RF immunosensor probe for monitoring the temperature of an electrostatic chuck in a substrate processing system

Abstract

To provide a sensor probe that is not affected by RF signals (RF bias signals, electrode signals, etc.) present in a temperature sensing environment.SOLUTION: In a substrate support 300, a sensor probe 190 includes an elongate body 330 that defines a cylindrical cavity 332 having an inner diameter. A printed circuit board 354 (such as a flexible PCB) fits into the cylindrical cavity. The sensor probe includes a first temperature sensing integrated circuit that is attached to a first end of the printed circuit board 354, and a cap is attached to a first end 334 of the elongate body 330. A threaded housing 336 at one end of the elongate body 330 receives a second end of the printed circuit board 354 and is attached to a base plate 310 of the substrate support.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This disclosure is a PCT international application of U.S. Patent Application No. 62 / 854,476, filed May 30, 2019. The entire disclosure of the above application is incorporated herein by reference.

[0002] The present disclosure relates generally to substrate processing systems, and more particularly to a sensor probe for monitoring the temperature of an electrostatic chuck in a substrate processing system. [Background technology]

[0003] The discussion of the background art provided herein is for the purpose of generally presenting the contents of the present disclosure, and the inventions of the presently named inventors are not admitted expressly or impliedly as prior art to the present disclosure, to the extent that they are described in this background art section or in aspects of the description that are not prior art at the time of filing.

[0004] Substrate processing systems perform processes on substrates, such as semiconductor wafers. Examples of substrate processing include deposition, ashing, etching, cleaning, and / or other processes. For substrate processing, a process gas mixture may be supplied to a processing chamber. A plasma may be used to ignite the gases to promote a chemical reaction.

[0005] A substrate is placed on a substrate support within a processing chamber during processing. Temperature changes in the substrate support can affect the processing. For example, deposition or etching rates may be affected by different temperatures at different locations on the substrate. As a result, deposition or etching may be different at different locations. Some substrate supports include embedded temperature sensors to sense temperatures in multiple zones. In some examples, each zone of the multiple zones includes one or more redundant temperature sensors to serve as a backup in case a temperature sensor in that zone fails. If all temperature sensors in one zone of the multiple zones fail, the substrate support must be replaced, which can be costly. Summary of the Invention

[0006] The sensor probe includes an elongated body defining an internal cavity having an inner diameter. A printed circuit board is configured to fit within the internal cavity. A first temperature-sensing integrated circuit is mounted to a first end of the printed circuit board. A cap is mounted to the first end of the elongated body adjacent to the first temperature-sensing integrated circuit. A housing is configured to receive the second end of the elongated body. The housing is configured to be mounted to a base plate of a substrate support.

[0007] In other features, the printed circuit board has a width that is less than the inner diameter and a length that is greater than the elongate body, the inner diameter being less than or equal to 3 mm, and at least two of the three orthogonal dimensions of the first temperature sensing integrated circuit being less than 3 mm.

[0008] In other features, a potting material connects the cap and the first temperature-sensing integrated circuit. The printed circuit board is flexible and can be bent at an angle adjacent to the first temperature-sensing integrated circuit. The cap has first and second legs extending from one side thereof and received in an internal cavity of the extension body. The extension body is mutually received in the housing. The extension body has a protrusion and further includes a spring positioned around the extension body to bias between the internal cavity of the housing and the protrusion.

[0009] In other features, the first temperature sensing integrated circuit senses the temperature of a surface in contact with the cap, the surface being a layer within the electrostatic chuck.

[0010] In other features, the extension includes a radial protrusion that centers the extension within the cavity of the base plate. The extension includes a slot, the slot having an elongated oval shape and aligned axially of the extension.

[0011] In other features, a shielding layer is disposed on at least one surface of the printed circuit board. The housing defines an inclined surface. An O-ring is disposed between the housing and the cavity in the base plate against the inclined surface.

[0012] In other features, the printed circuit board is flexible. A connector is connected to a second end of the printed circuit board. A plurality of wires are connected to traces on the printed circuit board by the connector. A second temperature sensing integrated circuit is mounted on the printed circuit board between the first temperature sensing integrated circuit and the second end of the printed circuit board.

[0013] The sensor probe includes an elongated body defining an internal cavity having an inner diameter. A first printed circuit board is configured to fit within the internal cavity. A temperature sensing integrated circuit is mounted on the first printed circuit board. A housing is configured to receive one end of the elongated body and is configured to be mounted to a base plate of the board support. A second printed circuit board is disposed within the housing. A plurality of first conductors connect the first printed circuit board to the second printed circuit board. A plurality of second conductors are configured to connect the second printed circuit board to an external device.

[0014] In other features, the first printed circuit board has a width less than the inner diameter and a length less than the length of the extension body. The second printed circuit board has a length less than the length of the housing. The inner diameter is 3 mm or less, and at least two of the three orthogonal dimensions of the temperature sensing integrated circuit are less than 3 mm.

