Substrate cleaning device, substrate cleaning method, and roll sponge for substrate cleaning device

Abstract

To provide a substrate cleaning apparatus, a substrate cleaning method, and a roll sponge for the substrate cleaning apparatus, with which it is possible to effectively clean a substrate.SOLUTION: A substrate cleaning apparatus includes a substrate holding part to hold a substrate, and a nozzle cleaning fluid supply part to supply a cleaning fluid to the substrate being held at an irradiation angle of not less than 5 degrees and less than 30 degrees.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a substrate cleaning apparatus, a substrate cleaning method, and a roll sponge for a substrate cleaning apparatus. [Background technology]

[0002] A substrate polishing apparatus first polishes a substrate and then cleans the substrate. For example, a roll sponge is used for cleaning the substrate. However, the substrate cleaning device included in a conventional substrate polishing apparatus does not necessarily clean the substrate effectively. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-246190 [Patent Document 2] Japanese Patent Application Laid-Open No. 2009-267368 Summary of the Invention [Problem to be solved by the invention]

[0004] In view of the above problems, there are provided a substrate cleaning apparatus and method capable of effectively cleaning substrates, and a roll sponge for use in the substrate cleaning apparatus. [Means for solving the problem]

[0005] According to one aspect of the present disclosure, there is provided a substrate cleaning apparatus comprising: a substrate holding unit that holds a substrate; and a nozzle cleaning liquid supply unit that supplies a cleaning liquid to the held substrate at an irradiation angle of 5 degrees or more and less than 30 degrees. By supplying the cleaning liquid to the substrate at an appropriate irradiation angle, the substrate can be cleaned effectively.

[0006] According to another aspect of the present disclosure, there is provided a substrate cleaning apparatus comprising: a substrate holding part for holding a substrate; and a nozzle for supplying a cleaning liquid to the held substrate, wherein a ratio Fy / Fx of a force component Fx in a direction parallel to the substrate and a force component Fy in a direction perpendicular to the substrate, of a force applied to the substrate by the cleaning liquid when the cleaning liquid is supplied, is 0.0875 or more and less than 0.577. By supplying the cleaning liquid to the substrate at an appropriate irradiation angle, the substrate can be cleaned effectively.

[0007] According to another aspect of the present disclosure, there is provided a substrate cleaning apparatus comprising: a substrate holding unit that holds a substrate; a cleaning unit that contacts at least a central portion of the held substrate to clean the substrate; and one or more nozzles that supply cleaning liquid to a portion of the held substrate, wherein when the cleaning unit contacts the substrate to clean the substrate, at least one of the nozzles supplies cleaning liquid to a position on the substrate that is different from the cleaning unit; and when the substrate is rinsed without the cleaning unit contacting the substrate, at least one of the nozzles supplies cleaning liquid to at least the central portion of the substrate. This allows the central portion of the substrate to be effectively cleaned as well.

[0008] It is desirable to provide a nozzle control unit that adjusts the supply position of the cleaning liquid from at least one of the nozzles. This allows the cleaning liquid to be supplied to a position on the substrate different from the cleaning portion during cleaning, and to the central portion of the substrate during rinsing.

[0009] The nozzle control unit is configured to rinse the substrate without the cleaning unit coming into contact with the substrate. At this time, it is desirable to move the supply position of the cleaning liquid from the center portion of the substrate to the outer periphery. This allows the cleaning liquid to be efficiently discharged outside the substrate.

[0010] According to another aspect of the present disclosure, there is provided a substrate cleaning apparatus comprising: a substrate holder for holding a substrate; a first nozzle for supplying a cleaning liquid to the held substrate; and a second nozzle for supplying a cleaning liquid to the held substrate, wherein the first nozzle and the second nozzle do not simultaneously supply cleaning liquid to the substrate. This prevents the cleaning liquid from the first nozzle and the cleaning liquid from the second nozzle from mixing, allowing the substrate W to be cleaned effectively.

[0011] It is desirable to provide a cleaning unit that contacts at least a central portion of the held substrate to clean the substrate, wherein the first nozzle supplies cleaning liquid to at least the central portion of the substrate, and the second nozzle supplies cleaning liquid to a position on the substrate different from the cleaning unit. This allows the central portion of the substrate to be effectively cleaned as well.

[0012] According to another aspect of the present disclosure, there is provided a substrate cleaning apparatus including a substrate holder that holds a substrate, and a nozzle that non-steadily supplies a cleaning liquid to the held substrate. By supplying the cleaning liquid non-steadily, pressure fluctuations can be applied to the substrate, allowing the substrate to be cleaned effectively.

[0013] The nozzle may supply the cleaning liquid intermittently, or may vary the amount of cleaning liquid supplied.

[0014] According to another aspect of the present disclosure, there is provided a substrate cleaning method comprising the steps of: contacting a cleaning unit with at least a central portion of a substrate; cleaning the substrate with the cleaning unit while supplying cleaning liquid to a position on the substrate different from the cleaning unit; moving the cleaning unit away from the substrate; and supplying cleaning liquid to at least the central portion of the substrate. This allows the central portion of the substrate to be effectively cleaned as well.

