Substrate processing apparatus and substrate processing method

Abstract

To provide a substrate processing apparatus capable of suppressing the application of excess liquid repellent to a part other than the end face portions of a substrate while suppressing an increase in the number of processing steps.SOLUTION: A substrate processing apparatus 100 includes a substrate holding portion 13 and a coating member 151. The substrate holding portion 13 rotates the substrate W while holding it. The coating member 151 applies a liquid repellent containing a liquid repellent substance capable of repelling a processing liquid used to process the substrate W to the end surface portion 51 of the substrate W by contacting the end surface portion 51 on the outer side in the radial direction RD of the rotating substrate W.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method. [Background technology]

[0002] The substrate processing apparatus described in Patent Document 1 includes a peripheral processing head. The peripheral processing head processes the peripheral surface of a substrate held by a spin chuck. The peripheral processing head includes a suction tube. The suction tube sucks excess processing liquid from the peripheral surface. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-70023 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the substrate processing apparatus of Patent Document 1 requires a suction process using a suction pipe, which increases the number of processing steps. On the other hand, the inventors of the present application focused on a process of applying a liquid-repellent agent that can repel processing liquid to the radial end surface of the substrate.

[0005] The present invention has been made in consideration of the above-mentioned problems, and its purpose is to provide a substrate processing apparatus and a substrate processing method that can prevent excess liquid repellent agent from being applied to parts of the substrate other than the edge surface while suppressing an increase in processing steps. [Means for solving the problem]

[0006] According to one aspect of the present invention, a substrate processing apparatus includes a substrate holding unit and an application member. The substrate holding unit holds and rotates a substrate. The application member contacts a radially outer edge surface of the rotating substrate to apply a liquid-repellent agent to the edge surface of the substrate, the liquid-repellent agent including a liquid-repellent substance capable of repelling a processing liquid used to process the substrate.

[0007] In one aspect of the present invention, it is preferable that the applicator applies the liquid repellent agent to the end surface of the substrate while rotating.

[0008] In one aspect of the present invention, the end surface portion of the substrate preferably has a front surface edge portion, a front surface shoulder portion, a side portion, a back surface shoulder portion, and a back surface edge portion. The front surface edge portion is preferably located radially outward from the main body of the substrate on the front surface side of the front and back surfaces of the substrate. The front surface shoulder is preferably located radially outward from the front surface edge portion on the front surface side. The back surface edge portion is preferably located radially outward from the main body of the substrate on the back surface side. The back surface shoulder is preferably located radially outward from the back surface edge portion on the back surface side. The side surface portion is preferably located radially outward from the substrate's outermost portion. The applicator preferably applies the liquid repellent agent to the side surface portion.

[0009] In one aspect of the present invention, it is preferable that the applicator applies the liquid repellent agent to the front surface shoulder portion, the side surface portion, and the back surface shoulder portion.

[0010] In one aspect of the present invention, it is preferable that at least a part of the applying member enters a notch present in the end surface portion of the substrate and contacts the bottom of the notch.

[0011] In one aspect of the present invention, the substrate processing apparatus preferably further includes a biasing mechanism that biases the applying member toward the inside in the radial direction of the substrate.

[0012] In one aspect of the present invention, the substrate processing apparatus preferably further includes a liquid-repellent agent supply unit that supplies the liquid-repellent agent to the application member. The liquid repellent agent may be a liquid, or may be soaked into the application member. The application member may contact the end surface portion from the radially outer side. The substrate may have a pattern including a plurality of structures, and may have a main body that is a portion radially inward from the end surface portion, and the end surface portion. The applicator may not contact the main body. The applicator may not apply the liquid repellent agent to the main body. At least a portion of the applying member that comes into contact with the edge surface of the substrate may be disk-shaped or cylindrical.A side surface of the applying member may come into contact with the edge surface of the substrate. The liquid repellent agent may be a mixture of a solvent and the liquid repellent substance. The substrate processing apparatus may further include a heating unit configured to heat a radially outer portion of the substrate including the edge surface of the substrate, and the heating unit may apply the liquid-repellent agent to the edge surface of the substrate using the application member, and then heat the radially outer portion of the substrate to evaporate the solvent from the liquid-repellent agent and adhere the liquid-repellent substance to the edge surface of the substrate. The liquid repellent substance may be a polymer compound and may be present on the edge surface of the substrate.

[0013] According to another aspect of the present invention, a substrate processing method includes a step of rotating a substrate while holding the substrate, and a step of applying a liquid-repellent agent containing a liquid-repellent substance capable of repelling a processing liquid used to process the substrate to the radially outer end surface of the substrate by contacting an application member with the radially outer end surface of the rotating substrate.

[0014] In one aspect of the present invention, in the step of applying the liquid repellent agent, the liquid repellent agent is preferably applied to the edge surface portion of the substrate while the application member is rotated on its axis.

[0015] In one aspect of the present invention, the end surface portion of the substrate preferably has a front surface edge portion, a front surface shoulder portion, a side portion, a back surface shoulder portion, and a back surface edge portion. The front surface edge portion is preferably located radially outward from the main body of the substrate on the front surface side of the front and back surfaces of the substrate. The front surface shoulder is preferably located radially outward from the front surface edge portion on the front surface side. The back surface edge portion is preferably located radially outward from the main body of the substrate on the back surface side. The back surface shoulder is preferably located radially outward from the back surface edge portion on the back surface side. The side surface portion is preferably located at the outermost radial position of the substrate. In the step of applying the liquid repellent agent, the liquid repellent agent is preferably applied to the side surface portion.

[0016] In one aspect of the present invention, in the step of applying the liquid repellent agent, the liquid repellent agent is preferably applied to the front surface shoulder portion, the side surface portion, and the back surface shoulder portion.

[0017] In one aspect of the present invention, in the step of applying the liquid repellent agent, it is preferable that at least a portion of the application member enters a notch present in the end surface portion of the substrate and contacts the bottom point of the notch.

[0018] In one aspect of the present invention, in the step of applying the liquid repellent agent, the application member is preferably biased toward the inside in the radial direction of the substrate.

[0019] In one aspect of the present invention, the substrate processing method preferably further includes the step of supplying the liquid repellent agent to the applying member. The liquid repellent agent may be a liquid, or may be soaked into the application member. The step of applying the liquid repellent agent may include the step of bringing the applying member into contact with the end surface of the rotating substrate from the radially outer side. The substrate may have a pattern including a plurality of structures, and may have a main body that is a portion radially inward from the end surface portion, and the end surface portion. The applicator may not contact the main body. The applicator may not apply the liquid repellent agent to the main body. At least a portion of the applying member that comes into contact with the edge surface of the substrate may be disk-shaped or cylindrical.A side surface of the applying member may come into contact with the edge surface of the substrate. The liquid-repellent agent may be a mixture of a solvent and the liquid-repellent substance. The substrate processing method may further include a step of heating a radially outer portion of the substrate including the edge surface of the substrate. The step of heating the radially outer portion of the substrate may include applying the liquid-repellent agent to the edge surface of the substrate in the step of applying the liquid-repellent agent, and then heating the radially outer portion of the substrate to evaporate the solvent from the liquid-repellent agent and adhere the liquid-repellent substance to the edge surface of the substrate. The liquid repellent substance may be a polymer compound and may be present on the edge surface of the substrate. [Effects of the Invention]

[0020] According to the present invention, it is possible to prevent excess liquid repellent agent from being applied to portions of the substrate other than the edge surface portion while suppressing an increase in the number of processing steps. [Brief explanation of the drawings]