[0015] In other features, the potting material is located inside the elongated body. The first printed circuit board and the temperature sensing integrated circuit are mounted parallel to the length of the elongated body. The temperature sensing integrated circuit senses the temperature of a surface in contact with the temperature sensing integrated circuit. The surface is a layer within the electrostatic chuck. The elongated body includes a radial protrusion that positions the elongated body in the center of the cavity in the base plate.

[0016] In other features, the elongated body includes a slot. The slot has an elongated oval shape and is aligned axially of the elongated body. The capacitor is connected to the first printed circuit board. The resistor is connected to the second printed circuit board. The shielding layer is disposed on a surface of the first printed circuit board.

[0017] The sensor probe includes an elongated body defining an internal cavity having an inner diameter. The temperature-sensing integrated circuit is configured to fit within the internal cavity. The housing is configured to receive one end of the elongated body and is configured to be attached to a base plate of a substrate support. A plurality of conductors extend through the housing and the elongated body and are configured to connect the temperature-sensing integrated circuit to an external device.

[0018] In other features, the inner diameter is 3 mm or less and at least two of the three orthogonal dimensions of the temperature sensing integrated circuit are less than 3 mm. The potting material is located inside the elongated body. The temperature sensing integrated circuit is attached parallel to the length of the elongated body. The temperature sensing integrated circuit is attached perpendicular to the length of the elongated body.

[0019] In other features, the temperature sensing integrated circuit senses the temperature of a surface in contact therewith, the surface being a layer within the electrostatic chuck. The elongated body includes a radial protrusion that centers the elongated body within the cavity in the base plate.

[0020] In other features, the elongated body includes a slot. The slot has an elongated oval shape and is aligned axially of the elongated body. A plurality of solder balls are attached to the temperature sensing integrated circuit. A plurality of first conductors are attached to the plurality of solder balls.

[0021] Further areas of applicability of the present disclosure will become apparent from the detailed description, the claims, and the drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure. [Brief explanation of the drawings]

[0022] The present disclosure will become better understood from the detailed description and the accompanying drawings.

[0023] [Figure 1] 1 is a functional block diagram of an exemplary capacitively coupled plasma (CCP) substrate processing system including a sensor probe according to the present disclosure.

[0024] [Figure 2] 1 is a functional block diagram of an exemplary inductively coupled plasma (ICP) substrate processing system including a sensor probe according to the present disclosure.

[0025] [Figure 3] 1 is a cross-sectional side view of an exemplary substrate support with a sensor probe according to the present disclosure.

[0026] [Figure 4A] FIG. 2 is a side view of an exemplary sensor probe according to the present disclosure.

[0027] [Figure 4B] 1 is a cross-sectional side view of an exemplary sensor probe according to the present disclosure.

[0028] [Figure 5] 1 is a plan view of an exemplary printed circuit board according to the present disclosure.

[0029] [Figure 6] FIG. 2 is an enlarged partial side view of an exemplary sensor probe body according to the present disclosure.

[0030] [Figure 7] 1 is an electrical circuit functional block diagram of an exemplary control circuit including a temperature sensing integrated circuit, a resistor, and a capacitor according to the present disclosure.

[0031] [Figure 8] 1 is a side view illustrating an example mounting of a temperature sensing integrated circuit on a printed circuit board according to the present disclosure.

[0032] [Figure 9A] 1 is a side view illustrating an example of mounting a temperature sensing integrated circuit and a printed circuit board to a metal cap according to the present disclosure. [Figure 9B] 1 is a side view illustrating an example of mounting a temperature sensing integrated circuit and a printed circuit board to a metal cap according to the present disclosure.

[0033] [Figure 10A] 10A and 10B are side views illustrating example potting of a temperature sensing integrated circuit into a cap according to the present disclosure. [Figure 10B] 10A and 10B are side views illustrating example potting of a temperature sensing integrated circuit into a cap according to the present disclosure.

[0034] [Figure 11A] 1 is a side view illustrating an example of inserting a printed circuit board, a temperature sensing integrated circuit, and a cap into a sensor probe body according to the present disclosure. [Figure 11B] 1 is a side view illustrating an example of inserting a printed circuit board, a temperature sensing integrated circuit, and a cap into a sensor probe body according to the present disclosure.

[0035] [Figure 12] FIG. 10 is a side view of another exemplary sensor probe according to the present disclosure.

[0036] [Figure 13] FIG. 10 is a cross-sectional side view of another exemplary sensor probe according to the present disclosure.

[0037] [Figure 14] 1 is a cross-sectional side view of a PCB with metal layers for EMI shielding according to the present disclosure.

[0038] [Figure 15] FIG. 10 is a cross-sectional side view of another exemplary sensor probe according to the present disclosure.

