Reed correction device

Abstract

To obtain a lead correcting apparatus capable of correcting a lead with high accuracy.SOLUTION: A lead correcting apparatus according to the present disclosure includes: a first lead holding part; and a second lead holding part. At least the first lead holding part comprises: a holding part that is rotated in a rotational surface crossing a direction where a lead of an electronic component is extended, and is constructed so as to nip the lead with the first lead holding part and the second lead holding part; and a main body part that is constructed so as to move the holding part in a direction along the rotational surface in a state where the lead is nipped by the first and second lead holding parts. On a side surface stood against the rotational surface of the first lead holding part, a first concave part housing the lead is formed.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to lead straightening devices. [Background technology]

[0002] Patent Document 1 discloses an electronic component energization device that applies current to a semiconductor laser module by abutting contact probes against lead terminals of the semiconductor laser module through the contact probes. This energization device includes a module mounting section on which the semiconductor laser module is mounted, and a correction jig that is configured to be movable back and forth toward the module mounting section from different directions. The tip of the correction jig is provided with a contact probe and a plate-like protrusion that is positioned near the contact probe and protrudes forward beyond the contact probe. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-4500 Summary of the Invention [Problem to be solved by the invention]

[0004] In the current-carrying device of Patent Document 1, plate-like protrusions are inserted between the lead terminals from three different directions, which allows the lead terminals to be pushed apart in multiple directions and the spacing between the lead terminals to be properly corrected. However, this method may not be able to correct the leads accurately.

[0005] The present disclosure has been made to solve the above-mentioned problems, and an object of the present disclosure is to provide a lead correction device that can correct leads with high accuracy. [Means for solving the problem]

[0006] The lead straightening device of the present disclosure has a first lead holding portion and a second lead holding portion, wherein at least the first lead holding portion rotates within a rotational plane intersecting the direction in which the lead of an electronic component extends, and the holding portion is configured to sandwich the lead between the first lead holding portion and the second lead holding portion, and a main body portion configured to move the holding portion in a direction along the rotational plane while the lead is sandwiched between the first lead holding portion and the second lead holding portion, and a first recess in which the lead is stored is formed on a side of the first lead holding portion that is erected relative to the rotational plane. [Effects of the Invention]

[0007] In the lead straightening device according to the present disclosure, a first recess for accommodating the lead is formed on the side surface of the first lead holding portion, which allows the lead to be securely held by the holding portion and allows the lead to be straightened with precision. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a plan view of a lead correction device according to a first embodiment. [Figure 2] 1 is a plan view showing a state in which the lead correction device according to the first embodiment holds a lead. [Figure 3] 1 is an enlarged view of a lead correction device according to a first embodiment. [Figure 4] 10 is an enlarged view showing a state in which a second lead holding portion according to the first embodiment has slid. FIG. [Figure 5] FIG. 2 is a side view of the holding portion according to the first embodiment. [Figure 6] FIG. 1 is a front view of an electronic component according to a first embodiment. [Figure 7] FIG. 2 is a bottom view of the electronic component according to the first embodiment. [Figure 8] FIG. 10 is a bottom view of the electronic component according to a modified example of the first embodiment. [Figure 9] 3A and 3B are diagrams illustrating the configuration of a main body according to the first embodiment. [Figure 10]5A and 5B are diagrams illustrating a configuration for sliding a second lead holding portion according to the first embodiment. [Figure 11] 5A and 5B are diagrams illustrating a configuration for sliding a second lead holding portion according to the first embodiment. [Figure 12] FIG. 2 is a cross-sectional view showing a stem holding portion according to the first embodiment. [Figure 13] FIG. 2 is a plan view showing a stem holding portion according to the first embodiment. [Figure 14] FIG. 1 is a plan view of a lead correction device according to a first comparative example. [Figure 15] 1A and 1B are diagrams illustrating a method for correcting a lead using a lead correction device according to a first comparative example. [Figure 16] 1A and 1B are diagrams illustrating a method for correcting a lead using a lead correction device according to a first comparative example. [Figure 17] FIG. 10 is a cross-sectional view of a lead correction device according to a second comparative example. [Figure 18] FIG. 10 is a plan view of a lead correction device according to a second embodiment. [Figure 19] FIG. 10 is a plan view showing a state in which the lead correction device according to the second embodiment holds a lead. [Figure 20] 10A and 10B are diagrams illustrating the configuration of a main body according to a second embodiment. [Figure 21] 10 is a diagram illustrating the arrangement of a plurality of holding parts according to the second embodiment. FIG. [Figure 22] FIG. 1 is a diagram showing an electronic component with narrowed leads. [Figure 23] FIG. 10 is a diagram showing an electronic component with bent leads. DETAILED DESCRIPTION OF THE INVENTION

