Method for attaching processing tools to processing equipment

Abstract

To provide a technology which prevents a worker from becoming dirty when a processing tool is exchanged and inhibits particles, such as processed wastes, from flowing to the outside.SOLUTION: A processing device includes: a holding part; a processing mechanism in which a processing tool is installed in an exchangeable manner; and an exterior cover. An installing method of the processing tool includes: monitoring a physical quantity used for creating an exchange command of the processing tool; creating the exchange command when a value of the physical quantity reaches a setting value; transmitting the exchange command to the outside of the processing device; detecting arrival of an exchange device, which has received the exchange command and traveled at the outside of the processing device, at a setting position at the outside of the exterior cover with the processing device; opening a shutter which opens or closes an admission port so that the exchange device can enter the exterior cover; and closing the shutter after the exchange device exchanges the processing tool and gets out from the inside to the outside of the exterior cover through the admission port.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a method for attaching a processing tool to a processing device, and to a processing device. [Background technology]

[0002] The grinding means described in Patent Document 1 includes a spindle, a wheel mount disposed at the lower end of the spindle, and a grinding wheel removably attached to the underside of the wheel mount. The grinding wheel includes an annular wheel base and a plurality of grinding stones disposed annularly on the underside of the wheel base. An operator attaches the wheel base to the underside of the wheel mount with fastening bolts. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-177444 Summary of the Invention [Problem to be solved by the invention]

[0004] One aspect of the present disclosure provides a technique for preventing an operator from getting dirty when replacing a processing tool and for suppressing particles such as processing debris from leaking to the outside. [Means for solving the problem]

[0005] A processing device according to one aspect of the present disclosure includes a holding unit that holds a processing body, a processing mechanism to which a processing tool that processes the processing body held in the holding unit is replaceably attached, and an exterior cover that houses the holding unit and the processing mechanism. A method for attaching a processing tool to the processing device includes monitoring a physical quantity used to create a processing tool replacement command, creating the replacement command when the value of the physical quantity reaches a set value, transmitting the replacement command to an outside of the processing device, an exchange device receiving the replacement command, acquiring an unused processing tool stored in a storage unit, and traveling to the outside of the processing device while holding the acquired unused processing tool, the processing device detecting that the exchange device that received the replacement command and traveled outside the processing device has arrived at a set position outside the exterior cover, and the exchange device replacing the exterior cover. The method includes opening a shutter that opens and closes the entrance so that entry can be made from the outside to the inside of the outer cover through the entrance; the replacement device removing the used processing tool attached to the processing mechanism, and then attaching the unused processing tool to the processing mechanism; the replacement device attaching the unused processing tool to the processing mechanism and exiting from the inside to the outside of the outer cover through the entrance, after which closing the shutter; and the replacement device traveling to the storage section while holding the used processing tool and placing the used processing tool in the storage section. The processing mechanism includes a flange to which the processing tool is attached, a spindle shaft with the flange at its lower end, and a spindle motor that rotates the spindle shaft. The replacement device includes an replacement mechanism that attaches the unused processing tool to the processing mechanism or removes the used processing tool from the processing mechanism, and an articulated arm that moves the replacement mechanism. The replacement mechanism includes a holding mechanism that holds the processing tool from below, a first rotation mechanism that rotates the holding mechanism to simultaneously rotate the processing tool and the flange, and an operation mechanism that tightens or loosens a fastener that fastens the processing tool to the processing mechanism. The processing tool has a plurality of holes for attaching the fasteners, spaced apart in the rotation direction of the processing tool. The first rotation mechanism stops the rotation of the holding mechanism so that the holes face the operation mechanism. The operating mechanism tightens the fastener to attach the unused processing tool to the hole stopped toward the operating mechanism. [Effects of the Invention]

[0006] According to one aspect of the present disclosure, it is possible to prevent an operator from getting dirty when replacing a processing tool, and also to suppress particles such as processing debris from leaking to the outside. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view showing an example of a factory layout. [Figure 2] FIG. 2 is a plan view showing another example of a factory layout. [Figure 3]FIG. 3 is a plan view showing an example of a grinding system. [Figure 4] FIG. 4 is a cross-sectional view showing a processing mechanism of a grinding device according to one embodiment. [Figure 5] FIG. 5 is a cross-sectional view showing a grinding device and an exchange device according to an embodiment. [Figure 6] FIG. 6 is an enlarged cross-sectional view of a part of FIG. [Figure 7] FIG. 7 is a functional block diagram showing components of the control units of the grinding device and the exchanging device according to one embodiment. [Figure 8] FIG. 8 is a cross-sectional view showing a grinding device and an exchange device according to a first modified example. [Figure 9] FIG. 9 is a cross-sectional view showing a grinding device and an exchange device according to a second modified example. [Figure 10] FIG. 10 is a cross-sectional view showing a grinding device and an exchanging device according to a third modified example. [Figure 11] FIG. 11 is a plan view showing an example of an exchange device including a storage unit. [Figure 12] FIG. 12 is a cross-sectional view showing a first modified example of the fastener. [Figure 13] FIG. 13 is a cross-sectional view showing a second modified example of the fastener. [Figure 14] FIG. 14 is a cross-sectional view showing an example of the first rotation mechanism. [Figure 15] FIG. 15 is a cross-sectional view showing an example of a gas supply mechanism. [Figure 16] FIG. 16 is a cross-sectional view showing another example of the gas supply mechanism. [Figure 17] FIG. 17 is a cross-sectional view showing an example of the second rotation mechanism. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In each drawing, the same or corresponding components are denoted by the same reference numerals, and their description may be omitted. In this specification, the X-axis, Y-axis, and Z-axis directions are perpendicular to each other. The X-axis and Y-axis directions are horizontal directions, and the Z-axis direction is vertical.

[0009] 1, a room in a factory is equipped with, for example, a grinding system 1 that grinds a substrate W, an exchange device 7 that exchanges a grinding tool D mounted on the grinding system 1, a hangar 8 that stores the exchange device 7, and a storage unit 9 that stores the grinding tool D. The factory may be, for example, a semiconductor factory, and the room may be, for example, a clean room.

[0010] The substrate W includes a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, or a glass substrate. The substrate W may further include a device layer formed on the surface of the semiconductor substrate or the glass substrate. The device layer includes an electronic circuit. The substrate W may also be a laminated substrate formed by bonding multiple substrates.

[0011] A plurality of grinding systems 1 may be arranged in a factory room as shown in FIG. 1, or only one may be arranged. The grinding system 1 grinds a substrate W with a grinding tool D. When the grinding tool D wears out, it is replaced by a replacement device 7. Since the replacement device 7 replaces the grinding tool D instead of a human, it is possible to prevent the human from becoming dirty. Replacing the grinding tool D includes removing the used grinding tool D and installing an unused grinding tool D.

[0012] The storage unit 9 stores the grinding tools D. In this embodiment, the used grinding tools D and the unused grinding tools D are stored in the same storage unit 9, but they may also be stored in separate storage units 9. The storage unit 9 is provided outside the grinding system 1. This makes it possible to reduce the size of the grinding system 1. Because the storage unit 9 is provided outside the grinding system 1, a self-propelled robot is used as the exchange device 7, unlike when the storage unit 9 is provided inside the grinding system 1.

