Peeling Mechanism

Abstract

To solve a problem in which a folding member presses a wafer through a dicing tape or moves in contact with the dicing tape, thereby damaging the wafer when peeling the dicing tape from the wafer.SOLUTION: A peeling mechanism 1 includes a wafer-side suction head 2 that suctions a wafer W under negative pressure, a tape-side suction head 3 that suctions a (dicing) tape T under negative pressure, and a peeling unit 5B that moves such that the tape T is pressed against one end of the tape-side suction head 3, and the tape-side suction head 3 is configured to move in a plane parallel to the surface of the wafer W that is attached to the tape T.EFFECT: Since no member is used to bend the tape T and there is no member that comes into contact with the wafer W (via the tape T), the wafer W will not be damaged.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a peeling mechanism that does not damage the wafer or apply indirect contact pressure to the wafer when peeling off the dicing tape. [Background technology]

[0002] For example, a protective tape is applied to a silicon wafer during surface treatment to protect the surface that is not to be treated, and after a predetermined treatment, a dicing tape is applied to the back side of the protective tape to prevent the individual pieces (wafer chips) from moving when the wafer is cut (diced) into individual pieces. After dicing, the dicing tape and the wafer chip are separated, and the wafer chip is moved to another process, such as an inspection process, a shipping process, or a manufacturing process.

[0003] Recently, wafer chips have become extremely small in size (area) and thickness, and this trend is expected to continue in the future. At the same time, it is becoming increasingly difficult to individually peel these tiny wafer chips from the dicing tape and transfer them to another process.

[0004] For example, Patent Document 1 (JP Patent Publication No. 2001-345368) and Patent Document 2 (JP Patent Publication No. 2008-270282) propose the following method, addressing the issue that the conventional method of using a needle to break through the dicing tape and lift the wafer chip to separate the two can potentially damage the wafer chip.

[0005] That is, Patent Document 1 proposes a wafer chip peeling and transporting method in which a silicon wafer on which multiple wafer chips are formed and dicing tape is attached is diced while leaving the dicing tape, the surface of each wafer chip opposite to the surface on which the dicing tape is attached is suction-fixed, the dicing tape is peeled off the wafer chip, the suction-fixed wafer chip is released, and the wafer chip is picked up and transported.

[0006] Patent Document 2 proposes a method for manufacturing a semiconductor device, which includes the steps of applying an adhesive to the backside of a singulated silicon wafer, placing the singulated silicon wafer on a holding table having a wafer suction section made of a porous material separated into at least two suction areas in the peeling direction of the adhesive tape, and suction-fixing the silicon wafer using a first suction path provided corresponding to the suction area, pulling the end of the adhesive tape to peel it off, switching to a second suction path corresponding to the suction area when a portion of the adhesive tape near an adjacent suction area has been peeled off, and suction-fixing the silicon wafer, moving the holding table and suction collet relative to each other after the adhesive tape has been peeled off, and moving the suction collet onto a wafer chip to be picked up, and picking up each wafer chip using the suction collet.

[0007] However, in Patent Documents 1 and 2, the edge portion of the dicing tape that has been peeled off from the wafer chip is folded back around a folding member toward the side to which it is still attached, which could result in this folding member pressing against the dicing tape and the wafer chip, preventing the two from being peeled off.

[0008] Furthermore, since the folding member moves while rubbing against the dicing tape (the adhesive side), as described above, it may press against the dicing tape and wafer chip, preventing them from peeling apart. Even if it does not press against them, the folding member may at least come into contact with the dicing tape and rub against the wafer chip through the dicing tape, potentially damaging the wafer chip. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] Japanese Patent Application Laid-Open No. 2001-345368 [Patent Document 2] Japanese Patent Application Laid-Open No. 2008-270282 Summary of the Invention [Problem to be solved by the invention]

[0010] The problem to be solved is that, in the past, the dicing tape was peeled off by folding it back around the fold-back member toward the adhesive side, which could press against the dicing tape and wafer chip, preventing them from being peeled off, and the fold-back member could rub against the wafer chip through the dicing tape, damaging the wafer chip. [Means for solving the problem]

[0011] In order to solve the above problems, the peeling mechanism of the present invention comprises a wafer-side suction head using a porous plate that applies negative pressure to the dicing side of the wafer, a tape-side suction head using a porous plate that applies negative pressure to the side of the dicing tape opposite the wafer-adhered side, and a peeling unit that moves in a direction perpendicular to the adhering surface between the wafer and the dicing tape so that the dicing tape is pressed against one end of the tape-side suction head, and the tape-side suction head mainly moves in a plane parallel to the adhering surface of the wafer to the dicing tape in a position that is not in contact with the dicing tape while it is adhered to the wafer.