[0015] According to another aspect of the present disclosure, there is provided a roll sponge for a substrate cleaning apparatus, comprising a cylindrical roll body and a plurality of nodule portions protruding cylindrically outward from the outer circumferential surface of the roll body, wherein at least a portion of the surface of the plurality of nodule portions is devoid of a skin layer. By utilizing the properties of the skin layer, the substrate can be cleaned effectively. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a schematic plan view of a substrate processing apparatus including a substrate cleaning apparatus according to an embodiment of the present invention; [Figure 2] FIG. 1 is a perspective view schematically showing a substrate cleaning apparatus according to a first embodiment. [Figure 3] 1 is a cross-sectional view schematically showing a substrate W and a foreign substance P adhering to its surface. [Figure 4] 10 is a graph schematically showing the relationship between the irradiation angle θ and the removal rate. [Figure 5] FIG. 10 is a perspective view schematically showing a substrate cleaning apparatus according to a second embodiment. [Figure 6] FIG. 10 is a perspective view schematically showing the supply of a cleaning liquid in a cleaning process. [Figure 7] FIG. 10 is a perspective view schematically showing the supply of a cleaning liquid in a rinsing step. [Figure 8] FIG. 10 is a schematic perspective view of a substrate cleaning apparatus according to a third embodiment. [Figure 9] FIG. 10 is a schematic perspective view of a substrate cleaning apparatus according to a fourth embodiment. [Figure 10] FIG. 10 is a schematic perspective view of a substrate cleaning apparatus according to a fifth embodiment. [Figure 11] FIG. 10 is a schematic perspective view of a substrate cleaning apparatus according to a sixth embodiment. [Figure 12] FIG. 13 is a perspective view schematically showing a substrate cleaning apparatus according to a seventh embodiment. [Figure 13] FIG. 4 is a diagram showing timing of supplying cleaning liquid by nozzles 32a and 32b. [Figure 14] FIG. 22 is a diagram schematically showing a supply flow rate of a cleaning liquid according to an example of the eighth embodiment. [Figure 15] FIG. 22 is a diagram schematically showing the supply flow rate of a cleaning liquid according to another example of the eighth embodiment. [Figure 16] FIG. 3 is a diagram showing a first example of a roll sponge 33. [Figure 17] FIG. 10 is a diagram showing a second example of the roll sponge 33. [Figure 18] FIG. 10 is a diagram showing a third example of the roll sponge 33. [Figure 19] FIG. 10 is a diagram showing a fourth example of the roll sponge 33. [Figure 20] FIG. 10 is a diagram showing a first example of a pencil sponge 38. [Figure 21] FIG. 10 is a diagram showing a second example of the pencil sponge 38. [Figure 22] FIG. 10 is a diagram showing a third example of the pencil sponge 38. [Figure 23] FIG. 10 is a diagram showing a fourth example of the pencil sponge 38. [Figure 24] A figure showing a fifth example of pencil sponge 38. [Figure 25] FIG. 10 is a diagram showing another cleaning unit 391. [Figure 26] FIG. 10 is a diagram showing yet another cleaning unit 392. [Figure 27] FIG. 10 is a diagram showing yet another cleaning unit 393. [Figure 28] FIG. 10 is a diagram showing yet another cleaning unit 394. [Figure 29] FIG. 10 is a diagram showing yet another cleaning unit 395. DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, the embodiments will be described in detail with reference to the drawings.

[0018] Figure 1 is a schematic plan view of a substrate processing apparatus including a substrate cleaning apparatus according to this embodiment. As shown in Figure 1, this substrate processing apparatus has a substantially rectangular housing 1, the interior of which is partitioned by partitions 1a and 1b into a load / unload section 2, a polishing section 3, and a cleaning section 4. The load / unload section 2, polishing section 3, and cleaning section 4 are each assembled independently and evacuated independently. Substrates are polished in the polishing section 3. The polished substrates are cleaned and dried in the cleaning section 4. The substrate processing apparatus also has a control section 5 that controls the substrate processing operations.

[0019] The load / unload section 2 has two or more (four in this embodiment) front load sections 20 on which substrate cassettes for stocking a large number of substrates (e.g., semiconductor wafers) are placed. These front load sections 20 are disposed adjacent to the housing 1 and are arranged along the width direction (direction perpendicular to the longitudinal direction) of the substrate processing apparatus.

[0020] Furthermore, in the loading / unloading section 2, a traveling mechanism 21 is installed along the row of front loading sections 20, and two transfer robots (loaders) 22 that can move along the arrangement direction of the substrate cassettes are installed on this traveling mechanism 21. The transfer robots 22 are able to access the substrate cassettes loaded in the front loading section 20 by moving on the traveling mechanism 21. Each transfer robot 22 has two hands, one above and one below. The upper hand is used to return a processed substrate to the substrate cassette, and the lower hand is used to remove an unprocessed substrate from the substrate cassette, so that the upper and lower hands can be used interchangeably. Furthermore, the lower hand of the transfer robot 22 is configured to be able to rotate about its axis to flip the substrate over.

[0021] The polishing section 3 is an area where substrates are polished (flattened), and includes, for example, four substrate polishing apparatuses 3A to 3D arranged in order from the loading / unloading section 2 side.

[0022] The cleaning section 4 is an area where substrates are cleaned and dried, and is divided into a cleaning chamber 190, a transfer chamber 191, a cleaning chamber 192, a transfer chamber 193, and a drying chamber 194, in that order from the opposite side to the loading / unloading section 2.

