Electronic devices

Abstract

To provide an electronic apparatus capable of attaining down-sizing while suppressing short-circuiting between adjacent leads.SOLUTION: An electronic apparatus A1 comprises an electronic component 1, a resin member 2 covering the electronic component 1, and a plurality of leads 3 each conducted to the electronic component 1. The resin member 2 includes a first resin side face 231 turned to one side in a first direction (y) orthogonal to a thickness direction (z) of the resin member 2. The plurality of leads 3 is disposed along the first resin side face 231 and includes a plurality of lateral exposed parts 41 exposed from the first resin side face 231. Each of the plurality of first lateral exposed parts 41 includes a first tapered portion 410 which is tapered toward the first resin side face 231 in a view in the thickness direction (z). The first tapered portion 410 includes a first distal end face 411 which is turned in the same direction as the first resin side face 231 in the first direction (y) and flush with the first resin side face 231.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to electronic devices. [Background technology]

[0002] Conventionally, there are leadless package electronic devices such as SON packages (Small Outline Non-leaded packages) and QFN packages (Quad Flat Non-leaded packages). Leadless package electronic devices have the advantage of being smaller and thinner because terminals for external connection do not protrude from the sealing resin that seals the electronic components. For example, Patent Document 1 discloses a leadless package semiconductor device that includes a semiconductor chip as an electronic component.

[0003] The semiconductor device described in Patent Document 1 includes a semiconductor chip, multiple leads, and a sealing resin. The multiple leads are made of, for example, copper. Each of the multiple leads is electrically connected to the semiconductor chip via thin metal wires and serves as a terminal for external connection when the semiconductor device is mounted on a circuit board of an electronic device or the like. The sealing resin covers the semiconductor chip. Such a semiconductor device is manufactured, for example, by the MAP (Molded Array Packaging) method. In the MAP method, multiple semiconductor chips are collectively sealed on a lead frame with sealing resin, and then the resultant is cut into individual pieces each having a single semiconductor chip by dicing. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-112961 Summary of the Invention [Problem to be solved by the invention]

[0005] The above-mentioned dicing includes, for example, a blade dicing method, in which the lead frame (plurality of leads) and the sealing resin are cut at the same time. During this dicing, the metal material of the lead frame may stretch, causing burrs (hereinafter referred to as "metal burrs") on the lead frame (leads). Such metal burrs may, for example, short-circuit adjacent leads, resulting in malfunction. Therefore, in conventional semiconductor devices (electronic devices), it was necessary to ensure an appropriate distance between adjacent leads in order to prevent short-circuiting between leads due to metal burrs. Therefore, in conventional semiconductor devices (electronic devices), there were limitations on how much the distance between adjacent leads could be reduced, making it difficult to reduce the size in plan view.

[0006] The present disclosure has been made in view of the above circumstances, and its purpose is to provide an electronic device that can be miniaturized while suppressing short circuits between adjacent leads. [Means for solving the problem]

[0007] The electronic device of the present disclosure comprises an electronic component, a resin member covering the electronic component, and a plurality of leads each electrically connected to the electronic component, wherein the resin member has a first resin side surface facing in a first direction perpendicular to a thickness direction of the resin member, the plurality of leads are arranged along the first resin side surface and each include a plurality of first lateral exposed portions exposed from the first resin side surface, each of the plurality of first lateral exposed portions including a first tapered portion tapering toward the first resin side surface when viewed in the thickness direction, and the first tapered portion has a first end surface facing in the same direction as the first resin side surface in the first direction and being flush with the first resin side surface. [Effects of the Invention]

[0008] According to the electronic device of the present disclosure, it is possible to reduce the size while suppressing short circuits between adjacent leads. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing an electronic device according to a first embodiment, as viewed from the bottom side. [Figure 2] FIG. 2 is a plan view showing the electronic device according to the first embodiment, in which resin members are shown by imaginary lines. [Figure 3] FIG. 3 is a diagram in which the electronic components are shown by imaginary lines in the plan view of FIG. [Figure 4] FIG. 4 is a bottom view showing the electronic device according to the first embodiment. [Figure 5] FIG. 5 is a partially enlarged view of a part of FIG. [Figure 6] FIG. 6 is a partially enlarged view of a part of FIG. [Figure 7] FIG. 7 is a partially enlarged view of a part of FIG. [Figure 8] FIG. 8 is a partially enlarged view of a part of FIG. [Figure 9] FIG. 9 is a front view showing the electronic device according to the first embodiment. [Figure 10] FIG. 10 is a rear view showing the electronic device according to the first embodiment. [Figure 11] FIG. 11 is a right side view showing the electronic device according to the first embodiment. [Figure 12] FIG. 12 is a left side view showing the electronic device according to the first embodiment. [Figure 13] FIG. 13 is a cross-sectional view taken along line XIII-XIII in FIG. [Figure 14] FIG. 14 is a cross-sectional view taken along line XIV-XIV in FIG. [Figure 15] FIG. 15 is a cross-sectional view taken along line XV-XV in FIG. [Figure 16] FIG. 16 is a cross-sectional view taken along line XVI-XVI in FIG. [Figure 17] FIG. 17 is a cross-sectional view taken along line XVII-XVII in FIG. [Figure 18] FIG. 18 is a bottom view showing one step of the method for manufacturing the electronic device according to the first embodiment. [Figure 19] FIG. 19 is a bottom view showing one step of the method for manufacturing the electronic device according to the first embodiment. [Figure 20] FIG. 20 is a cross-sectional view showing a step of the method for manufacturing the electronic device according to the first embodiment. [Figure 21] FIG. 21 is a bottom view showing one step of the method for manufacturing the electronic device according to the first embodiment. [Figure 22] FIG. 22 is a bottom view showing a step of the method for manufacturing the electronic device according to the first embodiment. [Figure 23] FIG. 23 is a cross-sectional view showing a step of the method for manufacturing the electronic device according to the first embodiment. [Figure 24] FIG. 24 is a bottom view showing one step of the method for manufacturing the electronic device according to the first embodiment. [Figure 25] FIG. 25 is a cross-sectional view showing a step of the method for manufacturing the electronic device according to the first embodiment. [Figure 26] FIG. 26 is a bottom view showing an electronic device according to a first modified example of the first embodiment. [Figure 27] FIG. 27 is a cross-sectional view showing an electronic device according to a first modified example of the first embodiment, and corresponds to the cross section shown in FIG. [Figure 28] FIG. 28 is a cross-sectional view showing an electronic device according to a first modified example of the first embodiment, and corresponds to the cross section shown in FIG. [Figure 29] FIG. 29 is a cross-sectional view showing an electronic device according to a first modified example of the first embodiment, and corresponds to the cross section of FIG. [Figure 30] FIG. 30 is a bottom view showing an electronic device according to a second modified example of the first embodiment. [Figure 31] FIG. 31 is a bottom view of a main part showing an electronic device according to a third modified example of the first embodiment. [Figure 32] FIG. 32 is a bottom view of a main part showing an electronic device according to a third modified example of the first embodiment. [Figure 33] FIG. 33 is a bottom view showing an electronic device according to a fourth modified example of the first embodiment. [Figure 34]FIG. 34 is a bottom view showing an electronic device according to another modified example of the first embodiment. [Figure 35] FIG. 35 is a bottom view showing an electronic device according to another modified example of the first embodiment. [Figure 36] FIG. 36 is a bottom view showing an electronic device according to another modified example of the first embodiment. [Figure 37] FIG. 37 is a bottom view showing an electronic device according to another modified example of the first embodiment. [Figure 38] FIG. 38 is a bottom view of a main part showing a first tapered portion of an electronic device according to another modified example of the first embodiment. [Figure 39] FIG. 39 is a bottom view of a main part showing a first tapered portion of an electronic device according to another modified example of the first embodiment. [Figure 40] FIG. 40 is a bottom view of a main part showing a first tapered portion of an electronic device according to another modified example of the first embodiment. [Figure 41] FIG. 41 is a bottom view of a main part showing a first tapered portion of an electronic device according to another modified example of the first embodiment. [Figure 42] FIG. 42 is a plan view showing an electronic device according to the second embodiment, in which resin members are shown by imaginary lines. [Figure 43] FIG. 43 is a bottom view showing the electronic device according to the second embodiment. [Figure 44] FIG. 44 is a plan view showing an electronic device according to a modified example of the second embodiment, in which resin members are indicated by imaginary lines. DETAILED DESCRIPTION OF THE INVENTION

[0010] Preferred embodiments of the electronic device of the present disclosure will be described below with reference to the drawings. Hereinafter, identical or similar components will be designated by the same reference numerals, and redundant description will be omitted. Terms such as "first," "second," and "third" in this disclosure are used merely as labels and are not intended to necessarily assign any order to their objects.

[0011] In this disclosure, unless otherwise specified, "a certain object A is formed on a certain object B" and "a certain object A is formed on (an object) B" include "a certain object A is formed directly on a certain object B" and "a certain object A is formed on a certain object B with another object interposed between the certain object A and the certain object B." Similarly, "a certain object A is disposed on a certain object B" and "a certain object A is disposed on (an object) B" include "a certain object A is disposed directly on a certain object B" and "a certain object A is disposed on a certain object B with another object interposed between the certain object A and the certain object B" unless otherwise specified. Similarly, "a certain object A is located on (an object) B" includes "a certain object A is in contact with a certain object B and is located on (an object) B" and "a certain object A is located on (an object) B with another object interposed between the certain object A and the certain object B." Additionally, unless otherwise specified, "when viewed from a certain direction, object A overlaps object B" includes "object A overlaps the entirety of object B" and "object A overlaps part of object B."

[0012] First Embodiment 1 to 17 show an electronic device A1 according to a first embodiment. The electronic device A1 includes an electronic component 1, a resin member 2, and a plurality of leads 3. The plurality of leads 3 includes a plurality of first leads 31, a plurality of second leads 32, a plurality of third leads 33, a plurality of fourth leads 34, a fifth lead 35, and a plurality of sixth leads 36.

[0013] For ease of explanation, the thickness direction of the electronic device A1 (resin member 2) will be referred to as the "thickness direction z." In the following explanation, one side of the thickness direction z will be referred to as the "upper side," and the other side will be referred to as the "lower side." Terms such as "upper," "lower," "upper," "lower," "top surface," and "bottom surface" indicate the relative positional relationship of components, parts, etc. in the thickness direction z, and do not necessarily define the relationship with the direction of gravity. Furthermore, "plan view" refers to the view in the thickness direction z. Furthermore, the direction perpendicular to the thickness direction z will be referred to as the "first direction y," and the direction perpendicular to the thickness direction z and the first direction y will be referred to as the "second direction x." The first direction y is the vertical direction in the plan view of the electronic device A1 (see FIG. 2). The second direction x is the horizontal direction in the plan view of the electronic device A1 (see FIG. 2). In this disclosure, the upper side of FIG. 2 is referred to as one side of the first direction y, the lower side of FIG. 2 is referred to as the other side of the first direction y, the right side of FIG. 2 is referred to as one side of the second direction x, and the left side of FIG. 2 is referred to as the other side of the second direction x.

[0014] The electronic device A1 is a surface-mount package. As shown in Fig. 1, the package structure of the electronic device A1 is, for example, a MAP type QFN. As shown in Fig. 2, the electronic device A1 is, for example, rectangular in plan view.

[0015] The electronic component 1 is an element that performs the electrical function of the electronic device A1. The electronic component 1 has, for example, a rectangular shape in a plan view. The electronic component 1 is, for example, an integrated circuit element made of a semiconductor. In this embodiment, as shown in FIGS. 2 and 13 , the electronic component 1 includes a switching circuit 101 and a control circuit 102. The switching circuit 101 is configured with a semiconductor switch such as a MOSFET or an IGBT. The switching circuit 101 is divided into two regions: a high-voltage region (upper arm circuit) and a low-voltage region (lower arm circuit). The switching circuit 101 converts, for example, input DC power (DC voltage) into AC power (AC voltage). The control circuit 102 is configured with, for example, a gate driver for driving the switching circuit 101. The electronic component 1 may not be an integrated circuit element, but may be an active functional element (for example, a transistor or a diode) or a passive functional element (for example, a resistor, a capacitor, or an inductor).

[0016] As shown in Figures 13 to 17, the electronic component 1 has an element principal surface 10a and an element rear surface 10b. The element principal surface 10a and the element rear surface 10b are spaced apart in the thickness direction z and face opposite each other. The element principal surface 10a faces downward in the thickness direction z, and the element rear surface 10b faces upward in the thickness direction. In this embodiment, the electronic component 1 is flip-chip mounted to multiple leads 3, and the element principal surface 10a faces the multiple leads 3, as shown in Figures 13 to 17.

