Wiring devices

Abstract

To provide a wiring accessory capable of improving heat dissipation and electrical insulation of substrate to a case.SOLUTION: The wiring accessory includes a wiring board 11, a case 81, an insulating sheet 61, and a heat dissipation material 71. The wiring board 11 is mounted with a heat-generating member 99. The case 81 accommodates the wiring board 11. The insulating sheet 61 is placed between the wiring board 11 and the case 81. The heat dissipation material 71 has electrical insulation. The heat dissipation material 71 is placed between the wiring board 11 and the case 81. The heat dissipation material 71 electrically insulates the wiring board 11 together with the insulating sheet 61 from the case 81. The heat dissipation material 71 has a thermal conductivity larger than that of the insulating sheet 61. The heat dissipation material 71 is in contact with the case 81.SELECTED DRAWING: Figure 11

Description

[Technical Field]

[0001] The present disclosure relates generally to a wiring device, and more particularly to a wiring device including a case that houses a substrate. [Background technology]

[0002] Patent Document 1 discloses a USB outlet. The USB outlet in Patent Document 1 includes a printed wiring board on which a USB socket is mounted, and a housing that houses the printed wiring board and has a plug insertion hole through which a USB plug connected to the USB socket is inserted.

[0003] The housing includes a body and a cover that are joined together in the vertical direction. The body has an accommodation recess that opens upward, and the cover has a plug insertion hole.

[0004] The storage recess has a pair of inner surfaces facing each other in one direction. Support protrusions that support the printed wiring board are provided on both ends of the body in the one direction, protruding upward, and misalignment prevention means are provided on the upper ends of the support protrusions to prevent misalignment of the printed wiring board. Legs are provided on each end of the printed wiring board in the one direction. The printed wiring board is supported by the support protrusions by positioning the legs on the misalignment prevention means. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-178097 Summary of the Invention [Problem to be solved by the invention]

[0006] In wiring devices such as the USB outlet of Patent Document 1, it is sometimes desirable to improve both the heat dissipation performance of releasing heat generated inside to the outside and the electrical insulation of the board from the case.

[0007] An object of the present disclosure is to improve heat dissipation and electrical insulation of the substrate from the case. [Means for solving the problem]

[0008] A wiring device according to one aspect of the present disclosure includes a substrate, a case, an insulating sheet, and a heat dissipation member. A heat-generating component is mounted on the substrate. The case houses the substrate. The insulating sheet is disposed between the substrate and the case. The heat dissipation member has electrical insulation properties. The heat dissipation member is disposed between the substrate and the case. The heat dissipation member, together with the insulating sheet, electrically insulates the substrate from the case. The heat dissipation member has a higher thermal conductivity than the insulating sheet. The heat dissipation member is provided to cover the heat generating component. The heat dissipation member is the substrate, the heat-generating component, and Contact with the case. [Effects of the Invention]

[0009] The present disclosure has the advantage of enabling improvement in heat dissipation and electrical insulation of the substrate from the case. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view of a wiring device according to an embodiment. [Figure 2] FIG. 2 is an exploded perspective view of the wiring device. [Figure 3] FIG. 3 is an exploded perspective view of the wiring device. [Figure 4] FIG. 4 is a front view of the wiring device. [Figure 5] 5 is a cross-sectional view of the wiring device taken along line VV in FIG. 4. FIG. [Figure 6] 6 is a cross-sectional view of the wiring device taken along line VI-VI in FIG. [Figure 7] 7 is a cross-sectional view of the wiring device taken along line VII-VII in FIG. [Figure 8] 8 is a cross-sectional view of the wiring device taken along line VIII-VIII in FIG. [Figure 9] FIG. 9 is a front view of a main part of the wiring device. [Figure 10] FIG. 10 is a schematic cross-sectional view of a main part of the wiring device. [Figure 11] FIG. 11 is a schematic cross-sectional view of another main part of the wiring device. [Figure 12] FIG. 12 is a block diagram showing a circuit configuration of the wiring device. [Figure 13] FIG. 13 is a schematic cross-sectional view of a main part of the wiring accessory of the first modification. [Figure 14] FIG. 14 is a perspective view of a wiring accessory according to the second modification. DETAILED DESCRIPTION OF THE INVENTION

[0011] A wiring device 100 according to one embodiment of the present disclosure will be described below with reference to Figures 1 to 12. Note that the figures described in the following embodiments are schematic diagrams, and the ratios of sizes and thicknesses of the components in the figures do not necessarily reflect the actual dimensional ratios.

[0012] (1) Overview 1 , a wiring fixture 100 according to the present embodiment is applied to a USB (Universal Serial Bus) outlet for connecting a USB plug 301 provided at the tip of a USB cable 300. The wiring fixture 100 supplies power to an electric device 200 electrically connected via the USB cable 300, or charges a battery provided in the electric device 200. The electric device 200 is, for example, a smartphone, a digital audio player, a laptop computer, or the like. In the present embodiment, as an example, the electric device 200 is a smartphone, and the wiring fixture 100 charges a battery provided in the smartphone.

[0013] The wiring device 100 according to the present embodiment is an indoor wiring device that is attached to, for example, the wall of a building. The building in which the wiring device 100 is installed may be, for example, a detached house, an apartment building, an office, a store, a nursing home, or the like.

[0014] The wiring device 100 is attached to an installation surface (for example, a wall surface of a building) with the power cable 400 electrically connected to the wiring device 100. In the wiring device 100, the USB plug 301 of the USB cable 300 is inserted into an insertion hole 861 formed in the front surface of a cover 85, which will be described later, to electrically connect the USB plug 301, thereby enabling the wiring device 100 to supply power to the electrical device 200, for example.

[0015] The wiring device 100 is a recessed wiring device that is attached to a construction surface using a mounting frame. More specifically, the mounting frame to which the wiring device 100 is attached is fixed to, for example, a recessed box, thereby attaching the wiring device 100 to the construction surface. The recessed box referred to here is a box-shaped member with an open front, and is installed within a wall so that the front surface is exposed forward through a mounting hole formed in the construction surface.

[0016] The wiring fixture 100 as a USB outlet complies with, for example, the USB-PD (Power Delivery) charging standard, particularly USB-PD 3.0 or later. To comply with the USB-PD charging standard, the wiring fixture 100 is required to be able to output a relatively large amount of power, such as 240 W (48 V, 5 A) or 100 W (20 V, 5 A). When the wiring fixture 100 generates a large amount of power, the heat generated by the electronic components of the wiring fixture 100 also increases. Therefore, the wiring fixture 100 is required to have high heat dissipation properties.

[0017] In wiring device 100 of the present embodiment, in order to improve heat dissipation, for example, a part of housing 8 (case 81) is formed from a material with high thermal conductivity, such as metal. In this case, ensuring electrical insulation between electronic components and board 11 inside wiring device 100 and case 81 becomes an issue. Therefore, wiring device 100 of the present embodiment employs the following configuration.

[0018] As shown in FIGS. 2 and 3, the wiring device 100 includes a substrate 11, a case 81, an insulating sheet 61, and a heat dissipation member 71.

[0019] At least one heat-generating component 99 is mounted on the substrate 11. In this disclosure, a "heat-generating component" refers to an electronic component that operates using electricity as energy and generates heat (a predetermined amount or more) during operation. Examples of the heat-generating component 99 include semiconductor switches such as FETs, capacitors, inductors, and transformers.

[0020] The case 81 accommodates the substrate 11. At least a portion of the case 81 is made of metal. In the wiring device 100 of the present embodiment, the entire case 81 is made of metal.

[0021] 2 and 9, the insulating sheet 61 is housed in a case 81. The insulating sheet 61 is disposed between the substrate 11 and the case 81.

[0022] The heat dissipation member 71 is housed in the case 81. The heat dissipation member 71 is disposed between the substrate 11 and the case 81. The heat dissipation member 71 has electrical insulation properties. The heat dissipation member 71, together with the insulating sheet 61, electrically insulates the substrate 11 from the case 81. The heat dissipation member 71 has a higher thermal conductivity than the insulating sheet 61. The heat dissipation member 71 is in contact with the case 81. In this disclosure, "two members are in contact (a first member is in contact with a second member)" means that at least a part of the first member and at least a part of the second member are in contact so as to be thermally coupled. "two members are in contact so as to be thermally coupled" means that the two members are in direct contact, or that the two members are in contact only via another member that has a higher thermal conductivity than the member of the two members that has a relatively lower thermal conductivity.