[0023] In the cleaning chamber 190, two substrate cleaning devices 201 (shown in FIG. 1) are arranged in a vertical direction. Similarly, two substrate cleaning apparatuses 202 (only one of which is shown in FIG. 1) are arranged in the cleaning chamber 192 in a vertically aligned manner. The substrate cleaning apparatuses 201 and 202 are cleaning machines that clean substrates using a cleaning liquid. Since these substrate cleaning apparatuses 201 and 202 are arranged in a vertically aligned manner, an advantage is obtained in that the footprint area is small.

[0024] Two substrate drying apparatuses 203 (only one of which is shown in FIG. 1) are arranged vertically within drying chamber 194. These two substrate drying apparatuses 203 are isolated from each other. Filter fan units are provided above each substrate drying apparatus 203 to supply clean air into each substrate drying apparatus 203.

[0025] The substrate processing apparatus may be provided with a control unit 5 to control the substrate cleaning apparatuses 201, 202, or each of the substrate cleaning apparatuses 201, 202 may be provided with a control unit (control device).

[0026] Next, a transfer mechanism for transferring substrates will be described. As shown in Fig. 1, a linear transporter 6 is disposed adjacent to the substrate polishing apparatuses 3A and 3B. This linear transporter 6 transfers substrates between four transfer positions (referred to as transfer positions TP1 to TP4 in order from the load / unload unit 2 side) along the direction in which the substrate polishing apparatuses 3A and 3B are arranged.

[0027] A linear transporter 7 is disposed adjacent to the substrate polishing apparatuses 3C and 3D. The linear transporter 7 transports substrates between three transport positions (referred to as transport positions TP5 to TP7 in order from the load / unload unit 2 side) along the direction in which the substrate polishing apparatuses 3C and 3D are arranged.

[0028] The substrate is transported to the substrate polishing apparatuses 3A and 3B by a linear transporter 6. The substrate is transferred to the substrate polishing apparatus 3A at a transfer position TP2. The substrate is transferred to the polishing apparatus 3B at a transfer position TP3. The substrate is transferred to the substrate polishing apparatus 3C at a transfer position TP6. The substrate is transferred to the substrate polishing apparatus 3D at a seventh transfer position TP7.

[0029] At the transfer position TP1, a lifter 11 is disposed for receiving a substrate from the transfer robot 22. The substrate is delivered from the transfer robot 22 to the linear transporter 6 via this lifter 11. A shutter (not shown) is provided on the partition wall 1a, positioned between the lifter 11 and the transfer robot 22, and when the substrate is to be transferred, the shutter is opened to allow the substrate to be delivered from the transfer robot 22 to the lifter 11.

[0030] A swing transporter 12 is disposed between the linear transporters 6, 7 and the cleaning unit 4. The swing transporter 12 has a hand that can move between transfer positions TP4 and TP5, and the substrate is transferred from the linear transporter 6 to the linear transporter 7 by the swing transporter 12.

[0031] Substrates are transported to substrate polishing apparatus 3C and / or substrate polishing apparatus 3D by linear transporter 7. Substrates polished in polishing unit 3 are transported to cleaning unit 4 via swing transporter 12. A temporary substrate table 180 mounted on a frame (not shown) is disposed to the side of swing transporter 12. As shown in FIG. 1, this temporary table 180 is disposed adjacent to linear transporter 6 and is located between linear transporter 6 and cleaning unit 4.

[0032] (First embodiment) The first embodiment relates to a preferable irradiation angle of a cleaning liquid onto a substrate to be cleaned in a substrate cleaning apparatus.

[0033] 2 is a perspective view schematically showing a substrate cleaning apparatus according to a first embodiment. The substrate cleaning apparatus includes a substrate holder 31 that holds and rotates a substrate W to be cleaned substantially horizontally, and a nozzle 32 that supplies a cleaning liquid to the held substrate W. The nozzle 32 is a single-tube nozzle having a diameter of, for example, 1 mm, and sprays the cleaning liquid onto a narrow area on the substrate W. The cleaning liquid may be pure water or a chemical solution. In this specification, the angle formed between the substrate surface and the cleaning liquid sprayed from the nozzle 32 is defined as the irradiation angle θ.

[0034] First, we use a simplified model to theoretically derive an appropriate irradiation angle θ. 3 is a cross-sectional view schematically showing a substrate W and a foreign substance P adhering to its surface. Here, the foreign substance P is assumed to be a sphere with a radius a, and a cleaning liquid is supplied at an irradiation angle θ. In this case, it can be considered that a force F caused by the cleaning liquid acts on the hemisphere of the foreign substance P on the nozzle 32 side. The larger the moment M about the axis of contact A between the substrate W and the foreign substance P, the more easily the foreign substance P can be removed. This moment M can be derived as follows.

[0035]

number

[0036] Along the way, we took into consideration that Fx = Fcosθ and Fy = Fsinθ. As a result, the moment M is proportional to cosθ. In other words, it was found that the smaller the irradiation angle θ, the more easily the foreign matter P can be removed.

[0037] Next, we experimentally considered an appropriate irradiation angle θ. We conducted experiments in which a substrate W was contaminated and the cleaning liquid was supplied to the center of the substrate W at various irradiation angles θ to measure the removal rate of foreign particles.

