Silicon carbide semiconductor device, power module device, power conversion device, and mobile body

Abstract

The purpose of the present invention is to provide a technology capable of increasing surge resistance in a silicon carbide semiconductor device in which an SBD is embedded. A silicon carbide semiconductor device comprises a first conductivity-type semiconductor layer provided with an active region including: a unit cell region including a Schottky barrier diode region and a MOSFET region; and a surge conduction region. The surge conduction region includes a Schottky barrier diode replacement region in which the first conductivity type of the Schottky barrier diode region is replaced with a second conductivity type. The area ratio of the Schottky barrier diode replacement region in the active region is at least 0.01%, and less than the area ratio of the Schottky barrier diode region in the active region when not replaced with the Schottky barrier diode replacement region.

Description

[Technical Field]

[0001] The present disclosure relates to a silicon carbide semiconductor device, a power module device, a power conversion device, and a mobile object. [Background technology]

[0002] It is known that when a forward current, i.e., a bipolar current, is continuously passed through a pn diode provided in a silicon carbide (SiC) semiconductor layer, crystal defects such as stacking faults occur in the crystal, resulting in a shift in forward voltage. This is thought to occur because the recombination energy generated when minority carriers injected through the pn diode recombine with majority carriers causes crystal defects, such as stacking faults, which are planar defects, to expand, starting from basal plane dislocations present in the silicon carbide semiconductor layer. These crystal defects obstruct the flow of current, and as the crystal defects expand, the current decreases and the forward voltage increases, resulting in a decrease in the reliability of the silicon carbide semiconductor device.

[0003] This increase in forward voltage also occurs in vertical MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) that use silicon carbide. Vertical MOSFETs have a body diode, which is a parasitic pn diode, between the source and drain. When a forward current flows through this body diode, it causes a decrease in reliability in the vertical MOSFET, similar to that of a pn diode. For this reason, when the body diode of a SiC-MOSFET is used as the freewheeling diode of the MOSFET, the MOSFET characteristics may be degraded.

[0004] In order to solve the reliability problem caused by the forward current flowing through the parasitic pn diode as described above, a configuration has been proposed in which a unipolar diode is built into a silicon carbide semiconductor device, which is a unipolar transistor such as a MOSFET, as a free wheel diode. For example, Patent Documents 1 and 2 propose a configuration in which a Schottky barrier diode (SBD), which is a unipolar diode, is built into a unit cell of a MOSFET.

[0005] In a silicon carbide semiconductor device including a unipolar transistor with a built-in unipolar diode, the bipolar current of the body diode, i.e., the parasitic pn diode, can be reduced during freewheeling operation, thereby suppressing deterioration of the characteristics of the transistor. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-017701 [Patent Document 2] International Publication No. 2014 / 038110 Summary of the Invention [Problem to be solved by the invention]

[0007] However, while bipolar pn diodes have low resistance due to conductivity modulation caused by bipolar operation, SBDs, which are unipolar diodes, have relatively high resistance. As a result, the energy generated when an SBD is conducting is higher than the energy generated when a body diode, which is a pn diode, is conducting.

[0008] As a result, in silicon carbide semiconductor devices with built-in SBDs such as those described above, when a surge current such as a fault current flows through the SBD, the generated energy density is high, causing the SBD to generate a large amount of heat, resulting in a problem of low surge resistance, which is the breakdown resistance against the surge current.

[0009] The present disclosure has been made in view of the above-mentioned problems, and has an object to provide a technique that can increase the surge resistance of a silicon carbide semiconductor device with a built-in SBD. [Means for solving the problem]

[0010] The silicon carbide semiconductor device according to the present disclosure includes a Schottky barrier diode region and a MOSFET region, and includes a plurality of unit cell regions that are periodically arranged in a plan view. ,sa a first conductivity type semiconductor layer provided with an active region, the active region including a gate conduction region; the surge current-carrying region is locally provided between the unit cell regions, and the plurality of unit cell regions are divided into several unit cell regions having periodicity corresponding to the locality; The surge current-carrying region includes a Schottky barrier diode replacement region in which the first conductivity type of the Schottky barrier diode region is replaced with a second conductivity type, and the area ratio of the Schottky barrier diode replacement region to the active region is 0.01% or more and less than the area ratio of the Schottky barrier diode region to the active region in the case where it is not replaced with the Schottky barrier diode replacement region. [Effects of the Invention]

[0011] According to the present disclosure, during prolonged reflux operation due to a surge current such as a fault current, the body diode in the active region surface operates earlier in conjunction with the operation of the pn diode formed in the Schottky barrier diode replacement region compared to when the Schottky barrier diode replacement region is not used, thereby reducing the generated energy density and increasing the surge resistance.

[0012] The objects, features, aspects and advantages of the present disclosure will become more apparent from the following detailed description and the accompanying drawings. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a plan view showing a configuration of a silicon carbide semiconductor device in accordance with a first embodiment. [Figure 2] FIG. 1 is a plan view showing a configuration of a silicon carbide semiconductor device in accordance with a first embodiment. [Figure 3] 1 is a cross-sectional view schematically illustrating a configuration of a silicon carbide semiconductor device in accordance with a first embodiment. [Figure 4] 1 is a schematic plan view showing a configuration of a silicon carbide semiconductor device in accordance with a first embodiment. [Figure 5] 1 is a schematic plan view showing a configuration of a silicon carbide semiconductor device in accordance with a first embodiment. [Figure 6] 1 is a cross-sectional view schematically illustrating a configuration of a silicon carbide semiconductor device in accordance with a first embodiment. [Figure 7] FIG. 1 is a plan view showing a configuration of a silicon carbide semiconductor device in accordance with a first embodiment. [Figure 8] 1 is a cross-sectional view schematically illustrating a configuration of a silicon carbide semiconductor device in accordance with a first embodiment. [Figure 9] 1 is a cross-sectional view schematically illustrating a configuration of a silicon carbide semiconductor device in accordance with a first embodiment. [Figure 10] 2 is a cross-sectional view illustrating a method for manufacturing the silicon carbide semiconductor device in accordance with the first embodiment. FIG. [Figure 11] 2 is a cross-sectional view illustrating a method for manufacturing the silicon carbide semiconductor device in accordance with the first embodiment. FIG. [Figure 12] 2 is a cross-sectional view illustrating a method for manufacturing the silicon carbide semiconductor device in accordance with the first embodiment. FIG. [Figure 13] 2 is a cross-sectional view illustrating a method for manufacturing the silicon carbide semiconductor device in accordance with the first embodiment. FIG. [Figure 14] 2 is a cross-sectional view illustrating a method for manufacturing the silicon carbide semiconductor device in accordance with the first embodiment. FIG. [Figure 15] 2 is a cross-sectional view illustrating a method for manufacturing the silicon carbide semiconductor device in accordance with the first embodiment. FIG. [Figure 16] 2 is a cross-sectional view illustrating a method for manufacturing the silicon carbide semiconductor device in accordance with the first embodiment. FIG. [Figure 17] 2 is a cross-sectional view illustrating a method for manufacturing the silicon carbide semiconductor device in accordance with the first embodiment. FIG. [Figure 18] FIG. 4 is a diagram showing simulation results of the silicon carbide semiconductor device according to the first embodiment. [Figure 19] FIG. 2 is a diagram illustrating switching of current flow in the silicon carbide semiconductor device in accordance with the first embodiment. [Figure 20] FIG. 2 is a diagram illustrating switching of current flow in the silicon carbide semiconductor device in accordance with the first embodiment. [Figure 21] FIG. 10 is a cross-sectional view schematically showing a configuration of a silicon carbide semiconductor device in accordance with a second embodiment. [Figure 22] FIG. 10 is a plan view showing a configuration of a silicon carbide semiconductor device in accordance with a third embodiment. [Figure 23] FIG. 10 is a plan view showing a configuration of a silicon carbide semiconductor device in accordance with a third embodiment. [Figure 24] FIG. 10 is a cross-sectional view schematically showing a configuration of a silicon carbide semiconductor device in accordance with a third embodiment. [Figure 25] FIG. 10 is a cross-sectional view schematically showing a configuration of a silicon carbide semiconductor device in accordance with a third embodiment. [Figure 26] FIG. 10 is a cross-sectional view illustrating a method for manufacturing a silicon carbide semiconductor device in accordance with a third embodiment. [Figure 27] FIG. 10 is a cross-sectional view illustrating a method for manufacturing a silicon carbide semiconductor device in accordance with a third embodiment. [Figure 28] FIG. 10 is a cross-sectional view illustrating a method for manufacturing a silicon carbide semiconductor device in accordance with a third embodiment. [Figure 29] FIG. 10 is a cross-sectional view illustrating a method for manufacturing a silicon carbide semiconductor device in accordance with a third embodiment. [Figure 30] FIG. 10 is a cross-sectional view illustrating a method for manufacturing a silicon carbide semiconductor device in accordance with a third embodiment. [Figure 31] FIG. 10 is a cross-sectional view illustrating a method for manufacturing a silicon carbide semiconductor device in accordance with a third embodiment. [Figure 32] FIG. 10 is a block diagram showing the configuration of a power module device according to a fourth embodiment. [Figure 33] FIG. 10 is a block diagram showing a configuration of a power conversion device according to a fifth embodiment. [Figure 34] FIG. 13 is a diagram showing a configuration of a moving body according to a sixth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0014] In the following description, n and p represent the conductivity types of semiconductors. In this disclosure, the first conductivity type is described as n-type and the second conductivity type is described as p-type, but the first conductivity type may also be p-type and the second conductivity type may also be n-type.

[0015] Hereinafter, embodiments will be described with reference to the accompanying drawings. Note that the drawings are shown schematically, and the relative sizes and positions of images shown in different drawings are not necessarily accurately depicted and may be changed as appropriate. In the following description, similar components are denoted by the same reference numerals, and their names and functions are also the same. Therefore, detailed descriptions thereof may be omitted.

[0016] The following describes a case where the silicon carbide semiconductor device is a SiC-MOSFET with an SBD. Compared to silicon semiconductor devices, silicon carbide semiconductor devices are capable of stable operation at high temperatures and high voltages and of faster switching speeds.

