Photosensitive resin composition, photosensitive resin film, method for producing cured product, laminate, and electronic component

Abstract

To provide a photosensitive resin composition that has excellent patternability even in the case of forming a thick photosensitive layer of 70 μm or more.SOLUTION: A photosensitive resin composition contains a component (A): a compound having a photopolymerizable functional group and a component (B): a photopolymerization initiator having a molar extinction coefficient of less than 8.0×103 L / mol cm to light of wavelength 365 nm. When the photosensitive resin composition has a thickness of 50 μm, an extinction to the light of wavelength 365 nm is less than 0.35.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present disclosure relates to a photosensitive resin composition, a photosensitive resin film, a method for producing a cured product, a laminate, and an electronic component. [Background technology]

[0002] In the manufacturing fields of semiconductor integrated circuits (LSIs) or wiring boards, photosensitive materials are used as resists for producing conductor patterns. For example, in the manufacture of wiring boards, a resist is formed using a photosensitive resin composition, and then a conductor pattern, metal posts, etc. are formed by plating. More specifically, a photosensitive layer is formed on a support (substrate) using a photosensitive resin composition or the like, and the photosensitive layer is exposed to light through a predetermined mask pattern. A development process is then performed so that the portions where the conductor pattern, metal posts, etc. will be formed can be selectively removed (peeled off), thereby forming a resist pattern (resist). Next, a conductor such as copper is formed on the removed portions by plating, and the resist pattern is then removed, thereby producing a wiring board equipped with a conductor pattern, metal posts, etc.

[0003] Conventionally, thick conductor patterns and metal posts have been fabricated by growing metal plating after removing the resist pattern. To meet such demands, for example, thick-film photosensitive resists with a photosensitive layer thickness of about 30 μm, or at most about 65 μm, have been used (see Patent Documents 1 and 2). In recent years, in order to further improve performance, attempts have been made to form a conductor layer as thick as approximately 150 μm by performing a plating process while destroying the layer of the metal ion dilute layer that exists in the direction of the desired plating growth using a plating solution (see Patent Document 3). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-034926 [Patent Document 2] Japanese Patent Application Laid-Open No. 2014-074774 [Patent Document 3] Japanese Patent Application Laid-Open No. 2014-080674 Summary of the Invention [Problem to be solved by the invention]

[0005] However, with conventional thick-film photosensitive resists, when a thick photosensitive layer of, for example, 70 μm or more is required, light is unlikely to penetrate all the way to the bottom, resulting in poor pattern shape. Furthermore, the method described in Patent Document 3 involves plating while partially destroying the metal ion dilute layer, making it difficult to stably form an excellent pattern. Therefore, there is a demand for photosensitive resists that have excellent pattern-forming properties, even when a photosensitive layer of 70 μm or even 150 μm or more, which is thicker than conventional resists, is formed.

[0006] Therefore, the problem to be solved by the present disclosure has been made in consideration of the above circumstances, and is to provide a photosensitive resin composition, a photosensitive resin film, a method for producing a cured product, a laminate, and an electronic component (hereinafter, sometimes referred to as a "photosensitive resin composition, etc.") that have excellent pattern formability even when a thick photosensitive layer of, for example, 70 μm or more is formed. [Means for solving the problem]

[0007] As a result of intensive research to solve the above problems, the present inventors have found that the problems can be solved by a photosensitive resin composition etc. having the following configuration. The present disclosure provides the following photosensitive resin composition etc.

[0008] [1] (A) component: a compound having a photopolymerizable functional group; (B) component: a compound having a molar absorption coefficient of 8.0 × 10 for light having a wavelength of 365 nm; 3and a photopolymerization initiator having a viscosity of less than 100µm / mol cm, wherein the photosensitive resin composition has an absorbance of less than 0.35 for light with a wavelength of 365nm when the thickness of the photosensitive resin composition is 50µm. [2] A photosensitive resin film having a photosensitive layer using the photosensitive resin composition described in [1] above. [3] A step of forming a photosensitive layer on a substrate using the photosensitive resin composition described in [1] above or the photosensitive resin film described in [2] above; a step of irradiating at least a part of the photosensitive layer with actinic rays to form a photocured portion; removing at least a portion of the photosensitive layer other than the photocured portion to form a resin pattern. [4] A laminate comprising a cured product of the photosensitive resin composition described in [1] above. [5] An electronic component comprising a cured product of the photosensitive resin composition described in [1] above. [Effects of the Invention]

[0009] According to the present disclosure, it is possible to provide a photosensitive resin composition or the like that has excellent pattern formability even when forming a thick photosensitive layer, for example, 70 μm or more. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 2 is a schematic diagram showing an example of a resolution evaluation mask used in the examples. DETAILED DESCRIPTION OF THE INVENTION

[0011] The present disclosure will be described in detail below. In this specification, a numerical range indicated using "to" indicates a range that includes the numerical values ​​before and after "to" as the minimum and maximum values, respectively. Furthermore, in numerical ranges described in stages in this specification, the upper or lower limit of a numerical range in one stage may be replaced with the upper or lower limit of a numerical range in another stage. In numerical ranges described in this specification, the upper or lower limit of the numerical range may be replaced with a value shown in the examples. "(Meth)acrylic acid" means at least one of "acrylic acid" and its corresponding "methacrylic acid", and the same applies to other similar expressions such as (meth)acrylate.

[0012] [Photosensitive resin composition] The photosensitive resin composition according to an embodiment of the present disclosure (hereinafter, sometimes simply referred to as the present embodiment) comprises component (A): a compound having a photopolymerizable functional group, and component (B): a compound having a molar absorption coefficient of 8.0 × 10 for light with a wavelength of 365 nm. 3 and a photopolymerization initiator having a viscosity of less than 100µm / mol cm, wherein the photosensitive resin composition has an absorbance of less than 0.35 for light with a wavelength of 365nm when the photosensitive resin composition has a thickness of 50µm. In this specification, the term "solid content" refers to the non-volatile content of the photosensitive resin composition excluding volatile substances such as water and solvents, and refers to the components that remain without volatilization when the resin composition is dried, and also includes those that are liquid, syrup-like, or waxy at room temperature. Here, in this specification, room temperature refers to 25°C. Hereinafter, when simply referred to as "molar absorption coefficient," it refers to "molar absorption coefficient for light having a wavelength of 365 nm," and when simply referred to as "absorbance," it refers to "absorbance for light having a wavelength of 365 nm when the thickness of the photosensitive resin composition is 50 μm."

[0013] The photosensitive resin composition of this embodiment has an absorbance of less than 0.35 for light with a wavelength of 365 nm when the photosensitive resin composition has a thickness of 50 μm. When the photosensitive resin composition has an absorbance of less than 0.35, even when a pattern is formed using a thick photosensitive layer of 70 μm or more using the photosensitive resin composition of this embodiment, light can easily pass through to the bottom of the photosensitive layer (the surface of the photosensitive layer facing the substrate), thereby improving pattern formability. From the same perspective, the absorbance of the photosensitive resin composition of this embodiment can be appropriately selected from 0.30 or less, 0.25 or less, or 0.22 or less. The lower limit of the absorbance can be appropriately selected from, for example, 0.001 or more, 0.005 or more, or 0.008 or more. The absorbance of the photosensitive resin composition can be appropriately adjusted by the types and contents of the compound having a photopolymerizable functional group, the photopolymerization initiator, the inorganic filler, and the like, which will be described later. The absorbance can be measured for light with a wavelength of 365 nm using, for example, an ultraviolet-visible spectrophotometer (product name: "U-3310 Spectrophotometer", manufactured by Hitachi High-Technologies Corporation) and using polyethylene terephthalate film alone as a reference. The absorbance of light with a wavelength of 365 nm when the photosensitive resin composition has a thickness of 50 μm can also be determined by converting the absorbance measured for a photosensitive resin composition with a thickness other than 50 μm into the absorbance for a thickness of 50 μm based on the Beer-Lambert law.

[0014] <Component (A): Compound having a photopolymerizable functional group> Examples of the photopolymerizable functional group contained in component (A) include ethylenically unsaturated groups such as a (meth)acryloyl group, a vinyl group, an alkenyl group such as an allyl group, etc. Among these, component (A) may contain a compound having a (meth)acryloyl group as the photopolymerizable functional group, from the viewpoint of improving pattern formability. In addition, from the viewpoint of improving pattern formability, component (A) may contain a compound having a carbon-nitrogen bond, or may contain a compound having a urethane bond as the carbon-nitrogen bond. Furthermore, from the viewpoint of improving pattern formability when a photosensitive layer having a thickness of 70 μm or more is formed, the lower limit of the content of the compound having a photopolymerizable functional group and a urethane bond may be appropriately selected from 70% by mass or more, 80% by mass or more, 85% by mass or more, 90% by mass or more, or 95% by mass or more, based on the total solid content of the photosensitive resin composition. Taking into consideration the pattern formability and coatability of the resulting resin composition, and the physical properties and characteristics required of a cured product of the resin composition, the upper limit is not particularly limited, but may be appropriately selected from 100% by mass or less, 99% by mass or less, 95% by mass or less, 85% by mass or less, or 80% by mass or less, based on the total solid content of the photosensitive resin composition. An example of a compound having a (meth)acryloyl group is (meth)acrylate, and an example of a compound having a urethane bond as a carbon-nitrogen bond is (meth)acrylate having a urethane bond (hereinafter, sometimes referred to as "urethane(meth)acrylate"). The number of photopolymerizable functional groups contained in component (A) may be appropriately selected from 1 to 24 from the viewpoint of pattern formability, and from 2 to 15 or 2 to 12 from the viewpoint of stabilizing the physical properties and characteristics of the resulting cured product. From the viewpoint of improving pattern formability, the photosensitive resin composition of the present embodiment may contain, as the component (A), a component (A1): a high molecular weight compound having a photopolymerizable functional group, or may contain a component (A2): a low molecular weight compound having a photopolymerizable functional group. The components (A1) and (A2) will be described below in order.

[0015] (Component (A1): High molecular weight substance having a photopolymerizable functional group) The component (A1) is a polymer having a photopolymerizable functional group. The term "polymer" refers to a compound having a weight-average molecular weight (Mw) of 2,500 or more. The weight-average molecular weight in this specification is a value measured by gel permeation chromatography (GPC) using tetrahydrofuran (THF). The photopolymerizable functional group contained in the component (A1) is the same as the photopolymerizable functional group contained in the component (A) described above, and from the viewpoint of improving pattern formability, the photopolymerizable functional group may contain a (meth)acryloyl group. The number of photopolymerizable functional groups contained in the component (A1) may be appropriately selected from 2 to 24 from the same viewpoint as above, and from 4 to 15 or 6 to 12 from the viewpoint of stabilizing the physical properties and characteristics of the resulting cured product. If the number of photopolymerizable functional groups is 2 or more, pattern formability, heat resistance, and rigidity of the cured product at high temperatures can be improved. On the other hand, if the number of photopolymerizable functional groups is 24 or less, the rigidity of the cured product is improved and adhesion to a substrate or the like is improved. In addition, a resin composition with appropriate viscosity can be obtained, improving coatability. When the applied resin composition is irradiated with light, the phenomenon in which only the surface portion tends to photocure rapidly while the interior portion does not photocure sufficiently can be suppressed. As a result, excellent resolution can be obtained, and excellent pattern formability can be achieved even when a thick photosensitive layer is formed. Furthermore, after at least one of photocuring and thermal curing is performed, the amount of unreacted photopolymerizable functional groups remaining can be reduced, thereby further suppressing fluctuations in the physical properties and characteristics of the resulting cured product. The component (A1) may contain a polymer having at least one skeleton selected from the group consisting of a chain hydrocarbon skeleton, an alicyclic skeleton, and an aromatic ring skeleton, and from the viewpoint of reducing the absorbance of the photosensitive resin composition, may contain a polymer having at least one skeleton selected from the group consisting of a chain hydrocarbon skeleton and an alicyclic skeleton.

