Substrate processing apparatus, control method for substrate processing apparatus, article manufacturing method, and program

Abstract

To provide a technique advantageous for reducing the occurrence of a conveyance error.SOLUTION: A substrate processing apparatus comprises: a processing unit that processes a substrate; a measurement unit that measures positional deviation of the substrate; a driving unit that drives the substrate to correct the positional deviation; a conveying unit that conveys the substrate; and a control unit that controls the conveying unit. When a force of the conveying unit to hold the substrate is larger than a prescribed value, the control unit controls the conveying unit to convey the substrate to the processing unit, and when the holding force is smaller than the prescribed value, causes the conveying unit to move the substrate from the measurement unit and subsequently convey the substrate to the measurement unit to measure positional deviation of the substrate, and controls the conveying unit on the basis of the positional deviation.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus, a method for controlling the substrate processing apparatus, a method for manufacturing an article, and a program. [Background technology]

[0002] In an apparatus for manufacturing products such as semiconductor devices or liquid crystal display devices, a substrate may be transported by a transport mechanism. If the holding force of the transport mechanism when holding and transporting the substrate with a holder is insufficient, the transport of the substrate may be stopped and an operator may be prompted to retrieve the substrate. Examples of causes of insufficient holding force for the substrate include contamination on the back surface of the substrate, warping of the substrate, deterioration of the transport mechanism, and abnormalities in the vacuum suction pressure.

[0003] Patent Document 1 describes detecting the holding force of a holding section that holds an object to be transported, and selecting transport characteristics that correspond to that holding force. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2001-219390 Summary of the Invention [Problem to be solved by the invention]

[0005] While the transfer mechanism is holding and transferring the substrate using the holder, the substrate may move relative to the holder. In such cases, the substrate cannot be transferred accurately to the target position, which can lead to transfer errors such as the substrate colliding with other components.

[0006] An object of the present invention is to provide an advantageous technique for reducing the occurrence of transport errors. [Means for solving the problem]

[0007] A first aspect of the present invention relates to a substrate processing apparatus, the substrate processing apparatus comprising: a processing section for processing a substrate; a measurement section for measuring a positional deviation of the substrate; a drive section for driving the substrate to correct the positional deviation; a transport section for transporting the substrate; and a control section for controlling the transport section, wherein the control section controls the transport section to transport the substrate to the processing section when a holding force of the substrate by the transport section is greater than a specified value; and when the holding force is less than the specified value, the control section controls the transport section to move the substrate to a specified position on a route from the measurement section to a specified destination, and then transports the substrate to the measurement section to measure a positional deviation of the substrate, and controls the transport section based on the positional deviation. A second aspect of the present invention relates to a substrate processing apparatus comprising: a processing section for processing a substrate; a measurement section for measuring a positional deviation of the substrate; a drive section for driving the substrate to correct the positional deviation; a transport section for transporting the substrate; and a control section for controlling the transport section, wherein the control section controls the transport section to transport the substrate to the processing section when a holding force of the substrate by the transport section is greater than a specified value; and when the holding force is less than the specified value, the control section transports the substrate through a route to a specified destination, and then transports it to the measurement section to measure a positional deviation of the substrate, and controls the transport section based on the positional deviation. [Effects of the Invention]

[0008] According to the present invention, an advantageous technique is provided for reducing the occurrence of transport errors. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a plan view schematically showing a configuration of a substrate processing apparatus according to an embodiment; [Figure 2] FIG. 2 is a diagram schematically illustrating an example of the configuration of an exposure unit. [Figure 3] FIG. 2 is a diagram schematically illustrating the configuration of a transport mechanism. [Figure 4A] FIG. 3 is a schematic plan view of an alignment unit. [Figure 4B] FIG. 4 is a schematic side view of an alignment unit. [Figure 4C] FIG. 3 is a schematic plan view of an alignment unit. [Figure 5] FIG. 10 is a perspective view illustrating an open cassette. [Figure 6] 3A to 3C are diagrams exemplarily showing the operation (control method) of the substrate processing apparatus according to the first embodiment. [Figure 7] 10A and 10B are diagrams exemplarily showing the operation (control method) of the substrate processing apparatus according to the second embodiment. [Figure 8] 10A and 10B are diagrams exemplarily showing the operation (control method) of the substrate processing apparatus according to the third embodiment. [Figure 9] 10A and 10B are diagrams exemplarily showing the operation (control method) of the substrate processing apparatus according to the fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0011] In this specification and the accompanying drawings, directions are basically indicated by an XYZ position system in which the vertical direction is the Z axis, the horizontal plane perpendicular to the vertical direction is the XY plane, and the axes are orthogonal to each other.

[0012] FIG. 1 is a plan view schematically illustrating the configuration of a substrate processing apparatus 1 according to an embodiment. The substrate processing apparatus 1 may be configured as an exposure apparatus that forms a pattern (latent image) on a substrate by projecting a pattern from an original onto the substrate using a projection optical system. The exposure apparatus is an example of a pattern formation apparatus or lithography apparatus that forms or transfers a pattern onto a substrate. The substrate processing apparatus 1 may also be configured as other types of pattern formation apparatus or lithography apparatus. Examples of other types of pattern formation apparatus or lithography apparatus include a lithography apparatus that uses a charged particle beam and an imprinting apparatus. The lithography apparatus may lithograph a pattern on a substrate using a charged particle beam such as an electron beam or an ion beam. The imprinting apparatus may form a pattern on a substrate by molding an imprint material on the substrate using a mold. Alternatively, the substrate processing apparatus 1 may be an ion implantation apparatus, a development apparatus, an etching apparatus, a film formation apparatus, an annealing apparatus, a sputtering apparatus, a vapor deposition apparatus, or a planarization apparatus. Alternatively, the substrate processing apparatus 1 may be a transport apparatus that transports substrates to multiple destinations.

[0013] The substrate processing apparatus 1 may include a chamber 2, and a pattern forming unit 4 and a transfer system 3 housed in the chamber 2. The pattern forming unit 4 may include, for example, an exposure unit 20. The transfer system 3 is configured to transport substrates to multiple destinations. The transfer system 3 may include a supply mechanism 5 that supplies substrates, an alignment unit 6, a carrier port 7 on which an open cassette capable of housing multiple substrates is placed, a transfer mechanism 8 that transports the substrates, a substrate load unit 9 that loads the substrates, and a substrate unload unit 10 that unloads the substrates.