[0038] Figure 4 is a graph showing a schematic relationship between the irradiation angle θ and the removal rate. As shown in the figure, in the range of θ = 15 to 40 degrees, the removal rate decreases as the irradiation angle θ increases. This agrees with the results obtained using Figure 3. When the irradiation angle θ exceeds 40 degrees, the removal rate becomes almost constant, which is thought to be because the fluid force of the cleaning liquid becomes constant. In any case, a large irradiation angle θ is not preferable because the cleaning power is low.

[0039] On the other hand, in the range where the irradiation angle θ is 10 degrees or less, the smaller the irradiation angle θ, the lower the removal rate, and the lower the removal rate becomes, especially when the irradiation angle θ is less than 5 degrees. This is because when the irradiation angle θ is too small, the supply This is thought to be because the supplied cleaning liquid branches (so-called liquid strings) on the substrate W, reducing the amount of cleaning liquid that reaches the foreign matter. Also, due to mechanical restrictions on the nozzle 32, it is difficult to make the irradiation angle θ too small.

[0040] From the above, it is preferable that the irradiation angle θ is 5 degrees or more and less than 40 degrees, and it is more preferable that it is 5 degrees or more and less than 30 degrees.

[0041] Here, the horizontal force component Fx (more precisely, the direction parallel to the substrate W) and the vertical force component Fy (more precisely, the direction perpendicular to the substrate W) that the cleaning liquid applies to the substrate W, and the irradiation angle θ satisfy the following relationship: tanθ=Fy / Fx

[0042] Therefore, in other words, the above-mentioned preferred irradiation angle θ is preferably set such that the ratio Fy / Fx of the vertical force Fy to the horizontal force Fx is in the range of 0.0875 (= tan5) or more and less than 0.839 (= tan40), and more preferably 0.0875 (= tan5) or more and less than 0.577 (= tan30).

[0043] As described above, in the first embodiment, the irradiation angle θ of the cleaning liquid is set to an appropriate value, so that the substrate W can be effectively cleaned. Note that the concept of this embodiment is applicable regardless of the specific configuration of the substrate cleaning apparatus, and for example, the substrate W may be held in a vertical direction. Furthermore, the nozzle 32 may supply the cleaning liquid to the underside of the substrate W instead of the top surface.

[0044] (Second embodiment) The second embodiment described next relates to a supply position of a cleaning liquid from a nozzle 32 in a substrate cleaning apparatus that cleans a substrate using a cleaning unit such as a roll sponge.

[0045] 5 is a perspective view schematically showing a substrate cleaning apparatus according to the second embodiment. The substrate cleaning apparatus includes a substrate holder 31, one or more nozzles 32, and a cleaning unit, a roll sponge 33. The roll sponge 33 extends horizontally and cleans the substrate W by contacting at least the center of the upper surface of the held substrate W.

[0046] The substrate cleaning apparatus first brings the roll sponge 33 into contact with the substrate W, and in this state supplies a cleaning liquid from the nozzle 32 to the upper surface of the substrate W to clean the substrate W (hereinafter referred to as the cleaning process). Next, the substrate cleaning apparatus separates the roll sponge 33 from the substrate W, and in this state supplies a cleaning liquid from the nozzle 32 to rinse the substrate W (hereinafter referred to as the rinsing process).

[0047] Here, in the cleaning process, the roll sponge 33 is in contact with the center of the substrate W. Therefore, the nozzle 32 supplies the cleaning liquid to a position shifted from the center of the substrate W so that the cleaning liquid does not collide with the roll sponge 33. In other words, in the cleaning process, not much cleaning liquid is supplied to the center of the substrate W.

[0048] If the nozzle 32 also supplies the cleaning liquid to a position shifted from the center of the substrate W in the subsequent rinsing step, the center of the substrate W will not be cleaned sufficiently.

[0049] Therefore, in this embodiment, in the cleaning step, the nozzle 32 supplies the cleaning liquid to a position shifted from the center of the substrate W, i.e., a position different from the roll sponge 33 (see FIG. 6). Then, after the roll sponge 33 is separated from the substrate W, in the rinsing step, the nozzle 32 supplies the cleaning liquid to a position including the central portion of the substrate W (see FIG. 7). This allows the central portion of the substrate W to be effectively cleaned as well.

[0050] There are various possible specific methods for switching the supply position of the cleaning liquid. For example, one nozzle 32 may be provided, and the supply position of the cleaning liquid from that nozzle 32 may be adjusted. Specific methods for doing this will be described in the third to sixth embodiments.

[0051] As another example, two or more nozzles 32 (for example, a single-tube nozzle and a fan-shaped nozzle that sprays the cleaning liquid in a spray-like manner) may be provided, and one nozzle 32 may supply the cleaning liquid to a position shifted from the center of the substrate W during the cleaning process, and another nozzle 32 may supply the cleaning liquid to a position including the center of the substrate W during the rinsing process.

[0052] Alternatively, two or more nozzles 32 may be provided, and the supply position of the cleaning liquid from one or more of the nozzles 32 may be adjusted.

[0053] As described above, in the second embodiment, in the cleaning step using the roll sponge 33, the cleaning liquid is supplied to a position different from the roll sponge 33, and in the rinsing step not using the roll sponge 33, the cleaning liquid is supplied to the central portion of the substrate W. Therefore, the central portion of the substrate W can also be effectively cleaned.

