sludge tray 3 is removed.

[0110] As described above, laser processing is performed using the laser processing device 20 of this embodiment.

[0111] <Effects of this embodiment> Next, the effects of this embodiment will be described.

[0112] In this embodiment, as shown in Figure 7(B), gas is blown onto the workpiece WO by the air blow nozzle 11. This blows away and removes the permeation suppression liquid LI adhering to the upper surface of the workpiece WO. This prevents the permeation suppression liquid LI from remaining on the upper surface of the workpiece WO, thereby preventing the workpiece WO from deteriorating in appearance. This also prevents the liquid adhering to the upper surface of the workpiece WO from drying and causing stains. This also prevents the liquid from remaining on the upper surface of the workpiece WO from causing rust.

[0113] Furthermore, the controller 50 controls the air blow nozzle 11 to automatically blow gas. This eliminates the need for manual wiping of the permeation suppression liquid LI from the surface of the workpiece WO. This reduces manual labor and simplifies the process even when a liquid such as the permeation suppression liquid LI is used during processing.

[0114] Furthermore, if the gas blown out from the air blow nozzle 11 directly hits the permeation suppression liquid LI, the permeation suppression liquid LI will not only blow up and wet the workpiece WO, but also wet the vicinity of the thermal processing device 20.

[0115] 7(B), in this embodiment, the movement trajectory MT of the air blow nozzle 11 when blowing gas onto the workpiece WO is limited to the planar shape of the workpiece WO. This prevents the gas blown out from the air blow nozzle 11 from being blown directly onto the permeation suppression liquid LI stored in the container 1. This prevents the gas from directly hitting the permeation suppression liquid LI, causing the permeation suppression liquid LI to be blown up and wetting the surface of the workpiece WO and the vicinity of the laser processing device 20.

[0116] 6, in this embodiment, the air blow nozzle 11 is movable in the vertical direction relative to the workpiece WO. This allows the gas outlet of the air blow nozzle 11 to be brought closer to the top surface of the workpiece WO. This allows the permeation suppression liquid LI adhering to the top surface of the workpiece WO to be efficiently blown away by the gas.

[0117] 3, in this embodiment, the air blow nozzle 11 is attached to the processing head 10. Therefore, the air blow nozzle 11 can be moved by the drive mechanism for moving the processing head 10. Therefore, a drive mechanism dedicated to the air blow nozzle 11 is not required.

[0118] 3, in this embodiment, the air blow nozzle 11 blows gas obliquely toward the top surface of the workpiece WO. This prevents the gas blown from the air blow nozzle 11 from flowing to the underside of the workpiece WO through slits in the workpiece WO formed by processing. This prevents the gas that has flowed to the underside of the workpiece WO through the slits from blowing up the permeation suppression liquid LI below the workpiece WO.

[0119] In this embodiment, the permeation suppression liquid LI contains a water displacement agent that improves the drainage of the workpiece WO. This makes it easier for liquid adhering to the surface of the workpiece WO to be removed from the workpiece WO by its own gravity. This also minimizes wetting of the back side of the workpiece WO.

[0120] As shown in Figure 7(A), when the air blow nozzle 11 moves along the movement trajectory MT from near one end of the workpiece WO in the Y direction to near the other end, it is preferable that the air blow nozzle 11 be inclined, for example, along the X direction, as shown in Figure 3.

[0121] In the above embodiment, a laser processing apparatus that processes a workpiece WO using laser light has been described as an example of the thermal processing apparatus 20. However, the thermal processing apparatus 20 of the present disclosure may be a plasma processing apparatus that processes a workpiece WO using plasma, in addition to a laser processing apparatus.

[0122] In the plasma processing device, by storing a liquid in the container 1, the dust generated when the workpiece WO is plasma processed can be efficiently collected without a large-scale dust collector, and the effect of improving cutting accuracy by reducing thermal strain can also be obtained.

[0123] However, when the workpiece WO is cut using the plasma processing device 20, the width of the cut groove becomes larger than in the case of laser processing. Therefore, even if the liquid level stored in the container 1 is lower than the upper surface of the workpiece WO, when the plasma jet hits the liquid during plasma processing, the liquid passes through the cut groove and rises to the upper surface of the workpiece WO, wetting the workpiece WO. Even if the workpiece WO becomes wet with liquid during plasma processing, the liquid can be removed from the workpiece WO with little effort by applying the present disclosure.

