Chip-type coil components

Abstract

To provide a chip type coil component having a directional property mark, capable of suppressing a volume reduction of a magnetic element assembly.SOLUTION: A chip type coil component 1 comprises: a magnetic element M; a coil pattern C embedded into the magnetic element M; and terminal electrodes E1 and E2 that are connected to the coil pattern C, and are exposed to a mounting surface S2 of the magnetic element M. On an upper surface S1 positioned on the side opposite to the mounting surface S2 of the magnetic element M, a directional property mark formed by a concave part 60 in which one part of the magnetic element M is removed is formed. Thus, since the concave part 60 formed in the magnetic element M functions as the directional property mark, a volume reduction of the magnetic element M by the directional property mark can be suppressed to the minimum.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a chip-type coil component, and more particularly to a chip-type coil component having a structure in which a coil pattern is embedded in a magnetic base body. [Background technology]

[0002] Patent Document 1 discloses a chip-type coil component with an orientation mark printed on the top surface of the element body. By providing an orientation mark on the top surface of the element body, the orientation of the chip-type coil component can be correctly identified during mounting. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2020-164380 Summary of the Invention [Problem to be solved by the invention]

[0004] However, printing a directionality mark on the top surface of the element body increases the height of the chip-type coil component by the thickness of the directionality mark. To prevent this increase in height, the height of the element body can be reduced by the thickness of the directionality mark, but if a magnetic material is used as the element body material, this reduces the volume of the magnetic element body, which leads to a problem of reduced magnetic properties.

[0005] Therefore, an object of the present invention is to suppress a decrease in the volume of the magnetic body in a chip-type coil component having a directionality mark. [Means for solving the problem]

[0006] The chip-type coil component according to the present invention comprises a magnetic base body, a coil pattern embedded in the magnetic base body, and a terminal electrode connected to the coil pattern and exposed on the mounting surface of the magnetic base body, and is characterized in that a directional mark consisting of a recess formed by removing a portion of the magnetic base body is formed on the upper surface of the magnetic base body opposite the mounting surface.

[0007] According to the present invention, the recesses formed in the magnetic body function as orientation marks, so that it is possible to minimize the reduction in the volume of the magnetic body due to the orientation marks.

[0008] The chip-type coil component according to the present invention may further include a metal film embedded in the magnetic body and positioned between the recess and the coil pattern, whereby the metal film functions as a stopper when the recess is formed by laser processing, making it easy to adjust the depth of the recess.

[0009] In the present invention, the recess may be filled with a filling material that has a contrast different from that of the upper surface of the magnetic body, thereby making it possible to improve the visibility of the orientation mark.

[0010] In the present invention, the magnetic element body includes a main body portion in which the coil pattern is embedded and a surface layer portion that forms the upper surface and has a different contrast from the main body portion, and the recess may be provided through the surface layer portion. This makes it possible to improve the visibility of the orientation mark. In this case, the average particle size of the magnetic filler contained in the surface layer portion may be smaller than the average particle size of the magnetic filler contained in the main body portion. This makes it possible to achieve high processability while maintaining the magnetic properties of the magnetic element body.

[0011] In the present invention, the surface roughness of the bottom surface of the recess may be different from the surface roughness of the top surface of the magnetic body, which makes it possible to improve the visibility of the orientation mark. [Effects of the Invention]

[0012] Thus, according to the present invention, it is possible to suppress a decrease in the volume of the magnetic body in a chip-type coil component having a directionality mark. [Brief explanation of the drawings]

[0013] [Figure 1] 1(a) and 1(b) are a schematic cross-sectional view and a top view, respectively, of a chip-type coil component 1 according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a schematic enlarged view of the recess 60. As shown in FIG. [Figure 3] FIG. 3 is a schematic cross-sectional view of a chip-type coil component 2 according to a second embodiment of the present invention. [Figure 4] FIG. 4 is a schematic cross-sectional view of a chip-type coil component 3 according to a third embodiment of the present invention. [Figure 5] FIG. 5 is a schematic cross-sectional view of a chip-type coil component 4 according to a fourth embodiment of the present invention. [Figure 6] FIG. 6 is a schematic cross-sectional view of a chip-type coil component 5 according to a fifth embodiment of the present invention. [Figure 7] FIG. 7 is a schematic cross-sectional view of a chip-type coil component 6 according to a sixth embodiment of the present invention. [Figure 8] FIG. 8 is a schematic cross-sectional view of a chip-type coil component 7 according to a seventh embodiment of the present invention. [Figure 9] FIG. 9 is a schematic cross-sectional view of a chip-type coil component 8 according to an eighth embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0015] First Embodiment 1(a) and 1(b) are a schematic cross-sectional view and a top view, respectively, of a chip-type coil component 1 according to a first embodiment of the present invention.

