Nozzle, soldering device, and method for manufacturing substrate device

Abstract

To obtain a nozzle that can suppress the generation of solder bridges compared to the case where the tip of the outlet in the tip member attached to the main body is not stepped with the tip of the opening of the main body.SOLUTION: A nozzle 80 has an attachment 100 with an upper surface 110 that extends outwardly in the radial direction of the outlet 94 from which molten solder J is discharged upwardly and does not project upwardly from the outlet 94, and a lower surface 112 that is connected from the outer edge of the upper surface 110 to the base 80B side and slopes inwardly in the radial direction toward the base 80B side, and a nozzle body 82 which has an aperture 86 at its tip through which molten solder J is discharged, and in which the attachment 100 is attached to the nozzle body with the outlet 94 positioned above the aperture 86.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a nozzle, a soldering device, and a method for manufacturing a substrate device. [Background technology]

[0002] The following Patent Document 1 discloses a nozzle having an upper inclined surface formed at the tip, which forms the outer edge surface of the outlet from which molten solder is ejected and which slopes radially outward as it approaches the base end, and a lower inclined surface which forms a circumferential surface connecting the outer edge of the upper inclined surface to the base end and which slopes radially inward as it approaches the base end. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5867645 Summary of the Invention [Problem to be solved by the invention]

[0004] For example, in a nozzle used to solder electronic components with terminals inserted into through-holes in a circuit board, the edge of the nozzle may wear over time, causing oxidation of the edge of the nozzle, which may disrupt the flow of molten solder being discharged from the nozzle. If this disruption occurs in the flow of molten solder, solder bridges, which electrically connect the terminals, may occur when soldering electronic components with terminals inserted into through-holes in a circuit board.

[0005] The purpose of the present disclosure is to provide a nozzle, a soldering device, and a method for manufacturing a substrate device that can suppress the occurrence of solder bridges compared to when there is no step between the tip of the discharge outlet of the tip member attached to the main body and the tip of the opening in the main body. [Means for solving the problem]

[0006] The nozzle of the first embodiment comprises a tip member having an upper surface that extends radially outward from the outlet through which molten solder is ejected upward and does not protrude upward from the outlet, and a lower surface that connects from the outer edge of the upper surface to the base end side and slopes radially inward as it approaches the base end side; and a main body that has an opening formed at the tip through which molten solder is ejected and to which the tip member is attached with the outlet positioned above the opening.

[0007] A nozzle according to a second aspect is the nozzle according to the first aspect, wherein at least a portion of the upper surface is inclined radially outward toward the base end portion.

[0008] The nozzle according to the third aspect is the nozzle according to the second aspect, wherein the inner circumferential surface of the tip member that forms the discharge outlet and the upper surface are directly connected via a ridge portion, and the angle formed between the inner circumferential surface and the upper surface in a vertical cross section is an acute angle.

[0009] A nozzle according to a fourth aspect is the nozzle according to the third aspect, wherein an angle formed between the inner circumferential surface and the upper surface in a vertical cross section is equal to or greater than 50° and smaller than 90°.

[0010] A nozzle according to a fifth aspect is the nozzle according to the third aspect, wherein the ridge portion of the tip member is a flat portion along the horizontal direction, and the horizontal width of the flat portion is 0.5 mm or less.

[0011] A nozzle according to a sixth aspect is the nozzle according to the first aspect, wherein the upper surface of the tip member is arranged along a horizontal direction.

[0012] A nozzle according to a seventh aspect is the nozzle according to any one of the first to sixth aspects, wherein the tip member is configured to be detachable from the main body.

[0013] The nozzle of the eighth aspect is the nozzle of the seventh aspect, wherein the outer peripheral surface of the main body has a tapered portion that slopes radially inward as it approaches the opening side, and the inner peripheral surface of the tip member has a contact surface that slopes radially inward as it approaches the discharge port side and that contacts the tapered portion.

[0014] A soldering device according to a ninth aspect includes a nozzle according to any one of the first to eighth aspects, a main body to which the base end of the nozzle is fixed, which collects and stores molten solder discharged from the nozzle outlet and discharges the stored molten solder from the nozzle outlet, and a moving device which moves the tip of the nozzle relative to the substrate along the back surface of the substrate.

[0015] The soldering apparatus according to the tenth aspect is the soldering apparatus according to the ninth aspect, and is configured such that the nozzle is replaced with one having a different angle between the inner circumferential surface forming the outlet of the tip member and the upper surface depending on the substrate.

[0016] The soldering apparatus according to the eleventh aspect is the soldering apparatus according to the ninth aspect, and is configured such that the nozzle is replaced with one having a different angle between the inner circumferential surface forming the outlet in the tip member and the top surface, depending on the vertical length or pitch of the terminals of the electronic component inserted into the through holes from the surface side of the board.

[0017] A method for manufacturing a substrate device according to a twelfth aspect uses a soldering apparatus according to any one of the ninth to eleventh aspects, and moves the nozzle relative to the substrate while ejecting molten solder from the ejection outlet along the back surface of the substrate, from the front surface side of the substrate, along the back surface of the substrate, on which terminals of electronic components have been inserted into through holes, thereby soldering the terminals to the substrate. [Effects of the Invention]

[0018] The nozzle according to the first aspect can suppress the occurrence of solder bridges compared to when there is no step between the tip of the discharge port in the tip member attached to the main body and the tip of the opening in the main body.

[0019] The nozzle according to the second aspect can suppress the occurrence of solder bridges when the jet of molten solder descends (that is, when it slows down) compared to when the entire top surface of the tip member is horizontal.

[0020] The nozzle according to the third aspect can suppress the occurrence of solder bridges when the molten solder jet descends (i.e., when it slows down) compared to when the angle between the surface forming the discharge port and the top surface of the tip member is 90° or more.

[0021] The nozzle according to the fourth aspect can suppress the occurrence of solder bridges when the molten solder jet descends (i.e., slows down) compared to when the angle between the surface of the tip member forming the discharge port and the top surface is 90° or more. Also, compared to when the angle between the surface of the tip member forming the discharge port and the top surface is less than 50°, the flow of the molten solder (for example, the flow of the molten solder as it flows down) is stabilized.

[0022] With the nozzle according to the fifth aspect, solder bridges due to oxidation of the flat surface are less likely to occur compared to when the width of the flat surface in the direction intersecting the axial direction of the main body is greater than 0.5 mm.

[0023] The nozzle according to the sixth aspect can suppress oxidation of the upper surface of the tip member when the discharge of molten solder is stopped, compared to when the upper surface of the tip member is inclined radially outward toward the base end side.

[0024] According to the nozzle of the seventh aspect, compared to when a tip member is joined to the main body, only the tip member that wears out can be replaced, and running costs are reduced.

[0025] According to the nozzle of the eighth aspect, the tip member can be more easily attached to and detached from the main body than when the outer circumferential surface of the main body and the inner circumferential surface of the tip member are arranged straight along the axial direction.

[0026] According to the soldering device of the ninth aspect, the occurrence of solder bridges can be suppressed compared to when a nozzle is provided in which the tip of the outlet of the tip member attached to the main body is not stepped with the tip of the opening of the main body.

[0027] According to the soldering device of the tenth aspect, compared to when the nozzle is not changed depending on the board, the occurrence of solder bridges can be suppressed when the molten solder jet descends (i.e., when slowing down) or when the nozzle is moved while soldering.

[0028] According to the soldering apparatus of the eleventh aspect, compared to when the nozzle is not changed according to the vertical length or pitch of the terminals of the electronic component, the occurrence of solder bridges can be suppressed when the molten solder jet descends (i.e., when slowing down) or when the nozzle is moved while soldering.