[0039] In the drawings, reference numbers may be repeated to identify similar and / or identical elements. DETAILED DESCRIPTION OF THE INVENTION

[0040] The present disclosure relates to a sensor probe for sensing the surface temperature of a substrate in a processing chamber. The sensor probe includes a temperature-sensing integrated circuit. In some examples, the temperature-sensing integrated circuit is located within a body made of metal and connected to a reference potential (such as ground). For example, the body may be grounded to a base plate. As a result, the body of the sensor probe functions as a Faraday cage, and the sensor probe is not affected by RF signals (such as RF bias signals, electrode signals, etc.) present in the temperature sensing environment. Alternatively, the body may be made of a metallic or non-metallic material, and a ground plane or electromagnetic shield may be used to reduce or further reduce electromagnetic interference (EMI).

[0041] In some examples, the temperature sensing integrated circuit has a small form factor of less than 3 mm in at least two of three orthogonal dimensions. In some examples, the temperature sensing integrated circuit has a small form factor of less than 2 mm in all three orthogonal dimensions. In some examples, the body of the sensor probe has an outer diameter of 4 mm or less and an inner diameter of 3 mm or less.

[0042] 1 and 2, an exemplary plasma processing chamber in which the sensor probe may be used is shown. As can be appreciated, the sensor probe may be used in a variety of other types of semiconductor processing equipment, such as cooling pedestals, spin chucks, and processing chambers. FIG. 1 illustrates an exemplary substrate processing system 110 according to the present disclosure. The substrate processing system 110 includes a processing chamber 122 that surrounds the other components of the substrate processing system 110 and contains an RF plasma (if used). The substrate processing system 110 includes an upper electrode 124 and a substrate support 126 (such as an electrostatic chuck (ESC)). During operation, a substrate 128 is positioned on the substrate support 126.

[0043] By way of example only, the upper electrode 124 may include a gas distribution device 129, such as a showerhead, for introducing and distributing process gases. The gas distribution device 129 may include a stem portion having one end coupled to the upper surface of the processing chamber. A base portion is generally cylindrical and extends radially outward from the other end of the stem at a location away from the upper surface of the processing chamber. The substrate-facing surface or faceplate of the showerhead base portion includes a plurality of holes through which precursors, reactants, etching gases, inert gases, carrier gases, other process gases, or purge gases may flow. Alternatively, the upper electrode 124 may include a conductive plate, and process gases may be introduced in other ways.

[0044] The substrate support 126 includes a base plate 130 that functions as a lower electrode. The base plate 130 supports a heating plate 132, which may correspond to a ceramic multi-zone heating plate. A thermal resistance layer 134 may be disposed between the heating plate 132 and the base plate 130. The base plate 130 may include one or more channels 136 for flowing a coolant therethrough.

[0045] The RF generation system 140 generates and outputs an RF voltage to one of the upper electrode 124 and the lower electrode (e.g., the base plate 130 of the substrate support 126). The other of the upper electrode 124 and the base plate 130 may be DC grounded, AC grounded, or floating. By way of example only, the RF generation system 140 may include an RF generator 142 that generates RF plasma power supplied to the upper electrode 124 or the base plate 130 by a matched distribution network 144. In other examples, the plasma may be generated inductively or indirectly.

[0046] Gas supply system 150 includes one or more gas sources 152-1, 152-2, ..., and 152-N (collectively, gas sources 152), where N is an integer greater than zero. Gas sources 152 are connected to manifold 160 by valves 154-1, 154-2, ..., and 154-N (collectively, valves 154) and MFCs 156-1, 156-2, ..., and 156-N (collectively, MFCs 156). Secondary valves may be used between MFCs 156 and manifold 160. Although a single gas supply system 150 is shown, more than one gas supply system may be used.

[0047] The temperature controller 163 may be connected to a plurality of thermal control elements (TCEs) 164 disposed on the heating plate 132. The temperature controller 163 may be used to control the plurality of TCEs 164 to control the temperature of the substrate support 126 and the substrate 128. The temperature controller 163 may be in communication with a coolant assembly 166 to control the flow of coolant through the flow passages 136. For example, the coolant assembly 166 may include a coolant pump, a reservoir, and / or one or more temperature sensors. The temperature controller 163 operates the coolant assembly 166 to selectively flow coolant through the flow passages 136 to cool the substrate support 126.

[0048] A valve 170 and a pump 172 may be used to evacuate reactants from the processing chamber 122. A system controller 180 may be used to control the components of the substrate processing system 110. One or more sensor probes 190 may be inserted into cavities defined in the substrate support to sense the surface temperature.

[0049] 2 illustrates another exemplary substrate processing system 210. The substrate processing system 210 includes a coil driver circuit 211. A pulse circuit 214 may be used to pulse the RF power on and off or to vary the amplitude or level of the RF power. A tuning circuit 213 may be directly connected to one or more induction coils 216. The tuning circuit 213 tunes the output of the RF source 212 to a desired frequency and / or a desired phase, matches the impedance of the coils 216, and isolates power between the coils 216. In some examples, the coil driver circuit 211 is replaced with one of the driver circuits described further below, along with control of the RF bias.