[0014] The alignment unit 6 may be configured to measure the alignment error of a substrate on which a pattern is to be formed in the pattern formation unit 4 and align the substrate based on the measurement. The alignment unit 6 may be configured, for example, as a pre-aligner. The carrier port 7 may be configured to hold a closed carrier instead of an open cassette. The transport mechanism 8 and the supply mechanism 5 may include a holder such as a hand that holds the substrate and a drive mechanism that transports the substrate by moving the holder. The transport mechanism 8 may be, for example, a horizontal articulated robot (scalar robot). The substrate loader 9 and the substrate unloader 10 may each have support units 91 and 101 that support the substrate from below.

[0015] The substrate processing apparatus 1 may further include a control unit 11. The control unit 11 may be configured to control the transfer system 3 and the pattern forming unit 4. The control unit 11 may include a first control unit that controls the transfer system 3 and a second control unit that controls the pattern forming unit 4. The control unit 11 may be configured, for example, by a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), an ASIC (abbreviation for Application Specific Integrated Circuit), a general-purpose or dedicated computer with an embedded program, or a combination of all or part of these.

[0016] 2 schematically shows an example configuration of the exposure unit 20. The exposure unit 20 may include a reticle (master) 21, a reticle stage (master stage) 24 that holds the reticle 21, an illumination device 23, a projection optical system 25, and a substrate stage 26 that holds the substrate 22. The exposure unit 20 may be configured to transfer the pattern of the reticle 21 onto the substrate 22 by a step-and-repeat method or a step-and-scan method.

[0017] The illumination device 23 includes a light source and an illumination optical system (not shown) and illuminates the reticle 21. The light source can be, for example, a pulsed light source (laser). Usable lasers include an ArF excimer laser with a wavelength of approximately 193 nm and an F2 excimer laser with a wavelength of approximately 153 nm. However, the type of laser is not limited to an excimer laser; for example, a YAG laser may be used. The number of lasers is also not limited. Furthermore, when a laser is used as the light source, a beam shaping optical system that shapes a parallel beam from the laser light source into a desired beam shape and an incoherent optical system that converts a coherent laser into an incoherent beam may be provided. Furthermore, the light source that can be used is not limited to a pulsed light source; one or more continuous light sources such as mercury lamps or xenon lamps can also be used. The illumination optical system includes lenses, mirrors, a light integrator, an aperture, and the like.

[0018] The reticle 21 is an original made of, for example, quartz glass, and has a pattern (e.g., a circuit pattern) to be transferred to the substrate. The reticle stage 24 is movable horizontally while holding the reticle 21. The projection optical system 25 projects and exposes the pattern of the reticle 21 illuminated with exposure light from the illumination device 23 onto the substrate 22 at a predetermined magnification (e.g., 1 / 4 or 1 / 5). The projection optical system 25 can be an optical system consisting of only multiple refractive lens elements, or an optical system (catadioptric optical system) consisting of multiple refractive lens elements and at least one concave mirror. Alternatively, the projection optical system 25 can be an optical system including multiple refractive lens elements and at least one diffractive optical element such as a kinoform, or an all-mirror optical system.

[0019] The substrate 22 is a substrate having a surface coated with photoresist. The substrate stage 26 can be configured to be movable at least in the horizontal direction while holding the substrate 22. For example, when a step-and-scan method is employed, the reticle stage 24 and the substrate stage 26 move in the horizontal direction in synchronization with each other.

[0020] Next, the transportation of the substrate 22 will be described. First, the substrate 22 coated with resist is loaded into the transport system 3. The loaded substrate 22 may be placed on a support portion 91 protruding from the top surface of the platform of the substrate loading unit 9. The transport mechanism 8 may transport the substrate 22 from the substrate loading unit 9 to the alignment unit 6. The alignment unit 6 adjusts the horizontal and rotational positions of the substrate 22. The supply mechanism 5 may transport the substrate 22 aligned by the alignment unit 6 to the substrate stage 26 of the exposure unit 20. The substrate stage 26 is movable along a horizontal plane and may position the transported substrate 22 at a predetermined processing position. A linear motor, an electromagnetic actuator, a pulse motor, or the like (not shown) may be used as a drive mechanism for the substrate stage 26. While the example in which the transport mechanism 8 and the supply mechanism 5 transport the substrate 22 has been described, other transport mechanisms may also be provided. Furthermore, the destination of the substrate 22 may include other destinations.

[0021] FIG. 3(a) is a plan view schematically illustrating an exemplary configuration of the transfer mechanism 8. FIG. 3(b) is a side view of the transfer mechanism 8, seen from the direction α illustrated in FIG. 3(a), for retrieving the substrate 22 placed in the substrate loading unit 9. The transfer mechanism 8 includes a hand (holding unit) 85 for holding the substrate 22, and may be configured to transport the substrate 22 by driving the hand 85. The shape of the hand 85 may be any shape that can retrieve the substrate 22 and is not limited to the shape illustrated in FIG. 3(a). A suction port 86 for vacuum-suctioning the substrate 22 may be provided on the upper surface of the hand 85. The suction port 86 may be connected to a reduced-pressure source 88, such as a vacuum pump, via an electromagnetic valve (not illustrated). The arrangement of the suction port 86 is not limited to the arrangement illustrated in FIG. 3(a), as long as it is capable of holding the substrate 22. For example, the suction port may be arranged over the entire upper surface of the hand 85, or multiple suction ports may be arranged.

[0022] A sensor 89 for detecting pressure may be provided in the exhaust flow path connecting the reduced pressure source 88 and the suction port 86. The exhaust flow path connecting the reduced pressure source 88 and the suction port 86 communicates with the space between the substrate 22 and the hand 85. Therefore, by detecting the pressure in the exhaust flow path, it is possible to detect the pressure in the space between the substrate 22 and the hand 85, in other words, the suction force or holding force acting on the substrate 22. The sensor 89 only needs to be able to detect the pressure in the space between the substrate 22 and the hand 85. Therefore, the sensor 89 may be positioned so as to directly detect the pressure in the space between the substrate 22 and the hand 85.

[0023] The transport mechanism 8 may include multiple drive mechanisms for driving the hand 85 about multiple axes, for example, four axes (X-axis, Y-axis, Z-axis, and θZ-axis). Here, the θZ-axis is rotation around the Z-axis. The transport mechanism 8 may include, for example, a drive mechanism 81 for horizontal drive, a drive mechanism 82 for vertical drive, and drive mechanisms 83 and 84 for rotational drive (θZ-axis). The drive mechanism 82 for vertical drive, the drive mechanisms 83 and 84 for rotational drive, and the hand 85 may each be connected by a drive shaft 87. Note that the configuration, number, combination, etc. of the drive mechanisms are not limited to this example.