[0017] As shown in FIGS. 2, 3, and 13 to 17, the electronic component 1 has a plurality of electrodes 11 to 14 arranged on the element principal surface 10a. The number, arrangement, shape, and planar dimensions of the plurality of electrodes 11 to 14 are not limited to the illustrated examples and may vary appropriately depending on the electronic component 1 used. The plurality of electrodes 11 to 13 are electrically connected to the switching circuit 101. As shown in FIG. 3, the plurality of electrodes 11 are connected to a plurality of first leads 31. The plurality of electrodes 12 are connected to a plurality of second leads 32. The plurality of electrodes 13 are connected to a fifth lead 35. The plurality of electrodes 14 are electrically connected to the control circuit 102. As shown in FIG. 3, some of the plurality of electrodes 14 are connected to one of the plurality of third leads 33, and some are connected to one of the plurality of fourth leads 34.

[0018] The resin member 2 is a sealing material that protects the electronic component 1. The resin member 2 contains an insulating resin material. The resin material is, for example, a black epoxy resin. As shown in FIGS. 1 to 17, the resin member 2 covers each of the leads 3 and the electronic component 1. As shown in FIG. 2, the resin member 2 has a rectangular shape in a plan view. The resin member 2 has a resin main surface 21, a resin back surface 22, a first resin side surface 231, a second resin side surface 232, a third resin side surface 233, a fourth resin side surface 234, a first resin recess 241, a second resin recess 242, a third resin recess 243, and a fourth resin recess 244.

[0019] 9 to 17, the resin main surface 21 and the resin back surface 22 are spaced apart in the thickness direction z and face opposite each other. The resin main surface 21 faces upward in the thickness direction z, and the resin back surface 22 faces downward in the thickness direction z. The resin main surface 21 is the uppermost surface of the resin member 2, and the resin back surface 22 is the lowermost surface of the resin member 2.

[0020] As shown in FIGS. 2 to 4, 11, 12, and 14 to 17, the first resin side surface 231 and the second resin side surface 232 are spaced apart in the first direction y and face opposite each other. The first resin side surface 231 faces one side in the first direction y, and the second resin side surface 232 faces the other side in the first direction y. The first resin side surface 231 and the second resin side surface 232 are each sandwiched between the resin main surface 21 and the resin back surface 22 in the thickness direction z. The first resin side surface 231 is connected to the resin main surface 21 and is connected to the resin back surface 22 via a first resin recess 241. The second resin side surface is connected to the resin main surface 21 and is connected to the resin back surface 22 via a second resin recess 242. The first resin side surface 231 and the second resin side surface 232 are each flat.

[0021] As shown in FIGS. 2 to 4, 9, 10, and 13, the third resin side surface 233 and the fourth resin side surface 234 are spaced apart in the second direction x and face opposite directions. The third resin side surface 233 faces one side of the second direction x, and the fourth resin side surface 234 faces the other side of the second direction x. The third resin side surface 233 and the fourth resin side surface 234 are each sandwiched between the resin main surface 21 and the resin back surface 22 in the thickness direction z. The third resin side surface 233 is connected to the resin main surface 21 and is connected to the resin back surface 22 via a third resin recess 243. The fourth resin side surface 234 is connected to the resin main surface 21 and is connected to the resin back surface 22 via a fourth resin recess 244. The third resin side surface 233 and the fourth resin side surface 234 are each flat.

[0022] As shown in FIGS. 15 and 17, the first resin recess 241 is recessed from the resin back surface 22 and connects to the first resin side surface 231. As shown in FIGS. 5, 6, 15, and 17, the first resin recess 241 has a first wall surface 241a and a first bottom surface 241b. The first wall surface 241a faces the same direction as the first resin side surface 231. As shown in FIGS. 5 and 6, the first wall surface 241a is located on the other side of the first resin side surface 231 in the first direction y, that is, closer to the inside of the electronic device A1 than the first resin side surface 231 in a plan view. The first bottom surface 241b connects to the first resin side surface 231 and the first wall surface 241a. In the example shown in FIGS. 15 and 17, the first bottom surface 241b is flat and faces downward in the thickness direction z. Alternatively, the first bottom surface 241b may be curved in a concave shape.

[0023] As shown in FIGS. 15 and 17 , the second resin recess 242 is recessed from the resin back surface 22 and connects to the second resin side surface 232. As shown in FIGS. 7 , 8 , 15 , and 17 , the second resin recess 242 has a second wall surface 242a and a second bottom surface 242b. The second wall surface 242a faces the same direction as the second resin side surface 232. As shown in FIGS. 7 and 8 , the second wall surface 242a is located on one side of the second resin side surface 232 in the first direction y, that is, closer to the inside of the electronic device A1 than the second resin side surface 232 in a plan view. The second bottom surface 242b connects to the second resin side surface 232 and the second wall surface 242a. In the example shown in FIGS. 15 and 17 , the second bottom surface 242b is flat and faces downward in the thickness direction z. Alternatively, the second bottom surface 242b may be curved in a concave shape.

[0024] The third resin recess 243 is recessed from the resin back surface 22 and connects to the third resin side surface 233. As shown in FIGS. 5 and 7, the third resin recess 243 has a third wall surface 243a and a third bottom surface 243b. The third wall surface 243a faces the same direction as the third resin side surface 233. As shown in FIGS. 5 and 7, the third wall surface 243a is located on the other side of the third resin side surface 233 in the second direction x, that is, closer to the inside of the electronic device A1 than the third resin side surface 233 in a plan view. The third bottom surface 243b connects to the third resin side surface 233 and the third wall surface 243a. For example, the third bottom surface 243b, like the first bottom surface 241b and the second bottom surface 242b, is flat and faces downward in the thickness direction z. Alternatively, the third bottom surface 243b may be curved in a concave shape.

[0025] The fourth resin recess 244 is recessed from the resin back surface 22 and connects to the fourth resin side surface 234. As shown in FIGS. 6 and 8, the fourth resin recess 244 has a fourth wall surface 244a and a fourth bottom surface 244b. The fourth wall surface 244a faces the same direction as the fourth resin side surface 234. As shown in FIGS. 6 and 8, the fourth wall surface 244a is located on one side of the fourth resin side surface 234 in the second direction x, that is, closer to the inside of the electronic device A1 in a plan view than the fourth resin side surface 234. The fourth bottom surface 244b connects to the fourth resin side surface 234 and the fourth wall surface 244a. For example, the fourth bottom surface 244b, like the first bottom surface 241b and the second bottom surface 242b, is flat and faces downward in the thickness direction z. Alternatively, the fourth bottom surface 244b may be curved in a concave shape.

[0026] The dimension in the thickness direction z of the resin member 2 (the dimension along the thickness direction z from the resin back surface 22 to the resin main surface 21) is, for example, 400 μm or more and 1000 μm or less. The dimension in the first direction y of the resin member 2 (the dimension along the first direction y from the first resin side surface 231 to the second resin side surface 232) is, for example, 1000 μm or more and 10000 μm or less. The dimension in the second direction x of the resin member 2 (the dimension along the second direction x from the third resin side surface 233 to the fourth resin side surface 234) is, for example, 1000 μm or more and 10000 μm or less. Note that these dimensions are not limited to the numerical ranges exemplified above.

[0027] The leads 3 are suitably connected to the electronic component 1. The leads 3 are made of copper or a copper alloy. As shown in FIGS. 3 and 4, the leads 3 include a plurality of first leads 31, a plurality of second leads 32, a plurality of third leads 33, a plurality of fourth leads 34, a fifth lead 35, and a plurality of sixth leads 36.

[0028] As shown in FIGS. 3, 4, and 14, the multiple first leads 31 each extend along the first direction y. As shown in FIGS. 3 and 4, the multiple first leads 31 are arranged at predetermined intervals in the second direction x in a plan view. Each of the multiple first leads 31 is joined to one of the electrodes 11 of the electronic component 1. Each of the multiple first leads 31 is partially exposed from the resin member 2. The portion of each first lead 31 exposed from the resin member 2 (a first side exposed portion 41A and a second side exposed portion 42B described below) is an input terminal (P terminal) to which DC power (voltage) to be converted is input in the electronic device A1, for example.

[0029] As shown in FIGS. 3, 4, and 15, the multiple second leads 32 each extend along the first direction y. As shown in FIGS. 3 and 4, the multiple second leads 32 are arranged at predetermined intervals in the second direction x in a plan view. Each of the multiple second leads 32 is disposed between a pair of adjacent first leads 31 in the second direction x. The multiple first leads 31 and the multiple second leads 32 are arranged alternately in the second direction x. Each of the multiple second leads 32 is joined to one of the electrodes 12 of the electronic component 1. Each of the multiple second leads 32 is partially exposed from the resin member 2. The portion of each second lead 32 exposed from the resin member 2 (a rear surface exposed portion 61 described below) is, for example, an output terminal for AC power (voltage) converted by a switching circuit 101 configured in the electronic component 1.

[0030] As shown in FIGS. 3, 4, and 13, the multiple third leads 33 are located on the other side of the multiple first leads 31 in the second direction x. Each of the multiple third leads 33 is joined to one of the electrodes 14 of the electronic component 1. Each of the multiple third leads 33 is partially exposed from the resin member 2. The portion of each third lead 33 exposed from the resin member 2 (a fourth lateral exposed portion 44 described below) is, for example, an input terminal for power (voltage) for driving the control circuit 102 of the electronic component 1, an input terminal for an electrical signal to be transmitted to the control circuit 102, or an output terminal for an electrical signal transmitted from the control circuit 102.

[0031] As shown in FIGS. 3 and 4 , the multiple fourth leads 34 are each located between the multiple first leads 31 and the multiple third leads 33 in the second direction x. Each of the multiple fourth leads 34 is joined to one of the electrodes 14 of the electronic component 1. Each of the multiple fourth leads 34 is partially exposed from the resin member 2. The portion of each fourth lead 34 exposed from the resin member 2 (a first side exposed portion 41C and a second side exposed portion 42C described below) is, for example, either an input terminal for an electrical signal to be transmitted to a control circuit 102 of the electronic component 1 or an output terminal for an electrical signal transmitted from the control circuit 102.

[0032] 3, 4, and 13, the fifth lead 35 is located on one side of the plurality of first leads 31 in the second direction x. Each electrode 13 of the electronic component 1 is joined to the fifth lead 35. The fifth lead 35 is partially exposed from the resin member 2. The portion of the fifth lead 35 exposed from the resin member 2 (a third lateral exposed portion 43 described below) is an input terminal (N terminal) to which DC power (voltage) to be converted into power is input in the electronic device A1, for example.

[0033] 3 and 4, the sixth leads 36 are arranged at four corners of the resin member 2 in a plan view. The sixth leads 36 include those arranged near corners of the resin member 2 formed by the first resin side surface 231 and the third resin side surface 233 as shown in FIG. 5, those arranged near corners of the resin member 2 formed by the first resin side surface 231 and the fourth resin side surface 234 as shown in FIG. 6, those arranged near corners of the resin member 2 formed by the second resin side surface 232 and the third resin side surface 233 as shown in FIG. 7, and those arranged near corners of the resin member 2 formed by the second resin side surface 232 and the fourth resin side surface 234 as shown in FIG. 8. In this embodiment, the sixth leads 36 are not electrically connected to the electronic component 1.

[0034] As shown in Figures 3 to 16, the multiple leads 3 include multiple first lateral exposed portions 41, multiple second lateral exposed portions 42, multiple third lateral exposed portions 43, multiple fourth lateral exposed portions 44, first corner exposed portions 51, second corner exposed portions 52, third corner exposed portions 53, fourth corner exposed portions 54, and multiple back surface exposed portions 61.

[0035] As shown in FIGS. 3, 4, and 10, the multiple first lateral exposed portions 41 are exposed from the first resin side surface 231. As shown in FIGS. 3 and 4, the multiple first lateral exposed portions 41 are arranged along the first resin side surface 231. Therefore, the multiple first lateral exposed portions 41 are arranged in the second direction x. As shown in FIGS. 3 and 4, the multiple first lateral exposed portions 41 include multiple first lateral exposed portions 41A, 41B, and 41C. The multiple first lateral exposed portions 41A are formed on the multiple first leads 31. The multiple first lateral exposed portions 41B are formed on the multiple second leads 32. The multiple first lateral exposed portions 41C are formed on those of the multiple fourth leads 34 that are arranged along the first resin side surface 231. In this embodiment, the distance d1 (see FIG. 4) between adjacent first lateral exposed portions 41 in the second direction x is, for example, not less than 50 μm and not more than 250 μm. In particular, in the example shown in FIGS. 3 and 4, the distance d1 between the first side exposed portion 41A and the first side exposed portion 41B adjacent in the second direction x is short, for example, not less than 50 μm and not more than 200 μm.