[0029] According to the method for manufacturing a substrate device relating to the 12th aspect, the occurrence of solder bridges can be suppressed compared to when a nozzle is provided in which the tip of the outlet of the tip member attached to the main body has no step with the tip of the opening in the main body. [Brief explanation of the drawings]

[0030] [Figure 1] 1 is a schematic diagram showing an example of a soldering device equipped with a nozzle according to a first embodiment. [Figure 2] FIG. 1 is an explanatory diagram of a point flow soldering method. [Figure 3] (A) is a diagram showing the state in which the nozzle is moved while discharging molten solder to perform soldering, (B) is a diagram showing the state just before the molten solder between the back surface of the board and the nozzle separates from the back surface, and (C) is a diagram showing the state in which the nozzle has passed the lead at the end of the electronic component and separated from the back surface. [Figure 4]FIG. 2 is a perspective view showing a nozzle with an attachment attached to the tip of the nozzle body. [Figure 5] FIG. 2 is a cross-sectional view taken along the axial direction of a nozzle to which an attachment is attached. [Figure 6] 10 is a cross-sectional view showing a state in which molten solder is discharged from the nozzle during initial use of the nozzle. FIG. [Figure 7] 10 is a cross-sectional view showing a state in which molten solder has been discharged from the nozzle after the nozzle has been used for a predetermined period of time. FIG. [Figure 8] 10A and 10B are diagrams illustrating a state in which the molten solder is separated from the lower end of the electronic component when the jet of molten solder from the nozzle outlet drops. [Figure 9] FIG. 10 is a cross-sectional view taken along the axial direction of a nozzle according to a second embodiment. [Figure 10] FIG. 10 is a cross-sectional view taken along the axial direction of the nozzle of the third embodiment, showing a state in which molten solder is being ejected from the nozzle. [Figure 11] 10(A) to 10(E) are diagrams showing the state of a jet of molten solder discharged from a nozzle according to a third embodiment as it descends over time. [Figure 12] FIG. 10 is a diagram showing the configuration of the third embodiment when the nozzle is moving, showing the state in which soldering is being performed by moving the nozzle while discharging molten solder. [Figure 13] FIG. 10 is a cross-sectional view taken along the axial direction of the nozzle of the fourth embodiment, showing a state in which molten solder is being discharged from the nozzle. [Figure 14] FIG. 10 is a diagram showing the configuration of a fourth embodiment in which the nozzle is moving, and shows a state in which soldering is being performed by moving the nozzle while discharging molten solder. [Figure 15] FIG. 10 is a diagram showing a state in which the jet of molten solder from the nozzle of the fourth embodiment is stopped. [Figure 16] FIG. 10 is a cross-sectional view showing a state of a nozzle of a comparative example at the time of initial use. [Figure 17] 10 is a cross-sectional view showing a state in which molten solder is discharged from the nozzle of the comparative example after the nozzle has been used for a predetermined period of time. FIG. [Figure 18]FIG. 10 is a perspective view showing the state of a nozzle of a comparative example after it has been used for a predetermined period of time. DETAILED DESCRIPTION OF THE INVENTION

[0031] Hereinafter, modes for implementing the technology of the present disclosure will be described.

[0032] [First embodiment] A soldering apparatus according to a first embodiment of the present invention will be described.

[0033] <Overall structure> First, the overall configuration of a soldering apparatus 10 (hereinafter referred to as "apparatus 10") of the first embodiment will be described. The apparatus 10 has the same structure as a known apparatus, except for a nozzle 80, which will be described later.

[0034] The apparatus 10 shown in FIG. 1 is a so-called point-flow soldering apparatus. Specifically, the apparatus 10 brings a nozzle 80 (see also FIG. 4 ), which ejects (jet) molten solder J from an ejection port 94, close to a back surface 50B of a printed circuit board 50 (hereinafter referred to as the “board 50”), as shown in FIGS. 2 and 3 . The nozzle 80 then moves along the back surface 50B of the board 50 while ejecting the molten solder J (see FIGS. 1 and 3 ) from the ejection port 94 of the nozzle 80, thereby soldering the leads 62 to the board 50. In this embodiment, the upper side of the board 50 in the vertical direction (the Z direction, described later) is the front surface 50A, and the lower side is the back surface 50B. The leads 62 are an example of terminals.

[0035] In Fig. 3, only three through-holes 52 are shown with dashed lines to avoid cluttering the drawing. Fig. 2 is an explanatory diagram showing the movement of the nozzle 80, with arrows S1 and S2 indicating the trajectory of the nozzle 80. While Fig. 2 illustrates the movement of one nozzle 80, for ease of understanding, the moving nozzle 80 is illustrated with multiple solid lines. Also, the component 60 is not shown. 1, the device 10 has a main body 12, a holder 14 that holds a substrate 50, and a drive unit 16 that moves the main body 12 in the X, Y, and Z directions. Note that the up-down direction in FIG. 1 is the Z direction (vertical direction), the left-right direction is the X direction (horizontal direction), and the direction perpendicular to the paper surface is the Y direction (horizontal direction).

[0036] The main body 12 has the function of collecting the molten solder J dispensed from the outlet 94 of the nozzle 80 and storing it in the storage tank 22, and discharging the stored molten solder J from the outlet 94 of the nozzle 80. Note that arrow M in FIG. 1 indicates the flow of the molten solder J. Although not shown, the main body 12 is provided with a pump that supplies the molten solder J to the inside of the nozzle 80 (a supply path 84, described below). The pump includes an impeller disposed within the storage tank 22, a first gear fixed to one end of the impeller's rotating shaft that protrudes outside the storage tank 22, a motor disposed outside the storage tank 22, a second gear fixed to the motor's rotating shaft, and a chain wound around the first gear and the second gear. The main body 12 dispenses the molten solder J from the outlet 94 of the nozzle 80 by operating the pump (rotating the motor). As the molten solder J jets upward from the discharge port 94, the molten solder J comes into contact with the substrate 50 and the leads 62, soldering the leads 62 to the substrate 50.

[0037] Then, the drive unit 16 moves the main body 12 relative to the holding unit 14 (substrate 50) in the X, Y, and Z directions, causing the nozzle 80 to move toward and away from the back surface 50B of the substrate 50 and along the back surface 50B, as described above. Here, "toward and away" refers to bringing the nozzle 80 close to the substrate 50 so that the nozzle 80 does not come into contact with the tips (lower ends) of the leads 62 of the component 60 inserted into the through-holes 52 of the substrate 50 and the molten solder J comes into contact with the leads 62, or to moving the nozzle 80 sufficiently away from the substrate 50 so that the molten solder J does not come into contact with the tips of the leads 62.

[0038] <Nozzle> Next, the structure of the nozzle 80 will be described.

[0039] 4 and 5, the nozzle 80 has a structure including a nozzle main body 82 having a reduced diameter on the outside (outer peripheral surface) of a tip portion 82A, and an attachment 100 attached to the tip portion 82A of the nozzle main body 82. A through-hole 102 is formed in the attachment 100, and the tip portion 82A of the nozzle main body 82 is inserted into this through-hole 102. The nozzle main body 82 is an example of a main body, and the attachment 100 is an example of a tip member.

[0040] (Nozzle body) The nozzle body 82 includes a supply path 84 through which the molten solder J is supplied, and an opening 86 formed at the end of the supply path 84 on the downstream side in the supply direction. The nozzle body 82 is disposed so that its axial direction is vertical (Z direction). The supply path 84 is configured as a through hole formed along the axial direction of the nozzle body 82, and the opening 86 is provided at the upper end (i.e., the tip) of the nozzle body 82. A tip surface 88 is formed on the periphery of the opening 86 in the nozzle body 82. In this embodiment, the tip surface 88 is provided along the horizontal direction and has a ring shape (doughnut shape) in a plan view (when viewed from above in the Z direction). In the nozzle body 82, the molten solder J supplied to the supply path 84 is discharged from the opening 86.

[0041] A tapered portion 83 is provided on the outer peripheral surface of the tip portion 82A of the nozzle body 82, and is inclined radially inward toward the opening 86 (tip side). In this embodiment, the tapered portion 83 is provided at a position corresponding to the area of ​​the nozzle body 82 where the attachment 100 is attached. The outer diameter of the nozzle body 82 vertically below the tapered portion 83 is constant along the vertical direction. In other words, the outer diameter of the nozzle body 82 excluding the tapered portion 83 is the same, equivalent, or similar in the vertical direction. Also, as an example, the inner diameter of the supply channel 84 is constant along the vertical direction of the nozzle body 82. In other words, the inner diameters of the through holes that form the supply channel 84 of the nozzle body 82 are the same, equivalent, or similar in the vertical direction.

