Inlay sheet, portable electronic device, and method for manufacturing inlay sheet

Abstract

To provide an inlay sheet configured to improve holdability of an IC module, a portable electronic device, and a method of manufacturing the inlay sheet.SOLUTION: An inlay sheet includes a sheet-like substrate, a wireless module, and a coil antenna. The substrate includes an opening. The wireless module includes an IC chip and an antenna connection terminal to which the antenna is connected. The wireless module is arranged in the opening. Both ends of the coil antenna are connected from the substrate to the antenna connection terminal of the wireless module via the opening. A connection member is provided which is pasted between an edge of the opening and both ends of a module substrate of the wireless module, the module substrate having no antenna connection terminal, to connect the substrate to the wireless module substrate. The connection member is formed of the same material as that of the substrate.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] Embodiments of the present invention relate to an inlay sheet, a portable electronic device, and a method for manufacturing the inlay sheet. Regarding the method. [Background technology]

[0002] In portable electronic devices such as wireless IC cards, wireless IC modules are installed in the The wireless IC module uses a laminated structure in which a conductive sheet is layered with other sheet materials. The module consists of a module board, an antenna connection terminal drawn on the module board, and a module and chip components such as LSIs mounted on a board.

[0003] In the manufacturing method of the inlay sheet, for example, an IC module is inserted into an opening of a sheet-like substrate. The coil antenna is drawn on the surface of the substrate, and one end side and the other end side of the coil antenna are The antenna connection terminal of the wireless IC module is electrically and mechanically connected at the It is known that:

[0004] For example, the coil antenna is bonded to the surface of the sheet-shaped substrate, and its end is connected to the wireless IC inside the opening. The inlay is connected to the antenna terminal of the module by soldering or other methods. In the sheet, it is required to improve the retention of the IC module placed in the opening of the base material. can be. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-235635 Summary of the Invention [Problem to be solved by the invention]

[0006] The inlay sheet according to the embodiment comprises a sheet-like substrate, a wireless module, and a coil antenna. The substrate has an opening. The wireless module has an IC chip and an antenna connection terminal to which an antenna is connected. The wireless module is disposed in the opening. Both ends of the coil antenna are connected to the antenna connection terminal of the wireless module from the substrate via the opening. The inlay sheet is attached between the edge of the opening and both ends of a module substrate of the wireless module that does not have the antenna connection terminal, and the substrate and the Wireless Module The connecting member is made of the same material as the base material. [Means for solving the problem]

[0007] The inlay sheet according to the embodiment includes a sheet-like substrate, a wireless module, and a coil assembly. The substrate has an opening. The wireless module includes an IC chip and an antenna. and an antenna connection terminal to which the wireless module is connected. The wireless module is disposed in the opening. Both ends of the coil antenna are connected to the base material through the opening and to the antenna of the wireless module. The edge of the opening and the antenna connection terminal of the wireless module are connected to each other. The substrate is attached between both ends of a module substrate having no terminals, and the substrate and the wireless module The connecting member is made of the same material as the base material. are. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a plan view showing the configuration of an IC card according to an embodiment. [Figure 2] Cross-sectional view of the IC card. [Figure 3] FIG. 1 is an explanatory diagram showing the configuration of an IC card. [Figure 4] FIG. 2 is a plan view showing a partial configuration of the IC card. [Figure 5] FIG. 2 is a cross-sectional view showing a partial configuration of the IC card. [Figure 6] FIG. 2 is a plan view showing the configuration of the IC module. [Figure 7] FIG. 2 is a cross-sectional view showing the configuration of the IC module. [Figure 8] 3A to 3C are explanatory diagrams showing the manufacturing process of the IC card. [Figure 9] FIG. 1 is a plan view showing an example of an inlay sheet according to an embodiment. [Figure 10] FIG. 10 is a plan view showing a partial configuration of an IC card according to another embodiment. [Figure 11] FIG. 10 is a plan view showing a partial configuration of an IC card according to another embodiment. [Figure 12] FIG. 10 is a plan view showing a partial configuration of an IC card according to another embodiment. [Figure 13] FIG. 2 is a cross-sectional view showing a partial configuration of the IC card according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] The configuration of the IC card 1 according to the first embodiment will be described below with reference to FIGS. 1 to 7. FIG. 1 is a plan view showing the configuration of an IC card 1 according to the first embodiment. 3 is a cross-sectional view of the IC card 1. FIG. 4 and FIG. 5 is a plan view and a cross-sectional view showing a part of the structure of an IC card. In the figure, arrows X, Y, and Z indicate 1 and 2 show a first direction, a second direction, and a third direction perpendicular to the direction of rotation, respectively.