[0012] In addition, in order to solve the above problems, the peeling mechanism of the present invention is mainly composed of a wafer-side suction head using a porous plate that applies negative pressure to the dicing side of the wafer, a tape-side suction head using a porous plate that applies negative pressure to the side of the dicing tape opposite the wafer-adhering side, and a separation unit that is inserted between the wafer and the dicing tape and moves in the direction in which the wafer and the dicing tape are attached while pressing the dicing tape against the tape-side suction head without coming into contact with the wafer. [Effects of the Invention]

[0013] The present invention does not use a member for bending the dicing tape, and therefore peels it off from the wafer without bending it, so nothing comes into contact with the wafer chips after the wafer has been diced, and therefore the wafer chips are not damaged. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is a perspective view showing the configuration of a first embodiment of a peeling mechanism of the present invention. [Figure 2] 1 is a partial cross-sectional view showing the configuration of a first embodiment of a peeling mechanism of the present invention. [Figure 3] 1(a) to 1(d) are diagrams illustrating the peeling state of the dicing tape in the configuration of the peeling mechanism according to the first embodiment of the present invention. [Figure 4] FIG. 10 is a perspective view showing the configuration of a second embodiment of the peeling mechanism of the present invention. [Figure 5] FIG. 4 is a partial cross-sectional view showing the configuration of a second embodiment of the peeling mechanism of the present invention. [Figure 6] 10(a) to 10(e) are diagrams illustrating the peeling state of the dicing tape in the configuration of the peeling mechanism according to the second embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0015] The present invention achieves the objective of peeling off the dicing tape without damaging the wafer by using a wafer-side suction head using a porous plate that applies negative pressure to the dicing side of the wafer, a tape-side suction head using a porous plate that applies negative pressure to the side of the dicing tape opposite the wafer-adhered surface, and a peeling unit that moves in a direction perpendicular to the adhesive surface between the wafer and the dicing tape so that the dicing tape is pressed against one end of the tape-side suction head, and the tape-side suction head moves in a plane parallel to the adhesive surface of the wafer to the dicing tape in a position that is not in contact with the dicing tape while it is adhered to the wafer.

[0016] The present invention can also achieve the above-mentioned object by a configuration comprising a wafer-side suction head using a porous plate that applies negative pressure to the dicing side of the wafer, a tape-side suction head using a porous plate that applies negative pressure to the side of the dicing tape opposite the wafer-adhering side, and a separation unit that is inserted between the wafer and the dicing tape and moves in the direction in which the wafer and the dicing tape are adhered while pressing the dicing tape against the tape-side suction head without coming into contact with the wafer.

[0017] In this invention, the term "wafer chip" refers to an individual wafer after dicing, but the term "wafer" refers to the "whole wafer chip" after dicing while it is still attached to the dicing tape, or when the dicing tape is peeled off by the wafer-side suction head (described later) and the entire wafer chip is still aligned. As a result, in the following description of this invention, the term "wafer chip" will not be used. Also, in this invention, the "attachment direction" refers to the direction in which the wafer and dicing tape are still attached.

[0018] In the present invention, the wafer is sucked under negative pressure by a wafer-side suction head and the dicing tape is sucked under negative pressure by a tape-side suction head, so that the dicing tape peeled off from the wafer does not twist or wrinkle, and the wafer after dicing can maintain an aligned state even if the dicing tape is peeled off.

[0019] Furthermore, because the tape-side suction head applies negative pressure to the dicing tape during and after peeling, there is no need to hold down the dicing tape (wafer) against the peeling force, and nothing other than the dicing tape comes into contact with the wafer, and no pressure is applied from the adhesive surface side. Therefore, the wafer is not rubbed (through the dicing tape) when the dicing tape is peeled off.

[0020] In the invention of claim 1, when the peeling portion moves the dicing tape away in a direction perpendicular to the dicing tape surface of the wafer at a position slightly away from the wafer placement position, without approaching the dicing tape surface of the wafer or pressing the wafer via the dicing tape, only the dicing tape is pulled at an angle in the same direction, and the dicing tape is peeled off from the wafer.