[0042] (attachment) The attachment 100 has a discharge port 94 at the upper end (tip) of the through-hole 102, from which the molten solder J is discharged upward. The attachment 100 also has an upper surface 110 that extends radially outward from the discharge port 94, and a lower surface 112 that connects from the outer edge of the upper surface 110 to the base end 80B (see FIG. 1) side of the nozzle 80. As an example, the cross section of the attachment 100 perpendicular to the axial direction is ring-shaped (donut-shaped), and the outer circumferential shape of the cross section is circular.

[0043] A contact surface 103 with which the tapered portion 83 of the nozzle body 82 comes into contact is provided on the inner circumferential surface of the through hole 102 in the attachment 100. The contact surface 103 is inclined radially inward as it approaches the discharge port 94 side (tip side) of the through hole 102. The attachment 100 is configured to be detachable from the nozzle body 82. In this embodiment, the attachment 100 is attached to the nozzle body 82 by covering the outside of the nozzle body 82 from above and bringing the contact surface 103 into contact with the tapered portion 83 of the nozzle body 82. By pulling the attachment 100 upward from the nozzle body 82, the contact surface 103 disengages from the tapered portion 83, and the attachment 100 can be removed. This allows the attachment 100 to be replaced with a new one for the nozzle body 82.

[0044] The nozzle 80 is configured so that the attachment 100 is attached to the nozzle body 82 with the outlet 94 of the attachment 100 positioned above the opening 86 of the nozzle body 82. That is, in the initial state of the nozzle 80 (the state shown in FIGS. 4 and 5), the outlet 94 of the attachment 100 is positioned above the opening 86 of the nozzle body 82.

[0045] 5, the vertical height H from the tip surface 88 (i.e., the opening 86) of the nozzle body 82 to the discharge port 94 of the attachment 100 is preferably 0.4 mm or more and 2.0 mm or less, more preferably 0.5 mm or more and 1.5 mm or less, and even more preferably 0.6 mm or more and 1.0 mm or less. The height H is the height by which the attachment 100 protrudes from the nozzle body 82. In other words, a step of height H is formed between the opening 86 of the nozzle body 82 and the discharge port 94 of the attachment 100. In this embodiment, the height H is 0.5 mm.

[0046] 4 and 5, the upper surface 110 does not protrude upward from the discharge port 94. In this embodiment, the upper surface 110 is an inclined surface that slopes radially outward toward the base end portion 80B (vertically downward (see FIG. 1)).

[0047] The lower surface 112 is an inclined surface that slopes radially inward toward the base end 80B side (vertically downward (see FIG. 1)) of the nozzle 80. The attachment 100 is provided with an edge (ridge portion) 114 formed by the upper surface 110 and the lower surface 112.

[0048] In other words, the upper portion of the attachment 100 is tapered upward (toward the discharge port 94), and the lower portion is tapered downward (toward the base end portion 80B).

[0049] In the attachment 100, an inner circumferential surface 104 of a through hole 102 that forms the discharge port 94 is directly connected to an upper surface 110 via a ridge portion 105. The discharge port 94 is formed by the ridge portion 105 that is circular in plan view. In a vertical cross section, an angle θ1 (see FIG. 5 ) formed between the inner circumferential surface 104 and the upper surface 110 is an acute angle. As an example, the inner circumferential surface 104 excluding the contact surface 103 is located above the contact surface 103 and, like the contact surface 103, is inclined radially inward toward the discharge port 94 (tip side). For example, the angle of the inner circumferential surface 104 with respect to the axial direction of the nozzle 80 is 7°. Although not shown, instead of the above configuration, the inner circumferential surface 104 excluding the contact surface 103 may be configured to be formed along the vertical direction.

[0050] For example, when the angle of the inner circumferential surface 104 with respect to the axial direction (vertical direction) of the nozzle 80 is 7°, the angle θ1 formed between the inner circumferential surface 104 and the top surface 110 in a vertical cross section is preferably 43° or more and less than 83°, more preferably 53° or more and less than 80°, and even more preferably 63° or more and less than 77°. In other words, the angle of the top surface 110 with respect to the axial direction of the nozzle 80 in a vertical cross section is preferably 50° or more and less than 90°, more preferably 60° or more and less than 87°, and even more preferably 70° or more and less than 84°. For example, the angle θ1 formed between the inner circumferential surface 104 and the top surface 110 in a vertical cross section is set to 53° (i.e., the angle of the top surface 110 with respect to the axial direction of the nozzle 80 is 60°).

[0051] In device 10 (see FIG. 1) equipped with nozzle 80, when a motor (not shown) of a pump that supplies molten solder J to supply path 84 of nozzle body 82 is rotated, molten solder J is discharged from outlet 94 of nozzle 80, as shown in FIG. 6. At this time, the jet of molten solder J causes the molten solder J to rise from outlet 94 of nozzle 80, and the molten solder J comes into contact with the vicinity of bottom end 60A of component 60 (near lead 62 shown in FIG. 3). Note that in FIG. 6, component 60 and board 50 are not shown in order to make it easier to understand the configuration of nozzle 80 and the state of the jet of molten solder J.

[0052] <Nozzle of Comparative Example> Before describing the operation and effects of this embodiment, a nozzle of a comparative example will be described. Note that the same parts as those of the nozzle 80 are given the same reference numerals and detailed description thereof will be omitted.

[0053] Fig. 16 shows a nozzle 500 of a comparative example. As shown in Fig. 16, the nozzle 500 includes a nozzle main body 82 and an attachment 502 attached to the nozzle main body 82. In the initial state, the nozzle 500 is configured so that a tip portion 502A on the upper surface 110 of the attachment 502 does not protrude from a tip surface 88 of the nozzle main body 82. A discharge port 504 for discharging molten solder J is provided in the tip surface 88 of the nozzle main body 82. In other words, the discharge port 504 and the tip portion 502A are positioned at the same, equivalent, or similar positions in the Z direction, and no step exists.

[0054] When the nozzle 500 of the comparative example is attached to the device 10 (see FIG. 1) and the leads 62 of the component 60 are soldered to the substrate 50, the attachment 502 arranged on the outer periphery of the nozzle body 82 begins to wear. The wear of the attachment 502 progresses mainly on the upper surface 110 of the attachment 502 as the molten solder J comes into contact with the upper surface 110 and flows down (see FIGS. 16 and 17). In particular, when the attachment 502 and the nozzle body 82 are made of different materials, the attachment 502 is likely to wear. When the nozzle 500 is used for a set period of time (for example, one month or more but two months or less), the nozzle body 82 may protrude higher than the tip 502A of the attachment 502, as shown in FIGS. 17 and 18. As a result, when molten solder J is not discharged from the discharge port 504 (see FIG. 18), the molten solder J is less likely to remain on the tip surface 88 of the nozzle body 82 and is more likely to come into contact with air, making it more susceptible to oxidation. For example, the nozzle body 82 is made of metal, and the tip surface 88 is prone to rust due to oxidation.

[0055] As oxidation progresses, the tip surface 88 of the nozzle body 82 begins to repel the molten solder J (i.e., the wettability of the molten solder J deteriorates), causing disruption to the flow of the molten solder J (the molten solder J that is discharged from the discharge port 504 and rises up, flowing down along the underside of the attachment 502). In other words, as shown by arrow E in FIG. 17 , a depression forms in the portion of the molten solder J that rises from the discharge port 504 of the nozzle 500. This raises the concern that when soldering the leads 62 of the component 60 to the board 50, a solder bridge that electrically connects the leads 62 by the solder may be more likely to occur. Here, the wettability of the molten solder J refers to the ease with which the molten solder J adheres to the substrate.

[0056] <Action and effect> Next, the operation and effects of this embodiment will be described.