[0017] <First Embodiment> Fig. 1 is a plan view showing the configuration of a silicon carbide semiconductor device 100 according to the first embodiment as viewed from above. The silicon carbide semiconductor device 100 according to the first embodiment is a planar silicon carbide semiconductor device. In Fig. 1, a gate pad 81 is formed on a part of the top surface of the silicon carbide semiconductor device 100, and a source electrode 80 is formed adjacent to this. In addition, a gate wiring 82 extending from the gate pad 81 is formed.

[0018] (1) Planar stripe structure 2 is a plan view of the silicon carbide layer of the silicon carbide semiconductor device 100 according to the first embodiment, viewed from above. FIG. 2 corresponds to the plan view of FIG. 1 in which the source electrode 80, the gate pad 81, and the gate wiring 82 are omitted. In the silicon carbide semiconductor device 100, an active region including a unit cell region and a surge current-carrying region is provided. In FIG. 2, unit cell regions including an SBD region (Schottky barrier diode region) and MOSFET regions provided on both sides of the SBD region are arranged in a stripe pattern. The structure of the silicon carbide semiconductor device 100 provided with such unit cell regions is called a "stripe type" structure.

[0019] 2, unit cell regions each including an n-type first isolation region 21 roughly corresponding to the SBD region and a p-type first well region 30 roughly corresponding to the MOSFET region are repeatedly arranged in one direction in a plan view. The region consisting of such a unit cell region in which an SBD-integrated MOSFET is formed and a surge current-carrying region (described later) is called an active region. The region around the active region, which includes a gate pad 81 formation region in which a p-type second well region 31 and the like are formed, is called a termination region.

[0020] FIG. 3 is a schematic cross-sectional view of a schematic configuration from source electrode 80 to gate wiring 82 on the periphery of silicon carbide semiconductor device 100 in FIG. 1, viewed from the longitudinal direction of a striped unit cell region.

[0021] In silicon carbide semiconductor device 100 shown in Fig. 3, drift layer 20 made of n-type silicon carbide is formed on the surface of semiconductor substrate 10 made of low-resistivity n-type silicon carbide. In the first embodiment, the semiconductor layer in which the active region is provided is drift layer 20 on semiconductor substrate 10, but it may be semiconductor substrate 10. A second well region 31 made of p-type silicon carbide is provided in a surface layer portion of drift layer 20 at a position substantially corresponding to the region in which gate wiring 82 described in Fig. 1 is provided, as shown in the cross-sectional view of Fig. 3.

[0022] First well regions 30 made of p-type silicon carbide are provided in a surface layer portion of drift layer 20 in the active region, which is the region below source electrode 80 described in Fig. 1. As shown in Fig. 2, first well regions 30 are formed in a striped pattern in plan view. A single well region obtained by connecting multiple first well regions 30 to each other may be provided, or multiple separated first well regions 30 may be provided.

[0023] As shown in FIG. 3, in the surface layer portion of the first well region 30, a source region 40 made of n-type silicon carbide is formed at a position a certain distance inward from the periphery of the first well region 30.

[0024] A contact region 35 made of low-resistance p-type silicon carbide is formed in a surface layer portion of the first well region 30 on one end side of the source region 40. A first separating region 21 made of silicon carbide is formed between adjacent contact regions 35 and penetrates the first well region 30. As shown in FIG. 2 , the first separating region 21 is formed in a stripe shape. The conductivity type of the first separating region 21 is n-type, the same as that of the drift layer 20, and the n-type impurity concentration of the first separating region 21 may be the same as the n-type impurity concentration of the drift layer 20, or may be higher or lower than the n-type impurity concentration of the drift layer 20.

[0025] 3, a Schottky electrode 71 having a stripe shape in a plan view is formed on the surface side of the first separating region 21 and making a Schottky connection with the first separating region 21. It is desirable that the Schottky electrode 71 is formed in a region that includes the corresponding first separating region 21 in a plan view.

[0026] An ohmic electrode 70 is formed on the surface of the source region 40. A source electrode 80 connected to the ohmic electrode 70, Schottky electrode 71, and contact region 35 is formed on these. The first well region 30 can easily exchange electrons and holes with the ohmic electrode 70 via the low-resistance contact region 35.

[0027] Of the regions between adjacent first well regions 30, second separating region 22 made of n-type silicon carbide is formed in a region separate from first separating region 21. Second separating region 22 has the same n-type conductivity as drift layer 20, and the n-type impurity concentration of second separating region 22 may be the same as the n-type impurity concentration of drift layer 20, or may be higher or lower than the n-type impurity concentration of drift layer 20.

[0028] A gate insulating film 50 made of, for example, silicon oxide is selectively formed on the surfaces of adjacent first well regions 30, the second separating region 22 therebetween, and the source regions 40 in those first well regions 30. A gate electrode 60 made of, for example, polycrystalline silicon is formed on at least the gate insulating film 50 above the first well region 30. The surface portion of the first well region 30 facing the gate electrode 60 with the gate insulating film 50 interposed therebetween is called a channel region.

[0029] A second well region 31 is formed outside first well region 30 at the outermost periphery of silicon carbide semiconductor device 100, and a third separated region 23 made of silicon carbide is formed between first well region 30 and second well region 31. The conductivity type of third separated region 23 is n-type, the same as that of drift layer 20, and the n-type impurity concentration of third separated region 23 may be the same as the n-type impurity concentration of drift layer 20, or may be higher or lower than the n-type impurity concentration of drift layer 20.

[0030] A gate insulating film 50 is selectively formed on the second well region 31, similar to the first well region 30, and a gate electrode 60 electrically connected to the gate electrode 60 formed on the first well region 30 is formed on the gate insulating film 50.

[0031] A silicon carbide conductive layer 45 made of silicon carbide is formed in a certain percentage of the upper portion of the second well region 31. The silicon carbide conductive layer 45 has a higher n-type impurity concentration and lower resistance than the drift layer 20. The silicon carbide conductive layer 45 has a lower sheet resistance than the second well region 31 and forms a pn junction with the p-type second well region 31. The silicon carbide conductive layer 45 is formed, for example, over a width equal to or greater than half the width of the second well region 31 in the lateral cross section. The portion where the silicon carbide conductive layer 45 is formed over a width equal to or greater than half the width of the second well region 31 in the lateral cross section does not need to be provided in all cross sections, and may be provided in some cross sections.

[0032] An interlayer insulating film 55 made of, for example, silicon oxide is formed between the gate electrode 60 and the source electrode 80. The gate electrode 60 and the gate wiring 82 above the second well region 31 are connected via a gate contact hole 95 formed in the interlayer insulating film 55. In addition, a JTE region 38 made of p-type silicon carbide is formed on the outer periphery of the second well region 31, i.e., on the opposite side to the first well region 30. The impurity concentration of the JTE region 38 is lower than the impurity concentration of the second well region 31. An FLR (Field Limiting Ring) may be formed instead of the JTE region 38. Alternatively, a combination of the JTE region 38 and an FLR may be formed.

[0033] A field insulating film 51 having a thickness larger than that of the gate insulating film 50 or the gate insulating film 50 is formed on the second well region 31 and the silicon carbide conductive layer 45. An opening, i.e., a termination region contact hole 91, is formed in a part of the gate insulating film 50 or the field insulating film 51 on the surface of the silicon carbide conductive layer 45. The silicon carbide conductive layer 45 and the source electrode 80 are ohmically connected via an ohmic electrode 72 at the termination portion below the termination region contact hole 91.

[0034] Termination region contact hole 91 penetrates gate insulating film 50 or field insulating film 51 and interlayer insulating film 55, and establishes an ohmic connection between silicon carbide conductive layer 45 and source electrode 80, but does not establish a connection between second well region 31 and source electrode 80. In addition, the width of silicon carbide conductive layer 45 is greater than the diameter or width of termination region contact hole 91. In the first embodiment, second well region 31 is not directly ohmically connected to source electrode 80.

[0035] In the active region, the ohmic electrode 70, the Schottky electrode 71, and the contact region 35 are connected to the source electrode 80 on the interlayer insulating film 55 via an active region contact hole 90 that penetrates the interlayer insulating film 55 and the gate insulating film 50.

[0036] A drain electrode 84 is formed on the back surface of the semiconductor substrate 10 .

[0037] When the plane orientation of the first main surface of the semiconductor substrate 10 is a (0001) plane having an off-angle in the <11-20> direction, the extension direction of the striped first well region 30 may be parallel to the <11-20> direction, which is the off-direction, or parallel to a direction perpendicular to the off-direction.

[0038] Fig. 4 is a schematic plan view more typically showing the configuration of the silicon carbide layer of Fig. 2. Active region 15 includes surge current carrying region 301 in addition to the unit cell region described above.

[0039] The surge conducting region 301 does not have a first separating region 21 in contact with the Schottky electrode 71, and is defined as, for example, a region whose periphery is surrounded by the first separating region 21. Here, "surrounded" does not necessarily mean being surrounded by a continuous first separating region 21, but also includes being adjacent to a plurality of first separating regions 21 that are spaced apart and periodically arranged at the end of the stripe in the extension direction, as shown in the plan view of FIG. 2. In other words, the surge conducting region 301 is a region of the active region 15 covered by the source electrode 80, whose periphery is adjacent to the first separating region 21 connected to the Schottky electrode 71 in a plan view, and more desirably is surrounded by the first separating region 21.

[0040] The area of ​​the surge conducting region 301 is sufficiently small compared to the overall area of ​​the active region 15, and the surge conducting region 301 is provided in the active region 15. The surge conducting region 301 is also covered by the source electrode 80, just like the unit cell region. For these reasons, the surge conducting region 301 is formed below the gate pad 81 around the active region 15, and is clearly distinguished from the second well region 31, which has a relatively large area.

[0041] The surge current-carrying region 301 is formed in at least one unit cell region in the chip. When the surge current-carrying region 301 is formed in two or more unit cell regions, it is desirable that the surge current-carrying regions 301 are formed so as to be dispersed within the chip in a plan view.

[0042] As will be described later, surge current-carrying region 301 includes Schottky barrier diode-replaced region 302 in which the n-type of the SBD region in the unit cell region is replaced with p-type, and p-type Schottky barrier diode-replaced region 302 functions as a p-n diode in cooperation with n-type drift layer 20. During freewheeling operation in silicon carbide semiconductor device 100, which occurs for a sufficiently long current-carrying time, such as 1 to 10 msec, the body diode in the unit cell region operates in conjunction with the operation of the p-n diode. The body diode here includes a parasitic p-n diode, which is the freewheeling diode of a MOSFET.

