Nozzle position adjusting method and substrate processing apparatus

Abstract

To provide a nozzle position adjustment method and a substrate processing device that can adjust a liquid supply position with high precision.SOLUTION: The total value of a first distance by which a nozzle travels from the separated position until the engagement surface comes into contact with the end surface of a jig plate and a second distance required to move the nozzle in a posture in which the engagement surface is in contact with the end surface of the jig plate along the radial direction to the processing position is calculated as the nozzle movement distance. Then, when substrate processing is performed, the nozzle is positioned at the processing position by moving the nozzle from the separated position by the nozzle movement distance.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present invention relates to a nozzle position adjusting method for adjusting the position of a nozzle in the radial direction of a substrate, and to a substrate processing technique for supplying a processing liquid to a substrate from a nozzle whose position has been adjusted by the nozzle position adjusting method. [Background technology]

[0002] BACKGROUND ART Substrate processing apparatuses are known that rotate substrates such as semiconductor wafers and supply processing liquids from nozzles to the substrates to perform chemical processing, cleaning processing, and the like (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-149423 Summary of the Invention [Problem to be solved by the invention]

[0004] During substrate processing, a nozzle is positioned above the substrate, and a processing liquid is ejected toward the upper surface of the substrate from an ejection port at the tip of the nozzle. For example, in the apparatus described in Patent Document 1, an etching liquid is supplied as a processing liquid to the peripheral edge of a substrate held and rotated by a spin chuck. As a result, a thin film formed on the peripheral edge of the upper surface of the substrate is etched away in a strip or doughnut shape. This is called bevel processing (or bevel etching processing), and corresponds to an example of the "substrate processing" of the present invention. In bevel processing, the dimensional accuracy of the width of the strip-shaped region (hereinafter referred to as the etching width) must be strictly controlled. To achieve this, it is necessary to precisely adjust the position in the radial direction of the substrate where the processing liquid is supplied to the substrate (hereinafter referred to as the "liquid supply position").

[0005] SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a nozzle position adjusting method and a substrate processing apparatus that are capable of adjusting the liquid supply position with high precision. [Means for solving the problem]

[0006] A first aspect of the present invention is a nozzle position adjustment method for positioning the nozzle in the radial direction to a processing position in order to supply processing liquid to a preset position from an edge surface of the substrate in a substrate processing apparatus including a rotary holder that holds and rotates a substrate around a rotation axis extending in a vertical direction, a nozzle that supplies processing liquid to the substrate for substrate processing, and a nozzle movement unit that moves the nozzle in a radial direction of the substrate, the method comprising a first step of holding a jig plate having the same shape as the substrate with the rotary holder, a second step of positioning the nozzle at a separated position away from the rotary holder, and a second step of positioning the nozzle in an orientation such that an engagement surface of the nozzle faces the edge surface of the jig plate held by the rotary holder, The method comprises a third step of starting to move the nozzle from the separated position to the jig plate; a fourth step of measuring a first distance moved by the nozzle from the execution of the third step until the engagement surface abuts the end face of the jig plate; and a fifth step of calculating the nozzle movement distance by adding a second distance required to move the nozzle in a position where the engagement surface abuts the end face of the jig plate along the radial direction to the processing position to the first distance.The method is characterized in that steps 1 to 5 are executed before substrate processing, while when substrate processing is performed, the nozzle is positioned at the processing position by moving the nozzle in the radial direction by the nozzle movement distance after executing step 2.

[0007] A second aspect of the present invention is a substrate processing apparatus comprising: a spin holder that holds and rotates a substrate around a rotation axis extending in a vertical direction; a nozzle that supplies a processing liquid for substrate processing to the substrate; a nozzle movement unit that moves the nozzle in a radial direction of the substrate; and a control unit that controls the nozzle movement unit so that the nozzle is positioned at a processing position for supplying the processing liquid to a predetermined position from an edge surface of the substrate, wherein the control unit controls a calibration unit that, before substrate processing, calculates a nozzle movement distance required to move the nozzle, which is positioned at a distance radially from the spin holder, to the processing position using a jig plate having the same shape as the substrate; and a nozzle positioning unit that positions the nozzle at the processing position by moving the nozzle from the separated position by a nozzle movement distance in the radial direction, and the calibration unit has a measurement unit that measures a first distance traveled by the nozzle after the nozzle starts to move from the separated position to the jig plate in an orientation where the engagement surface of the nozzle faces the end face of the jig plate held by the rotation holding unit until the engagement surface abuts against the end face of the jig plate, and a movement distance calculation unit that calculates the nozzle movement distance by adding a second distance required to move the nozzle in an orientation where the engagement surface abuts against the end face of the jig plate to the first distance.

[0008] Conventionally, the nozzle movement distance required to move the nozzle from the separated position to the processing position was determined by the operator. As a result, variations in the nozzle movement distance occurred between operators, which was one of the main causes of reduced accuracy in the liquid supply position. In contrast, in the inventions according to the first and second aspects, the nozzle movement distance is calculated as the sum of the first and second distances described above. In other words, the nozzle movement distance can be calculated without the intervention of the operator. Therefore, by moving the nozzle by the nozzle movement distance (= first distance + second distance) from the separated position, the nozzle can be positioned at the processing position with high accuracy.

[0009] A third aspect of the present invention is a nozzle position adjustment method for positioning the nozzle in the radial direction to a processing position in order to supply processing liquid to a preset position from an edge of the substrate in a substrate processing apparatus including a spinning holder that holds and rotates a substrate around a rotation axis extending in a vertical direction, a nozzle that supplies processing liquid to the substrate for substrate processing, and a nozzle moving unit that moves the nozzle in a radial direction of the substrate, the method including a seventh step of holding a jig plate having the same shape as the substrate with the spinning holder, an eighth step of positioning the nozzle at a spaced position away from the spinning holder, a ninth step of attaching a position adjustment jig to the nozzle so as to face the edge of the jig plate held by the spinning holder before and after the eighth step, and The method comprises a tenth step of starting to move the nozzle from the separated position to the jig plate with the jig facing the end face of the jig plate; an eleventh step of measuring a third distance moved by the nozzle from the execution of the tenth step until the position adjustment jig abuts the end face of the jig plate; and a twelfth step of calculating the nozzle movement distance by adding a fourth distance required to move the nozzle in the position where the position adjustment jig abuts the end face of the jig plate along the radial direction to the processing position to the third distance, and is characterized in that steps seven to twelfth are executed before substrate processing, while when substrate processing is performed, after the eighth step is executed, the nozzle is moved radially by the nozzle movement distance to position the nozzle at the processing position.

[0010] A fourth aspect of the present invention is a substrate processing apparatus comprising: a spin holder that holds and rotates a substrate around a rotation axis extending in a vertical direction; a nozzle that supplies a processing liquid for substrate processing to the substrate; a nozzle movement unit that moves the nozzle in a radial direction of the substrate; and a control unit that controls the nozzle movement unit so that the nozzle is positioned at a processing position for supplying the processing liquid to a predetermined position from an edge surface of the substrate, wherein the control unit controls a calibration unit that, before substrate processing, calculates a nozzle movement distance required to move the nozzle located at a position separated radially from the spin holder using a jig plate having the same shape as the substrate to the processing position; the nozzle positioning unit positions the nozzle at the processing position by moving the nozzle from the separated position by the nozzle movement distance, and the calibration unit has a measurement unit that measures a third distance traveled by the nozzle after the position adjustment jig attached to the nozzle starts to move from the separated position to the jig plate in an orientation facing the end face of the jig plate held by the rotation holding unit until the position adjustment jig abuts against the end face of the jig plate, and a movement distance calculation unit that calculates the nozzle movement distance by adding a fourth distance required to move the nozzle in an orientation in which the position adjustment jig abuts against the end face of the jig plate to the third distance.

[0011] In the third and fourth aspects of the invention, the nozzle movement distance is calculated as the sum of the third and fourth distances. In other words, the nozzle movement distance can be calculated without the intervention of an operator. Therefore, by moving the nozzle by the nozzle movement distance (= third distance + fourth distance) from the separated position, the nozzle is positioned at the processing position with high accuracy. [Effects of the Invention]

[0012] In the invention configured in this manner, the nozzle movement distance is determined without the intervention of an operator, and the nozzle position is adjusted based on that nozzle movement distance, so the liquid supply position can be adjusted with high precision. [Brief explanation of the drawings]

[0013] [Figure 1]1 is a plan view showing a schematic configuration of a substrate processing system equipped with a first embodiment of a substrate processing apparatus according to the present invention. [Figure 2] 1 is a diagram showing a configuration of a first embodiment of a substrate processing apparatus according to the present invention. [Figure 3] FIG. 3 is a plan view taken along the line AA in FIG. 2. [Figure 4] 10 is a diagram showing the dimensional relationship between a substrate held by a spin chuck and a rotating cup portion. FIG. [Figure 5A] FIG. 2 is a perspective view showing a processing liquid discharge nozzle on the upper surface side that is equipped in the processing mechanism in the first embodiment. [Figure 5B] FIG. 10 is a perspective view showing a processing liquid discharge nozzle on the upper surface side that is provided in the processing mechanism in the second embodiment. [Figure 6] 3 is a block diagram showing functions executed by a processing unit of the substrate processing apparatus shown in FIG. 2. FIG. [Figure 7] 3 is a flowchart showing a bevel process performed by the substrate processing apparatus shown in FIG. [Figure 8] 10 is a flowchart showing a calibration process included in the bevel process. [Figure 9] FIG. 2 is a schematic diagram showing each part of the apparatus during calibration processing. [Figure 10] FIG. 2 is a schematic diagram showing each part of the apparatus during bevel processing. [Figure 11] 10 is a flowchart showing a calibration process in the second embodiment. [Figure 12] FIG. 10 is a schematic diagram showing each part of the apparatus during calibration processing in the second embodiment. [Figure 13] 10 is a graph showing an example of eccentricity of a jig wafer after a centering process. DETAILED DESCRIPTION OF THE INVENTION

[0014] FIG. 1 is a plan view showing the schematic configuration of a substrate processing system equipped with a first embodiment of a substrate processing apparatus according to the present invention. This is not an external view of the substrate processing system 100, but a schematic view showing the internal structure by excluding the outer wall panels and other components of the substrate processing system 100 for easy understanding. The substrate processing system 100 is a single-wafer processing apparatus installed, for example, in a clean room, for processing substrates W, one by one, each of which has a circuit pattern or the like (hereinafter referred to as a "pattern") formed on only one main surface. A nozzle position adjustment method according to the present invention is performed in a processing unit 1 installed in the substrate processing system 100. In this specification, the pattern-formed surface (one main surface) of the two main surfaces of a substrate on which a pattern is formed is referred to as the "front surface," and the opposite main surface on which no pattern is formed is referred to as the "rear surface." The surface facing downward is referred to as the "lower surface," and the surface facing upward is referred to as the "upper surface." In this specification, the "pattern-formed surface" refers to the surface of a substrate on which a concave-convex pattern is formed in any region.