[0057] As shown in Figures 2 and 3, the device 10 shown in Figure 1 solders the leads 62 of the component 60 to the substrate 50 by bringing the nozzle 80 close to the back surface 50B of the substrate 50, which has the leads 62 inserted into the through holes 52, and moving the nozzle 80 along the back surface 50B of the substrate 50 while ejecting molten solder J from the nozzle outlet 94 of the nozzle 80. 2, 3(B), and 3(C), when the nozzle 80 reaches the lead 62 at the end of the component 60 on the movement direction S1 side, the nozzle 80 is moved away from the back surface 50B of the substrate 50, completing the soldering. This series of steps is described in detail below. That is, the device 10 first operates the drive unit 16 to move the nozzle 80 to a position where soldering of the lead 62 begins (the nozzle 80 on the left side of the paper in FIG. 2). Next, the device 10 rotates the motor at a predetermined rotation speed to discharge molten solder J from the discharge port 94 of the nozzle 80 (see FIG. 6). Next, the device 10 operates the drive unit 16 to move the nozzle 80 along the back surface 50B of the substrate 50 (see arrow S1 in FIG. 2 and FIG. 3(A)). Next, when the nozzle 80 reaches the end position of the soldering of the lead 62, the device 10 stops the drive unit 16 to stop the movement of the nozzle (nozzle 80 on the upper right side of the paper in FIG. 2, see FIGS. 3(B) and 11(A)). Next, the device 10 gradually reduces the rotation speed of the motor to lower the molten solder J (slow down, see FIGS. 11(B) to (E)). Next, the device 10 operates the drive unit 16 to move the nozzle 80 vertically downward (arrow S2 in FIG. 2).

[0058] 4 and 5, nozzle 80 has attachment 100 attached to tip 82A of nozzle body 82. Attachment 100 has a shape including an upper surface 110 that extends radially outward from discharge port 94, from which molten solder J is discharged upward, and does not protrude upward from discharge port 94, and a lower surface 112 that connects the outer edge of upper surface 110 to the base end 80B side (lower side) and slopes radially inward as it approaches base end 80B.

[0059] By attaching the attachment 100 having the above-described shape, the molten solder J between the nozzle 80 and the rear surface 50B of the substrate 50 flows down continuously and smoothly, compared to when only the nozzle body 82 without the attachment 100 is attached (when the tip of the nozzle does not protrude radially outward), which reduces the likelihood of a solder bridge connecting the leads 62. More specifically, the upper surface 110 of the attachment 100 slopes radially outward toward the base end 80B. Therefore, as shown in FIGS. 3(A) and 3(B), the lower end of the solder curtain formed by the molten solder J pulled by the leads 62 directly connects to the edge 114 of the attachment 100. The molten solder J pulled by the leads 62 then flows down continuously and smoothly along the lower surface 112.

[0060] Furthermore, the nozzle body 82 has an opening 86 formed at the upper end (tip) of the tip portion 82A through which the molten solder J is discharged. The attachment 100 is attached to the nozzle body 82 with the discharge port 94 positioned above the opening 86. Therefore, when the molten solder J is discharged from the discharge port 94, a sufficient amount of molten solder J can be positioned above the tip surface 88 of the nozzle body 82. This makes the tip surface 88 of the nozzle body 82 less susceptible to oxidation, suppresses deterioration of the wettability of the molten solder J, and reduces disruption of the flow of the molten solder J. For example, even if the motor rotation speed is reduced and the molten solder J falls into the nozzle 80 due to its own weight, a portion of the molten solder J remains on the tip surface 88 because of the step between the discharge port 94 of the attachment 100 and the opening 86 of the nozzle body 82. Therefore, the tip surface 88 is less likely to be exposed to air due to the remaining molten solder J, thereby suppressing oxidation. Furthermore, even if the tip surface 88 does oxidize, when the motor is rotated to eject the molten solder J from the outlet 94, the tip surface 88 is located below the outlet 94, so the adverse effect on the molten solder J ejected from the outlet 94 (disturbance in the flow due to deterioration in wettability) can be reduced to a negligible level.

[0061] Furthermore, even if ridge portion 105, which is the tip of attachment 100, wears when nozzle 80 is used for a set period of time (for example, one month or more and two months or less), it becomes easier to maintain outlet 94 of attachment 100 in a position above opening 86 of nozzle body 82. Furthermore, by predicting the wear state of ridge portion 105 of attachment 100 according to the usage time of nozzle 80, attachment 100 attached to nozzle body 82 can be replaced with a new attachment 100.

[0062] For this reason, the nozzle 80 can suppress the occurrence of solder bridges compared to a case where the discharge port 94 of the attachment 100 attached to the nozzle body 82 is flush with the opening 86 of the nozzle body 82 (a nozzle of a comparative example). More specifically, the discharge port 94 of the attachment 100 can be maintained in a state where it is positioned above the opening 86 of the nozzle body 82 until the predetermined time for replacing the attachment 100. For this reason, the occurrence of solder bridges can be suppressed for a longer period of time compared to a case where the discharge port 94 of the attachment 100 attached to the nozzle body 82 is flush with the opening 86 of the nozzle body 82.

[0063] Furthermore, the upper surface 110 of the nozzle 80 is inclined radially outward toward the base end 80B. As a result, as shown in FIG. 8 , when the jet of molten solder J from the discharge port 94 of the nozzle 80 descends (i.e., when slowing down), the molten solder J is likely to separate from the lower end 60A of the component 60. This makes it difficult for the molten solder J from the discharge port 94 to remain on the lower end 60A of the component 60. Here, "slowing down" refers to gradually lowering the height of the jet of molten solder J by gradually reducing the rotation speed of the motor (not shown) that jets the molten solder J while the height of the nozzle 80 relative to the board 50 remains unchanged (i.e., while the main body 12 is not moved in the Z direction by the drive unit 16).

[0064] 11(A) to 11(E) will be used to explain the state of the molten solder J as it jets downward from the discharge port 94 of the nozzle 130 (i.e., as it slows down). The nozzle 130 differs from the nozzle 80 of this embodiment only in the angle of the upper surface 110, and the other configuration is the same as the nozzle 80 (the same configurations are given the same reference numerals). The angle θ2 formed between the upper surface 110 and the inner circumferential surface 104 of the attachment 132 of the nozzle 130 is smaller than the angle θ1 formed between the upper surface 110 and the inner circumferential surface 104 of the nozzle 80. However, the state of the molten solder J as it jets downward from the discharge port 94 (i.e., as it slows down) tends to be similar.

[0065] 11(A) to 11(E), when the jet of molten solder J descends (i.e., when slowing down), the excess molten solder J between leads 62 moves to an equilibrium position as the jet height of molten solder J decreases. In other words, when the surface tension of molten solder J on the component 60 side is A, the interfacial tension on the component 60 side is A1, the surface tension of molten solder J on the nozzle 80 side is B, and the gravity of molten solder J is W, the molten solder J moves in an attempt to reach an equilibrium state (i.e., A+A1=B+W).

[0066] When the jet of molten solder J descends (i.e., when it slows down), the height of the jet of molten solder J decreases, and the molten solder J moves downward mainly due to the action of gravity (its own weight), but due to the influence of surface tension A on the component 60 side, it takes time for the excess molten solder J between the leads 62 to move downward compared to the speed at which the jet height falls. If the time for the excess molten solder J between the leads 62 to move is insufficient (too fast), a solder bridge may occur.

[0067] In the nozzle 80 of this embodiment, the upper surface 110 is inclined radially outward toward the base end 80B. This reduces the surface area of ​​the leads 62 that come into contact with the molten solder J compared to when the entire upper surface 110 is horizontal (disposed horizontally). Therefore, the distance between the molten solder J and the component 60 from the discharge port 94 increases, reducing the influence of the interfacial tension A1 on the component 60 side. However, because the nozzle 80 has an inclined upper surface 110, the molten solder J is more likely to flow down along the lower surface 112, and the surface tension B on the nozzle 80 side is smaller compared to when the entire upper surface 110 is horizontal. Therefore, the jet height of the molten solder J from the nozzle 80 can be reduced in response to a decrease in the motor rotation speed (gradually reducing the motor rotation speed can gradually reduce the jet height), thereby slowing the descent speed of excess molten solder J compared to when the entire upper surface 110 is horizontal. In other words, when the nozzle 80 is used, time is ensured for the excess molten solder J between the leads 62 to move downward.