[0043] In the first embodiment, the area ratio of the p-type Schottky barrier diode replacement region 302 to the active region 15 in plan view is 0.01% or more and less than the area ratio of the SBD region to the active region 15 when not replaced with the Schottky barrier diode replacement region 302, and more preferably 0.01% or more and 5% or less.

[0044] If the area ratio of the Schottky barrier diode replacement region 302 becomes equal to the area ratio of the SBD region without the Schottky barrier diode replacement region 302, the SBD will no longer exist within the surface of the active region 15, and the MOSFET will no longer function as an SBD-integrated MOSFET.

[0045] Furthermore, the smaller the ratio of the Schottky barrier diode replacement region 302 to the surface, the smaller the effect on the original electrical characteristics, and the higher efficiency (lower loss) of power conversion can be expected.

[0046] In silicon carbide semiconductor device 100 according to the first embodiment, during the above-described freewheeling operation, the area ratio of body diode chain operation region 16, which is a region where body diodes operate in a chain, to active region 15 increases as the current-carrying time increases, and eventually, body diodes operate over the entire surface of active region 15. FIG. 5 is a diagram showing an example of such a body diode chain operation region 16. The speed at which body diode chain operation region 16 expands to cover the entire surface of active region 15 during the above-described freewheeling operation can be adjusted by adjusting the size and number of surge conducting regions 301.

[0047] FIG. 6 is a cross-sectional view showing a schematic configuration of the surge current carrying region 301 and the active region contact hole 90 as viewed from the longitudinal direction of the striped unit cell region.

[0048] Inside the surge current-carrying region 301, one or more Schottky barrier diode replacement regions 302 made of p-type silicon carbide are formed in a surface layer portion of the drift layer 20. The Schottky barrier diode replacement region 302 is provided between the Schottky electrode 71 and the drift layer 20, thereby providing a p-n junction in the conduction path between the source electrode 80 and the drain electrode 84. In other words, the Schottky electrode 71 is not connected to an n-type silicon carbide layer such as the first separating region 21, which has the same n-type as the drift layer 20, and the Schottky electrode 71 and the drift layer 20 are separated by the Schottky barrier diode replacement region 302. Note that "connected" here refers to a state in which a Schottky current can flow in the chip cross-sectional direction without a p-n junction being present in the middle.

[0049] In the first embodiment, the Schottky barrier diode replacement region 302 is a p-type region that replaces the first separating region 21 sandwiched between adjacent first well regions 30. The Schottky barrier diode replacement region 302 is formed below the periodically formed Schottky electrodes 71. At this time, the first well regions 30 adjacent to the Schottky barrier diode replacement region 302 form a single p-type region. In such a layout, the combined width of the Schottky barrier diode replacement region 302 and the adjacent first well regions 30 is necessarily larger than the width of the first well regions 30. Two examples of the advantages of this layout are given below.

[0050] The first advantage is that the gate electrodes 60 and active region contact holes 90 in the surge conducting region 301 can be formed at the same pitch as in the surrounding regions. This allows the gate electrodes 60 and active region contact holes 90 to be aligned at equal intervals throughout the chip, improving the uniformity of processing. In addition, there is no longer a need to interrupt or branch the gate electrodes 60 and active region contact holes 90 at the ends of the surge conducting region 301 in the extension direction of the stripes, further improving the uniformity of processing.

[0051] The second advantage is that the gate electrode 60 can be formed to penetrate the surge current-carrying region 301 in a plan view. This has the effect of preventing the propagation of the gate potential from being interrupted in the surge current-carrying region 301. In particular, with a stripe structure, if the gate potential is interrupted in the surge current-carrying region 301, the gate potential cannot be propagated beyond that point, resulting in an area that does not function as a MOSFET and resulting in the disadvantage of ineffective use of the chip area. This disadvantage can be reduced by preventing the propagation of the gate potential from being interrupted in the surge current-carrying region 301. Furthermore, this configuration has a smaller delay in the propagation of the gate potential than a configuration in which the gate electrode pattern is formed to bypass the surge current-carrying region 301, thereby achieving high-speed switching and suppressing local concentration of the switching current.

[0052] Here, the active region contact hole 90 formed above the Schottky barrier diode replacement region 302 is referred to as the active region second contact hole 90B, and the other active region contact holes 90 are referred to as the active region first contact hole 90A. In the active region first contact hole 90A, the source electrode 80 contacts both the source region 40 and the first isolation region 21, while the active region second contact hole 90B contacts the p-type Schottky barrier diode replacement region 302. Therefore, a pn diode consisting of a pn junction between the Schottky barrier diode replacement region 302 and the drift layer 20 and passing a current in the thickness direction of the chip is formed at a position spaced from the SBD.

[0053] In the first embodiment, a second isolation region 22 is provided in the surge conducting region 301 between two adjacent Schottky barrier diode replaced regions 302 or between the Schottky barrier diode replaced region 302 and the first well region 30. A source region 40 is formed in the surface layer of the Schottky barrier diode replaced region 302 at a certain distance from its end, and a gate insulating film 50 and a gate electrode 60 are formed in the region from the second isolation region 22 to the source region 40. That is, in the first embodiment, a channel structure similar to that of the MOSFET region of the active region 15 is formed inside the Schottky barrier diode replaced region 302, and the surge conducting region 301 also has the function of a MOSFET.

[0054] In the channel structure, the distance between the source region 40 and the second isolation region 22 is called the channel length. The channel length formed in the surge current-carrying region 301 is preferably equal to or longer than the channel length formed in the MOSFET region of the active region 15. Note that if the channel length formed in the surge current-carrying region 301 is too short, the short channel effect causes current to flow in the surge current-carrying region 301 at a low gate voltage, resulting in a lower threshold voltage for the entire chip and increased likelihood of device malfunction. On the other hand, if the channel length formed in the surge current-carrying region 301 is too long, the channel current in the surge current-carrying region 301 becomes small, making it difficult to obtain the benefits of the channel current described below. For these reasons, it is desirable that the channel length formed in the surge current-carrying region 301 be the same as the channel length formed in the MOSFET region of the active region 15.

[0055] For the same reason, it is desirable that the impurity concentration of the channel formed in the surge current-carrying region 301 is the same as the impurity concentration of the channel region formed in the MOSFET region of the active region 15. In addition, it is desirable that the thickness of the gate insulating film 50 in the surge current-carrying region 301 is the same as the thickness of the gate insulating film 50 in the MOSFET region of the active region 15. With this configuration, it is possible to prevent the gate dielectric strength voltage of the Schottky barrier diode replacement region 302 from becoming lower than that of the MOSFET region, and to prevent the channel current from becoming smaller.

[0056] (2) Planar lattice structure Fig. 7 is a plan view showing another configuration of silicon carbide semiconductor device 100 in accordance with the first embodiment, as seen from above, and corresponds to the plan view of Fig. 2. In silicon carbide semiconductor device 100 shown in Fig. 7, unit cell regions, each including an SBD region and a MOSFET region surrounding the SBD region, are repeatedly arranged in the vertical and horizontal directions in plan view. The structure of silicon carbide semiconductor device 100 provided with such unit cell regions is called a "lattice type" structure.

[0057] 7, unit cell regions each including an n-type first isolation region 21 roughly corresponding to the SBD region and a p-type first well region 30 roughly corresponding to the MOSFET region are repeatedly arranged vertically and horizontally in a plan view. The region including the unit cell region in which the SBD-integrated MOSFET is formed and the surge current-carrying region is called the active region. The region around the active region, which includes the gate pad 81 formation region in which the p-type second well region 31 and the like are formed, is called the termination region.

[0058] FIG. 8 is a schematic cross-sectional view showing a schematic configuration from source electrode 80 to gate wiring 82 on the periphery of silicon carbide semiconductor device 100 in FIG.

[0059] In silicon carbide semiconductor device 100 shown in Fig. 8, drift layer 20 made of n-type silicon carbide is formed on the surface of semiconductor substrate 10 made of n-type low-resistance silicon carbide. Second well region 31 made of p-type silicon carbide is provided in a surface layer portion of drift layer 20 at a position substantially corresponding to the region where gate wiring 82 described in Fig. 1 is provided, as shown in the cross-sectional view of Fig. 8.

[0060] A plurality of first well regions 30 made of p-type silicon carbide are provided in the surface layer portion of drift layer 20 in the active region, which is the region below source electrode 80 described with reference to FIG.

[0061] In the surface layer portion of the first well region 30, a source region 40 made of n-type silicon carbide is formed at a position a certain distance inward from the outer periphery of the first well region 30.

[0062] A contact region 35 made of low-resistance p-type silicon carbide is formed on one end side of the source region 40 in the surface layer portion of the first well region 30. A first separating region 21 made of silicon carbide is formed between adjacent contact regions 35 and penetrates the first well region 30. The conductivity type of the first separating region 21 is n-type, the same as that of the drift layer 20, and the n-type impurity concentration of the first separating region 21 may be the same as the n-type impurity concentration of the drift layer 20, or may be higher or lower than the n-type impurity concentration of the drift layer 20.

[0063] A Schottky electrode 71 is formed on the surface side of the first separating region 21, making a Schottky connection with the first separating region 21. The Schottky electrode 71 is preferably formed in a region that includes the corresponding first separating region 21 in a plan view.

[0064] An ohmic electrode 70 is formed on the surface of the source region 40. A source electrode 80 connected to the ohmic electrode 70, Schottky electrode 71, and contact region 35 is formed on these. The first well region 30 can easily exchange electrons and holes with the ohmic electrode 70 via the low-resistance contact region 35.

[0065] Of the regions between adjacent first well regions 30, second separating region 22 made of n-type silicon carbide is formed in a region separate from first separating region 21. Second separating region 22 has the same n-type conductivity as drift layer 20, and the n-type impurity concentration of second separating region 22 may be the same as the n-type impurity concentration of drift layer 20, or may be higher or lower than the n-type impurity concentration of drift layer 20.