[0015] Here, the "substrate" in this embodiment can be any of various substrates, such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal displays, glass substrates for plasma displays, substrates for FEDs (Field Emission Displays), substrates for optical disks, substrates for magnetic disks, and substrates for magneto-optical disks. The following description will be given with reference to the drawings, taking as an example a substrate processing apparatus used primarily for processing semiconductor wafers, but the invention can also be applied to processing the various substrates exemplified above.

[0016] 1, the substrate processing system 100 includes a substrate processing unit 110 that processes substrates W, and an indexer unit 120 coupled to the substrate processing unit 110. The indexer unit 120 has a container holding unit 121 that can hold a plurality of containers C for accommodating substrates W (such as a FOUP (Front Opening Unified Pod), an SMIF (Standard Mechanical Interface) pod, or an OC (Open Cassette) that accommodates a plurality of substrates W in a sealed state). The indexer unit 120 also includes an indexer robot 122 that accesses the containers C held by the container holding unit 121 to remove unprocessed substrates W from the container C or store processed substrates W in the container C. Each container C accommodates a plurality of substrates W in a substantially horizontal position.

[0017] The indexer robot 122 comprises a base 122a fixed to the apparatus housing, an articulated arm 122b rotatable about a vertical axis relative to the base 122a, and a hand 122c attached to the tip of the articulated arm 122b. The hand 122c is structured so that a substrate W can be placed on its upper surface and held thereon. Indexer robots having such articulated arms and hands for holding substrates are well known, and therefore a detailed description thereof will be omitted.

[0018] The substrate processing section 110 includes a mounting table 112 on which an indexer robot 122 places a substrate W, a substrate transfer robot 111 disposed approximately in the center in a plan view, and a plurality of processing units 1 disposed to surround the substrate transfer robot 111. Specifically, the plurality of processing units 1 are disposed facing the space in which the substrate transfer robot 111 is disposed. The substrate transfer robot 111 randomly accesses the mounting tables 112 for these processing units 1 and transfers the substrate W between them. Meanwhile, each processing unit 1 performs a predetermined process on the substrate W and corresponds to a substrate processing apparatus according to the present invention. In this embodiment, these processing units (substrate processing apparatuses) 1 have the same function. This enables parallel processing of multiple substrates W. Note that the mounting table 112 is not necessarily required if the substrate transfer robot 111 can directly transfer the substrate W from the indexer robot 122 to the substrate transfer robot 111.

[0019] FIG. 2 is a diagram showing the configuration of a first embodiment of a substrate processing apparatus according to the present invention. FIG. 3 is a plan view taken along line AA in FIG. 2. In FIGS. 2 and 3 and the other figures referred to below, the dimensions and number of components may be exaggerated or simplified for ease of understanding. The substrate processing apparatus (processing unit) 1 includes a rotation mechanism 2, a scattering prevention mechanism 3, an upper surface protection and heating mechanism 4, a processing mechanism 5, an atmosphere separation mechanism 6, a lifting mechanism 7, a centering mechanism 8, and a substrate observation mechanism 9. These components 2 to 9 are housed in an internal space 12 of a chamber 11 and are electrically connected to a control unit 10 that controls the entire apparatus. Each of the components 2 to 9 operates in response to instructions from the control unit 10.

[0020] The control unit 10 may be, for example, a device similar to a general computer. That is, in the control unit 10, a CPU serving as a main control unit performs arithmetic processing in accordance with procedures written in a program, thereby controlling each part of the substrate processing apparatus 1. The detailed configuration and operation of the control unit 10 will be described later. In this embodiment, a control unit 10 is provided for each substrate processing apparatus 1, but a configuration in which a single control unit controls a plurality of substrate processing apparatuses 1 may also be used. In addition, a configuration in which the substrate processing apparatuses 1 are controlled by a control unit (not shown) that controls the entire substrate processing system 100 may also be used.

[0021] As shown in FIG. 2, a fan filter unit (FFU) 13 is attached to the ceiling wall 11a of the chamber 11. This fan filter unit 13 further purifies the air in the clean room in which the substrate processing apparatus 1 is installed and supplies it to the processing space in the chamber 11. The fan filter unit 13 includes a fan and a filter (e.g., a HEPA (High Efficiency Particulate Air) filter) for taking in air from the clean room and sending it into the chamber 11, and sends the clean air through an opening 11b provided in the ceiling wall 11a. This creates a downflow of clean air in the processing space in the chamber 11. In addition, to uniformly distribute the clean air supplied from the fan filter unit 13, a punched plate 14 having a large number of blow-out holes is provided directly below the ceiling wall 11a.

[0022] As shown in FIGS. 1 and 3, the substrate processing apparatus 1 has a shutter 15 provided on a side surface of the chamber 11. A shutter opening / closing mechanism (not shown) is connected to the shutter 15, and opens and closes the shutter 15 in response to an opening / closing command from the control unit 10. More specifically, in the substrate processing apparatus 1, when an unprocessed substrate W is loaded into the chamber 11, the shutter opening / closing mechanism opens the shutter 15, and the unprocessed substrate W is loaded face-up onto the spin chuck (corresponding to an example of a "rotation holder" of the present invention) 21 of the rotation mechanism 2 by a hand (not shown) of the substrate transfer robot 111. That is, the substrate W is placed on the spin chuck 21 with its upper surface Wf facing upward. Then, when the hand of the substrate transfer robot 111 retracts from the chamber 11 after the substrate has been loaded, the shutter opening / closing mechanism closes the shutter 15. Then, bevel processing is performed on the peripheral edge portion Ws of the substrate W within the processing space of the chamber 11 (corresponding to a sealed space SPs, which will be described in detail later). After the beveling process is completed, the shutter opening / closing mechanism reopens the shutter 15, and the hand of the substrate transport robot 111 removes the processed substrate W from the spin chuck 21. In this manner, in this embodiment, the internal space 12 of the chamber 11 is maintained at room temperature. In this specification, "room temperature" means a temperature range of 5°C to 35°C.

[0023] The rotation mechanism 2 rotates the substrate W while holding it in a substantially horizontal position with its surface facing upward, and also rotates part of the shatter prevention mechanism 3 in the same direction as the substrate W. The rotation mechanism 2 rotates the substrate W and the rotating cup portion 31 of the shatter prevention mechanism 3 around a vertical rotation axis AX that passes through the center of the main surface. Note that in Figure 2, dots are added to the rotated parts to clearly indicate the members and parts that rotate integrally with the rotation mechanism 2.

[0024] The rotation mechanism 2 includes a spin chuck 21, which is a disk-shaped member smaller than the substrate W. The spin chuck 21 has an upper surface that is substantially horizontal and a central axis that coincides with the rotation axis AX. A cylindrical rotation shaft 22 is connected to the lower surface of the spin chuck 21. The rotation shaft 22 extends vertically with its axis coincident with the rotation axis AX. A rotation drive unit (e.g., a motor) 23 is connected to the rotation shaft 22. The rotation drive unit 23 drives the rotation shaft 22 to rotate around its axis in response to a rotation command from the control unit 10. Therefore, the spin chuck 21 can rotate together with the rotation shaft 22 around the rotation axis AX. The rotation drive unit 23 and the rotation shaft 22 function to rotate the spin chuck 21 around the rotation axis AX, and the lower end of the rotation shaft 22 and the rotation drive unit 23 are housed in a cylindrical casing 24.

[0025] A through-hole (not shown) is provided in the center of the spin chuck 21, and communicates with the internal space of the rotating shaft 22. A pump 26 is connected to the internal space via piping 25 equipped with a valve (not shown). The pump 26 and the valve are electrically connected to the control unit 10 and operate in response to commands from the control unit 10. This allows negative pressure and positive pressure to be selectively applied to the spin chuck 21. For example, when the pump 26 applies negative pressure to the spin chuck 21 with the substrate W placed on the upper surface of the spin chuck 21 in a substantially horizontal position, the spin chuck 21 suction-holds the substrate W from below. On the other hand, when the pump 26 applies positive pressure to the spin chuck 21, the substrate W can be removed from the upper surface of the spin chuck 21. When the suction of the pump 26 is stopped, the substrate W can be moved horizontally on the upper surface of the spin chuck 21.

[0026] A nitrogen gas supply unit 29 is connected to the spin chuck 21 via a pipe 28 provided in the center of the rotation shaft 22. The nitrogen gas supply unit 29 supplies room-temperature nitrogen gas, supplied from a utility or the like in a factory where the substrate processing system 100 is installed, to the spin chuck 21 at a flow rate and timing according to a nitrogen gas supply command from the control unit 10, and causes the nitrogen gas to flow radially outward from the center on the underside Wb of the substrate W. Although nitrogen gas is used in this embodiment, other inert gases may also be used. This also applies to the heating gas discharged from the central nozzle, which will be described later. The term "flow rate" refers to the amount of a fluid, such as nitrogen gas, moving per unit time.