[0023] The wiring device 100 of the present embodiment includes the insulating sheet 61 and the heat dissipation member 71, and thereby can electrically insulate the board 11 from the case 81 while promoting heat transfer from the board 11 to the case 81. This makes it possible to improve heat dissipation and electrical insulation of the board 11 from the case 81.

[0024] Furthermore, the wiring device 100 of the present embodiment employs the following configuration in order to improve heat dissipation.

[0025] As shown in Figures 2 and 3, the wiring device 100 includes a first substrate 11 as the above-mentioned substrate 11, a first heat dissipation member 71 as the above-mentioned heat dissipation member 71, the above-mentioned case 81, a second substrate 21, and a second heat dissipation member 72.

[0026] The case 81 has a bottom wall 82 and a side wall 83. The case 81 houses the first substrate 11 and the second substrate 21. The case 81 houses the first substrate 11 and the second substrate 21 such that the first substrate 11 faces the bottom wall 82 and the second substrate 21 faces the side wall 83.

[0027] The first heat dissipation member 71 is disposed between the first substrate 11 and the bottom wall 82 of the case 81. The second heat dissipation member 72 is disposed between the second substrate 21 and the side wall 83 of the case 81. As shown in Fig. 7, the normal direction A1 of the first substrate 11 and the normal direction A2 of the second substrate 21 intersect with each other.

[0028] The wiring fixture 100 of the present embodiment includes the first heat dissipation member 71 and the second heat dissipation member 72, thereby facilitating heat transfer from the first board 11 to the case 81 via the first heat dissipation member 71, and facilitating heat transfer from the second board 21 to the case 81 via the second heat dissipation member 72. In addition, the heat from the first board 11 and the heat from the second board 21 can be transferred to different parts of the case 81 (the bottom wall 82 and the side wall 83). This improves heat dissipation.

[0029] (2)Details Hereinafter, details of the wiring device 100 according to this embodiment will be described with reference to FIGS.

[0030] Hereinafter, for convenience of explanation, when the wiring device 100 is attached to a construction surface, the side exposed from the construction surface (the wall surface of a building) will be referred to as the "front," the side located inside the wall will be referred to as the "rear," and the direction along the front-to-back direction will be referred to as the "front-to-back direction D1." Furthermore, the direction perpendicular to the front-to-back direction D1 and along which two insertion holes 861 formed in the top wall 86 of the cover 85 of the housing 8 are aligned will be referred to as the "up-to-down direction D2." In the up-to-down direction, the side inside the housing 8 where the input block 4 described below is located will be referred to as the "bottom," and the opposite side will be referred to as the "top." Furthermore, the direction perpendicular to both the front-to-back direction D1 and the up-to-down direction D2 will be referred to as the "left-to-right direction D3." However, these directions are defined merely for convenience of explanation and do not limit the direction in which the wiring device 100 is used.

[0031] As shown in Figures 1 to 3, the wiring device 100 of this embodiment includes a first block 1, a second block 2, a third block 3, an input block 4, an output block 5, an insulating sheet (first insulating sheet) 61, a heat dissipation member (first heat dissipation member) 71, a second heat dissipation member 72, and a housing 8.

[0032] (2.1) Housing As shown in FIGS. 1 to 3, the housing 8 includes a case 81 and a cover 85. As shown in FIGS.

[0033] The case 81 is made of metal. The case 81 has thermal conductivity. The case 81 has a thermal conductivity greater than that of the insulating plate of the first substrate 11, which will be described later. The case 81 is made of, for example, aluminum. The case 81 is, for example, aluminum die-cast.

[0034] As shown in Figures 2 and 3, the case 81 is box-shaped with an opening 810 on the front side. The opening 810 is roughly rectangular when viewed from the front. The cover 85 is box-shaped with an opening on the rear side. The cover 85 is attached to the case 81 so as to close the opening 810 of the case 81. The case 81 and the cover 85 form an accommodation space within the housing 8 by attaching the cover 85 to the case 81.

[0035] As shown in FIGS. 2 and 3 , the case 81 includes a bottom wall 82 and four side walls 83 (an upper wall 831, a lower wall 832, a left wall 833, and a right wall 834). The upper wall 831 protrudes forward from the upper edge of the bottom wall 82. The lower wall 832 protrudes forward from the lower edge of the bottom wall 82. The left wall 833 protrudes forward from the left edge of the bottom wall 82. The right wall 834 protrudes forward from the right edge of the bottom wall 82. The case 81 is formed by the bottom wall 82 and the four side walls 83 into a rectangular box shape having an opening 810. A void 811 is formed in the lower right portion of the bottom wall 82, extending from the right portion of the lower wall 832 to the lower portion of the right wall 834. The input block 4 is disposed in the void 811.

[0036] 2, a protrusion 813 that protrudes forward is formed on the front surface of the bottom wall 82 at a position above the cavity 811. The protrusion 813 extends in the up-down direction D2. The protrusion amount (dimension in the front-rear direction D1) of the protrusion 813 is greater than the thickness of the first insulating sheet 61. The protrusion amount (dimension in the front-rear direction D1) of the protrusion 813 is smaller than the height (dimension in the front-rear direction D1) of a spacer 92, which will be described later.

[0037] 3, a through-hole 821 for passing the screw 91 is formed in the center of the bottom wall 82. The through-hole 821 is countersunk so that the head of the screw 91 can be accommodated therein.

[0038] As shown in Figures 2 and 3, a corner 836 connecting the upper wall 831 and the left wall 833, a corner 837 connecting the upper wall 831 and the right wall 834, and a corner 838 connecting the lower wall 832 and the left wall 833 are each formed with a through-hole 841 penetrating in the front-to-rear direction D1. A semi-cylindrical tube portion 842 protruding forward is provided on the front surface of each of the corners 836 to 838. The inner surface of each tube portion 842 is connected to the inner surface of the corresponding through-hole 841. A thread groove is formed on the inner surface of each tube portion 842.

[0039] The cover 85 is made of resin, for example, PBT (polybutylene terephthalate) resin.

[0040] As shown in Figures 2 and 3, the cover 85 has a top wall 86 and four side walls 87 (an upper wall 871, a lower wall 872, a left wall 873, and a right wall 874). The upper wall 871 protrudes rearward from the upper edge of the top wall 86. The lower wall 872 protrudes rearward from the lower edge of the top wall 86. The left wall 873 protrudes rearward from the left edge of the top wall 86. The right wall 874 protrudes rearward from the right edge of the top wall 86.

[0041] 1 to 4, the left wall 873 is formed in a stepped shape. The left wall 873 is formed in a stepped shape from the front to the rear and toward the left. Two pairs of protrusions 851 for attaching the housing 8 to the attachment frame are formed on the upper and lower portions of the outer surface (left surface) of the last step of the left wall 873.

[0042] As shown in FIGS. 1 to 4, the right wall 874 is formed in a stepped shape. The right wall 874 is formed in a stepped shape that extends from the front to the rear and to the right. As shown in FIG. 3, a recess 875 that is recessed to the left is formed in the center of the last step of the right wall 874. An attachment piece 852 is disposed in the recess 875. The attachment piece 852 is held by the right wall 874 so as to be flexible in the left-right direction D3. A pair of protrusions 853 for attaching the housing 8 to a mounting frame is formed on the outer surface (right surface) of the attachment piece 852 (see FIG. 4).

[0043] As shown in FIG. 3 , the inner surface of a corner 876 connecting the upper wall 871 and the left wall 873, the inner surface of a corner 877 connecting the upper wall 871 and the right wall 874, the inner surface of a corner 878 connecting the lower wall 872 and the left wall 873, and the inner surface of a corner 879 connecting the lower wall 872 and the right wall 874 are each semi-cylindrical. A thread groove is formed on the inner surface of each of the corners 876 to 879. A screw hole is formed by the inner surfaces of the three tubular portions 842 of the case 81 and the inner surfaces of the three corners 876 to 878 of the cover 85. In addition, a semi-cylindrical tubular portion that protrudes forward and has a thread groove formed on the inner surface is provided on the front surface of the lower right corner of a terminal cover 44 (described later) of the input block 4, and a screw hole is formed by the inner surface of the tubular portion of the terminal cover 44 and the inner surface of the corner 879.

