Cooling device for processing unit

Abstract

To provide a cooling device for an arithmetic processing device capable of maintaining heat dissipation without using metal.SOLUTION: In a cooling device 1 of an arithmetic processing device 100 having a cooling member 7 in contact with the surface of the arithmetic processing device 100, the cooling member 7 is made of a carbon-based porous ceramic material and formed into a plate shape, and the cooling member 7 is cooled by a coolant 2. In addition, the arithmetic processing device 100 and the cooling member 7 are immersed in the coolant 2, and the cooling member 7 has an internal cooling member passage 27 through which gas passes, and the gas in the internal cooling member passage 27 is discharged to the coolant 2 as fine bubbles.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a technology for a cooling device for a processing unit. [Background technology]

[0002] For example, processing units including large-scale integrated circuits (LSIs) and composed of microprocessors with all functions integrated on a small number of chips are well known. The high-speed processing capabilities of these processing units generate heat from their semiconductor elements and other components. While the CPU generates the most heat within the processing unit, other integrated components required for high-speed processing also reach high temperatures, making it necessary to efficiently cool the entire processing unit. In other words, efficient cooling of the processing unit is necessary to improve its reliability.

[0003] On the other hand, for cooling processing units such as power modules for controlling electric power, a cooling device has been proposed in which a metal plate such as Al is bonded to the surface of the power module for heat dissipation, and a heat sink is further bonded via a metal layer to cool the substrate. An aluminum composite material in which aluminum or an aluminum alloy is filled in a carbonaceous member is used for the heat sink. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-98058 Summary of the Invention [Problem to be solved by the invention]

[0005] However, heat sinks containing metal have the potential for deterioration of heat dissipation due to oxidation. Furthermore, metal heat sinks cannot be used in immersion cooling systems that use fluorine-based refrigerants. Therefore, there has been a demand for a cooling system for processors that can maintain heat dissipation without using metal.

[0006] In view of the above, the present invention provides a cooling device for a processor that can maintain heat dissipation without using metal. [Means for solving the problem]

[0007] The problem to be solved by the present invention is as described above, and the means for solving this problem will now be described.

[0008] That is, in the present invention, there is provided a cooling device for a processing unit having a cooling member in contact with a surface of the processing unit, The cooling member is It has many tiny pores with diameters ranging from several μm to several tens of μm. It is made of a carbon-based porous ceramic material and is formed into a plate shape. The cooling member is cooled by a refrigerant. 、 the arithmetic processing unit and the cooling member are immersed in the refrigerant, The cooling member has an internal passage for passing gas therethrough, The gas in the passage in the cooling member is released into the refrigerant as fine bubbles. It is something.

[0010] In the present invention, the cooling member is The refrigerant circulates a liquid flow passage communicating with the refrigerant passage is provided therein; the cooling member has a passage in the bubble generating medium through which a gas passes; The gas in the bubble generating medium passage may be released as fine bubbles into the refrigerant in the liquid flow passage. [Effects of the Invention]

[0011] The present invention has the following effects.

[0012] In the present invention, the cooling element that comes into contact with the surface of the processor is made of a carbon-based porous ceramic material, thereby improving the heat dissipation performance of the cooling element and improving the thermal cooling efficiency of the processor. Furthermore, by using a carbon-based porous ceramic material for the cooling element and providing a liquid flow path inside the cooling element, the cooling element can be constantly cooled from the inside. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1A is a schematic plan view showing a processing unit and a cooling member according to a first embodiment of the present invention, and FIG. 1B is a schematic front view showing a processing unit and a cooling member according to the first embodiment of the present invention. [Figure 2] 1 is a schematic diagram showing an immersion cooling device according to a first embodiment of the present invention. [Figure 3] FIG. [Figure 4] FIG. 10 is a schematic diagram showing a cooling device for a processor according to a second embodiment of the present invention. [Figure 5] FIG. 10 is a schematic diagram showing a cooling device for a processing unit according to a third embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0014] Next, an embodiment of the invention will be described. First, the overall configuration of a cooling device 1 for a processor 100 according to one embodiment of the present invention will be described with reference to FIGS.