[0027] The rotation mechanism 2 includes a power transmission unit 27 for rotating the spin chuck 21 integrally with the substrate W and for rotating the rotating cup 31 in synchronization with the rotation. The power transmission unit 27 includes a circular member 27a made of a non-magnetic material or resin, a magnet 27b embedded in the circular member 27a, and a magnet 27c embedded in a lower cup 32, which is a component of the rotating cup 31. The circular member 27a is attached to the rotating shaft 22 and is rotatable together with the rotating shaft 22 about the rotation axis AX. A plurality of magnets 27b (36 in this embodiment) are arranged on the outer periphery of the circular member 27a, radially centered on the rotation axis AX and at equal angular intervals (10° in this embodiment). In this embodiment, two adjacent magnets 27b are arranged such that the outer and inner sides of one of the magnets 27b are north and south poles, respectively, and such that the outer and inner sides of the other magnet are south and north poles, respectively.

[0028] Similar to these magnets 27b, a plurality of magnets 27c (36 in this embodiment) are arranged radially around the rotation axis AX at equal angular intervals (10° in this embodiment). These magnets 27c are built into the lower cup 32. The lower cup 32 is a component of the scattering prevention mechanism 3, which will be described next, and has an annular shape. That is, the lower cup 32 has an inner peripheral surface that can face the outer peripheral surface of the annular member 27a. The inner diameter of this inner peripheral surface is larger than the outer diameter of the annular member 27a. The lower cup 32 is arranged concentrically with the rotation shaft portion 22 and the annular member 27a, with the inner peripheral surface facing the outer peripheral surface of the annular member 27a at a predetermined distance (= (the inner diameter - the outer diameter) / 2). An engagement pin and a connecting magnet are provided on the upper surface of the outer periphery of the lower cup 32, which connect the upper cup 33 to the lower cup 32, and this connected body functions as the rotation cup portion 31.

[0029] The lower cup 32 is supported by bearings (not shown) in the above-described arrangement so as to be rotatable about the rotation axis AX. A plurality of magnets 27c (36 in this embodiment) are arranged radially around the rotation axis AX at equal angular intervals (10° in this embodiment) on the inner peripheral edge of the lower cup 32. The arrangement of two adjacent magnets 27c is similar to that of the magnets 27b. One magnet is arranged so that its outer and inner surfaces are north and south poles, respectively, while the other magnet is arranged so that its outer and inner surfaces are south and north poles.

[0030] In the power transmission unit 27 configured in this manner, when the circular member 27a is rotated together with the rotating shaft 22 by the rotation drive unit 23, the magnetic force between the magnets 27b and 27c causes the lower cup 32 to rotate in the same direction as the circular member 27a while maintaining the air gap (the gap between the circular member 27a and the lower cup 32). This causes the rotating cup unit 31 to rotate around the rotation axis AX. In other words, the rotating cup unit 31 rotates in the same direction as the substrate W and in synchronization with it.

[0031] The anti-scattering mechanism 3 has a rotating cup portion 31 that is rotatable about the rotation axis AX while surrounding the outer periphery of the substrate W held by the spin chuck 21, and a fixed cup portion 34 that is fixedly provided so as to surround the rotating cup portion 31. The rotating cup portion 31 is provided so as to be rotatable about the rotation axis AX while surrounding the outer periphery of the rotating substrate W by connecting an upper cup 33 to a lower cup 32.

[0032] 4 is a diagram showing the dimensional relationship between the substrate held by the spin chuck and the rotating cup portion. The lower cup 32 has an annular shape. Its outer diameter is larger than that of the substrate W, and the lower cup 32 is disposed so as to be rotatable about the rotation axis AX while protruding radially from the substrate W held by the spin chuck 21 in a plan view from vertically above. In this protruding region, i.e., the upper surface peripheral portion 321 of the lower cup 32, engagement pins standing vertically upward along the circumferential direction and flat lower magnets are alternately attached, with a total of three engagement pins and three lower magnets. These engagement pins and lower magnets are disposed radially around the rotation axis AX and at equal angular intervals (60° in this embodiment).

[0033] 2, 3, and 4, the upper cup 33 has a lower annular portion 331, an upper annular portion 332, and an inclined portion 333 connecting these. The outer diameter D331 of the lower annular portion 331 is the same as the outer diameter D32 of the lower cup 32, and the lower annular portion 331 is located vertically above the peripheral edge portion 321 of the lower cup 32.

[0034] The upper cup 33 can be raised and lowered in the vertical direction by the lifting mechanism 7. When the upper cup 33 is moved upward by the lifting mechanism 7, a transport space for loading and unloading the substrate W is formed between the upper cup 33 and the lower cup 32 in the vertical direction. On the other hand, when the upper cup 33 is moved downward by the lifting mechanism 7, the upper cup 33 is positioned horizontally relative to the lower cup 32 by the action of the engagement pin and the connecting magnet, and the upper cup 33 and the lower cup 32 are connected to each other. As a result, as shown in the partially enlarged view of FIG. 3, the upper cup 33 and the lower cup 32 are integrated in the vertical direction with a gap GPc extending horizontally formed. The rotatable cup portion 31 is rotatable about the rotation axis AX while the gap GPc is formed.

[0035] 4, in the rotating cup part 31, the outer diameter D332 of the upper annular portion 332 is slightly smaller than the outer diameter D331 of the lower annular portion 331. Furthermore, when comparing the diameters d331, d332 of the inner peripheral surfaces of the lower annular portion 331 and the upper annular portion 332, the lower annular portion 331 is larger than the upper annular portion 332, and the inner peripheral surface of the upper annular portion 332 is located inside the inner peripheral surface of the lower annular portion 331 in a plan view from vertically above. The inner peripheral surfaces of the upper annular portion 332 and the lower annular portion 331 are connected by an inclined portion 333 around the entire circumference of the upper cup 33. Therefore, the inner peripheral surface of the inclined portion 333, i.e., the surface surrounding the substrate W, forms an inclined surface 334. That is, as shown in FIG. 8, the inclined portion 333 surrounds the outer periphery of the rotating substrate W and is capable of collecting droplets scattered from the substrate W, and the space surrounded by the upper cup 33 and the lower cup 32 functions as a collection space SPc.

[0036] Moreover, the inclined portion 333 facing the collection space SPc is inclined from the lower annular portion 331 upward toward the peripheral edge of the substrate W. Therefore, droplets collected in the inclined portion 333 flow along the inclined surface 334 to the lower end of the upper cup 33, i.e., the lower annular portion 331, and can then be discharged to the outside of the rotating cup portion 31 via the gap GPc.

[0037] The fixed cup portion 34 is disposed to surround the rotating cup portion 31 and forms a discharge space SPe. As shown in FIG. 2, the fixed cup portion 34 has a liquid receiving portion 341 and an exhaust portion 342 disposed inside the liquid receiving portion 341. The liquid receiving portion 341 has a cup structure that opens to face the opening of the gap GPc on the side opposite the substrate (the opening on the right hand side in the enlarged partial view in FIG. 3). In other words, the internal space of the liquid receiving portion 341 functions as the discharge space SPe and is connected to the collection space SPc via the gap GPc. Therefore, the liquid droplets collected by the rotating cup portion 31 are guided to the discharge space SPe together with gas components via the gap GPc. The liquid droplets are collected at the bottom of the liquid receiving portion 341 and are discharged from the fixed cup portion 34. Meanwhile, the gas components are collected in the exhaust portion 342. The exhaust portion 342 is connected to the exhaust mechanism 38. Therefore, the exhaust mechanism 38 operates in response to a command from the control unit 10 to adjust the pressure in the fixed cup portion 34, and the gas components in the exhaust portion 342 are efficiently exhausted. Furthermore, the pressure and flow rate of the exhaust space SPe are adjusted by precise control of the exhaust mechanism 38. For example, the pressure in the exhaust space SPe becomes lower than the pressure in the collection space SPc. As a result, the droplets in the collection space SPc are efficiently drawn into the exhaust space SPe, and the movement of droplets from the collection space SPc can be promoted.

[0038] As shown in FIGS. 2 and 3 , the upper surface protection and heating mechanism 4 has a shielding plate 41 disposed above the upper surface Wf of the substrate W held by the spin chuck 21. The shielding plate 41 has a circular plate portion 42 held in a horizontal position. The circular plate portion 42 incorporates a heater 421 whose drive is controlled by a heater drive unit 422. The circular plate portion 42 has a diameter slightly smaller than that of the substrate W. The circular plate portion 42 is supported by a support member 43 so that the lower surface of the circular plate portion 42 covers from above the surface region of the upper surface Wf of the substrate W, excluding the peripheral edge portion Ws. A notch portion 44 is formed in the peripheral edge portion of the circular plate portion 42. The notch portion 44 opens radially outward. This prevents the circular plate portion 42 from interfering with a processing liquid discharge nozzle included in the processing mechanism 5. That is, the processing liquid discharge nozzle can move back and forth in the radial direction X within a cutout space formed by the cutout portion 44 and extending radially outward.

[0039] The lower end of the support member 43 is attached to the center of the disk portion 42. A cylindrical through-hole is formed so as to vertically penetrate the support member 43 and the disk portion 42. A central nozzle 45 is inserted vertically into the through-hole. As shown in FIG. 2 , the central nozzle 45 is connected to a nitrogen gas supply unit 47 via a pipe 46. The nitrogen gas supply unit 47 supplies room-temperature nitrogen gas, supplied from the utility power of the factory in which the substrate processing system 100 is installed, to the central nozzle 45 at a flow rate and timing according to a nitrogen gas supply command from the control unit 10. In this embodiment, a ribbon heater 48 is attached to a portion of the pipe 46. The ribbon heater 48 generates heat in response to a heating command from the control unit 10 to heat the nitrogen gas flowing through the pipe 46.

[0040] The heated nitrogen gas (hereinafter referred to as "heated gas") is pressure-fed toward the central nozzle 45 and discharged from the central nozzle 45. When the heated gas is supplied while the disk 42 is positioned at a processing position adjacent to the substrate W held by the spin chuck 21, the heated gas flows from the center toward the periphery of the space between the upper surface Wf of the substrate W and the disk 42 incorporating the heater. This prevents the atmosphere around the substrate W from entering the upper surface Wf of the substrate W. As a result, it is possible to effectively prevent droplets contained in the atmosphere from being drawn into the space between the substrate W and the disk 42. Furthermore, the upper surface Wf is entirely heated by the heater 421 and the heated gas, thereby making the in-plane temperature of the substrate W uniform. This prevents the substrate W from warping and stabilizes the landing position of the processing liquid.