[0068] Therefore, compared to when the entire upper surface 110 of the attachment 100 is horizontal, the nozzle 80 can suppress the occurrence of solder bridges when the jet of molten solder J descends (that is, when it slows down).

[0069] In addition, in the nozzle 80, the attachment 100 has an inner surface 104 that forms the discharge port 94 and an upper surface 110 that are directly connected via a ridge portion 105, and in a vertical cross section, the angle θ1 formed between the inner surface 104 and the upper surface 110 is an acute angle.

[0070] Therefore, in the nozzle 80, the occurrence of solder bridges when the molten solder J jets down (i.e., when it slows down) can be suppressed compared to when the angle θ1 formed by the inner surface 104 that forms the discharge outlet 94 in the attachment 100 and the upper surface 110 is not an acute angle (i.e., when the angle of the upper surface 110 with respect to the axial direction of the nozzle 80 is 90° or more).

[0071] Furthermore, in the nozzle 80, for example, the angle of the inner circumferential surface 104 with respect to the axial direction (vertical direction) of the nozzle 80 is 7°. In a vertical cross section, the angle θ1 formed between the inner circumferential surface 104 that forms the discharge port 94 and the top surface 110 is 43° or more and less than 83°. In other words, in a vertical cross section, the angle of the top surface 110 with respect to the axial direction of the nozzle 80 is 50° or more and less than 90°.

[0072] For this reason, nozzle 80 can suppress the occurrence of solder bridges when the jet of molten solder J descends (i.e., when slowing down) compared to when angle θ1 formed between inner circumferential surface 104 that forms discharge port 94 and top surface 110 is 83° or more (i.e., the angle of top surface 110 with respect to the axial direction of nozzle 80 is 90° or more). Also, compared to when angle θ1 formed between inner circumferential surface 104 that forms discharge port 94 and top surface 110 is less than 43° (i.e., the angle of top surface 110 with respect to the axial direction of nozzle 80 is less than 50°), the flow of molten solder J (e.g., the flow when molten solder J flows down) is stabilized.

[0073] In the nozzle 80, the attachment 100 is configured to be detachable from the nozzle body 82. Therefore, compared to when the attachment 100 is joined to the nozzle body 82, only the attachment 100 that wears out can be replaced, and running costs are reduced.

[0074] In nozzle 80, a tapered portion 83 that slopes radially inward toward opening 86 is provided on the outer peripheral surface of tip end 82A of nozzle body 82. In addition, a contact surface 103 that slopes radially inward toward discharge port 94 and comes into contact with tapered portion 83 of nozzle body 82 is provided on the inner peripheral surface of through hole 102 in attachment 100. For this reason, in nozzle 80, attachment 100 is easier to attach to and detach from nozzle body 82 than in a case where the outer peripheral surface of nozzle body 82 and the inner peripheral surface of attachment 100 are arranged straight along the axial direction.

[0075] 1, device 10 includes nozzle 80, main body 12 to which base end 80B of nozzle 80 is fixed, and drive unit 16 that moves the tip end of nozzle 80 relative to substrate 50 along the back surface 50B of substrate 50. Main body 12 collects molten solder J dispensed from outlet 94 of nozzle 80 and stores it in storage tank 22, and also operates a pump (rotates a motor) to dispense the molten solder J stored in storage tank 22 from outlet 94 of nozzle 80. Therefore, device 10 can suppress the occurrence of solder bridges compared to a case where a nozzle is provided in which outlet 94 of attachment 100 attached to nozzle main body 82 is flush with opening 86 of nozzle main body 82.

[0076] Furthermore, in a method for manufacturing a substrate device including a component 60 and a substrate 50, apparatus 10 is used to move nozzle 80 relative to substrate 50 while discharging molten solder J from outlet 94 from the front surface 50A of substrate 50 along the back surface 50B of substrate 50, where leads 62 of component 60 have been inserted into through-holes, to solder leads 62 to substrate 50. Therefore, in the method for manufacturing a substrate device, the occurrence of solder bridges can be suppressed compared to when a nozzle is provided in which outlet 94 of attachment 100 attached to nozzle main body 82 is flush with opening 86 of nozzle main body 82.

[0077] Second Embodiment Next, a nozzle according to a second embodiment will be described. Note that the same components as those in the first embodiment described above are given the same reference numerals and the description thereof will be omitted.

[0078] FIG. 9 shows a nozzle 120 of the second embodiment. As shown in FIG. 9, the nozzle 120 includes a nozzle main body 82 and an attachment 122 as an example of a tip member. The attachment 122 has an inner circumferential surface 104 that forms the discharge port 94 and an upper surface 110 that are directly connected via a horizontal flat portion 124. The flat portion 124 is an example of a ridge portion. The horizontal width W1 of the flat portion 124 is preferably 0.5 mm or less, more preferably 0.4 mm or less, and even more preferably 0.3 mm or less. For example, the horizontal width W1 of the flat portion 124 is 0.4 mm. The other configurations of the nozzle 120 are similar to those of the nozzle 80 of the first embodiment.

[0079] In addition to the effects and advantages of the configuration similar to that of the nozzle 80 of the first embodiment, the nozzle 120 also provides the following effects and advantages.

[0080] In nozzle 120, inner circumferential surface 104 and upper surface 110 of attachment 122 are directly connected via horizontally extending flat portion 124, and flat portion 124 has a horizontal width W1 of 0.5 mm or less. When horizontal width W1 of flat portion 124 is 0.5 mm or less, even if flat portion 124 oxidizes, flat portion 124 repels molten solder J (see FIG. 1, etc.), which is less likely to disrupt the flow of molten solder J. Therefore, in nozzle 120, solder bridging due to oxidation of flat portion 124 is less likely to occur compared to when width W1 of flat portion 124 of attachment 122 is greater than 0.5 mm.

[0081] Third Embodiment Next, a nozzle according to a third embodiment will be described. Note that the same components as those in the first and second embodiments will be given the same reference numerals and the description thereof will be omitted.

[0082] A nozzle 130 of the third embodiment is shown in Figure 10. As shown in Figure 10, the nozzle 130 includes a nozzle main body 82 and an attachment 132 as an example of a tip member. The attachment 132 includes an upper surface 110 that slopes radially outward toward the base end 80B (see Figure 1), and a lower surface 112 that slopes radially inward toward the base end 80B (see Figure 1). In a vertical cross section, the angle θ2 formed between the inner circumferential surface 104 and the upper surface 110 is an acute angle and is smaller than the angle θ1 formed between the inner circumferential surface 104 and the upper surface 110 in the nozzle 80 of the first embodiment. For example, the angle of the inner circumferential surface 104 with respect to the axial direction (vertical direction) of the nozzle 80 is 7°, and the angle θ2 formed between the inner circumferential surface 104 and the upper surface 110 in a vertical cross section is set to 43° (i.e., the angle of the upper surface 110 with respect to the axial direction of the nozzle 80 is 50°). The other configurations of the nozzle 130 are the same as those of the nozzle 80 of the first embodiment.

[0083] The apparatus 10 (see FIG. 1) is configured to change the nozzle 130 to one with a different angle θ2 between the inner circumferential surface 104 that forms the discharge port 94 of the attachment 132 and the top surface 110, depending on the substrate 50. The apparatus 10 is equipped with a gripping unit (not shown) that can grip and release the base end 80B of the nozzle 130. In the apparatus 10, the nozzle 130 can be replaced with another nozzle by releasing the gripping unit to remove the base end 80B, and then gripping the base end of another nozzle with the gripping unit. The other configurations of the apparatus 10 are the same as those of the apparatus 10 of the first embodiment.

[0084] 11(A) to 11(E) show the state over time as the jet of molten solder J descends from the discharge port 94 of the nozzle 130 (i.e., during slow-down). Specifically, Fig. 11(A) shows the state before slow-down, and Fig. 11(B) shows the state when slow-down begins. Figs. 11(C) and 11(D) show the states at each predetermined time after the start of slow-down, and Fig. 11(E) shows the state when slow-down is completed.

