Component mounting device, component mounting method, and component mounting system

Abstract

To provide a component mounting device capable of improving the traceability of load information applied to a component.SOLUTION: A disclosed component mounting device includes: a pressing head that has a nozzle that presses a component against a board while holding the component; an electropneumatic regulator that has an air pressure adjustment unit that adjusts the air pressure applied to the nozzle and a measurement unit that measures the air pressure while the component is attached; and a control unit that is connected to the electropneumatic regulator to acquire load information based on the air pressure measured by the measuring unit.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting apparatus, a component mounting method, and a component mounting system. [Background technology]

[0002] Component mounting devices are known that hold components using suction nozzles and press them against a board.

[0003] Patent Document 1 discloses a component mounting device having a head that moves in a plane direction and a nozzle disposed on the head. In the component mounting device described in Patent Document 1, the head holds a component by the nozzle and mounts the component at a predetermined position on a board. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-192904 Summary of the Invention [Problem to be solved by the invention]

[0005] When mounting components on a board, it is necessary to apply an appropriate load to the components. However, without using a load cell or the like, it is difficult to determine whether the components have been mounted with an appropriate load.

[0006] Therefore, there is still room for improvement in terms of traceability of information on the load applied to a component when the component is pressed against a board.

[0007] In order to solve the above-mentioned problems, the present disclosure aims to provide a component mounting device with improved traceability of information on the load applied to components. [Means for solving the problem]

[0008] The component mounting device according to the present disclosure includes a pressure head having a nozzle for pressing the component against a board while holding the component and capable of raising and lowering relative to the board, an air pressure adjustment unit for adjusting the air pressure applied to the nozzle, and a measurement unit for measuring the air pressure during component mounting, and an electro-pneumatic regulator having such a pressure adjustment unit and a measurement unit, and a control unit connected to the electro-pneumatic regulator for acquiring load information based on the air pressure measured by the measurement unit.

[0009] The component mounting method according to the present disclosure includes the steps of holding a component with a nozzle provided on a pressing head that can be raised and lowered relative to a board, adjusting the air pressure applied to the nozzle by an air pressure adjustment unit in the electro-pneumatic regulator, lowering the nozzle a predetermined distance relative to the board and pressing the component against the board, measuring the air pressure by a measurement unit in the electro-pneumatic regulator, and acquiring load information based on the air pressure measured by the measurement unit by a control unit connected to the electro-pneumatic regulator.

[0010] The component mounting system according to the present disclosure includes a component mounting device and a processing device that communicates with the component mounting device via a network. The component mounting device has an electro-pneumatic regulator that has a nozzle that holds the component and presses it against a board, a pressing head that can be raised and lowered relative to the board, an air pressure adjustment unit that adjusts the air pressure applied to the nozzle, and a measurement unit that measures the air pressure during component mounting. The component mounting system also includes a control unit that is connected to the electro-pneumatic regulator and acquires load information based on the air pressure measured by the measurement unit, and a first communication unit that transmits the load information and information related to the component mounting environment via the network. The processing device has a second communication unit that receives the load information and information related to the mounting environment via the network, and a processing unit that associates and stores the load information and the information related to the mounting environment. [Effects of the Invention]

[0011] According to the present disclosure, it is possible to improve the traceability of information on the load applied to a part. [Brief explanation of the drawings]

[0012] [Figure 1]1 is a plan view of a component mounting apparatus according to an embodiment of the present invention; [Figure 2] Side view of the pressing head [Figure 3] Side view of the press head during component placement [Figure 4] Schematic diagram of pressure head and electro-pneumatic regulator [Figure 5] Control block diagram [Figure 6] Flow chart for component mounting [Figure 7] Graph showing nozzle operation during component placement [Figure 8A] Graph showing voltage fluctuations during component placement [Figure 8B] Graph showing load fluctuations during component placement [Figure 9A] Graph showing the relationship between command voltage and command load [Figure 9B] A graph showing the relationship between voltage and the load actually applied by the pressing head [Figure 10] Load information diagram [Figure 11] Diagram showing traceability data [Figure 12] 1 is a block diagram of a component mounting system according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0013] [Embodiment 1] A first embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for the purpose of explanation and can be modified as appropriate depending on the specifications of the component mounting device, head unit, suction nozzle, and component holder. In FIG. 1 and some parts described below, two axes that are orthogonal to each other in a horizontal plane are shown: the X-axis in the board transport direction (the left-right direction in FIG. 1) and the Y-axis that is orthogonal to the board transport direction (the up-down direction in FIG. 1). In addition, the Z-axis is shown as an axis that is orthogonal to the horizontal plane.