[0016] Examples of the urethane (meth)acrylate of the component (A1) include a reaction product of a (meth)acrylate having a hydroxyl group and an isocyanate compound having an isocyanate group. Examples of the (meth)acrylate having a hydroxyl group include compounds having at least one hydroxyl group and at least one (meth)acryloyl group in one molecule. More specifically, for example, monofunctional (meth)acrylates such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-chloro-2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 2-hydroxy-3-(o-phenylphenoxy)propyl (meth)acrylate, 2-hydroxy-3-(1-naphthoxy)propyl (meth)acrylate, 2-hydroxy-3-(2-naphthoxy)propyl (meth)acrylate, ethoxylated products thereof, propoxylated products thereof, ethoxylated propoxylated products thereof, and caprolactone-modified products thereof; bifunctional (meth)acrylates such as trimethylolpropane di(meth)acrylate, glycerin di(meth)acrylate, bis(2-(meth)acryloyloxyethyl)(2-hydroxyethyl)isocyanurate, and the like; Ethoxylated products, propoxylated products thereof, ethoxylated propoxylated products thereof, and caprolactone-modified products thereof; bifunctional epoxy (meth)acrylates such as cyclohexanedimethanol-type epoxy di(meth)acrylate, tricyclodecanedimethanol-type epoxy di(meth)acrylate, hydrogenated bisphenol A-type epoxy di(meth)acrylate, hydrogenated bisphenol F-type epoxy di(meth)acrylate, hydroquinone-type epoxy di(meth)acrylate, resorcinol-type epoxy di(meth)acrylate, catechol-type epoxy di(meth)acrylate, bisphenol A-type epoxy di(meth)acrylate, bisphenol F-type epoxy di(meth)acrylate, bisphenol AF-type epoxy di(meth)acrylate, biphenol-type epoxy di(meth)acrylate, fluorene bisphenol-type epoxy di(meth)acrylate, and monoallyl isocyanurate-type epoxy di(meth)acrylate;Examples of the epoxy (meth)acrylate include trifunctional or higher functional (meth)acrylates such as ditrimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol tetra(meth)acrylate, and dipentaerythritol penta(meth)acrylate, as well as their ethoxylated, propoxylated, and ethoxylated propoxylated derivatives, and caprolactone-modified derivatives; trifunctional or higher functional epoxy (meth)acrylates such as phenol novolac epoxy (meth)acrylate, cresol novolac epoxy poly(meth)acrylate, and isocyanuric acid epoxy tri(meth)acrylate; and hydroxypropylated derivatives such as trimethylolpropane tri(meth)acrylate and ditrimethylolpropane tetra(meth)acrylate. These may be used alone or in combination of two or more.

[0017] Here, the ethoxylated, propoxylated, ethoxylated propoxylated, and hydroxypropylated (meth)acrylates can be obtained, for example, by using as raw materials an alcohol compound (or a phenol compound) that is a raw material for the (meth)acrylate, to which one or more ethylene oxide groups, propylene oxide groups, ethylene oxide and propylene oxide groups, and hydroxypropyl groups have been added. The caprolactone modified product can be obtained by, for example, using an alcohol compound (or a phenol compound) that is a raw material for the (meth)acrylate, modified with ε-caprolactone as a raw material.

[0018] The isocyanate compound having an isocyanate group includes a compound having at least one isocyanate group in one molecule, and may be a compound having 1 to 3 isocyanate groups in one molecule. More specifically, the monoisocyanate compounds include aliphatic monoisocyanate compounds such as ethyl isocyanate, propyl isocyanate, butyl isocyanate, octadecyl isocyanate, and 2-isocyanatoethyl (meth)acrylate; alicyclic monoisocyanate compounds such as cyclohexyl isocyanate; aromatic monoisocyanate compounds such as phenyl isocyanate; aliphatic diisocyanate compounds such as tetramethylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, decamethylene diisocyanate, and dodecamethylene diisocyanate; 1,3-bis(isocyanatomethyl)cyclohexane, isophorone diisocyanate, 2,5-bis(isocyanatomethyl)norbornene, bis(4-isocyanatocyclohexyl)methane, 1,2-bis(4-isocyanatomethyl)cyclohexane, and the like. alicyclic diisocyanate compounds such as 2,2-bis(4-isocyanatocyclohexyl)ethane, 2,2-bis(4-isocyanatocyclohexyl)propane, 2,2-bis(4-isocyanatocyclohexyl)hexafluoropropane, and bicycloheptane triisocyanate; diisocyanate compounds such as 1,4-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 2,4'-diphenylmethane diisocyanate, 4,4'-diphenylmethane diisocyanate, o-xylylene diisocyanate, m-xylylene diisocyanate, hydrogenated xylylene diisocyanate, and naphthalene-1,5-diisocyanate; and polymers such as uretdione dimers, isocyanurates, and biuret trimers of these diisocyanate compounds. These may be used alone or in combination of two or more kinds, and the two or three isocyanate compounds constituting the polymer may be the same or different.

[0019] Among these, from the viewpoint of improving pattern formability, diisocyanate compounds such as aliphatic diisocyanate compounds, alicyclic diisocyanate compounds, and aromatic diisocyanate compounds, and polymers of these diisocyanate compounds may be appropriately selected, and in particular, hexamethylene diisocyanate, isophorone diisocyanate, 1,4-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 2,4'-diphenylmethane diisocyanate, 4,4'-diphenylmethane diisocyanate, and isocyanurate polymers (isocyanurate polyisocyanates) may be appropriately selected.

[0020] The reaction product of the above-mentioned (meth)acrylate having a hydroxyl group and an isocyanate compound has a (meth)acryloyl group as the photopolymerizable functional group and a urethane bond as the carbon-nitrogen bond. More specifically, it has, for example, an organic group derived from the (meth)acrylate having a hydroxyl group in the molecule (i.e., an organic group having 1 to 5 (meth)acryloyl groups, which is the residue obtained by removing the hydroxyl group from the above-mentioned (meth)acrylate having a hydroxyl group), a urethane bond, and an organic group derived from the above-mentioned isocyanate compound (i.e., an organic group having a chain hydrocarbon skeleton, an alicyclic skeleton, or an aromatic ring skeleton, which is the residue obtained by removing the isocyanate group from the above-mentioned isocyanate compound). These organic groups may be the same or different.

[0021] From the viewpoint of improving pattern formability, the urethane (meth)acrylate of the component (A1) may include, for example, a reaction product obtained by reacting a terminal isocyanate group of a polyaddition product of an isocyanate compound having at least two isocyanate groups in one molecule with a diol compound, with a (meth)acrylate having a hydroxyl group.

[0022] Examples of the isocyanate compound having at least two isocyanate groups in one molecule used here include, among the compounds exemplified above as the isocyanate compound, diisocyanate compounds such as aliphatic diisocyanate compounds, alicyclic diisocyanate compounds, and aromatic diisocyanate compounds, as well as multimers of these diisocyanate compounds such as uretdione dimers, isocyanurate dimers, and biuret trimers. The above isocyanate compounds can be used alone or in combination of two or more kinds.

[0023] Examples of diol compounds include diol compounds having 1 to 20 carbon atoms, and specific examples include linear or branched saturated diol compounds such as ethylene glycol, diethylene glycol, propanediol, dipropylene glycol, butanediol, pentanediol, isopentyl glycol, hexanediol, nonanediol, decanediol, dodecanediol, dimethyldodecanediol, and octadecanediol; linear or branched unsaturated diol compounds such as butenediol, pentenediol, hexenediol, methylpentenediol, and dimethylhexenediol; and diol compounds having an alicyclic skeleton such as various cyclohexanediols, various cyclohexanedimethanols, various tricyclodecanedimethanols, hydrogenated bisphenol A, and hydrogenated bisphenol F. Here, the saturated diol compounds and unsaturated diol compounds can be collectively referred to as diol compounds having a chain hydrocarbon skeleton. The above diol compounds can be used alone or in combination of two or more.

[0024] The diol compound having a chain hydrocarbon skeleton may be appropriately selected from saturated diol compounds having 1 to 20, 2 to 16, or 2 to 14 carbon atoms, from the viewpoint of improving pattern formability and increasing the glass transition temperature (Tg) after polymerization to improve water resistance, and more specifically, may be appropriately selected from ethylene glycol and octadecanediol. Furthermore, the diol compound having an alicyclic skeleton may be appropriately selected from diol compounds having an alicyclic skeleton having 5 to 20, 5 to 18, or 6 to 16 carbon atoms, from the viewpoint of improving pattern formability and increasing the glass transition temperature (Tg) after polymerization to improve water resistance. More specifically, the diol compound may be appropriately selected from various cyclohexanediols such as 1,3-cyclohexanediol and 1,4-cyclohexanediol, and various cyclohexanedimethanols such as 1,3-cyclohexanedimethanol and 1,4-cyclohexanedimethanol.

[0025] In addition, the (meth)acrylate having a hydroxyl group used here includes those exemplified as the (meth)acrylate used in the reaction product of the above-mentioned (meth)acrylate having a hydroxyl group and an isocyanate compound having an isocyanate group.

[0026] Examples of reaction products obtained by reacting a terminal isocyanate group of a polyaddition product of an isocyanate compound having at least two isocyanate groups in one molecule with a diol compound with a (meth)acrylate having a hydroxyl group include those having a structural unit represented by the following general formula (3):

[0027] [ka]

[0028] In general formula (3), X1 represents a divalent organic group having a chain hydrocarbon skeleton, an alicyclic skeleton, or an aromatic ring skeleton, and Y1 represents a divalent organic group having a chain hydrocarbon skeleton or an alicyclic skeleton. When component (A1) has a plurality of the above structural units, the plurality of X1s and Y1s may be the same or different. That is, component (A1) may have at least one skeleton selected from the group consisting of a chain hydrocarbon skeleton, an alicyclic skeleton, and an aromatic ring skeleton.

[0029] Examples of the divalent organic group represented by X1 include organic groups derived from the aliphatic diisocyanate compounds, alicyclic diisocyanate compounds, and aromatic diisocyanate compounds exemplified above as compounds having an isocyanate group, i.e., divalent organic groups having a chain hydrocarbon skeleton, an alicyclic skeleton, or an aromatic ring skeleton, which are residues obtained by removing the isocyanate group from the above isocyanate compounds. The divalent organic group represented by X1 may be these residues themselves, or may be a residue derived from an isocyanate compound derivative such as a polyaddition product of the above isocyanate compound and a diol compound. From the viewpoints of improving pattern formability and improving the transparency, water resistance, and moisture resistance of the resin composition in a balanced manner, X1 may be a divalent organic group having an alicyclic skeleton, particularly a divalent organic group having an alicyclic skeleton which is a residue of isophorone diisocyanate represented by the following formula (4):

[0030] [ka]

[0031] Examples of the divalent organic group having a chain hydrocarbon skeleton or an alicyclic skeleton for Y1 include organic groups derived from the diol compounds having a chain hydrocarbon skeleton and the diol compounds having an alicyclic skeleton exemplified above as the diol compounds, i.e., divalent organic groups having a chain hydrocarbon skeleton or an alicyclic skeleton which are residues obtained by removing hydroxyl groups from the above diol compounds. In particular, from the viewpoint of improving pattern formability and increasing the glass transition temperature (Tg) after polymerization to improve water resistance, the divalent organic group having a chain hydrocarbon skeleton may be appropriately selected from residues obtained by removing hydroxyl groups from saturated diol compounds having 1 to 20, 2 to 16, or 2 to 14 carbon atoms, more specifically, from residues obtained by removing hydroxyl groups from ethylene glycol or octadecanediol. From the same viewpoint, the divalent organic group having an alicyclic skeleton may be appropriately selected from residues obtained by removing hydroxyl groups from diol compounds having an alicyclic skeleton having 5 to 20, 5 to 18, or 6 to 16 carbon atoms, more specifically, from residues obtained by removing hydroxyl groups from various cyclohexanediols such as 1,3-cyclohexanediol and 1,4-cyclohexanediol, and various cyclohexanedimethanols such as 1,3-cyclohexanedimethanol and 1,4-cyclohexanedimethanol.

[0032] Specific examples of the reaction product obtained by reacting a terminal isocyanate group of a polyaddition product of an isocyanate compound having at least two isocyanate groups per molecule with a diol compound with a (meth)acrylate having a hydroxyl group include compounds represented by the following general formulas (5) and (6).

[0033] [ka]

[0034] In the general formulae (5) and (6), n1 and n2 each independently represent an integer of 3 to 20.

[0035] Furthermore, when an isocyanurate trimer (isocyanurate triisocyanate), which is a trimer of diisocyanate, is used as the isocyanate compound, examples of the reaction product include compounds represented by the following general formulas (7) and (8).

[0036] [ka]

[0037] In the general formulae (7) and (8), n3 and n4 each independently represent an integer of 2 to 20.

[0038] Commercially available products containing a urethane acrylate having a structural unit represented by the general formula (3) include, for example, UN-333 (number of functional groups: 2, Mw: 5,000), UN-1255 (number of functional groups: 2, Mw: 8,000), UN-904 (number of functional groups: 10, Mw: 4,900), UN-2600 (number of functional groups: 2, Mw: 2,500), UN-6200 (number of functional groups: 2, Mw: 6,500), UN-9000PEP (number of functional groups: 2, Mw: 5,000), UN-9200A (number of functional groups: 2, Mw: 15,000), UN-3320HS (number of functional groups: 15, Mw: 4,900), Examples include UN-6301 (number of functional groups: 2, Mw: 33,000), UN-954 (number of functional groups: 6, weight-average molecular weight: 4,500), UN-953 (number of functional groups: 20, weight-average molecular weight: 14,000 to 40,000), H-219 (number of functional groups: 9, weight-average molecular weight: 25,000 to 50,000) (all of the above are trade names, manufactured by Negami Chemical Industrial Co., Ltd.), and EBECRYL8405 (addition product of urethane acrylate / 1,6-hexanediol diacrylate = 80 / 20, number of functional groups: 4, Mw: 2,700) (trade name, manufactured by Daicel-Allnex Corporation). Furthermore, examples of commercially available products containing urethane methacrylates having structural units represented by the general formula (3) include UN-6060PTM (number of functional groups: 2, Mw: 6,000, product name, manufactured by Negami Chemical Industrial Co., Ltd.) etc. In the above description, the number of functional groups in parentheses and Mw represent the total number of (meth)acryloyl groups contained in the urethane (meth)acrylate and the weight average molecular weight, respectively.

