Print quality control system and print quality control method

Abstract

To provide a printing quality control system and a printing quality control method which can reduce occurrence of a poor printing state.SOLUTION: A printing quality control system comprises a pre-processing part. The pre-processing part obtains a measurement result of a printed state of solder printed on a substrate and executes a handling process that should be executed when a poor printed state occurs, beforehand, when the obtained measurement result exceeds a preliminary threshold set more rigidly than an inspection threshold for determining the poor printed state and satisfies a preset execution condition.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] This specification discloses a technique relating to a print quality control system and a print quality control method. [Background technology]

[0002] The print inspection device described in Patent Document 1 performs a recognition process on the image of the mask plate to obtain mask opening data indicating the position and shape of each pattern hole provided in the mask plate. The mask opening data is used as inspection data for print inspection. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-058298 Summary of the Invention [Problem to be solved by the invention]

[0004] There is a demand for reducing the occurrence of defective print states by performing in advance, before a defective print state is determined, the corrective action that should be taken when a defective print state occurs.

[0005] In view of the above circumstances, this specification discloses a print quality control system and a print quality control method that can reduce the occurrence of poor print quality. [Means for solving the problem]

[0006] This specification discloses a print quality control system including a pre-processing unit that acquires measurement results of the print quality of solder printed on a substrate, and when the acquired measurement results exceed a preliminary threshold that is set stricter than the inspection threshold used to determine whether the print quality is defective and a preset execution condition is satisfied, executes in advance a corrective action that should be taken when the print quality is defective.

[0007] This specification also discloses a print quality control method that includes a pre-processing step, in which measurement results of the print quality of solder printed on a board are acquired, and when the acquired measurement results exceed a preliminary threshold that is set stricter than the inspection threshold used to determine whether the print quality is defective and a preset execution condition is satisfied, a corrective action that should be taken when the print quality is defective is executed in advance. [Effects of the Invention]

[0008] According to the above print quality control system, it is possible to reduce the occurrence of poor print quality. What has been said above about the print quality control system also applies to the print quality control method. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is a diagram showing a configuration example of a substrate-related work line; [Figure 2] FIG. 1 is a partial cross-sectional view showing an example of the configuration of a printing press. [Figure 3] FIG. 2 is a block diagram showing an example of a control block of a print quality control system. [Figure 4] 10 is a flowchart illustrating an example of a control procedure performed by the print quality control system. [Figure 5] FIG. 10 is a schematic diagram illustrating an example of a setting screen. [Figure 6] FIG. 2 is a schematic diagram showing an example of an output from a display device. [Figure 7] 10A and 10B are schematic diagrams showing examples of displaying an image of a target opening portion. [Figure 8] FIG. 10 is a schematic diagram showing another example of the setting screen. DETAILED DESCRIPTION OF THE INVENTION

[0010] 1. Embodiment 1-1. Example of the structure of the WML work line for substrates In the substrate-related work line WML, predetermined substrate-related work is performed on the substrate 90. The substrate-related work line WML of this embodiment only needs to be equipped with a printer WM1 and a print inspection machine WM2, and the type and number of substrate-related work machines WM constituting the substrate-related work line WML are not limited. As shown in Fig. 1, the substrate-related work line WML of this embodiment is equipped with multiple (five) substrate-related work machines WM, including a printer WM1, a print inspection machine WM2, a component mounting machine WM3, a reflow furnace WM4, and a visual inspection machine WM5, and the substrate 90 is transported in this order by a substrate transport device.

[0011] The printer WM1 prints solder 80 at the mounting positions of multiple components on the board 90. The print inspection machine WM2 inspects the printing condition of the solder 80 printed by the printer WM1. The component mounting machine WM3 mounts multiple components on the board 90 on which the solder 80 has been printed by the printer WM1. There may be one or more component mounting machines WM3. When multiple component mounting machines WM3 are provided, the multiple component mounting machines WM3 can share the mounting work of multiple components.