[0024] The substrate 22 may be placed on a support 91 protruding from the upper surface of the platform of the substrate loading unit 9. Under the control of the control unit 11, the hand 85 may be inserted into the space below the substrate 22 and then driven upward. Air in the space below the substrate 22 may be sucked through the suction port 86, thereby holding the substrate 22 in the hand 85 by vacuum suction. The support 91 is then driven downward, transferring the substrate 22 from the support 91 to the hand 85. The hand 85 holds the substrate 22 by vacuum suction, preventing displacement of the substrate 22 during transport. When the substrate 22 comes into contact with the upper surface of the hand 85, the suction port 86 is blocked by the substrate 22. This changes the pressure in the exhaust flow path from atmospheric pressure to a negative pressure. The control unit 11 can detect the change in pressure in the exhaust flow path using the sensor 89, thereby detecting that the substrate 22 has been held by the hand 85 by vacuum suction. The pressure detected by the sensor 89 may be referred to as suction pressure. The suction pressure correlates with the holding force with which the hand 85 holds the substrate 22, so the holding force can be detected by detecting the suction pressure.

[0025] 4A and 4B are a schematic plan view and a side view, respectively, of the alignment unit 6. The alignment unit 6 may include, for example, a support unit 62 that supports the substrate 22, a drive unit 63 that drives the support unit 62, multiple sensors 64 to 66, and an alignment stage 67. The drive unit 63 may include, for example, a mechanism that rotates the support unit 62 around an axis parallel to the Z axis and a mechanism that horizontally moves the support unit 62 in at least one direction (typically the X direction and the Y direction) within the XY plane. The drive unit 63 may also have a mechanism that moves the support unit 62 in a direction parallel to the Z axis, i.e., an elevation mechanism. The support unit 62 and the drive unit 63 may constitute a movable stage mechanism in the alignment unit 6. The multiple sensors 64 to 66 may be supported by a support structure (e.g., a plate-like member) (not shown) so that the edge position of the substrate 22 can be detected from above the substrate 22.

[0026] The alignment unit 6 may include a plurality of light irradiation units 61. The plurality of light irradiation units 61 may be supported by an alignment stage 67, for example, so as to irradiate light toward the substrate 22. The plurality of light irradiation units 61 may be arranged so as to face a plurality of sensors 64 to 66, with the edge of the substrate 22 sandwiched between them. The plurality of sensors 64 to 66 may detect the edge position of the substrate 22 based on the boundary position between an area where the light from the light irradiation units 61 is blocked by the substrate 22 and an area where the light is not blocked, and may provide the detection result to the control unit 11 via wired or wireless communication.

[0027] Among the multiple sensors 64-66, sensor 64 can detect the position of a notch or orientation flat provided on substrate 22, i.e., the rotation angle (θ) around an axis (θZ axis) parallel to the Z axis of substrate 22, while drive unit 63 rotates substrate 22 once. Hereinafter, the term "rotation angle" refers to the rotation angle about the θZ axis. Drive unit 63 can detect the position of the notch or orientation flat with sensor 64 so that the notch or orientation flat is located below sensor 64, and can rotate substrate 22 based on the detection result so that the rotation angle of substrate 22 matches the appropriate rotation angle. The appropriate rotation angle can be a rotation angle preset by the user.

[0028] A notch is a mark formed by cutting a portion of the substrate 22 in a V-shape, as illustrated in FIG. 4A. Detecting the position of the notch allows the rotation angle of the substrate 22 to be detected. On the other hand, an orientation flat is an abbreviation for orientation flat, and is a mark formed by cutting a portion of the substrate 22 in a straight line. Detecting the position of the orientation flat allows the rotation angle of the substrate 22 to be detected. If a notch is provided on a small-diameter substrate 22, the size of the notch serving as a mark will be relatively small in accordance with the size of the substrate 22, making it impossible to accurately detect the rotation angle. Therefore, providing an orientation flat is preferable for a small-diameter substrate 22. On the other hand, providing an orientation flat on a large-diameter substrate 22 will increase the area of ​​the substrate 22 that must be cut for the mark. Therefore, providing a notch is preferable for a large-diameter substrate 22.

[0029] The sensors 65 and 66 are, for example, line sensors in which multiple photoelectric conversion elements are arranged in a line, and can detect the position of the substrate 22 on the XY plane based on their outputs. The sensors 65 and 66 are arranged so that the directions in which the multiple photoelectric conversion elements are arranged (directions having resolution) are perpendicular to each other, and each detects the distance from the edge of the substrate 22 to the center of the sensor (sensor center). When light is irradiated from the light irradiation unit 61 toward the substrate 22, the light is blocked by the substrate 22. The sensors 65 and 66 detect the distance from the edge of the substrate 22 to the sensor center. The arrows shown in FIG. 4A indicate the distance from the edge of the substrate 22 to the sensor center, and the distance from the edge to the sensor center detected by the sensor 65 is the same as the distance from the edge to the sensor center detected by the sensor 66. On the other hand, in the example of FIG. 4C, the substrate 22 is shifted in the positive direction of the X axis, and the distance from the edge to the sensor center detected by the sensor 65 is greater than the distance from the edge to the sensor center detected by the sensor 66.

[0030] The position (X) of substrate 22 in the X-axis direction can be detected based on the distance from the edge detected by sensor 65 to the sensor center and the distance from the edge detected by sensor 66 to the sensor center. As in the example of FIG. 4A, when the distance detected by sensor 65 is the same as the distance detected by sensor 66, substrate 22 is in the correct position in the X-axis direction. On the other hand, when the distance detected by sensor 65 is different from the distance detected by sensor 66 as in FIG. 4C, substrate 22 is not in the correct position in the X-axis direction.

[0031] If the substrate 22 has an orientation flat, the position (Y) of the substrate 22 in the Y-axis direction can be detected based on the distance from the edge detected by the sensor 65 to the sensor center and the distance from the edge detected by the sensor 66 to the sensor center. If the distance from the edge detected by the sensor 65 to the sensor center and the distance from the edge detected by the sensor 66 to the sensor center are each a predetermined distance preset by the user, the substrate 22 is in the correct position in the Y-axis direction. If the substrate 22 has a notch, the position (Y) of the substrate 22 in the Y-axis direction can be detected by measuring the width of the V-shaped cut of the notch with the sensor 64. If the width of the notch at a predetermined position is a predetermined length preset by the user, the substrate 22 is in the correct position in the Y-axis direction. In this way, the position of the substrate 22 on the XY plane (horizontal direction) can be detected using multiple sensors 64 to 66.