[0009] The lead straightening device according to each embodiment will be described with reference to the drawings. The same or corresponding components are designated by the same reference numerals, and repeated description may be omitted.

[0010] Embodiment 1 1 is a plan view of a lead correction device 100 according to a first embodiment. The lead correction device 100 is a device for correcting leads 52 of an electronic component 50. The lead correction device 100 includes a plurality of holding units 10 and a main body (described later) for driving the plurality of holding units 10. The main body is provided with a plurality of holding units 10, the number of which corresponds to the number of leads 52 of the electronic component 50, for example.

[0011] FIG. 2 is a plan view showing a state in which the lead correction device 100 according to the first embodiment holds a lead 52. FIG. 3 is an enlarged view of the lead correction device 100 according to the first embodiment. The holding unit 10 has a first lead holding unit 11 and a second lead holding unit 12. The first lead holding unit 11 is configured to rotate around a fulcrum and come into contact with the lead 52. The first lead holding unit 11 rotates in a plane of rotation that intersects with the direction in which the lead 52 of the electronic component 50 extends, as shown as a rotation direction r1 in FIG. 1. A first recess 13 for accommodating the lead 52 is formed on a side surface of the first lead holding unit 11 that is erected relative to the rotation plane. When the first lead holding unit 11 rotates in the rotation direction r1, the lead 52 is accommodated in the first recess 13.

[0012] As shown in Fig. 3, with the lead 52 stored in the first recess 13, the second lead holding portion 12 slides in a direction d1 along the plane of rotation of the first lead holding portion 11. Fig. 4 is an enlarged view showing the state in which the second lead holding portion 12 according to the first embodiment has slid. Fig. 5 is a side view of the holding portion 10 according to the first embodiment. As the second lead holding portion 12 slides, the lead 52 is sandwiched between the first lead holding portion 11 and the second lead holding portion 12.

[0013] The main body is configured to move the holding part 10 in direction d2 along the plane of rotation of the first lead holding part 11 while the first lead holding part 11 and the second lead holding part 12 sandwich the lead 52. As an example, as shown in FIG. 4, the main body moves the holding part 10 along the plane of rotation of the first lead holding part 11 in direction d2 away from the electronic component 50. This makes it possible to correct any narrowing of the lead 52. The direction in which the holding part 10 is moved may be changed according to the direction in which the lead 52 is to be corrected. For example, the holding part 10 may be moved so as to correct any widening of the lead 52.

[0014] The first lead holding portion 11 is, for example, a resin block made of resin. The second lead holding portion 12 is, for example, a conductive plate. The pair of first lead holding portion 11 and second lead holding portion 12 contact the lead 52, and power is supplied to the lead 52 by the conductive second lead holding portion 12. In this way, in this embodiment, power can be supplied while correcting the lead 52. In other words, the holding portion 10 in this embodiment also functions as a probe.

[0015] FIG. 6 is a front view of an electronic component 50 according to the first embodiment. FIG. 7 is a bottom view of the electronic component 50 according to the first embodiment. The electronic component 50 is, for example, an optical element. The electronic component 50 includes, for example, a stem 51 and a plurality of leads 52 extending from the stem 51. In the example of FIG. 7, the electronic component 50 includes four leads 52 arranged in a circle on the stem 51. FIG. 8 is a bottom view of an electronic component 50a according to a modified example of the first embodiment. The number of leads 52 that can be corrected by the lead correction device 100 is not limited and may be, for example, four or more pins. FIG. 8 shows an electronic component 50a with seven pins. The arrangement and number of holders 10 can be set according to the arrangement and number of leads 52 in the electronic component 50.