[0016] 1, the chip-type coil component 1 according to the first embodiment has a structure in which a coil pattern C is embedded in a magnetic body M. The magnetic body M has a top surface S1 and a mounting surface S2 that are perpendicular to the coil axis and located on opposite sides. Terminal electrodes E1 and E2 are exposed on the mounting surface S2, and during mounting, the terminal electrodes E1 and E2 are soldered to the circuit board so that the mounting surface S2 faces the circuit board.

[0017] The coil pattern C is made up of interlayer insulating films 50-54 and conductor layers L1-L4 alternately stacked in the coil axis direction. The coil pattern C is embedded in a magnetic body M. The magnetic body M has a portion covering the coil pattern C from both sides in the coil axis direction, a portion provided in the inner diameter region of the coil pattern C, and a portion provided in the outer region of the coil pattern C. Bump electrodes B1 and B2 are also embedded in the magnetic body M. The bump electrodes B1 and B2 connect one end and the other end of the coil pattern C to terminal electrodes E1 and E2, respectively.

[0018] The conductor layers L1 to L4 have spiral patterns 10, 20, 30, and 40, respectively. The spiral patterns 10, 20, 30, and 40 are connected in series to form one coil pattern C. The conductor layers L2 to L4 further have connection patterns 21, 31, and 41, respectively, and a bump electrode B1 is connected to the outer peripheral end of the spiral pattern 10 via the connection patterns 41, 31, and 21. The inner peripheral end of the spiral pattern 10 is connected to the inner peripheral end of the spiral pattern 20, the outer peripheral end of the spiral pattern 20 is connected to the outer peripheral end of the spiral pattern 30, the inner peripheral end of the spiral pattern 30 is connected to the inner peripheral end of the spiral pattern 40, and the outer peripheral end of the spiral pattern 40 is connected to the bump electrode B2. As a result, the spiral patterns 10, 20, 30, and 40 are connected in series between the terminal electrodes E1 and E2.

[0019] The magnetic body M is made of a composite magnetic member containing a metal magnetic filler made of iron (Fe) or a permalloy-based material and a resin binder, and forms a magnetic path for the magnetic flux generated by passing a current through the coil pattern C. As the resin binder, it is preferable to use a liquid or powdered epoxy resin.

[0020] The chip-type coil component 1 according to this embodiment has a recess 60 formed by removing a portion of the magnetic body M on the top surface S1 of the magnetic body M. The recess 60 is located at a position overlapping the coil pattern C when viewed from the stacking direction. The recess 60 functions as a directionality mark, serving as a mark for identifying the orientation of the chip-type coil component 1 during mounting. In this manner, in this embodiment, the recess 60 functions as a directionality mark, and unlike conventional chip-type coil components in which a directionality mark is printed, the height of the chip-type coil component 1 does not increase by the thickness of the directionality mark. Furthermore, since there is no need to reduce the height of the magnetic body M by the thickness of the directionality mark, it is possible to ensure a sufficient volume of the magnetic body M. Furthermore, because the flatness of the top surface S1 is maintained, the position of the chip-type coil component 1 can be stabilized even when the chip-type coil component 1 is transported with the top surface S1 facing downward.

[0021] The method for forming the recesses 60 is not particularly limited, and the recesses 60 may be formed by laser processing or drilling, or by providing a protrusion on a mold used to form the magnetic body M. When the recesses 60 are formed by laser processing or drilling, the metal magnetic filler exposed on the surface of the magnetic body M can be removed by etching after the recesses 60 are formed, and then the terminal electrodes E1, E2 can be formed.

[0022] Furthermore, when forming the recess 60 by laser processing, the laser processing conditions may be set so that the surface roughness of the bottom surface S3 of the recess 60 is greater than the surface roughness of the top surface S1, as shown in FIG. 2 . This increases the contrast between the top surface S1 and the bottom surface S3, thereby improving visibility. Conversely, the surface roughness of the bottom surface S3 of the recess 60 may be smaller than the surface roughness of the top surface S1. Even in this case, high contrast can be obtained. The depth D of the recess 60, i.e., the difference in height between the top surface S1 and the bottom surface S3, is preferably set as small as possible within a range that ensures sufficient visibility and ensures sufficient volume of the magnetic body M. Furthermore, the bottom surface S3 of the recess 60 does not need to be flat; for example, it may have a curved shape in which the depth D increases toward the center.