[0036] As shown in FIGS. 5 and 6, each of the multiple first lateral exposed portions 41 (the multiple first lateral exposed portions 41A to 41C) includes a first tapered portion 410. The first tapered portion 410 is a portion of each of the first lateral exposed portions 41A to 41C that tapers toward the first resin side surface 231 in a plan view. The first tapered portion 410 is formed at an end of each of the first lateral exposed portions 41A to 41C on one side in the first direction y, that is, at an end facing outward from the electronic device A1 in a plan view. As shown in FIGS. 5 and 6, the first tapered portion 410 has a first tip surface 411, a first chamfered portion 412, a first side surface 413, and a first back surface 414.

[0037] 5, 6, and 14 to 16, the first tip surface 411 faces the same direction as the first resin side surface 231 and is flush with the first resin side surface 231. The first tip surface 411 is flat. In this disclosure, unless otherwise specified, "flush" does not only refer to an embodiment in which two or more surfaces are ideally smooth surfaces, but also includes a case in which unevenness is unavoidably formed when cutting in the manufacturing process of the electronic device A1, and a case in which cutting marks are formed across each surface.

[0038] As shown in FIGS. 5 and 6, the first chamfered portion 412 is connected to the first tip surface 411. The first chamfered portion 412 is formed on one side of the first tapered portion 410 in the second direction x. The first chamfered portion 412 is inclined with respect to the first tip surface 411 in a plan view. In this embodiment, the first chamfered portion 412 is a flat surface. Alternatively, the first chamfered portion 412 may be a convexly curved surface in a plan view.

[0039] 5 and 6, the first side surface 413 is connected to the first tip surface 411 and the first back surface 414. The first side surface 413 is located on the opposite side of the first tip surface 411 from the first chamfered portion 412 in the second direction x. The first side surface 413 is flat and faces the other side of the second direction x. The first side surface 413 is approximately perpendicular to the first tip surface 411.

[0040] 6 and 14 to 16, the first back surface 414 faces downward in the thickness direction z. The first back surfaces 414 of the multiple first side exposed portions 41A, 41C are exposed from the resin back surface 22 and are flush with the resin back surface 22. The first back surfaces 414 of the multiple first side exposed portions 41B are covered with the resin member 2.

[0041] As shown in FIGS. 5, 6, 14, and 16, the multiple first lateral exposed portions 41A, 41C further include a first lateral recess 416. The first lateral recess 416 is recessed from the first back surface 414 and connects to the first tip surface 411. The first lateral recess 416 connects to the first resin recess 241. The surface of the first lateral recess 416 is flush with the surface of the first resin recess 241. As shown in FIGS. 14 and 16, the first lateral recess 416 has a first inner end surface 416a and a first connecting surface 416b.

[0042] 14 and 16, the first inner end surface 416a faces the same direction as the first tip surface 411 and is substantially parallel to the first tip surface 411. In a plan view, the first inner end surface 416a is located more inward of the electronic device A1 than the first tip surface 411 (on the other side in the first direction y, closer to the electronic component 1 in the first direction y). The first inner end surface 416a is connected to the first back surface 414. The first inner end surface 416a is flat. The first inner end surface 416a is flush with the first wall surface 241a.

[0043] As shown in Figures 14 and 16, the first connecting surface 416b is connected to the first inner end surface 416a and the first tip surface 411. In the example shown in Figures 14 and 15, the first connecting surface 416b is flat and faces downward in the thickness direction z. Unlike the example shown in Figures 14 and 15, the first connecting surface 416b may be curved concavely. The first connecting surface 416b is flush with the first bottom surface 241b.

[0044] In each of the plurality of first lateral exposed portions 41A, 41C, tin plating is applied to the first back surface 414 and the surface (first inner end surface 416a and first connecting surface 416b) of the first lateral recess 416. Note that instead of tin plating, multiple metal platings, for example, nickel, palladium, and gold stacked in this order, may be used.

[0045] As shown in FIGS. 3, 4, and 9, each of the multiple second lateral exposed portions 42 is exposed from the second resin side surface 232. The multiple second lateral exposed portions 42 are arranged along the second resin side surface 232. Therefore, the multiple second lateral exposed portions 42 are arranged in the second direction x. In the example shown in FIG. 3, the multiple second lateral exposed portions 42 are arranged symmetrically with respect to the multiple first lateral exposed portions 41 with respect to an auxiliary line L1 connecting the centers of the electronic device A1 in the first direction y. As shown in FIGS. 3 and 4, the multiple second lateral exposed portions 42 include multiple second lateral exposed portions 42A, 42B, and 42C. The multiple second lateral exposed portions 42A are formed on each of the multiple first leads 31. The multiple second lateral exposed portions 42B are formed on each of the multiple second leads 32. The multiple second lateral exposed portions 42C are formed on those of the multiple fourth leads 34 that are arranged along the second resin side surface 232. In this embodiment, the distance d2 (see FIG. 4) between the second lateral exposed portions 42 adjacent to each other in the second direction x is, for example, not less than 50 μm and not more than 250 μm. In particular, in the example shown in FIGS. 3 and 4, the distance d2 between the second lateral exposed portions 42A and 42B adjacent to each other in the second direction x is short, for example, not less than 50 μm and not more than 200 μm.

[0046] 7 and 8, each of the multiple second laterally exposed portions 42 (multiple second laterally exposed portions 42A to 42C) includes a second tapered portion 420. The second tapered portion 420 is a portion of each second laterally exposed portion 42 that tapers toward the second resin side surface 232 in a plan view. As shown in FIGS. 7 and 8, the second tapered portion 420 has a second tip surface 421, a second chamfered portion 422, a second side surface 423, and a second back surface 424.

[0047] 7, 8, and 14 to 16, second tip surface 421 faces the same direction as second resin side surface 232 and is flush with second resin side surface 232. Second tip surface 421 is flat.

[0048] As shown in FIGS. 7 and 8, the second chamfered portion 422 is connected to the second tip surface 421. The second chamfered portion 422 is formed on one side of the second tapered portion 420 in the second direction x. The second tapered portion 420 is inclined with respect to the second tip surface 421 in a plan view. In this embodiment, the second tapered portion 420 is a flat surface. Alternatively, the second chamfered portion 422 may be a convexly curved surface in a plan view.

[0049] 7 and 8, the second side surface 423 is connected to the second tip surface 421 and the second back surface 424. The second side surface 423 is located on the opposite side of the second tip surface 421 from the second chamfered portion 422 in the second direction x. The second side surface 423 is flat and faces the other side of the second direction x. The second side surface 423 is approximately perpendicular to the second tip surface 421.

[0050] 7, 8, and 14 to 16, the second back surface 424 faces downward in the thickness direction z. The second back surfaces 424 of the multiple second side exposed portions 42A, 42C are exposed from the resin back surface 22 and are flush with the resin back surface 22. The second back surfaces 424 of the multiple second side exposed portions 42B are covered with the resin member 2.

[0051] As shown in FIGS. 7, 8, 14, and 16, the multiple second lateral exposed portions 42A, 42C further include a second lateral recess 426. The second lateral recess 426 is recessed from the second back surface 424 and connects to the second tip surface 421. The second lateral recess 426 connects to the second resin recess 242. The surface of the second lateral recess 426 is flush with the surface of the second resin recess 242. As shown in FIGS. 14 and 16, the second lateral recess 426 has a second inner end surface 426a and a second connecting surface 426b.

[0052] 14 and 16, the second inner end surface 426a faces the same direction as the second tip surface 421 and is substantially parallel to the second tip surface 421. In a plan view, the second inner end surface 426a is located more inward of the electronic device A1 than the second tip surface 421 (on one side in the first direction y, closer to the electronic component 1 in the first direction y). The second inner end surface 426a is connected to the second back surface 424. The second inner end surface 426a is flat. The second inner end surface 426a is flush with the second wall surface 242a.

[0053] As shown in FIGS. 14 and 16, the second connecting surface 426b is connected to the second inner end surface 426a and the second tip surface 421. In the example shown in FIGS. 14 and 16, the second connecting surface 426b is flat and faces downward in the thickness direction z. Unlike the example shown in FIGS. 14 and 16, the second connecting surface 426b may be curved concavely. The second connecting surface 426b is flush with the second bottom surface 242b.

[0054] In each of the multiple second lateral exposed portions 42A, 42C, tin plating is applied to the second back surface 424 and the surfaces (second inner end surfaces 426a and second connecting surfaces 426b) of the second lateral recesses 426. Note that instead of tin plating, multiple metal platings, for example, nickel, palladium, and gold stacked in this order, may be used.

[0055] As shown in FIGS. 3, 4, and 11, each of the multiple third lateral exposed portions 43 is exposed from the third resin side surface 233. The multiple third lateral exposed portions 43 are arranged along the third resin side surface 233. Therefore, the multiple third lateral exposed portions 43 are arranged in the first direction y. Each of the multiple third lateral exposed portions 43 is formed in the fifth lead 35. In this embodiment, the distance d3 (see FIG. 4) between adjacent third lateral exposed portions 43 in the first direction y is, for example, not less than 100 μm and not more than 250 μm.

[0056] 5 and 7, each of the multiple third lateral exposed portions 43 includes a third tapered portion 430. The third tapered portion 430 is a portion of each third lateral exposed portion 43 that tapers toward the third resin side surface 233 in a plan view. The third tapered portion 430 is formed at an end of each third lateral exposed portion 43 on the outer side of the electronic device A1 (one side in the second direction x) in a plan view. As shown in FIGS. 5 and 7, the third tapered portion 430 has a third tip surface 431, a third chamfered portion 432, a third side surface 433, and a third back surface 434.

[0057] 5, 7, and 13, the third tip surface 431 faces the same direction as the third resin side surface 233 and is flush with the third resin side surface 233. The third tip surface 431 is flat.

[0058] As shown in FIGS. 5 and 7, the third chamfered portion 432 is connected to the third tip surface 431. The third chamfered portion 432 is formed on one side of the third tapered portion 430 in the first direction y. The third tapered portion 430 is inclined with respect to the third tip surface 431 in plan view. In this embodiment, the third tapered portion 430 is a flat surface. Alternatively, the third chamfered portion 432 may be a convexly curved surface in plan view.

[0059] 5 and 7, the third side surface 433 is connected to the third tip surface 431 and the third back surface 434. The third side surface 433 is located on the opposite side of the third tip surface 431 from the third chamfered portion 432 in the first direction y. The third side surface 433 is flat and faces the other side in the first direction y. The third side surface 433 is approximately perpendicular to the third tip surface 431.

[0060] 5, 7, and 13, the third back surface 434 faces downward in the thickness direction z. The third back surface 434 is exposed from the resin back surface 22 and is flush with the resin back surface 22.

[0061] 5, 7, and 13, each of the multiple third lateral exposed portions 43 further includes a third lateral recess 436. The third lateral recess 436 is recessed from the third back surface 434 and connects to the third tip surface 431. The third lateral recess 436 connects to the third resin recess 243. The surface of the third lateral recess 436 is flush with the surface of the third resin recess 243. The third lateral recess 436 has a third inner end surface 436a and a third connecting surface 436b.

[0062] 13, the third inner end surface 436a faces the same direction as the third tip surface 431 and is substantially parallel to the third tip surface 431. In a plan view, the third inner end surface 436a is located more inward of the electronic device A1 than the third tip surface 431 (on the other side in the second direction x, closer to the electronic component 1 in the second direction x). The third inner end surface 436a is connected to the third back surface 434. The third inner end surface 436a is flat. The third inner end surface 436a is flush with the third wall surface 243a.

[0063] As shown in Fig. 13, the third connecting surface 436b is connected to the third inner end surface 436a and the third tip surface 431. In the example shown in Fig. 13, the third connecting surface 436b is flat and faces downward in the thickness direction z. Unlike the example shown in Fig. 13, the third connecting surface 436b may be curved in a concave shape. The third connecting surface 436b is flush with the third bottom surface 243b.

[0064] In each of the multiple third lateral exposed portions 43, tin plating is applied to the third back surface 434 and the surfaces (third inner end surfaces 436a and third connecting surfaces 436b) of the third lateral recesses 436. Note that instead of tin plating, multiple metal platings, for example, nickel, palladium, and gold stacked in this order, may be used.

[0065] As shown in FIGS. 3, 4, and 12, each of the multiple fourth lateral exposed portions 44 is exposed from the fourth resin side surface 234. The multiple fourth lateral exposed portions 44 are arranged along the fourth resin side surface 234. Therefore, the multiple fourth lateral exposed portions 44 are arranged in the first direction y. Each of the multiple fourth lateral exposed portions 44 is formed in each of the multiple third leads 33. In this embodiment, the distance d4 (see FIG. 4) between adjacent fourth lateral exposed portions 44 in the first direction y is, for example, not less than 100 μm and not more than 250 μm.