[0014] (Overall composition) The overall configuration of the component mounting device 1 will be described with reference to Fig. 1. Fig. 1 is a plan view of the component mounting device 1.

[0015] The component mounting device 1 has a base 1a, a board transport mechanism 2, a component supply unit 4, a head unit 10, an electro-pneumatic regulator 40, a head camera 13, a component recognition camera 14, a nozzle stocker 15, and a control unit C. The component mounting device 1 is a device that mounts components 50 supplied by the component supply unit 4 onto a board 3 transported by the board transport mechanism 2.

[0016] The base 1a is a member that supports the component mounting device 1, which extends in the XY plane. Two Y-axis tables 8 are arranged on the upper surface of the base 1a, at both ends extending along the Y axis. Beams 9 extending along the X axis are connected to the two Y-axis tables 8. The beams 9 can move in the Y direction by moving along the Y-axis tables 8. The Y-axis tables 8 and beams 9 are equipped with linear drive mechanisms.

[0017] The board transport mechanism 2 is installed along the X-axis at the center of the base 1a. The board transport mechanism 2 transports the board 3 from upstream along the X-axis, and positions and holds it at a mounting position where the mounting of components 50 is performed. The board transport mechanism 2 also transports the board 3 downstream after the mounting of components 50 has been completed. The board transport mechanism 2 is, for example, a conveyor.

[0018] The two component supply units 4 are installed on both sides (front and back along the Y axis) of the board transport mechanism 2. Multiple tape feeders 5 are attached in parallel along the X axis to the component supply units 4 on both sides. The tape feeders 5 feed a carrier tape, on which pockets for storing components 50 are formed, in a direction from outside the component supply unit 4 toward the board transport mechanism 2. When the components 50 stored on the carrier tape reach the component removal position, the head unit 10 picks up the components 50. In addition, a tray feeder 7 is attached to one of the component supply units 4. The tray feeder 7 supplies multiple trays 6 containing components 50, connectors, etc. to the component removal position.

[0019] The head unit 10 is attached to the beam 9 so as to be movable along the X axis. Considering that the beam 9 is movable along the Y axis, the head unit 10 is movable in the XY plane relative to the base 1a. The head unit 10 in the first embodiment has three pressing heads 11. A suction nozzle is detachably attached to the tip of the lower end of each pressing head 11. The structure of the pressing head 11 will be described in detail below.

[0020] Here, the Y-axis table 8 and the beam 9 together constitute a head movement mechanism 12. Furthermore, the head movement mechanism 12 and the head unit 10 constitute a component mounting mechanism that performs a component mounting operation of mounting components 50 taken out from the component supply unit 4 onto the board 3.

[0021] The electro-pneumatic regulator 40 adjusts the amount of air supplied to the head unit 10, that is, the air pressure inside the head unit 10, in accordance with the command load commanded by the control unit C.

[0022] Head camera 13 is disposed on the underside of beam 9 and moves integrally with head unit 10. Head camera 13 recognizes the position of a board mark (not shown) provided on board 3. More specifically, head camera 13 moves together with head unit 10 above board 3 positioned at the mounting operation position of board transport mechanism 2, and recognizes the position of the board mark.

[0023] The component recognition camera 14 is disposed between the board transport mechanism 2 and the component supply unit 4. When the head unit 10 holding the component 50 taken out from the component supply unit 4 passes above the component recognition camera 14, the component recognition camera 14 captures an image of the component 50 from below. Taking into account the recognition results of the board 3 by the head camera 13 and the recognition results of the component 50 by the component recognition camera 14, the mounting position of the component 50 on the board 3 is corrected.

[0024] The nozzle stocker 15 has a plurality of nozzle storage sections 15a that stock nozzles to be attached to the press head 11. During a nozzle replacement operation, the component mounting device 1 replaces the nozzle attached to the press head 11 with the nozzle stored in the nozzle storage section 15a.

[0025] The control unit C controls each unit of the component mounting device 1. The control unit C includes a general-purpose processor such as a CPU or MPU that executes programs to achieve predetermined functions. The control unit C has a memory unit 31, and executes programs stored in the memory unit 31 to achieve the functions. The control unit C performs, for example, component mounting and nozzle replacement operations. The control unit C is not limited to a unit that achieves predetermined functions through the cooperation of hardware and software, but may also be a hardware circuit designed specifically to achieve the predetermined functions.

[0026] (Pressing head configuration) Next, the configuration of the press head 11 will be described in more detail with reference to Figures 2 and 3. Figure 2 is a side view of the press head 11. Figure 3 is a side view of the press head 11 during component mounting.

