Imaging device

Abstract

To provide an imaging device with which both high radiation performance and a reduced device size are achieved.SOLUTION: An imaging device 1 comprises: an imaging substrate 202 on which an imaging element is mounted; a main circuit board 101 on which a heat-generating element is mounted and which is located in approximately parallel to the imaging substrate 202; a duct unit 120 which is located on the back side of the main circuit board 101; and a cooling fan 102 for drawing in the ambient air to the duct unit 120. The duct unit 120 includes a duct base 104 facing the main circuit board 101 and located in approximately parallel to the main circuit board, and a duct plate 105 which is located to the duct base 104 so as to tilt at a prescribed angle, with the cooling fan 102 attached to the duct plate 105.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to an imaging device including a substrate on which a heat generating element is mounted. [Background technology]

[0002] An imaging device contains heat-generating elements, such as an image processing circuit and an imaging element, that generate heat during operation. The heat generated by these heat-generating elements can degrade the performance of not only the heat-generating elements themselves but also other electrical elements. Furthermore, the temperature of the exterior of the imaging device can rise, potentially causing discomfort to users holding the imaging device. Therefore, a mechanism is needed to efficiently exhaust the heat generated inside the imaging device to the outside.

[0003] One method for discharging heat generated inside an imaging device to the outside air is a forced air-cooling method in which a cooling fan is used to take in air from outside the imaging device, heat generated inside the imaging device is transferred to the taken-in air, and the heated air is then discharged outside the imaging device. For example, Patent Document 1 proposes a configuration in which a substantially L-shaped air-cooling duct is arranged and heated air is discharged from a diagonally rear position away from the heat-receiving part of the air-cooling duct in the imaging device. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-122718 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the imaging device disclosed in Patent Document 1, a part of the air-cooling duct and the cooling fan are disposed diagonally behind the imaging device body, which causes a problem that the imaging device body becomes large.

[0006] An object of the present invention is to provide an imaging device that achieves both efficient discharge of heat generated inside the imaging device body to the outside and miniaturization of the imaging device body. [Means for solving the problem]

[0007] The imaging device according to the present invention includes an imaging board on which an imaging element is mounted, a main circuit board on which a heat generating element is mounted and which is disposed on a rear side of the imaging board substantially parallel to an imaging surface of the imaging element, a duct unit disposed on the rear side of the main circuit board, and a cooling fan that takes in outside air into the duct unit. before a rear cover disposed on a rear side of the cooling fan, wherein the duct unit has a duct base that faces the main circuit board and is disposed substantially parallel to the main circuit board, and a duct plate that is disposed so as to be inclined at a predetermined angle with respect to the duct base; the rear cover is substantially parallel to the duct base, The cooling fan is attached to the duct plate, and a space having a substantially triangular cross-sectional shape when viewed from above the imaging device is formed between the cooling fan and the rear cover. [Effects of the Invention]

[0008] According to the present invention, it is possible to efficiently discharge heat generated inside the image pickup device body to the outside and to reduce the size of the image pickup device body. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a perspective view of the appearance of an imaging device according to an embodiment. [Figure 2] FIG. 2 is an exploded perspective view of the imaging device. [Figure 3] FIG. 1 is a perspective view showing the external configuration of a heat dissipation system for an imaging device; [Figure 4] FIG. 2 is an exploded perspective view of a heat dissipation system of the imaging device. [Figure 5] 2 is a rear view of the imaging device body and a cross-sectional view taken along the line AA in the rear view showing the schematic configuration of a heat dissipation system of the imaging device. [Figure 6]FIG. 2 is a cross-sectional view showing the internal layout of the imaging device. [Figure 7] FIG. 2 is a perspective view of a rear unit that constitutes the imaging device. [Figure 8] FIG. 2 is a perspective view showing an imaging unit and a front unit of the imaging device separated from each other. [Figure 9] FIG. 2 is an exploded perspective view of the imaging unit. [Figure 10] FIG. 2 is a perspective view showing an assembled state of the imaging unit and the front unit. [Figure 11] FIG. 2 is a cross-sectional view of a main unit, an imaging unit, and a front unit. [Figure 12] FIG. 2 is an exploded perspective view of the main unit. [Figure 13] This is a ZX cross-sectional view (including the optical axis) of the main unit and a partially enlarged view. [Figure 14] FIG. 3 is a perspective view showing a state in which the main circuit board, the power supply board, and the first thermally conductive sheet are assembled. [Figure 15] 3A and 3B are schematic diagrams illustrating the insertion and removal of recording media into and from the imaging device. [Figure 16] FIG. 2 is a perspective view illustrating a cross section of the imaging device body. [Figure 17] FIG. 10 is a perspective view illustrating the shape and attachment position of a second thermally conductive sheet. [Figure 18] FIG. 17 is an enlarged top view of part G in FIG. 16. [Figure 19] 2A and 2B are a perspective view and a bottom view of the imaging device. [Figure 20] 10 is a bottom view showing the right side of the imaging device placed on a placement surface. FIG. [Figure 21] FIG. 2 is a side view of the imaging device. [Figure 22] 22 is a cross-sectional view taken along the arrows JJ and KK in FIG. 21. [Figure 23] FIG. 2 is a side view of the imaging device main body. [Figure 24] FIG. 2 is a right side view of the imaging device body with the display panel open. [Figure 25]FIG. 2 is a diagram showing the right side and its vicinity as viewed from the bottom side of the imaging device body. [Figure 26] FIG. 2 is an exploded perspective view of the top unit. [Figure 27] FIG. 2 is a top view of the imaging device. [Figure 28] 28 is a cross-sectional view taken along the arrows VV and WW in FIG. 27. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0011] <External configuration of the imaging device> 1(a) and 1(b) are external perspective views of an imaging device 1 according to an embodiment, with the imaging device 1 viewed from different directions in FIGS. 1(a) and 1(b). For ease of explanation, a Cartesian coordinate system is defined as shown in FIGS. 1(a) and 1(b), with mutually orthogonal X, Y, and Z axes. The Z axis is parallel to the imaging optical axis of the imaging device 1 (an axis passing through the center of an imaging element described below and orthogonal to the imaging surface of the imaging element; hereinafter, referred to as the "optical axis"). The Z direction, in which the Z axis extends, is defined as the positive direction (+Z direction) toward the subject to be imaged, and the opposite direction is defined as the negative direction (-Z direction). When the Z axis lies within a horizontal plane, the X axis lies within the same horizontal plane, and the X direction, in which the X axis extends, is defined as the width direction of the imaging device 1. When the imaging device 1 is viewed from the subject side, the direction toward the right is defined as the positive direction (+X direction), and the direction toward the left is defined as the negative direction (-X direction). With the X-axis and Z-axis in a horizontal plane, the Y-axis is parallel to the vertical direction, and the Y direction in which the Y-axis extends is the height direction of the imaging device 1. Regarding the Y direction, the direction toward the heavens (sky) is defined as the positive direction (+Y direction), and the direction toward the earth (direction of gravity) is defined as the negative direction (-Y direction).