[0041] As shown in FIG. 2, the upper end of the support member 43 is fixed to a beam member 49 extending in a horizontal direction perpendicular to the substrate transport direction (the left-right direction in FIG. 3) in which the substrate W is loaded and unloaded. The beam member 49 is connected to the lifting mechanism 7 and is raised and lowered by the lifting mechanism 7 in response to commands from the control unit 10. For example, in FIG. 2, the beam member 49 is positioned downward, so that the disk portion 42 connected to the beam member 49 via the support member 43 is located at the processing position. On the other hand, when the lifting mechanism 7 raises the beam member 49 in response to a lift command from the control unit 10, the beam member 49, the support member 43, and the disk portion 42 rise together, and the upper cup 33 also rises in conjunction with the beam member 49, separating it from the lower cup 32. This widens the gap between the spin chuck 21 and the upper cup 33 and the disk portion 42, allowing the substrate W to be loaded and unloaded from the spin chuck 21.

[0042] 2 and 3, the processing mechanism 5 has a processing liquid discharge nozzle 51F arranged on the upper surface side of the substrate W, a processing liquid discharge nozzle 51B arranged on the lower surface side of the substrate W, and a processing liquid supply unit 52 that supplies the processing liquid to the processing liquid discharge nozzles 51F and 51B. In the following, in order to distinguish between the upper surface side processing liquid discharge nozzle 51F and the lower surface side processing liquid discharge nozzle 51B, they will be referred to as the "upper surface nozzle 51F" and the "lower surface nozzle 51B," respectively. Also, although two processing liquid supply units 52 are shown in FIG. 2, these are the same.

[0043] 5A is a perspective view showing the upper surface side processing liquid discharge nozzles equipped in the processing mechanism. In this embodiment, three upper surface nozzles 51F are provided, and a processing liquid supply unit 52 is connected to them. The processing liquid supply unit 52 is configured to be able to supply SC1, DHF, and functional water (CO2 water, etc.) as processing liquid, and SC1, DHF, and functional water can be independently discharged from the three upper surface nozzles 51F.

[0044] Each upper surface nozzle 51F has a nozzle main body 51F1 and an engagement portion 51F2 that is integrated with the nozzle main body 51F1. The engagement portion 51F2 can be made of a material that is harder than the nozzle main body 51F1, such as PBI (POLYBENZIMIDAZOLE) or amorphous carbon. As shown in the enlarged view of FIG. 3, the surface of the engagement portion 51F2 that is exposed toward the center of the substrate W functions as an engagement surface 512 during a calibration process, as will be described later.

[0045] 3, the nozzle body 51F1 has a lower tip surface provided with a discharge port 511 for discharging the processing liquid. As shown in the enlarged view of FIG. 3, the lower portions of a plurality of (three in this embodiment) upper surface nozzles 51F are disposed in the notched portions 44 of the disk portion 42 with the discharge ports 511 facing the peripheral edge of the upper surface Wf of the substrate W, and the upper portions of the upper surface nozzles 51F are movable integrally with the nozzle holder 53 in the radial direction X of the substrate W. The nozzle holder 53 is connected to a nozzle moving unit 54. The nozzle moving unit 54 has the function of moving the upper surface nozzles 51F collectively in the radial direction X. Accordingly, the nozzle moving unit 54 drives the three upper surface nozzles 51F collectively in the direction X in response to a nozzle movement command from the control unit 10. The nozzle movement command includes information regarding the nozzle movement distance, which will be described in detail later. When the upper surface nozzle 51F is moved a specified nozzle movement distance in the radial direction X based on this information, the upper surface nozzle 51F is positioned at the bevel processing position (see symbol Pt in FIGS. 9 and 10). As a result, the processing liquid is supplied from the upper surface nozzle 51F to a preset position from the edge of the substrate W. In order to position the nozzle 51F at the bevel processing position with high accuracy in this way, in this embodiment, a calibration process is executed prior to the bevel processing of the substrate W. This calibration process will be described later together with the configuration and operation of the nozzle movement unit 54.

[0046] The discharge port 511 of the upper surface nozzle 51F positioned at the bevel processing position faces the peripheral portion of the upper surface Wf of the substrate W. Then, when the processing liquid supply unit 52 supplies the processing liquid corresponding to the supply command out of the three types of processing liquid to the upper surface nozzle 51F for that processing liquid in response to a supply command from the control unit 10, the processing liquid is discharged from the discharge port 511 of that upper surface nozzle 51F to the peripheral portion of the upper surface Wf of the substrate W.

[0047] Furthermore, a lower sealed cup member 61 of the atmosphere separation mechanism 6 is detachably fixed to some of the components of the nozzle moving unit 54. That is, when performing bevel processing, the upper surface nozzle 51F and the nozzle holder 53 are integrated with the lower sealed cup member 61 via the nozzle moving unit 54, and are raised and lowered together with the lower sealed cup member 61 in the vertical direction Z by the lifting mechanism 7. On the other hand, when performing calibration processing, the lower sealed cup member 61 is detached, and the upper surface nozzle 51F and the nozzle holder 53 are reciprocated in the radial direction X by the nozzle moving unit 54 and are raised and lowered in the vertical direction Z by the lifting mechanism 7.

[0048] In this embodiment, a lower surface nozzle 51B and a nozzle support 57 are provided below the substrate W held by the spin chuck 21 to eject a processing liquid toward the peripheral portion of the lower surface Wb of the substrate W. The nozzle support 57 has a thin-walled cylindrical portion 571 extending vertically and a flange portion 572 having a ring shape folded outward in the radial direction at the upper end of the cylindrical portion 571. The cylindrical portion 571 has a shape that allows it to be freely inserted into the air gap formed between the annular member 27a and the lower cup 32. As shown in FIG. 2 , the nozzle support 57 is fixedly disposed so that the cylindrical portion 571 is loosely inserted into the air gap and the flange portion 572 is positioned between the substrate W held by the spin chuck 21 and the lower cup 32. Three lower surface nozzles 51B are attached to the peripheral portion of the upper surface of the flange portion 572. Each lower surface nozzle 51B has a discharge port (not shown) that opens toward the peripheral edge of the lower surface Wb of the substrate W, and is capable of discharging the processing liquid supplied from the processing liquid supply unit 52 via the piping 58.

[0049] The processing liquid discharged from these upper surface nozzle 51F and lower surface nozzle 51B performs bevel processing on the peripheral edge of the substrate W. Furthermore, on the lower surface side of the substrate W, a flange portion 572 is extended to the vicinity of the peripheral edge Ws. Therefore, nitrogen gas supplied to the lower surface side via the piping 28 flows along the flange portion 572 into the collection space SPc. As a result, backflow of droplets from the collection space SPc onto the substrate W is effectively suppressed.

[0050] The atmosphere separation mechanism 6 includes a lower sealing cup member 61 and an upper sealing cup member 62. Both the lower sealing cup member 61 and the upper sealing cup member 62 have a cylindrical shape that opens at the top and bottom. The inner diameters of the lower sealing cup member 61 and the upper sealing cup member 62 are larger than the outer diameter of the rotating cup unit 31. The atmosphere separation mechanism 6 is disposed so as to completely surround the spin chuck 21, the substrate W held by the spin chuck 21, the rotating cup unit 31, and the upper surface protection and heating mechanism 4 from above. More specifically, as shown in FIG. 2 , the upper sealing cup member 62 is fixedly disposed directly below the punching plate 14 so that its upper opening covers the opening 11b in the ceiling wall 11a from below. Therefore, the downflow of clean air introduced into the chamber 11 is divided into two parts: one that passes through the interior of the upper sealing cup member 62 and one that passes through the exterior of the upper sealing cup member 62.

[0051] The lower end of the upper sealed cup member 62 has a flange portion 621 having an inwardly folded annular shape. An O-ring 63 is attached to the upper surface of this flange portion 621. Inside the upper sealed cup member 62, the lower sealed cup member 61 is disposed so as to be movable in the vertical direction.

[0052] The upper end of the lower sealing cup member 61 has a flange portion 611 having an annular shape that is folded outward. This flange portion 611 overlaps with a flange portion 621 in a plan view from vertically above. Therefore, when the lower sealing cup member 61 descends, the flange portion 611 of the lower sealing cup member 61 is locked with the flange portion 621 of the upper sealing cup member 62 via the O-ring 63, as shown in FIGS. 3 and 14 . This positions the lower sealing cup member 61 at its lowest position. At this lowest position, the upper sealing cup member 62 and the lower sealing cup member 61 are connected in the vertical direction, and the downflow introduced into the upper sealing cup member 62 is guided toward the substrate W held by the spin chuck 21.

[0053] The lower end of the lower sealing cup member 61 has a flange portion 612 having an outwardly folded annular shape. In a plan view from vertically above, this flange portion 612 overlaps the upper end of the fixed cup portion 34 (the upper end of the liquid receiving portion 341). Therefore, at the lower limit position, as shown in the enlarged view in FIG. 3 , the flange portion 612 of the lower sealing cup member 61 is engaged with the fixed cup portion 34 via the O-ring 64. This connects the lower sealing cup member 61 and the fixed cup portion 34 in the vertical direction, and a sealed space SPs is formed by the upper sealing cup member 62, the lower sealing cup member 61, and the fixed cup portion 34. A bevel process can be performed on the substrate W within this sealed space SPs. In other words, by positioning the lower sealing cup member 61 at the lower limit position, the sealed space SPs is separated from the outer space SPo of the sealed space SPs (atmosphere separation). Therefore, the bevel process can be stably performed without being affected by the outer atmosphere. Furthermore, the processing liquid used for the bevel processing can be reliably prevented from leaking from the sealed space SPs to the outer space SPo, which increases the degree of freedom in the selection and design of the components to be placed in the outer space SPo.