[0044] 1 to 4, the top wall 86 has insertion holes 861 formed in the shape of elongated holes in the left-right direction D3 when viewed from the front. The top wall 86 has two insertion holes 861. The two insertion holes 861 are aligned in the up-down direction D2.

[0045] As shown in FIG. 3, a reinforcing rib 862 is provided around the insertion hole 861 on the rear surface of the top wall 86.

[0046] The case 81 and cover 85 are joined by butting the rear edge of the cover 85 against the opening 810 of the case 81 and screwing screws 90 from the rear into three screw holes formed by the three cylindrical portions 842 and the three corners 876 to 878. The terminal cover 44 is placed in the cavity 811 of the case 81 and screws 90 are screwed from the rear into screw holes formed by the cylindrical portions and corners 879 of the terminal cover 44, thereby joining the cover 85 and terminal cover 44.

[0047] (2.2) Output Block 2 and 3, the output block 5 includes an output board 51, output terminals 52, and electronic components 53. The output block 5 includes two output terminals 52. The output block 5 also includes a plurality of electronic components 53.

[0048] The output board 51 is, for example, a printed wiring board including an insulating plate made of glass-epoxy resin and a pattern conductor formed on the insulating plate.

[0049] The output board 51 is accommodated in the accommodation space of the housing 8 so that the normal direction A0 (see FIGS. 5 to 8) of the output board 51 is along the front-rear direction D1. The output board 51 is shaped like a rectangular plate that is longer vertically than horizontally. The output board 51 has a notch on the left side at the center from top to bottom.

[0050] The output board 51 is held in the housing 8 by being sandwiched between the case 81 and the cover 85 .

[0051] The output board 51 has a first surface 511 and a second surface 512 opposite to the first surface 511. The first surface 511 is the front surface, and the second surface 512 is the rear surface.

[0052] The output terminal 52 is, for example, a USB socket to which the USB plug 301 can be connected. The output terminal 52 is, for example, a USB Type-C terminal. The output terminal 52 is mounted on the first surface 511 of the output board 51.

[0053] When the wiring device 100 is assembled, the two output terminals 52 face the two insertion holes 861 of the cover 85, respectively. Therefore, the USB plug 301 of the USB cable 300 can be connected to the output terminals 52 through the insertion holes 861.

[0054] The plurality of electronic components 53 are mounted on the output board 51. The plurality of electronic components 53 are mounted on a first surface 511 of the output board 51. In this embodiment, all of the plurality of electronic components 53 are mounted on the first surface 511. However, this is not limiting, and some of the plurality of electronic components 53 may be mounted on the second surface 512.

[0055] The plurality of electronic components 53 may include heat-generating components 99. All of the plurality of electronic components 53 may be heat-generating components 99, or some of them may be heat-generating components 99. Not all of the plurality of electronic components 53 may be heat-generating components 99.

[0056] (2.3) First Block 2 and 3, the first block 1 includes a first substrate 11 and an electronic component 12. The first block 1 includes a plurality of electronic components 12.

[0057] Like the output board 51, the first board 11 is a printed wiring board including an insulating board made of, for example, glass-epoxy resin and a pattern conductor formed on the insulating board.

[0058] The first substrate 11 is accommodated in the accommodation space of the housing 8 so that the normal direction A1 (see FIGS. 5 to 7) of the first substrate 11 is aligned with the front-rear direction D1. The normal direction A1 of the first substrate 11 is aligned with the normal direction A0 of the output substrate 51. The first substrate 11 is disposed behind and parallel to the output substrate 51. The first substrate 11 is shaped like a rectangular plate that is longer vertically than horizontally. The first substrate 11 has a rectangular cutout in the lower right portion.

[0059] The first substrate 11 has a first surface 111 and a second surface 112 opposite to the first surface 111. The first surface 111 is the front surface, and the second surface 112 is the rear surface. The first substrate 11 has a through-hole 113 in the center.

[0060] The first substrate 11 is fixed to the case 81 of the housing 8 by screws 91. More specifically, as shown in FIGS. 5 and 6 , a spacer 92 is disposed between the bottom wall 82 of the case 81 and the first substrate 11. The spacer 92 has a through hole 921 penetrating in the front-rear direction D1. The spacer 92 is disposed at a position corresponding to the through hole 113 of the first substrate 11. Then, from the rear of the bottom wall 82, a screw 91 is passed through the through hole 821 of the bottom wall 82, the through hole 921 of the spacer 92, and the through hole 113 of the first substrate 11. Then, a nut 93 is fastened to the tip of the screw 91 on the first surface 111 side of the first substrate 11. In this way, the first substrate 11 is fixed to the housing 8 by the screw 91. In the front-rear direction D1, the distance between the bottom wall 82 of the case 81 and the first substrate 11 is maintained at the height of the spacer 92 (the dimension in the front-rear direction D1).

[0061] The screws 91 and the spacers 92 are made of, for example, resin. The screws 91 and the spacers 92 are electrically insulating. This makes it possible to increase the insulation distance between the first substrate 11 and the bottom wall 82 compared to when the screws 91 or the spacers 92 are conductive, and improves the electrical insulation of the first substrate 11 from the case 81. Furthermore, the nuts 93 are made of, for example, resin and are electrically insulating. This makes it possible to further improve the electrical insulation of the case 81 from the first substrate 11.

[0062] The first substrate 11 is electrically connected to the output substrate 51 of the output block 5. The first substrate 11 is electrically connected to the output substrate 51 via connection terminals and electric wires.

[0063] A plurality of electronic components 12 are mounted on the first substrate 11. Some of the plurality of electronic components 12 are mounted on a first surface 111 of the first substrate 11, and the remaining of the plurality of electronic components 12 are mounted on a second surface 112 of the first substrate 11.

[0064] The plurality of electronic components 12 may include a heat-generating component 99. All of the plurality of electronic components 12 may be heat-generating components 99, or some of them may be heat-generating components 99. In other words, at least one heat-generating component 99 is mounted on the first substrate 11.

[0065] (2.4) Second Block 2 and 3, the second block 2 includes a second substrate 21 and an electronic component 22. The second block 2 includes a plurality of electronic components 22.

[0066] Like the output board 51, the second board 21 is a printed wiring board including an insulating board made of, for example, glass-epoxy resin and a pattern conductor formed on the insulating board.

[0067] The second substrate 21 is accommodated in the accommodation space of the housing 8 so that the normal direction A2 (see FIG. 7) of the second substrate 21 is aligned with the left-right direction D3. The normal direction A2 of the second substrate 21 intersects with the normal direction A1 of the first substrate 11. In this embodiment, the normal direction A2 of the second substrate 21 is perpendicular to the normal direction A1 of the first substrate 11. As shown in FIG. 3, the second substrate 21 is disposed in the upper left portion of the first surface 111 of the first substrate 11 in a direction perpendicular to the first substrate 11. The second substrate 21 has a rectangular plate shape that is longer vertically than longitudinally.

[0068] In the present disclosure, "orthogonal" does not only mean a state in which they intersect at a 90-degree angle, but also means a state in which they are approximately orthogonal within a certain margin of error. In other words, the angle between the normal direction A1 of the first substrate 11 and the normal direction A2 of the second substrate 21 falls within a certain margin of error (for example, 10 degrees or less) from 90 degrees. In the present embodiment, as an example, the angle between the normal direction A1 of the first substrate 11 and the normal direction A2 of the second substrate 21 is 90 degrees.

[0069] The second substrate 21 has a first surface 211 and a second surface 212 opposite to the first surface 211. The first surface 211 is the left surface, and the second surface 212 is the right surface.

[0070] Second substrate 21 is electrically connected to first substrate 11. More specifically, second substrate 21 has pin connector 23. Furthermore, first substrate 11 has terminal 13 to which pin connector 23 is connected. When pin connector 23 is connected to terminal 13, first substrate 11 and second substrate 21 are electrically connected.