[0016] FIG. 9 is a diagram illustrating the configuration of the main body 30 according to the first embodiment. The main body 30 includes a drive unit 32 that moves the holder 10 in direction d2 along the rotation plane of the first lead holder 11. The main body 30 further includes a drive unit 34 that rotates the first lead holder 11 in rotation direction r1. The drive unit 32 is, for example, a motor or an air cylinder. The drive unit 34 is, for example, a motor. The configuration of the main body 30 is not limited to that shown in FIG. 9. It is sufficient for the main body 30 to rotate the first lead holder 11 in rotation direction r1 and move the holder 10 in direction d2.

[0017] The first lead holding portion 11 is also provided with a drive unit 36 ​​for sliding the second lead holding portion 12. Figures 10 and 11 are diagrams illustrating a configuration for sliding the second lead holding portion 12 according to the first embodiment. The second lead holding portion 12 is fixed to an insulating block 38 with screws 39. The drive unit 36 ​​is, for example, an air cylinder. When the drive unit 36 ​​presses the insulating block 38, the second lead holding portion 12 can slide along direction d1. The first lead holding portion 11 is also provided with an L-shaped guide 11a. The second lead holding portion 12 is held by the guide 11a. This allows the second lead holding portion 12 to slide stably.

[0018] FIG. 12 is a cross-sectional view showing the stem holding portion 40 according to the first embodiment. FIG. 13 is a plan view showing the stem holding portion 40 according to the first embodiment. The holding portion 10 rotates in one direction to contact the leads 52. Therefore, there is a possibility that the electronic component 50 may move in the direction of rotation of the holding portion 10. Therefore, it is preferable to provide a stem holding portion 40 that holds the stem 51. The stem holding portion 40 holds and fixes the electronic component 50, for example, from four directions. The contact portion of the stem holding portion 40 with the electronic component 50 is formed, for example, from a rubber-based material. This allows the electronic component 50 to be stably fixed. Furthermore, the corner slots 53 of the stem 51 may be fitted into the stem holding portion 40. This allows the electronic component 50 to be positioned. Furthermore, the electronic component 50 can be more stably fixed.

[0019] Next, the effects of this embodiment will be described. According to the lead correction device 100 of this embodiment, the first recess 13 for accommodating the lead 52 is formed on the side surface of the first lead holding portion 11. This allows the lead to be securely held by the holding portion 10, and the lead 52 to be corrected with precision. Furthermore, by sandwiching the lead 52 between the first lead holding portion 11 and the second lead holding portion 12, the holding portion 10, which is a probe, and the lead 52 can be securely brought into contact with each other.

[0020] Fig. 14 is a plan view of a lead correction device 800 according to a first comparative example. Figs. 15 and 16 are diagrams illustrating a method for correcting leads 52 using the lead correction device 800 according to the first comparative example. In the lead correction device 800, a three-pronged jig 810 is inserted from two directions into the base of the lead 52 of, for example, a four-pin electronic component 50. The lead 52 is then corrected by moving the jig 810 toward the tip of the lead 52. With this type of lead correction device 800, the arrangement of leads 52 that can be corrected may be limited.

[0021] In contrast to this, in this embodiment, the arrangement and number of the holders 10 are set in accordance with the electronic component 50, so that the lead correction device 100 can be applied to various products.

[0022] FIG. 17 is a cross-sectional view of a lead correction device 800a according to a second comparative example. The lead correction device 800a is applied to, for example, a seven-pin electronic component 50a. The lead correction device 800a, which is a simple conical jig, is inserted into the leads 52 to correct the leads 52. After correction, the electronic component 50a is inserted into a test socket and subjected to inspection. With this type of lead correction device 800a, depending on the condition of the electronic component 50a, the leads 52 may bend further during lead correction. Furthermore, correction of the leads 52 and inspection in which current is passed through the leads 52 must be performed in separate processes.

[0023] In contrast, in this embodiment, by moving the holding part 10 while the lead 52 is sandwiched between the first lead holding part 11 and the second lead holding part 12, it is possible to prevent the lead 52 from further bending during lead correction. Also, in this embodiment, there is no need to perform lead correction as a separate process before inspection. Therefore, inspection can be easily performed.