[0039] Furthermore, examples of commercially available products containing urethane acrylate represented by the above general formula (5) include UN-952 (number of functional groups: 10, Mw: 6,500 to 11,000), and examples of commercially available products containing urethane acrylate represented by the general formula (8) include UN-905 (number of functional groups: 15, Mw: 40,000 to 200,000) (all of the above are trade names, manufactured by Negami Chemical Industrial Co., Ltd.). Among these, UN-952 is particularly preferred from the viewpoints of pattern formability and photosensitivity.

[0040] The total number of (meth)acryloyl groups (number of photopolymerizable functional groups) contained in the urethane (meth)acrylate of component (A1) may be appropriately selected from 2 to 24 per molecule from the viewpoint of improving pattern formability and heat resistance, and from 4 to 15 or 6 to 12 from the viewpoint of stabilizing the physical properties and characteristics of the resulting cured product.

[0041] The weight-average molecular weight of component (A1) is at least 2,500, and may be at least 3,000 from the viewpoint of improving the coatability and resolution of the resin composition, and may be at least 3,500 from the viewpoint of improving the developability and compatibility. On the other hand, the upper limit of the weight-average molecular weight may be at most 40,000 or at most 30,000 from the viewpoint of improving the coatability and resolution of the resin composition, and may be at most 20,000 from the viewpoint of improving the developability and compatibility. A weight-average molecular weight of 2,500 or more can suppress the occurrence of sagging of the resin composition when applied to a substrate, resulting in excellent pattern formability. It also makes it easier to form a thick photosensitive layer, which can prevent the problem of increased stress in the resin due to cure shrinkage and reduced reliability. On the other hand, if the weight-average molecular weight is 40,000 or less, the coating property is improved, it becomes easy to form a thick photosensitive layer, and the pattern formability is improved. In addition, the solubility in the developer is also good, so that excellent resolution can be achieved. Furthermore, the transparency of the cured product is improved, and it is possible to obtain a cured product with the excellent transmittance required for a transparent material.

[0042] When the photosensitive resin composition of this embodiment contains the component (A1), the content of the component (A1) may be appropriately selected from 10% by mass or more, 30% by mass or more, or 40% by mass or more, based on the total solid content of the photosensitive resin composition. When the content is 10% by mass or more, the coatability is improved, and excellent pattern formability can be obtained even when a thick photosensitive layer is formed. Taking into consideration the pattern-forming ability and coatability of the resulting resin composition, and the physical properties and characteristics required of a cured product of the resin composition, the upper limit of the content of the component (A1) may be appropriately selected from 95 mass % or less, 85 mass % or less, or 75 mass % or less, based on the total solid content of the photosensitive resin composition. Furthermore, from the viewpoint of improving pattern formability, the content of the urethane (meth)acrylate in the (A1) component may be appropriately selected from 70 to 100 mass%, 80 to 100 mass%, 90 to 100 mass%, 95 to 100 mass%, or 100 mass% (total amount) based on the total solid content of the (A1) component.

[0043] (Component (A2): low molecular weight substance having a photopolymerizable functional group) The component (A2) is a low molecular weight compound having a photopolymerizable functional group. The term "low molecular weight compound" refers to a compound having a weight average molecular weight of less than 2,500. The photopolymerizable functional group contained in the component (A2) is the same as the photopolymerizable functional group contained in the component (A) described above, and from the viewpoint of improving pattern formability, the photopolymerizable functional group may contain a (meth)acryloyl group. The component (A2) has at least one photopolymerizable functional group, and the number of photopolymerizable functional groups may be appropriately selected from 1 to 12, 2 to 10, or 2 to 6 in order to improve pattern formability.

[0044] From the viewpoint of pattern formability, the photosensitive resin composition of this embodiment may contain, as component (A2), at least one selected from the group consisting of component (A2-1): a low-molecular-weight compound having a photopolymerizable functional group and an isocyanuric ring; component (A2-2): a low-molecular-weight compound having a photopolymerizable functional group and a urethane bond; and component (A2-3): a low-molecular-weight compound having a photopolymerizable functional group and an alicyclic skeleton. By including at least one of these compounds in the photosensitive resin composition of this embodiment, adhesion to the substrate of an electronic component tends to be improved, resulting in excellent pattern formability. Note that, in the case of a low-molecular-weight compound having two or more of an isocyanuric ring, a urethane bond, and an alicyclic skeleton, if it has at least an isocyanuric ring, it is classified as component (A2-1). Furthermore, in the case of a compound having a urethane bond and an alicyclic skeleton, it is classified as component (A2-2) based on the presence of the urethane bond. In other words, a low-molecular-weight compound having an alicyclic skeleton but no isocyanuric ring or urethane bond is classified as component (A2-3).

[0045] [Component (A2-1): Low-molecular-weight compound having an isocyanuric ring] The component (A2-1) is a low molecular weight compound having a photopolymerizable functional group and an isocyanuric ring skeleton, and from the viewpoint of improving pattern formability, it may have two or more photopolymerizable functional groups, or may have 2 to 5 photopolymerizable functional groups, or may have 2, 3, or even 3 photopolymerizable functional groups. The photopolymerizable functional group contained in the component (A2-1) is the same as the photopolymerizable functional group contained in the component (A) described above, and from the standpoint of improving pattern formability, the component (A2-1) may contain a (meth)acryloyl group as the photopolymerizable functional group. An example of the component (A2-1) is a compound represented by the following general formula (9).

[0046] [ka] (In general formula (9), R 13 , R 14 and R 15each independently represents an alkylene group having 1 to 8 carbon atoms; R 16 and R 17 each independently represents a hydrogen atom or a methyl group, and R 18 represents a hydrogen atom or a (meth)acryloyl group.

[0047] In general formula (9), R 13 , R 14 and R 15 The alkylene group having 1 to 8 carbon atoms represented by may be an alkylene group having 1 to 4 carbon atoms or an alkylene group having 1 to 3 carbon atoms. Examples of the alkylene group having 1 to 8 carbon atoms include a methylene group, an ethylene group, a propylene group, a butylene group, an isopropylene group, an isobutylene group, a t-butylene group, a pentylene group, and a hexylene group. Among these, an ethylene group may be used from the viewpoint of improving pattern formability. In general formula (9), R 16 and R 17 each independently represents a hydrogen atom or a methyl group, and may be a hydrogen atom from the viewpoint of improving sensitivity. In general formula (9), R 18 represents a hydrogen atom or a (meth)acryloyl group, and may be a (meth)acryloyl group from the viewpoint of improving pattern formability.

[0048] The compound represented by general formula (9) may be one or more selected from the group consisting of compounds represented by the following formula (9-1) and compounds represented by the following formula (9-2), and from the viewpoint of improving pattern formability, may be a compound represented by the following formula (9-1).

[0049] [ka]

[0050] The weight-average molecular weight of the component (A2-1) is less than 2,500, and may be appropriately selected from the range of 200 to 1,500, 300 to 1,000, or 350 to 600 in order to improve pattern formability.

[0051] The component (A2-1) may be a commercially available product, such as "A-9300" (a compound represented by the formula (9-1)) manufactured by Shin-Nakamura Chemical Co., Ltd., or "M-215" (a compound represented by the formula (9-2)) manufactured by Toagosei Co., Ltd. The component (A2-1) can be used alone or in combination of two or more types.

[0052] [Component (A2-2): Low-molecular-weight compound having a urethane bond] The component (A2-2) is a low molecular weight compound having a photopolymerizable functional group and a urethane bond, and from the viewpoint of improving pattern formability, it may have two or more photopolymerizable functional groups, or may have 2 to 6 photopolymerizable functional groups, or may have two photopolymerizable functional groups. The photopolymerizable functional group contained in the component (A2-2) is the same as the photopolymerizable functional group contained in the component (A) described above, and from the standpoint of improving pattern formability, the component (A2-2) may contain a (meth)acryloyl group as the photopolymerizable functional group.

[0053] Examples of the component (A2-2) include a reaction product of a (meth)acrylate having a hydroxyl group and an isocyanate compound having an isocyanate group. Examples of the (meth)acrylate having a hydroxyl group and the isocyanate compound include the (meth)acrylate having a hydroxyl group and the isocyanate compound exemplified for use in producing the component (A1). Examples of compounds appropriately selected from the viewpoint of improving pattern formability include the same compounds appropriately selected from the viewpoint of use in producing the component (A1).

[0054] Examples of the component (A2-2) include a reaction product in which a terminal isocyanate group of a polyaddition product of an isocyanate compound having at least two isocyanate groups per molecule and a diol compound is reacted with a (meth)acrylate having a hydroxyl group. Examples of the isocyanate compound having at least two isocyanate groups per molecule, the diol compound, and the (meth)acrylate having a hydroxyl group are the same as those exemplified for use in producing the component (A1). Examples of compounds appropriately selected from the viewpoint of improving pattern formability include the same compounds as those appropriately selected from the same viewpoint for use in producing the component (A1). An example of this reaction product is a urethane (meth)acrylate having a structural unit represented by the following general formula (10).

[0055] [ka]

[0056] In general formula (10), X2 represents a divalent organic group having a chain hydrocarbon skeleton, an alicyclic skeleton, or an aromatic ring skeleton, and Y2 represents a divalent organic group having a chain hydrocarbon skeleton or an alicyclic skeleton. That is, the component (A2-2) may be a compound having at least one skeleton selected from the group consisting of a chain hydrocarbon skeleton, an alicyclic skeleton, and an aromatic ring skeleton. Examples of X2 and Y2 are the same as those of X1 and Y1 in general formula (3). From the viewpoint of improving pattern formability and achieving a balanced improvement in the transparency, water resistance, and moisture resistance of the resin composition, X2 may be appropriately selected from divalent organic groups having a chain hydrocarbon skeleton, divalent organic groups having a branched chain hydrocarbon skeleton, and branched alkylene groups having 2 to 12 carbon atoms, such as residues of the above-mentioned aliphatic diisocyanate compounds. From the same viewpoint, Y2 may be appropriately selected from divalent organic groups having an alicyclic skeleton, such as residues of the above-mentioned diol compounds having an alicyclic skeleton.

[0057] Specific examples of the component (A2-2) include urethane acrylates represented by the following general formula (11).

[0058] [ka]

[0059] In the above general formula (11), n5 represents an integer of 1 to 4. 19 and R 20 are each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and multiple R 19 and R 20 At least three of the groups are alkyl groups having 1 to 4 carbon atoms. Among the urethane acrylates represented by the general formula (11) above, examples of commercially available products containing a urethane acrylate having a structural unit in which X2 in the general formula (10) above is a residue of trimethylhexamethylene diisocyanate, which is a divalent organic group having a chain hydrocarbon skeleton, and Y2 is a residue of cyclohexanedimethanol, which is a divalent organic group having an alicyclic skeleton, include TMCH-5R (trade name, number of functional groups: 2, Mw: 950, manufactured by Hitachi Chemical Co., Ltd.). Commercially available products containing a urethane (meth)acrylate having a structural unit represented by the general formula (10) include KRM8452 (number of functional groups: 10, Mw: 1,200, manufactured by Daicel-Allnex Corporation), UN-3320HA (number of functional groups: 6, Mw: 1,500, manufactured by Negami Chemical Industrial Co., Ltd.), and UN-3320HC (number of functional groups: 6, Mw: 1,500, manufactured by Negami Chemical Industrial Co., Ltd.) In the above description, the number of functional groups in parentheses and Mw represent the total number of (meth)acryloyl groups contained in the urethane (meth)acrylate and the weight-average molecular weight, respectively.

[0060] The weight-average molecular weight of the component (A2-2) is less than 2,500, and may be 1,500 or less from the viewpoint of improving adhesion, and may be 1,000 or less from the viewpoint of improving resolution. On the other hand, the lower limit of the weight-average molecular weight can be appropriately set depending on the desired purpose, but from the viewpoint of film formability, it may be 500 or more.

[0061] [Component (A2-3): Low-molecular-weight compound having an alicyclic skeleton] The component (A2-3) is a low molecular weight compound having a photopolymerizable functional group and an alicyclic skeleton, and from the viewpoint of improving pattern formability, it may have two or more photopolymerizable functional groups, or may have two to four photopolymerizable functional groups, or may have two photopolymerizable functional groups. The photopolymerizable functional group contained in the component (A2-3) is the same as the photopolymerizable functional group contained in the component (A) described above, and from the standpoint of improving pattern formability, the component (A2-3) may contain a (meth)acryloyl group as the photopolymerizable functional group. The alicyclic skeleton contained in the component (A2-3) is not particularly limited, and examples thereof include alicyclic hydrocarbon skeletons having 5 to 20 carbon atoms. The alicyclic hydrocarbon skeleton may be at least one selected from the group consisting of a cyclopentane skeleton, a cyclohexane skeleton, a cyclooctane skeleton, a cyclodecane skeleton, a norbornane skeleton, a dicyclopentane skeleton, and a tricyclodecane skeleton. Among these, a tricyclodecane skeleton may be used from the viewpoint of improving pattern formability.