[0066] A gate insulating film 50 made of, for example, silicon oxide is selectively formed on the surfaces of adjacent first well regions 30, the second separating region 22 therebetween, and the source regions 40 in those first well regions 30. A gate electrode 60 made of, for example, polycrystalline silicon is formed on at least the gate insulating film 50 above the first well region 30. The surface portion of the first well region 30 facing the gate electrode 60 with the gate insulating film 50 interposed therebetween is called a channel region.

[0067] A second well region 31 is formed outside first well region 30 at the outermost periphery of silicon carbide semiconductor device 100, and a third separated region 23 made of silicon carbide is formed between first well region 30 and second well region 31. The conductivity type of third separated region 23 is n-type, the same as that of drift layer 20, and the n-type impurity concentration of third separated region 23 may be the same as the n-type impurity concentration of drift layer 20, or may be higher or lower than the n-type impurity concentration of drift layer 20.

[0068] A gate insulating film 50 is selectively formed on the second well region 31, similar to the first well region 30, and a gate electrode 60 electrically connected to the gate electrode 60 formed on the first well region 30 is formed on the gate insulating film 50.

[0069] A silicon carbide conductive layer 45 made of silicon carbide is formed in a certain percentage of the upper portion of the second well region 31. The silicon carbide conductive layer 45 has a higher n-type impurity concentration and lower resistance than the drift layer 20. The silicon carbide conductive layer 45 has a lower sheet resistance than the second well region 31 and forms a pn junction with the p-type second well region 31. The silicon carbide conductive layer 45 is formed, for example, over a width equal to or greater than half the width of the second well region 31 in the lateral cross section. The portion where the silicon carbide conductive layer 45 is formed over a width equal to or greater than half the width of the second well region 31 in the lateral cross section does not need to be provided in all cross sections, and may be provided in some cross sections.

[0070] An interlayer insulating film 55 made of, for example, silicon oxide is formed between the gate electrode 60 and the source electrode 80. The gate electrode 60 and the gate wiring 82 above the second well region 31 are connected via a gate contact hole 95 formed in the interlayer insulating film 55. In addition, a JTE region 38 made of p-type silicon carbide is formed on the outer periphery of the second well region 31, i.e., on the opposite side to the first well region 30. The impurity concentration of the JTE region 38 is lower than the impurity concentration of the second well region 31. An FLR (Field Limiting Ring) may be formed instead of the JTE region 38. Alternatively, a combination of the JTE region 38 and an FLR may be formed.

[0071] A field insulating film 51 having a thickness larger than that of the gate insulating film 50 or the gate insulating film 50 is formed on the second well region 31 and the silicon carbide conductive layer 45. An opening, i.e., a termination region contact hole 91, is formed in a part of the gate insulating film 50 or the field insulating film 51 on the surface of the silicon carbide conductive layer 45. The silicon carbide conductive layer 45 and the source electrode 80 are ohmically connected via an ohmic electrode 72 at the termination portion below the termination region contact hole 91.

[0072] Termination region contact hole 91 penetrates gate insulating film 50 or field insulating film 51 and interlayer insulating film 55, and establishes an ohmic connection between silicon carbide conductive layer 45 and source electrode 80, but does not connect second well region 31 and source electrode 80. In addition, the width of silicon carbide conductive layer 45 is larger than the diameter or width of termination region contact hole 91.

[0073] In the first embodiment, the second well region 31 is not in direct ohmic contact with the source electrode 80.

[0074] In the active region, the ohmic electrode 70, the Schottky electrode 71, and the contact region 35 are connected to the source electrode 80 on the interlayer insulating film 55 via an active region contact hole 90 that penetrates the interlayer insulating film 55 and the gate insulating film 50.

[0075] A drain electrode 84 is formed on the back surface of the semiconductor substrate 10 .

[0076] 9 is a cross-sectional view showing a schematic configuration of the surge conducting region 301 and the active region contact hole 90. In this cross-sectional view, the configurations of the surge conducting region 301 and the Schottky barrier diode replacement region 302 are the same as those in FIG. 6, and therefore detailed description thereof will be omitted. In addition, the area ratio of the Schottky barrier diode replacement region 302 to the active region 15 in plan view is also the same as that explained with reference to FIGS. 4 and 5.

[0077] (3) Supplementary explanation common to stripe and grid types A high-area density SBD structure such as a folded structure may be formed in the region of the active region closest to the termination region. Alternatively, a high-area density SBD structure in the termination region, including a JBS with many SBDs formed therein, may be formed in the region of the termination region closest to the active region. A sense cell for sensing current may also be provided within the active region.

[0078] The concentration of n-type impurities in the second separation region 22 may be higher than the concentration of n-type impurities in the drift layer 20. When the drift layer 20 and the second separation region 22 are formed in this manner, the on-resistance can be reduced.

[0079] (4) Planar Mold Manufacturing Method Next, a method for manufacturing a planar silicon carbide semiconductor device 100 according to the first embodiment will be described with reference to the cross-sectional schematic views of Figures 10 to 17. A method for manufacturing a stripe silicon carbide semiconductor device 100 will be described below, but the method for manufacturing a lattice silicon carbide semiconductor device 100 is similar to the method described below.

[0080] First, a semiconductor substrate 10 is prepared, which is made of n-type, low-resistance silicon carbide having a first main surface oriented in a (0001) plane with an off-angle and a polytype of 4H. A 1×10 15 From 1×10 17 cm -3 The drift layer 20 is epitaxially grown from silicon carbide to a thickness of, for example, 5 to 50 μm with an n-type impurity concentration of 1000 μm.

[0081] Next, an implantation mask is formed using photoresist or the like in a predetermined region on the surface of the drift layer 20, and Al (aluminum), a p-type impurity, is ion-implanted. At this time, the depth of the Al ion implantation is set to, for example, about 0.5 to 3 μm, which does not exceed the thickness of the drift layer 20. The impurity concentration of the implanted Al is, for example, 1×10 17 From 1×10 19 cm -3 , which is higher than the impurity concentration of the drift layer 20. The implantation mask is then removed. The regions implanted with Al ions in this step become the first well region 30 in the active region and the second well region 31 in the termination region.

[0082] Next, an implantation mask is formed using photoresist or the like in a predetermined region on the surface of the drift layer 20, and Al, a p-type impurity, is ion-implanted. At this time, the depth of the Al ion implantation is set to about 0.5 to 3 μm, which does not exceed the thickness of the drift layer 20. The impurity concentration of the implanted Al is, for example, 1×10 17 From 1×10 19 cm -3 and the impurity concentration is set to be higher than that of the drift layer 20. Then, the implantation mask is removed. The region implanted with Al ions in this step becomes the Schottky barrier diode replacement region 302.

[0083] A portion of the surface of the first well region 30 adjacent to the Schottky barrier diode replacement region 302 becomes a channel region. To make the threshold voltage of the first well region 30 adjacent to the Schottky barrier diode replacement region 302 equal to or higher than, and preferably equal to, the threshold voltage of the MOSFET region, the p-type impurity concentrations of the surface of the Schottky barrier diode replacement region 302 and the adjacent first well region 30 may be equal to or higher than, and preferably equal to, the p-type impurity concentration of the surface of the first well region 30 in the MOSFET region. One method for achieving this is to perform the implantation step of the Schottky barrier diode replacement region 302 and the adjacent first well region 30 and the implantation step of the first well region 30 in the MOSFET region in the same process. This method makes it possible to make the p-type impurity concentrations of the surface of the Schottky barrier diode replacement region 302 and the first well region 30 equal to each other and reduce the number of processes.

[0084] Next, an implantation mask is formed using photoresist or the like in a predetermined region on the surface of the drift layer 20 in the termination region, and Al, a p-type impurity, is ion-implanted. At this time, the depth of the Al ion implantation is set to about 0.5 to 3 μm, which does not exceed the thickness of the drift layer 20. The impurity concentration of the implanted Al is, for example, 1×10 16 From 1×10 18 cm -3The impurity concentration is set to be higher than that of the drift layer 20 and lower than that of the first well region 30 and the Schottky barrier diode replacement region 302. The implantation mask is then removed. The region into which Al is ion-implanted by this step becomes the JTE region 38. Similarly, a higher impurity concentration, for example, 1×10 16 From 1×10 18 cm -3 The contact region 35 is formed by ion implanting Al at an impurity concentration of 1000 .mu.m.

[0085] Next, an implantation mask is formed using photoresist or the like so as to expose predetermined locations inside the surface layer portions of the first well region 30 and the Schottky barrier diode replacement region 302, and N (nitrogen) as an n-type impurity is ion-implanted. The depth of N ion implantation is shallower than the thickness of the first well region 30. The impurity concentration of the ion-implanted N is, for example, 1×10 18 From 1×10 21 cm -3 and is set to be higher than the p-type impurity concentration of the first well region 30 and the Schottky barrier diode replacement region 302. Of the regions into which N is implanted in this step, the region exhibiting n-type impurity becomes the source region 40. The thickness of the source region 40 only needs to be smaller than the thickness of the first well region 30.

[0086] Similarly, an implantation mask is formed using photoresist or the like so as to expose a predetermined location inside the second well region 31 of the termination region, and N, an n-type impurity, is ion-implanted. The depth of N ion implantation is shallower than the thickness of the second well region 31. The impurity concentration of the ion-implanted N is, for example, 1×10 18 From 1×10 21 cm -3 and is set to be higher than the p-type impurity concentration of second well region 31. Of the regions into which N is implanted in this step, the region exhibiting n-type becomes silicon carbide conductive layer 45. The thickness of silicon carbide conductive layer 45 only needs to be smaller than the thickness of second well region 31.

[0087] Silicon carbide conductive layer 45 and source region 40 may be formed in the same process, to the same thickness, and to the same impurity concentration, or silicon carbide conductive layer 45 and source region 40 may be formed in different processes, to different thicknesses, and to different impurity concentrations.

[0088] Next, the drift layer 20 is annealed in a heat treatment device in an inert gas atmosphere such as argon (Ar) gas at a temperature of 1300 to 1900°C for 30 seconds to 1 hour. This annealing electrically activates the implanted N and Al ions. Figures 10 and 11 are cross-sectional views of the same region as Figures 3 and 6 after the process up to this stage has been completed.