[0021] [Figure 1] 1 is a plan view showing the inside of a substrate processing apparatus according to an embodiment of the present invention. [Figure 2] FIG. 2 is a plan view showing the inside of the liquid-repellent agent application unit according to the embodiment. [Figure 3] FIG. 2 is a side view showing the inside of the liquid-repellent agent application unit according to the embodiment. [Figure 4] 1A to 1C are diagrams illustrating a liquid repellent agent application method according to the present embodiment. [Figure 5]1A is a cross-sectional view showing the substrate and brush according to the present embodiment, FIG. 1B is a cross-sectional view showing the state where a liquid repellent agent is applied to the side surface of the substrate according to the present embodiment, and FIG. 1C is a cross-sectional view showing the state where a liquid repellent agent is applied to the front surface shoulder, side surface, and back surface shoulder of the substrate according to the present embodiment. [Figure 6] FIG. 2 is a plan view showing a part of the substrate according to the embodiment. [Figure 7] FIG. 2 is a plan view showing a substrate according to the embodiment. [Figure 8] FIG. 10 is a plan view showing a state in which the brush according to the embodiment is in contact with a notch. [Figure 9] FIG. 2 is a plan view showing a brush and a notch according to the embodiment. [Figure 10] 1 is a flowchart showing a substrate processing method according to the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0022] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated. In addition, in the drawings, the X-axis, Y-axis, and Z-axis are appropriately illustrated to facilitate understanding. The X-axis, Y-axis, and Z-axis are mutually orthogonal, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction. Note that "plan view" refers to viewing an object from vertically above. Furthermore, "plan view" refers to a drawing when viewing an object from vertically above.

[0023] A substrate processing apparatus 100 according to an embodiment of the present invention will be described with reference to Figures 1 to 10. First, the substrate processing apparatus 100 will be described with reference to Figure 1. Figure 1 is a plan view showing the interior of the substrate processing apparatus 100. The substrate processing apparatus 100 shown in Figure 1 processes a substrate W. The substrate W has, for example, a pattern including a plurality of structures formed thereon.

[0024] The substrate W is, for example, a semiconductor wafer (e.g., a silicon wafer), a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. Hereinafter, as an example, the substrate W is a silicon wafer.

[0025] As shown in FIG. 1, the substrate processing apparatus 100 includes a plurality of load ports LP, an indexer robot IR, a center robot CR, a plurality of processing units 1, a control device 2, a plurality of fluid boxes 3, a chemical cabinet 4, and a liquid repellent application unit 5.

[0026] Each load port LP accommodates a plurality of stacked substrates W. The indexer robot IR transports the substrates W between the load port LP and the center robot CR. The center robot CR transports the substrates W between the indexer robot IR and the processing unit 1, between the indexer robot IR and the liquid-repellent agent application unit 5, or between the processing unit 1 and the liquid-repellent agent application unit 5. The liquid-repellent agent application unit 5 applies a liquid-repellent agent to the substrates W. Details of the liquid-repellent agent application unit 5 will be described later.

[0027] Each of the processing units 1 processes a substrate W with a processing liquid. Each of the processing units 1 is a single-wafer type apparatus that processes a substrate W one by one. Specifically, the processing unit 1 includes a front surface nozzle 7 and a back surface nozzle 8. The front surface nozzle 7 supplies the processing liquid to the front surface of the substrate W, out of the front surface (upper surface) and the back surface (lower surface) of the substrate W, to process the front surface of the substrate W. The back surface nozzle 8 supplies the processing liquid to the back surface of the substrate W to process the back surface of the substrate W.

[0028] The processing liquid is a chemical liquid or a rinse liquid. The chemical liquid is a liquid for processing the substrate W. Examples of the chemical liquid include dilute hydrofluoric acid (DHF), hydrofluoric acid (HF), buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), phosphoric acid (H3PO4), sulfuric acid, acetic acid, nitric acid, hydrochloric acid, ammonia water, hydrogen peroxide water, organic acids (e.g., citric acid, oxalic acid), organic alkalis (e.g., TMAH: tetramethylammonium hydroxide), ammonia-hydrogen peroxide water mixture (SC1), hydrochloric acid-hydrogen peroxide water mixture (SC2), isopropyl alcohol (IPA), surfactants, and corrosion inhibitors.

[0029] The rinse liquid is a liquid for washing away chemical liquids, by-products of chemical processing, and / or foreign matter from the substrate W. The rinse liquid is, for example, deionized water (DIW), carbonated water, electrolytic ionized water, hydrogen water, ozone water, or hydrochloric acid water with a diluted concentration (for example, about 10 ppm to 100 ppm).

[0030] A predetermined number of processing units 1 (three processing units 1 in the example of FIG. 1) are stacked vertically to form one tower TW. However, in the example of FIG. 1, one tower TW of the multiple towers TW (four towers TW in the example of FIG. 1) includes one liquid-repellent agent application unit 5 instead of one processing unit 1. The multiple towers TW are arranged to surround the center robot CR in a plan view. The arrangement of the liquid-repellent agent application unit 5 is not particularly limited. For example, the liquid-repellent agent application unit 5 may be arranged in a dedicated space in the substrate processing apparatus 100 or outside the substrate processing apparatus 100. The substrate processing apparatus 100 may also include multiple liquid-repellent agent application units 5.

[0031] Each of the multiple fluid boxes 3 houses a fluid device. The multiple fluid boxes 3 correspond to multiple towers TW, respectively. The chemical liquid cabinet 4 houses a chemical liquid. The chemical liquid in the chemical liquid cabinet 4 is supplied to all processing units 1 included in the tower TW corresponding to the fluid box 3 via one of the fluid boxes 3.

[0032] The control device 2 controls the load port LP, the indexer robot IR, the center robot CR, the processing unit 1, the fluid box 3, the chemical cabinet 4, and the liquid repellent application unit 5. The control device 2 is, for example, a computer.

[0033] The control device 2 includes a control unit 21 and a memory unit 22. The control unit 21 includes a processor such as a CPU (Central Processing Unit). The memory unit 22 includes a storage device and stores data and computer programs. Specifically, the memory unit 22 includes a main storage device such as a semiconductor memory, and an auxiliary storage device such as a semiconductor memory, a solid-state drive, and / or a hard disk drive. The memory unit 22 may include removable media. The memory unit 22 corresponds to an example of a non-transitory computer-readable storage medium.

[0034] Next, the liquid-repellent agent application unit 5 will be described with reference to Fig. 2. Fig. 2 is a plan view showing the interior of the liquid-repellent agent application unit 5. As shown in Fig. 2, the liquid-repellent agent application unit 5 includes a chamber 11, a spin chuck 13, a liquid-repellent agent application mechanism 15, a liquid-repellent agent supply unit 17, and a liquid receiving unit 19. The liquid-repellent agent supply unit 17 includes a liquid-repellent agent nozzle 171, a valve 172, and piping 173. A control unit 21 controls the spin chuck 13, the liquid-repellent agent application mechanism 15, and the liquid-repellent agent supply unit 17.

[0035] The chamber 11 has a substantially box shape and houses a spin chuck 13, a liquid repellent agent application mechanism 15, a liquid repellent agent nozzle 171, and a liquid receiving portion 19. The spin chuck 13 corresponds to an example of the "substrate holding portion" of the present invention.