[0012] The reflow furnace WM4 heats the board 90 on which multiple components have been mounted by the component mounting machine WM3, melting the solder 80 and performing soldering. The visual inspection machine WM5 inspects the mounting state of the multiple components mounted by the component mounting machine WM3. In this way, the board-related work line WML uses multiple (five) board-related work machines WM to sequentially transport the boards 90 and perform production processes including inspection processes to produce board products 900. The board-related work line WML can also be equipped with board-related work machines WM such as function inspection machines, buffer devices, board supply devices, board reversing devices, shield mounting devices, adhesive application devices, and ultraviolet irradiation devices as needed.

[0013] The plurality (five) of substrate-related performing machines WM and the management device WMC that make up the substrate-related performing line WML are communicatively connected by a communication unit LC. The communication unit LC may perform communication via a wired or wireless connection. Various communication methods are possible. In this embodiment, the plurality (five) of substrate-related performing machines WM and the management device WMC form an in-house information and communication network (LAN: Local Area Network). This allows the plurality (five) of substrate-related performing machines WM to communicate with each other via the communication unit LC. Furthermore, the plurality (five) of substrate-related performing machines WM can communicate with the management device WMC via the communication unit LC.

[0014] The management device WMC controls the multiple (five) substrate-related performing machines WM that make up the substrate-related performing line WML and monitors the operating status of the substrate-related performing line WML. The management device WMC stores various control data for controlling the multiple (five) substrate-related performing machines WM. The management device WMC transmits the control data to each of the multiple (five) substrate-related performing machines WM. Furthermore, each of the multiple (five) substrate-related performing machines WM transmits its operating status and production status to the management device WMC.

[0015] The management device WMC may be provided with a data server DSV. The data server DSV may store, for example, acquired data acquired by the substrate-related performing machine WM regarding substrate-related performing operations. For example, the acquired data may include various image data captured by the substrate-related performing machine WM. The acquired data may also include records (log data) of the operating status acquired by the substrate-related performing machine WM.

[0016] The data server DSV can also store various production information related to the production of the board 90. For example, component data such as information on the shape of each component type, information on electrical characteristics, and information on how to handle the components is included in the production information. Also, the production information includes inspection results from inspection machines such as the print inspection machine WM2 and the appearance inspection machine WM5.

[0017] 1-2. Configuration example of printing machine WM1 In this embodiment, the printer WM1 uses a squeegee 34 to slide across the mask 70, printing solder 80 onto the substrate 90 through the openings 71 in the mask 70. As shown in FIG. 2, the printer WM1 includes a substrate transport device 10, a mask support device 20, a squeegee moving device 30, a control device 40, and a display device 41. In this specification, the transport direction of the substrate 90 (a direction perpendicular to the paper surface of FIG. 2) is defined as the X-axis direction. The front-to-rear direction of the printer WM1 (the left-to-right direction in FIG. 2) perpendicular to the X-axis direction in a horizontal plane is defined as the Y-axis direction. The vertical direction (the up-and-down direction in FIG. 2) perpendicular to the X-axis and Y-axis directions is defined as the Z-axis direction.

[0018] The board transfer device 10 transfers a board 90 to be printed. The board 90 is a circuit board on which electronic circuits, electric circuits, magnetic circuits, etc. are formed. The board transfer device 10 is provided on a base BS1 of the printing machine WM1. The board transfer device 10 transfers the board 90, for example, by a belt conveyor extending in the X-axis direction.

[0019] The substrate transport device 10 includes a substrate holding unit 11 that holds the substrate 90 that has been carried into the printing machine WM1. The substrate holding unit 11 is provided below the mask 70 and is configured to be able to move up and down in the Z-axis direction by, for example, a linear motion mechanism such as a feed screw mechanism. Specifically, the substrate holding unit 11 is lowered when the substrate 90 is being transported, and when the substrate 90 is transported to a predetermined position, it rises together with the substrate 90 and holds the substrate 90 with the upper surface of the substrate 90 in close contact with the lower surface of the mask 70.

[0020] The mask support device 20 is provided above the substrate transport device 10. The mask support device 20 supports the mask 70 by a pair of support tables. The pair of support tables are arranged on the left side (the far side of the paper in FIG. 2 and shown in the figure) and the right side (the near side of the paper in FIG. 2 and not shown in the figure) of the printing machine WM1 when viewed from the front, and are formed to extend along the Y-axis direction.