[0071] The plurality of electronic components 22 are mounted on the second substrate 21. Some of the plurality of electronic components 22 are mounted on a first surface 211 of the second substrate 21, and the remaining of the plurality of electronic components 22 are mounted on a second surface 212 of the second substrate 21.

[0072] The plurality of electronic components 22 may include heat-generating components 99. All of the plurality of electronic components 22 may be heat-generating components 99, or some of them may be heat-generating components 99. In other words, at least one heat-generating component 99 is mounted on the second substrate 21. Note that not all of the plurality of electronic components 22 need to be heat-generating components 99.

[0073] (2.5) Third Block 2 and 3, the third block 3 includes a third substrate 31 and an electronic component 32. The third block 3 includes a plurality of electronic components 32.

[0074] Similar to the output board 51, the third board 31 is a printed wiring board including an insulating board made of, for example, glass-epoxy resin and a pattern conductor formed on the insulating board.

[0075] The third substrate 31 is accommodated in the accommodation space of the housing 8 so that a normal direction A3 (see FIG. 5) of the third substrate 31 is aligned with the up-down direction D2. The normal direction A3 of the third substrate 31 intersects with the normal direction A1 of the first substrate 11. In this embodiment, the normal direction A3 of the third substrate 31 is perpendicular to the normal direction A1 of the first substrate 11. The normal direction A3 of the third substrate 31 also intersects with the normal direction A2 of the second substrate 21. In this embodiment, the normal direction A3 of the third substrate 31 is perpendicular to the normal direction A2 of the second substrate 21. The third substrate 31 is disposed in the lower left portion of the first surface 111 of the first substrate 11, in a direction perpendicular to the first substrate 11. The third substrate 31 is shaped like a rectangular plate that is longer in the front-to-back direction than in the left-to-right direction.

[0076] The third substrate 31 has a first surface 311 and a second surface 312 opposite to the first surface 311. The first surface 311 is the upper surface, and the second surface 312 is the lower surface.

[0077] The third substrate 31 is electrically connected to the first substrate 11. More specifically, the third substrate 31 has a pin connector. The first substrate 11 has terminals to which the pin connector is connected. The pin connector is connected to the terminals of the first substrate 11, thereby electrically connecting the first substrate 11 and the third substrate 31.

[0078] The plurality of electronic components 32 are mounted on the third substrate 31. The plurality of electronic components 32 are mounted on the first surface 311 of the third substrate 31. In this embodiment, all of the plurality of electronic components 32 are mounted on the first surface 311. However, this is not limiting, and some of the plurality of electronic components 32 may be mounted on the second surface 312.

[0079] The plurality of electronic components 32 may include heat-generating components 99. All of the plurality of electronic components 32 may be heat-generating components 99, or some of them may be heat-generating components 99. Not all of the plurality of electronic components 32 may be heat-generating components 99.

[0080] (2.6) Input Block As shown in FIGS. 2, 3, and 8, the input block 4 includes an input board 41, a pair of input terminals 42 (only one is shown in FIG. 8), an electronic component 43, and a terminal cover 44.

[0081] Like the output board 51, the input board 41 is a printed wiring board including an insulating board made of, for example, glass-epoxy resin and a pattern conductor formed on the insulating board.

[0082] The input board 41 is accommodated in the accommodation space of the housing 8 so that the normal direction A10 of the input board 41 is along the front-rear direction D1. In this embodiment, the normal direction A10 of the input board 41 is along the normal direction A0 of the output board 51.

[0083] The input board 41 has a first surface 411 and a second surface 412 opposite to the first surface 411. The first surface 411 is the front surface, and the second surface 412 is the rear surface.

[0084] The input board 41 is electrically connected to the third board 31. More specifically, the input board 41 is electrically connected to the third board 31 by a pair of electric wires 45.

[0085] The pair of input terminals 42 are mounted on the input board 41. The pair of input terminals 42 are mounted on a second surface 412 of the input board 41. The pair of input terminals 42 are connected to the pair of power lines 401 (see FIG. 1) of the power cable 400, respectively.

[0086] Each of the pair of input terminals 42 is a so-called quick-connect terminal. Input terminal 42 includes, for example, a flat terminal portion 421 and a terminal fitting 422 formed by bending a metal sheet made of a copper alloy. Terminal fitting 422 includes a pressing portion 423 that uses elastic force to press power line 401 against terminal portion 421, and a locking portion 424 that prevents power line 401 from falling out.

[0087] The input block 4 further includes a release button 46. The release button 46 is a button for releasing the connection between the pair of input terminals 42 and the pair of power lines 401. In other words, by operating the release button 46 while the pair of input terminals 42 and the pair of power lines 401 are connected, the locking portion 424 separates from the power lines 401, thereby making it possible to remove the pair of power lines 401 from the pair of input terminals 42.

[0088] The electronic component 43 is mounted on the input board 41. The electronic component 43 is mounted on a first surface 411 of the input board 41. However, this is not limiting, and the electronic component 43 may be mounted on a second surface 412. Furthermore, a plurality of electronic components 43 may be mounted on the input board 41.

[0089] The terminal cover 44 is made of resin. For example, the terminal cover 44 is formed of PBT resin. The terminal cover 44 is arranged on the second surface 412 side of the input board 41. The terminal cover 44 has a rectangular box shape. The terminal cover 44 covers the pair of input terminals 42 from the rear and accommodates the pair of input terminals 42 inside.

[0090] The terminal cover 44 is disposed in a cavity 811 of the case 81. The terminal cover 44 has a shape in which the rear surface of the terminal cover 44 is connected to the rear surface of the case 81, the right surface of the terminal cover 44 is connected to the right surface of the case 81, and the bottom surface of the terminal cover 44 is connected to the bottom surface of the case 81 without any steps. Also, as described above, the front surface of the lower right corner of the terminal cover 44 is provided with a semi-cylindrical tube portion that protrudes forward and has a threaded inner surface.

[0091] 3, a pair of insertion holes 441 are formed in the rear wall of the terminal cover 44, into which the pair of power lines 401 are inserted. An operation hole 442 is formed in the rear wall of the terminal cover 44, into which a tool (for example, a flathead screwdriver) for operating the release button 46 is inserted.

[0092] (2.7) Insulation sheet As described above, the wiring device 100 includes the insulating sheet (first insulating sheet) 61. As shown in FIGS. 2 and 3, the wiring device 100 further includes a second insulating sheet 65 and a third insulating sheet 66.

[0093] The first insulating sheet 61 is made of, for example, polycarbonate. The first insulating sheet 61 has a rectangular box shape that fits along the inner surface of the case 81. The first insulating sheet 61 is disposed along the inner surface of the case 81.

[0094] As shown in FIGS. 2, 3 and 9, the first insulating sheet 61 has a bottom portion 62 and four side portions 63 (an upper portion 631, a lower portion 632, a left side portion 633, and a right side portion 634).

[0095] The bottom 62 has a shape that follows the front surface of the bottom wall 82 of the case 81. The bottom 62 has a rectangular notch 628 that corresponds to the cavity 811 in the lower right portion thereof.

[0096] A through-hole 629 for inserting the screw 90 is formed in the center of the bottom 62 at a position corresponding to the through-hole 821 of the bottom wall 82. The size of the through-hole 629 is larger than the size of the spacer 92.

[0097] The bottom 62 has a plurality of (here, five) openings 610. The plurality of openings 610 include two rectangular openings 611, 612 formed in the upper left portion of the bottom 62, a rectangular opening 613 formed in the lower left portion of the bottom 62, a rectangular opening 614 formed in the upper right portion of the bottom 62 and extending diagonally downward to the left, and a rectangular opening 615 formed in the lower right portion of the bottom 62 and connected to the notch 628. The opening 615 is formed at a position corresponding to the protrusion 813 of the bottom wall 82 of the case 81, and has a shape that allows the protrusion 813 to fit into it.