[0032] The control unit 11 controls a plurality of sensors 64 to 66 in Based on the detection result, i.e., the position information (X, Y, θ) of the substrate 22, the drive unit 63 is driven to move the substrate 22 to the appropriate position. By having the substrate 22 in the appropriate position, the time required for alignment in the exposure unit 20 can be reduced. The multiple sensors 64 to 66 may be configured as line sensors or area sensors. As long as the position information (X, Y, θ) of the substrate 22 can be obtained, the type and number of sensors are not limited to a specific one.

[0033] The control unit 11 can acquire the amount of deviation (amount of deviation from the correct position) of the position (X, Y, θ) of the substrate 22 supported by the support unit 62, i.e., the alignment error, based on the results detected using the multiple sensors 64 to 66. Then, the control unit 11 performs an operation to align the position of the substrate 22 with the correct position, i.e., alignment, by causing the drive unit 63 to drive the support unit 62 so as to correct the amount of deviation in the position of the substrate 22. Here, the alignment error (amount of deviation from the correct position) detected using the multiple sensors 64 to 66 is synonymous with the amount of correction by which the position of the substrate 22 should be corrected.

[0034] FIG. 5 is a perspective view illustrating an open cassette 71 placed on the carrier port 7. The open cassette 71 may include a pair of side walls 710 extending vertically, a bottom wall 711 connected to the lower ends of the pair of side walls 710, and a ceiling wall 712 facing the bottom wall 711 and connected to the upper ends of the pair of side walls. A plurality of slots 710a for accommodating substrates 22 are arranged at predetermined intervals in the side walls 710. A front opening 713 that allows the substrates 22 to be inserted and removed is provided on the front side of the open cassette 71, and a rear opening 714 that faces the front opening 713 is provided on the rear side. The rear opening 714 has a narrower left-right width than the front opening 713 so as not to allow the substrates 22 to be inserted and removed. In other words, the left-right width of the rear opening 714 is smaller than the outer diameter of the substrates 22.

[0035] An exemplary operation (control method) of the substrate processing apparatus 1 of the first embodiment will be described below with reference to FIG. 6. The operation shown in FIG. 6 is controlled by the control unit 11. In step S602, the substrate 22 is loaded into the substrate loader 9. Next, in step S603, the holding force of the substrate 22 by the transfer system 3 is detected. The holding force of the substrate 22 by the transfer system 3 can be detected, for example, by using a sensor 89 to detect pressure while the substrate 22 is being held by the hand 85 of the transfer mechanism 8. Alternatively, the holding force of the substrate 22 by the transfer system 3 may be detected by using a sensor (not shown) to detect the pressure of a suction line (not shown) provided in the support unit 91 immediately after the substrate 22 is loaded into the substrate loader 9.

[0036] Next, in step S604, the substrate 22 is transported to the alignment unit 6 by the transport mechanism 8. Next, in step S605, the alignment unit 6 measures the alignment error of the substrate 22 and aligns the substrate 22 based on the measurement. Next, in step S606, the control unit 11 determines whether the holding force of the substrate 22 detected in step S603 is greater than a specified value. If the control unit 11 determines that the holding force of the substrate 22 is greater than the specified value, the process proceeds to step S607. If the control unit 11 determines that the holding force of the substrate 22 is less than the specified value, the process proceeds to step S611. The holding force of the substrate 22 being greater than the specified value means that the substrate 22 can be transported to the pattern forming unit 4 by the supply mechanism 5, and the holding force of the substrate 22 being less than the specified value means that a problem may occur when the substrate 22 is transported to the pattern forming unit 4 by the supply mechanism 5. For example, if the back surface of the substrate 22 is dirty or if the substrate 22 has a warp that exceeds the allowable limit, the specified value can be preset to ensure that the holding force of the substrate 22 detected in step S603 is smaller than the specified value.

[0037] In step S607, the substrate 22 is transported to the pattern forming unit 4 by the supply mechanism 5, in step S608 the substrate 22 is exposed in the pattern forming unit 4, and in step S609 the substrate 22 is transported to the substrate unloading unit 10 by the transport mechanism 8.

[0038] In step S611, the substrate 22 is transported from the alignment unit 6 to a predetermined target position by the transport mechanism 8, and in step S612, the substrate 22 is transported from the predetermined target position to the alignment unit 6 by the transport mechanism. The predetermined target position can be, for example, a position immediately before the carrier port 7, which is the target position to which the substrate 22 is to be transported thereafter. Next, in step S613, the alignment unit 6 measures the alignment error of the substrate 22 and aligns the substrate 22 based on the measurement.

[0039] Steps S611, S612, and S613 are an example of an evaluation process in which the alignment error of the substrate is remeasured by the alignment unit 6 after the substrate, which has been aligned by the alignment unit 6, is transported by the transport system 3 through a predetermined path. The alignment error detected in the evaluation process is a positional deviation of the substrate 22 that may occur when the substrate 22 is transported by the transport system 3 (transport mechanism 8) through a predetermined path. In other words, the alignment error obtained in the evaluation process can be regarded as the amount of positional deviation that may occur when the substrate 22 is transported by the transport system 3 (transport mechanism 8) to the open cassette 71 placed in the carrier port 7 in step S615, which is performed subsequently.

[0040] In step S614, the control unit 11 determines whether the alignment error detected in step S613 (the alignment error detected in the evaluation process) is smaller than the determination criterion. If the alignment error detected in step S613 is smaller than the determination criterion, this means that no problems will occur when the substrate 22 is transported by the transport mechanism 8 to the open cassette 71 arranged in the carrier port 7 in step S615, which will be performed later. The determination criterion can be determined according to such a purpose. In one example, the determination criterion can be determined so as to ensure that the edge of the substrate 22 does not collide with the sidewall 710 when the substrate 22 is stored in the slot 710a of the open cassette 71.

[0041] If the control unit 11 determines that the alignment error detected in step S613 is smaller than the judgment standard, the control unit 11 proceeds to step S615. If the control unit 11 determines that the alignment error detected in step S613 is larger than the judgment standard, the control unit 11 proceeds to step S616. In step S615, the substrate 22 is transported by the transport mechanism 8 from the alignment unit 6 to the open cassette 71 arranged in the carrier port 7, and is stored in the open cassette 71. Execution of step S616 means that when the substrate 22 is transported from the alignment unit 6 to the open cassette 71 by the transport mechanism 8, a malfunction such as the substrate 22 colliding with the side wall 710 of the open cassette 71 may occur. Therefore, in step S616, the occurrence of an error is notified. The notification of the occurrence of an error can be performed, for example, by urging the operator to collect the substrate 22.

[0042] In the above example, the destination of the substrate 22 in step S615 is the open cassette 71, but the destination can be set arbitrarily. The destination may be selected from a plurality of candidate destinations. Destinations other than the open cassette 71 include, for example, the pattern forming unit 4 (exposure unit 20) and the substrate unloading unit 10.