[0021] 2 is a partial cross-sectional view of the printing machine WM1 cut along the Y-axis direction, and schematically shows the inside of the printing machine WM1 as viewed from the side, and cross sections of the mask 70 and the substrate 90. The mask 70 has openings 71 formed therethrough at predetermined positions on the wiring pattern of the substrate 90. The mask 70 is supported by the mask support device 20, for example, via a frame member provided on the outer periphery.

[0022] The squeegee moving device 30 raises and lowers the squeegee 34 in a direction perpendicular to the mask 70 (Z-axis direction), and moves the squeegee 34 in the Y-axis direction on the top surface of the mask 70. The squeegee moving device 30 includes a head driving device 31, a squeegee head 32, a pair of lifting and lowering devices 33, 33, and a pair of squeegees 34, 34. The head driving device 31 is disposed on the upper side of the printing machine WM1. The head driving device 31 can move the squeegee head 32 in the Y-axis direction by, for example, a linear motion mechanism such as a feed screw mechanism.

[0023] The squeegee head 32 is clamped and fixed to a moving body that constitutes the linear motion mechanism of the head drive device 31. The squeegee head 32 holds a pair of lifting devices 33, 33. Each of the pair of lifting devices 33, 33 holds a squeegee 34 and can be driven independently of each other. Each of the pair of lifting devices 33, 33 drives an actuator such as an air cylinder to raise and lower the squeegee 34 that it holds.

[0024] The squeegee 34 slides over the upper surface of the mask 70, moving the solder 80 supplied to the upper surface of the mask 70 along the mask 70. Cream solder (solder paste) can be used as the solder 80. The solder 80 is imprinted onto the substrate 90 through the openings 71 in the mask 70, and the solder 80 is printed on the substrate 90 arranged below the mask 70. In this embodiment, each of the pair of squeegees 34, 34 is a plate-like member formed to extend along the X-axis direction, which is perpendicular to the printing direction (Y-axis direction).

[0025] The front squeegee 34 (left side in FIG. 2) of the pair of squeegees 34 is used in a printing process that moves the solder 80 from the front side to the rear side, and the direction from the front side to the rear side of the printer WM1 is the traveling direction. The rear squeegee 34 (right side in FIG. 2) of the pair of squeegees 34 is used in a printing process that moves the solder 80 from the rear side to the front side, and the direction from the rear side to the front side of the printer WM1 is the traveling direction. Furthermore, for both squeegees 34, the direction opposite to the traveling direction is the retreating direction.

[0026] Each of the pair of squeegees 34, 34 is held by the lifting device 33 at an inclination such that the front portion located on the traveling direction side faces downward. In other words, each of the pair of squeegees 34, 34 is held by the lifting device 33 at an inclination such that the back portion located on the retreating direction side faces upward. The inclination angle of each of the pair of squeegees 34, 34 is adjusted by an adjustment mechanism provided below the lifting device 33.

[0027] The control device 40 includes a known arithmetic unit and storage device, and forms a control circuit. The control device 40 is communicably connected to the management device WMC via the communication unit LC shown in Fig. 1, and can send and receive various data. The control device 40 can drive and control the substrate transport device 10, mask support device 20, squeegee moving device 30, and display device 41 based on the production program, detection results of various sensors, etc.

[0028] As shown in Fig. 3, the control device 40 is provided with a storage device 60. The storage device 60 can be, for example, a magnetic storage device such as a hard disk drive, or a storage device using semiconductor elements such as flash memory. The storage device 60 stores a production program for driving the printing press WM1, etc. The control device 40 acquires various pieces of information stored in the storage device 60 and detection results of various sensors provided in the printing press WM1.

[0029] The control device 40, for example, drives and controls the squeegee moving device 30. The control device 40 sends a control signal to the squeegee moving device 30 based on the above-mentioned various information and detection results, etc. This controls the positions in the Y-axis direction and the Z-axis direction (height), as well as the movement speed and tilt angle, of the pair of squeegees 34, 34 held by the squeegee head 32. Then, as described above, the pair of squeegees 34, 34 are driven and controlled, and solder 80 is printed on the substrate 90 arranged on the underside of the mask 70.