[0027] As shown in FIG. 2, the pressing head 11 includes a housing 20, an air supply hose 21, a balloon 22, a piston 23, a cylinder 24, a bearing 26, a nozzle 27, and a Z-axis drive motor .

[0028] The housing 20 houses a balloon 22, a piston 23, a cylinder 24, and a bearing 26.

[0029] The air supply hose 21 is a hose member connected to the top of the housing 20 and supplies air from the electropneumatic regulator 40 to the balloon 22. The balloon 22 is an inflatable bag-shaped member. When air is supplied to the balloon 22 through the air supply hose 21, the air pressure P inside the balloon 22 changes, causing the balloon 22 to inflate.

[0030] The piston 23 is a rod-shaped member and is disposed inside the housing 20 so as to abut against the lower end of the balloon 22. The piston 23 receives a downward force in accordance with the air pressure P inside the balloon 22.

[0031] The cylinder 24 holds the piston 23 so that it can move along the Z axis. More specifically, a spline groove 25 is formed on the inner peripheral surface of the cylinder 24, and the piston 23 is held via the spline groove 25 so that it can move up and down.

[0032] The bearing 26 rotatably holds the cylinder 24 relative to the housing 20 .

[0033] Nozzle 27 is provided at the lower end of piston 23 and is a member that suctions component 50. A contact member 27A that contacts the upper surface of component 50 is provided at the tip of nozzle 27. A suction opening 27B of nozzle 27 opens on the lower surface of contact member 27A. When a vacuum source (not shown) connected to suction opening 27B is activated while contact member 27A is in contact with the upper surface of component 50, component 50 is sucked onto contact member 27A.

[0034] 3, during component mounting, press head 11 descends toward board 3, and component 50 held by nozzle 27 comes into contact with board 3. As piston 23 is pushed back toward balloon 22, the air pressure inside balloon 22 rises to air pressure P+ΔP. In this state, piston 23 is subjected to a force from above due to air pressure P+ΔP and a reaction force N from board 3 from below, with the force from air pressure P+ΔP and reaction force N being balanced. Reaction force N corresponds to the load applied to component 50; that is, air pressure P+ΔP corresponds to the load applied to component 50.

[0035] Next, the configurations of the pressure head 11 and the electropneumatic regulator 40 will be described in more detail with reference to Fig. 4. Fig. 4 is a schematic diagram of the pressure head 11 and the electropneumatic regulator 40.

[0036] As shown in FIG. 4, the pressing head 11 is connected to an electropneumatic regulator 40 .

[0037] The electro-pneumatic regulator 40 is configured to adjust the air pressure P in the pressing head 11 in accordance with the input voltage V. The electro-pneumatic regulator 40 has a measuring unit 41 and an air pressure adjusting unit 42.

[0038] The measuring unit 41 measures the air pressure P inside the balloon 22. The measuring unit 41 is, for example, an air pressure sensor. The measuring unit 41 outputs a voltage V based on the air pressure P to the air pressure adjusting unit 42 and the control unit C. The voltage V based on the air pressure P is a voltage V converted from the air pressure P in accordance with the proportional relationship between the air pressure P inside the balloon 22 and the voltage V in the electro-pneumatic regulator 40.

[0039] Specifically, the conversion formula between voltage V and air pressure P can be written as the following formula (1). V=αP+β (α and β are constants)...(1) Therefore, the voltage V can be obtained based on the air pressure P. In the first embodiment, the voltage V is equal to or greater than 1 V and equal to or less than 5 V, and the air pressure P is equal to or greater than 0 MPa and equal to or less than 0.5 MPa, and can be written as V=8P+1.

[0040] The air pressure adjusting unit 42 has multiple valves (not shown) and actuators connected to each valve. The valves of the air pressure adjusting unit 42 are connected to an air supply source 44 to supply air to the interior of the balloon 22. The valves of the air pressure adjusting unit 42 are also connected to the outside air to exhaust air from the interior of the balloon 22. When the control unit C determines the command load F0, a command voltage V0 corresponding to the command load F0 is input to the air pressure adjusting unit 42. The air pressure adjusting unit 42 adjusts the air pressure P inside the balloon 22 so that it reaches a command air pressure P0 corresponding to the command voltage V0. More specifically, the air pressure adjusting unit 42 operates the actuator in accordance with the command voltage V0 to change the opening degree of the valve, thereby causing the air pressure P inside the balloon 22 to reach the command air pressure P0. In addition, to maintain the air pressure P at the command air pressure P0, the air pressure adjusting unit 42 performs feedback control based on the voltage V output from the measurement unit 41.