[0043] According to the first embodiment, even if a sufficient holding force for transporting the substrate cannot be obtained, the positional deviation of the substrate that may occur during transport is evaluated, and if the substrate can be safely transported, the substrate can be transported to an alternative destination such as an open cassette. This reduces the frequency of errors that would stop the substrate processing apparatus 1, and improves the operating rate of the substrate processing apparatus 1.

[0044] In the above embodiment, the evaluation process of steps S611 to S613 is performed when it is determined that the substrate holding force is smaller than a specified value, but the evaluation process may also be performed at any time. For example, if the alignment error obtained by the evaluation process is smaller than a first criterion for transporting the substrate to the exposure unit, the substrate may be transported to the exposure unit. Also, if the alignment error obtained by the evaluation process is larger than the first criterion for transporting to the exposure unit but smaller than a second criterion for transporting to another destination, the substrate may be transported to another destination.

[0045] Step S615 can be understood as an example of a step in which the control unit 11 determines whether or not the substrate can be transported to a predetermined destination based on the alignment error obtained by the evaluation process. Alternatively, step S615 can be understood as an example of a step in which the control unit 11 determines whether or not the substrate can be transported to a predetermined destination based on the magnitude of the alignment error obtained by the evaluation process.

[0046] In step S615, the control unit 11 may determine to which of multiple destinations the substrate should be transported, based on the alignment error obtained by the evaluation process. Such multiple destinations may include an exposure unit, in other words, a pattern forming unit that forms a pattern on the substrate. The multiple destinations may include an open cassette, a substrate loading unit, and a substrate unloading unit. If the control unit 11 determines that the substrate cannot be transported to any of the multiple destinations, it may notify the occurrence of an error.

[0047] The operation (control method) of the substrate processing apparatus 1 of the second embodiment will be described below with reference to FIG. 7. Matters not mentioned in the second embodiment may follow the first embodiment. In the second embodiment, if it is determined that the holding force for holding the substrate is smaller than a specified value, the substrate transport speed by the transport system may be reduced below a reference speed. Alternatively, in the second embodiment, if the alignment error obtained by the evaluation process is larger than a threshold value, the substrate transport speed by the transport system may be reduced below a reference speed.

[0048] 7 is controlled by the control unit 11. In step S802, the substrate 22 is loaded into the substrate loading unit 9. Next, in step S803, the holding force of the substrate 22 by the transfer system 3 is detected. Next, in step S804, the control unit 11 determines whether the holding force of the substrate 22 detected in step S803 is smaller than a specified value. If the control unit 11 determines that the holding force of the substrate 22 is smaller than the specified value, the process proceeds to step S805. If the control unit 11 determines that the holding force of the substrate 22 is greater than the specified value, the process proceeds to step S806. If the holding force of the substrate 22 is greater than the specified value, the substrate 22 can be transported to the pattern forming unit 4 by the supply mechanism 5. If the holding force of the substrate 22 is smaller than the specified value, the substrate 22 may not be transported to the pattern forming unit 4.

[0049] In step S805, the control unit 11 sets the transport speed of the substrate 22 by the transport mechanism 8 to a speed slower than the reference speed. This reduces the possibility of the substrate 22 being misaligned during transport. In step S806, the substrate 22 is transported by the transport mechanism 8 to the alignment unit 6. Next, in step S807, the alignment unit 6 measures the alignment error of the substrate 22 and aligns the substrate 22 based on the measurement.

[0050] Next, in step S808, the control unit 11 determines whether the transport speed of the substrate 22 by the transport mechanism 8 is set to be slower than the reference speed. If the transport speed of the substrate 22 by the transport mechanism 8 is set to be slower than the reference speed, the control unit 11 proceeds to step S813; otherwise, the control unit 11 proceeds to step S809. In step S809, the substrate 22 is transported to the pattern forming unit 4 by the supply mechanism 5, in step S810 the substrate 22 is exposed in the pattern forming unit 4, and in step S811 the substrate 22 is transported to the substrate unloading unit 10 by the transport mechanism 8.

[0051] In step S813, the substrate 22 is transported from the alignment unit 6 to a predetermined target position by the transport mechanism 8, and in step S814, the substrate 22 is transported from the predetermined target position to the alignment unit 6 by the transport mechanism. The predetermined target position can be, for example, a position immediately before the carrier port 7, which is the target position to which the substrate 22 is to be transported thereafter. Next, in step S815, the alignment unit 6 measures the alignment error of the substrate 22 and aligns the substrate 22 based on the measurement.

[0052] Steps S813, S814, and S815 are an example of an evaluation process in which the alignment unit 6 remeasures the alignment error of the substrate after the substrate, which has been aligned by the alignment unit 6, is transported by the transport system 3 through a predetermined path. In the evaluation process, it is possible to evaluate a positional deviation (alignment error) of the substrate 22 that may occur when the substrate 22 is transported by the transport system 3 (transport mechanism 8) through a predetermined path. In other words, the alignment error obtained in the evaluation process can be regarded as the amount of positional deviation that may occur when the substrate 22 is transported by the transport system 3 (transport mechanism 8) to the open cassette 71 placed in the carrier port 7 in step S817, which is performed later.

[0053] In step S816, the control unit 11 determines whether the alignment error detected in step S815 (the alignment error detected in the evaluation process) is smaller than the reference value for determination. If the alignment error detected in step S815 is smaller than the reference value for determination, this means that no problems will occur even if the substrate 22 is transported by the transport mechanism 8 to the open cassette 71 arranged in the carrier port 7 in step S817, which will be performed subsequently.

[0054] If the control unit 11 determines that the alignment error detected in step S816 is smaller than the reference value for judgment, the control unit 11 advances the process to step S817, and if the control unit 11 determines that the alignment error detected in step S816 is larger than the reference value for judgment, the control unit 11 advances the process to step S818. In step S817, the substrate 22 is transported by the transport mechanism 8 from the alignment unit 6 to the open cassette 71 arranged in the carrier port 7, and is stored in the open cassette 71.

[0055] In step S818, the control unit 11 determines whether the set substrate transport speed is the minimum speed, and if so, proceeds to step S820, otherwise proceeds to step S819.

[0056] Execution of step S820 means that when the substrate 22 is transported from the alignment unit 6 to the open cassette 71 by the transport mechanism 8, a malfunction such as the substrate 22 colliding with the side wall 710 of the open cassette 71 may occur. Therefore, in step S820, a notification of the occurrence of an error is made. The notification of the occurrence of an error may be made, for example, in a manner that prompts the operator to collect the substrate 22. In step S819, the control unit 11 further slows the transport speed set as the transport speed at which the substrate 22 is transported by the transport mechanism 8, and proceeds to the above-mentioned step S813.