[0085] 11(B) to 11(D), when the jet of molten solder J descends (i.e., when slowing down), the excess molten solder J between leads 62 moves to an equilibrium position as the jet height of molten solder J decreases. In other words, when the surface tension of molten solder J on the component 60 side is A, the interfacial tension on the component 60 side is A1, the surface tension of molten solder J on the nozzle 80 side is B, and the gravity of molten solder J is W, the molten solder J moves in an attempt to reach an equilibrium state (i.e., A+A1=B+W).

[0086] 11(B) and (C), the height of the molten solder J drops, and the molten solder J moves downward mainly due to the action of gravity (its own weight), but due to the influence of surface tension A on the component 60 side, it takes time for the excess molten solder J between the leads 62 to move downward compared to the speed at which the height of the jet drops. If the time for the excess molten solder J between the leads 62 to move is insufficient (too fast), a solder bridge may occur.

[0087] In the nozzle 130, the upper surface 110 is inclined radially outward toward the base end 80B (see FIG. 1 ). This reduces the surface area of ​​the leads 62 that come into contact with the molten solder J compared to when the entire upper surface 110 is horizontal (disposed horizontally). Therefore, as shown in FIG. 11(D), the distance between the molten solder J and the component 60 from the discharge port 94 increases, reducing the influence of the interfacial tension A1 on the component 60 side. However, because the upper surface 110 of the nozzle 130 is inclined, the molten solder J is more likely to flow down along the lower surface 112, and the surface tension B on the nozzle 130 side is smaller compared to when the entire upper surface 110 is horizontal. Therefore, the jet height of the molten solder J from the nozzle 130 can be reduced in response to a decrease in the motor rotation speed (gradually reducing the motor rotation speed can gradually reduce the jet height), thereby slowing the descent speed of excess molten solder J. In other words, when the nozzle 130 is used, time is ensured for the excess molten solder J between the leads 62 to move downward.

[0088] Therefore, compared to when the entire upper surface 110 of the attachment 100 is horizontal, the nozzle 130 can suppress the occurrence of solder bridges when the jet of molten solder J descends (that is, when it slows down).

[0089] FIG. 12 shows the state in which the nozzle 130 moves horizontally to solder the leads 62 of the component 60 to the board 50. As shown in FIG. 12, as the nozzle 130 moves in the S1 direction (see FIG. 2), the excess molten solder J between the leads 62 moves to an equilibrium position. The excess molten solder J is acted upon by factors such as capillary action between the leads 62 of the component 60, interfacial tension F1 within the through-hole 52, interfacial tension F2 of the land formed around the through-hole 52, interfacial tension F3 of the leads 62, surface tension F4 of the molten solder J on the component 60 side, gravity F5 of the molten solder J, and surface tension F6 of the molten solder J on the nozzle 130 side. Therefore, the excess molten solder J moves to reach equilibrium. The time it takes for the excess molten solder J to move to the equilibrium position varies depending on the specifications of the component 60 and the board 50. If the excess molten solder J breaks (separates onto the substrate 50 side and the nozzle 130 side) before it reaches an equilibrium state, a solder bridge may occur.

[0090] The difference from when the molten solder J is slowed down is that as the position of the substrate 50 moves away from the nozzle 130, the direction in which the molten solder J is drawn toward the nozzle 130 changes from vertical to horizontal, and the effect of gravity F5 on the molten solder J becomes smaller. In other words, the excess molten solder J is drawn (pulled) toward the nozzle 130 mainly by the effect of surface tension F6 of the molten solder J. As the nozzle 130 moves, the excess molten solder J is drawn diagonally horizontally, so it is susceptible to the effect of interfacial tension F3 of the leads 62.

[0091] A similarity to the slowdown of the molten solder J is that if the movement speed of the nozzle 130 is fast, the excess molten solder J cannot move, which may result in the formation of a solder bridge. Also, if the surface area of ​​the leads 62 or lands in contact with the molten solder J is large, the interfacial tensions F2 and F3 become large, making it difficult for the excess molten solder J between the leads 62 to move toward the nozzle 130.

[0092] For example, if the leads 62 are long in the vertical direction, thick, or have a narrow pitch, the surface area of ​​contact between the molten solder J and the leads 62 increases, increasing the interfacial tension F3. This makes it difficult for excess molten solder J between the leads 62 to move toward the nozzle 130.

[0093] A nozzle 130 in which the angle θ2 formed between the inner peripheral surface 104 and the upper surface 110 is small can suppress the occurrence of solder bridges when the molten solder J slows down, but solder bridges may be more likely to occur when the nozzle 130 is moving horizontally while soldering.

[0094] The apparatus 10 of this embodiment is configured to change the nozzle 130 according to the substrate 50, with the angle θ2 formed between the inner circumferential surface 104 that forms the discharge port 94 in the attachment 132 and the upper surface 110 being different.

[0095] For example, in the apparatus 10, the nozzle 130 may be replaced with one in which the angle θ2 formed between the inner circumferential surface 104 that forms the discharge port 94 and the top surface 110 varies depending on the vertical length of the leads 62 (see FIGS. 11 and 12 ) inserted into the through holes 52 of the substrate 50 or the pitch of the leads 62. In addition, in the apparatus 10, the nozzle 130 in which the angle θ2 formed between the inner circumferential surface 104 that forms the discharge port 94 and the top surface 110 varies depending on the thickness of the leads 62 or the inner diameter of the lands around the through holes 52 may be replaced with one in which the angle θ2 formed between the inner circumferential surface 104 that forms the discharge port 94 and the top surface 110 varies.

[0096] In this embodiment, for components 60 and boards 50 that are prone to solder bridging when the molten solder J jet descends (i.e., when slowing down), a nozzle 130 is used in which the angle θ2 formed between the inner peripheral surface 104 and the top surface 110 is small. For example, for components 60 and boards 50 in which the vertical length of the leads 62 is short or the pitch of the leads 62 is narrow, solder bridging is prone to occur when slowing down, so a nozzle 130 in which the angle θ2 formed between the inner peripheral surface 104 and the top surface 110 is small is attached to the device 10 (see FIG. 1).

[0097] In addition to the effects and advantages of the configuration similar to that of the nozzle 80 of the first embodiment, the nozzle 130 also provides the following effects and advantages.

[0098] The apparatus 10 is configured to change the nozzle 130 to one with a different angle θ2 between the inner circumferential surface 104 that forms the discharge port 94 in the attachment 132 and the top surface 110, depending on the substrate 50. Therefore, the apparatus 10 can suppress the occurrence of solder bridges when the jet of molten solder J descends (i.e., when slowing down) or when the nozzle 130 moves while soldering, compared to when the nozzle 130 is not changed depending on the substrate 50.

[0099] Furthermore, in apparatus 10, nozzle 130 may be replaced with one having a different angle θ2 formed between inner circumferential surface 104 forming discharge outlet 94 in attachment 132 and top surface 110, depending on the vertical length or pitch of leads 62 of component 60 inserted into through-hole 52 from front surface 50A of substrate 50. Therefore, in apparatus 10, compared to a case where nozzle 130 is not replaced depending on the vertical length or pitch of leads 62 of component 60, it is possible to suppress the occurrence of solder bridges when the jet of molten solder J descends (i.e., when slowing down) or when nozzle 130 is moved during soldering.

[0100] [Fourth embodiment] Next, a nozzle according to a fourth embodiment will be described. Note that the same components as those in the first to third embodiments described above are given the same reference numerals and the description thereof will be omitted.

[0101] A nozzle 150 of a fourth embodiment is shown in Figure 13. As shown in Figure 13, the nozzle 150 includes a nozzle body 82 and an attachment 152 as an example of a tip member. The attachment 152 includes an upper surface 154 that extends radially outward from a discharge port 94 from which the molten solder J is discharged upward, and a lower surface 156 that connects the outer edge of the upper surface 154 to the base end 80B (see Figure 1). The upper surface 154 is formed (disposed) along the horizontal direction and does not protrude upward from the discharge port 94. The lower surface 156 is inclined radially inward toward the base end 80B (see Figure 1).