[0030] As shown in FIGS. 2 and 3, the control device 40 is provided with a display device 41. The display device 41 can display the working status of the printing press WM1. The display device 41 is also configured with a touch panel and also functions as an input device that accepts various operations by the worker. The worker can know the working status of the printing press WM1 via the display device 41. The worker can also set the printing press WM1, give instructions to the printing press WM1, and so on via the display device 41.

[0031] 1-3. Example of the configuration of the print quality control system 50 When the print inspection machine WM2 determines that the print quality is poor, the worker takes various measures. For example, the worker may clean the opening 71 or supply solder 80 depending on the condition of the opening 71 in the mask 70. Therefore, the worker needs to check the condition of the opening 71 in the mask 70 that has been determined to have a poor print quality.

[0032] Therefore, the substrate-related work line WML of this embodiment is provided with a print quality control system 50. When considered as a control block, the print quality control system 50 is provided with an imaging unit 51 and a display unit 52. The print quality control system 50 can also be provided with a pre-processing unit 53. As shown in FIG. 3 , the print quality control system 50 of this embodiment is provided with the imaging unit 51, the display unit 52, and the pre-processing unit 53.

[0033] The print quality control system 50 can be provided in various control devices and various computing devices, such as the printing press WM1, a substrate-related operation machine WM other than the printing press WM1, and the management device WMC. Taking into consideration the work performed by an operator after checking the state of the opening 71, the print quality control system 50 is preferably provided in the printing press WM1. As shown in Fig. 3, the print quality control system 50 of this embodiment is provided in the control device 40 of the printing press WM1.

[0034] The print quality control system 50 also executes control in accordance with the flowchart shown in Fig. 4. The imaging unit 51 makes a decision in step S13 and performs a process in step S14. The display unit 52 performs processes in steps S15 and S16. The pre-processing unit 53 makes a decision in step S11 and performs a process in step S12.

[0035] 1-3-1. Imaging unit 51 When the print inspection machine WM2 determines that the printing condition is poor, the imaging unit 51 causes the imaging device FC1 to capture an image of the target opening 71t, which is the opening 71 determined to have a poor printing condition (steps S13 and S14 shown in Figure 4).

[0036] The imaging device FC1 may take various forms as long as it can image the target opening 71t. The imaging device FC1 may be provided with a separate camera for imaging the target opening 71t, or may use a camera used for other imaging. The imaging device FC1 of this embodiment uses a mark camera for imaging positioning reference portions provided on each of the mask 70 and the substrate 90. The imaging device FC1, which is a mark camera, can be moved in the X-axis direction and the Y-axis direction by, for example, an XY table.

[0037] Specifically, when the substrate 90 is transported while the substrate holder 11 shown in FIG. 2 is in a lowered state, the imaging device FC1 moves to a positioning reference portion provided on the substrate 90 and captures an image of a predetermined area of ​​the substrate 90 including the positioning reference portion. Similarly, the imaging device FC1 captures an image of a predetermined area including the positioning reference portion of the mask 70. The control device 40 processes the captured image to recognize the positioning reference portion of the substrate 90 and the positioning reference portion of the mask 70. The control device 40 adjusts the position of at least one of the mask 70 and the substrate 90 to correct any misalignment between them. This allows the mask 70 and the substrate 90 to be positioned.

[0038] As shown in FIG. 1 , the printing machine WM1, the print inspection machine WM2, and the management device WMC are connected to each other via a communication unit LC so that they can communicate with each other. After the printing machine WM1 prints solder 80 on the substrate 90, the substrate 90 with the printed solder 80 is transported to the print inspection machine WM2. The print inspection machine WM2 sequentially inspects the printed state of the solder 80 on the transported substrate 90. If the print inspection machine WM2 determines that the printing state is defective, it notifies the printing machine WM1. The notification includes information identifying the position of the target opening 71t, which is the opening 71 determined to be defective in printing state. When the printing machine WM1 receives the notification, the imaging unit 51 moves the imaging device FC1 to a position facing the target opening 71t when the substrate holding unit 11 is lowered and the mask 70 and the substrate 90 are separated. The imaging unit 51 then causes the imaging device FC1 to capture an image of the target opening 71t.