[0057] In the second embodiment, the frequency of error occurrence can be reduced compared to the first embodiment.

[0058] Hereinafter, an exemplary operation (control method) of the substrate processing apparatus 1 according to the third embodiment will be described with reference to FIG. 8. Matters not mentioned in the third embodiment may follow those in the first embodiment. , regulation The control unit 11 offsets the substrate in the alignment unit 6 based on the alignment error obtained by the evaluation process, and then causes the transfer system 3 (transfer mechanism 8) to transfer the substrate.

[0059] In the third embodiment shown in Fig. 8, step S616 in the first embodiment shown in Fig. 6 is replaced by steps S617 and S618. In step S614, the control unit 11 determines whether the alignment error detected in step S613 (the alignment error detected in the evaluation process) is smaller than the reference value for determination. If the alignment error detected in step S613 is smaller than the reference value for determination, this means that no problems will occur even if the substrate 22 is transported by the transport mechanism 8 to the open cassette 71 arranged in the carrier port 7 in step S615, which is performed subsequently.

[0060] If the control unit 11 determines that the alignment error detected in step S613 is smaller than the reference value for judgment, the control unit 11 advances the process to step S615, and if the control unit 11 determines that the alignment error detected in step S613 is larger than the reference value for judgment, the control unit 11 advances the process to step S617. In step S615, the substrate 22 is transported by the transport mechanism 8 from the alignment unit 6 to an open cassette 71 arranged in the carrier port 7, and is stored in the open cassette 71.

[0061] In step S617, the alignment unit 6 aligns the substrate 22 based on the alignment error obtained in step S613. Next, in step S618, the control unit 11 controls the alignment unit 6 to offset the substrate 22 based on the alignment error obtained in step S613. For example, it can be assumed that the positional deviation that may occur when the substrate 22 is transported from the alignment unit 6 to the carrier port 7 by the transport mechanism 8 is equivalent to the alignment error obtained in step S613. In this case, if the alignment error obtained in step S613 is (ΔX, ΔY, Δθ), the offset can be (-ΔX, -ΔY, -Δθ). Then, in step S615, the substrate 22 is transported by the transport mechanism 8 from the alignment unit 6 to the open cassette 71 arranged in the carrier port 7 and stored in the open cassette 71.

[0062] Hereinafter, an exemplary operation (control method) of the substrate processing apparatus 1 of the fourth embodiment will be described with reference to FIG. 9. Matters not mentioned in the fourth embodiment may follow the first embodiment. In the fourth embodiment, when it is determined that the holding force of the substrate 22 detected in step S603 is smaller than a specified value, the substrate is transported to a destination selected from a plurality of candidate destinations. In the fourth embodiment shown in FIG. 9, step S603 is different from the first embodiment shown in FIG. 6 S621 has been added from 18.

[0063] In step S606, the control unit 11 determines whether the holding force of the substrate 22 detected in step S603 is greater than a specified value. If the control unit 11 determines that the holding force of the substrate 22 is greater than the specified value, the process proceeds to step S607. If the control unit 11 determines that the holding force of the substrate 22 is smaller than the specified value, the process proceeds to step S618.

[0064] In step S618, the substrate 22 is transported from the alignment unit 6 to the first target position by the transport mechanism 8, and in step S619, the substrate 22 is transported from the first target position to the alignment unit 6 by the transport mechanism 8. The first target position can be, for example, a position immediately before the exposure unit 20. Next, in step S620, the alignment unit 6 measures the alignment error of the substrate 22 and aligns the substrate 22 based on the measurement.

[0065] Steps S618, S619, and S620 are an example of a first evaluation process in which the substrate, which has been aligned by the alignment unit 6, is transported by the transport system 3 through a predetermined path that passes through a first target position, and then the alignment unit 6 remeasures the alignment error of the substrate. In the first evaluation process, it is possible to evaluate a positional deviation (alignment error) of the substrate 22 that may occur when the substrate 22 is transported by the transport system 3 (transport mechanism 8) through the first predetermined path. In other words, the alignment error obtained in the first evaluation process can be regarded as the amount of positional deviation that may occur when the substrate 22 is transported by the transport system 3 (transport mechanism 8) in the steps that will be performed thereafter.

[0066] In step S621, the control unit 11 determines whether the alignment error detected in step S620 (the alignment error detected in the evaluation process) is smaller than a first criterion for determination. If the alignment error detected in step S620 is smaller than the first criterion for determination, this means that transport to the exposure unit 20 is possible. From another perspective, the first criterion can be a criterion that can guarantee safe transport to the exposure unit 20.

[0067] If the control unit 11 determines that the alignment error detected in step S620 is smaller than the first standard for judgment, it proceeds to step S607, and if it determines that the alignment error detected in step S620 is larger than the standard for judgment, it proceeds to step S611.

[0068] In step S607, the substrate 22 is transported to the pattern forming unit 4 by the supply mechanism 5, in step S608 the substrate 22 is exposed in the pattern forming unit 4, and in step S609 the substrate 22 is transported to the substrate unloading unit 10 by the transport mechanism 8. Therefore, even if it is determined in step S606 that the holding force of the substrate 22 is smaller than the specified value, if it is determined that the alignment error detected in the evaluation process is smaller than the first standard, the substrate 22 is transported to the exposure unit 20 and exposed.

[0069] In step S611, the substrate 22 is transported from the alignment unit 6 to a second target position by the transport mechanism 8, and in step S612, the substrate 22 is transported from the second target position to the alignment unit 6 by the transport mechanism. The second target position can be, for example, a position immediately before the carrier port 7, which is the target position to which the substrate 22 is to be transported thereafter. Next, in step S613, the alignment unit 6 measures the alignment error of the substrate 22 and aligns the substrate 22 based on the measurement.

[0070] Steps S611, S612, and S613 are an example of a second evaluation process in which the substrate, which has been aligned by the alignment unit 6, is transported by the transport system 3 through a second path that passes through a second target position, and then the alignment unit 6 remeasures the alignment error of the substrate. In the second evaluation process, it is possible to evaluate a positional deviation of the substrate 22 that may occur when the substrate 22 is transported through the second path by the transport system 3 (transport mechanism 8). In other words, the alignment error obtained in the second evaluation process can be regarded as the amount of positional deviation that may occur when the substrate 22 is transported by the transport system 3 to the open cassette 71 arranged in the carrier port 7 in step S615, which is performed subsequently.