[0012] The imaging device 1 is broadly composed of an imaging device main body 2 and a lens barrel 3. Inside the imaging device main body 2 are arranged a power supply unit (not shown), a main circuit board that is responsible for overall control of the imaging device 1, an imaging element that converts an optical image formed by incident light from the lens barrel 3 into an electrical signal to generate an image signal, an image processing circuit that converts the image signal into image data, etc. Also, inside the imaging device main body 2, there is provided storage space for a storage medium for storing image data.

[0013] The lens barrel 3 is attached to the front side (+Z side) of the imaging device body 2. In this embodiment, the lens barrel 3 is a so-called interchangeable lens that is detachable from the imaging device body 2. However, this is not limiting, and the lens barrel 3 may be configured integrally with (inseparably from) the imaging device body 2.

[0014] A power switch 11 for switching the power on and off and an accessory shoe 12 for attaching and detaching various accessories are provided on the top surface (+Y side) of the imaging device main body 2. When viewed from the subject side (+Z side), an external terminal cover 13 for protecting connection terminals (not shown) such as a USB terminal and an HDMI (registered trademark) terminal for connecting the imaging device main body 2 to an external device (not shown) is provided on the right side surface (+X side) of the imaging device main body 2. In addition, an exhaust port 14 is provided on the right side surface of the imaging device main body 2 for discharging air heated by heat generated inside the imaging device main body 2 to the outside by a forced air-cooling mechanism using a cooling fan (described later).

[0015] A media cover 15 is disposed on the left side (-X side) of the imaging device body 2 when viewed from the subject side as a cover member for protecting a storage medium (not shown) stored in the imaging device body 2. A display panel 16 and an electronic viewfinder 17 are provided on the rear face (-Z side) of the imaging device body 2. In addition, an air intake 18 is provided on the rear face of the imaging device body 2 for drawing outside air into the imaging device body 2 by a forced air-cooling mechanism using a cooling fan, which will be described later.

[0016] The bottom surface (-Y side) of the imaging device main body 2 is provided with a battery chamber cover 19 for protecting a battery chamber (not shown) for storing a battery (not shown), and a tripod screw 20 for attaching and detaching a tripod (not shown).

[0017] <Schematic configuration of imaging device 1> 2 is an exploded perspective view of the imaging device 1, showing the state in which it has been disassembled into the units that make up the imaging device body 2. The imaging device body 2 is roughly composed of a main unit 100, an imaging unit 200, a shutter unit 300, a front unit 400, a top unit 500, a rear unit 600, a bottom unit 700, and a side unit 800.

[0018] The main unit 100 has a duct and cooling fan that form a closed space for the forced air-cooling mechanism, a main circuit board, etc. The imaging unit 200 has an imaging element and an imaging board 202 (see Figure 3) on which it is mounted. The shutter unit 300 has a shutter mechanism for adjusting exposure time. The front unit 400 has a mount to which the lens barrel 3 is detachably attached. The top unit 500 has a viewfinder unit with an electronic viewfinder 17 and a power switch 11. The rear unit 600 has a display panel 16 and an air intake, and the bottom unit 700 has a tripod part with a tripod screw 20. The side unit 800 has an external terminal cover 13 and an exhaust port 14.

[0019] The imaging device main body 2 is completed by assembling the shutter unit 300, imaging unit 200, main unit 100, top unit 500, rear unit 600, bottom unit 700, and side unit 800 to the front unit 400 in this order.

[0020] <Schematic configuration of heat dissipation system of imaging device 1> Fig. 3 is a perspective view showing the external configuration of the heat dissipation system of the imaging device 1. Fig. 4(a) and Fig. 4(b) are exploded perspective views of the heat dissipation system of the imaging device 1, and the exploded heat dissipation systems are viewed from different directions in Fig. 4(a) and Fig. 4(b), as indicated by the juxtaposed coordinate axes.

[0021] The main unit 100, imaging unit 200, and front unit 400 each have a heat dissipation structure, and these heat dissipation structures form the overall heat dissipation system of the imaging device 1. The main unit 100 includes a main circuit board 101 and a power supply board 110 as heat sources. The heat dissipation structure of the main unit 100 includes a cooling fan 102, a first cooling fan cushion 103, a duct base 104, a duct plate 105, and heat dissipation rubber 106. The heat dissipation structure of the main unit 100 also includes a first thermally conductive sheet 107, a second thermally conductive sheet 108, a heat sink 109, and a power supply board plate 111.

[0022] The imaging unit 200 has an imaging element 201 and an imaging board 202 as heat sources. The heat dissipation structure of the imaging unit 200 has an imaging board holder 203, heat dissipation rubber 204, a third heat conduction sheet 205, and an imaging cooling member 206. The heat dissipation structure of the front unit 400 has an imaging unit holding member 401.

[0023] Details of each heat dissipation structure will be described later, but here we will provide an overview of the heat dissipation system of the imaging device 1. Heat generated in the main circuit board 101 and the imaging board 202 is transferred to a duct base 104 made of a metal with high thermal conductivity, such as aluminum, via thermally conductive members such as heat dissipation rubber 106 and first, second, and third thermally conductive sheets 107, 108, and 205. A duct unit 120 having a closed space is formed by the duct base 104 and the duct plate 105, and outside air is taken into the duct unit 120 by the cooling fan 102. In this way, the air flowing inside the duct unit 120 is heated by heat exchange with the duct base 104, and the heated air is discharged to the outside, thereby dissipating heat from inside the imaging device main body 2 to the outside. The intake section 121 of the duct unit 120 is connected to the intake port 18 (see FIG. 1), and the exhaust section 122 of the duct unit 120 is connected to the exhaust port 14 (see FIG. 1).

[0024] The main circuit board 101 is held by a heat sink 109 and disposed so as to be perpendicular to the optical axis (not shown) of the imaging device 1. As shown in FIG. 4(a), an external connection terminal group 131 is mounted on the +X side of the main circuit board 101. As shown in FIG. 4(b), on the -X side of the main circuit board 101, a first media socket 132 is mounted on the +Z side surface, and a second media socket 133 is mounted on the -Z side surface. Note that in FIG. 1(a), the external connection terminal group 131 is covered by the external terminal cover 13, and in FIG. 1(b), the first media socket 132 and the second media socket 133 are covered by the media cover 15, and therefore are not visible from the outside.

[0025] The power supply board 110, which controls the power supply of the imaging device 1, is disposed substantially parallel to the main circuit board 101 behind the main circuit board 101 (in the -Z direction) so as to substantially overlap with the main circuit board 101 on the optical axis projection plane (when viewed from the +Z side to the -Z side along the optical axis). The power supply board 110 is held by a power supply board plate 111 and is fixed to the heat sink 109 via the power supply board plate 111.