[0089] Next, using CVD, photolithography, and the like, a field insulating film 51 made of silicon oxide is formed on the region other than the active region where the first well region 30 and the surge current carrying region 301 are formed, i.e., on the termination region. The film thickness of the field insulating film 51 is, for example, 0.5 to 2 μm, which is larger than the film thickness of the gate insulating film 50.

[0090] Next, the surface of the silicon carbide layer that is not covered by the field insulating film 51 is thermally oxidized to form a silicon oxide film of a desired thickness as the gate insulating film 50. Subsequently, a conductive polycrystalline silicon film, for example, is formed on the gate insulating film 50 and the field insulating film 51 by low-pressure CVD, and this is patterned to form the gate electrode 60. Next, an interlayer insulating film 55 made of, for example, silicon oxide and having a thickness larger than that of the gate insulating film 50 is formed by low-pressure CVD. Figures 12 and 13 are cross-sectional views of the same region as Figures 3 and 6 after the processes up to this stage have been completed.

[0091] Next, a part of the active region contact hole 90 is formed, which penetrates the interlayer insulating film 55 and the gate insulating film 50 and reaches the contact region 35 and the source region 40 in the active region, and a termination region contact hole 91 is formed, which reaches the silicon carbide conductive layer 45 in the termination region. However, the interlayer insulating film 55 and the gate insulating film 50 are left in the remaining part of the active region contact hole 90, i.e., the part where the Schottky electrode 71 is to be formed.

[0092] Next, a metal film primarily composed of Ni is formed by, for example, sputtering on the surface of the silicon carbide layer exposed from a portion of the active region contact hole 90 and the termination region contact hole 91, followed by heat treatment at a temperature of 600 to 1100°C. This causes the metal film primarily composed of Ni to react with the silicon carbide layer, forming a silicide layer between the metal film and the silicon carbide layer. Subsequently, the remaining metal film other than the silicide layer is removed by wet etching. As a result, the remaining silicide layer becomes the ohmic electrode 70 and the termination ohmic electrode 72. Figures 14 and 15 are cross-sectional views of the same region as Figures 3 and 6 after the process up to this stage has been completed.

[0093] Subsequently, a metal film containing Ni as a main component is formed on the back surface (second main surface) of the semiconductor substrate 10 and heat-treated to form a drain electrode 84 as a back surface ohmic electrode on the back side of the semiconductor substrate 10.

[0094] Next, a resist mask 99 is formed, and the interlayer insulating film 55 and gate insulating film 50 on the first isolation region 21 and the Schottky barrier diode replacement region 302, as well as the interlayer insulating film 55 at a position that will become the gate contact hole 95, are removed. The removal method is wet etching that does not damage the surface of the silicon carbide layer that will become the Schottky interface. 16 and 17 are cross-sectional views of the same region as in FIGS. 3 and 6 after the process up to this stage has been completed.

[0095] Subsequently, after removing the resist mask 99, a metal film to be a Schottky electrode is deposited by a sputtering method or the like. Then, using patterning with a photoresist or the like, a Schottky electrode 71 is formed on the first isolation region 21 in the active region contact hole 90 and on the Schottky barrier diode replacement region 302. The material of the Schottky electrode 71 is, for example, Ti (titanium), Mo (molybdenum), or the like.

[0096] Next, wiring metal such as Al is formed by sputtering or vapor deposition on the surface of the substrate that has been processed up to this point, and processed into a predetermined shape by photolithography to form source-side ohmic electrode 70, terminal ohmic electrode 72, source electrode 80 in contact with Schottky electrode 71, and gate pad 81 and gate wiring 82 in contact with gate electrode 60. In this manner, silicon carbide semiconductor device 100 according to the first embodiment shown in Figs. 3 and 6 is manufactured.

[0097] (5) Operation explanation Next, an operation of silicon carbide semiconductor device 100 according to the first embodiment will be described. Here, a silicon carbide semiconductor device in which the semiconductor material is 4H type silicon carbide will be described as an example. In this case, the built-in potential of the pn junction is approximately 2 V.

[0098] The operation of silicon carbide semiconductor device 100 in accordance with the first embodiment will be briefly described below, divided into four normal operating states and one abnormal state.

[0099] The first normal operation state is a state in which a higher voltage is applied to drain electrode 84 compared to source electrode 80, and a positive voltage equal to or greater than the threshold voltage is applied to gate electrode 60; this state will be referred to as the "on state" hereinafter. In this on state, an inversion channel is formed in the channel region, and a path through which electrons, which are carriers, flow is formed between n-type source region 40 and n-type second separating region 22. On the other hand, an electric field (reverse bias) is applied to the Schottky junction formed at the contact portion between first separating region 21 and Schottky electrode 71 in a direction that makes it difficult for current to flow through the Schottky junction, i.e., in the reverse direction, so no current flows.

[0100] Electrons flowing from the source electrode 80 to the drain electrode 84 are driven by an electric field generated by a positive voltage applied to the drain electrode 84. Therefore, electrons travel from the source electrode 80 to the drain electrode 84 via the ohmic electrode 70, the source region 40, the channel region, the second separation region 22, the drift layer 20, and the semiconductor substrate 10. Therefore, applying a positive voltage to the gate electrode 60 causes an on-current to flow from the drain electrode 84 to the source electrode 80. The voltage applied between the source electrode 80 and the drain electrode 84 at this time is called the on-voltage, and the value obtained by dividing the on-voltage by the density of the on-current is called the on-resistance. The on-resistance is equal to the sum of the resistances of the paths through which the electrons flow. The product of the on-resistance and the square of the on-current corresponds to the conduction loss consumed by the MOSFET when it is conducting, so a low on-resistance is preferable. In the first embodiment, the channel region is also formed in the surge conduction region 301. Therefore, the surge conduction region 301 can also contribute to reducing the on-resistance.

[0101] The second normal operating state is a state where a higher voltage is applied to the drain electrode 84 compared to the source electrode 80, and a voltage below the threshold is applied to the gate electrode 60. In this off state, there are no inversion carriers in the channel region, so no on-state current flows, and the high voltage that was applied to the load in the on-state is applied between the source electrode 80 and the drain electrode 84 of the MOSFET.

[0102] An electric field is applied to the Schottky junction formed at the contact between the first separation region 21 and the Schottky electrode 71 in the same direction as in the "on state," so ideally, no current flows. However, a much higher electric field than in the "on state" is applied, so leakage current may occur. A large leakage current increases heat generation in the MOSFET, which may thermally destroy the MOSFET and the module using the MOSFET. Therefore, to reduce leakage current, it is preferable to keep the electric field applied to the Schottky junction low.

[0103] The third normal operation state is a state in which a lower voltage is applied to the drain electrode 84 than to the source electrode 80, i.e., a back electromotive force is applied to the MOSFET, and a voltage less than the threshold is applied to the gate electrode 60. In this state, a freewheeling current flows from the source electrode 80 to the drain electrode 84. This state is hereinafter referred to as the "asynchronous rectification state." In the asynchronous rectification state, in the active region other than the surge conducting region 301, a forward electric field (forward bias) is applied to the Schottky junction formed at the contact between the first separation region 21 and the Schottky electrode 71. As a result, a unipolar current including an electron current flows from the Schottky electrode 71 to the n-type first separation region 21. In other words, a unipolar current flows through the SBD including the Schottky electrode 71 and the first separation region 21. The freewheeling current component of the freewheeling diode is mainly this unipolar component.

[0104] The source electrode 80 and the first well region 30 are at the same potential via the source-side ohmic electrode 70. As a result, a forward bias is also applied to the pn junction between the p-type first well region 30 and the drift layer 20. However, the pn junction is formed in parallel with the Schottky junction, and when switching from the off state to the asynchronous rectification state, the Schottky junction, which has a lower threshold voltage, turns on before the pn junction, so that the reflux current flows almost entirely through the Schottky junction and not through the pn junction.

[0105] Even when the voltage applied between the source and drain exceeds the built-in potential of the pn junction, a voltage applied to the pn junction is the source-drain voltage minus the voltage drop caused by the unipolar current of the SBD in the drift layer 20. This makes it possible to apply a high source-drain voltage without turning on the pn junction, and as a result, a high current can flow using only the unipolar current.

[0106] In this way, by incorporating an SBD, it is possible to suppress a bipolar forward current from flowing through the pn junction, i.e., the body diode, which is a parasitic pn diode, during asynchronous rectification. If a starting point such as a basal plane dislocation exists at the pn junction through which the bipolar current flows, crystal defects such as stacking faults may expand due to repeated asynchronous rectification. Crystal defects such as stacking faults block current flowing in the thickness direction of the chip, which may increase on-resistance and lead to thermal runaway, resulting in device failure. Since the silicon carbide semiconductor device 100 according to the first embodiment has an SBD incorporated, it is possible to suppress a bipolar current from flowing through the pn junction during reflux, thereby improving the reliability of the silicon carbide semiconductor device 100.

[0107] On the other hand, in the asynchronous rectification state, the surge conducting region 301 does not have a first separation region 21 connected to the Schottky electrode 71, so that a unipolar current does not easily flow. The unipolar current flowing through the junction between the Schottky electrode 71 formed around the surge conducting region 301 and the first separation region 21 diffuses in the chip plane direction in the drift layer 20, so that some unipolar current also flows in the drift layer 20 within the surge conducting region 301. However, the current density is lower than in the active regions other than the surge conducting region 301, so that a bipolar current flows more easily in the pn junction of the surge conducting region 301 due to a low source-drain voltage than in the active regions other than the surge conducting region 301.

[0108] When a bipolar current flows through a pn junction, crystal defects such as stacking faults may expand. However, because the asynchronous rectification sequence is expected to last only a short time, from several hundred nanoseconds to several microseconds, the expansion of crystal defects such as stacking faults is unlikely to occur. In the first embodiment, the area ratio of the Schottky barrier diode replacement region 302 to the active region is 0.01% or more and less than the area ratio of the SBD region to the active region 15 when not replaced with the Schottky barrier diode replacement region 302. More preferably, the area ratio is 0.01% or more and 5% or less. This reduces the possibility of reliability degradation due to the expansion of crystal defects such as stacking faults. Furthermore, an area ratio of 5% or less has almost negligible impact on chip electrical characteristics during normal operation, thereby suppressing degradation of electrical characteristics such as conduction loss due to the surge current-carrying region 301.