[0066] 6, 8, and 13, each of the multiple fourth lateral exposed portions 44 includes a fourth tapered portion 440. The fourth tapered portion 440 is a portion of each fourth lateral exposed portion 44 that tapers toward the fourth resin side surface 234 in a plan view. The fourth tapered portion 440 is formed at an end of each fourth lateral exposed portion 44 on the outer side of the electronic device A1 (the other side in the second direction x) in a plan view. The fourth tapered portion 440 has a fourth tip surface 441, a fourth chamfered portion 442, a fourth side surface 443, and a fourth back surface 444.

[0067] 6, 8, and 13, the fourth tip surface 441 faces the same direction as the fourth resin side surface 234 and is flush with the fourth resin side surface 234. The fourth tip surface 441 is flat.

[0068] As shown in FIGS. 6 and 8, the fourth chamfered portion 442 is connected to the fourth tip surface 441. The fourth chamfered portion 442 is formed on one side of the fourth tapered portion 440 in the first direction y. The fourth tapered portion 440 is inclined with respect to the fourth tip surface 441 in plan view. In this embodiment, the fourth tapered portion 440 is a flat surface. Alternatively, the fourth chamfered portion 442 may be a convex curved surface in plan view.

[0069] 6 and 8, the fourth side surface 443 is connected to the fourth tip surface 441 and the fourth back surface 444. The fourth side surface 443 is located on the opposite side of the fourth tip surface 441 from the fourth chamfered portion 442 in the first direction y. The fourth side surface 443 is flat and faces the other side in the first direction y. The fourth side surface 443 is approximately perpendicular to the fourth tip surface 441.

[0070] 6, 8, and 13, the fourth back surface 444 faces downward in the thickness direction z. The fourth back surface 444 is exposed from the resin back surface 22 and is flush with the resin back surface 22.

[0071] 13, each of the multiple fourth lateral exposed portions 44 further includes a fourth lateral recess 446. The fourth lateral recess 446 is recessed from the fourth back surface 444 and connects to the fourth tip surface 441. The fourth lateral recess 446 connects to the fourth resin recess 244. The surface of the fourth lateral recess 446 is flush with the surface of the fourth resin recess 244. As shown in FIGS. 6, 8, and 13, the fourth lateral recess 446 has a fourth inner end surface 446a and a fourth connecting surface 446b.

[0072] 13, the fourth inner end surface 446a faces the same direction as the fourth tip surface 441 and is substantially parallel to the fourth tip surface 441. In a plan view, the fourth inner end surface 446a is located more inward of the electronic device A1 than the fourth tip surface 441 (on one side in the second direction x, closer to the electronic component 1 in the second direction x). The fourth inner end surface 446a is connected to the fourth back surface 444. The fourth inner end surface 446a is flat. The fourth inner end surface 446a is flush with the fourth wall surface 244a.

[0073] As shown in Fig. 13, the fourth connecting surface 446b is connected to the fourth inner end surface 446a and the fourth tip surface 441. In the example shown in Fig. 13, the fourth connecting surface 446b is flat and faces downward in the thickness direction z. Unlike the example shown in Fig. 13, the fourth connecting surface 446b may be curved in a concave shape. The fourth connecting surface 446b is flush with the fourth bottom surface 244b.

[0074] In each of the multiple fourth lateral exposed portions 44, tin plating is applied to the fourth back surface 444 and the surfaces (fourth inner end surfaces 446a and fourth connecting surfaces 446b) of the fourth lateral recesses 446. Note that instead of tin plating, multiple metal platings, for example, nickel, palladium, and gold stacked in this order, may be used.

[0075] As shown in FIGS. 3 and 4 , the first corner exposed portion 51, the second corner exposed portion 52, the third corner exposed portion 53, and the fourth corner exposed portion 54 are arranged near the four corners of the resin member 2 in a plan view. The first corner exposed portion 51, the second corner exposed portion 52, the third corner exposed portion 53, and the fourth corner exposed portion 54 are each formed on each of the sixth leads 36. In this embodiment, none of the first corner exposed portion 51, the second corner exposed portion 52, the third corner exposed portion 53, and the fourth corner exposed portion 54 is electrically connected to the electronic component 1. Alternatively, at least one of the first corner exposed portion 51, the second corner exposed portion 52, the third corner exposed portion 53, and the fourth corner exposed portion 54 may be electrically connected to the electronic component 1.

[0076] 3 and 4, the first corner exposed portion 51 and the second corner exposed portion 52 are arranged on opposite sides of the plurality of first lateral exposed portions 41. As shown in FIGS. 3 and 4, the first corner exposed portion 51 is arranged on one side of the plurality of first lateral exposed portions 41 in the second direction x, and the second corner exposed portion 52 is arranged on the other side of the plurality of first lateral exposed portions 41 in the second direction x.

[0077] 4 and 5, the first corner exposed portion 51 is exposed from the resin back surface 22 and also from each of the first resin side surface 231 and the third resin side surface 233. As shown in FIGS. 5, 10, and 11, the first corner exposed portion 51 has two end faces 511, 512, two side faces 513, 514, a chamfered portion 515, a back surface 516, and two recesses 517, 518.

[0078] The two end faces 511, 512 are each exposed from the resin member 2. The two end faces 511, 512 are each flat. The end face 511 faces the same direction as the first resin side face 231 and is flush with the first resin side face 231. The end face 512 faces the same direction as the third resin side face 233 and is flush with the third resin side face 233.

[0079] The two side surfaces 513, 514 are each covered with the resin member 2. The side surface 513 faces the opposite side to the end surface 511 in the first direction y. The side surface 513 is connected to the end surface 512. The side surface 513 faces the multiple third lateral exposed portions 43. The side surface 514 faces the opposite side to the end surface 512 in the second direction x. The side surface 514 is connected to the end surface 511. The side surface 514 faces the multiple first lateral exposed portions 41.

[0080] Chamfered portion 515 is connected to end surface 511 and end surface 512. Chamfered portion 515 is a flat surface. In a plan view, chamfered portion 515 is inclined with respect to each of end surface 511 and end surface 512. Chamfered portion 515 is covered with resin member 2.

[0081] The back surface 516 faces downward in the thickness direction z. The back surface 516 is exposed from the resin back surface 22 and is flush with the resin back surface 22. The back surface 516 is connected to two side surfaces 513 and 514 and two recesses 517 and 518.

[0082] The recess 517 is recessed from the back surface 516 and connected to the end surface 511. The surface of the recess 517 is flush with the surface of the first resin recess 241 of the resin member 2. The recess 517 has a recess side surface 517a and a recess bottom surface 517b. The recess side surface 517a is connected to the back surface 516. The recess side surface 517a is flat. The recess side surface 517a faces the same direction as the end surface 511. In a plan view, the recess side surface 517a is located more inward of the electronic device A1 than the end surface 511 (on the other side in the first direction y). The recess side surface 517a is flush with the first wall surface 241a of the first resin recess 241. The recess bottom surface 517b is connected to the end surface 511 and the recess side surface 517a. In this embodiment, the recess bottom surface 517b is flat and faces downward in the thickness direction z. The recess bottom surface 517b is flush with the first bottom surface 241b of the first resin recess 241.

[0083] The recess 518 is recessed from the back surface 516 and connected to the end surface 512. The surface of the recess 518 is flush with the surface of the third resin recess 243 of the resin member 2. The recess 518 has a recess side surface 518a and a recess bottom surface 518b. The recess side surface 518a is connected to the back surface 516. The recess side surface 518a is flat. The recess side surface 518a faces the same direction as the end surface 512. In a plan view, the recess side surface 518a is located more inward of the electronic device A1 than the end surface 512 (on the other side in the second direction x). The recess side surface 518a is flush with the third wall surface 243a of the third resin recess 243. The recess bottom surface 518b is connected to the end surface 512 and the recess side surface 518a. In this embodiment, the recess bottom surface 518b is flat and faces downward in the thickness direction z. The recess bottom surface 518b is flush with the third bottom surface 243b of the third resin recess 243.

[0084] In first corner exposed portion 51, back surface 516, surfaces of recess 517 (recess side surface 517a and recess bottom surface 517b), and surfaces of recess 518 (recess side surface 518a and recess bottom surface 518b) are tin-plated. Note that instead of tin plating, multiple metal platings, for example, nickel, palladium, and gold stacked in this order, may be used.

[0085] 4 and 6, second corner exposed portion 52 is exposed from resin back surface 22 and also from first resin side surface 231 and fourth resin side surface 234. As shown in FIGS. 4, 6, 10, and 12, second corner exposed portion 52 has two end faces 521, 522, two side faces 523, 524, two chamfered portions 525A, 525B, a back surface 526, and two recesses 527, 528.

[0086] Two end faces 521, 522 are each exposed from the resin member 2. End face 521 is flat. End face 521 faces the same direction as first resin side face 231 and is flush with first resin side face 231. End face 522 is flat. End face 522 faces the same direction as fourth resin side face 234 and is flush with fourth resin side face 234.

[0087] The two side surfaces 523, 524 are each covered with the resin member 2. The side surface 523 faces the opposite side to the end surface 521 in the first direction y. The side surface 523 is connected to the end surface 522. The side surface 523 faces the multiple fourth lateral exposed portions 44. The side surface 524 faces the opposite side to the end surface 522 in the second direction x. The side surface 524 faces the multiple first lateral exposed portions 41.

[0088] Chamfered portion 525A is connected to each of two end faces 521, 522. Chamfered portion 525A is a flat surface. Chamfered portion 525A is inclined with respect to both of two end faces 521, 522 in a plan view. Chamfered portion 525A is covered with resin member 2.

[0089] Chamfered portion 525B connects to end face 521 and side face 524. Chamfered portion 525B is a flat surface. Chamfered portion 525B is inclined with respect to both end face 521 and side face 524 in a plan view. Chamfered portion 525B is covered with resin member 2.

[0090] The back surface 526 faces downward in the thickness direction z. The back surface 526 is exposed from the resin back surface 22 and is flush with the resin back surface 22. The back surface 526 is connected to two side surfaces 523, 524 and two recesses 527, 528.

[0091] The recess 527 is recessed from the back surface 526 and connected to the end surface 521. The recess 527 is flush with the first resin recess 241 of the resin member 2. The recess 527 has a recess side surface 527a and a recess bottom surface 527b. The recess side surface 527a is connected to the back surface 526. The recess side surface 527a is flat. The recess side surface 527a faces the same direction as the end surface 521. In a plan view, the recess side surface 527a is located more inward of the electronic device A1 than the end surface 521 (on the other side in the first direction y). The recess side surface 527a is flush with the first wall surface 241a of the first resin recess 241. The recess bottom surface 527b is connected to the end surface 521 and the recess side surface 527a. In this embodiment, the recess bottom surface 527b is flat and faces downward in the thickness direction z. The recess bottom surface 527b is flush with the second bottom surface 242b of the first resin recess 241.

[0092] The recess 528 is recessed from the back surface 526 and is connected to the end surface 522. The surface of the recess 528 is flush with the surface of the fourth resin recess 244 of the resin member 2. The recess 528 has a recess side surface 528a and a recess bottom surface 528b. The recess side surface 528a is connected to the back surface 526. The recess side surface 528a is flat. The recess side surface 528a faces the same direction as the end surface 522. In a plan view, the recess side surface 528a is located more inward of the electronic device A1 than the end surface 522 (on one side in the second direction x). The recess side surface 528a is flush with the fourth wall surface 244a of the fourth resin recess 244. The recess bottom surface 528b is connected to the end surface 522 and the recess side surface 528a. In this embodiment, the recess bottom surface 528b is flat and faces downward in the thickness direction z. The recess bottom surface 528b is flush with the fourth bottom surface 244b of the fourth resin recess portion 244.

[0093] In second exposed corner portion 52, end face 522, the surfaces of recess 527 (recess side surface 527a and recess bottom surface 527b), and the surfaces of recess 528 (recess side surface 528a and recess bottom surface 528b) are tin-plated. Note that instead of tin plating, multiple metal platings, for example, nickel, palladium, and gold stacked in this order, may be used.

[0094] 3 and 4, the third corner exposed portion 53 and the fourth corner exposed portion 54 are arranged on opposite sides of the second direction x with the plurality of second lateral exposed portions 42 interposed therebetween. As shown in FIGS. 3 and 4, the third corner exposed portion 53 is arranged on one side of the plurality of second lateral exposed portions 42 in the second direction x, and the fourth corner exposed portion 54 is arranged on the other side of the plurality of second lateral exposed portions 42 in the second direction x.

[0095] 4 and 7, third corner exposed portion 53 is exposed from resin back surface 22 and also from each of second resin side surface 232 and fourth resin side surface 234. As shown in FIGS. 4, 7, 9, and 11, third corner exposed portion 53 has two end faces 531, 532, two side faces 533, 534, two chamfered portions 535A, 535B, a back surface 536, and two recesses 537, 538.