[0026] The duct base 104 is disposed behind (on the -Z side of) the power supply board 110 and approximately parallel to the main circuit board 101 so as to approximately overlap with the main circuit board 101 on the optical axis projection plane. The duct plate 105 is attached to the duct base 104, and the duct plate 105 and the duct base 104 form a duct unit 120 having a closed space.

[0027] The cooling fan 102 is attached to the rear side (-Z side) of the duct base 104 with a first cooling fan cushion 103 sandwiched between the cooling fan 102 and the duct plate 105. When the cooling fan 102 is driven, air flows in the internal space of the sealed duct unit 120. The cooling fan 102 is a so-called centrifugal fan that draws in air from the surface direction and expels it from the centrifugal (side) direction.

[0028] Heat-generating elements that consume a lot of power and generate a lot of heat, such as an MPU, a video engine (image processing circuit), and a volatile memory, are mounted on the main circuit board 101. Heat generated on the main circuit board 101 is transferred to the duct base 104 via a first thermally conductive sheet 107. Heat generated on a first recording medium that can be attached to a first media socket 132 on the main circuit board 101 is transferred to the duct unit 120 via a second thermally conductive sheet 108. Heat generated on the imaging element 201 is transferred to the duct base 104 via a third thermally conductive sheet 205. Details of these heat transfer paths will be described later.

[0029] When the cooling fan 102 is driven, air (outside air) flows into the duct unit 120, causing heat exchange between the duct base 104, whose temperature has risen, and the air flowing through the duct unit 120, and the heated air is discharged to the outside. In this way, heat generated inside the image capture device body 2 is dissipated into the outside air, thereby cooling the image capture device body 2, in other words, suppressing an increase in the internal temperature.

[0030] [Heat dissipation structure of main unit 100] Next, the heat dissipation structure of the main unit 100 will be described. Fig. 5(a) is a rear view of the imaging device 1, and Fig. 5(b) is a cross-sectional view taken along the arrow AA in Fig. 5(a) showing the air flow in the heat dissipation system of the imaging device 1. Note that Fig. 5(b) only shows the main unit 100, rear unit 600, and side unit 800 in order to clearly show the heat dissipation structure of the main unit 100.

[0031] When the cooling fan 102 is driven, air is drawn into the interior of the imaging device body 2 through the air intake port 18, and flows in the direction indicated by the arrow in FIG. 5(b) and into the internal space of the duct unit 120 formed by the duct base 104 and the duct plate 105. The air that has flowed into the internal space of the duct unit 120 passes between the multiple duct fins 104a formed on the duct base 104, then passes through the inside of the cooling fan 102 and is discharged in the centrifugal direction of the cooling fan 102, and is then exhausted from the exhaust port 14.

[0032] The cooling fan 102 has two openings on its two surfaces. One opening of the cooling fan 102 abuts against the duct plate 105 with the first cooling fan cushion 103 sandwiched therebetween and faces the opening 105a of the duct plate 105. The other opening of the cooling fan 102 abuts against the rear plate 601 with the second cooling fan cushion 602 sandwiched therebetween. Because the rear plate 601 does not have an opening, when the rear unit 600 is assembled to the main unit 100, the other opening of the cooling fan 102 is blocked. Therefore, as described above, when the cooling fan 102 is driven, air flows into the duct unit 120 only through the air intake 18.

[0033] Fig. 6 is a cross-sectional view showing the internal layout of the imaging device 1, and corresponds to the cross-sectional view taken along the arrow AA in Fig. 5(a). Here, the structure of the cooling fan 102 and duct base 104 of the main unit 100 will be mainly described.

[0034] The main circuit board 101 is disposed so as to be approximately perpendicular to the optical axis of the imaging device 1. In other words, the main circuit board 101 is disposed so that its thickness direction is approximately parallel to the optical axis. The duct base 104, which forms the surface on the front side (main circuit board 101 side (+Z side)) of the duct unit 120, is disposed so as to be approximately perpendicular to the optical axis, in other words, so as to be approximately opposite to the main circuit board 101 in the optical axis direction. The duct plate 105, which forms the surface on the back side (-Z side) of the duct unit 120, is disposed so as to be inclined at a predetermined angle with respect to the optical axis (so that the angle it forms with the optical axis is greater than 0° and less than 90°), as shown in FIG. 6. In other words, the duct plate 105 is disposed so as to be inclined at a predetermined angle with respect to the duct base 104 (so that the angle it forms with the duct base 104 is greater than 0° and less than 90°).

[0035] The cooling fan 102 is attached to the rear surface (-Z side surface) of the duct plate 105, and therefore, the cooling fan 102 is attached at an angle with respect to the optical axis. Therefore, in the ZX plane, a space C having a substantially triangular cross section is formed between the cooling fan 102 and the rear cover 603, which is disposed substantially parallel to the main circuit board 101 behind the cooling fan 102 (-Z side). In other words, the cooling fan 102 is attached at an angle so that the space D having a substantially triangular cross section is embedded in the duct unit 120 having a substantially rectangular cross section. As can be seen from a comparison with FIG. 5(b), the space D is an area within the duct unit 120 where air does not flow, and therefore the heat dissipation efficiency (cooling efficiency) is not reduced. In other words, by disposing the cooling fan 102 at an angle with respect to the duct base 104, the space C is created without reducing the heat dissipation performance (cooling performance).

[0036] [Heat dissipation structure of rear unit 600] Next, we will explain the heat dissipation structure of the rear unit 600. Figures 7(a) and (b) are perspective views of the rear unit 600, with Figure 7(a) showing a state in which the rear plate 601 is attached and Figure 7(b) showing a state in which the rear plate 601 is removed.

[0037] The rear unit 600 has a display panel 16 (see FIG. 1(b) as appropriate). A panel connection line 610 connected to the display panel 16 is connected to a connector 611a of a rear connection flexible cable 611, and the rear connection flexible cable 611 is connected to the main circuit board 101 via a relay flexible cable (not shown). As a result, an image signal generated by the main circuit board 101 is transmitted to the display panel 16, and an image related to the image signal is displayed on the display panel 16.

[0038] The rear plate 601 has two continuous surfaces, one substantially parallel to the rear cover 603 and the other substantially parallel to the cooling fan 102, and of these two surfaces, the second cooling fan cushion 602 is attached to the surface parallel to the cooling fan 102. The panel connecting wire 610 is housed in a space formed by the rear cover 603, which is substantially perpendicular to the optical axis, and the surface of the rear plate 601 that is parallel to the cooling fan 102.