[0021] In addition, in the invention of claim 2, the separation part is inserted between the wafer and the dicing tape, and moves in the direction in which the wafer and the dicing tape are attached while pressing the dicing tape against the tape-side suction head without coming into contact with the wafer, so that only the dicing tape is sucked into the tape-side suction head, at which point the dicing tape is peeled off from the wafer.

[0022] Furthermore, in the above configuration, the present invention may be configured such that the wafer-side suction head transfers multiple wafer chips after dicing the wafer to the next process at once. This eliminates the need to move each individual wafer chip piece by a nozzle or collet, thereby speeding up processing. [Example]

[0023] Specific embodiments of the present invention will be described below with reference to Figures 1 to 6. The peeling mechanism 1 of the present invention has a first embodiment configuration and a second embodiment configuration, and common members are given the same reference numerals hereinafter, and duplicated explanations will be omitted.

[0024] The peeling mechanism 1 of the present invention peels off a dicing tape T (hereinafter referred to as tape T) from a diced wafer W. The tape T used in the present invention is not an individual circular piece, but a roll of a long piece wound up.

[0025] Furthermore, the peeling mechanism 1 of the present invention uses the wafer-side suction head 2 described below to transfer a wafer W in an upstream process to the tape-side suction head 3 described below on which tape T is placed, and bonds the wafer W to the tape T, then moves the wafer-side suction head 2 away from above the wafer W, and positions a dicing mechanism (not shown) in its place to dices the wafer W, and then again moves the wafer-side suction head 2 above the wafer W in place of the dicing mechanism to peel the tape T from the diced wafer W, and transfers multiple wafers W after the tape T has been peeled off to another process at once.In other words, it can perform the following processes: transfer from an upstream process, dicing process, peeling process, and transfer to a downstream process.

[0026] In the following, in the first and second embodiments, a configuration specialized for the process of peeling the tape T from the wafer W and transferring a plurality of wafers W after the tape T has been peeled off to another process at once will be described.

[0027] (First Example) 1 to 3 has the following configuration: 2 is a wafer-side suction head that applies negative pressure to the dicing side of a wafer W. This wafer-side suction head 2 includes an internally hollow housing 2A that is closed on five sides except for an opening 2a formed on the bottom surface as shown, and a porous plate 2B with ultrafine holes provided in the opening 2a.

[0028] The porous plate 2B in the housing 2 is large enough to cover the entire surface facing the wafer W to be handled. Therefore, the housing 2A is large enough to fit the porous plate 2B on the bottom surface. There is no particular limitation on the thickness.

[0029] Furthermore, a tube 2b connected to a suction pump (not shown) is connected to the wafer-side suction head 2 at a part of the housing 2A that does not interfere with the movement of the wafer-side suction head 2. By driving the suction pump, the wafer-side suction head 2 sucks the air inside the housing 2 through the tube 2b, generating negative pressure.

[0030] Furthermore, the wafer-side suction head 2 has an arm 2c connected to a moving mechanism (not shown) for moving the entire wafer-side suction head 2 up and down and back and forth and left and right on the opposite side of the housing 2 from the bottom side on which the porous plate 2B is provided, i.e., on the top side.

[0031] Reference numeral 3 denotes a tape-side suction head that applies negative pressure to the surface of the tape T opposite to the surface to which the wafer W is attached (hereinafter, this surface will be referred to as the back surface). The tape-side suction head 3 comprises a hollow housing 3A whose five surfaces are closed except for an opening 3a formed on the top surface as shown in the figure, and a porous plate 3B with ultrafine holes provided in the opening 3a, as shown in detail in FIG. 2(b).

[0032] The porous plate 3B in the housing 3 is large enough to cover the entire surface facing the wafer W to be handled. Therefore, the housing 3A is large enough to fit the porous plate 3B on the upper surface. There is no particular limitation on the thickness.

[0033] Furthermore, a tube 3b connected to a suction pump (not shown) is connected to the tape-side suction head 3 at a part of the housing 3A that does not interfere with the movement of the tape-side suction head 3. By driving the suction pump, the tape-side suction head 3 sucks the air inside the housing 3 through the tube 3b, generating negative pressure.

[0034] The negative pressure between the wafer-side suction head 2 and the tape-side suction head 3 is set higher for the wafer-side suction head 2. In other words, the wafer-side suction head 2 is set to exert stronger suction than the tape-side suction head 3.