[0109] The fourth normal operation state is a state in which a lower voltage is applied to the drain electrode 84 than to the source electrode 80, i.e., a back-electromotive force is applied to the MOSFET, and a voltage equal to or greater than the threshold voltage is applied to the gate electrode 60. In this state, a reflux current flows from the source electrode 80 to the drain electrode 84. This state is hereinafter referred to as the "synchronous rectification state." In the synchronous rectification state, a unipolar current flows through the channel in addition to a unipolar current flowing through the Schottky electrode 71. In the first embodiment, the channel is formed not only in the MOSFET region but also in the surge current-carrying region 301. Therefore, although the surge current-carrying region 301 does not have a junction between the Schottky electrode 71 and the first separation region 21, the channel current carries the unipolar current, preventing the pn junction from turning on. This prevents heat concentration in the surge current-carrying region 301 during the synchronous rectification state.

[0110] For example, in inverter operation, the synchronous rectification sequence takes up about half of the carrier cycle, and is assumed to be relatively long, lasting from several tens of microseconds to several milliseconds. This is much longer than the asynchronous rectification sequence, which is assumed to last from several hundred nanoseconds to several microseconds. If current continues to flow through a pn diode for such a long time, it will cause localized heat generation. The reason for this is explained below.

[0111] First, compared to unipolar current, bipolar current has the characteristic of causing conductivity modulation and reducing drift resistance. Resistance decreases in regions where bipolar current flows, and more current flows than in regions where only unipolar current flows. This causes a temperature rise in the localized region where bipolar current flows, further strengthening conductivity modulation and causing current concentration, which initiates a positive feedback loop. This results in localized heat generation in the surge current-carrying region 301, which may lead to reliability degradation such as cracks at electrode junctions and breakdown of the gate insulating film. In contrast, in the first embodiment, a channel current flows in the surge current-carrying region 301 during synchronous rectification. This suppresses the operation of the pn diode in the surge current-carrying region 301 and prevents localized heat generation, thereby achieving high reliability.

[0112] Finally, we will discuss an abnormal condition in which a surge current flows between the source and drain. In this condition, a current exceeding the rated current flows instantaneously from the source to the drain, as occurs in inverter failures and other similar events. In many of these cases, an off signal is assumed to be applied to the gate, and no current flows through the channel. At this time, the chip must not fail due to heat generation. The allowable current that does not cause failure is called surge withstand capability. To increase the allowable current, it is essential to allow the surge current to flow with low resistance and minimize heat generation in the chip. Furthermore, because abnormal conditions only occur in extremely rare cases, such as during accidents, and their frequency is low, it is generally said that there is no need to worry about reliability degradation due to current flow through pn diodes, such as the expansion of crystal defects such as stacking faults.

[0113] However, surge resistance should be improved. From the viewpoint of improving surge resistance, bipolar current, which generates conductivity modulation compared to unipolar current, is suitable for passing surge current with low resistance. In the surge current-carrying region 301 according to the first embodiment, the first separation region 21 connected to the Schottky electrode 71 is not present, making it difficult for unipolar current to flow. Therefore, at the start of surge current flow, the pn junction in the surge current-carrying region 301 turns on while the current flowing in regions other than the surge current-carrying region 301 is low, and bipolar current begins to flow. In this state, if the surge current transiently increases and reaches a large current exceeding the rated current, the bipolar current flowing from the surge current-carrying region 301 further increases, and holes in the drift layer 20 diffuse toward the active region around the surge current-carrying region 301.

[0114] In the region where holes are diffused, the resistance of the drift layer 20 decreases, the unipolar current density increases, and the parasitic pn diode (i.e., body diode) of the MOSFET turns on. Holes then diffuse into the drift layer 20 around this region, and the body diode in the adjacent active region turns on. In other words, when a surge current flows, the surge current-carrying region 301 acts as the starting point, and a chain reaction occurs among the surrounding body diodes, causing them to turn on one after another. By turning on the body diodes over a wide area of ​​the chip in this way, the chip enters a bipolar current-carrying state, and the generated energy is reduced due to the low resistance caused by conductivity modulation, thereby suppressing heat generation when chip current flows. In other words, the allowable surge current can be increased, thereby improving surge resistance.

[0115] In this way, surge current-carrying region 301 not only increases the current that can flow in surge current-carrying region 301, but also changes the characteristics over a wide range of the chip through chain reactions. Therefore, the area ratio of surge current-carrying region 301 to the active region can be small.

[0116] FIG. 18 shows the results of a TCAD (technology CAD) simulation verifying the chain operation of pn diodes from the Schottky barrier diode replacement region 302 with a width of 20 μm. The higher the density of the hatched dots in FIG. 18, the higher the hole concentration. Over time, the body diode chain operation region corresponding to the region with high hole concentration expands due to conductivity modulation of bipolar conduction. As described above, the body diode chain operation region is the region where the body diode, which is the parasitic pn diode of the MOSFET in the unit cell region, operates due to a chain reaction starting from the operation of the pn diode in the Schottky barrier diode replacement region 302.

[0117] After the pn diode in the surge current-carrying region 301 is activated by the surge current, the hole density in the adjacent cells increases over time, and the conductivity modulation propagates due to the operation of the body diode, which is a pn diode, and it was confirmed that the body diode chain operation region expands. By understanding the propagation speed of pn diode operation during surge current flow, i.e., the chain speed, it is possible to design the area ratio of the body diode chain operation region to the active region in the event of a surge current of 1 msec or more, which is generally considered to be an abnormal state.

[0118] According to the first embodiment, as described above, the SBD conduction is switched to the body diode conduction earlier than when the surge conduction region 301 is not present. The body diode, which is a pn diode, has low resistance due to conductivity modulation caused by bipolar operation, so the generated energy density decreases as soon as the body diode conducts. As a result, heat generation during surge conduction is suppressed, and surge resistance can be improved.

[0119] 19 is a graph showing the relationship between maximum forward voltage VFmax and applied current IFSM during a surge current conduction test for a prototype silicon carbide semiconductor device. In the prototype silicon carbide semiconductor device, the area ratio of p-type Schottky barrier diode replacement region 302 in surge current conduction region 301 to active region 15 in a plan view was changed.

[0120] As shown in Figure 19, the SBD conducts current in a relatively low current region, and when a certain current flows, it switches to body diode conduction, and the slope of the VI characteristics changes due to the change in resistance. The faster the switch to body diode conduction occurs, the lower the generated energy, which is advantageous for surge resistance. In Figure 19, the area ratio of the Schottky barrier diode replacement region 302 to the active region 15 in a plan view was varied from approximately 0.0197% to 0.1967%. As a result, it was confirmed that the body diode operation start voltage decreases and the switch to body diode conduction occurs more quickly as the area ratio increases.

[0121] 20 shows the results of confirming surge resistance based on this result. The surge current applied to the silicon carbide semiconductor device was gradually increased and measured until breakdown occurred in the silicon carbide semiconductor device. As a result, it was confirmed that the surge resistance was improved in the configuration having the Schottky barrier diode replacement region 302 compared to the configuration without the Schottky barrier diode replacement region 302.

[0122] Furthermore, in the first embodiment, the Schottky barrier diode replacement region 302 is connected to the source electrode 80 via the active region second contact hole 90B at a position distant from the junction between the Schottky electrode 71 and the first separation region 21. That is, a pn diode is formed in the surge current-carrying region 301, penetrating between the source and drain in the chip cross-sectional direction. This pn diode does not need to conduct current in the chip plane direction through a p-type layer with high sheet resistance, so when the pn diode is turned on by a surge current, a large bipolar current can flow. This makes the Schottky barrier diode replacement region 302 more likely to function as the starting point for pn diode operation.

[0123] Furthermore, in this first embodiment, a unipolar transistor and a bipolar diode coexist in the active region of the same chip, so the effective area of ​​the diode region can be made smaller than when one of them is externally attached.

[0124] To further increase surge resistance, it is desirable to arrange multiple surge current-carrying regions 301 evenly over the entire active region so that regions where pn diodes operate in a chain reaction from the surge current-carrying regions 301 are not unevenly distributed in the active region. With this configuration, heat generation locations can be dispersed.

[0125] <Embodiment 2> 21 is a cross-sectional view showing a schematic configuration of a surge conducting region 301 and an active region contact hole 90 according to the second embodiment. In the surge conducting region 301 according to the first embodiment, the second separating region 22 is formed as shown in FIG. 6. In contrast, in the surge conducting region 301 according to the second embodiment, the second separating region 22 is not formed as shown in FIG. 21. As an example of a layout method, in the surge conducting region 301, the regions including the first well region 30, the first separating region 21, and the second separating region 22 are all replaced with p-type.

[0126] With this configuration, there is no channel in surge current-carrying region 301, and therefore surge current-carrying region 301 does not function as a MOSFET. Therefore, even when the gate is turned on, the pn diode turns on preferentially, and the operation of the surrounding pn diodes is chained, thereby increasing surge resistance.

[0127] <Modifications of the First and Second Embodiments> In the above description, a unit cell structure in which an SBD region and a MOSFET region are integrated is formed in the active region. However, an SBD and a MOSFET may be arranged in parallel within a unit cell formed in the active region.

[0128] <Third Embodiment> Silicon carbide semiconductor device 100 according to the first and second embodiments is a planar type silicon carbide semiconductor device, whereas silicon carbide semiconductor device 100 according to the third embodiment is a trench type silicon carbide semiconductor device.

[0129] (1) Trench structure Fig. 22 is a plan view of the silicon carbide layer of silicon carbide semiconductor device 100 according to the third embodiment, as viewed from above, and is a plan view corresponding to Fig. 2. In silicon carbide semiconductor device 100 shown in Fig. 22, stripe-shaped gate trenches GT in which transistors are formed and stripe-shaped Schottky trenches ST in which Schottky electrodes are buried are arranged alternately and parallel to each other in the active region. A second well region 31 is formed in a termination region around the active region.