[0124] When the thermal processing apparatus 20 is a plasma processing apparatus, a plasma power supply control unit 55, a plasma power supply 44, and a plasma torch 5 are used instead of the laser oscillator control unit 55, the laser oscillator 44, and the laser head 5 described above. As shown in Fig. 6, the plasma power supply control unit 55 outputs a signal that controls the ON / OFF of the plasma power supply 44. When the plasma power supply 44 is turned ON, plasma is generated in the plasma torch 5, and the workpiece WO is processed by the plasma.

[0125] In the above embodiment, the workpiece WO is processed with the liquid level of the permeation suppression liquid LI raised to a position higher than the top surface of the workpiece WO. However, the present disclosure is not limited to this, and the liquid level of the permeation suppression liquid LI when processing the workpiece WO may be at a height below the top surface of the workpiece WO.

[0126] In the above embodiment, the permeation suppression liquid LI has been described as the liquid stored in the container 1. However, the present disclosure is not limited to this content, and the liquid stored in the container 1 may be a cooling liquid (e.g., water) for cooling the workpiece WO, or may be a scattering prevention liquid for preventing sludge from scattering.

[0127] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0128] 1 container, 1a bottom wall, 1b side wall, 1c pallet support portion, 2 cutting pallet, 2a first support plate, 2b second support plate, 2c placing portion, 3 sludge tray, 4 liquid level adjustment tank, 5 laser head (plasma torch), 5a main body portion, 5aa laser emission port (gas outlet), 5ba gas outlet, 5ab, 5bb gas supply portion, 5b outer nozzle, 6a condenser lens, 7 light-shielding cover, 7L lower end, 7a peripheral wall portion, 7b first upper plate, 7ba first hole, 7c second upper plate, 7ca second hole, 7d gap, 7e internal space, 10 processing head, 11 air blow nozzle, 12 valve, 20 thermal processing device, 21 support base, 22 X-direction movable base, 23 Y-direction movable base, 25 drive mechanism, 30 operation panel, 31 supply valve, 32 Pressurization valve, 33 pressure reducing valve, 34 discharge valve, 35 liquid storage tank, 36 supply piping, 37 gas piping, 38 overflow piping, 39 liquid discharge piping, 41 liquid level detection sensor, 42 transmittance detection sensor, 43 CAD / CAM device, 44 laser oscillator (plasma power supply), 46 air supply source, 47 liquid level adjustment mechanism, 50 controller, 51 memory unit, 52 execution program calculation unit, 53 liquid level control unit, 54 processing head movement control unit, 55 laser oscillator control unit (plasma power supply control unit), 56 air blow ON / OFF control unit, 60 processing start switch, BO head body, LI permeation suppression liquid, MT movement trajectory, WO workpiece.

Claims

1. A thermal processing device that processes a workpiece using laser light or plasma, a container that supports the workpiece and is capable of storing a liquid; an air blow nozzle that blows gas onto the workpiece supported in the container; a drive mechanism for moving the air blow nozzle; a controller that controls the drive mechanism so as to limit a movement locus of the air blow nozzle within a planar shape of the workpiece when the air blow nozzle blows gas onto the workpiece after the workpiece has been processed, The air blow nozzle blows gas onto the workpiece while moving along a movement trajectory different from a movement trajectory of a processing head during processing of the workpiece.

2. 2. The thermal processing apparatus according to claim 1, wherein the air blow nozzle is movable in a vertical direction relative to the workpiece.

3. The processing head has a laser head or a plasma torch and is movable relative to the workpiece; 3. The thermal processing apparatus according to claim 1, wherein the processing head has the air blow nozzle.

4. 4. The thermal processing apparatus according to claim 1, wherein the air blow nozzle blows the gas obliquely toward the upper surface of the workpiece.

5. a step of processing a workpiece supported in a container containing a liquid using a laser beam or plasma; and a step of blowing gas onto the workpiece using an air blow nozzle after the workpiece has been processed, limiting a movement locus of the air blow nozzle when the air blow nozzle blows gas onto the workpiece to within a planar shape of the workpiece; The air blow nozzle blows gas onto the workpiece while moving along a movement trajectory different from a movement trajectory of a processing head during processing of the workpiece.

6. The thermal processing method according to claim 5 , wherein the liquid contains a water displacement agent that improves the drainage of the workpiece.

7. In the step of processing the workpiece, a liquid level of the liquid is controlled to be higher than an upper surface of the workpiece supported by the container; 7. The thermal processing method according to claim 5, wherein in the step of blowing gas onto the workpiece, the liquid level is controlled to be lower than the upper surface of the workpiece supported by the container.

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