[0041] Here, the load F applied to the component 50 corresponds to the voltage V in the electropneumatic regulator 40 and the air pressure P inside the balloon 22. A method for converting the load F and the voltage V will be described later.

[0042] (Configuration of control unit) Next, the configuration of the control unit C will be described in more detail with reference to Fig. 5. Fig. 5 is a block diagram of the control unit C.

[0043] 5, the control unit C is electrically connected to the component supply unit 4, the board transport mechanism 2, the component recognition camera 14, the head camera 13, the pressing head 11, and the electro-pneumatic regulator 40. The control unit C also has a component mounting processing unit 32, a load command unit 33, a contact determination unit 34, a load appropriateness determination unit 35, a traceability data creation unit 36, a traceability data output unit 37, and a memory unit 31.

[0044] During component mounting, component mounting processing unit 32 controls the operations of component supply unit 4, board transport mechanism 2, component recognition camera 14, and head camera 13 to align component 50 with board 3 and mount component 50. The position and orientation of component 50 are aligned with the mounting position on the surface of board 3, and component 50 is mounted at the mounting position.

[0045] The load command unit 33 is configured to determine a command load F0 to be input to the electro-pneumatic regulator 40. The command load F0 is a value of a load required to mount the component 50 on the board 3. The load command unit 33 may determine the command load F0 based on a production program stored in the memory unit 31.

[0046] Contact determination unit 34 is configured to determine whether component 50 has come into contact with board 3 during component placement. Contact determination unit 34 performs contact determination based on load information derived from air pressure P measured by measurement unit 41 during component placement. For example, contact determination unit 34 determines that component 50 has come into contact with board 3 if voltage V based on air pressure P measured during touchdown is greater than a predetermined threshold K1, and determines that component 50 has not come into contact with board 3 if voltage V is less than threshold K1. Threshold K1 is defined, for example, according to the rigidity of component 50 or board 3, and is stored in storage unit 31. In the first embodiment, contact determination unit 34 performs contact determination in real time during component placement.

[0047] Here, the load information refers to information related to the load F actually applied to the component 50 during component mounting. In addition to the load F applied to the component 50, the load information may also include the air pressure P or voltage V measured when the load F is applied to the component 50.

[0048] Load appropriateness determination unit 35 is configured to determine whether load F applied to component 50 is appropriate (appropriateness determination) during component mounting. Load appropriateness determination unit 35 performs appropriateness determination based on load information based on air pressure P measured by measurement unit 41 during component mounting. For example, load appropriateness determination unit 35 determines that load F is appropriate if voltage V based on air pressure P is within a predetermined appropriate range L, and determines that load F is inappropriate if voltage V is outside the predetermined appropriate range L. The appropriate range L for voltage V is defined according to, for example, the strength or function of component 50 or board 3, and is stored in memory unit 31. In the first embodiment, load appropriateness determination unit 35 performs appropriateness determination in real time during component mounting.

[0049] The traceability data generating unit 36 ​​and the traceability data output unit 37 are configured to handle traceability data in order to improve the traceability of the load F during component mounting.

[0050] The traceability data is data related to the placement quality of the component 50 placed on the board 3. More specifically, the traceability data includes load information based on measurements by the measurement unit 41 and placement environment-related information related to the placement of the component 50. The placement environment-related information includes at least one of information about the component 50, information about the board 3, and information about the component placement apparatus 1. For example, the information about the component 50 includes the command load F0 of the component 50 and the type of the component 50. For example, the information about the board 3 includes identification information about the board 3, the placement position of the component 50 on the board 3, and the type of component already placed on the board 3 before the component 50. For example, the information about the component placement apparatus 1 includes the type of nozzle 27, identification information about the nozzle 27, and the suction pressure. The traceability data may be stored for each component 50 during component placement.

[0051] The traceability data creating unit 36 ​​creates traceability data by linking the load information stored in the storage unit 31 with the mounting environment related information. The traceability data output unit 37 outputs the created traceability data.

[0052] The storage unit 31 is a recording medium that records various information. The storage unit 31 is realized, for example, by a flash memory, a solid-state device (SSD), a hard disk, or other storage device, or by an appropriate combination of these. The storage unit 31 stores, for example, a production program executed by the control unit C and traceability data related to component placement. The production program includes information related to the type of component 50 to be placed, the placement position, the placement order, the command load F0, and the nozzle.