[0039] 6, the miniaturization of the imaging device body 2 due to the layout of the main unit 100 and the rear unit 600 will be described. As described above, the cooling fan 102 is attached to the duct plate 105 disposed at an angle with respect to the optical axis in the duct unit 120. Therefore, a space C having a substantially triangular cross section on the Y-axis projection plane (when viewed from above the imaging device 1) is formed between the cooling fan 102 and the rear cover 603. Therefore, by storing the panel connection wire 610 of the rear unit 600 in the space C and making effective use of the space C, the imaging device body 2 can be miniaturized (reduced thickness in the Z direction).

[0040] Next, the positional relationship between the cooling fan 102 and the duct fins 104a will be described. As shown in Figures 4(b) and 5(b), multiple duct fins 104a are provided inside the duct unit 120 so as to extend along the airflow direction. The duct fins 104a are positioned so as to substantially overlap with the main heat source of the main circuit board 101 on the optical axis projection plane. Therefore, heat is transferred from the main heat source near the duct fins 104a to the duct fins 104a via the first thermal conduction sheet 107, allowing the duct fins 104a to function efficiently as a heat sink.

[0041] 5(b), the cooling fan 102 and the duct fin 104a are arranged in positions where they do not overlap on the optical axis projection plane, but at least partially overlap in the Z direction (where they at least partially overlap on the X axis projection plane (when viewed from the width direction of the image capture device 1)). This makes it possible to reduce the size of the image capture device body 2 (reduce its thickness in the Z direction).

[0042] Furthermore, the cross-sectional area of ​​the duct fins 104a in the direction of air flow is designed to be approximately the same as the cross-sectional area of ​​the cooling fan 102 in the direction of air flow. This makes it possible to arrange duct fins 104a with the surface area required to function as a heat sink and ensure the air flow rate required for heat dissipation, thereby achieving high heat dissipation performance.

[0043] [Heat dissipation structure of the imaging unit 200] Next, the heat dissipation structure of the imaging unit 200 will be described. Fig. 8 is a perspective view showing the imaging unit 200 and the front unit 400 separated. Fig. 9 is an exploded perspective view of the imaging unit 200. Fig. 10 is a perspective view showing the imaging unit 200 and the front unit 400 assembled together, mainly showing the top and back structures. Fig. 11 is a YZ cross-sectional view (a cross-sectional view on a plane perpendicular to the X-axis) of the main unit 100, imaging unit 200, and front unit 400, showing a cross section at a position including the optical axis of the imaging device 1.

[0044] In this embodiment, the imaging element 201 and imaging board 202 are integrally formed with the imaging board 202 disposed on the rear side of the imaging element 201 in the optical axis direction, and are electrically connected. Incident light from the lens barrel 3 forms an image on the imaging surface 1003 of the imaging element 201.

[0045] The imaging unit 200 and the front unit 400 are fixed between the imaging board holder 203 and the imaging unit holding member 401 via washers 1001. By changing the thickness of the washer 1001 or by stacking multiple washers 1001, it is possible to adjust the distance in the optical axis direction from the lens mount surface 1002 to the imaging surface 1003 of the imaging element 201 (so-called flange back). It is desirable that the imaging board holder 203 and the imaging unit holding member 401 be fixed at three or more points so that the tilt of the imaging surface 1003 in the optical axis direction relative to the lens mount surface 1002 can be adjusted.

[0046] The imaging board 202 and imaging board holder 203 are bonded (fixed) with an adhesive. An imaging unit electrical connection member 1010 electrically connects the imaging board 202 and the main circuit board 101. The imaging unit electrical connection member 1010 is specifically a flexible board, and is provided in two locations in the X-axis direction as shown in FIG. 10. A heat dissipation rubber 204 and a third thermally conductive sheet 205 are attached to the back surface of the structure consisting of the imaging element 201, imaging board 202, and imaging board holder 203. The third thermally conductive sheet 205 is, for example, a sheet material such as a graphite sheet with high thermal conductivity.

[0047] The third thermally conductive sheet 205 is attached across the back surfaces of the imaging board holder 203 and the heat dissipation rubber 204. The third thermally conductive sheet 205 has a plurality of heat transfer sections 1020. Of the plurality of heat transfer sections 1020, a front-side heat transfer section 1021 is connected to the imaging unit holding member 401 made of a metal such as aluminum that has high thermal conductivity. Therefore, heat generated in the imaging element 201 and imaging board 202 is transferred and diffused via the front-side heat transfer section 1021 of the third thermally conductive sheet 205 to the imaging unit holding member 401, which has a large heat capacity, thereby suppressing a temperature rise in the imaging unit 200.

[0048] Of the multiple heat transfer sections 1020 of the third thermal conduction sheet 205, the rear-side heat transfer sections 1022 are thermally connected to the duct base 104. The rear-side heat transfer sections 1022 are routed along the imaging section electrical connection member 1010 and are thermally connected to the duct base 104. The rear-side heat transfer sections 1022 are provided in two locations, one above the other (+Y side and -Y side).

[0049] An imaging element cushion member 1030, which is an elastic member, is disposed between the reinforcing plate 1013, to which the main circuit board connector 1012 is attached, and the rear-side heat transfer section 1022. The imaging element cushion member 1030 is charged (compressed) when the duct unit 120 is attached to the main unit 100, thereby urging the duct contact surface 1023 of the rear-side heat transfer section 1022 against the duct base 104. This ensures that the duct contact surface 1023 is in reliable contact with the duct base 104 without any variation in the contact state during assembly, enabling highly efficient heat dissipation.

[0050] One end of the imaging unit electrical connection member 1010 is connected to the imaging board connector 1011. The other end of the imaging unit electrical connection member 1010 is bent in an S or U shape from the imaging board connector 1011, routed to the back side of the main circuit board 101, and connected to the main circuit board connector 1012 attached to the reinforcing plate 1013. As described above, the imaging element cushion member 1030 is charged, which prevents the imaging unit electrical connection member 1010 from coming off the main circuit board connector 1012.

[0051] The heat dissipation rubber 204 is attached to the back surface of the imaging board 202 and is sandwiched between the imaging board 202 and the third thermally conductive sheet 205. In this embodiment, the heat dissipation rubber 204 is attached to two locations spaced apart in the Y direction, but the number and positions of the heat dissipation rubber 204 are not limited to this, and for example, the heat dissipation rubber 204 may be attached to two locations spaced apart in the X direction.

[0052] An imaging cooling member 206 is attached to the front surface of the imaging board holder 203. The imaging cooling member 206 is positioned so as to come into contact with the imaging unit holding member 401 when the imaging unit 200 is attached to the front unit 400, and is sandwiched between the imaging board holder 203 and the imaging unit holding member 401. The imaging cooling member 206 is, for example, a cushioning material wrapped in a graphite sheet, or highly flexible heat-dissipating rubber.