[0054] The preferred range of the irradiation angle θ from the nozzle 32 is as described in the first embodiment. The concept of this embodiment is applicable regardless of the specific configuration of the substrate cleaning apparatus, and for example, a roll sponge for cleaning the underside of the substrate W and a nozzle for supplying cleaning liquid to the underside of the substrate W may be provided. The substrate W may also be held in the vertical direction.

[0055] (Third embodiment) In the second embodiment, it has been described that the supply position of the cleaning liquid from the nozzle 32 may be adjusted. In the third to sixth embodiments described below, specific configuration examples in which the supply position of the cleaning liquid is adjusted will be shown.

[0056] 8 is a schematic perspective view of a substrate cleaning apparatus according to a third embodiment. The substrate cleaning apparatus includes four substrate holders 31, a nozzle 32, roll sponges 33a and 33b that contact the top and bottom surfaces of a substrate W, rotation mechanisms 34a and 34b that rotate the roll sponges 33a and 33b, guide rails 35, an elevation mechanism 36, and a nozzle control unit 60 that adjusts the position (supply direction) of cleaning liquid supplied by the nozzle 32. Note that while only the nozzle 32 that supplies cleaning liquid to the top surface of the substrate W held by the substrate holder 31 and the corresponding nozzle control unit 60 are illustrated, a nozzle that supplies cleaning liquid to the bottom surface of the substrate W and a corresponding nozzle control unit may also be provided.

[0057] The substrate holding parts 31 are, for example, rollers, and have a two-stage structure consisting of holding parts 311 and shoulder parts (support parts) 312. The diameter of the shoulder parts 312 is larger than the diameter of the holding parts 311, and the holding parts 311 are formed on the shoulder parts 312. At least some of the four substrate holding parts 31 (for example, two adjacent ones) can be moved toward and away from each other by a drive mechanism (for example, an air cylinder).

[0058] The rotation mechanism 34a rotates the upper roll sponge 33a. The rotation mechanism 34a is attached to a guide rail 35 that guides its vertical movement, and is supported by an elevation mechanism 36. The rotation mechanism 34a and the upper roll sponge 33a are moved vertically by the elevation mechanism 36.

[0059] Although not shown, a rotation mechanism 34b that rotates the lower roll sponge 33b is also attached to the guide rail, and the rotation mechanism 34b and the lower roll sponge 33b are moved up and down by a lifting mechanism not shown. The lifting mechanism 36 may be, for example, a motor-driven mechanism using a ball screw or an air shaft. Linda is used.

[0060] The roll sponges 33a and 33b are moved by the lifting mechanism 36 as follows. The roll sponges 33a and 33b are spaced apart from each other when the substrate W is being loaded or unloaded. That is, the roll sponge 33a is in a raised state, and the roll sponge 33b is in a lowered state.

[0061] In the cleaning step, the roll sponge 33a is lowered and the roll sponge 33b is raised, so that the roll sponge 33a comes into contact with the upper surface of the substrate W and the roll sponge 33b comes into contact with the lower surface of the substrate W.

[0062] In the rinsing step, the roll sponge 33a moves up and the roll sponge 33b moves down, so that the roll sponges 33a and 33b are separated from the substrate W.

[0063] The nozzle control unit 60 controls where on the substrate W the nozzle 32 supplies the cleaning liquid. Specifically, in the cleaning process, the nozzle control unit 60 controls the nozzle 32 so that the cleaning liquid is supplied to a position different from the roll sponge 33a (a position offset from the center of the substrate W). In addition, in the rinsing process, the nozzle control unit 60 controls the nozzle 32 so that the cleaning liquid is supplied from the nozzle 32 to the central part of the substrate W. It can also be said that the nozzle control unit 60 controls the direction in which the cleaning liquid is irradiated by the nozzle 32.

[0064] Specifically, the nozzle control unit 60 includes a tube 61 , a disk 62 , a motor 63 , a shaft 64 , a guide 65 , and a fixture 66 .

[0065] The tube 61 communicates with the nozzle 32 and guides the cleaning liquid to the nozzle 32. One end of the shaft 64 is fixed to the terminal end of the disk 62, which is rotated by the motor 63, and the other end is fixed to the distal end side of the nozzle 32. A vertically long opening is formed in the guide 65, into which the distal end of the nozzle 32 fits. An opening is formed in the fixture 66, into which the nozzle 32 passes.

[0066] Motor 63 rotates disk 62, which moves shaft 64. Nozzle 32 fixed to shaft 64 moves up and down along the opening of guide 65, and as a result, the angle of nozzle 32 changes around fixture 66 as an axis. This controls the direction in which the cleaning liquid is irradiated.

[0067] (Fourth embodiment) The fourth embodiment, which will be described next, differs from the third embodiment in the configuration of the nozzle control unit. The nozzle control unit will be described below.

[0068] 9 is a schematic perspective view of a substrate cleaning apparatus according to the fourth embodiment. A nozzle control unit 70 in the figure includes a cam 71, a motor 72, a shaft 73, a roller 74, a guide 75, and a fixture 76.

[0069] One end of shaft 73 is connected via roller 74 to cam 71, which is rotated by motor 72, and the other end is fixed to the end side of nozzle 32. A vertically long opening is formed in guide 75, into which the end of nozzle 32 fits. An opening is formed in fixture 76, and nozzle 32 passes through this opening.