[0015] The cooling device 1 is a cooling device for the arithmetic processing device 100, which has a cooling member 7 that contacts the surface of the arithmetic processing device 100. Due to miniaturization and integration, arithmetic processing devices 100 that generate a large amount of heat have been developed. For example, the arithmetic processing device 100 has a microprocessor 100a that is a CPU, and various integrated components such as a bridge used for high-speed arithmetic processing. Furthermore, although the microprocessor 100a generates the most heat within the arithmetic processing device 100, other integrated components required for high-speed processing also reach high temperatures, so the entire arithmetic processing device 100 needs to be cooled efficiently. There has been a demand for a cooling member 7 made of a material with good heat dissipation efficiency to cool the arithmetic processing device 100 that has semiconductor elements that generate a large amount of heat.

[0016] The cooling member 7 is formed into a plate shape from a carbon-based porous ceramic material. The cooling member 7 is attached to the surface of a box-shaped member 100b that houses a microprocessor 100a, which is part of a processing unit 100 configured with semiconductor elements and the like. The microprocessor 100a is mounted on a substrate 100c. Heat generated by the microprocessor 100a is conducted from the surface of the box-shaped member 100b to the cooling member 7, and is then dissipated from the cooling member 7 into the air if the cooling member is an air-cooled type, or into the refrigerant 2 if the cooling member is a refrigerant-cooled type.

[0017] A carbon-based porous ceramic material is an inorganic material that is composed of only carbon or a composite material containing carbon and ceramic. A film several nanometers thick is formed on the surface of the carbon-based porous material. The film is made of an inorganic film containing silicon. This configuration allows heat to be conducted to the voids in the carbon-based porous material, resulting in a material with high heat dissipation efficiency. Furthermore, since carbon-based porous materials have excellent corrosion resistance and high-temperature resistance, a decrease in heat dissipation efficiency can be prevented. This allows the microprocessor 100a to be cooled without a decrease in efficiency, even when it becomes unexpectedly hot.

[0018] Next, the immersion type cooling device 1 will be described with reference to FIGS. The cooling device 1 is a device that constantly cools the processor 100 and the cooling member 7 by immersing them in a refrigerant 2, and includes a refrigerant container 3 that stores the refrigerant 2. The immersion type cooling device 1 has the advantage of increasing hardware density because the refrigerant 2 efficiently removes heat from the processor 100. Another advantage of the immersion type cooling device 1 is that the refrigerant 2 is less likely to deteriorate, eliminating the need for maintenance such as changing the liquid.

[0019] The coolant 2 is made of, for example, a fluorocarbon-based coolant, and is made of a liquid that does not affect electronic devices such as the arithmetic processing device 100. That is, the fluorocarbon-based coolant has very high insulating properties and can prevent current from flowing through the substrate 100c and the microprocessor 100a. The coolant 2 is circulated by a pump or the like (not shown), and is cooled by a cooler such as a chiller.

[0020] A cooling member internal passage 27 is provided inside the cooling member 7. The cooling member internal passage 27 communicates with a gas passage 55, and a compressor 22 is connected to the gas passage 55. The compressor 22 is a device that compresses and delivers oxygen, and is composed of, for example, a compressed oxygen container and a valve.

[0021] The cooling member 7 is made of a porous material and has many fine pores 7A with diameters of several μm to several tens of μm, as shown in FIG. 3. The cooling member 7 is an electrical conductor, and the bubbles generated from the cooling member 7 are negatively charged. In other words, free electrons are added to the fine bubbles as they pass through the cooling member 7, which is an electrical conductor, and the bubbles are thereby negatively charged. This negative charge causes the bubbles to repel each other, preventing them from coalescing and becoming larger bubbles.

[0022] Next, the cooling method of the immersion type cooling device 1 will be described with reference to FIGS. The refrigerant 2 in the refrigerant container 3 is constantly cooled as it circulates. The refrigerant 2 cools the cooling member 7 in the refrigerant container 3. Oxygen is pressure-fed from the compressor 22 into the cooling member 7 in the refrigerant 2. The oxygen pressure-fed from the compressor 22 is sent to the cooling member passage 27 through the gas passage 55. The oxygen sent to the cooling member passage 27 is generated as fine bubbles from the holes 7A in the cooling member 7, and the fine bubbles are dissolved in the refrigerant 2 in the refrigerant container 3. That is, the oxygen supplied to the cooling member passage 27 passes through the fine holes 7A with diameters of several μm to several tens of μm provided in the cooling member 7, becoming fine bubbles and being released into the liquid. The fine bubbles released into the refrigerant 2 are separated from the surface of the cooling member 7 the moment they are released onto the surface.