[0053] (Operation of control unit) Next, an example of the operation of the component mounting apparatus 1 configured as described above will be described with reference to Figs. 6 and 7. Fig. 6 is a flow diagram of component mounting. Fig. 7 is a graph showing the operation of the nozzle 27 during component mounting. In Fig. 7, the horizontal axis represents time, and the vertical axis represents the displacement of the nozzle 27 in the Z direction.

[0054] The component mounting operation includes a component holding step (S11), an air pressure adjusting step (S12, S13), a component lowering step (S14, S15), an air pressure storing step (S16-S18), a component pressing step (S19, S20), an air pressure storing step (S21, S22), and a component releasing step (S23).

[0055] First, in the component holding step, the control unit C holds a component 50 by the press head 11 (S11). Specifically, based on the production program stored in the memory unit 31, the control unit C moves the press head 11 to above the component supply unit 4 and sucks and holds the top surface of a predetermined component 50 with the nozzle 27 (see FIG. 2).

[0056] Next, the control unit C determines the command load F0 based on the production program (S12). Specifically, the load command unit 33 of the control unit C determines the command load F0 in accordance with the part in the production program.

[0057] Next, the control unit C adjusts the air pressure P in the balloon 22 to a command air pressure P0 in accordance with the command load F0 (S13). Specifically, the control unit C converts the command load F0 into a command voltage V0 and inputs the command voltage V0 to the electro-pneumatic regulator 40. In accordance with the input command voltage V0, the air pressure adjustment unit 42 adjusts the opening of a valve (not shown) connected to the air supply source 44 to adjust the air pressure P inside the balloon 22 to the command air pressure P0. When the air pressure P reaches the command air pressure P0, the adjustment of the air pressure P by the air pressure adjustment unit 42 may be terminated. Note that if the air pressure P inside the balloon 22 significantly deviates from the command air pressure P0 after reaching the command air pressure P0, the air pressure P inside the balloon 22 may be readjusted to the command air pressure P0.

[0058] Next, the control unit C aligns the substrate 3 and the component 50 based on the production program (S14). Specifically, the component mounting processing unit 32 of the control unit C moves the press head 11 holding the component 50 to a descent start point (point A in FIG. 7) above the mounting position on the substrate 3, and rotates it in a predetermined direction to align the component 50 with the mounting position. Note that, to improve production efficiency, the step of adjusting the air pressure P in the balloon 22 to the command air pressure P0 in accordance with the command load F0 (S13) and the step of aligning the substrate 3 and the component 50 based on the production program (S14) may be performed simultaneously.

[0059] Next, the control unit C starts the descent of the press head 11 (S15). As shown in FIG. 7, the control unit C causes the press head 11 to descend a first distance D1 from the descent start point (point A) toward the substrate 3. The descent speed may be constant or may vary. In the first embodiment, the press head 11 descends at high speed from the descent start position to approach the substrate 3, and then the descent speed is slowed down when it gets close enough (point B). Such a change in speed can reduce the time required for the mounting operation while suppressing impact on the substrate 3.

[0060] As shown in FIG. 7, the pressing head 11 is lowered by a first distance D1, so that the component 50 approaches the substrate 3 (between point B and point C).

[0061] When the pressing head 11 has completed descending the first distance D1, the measuring unit 41 measures the air pressure P and outputs a voltage V based on the air pressure P to the control unit C. The control unit C determines whether the voltage V is greater than a threshold value K1 (S16). Specifically, the contact determination unit 34 of the control unit C obtains the voltage V from the measuring unit 41 and compares it with the threshold value K1 stored in the memory unit 31.

[0062] If the voltage V is greater than the threshold K1 (Yes in S16), the contact determination unit 34 determines that the component 50 has come into contact with the board 3, i.e., that the component 50 has "touched down." The control unit C determines the air pressure P at the time of touchdown as a first air pressure P1, and stores a first voltage V1 based on the first air pressure P1 in the memory unit 31 (S17).

[0063] If the voltage V is smaller than the threshold value K1 (No in S16), the contact determination unit 34 determines that the component 50 is not yet in contact with the board 3. After this determination, the control unit C further lowers the pressing head 11 by a second distance D2 (S18) and returns to step 16. The second distance D2 is smaller than the first distance D1, and may be, for example, 0.1 times the first distance D1.

[0064] FIG. 7 shows an example in which the component 50 is not in contact with the board after being lowered by the first distance D1, but the component 50 touches down by further lowering the press head 11 by a second distance D2.

[0065] Subsequently, after touchdown, control unit C further lowers press head 11 by a third distance D3 to press component 50 into board 3 (S19). Press head 11 reaches the lowest point (point D).