[0035] Furthermore, the tape-side suction head 3 has a carriage 3c provided at the center of the lower surface of the housing 3, opposite the upper surface on which the porous plate 3B is provided in this example. This carriage 3c has wheels 3d at the lower part thereof that contacts the installation surface of the peeling mechanism 1, for moving the carriage 3c in two opposing lateral directions (hereinafter, these directions are referred to as the front-rear direction) among the four lateral surfaces adjacent to the upper surface, with two wheels provided on each side perpendicular to the front-rear direction.

[0036] In this example, reference numeral 4 denotes a moving mechanism provided on, for example, the carriage 3c and the installation surface. This moving mechanism 4 moves the tape-side suction head 3 linearly in the front-to-rear direction and controls the moving speed. The moving mechanism 4 is composed of a moving screw shaft 4A with both ends disposed in the front-to-rear direction, a ball nut 4B provided inside the carriage 3c and screwed onto the moving screw 4A, a motor 4C connecting one end of the moving screw shaft 4A (hereinafter referred to as the rear) and its output shaft, and a bearing 4D pivotally supporting the other end of the moving screw shaft 4A (hereinafter referred to as the front) and one end of the output shaft.

[0037] The method and configuration for moving the tape-side suction head 3 in the forward and backward directions are not limited to those described above, but the condition is that the tape-side suction head 3 is moved accurately in a straight line in the forward and backward directions.

[0038] Reference numeral 5 denotes a peeling mechanism that peels the tape T from the wafer W. The peeling mechanism 5 in the first embodiment has a pivotal support part 5A that pivotally supports the original roll of tape T on one side in the front-rear direction, and a peeling part 5B (peeling member) that winds up and peels the tape T on the other side.

[0039] The pivoting portion 5A pivotally supports the original roll of tape T on its shaft portion and is capable of locking the rotation of the shaft portion 5Aa. When adhering the tape T to the wafer W and when peeling it off, the pivoting portion 5A locks the rotation of the shaft portion 5Aa to prevent the tape T from being inadvertently fed out. The pivoting portion 5A also has a guide roller 5Ab for maintaining the height of the tape placement surface of the tape-side suction head 3 and the transport surface of the tape T.

[0040] The peeling section 5B is provided with a feeding end of the tape T, and is configured to be able to take up the tape T by rotating the take-up shaft 5Ba. The peeling section 4B maintains both ends of the take-up shaft 5Ba horizontally, and the take-up shaft 5Ba is supported by the shaft moving section 5C so that both ends move up and down in synchronization.

[0041] The peeling mechanism 1 of the first embodiment configured as described above operates as shown in Figure 3. The wafer W is attached to the tape T placed on the tape-side suction head 3 and is in a diced state. The tape T is locked by the shaft 5Aa and the take-up shaft 5Ba in a state where a predetermined tension is applied to both the pivotal support portion 5A and the peeling portion 5B so that the tape T does not sag, and the shaft moving portion 5C is set at the same height as the surface on the tape-side suction head 3 where the tape T is placed.

[0042] 3(a), the wafer-side suction head 2 is moved and adjusted to a horizontal position where the entire area of ​​the diced wafer W is covered with the porous plate 2B, and is then lowered toward the tape-side suction head 3. The wafer-side suction head 2 stops its descent at a predetermined distance from the top surface of the wafer W placed on the top surface of the tape-side suction head 3.

[0043] In Fig. 3(b), when the wafer-side suction head 2 descends to a predetermined position, the inside of the housing 2A is put into a negative pressure state. When the housing 2A is put into a negative pressure state, the wafer W together with the tape T is sucked into the wafer-side suction head 2. After the wafer W is sucked into the wafer-side suction head 2, the inside of the housing 3A of the tape-side suction head 3 is put into a negative pressure state as shown in Fig. 3(c).

[0044] In Figure 3(c), after the wafer W is sucked into the wafer side suction head 2, the winding shaft 5Ba of the peeling section 5B in the peeling mechanism 5 is lowered by the shaft moving section 5C, and the motor 4B in the moving mechanism 4 is rotated so that the tape side suction head 3 moves toward one end of the moving screw shaft 4A, i.e., moves backward.