[0050] In some examples, a plenum 220 may be disposed between the coil 216 and the dielectric window 224 to control the temperature of the dielectric window 224 by hot and / or cold air flow. The dielectric window 224 is disposed along one side of the processing chamber 228. The processing chamber 228 further includes a substrate support (or pedestal) 232. The substrate support 232 may include an electrostatic chuck (ESC), a mechanical chuck, or another type of chuck. Process gases are supplied to the processing chamber 228, and a plasma 240 is generated within the processing chamber 228. The plasma 240 etches the exposed surface of the substrate 234. A driver circuit 252 (e.g., one of the driver circuits described below) may be used to provide an RF bias to an electrode of the substrate support 232 during operation.

[0051] A gas supply system 256 may be used to supply a process gas mixture to the processing chamber 228. The gas supply system 256 may include a process gas and an inert gas source 257, a gas metering system 258 such as valves and mass flow controllers, and a manifold 259. A gas supply system 260 may be used to supply gas 262 to the plenum 220 through a valve 261. The gas may include a cooling gas (cooling air) used to cool the coil 216 and the dielectric window 224. A heater / cooler 264 may be used to heat / cool the substrate support 232 to a predetermined temperature. An exhaust system 265 includes a valve 266 and a pump 267 to remove reactants from the processing chamber 228 by purging or evacuation.

[0052] A controller 254 may be used to control the etching process. The controller 254 monitors system parameters and controls the supply of gas mixtures, ignition, maintenance, and extinguishing of plasma, removal of reactants, supply of cooling gases, etc. The controller 254 may also control various aspects of the coil driver circuit 211 and the driver circuit 252, as described in more detail below. One or more sensor probes 190 may be inserted into a cavity in the substrate support to sense the temperature of the substrate.

[0053] 3, 4A, and 4B, a substrate support 300, such as an electrostatic chuck (ESC), includes a base plate 310 disposed adjacent to a heater layer 314. While the base plate of the substrate support is shown, the sensor probe may also be used to sense the surface temperature of other components of the substrate processing equipment. The heater layer 314 includes a heater 316. A ceramic layer 318 including an electrode 320 is disposed adjacent to the heater layer 314. The sensor probe 190 is inserted into a cylindrical cavity 332.

[0054] In some examples, the sensor probe 190 includes an elongate body 330 having a first end 334. The first end 334 of the sensor probe 190 has a diameter larger than the diameter of the elongate body 330. The elongate body 330 is received in a threaded housing 336 located at one end thereof.

[0055] The threaded housing 336 includes a first portion 338, a second portion 340, and a third portion 344. In some examples, the first portion 338, the second portion 340, and the third portion 344 are cylindrical and include a connected internal cavity. The second portion 340 has a diameter larger than the diameter of the first portion 338. The second portion 340 includes threads 346 that are received in a threaded hole 348 in the base plate 310 of the substrate support 300. The third portion 344 projects radially outward from the base plate 310 to allow the sensor probe 190 to rotate relative to the base plate 310 for insertion and removal.

[0056] A printed circuit board (PCB) 354 (such as a flexible PCB) extends through the elongate body 330 and from the third portion 344 of the threaded housing 336. The PCB 354 is connected by a connector 356 (such as a PCB) to one or more wires 360 that provide power, ground, and one or more signal lines to and from an integrated circuit located within the sensor probe 190.

[0057] 4A, the extension 330 of the sensor probe 190 includes a beveled surface 361 that provides a transition from the diameter of the extension 330 to the larger diameter of the first end 334. A spacer 362 protrudes radially from the extension 330 to evenly space the extension 330 within the cylindrical cavity 332. A beveled surface 372 provides a transition from the first portion 338 to the second portion 340 of the threaded housing 336. In some examples, an O-ring 376 is positioned against the beveled surface 372 and functions as an RF gasket.

[0058] 4B, the extension 330 includes a radially protruding surface 408 located along the first end 334. The sensor probe 190 includes a spring 410 located about the first end 334 adjacent the inner surface of a cavity formed in the threaded housing 336. The spring 410 biases one end of the extension 330 against a surface to determine the surface temperature.

[0059] A first integrated circuit 420 is mounted on PCB 354. The first integrated circuit 420 senses a first temperature of the surface to be monitored. In some examples, a second integrated circuit 422 is mounted on PCB 354. The second integrated circuit 422 is used to sense a temperature remote from the surface to be monitored for monitoring diagnostics and / or sanity checks of the first integrated circuit 420 and to increase the reliability of the temperature measured by the first integrated circuit 420.

[0060] 5 shows a PCB 354 with a first portion 508 that extends a distance greater than the extension body 330 of the sensor probe 190. A first integrated circuit 420 is attached to one end of the first portion 508. If a second integrated circuit 422 is used, it is attached at a location remote from the first integrated circuit 420. A second end 510 of the PCB 354 includes terminals 526 connected to traces 522 (partially shown). The PCB 354 includes two or more layers containing conductive traces, vias, ground planes, etc. to provide connections from the terminals 526 to the first integrated circuit 420 and / or the second integrated circuit 422.