[0096] The two end faces 531, 532 are each exposed from the resin member 2. The two end faces 531, 532 are each flat. The end face 531 faces the same direction as the second resin side face 232 and is flush with the second resin side face 232. The end face 532 faces the same direction as the third resin side face 233 and is flush with the third resin side face 233.

[0097] The two side surfaces 533, 534 are each covered with the resin member 2. The two side surfaces 533, 534 are each flat. The two side surfaces 533, 534 are perpendicular to each other. The side surface 533 faces the opposite side to the end surface 531 in the first direction y. The side surface 533 faces the multiple third lateral exposed portions 43. The side surface 534 faces the opposite side to the end surface 532 in the second direction x. The side surface 534 faces the multiple second lateral exposed portions 42.

[0098] The chamfered portion 535A is connected to the two end faces 531, 532. The chamfered portion 535A is a flat surface. In a plan view, the chamfered portion 535A is inclined with respect to both of the two end faces 531, 532. The chamfered portion 535A is covered with the resin member 2.

[0099] Chamfered portion 535B connects to end face 532 and side face 533. Chamfered portion 535B is a flat surface. Chamfered portion 535B is inclined with respect to both end face 532 and side face 533 in a plan view. Chamfered portion 535B is covered with resin member 2.

[0100] The back surface 536 faces downward in the thickness direction z. The back surface 536 is exposed from the resin back surface 22 and is flush with the resin back surface 22. The back surface 536 is connected to two side surfaces 533, 534 and two recesses 537, 538.

[0101] The recess 537 is recessed from the back surface 536 and connected to the end surface 531. The surface of the recess 537 is flush with the surface of the second resin recess 242 of the resin member 2. The recess 537 has a recess side surface 537a and a recess bottom surface 537b. The recess side surface 537a is connected to the back surface 536. The recess side surface 537a is flat. The recess side surface 537a faces the same direction as the end surface 531. In a plan view, the recess side surface 537a is located more inward of the electronic device A1 than the end surface 531 (on one side in the first direction y). The recess side surface 537a is flush with the second wall surface 242a of the second resin recess 242. The recess bottom surface 537b is connected to the end surface 531 and the recess side surface 537a. In this embodiment, the recess bottom surface 537b is flat and faces downward in the thickness direction z. The recess bottom surface 537b is flush with the second bottom surface 242b of the second resin recess 242.

[0102] The recess 538 is recessed from the back surface 536 and is connected to the end surface 532. The surface of the recess 538 is flush with the surface of the third resin recess 243 of the resin member 2. The recess 538 has a recess side surface 538a and a recess bottom surface 538b. The recess side surface 538a is connected to the back surface 536. The recess side surface 538a is flat. The recess side surface 538a faces the same direction as the end surface 532. In a plan view, the recess side surface 538a is located more inward of the electronic device A1 than the end surface 532 (on the other side in the second direction x). The recess side surface 538a is flush with the third wall surface 243a of the third resin recess 243. The recess bottom surface 538b is connected to the end surface 532 and the recess side surface 538a. In this embodiment, the recess bottom surface 538b is flat and faces downward in the thickness direction z. The recess bottom surface 538b is flush with the third bottom surface 243b of the third resin recess 243.

[0103] In third corner exposed portion 53, back surface 536, surfaces of recess 537 (recess side surface 537a and recess bottom surface 537b), and surfaces of recess 538 (recess side surface 538a and recess bottom surface 538b) are tin-plated. Note that instead of tin plating, multiple metal platings, for example, nickel, palladium, and gold stacked in this order, may be used.

[0104] 4 and 8, the fourth corner exposed portion 54 is exposed from the resin back surface 22 and also from each of the second resin side surface 232 and the fourth resin side surface 234. As shown in FIGS. 4, 8, 9, and 12, the fourth corner exposed portion 54 has two end faces 541, 542, two side faces 543, 544, two chamfered portions 545A, 545B, a back surface 546, and two recesses 547, 548.

[0105] The two end faces 541, 542 are each exposed from the resin member 2. The two end faces 541, 542 are each flat. The end face 541 faces the same direction as the second resin side face 232 and is flush with the second resin side face 232. The end face 542 faces the same direction as the fourth resin side face 234 and is flush with the fourth resin side face 234.

[0106] The two side surfaces 543, 544 are each covered with the resin member 2. The side surface 543 faces the opposite side to the end surface 541 in the first direction y. The side surface 543 faces the multiple fourth lateral exposed portions 44. The side surface 544 faces the opposite side to the end surface 542 in the second direction x. The side surface 544 faces the multiple second lateral exposed portions 42. The two side surfaces 543, 544 are perpendicular to each other.

[0107] Chamfered portion 545A is connected to end face 541 and side face 544. Chamfered portion 545A is a flat surface. Chamfered portion 545A is inclined with respect to both end face 541 and side face 544 in a plan view. Chamfered portion 545A is covered with resin member 2.

[0108] Chamfered portion 545B is connected to end face 542 and side face 543. Chamfered portion 545B is a flat surface. Chamfered portion 545B is inclined with respect to both end face 542 and side face 543 in a plan view. Chamfered portion 545B is covered with resin member 2.

[0109] The back surface 546 faces downward in the thickness direction z. The back surface 546 is exposed from the resin back surface 22 and is flush with the resin back surface 22. The back surface 546 is connected to two side surfaces 543, 544 and two recesses 547, 548.

[0110] The recess 547 is recessed from the back surface 546 and connected to the end surface 541. The surface of the recess 547 is flush with the surface of the second resin recess 242 of the resin member 2. The recess 547 has a recess side surface 547a and a recess bottom surface 547b. The recess side surface 547a is connected to the back surface 546. The recess side surface 547a is flat. The recess side surface 547a faces the same direction as the end surface 541. In a plan view, the recess side surface 547a is located more inward of the electronic device A1 than the end surface 541 (on one side in the first direction y). The recess side surface 547a is flush with the second wall surface 242a of the second resin recess 242. The recess bottom surface 547b is connected to the end surface 541 and the recess side surface 547a. In this embodiment, the recess bottom surface 547b is flat and faces downward in the thickness direction z. The recess bottom surface 547b is flush with the second bottom surface 242b of the second resin recess 242.

[0111] The recess 548 is recessed from the back surface 546 and is connected to the end surface 542. The surface of the recess 548 is flush with the surface of the fourth resin recess 244 of the resin member 2. The recess 548 has a recess side surface 548a and a recess bottom surface 548b. The recess side surface 548a is connected to the back surface 546. The recess side surface 548a is flat. The recess side surface 548a faces the same direction as the end surface 542. In a plan view, the recess side surface 548a is located more inward of the electronic device A1 than the end surface 542 (on one side in the second direction x). The recess side surface 548a is flush with the fourth wall surface 244a of the fourth resin recess 244. The recess bottom surface 548b is connected to the end surface 542 and the recess side surface 548a. In this embodiment, the recess bottom surface 548b is flat and faces downward in the thickness direction z. The recess bottom surface 548b is flush with the fourth bottom surface 244b of the fourth resin recess 244.

[0112] In fourth corner exposed portion 54, back surface 546, surfaces of recess 547 (recess side surface 547a and recess bottom surface 547b), and surfaces of recess 548 (recess side surface 548a and recess bottom surface 548b) are tin-plated. Note that instead of tin plating, multiple metal platings, for example, nickel, palladium, and gold stacked in this order, may be used.

[0113] 4, each of the multiple exposed back surfaces 61 is not exposed from any of the first resin side surface 231, the second resin side surface 232, the third resin side surface 233, and the fourth resin side surface 234, but is exposed only from the resin back surface 22. The multiple exposed back surfaces 61 are formed on each of the multiple second leads 32.

[0114] 4 and 15, each of the multiple rear surface exposed portions 61 has a rear surface 611. The rear surface 611 faces downward in the thickness direction z. The rear surface 611 is exposed from the resin rear surface 22 and is flush with the resin rear surface 22.

[0115] Next, a method for manufacturing the electronic device A1 will be described with reference to Figures 18 to 25. Figures 18, 19, 21, 22, and 24 are bottom views of a main part showing one step in the method for manufacturing the electronic device A1. Figures 20, 23, and 25 are cross-sectional views of a main part showing one step in the method for manufacturing the electronic device A1, and correspond to the cross section of the electronic device A1 shown in Figure 14.

[0116] First, a lead frame 30 shown in FIG. 18 is prepared. The lead frame 30 is large enough to accommodate multiple electronic devices A1. FIG. 18 shows an enlarged view of a portion of the lead frame 30 corresponding to four electronic devices A1. The lead frame 30 is formed by cutting out and etching a flat plate containing copper or a copper alloy as a constituent material. The lead frame 30 has portions that will later become multiple leads 3, and the multiple leads 3 are connected to each other via a frame portion 301. Appropriate notches 302 are formed in the portions where adjacent leads 3 are connected. In the example shown in FIG. 18, the notches 302 are trapezoidal in plan view. For example, the notches 302 are formed on one side in the second direction x in the portions where first leads 31 adjacent to each other in the first direction y are connected, the portions where second leads 32 adjacent to each other in the first direction y are connected, and the portions where fourth leads 34 adjacent to each other in the first direction y are connected. Furthermore, a notch 302 is formed on one side in the first direction y at a portion where each third lead 33 and fifth lead 35 adjacent in the second direction x are connected. In addition, appropriate notches 302 are formed at a portion where sixth leads 36 adjacent in the first direction y are connected and at a portion where sixth leads 36 adjacent in the second direction x are connected. The shape of the lead frame 30 (particularly the frame portion 301) is not limited to the example shown in FIG.

[0117] 19 and 20, electronic component 1 is mounted on lead frame 30, and then resin member 2 is formed. Resin member 2 is formed by, for example, molding. Resin member 2 covers electronic component 1 and also partially covers lead frame 30. As shown in FIGS. 19 and 20, part of lead frame 30 is exposed from resin back surface 22.

[0118] Next, half-cut dicing is performed as shown in FIG. 21. In FIG. 21, the areas to be half-cut diced are indicated by dots. In half-cut dicing, a dicing blade is moved in the direction indicated by the arrow in FIG. 21 (first dicing direction). In the first dicing direction along the first direction y, the dicing blade moves from the other side of the first direction y toward one side of the first direction y (i.e., from the side where the notches 302 are not formed toward the side where the notches 302 are formed). In addition, in the first dicing direction along the second direction x, the dicing blade moves from the other side of the second direction x toward one side of the second direction x (i.e., from the side where the notches 302 are not formed toward the side where the notches 302 are formed). By performing half-cut dicing, grooves 91 having a grid shape in plan view are formed across the resin member 2 and the lead frame 30, as shown in FIGS. 22 and 23. After half-cut dicing, metal burrs may be removed as needed.

[0119] Next, plating is performed on the resin rear surface 22 and the surface of the lead frame 30 exposed from the groove 91. In this embodiment, for example, tin plating is formed.

[0120] Next, as shown in FIGS. 24 and 25, the electronic components 1 are separated by full-cut dicing (cutting). In FIG. 24, the areas to be full-cut diced are indicated by dots. In full-cut dicing, a dicing blade is moved in the direction indicated by the arrow in FIG. 24 (second dicing direction), for example. In the second dicing direction along the first direction y, the dicing blade moves from the other side of the first direction y to one side of the first direction y (i.e., the direction from the side where the notches 302 are not formed to the side where the notches 302 are formed). In the second dicing direction along the second direction x, the dicing blade moves from the other side of the second direction x to one side of the second direction x (i.e., the direction from the side where the notches 302 are not formed to the side where the notches 302 are formed). A dicing blade used in full-cut dicing is thinner than a dicing blade used in half-cut dicing.

[0121] 1 to 17 are manufactured through the above steps. The manufacturing method of the electronic device A1 described above is an example, and the present invention is not limited to the above example.

[0122] The functions and effects of the electronic device A1 are as follows.

[0123] The electronic device A1 includes a plurality of first lateral exposed portions 41. The plurality of first lateral exposed portions 41 are arranged along the first resin side surface 231 and each is exposed from the first resin side surface 231. Each of the plurality of first lateral exposed portions 41 includes a first tapered portion 410 that tapers toward the first resin side surface 231 when viewed in the thickness direction z. The first tapered portion 410 faces the same direction as the first resin side surface 231 in the first direction y and has a first end surface 411 that is flush with the first resin side surface 231. The first end surface 411 is formed during singulation in the manufacturing process of the electronic device A1. With this configuration, the distance between the first end surfaces 411 of the first lateral exposed portions 41 adjacent to each other in the second direction x is greater than when the first tapered portion 410 is not formed. As a result, even if metal burrs are generated during the manufacturing of the electronic device A1 (singling by the full-cut dicing), the electronic device A1 can suppress short-circuiting between the multiple first lateral exposed portions 41. Therefore, compared to a configuration in which the first tapered portion 410 is not formed in each first lateral exposed portion 41, the electronic device A1 can reduce the spacing between adjacent leads 3 while suppressing short-circuiting between the multiple first lateral exposed portions 41. In other words, the electronic device A1 can be miniaturized while suppressing short-circuiting between adjacent leads 3. Furthermore, since the first tapered portion 410 is formed in each first lateral exposed portion 41, the area over which the leads 3 (each first lateral exposed portion 41) are cut is small during full-cut dicing. Therefore, even if metal burrs are generated, the size (length) of the metal burrs can be reduced.