[0053] In the imaging unit 200 configured as described above, heat generated in the imaging element 201 and imaging board 202 is transferred to the third thermally conductive sheet 205 via the imaging board holder 203 and the heat-dissipating rubber 204. A portion of the heat transferred to the third thermally conductive sheet 205 is transferred to the imaging unit holding member 401 via the front-side heat transfer portion 1021 and diffused therein. A portion of the heat transferred to the third thermally conductive sheet 205 is transferred to the duct base 104 via the rear-side heat transfer portion 1022 and dissipated to the outside of the imaging device body 2 by a forced air-cooling mechanism using the cooling fan 102. By forming such a heat dissipation path, heat generated in the imaging unit 200 can be efficiently dissipated to the outside.

[0054] [Heat dissipation structure of main circuit board 101] Next, the heat dissipation structure of the main circuit board 101 will be described. Fig. 12 is an exploded perspective view of the main unit 100. Fig. 13(a) is a ZX cross-sectional view (a cross-sectional view perpendicular to the Y axis) of the main unit 100, and is represented as a cross-section including the optical axis (not shown). Fig. 13(b) is an enlarged view of area E shown in Fig. 13(a). Fig. 14 is a perspective view showing the main circuit board 101, power supply board 110, and first thermal conduction sheet 107 assembled together.

[0055] The main circuit board 101 is mounted with a main heat source element 1060 that consumes a lot of power, such as a video engine or volatile memory. Note that in FIG. 12 , multiple main heat source elements 1060 are indicated by ellipses. A power supply board 110 and a duct unit 120 are arranged substantially parallel to the main circuit board 101 on the optical axis projection plane of the main heat source element 1060. In the imaging device 1, the power supply board 110 is arranged between the duct base 104 and the main heat source element 1060 in the optical axis direction, and therefore a configuration is required to transfer heat generated on the main circuit board 101 to the duct base 104 while avoiding the power supply board 110. Meanwhile, the power supply board 110 also consumes a lot of power because it is equipped with electronic and electrical components that control the power supply for operating each function of the imaging device 1, and therefore requires heat dissipation.

[0056] Therefore, first heat conduction sheet 107, main heat source element cushion member 1050, and heat dissipation rubber 1040 are used to transfer heat from main heat source element 1060 on main circuit board 101 and power supply board 110 to duct base 104, and dissipate the heat from duct base 104. Details of this heat dissipation structure will be described below.

[0057] A main heat source element cushion member 1050 is attached to the front (+Z side) of power supply board plate 111 that holds power supply board 110, and a first thermally conductive sheet 107 is attached further in front of that. When power supply board 110 is assembled to main circuit board 101 in this state, main heat source element cushion member 1050 is charged and first thermally conductive sheet 107 comes into contact with main heat source element 1060 on main circuit board 101. A heat dissipation rubber 1040 is attached to the rear (-Z side) of power supply board 110. Furthermore, a duct-side contact surface 1070 of first thermally conductive sheet 107 is attached to the rear (-Z side) of heat dissipation rubber 1040. Here, it is desirable to use a material with appropriate elasticity for heat dissipation rubber 1040. This allows the heat dissipation rubber 1040 to be charged when the duct unit 120 is assembled to the main unit 100, and the duct side contact surface 1070 of the first thermally conductive sheet 107 to be reliably contacted with the duct base 104.

[0058] Here, the main heat source element cushion member 1050 has thermal insulation properties. Therefore, it is possible to suppress the transfer of heat generated by the main heat source element 1060 to the power supply board 110 (power supply board plate 111), while transferring heat generated by the main circuit board 101 to the duct base 104 through the first thermally conductive sheet 107. On the other hand, the heat-dissipating rubber 1040 is a member having thermal conductivity. Therefore, it is possible to transfer heat generated by the power supply board 110 to the duct base 104 through the heat-dissipating rubber 1040 and the duct-side abutment surface 1070 of the first thermally conductive sheet 107. The heat transferred to the duct base 104 in this manner is dissipated to the outside of the image capture device body 2 by a forced air-cooling mechanism using the cooling fan 102.

[0059] In this embodiment, the duct-side contact surface 1070 is routed from the outside of two opposing sides (specifically, left and right (±X sides)) of the power supply board 110 to the rear (-Z side) of the heat dissipation rubber 1040. However, the configuration is not limited to this, and the duct-side contact surface 1070 may be routed from the outside of only one side of the power supply board 110, or from the outside of the other two opposing sides, that is, top and bottom (±Y sides).

[0060] However, to improve heat dissipation performance, it is desirable to route the duct-side contact surface 1070 from both sides in the X direction (or Y direction) as in this embodiment. In this case, the duct-side contact surfaces 1070 pulled out from the ±X sides are attached to the heat-dissipating rubber 1040 by a distance d shown in FIG. 14 so as not to overlap in the optical axis direction (Z direction). Here, the duct-side contact surface 1070 has a tapered shape from the base portion attached to the heat-dissipating rubber 1040 to the tip, but this is not limited to this. This prevents uneven contact between the duct-side contact surface 1070 and the duct base 104 and increases the amount of heat transport by the first thermal conduction sheet 107 from the main heat source element 1060 to the duct base 104 to nearly the upper limit of this configuration, thereby improving heat dissipation performance.

[0061] [Heat dissipation structure from recording media] Next, we will explain the heat dissipation structure from the recording media housed in the imaging device 1. The imaging device 1 is capable of recording and playing back various types of data using card-shaped recording media. Recording media are required to have larger recording capacities and faster transfer speeds, and as the transfer speed increases, power consumption and heat generation increase, so cooling (heat dissipation) is required to prevent performance degradation due to temperature rise.

[0062] 15 is a schematic diagram illustrating the insertion and removal of recording media 3001 into and from the imaging device 1. In a typical imaging device, the grip section is provided on the -X side, assuming that the imaging device body will be gripped with the right hand. Furthermore, due to layout considerations such as the image sensor, a recording media housing section into which recording media is inserted is often located in the grip section. The imaging device 1 is no different, with a grip section 3002 provided on the -X side of the imaging device body 2, and a first media socket 132 and a second media socket 133, which are recording media housing sections, provided in the grip section 3002. The recording media housing section is provided with an openable media cover 15, and the recording media 3001 is inserted and removed with the media cover 15 open.

[0063] 16 is a perspective view of the imaging device main body 2, showing a cross section taken along the arrow AA in FIG. 5(a), and mainly showing the rear (-Z side) portion from the main circuit board 101. The first media socket 132 is disposed offset in the X direction relative to the duct unit 120, and is mounted on the main circuit board 101. This is because the grip portion 3002 in which the recording media accommodating section is disposed has a limit to its thickness in the Z direction in order to ensure ease of gripping, and therefore it is difficult to arrange the first media socket 132 so that part of the duct unit 120 overlaps with the optical axis projection plane.