[0071] In step S614, the control unit 11 determines whether the alignment error detected in step S613 (the alignment error detected in the evaluation process) is smaller than a second criterion for determination. If the alignment error detected in step S613 is smaller than the second criterion for determination, this means that no problems will occur even if the substrate 22 is transported by the transport mechanism 8 to the open cassette 71 arranged in the carrier port 7 in step S615, which is performed subsequently. The second criterion for determination can be determined according to such a purpose.

[0072] The third embodiment can be understood as an example in which a substrate is transported to a destination selected from a plurality of destinations. The destinations may have priorities, and the tolerances of the alignment errors (first and second criteria) obtained by the evaluation process may be set smaller for destinations with higher priorities.

[0073] When the output of the sensor 89 indicates that the substrate holding force is smaller than a specified value, the control unit 11 can control the evaluation process using the first route assigned to the first transport destination with the first priority as the predetermined route. When the alignment error obtained by the evaluation process using the first route satisfies a first criterion, the control unit 11 can control the transport system 3 to transport the substrate to the first transport destination. When the alignment error obtained by the evaluation process using the first route does not satisfy the first criterion, the control unit 11 can control the evaluation process using the second route assigned to the second transport destination with the second priority as the predetermined route. When the alignment error obtained by the evaluation process using the second route satisfies a second criterion, the control unit 11 can control the transport system 3 to transport the substrate to the second transport destination.

[0074] Hereinafter, a method for manufacturing an article using the substrate processing apparatus 1 configured as a pattern forming apparatus will be described. The method for manufacturing an article includes the steps of controlling the substrate processing apparatus 1 according to the control method described above to process a substrate and form a pattern on the substrate, and processing the substrate on which the pattern has been formed to obtain an article. The pattern can be formed in step S608 or S810. When the substrate processing apparatus 1 is configured as an exposure apparatus, a latent image can be formed as a pattern on a photoresist film of the substrate in step S608 or S810, and the latent image can be converted into a physical pattern through a development step. The step of processing the substrate on which the pattern has been formed may include a development step, or may include a step of processing (e.g., etching) the substrate that has been subjected to the development step.

[0075] The present disclosure includes disclosure of the following substrate processing apparatus, a method for controlling the substrate processing apparatus, a method for manufacturing an article, and a program. (Item 1) A substrate processing apparatus for processing a substrate, an alignment unit that measures an alignment error of the substrate and aligns the substrate based on the measurement; a transfer system for transferring the substrate; a control unit that executes an evaluation process of transporting the substrate, which has been aligned by the alignment unit, through a predetermined path by the transport system, and then re-measuring an alignment error of the substrate by the alignment unit, the control unit controls the transfer of the substrate by the transfer system based on the alignment error obtained by the evaluation process. A substrate processing apparatus comprising: (Item 2) a sensor for detecting a holding force of the substrate by the transfer system; the control unit executes the evaluation process when the output of the sensor indicates that the holding force of the substrate is smaller than a specified value. 2. The substrate processing apparatus according to item 1, (Item 3) the control unit determines whether or not the substrate can be transported to a predetermined destination based on the alignment error obtained by the evaluation process. 3. The substrate processing apparatus according to item 2, (Item 4) the control unit determines whether or not the substrate can be transported to a predetermined destination based on the magnitude of the alignment error obtained by the evaluation process. 3. The substrate processing apparatus according to item 2, (Item 5) the control unit determines, based on the alignment error obtained by the evaluation process, to which of a plurality of destinations the substrate should be transported. 5. The substrate processing apparatus according to any one of items 2 to 4, wherein: (Item 6) the plurality of transfer destinations include a pattern forming unit that forms a pattern on the substrate; 6. The substrate processing apparatus according to item 5, (Item 7) the plurality of transport destinations further include an open cassette, a substrate loading section, and a substrate unloading section; 7. The substrate processing apparatus according to item 5 or 6, (Item 8) the control unit notifies the occurrence of an error when it determines that the substrate cannot be transported to any of the plurality of transport destinations. 8. The substrate processing apparatus according to any one of items 5 to 7, wherein: (Item 9) the plurality of transfer destinations have priorities, and the allowable amount of alignment error obtained by the evaluation process is smaller for a destination with a higher priority; 9. The substrate processing apparatus according to any one of items 5 to 8, wherein: (Item 10) when the output of the sensor indicates that the holding force of the substrate is smaller than the specified value, the control unit executes the evaluation process using a first route assigned to a first transport destination having the first priority as the predetermined route; the control unit controls the transfer system to transfer the substrate to the first transfer destination when the alignment error obtained by the evaluation process using the first path satisfies a first criterion; when the alignment error obtained by the evaluation process using the first route does not satisfy the first criterion, the control unit executes the evaluation process using the second route assigned to the second transport destination having the second highest priority as the predetermined route; the control unit controls the transfer system to transfer the substrate to the second transfer destination when the alignment error obtained by the evaluation process using the second path satisfies a second criterion. 10. The substrate processing apparatus according to item 9, (Item 11) the control unit reduces a transport speed of the substrate by the transport system when the alignment error obtained by the evaluation process is greater than a reference value. 11. The substrate processing apparatus according to any one of items 1 to 10, (Item 12) the control unit offsets the substrate to the alignment unit based on the alignment error obtained by the evaluation process, and then causes the transfer system to transfer the substrate. 12. The substrate processing apparatus according to any one of items 1 to 11, characterized in that: (Item 13) further comprising a pattern forming unit that forms a pattern on the substrate; the control unit controls the transport system to transport the substrate, which has been aligned in the alignment unit, to the pattern formation unit when the output of the sensor indicates that the holding force of the substrate is greater than the specified value. 13. The substrate processing apparatus according to any one of items 2 to 12, characterized in that: (Item 14) 1. A method for controlling a substrate processing apparatus including an alignment unit that measures an alignment error of a substrate and aligns the substrate based on the measurement, and a transfer system that transfers the substrate, comprising: a first step of controlling the alignment unit to align the substrate; a second step of controlling the transfer system so that the substrate is transferred through a predetermined path after the first step; a third step of controlling the alignment unit to measure an alignment error of the substrate after the second step; a fourth step of controlling the transfer of the substrate by the transfer system based on the alignment error obtained in the third step, A method for controlling a substrate processing apparatus comprising: (Item 15) When the holding force of the substrate by the transfer system is smaller than a specified value, the first step, the second step, the third step, and the fourth step are performed. 15. The method for controlling a substrate processing apparatus according to item 14. (Item 16) a fifth step of controlling the transport system so that the substrate is transported to a pattern forming unit when the holding force is greater than the specified value; 16. The method for controlling a substrate processing apparatus according to item 15, (Item 17) a sixth step of controlling the pattern forming unit to form a pattern on the substrate; 17. The method for controlling a substrate processing apparatus according to item 16, (Item 18) forming a pattern on a substrate by processing the substrate according to the method for controlling a substrate processing apparatus according to item 17; processing the patterned substrate to obtain an article; A method for manufacturing an article, comprising: (Item 19) 18. A program for causing a control unit of a substrate processing apparatus to operate so as to execute the method for controlling a substrate processing apparatus according to any one of items 14 to 17.