[0039] In this embodiment, the inspection results obtained by the print inspection machine WM2 are stored in the data server DSV. Inspection results indicating poor printing conditions include misalignment, bleeding, chipping, fading, and bridging of the solder 80. Misalignment of the solder 80 refers to a state in which the deviation of the solder 80 printed on the board 90 from the target printing position exceeds the allowable range. Bleeding of the solder 80 refers to a state in which the area of ​​the solder 80 printed on the board 90 is larger than the upper allowable limit. Chip-out of the solder 80 refers to a state in which the area of ​​the solder 80 printed on the board 90 is smaller than the lower allowable limit. Fading of the solder 80 refers to a state in which the height of the solder 80 printed on the board 90 is lower than the lower allowable limit. Bridging of the solder 80 refers to a state in which solder 80 printed at different positions on the board 90 is connected.

[0040] Furthermore, the print inspection machine WM2 of this embodiment can measure the printing condition of the solder 80 printed on the substrate 90. In this embodiment, the measurement results measured by the print inspection machine WM2 are stored in the data server DSV. The measurement results of the printing condition include at least one of the deviation of the solder 80 printed on the substrate 90 from the target printing position, and the area and volume of the solder 80 printed on the substrate 90.

[0041] When print inspection machine WM2 determines that the print condition is defective, print quality control system 50 can obtain the inspection results and measurement results of print inspection machine WM2 from data server DSV. Print quality control system 50 can also obtain the inspection results and measurement results directly from print inspection machine WM2. Furthermore, print inspection machine WM2 can also send the inspection results and measurement results directly to print quality control system 50. In either case, print quality control system 50 can store the inspection results and measurement results in storage device 60 shown in FIG. 3.

[0042] 1-3-2.Display section 52 The display unit 52 causes the display device 41 to display the image PT0 of the target opening 71t captured by the imaging device FC1 (step S15 shown in FIG. 4).

[0043] The display device 41 may take various forms as long as it can display the image PT0 of the target opening 71t. The display device 41 may be a separate display device that displays the image PT0 of the target opening 71t, or a display device used for other displays may be used. As described above, the display device 41 of this embodiment can display the operating status of the printing press WM1, etc.

[0044] As shown in Fig. 5, the print quality control system 50 of this embodiment can preset subsequent processing depending on the type of print quality defect determined by the print inspection machine WM2. As described above, the display device 41 is configured with a touch panel and also functions as an input device that accepts various operations by the worker. For example, the worker can display the work phase on the display device 41 by operating operation units BP11 to BP41, which are surrounded by dashed line BL1 in Fig. 5.

[0045] When the worker operates operation unit BP11, display device 41 displays the work in the production program creation stage. When the worker operates operation unit BP21, display device 41 displays the work in the production stage. When the worker operates operation unit BP31, display device 41 displays the work in the cleanup stage. When the worker operates operation unit BP41, display device 41 displays the work in the error occurrence stage. The worker can also display the work status, setting screens, etc. in each work phase by operating operation units BP22 to BP24, which are surrounded by dashed line BL2, for example.

[0046] FIG. 5 shows an example of a setting screen. By operating operation area BP51, the operator can set the type of print defect, the number of pads and boards on which the defect occurred, and the subsequent processing. For example, the settings at the top of FIG. 5 indicate that processing indicated as Processing 1 will be executed when a print defect indicated as Defect 1 occurs consecutively for number PD1 of pads and number BD1 of boards. Although the conditions and processing contents are different, the above also applies to print defects indicated as Defect 2 to Defect 4.

[0047] The details of the printing defects include the inspection results described above (printing misalignment, bleeding, chipping, fading, bridging, etc. of the solder 80). The operator can select at least one from multiple types of inspection results. The operator can also input any number of pads and boards. Subsequent processing includes stopping the printing machine WM1, displaying an image PT0 of the target opening 71t, manual cleaning of the target opening 71t, unclamping the mask 70 during manual cleaning, automatic cleaning of the target opening 71t, manual supply of solder 80, automatic supply of solder 80, etc. The operator can select any processing that includes at least displaying an image PT0 of the target opening 71t.