[0061] 6, the extension 330 may include one or more slots 610 to facilitate heat transfer. In some examples, the slots 610 have an elongated oval shape and are aligned axially along the extension 330.

[0062] 7, a circuit 700 is shown having the first integrated circuit 420, resistors R1 and R2, and capacitor C1. + is the V of the first integrated circuit 420 +A first reference potential, such as ground, is connected to the GND input and the second input of the first integrated circuit 420. Signal lines S1 and S2 are connected to the SDA and SGL lines of the first integrated circuit 420. Resistors R1 and R2 are connected to the voltage supply line V + and signal line S1 and signal line S2.

[0063] 8, there is shown the attachment of first integrated circuit 420 to PCB 354. Solder bumps 810 couple pads of first integrated circuit 420 to corresponding pads of PCB 354.

[0064] 9A and 9B, the attachment of the first integrated circuit 420 and PCB 354 to a cap 820 is shown. In some examples, the cap 820 is made of metal and has legs 822 and 824 extending from one side thereof. In FIG. 9A, the cap 820 is positioned or attached with the legs 822 and 824 extending perpendicular to the mounting surface of the PCB 354. In FIG. 9B, the cap 820 is positioned or attached with the legs 822 and 824 extending parallel to the mounting surface of the PCB 354.

[0065] 10A and 10B, there is shown the potting of the first integrated circuit 420 into the cap 820. A potting material 1010 is injected to attach the cap 820 to the integrated circuit.

[0066] 11A and 11B, PCB 354, first integrated circuit 420, and cap 820 are inserted into cavity 1100 of elongated body 330. In FIG. 11B, PCB 354 is bent at a right angle so that legs 822 and 824 of cap 820 are inserted into one end of elongated body 330.

[0067] 12 and 13, another exemplary sensor probe 1200 is shown. In Figure 12, the sensor probe 1200 includes an extension body 1210 coupled to a threaded housing 1214. In some examples, the threaded housing 1214 includes a threaded surface 1216.

[0068] In FIG. 13 , a first integrated circuit 1320 is attached to a first PCB 1326 by solder balls 1330. A capacitor 1334 is attached to the first PCB 1326. A second PCB 1350 is disposed in the threaded housing 1214 and includes an attached resistor 1360. One or more wires 1362 provide external connections. One or more wires or hard PCB traces 1366 provide connections between the first PCB 1326 and the second PCB 1350. A potting material 1370 is located inside the elongated body 1210. The first integrated circuit 1320 senses the temperature of a surface 1380.

[0069] 14, if additional shielding is needed, a shielding layer 1410 can be used to cover the top and / or bottom surfaces of the PCB 1400 to provide enhanced shielding. In some examples, the shielding layer 1410 includes a metal layer. In some examples, the shielding layer 1410 is connected to a reference potential, such as ground. In other examples, the shielding layer 1410 includes multiple conductors. In some examples, the multiple conductors are equally spaced and form a grid in one or more lateral directions. The multiple conductors are connected to a reference potential, such as ground.

[0070] Referring now to FIG. 15 , sensor probes may be implemented without a printed circuit board. While two sensor probes are shown to illustrate variations in the location of the temperature-sensing integrated circuit, one or more sensor probes may be used in a given application. First sensor probe 1510-1 and second sensor probe 1510-2 include integrated circuits 1520-1 and 1520-2 located within elongated bodies 1210-1 and 1210-2, respectively, adjacent the surface-facing ends of elongated bodies 1210-1 and 1210-2. Multiple solder balls 1530-1 and multiple solder balls 1530-2 provide connections to integrated circuit 1520-1 and integrated circuit 1520-2, respectively. The plurality of wires 1562-1 and the plurality of wires 1562-2 are soldered to selected ones of the plurality of solder balls 1530-1 and the plurality of solder balls 1530-2 to provide one or more external connections to the integrated circuits 1520-1 and 1520-2 through the threaded housings 1214-1 and 1214-2 and the extensions 1210-1 and 1210-2, respectively. In some examples, the plurality of wires 1562-1 and the plurality of wires 1562-2 include insulated conductors.

[0071] Potting material 1570-1 and potting material 1570-2 are located inside elongated body 1210-1 and elongated body 1210-2, respectively. Integrated circuit 1520-1 and integrated circuit 1520-2 sense the temperature of surface 1580. Integrated circuit 1520-1 and integrated circuit 1520-2 can be positioned parallel to elongated body 1210-1 and elongated body 1210-2, perpendicular to elongated body 1210-1 and elongated body 1210-2, or at an angle therebetween.

[0072] In some examples, the number of solder balls S is equal to the number of wires W (S and W are integers greater than 1). In other examples, S>W or W>S.