[0013] The replacement device 7 waits in the storage 8 until it receives a replacement command for the grinding tool D. When the replacement device 7 receives the replacement command, it travels, for example, to the grinding system 1 and removes the used grinding tool D from the grinding system 1. Next, the replacement device 7 travels to the storage unit 9 while holding the removed used grinding tool D, and places the used grinding tool D in the storage unit 9. Thereafter, the replacement device 7 acquires an unused grinding tool D from the storage unit 9, and travels to the grinding system 1 while holding the acquired unused grinding tool D, and attaches the unused grinding tool D to the grinding system 1. Finally, the replacement device 7 returns to the storage 8 and waits.

[0014] Alternatively, when the exchange device 7 receives an exchange command, it first travels to the storage unit 9, acquires an unused grinding tool D there, and travels to the grinding system 1 while holding the acquired unused grinding tool D. Next, the exchange device 7 removes the used grinding tool D from the grinding system 1. Subsequently, the exchange device 7 attaches the unused grinding tool D to the grinding system 1. Thereafter, the exchange device 7 travels to the storage unit 9 while holding the removed used grinding tool D, and places the used grinding tool D in the storage unit 9. Finally, the exchange device 7 returns to the hangar 8 and waits.

[0015] The storage unit 9 is common to a plurality of grinding systems 1. Compared to the case where a storage unit 9 is provided for each grinding system 1, the number of storage units 9 installed can be reduced.

[0016] 2, the storage unit 9 may be provided for each grinding system 1. In this case, the storage unit 9 can be installed closer to the grinding system 1 than when the storage unit 9 is common to multiple grinding systems 1.

[0017] 1 and 2 is provided separately from the exchange device 7, but the exchange device 7 may also be provided with the storage unit 9 as shown in FIG. 11. The storage unit 9 of the exchange device 7 travels together with the traveling platform 73 of the exchange device 7. In this case, the traveling distance of the exchange device 7 can be shortened. The storage unit 9 of the exchange device 7 temporarily stores the grinding tools D that are transported between the storage unit 9 (see FIG. 1 or 2) fixed to the outside of the exchange device 7 and the processing mechanism 43 of the grinding system 1.

[0018] Next, the grinding system 1 will be described with reference to Fig. 3. The grinding system 1 includes a carry-in / out unit 2, a cleaning unit 3, a grinding unit 4, and a control unit 5. The carry-in / out unit 2, the cleaning unit 3, and the grinding unit 4 are arranged in this order from the negative side in the X-axis direction to the positive side in the X-axis direction.

[0019] The loading / unloading section 2 has a mounting table 21 on which a cassette C is placed. The cassette C stores a plurality of substrates W spaced apart in the vertical direction. The mounting table 21 includes a plurality of mounting plates 22 arranged in a row in the Y-axis direction. A cassette C is placed on each of the plurality of mounting plates 22. The number of mounting plates 22 is not particularly limited. Similarly, the number of cassettes C is not particularly limited.

[0020] The loader / unloader 2 also has a first transfer region 23. In plan view, the first transfer region 23 is disposed adjacent to the mounting table 21 and a transition device 35 (described later) so as to be sandwiched between the mounting table 21 and the transition device 35. The loader / unloader 2 has a first transfer device 24 that transfers the substrate W in the first transfer region 23. The first transfer device 24 transfers the substrate W between multiple devices disposed adjacent to the first transfer region 23. The first transfer device 24 includes a first transfer arm 24a that holds the substrate W. The first transfer arm 24a is capable of moving in the horizontal direction (both in the X-axis direction and the Y-axis direction) and the vertical direction, and of rotating about a vertical axis. The number of first transfer arms 24a may be one or more.

[0021] The cleaning section 3 has a first cleaning device 31. The first cleaning device 31 scrubs and washes the substrate W after it has been ground by the grinding device 40, which will be described later. The first cleaning device 31 includes a cleaning body such as a sponge or a brush, and removes particles such as grinding dust with the cleaning body.

[0022] The cleaning section 3 also has a second cleaning device 32. The second cleaning device 32 etches the substrate W with a chemical solution after it has been ground by the grinding device 40. The second cleaning device 32 includes a spin chuck that holds the substrate W and a nozzle that discharges the chemical solution. The nozzle supplies the chemical solution to the center of the upper surface of the rotating substrate W.

[0023] The cleaning section 3 may further include a third cleaning device 33. Unlike the first cleaning device 31 and the second cleaning device 32, the third cleaning device 33 cleans the substrate W before it is ground by the grinding device 40. Like the first cleaning device 31, the third cleaning device 33 scrubs the substrate W. This can prevent foreign matter from getting caught between the chuck 42 of the grinding device 40 and the substrate W, allowing the substrate W to be ground flat.

[0024] The cleaning unit 3 has a detection device 34. The detection device 34 detects the center of the substrate W before it is ground by the grinding device 40. In a plan view, the detection device 34 can align the center of the substrate W with the center of the chuck 42 of the grinding device 40. In addition to the center of the substrate W, the detection device 34 may also detect the crystal orientation of the substrate W; specifically, it may detect a notch or orientation flat that indicates the crystal orientation of the substrate W. In a rotating coordinate system that rotates together with the chuck 42, the detection device 34 can align the crystal orientation of the substrate W to a desired orientation.

[0025] The first cleaning device 31, the third cleaning device 33, and the detection device 34 may be stacked in the vertical direction to reduce the installation area of ​​the grinding system 1. For example, the detection device 34, the first cleaning device 31, and the third cleaning device 33 are arranged in this order from bottom to top. However, the order is not particularly limited.

[0026] The cleaning section 3 has a transition device 35. The transition device 35 temporarily accommodates the substrate W. A plurality of transition devices 35 may be stacked vertically. The arrangement and number of the transition devices 35 are not particularly limited.

[0027] The cleaning unit 3 has a second transfer region 36. In plan view, the second transfer region 36 is arranged adjacent to the first cleaning apparatus 31, the second cleaning apparatus 32, and the transition device 35, and is surrounded on three sides by the first cleaning apparatus 31, the second cleaning apparatus 32, and the transition device 35. The cleaning unit 3 has a second transfer device 37 that transfers the substrate W in the second transfer region 36. The second transfer device 37 transfers the substrate W between multiple devices arranged adjacent to the second transfer region 36. The second transfer device 37 includes a second transfer arm 37a that holds the substrate W. The second transfer arm 37a is capable of moving in the horizontal direction (both in the X-axis direction and the Y-axis direction) and the vertical direction, and of rotating about a vertical axis. The number of second transfer arms 37a may be one or more.

[0028] The cleaning unit 3 has a rectangular shape with corners cut out in a plan view, and the third transfer region 38 is disposed in the cut-out position. In a plan view, the third transfer region 38 is disposed adjacent to the second transfer region 36, the first cleaning device 31, and the grinding device 40, and is surrounded on three sides by the second transfer region 36, the first cleaning device 31, and the grinding device 40. The third transfer region 38 may be provided inside a housing that covers both the cleaning unit 3 and the third transfer region 38, or may be provided inside a housing separate from the housing that covers the cleaning unit 3 and connected to the cleaning unit 3.

[0029] The grinding system 1 includes a third transfer device 39 that transfers the substrate W in a third transfer region 38. The third transfer device 39 transfers the substrate W between a plurality of devices arranged adjacent to the third transfer region 38. The third transfer device 39 includes a suction pad 39a that holds the substrate W. The suction pad 39a adsorbs the substrate W from above. The suction pad 39a is capable of moving in the horizontal direction (both in the X-axis direction and the Y-axis direction) and the vertical direction, and of rotating about a vertical axis.