[0048] For example, assume that the process indicated by Process 1 is to stop the printing press WM1 and display an image PT0 of the target opening 71t. In this case, when a printing condition defect indicated by Defect 1 occurs consecutively for the number of pads PD1 and the number of boards BD1, the control device 40 stops the printing press WM1. Then, the display unit 52 causes the display device 41 to display the image PT0 of the target opening 71t.

[0049] FIG. 6 shows an example of the output from the display device 41. By having the display unit 52 display an image PT0 of the target opening 71t on the display device 41, for example, the worker can easily check the state of the target opening 71t. FIG. 7 is an enlarged view of some of the target openings 71t included in the image PT0. For example, the target opening 71t in the upper part of FIG. 7 has solder 80 attached to the outer edge of the target opening 71t. If this state is left as it is, the solder 80 is likely to bleed, bridge, and the like.

[0050] Conversely, the target openings 71t in the lower row have solder 80 attached to the inner edges of the target openings 71t. If this state is left as it is, the solder 80 is likely to chip or fade. In this way, the print quality control system 50 can alert the worker by having the worker check the state of the target openings 71t, and urge the worker to take action (for example, cleaning the target openings 71t).

[0051] The display unit 52 may display, on the display device 41, position-related information that can identify the position of the target opening 71t in the mask 70 along with the image PT0 of the target opening 71t. This allows the worker to easily know the position of the target opening 71t, facilitating response. The position-related information is not limited to any particular information as long as it can identify the position of the target opening 71t in the mask 70. For example, the position-related information may include circuit codes, which are symbols and numbers that identify elements (components) that make up a circuit, and coordinates (coordinates in the X-axis direction and coordinates in the Y-axis direction). In the example shown in FIG. 6, the display unit 52 may display, for example, the circuit code in the display area BP61.

[0052] The imaging unit 51 can also hold the imaging device FC1 at a position facing the target opening 71t. This allows the worker to easily determine the position of the target opening 71t based on the position of the imaging device FC1, making it easier to take action. In this case, the display unit 52 may display on the screen shown in FIG. 6 that the imaging device FC1 is held at a position facing the target opening 71t.

[0053] Furthermore, the display unit 52 can also display a schematic representation of the mask 70 and the target opening 71t on the display device 41 to guide the operator to the location of the target opening 71t in the mask 70. This allows the operator to easily determine the location of the target opening 71t, facilitating appropriate action. The method of displaying the mask 70 and the target opening 71t is not limited. As shown in FIG. 6, for example, the display unit 52 can display an image IM0 of the arrangement of the multiple openings 71 in the mask 70 on the display device 41, and display the target opening 71t in a different color from the other openings 71. In the figure, the target opening 71t is shown in black for ease of illustration, but the display color of the target opening 71t is preferably a color that calls attention, such as red or yellow.

[0054] The display unit 52 can also cause the display device 41 to display an arrangement image IM0 of the plurality of openings 71 in the mask 70 and cause the target opening 71t to flash. Furthermore, the display unit 52 can also cause the display device 41 to display an arrangement image IM0 of the plurality of openings 71 in the mask 70 and cause an icon to be displayed near the target opening 71t. The icon is preferably in the form of a warning, such as an exclamation mark.

[0055] Furthermore, when there are multiple target openings 71t, the display unit 52 can also cause the display device 41 to display an image PT0 of a target opening 71t selected by the worker. This allows the worker to easily check the image PT0 of the desired target opening 71t. In the example shown in FIG. 6, for example, the worker operates the operation unit BP71 to display images PT0 of some of the multiple target openings 71t in a predetermined order. Note that, for example, the worker can input the position-related information described above, and the display unit 52 can also cause the display device 41 to directly display the image PT0 of a specific target opening 71t.

[0056] The display unit 52 can also display on the display device 41 countermeasures to be performed when a printing defect occurs so that the worker can select them (step S16 shown in FIG. 4). This makes it easier for the worker to take action compared to when the countermeasures are not displayed. The countermeasures are not limited. For example, the countermeasures include at least one of cleaning the target opening 71t and supplying solder 80.