[0064] In this embodiment, the first media socket 132 and the duct unit 120 are thermally connected by the second thermally conductive sheet 108, and heat generated by the recording medium 3001 is dissipated to the duct unit 120 via the first media socket 132 and the second thermally conductive sheet 108.

[0065] 17 is a perspective view illustrating the shape and attachment position of the second thermally conductive sheet 108. The second thermally conductive sheet 108 has a first coupling portion 108a that couples to the surface of the first media socket 132 and a second coupling portion 108b that couples to the inner surface of the duct unit 120, and is attached to the dashed line portion H shown in FIG. 17. By coupling the second coupling portion 108b to the inner surface of the duct unit 120, the second coupling portion 108b comes into direct contact with the air flowing inside the duct unit 120. This allows heat transferred from the recording medium 3001 to the second thermally conductive sheet 108 to be efficiently discharged to the outside.

[0066] 18 is a top view (viewed from the +Y side) showing an enlarged view of portion G shown in FIG. 16. Second thermally conductive sheet 108 is thermally connected to rear heat sink 3007 via elastic heat sink member 3004 in the path from first joint 108a to second joint 108b. Rear heat sink 3007 is a metal plate that supports operation members such as operation buttons 3008a and 3008b and operation dial 3009 that are arranged on the rear surface of gripping portion 3002. As a result, heat generated by recording medium 3001 is transferred to rear heat sink 3007 via second thermally conductive sheet 108 and heat sink member 3004, and is then dissipated from rear heat sink 3007 to the outside.

[0067] Additionally, the second thermally conductive sheet 108 is inserted into the interior (inside the air flow path) of the duct unit 120 through an opening provided in the duct unit 120, along the path from the first joint 108a to the second joint 108b. A cushion member 3010 serving as an elastic member is disposed between the second thermally conductive sheet 108 and the duct unit 120 at this opening (the insertion point of the second thermally conductive sheet 108 into the duct unit 120). The cushion member 3010 is compressed to close the opening and press a portion of the second thermally conductive sheet 108 against the duct base 104 of the duct unit 120. This maintains the airtightness of the air flow path of the duct unit 120, ensuring reliable heat dissipation.

[0068] In the above explanation, a heat dissipation structure for dissipating heat from a recording medium is applied to one media socket (first media socket 132), but an equivalent heat dissipation structure may also be applied to the second media socket 133. Also, a heat dissipation structure may be provided in both the first media socket 132 and the second media socket 133. The second thermally conductive sheet 108 may not be directly attached to the first media socket 132, but may be attached to the surface of the main circuit board 101 on which the first media socket 132 is mounted, opposite the mounting surface of the first media socket 132. Also, the board on which the media socket is mounted is not limited to the main circuit board 101, and may be a dedicated board (media board).

[0069] [About the intake vent 18 and exhaust vent 14] 5(b), in the imaging device 1, the cooling fan 102 takes in external air through the air intake 18, passes the air through the internal duct unit 120, and then discharges the air through the air exhaust 14. At this time, in order for the duct unit 120 to exhibit its heat dissipation performance, it is necessary to ensure a sufficient amount of air to pass through the duct unit 120, and to achieve this, both the air intake 18 and the air exhaust 14 need to have a necessary and sufficient opening amount (opening area).

[0070] However, simply increasing the opening size of each of intake port 18 and exhaust port 14 on one exterior surface would make it difficult to achieve the miniaturization of imaging device 1 that is an object of the present invention, and there is also the risk of impairing the appearance (beauty). Therefore, the opening of intake port 18 is formed across two surfaces. This makes it possible to ensure an equivalent opening size compared to when the same opening size is ensured on one surface, and also improves the design by reducing the opening size visible when a user faces the opening surface.

[0071] Specifically, as shown in Fig. 18, air intake 18 is provided on first surface 3013 and second surface 3014 that are not parallel to each other. Air intake duct cover 3011, which forms a flow path for air taken in through air intake 18, has first space 3016 extending in a direction perpendicular to first surface 3013 and second space 3017 extending in a direction perpendicular to second surface 3014. As shown in Fig. 18, first space 3016 and second space 3017 are formed so as not to overlap on the Y-axis projection plane. This ensures a sufficient opening size for air intake 18 while maintaining a structure in which the width of the flow path is not narrowed relative to the opening size.

[0072] Furthermore, intake duct cover 3011 is formed to have third space 3018 that is perpendicular to third surface 3015 extending on second surface 3014 and includes a region that does not overlap with second space 3017. As a result, the flow path formed by intake duct cover 3011 is shaped to be recessed inside imaging device 1, and second thermally conductive sheet 108 is coupled to duct unit 120 in third space 3018.

[0073] On the other hand, since the flow path is recessed, the range of the inside of the duct unit 120 that can be seen from the opening surface of the intake port 18 becomes wider. Since the inner wall surface of the duct unit 120 is not subjected to exterior treatment such as painting, the fact that the inside of the duct unit 120 can be seen from a wide range may degrade the quality of the imaging device 1.

[0074] To address this problem, in this embodiment, as shown by the arrows in Figure 16, air intake louvers 3012 provided on air intake duct cover 3011 extend in a direction perpendicular to the opening surface of air intake 18, making it difficult to see the inside of duct unit 120 from the opening surface. The extension direction of air intake louvers 3012 is parallel to first space 3016, second space 3017, and third space 3018. Therefore, even if air intake louvers 3012 are extended, they do not interfere with the flow of air flowing into duct unit 120, and therefore do not reduce heat dissipation performance. Note that the configuration of the two-sided opening of air intake 18 and air intake louvers 3012 described above can also be applied to exhaust outlet 14.

[0075] Regarding the relationship between the operation dial 3009 arranged on the back surface of the imaging device body 2 and the air intake 18, if the operation dial 3009 is arranged near the opening surface of the air intake 18, there is a risk that the fingers operating the operation dial 3009 will block the air intake 18. To avoid this problem, the operation dial 3009 protrudes further to the -Z side than the exterior surface, and is arranged so that the rotation axis 3009a of the operation dial is approximately parallel to the first surface 3013 and is closer to the second surface 3014 than the first surface 3013. This makes it possible to make it less likely that the air intake 18 will be blocked by the fingers operating the operation dial 3009.

[0076] Next, the configuration of the exhaust port 14 and its vicinity will be described. Fig. 19(a) is a perspective view of the imaging device 1, mainly showing the configuration of the right side surface and bottom surface (lower surface). Fig. 19(b) is a bottom view of the imaging device 1. Fig. 20 is a bottom view showing a state in which the imaging device 1 is placed so that the right side surface of the imaging device 1 is in contact with the upper surface of a table or the like.