[0130] 23 is an enlarged plan view of the active region of the silicon carbide semiconductor device 100 according to the third embodiment. A first connection region 36 and a second connection region 37 made of p-type silicon carbide are formed adjacent to each other in the gate trench GT and the Schottky trench ST at regular intervals along the extension direction of the gate trench GT and the Schottky trench ST. Furthermore, in the surge conducting region 301, a p-type Schottky barrier diode replacement region 302 is formed adjacent to the Schottky trench ST. A region including the surge conducting region 301 and a unit cell region including the Schottky trench ST substantially corresponding to the SBD region and the gate trench GT substantially corresponding to the MOSFET region is referred to as the active region.

[0131] In the termination region of silicon carbide semiconductor device 100 according to the third embodiment, a structure similar to that of planar type silicon carbide semiconductor device 100 described in the first embodiment etc. may be formed, or a different structure suited to the trench type may be formed. Only the active region of silicon carbide semiconductor device 100 according to the third embodiment will be described below.

[0132] Fig. 24 is a cross-sectional view showing a portion of the active region including the surge conducting region 301 in Fig. 23 where the first connection region 36 and the second connection region 37 are not formed. Fig. 25 is a cross-sectional view showing a portion of the active region including the surge conducting region 301 in Fig. 23 where the first connection region 36 and the second connection region 37 are formed.

[0133] 23 to 25, a drift layer 20 made of n-type silicon carbide is formed on the surface of a semiconductor substrate 10 made of low-resistivity n-type silicon carbide. In the third embodiment, the semiconductor layer provided with the active region is drift layer 20 on semiconductor substrate 10, but it may be semiconductor substrate 10. A first well region 30 made of p-type silicon carbide is formed in a surface layer portion of drift layer 20, as shown in the cross-sectional views of FIGS. 24 and 25.

[0134] A source region 40 made of n-type silicon carbide is formed in a portion of the surface layer on the first well region 30. A contact region 35 made of low-resistivity p-type silicon carbide is formed adjacent to the source region 40 in the remaining surface layer on the first well region 30.

[0135] In the active region, a gate trench GT is formed, penetrating the source region 40 and the first well region 30 to reach the drift layer 20. In addition, a Schottky trench ST is formed in another location, penetrating the source region 40 and the first well region 30 to reach the drift layer 20.

[0136] The gate trenches GT and the Schottky trenches ST are arranged alternately and parallel to each other. The gate trenches GT and the Schottky trenches ST have the same depth, but may have different depths. Furthermore, the gate trenches GT and the Schottky trenches ST may be formed with the same width, or may have different widths.

[0137] A gate electrode 60 is formed in the gate trench GT via a gate insulating film 50 made of, for example, silicon oxide. The gate electrode 60 is made of, for example, low-resistivity polycrystalline silicon with a high impurity concentration. An interlayer insulating film 55 made of, for example, silicon oxide is formed on the gate electrode 60. A Schottky electrode 71 and a source electrode 80 are formed in the Schottky trench ST, and the Schottky electrode 71 is formed in contact with the drift layer 20 and is Schottky-connected to the drift layer 20.

[0138] A p-type first protection region 32 is formed in the drift layer 20 at the bottom of the gate trench GT. A p-type second protection region 33 is formed in the drift layer 20 at the bottom of the Schottky trench ST. The first protection region 32 and the second protection region 33 preferably have the same depth and the same impurity concentration.

[0139] 25, the first protection region 32 and the first well region 30 are connected by a p-type first connection region 36. The second protection region 33 and the first well region 30 are connected by a p-type second connection region 37.

[0140] An ohmic electrode 70 is formed on the surface of the source region 40. A source electrode 80 connected to the ohmic electrode 70, the Schottky electrode 71, and the contact region 35 is formed thereon. The first well region 30 can easily exchange electrons and holes with the ohmic electrode 70 via the low-resistance contact region 35. The source electrode 80 is also connected to the Schottky electrode 71 in the Schottky trench ST.

[0141] Of the side surfaces of the gate trench GT in which the gate electrode 60 is formed, a region of the first well region 30 facing the gate electrode 60 via the gate insulating film 50 is called a channel region. Of the side surfaces of the Schottky trench ST, an SBD is formed at a location where the Schottky electrode 71 and the drift layer 20 are in contact with each other.

[0142] A drain electrode 84 is formed on the back surface of the semiconductor substrate 10 .

[0143] The second well region 31 in the termination region may have the same depth and thickness as the first well region 30 in the active region. The second well region 31 in the termination region may be formed to the depth of the bottoms of the gate trench GT and the Schottky trench ST so as to have the same depth as the first protection region 32 and the second protection region 33 in the active region. A low-resistance n-type silicon carbide conductive layer 45 may be formed in a surface layer portion of the second well region 31. The second well region 31 does not need to be directly ohmically connected to the source electrode 80.

[0144] 24, in the third embodiment, the first separating region 21 contacts the side surface of the Schottky trench ST and corresponds to a region sandwiched between the first well region 30 contacting the Schottky trench ST and the second protection region 33. The second separating region 22 contacts the side surface of the gate trench GT and corresponds to a region sandwiched between the first well region 30 contacting the gate trench GT and the first protection region 32.

[0145] In the surge current-carrying region 301, the first isolation region 21 is replaced with a p-type Schottky barrier diode replacement region 302 that contacts the side surface of the Schottky trench ST. Note that in Figures 24 and 25, the boundary of the Schottky barrier diode replacement region 302 is shown by a dotted line for convenience. The Schottky electrode 71 is not connected to an n-type silicon carbide layer such as the first isolation region 21, which has the same n-type as the drift layer 20, and the Schottky electrode 71 and the drift layer 20 are separated by the p-type Schottky barrier diode replacement region 302.

[0146] In the third embodiment, similarly to the first embodiment, the area ratio of the Schottky barrier diode replacement region 302 to the active region 15 in plan view is 0.01% or more and less than the area ratio of the SBD region to the active region 15 when not replaced with the Schottky barrier diode replacement region 302, and more preferably 0.01% or more and 5% or less.

[0147] (2) Trench type manufacturing method Next, a method for manufacturing trench type silicon carbide semiconductor device 100 according to the third embodiment will be described with reference to the schematic cross-sectional views of the active region in Figures 26 to 31. Here, a method for manufacturing the portions where first connection region 36, second connection region 37, and Schottky barrier diode replacement region 302 are not formed will be described, but the portions where these regions are formed are also generally the same as those described below, and will therefore not be shown in the figures and will be described as appropriate.

[0148] First, a semiconductor substrate 10 is prepared, which is made of n-type, low-resistance silicon carbide having a first main surface oriented in a (0001) plane with an off-angle and a polytype of 4H. For example, 1×10 15 From 1×10 17 cm -3 The drift layer 20 is epitaxially grown from silicon carbide to a thickness of, for example, 5 to 50 μm with an n-type impurity concentration of 1000 μm.

[0149] Next, Al, which is a p-type impurity, is ion-implanted into the surface of the drift layer 20. At this time, the depth of the Al ion implantation is set to, for example, about 0.5 to 3 μm, which does not exceed the thickness of the drift layer 20. The impurity concentration of the implanted Al is, for example, 1×10 17 From 1×10 19 cm -3 and the impurity concentration is set to be higher than that of the drift layer 20. The region into which Al ions are implanted in this step becomes the first well region 30 in the active region, and the second well region 31 in the termination region. Note that the first well region 30 may be formed on the drift layer 20 by an epitaxial method instead of ion implantation.

[0150] Next, a predetermined region of the surface layer of the first well region 30 is doped with an impurity concentration higher than that of the first well region 30, for example, 1×10 16 From 1×10 18 cm -3 The contact region 35 is formed by ion-implanting Al at an impurity concentration of 1×10. Furthermore, N, an n-type impurity, is ion-implanted into a predetermined region in the surface layer of the first well region 30. The depth of N ion implantation is shallower than the thickness of the first well region 30. Furthermore, the impurity concentration of the ion-implanted N is, for example, 1×10 18 From 1×10 21 cm -3 and the concentration of the p-type impurities is set to be higher than the concentration of the p-type impurities in the first well region 30. Of the regions into which N is implanted in this step, the region exhibiting n-type impurities becomes the source region 40. Figure 26 is a cross-sectional view of the active region after the steps up to this stage have been completed.

[0151] Next, one of a gate trench GT and a Schottky trench ST is formed in one source region 40 between adjacent contact regions 35. The gate trenches GT and the Schottky trenches ST are arranged alternately. Al, which is a p-type impurity, is ion-implanted into the bottom of each of the gate trenches GT and the Schottky trenches ST. This forms a first protection region 32 at the bottom of the gate trench GT and a second protection region 33 at the bottom of the Schottky trench ST. The impurity concentration of each of the first protection region 32 and the second protection region 33 is, for example, 1×10 17 From 1×10 19 cm -3 is.

[0152] The first connection region 36 and the second connection region 37 formed in the gate trench GT and the Schottky trench ST, respectively, are formed by, for example, obliquely implanting ions of p-type impurities such as Al from a direction perpendicular to the extension direction of each trench. The impurity concentration of each of the first connection region 36 and the second connection region 37 is, for example, 1×10 17 From 1×10 19 cm -3 is.

[0153] The Schottky barrier diode replacement region 302 is formed by obliquely implanting ions of p-type impurities such as Al from a direction perpendicular to the extension direction of the Schottky trench ST, similar to the first connection region 36 and the second connection region 37. The impurity concentration of the Schottky barrier diode replacement region 302 is 1×10 17 From 1×10 19 cm -3 If the Schottky barrier diode replacement region 302 is formed simultaneously with at least one of the first connection region 36 and the second connection region 37, the number of steps can be reduced.

[0154] Here, when the plane orientation of the first main surface of the semiconductor substrate 10 is a (0001) plane having an off-axis angle in the <11-20> direction, the extension directions of the gate trench GT and the Schottky trench ST in the active region may be parallel to the <11-20> direction, which is the off-axis direction. With this configuration, the Schottky trench ST and the trench sidewalls on both sides thereof are no longer affected by the off-axis direction of the semiconductor substrate 10, so that variations in the barrier height of the Schottky interface of the Schottky trench ST can be reduced. Furthermore, the threshold voltage of the MOSFET in the gate trench GT is no longer affected by the off-axis direction of the semiconductor substrate 10, so that variations in the threshold voltage of the MOSFET can be reduced.