[0023] <Second embodiment> FIG. 3 is a schematic cross-sectional view of a chip-type coil component 2 according to a second embodiment of the present invention.

[0024] 3, the chip-type coil component 2 according to the second embodiment differs from the chip-type coil component 1 according to the first embodiment in that a metal film 61 is embedded in a magnetic base body M. Since the other basic configurations are the same as those of the chip-type coil component 1 according to the first embodiment, the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0025] The metal film 61 is embedded in a surface layer portion of the magnetic body M near the upper surface S1, and functions as a stopper when the recess 60 is formed by laser processing. This makes it easy to adjust the depth of the recess 60, since the depth D of the recess 60 is determined by the depth of the metal film 61. In this embodiment, the metal film 61 may be exposed at the bottom surface of the recess 60. This increases the contrast between the recess 60 and the upper surface S1, thereby improving visibility.

[0026] <Third embodiment> FIG. 4 is a schematic cross-sectional view of a chip-type coil component 3 according to a third embodiment of the present invention.

[0027] 4, the chip-type coil component 3 according to the third embodiment differs from the chip-type coil component 2 according to the second embodiment in that the metal film 61 is provided only on the bottom surface of the recess 60 and its periphery. As the other basic configurations are the same as those of the chip-type coil component 2 according to the second embodiment, the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0028] According to this embodiment, the metal film 61 is provided only on the bottom surface of the recess 60 and its periphery, so that the magnetic flux generated by passing a current through the coil pattern C is less likely to be obstructed by the metal film 61. In particular, by removing the metal film 61 at a position that overlaps the inner diameter region of the coil pattern C when viewed from the coil axis direction, it is possible to significantly reduce eddy current loss due to the metal film 61.

[0029] <Fourth embodiment> FIG. 5 is a schematic cross-sectional view of a chip-type coil component 4 according to a fourth embodiment of the present invention.

[0030] 5, the chip-type coil component 4 according to the fourth embodiment differs from the chip-type coil component 1 according to the first embodiment in that the recess 60 is filled with a filling member 62. As the other basic configurations are the same as those of the chip-type coil component 1 according to the first embodiment, the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0031] The embedding member 62 is made of a material with a contrast different from that of the top surface S1 of the magnetic body M, and serves to enhance the visibility of the orientation mark. The material of the embedding member 62 is not particularly limited, and may be a non-magnetic material such as a colored resin, a metal material, or a magnetic material such as ferrite or permalloy. If a colored resin is used as the material of the embedding member 62, the orientation mark can be any color. Furthermore, if a metal material is used as the material of the embedding member 62, high contrast can be achieved due to the difference in reflectivity between the top surface S1 of the magnetic body M and the embedding member 62. Furthermore, if a magnetic material is used as the material of the embedding member 62, the reduction in volume of the magnetic body M due to the recess 60 is compensated for, thereby increasing the inductance of the product.

[0032] <Fifth embodiment> FIG. 6 is a schematic cross-sectional view of a chip-type coil component 5 according to a fifth embodiment of the present invention.

[0033] 6, the chip-type coil component 5 according to the fifth embodiment differs from the chip-type coil component 1 according to the first embodiment in that the magnetic body M is composed of a main body portion M1 and a surface layer portion M2, and a recess 60 is provided penetrating the surface layer portion M2. As the other basic configurations are the same as those of the chip-type coil component 1 according to the first embodiment, the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0034] The main body portion M1 and surface layer portion M2 of the magnetic element M are both made of a composite magnetic material containing a metal magnetic filler made of iron (Fe) or a permalloy-based material and a resin binder. Here, the main body portion M1 is the portion in which the coil pattern C is embedded. The surface layer portion M2 constitutes the upper surface S1 of the magnetic element M and has a contrast different from that of the main body portion M1. One method for differentiating the contrast between the main body portion M1 and the surface layer portion M2 is to make the average particle size of the magnetic filler contained in the main body portion M1 different from that of the magnetic filler contained in the surface layer portion M2. In particular, if the average particle size of the magnetic filler contained in the surface layer portion M2 is made smaller than that of the magnetic filler contained in the main body portion M1, the magnetic properties of the main body portion M1 are improved by the magnetic filler with a larger particle size, and the laser processing of the surface layer portion M2 is facilitated by the magnetic filler with a smaller particle size.