[0124] The electronic device A1 includes a plurality of second lateral exposed portions 42. The plurality of second lateral exposed portions 42 are arranged along the second resin side surface 232 and each is exposed from the second resin side surface 232. Each of the plurality of second lateral exposed portions 42 includes a second tapered portion 420 that tapers toward the second resin side surface 232 when viewed in the thickness direction z. The second tapered portion 420 faces the same direction as the second resin side surface 232 in the first direction y and has a second end surface 421 that is flush with the second resin side surface 232. Note that the second end surface 421 is formed during singulation in the manufacturing process of the electronic device A1. With this configuration, the electronic device A1 can reduce short-circuiting between the plurality of second lateral exposed portions 42 while reducing the spacing between adjacent leads 3, as compared to a configuration in which the second tapered portion 420 is not formed in each second lateral exposed portion 42, similar to the first lateral exposed portion 41. That is, the electronic device A1 can be miniaturized while suppressing short circuits between adjacent leads 3. Also, short circuits between the leads 3 can be suppressed on both the first resin side surface 231 and the second resin side surface 232 that are spaced apart in the first direction y. Furthermore, since the second tapered portion 420 is formed in each second lateral exposed portion 42, the area over which the leads 3 (each second lateral exposed portion 42) are cut during full-cut dicing is small. Therefore, even if metal burrs are generated, the size (length) of the metal burrs can be reduced.

[0125] The electronic device A1 includes a plurality of third lateral exposed portions 43 arranged along the third resin side surface 233, and each third lateral exposed portion 43 includes a third tapered portion 430 tapered toward the third resin side surface 233 in a plan view. With this configuration, the electronic device A1 can reduce the spacing between adjacent leads 3 while suppressing short-circuiting between the plurality of third lateral exposed portions 43, compared to a configuration in which the third tapered portion 430 is not formed in each third lateral exposed portion 43, as is the case with the first lateral exposed portion 41 and the second lateral exposed portion 42. In other words, the electronic device A1 can be miniaturized while suppressing short-circuiting between adjacent leads 3. Furthermore, because the third tapered portion 430 is formed in each third lateral exposed portion 43, the area over which the leads 3 (each third lateral exposed portion 43) are cut is small during full-cut dicing. Therefore, even if metal burrs are generated, the size (length) of the metal burrs can be reduced.

[0126] The electronic device A1 includes a plurality of fourth lateral exposed portions 44 arranged along the fourth resin side surface 234, and each fourth lateral exposed portion 44 includes a fourth tapered portion 440 tapering toward the fourth resin side surface 234 in a plan view. With this configuration, the electronic device A1 can reduce the spacing between adjacent leads 3 while suppressing short circuits between the plurality of fourth lateral exposed portions 44, compared to a configuration in which the fourth tapered portion 440 is not formed in each fourth lateral exposed portion 44, as is the case with the first lateral exposed portion 41 and the second lateral exposed portion 42. In other words, the electronic device A1 can be miniaturized while suppressing short circuits between adjacent leads 3. Furthermore, because the fourth tapered portion 440 is formed in each fourth lateral exposed portion 44, the area over which the leads 3 (each fourth lateral exposed portion 44) are cut is small during full-cut dicing. Therefore, even if metal burrs are generated, the size (length) of the metal burrs can be reduced.

[0127] In the electronic device A1, the first tapered portion 410 includes a first tip surface 411 and a first chamfered portion 412. The first chamfered portion 412 is located on one side of the first tip surface 411 in the second direction x. The second tapered portion 420 includes a second tip surface 421 and a second chamfered portion 422. The second chamfered portion 422 is located on one side of the second tip surface 421 in the second direction x. Metal burrs that may be generated during the manufacturing of the electronic device A1 (singling by the full-cut dicing described above) often protrude in the second dicing direction during the full-cut dicing. Therefore, in the electronic device A1, the first chamfered portion 412 is formed on each first lateral exposed portion 41 on the forward side of the second dicing direction along the second direction x. Furthermore, in each second lateral exposed portion 42, a second chamfered portion 422 is formed on the forward side in the progression direction of the second dicing direction along the second direction x. As a result, in the electronic device A1, by forming each first tapered portion 410 and each second tapered portion 420 in consideration of the second dicing direction, it is possible to prevent both short-circuiting between adjacent first lateral exposed portions 41 and short-circuiting between adjacent second lateral exposed portions 42. The same applies to the third chamfered portion 432 included in the third tapered portion 430 and the fourth chamfered portion 442 included in the fourth tapered portion 440.

[0128] Next, electronic devices A2 to A4 according to modifications of the first embodiment will be described.

[0129] 26 to 29 show an electronic device A2 according to a first modified example of the first embodiment. As shown in the figures, the electronic device A2 differs from the electronic device A1 in the following respects. First, the resin member 2 does not have the first resin recess 241, the second resin recess 242, the third resin recess 243, or the fourth resin recess 244. Second, each of the first lateral exposed portions 41A and 41C does not include the first lateral recess 416. Third, each of the second lateral exposed portions 42A and 42C does not include the second lateral recess 426. Fourth, each of the third lateral exposed portions 43 does not include the third lateral recess 436. Fifth, each of the fourth lateral exposed portions 44 does not include the fourth lateral recess 446.

[0130] The electronic device A2 shown in FIGS. 26 to 29 can be manufactured by, for example, not performing half-cut dicing in the manufacturing method of the electronic device A1.

[0131] In the electronic device A2, similar to the electronic device A1, it is possible to reduce the size while preventing short circuits between adjacent leads 3.

[0132] FIG. 30 shows an electronic device A3 according to a second modified example of the first embodiment. As shown in FIG. 30, the electronic device A3 differs from the electronic device A1 in the following respects. First, the first tapered portions 410 of the multiple first lateral exposed portions 41 are formed on one side in the first direction y of the first wall surface 241a of the first resin recess 241. Second, the second tapered portions 420 of the multiple second lateral exposed portions 42 are formed on the other side in the first direction y of the second wall surface 242a of the second resin recess 242. Third, the third tapered portions 430 of the multiple third lateral exposed portions 43 are formed on one side in the second direction x of the third wall surface 243a of the third resin recess 243. Fourth, the fourth tapered portions 440 of the multiple fourth lateral exposed portions 44 are formed on the other side in the second direction x of the fourth wall surface 244a of the fourth resin recess 244.

[0133] As with electronic device A1, electronic device A3 can be miniaturized while suppressing short circuits between adjacent leads 3. Furthermore, in electronic device A3, the area of ​​the portions of each of first side exposed portions 41, second side exposed portions 42, third side exposed portions 43, and fourth side exposed portions 44 that are exposed from resin back surface 22 can be increased, thereby increasing the mounting strength to a circuit board of an electronic device or the like.

[0134] 31 and 32 show an electronic device A4 according to a third modified example of the first embodiment. FIGS. 31 and 32 are bottom views of essential parts of the electronic device A4. As shown in FIGS. 31 and 32, the electronic device A4 differs from the electronic device A1 in the following respects. First, as shown in FIG. 31, in at least one of the multiple first lateral exposed portions 41, the first tapered portion 410 further includes a first protrusion 415. Second, as shown in FIG. 32, in at least one of the multiple second lateral exposed portions 42, the second tapered portion 420 further includes a second protrusion 425. Third, as shown in FIG. 31, in at least one of the multiple third lateral exposed portions 43, the third tapered portion 430 further includes a third protrusion 435. Fourth, as shown in FIG. 32, in at least one of the multiple fourth lateral exposed portions 44, the fourth tapered portion 440 further includes a fourth protrusion 445.

[0135] As shown in FIG. 31 , the first protrusion 415 is connected to the first tip surface 411 and the first chamfered portion 412. In plan view, the first protrusion 415 protrudes to one side in the second direction x (toward the direction of the second dicing direction along the second direction x). As shown in FIG. 32 , the second protrusion 425 is connected to the second tip surface 421 and the second chamfered portion 422. In plan view, the second protrusion 425 protrudes to one side in the second direction x (toward the direction of the second dicing direction along the second direction x). As shown in FIG. 31 , the third protrusion 435 is connected to the third tip surface 431 and the third chamfered portion 432. In plan view, the third protrusion 435 protrudes to one side in the first direction y (toward the direction of the second dicing direction along the first direction y). 32, the fourth protrusion 445 is connected to the fourth tip surface 441 and the fourth chamfered portion 442. The fourth protrusion 445 protrudes to one side in the first direction y (toward the progressing direction of the second dicing direction in the first direction y) in plan view.

[0136] The first protrusion 415, the second protrusion 425, the third protrusion 435, and the fourth protrusion 445 are each metal burrs that are unintentionally formed during the manufacturing of the electronic device A1 (singling by the full-cut dicing described above). The first protrusion 415, the second protrusion 425, the third protrusion 435, and the fourth protrusion 445 do not need to have the same shape. Furthermore, the electronic device A4 is not limited to having all of the first protrusion 415, the second protrusion 425, the third protrusion 435, and the fourth protrusion 445, and may have at least one or more of them.

[0137] As with the electronic device A1, the electronic device A4 can be miniaturized while suppressing short circuits between adjacent leads 3. Furthermore, the electronic device A4 can ensure the distance between the cut portions of each lead 3 by using the first tapered portion 410, the second tapered portion 420, the third tapered portion 430, and the fourth tapered portion 440. That is, even if the electronic device A4 has the first protrusion 415, the second protrusion 425, the third protrusion 435, and the fourth protrusion 445, which are metal burrs that may be generated during cutting, the electronic device A4 can suppress short circuits between the leads 3. Therefore, there is no need to perform a process to remove the metal burrs after singulation by the full-cut dicing, which simplifies the manufacturing process and reduces manufacturing costs.

[0138] 33 shows an electronic device A5 according to a fourth modified example of the first embodiment. As shown in FIG. 33, the electronic device A5 differs from the electronic device A1 in the following respects. First, in the first tapered portion 410 of each first lateral exposed portion 41, the first chamfered portion 412 is located on the other side in the second direction x with respect to the first end face 411, rather than on one side in the second direction x. Second, in the fourth tapered portion 440 of each fourth lateral exposed portion 44, the fourth chamfered portion 442 is located on the other side in the first direction y with respect to the fourth end face 441, rather than on one side in the first direction y.

[0139] In the electronic device A5, the second dicing direction along the second direction x when cutting each first lateral exposed portion 41 preferably extends from one side in the second direction x to the other side in the second direction x. Furthermore, the second dicing direction along the first direction y when cutting each fourth lateral exposed portion 44 preferably extends from one side in the first direction y to the other side in the first direction y. Note that in the example shown in FIG. 33, the shapes (positions of the chamfers) of the first corner exposed portion 51, the second corner exposed portion 52, the third corner exposed portion 53, and the fourth corner exposed portion 54 have been appropriately modified in consideration of this second dicing direction.

[0140] In the electronic device A5, similarly to the electronic device A1, it is possible to suppress short circuits between adjacent leads 3 and achieve miniaturization.

[0141] In the first embodiment and its modified examples described above, no other leads 3 are arranged on one side of the first corner exposed portion 51 in the second direction x and one side of the first direction y. Therefore, even if metal burrs are generated on the first corner exposed portion 51 due to the dicing by the full-cut dicing, there is a low possibility of short-circuiting to other leads 3. Therefore, as shown in FIG. 34 , the first corner exposed portion 51 does not need to have a chamfered portion 515. Furthermore, no other leads 3 are arranged on one side of the second corner exposed portion 52 in the first direction y. Therefore, as shown in FIG. 34 , the second corner exposed portion 52 does not need to have a chamfered portion 525B. Similarly, no other leads 3 are arranged on one side of the third corner exposed portion 53 in the second direction x. Therefore, as shown in FIG. 34 , the third corner exposed portion 53 does not need to have a chamfered portion 535A. 34 , the first corner exposed portion 51 overlaps, in a plan view, a first resin corner portion 251 configured by the first resin side surface 231 and the third resin side surface 233. The third corner exposed portion 53 overlaps, in a plan view, a second resin corner portion 252 configured by the second resin side surface 232 and the third resin side surface 233. The second corner exposed portion 52 overlaps, in a plan view, a third resin corner portion 253 configured by the first resin side surface 231 and the fourth resin side surface 234, and the fourth corner exposed portion 54 overlaps, in a plan view, a fourth resin corner portion 254 configured by the second resin side surface 232 and the fourth resin side surface 234.