[0098] The upper portion 631 is shaped to fit along the underside of the upper wall 831 of the case 81. The lower portion 632 is shaped to fit along the upper side of the lower wall 832 of the case 81. The left portion 633 is shaped to fit along the right side of the left wall 833 of the case 81. The right portion 634 is shaped to fit along the left side of the right wall 834 of the case 81. The upper portion 631, the lower portion 632, the left portion 633, and the right portion 634 do not have any openings. The bottom portion 62 and the four side portions 63 are integrally formed.

[0099] The first insulating sheet 61 further has a protruding portion 635 that extends along the upper side of the notch 628 in the left-right direction D3 and protrudes forward.

[0100] The first insulating sheet 61, together with the first heat dissipation member 71, electrically insulates the first substrate 11 from the case 81. The first insulating sheet 61 also electrically insulates the second substrate 21 from the case 81. The first insulating sheet 61 electrically insulates the third substrate 31 from the case 81. The first insulating sheet 61 suppresses external static electricity, lightning surges, and the like that are applied to the first to third substrates 11 to 31.

[0101] The second insulating sheet 65 is made of, for example, polycarbonate. As shown in FIGS. 2 and 3 , the second insulating sheet 65 is disposed between the output board 51 and the first board 11. The second insulating sheet 65 is disposed between the output board 51 and the electronic components 12 mounted on the first board 11. The second insulating sheet 65 electrically insulates the output board 51 from the electronic components 12.

[0102] The third insulating sheet 66 is made of, for example, polycarbonate. As shown in FIGS. 2 and 3 , the third insulating sheet 66 is disposed between the output board 51 and the first board 11. The third insulating sheet 66 is disposed between the output board 51 and the electronic components 32 mounted on the third board 31. The third insulating sheet 66 electrically insulates the output board 51 from the electronic components 32.

[0103] (2.8) Heat dissipation material As described above, the wiring device 100 includes a heat dissipation member (first heat dissipation member) 71. The wiring device 100 also includes a second heat dissipation member 72. As shown in FIGS. 2 and 3, the wiring device 100 also includes an additional heat dissipation member 73.

[0104] The first heat dissipation member 71 has electrical insulation properties. The first heat dissipation member 71 has thermal conductivity. The first heat dissipation member 71 is sheet-shaped. The first heat dissipation member 71 is a thermal sheet. The first heat dissipation member 71 is made of, for example, silicon. The first heat dissipation member 71 has stretchability (elasticity). Because the first heat dissipation member 71 is a thermal sheet, it is possible to achieve a longer lifespan compared to, for example, a volatile liquid such as grease.

[0105] The first heat dissipation member 71 is disposed between the bottom wall 82 of the case 81 and the first substrate 11. As described above, the first insulating sheet 61 is disposed along the inner surface of the case 81, and therefore the first heat dissipation member 71 is disposed between the bottom 62 of the first insulating sheet 61 and the first substrate 11. The first heat dissipation member 71 is disposed at a position corresponding to the opening 610 of the first insulating sheet 61. From another perspective, the first insulating sheet 61 is disposed along the inner surface of the case 81 in a portion of the case 81 that is not in (direct) contact with the first heat dissipation member 71.

[0106] The first heat dissipation member 71 is disposed so as to fill the opening 610. The first heat dissipation member 71 is sandwiched between the periphery of the opening 610 in the first insulating sheet 61 and the first substrate 11. The first heat dissipation member 71, together with the first insulating sheet 61, electrically insulates the first substrate 11 from the case 81.

[0107] The first heat dissipation member 71 has a plurality of (here, three) sheet pieces 711, 712, and 713. Each of the sheet pieces 711, 712, and 713 is sheet-shaped. The plurality of sheet pieces 711 to 713 are arranged apart from one another. However, this is not limiting, and the plurality of sheet pieces 711 to 713 may be arranged so that some of them overlap each other. Alternatively, the plurality of sheet pieces 711 to 713 may be formed integrally.

[0108] 9, sheet piece 711 is placed at a position corresponding to openings 611 and 612, filling openings 611 and 612. Sheet piece 712 is placed at a position corresponding to opening 613, filling opening 613. Sheet piece 713 is placed at a position corresponding to openings 614 and 615, filling openings 614 and 615. All of the multiple (five) openings 611 to 615 are filled by the multiple (three) sheet pieces 711 to 713.

[0109] In its natural, unstretched state, the first heat dissipation member 71 has a thickness (dimension in the front-rear direction D1) greater than the height (dimension in the front-rear direction D1) of the spacer 92. When the first heat dissipation member 71 is disposed between the first insulating sheet 61 and the first substrate 11 and the first substrate 11 is fixed to the bottom wall 82 with the screws 91, the first heat dissipation member 71 is compressed in the front-rear direction D1 by being sandwiched between the first insulating sheet 61 and the first substrate 11. However, the portion of the first heat dissipation member 71 corresponding to the opening 610 is not compressed and protrudes into the opening 610, contacting the bottom wall 82. As a result, the front surface of the first heat dissipation member 71 contacts the second surface 112 of the first substrate 11, and the rear surface of the first heat dissipation member 71 contacts the bottom wall 82 (see FIG. 7 ). That is, the first heat dissipation member 71 contacts the bottom wall 82 of the case 81.

[0110] 3 and 5, sheet piece 711 of first heat dissipation member 71 is in contact with electronic component 12 mounted on second surface 112 of first substrate 11. This makes it possible to further improve heat dissipation. This point will be described in more detail with reference to FIG. 10.

[0111] As shown in FIG. 10 , an electronic component 12, which is a heat-generating component 99, is mounted on the second surface 112 of the first substrate 11. The first substrate 11 is disposed so that the second surface 112 faces the bottom wall 82 of the case 81. The sheet piece 711 of the first heat dissipation member 71 is disposed between the first substrate 11 and the bottom wall 82 of the case 81, and covers the entire heat-generating component 99. In other words, the heat-generating component 99 is embedded in the first heat dissipation member 71. As a result, the first heat dissipation member 71 is in contact with the heat-generating component 99. The first heat dissipation member 71 is also in contact with the first substrate 11.

[0112] As shown in FIG. 10, the sheet piece 711 of the first heat dissipation member 71 is in contact with the bottom wall 82 of the case 81 through the opening 610 of the first insulating sheet 61.

[0113] In this way, the first heat dissipation member 71 comes into contact with the case 81 and the heat-generating component 99, which promotes the transfer of heat from the heat-generating component 99 to the case 81, thereby enabling further improvement in heat dissipation.

[0114] It is preferable that the first heat dissipation member 71 be in planar contact with the case 81. It is preferable that the entire portion of the first heat dissipation member 71 that corresponds to the opening 610 of the first insulating sheet 61 be in planar contact with the case 81. This makes it possible to further improve heat dissipation.

[0115] 6, the sheet piece 713 of the first heat dissipation member 71 is disposed at a position corresponding to the opening 615 of the first insulating sheet 61. A protrusion 813 on the bottom wall 82 of the case 81 fits into the opening 615, and the sheet piece 713 is in contact with the protrusion 813. This makes it possible to further improve heat dissipation compared to a case where the protrusion 813 is not present. This point will be described in more detail with reference to FIG. 11.

[0116] As shown in FIG. 11 , an electronic component 12, which is a heat-generating component 99, is mounted on a first surface 111 of a first substrate 11. The first substrate 11 is disposed such that a second surface 112 faces a bottom wall 82 of a case 81. The bottom wall 82 of the case 81 has a protrusion 813 that protrudes toward the first substrate 11. The protrusion 813 is fitted into an opening 610 of a first insulating sheet 61. The sheet piece 713 of the first heat dissipation member 71 is disposed between the first substrate 11 and the protrusion 813 of the case 81. This brings the first heat dissipation member 71 into contact with the first substrate 11. The first heat dissipation member 71 also comes into contact with the case 81 (protrusion 813). This allows heat generated by the heat-generating component 99 to be transferred to the first substrate 11, and heat from the first substrate 11 to be transferred to the case 81 via the first heat dissipation member 71.