[0054] The lower sealing cup member 61 is configured to be movable vertically upward. Furthermore, as described above, the nozzle head 56 (= upper surface nozzle 51F + nozzle holder 53) is fixed to the middle portion of the lower sealing cup member 61 in the vertical direction via a part of the nozzle moving part 54. In addition to this, as shown in FIGS. 2 and 3, the upper surface protection and heating mechanism 4 is fixed to the middle portion of the lower sealing cup member 61 via the beam member 49. That is, as shown in FIG. 3, the lower sealing cup member 61 is connected to one end of the beam member 49, the other end of the beam member 49, and the nozzle moving part 54 at three different locations in the circumferential direction. When the lifting mechanism 7 lifts and lowers the one end of the beam member 49, the other end of the beam member 49, and the nozzle moving part 54, the lower sealing cup member 61 also lifts and lowers accordingly.

[0055] 2, 3, and 14, a plurality of (four) protrusions 613 are provided on the inner peripheral surface of the lower sealing cup member 61 protruding inward as engagement portions that can engage with the upper cup 33. Each of the protrusions 613 extends to the space below the upper annular portion 332 of the upper cup 33. Each of the protrusions 613 is attached so as to move downward away from the upper annular portion 332 of the upper cup 33 when the lower sealing cup member 61 is positioned at the lowest position. When the lower sealing cup member 61 rises, each of the protrusions 613 can engage with the upper annular portion 332 from below. Even after this engagement, the upper cup 33 can be separated from the lower cup 32 by further rising the lower sealing cup member 61.

[0056] In this embodiment, after the lower sealing cup member 61 starts to rise together with the upper surface protection and heating mechanism 4 and the nozzle head 56 by the lifting mechanism 7, the upper cup 33 also rises together. As a result, the upper cup 33, the upper surface protection and heating mechanism 4, and the nozzle head 56 move upward away from the spin chuck 21. By moving the lower sealing cup member 61 to the retracted position, a transfer space is formed through which the hand of the substrate transfer robot 111 can access the spin chuck 21. Then, loading and unloading of the substrate W onto and from the spin chuck 21 can be performed via this transfer space. Thus, in this embodiment, the substrate W can access the spin chuck 21 with minimal lifting of the lower sealing cup member 61 by the lifting mechanism 7.

[0057] The lifting mechanism 7 has two lifting drive units 71 and 72. As shown in FIG. 3 , the lifting drive unit 71 is provided with a first lifting motor 711. The first lifting motor 711 operates in response to a drive command from the control unit 10 to generate a rotational force. Two lifting units 712 and 713 are connected to the first lifting motor 711. The lifting units 712 and 713 simultaneously receive the rotational force from the first lifting motor 711. The lifting unit 712 raises and lowers the support member 491, which supports one end of the beam member 49, in the vertical direction Z according to the rotation amount of the first lifting motor 711. The lifting unit 713 raises and lowers the nozzle moving unit 54, which supports the nozzle head 56 and moves it in the radial direction X, in the vertical direction Z according to the rotation amount of the first lifting motor 711.

[0058] 3, the lift drive unit 72 has a second lift motor 721 and a lift unit 722. The second lift motor 721 operates in response to a drive command from the control unit 10 to generate a rotational force, which is applied to the lift unit 722. The lift unit 722 raises and lowers the support member 492, which supports the other end of the beam member 49, in the vertical direction in accordance with the amount of rotation of the second lift motor 721.

[0059] The lifting and lowering drivers 71 and 72 synchronously move the support members 491, 492, and 54, which are fixed to the side surface of the lower sealing cup member 61 at three different positions in the circumferential direction, in the vertical direction. This allows the upper surface protection and heating mechanism 4, the nozzle head 56, and the lower sealing cup member 61 to be stably raised and lowered. Furthermore, the upper cup 33 can also be stably raised and lowered in conjunction with the raising and lowering of the lower sealing cup member 61.

[0060] The centering mechanism 8 has a contact member 81 that can move toward and away from the edge of the substrate W loaded on the spin chuck 21, and a centering drive unit 82 for moving the contact member 81 horizontally. In this embodiment, three contact members 81 are arranged radially at equal angular intervals around the rotation axis AX, only one of which is shown in FIG. 2. In this centering mechanism 8, while suction by the pump 26 is stopped (i.e., while the substrate W is horizontally movable on the upper surface of the spin chuck 21), the centering drive unit 82 moves the contact member 81 toward the substrate W in response to a centering command from the control unit 10 (centering process). This centering process eliminates eccentricity of the substrate W with respect to the spin chuck 21, and the center of the substrate W coincides with the center of the spin chuck 21.

[0061] The substrate observing mechanism 9 has an observing head 91 for observing the peripheral edge of the substrate W. This observing head 91 is configured to be able to move towards and away from the peripheral edge of the substrate W. An observing head drive unit 92 is connected to the observing head 91. When observing the peripheral edge of the substrate W using the observing head 91, the observing head drive unit 92 brings the observing head 91 close to the substrate W in response to an observation command from the control unit 10 (observation process). Then, the peripheral edge of the substrate W is imaged using the observing head 91. The imaged image is sent to the control unit 10. Based on this image, the control unit 10 inspects whether the bevel processing has been performed satisfactorily.

[0062] The control unit 10 includes an arithmetic processing unit 10A, a memory unit 10B, a reader 10C, an image processor 10D, a drive controller 10E, a communication unit 10F, and an exhaust controller 10G. The memory unit 10B is configured with a hard disk drive or the like and stores a program for executing the calibration process and the bevel process by the substrate processing apparatus 1. The program is stored, for example, on a computer-readable recording medium RM (e.g., an optical disk, a magnetic disk, a magneto-optical disk, etc.). The reader 10C reads the program from the recording medium RM and stores it in the memory unit 10B. The program may be provided not only from the recording medium RM but also via a telecommunications line. The image processor 10D performs various processes on images captured by the substrate observation mechanism 9. The drive controller 10E controls the various drive units of the substrate processing apparatus 1. The communication unit 10F communicates with a control unit that controls the various units of the substrate processing system 100. The exhaust controller 10G controls the exhaust mechanism 38.

[0063] The control unit 10 is also connected to a display unit 10H (for example, a display) that displays various information, and an input unit 10J (for example, a keyboard and a mouse) that accepts input from an operator.

[0064] The arithmetic processing unit 10A is configured by a computer having a CPU (Central Processing Unit), RAM (Random Access Memory), etc., and controls each part of the substrate processing apparatus 1 in accordance with a program stored in the storage unit 10B as follows to perform the calibration process and the bevel process. To perform these processes, the arithmetic processing unit 10A executes the above program to perform the functions shown in FIG.

[0065] 6 is a block diagram showing functions executed by the arithmetic processing unit of the substrate processing apparatus shown in FIG. 2. The arithmetic processing unit 10A includes a calibration unit 10K and a nozzle positioning unit 10L. The calibration unit 10K calculates the nozzle movement distance required to move the upper surface nozzle 51F, which is located at a home position (see symbol Ph in FIG. 9) spaced apart from the spin chuck 21 in the radial direction X, to a bevel processing position Pt using a jig wafer (corresponding to an example of the "jig plate" of the present invention) having the same shape as the substrate W. To perform this function, the calibration unit 10K includes a measurement unit 10K1 and a movement distance calculation unit 10K2. Measurement unit 10K1 measures a first distance traveled by top surface nozzle 51F from the home position to the jig wafer (denoted by symbol JW in FIG. 9) after top surface nozzle 51F starts moving from the home position to the jig wafer in an orientation in which engagement surface 512 of top surface nozzle 51F faces the edge surface of the jig wafer held by spin chuck 21 until engagement surface 512 abuts on the edge surface of the jig wafer. Movement distance calculation unit 10K2 also reads from memory unit 10B a second distance M2 required to move top surface nozzle 51F in an orientation in which engagement surface 512 abuts on the edge surface of the jig wafer along radial direction X to a bevel processing position, and adds this to the first distance to calculate the nozzle movement distance.

[0066] Meanwhile, the nozzle positioning unit 10L positions the upper surface nozzle 51F based on the nozzle movement distance calculated by the calibration unit 10K. More specifically, the nozzle positioning unit 10L positions the upper surface nozzle 51F at the bevel processing position by moving the upper surface nozzle 51F in the radial direction X from the separated position by the nozzle movement distance.

[0067] Fig. 7 is a flowchart showing the bevel process performed by the substrate processing apparatus shown in Fig. 2. Fig. 8 is a flowchart showing the calibration process included in the bevel process. Fig. 9 is a schematic diagram showing each part of the apparatus during the calibration process. Fig. 10 is a schematic diagram showing each part of the apparatus during the bevel process. Here, after explaining the configuration of the nozzle movement unit 54, the nozzle position adjustment performed in the calibration process and the bevel process will be described in detail.

[0068] 9 and 10, the nozzle moving part 54 is attached to the upper end of the lifter 713a of the lifting / lowering part 713 while holding the nozzle head 56 (=upper surface nozzle 51F+nozzle holder 53). Therefore, when the lifter 713a expands and contracts in the vertical direction in response to a lifting / lowering command from the control unit 10, the nozzle moving part 54 and the nozzle head 56 move in the vertical direction Z accordingly.

[0069] In addition, in the nozzle movement section 54, a base member 541 is fixed to the upper end of the lifter 713a. A linear motion actuator 542 is attached to this base member 541. The linear motion actuator 542 has a motor (hereinafter referred to as the "nozzle drive motor") 543 that functions as a drive source for moving the nozzle in the radial direction X, and a motion conversion mechanism 545 that converts the rotational motion of a rotor such as a ball screw connected to the rotation shaft of the nozzle drive motor 543 into linear motion, thereby moving a slider 544 back and forth in the radial direction X. In addition, in the motion conversion mechanism 545, a guide such as an LM Guide (registered trademark) is used to stabilize the movement of the slider 544 in the radial direction X.