[0066] With the component 50 pressed into the board 3, the control unit C stops the pressing head 11 for the component holding time T and holds the component 50 (S20, point E).

[0067] The distances D1 to D3 and the component holding time T may be values ​​included in the production program.

[0068] Before the component holding time T has elapsed and the pressing head 11 is separated from the substrate 3, the measuring unit 41 measures the air pressure P, and the control unit C regards the air pressure P as a second air pressure P2, acquires a second voltage V2 based on the second air pressure P2, and stores it in the memory unit 31 (S21).

[0069] The control unit C determines whether the second voltage V2 is within the appropriate range L (S22). Specifically, the load appropriateness determination unit 35 of the control unit C acquires the second voltage V2 and compares it with the appropriate range L stored in the memory unit 31. In other words, the load appropriateness determination unit 35 determines whether the second voltage V2 is greater than the lower limit value L1 of the appropriate range L and less than the upper limit value L2 of the range.

[0070] If second voltage V2 is within appropriate range L (Yes in S22), load appropriateness determination unit 35 determines that the load applied to component 50 was appropriate. Thereafter, control unit C raises press head 11 (S23). As shown in Fig. 7, press head 11 rises and moves away from substrate 3 (point F).

[0071] If the second voltage V2 is not within the appropriate range L (No in S22), it is determined that the load applied to the component 50 was not appropriate, and a warning is displayed to the user (S24). The warning may include an instruction to the user to stop the equipment. The traceability data creation unit 36 ​​may store the fact that the warning was issued in the memory unit 31. Then, the process returns to step 23.

[0072] FIG. 8A is a graph showing fluctuations in voltage V of electropneumatic regulator 40 during component mounting shown in FIG.

[0073] 8A, at point A, the voltage V of the electropneumatic regulator 40 is an initial voltage Vs, and the air pressure P inside the balloon 22 is an initial air pressure Ps. When a command voltage V0 is input to the electropneumatic regulator 40 by control unit C, the voltage V increases due to the operation of the electropneumatic regulator 40, and reaches the command voltage V0 between points A and B. As the voltage V increases, the air pressure P also increases and reaches the command air pressure P0.

[0074] As shown in FIG. 8A, with the voltage V held constant at the command voltage V0, the component 50 touches down on the substrate 3 (point C). At touchdown, the component 50 receives a repulsive force from the substrate 3, pushing the piston 23 back toward the balloon 22 and compressing the balloon 22. As a result, the air pressure P inside the balloon 22 increases rapidly, and as shown in FIG. 8A, the voltage V output from the electro-pneumatic regulator 40 also increases rapidly. Furthermore, as the air pressure P inside the balloon 22 increases, the force with which the balloon 22 pushes back against the piston 23 increases, pushing the piston 23 downward. As a result, the balloon 22 expands, and the air pressure P and voltage V decrease rapidly. Therefore, the first voltage V1 at touchdown is a local maximum value generated by fluctuations in the voltage V before and after touchdown.

[0075] Thereafter, the component 50 is pressed into the substrate 3 up to point D, causing the air pressure P and voltage V to increase further. At point D, the air pressure P inside the balloon 22 and the repulsive force from the substrate 3 are balanced, and the air pressure P and voltage V are maintained constant between points D and E. The above-mentioned second voltage V2 is the value when the voltage V becomes stable and constant, and the second voltage V2 is also a local maximum value.

[0076] Thereafter, between point E and point F, the pressure head 11 starts to move away from the substrate 3, so the air pressure P and the voltage V decrease. When moving away from the substrate 3, the voltage V returns to the command voltage V0.

[0077] Thereafter, the air pressure adjusting unit 42 may resume adjusting the air pressure P. The initial voltage Vs is input to the electro-pneumatic regulator 40, and the voltage V decreases due to the operation of the electro-pneumatic regulator 40, and at point F and after, returns to the initial voltage Vs.

[0078] 8B is a graph showing fluctuations in load F during component placement shown in FIG. 7. As shown in FIG. 8B, load F varies in response to voltage V of electro-pneumatic regulator 40. Specifically, load F increases from initial load Fs to command load F0 as voltage V increases between points A and B. At touchdown, load F reaches a first load F1, which is a local maximum value. Furthermore, when voltage V stabilizes and becomes constant, load F reaches a second load F2, which is also a local maximum value. The magnitude relationship between first load F1 and second load F2 depends on the placement conditions.