[0010] As shown in FIGS. 1 to 3, an IC card 1 as a portable electronic device is The first core sheet 11 is a support, and the second core sheet 12 is laminated on one side of the first core sheet 11. a first cover sheet 13 laminated on the back surface of the first core sheet 11; and a second cover sheet 14 laminated on the surface of the second core sheet 12. For example, The IC card 1 is configured to be capable of contactless communication with a processing device such as a reader / writer, and is located close to the processing device. For example, IC cards1 are used for passports, transportation cards, credit cards, etc. It is used for credit cards, etc.

[0011] The IC card 1 is, for example, a laminated sheet in which a first core sheet 11 and a second core sheet 12 are laminated. The first cover sheet 13 and the second cover sheet 14 are placed on the front and back of the body, respectively. For example, it is constructed by bonding the pieces together using a heat press.

[0012] The first core sheet 11 is made up of a sheet substrate 15 (substrate) having an opening 15a and a sheet substrate 1 The non-contact coil antenna 17 is drawn on the surface of the sensor 5, and the wireless module is disposed in the opening 15a. and an IC module 20 as a module.

[0013] The sheet substrate 15 is made of PVC (polyvinyl chloride), PET-G (glycol-modified polyethylene terephthalate), For example, rectangular sheets are made from resin materials such as polyethylene terephthalate (PET) and PC (polycarbonate). The sheet substrate 15 is formed in a box shape. The sheet substrate 15 has a predetermined portion where the IC module 20 is accommodated. The rectangular opening 15a is formed in the sheet substrate 15. A through hole that extends from the surface on one side of the stacking direction (Z direction) to the back surface on the other side of the stacking direction, The IC module 20 is disposed inside the sheet substrate 15. Wiring portions and various terminals may be formed on the sheet substrate 15 as mounting components. In addition to the IC module 20, other electronic components may be mounted on the board.

[0014] As shown in FIGS. 1 to 5, the coil antenna 17 is made of, for example, a copper wire and is attached to a sheet substrate. A predetermined pattern is drawn on the surface of the sheet substrate 15 and fixed to the sheet substrate 15. For example, a coil The antenna 17 is formed by heating a copper wire and pressing it against the sheet substrate 15. The coil antenna is then drawn in a predetermined pattern shape on the sheet substrate 15. The nozzle 17 may be fixed to the sheet substrate 15 with an adhesive or the like instead of being thermocompressed. A part of the coil antenna 17 may be embedded in the sheet substrate 15 .

[0015] The coil antenna 17 is a loop antenna having one end 17a and the other end 17 b, a loop portion 17c wound around the outer periphery of the sheet substrate 15 multiple times, and the loop portion 17c and passing portions 17d, 17e disposed over the opening 15a between the both ends 17a, 17b. For example, the coil antenna 17 has end portions 17a and 17b and a loop portion 17c. is placed on the surface of the sheet substrate 15 and bonded to the sheet substrate 15.

[0016] In the coil antenna 17, the passing portions 17d and 17e arranged above the opening 15a are For example, both sides of the IC chip 22 and the molded part 28 on the module substrate 21 in the first direction In the areas adjacent to the first and second directions, the first and second directions extend linearly in a second direction perpendicular to the first direction. That is, the passages 17d and 17e are connected from one end of the opening 15a to the other end in the second direction. , and is disposed on the module substrate 21 of the IC module 20. For example, The tenon 17 is connected to the IC module 20 at a total of three or more passing portions 17d and 17e. The coil antenna 17 has bent portions and folded portions where the extending direction changes. For example, the end portions that are continuous with the passing portions 17d and 17e and are joined to the surface of the sheet substrate 15 may be The folds 17a and 17b are formed with turning portions where the extending direction changes.