[0073] The foregoing is merely illustrative in nature and is not intended to limit the disclosure, its application, or uses in any way. The broad teachings of the present disclosure may be embodied in a variety of forms. Thus, while the present disclosure includes specific examples, other variations will become apparent upon review of the drawings, this specification, and the following claims, and the true scope of the present disclosure should not be so limited. It should be understood that one or more steps within a method may be performed in a different order (or simultaneously) without altering the principles of the present disclosure. Furthermore, although each embodiment is described above as having particular features, any one or more of those features described with respect to an embodiment of the present disclosure may be implemented in other embodiments and / or in combination with features of other embodiments (even if the combination is not expressly stated). In other words, the described embodiments are not mutually exclusive, and permutations of one or more embodiments with one another remain within the scope of the present disclosure.

[0074] Spatial and functional relationships between elements (e.g., between modules, circuit elements, semiconductor layers, etc.) are described using various terms, including "connected," "engaged," "coupled," "adjacent," "adjacent," "on," "above," "below," and "disposed." When a relationship between a first element and a second element is described in the above disclosure, unless expressly specified as "direct," the relationship may be a direct relationship where no other intervening elements exist between the first element and the second element, or an indirect relationship where one or more intervening elements (spatial or functional) exist between the first element and the second element. As used herein, the phrase "at least one of A, B, and C" should be interpreted to mean a logic (A or B or C) using a non-exclusive logical OR, and not to mean "at least one of A, at least one of B, and at least one of C."

[0075] In some embodiments, the controller is part of a system, which may be part of the examples described above. Such systems may include semiconductor processing equipment with processing tools, chambers, processing platforms, and / or specific processing components (such as wafer pedestals and gas flow systems). These systems may be integrated with electronics for controlling operations before, during, and after processing of semiconductor wafers or substrates. These electronics may be referred to as a "controller" and may control various components or subcomponents of the system. Depending on the processing requirements and / or the type of system, the controller may be programmed to control any of the processes disclosed herein, including supplying process gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid supply settings, positional operation settings, and wafer transfer to and from the tool and other transport tools and / or load locks connected or coupled to the specific system.

[0076] Generally, a controller may be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operations, enable cleaning operations, enable endpoint measurements, etc. Integrated circuits may include chips in firmware format that store program instructions, digital signal processors (DSPs), chips defined as application-specific integrated circuits (ASICs), and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software). Program instructions may be instructions communicated to the controller in the form of various personalizations (or program files) that define operational parameters for performing a particular process on or for a semiconductor wafer or system. In some embodiments, the operational parameters may be part of a recipe defined by a process engineer to accomplish one or more processing steps during the manufacture of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or wafer dies.

[0077] In some embodiments, the controller may be part of or coupled to a computer integrated with, coupled to, or otherwise networked to the system. For example, the controller may be in the “cloud” that enables remote access to wafer processing, or may be all or part of a fab host computer system. The computer may enable remote access to the system to monitor the progress of manufacturing operations, examine the history of past manufacturing operations, examine trends or performance metrics from multiple manufacturing operations, modify parameters of a current process, set processing steps following a current process, or initiate a new process. In some examples, a remote computer (e.g., a server) can provide process recipes to the system over a network, which may include a local network or the Internet. The remote computer may include a user interface that enables entry or programming of parameters and / or settings that are then communicated from the remote computer to the system. In some examples, the controller receives instructions in the form of data specifying parameters for each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process being performed and the type of tool the controller is connected to or configured to control. Thus, as described above, the controller may be distributed, for example, by including one or more separate controllers networked together and cooperating toward a common purpose, such as the process or control described herein. An example of a controller distributed for such a purpose would be one or more integrated circuits on the chamber that are located remotely (e.g., at the platform level or as part of a remote computer) and communicate with one or more integrated circuits that cooperate to control the process in the chamber.

[0078] Without being limited thereto, example systems may include plasma etch chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, bevel edge etch chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etch (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, and other semiconductor processing systems related to or usable in the fabrication and / or manufacturing of semiconductor wafers.