[0062] The weight-average molecular weight of the component (A2-3) is less than 2,500, and may be 1,500 or less from the viewpoint of improving adhesion, and may be 1,000 or less from the viewpoint of improving resolution, or may be 500 or less. On the other hand, the lower limit of the weight-average molecular weight can be appropriately set depending on the desired purpose, but may be 150 or more, or 200 or more from the viewpoint of film formability. From the viewpoint of film-forming properties, the component (A2-3) may be tricyclodecane dimethanol diacrylate.

[0063] When the photosensitive resin composition of this embodiment contains the component (A2), the content of the component (A2) may be appropriately selected from 3% by mass or more, 5% by mass or more, 10% by mass or more, or 20% by mass or more, based on the total solid content of the photosensitive resin composition. When the content of the component (A2) is 3% by mass or more, excellent pattern formability can be obtained even when a thick photosensitive layer is formed, and excellent rigidity of the cured product can also be obtained. From the same viewpoint, the upper limit of the content of the component (A2) may be appropriately selected from 70% by mass or less, 60% by mass or less, or 50% by mass or less, based on the total solid content of the photosensitive resin composition.

[0064] When the photosensitive resin composition of this embodiment contains the component (A1) and the component (A2), the content of the component (A2) relative to 100 parts by mass of the total solid content of the component (A1) may be appropriately selected from 20 to 120 parts by mass, 25 to 110 parts by mass, or 30 to 100 parts by mass, from the viewpoint of improving pattern formability and rigidity of the cured product.

[0065] When the component (A2) contains the component (A2-1), the amount of the component (A2-1) relative to the total solid content of the component (A2) may be appropriately selected from 15% by mass or more, 40% by mass or more, 70% by mass or more, 90% by mass or more, or 95% by mass or more. A content of the component (A2-1) of 15% by mass or more provides excellent pattern formability even when a thick photosensitive layer is formed, and also provides excellent rigidity of the cured product. From the same viewpoint, the upper limit of the amount of the component (A2-1) is 100% by mass or less, and 100% by mass, i.e., the entirety of the component (A2) may be the component (A2-1). When the component (A2) contains the component (A2-2), the content of the component (A2-2) in the total solid content of the component (A2) may be appropriately selected from 20 to 100 mass%, 40 to 95 mass%, or 50 to 90 mass%. When the component (A2) contains the component (A2-3), the content of the component (A2-3) relative to the total solid content of the component (A2) may be appropriately selected from 10 to 50 mass%, 15 to 40 mass%, or 20 to 30 mass%.

[0066] <Component (B): Photopolymerization initiator> The photosensitive resin composition of the present embodiment contains, as the component (B), a photosensitive resin having a molar absorption coefficient of 8.0×10 3 Contains a photoinitiator with a molecular weight of less than L / mol cm. The photosensitive resin composition of this embodiment contains component (B) as a photopolymerization initiator, which can reduce the absorbance of the photosensitive resin composition and allow light to pass through appropriately to the bottom of the photosensitive layer (the surface of the photosensitive layer facing the substrate), thereby improving pattern formability. Furthermore, by setting the molar absorption coefficient of the photopolymerization initiator within the above range, the progress of the photopolymerization reaction in areas other than the exposed area can be suppressed, thereby achieving excellent pattern formability. From the viewpoint of improving pattern formability, the molar absorption coefficient of the component (B) is 5.0 × 10 3 L / mol·cm or less, 3.0×10 3 L / mol·cm or less, 1.0×10 3 L / mol·cm or less, 0.5×10 3 L / mol·cm or less, 0.2×10 3 L / mol cm or less, or 0.1×10 3 The lower limit of the molar extinction coefficient of component (B) is not particularly limited, but may be appropriately selected from, for example, 1 L / mol cm or more, 5 L / mol cm or more, or 10 L / mol cm or more. The molar absorption coefficient of the component (B) can be measured, for example, using an ultraviolet-visible spectrophotometer according to the method described in the Examples.

[0067] The component (B) has a molar absorption coefficient of 8.0 × 10 3There are no particular limitations on the photopolymerization initiator, and it can be appropriately selected from commonly used photopolymerization initiators, as long as it has a viscosity of less than L / mol cm and can polymerize the photosensitive resin. From the viewpoint of improving pattern formability, examples of photopolymerization initiators that generate free radicals when exposed to actinic rays include acylphosphine oxide-based, oxime ester-based, aromatic ketone-based, quinone-based, alkylphenone-based, imidazole-based, acridine-based, phenylglycine-based, and coumarin-based photopolymerization initiators. Among these, component (B) may contain at least one selected from the group consisting of alkylphenone-based photopolymerization initiators and acylphosphine oxide-based photopolymerization initiators.

[0068] The acylphosphine oxide photopolymerization initiator has an acylphosphine oxide group (>P(=O)-C(=O)- group), and examples thereof include (2,6-dimethoxybenzoyl)-2,4,6-pentylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide ("IRGACURE-TPO" (BASF)), ethyl-2,4,6-trimethylbenzoylphenylphosphinate, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide ("IRGACURE-819" (BASF)), (2,5-dihydroxyphenyl)diphenylphosphine oxide, (p-hydroxyphenyl)diphenylphosphine oxide, bis(p-hydroxyphenyl)phenylphosphine oxide, and tris(p-hydroxyphenyl)phosphine oxide.

[0069] The oxime ester photopolymerization initiator is a photopolymerization initiator having an oxime ester bond, and examples thereof include 1,2-octanedione-1-[4-(phenylthio)phenyl]-2-(O-benzoyloxime) (trade name: OXE-01, manufactured by BASF), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone-1-(O-acetyloxime) (trade name: OXE-02, manufactured by BASF), and 1-phenyl-1,2-propanedione-2-[O-(ethoxycarbonyl)oxime] (trade name: Quantacure-PDO, manufactured by Nippon Kayaku Co., Ltd.).

[0070] Examples of aromatic ketone photopolymerization initiators include benzophenone, N,N'-tetramethyl-4,4'-diaminobenzophenone (Michler's ketone), N,N'-tetraethyl-4,4'-diaminobenzophenone, 4-methoxy-4'-dimethylaminobenzophenone, 2,2-dimethoxy-1,2-diphenylethan-1-one ("IRGACURE-651" (BASF)), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one ("IRGACURE-369" (BASF)), and 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propan-1-one ("IRGACURE-907" (BASF)).

[0071] Examples of quinone photopolymerization initiators include 2-ethylanthraquinone, phenanthrenequinone, 2-t-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-phenylanthraquinone, 2,3-diphenylanthraquinone, 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthraquinone, 2-methyl-1,4-naphthoquinone, and 2,3-dimethylanthraquinone.

[0072] Examples of alkylphenone-based photopolymerization initiators include benzoin-based compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin phenyl ether; 2,2-dimethoxy-1,2-diphenylethan-1-one ("IRGACURE-651" (BASF)); 1-hydroxy-cyclohexyl-phenyl-ketone ("IRGACURE-184" (BASF)); 2-hydroxy-2-methyl-1- Examples include phenyl-propan-1-one ("IRGACURE-1173" (BASF)), 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one ("IRGACURE-2959" (BASF)), and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methyl-propan-1-one ("IRGACURE-127" (BASF)).

[0073] Examples of the imidazole-based photopolymerization initiator include 2,4,5-triarylimidazole dimers such as 2-(o-chlorophenyl)-4,5-diphenylimidazole dimers such as 2-(2-chlorophenyl)-1-[2-(2-chlorophenyl)-4,5-diphenyl-1,3-diazol-2-yl]-4,5-diphenylimidazole, 2-(o-chlorophenyl)-4,5-di(methoxyphenyl)imidazole dimers, 2-(o-fluorophenyl)-4,5-diphenylimidazole dimers, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimers, and 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimers.

[0074] Examples of the acridine-based photopolymerization initiator include 9-phenylacridine and 1,7-bis(9,9'-acridinyl)heptane.

[0075] Examples of the phenylglycine-based photopolymerization initiator include N-phenylglycine, N-methyl-N-phenylglycine, and N-ethyl-N-phenylglycine.

[0076] Furthermore, examples of the coumarin-based photopolymerization initiator include 7-amino-4-methylcoumarin, 7-dimethylamino-4-methylcoumarin, 7-diethylamino-4-methylcoumarin, 7-methylamino-4-methylcoumarin, 7-ethylamino-4-methylcoumarin, 7-methylaminocyclopenta[c]coumarin, 7-aminocyclopenta[c]coumarin, 7-diethylaminocyclopenta[c]coumarin, 4,6-dimethyl-7-ethylaminocoumarin, 4,6-diethyl-7-ethylaminocoumarin, and 4,6-dimethyl-7-diethylaminocoumarin. 7-Diethylamino-5',7'-dimethoxy-3,3'-carbonylbiscoumarin, 3,3'-carbonylbis[7-(diethylamino)coumarin], 7-diethylamino-3-thienoxacumarin, and the like.

[0077] Among these, from the viewpoint of improving pattern formability, the component (B) may contain at least one compound selected from the group consisting of a compound represented by the following general formula (1) and a compound represented by the following general formula (2):

[0078] [ka] (In general formula (1), R 1 , R 2 and R 3 each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or an alkoxy group having 1 to 8 carbon atoms; R 4 and R 5 each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, or an aryl group having 6 to 12 carbon atoms. 1 ~R 5 may each have a substituent.

[0079] [ka] (In general formula (2), R 6 represents a hydroxyl group, an alkoxy group having 1 to 8 carbon atoms, or an amino group, and R 7 and R 8 R each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, or an aryl group having 6 to 12 carbon atoms. 7 and R 8 may be bonded to each other to form a ring structure having 3 to 16 carbon atoms. 6 ~R 8 may each have a substituent, and in the case of amino groups having a substituent, the substituents may be bonded to each other to form a ring structure having 3 to 12 carbon atoms. 9 each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a mercapto group, or an organic group having 1 to 10 carbon atoms which may contain one or more atoms selected from an oxygen atom, a nitrogen atom, and a sulfur atom.

[0080] In general formula (1), R 1 , R 2 and R 3 each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or an alkoxy group having 1 to 8 carbon atoms. R 1 , R 2 and R 3 The alkyl group having 1 to 8 carbon atoms represented by may be an alkyl group having 1 to 4 carbon atoms, or an alkyl group having 1 or 2 carbon atoms. Examples of the alkyl group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a tert-butyl group, an n-heptyl group, an n-hexyl group, and an n-octyl group. R 1 , R 2 and R 3The alkoxy group having 1 to 8 carbon atoms represented by may be an alkoxy group having 1 to 4 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms. Examples of the alkoxy group include a methoxy group, an ethoxy group, an n-propoxy group, an isopropoxy group, an n-butoxy group, a tert-butoxy group, an n-heptyloxy group, an n-hexyloxy group, and an n-octyloxy group. Among these groups, R 1 , R 2 and R 3 may be a methyl group from the viewpoint of improving resolution.

[0081] In general formula (1), R 4 and R 5 each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, or an aryl group having 6 to 12 carbon atoms. R 4 and R 5 The alkyl group having 1 to 8 carbon atoms and the alkoxy group having 1 to 8 carbon atoms represented by R 1 , R 2 and R 3 This is explained in the same way as in the case of R 4 and R 5 The aryl group having 6 to 12 carbon atoms represented by may be an aryl group having 6 to 10 carbon atoms, or an aryl group having 6 to 8 carbon atoms. Examples of the aryl group include a phenyl group and a naphthyl group.

[0082] R 1 ~R 5 Examples of the substituent that R may have include a halogen atom, a carboxy group, a hydroxy group, an amino group, a mercapto group, an alkyl group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, and an aryl group having 6 to 12 carbon atoms. 1 ~R 5 The alkyl group, alkoxy group and aryl group which may be substituted by R 1 ~R 5 Examples of the alkyl group, alkoxy group, and aryl group are the same as those described above.

[0083] In general formula (2), R 6 represents a hydroxyl group, an alkoxy group having 1 to 8 carbon atoms, or an amino group. R 6 The alkoxy group represented by is R 1 , R 2 and R 3 This is explained in the same way as in the case of Among these groups, R 6 may be a hydroxyl group or a methoxy group from the viewpoint of improving pattern formability.