[0017] Specifically, the passing portions 17d and 17e near the ends 17a and 17b of the coil antenna 17 However, by joining the IC module 20 by soldering or welding, As an example, the coil antenna 17 is mechanically connected to the passing portion 1 on one end 17a side. 7d is joined to one antenna connection terminal 23 at two points, and the other end 17b side The passing portion 17e is joined to the other antenna connection terminal 23 at two points. Two joints 25 are formed on each of the tena connection terminals 23, totaling four joints 25.

[0018] That is, the coil antenna 17 has the loop portion 17c joined to the surface of the sheet substrate 15. The other parts, ie, the passing parts 17d and 17e, are connected to the module substrate 21 or the antenna. The coil antenna 17 is connected to the antenna connection terminal 23. The passing portions 17d and 17e of the coil antenna 17 are made of a material In the gap G1 between the edge of the opening 15a of the substrate 15 and the module substrate 21, It has a portion that is not bonded to the mold substrate 21 .

[0019] As shown in FIGS. 6 and 7, the IC module 20 includes a module substrate 21 and an IC chip. The antenna connector 20 includes a cap 22, an antenna connection terminal 23, a wire 27, and a molded portion 28.

[0020] The module substrate 21 is configured in a rectangular plate shape and is disposed within the opening 15a of the sheet base material 15. The module substrate 21 is made of, for example, a glass epoxy material. The plate 21 is configured to be slightly smaller than the opening 15a, and the outer periphery of the module substrate 21 and the opening 15a are spaced apart. A gap is formed between the inner wall of 5a and the inner wall of 5b.

[0021] The IC chip 22 is, for example, an LSI (Large Scale Integration) The IC chip 22 is mounted on the module substrate 21. , and is connected to the conductor portion 23a by wire bonding via a wire 27, and the molded portion For example, the IC chip 22 includes memories such as RAM and ROM, a CPU, The IC chip 22 is provided on the front side of the module substrate 21. The inside of the storage section formed by the opening 15a and the opening 12a of the second core sheet 12 described later. will be placed in.

[0022] The antenna connection terminal 23 is disposed on the module substrate 21 in a first direction of the IC chip 22. The antenna connection terminals 23 are provided on one and the other side of the metal layer 21, for example. The antenna connection terminal 23 is connected to a terminal on the IC chip 22 side. The antenna connection terminal 23 faces the IC chip 22 located in the center. Each antenna connection terminal 23 has a linear conductor portion 23a extending in the first direction. The antenna 17 has an antenna joint 25 to which it is joined.

[0023] For example, in this embodiment, two antenna connections are provided on both sides of the IC chip 22. The coil antennas 17 are connected to the terminals 23 at two locations. Two antenna joints 25 are provided on each side, for a total of four.

[0024] The wire 27 is, for example, a gold wire, and connects the conductive wire portion 23a and the IC chip 22. For example, one end of the wire 27 is electrically connected to a terminal of the IC chip 22, and the other end is connected to an antenna. The lead wire 23a is electrically connected to the connecting terminal 23.

[0025] The molded portion 28 is made of a resin material and includes the IC chip 22, the wire 27, and the conductive wire portion 23. For example, the molded portion 28 is configured in the shape of a rectangular block.

[0026] The second core sheet 12 is made of a resin material and is formed in a rectangular shape that is long in one direction. The core sheet 12 is made of the same material as the sheet base material 15 of the first core sheet 11. For example, the second core sheet 12 is made of PVC, PETG, PC, etc. 2 is laminated on the front side of the first core sheet 11. The outer shape of the second core sheet 12 is the same as that of the first core The second core sheet 12 is formed in the same shape as the outer shape of the sheet 11. The second core sheet 12 has a hole penetrating through it in the thickness direction. The opening 12a is a through hole having the same shape as the opening 15a or a size larger than the opening 15a. The IC module 20 is accommodated by being overlapped with the opening 15a in the stacking direction. For example, the opening 12a is formed by the outer periphery of the molded portion 28 of the IC module 20. The IC module 2 is formed in a rectangular shape along the edge of the first core sheet 11 and protrudes from the first core sheet 11. Contains at least part of a 0.