[0024] Furthermore, by forming the first lead holding portion 11 from resin, it is possible to prevent the lead 52 from being damaged when the first lead holding portion 11 comes into contact with the lead 52. Note that both the first lead holding portion 11 and the second lead holding portion 12 may be conductive. Furthermore, the lead correction device 100 does not need to have an inspection function. In this case, both the first lead holding portion 11 and the second lead holding portion may be formed from a non-conductive material such as resin.

[0025] 5, the first lead holding portion 11 is thicker than the second lead holding portion 12. This prevents the lead 52 from being pulled locally, allowing the lead 52 to be stably straightened. The second lead holding portion 12 is provided on the first lead holding portion 11 closer to the base of the lead 52. This allows the second lead holding portion 12 to contact a portion of the lead 52 close to the base, preventing the lead 52 from bending due to contact with the holding portion 10. The first lead holding portion 11 may be as thin as the second lead holding portion 12. This allows the holding portion 10 to hold the lead 52 even if the lead 52 is bent, for example.

[0026] These modifications can be applied as appropriate to the lead correction device according to the following embodiments. Note that the lead correction device according to the following embodiments has many points in common with embodiment 1, so the differences from embodiment 1 will be mainly described.

[0027] Embodiment 2 Fig. 18 is a plan view of a lead correction device 200 according to embodiment 2. Fig. 19 is a plan view showing a state in which the lead correction device 200 according to embodiment 2 holds a lead 52. The lead correction device 200 includes a plurality of holding units 210 and a main body unit (described later) for driving the plurality of holding units 210. The main body unit is provided with a plurality of holding units 210, the number of which corresponds to the number of leads 52 included in the electronic component 50, for example.

[0028] In this embodiment, holding portion 210 has a scissors shape and includes first lead holding portion 211 and second lead holding portion 212. First lead holding portion 211 and second lead holding portion 212 rotate in a plane of rotation that intersects with the direction in which leads 52 of electronic component 50 extend, as shown by rotation directions r2 and r3 in FIG. 18 . This causes lead 52 to be sandwiched between first lead holding portion 211 and second lead holding portion 212. A first recess 213 for accommodating lead 52 is formed on a side surface of first lead holding portion 211 that stands against the plane of rotation. Furthermore, a second recess 214 for accommodating lead 52 is formed on a side surface of second lead holding portion 212 that stands against the plane of rotation.

[0029] The main body moves the holding portion 210 along the rotation plane of the first lead holding portion 211 in a direction d3 toward the electronic component 50, and rotates the first lead holding portion 211 and the second lead holding portion 212 in the rotation directions r2 and r3. This brings the holding portion 210 into contact with the lead 52. The main body moves the holding portion 210 in a direction d2 along the rotation plane of the first lead holding portion 211, with the lead 52 sandwiched between the first lead holding portion 211 and the second lead holding portion 212. As an example, the main body moves the holding portion 210 along the rotation plane of the first lead holding portion 211 in a direction d2 away from the electronic component 50. This allows the narrowing of the lead 52 to be corrected. The direction in which the holding portion 210 is moved may be changed according to the direction in which the lead 52 is to be corrected. For example, the holding portion 210 may be moved so as to correct the widening of the lead 52.

[0030] 20 is a diagram illustrating the configuration of main body 230 according to embodiment 2. Main body 230 includes drive unit 232 that moves holding unit 210 in directions d2 and d3 along the rotation plane of first lead holding unit 211. Drive unit 232 is, for example, a motor or an air cylinder.

[0031] Furthermore, main body 230 includes driver 234 that rotates first lead holding portion 211 and second lead holding portion 212 in rotation directions r2 and r3. Driver 234 is connected to first lead holding portion 211 and second lead holding portion 212 via connector 235, which is an insulator made of ceramic or the like. Driver 234 moves in direction d4, thereby rotating first lead holding portion 211 and second lead holding portion 212 around a fulcrum. Driver 234 is, for example, a motor or an air cylinder.