[0117] 11, when the case 81 has the protrusion 813, the distance R1 (corresponding to the thickness of the first heat dissipation member 71) of the heat transfer path along which heat is transferred from the first substrate 11 to the case 81 is shorter than the distance R0 of the heat transfer path when the case 81 does not have the protrusion 813. Therefore, when the case 81 has the protrusion 813, the thermal resistance of the heat transfer path between the first substrate 11 and the case 81 is smaller than when the case 81 does not have the protrusion 813. This promotes the transfer of heat from the first substrate 11 to the case 81, making it possible to further improve heat dissipation.

[0118] The first substrate 11 preferably has a copper inlay 114 as shown in Fig. 11. That is, the first substrate 11 is a copper inlay substrate. The copper inlay 114 is provided in a portion of the first substrate 11 where the heat-generating component 99 is mounted. The first heat dissipation member 71 is in contact with the copper inlay 114. In this way, the first heat dissipation member 71 is in contact with the copper inlay 114 of the first substrate 11, thereby making it possible to further improve heat dissipation.

[0119] In the wiring fixture 100 of the present embodiment, at least one of a first insulating sheet 61 and a first heat dissipation member 71 is interposed between the first substrate 11 and the case 81 over the entire second surface 112 of the first substrate 11. More specifically, as shown in FIG. 5 , assuming an imaginary line X1 extending from the first substrate 11 to the bottom wall 82 of the case 81 along the front-rear direction D1, the imaginary line X1 intersects with at least one of the first insulating sheet 61 and the first heat dissipation member 71 no matter what point on the first substrate 11 is the starting point. That is, any imaginary line X1 extending from the first substrate 11 to the case 81 along the direction in which the first substrate 11 and the case 81 face each other (the front-rear direction D1) intersects with at least one of the first insulating sheet 61 and the first heat dissipation member 71. This increases the insulation distance between the first substrate 11 and the case 81, thereby improving the electrical insulation of the first substrate 11 from the case 81.

[0120] The second heat dissipation member 72 has electrical insulation properties. The second heat dissipation member 72 has thermal conductivity. The second heat dissipation member 72 is sheet-shaped. The second heat dissipation member 72 is a thermal sheet. The second heat dissipation member 72 is made of, for example, silicon. The second heat dissipation member 72 has stretchability (elasticity).

[0121] The second heat dissipation member 72 is disposed between the side wall 83 (left wall 833) of the case 81 and the second board 21. Since the first insulating sheet 61 is disposed along the inner surface of the case 81 as described above, the second heat dissipation member 72 is disposed between the left side portion 633 of the first insulating sheet 61 and the second board 21.

[0122] The second heat dissipation member 72 is sandwiched between the left side portion 633 of the first insulating sheet 61 and the second substrate 21. As a result, the electronic components 22 mounted on the first surface 211 of the second substrate 21 are embedded in the second heat dissipation member 72, and the second heat dissipation member 72 comes into contact with the electronic components 22. In addition, the right surface of the second heat dissipation member 72 comes into contact with the first surface 211 of the second substrate 21.

[0123] In this way, the wiring device 100 includes the first heat dissipation member 71 and the second heat dissipation member 72, thereby forming two heat transfer paths for dissipating heat generated from the heat-generating component 99 to the case 81. This makes it possible to further improve heat dissipation performance.

[0124] The additional heat dissipation member 73 has electrical insulation properties. The additional heat dissipation member 73 has thermal conductivity. The additional heat dissipation member 73 is sheet-shaped. The additional heat dissipation member 73 is a thermal sheet. The additional heat dissipation member 73 is made of silicon, for example. The additional heat dissipation member 73 has stretchability (elasticity).

[0125] 7, the additional heat dissipation member 73 is disposed between the cover 85 and the output board 51. The additional heat dissipation member 73 is disposed so as to cover the electronic components 53 mounted on the output board 51. The additional heat dissipation member 73 is sandwiched between the cover 85 and the output board 51. As a result, the electronic components 53 mounted on the first surface 511 of the output board 51 come into contact with the lower surface of the additional heat dissipation member 73.

[0126] The wiring device 100 is provided with the additional heat dissipation member 73, so that heat generated from the electronic components 53 mounted on the output board 51 can be dissipated to the housing 8 via the additional heat dissipation member 73. This makes it possible to further improve heat dissipation performance.

[0127] (2.9) Circuit configuration The circuit configuration of the wiring accessory 100 (USB outlet) will be described with reference to FIG.

[0128] As shown in FIG. 12, the wiring device 100 includes an input circuit 101, a common filter 102, a diode bridge 103, a normal filter 104, a DC / DC converter 105, an output circuit 106, and a control circuit 107.

[0129] The input circuit 101 is connected to an external power supply 110. The external power supply 110 is an AC power supply. The input circuit 101 has a pair of input terminals 42 in the input block 4. A power cable 400 is connected to the pair of input terminals 42, thereby connecting the input circuit 101 to the external power supply 110. AC input power is input to the input circuit 101 from the external power supply 110.

[0130] The common filter 102 is connected to the input circuit 101. The common filter 102 reduces common mode noise. The common filter 102 is configured by electronic components 32 mounted on the third substrate 31. The electronic components 32 that configure the common filter 102 may include a capacitor and a coil (choke coil).

[0131] Diode bridge 103 is connected to input circuit 101 via common filter 102. Diode bridge 103 converts AC input power into pulsating DC power. Diode bridge 103 is composed of electronic components 12 mounted on first substrate 11. Electronic components 12 constituting diode bridge 103 may include diodes.

[0132] The normal filter 104 is connected to the output terminal of the diode bridge 103. The normal filter 104 reduces normal mode noise. The normal filter 104 is configured by an electronic component 22 mounted on the second substrate 21 and an electronic component 12 mounted on the first substrate 11. The electronic components 12 and 22 that configure the normal filter 104 may include capacitors.

[0133] DC / DC converter 105 is connected to the output terminal of diode bridge 103 via normal filter 104. Here, DC / DC converter 105 is an isolated DC / DC converter equipped with an isolation transformer. DC / DC converter 105 converts the pulsating DC power generated by diode bridge 103 into DC power having a desired voltage value. DC / DC converter 105 is composed of electronic components 12 mounted on first substrate 11. Electronic components 12 constituting DC / DC converter 105 may include an isolation transformer, a semiconductor switch, and a capacitor. The isolation transformer and semiconductor switch equipped in DC / DC converter 105 are heat-generating components 99.

[0134] The output circuit 106 is connected to the DC / DC converter 105. The output circuit 106 has two output terminals 52 in the output block 5. The output circuit 106 outputs the DC power generated by the DC / DC converter 105 to the USB plug 301 connected to the output terminal 52.

[0135] The control circuit 107 is composed of electronic components 12 mounted on the first substrate 11 and electronic components 53 mounted on the output substrate 51. The control circuit 107 controls the operation of the DC / DC converter 105 (turning on and off of the semiconductor switches provided in the DC / DC converter 105). The control circuit 107 controls the operation of the DC / DC converter 105 based on information (charging voltage, charging current, etc.) received from the electric device 200 connected to the output terminal 52.

[0136] As described above, the wiring device 100 includes an input circuit 101, a conversion circuit (diode bridge 103 and DC / DC converter 105), and an output circuit 106. The input circuit 101 is connected to an external power supply 110 and receives AC input power from the external power supply 110. The conversion circuit is made up of a plurality of electronic components including a heat-generating component 99, and converts the input power into DC output power. The output circuit 106 outputs the output power. This enables the wiring device 100 to supply output power to the electric device 200.

[0137] (3) Variations The above embodiment is merely one of various embodiments of the present disclosure. The above embodiment can be modified in various ways depending on the design, etc., as long as the object of the present disclosure can be achieved. Modified examples of the embodiment are listed below. Hereinafter, the above embodiment may also be referred to as a "basic example." The basic example and the modified examples described below can be applied in appropriate combination.

[0138] (3.1) Variation 1 The wiring fixture of this modified example will be described with reference to Fig. 13. In the wiring fixture of this modified example, components similar to those of the wiring fixture 100 of the basic example will be denoted by the same or corresponding reference numerals, and descriptions thereof will be omitted as appropriate.