[0030] The grinding unit 4 includes a grinding device 40. The grinding device 40 grinds the substrate W. The grinding includes polishing. The abrasive grains used for grinding may be either fixed abrasive grains or loose abrasive grains. The grinding device 40 includes, for example, a table 41, four chucks 42, and three processing mechanisms 43.

[0031] The table 41 holds four chucks 42 at equal intervals around a rotation center line R1 and rotates around the rotation center line R1. Each of the four chucks 42 rotates together with the table 41 and moves to a carry-in / out position A0, a primary grinding position A1, a secondary grinding position A2, a tertiary grinding position A3, and the carry-in / out position A0 in this order.

[0032] The loading / unloading position A0 serves as both a position where the substrate W is loaded and a position where the substrate W is unloaded. In this embodiment, the loading position and the unloading position are the same position, but they may be different positions. The primary grinding position A1 is a position where primary grinding of the substrate W is performed. The secondary grinding position A2 is a position where secondary grinding of the substrate W is performed. The tertiary grinding position A3 is a position where tertiary grinding of the substrate W is performed.

[0033] The four chucks 42 are attached to the table 41 so as to be rotatable about their respective rotation center lines R2 (see FIG. 4). At the primary grinding position A1, the secondary grinding position A2, and the tertiary grinding position A3, the chucks 42 rotate about their respective rotation center lines R2.

[0034] One processing mechanism 43 performs primary grinding of the substrate W at the primary grinding position A1. Another processing mechanism 43 performs secondary grinding of the substrate W at the secondary grinding position A2. The remaining processing mechanism 43 performs tertiary grinding of the substrate W at the tertiary grinding position A3.

[0035] The number of processing mechanisms 43 may be one or more. The number of chucks 42 may be greater than the number of processing mechanisms 43. However, the table 41 may not be present. If the table 41 is not present, the number of chucks 42 may be the same as the number of processing mechanisms 43, or may be one.

[0036] The control unit 5 is, for example, a computer, and includes a CPU (Central Processing Unit) 51 and a storage medium 52 such as a memory. The storage medium 52 stores programs that control various processes executed in the grinding system 1. The control unit 5 controls the operation of the grinding system 1 by causing the CPU 51 to execute the programs stored in the storage medium 52.

[0037] Next, a description will be given of the operation of the grinding system 1. The following operation is performed under the control of the control unit 5.

[0038] First, the first transfer device 24 takes out the substrate W from the cassette C and transfers it to the transition device 35. Subsequently, the second transfer device 37 transfers the substrate W from the transition device 35 to the third cleaning device 33.

[0039] Next, the third cleaning device 33 cleans the substrate W before it is ground by the grinding device 40. The clean substrate W can be placed on the chuck 42 of the grinding device 40, which prevents foreign matter from getting caught. Therefore, the substrate W can be ground flat and the thickness deviation of the substrate W can be prevented from worsening. After the substrate W is dried, the second transport device 37 transports the substrate W from the third cleaning device 33 to the detection device 34.

[0040] It should be noted that the third cleaning device 33 may be omitted if the unground substrate W is clean or if the grinding device 40 has a mechanism for cleaning the unground substrate W. In this case, the second transport device 37 transports the substrate W from the transition device 35 to the detection device 34.

[0041] Next, the detection device 34 detects the center of the substrate W. The detection device 34 may also detect the crystal orientation of the substrate W, and more specifically, may also detect a notch or the like. Thereafter, the third transfer device 39 transfers the substrate W from the detection device 34 to the chuck 42 of the grinding device 40. During this time, the control unit 5 controls the third transfer device 39 based on the detection result of the detection device 34 to align the center of the chuck 42 with the center of the substrate W. The control unit 5 also controls the third transfer device 39 based on the detection result of the detection device 34 to align the crystal orientation of the substrate W with a desired orientation in a rotating coordinate system that rotates together with the chuck 42.

[0042] Next, the grinding device 40 grinds the upper surface of the substrate W. The substrate W rotates together with the table 41 and moves to the load / unload position A0, the first grinding position A1, the second grinding position A2, the third grinding position A3, and the load / unload position A0 in this order. During this time, the first grinding, the second grinding, and the third grinding are performed. Thereafter, the third transfer device 39 transfers the substrate W from the chuck 42 to the first cleaning device 31.

[0043] Next, the first cleaning device 31 cleans the upper surface of the substrate W to remove particles such as grinding debris. After the substrate W is dried, the second transfer device 37 transfers the substrate W from the first cleaning device 31 to the second cleaning device 32.

[0044] Next, the second cleaning device 32 etches the upper surface of the substrate W to remove grinding marks. After the substrate W is dried, the second transfer device 37 transfers the substrate W from the second cleaning device 32 to the transition device 35. Then, the first transfer device 24 transfers the substrate W from the transition device 35 to the cassette C. The substrate W is stored in the cassette C.

[0045] Next, the processing mechanism 43 of the grinding device 40 will be described with reference to Fig. 4. The processing mechanism 43 has a movable part 43a to which a grinding tool D is attached. The processing mechanism 43 is a drive mechanism that drives the grinding tool D. The grinding tool D is brought into contact with the substrate W to grind the substrate W. The grinding tool D has, for example, a disk-shaped grinding wheel D1 and a plurality of grinding stones D2 arranged in a ring shape on the underside of the grinding wheel D1.

[0046] The movable part 43a includes a flange 43a1 on which the grinding tool D is attached, a spindle shaft 43a2 on whose lower end the flange 43a1 is attached, and a spindle motor 43a3 that rotates the spindle shaft 43a2. The flange 43a1 is disposed horizontally, and the grinding tool D is replaceably attached to its lower surface with fasteners E such as bolts. A plurality of fasteners E are provided at intervals along the periphery of the flange 43a1. The spindle shaft 43a2 is disposed vertically. The spindle motor 43a3 rotates the spindle shaft 43a2, thereby rotating the grinding tool D attached to the flange 43a1. The rotation center line R3 of the grinding tool D is the rotation center line of the spindle shaft 43a2.

[0047] The machining mechanism 43 further includes an elevator 43b that raises and lowers the movable part 43a. The elevator 43b includes, for example, a vertical Z-axis guide 43b1, a Z-axis slider 43b2 that moves along the Z-axis guide 43b1, and a Z-axis motor 43b3 that moves the Z-axis slider 43b2. The movable part 43a is fixed to the Z-axis slider 43b2, and the movable part 43a and grinding tool D rise and fall together with the Z-axis slider 43b2. The elevator 43b further includes a position detector 43b4 that detects the position of the grinding tool D. The position detector 43b4 detects, for example, the rotation of the Z-axis motor 43b3 to detect the position of the grinding tool D.

[0048] The lifting unit 43b lowers the grinding tool D from the standby position. The grinding tool D rotates while descending, comes into contact with the upper surface of the rotating substrate W, and grinds the entire upper surface of the substrate W. When the thickness of the substrate W reaches a set value, the lifting unit 43b stops the lowering of the grinding tool D. Thereafter, the lifting unit 43b raises the grinding tool D to the standby position.

[0049] Next, the attachment and detachment of the grinding tool D to the processing mechanism 43 will be described with reference to Figures 5 and 6. As shown in Figure 5, the grinding device 40 has an exterior cover 44. The exterior cover 44 houses a chuck 42 as a holder for holding the substrate W and the processing mechanism 43 to which the grinding tool D is replaceably attached. The exterior cover 44 prevents particles such as grinding dust generated inside from escaping to the outside, thereby keeping the factory room clean.