[0045] The tape T is tilted, that is, at a predetermined angle with respect to the underside of the wafer W, as the winding shaft 5Ba of the peeling section 5B descends, with the front end of the tape suction head 3 as a fulcrum, due to the gap between the wafer-side suction head 2 (the underside of the wafer W via the tape T sucked by it) and the tape-side suction head 3, and the front end of the tape-side suction head 3, and as a result, the tape T is peeled little by little from the wafer W. Note that when the tape T is peeled off, there is no other contact object on the underside of the wafer W other than the tape T.

[0046] 3(d), when the take-up shaft 5Ba of the peeling section 5B is lowered to its lowest position and the tape-side suction head 3 is retracted to its final position, the tape T is peeled off from the entire underside of the diced wafer W. At this time, the lowering of the take-up shaft 5Ba places the front side of the tape T in a position where it will not be reattached to the wafer W, while the suction of the tape-side suction head 3 prevents the rear side of the tape T from moving toward the wafer W. After this, the wafer-side suction head 2 is raised and moved back and forth and left and right to transfer all of the wafers W at once to another process.

[0047] (Second Example) The peeling mechanism 1 of the second embodiment shown in Figures 4 to 6 has the following configuration. 2 is a wafer-side suction head that applies negative pressure to the dicing side surface of the wafer W, and has the same configuration as that of the first embodiment. The second embodiment differs from the first embodiment in that the tape-side suction head 3 does not move in the front-to-rear direction and therefore does not have the configuration of the carriage 3c, and therefore does not have the configuration of the moving mechanism 4, and in that the peeling mechanism 5 has been changed to a transport mechanism 6 and a separation mechanism 7. This will be explained below.

[0048] Reference numeral 6 denotes a transport mechanism that feeds out and winds up the tape T. The transport mechanism 6 has a pivot part 6A that pivotally supports a shaft part 6Aa of the original roll of tape T at one end (rear side) in the direction of feeding and winding of the tape T (hereinafter referred to as the front-rear direction), and a pivot part 6B that pivotally supports a winding shaft 6Ba that winds up the tape T at the other end (front side).

[0049] The pivotal support portion 6A is controlled to lock the rotation of the shaft portion 6Aa to prevent the tape T from being inadvertently fed out when the tape T is adhered to the wafer W and when it is peeled off. On the other hand, the pivotal support portion 6B is provided with the feeding end portion of the tape T, and is capable of winding up the tape T by rotating the winding shaft 6Ba. The pivotal support portions 6A and 6B both have guide rollers 6Ab and 6Bb to maintain the height of the tape placement surface of the tape-side suction head 3 and the transport surface of the tape T.

[0050] Reference numeral 7 denotes a separation mechanism for separating the tape T and the wafer W. The separation mechanism 7 comprises a separation part 7A whose peripheral surface is positioned at the same height as the upper surface of the tape-side suction head 3, and a movement part 7B that supports both ends of the shaft of the separation part 7A and moves the separation part 7A horizontally in the front-to-rear direction.

[0051] In this example, the separation unit 7 has an outer shape with a circular cross section, and is pivotally supported on the moving unit 7B so as to be horizontally movable and rotatable about its axis. The rotation of the separation unit 7 is due to adhesion to the tape T and the horizontal movement, i.e., the separation unit 7 may be configured to be free to rotate without rotating on its own, or the separation unit 7 may be configured to rotate on its own and move horizontally in cooperation with the moving unit 7.

[0052] As described below, the separation unit 7A moves from front to back between the wafer W and tape T sucked by the wafer side suction head 2 using the moving unit 7B, thereby separating the tape T and sucking it toward the tape side suction head 3.

[0053] The operation of the peeling mechanism 1 having the configuration of the second embodiment will now be described. First, in the state immediately before the description, the diced wafer W is attached to the tape T and placed on the tape-side suction head 2. The transport mechanism 6 is in a state where no unnecessary tension is applied to the tape T and there is no unnecessary slack, and the shaft 6Aa of the pivotal support portion 6A and the take-up shaft 6Ba of the pivotal support portion 6B are locked to prevent rotation. Also, the separation mechanism 7 is in a state where the separation portion 7A is in contact with the top surface of the tape T at a position near the pivotal support portion 6B in front.

[0054] 6(a), the wafer-side suction head 2 is moved and adjusted to a horizontal position where the entire area of ​​the diced wafer W is covered with the porous plate 2B, and is then lowered toward the tape-side suction head 3. The wafer-side suction head 2 stops its descent at a predetermined distance from the top surface of the wafer W placed on the top surface of the tape-side suction head 3.