[0027] The first cover sheet 13 and the second cover sheet 14 are formed in the shape of, for example, a rectangular plate. The outer periphery of the cover sheet 13 is the same as the outer shape of the first core sheet 11 and the second core sheet 12. The cover sheets 13 and 14 are formed in the same shape. For example, the cover sheets 13 and 14 are made of PVC, PETG, PC, etc. A base layer made of a resin material and a pattern or letter drawn on the surface of the base layer For example, the cover sheets 13 and 14 are the sheet base material of the first core sheet 11. 15 and the second core sheet 12 are made of the same material.

[0028] In the IC card 1 configured in this manner, the IC module 20 is The coil spring 14 has three or more joining portions to be joined to the substrate 15. The antenna 17 is connected to the antenna connection terminals 23 of the IC module 20 at four points. A joint 25 is formed.

[0029] Such an IC card 1 is made up of a first core sheet 11 and a laminated material on the surface of the first core sheet 11. The first core sheet 11 is then placed on the second core sheet 12, and a first cover sheet 13 is placed on the back side of the first core sheet 11. The second cover sheet 14 is placed on the front side of the second core sheet 12 and then heated and pressed. In this way, the stacked sheets 11 to 14 are joined together.

[0030] FIG. 8 is an explanatory diagram showing the manufacturing process of an IC card, and FIG. 9 shows an example of an inlay sheet. As shown in FIG. 8, the method for manufacturing the first core sheet 11 includes: The IC module 20 is placed in the opening 15a. and the antenna 17 is joined at least at three or more points. An opening 15a is formed in the substrate 15 (ST1), and an IC module 20 is disposed in the opening 15a. Then, the IC module in the opening 15a is placed on the surface of the sheet base material 15 (ST2). The coil antenna 17 is formed in a predetermined pattern passing through the wire 20 (ST3). A part of the antenna 17 is disposed on the antenna connection terminal 23 of the IC module 20, and the connection terminal 23 The parts are joined by welding or soldering (ST4).

[0031] For example, the first core sheet 11 is a sheet unit 110 in which a plurality of inlets are arranged. After being integrally formed as a single sheet, it is cut into a predetermined shape and separated into individual pieces. A plurality of openings 15a are formed in a large base sheet material 150 in which the substrate 15 is continuous (ST 1), an IC module 20 is placed in each opening 15a (ST2). The coil antenna 17 corresponding to the C module is drawn (ST3), and each IC module 20 The antenna 17 is joined onto the antenna connection terminal 23 to form three or more joints 25 (S T4) As a result of the above, a plurality of IC modules 20 are mounted on the base sheet material 150. The sheet unit 110 is then completed. and a sheet unit 110 on which the second core sheets 12 are mounted, and a second core sheet 12 which is divided into individual pieces. The sheet unit 110 is then individually attached to the back side of the sheet unit 110. The third sheet material is laminated, and the second cover sheet is formed on the front side of the second sheet material by dividing it into pieces. The fourth sheet material, which will be the sheet 14, is placed on top of the other sheet material and heat-pressed to form a laminate of multiple sheet materials. are joined together (ST5) to form a card unit on which a plurality of IC modules 20 are mounted. Then, the card unit is cut into individual pieces (ST6), and multiple IC cards are produced. The IC module 1 is formed as a part of the laminated structure of one IC card 1. The first core sheet 11 having the 20 is called an inlay sheet, and before being divided into individual pieces in the manufacturing process, The sheet unit 110 is a large sheet material on which a plurality of IC modules 20 are mounted. It is called an inlay sheet.

[0032] As described above, the first core sheet 11 and the IC card 1 according to the first embodiment are IC modules. The module 20 is connected to the coil antenna 17 or the substrate 15 at three or more locations, for example, four locations. For this purpose, for example, two points are bonded, one on each side of the IC chip 22. Compared with a structure in which the first core sheet 11 is bonded by a bonding wire, the IC module 20 is held more firmly. This improves ease of handling during transportation. The coil antenna is arranged through a gap and extends from the sheet substrate. Inlays that are attached to the cable's connection terminals at only two points provide unstable support. If the inlay is transported to the next process in this state, the wireless module will be greatly damaged by the vibrations. The antenna wire may break near the joint due to shaking. According to the embodiment, the IC module 20 and the coil antenna 17 are joined at three or more points. In addition, the antenna can be supported by the two passing portions 17d and 17e. By joining the antenna connection terminal 23 with the plurality of joining portions 25, 25, the distance between the joining portions 25 is secured. This improves stability and strength. In addition, it prevents the IC module 20 from being displaced or coming off during the manufacturing process. This prevents the product from falling off and improves positional accuracy when it is commercialized.