[0050] The exterior cover 44 has an entrance 44a through which the replacement device 7 passes when entering the interior of the exterior cover 44 from the outside. The replacement device 7 enters the interior of the exterior cover 44 from the outside instead of a person, and replaces the grinding tool D inside the exterior cover 44.

[0051] Since the replacement device 7 enters the interior of the exterior cover 44 instead of a person to replace the grinding tool D, it is possible to prevent the person from becoming dirty with the deposits inside the exterior cover 44. Furthermore, since the replacement device 7 is provided outside the grinding device 40, the grinding device 40 can be made smaller than when the replacement device 7 is provided inside the grinding device 40.

[0052] The grinding device 40 is provided with a shutter 45 that opens and closes the entrance 44a of the exterior cover 44. The shutter 45 basically closes the entrance 44a, and opens the entrance 44a when the exchange device 7 enters. Compared to when the entrance 44a is always open, this can suppress the outflow of particles from the inside to the outside of the exterior cover 44 through the entrance 44a, and the factory room can be kept clean.

[0053] The grinding device 40 may include a movement mechanism 46 that moves the shutter 45 between an open position (for example, the position shown in FIG. 5) that opens the entrance 44a and a closed position that closes the entrance 44a. The movement mechanism 46 is a pneumatic cylinder, an electric cylinder, or the like. The electric cylinder includes a motor and a ball screw. The shutter 45 can be moved automatically rather than manually.

[0054] 3, the grinding device 40 has a plurality of processing mechanisms 43, and an entrance 44a is provided for each processing mechanism 43. For example, the processing mechanisms 43 and the entrances 44a are provided at the first grinding position A1, the second grinding position A2, and the third grinding position A3, respectively. A shutter 45 is provided for each entrance 44a, and the shutter 45 is moved for each entrance 44a.

[0055] The greater the number of processing mechanisms 43, the more pronounced the effect of providing the exchange device 7 outside the grinding apparatus 40. Unlike the present embodiment, if an exchange device 7 is provided inside the grinding apparatus 40 for each processing mechanism 43, or if an exchange device 7 common to multiple processing mechanisms 43 is provided inside the grinding apparatus 40, the grinding apparatus 40 will become larger. On the other hand, according to the present embodiment, the exchange device 7 is provided outside the grinding apparatus 40, so the grinding apparatus 40 can be made smaller. However, the number of processing mechanisms 43 may be one.

[0056] 5, the grinding device 40 may include a limiting mechanism 47. The limiting mechanism 47 limits the outflow of gas from the inside to the outside of the exterior cover 44 through the inlet 44a of the exterior cover 44. By limiting the outflow of gas, the outflow of particles can be suppressed, and the factory room can be kept clean.

[0057] For example, the restriction mechanism 47 includes an exhaust line 47a that creates a negative pressure inside the exterior cover 44 compared to the outside. The exhaust line 47a is a duct or the like, and connects the exterior cover 44 to an exhaust source. The exhaust source is, for example, a vacuum pump or an ejector. An air pressure controller 47b, for example, is provided midway along the exhaust line 47a. The air pressure controller 47b controls the air pressure inside the exterior cover 44. The difference in air pressure creates an airflow that flows from the inlet 44a of the exterior cover 44 toward the inside. As a result, the outflow of gas from the inside of the exterior cover 44 to the outside can be restricted.

[0058] Although the connection port of the exhaust line 47a with the exterior cover 44 is shown above the inlet 44a of the exterior cover 44 in FIG. 5, it may be below. In the latter case, a downflow can be formed inside the exterior cover 44. A blower such as a fan filter unit may be provided on the ceiling of the exterior cover 44. The amount of air blown and the amount of air exhausted are controlled so as to create a negative pressure inside the exterior cover 44 compared to the outside.

[0059] The grinding device 40 may be equipped with a cleaning mechanism 48. The cleaning mechanism 48 supplies cleaning liquid to the grinding tool D or peripheral components of the grinding tool D using a nozzle or the like. The cleaning liquid is, for example, DIW (deionized water). The peripheral components of the grinding tool D are, for example, a flange 43a1 or a spindle shaft 43a2. Before removing a used grinding tool D from the processing mechanism 43, the grinding tool D and the like are cleaned. This makes it possible to prevent the replacement device 7 from becoming dirty. Furthermore, cleaning the grinding tool D using the cleaning mechanism 48 makes it possible to prevent particles from being carried outside along with the grinding tool D.

[0060] The grinding device 40 includes a control unit 50. The control unit 50 is, for example, a computer, and includes a CPU 50a and a storage medium 50b such as a memory. The storage medium 50b stores programs that control various processes executed by the grinding device 40. The control unit 50 controls the operation of the grinding device 40 by having the CPU 50a execute the programs stored in the storage medium 50b. The control unit 50 of the grinding device 40 may be part of the control unit 5 of the grinding system 1.

[0061] The replacement device 7 includes, for example, a replacement mechanism 71, a moving mechanism 72, a running platform 73, and a running mechanism 74. The replacement mechanism 71 attaches a grinding tool D to the processing mechanism 43 or removes the grinding tool D from the processing mechanism 43. The replacement mechanism 71 is capable of moving in horizontal directions (both in the X-axis direction and the Y-axis direction) and vertical directions, and of rotating about a vertical axis. The moving mechanism 72 moves the replacement mechanism 71 from the outside to the inside of the exterior cover 44 through the entrance 44a of the exterior cover 44. The moving mechanism 72 is, for example, an articulated arm, and holds the replacement mechanism 71 at one end and is connected to the running platform 73 at the other end. The running platform 73 supports the moving mechanism 72. The running mechanism 74 moves the running platform 73.

[0062] Since the exchange device 7 is provided outside the grinding device 40, a self-propelled robot is used as the exchange device 7, unlike when the exchange device 7 is provided inside the grinding device 40. The exchange device 7 exchanges the grinding tool D instead of a human. This prevents the human from getting dirty. Furthermore, since the exchange device 7 is provided outside the grinding device 40, the grinding device 40 can be made smaller than when the exchange device 7 is provided inside the grinding device 40.

[0063] As shown in FIG. 6, the replacement mechanism 71 has a holding mechanism 71a that holds a grinding tool D. The holding mechanism 71a holds a container F that stores the grinding tool D. The container F is box-shaped and open at the top, with a recess on the top surface. The grinding tool D is stored in the recess. The container F stores the grinding tool D and prevents the grinding fluid, grinding chips, etc. from falling when the grinding tool D is removed. The holding mechanism 71a may also hold the grinding tool D.

[0064] The replacement mechanism 71 has a rotation-preventing mechanism 71b that stops the rotation of the spindle shaft 43a2 of the processing mechanism 43. The rotation-preventing mechanism 71b includes, for example, a clamp that grips the flange 43a1 or the spindle shaft 43a2. Alternatively, the rotation-preventing mechanism 71b includes a pin that is inserted into a hole in the flange 43a1 or the spindle shaft 43a2. With the rotation of the spindle shaft 43a2 stopped by the rotation-preventing mechanism 71b and the rotation of the grinding tool D stopped, the fastener E can be tightened or loosened.

[0065] The replacement mechanism 71 has an operation mechanism 71c that tightens or loosens a fastener E that fastens the grinding tool D to the processing mechanism 43. When the fastener E is a bolt, the operation mechanism 71c is made up of a tool such as a spanner or wrench that fits onto the bolt and a rotation mechanism that turns the tool.