[0142] In the first embodiment and its modified examples described above, to prevent the first corner exposed portion 51, the second corner exposed portion 52, the third corner exposed portion 53, and the fourth corner exposed portion 54 from falling off the resin member 2, the first corner exposed portion 51 may be covered by the first resin corner portion 251, the second corner exposed portion 52 may be covered by the third resin corner portion 253, the third corner exposed portion 53 may be covered by the second resin corner portion 252, and the fourth corner exposed portion 54 may be covered by the fourth resin corner portion 254, as shown in FIG. 35 . In the electronic device shown in FIG. 35 , the fourth corner exposed portion 54 is provided with a chamfered portion 545C connecting the end surface 541 to the end surface 542, as compared to the fourth corner exposed portion 54 of the electronic device A1. Note that in the example shown in FIG. 35 , the second corner exposed portion 52 has a pair of chamfered portions 525A and 525B connecting to both sides of the end surface 521 in the second direction x. In the example shown in FIG. 35, end face 521 corresponds to the "first end face" set forth in the claims, and each of chamfered portions 525A and 525B corresponds to the "third chamfered portion" set forth in the claims. Furthermore, fourth corner exposed portion 54 has a pair of chamfered portions 545A and 545C connected to both sides of end face 541 in the second direction x. In the example shown in FIG. 35, end face 541 corresponds to the "second end face" set forth in the claims, and each of chamfered portions 545A and 545C corresponds to the "fourth chamfered portion" set forth in the claims.

[0143] In the first embodiment and its modified examples described above, the first tapered portion 410 is provided on all of the multiple first lateral exposed portions 41. However, it is not necessary to provide the first tapered portion 410 on all of the multiple first lateral exposed portions 41. FIG. 36 is a bottom view showing an electronic device according to such a modified example. In the example shown in FIG. 36, the distance d1 between the first lateral exposed portion 41A and the first lateral exposed portion 41B adjacent to each other in the second direction x is small (for example, 200 μm or less), which may cause a short circuit between the first lateral exposed portion 41A and the first lateral exposed portion 41B. Therefore, the first tapered portion 410 is formed on each of the first lateral exposed portions 41A and 41B. On the other hand, the distance d1 between the first lateral exposed portions 41C adjacent to each other in the second direction x is large (for example, greater than 200 μm), which may reduce the risk of a short circuit between the first lateral exposed portions 41C. Therefore, as shown in FIG. 36 , the first tapered portion 410 may not be formed in each first lateral exposed portion 41C. As described above, the first tapered portion 410 may be provided only in those first lateral exposed portions 41 that are adjacent to each other in the second direction x, among the multiple first lateral exposed portions 41. This also applies to the second tapered portion 420 in the multiple second lateral exposed portions 42, the third tapered portion 430 in the multiple third lateral exposed portions 43, and the fourth tapered portion 440 in the multiple fourth lateral exposed portions 44. Note that, since each third lateral exposed portion 43 is formed on one fifth lead 35, there is no potential difference between the third lateral exposed portions 43 (no short circuit occurs even if directly conductive). Therefore, from an electrical standpoint, each third lateral exposed portion 43 may not have a third tapered portion 430, regardless of the size of the interval d3 therebetween (even if the interval d3 is small). In such a modification, first lateral exposed portion 41 without first tapered portion 410, second lateral exposed portion 42 without second tapered portion 420, third lateral exposed portion 43 without third tapered portion 430, and fourth lateral exposed portion 44 without fourth tapered portion 440 have a large area exposed from resin member 2, thereby increasing the bonding strength to a circuit board of an electronic device or the like. The same applies to the relationship between each of first corner exposed portion 51, second corner exposed portion 52, third corner exposed portion 53, and fourth corner exposed portion 54 and the other leads 3 adjacent thereto.

[0144] In the first embodiment and its modified examples, the first tapered portion 410 is formed in each first side exposed portion 41B. However, unlike this configuration, the first tapered portion 410 may not be formed in each first side exposed portion 41B. In the example, the second tapered portion 420 is formed in each second side exposed portion 42B. However, unlike this configuration, the second tapered portion 420 may not be formed in each second side exposed portion 42B. For example, FIG. 37 shows an electronic device according to such a modified example. The first side exposed portion 41B of each second lead 32 is not exposed from the first resin recess 241. In this configuration, metal burrs are less likely to be generated when singulating by the full-cut dicing. (In other words, the first side exposed portion 41A exposed from the first resin recess 241 is more likely to be generated when singulating by the full-cut dicing.) 37 can be miniaturized while suppressing short circuits between the leads 3, even without providing the first tapered portion 410 on each first side exposed portion 41B. Similarly, the second side exposed portion 42B of each second lead 32 is not exposed from the second resin recess 242. Therefore, the electronic device shown in FIG. 37 can be miniaturized while suppressing short circuits between the leads 3, even without providing the second tapered portion 420 on each second side exposed portion 42B.

[0145] In the first embodiment and its modified examples described above, the shape of each first tapered portion 410 is not limited to the illustrated example. For example, each first tapered portion 410 may have the shape shown in FIGS. 38 to 41 . The first tapered portion 410 shown in FIG. 38 includes a pair of first chamfered portions 412. The pair of first chamfered portions 412 are connected to both ends of the first distal end surface 411 in the second direction x. In the example shown in FIG. 38 , each of the pair of first chamfered portions 412 is a flat surface. In the first tapered portion 410 shown in FIG. 39 , the first chamfered portion 412 is a curved surface that is convex in plan view. The first tapered portion 410 shown in FIG. 40 includes a pair of first chamfered portions 412, similar to the example shown in FIG. 38 . However, unlike the example shown in FIG. 38 , each of the pair of first chamfered portions 412 is a curved surface that is convex in plan view. The first tapered portion 410 shown in FIG. 41 corresponds to the entire first lateral exposed portion 41. 41, the first side exposed portion 41 is formed of a first tapered portion 410. Although not shown in the drawings or in detail, the second tapered portion 420, the third tapered portion 430, and the fourth tapered portion 440 may each be formed in the same shape as each of the shapes shown in FIGS.

[0146] Second Embodiment 42 and 43 show an electronic device B1 according to the second embodiment. As shown in Fig. 42 and 43, the electronic device B1 differs from the electronic device A1 mainly in that the configuration of the multiple leads 3 is different and that the electronic device B1 further includes an island lead 37.

[0147] 42 and 43, in the electronic device B1, the multiple leads 3 include multiple first leads 31, multiple second leads 32, and multiple sixth leads 36. The multiple first leads 31 and some of the sixth leads 36 are located on one side of the island lead 37 in the first direction y, and the multiple second leads 32 and the remaining sixth leads 36 are located on the other side of the island lead 37 in the first direction y. The multiple leads 3 (the multiple first leads 31, the multiple second leads 32, and the multiple sixth leads 36) are arranged around the island lead 37 in a plan view.

[0148] The island lead 37 overlaps the electronic component 1 in a plan view. The island lead 37 includes an island portion 371 and a pair of extending portions 372. The island portion 371 overlaps the electronic component 1 in a plan view and is disposed approximately in the center of the electronic device B1. The pair of extending portions 372 extend in the second direction x from each edge of the island portion 371 in the second direction x. A portion of each of the pair of extending portions 372 on the side connected to the island portion 371 is covered with the resin member 2.

[0149] In the electronic device B1, the electronic component 1 has a plurality of electrodes 19. The plurality of electrodes 19 are arranged on the element main surface 10a. The plurality of electrodes 19 are appropriately bonded to a plurality of leads 3 (a plurality of first leads 31, a plurality of second leads 32, and a plurality of sixth leads 36) and an island lead 37, respectively.

[0150] In the electronic device B1, the multiple first side exposed portions 41 are formed on the multiple first leads 31, respectively. The multiple second side exposed portions 42 are formed on the multiple second leads 32, respectively. The third side exposed portion 43 and the fourth side exposed portion 44 are formed on the island lead 37 (each of the pair of extending portions 372).

[0151] In the electronic device B1, similarly to the electronic device A1, it is possible to suppress short circuits between adjacent leads 3 and achieve miniaturization.

[0152] Note that the electronic device B1 may adopt the configurations of the electronic devices A2 to A5 and other modified examples, as appropriate. For example, like the electronic device A2, the electronic device B1 may be configured without the first resin recess 241, the second resin recess 242, the third resin recess 243, and the fourth resin recess 244. Like the electronic device A3, the electronic device B1 may be configured such that the first tapered portion 410 is formed on one side of the first wall surface 241a in the first direction y. Furthermore, the second tapered portion 420, the third tapered portion 430, and the fourth tapered portion 440 may be formed on the other side of the second wall surface 242a in the first direction y, on one side of the third wall surface 243a in the second direction x, and on the other side of the fourth wall surface 244a in the second direction x, respectively. As with the electronic device A4, the electronic device B1 may be configured such that the first tapered portion 410 in at least one of the plurality of first lateral exposed portions 41 further includes a first protrusion 415. Furthermore, the electronic device B1 may be configured such that the second tapered portion 420 in at least one of the plurality of second lateral exposed portions 42 further includes a second protrusion 425, the electronic device B1 may be configured such that the third tapered portion 430 in at least one of the plurality of third lateral exposed portions 43 further includes a third protrusion 435, or the electronic device B1 may be configured such that the fourth tapered portion 440 in at least one of the plurality of fourth lateral exposed portions 44 further includes a fourth protrusion 445. As with electronic device A5, in electronic device B1, the first chamfered portion 412 in the first tapered portion 410 of each first lateral exposed portion 41 may be configured to be located on the other side of the second direction x relative to the first tip surface 411, or the fourth chamfered portion 442 in the fourth tapered portion 440 of each fourth lateral exposed portion 44 may be configured to be located on the other side of the first direction y relative to the fourth tip surface 441.

[0153] Next, an electronic device B2 according to a modification of the second embodiment will be described.

[0154] Fig. 44 shows an electronic device B2 according to a modified example of Embodiment 2. As shown in Fig. 44, the electronic device B2 differs from the electronic device B1 mainly in that the electronic component 1 is not flip-chip mounted.

[0155] In the electronic device B2, the element main surface 10a of the electronic component 1 faces upward in the thickness direction z, and the element back surface 10b faces downward in the thickness direction z. Therefore, in the electronic device B2, the element back surface 10b faces the multiple leads 3 and the island lead 37.

[0156] 44, the electronic device B2 includes a plurality of wires 7. The plurality of wires 7 are bonding wires that provide electrical continuity between two locations spaced apart from each other. Each of the plurality of wires 7 is bonded to one of the electrodes 19 of the electronic component 1 and one of the plurality of leads 3, providing electrical continuity between them.

[0157] As with electronic device B1, electronic device B2 can be miniaturized while suppressing short circuits between adjacent leads 3. In other words, the electronic device of the present disclosure is not limited to one in which electronic components 1 are flip-chip mounted, but can also be applied to one in which electronic components 1 are mounted using bonding wires.