[0023] The fine bubbles in the refrigerant 2 improve the cooling efficiency of the refrigerant 2. That is, the fine bubbles in the refrigerant 2 agitate the refrigerant 2, eliminating temperature bias in the refrigerant 2 and making the temperature uniform, thereby improving the cooling efficiency. Furthermore, the thermal energy is consumed by the collapse of the fine bubbles, thereby improving the cooling efficiency of the refrigerant 2.

[0024] Next, the overall configuration of the cooling device 101 of the processor 100 according to the second embodiment will be described with reference to Fig. 4. The cooling device 101 has a liquid flow path 121 and a cooling member internal path 127 provided within a cooling member 107. In the cooling device 101 according to the second embodiment, the same components as those of the cooling device 1 according to the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

[0025] Cooling device 101 is a device that cools processing unit 100 with refrigerant 2, and is composed of refrigerant passage 103 through which refrigerant 2 circulates, circulator 4, radiator 5, and cooling member 107.

[0026] Cooling member 107 is formed into a plate shape from a carbon-based porous ceramic material. Cooling member 107 is attached to the surface of box-shaped member 100b that houses microprocessor 100a, which is part of processing device 100 configured with semiconductor elements, etc. Heat generated by microprocessor 100a is conducted from the surface of box-shaped member 100b to cooling member 107 and dissipated into refrigerant 2.

[0027] A liquid flow passage 121 that communicates with the refrigerant passage 103 is provided inside the cooling member 107. The liquid flow passage 121 is provided midway along the circulation path of the refrigerant passage 103, and the refrigerant in the refrigerant passage 103 flows into the liquid flow passage 121, absorbs heat from the cooling member 107, and is then released back into the refrigerant passage 103.

[0028] Furthermore, a cooling member internal passage 127 is provided inside the cooling member 107. The cooling member internal passage 127 communicates with the gas passage 55, and the compressor 22 is connected to the gas passage 55. The compressor 22 is a device that compresses and delivers oxygen, and is composed of, for example, a compressed oxygen container and a valve.

[0029] Similarly to the cooling member 7 of the first embodiment, the cooling member 107 is made of a porous material and has many fine pores with diameters of several μm to several tens of μm. The cooling member 107 is an electrical conductor, and the bubbles generated from the cooling member 107 are negatively charged. In other words, free electrons are added to the fine bubbles as they pass through the cooling member 107, which is an electrical conductor, and the bubbles are thereby negatively charged. This negative charge causes the bubbles to repel each other, preventing them from coalescing and becoming larger bubbles.

[0030] Next, a cooling method of the cooling device 101 of the arithmetic processing device 100 according to the second embodiment will be described. The refrigerant 2 in the refrigerant passage 103 is circulated by the circulator 4. The refrigerant 2 flows from the refrigerant passage 103 into the liquid flow passage 121 of the cooling member 7 and cools the cooling member 107. In addition, oxygen is pressure-fed from the compressor 22 into the refrigerant 2. The pressure-fed oxygen from the compressor 22 is sent to the cooling member passage 127 through the gas passage 55. The oxygen sent to the cooling member passage 127 is generated as fine bubbles from the pores of the cooling member 107, and the fine bubbles are dissolved in the refrigerant 2 in the liquid flow passage 21. That is, the oxygen supplied to the cooling member passage 127 passes through small pores with diameters of several μm to several tens of μm provided in the cooling member 107, becoming fine bubbles and being released into the liquid. The fine bubbles released into the refrigerant 2 are separated from the surface by the flow of the surrounding refrigerant 2 the moment they are released onto the inner surface of the cooling member 107.

[0031] The microscopic bubbles in the refrigerant 2 make it possible to reduce the pressure loss of the refrigerant 2. That is, pressure loss appears as the sum of kinetic energy dissipation due to friction between fluids inside the refrigerant 2 that occurs everywhere in the refrigerant passage 103, but by mixing microscopic bubbles, friction between fluids in the refrigerant 2 can be reduced, thereby reducing the pressure loss.

[0032] Furthermore, by generating microscopic bubbles directly in the liquid flow passages 121 of the cooling member 107, the microscopic bubbles are generated inside the liquid flow passages 121 where pressure loss is most likely to occur, reducing the chances of the microscopic bubbles collapsing before reaching the liquid flow passages 121. This makes it possible to more efficiently reduce the pressure loss of the refrigerant 2.