[0070] When the motor 72 rotates the cam 71, the roller 74 moves along the shape of the cam 71. This causes the shaft 73 to move up and down, and the nozzle 32 fixed to the shaft 73 moves up and down along the opening of the guide 75. As a result, the angle of the nozzle 32 changes with the fixture 76 as the axis. This changes the direction in which the cleaning liquid is irradiated.

[0071] (Fifth embodiment) The fifth embodiment, which will be described next, differs from the third embodiment in the configuration of the nozzle control unit. The nozzle control unit will be described below.

[0072] 10 is a schematic perspective view of a substrate cleaning apparatus according to the fifth embodiment. A nozzle control unit 80 in the figure has a disk 81, a motor 82, and a shaft 83. Note that a cam may be used instead of the disk 81.

[0073] One end of the shaft 83 is connected to a disk 81 that is rotated by a motor 82, and the other end is fixed to the tip side of the nozzle 32. When the motor 82 rotates the disk 81, the position of the shaft 83 that is connected to the tip of the nozzle 32 changes. This controls the direction in which the cleaning liquid is applied.

[0074] (Sixth embodiment) The sixth embodiment, which will be described next, differs from the third embodiment in the configuration of the nozzle control unit. The nozzle control unit will be described below.

[0075] 11 is a schematic perspective view of a substrate cleaning apparatus according to the sixth embodiment. A nozzle control unit 90 in the figure has a robot arm 91 and a holder 92.

[0076] Robot arm 91 is rotatable around rotation axis 911, and has holder 92 attached to its tip. Holder 92 holds nozzle 32. When robot arm 91 rotates, the direction of nozzle 32 held by holder 92 changes. This controls the direction of application of the cleaning liquid.

[0077] Although several examples of nozzle control units have been given above, it goes without saying that various modifications are possible. For example, the nozzle control unit may include an elevation mechanism that raises and lowers the nozzle 32 (or a member that supports the nozzle 32), allowing the nozzle 32 to move up and down. Alternatively, the nozzle control unit may include a swing mechanism that swings the nozzle 32 (or a member that supports the nozzle 32) in a horizontal plane. In this case, the cleaning liquid may be discharged more effectively during the rinsing step by moving the supply position of the cleaning liquid from the center to the outer periphery of the substrate W. In any case, it is desirable that the nozzle control unit be configured to be able to supply the cleaning liquid to the center of the substrate W as well as to other positions.

[0078] As another configuration example, an arm may be attached to a support column, and one or more nozzles may be installed on the arm. A pen cleaning mechanism may be provided on the arm. The nozzle may be a single-tube nozzle, a fan-shaped nozzle, a two-fluid jet nozzle, a three-fluid jet nozzle, or any combination thereof. Furthermore, the nozzle may be movable in parallel within a horizontal plane by a nozzle control unit, may be movable vertically by the operation of the support column, or may be movable on a trajectory passing through the center of the substrate (or offset from the center) by rotating around the support column. When multiple nozzles are provided, only one of them may move on a trajectory passing through the center, and the others may move on trajectories offset from the center. The angle at which the cleaning liquid is emitted from the nozzle may be adjustable, and the appropriate angle is as described in the first embodiment.

[0079] The nozzles may supply the same or different chemicals. The chemicals may be alkaline, acidic, or neutral, or may be pure water, pure water mixed with gas, functional water, or pure water mixed with a small amount of chemical.

[0080] (Seventh embodiment) The seventh embodiment described next relates to the timing of supplying a cleaning liquid from each nozzle 32 in a substrate cleaning apparatus having a plurality of nozzles 32. The following description will focus on the differences from the first embodiment.

[0081] 12 is a perspective view schematically illustrating a substrate cleaning apparatus according to a seventh embodiment. The substrate cleaning apparatus includes a substrate holder 31 and two nozzles 32a and 32b. As an example, nozzle 32a is a single-tube nozzle, and nozzle 32b is a fan-shaped nozzle. Alternatively, nozzles 32a and 32b may be nozzles that spray multiple fluids. Furthermore, one nozzle 32a may supply cleaning liquid to the central portion of the substrate W, and the other nozzle 32b may supply cleaning liquid to a portion other than the central portion of the substrate W (for example, the outer periphery). The cleaning liquid from nozzle 32a may be the same as or different from the cleaning liquid from nozzle 32b.

[0082] When the cleaning liquid is supplied from the two nozzles 32a and 32b simultaneously, the cleaning effect may be reduced in an area on the substrate W where the cleaning liquid from the nozzle 32a and the cleaning liquid from the nozzle 32b mix together.

[0083] 13, the nozzles 32a and 32b are prevented from simultaneously supplying the cleaning liquid to the substrate W. More specifically, first, the nozzle 32a supplies the cleaning liquid to the substrate W. Then, after the supply of the cleaning liquid from the nozzle 32a is stopped, the nozzle 32b supplies the cleaning liquid to the substrate W. Thereafter, after the supply of the cleaning liquid from the nozzle 32b is stopped, the nozzle 32a supplies the cleaning liquid to the substrate W. Of course, there may be a period during which neither the nozzles 32a nor 32b supplies the cleaning liquid.

[0084] As described above, in the seventh embodiment, the nozzles 32a and 32b exclusively supply the cleaning liquid to the substrate W, thereby effectively cleaning the substrate W. Even if three or more nozzles are provided, it is sufficient that these nozzles exclusively supply the cleaning liquid to the substrate W.