[0036] The spin chuck 13 rotates the substrate W while holding it. Specifically, the spin chuck 13 rotates the substrate W around the rotation axis AX1 while holding the substrate W substantially horizontally. The liquid repellent agent application mechanism 15 applies a liquid repellent agent to an end surface portion 51 of the substrate W that is located outside the radial direction RD. The end surface portion 51 is a substantially annular portion of the substrate W that is located around the rotation axis AX1. In this embodiment, the radial direction RD is substantially parallel to the horizontal direction. The radial direction RD is also perpendicular to the rotation axis AX1. The radial direction RD can also be considered as a radial direction relative to the rotation axis AX1. The circumferential direction around the rotation axis AX1 may be referred to as a circumferential direction CD. The circumferential direction CD can also be considered as the circumferential direction of the substrate W.

[0037] The liquid repellent agent is a liquid containing a liquid repellent substance. Specifically, the liquid repellent agent is a solution containing the liquid repellent substance. The liquid repellent substance is a substance that can repel the processing liquid used to process the substrate W. In other words, the liquid repellent substance is a substance that has the property of repelling the processing liquid more than the substrate W. The liquid repellent substance has liquid repellency. Liquid repellency is the property of repelling liquid. For example, a substance with a contact angle of 90 degrees or more is a liquid repellent substance.

[0038] The liquid repellent agent is a mixture of a solvent and a liquid repellent substance as a solute. The solvent is, for example, water. The water is, for example, the same liquid as a rinse solution. The liquid repellent substance is, for example, a polymer compound. The liquid repellent substance is preferably a non-fluorine-based liquid repellent substance. As an example, Neoseed (registered trademark) manufactured by Nicca Chemical can be used as the liquid repellent substance. The liquid repellent agent may also be wax.

[0039] The liquid-repellent substance is, for example, a water-repellent substance. A water-repellent substance is a substance that can repel water. In other words, a water-repellent substance is a substance that has the property of repelling water more than the substrate W. A water-repellent substance has water repellency. Water repellency refers to the property of repelling water. For example, a substance with a contact angle of 90 degrees or more is a water-repellent substance. In this case, the water is, for example, the same liquid as the rinse liquid. When a water-repellent substance is used as the liquid-repellent substance, it is effective when the processing liquid is an aqueous solution. Note that when the liquid-repellent substance is a water-repellent substance, the liquid-repellent agent is a water-repellent agent.

[0040] The liquid-repellent substance may be, for example, a silicone-based liquid-repellent substance or an acrylic-based liquid-repellent substance. The silicone-based liquid-repellent substance imparts liquid-repellency to silicon itself and compounds containing silicon. The silicone-based liquid-repellent substance may be, for example, a silane coupling agent. The silane coupling agent may include, for example, at least one of HMDS (hexamethyldisilazane), TMS (tetramethylsilane), fluorinated alkylchlorosilane, alkyldisilazane, and a non-chloro-based hydrophobizing agent. The non-chloro-based hydrophobizing agent may include, for example, at least one of dimethylsilyldimethylamine, dimethylsilyldiethylamine, hexamethyldisilazane, tetramethyldisilazane, bis(dimethylamino)dimethylsilane, N,N-dimethylaminotrimethylsilane, N-(trimethylsilyl)dimethylamine, and an organosilane compound.

[0041] The liquid-repellent substance may be, for example, a metal-based liquid-repellent substance that imparts liquid-repellency to metal itself and compounds containing metal. The metal-based liquid-repellent substance includes, for example, at least one of an amine having a hydrophobic group and an organosilicon compound.

[0042] Specifically, the liquid-repellent agent application mechanism 15 includes a brush 151. The brush 151 corresponds to an example of the "application member" of the present invention.

[0043] At the application position P1, the brush 151 contacts the outer edge surface 51 of the substrate W in the radial direction RD while the substrate W is rotating, thereby applying a liquid-repellent agent containing a liquid-repellent substance capable of repelling a processing liquid used to process the substrate W to the edge surface 51 of the substrate W. Therefore, compared to when the liquid-repellent agent is ejected onto the substrate W using a nozzle or the like, it is possible to prevent excess liquid-repellent agent from being applied to portions of the substrate W other than the edge surface 51. In addition, a suction process for sucking excess liquid-repellent agent is not required. Therefore, according to this embodiment, it is possible to prevent excess liquid-repellent agent from being applied to portions of the substrate W other than the edge surface 51 while suppressing an increase in the number of processing steps. The portion of the substrate W other than the edge surface 51 is, for example, a portion of the substrate W on which a pattern is formed. Note that, for example, when the liquid-repellent agent is applied using a nozzle or the like, the nozzle or the like is spaced apart from the substrate W. Therefore, when the liquid-repellent agent is ejected from the nozzle or the like, there is a possibility that the liquid-repellent agent will splash onto portions of the substrate W other than the edge surface 51.

[0044] The application position P1 indicates a position where the brush 151 contacts the edge surface portion 51 of the substrate W. On the other hand, the standby position P2 indicates a position that is further outward in the radial direction RD than the application position P1. In other words, the standby position P2 indicates a position where the brush 151 is separated from the substrate W in the radial direction RD. A liquid receiving portion 19 is disposed below the standby position P2. The liquid receiving portion 19 is, for example, a pot.

[0045] At the standby position P2, the liquid-repellent agent supplier 17 supplies the liquid-repellent agent to the brush 151. Therefore, according to this embodiment, the liquid-repellent agent can be effectively soaked into the brush 151.

[0046] The brush 151 has, for example, a substantially cylindrical shape. The brush 151 has, for example, elasticity. The brush 151 includes, for example, a porous material. In this case, the brush 151 may be, for example, sponge-like. The brush 151 preferably has liquid repellency, because this makes it easier for the liquid repellent agent to be transferred to the substrate W. The material of the brush 151 is, for example, PTFE (polytetrafluoroethylene) or PFA (tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer). Note that, for example, the brush 151 may be configured by combining multiple members, or may include multiple bristles.

[0047] Specifically, in the liquid repellent agent supply unit 17, the liquid repellent agent nozzle 171 discharges the liquid repellent agent onto the brush 151 located at the standby position P2. As a result, the liquid repellent agent soaks into the brush 151.

[0048] More specifically, a pipe 173 is connected to the liquid repellent agent nozzle 171. The pipe 173 supplies the liquid repellent agent to the liquid repellent agent nozzle 171. A valve 172 is arranged in the pipe 173. The valve 172 closes or opens the flow path of the pipe 173. The control unit 21 controls the valve 172 so that the valve 172 opens the flow path of the pipe 173. As a result, the valve 172 opens the flow path of the pipe 173, and the liquid repellent agent nozzle 171 ejects the liquid repellent agent toward the brush 151. The liquid repellent agent that has not soaked into the brush 151 drops into the liquid receiving portion 19 and accumulates in the liquid receiving portion 19.

[0049] Next, the liquid-repellent agent coating unit 5 will be described in detail with reference to FIG. 3. FIG. 3 is a side view showing the interior of the liquid-repellent agent coating unit 5. As shown in FIG. 3, in the liquid-repellent agent coating unit 5, the spin chuck 13 is a vacuum suction-type chuck. Specifically, the spin chuck 13 includes a spin shaft 131, a spin base 132, and a spin motor 133. The spin shaft 131 extends substantially vertically. The spin base 132 has a substantially circular plate shape and is attached to the upper end of the spin shaft 131. The spin base 132 holds the substrate W in a substantially horizontal position. In the example of FIG. 3, the spin base 132 holds the substrate W in a substantially horizontal position by suctioning the backside of the substrate W. The spin motor 133 has a rotation shaft coaxially coupled to the spin shaft 131. The spin motor 133 rotates the substrate W around a rotation axis AX1 of the spin shaft 131 while the substrate W is held by the spin base 132.