[0084] In general formula (2), R 7 and R 8 each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, or an aryl group having 6 to 12 carbon atoms. R 7 and R 8 The alkyl group, alkoxy group and aryl group represented by R in general formula (1) 1 ~R 5 This is explained in the same way as in the case of R 7 and R 8 may be bonded to each other to form a ring structure having 3 to 16 carbon atoms. The cyclic structure may be a cyclic structure having 4 to 10 carbon atoms, or may be a cyclic structure having 5 to 8 carbon atoms. The cyclic structure may be an alicyclic structure from the viewpoint of improving pattern formability, and examples of the alicyclic structure include a cyclopentane structure, a cyclohexane structure, a cycloheptane structure, and a cyclooctane structure. 7 and R 8 may contain carbon atoms that are directly bonded together.

[0085] R 6 ~R 8 The substituents that may be possessed by R in the general formula (1) are as follows: 1 ~R 5 The substituents that may be possessed by the group are explained in the same manner as those of the group. However, in the amino group having a substituent, the substituents may be bonded to each other to form a ring structure having 3 to 12 carbon atoms. The cyclic structure formed by the substituent of the amino group may be a cyclic structure having 3 to 10 carbon atoms, or may be a cyclic structure having 3 to 5 carbon atoms. The cyclic structure may be a 5- to 10-membered ring containing the nitrogen atom of the amino group, a 5- to 7-membered ring containing the nitrogen atom of the amino group, or a 6-membered ring containing the nitrogen atom of the amino group. Furthermore, these cyclic structures may contain a heteroatom other than the nitrogen atom, such as an oxygen atom. Specific examples of cyclic structures formed by substituents on amino groups include structures represented by the following formula (2-1):

[0086] [ka]

[0087] In general formula (2), R 9 each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a mercapto group, or an organic group having 1 to 10 carbon atoms which may contain one or more atoms selected from an oxygen atom, a nitrogen atom, and a sulfur atom. R 9 The organic group having 1 to 10 carbon atoms represented by may be an organic group having 1 to 6 carbon atoms, or an organic group having 1 to 4 carbon atoms. R 9 The organic group having 1 to 10 carbon atoms represented by may be a hydrocarbon group such as an alkyl group, an alkenyl group, or an aryl group. These alkyl groups, alkenyl groups, and aryl groups include those represented by R 1 ~R 5 The alkyl group, alkenyl group and aryl group represented by are explained in the same manner as those represented by the above. R 9 Examples of the organic group having 1 to 10 carbon atoms and containing an oxygen atom represented by include an alkoxy group. R 9 Examples of the organic group having 1 to 10 carbon atoms and containing a nitrogen atom represented by the formula (2-1) include groups represented by the formula (2-1) above. R 9Examples of the organic group having 1 to 10 carbon atoms and containing a sulfur atom represented by include alkylthio groups such as methylthio groups.

[0088] The content of component (B) may be appropriately selected from the following amounts such that, when the photosensitive resin composition of this embodiment has a thickness of 50 μm, the absorbance for light with a wavelength of 365 nm is less than 0.35, 0.34 or less, 0.30 or less, 0.26 or less, or 0.22 or less. By setting the content of component (B) within the above range, even when a pattern is formed using a thick photosensitive layer of, for example, 70 μm or more using the photosensitive resin composition of this embodiment, light can easily pass through to the bottom of the photosensitive layer (the surface of the photosensitive layer facing the substrate), thereby improving pattern formability.

[0089] The content of component (B) is usually selected appropriately from 0.05 to 30 mass%, 0.2 to 20 mass%, or 0.5 to 15 mass%, based on the total solid content of the photosensitive resin composition. By setting the content within the above range, the sensitivity of the photosensitive resin composition can be improved, deterioration of the resist shape can be suppressed, and pattern formability can be improved.

[0090] The content of component (B) may be determined depending on the molar absorption coefficient, molecular weight, etc. of component (B), and may be appropriately selected from amounts such that the value P, expressed by the following formula, calculated from the molar absorption coefficient, molecular weight, and content of the photopolymerization initiator, is 0.1 or more, 0.2 or more, or 0.3 or more, or 3 or less, 2 or less, or 1.2 or less. When P, expressed by formula (i), is within the above range, excellent pattern formability is obtained. P=A×B / C (i) A: Molar absorption coefficient of the photoinitiator at 365 nm (L / mol cm) B: The content (mass%) of the photopolymerization initiator relative to the total amount of the photosensitive resin composition (however, if the photosensitive resin composition contains a filler, the mass of the filler is excluded). C: Molecular weight of photopolymerization initiator

[0091] In addition to the component (B) described above, (B') photopolymerization initiation aids such as tertiary amines such as N,N-dimethylaminobenzoic acid ethyl ester, N,N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, and triethanolamine can also be used alone or in combination of two or more.

[0092] <Component (C): Silane Compound> The photosensitive resin composition of the present embodiment may further contain a silane compound (C). Known silane coupling agents can be used as component (C). Component (C) can improve the adhesion of electronic components to the substrate, and is particularly effective when the substrate is a silicon-containing substrate (e.g., glass substrate, silicon wafer, epoxy resin-impregnated glass cloth substrate, etc.). Examples of silane coupling agents include alkoxysilanes such as methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, and phenyltriethoxysilane; (meth)acryloxypropyltrimethoxysilane, (meth)acryloxypropylmethyldimethoxysilane, and other (meth)acryloyl group-containing alkoxysilanes; γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, and 3-triethoxysilyl-N-(1,3-dimethylbutylidene)propylamine, and other amine-based alkoxysilanes; γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, and glycidoxypropyltriethoxysilane. Examples of suitable alkoxysilanes include glycidoxy group-containing alkoxysilanes such as glycidoxypropylmethyldiethoxysilane and glycidoxypropylmethyldiisopropenoxysilane; alicyclic epoxy group-containing alkoxysilanes such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane; ureido group-containing alkoxysilanes such as 3-ureidopropyltriethoxysilane; mercapto group-containing alkoxysilanes such as 3-mercaptopropyltrimethoxysilane and 3-mercaptopropylmethyldimethoxysilane; carbamate group-containing alkoxysilanes such as triethoxysilylpropylethylcarbamate; and polybasic acid anhydride group-containing alkoxysilanes such as 3-(triethoxysilyl)propylsuccinic anhydride. These may be used alone or in combination of two or more. From the viewpoint of further improving adhesion, a silane coupling agent having an ethylenically unsaturated group in the molecule may be used, such as a (meth)acryloyl group-containing alkoxysilane such as (meth)acryloxypropyltrimethoxysilane or (meth)acryloxypropylmethyldimethoxysilane, or a glycidoxy group-containing alkoxysilane such as glycidoxypropyltrimethoxysilane, glycidoxypropylmethyldiethoxysilane or glycidoxypropylmethyldiisopropenoxysilane.

[0093] When the photosensitive resin composition contains component (C), the content of component (C) may be appropriately selected from 0.05 to 15 mass%, 0.1 to 10 mass%, 0.1 to 7 mass%, 1 to 7 mass%, or 1 to 5 mass%, based on the total solid content of the photosensitive resin composition. By setting the content within the above range, deterioration of the resist shape can be suppressed and pattern formability can be improved.

[0094] <(D) component: high Tg polymer> The photosensitive resin composition of this embodiment may contain, as component (D), a polymer having a glass transition temperature of 70 to 150°C and no carbon-nitrogen bond. The term "polymer" is defined as in the component (A1) above. The inclusion of component (D) has the effect of suppressing tackiness of the photosensitive resin composition. From the viewpoints of pattern formability and reducing tackiness, component (D) may contain an ethylenically unsaturated group. Examples of the ethylenically unsaturated group include a (meth)acryloyl group and a vinyl group, and from the viewpoint of pattern formability, the ethylenically unsaturated group may be a (meth)acryloyl group. The component (D) may contain a polymer having at least one skeleton selected from the group consisting of an alicyclic skeleton and an aromatic ring skeleton, and from the viewpoints of pattern formability and reduced tackiness, may contain a polymer having an alicyclic skeleton.

[0095] The polymer having an alicyclic skeleton can be produced, for example, by reacting a portion of the acid groups derived from an acid group-containing acrylic resin (d1) having no carbon-nitrogen bond with epoxy groups derived from an alicyclic epoxy group-containing unsaturated compound (d2) having no carbon-nitrogen bond. The acid group-containing acrylic resin (d1) having no carbon-nitrogen bond can be a copolymer obtained by copolymerizing an acid having an ethylenically unsaturated group with one or more monomers selected from the group consisting of esters of (meth)acrylic acid, vinyl aromatic compounds, polyolefin compounds, and the like. Specific examples include copolymers obtained by copolymerizing an acid having an ethylenically unsaturated group, such as (meth)acrylic acid, 2-carboxyethyl (meth)acrylate, 2-carboxypropyl (meth)acrylate, or (anhydrous) maleic acid, as an essential component, with one or more monomers selected from (meth)acrylic acid esters such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, stearyl (meth)acrylate, hydroxyethyl (meth)acrylate, and hydroxypropyl (meth)acrylate; vinyl aromatic compounds such as styrene, α-methylstyrene, vinyltoluene, and p-chlorostyrene; polyolefin compound monomers such as butadiene, isoprene, and chloroprene; and other monomers such as methyl isopropenyl ketone, vinyl acetate, and vinyl propionate. The acid value of component (d1) may be 15 mgKOH / g or more, or may be 40 to 500 mgKOH / g. When component (d1) has such an acid value, a sufficient amount of acid groups remains in component (D) even after component (d1) is reacted with component (d2), which will be described later.

[0096] The alicyclic epoxy group-containing unsaturated compound (d2) having no carbon-nitrogen bond is preferably a compound having one ethylenically unsaturated group and an alicyclic epoxy group in one molecule. Specific examples thereof include compounds represented by any of the following formulae (I) to (X):

[0097] [ka]

[0098] [ka]

[0099] where R D1 are each independently a hydrogen atom or a methyl group. D2 are each independently a saturated aliphatic hydrocarbon group. R D2 Examples of the aliphatic saturated hydrocarbon group represented by the formula (I) include a linear or branched alkylene group having 1 to 6 carbon atoms, a cycloalkylene group having 3 to 8 carbon atoms, an arylene group having 6 to 14 carbon atoms, and divalent organic groups formed by a combination thereof. Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, a tetramethylene group, an ethylethylene group, a pentamethylene group, and a hexamethylene group. Examples of the cycloalkylene group include a cyclopentylene group, a cyclohexylene group, and a cyclooctylene group. Examples of the arylene group include a phenylene group and a naphthylene group. Examples of the divalent organic group formed by a combination thereof include a -CH2-phenylene group -CH2- and a -CH2-cyclohexylene group -CH2-. R D2 From the viewpoint of pattern formability and reducing tackiness, the alkyl group may be a methylene group, an ethylene group, a propylene group, a tetramethylene group, an ethylethylene group, a pentamethylene group, a hexamethylene group, a phenylene group, a cyclohexylene group, a -CH-phenylene group -CH-, a methylene group, an ethylene group, a propylene group, or a methylene group.

[0100] The alicyclic epoxy group-containing unsaturated compound (d2) having no carbon-nitrogen bond may be a compound represented by the above formula (III) from the viewpoint of pattern formability. Component (D) may be a commercially available product, such as (ACA)Z250 from the Cyclomer P series (manufactured by Daicel-Allnex Corporation, acid value 101.7 mgKOH / g). (ACA)Z250 is a resin composed of three structural units represented by the following formula, which are produced by reacting an acid group-containing acrylic resin with an alicyclic epoxy group-containing unsaturated compound.

[0101] [ka] (In the formula, R D1 represents a hydrogen atom or a methyl group. D3 represents an alkyl group having 1 to 6 carbon atoms or a hydroxyalkyl group having 1 to 6 carbon atoms.

[0102] The glass transition temperature of component (D) is 70 to 150° C., but may alternatively be 100 to 150° C., 115 to 150° C., or 125 to 150° C. Here, the glass transition temperature of component (D) is a value measured by the following method. (Method for measuring the glass transition temperature of component (D)) As a pretreatment for the measurement, component (D) is heated at 120°C for 3 hours and then cooled to prepare a sample. Using 10 mg of the sample, a differential scanning calorimeter (Shimadzu Corporation, product name: DSC-50) is used to heat the sample in a nitrogen stream over a temperature range of 25 to 200°C at a heating rate of 20°C / min to eliminate the influence of the solvent, etc. After cooling to 25°C, the sample is again heated under the same conditions, and the temperature at which the baseline begins to deviate is taken as the glass transition temperature.

[0103] The weight average molecular weight of component (D) may be 3,000 to 50,000, 4,000 to 40,000, or 5,000 to 30,000. If it is 3,000 or more, the tack suppression effect tends to be greater, and if it is 50,000 or less, the resolution tends to be improved.

[0104] When the photosensitive resin composition of the present embodiment contains the component (D), the content of the component (D) may be 5 to 60 parts by mass, 10 to 40 parts by mass, or 10 to 30 parts by mass, relative to 100 parts by mass of the total of the component (A1) and the component (D), from the viewpoints of pattern formability and reducing tackiness.