[0085] (Eighth embodiment) The eighth embodiment, which will be described next, non-steadily supplies the cleaning liquid from the nozzle 32. The configuration of the substrate cleaning apparatus is similar to that shown in FIG.

[0086] 14 is a diagram schematically illustrating the supply flow rate of the cleaning liquid according to an example of the eighth embodiment. In this example, the nozzle 32 supplies the cleaning liquid intermittently. For example, the nozzle 32 supplies the cleaning liquid during periods T1, T3, and T5, and does not supply the cleaning liquid during periods T2 and T4 therebetween. In other words, the periods during which the cleaning liquid is supplied and the periods during which the cleaning liquid is not supplied are alternately repeated.

[0087] During periods T2 and T4 when no cleaning liquid is supplied, the film of cleaning liquid disappears on the substrate W. In such a state, the cleaning liquid is suddenly supplied (periods T3 and T5) to give a shock (pressure fluctuation) to the substrate W, thereby improving the cleaning effect.

[0088] Such control is realized, for example, by opening and closing an electromagnetic valve at the base of the nozzle 32.

[0089] 15 is a diagram schematically illustrating the supply flow rate of the cleaning liquid according to another example of the eighth embodiment. In this example, the nozzle 32 varies the supply rate of the cleaning liquid. For example, the nozzle 32 gradually reduces the supply rate of the cleaning liquid during a period T11, suddenly increases the supply rate during a subsequent period T12, keeps the supply rate almost constant during a subsequent period T13, and suddenly reduces the supply rate during a subsequent period T14. In other words, the supply rate of the cleaning liquid gradually decreases / increases, suddenly decreases / increases, or remains almost constant.

[0090] This embodiment also makes it possible to apply a shock to the substrate W, particularly during the period when the supply amount of cleaning liquid is rapidly increased, thereby improving the cleaning effect.

[0091] Such control is achieved, for example, by using a regulator to adjust the pressure applied to a supply tank at the base of the nozzle 32.

[0092] In this way, in the eighth embodiment, the cleaning liquid is non-steadily supplied from the nozzle to one substrate W, thereby improving the cleaning power.

[0093] (Ninth embodiment) The ninth embodiment described next relates to the surface material of the roll sponge 33.

[0094] When the roll sponge 33 is manufactured by molding a resin such as polyvinyl alcohol (PVA), a surface layer (hereinafter referred to as a skin layer) that contacts the mold during molding and an underlying layer are formed. When there is no skin layer and the underlying layer is exposed, it is also called a lack of a skin layer.

[0095] The skin layer is a hard layer with a thickness of about 1 to 10 μm and small pores with a diameter of several μm to several tens of μm. Therefore, it is easy to retain the cleaning solution, but there is a risk of damaging the surface of the substrate during cleaning.

[0096] On the other hand, the lower layer without the skin layer has large pores ranging from 10 μm to several hundred μm in diameter and is a soft layer. This allows it to fit easily to the surface of the substrate and is less likely to damage the surface. Furthermore, the cleaning solution can easily flow in and out.

[0097] Taking the above characteristics into consideration, it is desirable to design which parts of the roll sponge 33 are to be skin layers and which parts are to lack the skin layer. Various specific embodiments are conceivable.

[0098] FIG. 16 is a diagram showing a first example of a roll sponge 33. FIG. 16(a) is a longitudinal side view of a roll sponge 33a, and FIG. 16(b) is a side view of FIG. 16(a). In FIG. 16 and subsequent figures, spotted areas indicate areas where the skin layer is absent. The roll sponge 33 has a cylindrical roll body 331 and multiple nodule portions 332 that protrude outward in a cylindrical shape from the outer peripheral surface of the roll body 331. As shown in the figure, only both side surfaces of the roll body 331 may be absent from the skin layer. In other words, the roll body 331 may be covered with a skin layer other than both side surfaces.

[0099] 17 is a diagram showing a second example of the roll sponge 33. As shown in the figure, the skin layer may be absent only on the surface of the roll body 331 and the side surfaces of the nodule portions 332. In other words, the side surfaces of the roll body 331 and the tips of the nodule portions 332 may be covered with a skin layer.

[0100] 18 is a diagram showing a third example of the roll sponge 33. As shown in the figure, the skin layer may be absent only at the tip of the nodule portion 332. In other words, the side surfaces of the roll body 331 and the nodule portion 332 may be covered with the skin layer.

[0101] 19 is a diagram showing a fourth example of the roll sponge 33. As shown in the figure, the skin layer may be absent only at the tips of some of the nodule portions 332. In other words, other than the tips of these nodule portions 332, the other nodule portions 332 and the roll body 331 may be covered with the skin layer.

[0102] Alternatively, all surfaces of the roll sponge 33 may be covered with a skin layer, or all surfaces may lack a skin layer. Any two or more of the exemplified roll sponges 33 may be combined, and the surface, side surfaces, and side surfaces and / or tips of the nodule portions 332 of the roll body 331 may lack a skin layer or may be covered with a skin layer in part or in whole.

[0103] (Tenth embodiment) The tenth embodiment described next relates to a cleaning unit having a shape other than that of the roll sponge 33. First, a case will be described in which the cleaning unit is a pencil sponge that comes into contact with a portion including the center of the substrate W and performs cleaning while rotating.