[0033] By forming the cooling member 107 from a carbon-based porous material, the thermal conductivity is increased and the heat dissipation is improved. Also, the pressure loss of the refrigerant 2 is reduced, so that the cooling member 107 can be cooled efficiently.

[0034] Next, the overall configuration of the cooling device 201 of the arithmetic processing device 100 according to the third embodiment will be described with reference to Fig. 5. The cooling device 201 has a fine bubble generation tank 231 provided midway through the refrigerant passage 103. In the cooling device 201 according to the third embodiment, the same components as those in the cooling device 1 according to the first embodiment and the cooling device 101 according to the second embodiment are denoted by the same reference numerals, and description thereof will be omitted.

[0035] The cooling device 201 is a device that cools the arithmetic processing device 100 with a refrigerant 2, and is composed of a refrigerant passage 103 through which the refrigerant 2 circulates, a circulator 4, a radiator 5, and a cooling member 207.

[0036] Cooling member 207 is formed into a plate shape from a carbon-based porous ceramic material. Cooling member 207 is attached to the surface of box-shaped member 100b that houses microprocessor 100a, which is part of processing device 100 configured with semiconductor elements, etc. Heat generated by microprocessor 100a is conducted from the surface of box-shaped member 100b to cooling member 207 and dissipated into refrigerant 2.

[0037] A liquid flow passage 221 that communicates with the refrigerant passage 103 is provided inside the cooling member 207. The liquid flow passage 221 is provided midway along the circulation path of the refrigerant passage 103, and the refrigerant in the refrigerant passage 103 flows into the liquid flow passage 221, absorbs heat from the cooling member 207, and is then released back into the refrigerant passage 103.

[0038] Furthermore, the cooling member 207 is made of a porous material, similar to the cooling member 7 of the first embodiment, and has many fine pores with diameters of several μm to several tens of μm.

[0039] A fine bubble generation tank 231 is provided in the middle of the refrigerant passage 103. A bubble generation medium 227 is provided in the fine bubble generation tank 231. The bubble generation medium 227 communicates with a gas passage 55, and a compressor 22 is connected to the gas passage 55. The compressor 22 is a device that compresses and delivers oxygen, and is composed of, for example, a compressed oxygen container and a valve.

[0040] The bubble generation medium 227 is an electric conductor, and like the cooling member 7 of the first embodiment, is made of a porous material and has many fine pores with diameters of several μm to several tens of μm. The bubbles generated from the bubble generation medium 227 are negatively charged. In other words, free electrons are added to the fine bubbles as they pass through the conductive bubble generation medium 227, causing them to become negatively charged. This negative charge causes the bubbles to repel each other, preventing them from coalescing and forming larger bubbles.

[0041] Next, a cooling method of the cooling device 201 of the arithmetic processing device 100 according to the third embodiment will be described with reference to FIG. The refrigerant 2 in the refrigerant passage 103 is circulated by the circulator 4. The refrigerant 2 flows from the refrigerant passage 103 into the liquid flow passage 221 of the cooling member 207 to cool the cooling member 207. A fine bubble generation tank 231 is provided midway through the refrigerant passage 103, and a bubble generation medium 227 is provided in the fine bubble generation tank 231. Oxygen is pumped from the compressor 22 into the refrigerant 2. The oxygen pumped from the compressor 22 passes through a gas passage 55 and is sent to a passage in the bubble generation medium 227. The oxygen sent to the passage is generated as fine bubbles from the pores of the bubble generation medium 227, and the fine bubbles are dissolved in the refrigerant 2 in the fine bubble generation tank 231. That is, the oxygen supplied to the bubble generation medium 227 passes through fine pores with diameters of several μm to several tens of μm provided in the bubble generation medium 227, becoming fine bubbles and being released into the refrigerant 2. The minute bubbles released into the refrigerant 2 are separated from the surface by the flow of the surrounding refrigerant 2 the moment they are released onto the surface of the bubble generation medium 227.

[0042] The microscopic bubbles in the refrigerant 2 make it possible to reduce the pressure loss of the refrigerant 2. That is, pressure loss appears as the sum of kinetic energy dissipation due to friction between fluids inside the refrigerant 2 that occurs everywhere in the refrigerant passage 103, but by mixing microscopic bubbles, friction between fluids in the refrigerant 2 can be reduced, thereby reducing the pressure loss.