[0066] As shown in FIG. 1 etc., a plurality of pairs of replacement mechanism 71 and movement mechanism 72 may be provided and controlled independently. One pair is used for attaching grinding tool D, and another pair is used for removing grinding tool D. Unlike when there is only one pair of replacement mechanism 71 and movement mechanism 72, if there are a plurality of pairs, the grinding tool D can be quickly removed and attached in succession. In other words, the replacement device 7 does not need to go back and forth between the grinding device 40 and the storage unit 9 between the removal and attachment of the grinding tool D.

[0067] If the storage unit 9 (see FIG. 11) of the exchange device 7 stores both used and unused grinding tools D, the grinding tools D can be removed and attached quickly and successively even if there is only one exchange mechanism 71 and one moving mechanism 72. Also, if the storage unit 9 (see FIG. 11) of the exchange device 7 stores a plurality of both used and unused grinding tools D, it is possible to perform exchange work on a plurality of processing mechanisms 43 consecutively without having to go back and forth between the storage unit 9 (see FIGS. 1 and 2) fixed to the outside of the exchange device 7 and the grinding device 40.

[0068] The exchange device 7 may include an imaging device 75 that captures an image of the exchange mechanism 71. The imaging device 75 is attached to one end of the moving mechanism 72, similar to the exchange mechanism 71. The exchange mechanism 71 can be controlled while monitoring the operation of the exchange mechanism 71 with the imaging device 75.

[0069] The exchange device 7 includes a control unit 76. The control unit 76 is, for example, a computer, and includes a CPU 76a and a storage medium 76b such as a memory. The storage medium 76b stores programs that control various processes executed in the exchange device 7. The control unit 76 controls the operation of the exchange device 7 by having the CPU 76a execute the programs stored in the storage medium 76b.

[0070] Next, the functions of the control unit 50 of the grinding device 40 and the control unit 76 of the exchange device 7 will be described with reference to FIG. 7. Note that each functional block shown in FIG. 7 is conceptual and does not necessarily have to be physically configured as shown. All or part of each functional block can be configured by functionally or physically distributing or integrating in any unit. All or any part of the processing functions performed by each functional block can be realized by a program executed by a CPU, or can be realized as hardware using wired logic.

[0071] First, we will explain the functions of the control unit 50 of the grinding device 40. The control unit 50 has, for example, a replacement command creation unit 50c, a position detection unit 50d, an opening / closing control unit 50e, a negative pressure control unit 50f, a cleaning control unit 50g, and an auto-setup control unit 50h.

[0072] The replacement command creation unit 50c determines whether the grinding tool D needs to be replaced and creates a replacement command for the grinding tool D. Specifically, the replacement command creation unit 50c monitors, for example, the number of substrates W ground by the grinding tool D, the amount of wear on the grinding tool D, or the elapsed time since the grinding tool D was attached, and creates a replacement command when the monitored value reaches a set value. The created replacement command is transmitted wirelessly or via a cable to the control unit 76 of the replacement device 7. The replacement device 7 and the grinding device 40 may send and receive signals via an external computer. When the replacement device 7 receives the replacement command and a request from the grinding device 40, it travels to the grinding device 40.

[0073] The position detection unit 50d detects, by the detection unit 53, whether the running platform 73 of the exchange device 7 has arrived at a position where the grinding tool D is exchanged (for example, the position shown in FIG. 5). The position where the grinding tool D is exchanged is set outside the exterior cover 44, and serves as both a position where the grinding tool D is attached and a position where the grinding tool D is removed. The detection unit 53 detects, for example, that the running platform 73 of the exchange device 7 has arrived at a set position outside the exterior cover 44. The detection unit 53 is attached, for example, to the outer wall surface of the exterior cover 44, above the entrance 44a. The detection unit 53 is, for example, a camera or the like.

[0074] The opening / closing control unit 50e controls the moving mechanism 46 of the shutter 45 to control the position of the shutter 45. When the running platform 73 of the exchange device 7 arrives at the position where the grinding tool D is exchanged, the opening / closing control unit 50e changes the position of the shutter 45 from the closed position to the open position. Also, when the running platform 73 of the exchange device 7 leaves the position where the grinding tool D is exchanged, the opening / closing control unit 50e changes the position of the shutter 45 from the open position to the closed position.

[0075] The negative pressure control unit 50f controls the air pressure controller 47b of the exhaust line 47a to make the pressure inside the exterior cover 44 negative compared to the outside. The negative pressure control unit 50f makes the pressure inside the exterior cover 44 negative compared to the outside at least while the shutter 45 opens the entrance 44a of the exterior cover 44.

[0076] Before the shutter 45 opens the entrance 44a of the exterior cover 44, the cleaning control unit 50g controls the cleaning mechanism 48 to supply cleaning liquid to the grinding tool D or peripheral components of the grinding tool D. The supply of cleaning liquid is performed, for example, after generating a command to replace the grinding tool D. Note that the supply of cleaning liquid may also be performed during grinding of the substrate W or at the end of grinding.

[0077] The auto-setup control unit 50h performs auto-setup when the replacement of the grinding tool D is completed and the replacement device 7 leaves the position where the grinding tool D was replaced. The auto-setup includes, for example, dressing of an unused grinding tool D or temperature adjustment inside the exterior cover 44.

[0078] Next, a description will be given of the functions of the control unit 76 of the exchange device 7. The control unit 76 has, for example, a travel control unit 76c, a movement control unit 76d, and an exchange control unit 76e.

[0079] The travel control unit 76c controls the travel mechanism 74 and controls the position of the travel base 73. For example, the travel control unit 76c controls the travel mechanism 74 and causes the travel base 73 to travel between a position where the grinding tool D is stored and a position where the grinding tool D is replaced.

[0080] The movement control unit 76d controls the movement mechanism 72 and controls the position of the replacement mechanism 71. When the replacement device 7 detects from a signal or the like transmitted from the grinding device 40 that the traveling platform 73 has stopped at the position where the grinding tool D is replaced and the entrance 44a of the exterior cover 44 is open, the movement control unit 76d moves the replacement mechanism 71 from the outside to the inside of the exterior cover 44 through the entrance 44a of the exterior cover 44. Furthermore, before the traveling platform 73 leaves the position where the grinding tool D is replaced, the movement control unit 76d moves the replacement mechanism 71 from the inside to the outside of the exterior cover 44 through the entrance 44a of the exterior cover 44.

[0081] The replacement control unit 76e controls the replacement mechanism 71 and controls the removal or installation of the grinding tool D. The replacement control unit 76e holds the grinding tool D with the holding mechanism 71a and tightens or loosens the fastener E with the operation mechanism 71c while stopping the rotation of the spindle shaft 43a2 with the rotation prevention mechanism 71b. The replacement control unit 76e controls the replacement mechanism 71 while monitoring the operation of the replacement mechanism 71 with the imaging device 75.