[0033] Although one embodiment of the present invention has been described above in detail, the present invention is not limited to the above embodiment. The present invention is not limited to the above, and modifications and improvements are possible as appropriate.

[0034] For example, in the first embodiment, the IC chip 22 is provided on both sides in one direction with a The antenna connection terminals 23 are provided at both ends 17a and 17b of the coil antenna 17. The passing portions 17d and 17e passing over the opening 15a in the vicinity of b are joined to the connection terminal 23, However, the present invention is not limited to this. For example, the antenna connection terminal 23 are formed in four separate locations, and the coil antenna 17 is joined to each antenna connection terminal 23. It may be possible.

[0035] For example, as another embodiment, a first core sheet 11A shown in FIG. 10 is a module substrate 21 In addition to the pair of antenna connection terminals 23 at both ends in the first direction, A pair of antenna connection terminals 29 are formed, and the antenna connection terminals 2 3 and 29 are provided with one joint 25 to which the antenna 17 is joined. The coil antenna 17 has a passing portion 17d joined to one of the connection terminals 23, and The end portion of the sheet 15 extends above the sheet base material 15 and is joined to the sheet base material 15. The portion on the end side further extends to the second antenna connection terminal 29. It is joined to the child 29.

[0036] That is, the coil antenna 17 has passing portions 17d and 17e and end portions 17a and 17b. Between them, relay portions 17f and 17g are joined to the surface of the sheet substrate 15, and an antenna connection terminal 2 9 and includes extending portions 17h and 17i joined to the antenna connection terminal 29. For example, the relay portions 17f and 17g form a rectangular pattern. The semiconductor device is placed on a cooling substrate 21 .

[0037] The connection terminal 23 and the connection terminal 29 are electrically connected by a conductor portion 23b.

[0038] In this embodiment, the joints 25 are provided at three or more locations, so that the IC module The coil antenna 17 has relay portions 17f and 17f. The passing portions 17d and 17e are connected to the antenna connection terminals 23 and 29 by the connecting portion 25 via the g. This allows for further improvement in stability.

[0039] In the above example, the antenna connection terminals 23 and 29 are electrically connected to the conductor portions 23a and 23b. The antenna connection terminals 23 and 29 are electrically connected to the IC chip. For example, as another embodiment, the first core sheet 1 shown in FIG. 1B, the second connection terminal 29 is not connected to the connection terminal 23 by the conductor portion 23b, It may also be an auxiliary terminal for connecting the antenna 17 .

[0040] In the above embodiment, the coil antenna 17 is connected to the antenna connection terminal 23 at four locations. However, the joining portion is not limited to this. For example, the joining portion may be a coil arm. It may be a connection portion connected to the base material 15 instead of the antenna 17 .

[0041] For example, as another embodiment, as shown in FIGS. 12 and 13, a first inlay sheet is The core sheet 11C has two connectors that are attached to the edge of the opening 15a and the module substrate 21. The antenna 17 is connected to the IC module 20 by the connecting member 18. A joint 19 is formed. That is, in this embodiment, the antenna 17 is The number of joints 25 joined to the substrate 15 and the IC module 20 by the connecting member 18 The total number of joints 19 connected to the first connector 18 is 3 or more. At least the sheet substrate 15 of the sheet 11, the second core sheet 12, and the cover sheets 13 and 14 For example, the connecting member 18 is made of PVC, PETG, PC, etc. It is formed from a resin material.