[0102] For example, the angle of the inner circumferential surface 104 with respect to the axial direction (vertical direction) of the nozzle 80 is 7°, and the angle θ2 formed between the inner circumferential surface 104 and the top surface 154 in a vertical cross section is set to 83°. In other words, the angle of the top surface with respect to the axial direction of the nozzle 80 in a vertical cross section is set to 90°. The other configurations of the nozzle 150 are the same as those of the nozzle 80 of the first embodiment.

[0103] 14 shows the state in which component 60 is soldered to substrate 50 by horizontal movement of nozzle 150. As shown in FIG. 14, as nozzle 150 moves in direction S1 (see FIG. 2), excess molten solder J between leads 62 moves to an equilibrium position.

[0104] Here, we will explain the results of checking the flow state of molten solder J for nozzle 130 shown in Figure 10 and nozzle 150 shown in Figure 13, which have different angles θ2 between inner surface 104 and top surface 110 in vertical cross section.

[0105] When soldering a component 60 with long leads 62 to a substrate 50, the height of the molten solder J dispensed from the nozzle outlet must be increased. For example, if the jet height of the molten solder J (the height of the molten solder J rising above the nozzle outlet 94) during soldering by moving the nozzle 130 horizontally is set to a high jet height of approximately 4000 μm, the molten solder J rising above the nozzle outlet 94 may fluctuate significantly (sway) up and down and side to side due to pulsation, making it unstable. In this experiment, the state of the jet of molten solder J was confirmed using a nozzle 150 in which the angle θ2 between the inner circumferential surface 104 and the top surface 110 in the vertical cross section was 83°, and nozzles 130 in which θ2 was 73°, 63°, and 43° (three types of nozzles 130 with different angles θ2). In other words, nozzle 150 was used, in which the angle of the top surface relative to the axial direction (vertical direction) of nozzle 80 in a vertical cross section was 90°, and nozzle 130 was used, in which the angle was 80°, 70°, or 50°. In this experiment, it was found that as the jet height of molten solder J was increased, the larger the angle θ2 formed between inner circumferential surface 104 and top surface 110, the more stable the jet of molten solder J. In particular, it was found that nozzle 150 of this embodiment produced the most stable jet of molten solder J. In other words, it was found that nozzle 150 was able to suppress pulsation of molten solder J when soldering while moving horizontally, even when the jet height was increased, and allowed molten solder J to flow down continuously and smoothly.

[0106] In the nozzle 150 of this embodiment, the molten solder J can be held by surface tension on the upper surface 154 of the attachment 152. Therefore, it is believed that the large surface tension prevents the molten solder J from protruding from the center of the nozzle 150, thereby stabilizing the jet of molten solder J.

[0107] In the nozzles 130, 150, it is generally necessary to suppress pulsation of the molten solder J discharged from the discharge port 94. Here, "pulsation" refers to the alternating repetition of (a) the molten solder J accumulating at the top of the nozzle 80, and (b) the accumulated molten solder J flowing down the outer periphery of the nozzle 80. When pulsation occurs, the flow of the molten solder J from the discharge port 94 becomes turbulent (shaking occurs), and it has been empirically found that this makes it more likely that a solder bridge connecting the leads 62 will occur. For example, if the angle θ2 between the inner circumferential surface 104 and the upper surface 110 in a vertical cross section is 43° (i.e., the angle of the upper surface 110 with respect to the axial direction (vertical direction) of the nozzle 130 is 50°), it is thought that if the jet of molten solder J is made higher, the central part of the nozzle 130 (see FIG. 10) will swell due to the jet pressure, making the jet of molten solder J more likely to become unstable. In other words, the stability of the molten solder J at a high jet is better the larger the angle θ2 between the inner circumferential surface 104 and the upper surface 110 in a vertical cross section. In other words, the nozzle 150 of this embodiment has the best stability of the molten solder J at a high jet.

[0108] However, it was found that when the jet of molten solder J descends (slows down), the greater the angle θ2 formed between inner circumferential surface 104 and upper surface 110, the more rapidly the jet height of molten solder J drops. In other words, among the four types of nozzles described above (nozzle 150 and the three types of nozzles 130 with different angles θ2), nozzle 150 has the fastest drop in jet height when slowing down. The reason for the sudden drop in the jet height of molten solder J is thought to be the susceptibility to the effects of the surface tension of the molten solder J at nozzle 150 and the gravitational force (its own weight) of the molten solder J. In other words, when the motor rotation speed is gradually reduced, the molten solder J that has risen above nozzle outlet 94 and upper surface 154 of nozzle 150 stops flowing down along lower surface 156 due to the strong surface tension of the risen molten solder J. In this state, if the rotation speed of the motor is further gradually reduced, the mounded molten solder J is drawn into the supply path 84 (flows down the supply path 84) in increasing amounts due to its own weight and the reduction in the rotation speed of the motor. In other words, the molten solder J that has formed a mound above the discharge port 94 and upper surface 154 of the nozzle 150 is rapidly drawn into the supply path 84. Note that the molten solder J is supplied to the supply path 84 by rotating the impeller with the motor, so the molten solder J is not discharged from the discharge port 94 just because the motor is rotating. In other words, the discharge or drawing of the molten solder J from the discharge port 94 is determined by the balance between the weight of the mounded molten solder J on the discharge port 94 and upper surface 154 and the molten solder J in the supply path 84, and the force of the motor to supply the molten solder J to the supply path 84.

[0109] If the jet height of the molten solder J suddenly drops, the molten solder J will rapidly separate from the leads 62, making it impossible for the excess molten solder J between the leads 62 to move toward the nozzle 150, which may result in the occurrence of a solder bridge.

[0110] For this reason, depending on the substrate 50 of the component 60, the device 10 (see Figure 1) uses either a nozzle 130 in which the angle θ2 formed between the inner surface 104 and the top surface 110 is 43° (the angle of the top surface 110 relative to the axial direction of the nozzle is 50°), or a nozzle 150 in which the angle θ2 formed between the inner surface 104 and the top surface 154 is 83° (the angle of the top surface 154 relative to the axial direction of the nozzle is 90°).

[0111] In this embodiment, for a component 60 in which solder bridging is likely to occur when the nozzle 150 is moved horizontally, a nozzle 150 is used in which the angle θ2 formed between the inner circumferential surface 104 forming the discharge port 94 and the top surface 154 is large. For example, if the lead 62 is long in the vertical direction or has a large diameter, solder bridging is likely to occur when the nozzle is moved horizontally. Therefore, a nozzle 150 in which the angle θ2 formed between the inner circumferential surface 104 and the top surface 154 is large is attached to the device 10 (see FIG. 1). That is, the device 10 (see FIG. 1) is replaced with the nozzle 150 to solder the component 60. Specifically, the attachment attached to the nozzle body 82 of the device 10 is replaced, for example, from attachment 132 (see FIG. 10) to attachment 152 (see FIG. 13).

[0112] In addition to the effects and advantages of the configuration similar to that of the nozzle 80 of the first embodiment, the nozzle 150 also provides the following effects and advantages.

[0113] In nozzle 150, upper surface 154 of attachment 152 is formed (disposed) along the horizontal direction. Therefore, as shown in Fig. 15 , even when the discharge of molten solder J from discharge port 94 is stopped, molten solder J remains on upper surface 154, thereby preventing exposure of upper surface 154. Therefore, in nozzle 150, oxidation of upper surface 154 of attachment 152 can be prevented when the discharge of molten solder J from discharge port 94 is stopped, compared to a case in which upper surface 154 of attachment 152 is inclined radially outward toward the base end (80B).

[0114] Furthermore, in attachment 152, upper surface 154 is arranged along the horizontal direction, which stabilizes the jet of molten solder J from discharge port 94 when nozzle 150 moves horizontally. Therefore, in nozzle 150, the occurrence of solder bridges when nozzle 150 moves horizontally while soldering can be suppressed compared to when upper surface 154 of attachment 152 is inclined radially outward toward base end 80B (see FIG. 1).