[0139] 13 , bottom wall 82 of case 81 has a recessed portion 814 recessed away from first board 11. Recessed portion 814 is formed at a position corresponding to opening 610 of first insulating sheet 61. First heat dissipation member 71 is disposed between first board 11 and bottom wall 82 of case 81 so as to be fitted into recessed portion 814. That is, first heat dissipation member 71 is in contact with first board 11 and case 81 (recessed portion 814). Heat generated by heat-generating component 99 is transferred to first board 11, and heat from first board 11 is transferred to case 81 via first heat dissipation member 71.

[0140] When the case 81 has the recessed portion 814, the distance R2 (corresponding to the thickness of the first heat dissipation member 71) of the heat transfer path along which heat is transferred from the first substrate 11 to the case 81 is longer than the distance R0 of the heat transfer path when the case 81 does not have the protruding portion 813. Therefore, when the case 81 has the recessed portion 814, the thermal resistance of the heat transfer path between the first substrate 11 and the case 81 is greater than when the case 81 does not have the recessed portion 814. This makes it more difficult for heat to be transferred from the first substrate 11 to the case 81, making it possible to prevent an excessive temperature rise in the case 81.

[0141] (3.2) Variation 2 A wiring fixture 100A of this modified example will be described with reference to Fig. 14. In wiring fixture 100A of this modified example, components similar to those of wiring fixture 100 of the basic example will be denoted by the same or corresponding reference numerals, and descriptions thereof will be omitted as appropriate.

[0142] In a wiring accessory 100A of this modified example, as shown in FIG. 14, a housing 8A includes a case 81A and a cover 85A.

[0143] The case 81A has a bottom wall 82A, a first side wall (right wall 834A), and a second side wall (left wall 833A). The first side wall (right wall 834A) and the second side wall (left wall 833A) intersect with the bottom wall 82A. The case 81A houses the first board 11A and the second board 21A. The case 81A houses the first board 11A and the second board 21A so that the first board 11A faces the first side wall (right wall 834A) and the second board 21A faces the second side wall (left wall 833A).

[0144] Heat-generating components 99 (see FIG. 2, etc.) are mounted on the first substrate 11A, and heat-generating components 99 are mounted on the second substrate 21A.

[0145] The first heat dissipation member 71A is disposed between the first substrate 11A and the first side wall (right wall 834A). The first heat dissipation member 71A is in contact with the first substrate 11A. The second heat dissipation member 72A is disposed between the second substrate 21A and the second side wall (left wall 833A). The second heat dissipation member 72A is in contact with the second substrate 21A. The first substrate 11A faces the second substrate 21A.

[0146] In wiring fixture 100A of this modified example, similar to wiring fixture 100 of the basic example, two heat transfer paths are formed to dissipate heat generated from heat-generating component 99 to case 81A, thereby further improving heat dissipation.

[0147] (3.3) Other Modifications In one modification, the wiring apparatus 100 may include one or more than two output terminals 52.

[0148] In one modification, the wiring device 100 may include the first insulating sheet 61, and may not include one or both of the second insulating sheet 65 and the third insulating sheet 66.

[0149] In one modified example, the wiring apparatus 100 may not include the additional heat dissipation member 73.

[0150] In one modification, the first heat dissipation member 71 does not need to be in contact with the first substrate 11 as long as it is in contact with the heat-generating component 99.

[0151] In one modified example, the peripheral edge of the opening 610 of the first insulating sheet 61 may overlap the peripheral edge of the protruding portion 813 of the case 81. In other words, the opening 610 of the first insulating sheet 61 may be formed smaller than the protruding portion 813, and the peripheral edge of the opening 610 of the first insulating sheet 61 may rest on the protruding portion 813 of the case 81 and be sandwiched between the protruding portion 813 and the first heat dissipation member 71.

[0152] In one modified example, the peripheral edge of opening 610 of first insulating sheet 61 may overlap the peripheral edge of recessed portion 814 of case 81. In other words, opening 610 of first insulating sheet 61 may be formed smaller than recessed portion 814, and the peripheral edge of opening 610 of first insulating sheet 61 may extend into recessed portion 814 of case 81 and be sandwiched between recessed portion 814 and first heat dissipation member 71.

[0153] In one modified example, the second heat dissipation member 72 may be in contact with the side wall 83 of the case 81. For example, the left side portion 633 of the first insulating sheet 61 may have an opening 610, and the second heat dissipation member 72 may be arranged to fill the opening 610.

[0154] In one modified example, the heat-generating component 99 may include a resin mold. In other words, the contact between the first heat-dissipating member 71 and the heat-generating component 99 may include the contact between the first heat-dissipating member 71 and the resin mold of the heat-generating component 99.

[0155] In one modified example, the material of the case 81 is not limited to metal, but may be any material that has thermal conductivity and electrical conductivity.

[0156] (4) Summary As is clear from the above-described embodiments and modifications, the present specification discloses the following aspects.

[0157] (4.1) First Summary A wiring device (100, 100A) of a first aspect includes a board (11, 11A), a case (81, 81A), an insulating sheet (61), and a heat dissipation member (71). A heat-generating component (99) is mounted on the board (11, 11A). The case (81, 81A) houses the board (11, 11A). The insulating sheet (61) is disposed between the board (11, 11A) and the case (81, 81A). The heat dissipation member (71) has electrical insulation properties. The heat dissipation member (71) is disposed between the board (11, 11A) and the case (81, 81A). The heat dissipation member (71), together with the insulating sheet (61), electrically insulates the board (11, 11A) from the case (81, 81A). The heat dissipation member (71) has a higher thermal conductivity than the insulating sheet (61). The heat dissipation member (71) is in contact with the case (81, 81A).

[0158] According to this aspect, it is possible to improve heat dissipation and electrical insulation of the substrate (11, 11A) from the case (81, 81A).

[0159] In the wiring accessories (100, 100A) of the second embodiment, the heat dissipation member (71) contacts the heat-generating component (99) in the first embodiment.

[0160] According to this aspect, it is possible to further improve the heat dissipation performance.

[0161] In the wiring device (100, 100A) of the third aspect, in the first or second aspect, the heat dissipation member (71) is in contact with the board (11, 11A).

[0162] According to this aspect, it is possible to further improve the heat dissipation performance.

[0163] In the wiring device (100, 100A) of the fourth aspect, in the third aspect, the substrate (11, 11A) has a copper inlay (114) in a portion where the heat-generating component (99) is mounted. The heat dissipation member (71) is in contact with the copper inlay (114).

[0164] According to this aspect, it is possible to further improve the heat dissipation performance.

[0165] In the wiring device (100, 100A) of the fifth aspect, in any one of the first to fourth aspects, the insulating sheet (61) is arranged along the inner surface of the case (81, 81A) in a portion of the case (81, 81A) that is not in contact with the heat dissipation member (71).

[0166] According to this embodiment, it is possible to further improve the electrical insulation of the substrate (11, 11A) from the case (81, 81A).

[0167] In the wiring device (100, 100A) of the sixth aspect, in the fifth aspect, the insulating sheet (61) has an opening (610). The heat dissipation member (71) is arranged at a position corresponding to the opening (610) of the insulating sheet (61) so as to fill the opening (610).

[0168] According to this embodiment, it is possible to further improve the electrical insulation of the substrate (11, 11A) from the case (81, 81A).

[0169] In the wiring device (100, 100A) of the seventh aspect, in the sixth aspect, the heat dissipation member (71) is sandwiched between the peripheral edge of the opening (610) in the insulating sheet (61) and the substrate (11, 11A).

[0170] According to this embodiment, it is possible to further improve the electrical insulation of the substrate (11, 11A) from the case (81, 81A).

[0171] In the wiring device (100, 100A) of the eighth aspect, in any one of the first to seventh aspects, the case (81, 81A) has a protrusion (813) protruding toward the board (11, 11A). The heat dissipation member (71) is in contact with the protrusion (813).

[0172] According to this aspect, it is possible to further improve the heat dissipation performance.

[0173] In a wiring device (100, 100A) of a ninth aspect, in any one of the first to eighth aspects, the case (81, 81A) has a recessed portion (814) recessed away from the board (11, 11A). The heat dissipation member (71) is fitted into the recessed portion (814).

[0174] According to this embodiment, it is possible to prevent the temperature of the case (81, 81A) from rising excessively.