[0105] <Component (E): Thermal radical polymerization initiator> The photosensitive resin composition of this embodiment may further contain (E) a thermal radical polymerization initiator. The component (E) is not particularly limited, and examples thereof include dialkyl peroxides such as α,α'-bis(t-butylperoxy)diisopropylbenzene, dicumyl peroxide, t-butylcumyl peroxide, and di-t-butyl peroxide; ketone peroxides such as methyl ethyl ketone peroxide, cyclohexanone peroxide, and methylcyclohexanone peroxide; 1,1-bis(t-butylperoxy)cyclohexane, 1,1-bis(t-butylperoxy)-2-methylcyclohexane, 1,1-bis(t-butylperoxy)-3,3,5-trimethylcyclohexane, and 1,1-bis(t-butylperoxy)-2-methylcyclohexane. Peroxyketals such as 1,1-bis(t-hexylperoxy)cyclohexane and 1,1-bis(t-hexylperoxy)-3,3,5-trimethylcyclohexane; hydroperoxides such as p-menthane hydroperoxide; diacyl peroxides such as octanoyl peroxide, lauroyl peroxide, stearyl peroxide, and benzoyl peroxide; peroxycarbonates such as bis(4-t-butylcyclohexyl) peroxydicarbonate, di-2-ethoxyethyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, and di-3-methoxybutyl peroxycarbonate;t-Butyl peroxypivalate, t-hexyl peroxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis(2-ethylhexanoylperoxy)hexane, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t-butylperoxyisobutyrate, t-hexylperoxyisopropyl monocarbonate, t-butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylaurylate, t-butyl Examples of the initiator include peroxide-based polymerization initiators such as peroxyesters such as peroxyisopropyl monocarbonate, t-butylperoxy-2-ethylhexyl monocarbonate, t-butyl peroxybenzoate, t-hexyl peroxybenzoate, 2,5-dimethyl-2,5-bis(benzoylperoxy)hexane, and t-butyl peroxyacetate, and azo-based polymerization initiators such as 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), and 2,2'-azobis(4-methoxy-2'-dimethylvaleronitrile);

[0106] From the viewpoint of improving pattern formability, the component (E) may be a peroxide polymerization initiator, a dialkyl peroxide polymerization initiator, or the like, among which dicumyl peroxide may be selected. The component (E) may be used alone or in combination of two or more.

[0107] When component (E) is contained, its content may be appropriately selected from 0.1 to 10 mass%, 0.2 to 5 mass%, or 0.3 to 1.5 mass%, based on the total solid content of the photosensitive resin composition. By setting the content within the above range, the heat resistance of the photosensitive resin composition is improved, and the reliability when used as a permanent film is improved.

[0108] <(F) Component: Inorganic filler> The photosensitive resin composition of the present embodiment may contain (F) an inorganic filler for the purpose of further improving various properties such as adhesion between the photosensitive resin composition and a substrate, heat resistance, and rigidity of the cured product. Examples of the (F) component include silica (SiO2), alumina (Al2O3), titania (TiO2), tantalum oxide (Ta2O5), zirconia (ZrO2), silicon nitride (Si3N4), barium titanate (BaO·TiO2), barium carbonate (BaCO3), magnesium carbonate (MgCO3), aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), lead titanate (PbO·TiO2), lead zirconate titanate (PZT), lead lanthanum zirconate titanate (PLZT), gallium oxide (Ga2O3), spinel (MgO·Al2O3), and magnesium hydroxide (Mg(OH)2). Examples of inorganic fillers that can be used include zirconia (Y2O3·ZrO2), zirconia silicate (BaO·8SiO2), boron nitride (BN), calcium carbonate (CaCO3), barium sulfate (BaSO4), calcium sulfate (CaSO4), zinc oxide (ZnO), magnesium titanate (MgO·TiO2), hydrotalcite, mica, calcined kaolin, and carbon (C). These inorganic fillers can be used alone or in combination.

[0109] The average particle size of component (F) may be appropriately selected from 0.01 to 3 μm, 0.01 to 2 μm, or 0.02 to 1 μm from the viewpoint of improving adhesiveness, heat resistance, and rigidity of the cured product. Here, the average particle size of component (F) refers to the average particle size of the inorganic filler dispersed in the photosensitive resin composition, and is a value obtained by measuring it as follows. First, the photosensitive resin composition is diluted (or dissolved) 1,000 times (by volume) with methyl ethyl ketone, and then particles dispersed in the solvent are measured using a submicron particle analyzer (manufactured by Beckman Coulter, Inc., product name: N5) in accordance with the international standard ISO 13321 at a refractive index of 1.38. The particle size at 50% of the cumulative value (by volume) in the particle size distribution is taken as the average particle size. Furthermore, component (F) contained in the photosensitive layer or cured film of the photosensitive resin composition formed on the carrier film can also be measured using the submicron particle analyzer after diluting (or dissolving) the composition 1,000 times (by volume) with a solvent as described above.

[0110] The content of component (F), based on the total solid content of the photosensitive resin composition, may be appropriately selected from the range of 10% by mass or less, 5% by mass or less, or 1% by mass or less, and the lower limit may be appropriately selected from the range of more than 0% by mass, or may be 0% by mass (exclusive). By substantially not including component (F), the transmittance of the photosensitive resin composition is improved, and even when a pattern is formed using a thick photosensitive layer of, for example, 70 μm or more, light can easily pass through to the bottom of the photosensitive layer (the surface of the photosensitive layer facing the substrate), thereby improving pattern formability.

[0111] <Other additives> The photosensitive resin composition of the present embodiment may further contain additives such as a sensitizer, a heat-resistant polymer, a thermal crosslinking agent, and an adhesion aid other than the component (C), as needed.

[0112] Examples of sensitizers include pyrazolines, anthracenes, xanthones, oxazoles, benzoxazoles, thiazoles, benzothiazoles, triazoles, stilbenes, triazines, thiophenes, naphthalimides, etc. These can be used alone or in combination of two or more.

[0113] Examples of heat-resistant polymers that can be used as engineering plastics from the viewpoint of improving processability include polyoxazoles and their precursors, novolak resins such as phenol novolak and cresol novolak, polyamideimides, polyamides, etc. These may be used alone or in combination of two or more thereof.

[0114] Examples of the thermal crosslinking agent, from the viewpoint of improving the rigidity of the cured product, include epoxy resins, phenolic resins substituted at the α-position with a methylol group or an alkoxymethyl group, melamine resins substituted at the N-position with at least one group selected from the group consisting of a methylol group and an alkoxymethyl group, and urea resins. These may be used alone or in combination of two or more.

[0115] The content of these other additives is not particularly limited as long as it is within a range that does not impair the effects of the photosensitive resin composition of the present embodiment, and may be appropriately selected from, for example, 0.1 to 10 mass %, 0.3 to 5 mass %, or 0.5 to 5 mass % based on the total solid content of the photosensitive resin composition.

[0116] The contents of the component (A), the component (B), the components (C) to (F) used as needed, and other additives in the photosensitive resin composition of this embodiment are appropriately determined within a range such that when the photosensitive resin composition of this embodiment has a thickness of 50 μm, the absorbance for light with a wavelength of 365 nm is less than 0.35.

[0117] <Diluent> A diluent can be used in the photosensitive resin composition of this embodiment, if necessary. Examples of diluents include polar solvents such as alcohols having 1 to 6 carbon atoms, such as isopropanol, isobutanol, and t-butanol; amides, such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methylpyrrolidone; sulfur-containing solvents, such as dimethyl sulfoxide and sulfolane; esters, such as γ-butyrolactone and dimethyl carbonate; and esters, such as cellosolve acetate, ethyl cellosolve acetate, butyl cellosolve acetate, carbitol acetate, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, and propylene glycol monoethyl ether acetate. These diluents can be used alone or in combination of two or more.

[0118] The amount of diluent used may be appropriately selected from amounts such that the total solid content in the photosensitive resin composition is 50 to 90 mass%, 60 to 80 mass%, or 65 to 75 mass%. That is, when a diluent is used, the content of the diluent in the photosensitive resin composition may be appropriately selected from 10 to 50 mass%, 20 to 40 mass%, or 25 to 35 mass%. By setting the amount of diluent used within the above range, the coatability of the photosensitive resin composition is improved, and it becomes possible to form a more precise pattern. Furthermore, for example, when forming a photosensitive layer having a thickness of 70 μm or more, the amount can be set so that the viscosity of the photosensitive resin composition at 25°C is 0.5 to 20 Pa·s or 1 to 10 Pa·s, taking into consideration the ease of forming the photosensitive layer.

[0119] The photosensitive resin composition of the present embodiment can be obtained by uniformly kneading and mixing the above-mentioned component (A), component (B), components (C) to (F) that are used as desired, other additives, and a diluent using a roll mill, a bead mill, or the like.

[0120] The photosensitive resin composition of the present embodiment may be used in the form of a liquid or a film. When used in a liquid form, the method for applying the photosensitive resin composition of the present embodiment is not particularly limited, and examples thereof include various application methods such as printing, spin coating, spray coating, jet dispensing, inkjet coating, dip coating, etc. Among these, from the viewpoint of more easily forming a thick photosensitive layer, the printing method or spin coating method may be appropriately selected. When used in the form of a film, it can be used, for example, in the form of a photosensitive resin film described below. In this case, a photosensitive layer of the desired thickness can be formed by laminating layers using a laminator or the like.

[0121] [Photosensitive resin film] The photosensitive resin film of the present embodiment has a photosensitive layer using the photosensitive resin composition of the present embodiment. The photosensitive resin film of the present embodiment may have a carrier film. In this specification, the term "layer" includes a structure having a shape formed on a part of the surface as well as a structure having a shape formed on the entire surface when observed in a plan view.

[0122] The photosensitive resin film of the present embodiment can be produced, for example, by applying the photosensitive resin composition of the present embodiment to a carrier film by any of the above-mentioned coating methods to form a coating film, and then drying the coating film to form a photosensitive layer. When the photosensitive resin composition of the present embodiment contains a diluent, at least a part of the diluent may be removed during drying.

[0123] The coating film can be dried using hot air drying or a dryer using far-infrared or near-infrared rays, and the drying temperature can be appropriately selected from 60 to 120°C, 70 to 110°C, or 90 to 110°C. The drying time can be appropriately selected from 1 to 60 minutes, 2 to 30 minutes, or 5 to 20 minutes. If the photosensitive resin composition of this embodiment contains a diluent, drying under the above conditions can also remove at least a portion of the diluent.

[0124] Examples of the carrier film include resin films such as polyester resin films such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polyethylene naphthalate (PEN), and polyolefin resin films such as polypropylene and polyethylene. A polyester resin film may be selected from the viewpoint of improving the mechanical strength and heat resistance of the photosensitive resin film. The thickness of the carrier film may be appropriately selected from 10 μm to 3 mm or 10 to 200 μm, taking into consideration ease of handling and the like.

[0125] The thickness of the photosensitive layer may be appropriately selected from 1 to 500 μm, 10 to 300 μm, or 30 to 100 μm. By setting the thickness to 30 μm or more, for example, when forming a photosensitive layer having a thickness of 150 μm or more, the number of operations such as lamination can be further reduced. Furthermore, by setting the thickness to 100 μm or less, deformation of the photosensitive layer due to the stress difference between the inside and outside of the core when the photosensitive resin film is wound around the core can be further reduced. Considering the effect of the photosensitive resin composition of this embodiment, which is capable of obtaining excellent pattern formability even when a thick photosensitive layer is formed, the thickness may be 70 μm or more, or even greater than 100 μm. A photosensitive layer having a thickness of 70 μm or more can be obtained, for example, by laminating a photosensitive layer formed on a carrier film with a photosensitive layer formed on a protective layer described below, to obtain a photosensitive resin film having a carrier film, a thick photosensitive layer, and a protective layer in this order.

[0126] In addition, the photosensitive resin film of this embodiment may have a protective layer laminated on the surface of the photosensitive layer opposite to the surface in contact with the carrier film. For example, a resin film such as polyethylene or polypropylene may be used as the protective layer. The resin film may be the same as or different from the above-described carrier film.

[0127] [Method of manufacturing the cured product] The method for producing a cured product of this embodiment sequentially includes the steps of providing a photosensitive layer on a substrate using the photosensitive resin composition or photosensitive resin film of this embodiment (photosensitive layer formation step), irradiating at least a portion of the photosensitive layer with actinic radiation to form a photocured portion (exposure step), and removing at least a portion of the photosensitive layer other than the photocured portion to form a resin pattern (removal step). If desired, the method further includes a step of heat-treating the resin pattern (heating step). The method for producing a cured product of this embodiment enables the formation of a desired pattern. Furthermore, by taking advantage of the characteristic of the photosensitive resin composition of this embodiment, which exhibits excellent pattern-forming properties even when a thick photosensitive layer, for example, 70 μm or thicker, is formed, the desired pattern can be formed using a thick cured product, for example, 70 μm or thicker. In this specification, the term "step" does not only refer to an independent step, but also includes a step that cannot be clearly distinguished from other steps, as long as the intended effect of the step is achieved.