[0043] Furthermore, the presence of fine bubbles dissolved in the refrigerant 2 flowing inside the cooling member 207 can efficiently reduce pressure loss in the refrigerant 2 and improve cooling efficiency. Furthermore, the collapse of the fine bubbles in the radiator 5 improves heat dissipation efficiency.

[0044] By forming the cooling member 207 from a carbon-based porous material, the thermal conductivity is increased and the heat dissipation is improved. In addition, the pressure loss of the refrigerant 2 is reduced, so that the cooling member 207 can be cooled efficiently.

[0045] As described above, the cooling device 1 for the arithmetic processing device 100 has a cooling member 7 that contacts the surface of the arithmetic processing device 100, and the cooling member 7 is formed in a plate shape from a carbon-based porous ceramic material, and the cooling member 7 is cooled by the refrigerant 2.

[0046] By configuring the cooling member 7 in this way, the thermal conductivity is increased and heat dissipation is improved by using a carbon-based porous ceramic material, which makes it possible to efficiently cool the entire processing device 100, which has, for example, a microprocessor 100a (CPU) and various integrated components such as a bridge used for high-speed processing.

[0047] In addition, the arithmetic processing device 100 and the cooling member 7 are immersed in the refrigerant 2, and the inside of the cooling member 7 has an internal passage 27 for passing gas, and the gas in the internal passage 27 of the cooling member is released into the refrigerant 2 as fine bubbles.

[0048] With this configuration, fine bubbles are generated from the cooling member 7, and the cooling efficiency of the refrigerant 2 is improved.

[0049] In addition, the cooling member 107 may have a liquid flow passage 121 therein that communicates with the refrigerant passage 103, and the cooling member 107 may have a passage 127 within the cooling member through which gas passes, and the gas in the passage 127 within the cooling member may be released as fine bubbles into the refrigerant 2 within the liquid flow passage 121.

[0050] With this configuration, micro-bubbles are generated directly in the liquid flow passages 121 of the cooling member 7, where pressure loss is most likely to occur, thereby reducing the chances of the micro-bubbles collapsing before reaching the liquid flow passages 121. This makes it possible to more efficiently reduce the pressure loss of the refrigerant 2.

[0051] In the first to third embodiments, compressed oxygen is dissolved as fine bubbles in the fluorocarbon-based refrigerant, but this is not limited to this, and it is also possible to use, for example, an inert gas such as nitrogen or argon.

[0052] In another embodiment, the refrigerant 2 is made of pure water. Pure water usually has dissolved oxygen. Therefore, in this embodiment, nitrogen is used as fine bubbles to remove the dissolved oxygen.

[0053] The cooling device 1 is a cooling device for the arithmetic processing device 100, which has a cooling member 7 that contacts the surface of the arithmetic processing device 100. Due to miniaturization and integration, arithmetic processing devices 100 that generate a large amount of heat have been developed. For example, the arithmetic processing device 100 has a microprocessor 100a that is a CPU, and various integrated components such as a bridge used for high-speed arithmetic processing. Furthermore, although the microprocessor 100a generates the most heat within the arithmetic processing device 100, other integrated components required for high-speed processing also reach high temperatures, so the entire arithmetic processing device 100 needs to be cooled efficiently. There has been a demand for a cooling member 7 made of a material with good heat dissipation efficiency to cool the arithmetic processing device 100 that has semiconductor elements that generate a large amount of heat.

[0054] The cooling member 7 is formed into a plate shape from a carbon-based porous ceramic material. The cooling member 7 is attached to the surface of a box-shaped member 100b that houses a microprocessor 100a, which is part of a processing unit 100 configured with semiconductor elements and the like. The microprocessor 100a is mounted on a substrate 100c. Heat generated by the microprocessor 100a is conducted from the surface of the box-shaped member 100b to the cooling member 7, and is then dissipated from the cooling member 7 into the air if the cooling member is an air-cooled type, or into the refrigerant 2 if the cooling member is a refrigerant-cooled type.

[0055] A carbon-based porous ceramic material is an inorganic material that is composed of only carbon or a composite material containing carbon and ceramic. A film several nanometers thick is formed on the surface of the carbon-based porous material. The film is made of an inorganic film containing silicon. This configuration allows heat to be conducted to the voids in the carbon-based porous material, resulting in a material with high heat dissipation efficiency. Furthermore, since carbon-based porous materials have excellent corrosion resistance and high-temperature resistance, a decrease in heat dissipation efficiency can be prevented. This allows the microprocessor 100a to be cooled without a decrease in efficiency, even when it becomes unexpectedly hot.