[0077] The right side cover of the imaging device main body 2 has a first side surface 5000, a second side surface 5001, and a third side surface 5002. The first side surface 5000 is substantially orthogonal to the X-axis. The second side surface 5001 is continuous from the first side surface 5000 and has an inclined surface portion that forms a predetermined angle with the surface orthogonal to the X-axis. The third side surface 5002 is continuous from the second side surface 5001 and is substantially parallel to the first side surface 5000.

[0078] In the X direction, the distance h1 from the optical axis to the first side surface 5000 is different from the distance h2 from the optical axis to the third side surface 5002 (h1≠h2). In the imaging device main body 2, the relationship is h1 < h2. The exhaust port 14 for discharging the heat inside the imaging device main body 2 to the outside is provided on the second side surface 5001. Therefore, as shown in FIG. 20, even when the right side surface of the imaging device 1 is placed in contact with the placement surface, the exhaust port 14 is not blocked by the placement surface. Thus, the heat inside the imaging device 1 can be reliably released to the outside.

[0079] FIG. 21 is a side view of the imaging device 1. FIG. 22(a) is a cross-sectional view taken along the arrow J-J shown in FIG. 21, and FIG. 22(b) is a cross-sectional view taken along the arrow K-K shown in FIG. 21. As shown in FIG. 22(b), the cooling fan 102 is arranged close to the exhaust port 14, whereby the heat inside the imaging device 1 can be efficiently released from the exhaust port 14 by the cooling fan 102 to the outside.

[0080] Also, as shown in FIGS. 21 and 22(a), the exhaust port 14 has a plurality of lattice-shaped exhaust port louver portions 14a. The exhaust port louver portion 14a is inclined obliquely downward from the inside of the imaging device 1 toward the outside. As a result, it is difficult to see the inside of the exhaust port 14 when looking at the exhaust port 14. That is, by making it difficult to see the cooling fan 102 arranged in the vicinity of the exhaust port 14 from the outside, the deterioration of quality can be prevented or the quality can be improved.

[0081] 22(b), the second side surface 5001 on which the exhaust port 14 is disposed is inclined with respect to a plane perpendicular to the X-axis. This makes it even more difficult to see the inside of the exhaust port 14 when viewing the exhaust port 14 from the right side surface (+X side) of the imaging device 1, thereby preventing a decrease in quality or improving quality. Furthermore, as shown in FIG. 22(a), the exhaust direction 5005 of the cooling fan 102 is approximately parallel to the inclination of the exhaust port louver portion 14a. This allows the air flowing through the duct unit 120 to be smoothly exhausted from the exhaust port 14 (reducing pressure loss), thereby enabling efficient heat dissipation from the inside of the imaging device 1 to the outside air. The structure of the opening of the exhaust port 14 is not limited to an opening for exhaust, but can also be applied to an opening for intake.

[0082] [Positional relationship between external connection terminal group 131 and exhaust port 14] Next, we will explain the arrangement of connection terminals in the imaging device 1. Fig. 23(a) is a side view of the imaging device main body 2, showing a state in which the external terminal cover 13 that protects the external connection terminal group 131 has been removed. Fig. 23(b) is a side view of the imaging device 1, showing a state in which the external terminal cover 13 has been attached.

[0083] An exhaust port 14 is provided on the right side surface of the imaging device main body 2. Further, near the exhaust port 14, connection terminals 7000a and 7000b are arranged as an external connection terminal group 131 that enables input and output of data, power, and the like to the imaging device 1 by connecting a connector cable or the like.

[0084] On the right side surface of the imaging device body 2, five connection terminals 7000a are arranged in front of the exhaust port 14 (+Z side), and another connection terminal 7000b is arranged above the exhaust port 14 (+Y side). When a predetermined connector cable is inserted into each of the connection terminals 7000a or 7000b, the cable housing portion of the connector cable protrudes toward the +X side of the imaging device body 2.

[0085] An external terminal cover 13 is provided as a cover member for protecting the connection terminals 7000a, 7000b when the connection terminals 7000a, 7000b are not in use. When covering the connection terminals 7000a, 7000b, the external terminal cover 13 is held in a shape that is aligned with the right side surface of the imaging device main body 2. When using a desired connection terminal out of the connection terminals 7000a, 7000b, it is necessary to open the corresponding external terminal cover 13. The external terminal cover 13 is positioned so that it can be moved in a direction away from the imaging device main body 2 by hooking a finger or the like on the end and pushing it up.

[0086] [Relationship between the external connection terminal group 131, the external terminal cover 13 and the display panel 16] A display panel 16 is disposed on the rear side of the imaging device body 2 via a two-axis variable angle hinge mechanism so as to be rotatable in the opening / closing direction and in the tilt / flipping direction. That is, the display panel 16 is rotatable in the opening / closing direction about an axis (first rotation axis) parallel to the Y axis between a closed position located on the rear side of the imaging device body 2 and an open position protruding to the +X side of the imaging device body 2. The display panel 16 is also rotatable in the tilt / flipping direction about an axis (second rotation axis) perpendicular to the Y axis.

[0087] FIG. 24 is a right side view of the imaging device main body 2, showing a state in which the display panel 16 is opened approximately 180 degrees in the opening / closing direction (a state in which the display panel 16 protrudes toward the front side of the paper (open state)). ) 7. When the display panel 16 is rotated in the tilt / flipping direction in the open state, the display panel 16 can rotate within the range of a rotation locus 7002. The rotation locus 7002 is close to the first side surface 5000 on which the connection terminal 7000a is arranged, but the rotation locus 7002 does not overlap with the connection terminals 7000a and 7000b on the X-axis projection plane. Therefore, even when cables are connected to the connection terminals 7000a and 7000b, the rotation of the display panel 16 in the tilt / flipping direction is not hindered by the cables.

[0088] On the other hand, there is an overlapping portion 7002x where the external terminal cover 13 and the rotation trajectory 7002 partially overlap on the X-axis projection plane. The effect of the overlapping portion 7002x on the operability of the external terminal cover 13 will be described with reference to FIG. 25. FIG. 25 is a diagram showing the image capture device body 2 viewed from the bottom side toward the right side surface thereof, with the display panel 16 opened approximately 180 degrees in the opening / closing direction and rotated approximately 90 degrees in the tilt / flipping direction. In this state, the display screen of the display panel 16 faces the +Y direction.

[0089] As described above, the side unit 800 is formed with three surfaces (the first side surface 5000, the second side surface 5001, and the third side surface 5002). The external terminal cover 13, which corresponds to the first side surface 5000, is located on the -X side of the hinge surface of the display panel 16, which corresponds to the third side surface 5002, and therefore a gap 7003 is formed between the display panel 16 and the external terminal cover 13. Therefore, even if there is an overlapping portion 7002x where the display panel 16 overlaps with the external terminal cover 13 on the X-axis projection plane, the user can insert their finger into the gap 7003 and pull up the external terminal cover 13, thereby easily opening the external terminal cover 13.