[0070] A head support member 547 is connected to the slider 544, which is driven to reciprocate in the radial direction X, via a connecting member 546. The head support member 547 has a rod shape extending in the radial direction X. The (+X) end of the head support member 547 is fixed to the slider 544. Meanwhile, the (-X) end of the head support member 547 extends horizontally toward the spin chuck 21, and the nozzle head 56 is attached to the tip of the end. Therefore, when the nozzle drive motor 543 rotates in response to a nozzle movement command from the control unit 10, the slider 544, the head support member 547, and the nozzle head 56 move integrally in the (+X) direction or the (-X) direction corresponding to the rotation direction, and by a distance corresponding to the amount of rotation. As a result, the upper surface nozzle 51F attached to the nozzle head 56 is positioned in the radial direction X. For example, as shown in (a) of FIG. 7 , when the upper surface nozzle 51F is positioned at a preset home position Ph (corresponding to an example of the “separate position” of the present invention), the spring member 548 provided in the motion conversion mechanism 545 is compressed by the slider 544, applying a biasing force in the (−X) direction to the slider 544. This allows the backlash included in the motion conversion mechanism 545 to be controlled. In other words, because the motion conversion mechanism 545 includes mechanical components such as guides, it is practically difficult to reduce the backlash along the radial direction X to zero. Unless sufficient consideration is given to this, the positioning accuracy of the upper surface nozzle 51F in the radial direction X decreases. Therefore, in this embodiment, by providing the spring member 548, the backlash is always biased in the (−X) direction when the upper surface nozzle 51F is stationary at the home position Ph. This allows the effects of backlash to be suppressed by performing a bevel process including a calibration process, which will be described next with reference to FIGS. 7 to 10 , enabling highly accurate nozzle positioning.

[0071] In this embodiment, when performing bevel processing, the arithmetic processing unit 10A determines whether the nozzle movement distance (symbol M in FIGS. 9 and 10) required to move and position the upper surface nozzle 51F to the bevel processing position has already been acquired and stored in the memory unit 10B (step S1). Only when the nozzle movement distance M has not been acquired ("NO" in step S1), the arithmetic processing unit 10A executes the calibration process (step S2). On the other hand, when the nozzle movement distance M has already been acquired ("YES" in step S1), the calibration process is skipped and the process proceeds to step S3.

[0072] When performing the calibration process, the operator removes the atmosphere separation mechanism 6, and after the processing unit 10A executes the steps shown in FIGS. 8 and 9, the operator returns the atmosphere separation mechanism 6 to its original position and proceeds to step S3. In this calibration process, the processing unit 10A controls the nozzle drive motor 543 so that the upper surface nozzle 51F is positioned at a home position Ph spaced apart from the spin chuck 21 in the radial direction X (step S201). During this positioning, as the upper surface nozzle 51F moves to the home position Ph, the slider 544 compresses the spring member 548, and the biasing force associated with the compression is applied to the slider 544, as shown in FIG. 9(a). As a result, backlash generated in the motion conversion mechanism 545 is biased in the (-X) direction. In addition, in this embodiment, in consideration of subsequent processes, the upper surface nozzle 51F is positioned at a height position Zh in the vertical direction Z that is lower than a height position Zt at which the bevel processing is performed (hereinafter referred to as the "processing height position") when the upper surface nozzle 51F performs the bevel processing. This height position Zh coincides with the height of the jig wafer JW that will be placed on the spin chuck 21 in the next step S202.

[0073] In step S202, the jig wafer JW is placed on the spin chuck 21. This placing operation, or so-called loading operation, may be performed by an operator or by the substrate transport robot 111. During this loading operation, application of negative pressure to the spin chuck 21 is stopped.

[0074] The arithmetic processing unit 10A issues a centering command to the centering drive unit 82 while maintaining the suspension of the application of the negative pressure. In response to this, the centering drive unit 82 moves the abutting member 81 closer to the jig wafer JW, thereby aligning the center of the jig wafer JW with the center of the spin chuck 21 (centering process). Subsequently, the arithmetic processing unit 10A issues a negative pressure application command to the pump 26. As a result, the jig wafer JW is attracted and held by the spin chuck 21 (step S203). As shown in FIG. 9(a), the edge surface of the jig wafer JW faces the engagement surface 512 of the upper surface nozzle 51F while being at the same height.

[0075] In the next step S204, the arithmetic processing unit 10A issues a drive command to the nozzle drive motor 543 to start moving the upper nozzle 51F toward the jig wafer JW. Simultaneously with this start of movement, the arithmetic processing unit 10A starts counting the movement distance of the jig wafer JW and continues counting until the engagement surface 512 of the upper nozzle 51F abuts against the edge of the jig wafer JW (step S205). In this embodiment, abutment of the engagement surface 512 with the edge of the jig wafer JW is determined based on whether the value of the drive current (hereinafter referred to as the "current value") of the nozzle drive motor 543 suddenly fluctuates and exceeds a preset value (step S206). This allows accurate detection of the abutment of the engagement surface 512 with the edge of the jig wafer JW. Note that in this embodiment, the abutment determination is performed based on the current value, but the determination method is not limited to this. For example, optical components such as a camera or optical sensor may be attached to the nozzle head 56, and the abutment determination may be performed by optical detection using the optical components. Furthermore, the arithmetic processing unit 10A may control the nozzle drive motor 543 to decelerate the moving speed of the jig wafer JW as the upper surface nozzle 51F approaches the jig wafer JW, thereby reducing the impact when the upper surface nozzle 51F comes into contact with the jig wafer JW.

[0076] Simultaneously with the contact of the engagement surface 512 with the edge surface of the jig wafer JW, the arithmetic processing unit 10A issues a movement stop command to the nozzle drive motor 543 to stop the movement of the upper surface nozzle 51F along the radial direction X. As a result, as shown in FIG. 9(b), the upper surface nozzle 51F is positioned at the contact position Pe with the engagement surface 512 of the upper surface nozzle 51F in contact with the edge surface of the jig wafer JW. Concurrently, the arithmetic processing unit 10A stores the movement distance counted in step S205 in the memory unit 10B (step S207). This movement distance refers to the distance the upper surface nozzle 51F has traveled from the home position Ph to the contact position Pe and corresponds to an example of the "first distance" of the present invention. Therefore, hereinafter, this movement distance will be referred to as the first distance M1.

[0077] Next, the arithmetic processing unit 10A issues an upward command to the lifting mechanism 7 while keeping the upper surface nozzle 51F positioned at the abutment position Pe. As a result, the upper surface nozzle 51F is raised to the processing height position Zt, as shown in section (c) of FIG. 9 (step S208). Subsequently, the arithmetic processing unit 10A reads the second distance M2 from the storage unit 10B and issues a drive command to the nozzle drive motor 543 to further move the upper surface nozzle 51F by the second distance M2 in the direction toward the rotation axis AX, i.e., in the (-X) direction, as shown in section (d) of FIG. 9 (step S209). If the upper surface nozzle 51F is positioned as designed after this movement, it should be located at the bevel processing position Pt. Therefore, in this embodiment, the arithmetic processing unit 10A waits for the operator to confirm the positioning of the upper surface nozzle 51F at the bevel processing position Pt before determining the nozzle movement distance M. Here, if it is not confirmed that the upper surface nozzle 51F is positioned at the bevel processing position Pt ("NO" in step S210), the calibration process is interrupted and the process proceeds to error processing.

[0078] When positioning to the bevel processing position Pt is confirmed in step S210, the arithmetic processing unit 10A calculates the nozzle movement distance M by adding the second distance M2 to the first distance M1 obtained in step S207 (step S211). This nozzle movement distance M is saved in the memory unit 10B. Furthermore, the arithmetic processing unit 10A issues a home return command to the nozzle drive motor 543 to return the upper surface nozzle 51F to the home position Ph (step S212). More specifically, the upper surface nozzle 51F is moved in the (+X) direction by the nozzle movement distance M and separated from the jig wafer JW. Furthermore, the arithmetic processing unit 10A issues a negative pressure stop command to the pump 26 to stop applying negative pressure to the spin chuck 21.

[0079] In step S213, the jig wafer JW is unloaded from the spin chuck 21. When the calibration process is completed in this manner, the operator returns the atmosphere separation mechanism 6 to its original position. The unloading operation may be performed by the operator or by the substrate transport robot 111.

[0080] Returning to FIG. 7, the explanation of the bevel processing will be continued. In step S3, as shown in (a) of FIG. 10, the substrate W before the bevel processing is placed on the spin chuck 21. During this loading operation, the upper surface nozzle 51F is located at the home position Ph and the processing height position Zt. Furthermore, application of negative pressure to the spin chuck 21 is stopped. Then, in this standby state, the loading operation is performed by the substrate transport robot 111.

[0081] Subsequently, in the same manner as in step S203, the centering process for the substrate W and the suction and holding of the substrate W are carried out (step S4).

[0082] Next, the arithmetic processing unit 10A reads out the nozzle movement distance M from the memory unit 10B. Then, the arithmetic processing unit 10A issues a nozzle movement command to the nozzle drive motor 543, and moves the upper surface nozzle 51F by the nozzle movement distance M in the direction toward the rotation axis AX, i.e., in the (-X) direction, as shown in (b) of FIG. 10 (step S5).

[0083] When preparation for supplying the processing liquid to the peripheral edge of the substrate W is thus completed, the arithmetic processing unit 10A issues a rotation command to the rotation drive unit 23 to rotate the substrate W about the rotation axis AX, and issues a supply command to the processing liquid supply unit 52 to supply the processing liquid to the upper surface nozzle 51F, thereby performing bevel processing on the peripheral edge of the substrate W (step S6).

[0084] In this embodiment, after the beveling process is completed, the arithmetic processing unit 10A issues an observation command to the observation head driving unit 92 to bring the observation head 91 close to the substrate W (observation process). Then, the arithmetic processing unit 10A checks whether the beveling process has been performed satisfactorily based on an image of the peripheral edge of the substrate W captured using the observation head 91. If the desired etching width has not been obtained ("NO" in step S7), the beveling process is interrupted and error processing is executed.

[0085] As described above, according to the first embodiment, with less operator work than in the prior art, the movement distance (first distance M1) of the upper nozzle 51F until the engagement surface 512 of the upper nozzle 51F abuts against the edge surface of the jig wafer JW and the distance (second distance) required to move the upper nozzle 51F in an orientation in which the engagement surface 512 abuts against the edge surface of the jig wafer JW along the radial direction X to the bevel processing position Pt are acquired. The sum of these distances is then calculated as the nozzle movement distance M. Therefore, the first embodiment solves the conventional problem of different nozzle movement distances M for each operator, making it possible to adjust the liquid supply position with high precision. Furthermore, the reduced operator work reduces the total cost required for substrate processing and also reduces positioning accuracy errors between substrate processing apparatuses 1 and chambers 11. As a result, bevel processing can be performed stably.