[0055] 6(b), when the wafer-side suction head 2 descends to a position at a predetermined distance from the top surface of the wafer W, a negative pressure state is created inside the housing 2A. When the housing 2A is in a negative pressure state, the wafer W together with the tape T is sucked into the wafer-side suction head 2. After the wafer W is sucked into the wafer-side suction head 2, a negative pressure state is created inside the housing 3A of the tape-side suction head 3, as shown in FIG.

[0056] 6(c) and 6(d), the moving part 7B of the separation mechanism 7 is driven to move the separation part 7A, which is currently positioned in the front, toward the pivot part 6A (rearward). When the separation part 7A is positioned under the bottom surface of the wafer W, the separation part 7A presses the tape T down toward the tape-side suction head 3. As soon as the tape T is pressed down by the separation part 7A, it is sucked into the porous plate 3B of the tape-side suction head 3, and is therefore not re-adhered to the wafer W.

[0057] Furthermore, the separation section 7A simply moves back and forth at a constant height at the tape-side suction head 3 (the surface of the tape T that adheres to the wafer W), so even if the tape T is pressed down toward the tape-side suction head 3, it will not come into contact with the wafer W.

[0058] 6(e), when the separating unit 7A has moved all the way to the rear, the tape T has been peeled off from the entire underside of the diced wafer W. At this time, the suction of the tape-side suction head 3 prevents the peeled tape T from moving toward the wafer W. After this, the wafer-side suction head 2 is raised and moved back and forth and left and right to transfer the entire wafer W to another process at once.

[0059] In the first and second embodiments described above, the tape T was required to be in the form of a long roll, i.e., the tape T was required to be fed and wound up, but a normal circular tape may also be used.

[0060] When the tape T is circular, instead of a configuration for feeding and winding the tape T, a configuration can be adopted in which the tape T is clipped at a position that protrudes from the wafer W and that is diametrically opposed to the tape T in the radial direction. This clipping configuration can be substituted by a ring that is provided on the outer periphery of the tape T during dicing. In this case, in the second embodiment, there is no modification other than the clipping configuration, but in the first embodiment, a member (corresponding to a peeling portion) that presses down the position that protrudes from the wafer W between the clip position of the tape T and the wafer W can be provided.

[0061] As described above, in both the first and second embodiments, the peeling mechanism 1 of the present invention does not come into contact with any components when peeling the tape T from the diced wafer W, and since there are no contacting components and the tape T does not rub against the adhesive surface of the wafer W, it does not scratch the wafer W. Furthermore, since the diced wafers W after the tape T has been peeled can be transferred all at once, the overall work efficiency is improved. [Explanation of symbols]

[0062] 1 Peeling mechanism 2 Wafer side suction head 2B Porous Plate 3 Tape side suction head 3B Porous Plate 5 Peeling mechanism 5B Peeling part 5C Shaft moving part 6. Conveyor mechanism 7 Separation mechanism 7A Separation part 7B Moving part W wafer T (dicing) tape

Claims

1. A peeling mechanism that peels dicing tape from a wafer after dicing, comprising: a wafer-side suction head using a porous plate that applies negative pressure to the dicing side of the wafer; a tape-side suction head using a porous plate that applies negative pressure to the side of the dicing tape opposite the wafer-adhered surface; and a peeling unit that moves in a direction perpendicular to the adhering surface between the wafer and the dicing tape so that the dicing tape is pressed against one end of the tape-side suction head, wherein the tape-side suction head moves in a plane parallel to the adhering surface of the wafer to the dicing tape at a position that is not in contact with the dicing tape that is adhered to the wafer.

2. A peeling mechanism that peels off dicing tape from a wafer after dicing, comprising: a wafer-side suction head using a porous plate that applies negative pressure suction to the dicing side of the wafer; a tape-side suction head using a porous plate that applies negative pressure suction to the side of the dicing tape opposite the wafer-adhered side; and a separation unit that is inserted between the wafer and the dicing tape and moves in the direction in which the wafer and the dicing tape are attached while pressing the dicing tape against the tape-side suction head without coming into contact with the wafer.

3. 3. The peeling mechanism according to claim 1, wherein said wafer-side suction head transfers a plurality of wafer chips after dicing the wafer to a next process at one time.

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