[0128] (Photosensitive layer formation process) In forming the photosensitive layer, the photosensitive resin composition or the photosensitive resin film of this embodiment can be applied or laminated on a substrate, respectively, to form the photosensitive layer. Examples of the substrate include glass substrates, silicon wafers, metal oxide insulators such as TiO2 and SiO2, silicon nitride, ceramic piezoelectric substrates, and epoxy resin-impregnated glass cloth substrates.

[0129] When forming a photosensitive layer by coating a substrate with a photosensitive resin composition, the photosensitive resin composition may be dissolved in the diluent to form a solution, and then coated onto the substrate. If necessary, the coating film obtained by coating may be dried. Coating and drying may be performed by the various coating methods and coating film drying methods described above for producing the photosensitive resin film. When a photosensitive resin film is used, the photosensitive layer can be formed by a lamination method using a laminator or the like.

[0130] The thickness of the photosensitive layer provided on the substrate varies depending on the formation method (coating method or lamination method), the solids concentration and viscosity of the photosensitive resin composition, etc., but the lower limit of the dried photosensitive layer may be appropriately selected from 10 μm or more, 30 μm or more, 50 μm or more, 70 μm or more, 100 μm or more, more than 100 μm, or 150 μm or more. The upper limit is not particularly limited as long as a resin pattern can be formed, but may be appropriately selected from, for example, 500 μm or less, 300 μm or less, or 250 μm or less. The thickness of the photosensitive layer may be appropriately selected from the above range depending on the application. When used for electronic components, etc., the lower limit may be appropriately selected from 70 μm or more, more than 100 μm, or 150 μm or more, and the upper limit may be appropriately selected from 500 μm or less, 300 μm or less, or 250 μm or less. In the method for producing a cured product of this embodiment, a photosensitive layer is formed using the photosensitive resin composition of this embodiment, so that a thick photosensitive layer can be formed. For example, when forming a photosensitive layer having a thickness of 150 μm or more, the layer may not be formed by a single coating (and drying, if necessary) or lamination, but may be formed by repeating multiple coatings (and drying, if necessary) or laminations until the desired thickness is achieved.

[0131] (Exposure process) In the exposure step, the photosensitive layer formed on the substrate in the photosensitive layer forming step is at least partially irradiated with actinic rays as needed, and the exposed portion is photocured to form a cured portion. When irradiating with actinic rays, the photosensitive layer may be irradiated with actinic rays through a mask having a desired pattern, or may be irradiated with actinic rays by a direct writing exposure method such as LDI (Laser Direct Imaging) exposure method or DLP (Digital Light Processing) exposure method. Furthermore, from the viewpoint of improving pattern formability, post-exposure baking (PEB) may be performed after exposure using a hot plate, dryer, etc. The drying conditions are not particularly limited, but may be performed at a temperature of 60 to 120°C or 70 to 110°C for 15 seconds to 5 minutes or 30 seconds to 3 minutes.

[0132] The exposure dose of actinic rays is 10 to 2,000 mJ / cm 2 , 100-1,500mJ / cm 2 , or 300 to 1,000 mJ / cm 2 Examples of actinic rays that can be used include ultraviolet rays, visible light, electron beams, and X-rays. Examples of light sources that can be used include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, and halogen lamps.

[0133] (Removal process) In the removal step, at least a portion of the photosensitive layer formed in the exposure step other than the cured portion (unexposed portion) is removed to form a resin pattern. The unexposed portion may be removed using a developer such as an organic solvent. Examples of organic solvents include ethanol, cyclohexanone, cyclopentanone, propylene glycol methyl ether acetate, and N-methylpyrrolidone. Among them, cyclopentanone can be used from the viewpoint of development speed. These can be used alone or in combination of two or more. In addition, various commonly used additives may be added to the organic solvent used as the developer.

[0134] After removing the unexposed areas with the developer, the film may be washed (rinsed) with water, alcohol such as methanol, ethanol or isopropyl alcohol, n-butyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol dimethyl ether acetate, or the like, if necessary.

[0135] (Heating process) The heating step is a step that is adopted as necessary, in which the resin pattern formed in the removing step is heat-treated to form a cured product. The heat treatment is preferably carried out for 1 to 2 hours while the temperature is increased stepwise at a selected heating temperature. The heating temperature may be appropriately selected from 120 to 240°C, 140 to 230°C, or 150 to 220°C. When the temperature is increased stepwise, for example, heat treatment may be carried out at at least one of around 120°C and around 160°C for 10 to 50 minutes or 20 to 40 minutes, followed by heat treatment at around 220°C for 30 to 100 minutes or 50 to 70 minutes.

[0136] The thickness of the resulting resin pattern is the same as the thickness of the photosensitive layer after drying, and may be appropriately selected from a lower limit of 10 μm or more, 30 μm or more, 50 μm or more, 70 μm or more, 100 μm or more, more than 100 μm, or 150 μm or more, and an upper limit of 500 μm or less, 300 μm or less, or 250 μm or less. The thickness of the resin pattern may be appropriately selected from the above range depending on the application, and when used in electronic components, etc., the lower limit may be appropriately selected from a lower limit of 70 μm or more, more than 100 μm, or 150 μm or more, and an upper limit may be appropriately selected from a lower limit of 500 μm or less, 300 μm or less, or 250 μm or less.

[0137] [Laminate] The laminate of this embodiment includes a cured product of the photosensitive resin composition of this embodiment, and examples thereof include a laminate including the cured product on various supports such as a substrate used in the above-described method for producing a cured product, a carrier film for a photosensitive resin film, etc. The cured product of the photosensitive resin composition of this embodiment can be formed, for example, by the above-described method for producing a cured product of this embodiment.

[0138] The thickness of the cured product in the laminate of this embodiment may be appropriately selected from a lower limit of 10 μm or more, 30 μm or more, 50 μm or more, 70 μm or more, 100 μm or more, more than 100 μm, or 150 μm or more, and an upper limit of 500 μm or less, 300 μm or less, or 250 μm or less. The thickness of the cured product may be appropriately selected from the above range depending on the application, and when used in electronic components, etc., the lower limit may be appropriately selected from a lower limit of 70 μm or more, more than 100 μm, or 150 μm or more, and an upper limit may be appropriately selected from a lower limit of 500 μm or less, 300 μm or less, or 250 μm or less.

[0139] The cured product provided on a substrate obtained by the above-described method for producing a cured product uses the photosensitive resin composition of this embodiment, and excellent pattern formability can be obtained even with a thick photosensitive layer, for example, 70 μm or more. Therefore, it is possible to meet the demand for electronic circuit boards that require thick cured products to be provided on substrates in finer patterns, in line with the trend toward miniaturization and higher performance of electronic devices. Furthermore, for example, by using a cured product formed from the photosensitive resin composition of this embodiment as an insulating film in a plating process in the production of electronic circuit boards, it is possible to suppress a decrease in yield due to short circuits between wiring. Therefore, the laminate of this embodiment is used as an electronic component such as an electronic circuit board in a mobile terminal such as a mobile phone. [Example]

[0140] The objects and advantages of the present embodiment will be explained in more detail below based on examples and comparative examples, but the present embodiment is not limited to the following examples.

[0141] (Method for measuring weight-average molecular weight) The weight average molecular weight was determined by the GPC method using the following equipment in terms of standard polystyrene, and was measured using a solution in which 0.5 mg of polymer was dissolved in 1 mL of tetrahydrofuran (THF). Device name: Tosoh Corporation HLC-8320GPC Columns: Gelpack R-420, R-430, and R-440 (3 columns connected) Detector: RI detector Column temperature: 40℃ Eluent:THF Flow rate: 1ml / min Standard material: polystyrene

[0142] (Method for measuring molar extinction coefficient) The absorbance of the photopolymerization initiator was measured using a UV-visible spectrophotometer (product name: U-3010, manufactured by Hitachi High-Technologies Corporation) and a 1 cm thick quartz cell. Specifically, 0.001 g of the photopolymerization initiator was dissolved in 0.01 L of methanol to obtain a 0.1 mass% sample solution. The obtained 0.1 mass% sample solution was then diluted 10-fold and 100-fold to obtain 0.01 mass% and 0.001 mass% sample solutions, respectively. The absorbance of each sample solution at a wavelength of 365 nm was measured, and the molar extinction coefficient was calculated from the slope of the graph, with the horizontal axis representing molar concentration and the vertical axis representing absorbance.

[0143] (Examples 1 to 21, Comparative Examples 1 to 3) The components were blended according to the formulations shown in Tables 1 and 2 (the units of values ​​in the tables are parts by mass, and in the case of solutions, they are solid content equivalents), and kneaded using a three-roll mill to prepare photosensitive resin compositions. N,N-dimethylacetamide was added so that the solid content concentration became 60% by mass, and a photosensitive resin composition was obtained.

[0144] Next, the photosensitive resin composition obtained above was used to carry out various evaluations under the conditions shown below.

[0145] [Preparation of photosensitive resin film] A 50 μm-thick polyethylene terephthalate film (product name: A-4100, manufactured by Teijin Limited) was used as a carrier film, and the resin compositions of the Examples and Comparative Examples were uniformly coated onto the carrier film so that the thickness after drying would be 50 μm. Next, a photosensitive layer was formed by heating and drying at 100° C. for 15 minutes using a hot air convection dryer, and a photosensitive resin film having a carrier film and a photosensitive layer was produced.

[0146] [Absorbance measurement] The photosensitive resin film obtained in the above "Preparation of Photosensitive Resin Film" was measured for absorbance at a wavelength of 365 nm when the photosensitive layer was 50 μm thick (thickness after drying). Specifically, the absorbance (Abs) at a wavelength of 365 nm was measured using an ultraviolet-visible spectrophotometer (product name: "U-3310 Spectrophotometer", manufactured by Hitachi High-Technologies Corporation). A polyethylene terephthalate (PET) film was used as a reference. The measurement results are shown in Tables 1 and 2.

[0147] [Evaluation of pattern formation] A photosensitive resin film was laminated on a glass epoxy substrate (obtained by etching the copper of MCL-E-679F (trade name, manufactured by Hitachi Chemical Co., Ltd.)) with the photosensitive layer facing the glass epoxy substrate, and the carrier film was removed. The lamination was performed at 60°C using a laminator. Next, a photosensitive resin film was laminated again on the photosensitive layer using the method described above, and the carrier film was removed. This process was repeated three times to obtain a laminate comprising a 200 μm-thick photosensitive layer and a carrier film on a glass epoxy substrate. A resolution evaluation mask having the pattern shape shown in Figure 1 (30 patterns combining six types of line width (5 μm, 8 μm, 10 μm, 15 μm, 20 μm, 25 μm) and five types of line space (50 μm, 80 μm, 100 μm, 150 μm, 200 μm)) was placed on the carrier film of the laminate as the exposure area, and an i-line filter (Asahi Spectroscopy Co., Ltd.: HB-0365) was placed on top. A high-precision parallel exposure machine (Mikasa Co., Ltd.) was used to expose the mask to 300 mJ / cm of light with a wavelength of 365 nm (i-line). 2 The exposed sample was then post-exposure heated on a hot plate at 90°C for 1 minute. The carrier film was then removed, and the pattern was developed by immersion in a developer (cyclopentanone) for 20 minutes. The developed pattern was dried at room temperature for 30 minutes and observed using a metallurgical microscope to evaluate pattern formability. Evaluation was performed according to the following criteria. Here, "formable" means that the unexposed areas were cleanly removed and there were no defects such as collapse in the line portions (exposed areas). The evaluation results are shown in Tables 1 and 2. Note that "line (μm) / space (μm)" listed in the tables refers to the line width value (μm) / line space value (μm) of the pattern that had the narrowest line space among the patterns that could be formed, and also the pattern that had the narrowest line width that could be formed among the patterns with that line space. A: It was possible to form a pattern having a line width of 15 μm or less and a line space of 100 μm or less (hereinafter, these patterns will be referred to as "pattern A"). B: Pattern A could not be formed, but a pattern with a line width of 15 μm or less and a line space of 150 to 200 μm, or a pattern with a line width of 20 to 25 μm and a line space of 50 to 100 μm, could be formed (hereinafter these patterns will be referred to as "pattern B"). C: Patterns A and B could not be formed, but a pattern having a line width of 20 to 25 μm and a line space of 150 to 200 μm could be formed. D: Not all patterns were formed.

[0148] [Evaluation of insulation reliability] The insulation reliability was evaluated by a high-temperature, high-humidity bias test. The photosensitive resin film having a thickness of 50 μm obtained in Examples 1 to 21 was attached to the interdigital copper electrodes of a TEG (Test Element Group) device (trade name: WALTS-KIT EM0101JY, manufactured by WALTS, L / S=40 μm / 15 μm) at 60°C using a laminator, with the photosensitive layer facing the interdigital copper electrodes. Next, a 1,000 mJ / cm 2 i-ray was applied. 2 After the exposure, the film was heated on a hot plate at 90°C for 1 minute, and then the carrier film was removed. The film was then heated in an oven at 200°C for 1 hour, and then cooled to room temperature to obtain a measurement sample. Lead wires were attached to the TEG electrodes of the obtained measurement samples with solder, and a high-temperature, high-humidity bias test was carried out (voltage: 5 V (DC), test time: 100 hours, 85°C, 85% RH (using a high-temperature, high-humidity chamber (manufactured by ESPEC))). As a result, the measurement samples obtained using the photosensitive resin films of Examples 1 to 21 all had a resistance value of 1.0 × 10 7 Ω or more, and it was confirmed that the insulation reliability was excellent.