[0155] Next, the drift layer 20 is annealed in a heat treatment device in an inert gas atmosphere such as Ar gas at a temperature of 1300 to 1900°C for 30 seconds to 1 hour. This annealing electrically activates the implanted N and Al ions. Figure 27 is a cross-sectional view of the active region after the process up to this stage.

[0156] Subsequently, as shown in FIG. 28, the inside of the Schottky trench ST is filled with a protective insulating film 52 made of, for example, silicon oxide.

[0157] Next, the surface of the silicon carbide layer not covered with the protective insulating film 52 is thermally oxidized to form a gate insulating film 50 of a desired thickness made of, for example, silicon oxide in the gate trench GT. Subsequently, a conductive polycrystalline silicon film, for example, is formed on the gate insulating film 50 by low-pressure CVD, and this is patterned to form a gate electrode 60. Next, an interlayer insulating film 55 made of, for example, silicon oxide and having a thickness larger than that of the gate insulating film 50 is formed on the gate electrode 60 by low-pressure CVD. Subsequently, the interlayer insulating film 55 and the gate insulating film 50 are selectively removed by wet etching so as to expose the contact region 35 and the source region 40 in the active region. Figure 29 is a cross-sectional view of the active region after the process up to this stage has been completed.

[0158] Next, a metal film containing Ni as its main component is formed on the surface of the silicon carbide layer in the exposed source region 40 and contact region 35 by, for example, sputtering, and then heat treatment is performed at a temperature of 600 to 1100°C. This causes the metal film containing Ni as its main component to react with the silicon carbide layer, forming a silicide layer between the metal film and the silicon carbide layer. Next, the remaining metal film other than the silicide layer is removed by wet etching. As a result, the remaining silicide layer becomes the ohmic electrode 70. Figure 30 is a cross-sectional view of the active region after the processes up to this stage have been completed.

[0159] Next, the protective insulating film 52 in the Schottky trench ST is removed with hydrofluoric acid or the like, and then the Schottky electrode 71 is formed in the Schottky trench ST. The material of the Schottky electrode 71 is, for example, Ti or Mo.

[0160] Next, a source electrode 80 mainly made of Al is formed in contact with the Schottky electrode 71 and the ohmic electrode 70. FIG. 31 is a cross-sectional view of the active region after the process up to this stage. The gate pad 81 and gate wiring 82 are formed in the same manner as the source electrode 80. The gate pad 81 and gate wiring 82 may be formed simultaneously with the source electrode 80.

[0161] Next, a metal film containing Ni as a main component is formed on the back surface of semiconductor substrate 10 and heat-treated to form drain electrode 84, which is a back surface ohmic electrode, on the back surface of semiconductor substrate 10. In this manner, silicon carbide semiconductor device 100 in accordance with the third embodiment shown in FIG.

[0162] (3) Operation explanation The operation and effects of trench type silicon carbide semiconductor device 100 according to the third embodiment are similar to those of planar type silicon carbide semiconductor device 100 according to the first and second embodiments, and therefore detailed description thereof will be omitted.

[0163] <Fourth Embodiment> 32 is a block diagram schematically showing the configuration of a power module apparatus 101 according to the present embodiment 4. Power module apparatus 101 includes a plurality of silicon carbide semiconductor devices 100, each of which is the silicon carbide semiconductor device 100 according to any of the embodiments 1 to 4.

[0164] This configuration can improve the surge resistance of the power module device 101 when a surge current flows. Also, since a longer time can be secured between the detection of the surge current and the cutoff in the power module device 101, it is possible to improve the design flexibility of a surge protection circuit (not shown) that operates when a surge current flows.

[0165] Note that a plurality of silicon carbide semiconductor devices that serve as switching elements and free wheel diodes may be connected in parallel to increase the current processed by the power module device 101. The plurality of silicon carbide semiconductor devices may include silicon carbide semiconductor devices 100 that have a surge current-carrying region 301 and silicon carbide semiconductor devices that do not have a surge current-carrying region 301. However, the plurality of silicon carbide semiconductor devices may include only silicon carbide semiconductor devices 100, so that when a surge current flows, the pn diode of a specific silicon carbide semiconductor device turns on and the current does not concentrate in that silicon carbide semiconductor device.

[0166] <Fifth Embodiment> 33 is a block diagram showing a power conversion device 501 according to the fifth embodiment. Power conversion device 501 includes a control circuit 501a, a drive circuit 501b, and a main conversion circuit 501c equipped with silicon carbide semiconductor device 100 according to any one of the first to fourth embodiments. Note that main conversion circuit 501c may be equipped with power module device 101 according to the fourth embodiment instead of silicon carbide semiconductor device 100 according to any one of the first to fourth embodiments.

[0167] Drive circuit 501b drives silicon carbide semiconductor device 100 of main conversion circuit 501c based on a control signal from control circuit 501a. For example, drive circuit 501b turns on the gate of the MOSFET of silicon carbide semiconductor device 100, except for a short dead time, when a freewheeling current flows through a parasitic pn diode that is a freewheeling diode of silicon carbide semiconductor device 100. This configuration enables a unipolar current to flow through the channel, and heat concentration in surge current-carrying region 301 can be avoided.

[0168] Main conversion circuit 501c including silicon carbide semiconductor device 100 converts power from power supply 502 into power usable by load 503 by driving silicon carbide semiconductor device 100 based on the control signal.

[0169] The above configuration can improve the surge resistance of the power conversion device 501 when a surge current flows. Also, since a longer time can be secured between the detection of a surge current and the cutoff of the current in the power conversion device 501, it is possible to improve the design flexibility of a surge protection circuit (not shown) that operates when a surge current flows.

[0170] Furthermore, in this fifth embodiment, the silicon carbide semiconductor device 100 according to the first to fourth embodiments is applied as the switching element of the main conversion circuit 501c, thereby realizing a power conversion device 501 with low loss and improved reliability in high-speed switching.

[0171] <Sixth Embodiment> Fig. 34 is a diagram showing a moving body 601 according to the sixth embodiment. In the example of Fig. 34, the moving body 601 is a train, but is not limited to this. The moving body 601 is provided with a power conversion device 501 according to the fifth embodiment, and the power conversion device 501 generates power required by the moving body 601. With this configuration, the power conversion device used in the moving body 601 can achieve the same effects as the power conversion device 501 according to the fifth embodiment.

[0172] <Supplementary explanation for embodiments 1 to 6> The p-type impurity described above may be boron (B) or gallium (Ga) instead of aluminum (Al). The n-type impurity described above may be phosphorus (P) instead of nitrogen (N). The gate insulating film 50 described above does not necessarily need to be an oxide film such as SiO2, but may be an insulating film other than an oxide film, or a combination of an insulating film other than an oxide film and an oxide film. Furthermore, the gate insulating film 50 may not be silicon oxide obtained by thermally oxidizing silicon carbide, but may be a deposited film made of silicon oxide formed by a CVD method or the like. Furthermore, the above description has been given using specific examples of the crystal structure, the plane orientation of the main surface, the off-angle, and each implantation condition, but these numerical ranges are not limited to these. Furthermore, the silicon carbide semiconductor device 100 may have a configuration in which an SBD is built into a MOSFET having a superjunction structure.

[0173] It should be noted that the embodiments and modifications may be freely combined, and the embodiments and modifications may be modified or omitted as appropriate.

[0174] The above description is illustrative in all respects and is not restrictive. It is understood that countless variations not illustrated can be envisioned. [Explanation of symbols]

[0175] 15 active region, 16 body diode chain operating region, 20 drift layer, 100 silicon carbide semiconductor device, 101 power module device, 301 surge current carrying region, 302 Schottky barrier diode replacement region, 501 power conversion device, 551 mobile body.

Claims

1. a semiconductor layer of a first conductivity type provided with an active region, the active region including a plurality of unit cell regions that are periodically arranged in a plan view and that include a Schottky barrier diode region and a MOSFET region, and a surge current-carrying region; the surge current-carrying region is locally provided between the unit cell regions, and the plurality of unit cell regions are divided into several unit cell regions having periodicity corresponding to the locality; the surge current-carrying region includes a Schottky barrier diode replacement region in which the first conductivity type of the Schottky barrier diode region is replaced with a second conductivity type, an area ratio of the Schottky barrier diode replacement region to the active region that is equal to or greater than 0.01% and less than an area ratio of the Schottky barrier diode region to the active region that would be occupied by the Schottky barrier diode replacement region if not replaced with the Schottky barrier diode replacement region;

2. 2. The silicon carbide semiconductor device according to claim 1, The silicon carbide semiconductor device, wherein the surge current carrying region has a function of a MOSFET.

3. 2. The silicon carbide semiconductor device according to claim 1, an area ratio of the Schottky barrier diode replacement region to the active region is not less than 0.01% and not more than 5%.

4. a semiconductor layer of a first conductivity type provided with an active region, the active region including a plurality of unit cell regions that are periodically arranged in a plan view and that include a Schottky barrier diode region and a MOSFET region, and a surge current-carrying region; the active region further includes a well region of a second conductivity type that constitutes the MOSFET region and has a channel in a part of its surface; In a plan view, the width of the surge current-carrying region in the short side direction is larger than the width of the well region in the short side direction; the surge current-carrying region includes a Schottky barrier diode replacement region in which the first conductivity type of the Schottky barrier diode region is replaced with a second conductivity type, an area ratio of the Schottky barrier diode replacement region to the active region that is equal to or greater than 0.01% and less than an area ratio of the Schottky barrier diode region to the active region that would be occupied by the Schottky barrier diode replacement region if not replaced with the Schottky barrier diode replacement region;

5. 5. The silicon carbide semiconductor device according to claim 4, a width in a short side direction of the surge current carrying region that is at least twice the width in the short side direction of the well region in a plan view;

6. 5. The silicon carbide semiconductor device according to claim 4, a width in a short side direction of the surge current carrying region being larger than a width in the short side direction of the unit cell region in a plan view;

7. A power module device comprising a plurality of silicon carbide semiconductor devices, each of which is the silicon carbide semiconductor device according to claim 1 or 4.

8. A power conversion device that converts electric power using a power module device comprising the silicon carbide semiconductor device according to claim 1 or 4.

9. A mobile object provided with the power conversion device according to claim 8.

Images