[0050] The liquid-repellent agent coating unit 5 further includes a heating section 20. The heating section 20 heats the outer portion of the substrate W in the radial direction RD from the back surface side of the substrate W under the control of the control section 21. The heating section 20 is disposed further outward in the radial direction RD than the spin chuck 13. The heating section 20 is disposed below the substrate W. Specifically, the heating section 20 is disposed below the outer portion of the substrate W in the radial direction RD. In the example of FIG. 3, the heating section 20 has a substantially annular shape extending around the rotation axis AX1. The heating section 20 is, for example, a heater. The direction along the rotation axis AX1 may be referred to as the axial direction AD. The axial direction AD is perpendicular to the substrate W and substantially parallel to the vertical direction.

[0051] The liquid-repellent agent application mechanism 15, under the control of the control unit 21, swings the brush 151 in the horizontal direction and raises and lowers the brush 151. The liquid-repellent agent application mechanism 15 moves the brush 151 between an application position P1 (FIG. 2) and a standby position P2 (FIG. 2).

[0052] Specifically, the liquid repellent application mechanism 15 includes a swing arm 152, a swing mechanism 153, a lifting mechanism 154, and an arm base shaft 155. A brush 151 is attached to one horizontal end of the swing arm 152. The swing arm 152 swings the brush 151 in a substantially horizontal direction and raises and lowers the brush 151.

[0053] More specifically, the swing mechanism 153 swings the swing arm 152 approximately horizontally around the swing axis AX3 under the control of the control unit 21. More specifically, the upper end of the arm base shaft 155 is coupled to the other horizontal side of the swing arm 152. The driving force of the swing mechanism 153 is input to the arm base shaft 155. By inputting the driving force of the swing mechanism 153 to the arm base shaft 155, the arm base shaft 155 is rotated back and forth, and the swing arm 152 swings around the arm base shaft 155 as a fulcrum. The swing mechanism 153 includes, for example, a motor.

[0054] Furthermore, the lifting mechanism 154 lifts and lowers the swing arm 152 under the control of the control unit 21. More specifically, the lifting mechanism 154 is coupled to the arm base shaft 155. The lifting mechanism 154 moves the arm base shaft 155 up and down, thereby moving the swing arm 152 up and down integrally with the arm base shaft 155. The lifting mechanism 154 includes, for example, a ball screw mechanism and a motor that provides a driving force to the ball screw mechanism.

[0055] Specifically, the swing arm 152 includes an arm body 156, a support shaft 157, and a rotation mechanism 158. The arm body 156 is hollow and extends in a substantially horizontal direction. The arm body 156 is swung in a substantially horizontal direction by a swing mechanism 153. The arm body 156 is raised and lowered by a lifting mechanism 154. The support shaft 157 is located on one horizontal side of the arm body 156 and protrudes in a substantially horizontal direction. The rotation mechanism 158 is supported by the support shaft 157. The brush 151 is attached to the lower end of the rotation mechanism 158.

[0056] The rotation mechanism 158 rotates the brush 151 around the rotation axis AX2 under the control of the control unit 21. That is, the rotation mechanism 158 rotates the brush 151 around its axis. Specifically, the rotation mechanism 158 includes a brush motor 160 and a brush holder 162. The output shaft 161 of the brush motor 160 extends vertically downward. That is, the output shaft 161 extends downward along the axial direction AD. The brush holder 162 is attached to the lower end of the output shaft 161. The brush holder 162 holds the brush 151. The brush motor 160 rotates the output shaft 161, thereby rotating the brush 151 together with the brush holder 162 around the rotation axis AX2. In this embodiment, the rotation axis AX2 is substantially parallel to the rotation axis AX1. Therefore, the axial direction AD is substantially parallel to the rotation axis AX2.

[0057] The swing arm 152 further includes a biasing mechanism 159. Under the control of the control unit 21, the biasing mechanism 159 biases the brush 151 inward in the radial direction RD of the substrate W via the support shaft 157 and the rotation mechanism 158. Specifically, the biasing mechanism 159 maintains the pressing pressure of the brush 151 in the radial direction RD against the end surface portion 51 of the substrate W at a preset pressing pressure. The pressing pressure is the pressure when pressing the brush 151 against the end surface portion 51 in the radial direction RD. For example, the biasing mechanism 159 biases the brush 151 inward in the radial direction RD of the substrate W by driving the support shaft 157 along the radial direction RD using an air cylinder.

[0058] Next, a liquid-repellent agent application method according to this embodiment will be described with reference to Fig. 4. The liquid-repellent agent application method constitutes a part of a substrate processing method according to this embodiment. Fig. 4 is a diagram showing the liquid-repellent agent application method according to this embodiment.

[0059] As shown in FIG. 4, the liquid repellent agent application method includes steps S10, S20, and S30.

[0060] First, in step S10, at standby position P2, the liquid repellent agent nozzle 171 ejects the liquid repellent agent 81 toward the rotating brush 151. As a result, the liquid repellent agent 81 permeates the brush 151. In particular, in step S10, the rotation mechanism 158 (FIG. 3) rotates the brush 151, so that the liquid repellent agent 81 permeates the brush 151 evenly. In FIG. 4, the liquid repellent agent nozzle 171 ejects the liquid repellent agent 81 in a direction intersecting the rotation axis AX2. Specifically, the liquid repellent agent nozzle 171 ejects the liquid repellent agent 81 in a direction approximately perpendicular to the rotation axis AX2.

[0061] Next, in step S20, at application position P1, brush 151 comes into contact with edge surface 51 of the rotating substrate W, thereby applying liquid repellent agent 81 to edge surface 51 of the substrate W. Preferably, in step S20, rotation mechanism 158 (FIG. 3) rotates brush 151. In this case, brush 151 applies liquid repellent agent 81 to edge surface 51 of the substrate W while rotating. As a result, according to this embodiment, liquid repellent agent 81 can be more reliably applied to edge surface 51 of the substrate W.

[0062] 4, at the contact position between the edge surface 51 of the substrate W and the brush 151, the rotation direction of the substrate W is opposite to the rotation direction of the brush 151. Therefore, the liquid repellent agent 81 can be more reliably applied to the edge surface 51 of the substrate W. Note that at the contact position between the edge surface 51 of the substrate W and the brush 151, the rotation direction of the substrate W and the rotation direction of the brush 151 may be the same.

[0063] Next, in step S30, the heating unit 20 heats the outer portion of the substrate W in the radial direction RD from below the substrate W, thereby drying the liquid-repellent agent 81 (step S20) applied to the edge surface 51. As a result, the solvent evaporates from the liquid-repellent agent 81, and the liquid-repellent substance 82 adheres to the edge surface 51 of the substrate W. In other words, the heating unit 20 dries the liquid-repellent agent 81, causing the liquid-repellent substance 82 in the liquid-repellent agent 81 to adhere to the edge surface 51 of the substrate W.

[0064] For example, a substrate W having a liquid-repellent substance 82 attached to its edge surface 51 is carried into the processing unit 1 (FIG. 1). Then, the back surface nozzle 8 (FIG. 1) ejects a processing liquid onto the back surface A2 of the substrate W. In this case, the liquid-repellent substance 82 attached to the edge surface 51 of the substrate W repels the processing liquid, thereby preventing the processing liquid from flowing from the back surface A2 to the front surface A1 of the substrate W. As a result, it is possible to prevent the pattern formed on the front surface A1 of the substrate W from being affected by the processing liquid ejected onto the back surface A2.