[0082] Next, the operations of the grinding device 40 and the replacement device 7 will be described together. The grinding device 40 determines whether the grinding tool D needs to be replaced and generates a replacement command for the grinding tool D. The grinding device 40 then transmits the replacement command to the replacement device 7. If the grinding device 40 determines that the grinding tool D needs to be replaced, it stops grinding the substrate W and performs cleaning using the cleaning mechanism 48. Meanwhile, upon receiving the replacement command from the grinding device 40, the replacement device 7 approaches the grinding device 40. When the grinding device 40 detects that the carriage 73 of the replacement device 7 has arrived at the position where the grinding tool D is to be replaced, it opens the shutter 45. The replacement device 7 then causes the replacement mechanism 71 to enter the interior through the entrance 44a of the exterior cover 44. The replacement device 7 then removes the used grinding tool D from the processing mechanism 43 and attaches an unused grinding tool D to the processing mechanism 43. Thereafter, the exchanging device 7 causes the exchanging mechanism 71 to exit to the outside through the entrance 44a of the exterior cover 44. Thereafter, the grinding device 40 closes the shutter 45 and performs auto-setup control. Next, the grinding device 40 resumes grinding of the substrate W.

[0083] Next, a grinding device 40 and an exchanging device 7 according to a first modified example will be described with reference to Fig. 8. Differences from the above embodiment will be mainly described below.

[0084] The limiting mechanism 47 of the grinding device 40 of this modified example has a sealing member 47c in addition to the exhaust line 47a. Note that the limiting mechanism 47 may have only the sealing member 47c. The sealing member 47c comes into contact with the articulated arm or the like of the exchange device 7 that has entered the entrance 44a of the exterior cover 44, and closes the entrance 44a of the exterior cover 44. The sealing member 47c limits the outflow of gas and suppresses the outflow of particles.

[0085] The seal member 47c is attached to, for example, the shutter 45, and moves together with the shutter 45. A pair of shutters 45 is provided, and the seal members 47c are attached to the opposing surfaces of the pair of shutters 45. The pair of seal members 47c sandwich and encase the exchange device 7, and close the entrance 44a of the exterior cover 44. The seal member 47c is made of a flexible material such as rubber, and deforms to follow the outer shape of the exchange device 7.

[0086] When the running platform 73 of the exchange device 7 reaches a set position outside the exterior cover 44, the opening / closing control unit 50e changes the position of the shutter 45 from the closed position to the open position. Thereafter, the movement control unit 76d moves the exchange mechanism 71 from the outside to the inside of the exterior cover 44 through the entrance 44a of the exterior cover 44. At this time, the seal member 47c does not come into contact with the exchange device 7.

[0087] Thereafter, the opening / closing control unit 50e changes the position of the shutter 45 from the open position to the sealed position (for example, the position shown in FIG. 8). The sealed position is a position where the sealing member 47c comes into contact with the articulated arm or the like of the exchange device 7 and blocks the entrance 44a of the exterior cover 44. With the entrance 44a blocked by the sealing member 47c, the exchange control unit 76e controls the exchange mechanism 71 to remove or attach the grinding tool D.

[0088] When the removal or installation of the grinding tool D is completed, the opening / closing control unit 50e changes the position of the shutter 45 from the sealed position to the open position. Next, the movement control unit 76d moves the replacement mechanism 71 from the outside to the inside of the exterior cover 44 through the entrance 44a of the exterior cover 44. Thereafter, the travel control unit 76c controls the traveling mechanism 74 to cause the traveling platform 73 to travel from the position where the grinding tool D is replaced to the position where the grinding tool D is stored.

[0089] Next, a grinding device 40 and an exchanging device 7 according to a second modified example will be described with reference to Fig. 9. Below, differences from the above embodiment and the above first modified example will be mainly described.

[0090] The exterior cover 44 of the grinding apparatus 40 of this modified example has a main housing 44b in which an entrance 44a is formed, and a sub-housing 44c attached to the outer wall surface of the main housing 44b so as to surround the entrance 44a of the main housing 44b. The main housing 44b houses a chuck 42 as a holder for holding the substrate W, and a processing mechanism 43 to which a grinding tool D is replaceably attached.

[0091] The sub-housing 44c includes a second entrance 44d through which the replacement device 7 passes when entering the inside of the sub-housing 44c from the outside. After arriving at a position where the replacement device 7 replaces the grinding tool D, the replacement device 7 passes through the second entrance 44d and the entrance 44a in this order, enters the inside of the main housing 44b, and replaces the grinding tool D inside the main housing 44b.

[0092] The grinding device 40 is provided with a second shutter 61 that opens and closes the second entrance 44d of the sub-housing 44c. The second shutter 61 basically closes the second entrance 44d, and opens the second entrance 44d when the exchange device 7 enters. Compared to when the second entrance 44d is always open, this can suppress the outflow of particles from the inside to the outside of the exterior cover 44 through the second entrance 44d, and can keep the factory room clean.

[0093] The grinding device 40 may include a second movement mechanism 62 that moves the second shutter 61 between a second open position that opens the second entrance 44d and a second closed position that closes the second entrance 44d. The second movement mechanism 62 is a pneumatic cylinder, an electric cylinder, or the like. The second shutter 61 can be moved automatically rather than manually.

[0094] Like the entrance 44a, the second entrance 44d is provided for each processing mechanism 43. For example, the second entrance 44d is provided at each of the first grinding position A1, the second grinding position A2, and the third grinding position A3. A second shutter 61 is provided for each second entrance 44d, and the second shutter 61 is moved for each second entrance 44d.

[0095] The control unit 50 of the grinding device 40 includes a second opening / closing control unit (not shown). The second opening / closing control unit controls the second moving mechanism 62 to control the position of the second shutter 61. When the running platform 73 of the exchange device 7 arrives at a position where the grinding tool D is replaced, the second opening / closing control unit changes the position of the second shutter 61 from the second closed position to the second open position. Furthermore, when the running platform 73 of the exchange device 7 leaves the position where the grinding tool D is replaced, the second opening / closing control unit changes the position of the second shutter 61 from the second open position to the second closed position.

[0096] The limiting mechanism 47 of the grinding device 40 may have a second seal member 47d. The second seal member 47d comes into contact with the articulated arm or the like of the exchange device 7 that has entered the second entrance 44d of the sub-housing 44c, and closes the second entrance 44d of the sub-housing 44c. The second seal member 47d limits the outflow of gas and suppresses the outflow of particles.

[0097] The second seal member 47d is attached to, for example, the second shutter 61 and moves together with the second shutter 61. A pair of second shutters 61 is provided, and the second seal members 47d are attached to the opposing surfaces of the pair of second shutters 61. The pair of second seal members 47d sandwich and encase the exchange device 7, and close the second entrance 44d of the exterior cover 44. The second seal member 47d is made of a flexible material such as rubber, and deforms to follow the outer shape of the exchange device 7.

[0098] When the running platform 73 of the exchange device 7 reaches a set position outside the exterior cover 44, the second opening / closing control unit changes the position of the second shutter 61 from the second closed position to the second open position. Thereafter, the movement control unit 76d moves the exchange mechanism 71 from the outside to the inside of the sub-housing 44c through the second entrance 44d of the sub-housing 44c. At this time, the second seal member 47d does not come into contact with the exchange device 7.

[0099] Thereafter, the second opening / closing control unit changes the position of the second shutter 61 from the second open position to the second sealing position (for example, the position shown in FIG. 9). The second sealing position is a position where the second sealing member 47d comes into contact with the articulated arm or the like of the replacement device 7 and blocks the second entrance 44d of the sub-housing 44c. With the second sealing member 47d blocking the second entrance 44d, the opening / closing control unit 50e changes the position of the shutter 45 from the closed position to the open position. Next, the movement control unit 76d moves the replacement mechanism 71 from the outside to the inside of the main housing 44b through the entrance 44a of the main housing 44b. Next, the opening / closing control unit 50e changes the position of the shutter 45 from the open position to the sealing position. Thereafter, the replacement control unit 76e controls the replacement mechanism 71 to remove or install the grinding tool D. When the second seal member 47d is attached to the second shutter 61, the outflow of particles can be suppressed by blocking the second entrance 44d of the sub-housing 44c with the second seal member 47d. Therefore, the seal member 47c may not be necessary. However, if the seal member 47c is present, the outflow of particles can be further suppressed.