[0079] However, due to the configuration of the component mounting device 1, it is difficult to directly measure the load F, like the air pressure P or voltage V. On the other hand, if the board 3 is deformed, the load actually applied to the component 50 may not match the command load F0. From the perspective of product quality assurance, therefore, improved traceability in the manufacturing process, such as component mounting, is required. Therefore, in this disclosure, to improve traceability, the load F actually applied by the press head 11 to the component 50 is stored and managed along with the command load F0. More specifically, in this disclosure, the load F is calculated based on the voltage V.

[0080] The method of converting the load F will be described with reference to Fig. 9A and Fig. 9B. Fig. 9A is a graph showing the relationship between the command voltage V0 and the command load F0. Fig. 9B is a graph showing the relationship between the voltage V and the load F actually applied by the pressing head 11.

[0081] 4, the component mounting apparatus 1 executes a first conversion Cal1 that converts the command load F0 determined by the control unit C into a command voltage V0, and a second conversion Cal2 that converts the measured voltage V based on the air pressure P measured by the measurement unit 41 into the load F actually applied to the component 50. The first conversion Cal1, which does not use a measured value, shows a different relationship from the second conversion Cal2, which uses a measured value, and therefore it is necessary to use two conversion methods.

[0082] At the time of installation of the device, the conversion formulas for the first conversion Cal1 and the second conversion Cal2 are unknown. Therefore, with reference to FIG. 9A, we will first explain how to determine the conversion formula for the first conversion Cal1. When two known different command voltages V01 and V02 are input to the electro-pneumatic regulator 40, the command loads F01 and F02 applied by the press head 11 are measured using a load cell or the like attached to the press head 11. Because it is known that the command voltage V0 has a linear approximation relationship with the command load F0, the following conversion formula for the first conversion Cal1 can be obtained by plotting the two points of the command voltages V01 and V02 and the command loads F01 and F02: V0=δF0+ε (δ and ε are constants) (2) The control unit C can convert the command load F0 into a command voltage V0 based on the above relationship.

[0083] Next, with reference to Fig. 9B, a method for determining the conversion formula for the second conversion Cal2 will be described. The air pressures P3 and P4 when the pressing head 11 applies two known different loads F3 and F4 are measured by the measurement unit 41 and converted into voltages V3 and V4. To apply the known loads F3 and F4, for example, a load cell may be attached to the pressing head 11. Because it is known that the measured voltage V has a linear approximation relationship with the load F, the following conversion formula for the second conversion Cal2 can be obtained by plotting the voltages V3 and V4 and the loads F3 and F4 at two points: V=γF+φ (γ and φ are constants)...(3) The control unit C can convert the measured voltage V into the load F actually applied to the component 50 based on the above relationship.

[0084] The first conversion Cal1 and the second conversion Cal2 may be derived for each pressure head 11 in the head unit, or a common relationship may be used.

[0085] Fig. 10 is a diagram showing load information, and Fig. 11 is a diagram showing traceability data.

[0086] 10, the control unit C can convert the first voltage V1 and the second voltage V2 into the first load F1 and the second load F2 that are actually applied to the component 50. In the first embodiment, the first voltage V1 and the first load F1 are stored in the memory unit 31 as first load information, and the second voltage V2 and the second load F2 are stored in the memory unit 31 as second load information.

[0087] 11, the traceability data creation unit 36 ​​links the load information stored in the memory unit 31 with the wearing environment related information stored in the memory unit 31. Furthermore, the traceability data creation unit 36 ​​may link the load information stored in the memory unit 31 with the determination result of the second voltage V2 (S22).

[0088] The traceability data output unit 37 outputs the load information linked to the mounting environment related information from the component mounting device 1. The traceability data output unit 37 may display the data on a display or other display unit, or may print the data on paper or other media. The traceability data output unit 37 may also transmit the data to an external device and store it in the external device.

[0089] The above operation may also be performed in turn in each of the pressing heads 11 in the head unit 10.

[0090] (effect) The component mounting device 1 according to the first embodiment can achieve the following effects.

[0091] As described above, the component mounting apparatus 1 of the first embodiment includes a press head 11, an electro-pneumatic regulator 40, and a control unit C. The press head 11 has a nozzle 27 that holds a component 50 and presses the component 50 against the board 3, and is capable of moving up and down relative to the board 3. The electro-pneumatic regulator 40 has an air pressure adjustment unit 42 that adjusts the air pressure P applied to the nozzle 27, and a measurement unit 41 that measures the air pressure P during component mounting. The control unit C is connected to the electro-pneumatic regulator 40 and acquires load information based on the air pressure P measured by the measurement unit 41.