[0115] The apparatus 10 of this embodiment is configured to change the nozzle (or attachment) depending on the substrate 50, with a different angle θ2 formed between the inner circumferential surface 104 that forms the discharge port 94 of the attachment and the top surface 154. Therefore, compared to when the nozzle (nozzle 130 (attachment 132) or nozzle 150 (attachment 152)) is not changed depending on the substrate 50, the apparatus 10 can suppress the occurrence of solder bridges when the jet of molten solder J descends (i.e., when slowing down) or when the nozzle moves horizontally while soldering. Specifically, when soldering a component 60 that is prone to solder bridges when the nozzle moves horizontally to the substrate 50, the nozzle 150 is held by the gripping portion of the apparatus 10, or the attachment 152 is attached to the nozzle body 82 held by the gripping portion of the apparatus 10. Here, the component 60 prone to solder bridges during horizontal nozzle movement is, for example, a component 60 with long leads 62 protruding vertically from the rear surface 50B of the substrate 50. When soldering a component 60 prone to solder bridges during slowdown to the substrate 50, the nozzle 130 is held by the gripping portion of the device 10, or an attachment 132 is attached to the nozzle body 82 held by the gripping portion of the device 10. Here, the component 60 prone to solder bridges during slowdown is, for example, a component 60 with short leads 62 protruding vertically from the rear surface 50B of the substrate 50, or leads 62 with narrow pitch. The nozzle may be replaced using a three-axis robot (a robot movable in the X, Y, and Z directions) equipped with a chuck to which the nozzle can be attached or detached. The attachment may be replaced using a three-axis robot equipped with a chuck to which the attachment can be attached or detached.

[0116] Furthermore, the apparatus 10 is configured to change the nozzle to one with a different angle θ2 between the inner circumferential surface 104 that forms the discharge port 94 of the attachment and the top surface, depending on the vertical length or pitch of the leads 62 of the component 60 inserted into the through-holes 52 from the front surface 50A of the board 50. Therefore, the apparatus 10 can suppress the occurrence of solder bridges when the jet of molten solder J descends (i.e., when slowing down) or when the nozzle is moved during soldering, compared to when the nozzle is not changed depending on the vertical length or pitch of the leads 62 of the component 60.

[0117] <Other> The present disclosure is not limited to the above-described embodiment.

[0118] For example, in the above embodiment, the tip of the nozzle 80 is formed to protrude radially outward by attaching the attachments 100, 122, 132, and 152, which are separate members, to the tip 82A of the nozzle main body 82, but this is not limiting. The attachments 100, 122, 132, and 152 may be integral with the nozzle main body 82. In other words, the outer shape of the tip of the nozzle 80 may be formed as a shape in which the attachments 100, 122, 132, and 152 are attached, and the attachments may be integrally machined from a single metal material. However, in this case, the effect of being able to replace the attachments is not achieved.

[0119] In the above embodiment, the inner circumferential surface 104 forming the discharge port 94 is inclined radially inward from the contact surface 103 toward the tip end, but the present disclosure is not limited to this configuration. For example, the inner circumferential surface 104 forming the discharge port 94 may be configured to be formed along the vertical direction. In a configuration in which the inner circumferential surface 104 is formed along the vertical direction, the angle θ1 formed between the inner circumferential surface 104 and the upper surface 110 in a vertical cross section is preferably 50° or more and less than 90°, more preferably 60° or more and 87° or less, and even more preferably 70° or more and 84° or less.

[0120] Furthermore, in the above embodiments, the shapes of the attachments 100, 122, 132, and 152 are shown as having a ring-shaped (doughnut-shaped) cross section perpendicular to the axial direction (vertical direction) of the attachment and a circular outer periphery of the cross section, but are not limited to this. For example, the attachments may have a rectangular outer periphery in a cross section perpendicular to the axial direction, with a through hole formed in the center.

[0121] In the above embodiment, the nozzle (nozzle 80, 120, 130, or 150) is moved along the rear surface 50B of the fixed substrate 50, but this is not limiting. The nozzle (nozzle 80, 120, 130, or 150) may be fixed, and the substrate 50 may be moved along the nozzle outlet, or both the nozzle (nozzle 80, 120, 130, or 150) and the substrate 50 may be moved.

[0122] Furthermore, it goes without saying that the present invention can be embodied in various forms without departing from the spirit of the present invention. [Explanation of symbols]

[0123] 10 Soldering equipment 12 Main body 14 Holding part 50 Printed circuit board (example of circuit board) 50A surface 50B back 52 through holes 60 Electronic Components (Examples of Components) 60A bottom end 62 Lead (an example of a terminal) 80 nozzles 80B Base end 82 Nozzle body (example of the body) 83 Tapered section 86 Aperture 94 Discharge port 100 Attachment (an example of a tip part) 102 Through hole 103 Contact surface 104 Inner surface 105 Ridge 110 Top surface 112 Bottom surface 120 nozzles 122 Attachment (an example of a tip component) 124 Flat surface (example of ridge line) 130 nozzles 132 Attachment (an example of a tip component) 140 nozzles 150 nozzles 152 Attachment (an example of a tip part) 154 Top surface 156 Bottom θ1 Angle between the inner surface and the top surface θ2 Angle between the inner surface and the top surface

Claims

1. a tip member including an upper surface that spreads radially outward from a discharge port through which molten solder is discharged upward and does not protrude upward from the discharge port, and a lower surface that connects an outer edge of the upper surface to a base end side and slopes radially inward as it approaches the base end side, with at least a portion of the upper surface sloped radially outward as it approaches the base end side; a main body having an opening formed at a tip end portion through which molten solder is discharged, the main body having the tip end member attached thereto with the discharge port positioned above the opening; A nozzle equipped with

2. 2. The nozzle according to claim 1, wherein the tip member has an inner circumferential surface that forms the discharge port and the upper surface that are directly connected via a ridge portion, and the angle formed between the inner circumferential surface and the upper surface in a vertical cross section is an acute angle.

3. 3. The nozzle according to claim 2, wherein an angle formed between the inner circumferential surface and the upper surface in a vertical cross section is equal to or greater than 50 degrees and smaller than 90 degrees.

4. 3. The nozzle according to claim 2, wherein the ridge portion of the tip member is a flat surface extending in a horizontal direction, and the horizontal width of the flat surface is 0.5 mm or less.

5. 5. The nozzle according to claim 1, wherein the tip member is configured to be detachable from the main body.

6. A tip member having an upper surface that spreads radially outward from a discharge port through which molten solder is discharged upward and does not protrude upward from said discharge port, and a lower surface that connects from the outer edge of said upper surface to a base end side and slopes radially inward as it approaches said base end side; a main body having a tip end formed with an opening for discharging molten solder, the main body having the tip end member attached thereto with the discharge port positioned above the opening; Equipped with The tip member is configured to be detachable from the main body, The outer peripheral surface of the main body includes a tapered portion that is inclined radially inward toward the opening, The nozzle has an inner peripheral surface of the tip member that slopes radially inward toward the discharge port and has a contact surface that contacts the tapered portion.

7. The nozzle of claim 6 , wherein the upper surface of the tip member is disposed along a horizontal direction.

8. A nozzle according to any one of claims 1 to 7; a main body to which a base end of the nozzle is fixed, the main body collecting and storing the molten solder discharged from the discharge port of the nozzle, and discharging the stored molten solder from the discharge port of the nozzle; a moving device that moves the tip of the nozzle relative to the substrate along the back surface of the substrate; A soldering device comprising:

9. 9. The soldering apparatus according to claim 8, wherein the nozzle is changed to one having a different angle between the inner peripheral surface of the tip member that forms the discharge port and the upper surface, depending on the board.

10. 9. The soldering device according to claim 8, wherein the nozzle is replaced with one having a different angle between the inner circumferential surface forming the discharge outlet in the tip member and the top surface, depending on the vertical length or pitch of the terminals of the electronic component inserted into the through holes from the surface side of the board.

11. A method for manufacturing a substrate device using the soldering device described in any one of claims 8 to 10, in which molten solder is ejected from the ejection outlet along the back surface of the substrate on which terminals of electronic components have been inserted into through holes from the front surface side of the substrate, while the nozzle is moved relative to the substrate, thereby soldering the terminals to the substrate.

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