[0100] After the grinding tool D has been removed or installed, the opening / closing control unit 50e changes the position of the shutter 45 from the sealed position to the open position. Then, the movement control unit 76d moves the replacement mechanism 71 from the inside to the outside of the main housing 44b through the entrance 44a of the main housing 44b. Then, the opening / closing control unit 50e changes the position of the shutter 45 from the open position to the closed position. Then, the second opening / closing control unit changes the position of the second shutter 61 from the second sealed position to the second open position. Then, the movement control unit 76d moves the replacement mechanism 71 from the inside to the outside of the sub-housing 44c through the second entrance 44d of the sub-housing 44c. Then, the travel control unit 76c controls the travel mechanism 74 to travel the travel platform 73 from the position where the grinding tool D is replaced to the position where the grinding tool D is stored. In this way, by closing at least one of the entrance 44a and the second entrance 44d without opening them simultaneously, the inside of the main housing 44b can be prevented from being exposed to the outside of the grinding device 40.

[0101] Next, a grinding device 40 and an exchanging device 7 according to a third modified example will be described with reference to Fig. 10. Below, differences from the above embodiment, the above first modified example, and the above second modified example will be mainly described.

[0102] The exchange device 7 of this modified example includes a housing 77 attached to the running platform 73. The housing 77 comes into contact with the outer wall surface of the exterior cover 44 while accommodating the exchange mechanism 71 and the moving mechanism 72, thereby sealing the inside of the housing 77. The housing 77 may have a seal member 77a on the surface that comes into contact with the exterior cover 44.

[0103] When the shutter 45 opens the entrance 44a of the exterior cover 44, the inside of the housing 77 and the inside of the exterior cover 44 communicate with each other via the entrance 44a of the exterior cover 44. In this state, the grinding tool D is replaced. The housing 77 can restrict the outflow of gas and suppress the outflow of particles, thereby keeping the factory room clean.

[0104] 9, when the exterior cover 44 has a main housing 44b and a sub-housing 44c, the housing 77 comes into contact with the outer wall surface of the sub-housing 44c. When the second shutter 61 opens the second entrance 44d of the sub-housing 44c and the shutter 45 opens the entrance 44a of the main housing 44b, the interior of the housing 77 communicates with the interior of the main housing 44b.

[0105] As shown in FIG. 6, the processing mechanism 43 includes a mounting portion (e.g., a flange 43a1) to which the grinding tool D is replaceably mounted, and a fastener E that fastens the flange 43a1 and the grinding tool D. The fastener E is, for example, a bolt. The fastener E fastens the flange 43a1 and the grinding tool D from above the flange 43a1. For example, the fastener E is inserted into a straight hole that penetrates the flange 43a1 in the vertical direction and screwed into a threaded hole formed on the top surface of the grinding tool D (more specifically, the grinding wheel D1). The fastener E is operated by an operating mechanism 71c. As shown in FIG. 6, the operating mechanism 71c tightens and loosens the fastener E above the flange 43a1.

[0106] A cover or the like that covers the spindle shaft 43a2 may be provided above the flange 43a1 to protect the spindle shaft 43a2 from grinding fluid containing grinding chips. If a cover or the like is provided, it becomes difficult for the operating mechanism 71c to enter above the flange 43a1, making it difficult to operate the fastener E.

[0107] Therefore, as shown in Fig. 12, the fastener E may fasten the flange 43a1 and the grinding tool D from the side of the flange 43a1. Alternatively, as shown in Fig. 13, the fastener E may fasten the flange 43a1 and the grinding tool D from diagonally below the flange 43a1. In either case, even if a cover or the like is present above the flange 43a1, the operating mechanism 71c does not enter above the flange 43a1, making it easy for the operating mechanism 71c to operate the fastener E.

[0108] 12, the flange 43a1 includes, for example, a disk-shaped upper flange 101 and a disk-shaped lower flange 102 having an outer diameter smaller than that of the upper flange 101. On the other hand, the grinding tool D includes a ring portion 111 that fits onto the lower flange 102, a disk portion 112 that closes the lower side of the ring portion 111, and a plurality of grinding wheels 113 arranged along the outer periphery of the disk portion 112.

[0109] 12, the axial direction of the fastener E may be perpendicular to the rotation center line R3 of the spindle shaft 43a2. The fastener E is inserted into a straight hole that radially penetrates the grinding tool D (specifically, the ring portion 111), and screwed into a threaded hole formed in the outer peripheral surface of the flange 43a1 (specifically, the lower flange 102), for example.

[0110] 13, the axial direction of the fastener E may be inclined downward as it becomes farther from the rotation center line R3 of the spindle shaft 43a2. The fastener E is inserted, for example, into a straight hole that passes obliquely through the grinding tool D, and screwed into a threaded hole formed in the underside of the flange 43a1.

[0111] As shown in FIG. 14, the replacement mechanism 71 has a holding mechanism 71a that holds the grinding tool D. The holding mechanism 71a holds the grinding tool D, for example, from below. The holding mechanism 71a is provided at the tip of an articulated arm 72a, for example, via a first rotation mechanism 71d described below. The tip of the articulated arm 72a enters below the processing mechanism 43 from the side and is lifted upward. Thereafter, the holding mechanism 71a comes into contact with the grinding tool D and holds it.

[0112] The replacement mechanism 71 may include a first rotation mechanism 71d that rotates the holding mechanism 71a. When the holding mechanism 71a holds the grinding tool D, the rotation center line of the holding mechanism 71a coincides with the rotation center line R3 of the spindle shaft 43a2. By rotating the holding mechanism 71a with the first rotation mechanism 71d, the grinding tool D and the flange 43a1 can be rotated simultaneously, and the fastener E can be directed toward the operating mechanism 71c. This simplifies the operation of the operating mechanism 71c.

[0113] When multiple fasteners E are provided at intervals around the circumferential direction of the grinding tool D, the control unit 76 repeatedly rotates the holding mechanism 71a using the first rotation mechanism 71d and loosens the fasteners E using the operation mechanism 71c. Before the operation mechanism 71c loosens the fasteners E, the rotation of the holding mechanism 71a is stopped so that the fasteners E face the operation mechanism 71c. At this time, the control unit 76 may monitor the position of the fasteners E using the imaging device 75 shown in FIG. 6, determine whether the position of the fasteners E is at the desired position, and control the rotation stop position of the holding mechanism 71a. When all the fasteners E are removed, the grinding tool D and the processing mechanism 43 are released from each other.

[0114] 15, the replacement mechanism 71 may have a gas supply mechanism 71e that supplies gas between the grinding tool D and the processing mechanism 43 to assist in separating the grinding tool D and the processing mechanism 43. The gas supply mechanism 71e includes a nozzle 121 that discharges gas. The nozzle 121 supplies gas to, for example, the gap between the lower surface of the upper flange 101 and the upper surface of the ring portion 111. The wind pressure of the gas can make it easier to separate the grinding tool D and the processing mechanism 43.