[0079] As described above, the controller may be in communication with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, nearby tools, tools located throughout the factory, a main computer, another controller, or tools used to transport materials to and from tool locations and / or load ports in a semiconductor fabrication factory, depending on the processing steps being performed by the tool. The present disclosure includes the following application examples: [Application example 1] A sensor probe, an elongate body defining an interior cavity having an inner diameter; a printed circuit board configured to fit within the interior cavity; a first temperature sensing integrated circuit mounted to a first end of the printed circuit board; a cap attached to a first end of the elongated body adjacent the first temperature sensing integrated circuit; a housing configured to receive a second end of the extension body, the housing configured to be attached to a base plate of a substrate support; The sensor probe comprises: [Application example 2] The sensor probe according to Application Example 1, The printed circuit board has a width less than the inner diameter and a length greater than the extension body. [Application example 3] The sensor probe according to Application Example 1, The sensor probe, wherein the inner diameter is 3 mm or less and at least two of three orthogonal dimensions of the first temperature sensing integrated circuit are less than 3 mm. [Application example 4] The sensor probe according to Application Example 1, further comprising: The sensor probe includes a potting material connecting the cap and the first temperature sensing integrated circuit. [Application example 5] The sensor probe according to Application Example 1, The printed circuit board is flexible and bends at an angle adjacent the first temperature sensing integrated circuit, the sensor probe. [Application Example 6] The sensor probe according to Application Example 1, The cap includes a first leg and a second leg extending from one side of the cap and received in the internal cavity of the elongated body. [Application Example 7] The sensor probe according to Application Example 1, The extension body is reciprocally received in the housing. [Application Example 8] The sensor probe according to Application Example 1, The sensor probe, wherein the extension includes a protrusion, and further includes a spring positioned around the extension and biased between an internal cavity of the housing and the protrusion. [Application Example 9] The sensor probe according to Application Example 1, The first temperature sensing integrated circuit senses the temperature of a surface in contact with the cap, the sensor probe. [Application Example 10] The sensor probe according to Application Example 9, The surface is a layer within an electrostatic chuck. [Application Example 11] The sensor probe according to Application Example 1, The sensor probe, wherein the extension includes a radial protrusion for centering the extension within the cavity of the base plate. [Application Example 12] The sensor probe according to Application Example 1, The sensor probe, wherein the extension body includes a slot. [Application Example 13] The sensor probe according to Application Example 12, The slot has an elongated oval shape and is aligned axially of the elongated body. [Application Example 14] The sensor probe according to Application Example 1, further comprising: The sensor probe includes a shielding layer disposed on at least one surface of the printed circuit board. [Application Example 15] The sensor probe according to Application Example 1, The sensor probe, wherein the housing defines an inclined surface, and further comprising an O-ring disposed against the inclined surface between the housing and the cavity in the base plate. [Application Example 16] The sensor probe according to Application Example 1, The printed circuit board is flexible. [Application Example 17] The sensor probe according to Application Example 16, further comprising: a connector connected to a second end of the printed circuit board; a plurality of wires connected by the connector to traces on the printed circuit board; A sensor probe comprising: [Application Example 18] The sensor probe according to Application Example 1, further comprising: the sensor probe comprising a second temperature sensing integrated circuit mounted on the printed circuit board between the first temperature sensing integrated circuit and a second end of the printed circuit board. [Application Example 19] A sensor probe, an elongate body defining an interior cavity having an inner diameter; a first printed circuit board configured to fit within the interior cavity; a temperature sensing integrated circuit mounted on the first printed circuit board; a housing configured to receive one end of the extension body and configured to be attached to a base plate of a substrate support; a second printed circuit board disposed within the housing; a plurality of first conductors connecting the first printed circuit board to the second printed circuit board; a plurality of second conductors configured to connect the second printed circuit board to an external device; A sensor probe comprising: [Application Example 20] The sensor probe according to Application Example 19, The first printed circuit board has a width less than the inner diameter and a length less than the length of the extension body. [Application Example 21] The sensor probe according to Application Example 19, The second printed circuit board has a length that is shorter than a length of the housing. [Application Example 22] The sensor probe according to Application Example 19, The sensor probe, wherein the inner diameter is 3 mm or less and at least two of three orthogonal dimensions of the temperature sensing integrated circuit are less than 3 mm. [Application Example 23] The sensor probe according to Application Example 19, further comprising: The sensor probe includes a potting material located within the elongated body. [Application Example 24] The sensor probe according to Application Example 19, The sensor probe, wherein the first printed circuit board and the temperature sensing integrated circuit are mounted parallel to the length of the elongated body. [Application Example 25] The sensor probe according to Application Example 19, The temperature sensing integrated circuit senses the temperature of a surface in contact with the sensor probe. [Application Example 26] The sensor probe according to Application Example 25, The surface is a layer within an electrostatic chuck. [Application Example 27] The sensor probe according to Application Example 19, The sensor probe, wherein the extension includes a radial protrusion for centering the extension within the cavity of the base plate. [Application Example 28] The sensor probe according to Application Example 19, The sensor probe, wherein the extension body includes a slot. [Application Example 29] The sensor probe according to Application Example 28, The slots have an elongated oval shape and are aligned axially of the elongated body. [Application Example 30] The sensor probe according to Application Example 19, further comprising: A sensor probe comprising a capacitor connected to the first printed circuit board. [Application Example 31] The sensor probe according to Application Example 19, further comprising: A sensor probe comprising a resistor connected to the second printed circuit board. [Application Example 32] The sensor probe according to Application Example 19, further comprising: The sensor probe includes a shielding layer disposed on a surface of the first printed circuit board. [Application Example 33] A sensor probe, an elongate body defining an interior cavity having an inner diameter; a temperature sensing integrated circuit configured to fit within the internal cavity; a housing configured to receive one end of the extension body and configured to be attached to a base plate of a substrate support; a plurality of conductors passing through the housing and the elongated body and configured to connect the temperature sensing integrated circuit to an external device; A sensor probe comprising: [Application Example 34] The sensor probe according to Application Example 33, The sensor probe, wherein the inner diameter is 3 mm or less and at least two of three orthogonal dimensions of the temperature sensing integrated circuit are less than 3 mm. [Application Example 35] The sensor probe according to Application Example 33, further comprising: The sensor probe includes a potting material located within the elongated body. [Application Example 36] The sensor probe according to Application Example 33, The temperature sensing integrated circuit is mounted parallel to the length of the extension body. [Application Example 37] The sensor probe according to Application Example 33, The temperature sensing integrated circuit is mounted perpendicular to the length of the extension body. [Application Example 38] The sensor probe according to Application Example 33, The temperature sensing integrated circuit senses the temperature of a surface in contact with the sensor probe. [Application Example 39] The sensor probe according to Application Example 38, The surface is a layer within an electrostatic chuck. [Example 40] The sensor probe according to Application Example 33, The sensor probe, wherein the extension includes a radial protrusion for centering the extension within the cavity of the base plate. [Application Example 41] The sensor probe according to Application Example 33, The sensor probe, wherein the extension body includes a slot. [Application Example 42] The sensor probe according to Application Example 41, The slots have an elongated oval shape and are aligned axially of the elongated body. [Application Example 43] The sensor probe according to Application Example 33, further comprising: a plurality of solder balls attached to the temperature sensing integrated circuit, the plurality of first conductors being attached to the plurality of solder balls;