[0086] Furthermore, since the second distance M2 is a value determined by design based on the bevel processing position Pt and the radial size of the substrate W, it is also possible to calculate the nozzle movement distance M immediately after measuring the first distance M1. That is, steps S207 to S209 in FIG. 8 may be omitted and the process may proceed directly to step S211. This reduces the time required for the calibration process. However, in the first embodiment, as shown in FIG. 8 and FIG. 9 (d), the upper surface nozzle 51F is moved to the bevel processing position Pt, and the nozzle movement distance M is determined after the relative position of the upper surface nozzle 51F with respect to the jig wafer JW is confirmed. This allows for more accurate nozzle position adjustment.

[0087] Furthermore, at the home position Ph, the biasing force generated by the spring member 548 is always applied to the slider 544, and the backlash generated in the motion conversion mechanism 545 is biased in the (-X) direction. This reliably suppresses variations in the measurement results of the first distance M1 due to backlash, and the nozzle movement distance M can be accurately determined. As a result, the upper surface nozzle 51F can be positioned at the bevel processing position Pt with high precision without being affected by backlash. The installation of the spring member 548 is optional, and the spring member 548 may also be installed in the second embodiment described next.

[0088] Furthermore, since the centering process is performed on the jig wafer JW prior to measuring the first distance M1, the first distance M1 can be determined stably.

[0089] Furthermore, in the first embodiment, the upper surface nozzle 51F is integrated with two types of components having different hardnesses. Of course, the upper surface nozzle 51F may be formed from a single material, but wear of the engagement surface 512 due to contact with the jig wafer JW may become a problem. In contrast, in the first embodiment, the hardness of the engagement portion 51F2 is higher than that of the nozzle main body 51F1, so this wear can be effectively suppressed. In other words, a decrease in device operation due to wear on the engagement surface 512 can be suppressed.

[0090] As described above, in the first embodiment, a part (engagement surface 512) of the upper surface nozzle 51F is brought into contact with the jig wafer JW, but a dedicated position adjustment jig may also be used to determine the nozzle movement distance M (second embodiment). Hereinafter, the second embodiment of the present invention will be described with reference to FIGS. 5B, 11, and 12.

[0091] FIG. 5B is a perspective view showing an upper surface-side processing liquid discharge nozzle equipped to a processing mechanism in the second embodiment. FIG. 11 is a flowchart showing a calibration process in the second embodiment. FIG. 12 is a schematic diagram showing each part of the device during a calibration process in the second embodiment. The second embodiment differs significantly from the first embodiment in that the nozzle movement distance M is obtained while attaching and detaching a position adjustment jig PJ to and from the upper surface nozzle 51F instead of the engagement surface 512, and that a spring member 548 is not provided. In other respects, the second embodiment is the same as the first embodiment. Therefore, the following description will focus on the differences, and the same components will be denoted by the same reference numerals and will not be described again.

[0092] 12(a), in the calibration process in the second embodiment, the calculation processing unit 10A controls the nozzle drive motor 543 so that the upper surface nozzle 51F is located at a home position Ph spaced apart from the spin chuck 21 in the radial direction X (step S221). At the home position Ph, the upper surface nozzle 51F is positioned at a height position Zt that is the same as the bevel processing position Pt in the vertical direction Z.

[0093] Next, as in the first embodiment, the jig wafer JW is loaded (step S222), and the jig wafer JW is centered and held by suction (step S23). After that, the operator confirms that the upper end of the position adjustment jig PJ is detachably attached to the side of the upper surface nozzle 51F while the lower end of the rectangular position adjustment jig PJ faces the edge surface of the jig wafer JW (step S224). The arithmetic processing unit 10A then issues a drive command to the nozzle drive motor 543 to start moving the position adjustment jig PJ and the upper surface nozzle 51F toward the jig wafer JW. Simultaneously with this start of movement, the arithmetic processing unit 10A starts counting the distance the jig wafer JW has moved and continues counting until the lower end of the position adjustment jig PJ abuts against the edge surface of the jig wafer JW (step S226). Then, similarly to the first embodiment, the arithmetic processing unit 10A detects contact of the position adjustment jig PJ with the jig wafer JW based on fluctuations in the current value of the nozzle drive motor 543 (step S227). Of course, the contact of the position adjustment jig PJ with the jig wafer JW may be detected by the optical detection described above.

[0094] Simultaneously with the contact of the position adjustment jig PJ with the edge surface of the jig wafer JW, the arithmetic processing unit 10A issues a movement stop command to the nozzle drive motor 543 to stop the movement of the upper surface nozzle 51F along the radial direction X. As a result, as shown in FIG. 12(b), the upper surface nozzle 51F is positioned at the contact position Pe with the position adjustment jig PJ in contact with the edge surface of the jig wafer JW. Concurrently, the arithmetic processing unit 10A stores the movement distance counted in step S205 in the memory unit 10B (step S228). This movement distance refers to the distance the upper surface nozzle 51F has traveled from the home position Ph to the contact position Pe, and corresponds to an example of the "third distance" of the present invention. Therefore, hereinafter, this movement distance will be referred to as the third distance M3.

[0095] Next, as shown in section (c) of FIG. 12, after the position adjustment jig PJ is removed by the operator (step S229), the arithmetic processing unit 10A reads the fourth distance M4 from the storage unit 10B and issues a drive command to the nozzle drive motor 543 to further move the upper surface nozzle 51F by the fourth distance M4 in the direction toward the rotation axis AX, i.e., in the (-X) direction, as shown in section (d) of FIG. 12 (step S230). If the upper surface nozzle 51F after this movement is as designed, it should be positioned at the bevel processing position Pt. The arithmetic processing unit 10A waits for the operator to confirm the positioning of the upper surface nozzle 51F at the bevel processing position Pt before determining the nozzle movement distance M. Here, if the positioning of the upper surface nozzle 51F at the bevel processing position Pt is not confirmed ("NO" in step S231), the calibration process is interrupted and error processing proceeds.

[0096] When positioning at the bevel processing position Pt is confirmed in step S231, the arithmetic processing unit 10A calculates the nozzle movement distance M by adding the fourth distance M4 to the third distance M3 obtained in step S228 (step S232). This nozzle movement distance M is saved in the memory unit 10B. Furthermore, the arithmetic processing unit 10A issues a home return command to the nozzle drive motor 543 to return the upper surface nozzle 51F to the home position Ph (step S233). More specifically, the upper surface nozzle 51F is moved in the (+X) direction by the nozzle movement distance M and separated from the jig wafer JW. Furthermore, the arithmetic processing unit 10A issues a negative pressure stop command to the pump 26 to stop applying negative pressure to the spin chuck 21.

[0097] In step S234, the jig wafer JW is unloaded from the spin chuck 21. When the calibration process is completed in this manner, the operator returns the atmosphere separation mechanism 6 to its original position. The unloading operation may be performed by the operator or by the substrate transport robot 111. Following the calibration process, a bevel process similar to that in the first embodiment is performed.

[0098] As described above, in the second embodiment, with less operator work than in the prior art, the movement distance (third distance M3) of the upper nozzle 51F until the position adjustment jig PJ attached to the upper nozzle 51F abuts against the edge surface of the jig wafer JW and the distance (fourth distance) required to move the upper nozzle 51F in the position where the position adjustment jig PJ abuts against the edge surface of the jig wafer JW along the radial direction X to the bevel processing position Pt are obtained. The sum of these distances is then calculated as the nozzle movement distance M. Therefore, similar to the first embodiment, the second embodiment also solves the conventional problem of different nozzle movement distances M for different operators, making it possible to adjust the liquid supply position with high precision. Furthermore, the reduced operator work reduces the total cost required for substrate processing and the positioning accuracy error between substrate processing apparatuses 1 and chambers 11. As a result, bevel processing can be performed stably.

[0099] Furthermore, since the fourth distance M4 is a value determined by the design based on the bevel processing position Pt and the radial size of the position adjustment jig PJ and the substrate W, it is also possible to calculate the nozzle movement distance M immediately after measuring the third distance M3. That is, steps S230 to S232 in FIG. 11 may be omitted and the process may proceed directly to step S233. This reduces the time required for the calibration process. However, as in the first embodiment, the nozzle movement distance M is determined after the upper surface nozzle 51F is moved to the bevel processing position Pt and the relative position of the upper surface nozzle 51F with respect to the jig wafer JW is confirmed. This allows for more accurate nozzle position adjustment.

[0100] Furthermore, since the centering process is performed on the jig wafer JW prior to measuring the third distance M3, the third distance M3 can be determined stably.

[0101] Furthermore, in the second embodiment, the position adjustment jig PJ is attached and detached to the upper surface nozzle 51F before and after measuring the third distance M3, so that the height position of the upper surface nozzle 51F can always be maintained at the same height position as the bevel processing position Pt, and the calibration processing and bevel processing can be performed stably.

[0102] The present invention is not limited to the above-described embodiment, and various modifications other than those described above are possible without departing from the spirit of the present invention. For example, in the above-described embodiment, the jig wafer JW is centered so that the center of the jig wafer JW substantially coincides with the rotation axis AX. However, it is difficult to reduce the amount of deviation of the center of the jig wafer JW relative to the rotation axis AX, i.e., the amount of eccentricity, to zero. For example, as shown in FIG. 13, the position of the end face of the jig wafer JW in the radial direction X periodically fluctuates, and the amount of eccentricity Md becomes greater than zero. Therefore, in the first embodiment, in step S203, the jig wafer JW is suction-held at a rotation angle at which the end face of the jig wafer JW is positioned furthest in the (+X) direction, and in step S211, the arithmetic processing unit 10A calculates the following equation: Nozzle movement distance M=M1+M2+Md In the second embodiment, the jig wafer JW is suction-held at a rotation angle at which the edge of the jig wafer JW is positioned furthest in the (+X) direction in step S223, and the arithmetic processing unit 10A calculates the nozzle movement distance M in accordance with the following equation: Nozzle movement distance M=M3+M4+Md The nozzle movement distance M may be calculated according to the amount of eccentricity M (fourth embodiment). According to these embodiments, the influence of eccentricity can be suppressed. Note that, when performing calibration processing by suction-holding the jig wafer JW at the rotation angle at which the edge of the jig wafer JW is positioned furthest in the (-X) direction, conversely, Md can be subtracted. In this way, by correcting the nozzle movement distance M by the amount of eccentricity Md, the influence of eccentricity can be minimized, and nozzle position adjustment can be performed with high precision.