[0115] 16, the grinding tool D may be formed with a hole 114 that guides the gas supplied from the nozzle 121 to the contact surface between the grinding tool D and the processing mechanism 43. The hole 114 guides the gas supplied from the nozzle 121, for example, to the gap between the lower surface of the flange 43a1 and the upper surface of the grinding tool D. The hole 114 may be a dedicated hole, or may also be used as a hole for attaching a fastener E (for example, a straight hole or a screw hole).

[0116] 17, the replacement mechanism 71 may have a second rotation mechanism 71f that rotates the spindle shaft 43a2 of the processing mechanism 43. The second rotation mechanism 71f includes, for example, a roller 131. The rotation center line of the roller 131 is parallel to the rotation center line R3 of the spindle shaft 43a2, and the roller 131 and the flange 43a1 are in contact with each other. When the roller 131 is rotated, the flange 43a1 is rotated due to friction.

[0117] Before attaching the grinding tool D to the flange 43a1, the second rotation mechanism 71f rotates the flange 43a1 to orient the holes 105 (for example, threaded holes or straight holes) of the flange 43a1, into which the fasteners E are to be attached, in a desired direction. At this time, the control unit 76 may monitor the direction of the flange 43a1 using the imaging device 75 shown in FIG. 6, determine whether the direction of the flange 43a1 is the desired direction, and control the rotation stop position of the flange 43a1.

[0118] 17, before attaching the grinding tool D to the flange 43a1, the first rotation mechanism 71d rotates the grinding tool D to orient the hole 115 (e.g., a straight hole or a threaded hole) of the grinding tool D, into which the fastener E is attached, in the desired direction. At this time, the control unit 76 may monitor the orientation of the grinding tool D using the imaging device 75 shown in FIG. 6, determine whether the orientation of the grinding tool D is the desired orientation, and control the rotation stop position of the grinding tool D. Thereafter, the tip of the articulated arm 72a is lifted upward, and the grinding tool D comes into contact with the flange 43a1.

[0119] The orientation of the holes 115 of the grinding tool D, for attaching the fastener E, is aligned with the orientation of the holes 105 of the flange 43a1, for attaching the fastener E. One pair of the holes 115, 105 is oriented toward the operating mechanism 71c. The tip of the articulated arm 72a is then raised upward, and the grinding tool D contacts the flange 43a1. Next, the operating mechanism 71c fastens the grinding tool D to the flange 43a1 with the fastener E. The control unit 76 then repeatedly rotates the holding mechanism 71a using the first rotation mechanism 71d and tightens the fastener E using the operating mechanism 71c. At this time, the control unit 76 may monitor the positions of the holes 115, 105 using the imaging device 75 shown in FIG. 6, determine whether the holes 115, 105 are positioned as desired, and control the rotation stop position of the holding mechanism 71a. When all the fasteners E are tightened, the fastening of the grinding tool D and the processing mechanism 43 is completed.

[0120] The processing device, the method for attaching a processing tool to the processing device, the replacement device, and the replacement method according to the present disclosure have been described above, but the present disclosure is not limited to the above-described embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These naturally fall within the technical scope of the present disclosure.

[0121] For example, the processing device of the present disclosure is a grinding device in the above embodiment, but it may also be a cutting device or a cutting device, etc. Grinding includes polishing. The processing device may be one that includes a processing mechanism to which a processing tool is replaceably attached. When the processing device is a cutting device, a cutting tool such as an end mill is replaceably attached to the processing mechanism. When the processing device is a cutting device, a cutting tool such as a blade is replaceably attached to the processing mechanism. The processing tool may be one that comes into contact with the processing body and processes the processing body. When the processing tool comes into contact with the processing body and becomes worn, it is replaced.

[0122] Furthermore, the object to be processed by the processing apparatus of the present disclosure is the substrate W in the above embodiment, but is not limited to the substrate W.

[0123] This application claims priority based on Japanese Patent Application No. 2020-081378, filed with the Japan Patent Office on May 1, 2020, the entire contents of which are incorporated herein by reference. [Explanation of symbols]

[0124] 7 Exchange device 40 Grinding equipment (processing equipment) 42 Chuck (holding part) 43 Processing mechanism 44 Exterior cover 44a entrance 45 Shutter D Grinding tools (processing tools) W substrate (processing body)

Claims

1. A method for attaching a processing tool to a processing device including: a holding part that holds a processing body; a processing mechanism to which a processing tool that processes the processing body held by the holding part is replaceably attached; and an exterior cover that houses the holding part and the processing mechanism, monitoring a physical quantity used to generate a command to change the tool; generating the replacement command when the value of the physical quantity reaches a set value; Transmitting the replacement command to an outside of the processing device; an exchange device receiving the exchange command, acquiring the unused processing tool stored in the storage unit, and traveling to the outside of the processing device while holding the acquired unused processing tool; The processing device detects that the replacement device, which has received the replacement command and traveled outside the processing device, has arrived at a set position outside the exterior cover; opening a shutter that opens and closes the entrance so that the replacement device can enter from the outside to the inside of the exterior cover through the entrance of the exterior cover; The replacement device removes the used processing tool attached to the processing mechanism, and then the replacement device attaches the unused processing tool to the processing mechanism; the replacement device attaches the unused processing tool to the processing mechanism, exits from the inside of the exterior cover to the outside through the entrance, and then closes the shutter; the replacement device carries the used processing tool and travels to the storage unit, and places the used processing tool in the storage unit; Including, the processing mechanism includes a flange to which the processing tool is attached, a spindle shaft having the flange provided at its lower end, and a spindle motor that rotates the spindle shaft; the replacement device includes an replacement mechanism that attaches the unused processing tool to the processing mechanism or removes the used processing tool from the processing mechanism, and an articulated arm that moves the replacement mechanism, The replacement mechanism includes a holding mechanism that holds the processing tool from below, a first rotation mechanism that rotates the holding mechanism to simultaneously rotate the processing tool and the flange, and an operation mechanism that tightens or loosens a fastener that fastens the processing tool and the processing mechanism, the processing tool has a plurality of holes for attaching the fasteners at intervals in a rotation direction of the processing tool, the first rotation mechanism stops the rotation of the holding mechanism so that the hole faces the operating mechanism; The operating mechanism tightens the fastener to install the unused processing tool in the hole stopped toward the operating mechanism, in a method for installing a processing tool of a processing device.

2. 2. The method for attaching a processing tool to a processing device according to claim 1, wherein the exchange command is transmitted to the exchange device via computers provided external to both the processing device and the exchange device.

3. The method for attaching a processing tool to a processing device according to claim 1 or 2, wherein the processing device has a cleaning mechanism for cleaning the used processing tool, and a cleaning liquid is supplied to the used processing tool before the shutter is opened.

4. 3. The method for attaching a processing tool to a processing device according to claim 1, further comprising: dressing the unused processing tool after the replacement device attaches the unused processing tool to the processing mechanism and the processing device closes the shutter.

5. 3. The method for attaching a processing tool to a processing device according to claim 1, further comprising: adjusting the temperature inside the outer cover after the replacement device attaches the unused processing tool to the processing mechanism and the processing device closes the shutter.

6. 3. The method for attaching a processing tool to a processing device according to claim 1 or 2, wherein the physical quantity is the number of workpieces ground by the processing tool, the amount of wear of the processing tool, or the elapsed time since the processing tool was attached.

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