[0065] Here, the liquid-repellent substance 82 attached to the edge surface 51 of the substrate W is a polymer compound. Therefore, there is no need to perform an operation to remove the liquid-repellent substance 82, because the liquid-repellent substance 82 is merely present on the edge surface 51.

[0066] Next, the substrate W will be described in detail with reference to Figures 5 and 6. Figure 5(a) is a cross-sectional view showing the substrate W and the brush 151. Figure 5(b) is a cross-sectional view showing a state in which a liquid-repellent agent 81 has been applied to a side surface portion 515 of the substrate W. Figure 5(c) is a cross-sectional view showing a state in which the liquid-repellent agent 81 has been applied to a front surface shoulder portion 512, a side surface portion 515, and a back surface shoulder portion 514 of the substrate W. Figures 5(a) to 5(c) show enlarged cross sections of the outer portion of the substrate W in the radial direction RD. Figure 6 is a plan view showing a part of the substrate W. Figure 6 shows an enlarged view of the surface A1 of the outer portion of the substrate W in the radial direction RD.

[0067] As shown in FIGS. 5(a) and 6, the substrate W has a main body 50 (hereinafter referred to as "substrate main body 50") and an end surface portion 51. The substrate main body 50 refers to the portion of the substrate W excluding the end surface portion 51. In other words, the substrate main body 50 refers to the portion of the substrate W that is more inward in the radial direction RD than the end surface portion 51. In other words, the substrate main body 50 refers to a substantially flat portion of the substrate W along the radial direction RD. A pattern is formed on the substrate main body 50. For example, the pattern is formed on the substrate main body 50 on the front surface A1 side of the substrate W. Note that, for example, the pattern may also be formed on the substrate main body 50 on the back surface A2 side of the substrate W. The substrate main body 50 has a substantially circular disk shape. Note that in FIG. 6, for ease of understanding, the boundary between the substrate main body 50 and the end surface portion 51 is indicated by a dashed line.

[0068] Specifically, the substrate body 50 includes a body front surface peripheral portion 501 and a body back surface peripheral portion 502. The body front surface peripheral portion 501 indicates a peripheral region of the front surface A1 of the substrate body 50. The body back surface peripheral portion 502 indicates a peripheral region of the back surface A2 of the substrate body 50. Each of the body front surface peripheral portion 501 and the body back surface peripheral portion 502 is a substantially annular region around the rotation axis AX1 (FIG. 2). The width in the radial direction RD of each of the body front surface peripheral portion 501 and the body back surface peripheral portion 502 is, for example, 1 mm or more and 4 mm or less.

[0069] The end surface portion 51 indicates a portion of the substrate W that is further outward in the radial direction RD than the substrate main body 50. In other words, the end surface portion 51 indicates an end surface region of the substrate W that is further outward in the radial direction RD than the substrate main body 50. In further other words, the end surface portion 51 indicates an end surface region of the substrate W that is further outward in the radial direction RD than the main body front surface peripheral portion 501 and the main body back surface peripheral portion 502. The end surface portion 51 has a front surface edge portion 511, a front surface shoulder portion 512, a side portion 515, a back surface shoulder portion 514, and a back surface edge portion 513.

[0070] The front surface edge 511 is located on the front surface A1 side of the front surface A1 and back surface A2 of the substrate W, and is located radially outward from the substrate main body 50 in the radial direction RD. The front surface edge 511 is a substantially annular region around the rotation axis AX1 (FIG. 2). In a plan view, the front surface edge 511 surrounds the substrate main body 50 (specifically, the main body front surface peripheral portion 501) in the circumferential direction CD. In a cross-sectional view, the front surface edge 511 includes an inclined surface that is inclined from the main body front surface peripheral portion 501 toward the front surface shoulder 512 with respect to the front surface A1 of the substrate main body 50. The front surface edge 511 connects the main body front surface peripheral portion 501 and the front surface shoulder 512.

[0071] The surface shoulder 512 is located on the surface A1 side, radially outward of the surface edge 511 in the circumferential direction RD. The surface shoulder 512 is a substantially annular region around the rotation axis AX1 (FIG. 2). In a plan view, the surface shoulder 512 surrounds the surface edge 511 in the circumferential direction CD. In a cross-sectional view, the surface shoulder 512 includes a curved surface that curves from the surface edge 511 toward the side surface 515. The surface shoulder 512 connects the surface edge 511 and the side surface 515.

[0072] The back surface edge 513 is located on the back surface A2 side, further outward in the radial direction RD than the substrate main body 50. The back surface edge 513 is a substantially annular region around the rotation axis AX1 (FIG. 2). In a plan view, the back surface edge 513 surrounds the substrate main body 50 (specifically, the main body back surface peripheral edge 502) in the circumferential direction CD. In a cross-sectional view, the back surface edge 513 includes an inclined surface that is inclined from the main body back surface peripheral edge 502 toward the back surface shoulder 514 with respect to the back surface A2 of the substrate main body 50. The back surface edge 513 connects the main body back surface peripheral edge 502 and the back surface shoulder 514.

[0073] The back surface shoulder 514 is located on the back surface A2 side, radially outward in the RD direction than the back surface edge 513. The back surface shoulder 514 is a substantially annular region around the rotation axis AX1 (FIG. 2). Back shoulder 514 In a plan view, the rear surface shoulder 514 surrounds the rear surface edge 513 in the circumferential direction CD. In a cross-sectional view, the rear surface shoulder 514 includes a curved surface that curves from the rear surface edge 513 toward the side surface 515. The rear surface shoulder 514 connects the rear surface edge 513 and the side surface 515.

[0074] The side surface portion 515 is located at the outermost position in the radial direction RD of the substrate W. The side surface portion 515 is a substantially annular region around the rotation axis AX1 (FIG. 2). In a plan view, the side surface portion 515 surrounds the front surface shoulder 512 and the back surface shoulder 514 in the circumferential direction CD. In a cross-sectional view, the side surface portion 515 includes a flat surface extending from the front surface shoulder 512 toward the back surface shoulder 514. The side surface portion 515 has a substantially cylindrical shape around the rotation axis AX1. The side surface portion 515 connects the front surface shoulder 512 and the back surface shoulder 514.

[0075] In this embodiment, preferably, as shown in FIG. 5(b), the brush 151 contacts only the side surface portion 515 and applies the liquid-repellent agent 81 to the side surface portion 515. Therefore, while the brush 151 is applying the liquid-repellent agent 81, the liquid-repellent agent 81 can be reliably prevented from entering the main body front surface peripheral portion 501 and the main body back surface peripheral portion 502. As a result, it is possible to more effectively prevent excess liquid-repellent agent 81 from being applied to the substrate main body 50. Furthermore, because the liquid-repellent agent 81 does not enter the main body front surface peripheral portion 501 and the main body back surface peripheral portion 502, patterns can also be formed on the main body front surface peripheral portion 501 and the main body back surface peripheral portion 502.

[0076] 5(c), the brush 151 may contact the front surface shoulder 512, the side surface 515, and the back surface shoulder 514 to apply the liquid repellent agent 81 to the front surface shoulder 512, the side surface 515, and the back surface shoulder 514. Even in this case, the front surface edge 511 and the back surface edge 513 can prevent the liquid repellent agent 81 from entering the main body front surface peripheral portion 501 and the main body back surface peripheral portion 502 while the brush 151 is applying the liquid repellent agent 81. As a result, it is possible to prevent excess liquid repellent agent 81 from being applied to the substrate main body 50, and it is also possible to form a pattern on the main body front surface peripheral portion 501 and the main body back surface peripheral portion 502.