[0057] 6, for example, an operator can select at least one of a plurality of countermeasures by operating the operation unit BP81. Specifically, the operator can select countermeasures such as manual cleaning of the target opening 71t, unclamping of the mask 70 during manual cleaning, automatic cleaning of the target opening 71t, manual supply of solder 80, and automatic supply of solder 80. The operator can also specify a cleaning method. Cleaning methods include, for example, dry cleaning, wet cleaning (e.g., a method of cleaning by applying alcohol, etc.), a combination of dry and wet cleaning, and suction cleaning (a method of cleaning by suctioning residue remaining in the target opening 71t).

[0058] Furthermore, if the corrective action includes cleaning the target opening 71t, as shown in Fig. 6, the display unit 52 can also display an image PT1 of the target opening 71t after cleaning on the display device 41 so that it can be compared with an image PT0 of the target opening 71t before cleaning. This allows, for example, the operator to easily confirm the effect of cleaning the target opening 71t. Furthermore, the print quality control system 50 can also urge the operator to repeat the cleaning if the cleaning of the target opening 71t is insufficient.

[0059] 1-3-3. Pre-processing unit 53 When the measurement result of the print condition measured by the print inspection machine WM2 exceeds a preliminary threshold that is set stricter than the inspection threshold used by the print inspection machine WM2 to determine whether the print condition is defective, the pre-processing unit 53 executes in advance the countermeasure processing that should be performed when a defective print condition occurs (steps S11 and S12 shown in Figure 4).

[0060] The measurement contents measured by the print inspection machine WM2 and the corrective actions taken are not limited. For example, the measurement results of the printing condition include at least one of the deviation of the solder 80 printed on the substrate 90 from the target printing position, and the area and volume of the solder 80 printed on the substrate 90. In addition, the corrective action includes at least one of cleaning the opening 71 where the measurement result of the printing condition exceeds the preliminary threshold and supplying solder 80.

[0061] FIG. 8 shows an example of a setting screen (corresponding to the setting section). By operating operation area BP52, the operator can set a preliminary threshold, the number of pads, the number of boards, and subsequent processing. For example, the top setting in FIG. 8 indicates that when a state in which the area of ​​solder 80 printed on board 90 exceeds a percentage S1 (%) of the target value (100%) occurs consecutively for number of pads PD5 and number of boards BD5, a corrective processing shown as processing 5 is executed. Percentage S1 corresponds to the preliminary threshold, and in this case, percentage S1 is set to be smaller than the upper limit (percentage) of the inspection threshold for the area of ​​solder 80 printed on board 90.

[0062] The setting in the second row from the top indicates that when the area of ​​solder 80 printed on board 90 falls below percentage S2 (%) of the target value (100%) for a consecutive number of pads PD6 and number of boards BD6, a corrective action shown as Process 6 is executed. Percentage S2 corresponds to a preliminary threshold, and in this case, percentage S2 is set to be greater than the lower limit (percentage) of the inspection threshold for the area of ​​solder 80 printed on board 90.

[0063] The settings in the third and fourth rows from the top are conditions and processing settings for the volume of the solder 80 printed on the substrate 90, and are set in the same way as the area of ​​the solder 80 printed on the substrate 90. The above also applies to the measurement contents of other printing conditions (for example, the deviation of the solder 80 printed on the substrate 90 from the target printing position).

[0064] The operator can input any number of pads and boards. The processes (countermeasures) that can be input in processes 5 to 8 include manual cleaning of the opening 71 where the print state measurement result exceeds the preliminary threshold, unclamping of the mask 70 during manual cleaning, automatic cleaning of the opening 71, manual supply of solder 80, automatic supply of solder 80, etc. The processes (countermeasures) that can be input in processes 5 to 8 can also include stopping the printer WM1, displaying an image of the opening 71, etc.

[0065] For example, assume that the processes shown in processes 5 and 6 are automatic cleaning of openings 71 for which the measurement results of the print state exceed a preliminary threshold. In this case, the area of ​​solder 80 printed on board 90 is not judged to be defective by print inspection machine WM2, but if a state in which the area exceeds a preliminary threshold, which is set stricter than the inspection threshold, occurs consecutively for a predetermined number of pads and a predetermined number of boards, pre-processing unit 53 causes printer WM1 to perform automatic cleaning.