[0149] [Table 1]

[0150] [Table 2]

[0151] Details of each material in Tables 1 and 2 are as follows: [Component (A1)] UN-952: Urethane acrylate (manufactured by Negami Chemical Industrial Co., Ltd., product name, number of functional groups: 10, weight-average molecular weight: 9,000, a reaction product of an acrylate having a hydroxyl group and a diisocyanate compound, containing an acryloyl group (photopolymerizable functional group), a urethane bond (carbon-nitrogen bond), a chain hydrocarbon skeleton, and an alicyclic hydrocarbon skeleton within the molecule.) UN-954: Urethane acrylate (manufactured by Negami Chemical Industrial Co., Ltd., product name, number of functional groups: 6, weight average molecular weight: 4,500) [(A2) component] TMCH-5R: Urethane acrylate (manufactured by Hitachi Chemical Co., Ltd., product name, number of functional groups: 2, weight-average molecular weight: 950, a compound containing an acryloyl group (photopolymerizable functional group), a urethane bond (carbon-nitrogen bond), a chain hydrocarbon skeleton, and an alicyclic hydrocarbon skeleton within the molecule; corresponds to component (A2-2)). A-9300: isocyanuric acid ethylene oxide-modified triacrylate (trade name, manufactured by Shin-Nakamura Chemical Co., Ltd., molecular weight: 423, a compound represented by the formula (9-1) above, which corresponds to the component (A2-1)). UN-3320HA: urethane (meth)acrylate (trade name, manufactured by Negami Chemical Industrial Co., Ltd., number of functional groups: 6, weight-average molecular weight: 1,500, urethane (meth)acrylate having a structural unit represented by the above general formula (10), and corresponds to component (A2-2)). A-DCP: Tricyclodecane dimethanol diacrylate (product name, manufactured by Shin-Nakamura Chemical Co., Ltd., corresponds to component (A2-3)) [(B) Component] TPO: 2,4,6-trimethylbenzoyldiphenylphosphine oxide, "IRGACURE-TPO" (BASF, product name) I-651: 2,2-dimethoxy-1,2-diphenylethan-1-one, "IRGACURE-651" (BASF, trade name) I-184: 1-hydroxycyclohexylphenyl ketone "IRGACURE-184" (BASF, trade name) I-819: "IRGACURE-819" (BASF, trade name), which is bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide OXE-01: "IRGACURE-OXE-01" (BASF product name), which is 1,2-octanedione-1-[4-(phenylthio)phenyl]-2-(O-benzoyloxime) [(C) component] KBM-803: 3-mercaptopropyltrimethoxysilane (product name, manufactured by Shin-Etsu Chemical Co., Ltd.) [(D) component] Z250: Cyclomer P(ACA)Z250 (trade name, manufactured by Daicel-Allnex Corporation, a resin consisting of three structural units represented by the following formula (weight average molecular weight: 19,000 to 25,000) produced by reacting an acid group-containing acrylic resin with an alicyclic epoxy group-containing unsaturated compound). [ka] (In the formula, R D1 represents a hydrogen atom or a methyl group. D3 represents an alkyl group having 1 to 6 carbon atoms or a hydroxyalkyl group having 1 to 6 carbon atoms.

[0152] It was confirmed from Tables 1 and 2 that the photosensitive resin compositions of this embodiment of Examples 1 to 21 had excellent pattern formability. In contrast, the photosensitive resin compositions of Comparative Examples 1 and 3, which had an absorbance of 0.35 or more, filled in the pattern, and the photosensitive resin composition of Comparative Example 2 gelled, and both had poor pattern formability.

Claims

1. Component (A): a compound having a photopolymerizable functional group; and component (B): a compound having a molar absorption coefficient of 1 L / mol cm or more (8.0×10) for light having a wavelength of 365 nm. ３ a photosensitive resin composition for resists, comprising a photopolymerization initiator having a viscosity of less than L / mol cm and a component (C): a silane compound, the component (B) contains at least one selected from the group consisting of an aromatic ketone-based photopolymerization initiator and an alkylphenone-based photopolymerization initiator, and 2,4,6-trimethylbenzoyldiphenylphosphine oxide; the content of the component (C) is 1 to 15 mass% based on the total solid content of the photosensitive resin composition, a photosensitive resin composition having an absorbance of 0.001 or more and less than 0.35 at a wavelength of 365 nm when the thickness of the photosensitive resin composition is 50 μm (wherein the photosensitive resin composition contains a photopolymerizable compound (a1) having at least one ethylenically unsaturated group, a photopolymerization initiator (b1), and a compound (c1) having a hindered phenol structure, and the component (a1) contains a (meth)acrylate compound; a composition containing a carboxyl group-containing resin, a photopolymerization initiator, a photosensitive acrylate compound, and a filler, wherein the refractive index of the filler is 1.5 to 1.6, and the dried coating film thereof has an absorbance of at least 0.01 to 0.2 at a wavelength of 365 nm or 0.01 to 0.2 at a wavelength of 405 nm per 25 μm thickness; or an absorbance of any one of (a) to (d); an ultraviolet-curable resin composition for optical disks, which contains, in the resin composition, 15 to 70% by weight of a (meth)acrylate monomer (a2) having an ethylene oxide chain in its molecule, 5 to 50% by weight of a urethane (meth)acrylate (b2), 2 to 50% by weight of an epoxy (meth)acrylate (c2), and 1 to 10% by weight of a photopolymerization initiator (d2), and which is characterized in that the glass transition temperature of the cured film produced by the ultraviolet-curable resin composition is 10 to 65°C and the maximum value of the mechanical loss coefficient tanδ of the cured film is in the range of 0.35 to 0.75; and an active energy ray-curable coating agent composition which contains, as curable components, the following components (a3) ​​to (d3) in the following proportions: (a3) Urethane (meth)acrylate having a weight average molecular weight of 1,000 to 60,000: 5 to 50% by weight of the total amount of the curable components (b3) Compound having a hydrophilic group and one ethylenically unsaturated group: 5 to 45% by weight of the total amount of the curable components (c3) A compound having a cyclic hydrocarbon group and one ethylenically unsaturated group, other than component (b3): ​​5 to 65% by weight of the total amount of the curable components (d3) A compound having an ethylenically unsaturated group other than components (a3) ​​to (c3): 0 to 40% by weight of the total amount of the curable components

2. Component (A): a compound having a photopolymerizable functional group; and component (B): a compound having a molar absorption coefficient of 1 L / mol cm or more and 0.5×10 for light having a wavelength of 365 nm. ３ a photosensitive resin composition for resist, comprising a photopolymerization initiator having a viscosity of 1000 kJ / mol cm or less, and a component (C): a silane compound, the component (B) contains at least one selected from the group consisting of an aromatic ketone-based photopolymerization initiator and an alkylphenone-based photopolymerization initiator, and 2,4,6-trimethylbenzoyldiphenylphosphine oxide; a photosensitive resin composition having an absorbance of 0.001 or more and less than 0.35 at a wavelength of 365 nm when the thickness of the photosensitive resin composition is 50 μm (wherein the photosensitive resin composition contains a photopolymerizable compound (a1) having at least one ethylenically unsaturated group, a photopolymerization initiator (b1), and a compound (c1) having a hindered phenol structure, and the component (a1) contains a (meth)acrylate compound; a composition containing a carboxyl group-containing resin, a photopolymerization initiator, a photosensitive acrylate compound, and a filler, wherein the refractive index of the filler is 1.5 to 1.6, and the dried coating film thereof has an absorbance of at least 0.01 to 0.2 at a wavelength of 365 nm or 0.01 to 0.2 at a wavelength of 405 nm per 25 μm thickness; or an absorbance of any one of (a) to (d); an ultraviolet-curable resin composition for optical disks, which contains, in the resin composition, 15 to 70% by weight of a (meth)acrylate monomer (a2) having an ethylene oxide chain in its molecule, 5 to 50% by weight of a urethane (meth)acrylate (b2), 2 to 50% by weight of an epoxy (meth)acrylate (c2), and 1 to 10% by weight of a photopolymerization initiator (d2), and which is characterized in that the glass transition temperature of the cured film produced by the ultraviolet-curable resin composition is 10 to 65°C and the maximum value of the mechanical loss coefficient tanδ of the cured film is in the range of 0.35 to 0.75; and an active energy ray-curable coating agent composition which contains, as curable components, the following components (a3) ​​to (d3) in the following proportions: (a3) Urethane (meth)acrylate having a weight average molecular weight of 1,000 to 60,000: 5 to 50% by weight of the total amount of the curable components (b3) Compound having a hydrophilic group and one ethylenically unsaturated group: 5 to 45% by weight of the total amount of the curable components (c3) A compound having a cyclic hydrocarbon group and one ethylenically unsaturated group, other than component (b3): ​​5 to 65% by weight of the total amount of the curable components (d3) A compound having an ethylenically unsaturated group other than components (a3) ​​to (c3): 0 to 40% by weight of the total amount of the curable components

3. 3. The photosensitive resin composition according to claim 2, wherein the content of the component (C) is 0.05 to 15 mass% based on the total solid content of the photosensitive resin composition.

4. The photosensitive resin composition according to any one of claims 1 to 3, wherein the aromatic ketone-based photopolymerization initiator comprises at least one selected from the group consisting of benzophenone, N,N'-tetramethyl-4,4'-diaminobenzophenone, N,N'-tetraethyl-4,4'-diaminobenzophenone, 4-methoxy-4'-dimethylaminobenzophenone, 2,2-dimethoxy-1,2-diphenylethan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, and 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propan-1-one.

5. The alkylphenone-based photopolymerization initiator is benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin phenyl ether, 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methyl-propan-1-one. The photosensitive resin composition according to any one of claims 1 to 4, comprising at least one selected from the group consisting of:

6. The component (B) has a molar absorption coefficient of 1 L / mol cm or more and 0.1×10 ３ The photosensitive resin composition according to any one of claims 1 to 5, containing a photopolymerization initiator having a viscosity of 1 L / mol cm or less.

7. The photosensitive resin composition according to any one of claims 1 to 6, wherein the content of the component (B) is 0.05 to 30 mass% based on the total amount of solids in the photosensitive resin composition.

8. The photosensitive resin composition according to any one of claims 1 to 7, wherein the content of the component (B) is an amount such that the value P represented by the following formula (i) is 0.1 or more and 3 or less: P=A×B / C (i) A: molar absorption coefficient of the photopolymerization initiator with respect to light having a wavelength of 365 nm (L / mol cm) B: The content (mass%) of the component (B) relative to the total amount of the photosensitive resin composition (however, if the photosensitive resin composition contains a filler, the mass of the filler is excluded) C: Molecular weight of photopolymerization initiator

9. The photosensitive resin composition according to any one of claims 1 to 8, comprising, as the component (A), a component (A1): a high-molecular-weight compound having a photopolymerizable functional group and a weight-average molecular weight of 2,500 or more, and a component (A2): a low-molecular-weight compound having a photopolymerizable functional group and a weight-average molecular weight of less than 2,500.

10. The photosensitive resin composition according to claim 9, wherein the component (A2) is a low-molecular-weight compound having a photopolymerizable functional group and a urethane bond.

11. 11. The photosensitive resin composition according to claim 9, wherein the contents of the component (A1), the component (A2), and the component (B) are 10 to 95% by mass, 3 to 70% by mass, and 0.05 to 30% by mass, respectively, based on the total amount of solids in the photosensitive resin composition.

12. The photosensitive resin composition according to any one of claims 1 to 11, wherein the component (C) contains a (meth)acryloyl group-containing alkoxysilane.

13. The photosensitive resin composition according to any one of claims 1 to 12, wherein the component (C) contains (meth)acryloxypropyltrimethoxysilane.

14. A photosensitive resin film having a photosensitive layer using the photosensitive resin composition according to any one of claims 1 to 13.

15. A step of forming a photosensitive layer on a substrate using the photosensitive resin composition according to any one of claims 1 to 13 or the photosensitive resin film according to claim 14; a step of irradiating at least a part of the photosensitive layer with actinic rays to form a photocured portion; removing at least a portion of the photosensitive layer other than the photocured portion to form a resin pattern.

16. The method for producing a cured product according to claim 15, further comprising a step of heat treating the resin pattern.

17. The method for producing a cured product according to claim 15 or 16, wherein the resin pattern has a thickness of 70 to 300 μm.

18. A laminate comprising a cured product of the photosensitive resin composition according to any one of claims 1 to 13.

19. The laminate according to claim 18, wherein the thickness of the cured product is 70 to 300 μm.

20. An electronic part comprising a cured product of the photosensitive resin composition according to any one of claims 1 to 13.

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