[0077] For example, the control unit 21 adjusts the biasing force (pressure) of the biasing mechanism 159 to elastically deform the brush 151, thereby bringing the brush 151 into contact with the front shoulder portion 512, the side portion 515, and the back shoulder portion 514.

[0078] In addition, as long as the liquid repellent agent does not enter the main body front surface peripheral portion 501 and the main body back surface peripheral portion 502, the brush 151 may contact the front surface edge portion 511, front surface shoulder portion 512, side portion 515, back surface shoulder portion 514, and back surface edge portion 513 of the substrate W and apply the liquid repellent agent to the front surface edge portion 511, front surface shoulder portion 512, side portion 515, back surface shoulder portion 514, and back surface edge portion 513.

[0079] 5(a), for example, the length Lb of the brush 151 in the axial direction AD is longer than the thickness d of the substrate W in the axial direction AD. For example, the thickness d of the substrate W is 765 μm, and the length Lb of the brush 151 is 800 μm. Furthermore, for example, the radius of curvature of the front surface shoulder 512 is 270 μm, the length L0 of the side surface 515 in the axial direction AD is 228 μm, and the radius of curvature of the back surface shoulder 514 is 238 μm. Furthermore, for example, the length L1 is 314 μm, and the length L2 is 323 μm. The length L1 indicates the distance along the radial direction RD from the inner end in the radial direction RD of the front surface edge 511 to the outer end in the radial direction RD of the front surface shoulder 512 (the side surface 515). The length L2 indicates the distance along the radial direction RD from the inner end in the radial direction RD of the back surface edge 513 to the outer end in the radial direction RD of the back surface shoulder 514 (the side surface 515). Moreover, the front edge 511 has an inclination angle θ1 with respect to the main body front edge 501. The back edge 513 has an inclination angle θ2 with respect to the main body back edge 502. For example, the inclination angle θ1 is 22.3 degrees, and the inclination angle θ2 is 23.3 degrees.

[0080] Next, a notch 52 formed in the substrate W will be described with reference to Fig. 7. Fig. 7 is a plan view showing the substrate W. As shown in Fig. 7, the substrate W may have a notch 52. In plan view, the notch 52 is a recess recessed inward in the radial direction RD from an end surface portion 51 of the substrate W. The width of the notch 52 in the circumferential direction CD becomes smaller, for example, as it moves more inward in the radial direction RD.

[0081] Next, application of the liquid repellent agent to the notch 52 will be described with reference to Fig. 8. Fig. 8 is a plan view showing a state in which the brush 151 is in contact with the notch 52. As shown in Fig. 8, at least a portion of the brush 151 enters the notch 52 present in the edge surface portion 51 of the substrate W and comes into contact with the bottom point BM of the notch 52. Therefore, according to this embodiment, as in the case of the edge surface portion 51, it is possible to apply the liquid repellent agent to the notch 52 while preventing the liquid repellent agent from entering the substrate body 50 (specifically, the body front surface peripheral portion 501 and the body back surface peripheral portion 502).

[0082] 8, in plan view, the entire brush 151 is inserted into the notch 52. However, as long as the brush 151 is in contact with the bottom point BM of the notch 52, in plan view, only a portion of the brush 151 may be inserted into the notch 52.

[0083] In the example of FIG. 8, the diameter 2R of the brush 151 is smaller than the maximum width L of the notch 52 in the circumferential direction CD. "R" indicates the radius of the brush 151 in a plan view. In this embodiment, the brush 151 is substantially circular in a cross-sectional view. The cross-sectional view in this case indicates that the brush 151 is cut along an imaginary plane perpendicular to the rotation axis AX2 (FIG. 3). In this embodiment, the radius R and diameter 2R of the brush 151 respectively indicate the radius and diameter of the brush 151 in a cross-sectional view. In addition, in the example of FIG. 8, the diameter 2R of the brush 151 is smaller than the depth D of the notch 52 in the radial direction RD. Therefore, in a plan view, the entire brush 151 fits within the notch 52. Because the substrate W rotates in the rotation direction D1, the brush 151 moves relative to the notch 52. Therefore, the liquid repellent agent can be applied to the entire notch 52.

[0084] In particular, in this embodiment, the biasing mechanism 159 (FIG. 3) biases the brush 151 inward in the radial direction RD of the substrate W. Therefore, when the brush 151 is positioned in the notch 52 due to rotation of the substrate W, the brush 151 quickly enters the notch 52. As a result, the liquid repellent agent can be applied to the notch 52 more reliably.

[0085] Next, an example of a method for determining the radius R of the brush 151 will be described with reference to Fig. 7 and Fig. 9. As shown in Fig. 7, the width L of the notch 52 is expressed by formula (1). In formula (1), "Rw" represents the radius of the substrate W. "θ" represents the central angle relative to the notch 52. The unit of the central angle θ is "degrees."

[0086] L = 2π × Rw × (θ / 360) … (1)

[0087] Fig. 9 is a plan view showing the brush 151 and the notch 52. As shown in Fig. 9, the bottom point BM of the notch 52 is set as the origin 0, and the x and y coordinates are defined. Then, the notch 52 is approximated by a parabola y. Therefore, the notch 52 is expressed by equation (2). The coefficient a of equation (2) is expressed by equation (3).

[0088] y=a×x 2 …(2) a=y / x 2 =By / Ax 2 …(3)

[0089] The radius of curvature Rc at each point x of the parabola y is given by equation (4). "y1" represents the first derivative of equation (2) and is given by equation (5). "y2" represents the second derivative of equation (2) and is given by equation (6).

[0090] Rc=(1+y1 2 ) 3 / 2 / y2 …(4) y1=dy / dx …(5) y2=dy / dx …(6)

[0091] The radius of curvature R0 of the parabola y at the origin 0, that is, the radius of curvature R0 at the bottom point BM of the notch 52, is given by equation (7). That is, in equation (7), x=0.

[0092] R0=(1+(2a) 2 ×x 2 ) 3 / 2 / 2a=1 / 2a …(7)

[0093] In this embodiment, the radius of curvature R0 at the origin 0 is set to the radius R of the brush 151. As a result, the brush 151 can reliably enter the notch 52, and the liquid repellent agent can be reliably applied to the notch 52.

[0094] Here, as an example, the maximum value Rmx and minimum value Rmn of the radius R of the brush 151 are calculated.

[0095] First, the maximum value Rmx is calculated. In this case, if the radius Rw of the substrate W is 150 mm and the central angle θ is 2, then according to equation (1), the width L of the notch 52 is 5.24 mm. Furthermore, if Ax = 2.62 mm and By = 1.20 mm, then according to equation (3), the coefficient a is 0.175. By substituting the coefficient a into equation (7), the maximum value of the radius of curvature R0 is 2.86 mm. Therefore, the maximum value Rmx of the radius R of the brush 151 is set to 2.86 mm.

[0096] Next, the minimum value Rmn is calculated. In this case, if the radius Rw of the substrate W is 150 mm and the central angle θ is 1.5, then according to equation (1), the width L of the notch 52 is 3.93 mm. Furthermore, if Ax = 1.96 mm and By = 1.20 mm, then according to equation (3), the coefficient a is 0.31. By substituting the coefficient a into equation (7), the minimum value of the radius of curvature R0 is 1.61 mm. Therefore, the minimum value Rmn of the radius R of the brush 151 is set to 1.61 mm.