[0066] As described above, the print quality control system 50 of this embodiment is equipped with the preliminary processing unit 53, and therefore can execute corrective action before the print inspection machine WM2 determines that the print condition is defective. Therefore, the print quality control system 50 can reduce the number of defects that are determined to be print defects by the print inspection machine WM2 compared to when preliminary corrective action is not performed. Note that if the preliminary corrective action is insufficient, the print inspection machine WM2 determines that the print condition is defective, and control is performed by the imaging unit 51 and display unit 52 described above.

[0067] 1-4. Example of configuration of second print quality control system 500 In the print quality control system 50 of the embodiment described above (hereinafter referred to as the first print quality control system 50), after the print inspection machine WM2 determines that the print condition is poor, the imaging unit 51 causes the imaging device FC1 to capture an image of the target opening 71t, and the display unit 52 causes the display device 41 to display the image PT0 of the target opening 71t.

[0068] However, there is a demand to reduce the number of defects that are determined to be print defects by the print inspection machine WM2 by implementing the corrective action that should be taken when a print defect occurs before the print inspection machine WM2 determines that the print defect is bad. Therefore, the second print quality control system 500 includes the above-mentioned pre-processing unit 53 as an essential component. This allows the second print quality control system 500 to implement the corrective action before the print inspection machine WM2 determines that the print defect is bad, and can reduce the number of defects that occur compared to when the corrective action is not implemented.

[0069] In the second print quality control system 500, the measurement contents measured by the print inspection machine WM2 and the corrective actions taken are not limited. For example, the print condition measurement results include at least one of the deviation of the solder 80 printed on the substrate 90 from the target printing position, and the area and volume of the solder 80 printed on the substrate 90. The corrective actions include at least one of cleaning the openings 71 where the print condition measurement results exceed the preliminary threshold and supplying solder 80. The second print quality control system 500 can also include the imaging unit 51 and display unit 52 described above. The imaging unit 51 and display unit 52 may be in any of the forms described above. Duplicate explanations will be omitted in this specification.

[0070] 2.Printing quality control method What has been said about the print quality control system also applies to the print quality control method. Specifically, the print quality control method includes a pre-processing step. The pre-processing step corresponds to the control performed by pre-processing unit 53. The print quality control method can also include an imaging step and a display step. The imaging step corresponds to the control performed by imaging unit 51. The display step corresponds to the control performed by display unit 52.

[0071] 3. Examples of Effects of the Embodiments The print quality control system can reduce the occurrence of poor print quality. What has been said above about the print quality control system can also be said about the print quality control method. [Explanation of symbols]

[0072] 50,500: Print quality control system, 53: Pre-processing unit, 70: Mask, 71: opening, 80: solder, 90: substrate.

Claims

1. a pre-processing unit that acquires a measurement result of the printing state of the solder printed on the board, and when the acquired measurement result exceeds a preliminary threshold that is set stricter than an inspection threshold for determining whether the printing state is defective and a preset execution condition is satisfied, executes in advance a countermeasure process that should be executed when the printing state is defective; a setting unit that can set a plurality of combinations of the measurement content of the printing state and the preliminary threshold value corresponding to the measurement content of the printing state, and can set the number of pads and the number of boards included in the execution conditions for each combination; Equipped with The pre-processing unit is a printing quality control system that executes the countermeasure processing when the measurement result exceeds the preliminary threshold value for a set number of pads and a set number of substrates in succession.

2. a preliminary processing step of acquiring measurement results of the printing state of the solder printed on the board, and when the acquired measurement results exceed a preliminary threshold set stricter than an inspection threshold for determining defects in the printing state and a preset execution condition is satisfied, executing in advance a corrective action to be taken when a defect in the printing state occurs; a setting step of setting a plurality of combinations of the measurement content of the printing state and the preliminary threshold value corresponding to the measurement content of the printing state, and setting the number of pads and the number of boards included in the execution conditions for each combination; Equipped with The pre-processing step is a printing quality control method in which the corrective action is executed when the measurement results exceeding the preliminary threshold occur consecutively for a set number of pads and a set number of substrates.

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