[0076] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments and various modifications and changes are possible within the scope of the gist of the present invention. [Explanation of symbols]

[0077] 1: substrate processing apparatus, 3: transfer system, 4: pattern forming device, 6: alignment unit, 7: carrier port, 8: transfer mechanism, 9: substrate loading unit, 10: substrate unloading unit, 11: system Obe 、 20: Exposure section

Claims

1. a processing section for processing a substrate; a measurement unit that measures a positional deviation of the substrate; a driving unit that drives the substrate so as to correct the positional deviation; a transport unit that transports the substrate; a control unit that controls the transport unit, the control unit controls the transport unit to transport the substrate to the processing unit when a holding force of the substrate by the transport unit is greater than a specified value; A substrate processing apparatus characterized in that, when the holding force is smaller than the specified value, the transport unit moves the substrate to a predetermined position on a path from the measurement unit to a predetermined destination, and then transports the substrate to the measurement unit to measure a positional deviation of the substrate, and controls the transport unit based on the positional deviation.

2. A processing section for processing a substrate; a measurement unit that measures a positional deviation of the substrate; a driving unit that drives the substrate so as to correct the positional deviation; a transport unit that transports the substrate; a control unit that controls the transport unit, the control unit controls the transport unit to transport the substrate to the processing unit when a holding force of the substrate by the transport unit is greater than a specified value; A substrate processing apparatus characterized in that, when the holding force is smaller than the specified value, the substrate is transported through a route toward a predetermined destination, and then transported to the measurement unit to measure the positional deviation of the substrate, and the transport unit is controlled based on the positional deviation.

3. 3. The substrate processing apparatus according to claim 1, wherein the control unit drives the substrate by the drive unit so as to correct the measured positional deviation when the holding force is smaller than the specified value.

4. Further, a sensor for detecting the holding force is provided, 3. The substrate processing apparatus according to claim 1, wherein the control unit controls the transport unit based on the measured positional deviation when the holding force detected by the sensor is smaller than a specified value.

5. 3. The substrate processing apparatus according to claim 1, wherein the control unit determines whether or not the substrate can be transported to a predetermined destination based on the measured positional deviation when the holding force is smaller than the specified value.

6. 3. The substrate processing apparatus according to claim 1, wherein the control unit determines whether or not the substrate can be transported to a predetermined destination based on the magnitude of the measured positional deviation when the holding force is smaller than the specified value.

7. The substrate processing apparatus according to claim 4 , wherein the control unit determines to which of a plurality of destinations the substrate should be transported based on the measured positional deviation.

8. 8. The substrate processing apparatus according to claim 7, wherein the plurality of transfer destinations include a pattern forming unit that forms a pattern on the substrate.

9. the plurality of transfer destinations further include a cassette for storing the substrate, a substrate loading unit having a support part for supporting the loaded substrate, and a substrate unloading unit having a support part for supporting the unloaded substrate. The substrate processing apparatus according to claim 8 .

10. the control unit notifies the occurrence of an error when it determines that the substrate cannot be transported to any of the plurality of transport destinations. The substrate processing apparatus according to claim 7 .

11. the plurality of transport destinations have priorities, and the higher the priorities, the smaller the tolerance for the measured positional deviation. The substrate processing apparatus according to claim 7 .

12. when the output of the sensor indicates that the holding force of the substrate is smaller than the specified value, the control unit transports the substrate toward a first transport destination having the first priority, and then performs the measurement to measure a first positional deviation of the substrate; the control unit controls the transport unit to transport the substrate to the first destination when the first positional deviation satisfies a first criterion; when the first positional deviation does not satisfy the first criterion, the control unit transports the substrate to a second transport destination having the second highest priority, and then measures a second positional deviation of the substrate; the control unit controls the transport unit to transport the substrate to the second destination when the second positional deviation satisfies a second criterion. The substrate processing apparatus according to claim 11 .

13. the control unit reduces a transport speed of the substrate by the transport unit when the holding force is smaller than the specified value and when the measured positional deviation is larger than a reference value. The substrate processing apparatus according to claim 1 .

14. when the holding force is smaller than the specified value, the control unit causes the drive unit to offset the substrate based on the measured positional deviation, and then causes the transport unit to transport the substrate. The substrate processing apparatus according to claim 1 .

15. A control method for controlling substrate transport, comprising: a first control step of controlling the transport of the substrate so that the substrate is transported to a processing section that processes the substrate when a holding force of the substrate by a transport section that transports the substrate is greater than a specified value; a second control step of controlling the transport of the substrate when the holding force is smaller than a specified value; The second control step a first step of measuring a positional deviation of the substrate by a measurement unit; a second step of driving the substrate so as to correct the positional deviation; a third step of moving the substrate by the transport unit to a predetermined position on a path from the measurement unit to a predetermined destination, and then transporting the substrate to the measurement unit to measure a positional deviation of the substrate; a fourth step of controlling the transportation of the substrate based on the positional deviation measured in the third step, A control method comprising:

16. a fifth step of controlling the processing unit to form a pattern on the substrate when the holding force is greater than a specified value; 16. The control method according to claim 15.

17. A method for controlling substrate transport, comprising: a first control step of controlling the transport of the substrate so that the substrate is transported to a processing section that processes the substrate when a holding force of the substrate by a transport section that transports the substrate is greater than a specified value; a second control step of controlling the transport of the substrate when the holding force is smaller than a specified value; The second control step a first step of measuring a positional deviation of the substrate by a measurement unit; a second step of driving the substrate so as to correct the positional deviation; a third step of transporting the substrate by the transport unit through a path from the measurement unit to a predetermined destination, and then transporting the substrate to the measurement unit to measure a positional deviation of the substrate; a fourth step of controlling the transportation of the substrate based on the positional deviation measured in the third step, A control method comprising:

18. transporting a substrate in accordance with the control method of any one of claims 15 to 17; forming a pattern on the substrate transported in the above step; processing the patterned substrate to obtain an article; A method for manufacturing an article, comprising:

19. A program that causes a computer to execute the control method according to claim 15.

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