[0097] That is, for example, when the width L of the notch 52 is 3.93 mm or more and 5.24 mm or less, the radius R of the brush 151 is set to 1.61 mm or more and 2.86 mm or less.

[0098] Next, a substrate processing method according to this embodiment will be described with reference to Figures 1 to 3 and 10. The substrate processing method includes a liquid repellent agent application method. Figure 10 is a flowchart showing the substrate processing method according to this embodiment. As shown in Figure 10, the substrate processing method includes steps S1 to S10. Steps S1 to S10 are performed by a substrate processing apparatus 100.

[0099] First, in step S1, the liquid-repellent agent supply unit 17 (FIG. 2) supplies the liquid-repellent agent to the brush 151 while rotating the brush 151, which is located at the standby position P2 (FIG. 2). Specifically, the control unit 21 controls the rotation mechanism 158 (FIG. 3) so that the brush 151 rotates on its axis. As a result, the rotation mechanism 158 rotates the brush 151 on its axis. Furthermore, the control unit 21 controls the liquid-repellent agent supply unit 17 so that the liquid-repellent agent is supplied to the brush 151. As a result, the liquid-repellent agent supply unit 17 supplies the liquid-repellent agent to the brush 151. Note that the rotation of the brush 151 and the supply of the liquid-repellent agent may be performed simultaneously, or the rotation may be performed first and the supply of the liquid-repellent agent may be performed later, or the rotation may be performed later and the supply of the liquid-repellent agent may be performed first. Note that when the supply of the liquid-repellent agent to the brush 151 is completed, the rotation mechanism 158 stops the rotation of the brush 151.

[0100] Next, in step S2, the control unit 21 controls the center robot CR (FIG. 1) to load the substrate W into the liquid-repellent agent coating unit 5. As a result, the center robot CR loads the substrate W into the liquid-repellent agent coating unit 5 and causes the substrate W to be held by the spin chuck 13 (FIG. 3).

[0101] Next, in step S3, the control unit 21 controls the spin chuck 13 to rotate the substrate W. As a result, the spin chuck 13 rotates the substrate W.

[0102] Next, in step S4, the brush 151 comes into contact with the edge surface 51 of the rotating substrate W while rotating, and applies the liquid repellent agent to the edge surface 51 of the substrate W.

[0103] Specifically, the control unit 21 controls the rotation mechanism 158 so that the brush 151 rotates on its axis. As a result, the rotation mechanism 158 rotates the brush 151 on its axis. Then, the control unit 21 controls the swing arm 152 (FIG. 3) so that the brush 151 moves from the standby position P2 to the application position P1 (FIG. 2). As a result, the swing arm 152 moves the brush 151 from the standby position P2 to the application position P1. In other words, the control unit 21 controls the swing arm 152 so that the rotating brush 151 comes into contact with the edge surface 51 of the substrate W. As a result, the swing arm 152 brings the rotating brush 151 into contact with the edge surface 51 of the substrate W. Thus, the liquid-repellent agent is applied to the edge surface 51 of the substrate W. When the application of the liquid-repellent agent is completed, the swing arm 152 moves the brush 151 to the standby position P2, and the rotation mechanism 158 stops the rotation of the brush 151.

[0104] Next, in step S5, the control unit 21 controls the heating unit 20 (FIG. 3) to heat the liquid-repellent agent attached to the substrate W. As a result, the heating unit 20 heats the liquid-repellent agent and dries it. As a result, the liquid-repellent substance contained in the liquid-repellent agent adheres to the edge portion 51 of the substrate W.

[0105] Next, in step S6, the control unit 21 controls the spin chuck 13 to stop the rotation of the substrate W. As a result, the spin chuck 13 stops the rotation of the substrate W.

[0106] Next, in step S7, the control unit 21 controls the center robot CR to unload the substrate W from the liquid-repellent agent coating unit 5. As a result, the center robot CR unloads the substrate W from the liquid-repellent agent coating unit 5.

[0107] Next, in step S8, the control unit 21 controls the center robot CR to load the substrate W having the liquid-repellent substance attached to the edge surface 51 into the processing unit 1 (FIG. 1). As a result, the center robot CR loads the substrate W into the processing unit 1.

[0108] Next, in step S9, the control unit 21 controls the processing unit 1 to process the substrate W with the processing liquid. As a result, the processing unit 1 processes the substrate W with the processing liquid. As an example, the back surface nozzle 8 (FIG. 1) of the processing unit 1 discharges the processing liquid onto the back surface A2 of the substrate W to process the back surface A2 of the substrate W. As another example, the front surface nozzle 7 (FIG. 1) of the processing unit 1 discharges the processing liquid onto the front surface A1 of the substrate W to process the front surface A1 of the substrate W.

[0109] Next, in step S10, the control unit 21 controls the center robot CR to unload the substrate W from the processing unit 1. As a result, the center robot CR unloads the substrate W from the processing unit 1. Then, the processing ends.

[0110] 10, according to the substrate processing method of this embodiment, the brush 151 is brought into contact with the edge surface 51 of the substrate W, thereby applying the liquid repellent agent to the edge surface 51 of the substrate W (step S4). This prevents the liquid repellent agent from scattering, eliminating the need for a step of suctioning excess liquid repellent agent. This prevents excess liquid repellent agent from being applied to areas other than the edge surface 51 of the substrate W, while suppressing an increase in the number of processing steps.

[0111] Furthermore, according to this embodiment, even if the processing liquid is discharged onto the back surface A2 of the substrate W in step S9, for example, the processing liquid can be prevented from flowing around to the front surface A1 of the substrate W. This is because the liquid-repellent agent is applied to the edge surface 51 of the substrate W in step S4, and the liquid-repellent agent on the edge surface 51 of the substrate W is dried in step S5, so that the liquid-repellent material adheres to the edge surface 51 of the substrate W.

[0112] The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above embodiments and can be implemented in various forms without departing from the spirit of the present invention. Furthermore, the components disclosed in the above embodiments can be modified as appropriate. For example, some of the components shown in one embodiment may be added to the components of another embodiment, or some of the components shown in one embodiment may be deleted from the embodiment.

[0113] Furthermore, the drawings mainly show each component in a schematic manner to facilitate understanding of the invention, and the thickness, length, number, spacing, etc. of each component shown in the drawings may differ from the actual ones due to the convenience of creating the drawings. Furthermore, the configuration of each component shown in the above embodiment is merely an example and is not particularly limited, and it goes without saying that various modifications are possible within a range that does not substantially deviate from the effects of the present invention.

[0114] (1) In the embodiment described with reference to Figures 4 and 10, the brush 151 rotates on its axis by the rotation mechanism 158. However, the brush 151 may rotate on its axis following the rotation of the substrate W. Note that the brush 151 does not need to rotate on its axis as long as the liquid repellent agent can be applied to the edge surface 51 of the substrate W.

[0115] (2) In the embodiment described with reference to Fig. 10, after the liquid-repellent agent is applied to the substrate W, the processing unit 1 processes the substrate W with the processing liquid. However, after the liquid-repellent agent is applied to the substrate W, the liquid-repellent agent application unit 5 may process the substrate W with the processing liquid. In this case, the liquid-repellent agent application unit 5 includes a nozzle that ejects the processing liquid onto the substrate W. For example, the liquid-repellent agent application unit 5 may include a front surface nozzle 7 and / or a back surface nozzle 8.