[0032] The configuration of main body 230 is not limited to that shown in Fig. 20. Main body 230 only needs to be able to rotate first lead holding portion 211 and second lead holding portion 212 in rotation directions r2 and r3, and move holding portion 210 in directions d2 and d3.

[0033] 21 is a diagram illustrating the arrangement of multiple holding portions 210 according to embodiment 2. The multiple holding portions 210 are arranged, for example, radially in a plan view, corresponding to the multiple leads 52. The multiple holding portions 210 are provided offset in a direction perpendicular to the plane of rotation of the first lead holding portion 211, that is, in the direction in which the leads 52 extend.

[0034] Of the multiple holding portions 210, holding portion 210a, which is arranged closest to the base of lead 52, is composed of first lead holding portion 211a made of resin and conductive second lead holding portion 212. Here, in holding portion 210a, first lead holding portion 211a is arranged closer to stem 51 than second lead holding portion 212. This makes it possible to prevent short-circuiting between the probe and stem 51. Note that in other holding portions 210, both first lead holding portion 211 and second lead holding portion 212 are conductive. In all holding portions 210, first lead holding portion 211 may be made of resin and second lead holding portion 212 may be conductive.

[0035] The pair of first lead holding portion 211 and second lead holding portion 212 contacts lead 52, and power is supplied to lead 52 by conductive first lead holding portion 211 or second lead holding portion 212. In this manner, in this embodiment, power can be supplied while correcting lead 52. In other words, holding portion 10 in this embodiment also functions as a probe.

[0036] Next, the effects of this embodiment will be described. In this embodiment, first recess 213 and second recess 214 for accommodating lead 52 are formed on the side surfaces of first lead holding portion 211 and second lead holding portion 212. This allows lead 52 to be reliably held by holding portion 210, and lead 52 to be corrected with precision. Furthermore, by sandwiching lead 52 between first lead holding portion 211 and second lead holding portion 212, it is possible to reliably bring holding portion 210, which is a probe, into contact with lead 52.

[0037] 21, by arranging the multiple holding parts 210 in a spiral shape with the heights shifted, it is possible to prevent adjacent holding parts 210 from shorting out even if the number of holding parts 210 increases. Therefore, the lead correction device 200 can be used for multi-pin products.

[0038] Fig. 22 is a diagram showing electronic component 50 in which leads 52 are narrowed. Fig. 23 is a diagram showing electronic component 50 in which leads 52 are bent. In this embodiment, leads 52 are sandwiched between thinly formed first lead holding portion 211 and second lead holding portion 212. Therefore, contact between holding portion 210 and leads 52 is possible not only when leads 52 are narrowed as shown in Fig. 22, but also when leads 52 are bent as shown in Fig. 23.

[0039] Furthermore, in this embodiment, since each holding portion 210 is formed thin, the holding portion 210 can be brought into contact with a portion close to the base of the lead 52. Therefore, bending of the lead 52 due to contact with the holding portion 210 can be suppressed.

[0040] The stem holding portion 40 described in the first embodiment may be applied to this embodiment. Also, the lead correction device 200 does not need to have an inspection function. In this case, both the first lead holding portion 211 and the second lead holding portion 212 may be formed of a non-conductive material such as resin.

[0041] The technical features described in each embodiment may be used in appropriate combination.