[0103] Furthermore, in the above embodiment, the present invention is applied to the substrate processing apparatus 1 having the atmosphere separation mechanism 6, but the present invention can also be applied to a substrate processing apparatus that does not have the atmosphere separation mechanism 6. Furthermore, the present invention is applied to the substrate processing apparatus having the rotating cup portion 31, but the present invention can also be applied to a substrate processing apparatus that constantly collects droplets scattered from the substrate W using a stationary cup portion. [Industrial Applicability]

[0104] The present invention can be applied to a nozzle position adjustment method for adjusting the position of a nozzle in the radial direction X of a substrate, and to general substrate processing techniques for supplying a processing liquid to a substrate from a nozzle whose position has been adjusted by the nozzle position adjustment method. [Explanation of symbols]

[0105] 1...Substrate processing apparatus (processing unit) 10...Control unit 10A: Processing unit 10B…Storage section 10K…Calibration section 10L...Nozzle positioning part 10K1...Measuring unit 10K2...Movement distance calculation section 512...(Upper nozzle) engagement surface 51B... Processing liquid discharge nozzle (upper nozzle) 543...(Nozzle drive) motor 545...Movement conversion mechanism 548...Spring member AX...rotation axis JW: Jig wafer M: Nozzle movement distance M1…1st distance M2…Second distance M3: Third distance M4…4th distance Md…Eccentricity Pe…Contact position Ph…Home position (away position) PJ...Position adjustment jig Pt...(bevel) processing position Z: Vertical direction

Claims

1. In a substrate processing apparatus including a rotation holding unit that holds and rotates a substrate around a rotation axis that extends in a vertical direction, a nozzle that supplies a processing liquid for substrate processing to the substrate, and a nozzle moving unit that moves the nozzle in a radial direction of the substrate, a nozzle position adjustment method is provided for positioning the nozzle at a processing position in the radial direction to supply the processing liquid to a predetermined position from an edge surface of the substrate, the method comprising: a first step of holding a jig plate having the same shape as the substrate by the rotary holding unit; a second step of positioning the nozzle at a position spaced apart from the rotation holder; a third step of starting to move the nozzle from the separated position toward the jig plate in a position where an engagement surface of the nozzle faces an end surface of the jig plate held by the rotation holding portion; a fourth step of measuring a first distance traveled by the nozzle from the execution of the third step until the engagement surface abuts against the end surface of the jig plate; a fifth step of calculating a nozzle movement distance by adding a second distance required to move the nozzle in a position where the engagement surface is in contact with the end surface of the jig plate along the radial direction to the processing position to the first distance, The first to fifth steps are performed before the substrate processing, A nozzle position adjustment method characterized in that, when performing the substrate processing, after performing the second process, the nozzle is positioned at the processing position by moving the nozzle in the radial direction by the nozzle movement distance.

2. The nozzle position adjustment method according to claim 1, The fifth step is a nozzle position adjusting method that is executed by reading out the second distance stored in advance in a storage unit of the substrate processing apparatus from the storage unit.

3. The nozzle position adjustment method according to claim 1, a sixth step of moving the nozzle above the jig plate in a position where the engagement surface is in contact with the end surface of the jig plate, and then moving the nozzle to the second distance in the radial direction; The nozzle position adjusting method includes performing the sixth step before the substrate processing.

4. In a substrate processing apparatus including a rotation holding unit that holds and rotates a substrate around a rotation axis that extends in a vertical direction, a nozzle that supplies a processing liquid for substrate processing to the substrate, and a nozzle moving unit that moves the nozzle in a radial direction of the substrate, a nozzle position adjustment method is provided for positioning the nozzle at a processing position in the radial direction to supply the processing liquid to a predetermined position from an edge surface of the substrate, the method comprising: a seventh step of holding a jig plate having the same shape as the substrate by the rotary holding unit; an eighth step of positioning the nozzle at a position spaced apart from the rotation holder; a ninth step of attaching a position adjustment jig to the nozzle so as to face the end surface of the jig plate held by the rotary holding unit before or after the eighth step; a tenth step of starting to move the nozzle from the separated position toward the jig plate with the position adjustment jig facing the end surface of the jig plate; an eleventh step of measuring a third distance traveled by the nozzle from the execution of the tenth step until the position adjustment jig abuts against the end surface of the jig plate; a twelfth step of calculating a nozzle movement distance by adding a fourth distance required to move the nozzle, with the position adjustment jig in a position where it is in contact with the end surface of the jig plate, to the third distance, Before the substrate processing, the seventh step to the twelfth step are performed, A nozzle position adjustment method characterized in that, when performing the substrate processing, after performing the eighth step, the nozzle is positioned at the processing position by moving the nozzle in the radial direction by the nozzle movement distance.

5. The nozzle position adjustment method according to claim 4, The twelfth step is a nozzle position adjusting method that is executed by reading out the fourth distance stored in advance in a storage unit of the substrate processing apparatus from the storage unit.

6. The nozzle position adjustment method according to claim 4, a thirteenth step of moving the nozzle by the fourth distance in the radial direction after removing the position adjustment jig that is in contact with the end surface of the jig plate from the nozzle, the attitude in the tenth step is an attitude in which the nozzle is positioned above the jig plate while a lower end of the position adjustment jig is positioned at the same height as the jig plate in the vertical direction, The thirteenth step is a nozzle position adjusting method that is performed before the substrate processing.

7. The nozzle position adjustment method according to any one of claims 1 to 6, a nozzle position adjustment method for measuring an amount of eccentricity of a center of the jig plate held by the rotation holding unit relative to the rotation axis before performing the substrate processing, and correcting the nozzle movement distance based on the amount of eccentricity.

8. The nozzle position adjustment method according to claim 7, A nozzle position adjustment method in which, before the jig plate is held by the rotating holding unit, a centering process is performed to align the center of the jig plate with the rotation axis, and then the eccentricity amount is measured and the nozzle movement distance is corrected.

9. The nozzle position adjustment method according to any one of claims 1 to 6, When the nozzle moving unit has a motor as a drive source for moving the nozzle, The nozzle position adjustment method detects contact with the end face of the jig plate based on fluctuations in the current supplied to the motor or fluctuations in the load on the motor.

10. The nozzle position adjustment method according to any one of claims 1 to 6, A nozzle position adjustment method in which contact with the end face of the jig plate is detected by an optical component attached to the nozzle.

11. The nozzle position adjustment method according to any one of claims 1 to 6, When the nozzle moving unit has a linear actuator having a motor and a motion conversion mechanism that converts the rotational motion of the motor into linear motion, a nozzle position adjusting method for positioning the nozzle such that, when the nozzle is positioned at the separated position, backlash included in the motion converting mechanism is biased to one side in the radial direction;

12. The nozzle position adjustment method according to claim 11, A nozzle position adjustment method in which the nozzle positioned at the separated position is biased in a direction toward the rotation axis, thereby biasing the backlash toward the rotation axis in the radial direction.

13. a rotation holder that holds and rotates the substrate around a rotation axis that extends in a vertical direction; a nozzle for supplying a processing liquid for processing the substrate onto the substrate; a nozzle moving unit that moves the nozzle in a radial direction of the substrate; a control unit that controls the nozzle movement unit so that the nozzle is positioned at a processing position for supplying the processing liquid to a predetermined position from the edge surface of the substrate, The control unit a calibration unit that calculates a nozzle movement distance required to move the nozzle, which is located at a position separated from the rotation holder in the radial direction, to the processing position using a jig plate having the same shape as the substrate, before the substrate processing; and a nozzle positioning unit that positions the nozzle at the processing position by moving the nozzle from the separated position by the nozzle movement distance in the radial direction, The calibration unit a measuring unit that measures a first distance traveled by the nozzle after the nozzle starts moving from the separated position to the jig plate in an attitude in which an engagement surface of the nozzle faces the end surface of the jig plate held by the rotation holding unit, until the engagement surface abuts against the end surface of the jig plate; a movement distance calculation unit that calculates the nozzle movement distance by adding a second distance required to move the nozzle, with the engagement surface in contact with the end surface of the jig plate, along the radial direction to the processing position to the first distance; have A substrate processing apparatus comprising:

14. The substrate processing apparatus according to claim 13, the nozzle includes a nozzle body having a discharge port for discharging the treatment liquid, and an engagement portion having the engagement surface and integrated with the nozzle body, The substrate processing apparatus, wherein the engagement portion has a hardness higher than that of the nozzle body.

15. a rotation holder that holds and rotates the substrate around a rotation axis that extends in a vertical direction; a nozzle for supplying a processing liquid for processing the substrate onto the substrate; a nozzle moving unit that moves the nozzle in a radial direction of the substrate; a control unit that controls the nozzle movement unit so that the nozzle is positioned at a processing position for supplying the processing liquid to a predetermined position from the edge surface of the substrate, The control unit a calibration unit that calculates a nozzle movement distance required to move the nozzle, which is located at a position separated from the rotation holder in the radial direction, to the processing position using a jig plate having the same shape as the substrate, before the substrate processing; and a nozzle positioning unit that positions the nozzle at the processing position by moving the nozzle from the separated position by the nozzle movement distance in the radial direction, The calibration unit a measurement unit that measures a third distance traveled by the nozzle after the nozzle starts moving from the separated position to the jig plate in a position where the position adjustment jig attached to the nozzle faces the end surface of the jig plate held by the rotation holding unit, until the position adjustment jig abuts against the end surface of the jig plate; a movement distance calculation unit that calculates the nozzle movement distance by adding a fourth distance required to move the nozzle, with the position adjustment jig in a position where it is in contact with the end surface of the jig plate, to the third distance; A substrate processing apparatus comprising:

16. 16. The substrate processing apparatus according to claim 15, The substrate processing apparatus, wherein the position adjustment jig has a hardness higher than that of the nozzle.

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