[0116] (3) Although the brush 151 described with reference to Fig. 3 has a substantially cylindrical shape, the shape of the brush 151 is not particularly limited. It is sufficient that the portion of the brush 151 that comes into contact with the edge surface 51 of the substrate W has at least a substantially disk shape or a substantially cylindrical shape, for example. In this case, the radius R of the brush 151 to which the radius of curvature R0 is set indicates the radius of the portion of the brush 151 that comes into contact with the edge surface 51 of the substrate W. For example, the brush 151 may have an integrated shape in which a substantially inverted truncated cone-shaped portion, a substantially disk-shaped portion, and a substantially truncated cone-shaped portion are aligned in the axial direction AD.

[0117] (4) The spin chuck 13 described with reference to FIG. 3 is of the vacuum suction type, but may be of the clamping type or Bernoulli type, for example. [Industrial Applicability]

[0118] The present invention is suitably used in a substrate processing apparatus and a substrate processing method. [Explanation of symbols]

[0119] 13 Spin chuck (substrate holder) 17 Liquid repellent supply unit 100 Substrate processing apparatus 151 Brush (application part) 158 Rotation mechanism 159 Biasing mechanism 511 Surface edge 512 Surface shoulder 513 Back edge 514 Back shoulder 515 Side part W substrate

Claims

1. a substrate holder that holds a substrate and rotates the substrate; an application member that applies a liquid-repellent agent, including a liquid-repellent substance capable of repelling a processing liquid used to process the substrate, to the end surface of the substrate on the outer side in the radial direction by contacting the end surface of the substrate while the substrate is rotating; Equipped with In the substrate processing apparatus, the liquid repellent agent is a liquid and is soaked into the application member.

2. The substrate processing apparatus according to claim 1 , wherein the applying member applies the liquid repellent agent to the edge surface of the substrate while rotating.

3. the edge portion of the substrate has a front edge portion, a front shoulder portion, a side portion, a back shoulder portion, and a back edge portion; the front surface edge portion is located radially outward of the main body of the substrate on the front surface side of the front surface and the back surface of the substrate, the surface shoulder is located radially outward of the surface edge on the surface side, the rear surface edge portion is located radially outward from the main body of the substrate on the rear surface side, the rear surface shoulder is located radially outward of the rear surface edge on the rear surface side, the side surface portion is located at the outermost position in the radial direction of the substrate, The substrate processing apparatus according to claim 1 , wherein the applying member applies the liquid repellent agent to the side surface portion.

4. The substrate processing apparatus according to claim 3 , wherein the applying member applies the liquid repellent agent to the front surface shoulder portion, the side surface portion, and the rear surface shoulder portion.

5. The substrate processing apparatus according to claim 1 , wherein at least a portion of the applying member enters a notch present in the edge surface portion of the substrate and contacts a bottom point of the notch.

6. The substrate processing apparatus according to claim 5 , further comprising a biasing mechanism that biases the applying member toward an inner side in a radial direction of the substrate.

7. The substrate processing apparatus according to claim 1 , further comprising a liquid-repellent agent supplying unit that supplies the liquid-repellent agent to the applying member.

8. A substrate processing apparatus described in any one of claims 1 to 7, wherein the coating member contacts the end surface portion from the radially outer side.

9. The substrate is a main body having a pattern including a plurality of structures and being a portion radially inward of the end surface portion; the end surface portion and and 3. The substrate processing apparatus according to claim 1, wherein the applying member does not contact the main body and does not apply the liquid repellent agent to the main body.

10. A substrate processing apparatus described in any one of claims 1 to 9, wherein the portion of the coating member that contacts the end surface of the substrate is at least disk-shaped or cylindrical, and the side of the coating member contacts the end surface of the substrate.

11. The liquid repellent agent is a mixture of a solvent and the liquid repellent substance, a heating unit configured to heat a radially outer portion of the substrate including the end surface of the substrate; 11. The substrate processing apparatus according to claim 1, wherein the heating unit applies the liquid-repellent agent to the edge surface of the substrate using the application member, and then heats the radially outer portion of the substrate to evaporate the solvent from the liquid-repellent agent and adhere the liquid-repellent substance to the edge surface of the substrate.

12. A substrate processing apparatus as described in Claim 11, wherein the liquid-repellent substance is a polymer compound and is present on the end surface portion of the substrate.

13. rotating the substrate while holding the substrate; a step of applying a liquid-repellent agent containing a liquid-repellent substance capable of repelling a processing liquid for processing the substrate to the end surface of the substrate by bringing an application member into contact with the end surface of the substrate in the radially outer direction while the substrate is rotating; Including, The liquid repellent agent is a liquid and soaks into the application member.

14. The substrate processing method according to claim 13 , wherein in the step of applying the liquid repellent agent, the liquid repellent agent is applied to the edge surface of the substrate while the applying member is rotated on its axis.

15. the edge portion of the substrate has a front edge portion, a front shoulder portion, a side portion, a back shoulder portion, and a back edge portion; the front surface edge portion is located radially outward of the main body of the substrate on the front surface side of the front surface and the back surface of the substrate, the surface shoulder is located radially outward of the surface edge on the surface side, the rear surface edge portion is located radially outward from the main body of the substrate on the rear surface side, the rear surface shoulder is located radially outward of the rear surface edge on the rear surface side, the side surface portion is located at the outermost position in the radial direction of the substrate, 15. The substrate processing method according to claim 13, wherein in the step of applying the liquid-repellent agent, the liquid-repellent agent is applied to the side surface portion.

16. The substrate processing method according to claim 15 , wherein in the step of applying the liquid repellent agent, the liquid repellent agent is applied to the front surface shoulder portion, the side surface portion, and the back surface shoulder portion.

17. 17. The substrate processing method according to claim 13, wherein in the step of applying the liquid-repellent agent, at least a portion of the application member enters a notch present in the edge surface portion of the substrate and contacts a bottom point of the notch.

18. The substrate processing method according to claim 17 , wherein in the step of applying the liquid repellent agent, the applying member is biased toward an inner side in a radial direction of the substrate.

19. The substrate processing method according to claim 13 , further comprising the step of supplying the liquid repellent agent to the applying member.

20. A substrate processing method described in any one of claims 13 to 19, wherein the step of applying the liquid repellent agent includes a step of contacting the application member from the radially outer side of the end surface portion of the substrate while rotating.

21. The substrate, a main body having a pattern including a plurality of structures and being a portion radially inward of the end surface portion; the end surface portion and and 15. The substrate processing method according to claim 13, wherein the applying member does not contact the main body and does not apply the liquid repellent agent to the main body.

22. A substrate processing method described in any one of claims 13 to 21, wherein the portion of the coating member that contacts the end surface of the substrate is at least disk-shaped or cylindrical, and the side of the coating member contacts the end surface of the substrate.

23. The liquid repellent agent is a mixture of a solvent and the liquid repellent substance, heating a radially outer portion of the substrate including the end surface of the substrate; 23. The substrate processing method according to claim 13, wherein the step of heating the radially outer portion of the substrate comprises applying the liquid-repellent agent to the edge surface of the substrate in the step of applying the liquid-repellent agent, and then heating the radially outer portion of the substrate to evaporate the solvent from the liquid-repellent agent and adhere the liquid-repellent substance to the edge surface of the substrate.

24. A substrate processing method as described in Claim 23, wherein the liquid-repellent substance is a polymer compound and is present on the end surface portion of the substrate.

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