[0090] [Heat dissipation structure of electronic viewfinder 17] Next, the heat dissipation structure of the electronic viewfinder 17 will be described. Fig. 26 is an exploded perspective view of the top unit 500. The electronic viewfinder 17 is made up of a finder panel 7005 that displays an image, and an optical component 7004 that magnifies the image on the finder panel 7005. The electronic viewfinder 17 is fixed by screws to a finder cover 7007 that covers the top and sides of the electronic viewfinder 17. A flexible substrate 7006 connected to the finder panel 7005 is connected to the main circuit board 101 (not shown in Fig. 26), and an image signal is sent from the main circuit board 101 to the finder panel 7005. When the electronic viewfinder 17 is in use, the finder panel 7005 generates heat, so a heat dissipation structure is required to ensure stable image display on the finder panel 7005.

[0091] Fig. 27 is a top view of the imaging device, Fig. 28(a) is a cross-sectional view taken along the arrow VV in Fig. 27, and Fig. 28(b) is a cross-sectional view taken along the arrow WW in Fig. 27.

[0092] The viewfinder cover 7007 has a heat dissipation wall 7009. When the viewfinder cover 7007 is attached, the heat dissipation wall 7009 is disposed approximately parallel to the rear surface (+Z side surface) of the viewfinder panel 7005, in other words, approximately perpendicular to the top surface. The viewfinder cover 7007 is formed of a metal such as magnesium that has high thermal conductivity, is lightweight, and has high rigidity. In addition, a heat dissipation rubber 7008 is attached to the rear surface (-Z side surface) of the viewfinder panel 7005. The surface of the heat dissipation rubber 7008 opposite to the surface that abuts against the rear surface of the viewfinder panel 7005 abuts against the heat dissipation wall 7009. In other words, the heat dissipation rubber 7008 is sandwiched between the heat dissipation wall 7009 and the viewfinder panel 7005.

[0093] Furthermore, an accessory shoe 12 is disposed in the center of the viewfinder cover 7007. The periphery of the accessory shoe 12 is covered with a shoe cover 7011 that is separate from the viewfinder cover 7007. The shoe cover 7011 is made of a material with low thermal conductivity, such as resin.

[0094] As shown in Fig. 28(b), the shoe cover 7011 covers the base (the portion on the +Y side) of the heat dissipation wall 7009. Heat generated in the finder panel 7005 is conducted from the lower portion (the portion on the -Y side) of the heat dissipation wall 7009 to the base portion along the arrows shown on the heat dissipation wall 7009 in Fig. 28(a). The heat conducted to the base of the heat dissipation wall 7009 is conducted into the main body along the arrows shown on the heat dissipation wall 7009 in Fig. 28(b) and is released to the outside via the duct base 104, etc.

[0095] In this way, by using a viewfinder cover 7007 made of metal with high thermal conductivity as a heat-conducting member for transferring heat generated in the viewfinder panel 7005, it is possible to reduce the number of parts and achieve cost reductions. In addition, the vicinity of the base of the viewfinder cover 7007 is covered with a shoe cover 7011 made of resin with low thermal conductivity, so the user does not directly come into contact with the heat dissipation path, ensuring safety. Furthermore, when the user uses the electronic viewfinder 17, the user's pupil 7012 looking into the electronic viewfinder 17 is positioned as shown in FIG. 28( a). The user's pupil 7012 is positioned in the opposite direction in the Z direction from the heat dissipation wall 7009, with the electronic viewfinder 17 between them, so the pupil 7012 is not subjected to thermal stimulation.

[0096] As explained above, the imaging device 1 according to this embodiment can efficiently dissipate heat generated inside the imaging device body 2 to the outside, and can also achieve a compact imaging device body 2.

[0097] While the present invention has been described in detail above based on preferred embodiments thereof, the present invention is not limited to these specific embodiments, and various forms within the scope of the gist of the present invention are also included in the present invention. Furthermore, each of the above-described embodiments merely represents one embodiment of the present invention, and each embodiment can be combined as appropriate. [Explanation of symbols]

[0098] 1. Imaging device 2. Imaging device body 12 Accessory shoe 13 External terminal cover 14 Exhaust port 16 Display panel 17 Electronic viewfinder 18 Air intake 101 Main circuit board 102 Cooling fan 104 Duct base 105 Duct Plate 107 First thermal conductive sheet 108 Second thermal conductive sheet 110 Power supply board 120 Duct unit 131 External connection terminals 202 Imaging board 205 Third thermal conductive sheet 401 Imaging unit holding member 1021 Front heat transfer section 1022 Rear heat transfer section 1030 Image sensor cushion member 7005 Finder Panel 7007 Viewfinder Cover 7008 Heat dissipation rubber 7009 Heat dissipation wall 7011 Shoe Cover

Claims

1. an imaging board on which an imaging element is mounted; a main circuit board on which a heat generating element is mounted and which is disposed on the rear surface side of the imaging board and substantially parallel to the imaging surface of the imaging element; a duct unit disposed on the rear side of the main circuit board; a cooling fan that takes in outside air into the duct unit; a rear cover disposed on a rear side of the cooling fan, The duct unit includes: a duct base disposed opposite to the main circuit board and substantially parallel to the main circuit board; a duct plate disposed so as to be inclined at a predetermined angle with respect to the duct base, the rear cover is substantially parallel to the duct base, the cooling fan is attached to the duct plate; an imaging device, wherein a space having a substantially triangular cross section as viewed from above the imaging device is formed between the cooling fan and the rear cover;

2. a display device disposed on a rear surface of the imaging device; the rear cover includes an electrical connection portion connected to the display device; The imaging device according to claim 1 , wherein the electrical connection portion is disposed in the space.

3. The duct unit includes a plurality of duct fins extending along the flow direction of air flowing inside the duct unit, 3. The imaging device according to claim 1, wherein the duct fin is provided at a position that does not overlap with the cooling fan on a projection surface from above the imaging device, but overlaps with the cooling fan on a projection surface from the width direction of the imaging device.

4. an imaging board on which an imaging element is mounted; a main circuit board on which a heat generating element is mounted and which is disposed on the rear surface side of the imaging board and substantially parallel to the imaging surface of the imaging element; a duct unit disposed on the rear side of the main circuit board; a cooling fan that takes in outside air into the duct unit, The duct unit includes: a duct base disposed opposite to the main circuit board and substantially parallel to the main circuit board; a duct plate disposed so as to be inclined at a predetermined angle with respect to the duct base; a plurality of duct fins extending along the flow direction of air flowing inside the duct unit, the cooling fan is attached to the duct plate; An imaging device characterized in that the duct fin is located in a position that does not overlap with the cooling fan on a projection surface from above the imaging device, but overlaps with the cooling fan on a projection surface from the width direction of the imaging device.

Images