[0056] Next, the immersion type cooling device 1 will be described with reference to FIGS. The cooling device 1 is a device that constantly cools the processor 100 and the cooling member 7 by immersing them in a refrigerant 2, and includes a refrigerant container 3 that stores the refrigerant 2. The immersion type cooling device 1 has the advantage of increasing hardware density because the refrigerant 2 efficiently removes heat from the processor 100. Another advantage of the immersion type cooling device 1 is that the refrigerant 2 is less likely to deteriorate, eliminating the need for maintenance such as changing the liquid. Pure water is low in cost and can be easily replenished to replace losses due to evaporation.

[0057] A cooling member internal passage 27 is provided inside the cooling member 7. The cooling member internal passage 27 communicates with a gas passage 55, and a compressor 22 is connected to the gas passage 55. The compressor 22 is a device that compresses and feeds nitrogen, which is an inert gas, and is composed of, for example, a compressed nitrogen container and a valve.

[0058] The cooling member 7 is made of a porous material and has many fine pores 7A with diameters of several μm to several tens of μm, as shown in FIG. 3. The cooling member 7 is an electrical conductor, and the bubbles generated from the cooling member 7 are negatively charged. In other words, free electrons are added to the fine bubbles as they pass through the cooling member 7, which is an electrical conductor, and the bubbles are thereby negatively charged. This negative charge causes the bubbles to repel each other, preventing them from coalescing and becoming larger bubbles.

[0059] Next, the cooling method of the immersion type cooling device 1 will be described with reference to FIGS. The refrigerant 2 in the refrigerant container 3 is constantly cooled while circulating. The refrigerant 2 cools the cooling element 7 in the refrigerant container 3. Nitrogen, an inert gas, is pressure-fed from the compressor 22 into the cooling element 7 in the refrigerant 2. The pressure-fed nitrogen from the compressor 22 passes through the gas passage 55 and is sent to the cooling element passage 27. The nitrogen sent to the cooling element passage 27 is generated as fine bubbles from the holes 7A in the cooling element 7, and the fine bubbles dissolve in the refrigerant 2 in the refrigerant container 3. That is, the nitrogen supplied to the cooling element passage 27 passes through the small holes 7A, each with a diameter of several microns to several tens of microns, provided in the cooling element 7, and becomes fine bubbles before being released into the liquid. The nitrogen released into the refrigerant 2 has a high pressure, and its partial pressure is greater than that of the dissolved oxygen, so the oxygen is replaced by nitrogen, an inert gas. Because the deoxidized pure water is free of oxygen, which is an oxidant, deterioration of the microprocessor 100a and other components, such as the board 100c, due to oxidation can be prevented. The coolant 2 is circulated by a pump or the like (not shown) and is cooled by a cooler such as a chiller.

[0060] Furthermore, the fine bubbles in the refrigerant 2 improve the cooling efficiency of the refrigerant 2. That is, the fine bubbles in the refrigerant 2 agitate the refrigerant 2, eliminating temperature bias in the refrigerant 2 and making the temperature uniform, thereby improving cooling efficiency. Furthermore, thermal energy is consumed by the collapse of the fine bubbles, thereby improving the cooling efficiency of the refrigerant 2. [Explanation of symbols]

[0061] 1 Cooling device 2. Refrigerant 3 Refrigerant container 4 Circulator 5 Heat sink 7 Cooling material 7A hole 22 Compression device 27 Passage inside cooling member 55 Gas passage 100 Processing unit 101 Cooling device 107 Cooling material 121 Liquid flow path 127 Passage in cooling member

Claims

1. A cooling device for a processing unit having a cooling member in contact with a surface of the processing unit, The cooling member is formed in a plate shape from a carbon-based porous ceramic material having a large number of fine pores with diameters of several μm to several tens of μm, the cooling member is cooled by a refrigerant, the arithmetic processing unit and the cooling member are immersed in the refrigerant, The cooling member has an internal passage for passing gas therethrough, The gas in the passage in the cooling member is released into the refrigerant as fine bubbles. A cooling device for a processing unit.

2. the cooling member has a liquid flow passage therein that communicates with a refrigerant passage through which the refrigerant circulates; the cooling member has a passage therein through which a gas passes; The gas in the passage in the cooling member is released as fine bubbles into the refrigerant in the liquid flow passage.

2. The cooling device for a processing unit according to claim 1.

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