[0158] The electronic device according to the present disclosure is not limited to the above-described embodiment. The specific configuration of each part of the electronic device according to the present disclosure can be freely designed. For example, the electronic device according to the present disclosure includes the following embodiments. [Appendix 1] Electronic components and a resin member covering the electronic component; a plurality of leads each of which is electrically connected to the electronic component; Equipped with the resin member has a first resin side surface facing one side in a first direction perpendicular to a thickness direction of the resin member, the plurality of leads are arranged along the first resin side surface and each include a plurality of first side exposed portions that are exposed from the first resin side surface; each of the plurality of first lateral exposed portions includes a first tapered portion tapered toward the first resin side surface as viewed in the thickness direction; The first tapered portion faces the same direction as the first resin side surface in the first direction and has a first tip surface that is flush with the first resin side surface. [Appendix 2] The electronic device described in Appendix 1, wherein in each of the multiple first lateral exposed portions, the first tapered portion is connected to the first tip surface when viewed in the thickness direction and has a first chamfered portion formed on one side in a second direction perpendicular to the thickness direction and the first direction. [Appendix 3] The electronic device described in Appendix 2, wherein each of the plurality of first lateral exposed portions further includes a first protrusion portion connected to the first end surface and the first chamfered portion and protruding in one of the second directions. [Appendix 4] the resin member has a second resin side surface facing the opposite side to the first resin side surface in the first direction, the plurality of leads are arranged along the second resin side surface and further include a plurality of second side exposed portions each exposed from the second resin side surface; each of the plurality of second lateral exposed portions includes a second tapered portion tapered toward the second resin side surface as viewed in the thickness direction; The electronic device of either Appendix 2 or Appendix 3, wherein the second tapered portion faces in the same direction as the second resin side surface in the first direction and has a second tip surface that is flush with the second resin side surface. [Appendix 5] The electronic device described in Appendix 4, wherein in each of the plurality of second lateral exposed portions, the second tapered portion is connected to the second tip surface when viewed in the thickness direction and has a second chamfered portion formed in one of the thickness direction and the second direction. [Appendix 6] The electronic device described in Appendix 5, wherein each of the multiple second lateral exposed portions further includes a second protrusion portion connected to the second end surface and the second chamfered portion and protruding in one of the second directions. [Appendix 7] The electronic device of either Appendix 5 or Appendix 6, wherein the resin member has a resin main surface and a resin back surface spaced apart in the thickness direction, a first resin recess recessed from the resin back surface and connected to the first resin side surface, and a second resin recess recessed from the resin back surface and connected to the second resin side surface. [Appendix 8] 8. The electronic device of claim 7, wherein each of the plurality of first lateral exposed portions includes a first lateral recess connected to the first resin recess. [Appendix 9] 9. The electronic device of claim 8, wherein each of the plurality of second lateral exposed portions includes a second lateral recess connected to the second resin recess. [Appendix 10] the first resin recess has a first wall surface that is connected to the resin back surface and faces in the same direction as the first resin side surface, 10. The electronic device according to claim 7, wherein the first tapered portion is formed on one side of the first direction relative to the first wall surface when viewed in the thickness direction. [Appendix 11] the second resin recess has a second wall surface that is connected to the resin back surface and faces in the same direction as the second resin side surface, 11. The electronic device according to claim 10, wherein the second tapered portion is formed on the other side of the first direction than the second wall surface when viewed in the thickness direction. [Appendix 12] the resin member has a third resin side surface facing one side of the second direction and a fourth resin side surface facing the other side of the second direction; An electronic device described in any one of Appendix 4 to Appendix 11, wherein each of the third resin side surface and the fourth resin side surface is perpendicular to both the first resin side surface and the second resin side surface, respectively, when viewed in the thickness direction. [Appendix 13] the plurality of leads further include a first corner exposed portion and a second corner exposed portion disposed on either side of the plurality of first side exposed portions in the second direction; the first corner exposed portion is exposed from the first resin side surface and the third resin side surface, 13. The electronic device according to claim 12, wherein the second corner exposed portion is exposed from the first resin side surface and the fourth resin side surface. [Appendix 14] the plurality of leads further include a third corner exposed portion and a fourth corner exposed portion disposed on either side of the plurality of second side exposed portions in the second direction; the third corner exposed portion is exposed from the second resin side surface and the third resin side surface, 14. The electronic device according to claim 13, wherein the fourth corner exposed portion is exposed from the second resin side surface and the fourth resin side surface. [Appendix 15] the first corner exposed portion overlaps a first resin corner portion configured by the first resin side surface and the third resin side surface as viewed in the thickness direction; 15. The electronic device according to claim 14, wherein the third corner exposed portion overlaps a second resin corner portion formed by the second resin side surface and the third resin side surface when viewed in the thickness direction. [Appendix 16] the second corner exposed portion has a first end surface exposed from the first resin side surface, and a pair of third chamfered portions respectively connected to both sides of the first end surface in the second direction; An electronic device described in either Appendix 14 or Appendix 15, wherein the fourth corner exposed portion has a second end surface exposed from the second resin side surface and has a pair of fourth chamfered portions connected to both sides of the second end surface in the second direction. [Appendix 17] further comprising an island lead overlapping the electronic component when viewed in the thickness direction; 17. The electronic device according to claim 1, wherein the plurality of leads are arranged around the island lead. [Appendix 18] 18. The electronic device according to claim 1, wherein the electronic component is flip-chip mounted. [Explanation of symbols]

[0159] A1~A5,B1,B2:Electronic equipment 1: Electronic parts 10a: element main surface 10b: Back side of element 11~14,19: Electrode 2: Resin material 21: Resin main surface 22: Resin back 101: Switching circuit 102: Control circuit 231: First resin side 232: Second resin side 233: Third resin side 234: 4th resin side 241: First resin recess 241a: 1st wall 241b: 1st bottom surface 242: Second resin recess 242a: 2nd wall 242b: 2nd bottom surface 243: Third resin recess 243a: 3rd wall 243b: 3rd bottom surface 244: 4th resin recess 244a: 4th wall 244b: 4th bottom 251: 1st resin corner 252:Second resin corner 253:Third resin corner 254: 4th resin corner 3: Lead 30: Lead frame 301: Frame section 302: Notch 31: First lead 32: Second lead 33: Third lead 34: 4th lead 35: 5th lead 36: 6th lead 37: Island Lead 371: Island section 372: Extension part 41,41A,41B,41C: 1st side exposed part 410: First tapered section 411: 1st tip surface 412: First chamfer 413 :1st side 414: First back side 415: 1st protrusion 416: First lateral recess 416a: First inner end surface 416b: 1st connection surface 42,42A,42B,42C: 2nd side exposed part 420: Second tapered section 421: 2nd tip surface 422: Second chamfer 423:Second side 424: Second back side 425:Second protrusion 426: Second lateral recess 426a: Second inner end surface 426b: 2nd connection surface 43: Third side exposed part 430: Third tapered section 431:Third tip surface 432: Third chamfer 433:Third side 434: Third reverse side 435: Third protrusion 436: Third lateral recess 436a: Third inner end surface 436b: 3rd connecting surface 44: 4th side exposed part 440: 4th tapered section 441: 4th tip surface 442: 4th chamfer 443: 4th side 444: 4th back side 445: 4th protrusion 446: 4th lateral recess 446a: 4th inner end surface 446b: 4th connecting surface 51: 1st corner exposed part 511,512: End face 513, 514: Side 515: Chamfered part 516: Back side 517,518: Recess 517a, 518a: Recessed side 517b, 518b: Bottom of recess 52:Second corner exposed part 521,522: End face 523, 524: Side 525A, 525B: Chamfered part 526: Back side 527,528: Recess 527a, 528a: Recessed side 527b, 528b: Bottom of recess 53: Third corner exposed part 531,532: End face 533, 534: Side 535A, 535B: Chamfered part 536: Back side 537,538: Recess 537a, 538a: Recessed side 537b, 538b: Bottom of recess 54: 4th corner exposed part 541,542: End face 543,544: Side 545A, 545B, 545C: Chamfered section 546: Back side 547,548: Recess 547a, 548a: Recessed side 547b, 548b: Bottom of recess 61: Exposed back surface 611: Back side 7: Wire 91: Groove

Claims

1. Electronic components and a resin member covering the electronic component; a plurality of leads each of which is electrically connected to the electronic component; Equipped with the resin member has a first resin side surface facing one side in a first direction perpendicular to a thickness direction of the resin member, and a resin back surface facing one side in the thickness direction, the plurality of leads are arranged along the first resin side surface, and each includes a plurality of first side exposed portions exposed from the first resin side surface, and a back surface exposed portion exposed only from the resin back surface; each of the plurality of first lateral exposed portions includes a first tapered portion tapered toward the first resin side surface as viewed in the thickness direction; the first tapered portion has a first tip surface that faces the same direction as the first resin side surface in the first direction and is flush with the first resin side surface; the plurality of leads include at least one first lead having any one of the plurality of first side exposed portions, and at least one second lead having any other one of the plurality of first side exposed portions and the rear surface exposed portion; In each of the plurality of first lateral exposed portions, the first tapered portion has a first chamfered portion that is connected to the first tip end surface when viewed in the thickness direction and that is formed on one side in a second direction that is perpendicular to the thickness direction and the first direction, and a first side surface that is connected to the first tip end surface when viewed in the thickness direction and that is formed on the other side in the second direction, In the first tapered portion of each of the plurality of first lateral exposed portions, the first chamfered portion faces the same direction, In the first tapered portion of each of the plurality of first lateral exposed portions, the first side surface is a flat surface facing the other side in the second direction, the resin member has a third resin side surface facing one side of the second direction and a fourth resin side surface facing the other side of the second direction; the third resin side surface and the fourth resin side surface are orthogonal to the first resin side surface when viewed in the thickness direction, the plurality of leads further include a first corner exposed portion and a second corner exposed portion disposed on either side of the plurality of first side exposed portions in the second direction; the first corner exposed portion is exposed from the first resin side surface and the third resin side surface, the second corner exposed portion is exposed from the first resin side surface and the fourth resin side surface, an electronic device, wherein each of the first corner exposed portion and the second corner exposed portion includes a chamfered portion facing in the same direction as the first chamfered portion of the first tapered portion of each of the plurality of first side exposed portions;

2. Each of the plurality of first side exposed portions further includes a first protrusion portion that is connected to the first tip surface and the first chamfered portion and protrudes in one direction in the second direction. The electronic device of claim 1 .

3. the resin member has a second resin side surface facing the opposite side to the first resin side surface in the first direction, the plurality of leads are arranged along the second resin side surface and further include a plurality of second side exposed portions each exposed from the second resin side surface; each of the plurality of second lateral exposed portions includes a second tapered portion tapered toward the second resin side surface as viewed in the thickness direction; the second tapered portion has a second tip surface that faces the same direction as the second resin side surface in the first direction and is flush with the second resin side surface, the at least one first lead has any of the plurality of second side exposed portions; the at least one second lead has any other of the plurality of second side exposed portions; 3. The electronic device according to claim 1 or 2.

4. In each of the plurality of second lateral exposed portions, the second tapered portion has a second chamfered portion that is connected to the second tip end surface as viewed in the thickness direction and that is formed on one side in the thickness direction and the second direction, and a second side surface that is connected to the first tip end surface as viewed in the thickness direction and that is formed on the other side in the second direction, In the second tapered portion of each of the plurality of second lateral exposed portions, the second chamfered portion faces the same direction, In the second tapered portion of each of the plurality of second lateral exposed portions, the second side surface is a flat surface facing the other side in the second direction, the third resin side surface and the fourth resin side surface are orthogonal to the second resin side surface when viewed in the thickness direction, the plurality of leads further include a third corner exposed portion and a fourth corner exposed portion disposed on either side of the plurality of second side exposed portions in the second direction; the third corner exposed portion is exposed from the second resin side surface and the third resin side surface, the fourth corner exposed portion is exposed from the second resin side surface and the fourth resin side surface, each of the third corner exposed portion and the fourth corner exposed portion includes a chamfered portion facing in the same direction as the second chamfered portion of the second tapered portion of each of the plurality of second side exposed portions; The electronic device of claim 3 .

5. Each of the plurality of second side exposed portions further includes a second protrusion portion that is connected to the second tip surface and the second chamfered portion and protrudes in one direction in the second direction.

5. The electronic device of claim 4.

6. The resin member has a resin main surface spaced from the resin back surface in the thickness direction, a first resin recess recessed from the resin back surface and connected to the first resin side surface, and a second resin recess recessed from the resin back surface and connected to the second resin side surface.

6. The electronic device according to claim 4 or claim 5.

7. The electronic device according to claim 6 , wherein each of the plurality of first side exposed portions includes a first side recess connected to the first resin recess.

8. The electronic device according to claim 7 , wherein each of the plurality of second lateral exposed portions includes a second lateral recess connected to the second resin recess.

9. the first resin recess has a first wall surface that is connected to the resin back surface and faces in the same direction as the first resin side surface, the first tapered portion is formed on the one side in the first direction relative to the first wall surface when viewed in the thickness direction; 9. An electronic device according to any one of claims 6 to 8.

10. the second resin recess has a second wall surface that is connected to the resin back surface and faces in the same direction as the second resin side surface, the second tapered portion is formed on the other side of the second wall surface in the first direction as viewed in the thickness direction.

10. The electronic device of claim 9.

11. the first corner exposed portion overlaps a first resin corner portion configured by the first resin side surface and the third resin side surface when viewed in the thickness direction; the third corner exposed portion overlaps a second resin corner portion configured by the second resin side surface and the third resin side surface when viewed in the thickness direction.

5. The electronic device of claim 4.

12. the second corner exposed portion has a first end surface exposed from the first resin side surface, and a pair of third chamfered portions respectively connected to both sides of the first end surface in the second direction, one of the pair of third chamfered portions is the chamfered portion of the second exposed corner portion, the fourth corner exposed portion has a second end surface exposed from the second resin side surface, and a pair of fourth chamfered portions respectively connected to both sides of the second end surface in the second direction, one of the pair of fourth chamfered portions is the chamfered portion of the fourth corner exposed portion; 12. The electronic device of claim 11.

13. further comprising an island lead overlapping the electronic component when viewed in the thickness direction; the plurality of leads are arranged around the island lead; 13. An electronic device according to any one of claims 1 to 12.

14. The electronic component is flip-chip mounted.

14. An electronic device according to any one of claims 1 to 13.

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