Claims

1. A substrate support comprising: a plurality of plates including a first plate disposed on a second plate; At least one sensor probe that penetrates the second plate and detects a temperature of the first plate, each of the at least one sensor probe comprising: a housing extending at least partially into the second plate; an elongate body defining an internal cavity and including a first end and a second end, the first end being received within the housing; a printed circuit board disposed within the internal cavity and extending along the internal cavity, the printed circuit board having a first end and a second end, the second end of the printed circuit board being disposed at the second end of the elongated body; a first temperature sensing integrated circuit mounted to the second end of the printed circuit board; At least one sensor probe comprising: A substrate support comprising:

2. The substrate support of claim 1, The printed circuit board has a width that is smaller than an inner diameter of the elongated body and a length that is greater than the elongated body.

3. The substrate support of claim 1, A substrate support, wherein the printed circuit board is flexible and bends at an angle adjacent the first temperature sensing integrated circuit.

4. The substrate support of claim 1, further comprising: A substrate support comprising a cap attached to the second end of the elongate body adjacent the first temperature sensitive integrated circuit.

5. The substrate support of claim 4, The cap includes a first leg and a second leg extending from one side of the cap and received in the internal cavity of the elongated body.

6. The substrate support of claim 1, The substrate support, wherein the extension comprises a protrusion, and further comprising a spring positioned around the extension and biased between an interior cavity of the housing and the protrusion.

7. The substrate support of claim 4, the first temperature sensing integrated circuit senses the temperature of a surface in contact with the cap; The substrate support, wherein the surface is a layer in an electrostatic chuck.

8. The substrate support of claim 1, The extension comprises a radial protrusion configured to center the extension within the cavity of the second plate.

9. The substrate support of claim 1, the extension includes slots for heat transfer; The slots have an elongated oval shape and are aligned axially of the elongated body.

10. The substrate support of claim 1, further comprising: A substrate support comprising a shielding layer disposed on at least one surface of the printed circuit board.

11. The substrate support of claim 1, The substrate support, wherein the housing defines an inclined surface, and further comprising an O-ring disposed against the inclined surface between the housing and the cavity of the second plate.

12. The substrate support of claim 1, further comprising: a connector connected to the first end of the printed circuit board; a plurality of wires connected by the connector to traces on the printed circuit board; A substrate support comprising:

13. The substrate support of claim 1, further comprising: a substrate support comprising a second temperature sensing integrated circuit mounted on the printed circuit board between the first temperature sensing integrated circuit and the second end of the printed circuit board; 14. The substrate support of claim 1, a surface of the first temperature sensing integrated circuit attached to a mounting surface of the printed circuit board; A board support, wherein the surface of the first temperature sensing integrated circuit extends parallel to the mounting surface of the printed circuit board.

15. The substrate support of claim 1, a first portion of the surface of the printed circuit board extending from the first end of the extension body to the second end of the extension body; a second portion of the surface of the printed circuit board extending perpendicular to the first portion of the surface of the printed circuit board; The first temperature sensing integrated circuit is mounted to the second portion of the surface of the printed circuit board, a substrate support.

16. The substrate support of claim 1, The first temperature sensing integrated circuit senses the temperature of a surface in contact therewith.

17. The substrate support of claim 16, The substrate support, wherein the surface is a surface of the first plate.

18. The substrate support of claim 1, The second end of the extension contacts the first plate.

19. The substrate support of claim 1, The first temperature sensing integrated circuit comprises a plurality of solder balls attached to the printed circuit board.

20. The substrate support of claim 1, The first temperature sensing integrated circuit measures the temperature of the second plate.

21. The substrate support of claim 1, The housing threadably engages the second plate.

22. The substrate support of claim 1, The housing is attached to the second plate.

23. The substrate support of claim 1, The substrate support, wherein the housing and the extension are configured to be at least partially mounted within the second plate.

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