[0175] In a wiring device (100, 100A) of a tenth aspect, in any one of the first to ninth aspects, the heat dissipation member (71) is a thermal sheet.

[0176] According to this aspect, it is possible to extend the life of the wiring device (100, 100A).

[0177] In the wiring device (100, 100A) of the eleventh aspect, in any one of the first to tenth aspects, any imaginary line (X1) extending from the board (11, 11A) to the case (81, 81A) along the direction in which the board (11, 11A) and the case (81, 81A) face each other intersects with at least one of the insulating sheet (61) and the heat dissipation member (71).

[0178] According to this embodiment, it is possible to further improve the electrical insulation of the substrate (11, 11A) from the case (81, 81A).

[0179] A wiring device (100, 100A) of a twelfth aspect is any one of the first to eleventh aspects and includes an input circuit (101), a conversion circuit (diode bridge 103, DC / DC converter 105), and an output circuit (106). The input circuit (101) is connected to an external power supply and receives AC input power from the external power supply. The conversion circuit is composed of a plurality of electronic components including a heat-generating component (99). The conversion circuit converts the input power into DC output power. The output circuit (106) outputs the output power.

[0180] According to this aspect, it is possible to supply output power to an external device.

[0181] (4.2) Second Summary The wiring device (100) of the first aspect includes a first board (11), a second board (21), a case (81), a first heat dissipation member (71), and a second heat dissipation member (72). The case (81) has a bottom wall (82) and a side wall (83) intersecting the bottom wall (82). The case (81) houses the first board (11) and the second board (21) such that the first board (11) faces the bottom wall (82) and the second board (21) faces the side wall (83). The first heat dissipation member (71) is disposed between the first board (11) and the bottom wall (82) of the case (81). The second heat dissipation member (72) is disposed between the second board (21) and the side wall (83) of the case (81).

[0182] According to this aspect, it is possible to improve heat dissipation.

[0183] In the wiring device (100) of the second aspect, in the first aspect, the case (81) has a higher thermal conductivity than the insulating plate of the first substrate (11).

[0184] According to this aspect, it is possible to further improve the heat dissipation performance.

[0185] In the wiring device (100) of the third embodiment, the case (81) is made of metal in the second embodiment.

[0186] According to this aspect, it is possible to further improve the heat dissipation performance.

[0187] In the wiring device (100) of the fourth aspect, in any one of the first to third aspects, at least one heat-generating component (99) is mounted on the first board (11).

[0188] According to this embodiment, the heat generated by the heat-generating component (99) can be released to the bottom wall through the first heat-dissipating member (71), thereby further improving the heat dissipation performance.

[0189] In the wiring device (100) of the fifth aspect, in the fourth aspect, the first heat dissipation member (71) contacts the heat-generating component (99) mounted on the first board (11).

[0190] According to this aspect, it is possible to further improve the heat dissipation performance.

[0191] In the wiring device (100) of the sixth aspect, in the fourth or fifth aspect, at least one heat-generating component (99) is mounted on the second board (21).

[0192] According to this embodiment, the heat generated by the heat-generating component (99) can be released to the side wall via the second heat-dissipating member (72), thereby further improving the heat dissipation performance.

[0193] In the wiring device (100) of the seventh aspect, in the sixth aspect, the second heat dissipation member (72) is in contact with the heat-generating component (99) mounted on the second board (21).

[0194] According to this aspect, it is possible to further improve the heat dissipation performance.

[0195] In the wiring device (100) of the eighth aspect, in any one of the first to seventh aspects, at least one of the first heat dissipation member (71) and the second heat dissipation member (72) is stretchable.

[0196] According to this aspect, it is possible to further improve the heat dissipation performance.

[0197] In the wiring device (100) of the ninth aspect, in any one of the first to eighth aspects, at least one of the first heat dissipation member (71) and the second heat dissipation member (72) is a thermal sheet.

[0198] According to this embodiment, it is possible to extend the life of the wiring device (100).

[0199] In the wiring device (100) of the tenth aspect, in any one of the first to ninth aspects, the first heat dissipation member (71) is in contact with the bottom wall (82) of the case (81).

[0200] According to this aspect, it is possible to further improve the heat dissipation performance.

[0201] In the wiring device (100) of the eleventh aspect, in any one of the first to tenth aspects, the second heat dissipation member (72) is in contact with the side wall (83) of the case (81).

[0202] According to this aspect, it is possible to further improve the heat dissipation performance.

[0203] A wiring device (100A) of a twelfth aspect includes a first board (11A), a second board (21A), a case (81A), a first heat dissipation member (71A), and a second heat dissipation member (72A). The case (81A) has a bottom wall (82A), a first side wall (right wall 834A), and a second side wall (left wall 833A). The first side wall and the second side wall intersect with the bottom wall (82A). The case (81A) accommodates the first board (11A) and the second board (21A) such that the first board (11A) faces the first side wall and the second board (21A) faces the second side wall. The first heat dissipation member (71A) is disposed between the first board (11A) and the first side wall of the case (81A). The second heat dissipation member (72) is disposed between the second substrate (21) and the second side wall of the case (81A). The first substrate (11) and the second substrate (21) face each other.

[0204] According to this aspect, it is possible to improve heat dissipation.

[0205] A wiring device (100, 100A) of a thirteenth aspect is any one of the first to twelfth aspects and includes an input circuit (101), a conversion circuit (diode bridge 103, DC / DC converter 105), and an output circuit (106). The input circuit (101) is connected to an external power supply and receives AC input power from the external power supply. The conversion circuit is composed of a plurality of electronic components mounted on at least one of the first board (11, 11A) and the second board (21, 21A). The conversion circuit converts the input power into DC output power. The output circuit (106) outputs the output power.

[0206] According to this aspect, it is possible to supply output power to an external device. [Explanation of symbols]

[0207] 100,100A wiring device 11, 11A board, first board 21, 21A Second board 61 Insulation sheet 610 Aperture 71, 71A heat dissipation member, first heat dissipation member 72, 72A Second heat dissipation member 81,81A Case 82,82A bottom wall 83 Side wall 833A Left wall (second side wall) 834A Right wall (first side wall) 813 Protrusion 814 recess 99 Heat-generating parts 101 Input circuit 106 Output circuit 114 Copper Inlay A1 Normal direction A2 normal direction X1 Virtual Line

Claims

1. a substrate on which heat-generating components are mounted; a case for accommodating the substrate; an insulating sheet disposed between the substrate and the case; a heat dissipation member having electrical insulation properties, disposed between the substrate and the case, and electrically insulating the substrate from the case together with the insulating sheet; Equipped with the heat dissipation member has a thermal conductivity greater than that of the insulating sheet, the heat dissipation member is provided to cover the heat-generating component, the heat dissipation member is in contact with the substrate, the heat-generating component, and the case; Wiring equipment.

2. The insulating sheet is arranged along the inner surface of the case in a portion of the case that is not in contact with the heat dissipation member. The wiring device according to claim 1 .

3. The insulating sheet has an opening, The heat dissipation member is disposed at a position corresponding to the opening of the insulating sheet so as to fill the opening. The wiring device according to claim 2 .

4. The heat dissipation member is sandwiched between the peripheral portion of the opening in the insulating sheet and the substrate. The wiring device according to claim 3 .

5. The case has a protrusion that protrudes toward the substrate, The heat dissipation member is in contact with the protrusion. The wiring device according to any one of claims 1 to 4.

6. The case has a recessed portion recessed away from the substrate, The heat dissipation member is fitted into the recessed portion. The wiring device according to any one of claims 1 to 5.

7. The heat dissipation member is a thermal sheet. The wiring device according to any one of claims 1 to 6.

8. Any imaginary line extending from the substrate to the case along the direction in which the substrate and the case face each other intersects with at least one of the insulating sheet and the heat dissipation member. The wiring device according to any one of claims 1 to 7.

9. An input circuit connected to an external power supply to receive AC input power from the external power supply; a conversion circuit that is configured by a plurality of electronic components including the heat-generating component and converts the input power into DC output power; an output circuit that outputs the output power; Further comprising: The wiring device according to any one of claims 1 to 8.

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