[0104] 20 is a diagram showing a first example of a pencil sponge 38. The pencil sponge 38 in this figure is cylindrical, and its underside is the cleaning surface. As shown in the figure, only the side surfaces may lack a skin layer. In other words, the upper and lower surfaces may be covered with a skin layer.

[0105] 21 is a diagram showing a second example of a pencil sponge 38. As shown in the figure, only the side and bottom surfaces may lack a skin layer. In other words, the top surface may be covered with a skin layer.

[0106] 22 is a diagram showing a third example of a pencil sponge 38. As shown in the figure, only the upper surface may lack a skin layer, that is, the side and lower surfaces may be covered with a skin layer.

[0107] 23 is a diagram showing a fourth example of a pencil sponge 38. As shown in the figure, only the lower surface may lack a skin layer. In other words, the side and upper surfaces may be covered with a skin layer.

[0108] FIG. 24 is a diagram showing a fifth example of pencil sponge 38. Pencil sponge 38 in the same figure has a plurality of nodule portions 381 protruding cylindrically from the underside. Only the underside of nodule portion 381 may be covered with a skin layer, or the entire surface of nodule portion 381 may be free of a skin layer, or only the side surfaces of nodule portion 381 may be free of a skin layer, or only the tips of nodule portion 381 may be free of a skin layer, or only the tips of some nodule portions 381 may be free of a skin layer. In addition, any of the nodule portions 381 described above may be added to pencil sponges 38 shown in each of FIGS. 20 to 23.

[0109] Alternatively, the entire surface may be covered with a skin layer, or the entire surface may be devoid of a skin layer.

[0110] 25 is a diagram showing another cleaning unit 391. This cleaning unit 391 has a circular brush 391b attached approximately at the center of a base unit 391a and four brushes 391c arranged at equal intervals and extending in the radial direction, the undersides of which constitute the cleaning surface. The base unit 391a, brushes 391b, and / or brushes 391c may be partially or entirely devoid of a skin layer, or both cleaning surfaces may be covered with a skin layer.

[0111] 26 is a diagram showing yet another cleaning unit 392. This cleaning unit 392 has a cross-shaped brush 392b attached to a base 392a, the underside of which is the cleaning surface. The brush 392b has an opening in the center, through which cleaning liquid may be supplied. The base 392a and / or the brush 392b may be partially or entirely devoid of a skin layer, or may be covered with a skin layer.

[0112] 27 is a diagram showing another cleaning unit 393. This cleaning unit 393 has scrubbing members A sponge portion 393b and a brush portion 393c are formed on a part of scrubbing member 393a. Part or all of scrubbing member 393a, sponge portion 393b, and / or brush portion 393c may be free of a skin layer or may be covered with a skin layer.

[0113] 28 is a diagram showing yet another cleaning unit 394. This cleaning unit 394 has protrusions 394b and 394c formed on a sheet 394a. Protrusion 394b extends in a ridge-like manner from near the center of sheet 394a to the outer periphery, and protrusion 394c extends in a ridge-like manner from the outer periphery of protrusion 394b to the outer periphery of sheet 394a. Part or all of protrusions 394b and / or protrusions 394c may be free of a skin layer or may be covered with a skin layer.

[0114] 29 is a diagram showing yet another cleaning unit 395. This cleaning unit 395 has a base 395a and a brush 395b attached to the underside thereof. Part or all of the brush 395b may lack a skin layer, or may be covered with a skin layer.

[0115] The above-described embodiments may be combined in any desired manner. The substrate cleaning apparatus described above can be applied to a bevel polishing apparatus for polishing the bevel of a substrate, a back surface polishing apparatus for polishing the back surface, a partial polishing apparatus for partial polishing, and even a cleaning apparatus for an exposure apparatus, in addition to the substrate processing apparatus shown in FIG.

[0116] The operations in each embodiment can also be performed using the following software / system. The software / system is composed of, for example, a main controller having a CPU, memory, recording medium, and software, a unit controller, and a unit that executes the operations. In each embodiment, taking the substrate cleaning device as the unit, the unit controller controls the amount, angle, time, and positional movement of fluid (cleaning liquid) sprayed from multiple nozzles, as well as the position and rotational speed of the roll. The main controller monitors this control and issues operational instructions. Sensors required for control include a pressure sensor for supplying cleaning liquid to the nozzles, a position sensor such as an encoder, a timer, a roll position sensor, a load cell for measuring friction, a rotational speed sensor, and the like. Furthermore, software can be installed later by updating the initial software.

[0117] The above-described embodiments have been described for the purpose of enabling a person of ordinary skill in the art to practice the present invention. Various modifications of the above-described embodiments would naturally be possible for a person skilled in the art, and the technical concept of the present invention may also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but should be accorded the broadest scope consistent with the technical concept defined by the claims. [Explanation of symbols]

[0118] 31 Board holding part 32, 32a, 32b nozzle 33, 33a, 33b Roll sponge 331 Roll body 332 Nodule 60 Nozzle control unit

Claims

1. A cylindrical roll body; a plurality of nodule portions protruding outward in a cylindrical shape from the outer circumferential surface of the nozzle; The nodule portions have no skin layers on their sides, The roll sponge for a substrate cleaning device, wherein tips of the plurality of nodule portions are covered with a skin layer.

2. The roll sponge according to claim 1 , wherein the surface of the roll body is covered with a skin layer.

3. The roll sponge according to claim 1 or 2, wherein the surface of the roll body is devoid of a skin layer.

Images