[0042] As a method for manufacturing such a first core sheet 11C, for example, a method for forming openings 11C in a sheet substrate 15 is described below. 5a (ST1), and an IC module 20 is placed in the formed opening 15a. (ST2), a predetermined pattern is formed from the surface of the sheet substrate 15 to the IC module 20. The antenna 17 is formed (ST3) and the antenna 1 is connected to the IC module 20. 7 to form a joint 25, and the edge of the opening 15a of the sheet substrate 15 and the IC module The connecting member 18 is attached to two locations to form a joint 19. (ST3), for example, a first core sheet 11C, a second core sheet 12, and a cover When the sheets 13 and 14 are laminated and hot-pressed, the first core sheet 11C and the second core sheet The connecting member 18, which is made of the same material as the connecting member 12, is melted and integrated.

[0043] In this embodiment, three or more joints or connections are provided. This improves the holding performance of the IC module 20.

[0044] The number of joining points is not limited to four. For example, three or five or more joining points may be used. The wiring shape of the antenna is not limited to that in the above embodiment. For example, in the first embodiment, on the distal end side that has passed through the opening 15a, Although the end portions 17a and 17b are folded back, they may extend linearly.

[0045] In addition to the above configuration, the IC card 1 may be provided with other configurations as needed. 1. In addition, the IC card 1 is made up of four layers of sheets 11 to 1. However, it is not limited to this, and any of the sheets may be omitted to form a three-layer or more structure. It may be a bottom layer or five or more layers.

[0046] In addition, the openings 15a and 12a constituting the storage portion are through holes, but For example, either or both of them may be recessed.

[0047] Although the IC card 1 is exemplified as a portable electronic device, the present invention is not limited to this. , and can be used in various electronic devices.

[0048] According to at least one of the above-described embodiments, it is possible to improve the holding property of the wireless module. do.

[0049] Although several embodiments of the present invention have been described, these embodiments are presented by way of example only. These novel embodiments are not intended to limit the scope of the invention. It is possible to implement the invention in various other forms, and various modifications are possible without departing from the spirit of the invention. These embodiments and their modifications are within the scope of the invention. It is included in the summary and in the scope of the invention described in the claims and their equivalents. . [Explanation of symbols]

[0050] 1...IC card, 11, 11A, 11B, 11C...first core sheet (inlay sheet), 12...second core sheet, 12a...opening, 13...first cover sheet, 14...second cover sheet 15...sheet substrate, 15a...opening, 17...coil antenna, 17a...end, 17b... End portion, 17c...loop portion, 17d...passing portion, 17e...passing portion, 17f...relay portion, 17g... Relay portion, 17h...extension portion, 17i...extension portion, 18...connection member (joint portion), 20...IC module module (wireless module), 21...module substrate, 22...IC chip, 23...antenna Connection terminal, 23a...conductor portion, 23b...conductor portion, 25...joint portion, 27...wire, 28...motor ld part, 29...connection terminal, 110...seat unit (inlay sheet), 150...base Sheet material, G1...gap.

Claims

1. an inlay sheet comprising: a sheet-like substrate having an opening; a wireless module having a module substrate, an IC chip, and an antenna connection terminal to which an antenna is joined, the wireless module being disposed in the opening; and a coil antenna provided on the surface of the substrate, wherein both ends of the coil antenna are joined from the substrate through the opening to the antenna connection terminal of the wireless module, and the inlay sheet has connecting members attached between the edges of the opening and both ends of a module substrate that does not have the antenna connection terminal of the wireless module, connecting the substrate and the wireless module, the connecting members being made of the same material as the substrate.

2. A portable electronic device comprising: an inlay sheet according to claim 1; a second core sheet stacked on one side of the inlay sheet in the stacking direction and having an opening in which the wireless module is disposed; and a cover sheet arranged on at least one side of the stack of the inlay sheet and the second core sheet in the stacking direction.

3. A method for manufacturing an inlay sheet, comprising: arranging a wireless module having a module substrate, an IC chip disposed on the module substrate, and antenna connection terminals formed on both ends of the module substrate in an opening formed in a sheet substrate; forming an antenna extending from the surface of the sheet substrate to the wireless module, and joining both ends of the antenna to the wireless module using two antenna connection terminals at both ends of the wireless module; and attaching connecting members made of the same material as the sheet substrate between edges of the opening in the sheet substrate and both ends of the module substrate of the wireless module that do not have the antenna connection terminals.

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