[0035] In this embodiment, the recess 60 is provided so as to penetrate the surface layer M2, and therefore the main body M1 is exposed at the bottom surface of the recess 60. This results in a large difference in contrast between the upper surface S1 of the magnetic body M and the recess 60, making it possible to use the recess 60 as a directionality mark. Furthermore, instead of a composite magnetic member, a magnetic material such as ferrite or permalloy may be used as the material for the surface layer M2.

[0036] Sixth Embodiment FIG. 7 is a schematic cross-sectional view of a chip-type coil component 6 according to a sixth embodiment of the present invention.

[0037] 7, the chip-type coil component 6 according to the sixth embodiment differs from the chip-type coil component 5 according to the fifth embodiment in that a metal film 61 is embedded in a magnetic base body M. As the other basic configurations are the same as those of the chip-type coil component 5 according to the fifth embodiment, the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0038] The metal film 61 is provided between the main body portion M1 and the surface layer portion M2. As a result, when the recess 60 is formed by laser processing the surface layer portion M2, the metal film 61 functions as a stopper, making it easy to adjust the depth of the recess 60.

[0039] Seventh Embodiment FIG. 8 is a schematic cross-sectional view of a chip-type coil component 7 according to a seventh embodiment of the present invention.

[0040] 8, the chip-type coil component 7 according to the seventh embodiment differs from the chip-type coil component 5 according to the fifth embodiment in that the recess 60 reaches the main body portion M1. As the other basic configurations are the same as those of the chip-type coil component 5 according to the fifth embodiment, the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0041] In this embodiment, the recess 60 penetrates the surface layer portion M2, and a portion of the main body portion M1 is removed by the recess 60. This ensures that the recess 60 is sufficiently deep, making it possible to obtain high contrast.

[0042] Eighth Embodiment FIG. 9 is a schematic cross-sectional view of a chip-type coil component 8 according to an eighth embodiment of the present invention.

[0043] 9, the chip-type coil component 8 according to the eighth embodiment differs from the chip-type coil component 1 according to the first embodiment in that a metal film 61 is provided on the surface of the interlayer insulating film 50 located on the upper surface S1 side of the magnetic body M. Since the other basic configurations are the same as those of the chip-type coil component 1 according to the first embodiment, the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0044] In this embodiment, the metal film 61 also functions as a stopper when the recess 60 is formed by laser processing, but the recess 60 does not reach the metal film 61. By providing such a metal film 61, the depth of the recess 60 will not become excessively large due to manufacturing variations, and as a result, damage to the coil pattern C will not occur.

[0045] The above describes a preferred embodiment of the present invention, but the present invention is not limited to the above embodiment, and various modifications are possible within the scope of the present invention, and it goes without saying that these modifications are also included within the scope of the present invention. [Explanation of symbols]

[0046] 1~8 Chip type coil parts 10, 20, 30, 40 spiral pattern 21,31,41 connection patterns 50~54 Interlayer insulating film 60 recess 61 Metal Film 62 Embedded parts B1, B2 bump electrodes C coil pattern E1,E2 terminal electrode L1~L4 conductor layers M magnetic element M1 Main body M2 Surface part S1 Top surface of magnetic element S2 Mounting surface of magnetic element S3 Bottom of recess

Claims

1. A magnetic element; a coil pattern and a metal film embedded in the magnetic body; a terminal electrode connected to the coil pattern and exposed on a mounting surface of the magnetic base body, a direction mark formed by a recess formed by removing a part of the magnetic body is formed on an upper surface of the magnetic body opposite to the mounting surface; The chip-type coil component is characterized in that the metal film is exposed on the bottom surface of the recess.

2. the magnetic body includes a main body portion in which the coil pattern is embedded, and a surface layer portion that forms the upper surface and has a different contrast from the main body portion, 2. The chip-type coil component according to claim 1, wherein the recess is provided so as to penetrate through the surface layer.

3. 3. The chip-type coil component according to claim 2, wherein the average particle size of the magnetic filler contained in the surface layer portion is smaller than the average particle size of the magnetic filler contained in the main body portion.

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