[0042] Various aspects of the present disclosure are summarized below as appendices. (Appendix 1) a holding section having a first lead holding section and a second lead holding section, wherein at least the first lead holding section rotates within a rotation plane that intersects with the direction in which the leads of the electronic component extend, and the first lead holding section and the second lead holding section are configured to sandwich the leads; a main body configured to move the holding parts in a direction along the rotation plane while the first lead holding part and the second lead holding part sandwich the lead; Equipped with A lead straightening device, characterized in that a first recess for accommodating the lead is formed on a side surface of the first lead holding part that is erected relative to the rotation surface. (Appendix 2) The lead straightening device described in Appendix 1, characterized in that when the lead is stored in the first recess, the second lead holding portion slides along the rotation surface, thereby clamping the lead between the first lead holding portion and the second lead holding portion. (Appendix 3) The lead correction device according to claim 2, wherein the first lead holding portion is formed of resin, and the second lead holding portion is conductive. (Appendix 4) 4. The lead straightening device according to claim 2, wherein the main body moves the holding part along the rotation surface in a direction away from the electronic component. (Appendix 5) 5. The lead straightening device according to claim 2, wherein the main body is provided with a plurality of holding portions corresponding to the number of the leads. (Appendix 6) The lead correction device described in Appendix 1, characterized in that the first lead holding portion and the second lead holding portion rotate within the rotation plane to clamp the lead between the first lead holding portion and the second lead holding portion. (Appendix 7) The lead correction device described in Appendix 6, characterized in that a second recess in which the lead is stored is formed on a side surface of the second lead holding portion that is erected relative to the rotation surface. (Appendix 8) The lead correction device according to claim 6 or 7, wherein the first lead holding portion is made of resin, and the second lead holding portion is conductive. (Appendix 9) The lead straightening device according to any one of claims 6 to 8, wherein the main body moves the holding part along the rotation surface in a direction away from the electronic component. (Appendix 10) 10. The lead straightening device according to any one of claims 6 to 9, wherein the main body is provided with a plurality of the holding portions corresponding to the number of the leads. (Appendix 11) The lead straightening device according to claim 10, wherein the plurality of holding portions are arranged offset in a direction perpendicular to the rotation plane. [Explanation of symbols]

[0043] 10 holding portion, 11 first lead holding portion, 11a guide, 12 second lead holding portion, 13 first recess, 30 main body portion, 32 drive portion, 34 drive portion, 36 drive portion, 38 insulating block, 39 screw, 40 stem holding portion, 50 electronic component, 50a electronic component, 51 stem, 52 lead, 53 square slot, 100 lead correction device, 200 lead correction device, 210 holding portion, 210a holding portion, 211 first lead holding portion, 211a first lead holding portion, 212 second lead holding portion, 213 first recess, 214 second recess, 230 main body portion, 232 drive portion, 234 drive portion, 235 connection portion, 800 lead correction device, 800a lead correction device, 810 jig

Claims

1. a holding portion having a first lead holding portion and a second lead holding portion, wherein at least the first lead holding portion rotates within a rotation plane intersecting a direction in which the leads of the electronic component extend, and the first lead holding portion and the second lead holding portion are configured to sandwich the leads; a main body configured to move the first lead holding portion and the second lead holding portion in a direction along the rotation plane while the first lead holding portion and the second lead holding portion sandwich the lead; Equipped with A lead straightening device, characterized in that a first recess for accommodating the lead is formed on a side surface of the first lead holding portion that is erected relative to the rotation surface.

2. The lead straightening device according to claim 1, characterized in that, when the lead is stored in the first recess, the second lead holding portion slides along the rotation surface, thereby sandwiching the lead between the first lead holding portion and the second lead holding portion.

3. 3. The lead straightening device according to claim 2, wherein the first lead holding portion is made of resin, and the second lead holding portion is conductive.

4. 4. The lead straightening device according to claim 2, wherein the main body moves the holding portion along the rotation surface in a direction away from the electronic component.

5. the main body is provided with a plurality of the holding portions corresponding to the number of the leads; 4. The lead straightening device according to claim 2, wherein the main body moves each of the plurality of holding parts along the rotation plane in a direction away from the electronic component.

6. 2. The lead straightening device according to claim 1, wherein the first lead holding portion and the second lead holding portion rotate within the plane of rotation to sandwich the lead between the first lead holding portion and the second lead holding portion.

7. 7. The lead straightening device according to claim 6, wherein a second recess for accommodating the lead is formed on a side surface of the second lead holding portion that is erected relative to the rotation surface.

8. 8. The lead straightening device according to claim 6, wherein the first lead holding portion is made of resin, and the second lead holding portion is conductive.

9. 8. The lead straightening device according to claim 6, wherein the main body moves the holding part along the rotation plane in a direction away from the electronic component.

10. the main body is provided with a plurality of the holding portions corresponding to the number of the leads; 8. The lead straightening device according to claim 6, wherein the main body moves each of the plurality of holding parts along the rotation plane in a direction away from the electronic component.

11. The lead straightening device according to claim 10, wherein the plurality of holding portions are provided offset in a direction perpendicular to the rotation plane.

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