[0092] With this configuration, it is possible to store not only the input command load F0 but also load information related to the load F actually applied to component 50 when component 50 is mounted on board 3, without using a load measuring device such as a load cell. Storing the load information improves traceability in the mounting work of component 50.

[0093] Furthermore, in the component mounting apparatus 1 of the first embodiment, when the control unit C determines that the component 50 is in contact with the board 3, it acquires first load information based on the first air pressure P1.

[0094] With this configuration, first load information based on the first air pressure P1 at touchdown can be stored. Also, when the first voltage V1 is the maximum value of the voltage V during the mounting operation, load information based on the maximum voltage can be stored, further improving traceability during the mounting operation of the component 50.

[0095] Furthermore, in the component mounting apparatus 1 of the first embodiment, the control unit C determines that the component 50 is in contact with the board 3 when the voltage V based on the air pressure P is greater than the threshold value K1.

[0096] With this configuration, it is possible to determine whether or not the component 50 and the board 3 are in contact with each other.

[0097] Furthermore, in the component mounting apparatus 1 of this embodiment, the control unit C acquires second load information based on the second air pressure P2 after the contact determination (S16) and the predetermined component holding time T has elapsed.

[0098] With this configuration, after touchdown, second load information based on the stable second air pressure P2 can be stored. Furthermore, when the second voltage V2 is the maximum value of the voltage V2 during the placement operation, load information based on the maximum voltage can be stored, further improving the traceability of the placement operation of the component 50.

[0099] In the component mounting apparatus 1 of this embodiment, the control unit C acquires second load information based on the second air pressure P2 and determines whether the second voltage V2 is appropriate.

[0100] With this configuration, it is possible to determine whether the stable second voltage V2 is appropriate.

[0101] Furthermore, in the component mounting device 1 of this embodiment, the control unit C outputs the load information and the information about the mounting environment of the component 50 in association with each other.

[0102] With this configuration, linked data is created and the load information is managed together with information about the mounting environment of the component 50, improving traceability in the mounting work.

[0103] In addition, in the component mounting device 1 of this embodiment, the information regarding the mounting environment of the component 50 includes at least one of information regarding the component 50, information regarding the board 3, information regarding the nozzle 27, and the command load F0 input to the electro-pneumatic regulator 40.

[0104] This configuration further improves traceability in the mounting work.

[0105] In the component mounting apparatus 1 of this embodiment, the load information includes the load F that presses the component 50 against the board 3.

[0106] With this configuration, when component 50 is mounted on board 3, the load F actually applied to component 50 can be stored, improving traceability in the mounting work.

[0107] The component mounting method of this embodiment also includes a step of holding component 50 with nozzle 27 provided on press head 11 that can be raised and lowered relative to board 3. Furthermore, the component mounting method also includes a step of air pressure adjustment unit 42 in electro-pneumatic regulator 40 adjusting air pressure P applied to nozzle 27 during component mounting. Furthermore, the component mounting method also includes a step of nozzle 27 descending a predetermined distance D1, D2, or D3 relative to board 3 to press component 50 against board 3. Furthermore, the component mounting method also includes a step of measurement unit 41 in electro-pneumatic regulator 40 measuring air pressure P. Furthermore, the component mounting method also includes a step of control unit C connected to electro-pneumatic regulator 40 acquiring load information based on air pressure P measured by measurement unit 41.

[0108] With this configuration, load information relating to the load F actually applied to the component 50 is stored, and by storing the load information, traceability in the mounting work is improved.

[0109] Although the component mounting apparatus 1 has been described as having the head camera 13 that recognizes the board marks, the present invention is not limited to this. For example, when mounting components 50 on a board that does not have board marks, the component mounting apparatus 1 does not need to have the head camera 13.

[0110] Although the example in which the component mounting apparatus 1 makes the determinations in steps 16 and 22 during the mounting operation has been described, the present invention is not limited to this. For example, the control unit C may not perform the determinations in steps 17 and 22, but may store the voltages V1 and V2 in the memory unit 31 and make the determinations after the mounting operation is completed. Also, the determinations may be made when a product equipped with the board 3 breaks down.

[0111] Although the above description deals with an example in which the determinations in steps 16 and 22 are made based on voltages V1 and V2, the present invention is not limited to this. In step 16, if the first load information based on the first air pressure P1 is greater than a predetermined threshold, it may be determined that the component 50 is in contact with the board 3. For example, if the first air pressure P1 or the first load F1 is greater than a corresponding threshold, it may be determined that the component 50 is in contact with the board 3. In step 22, if the second load information based on the second air pressure P2 falls within a predetermined range, it may be determined that the second load information is appropriate. For example, if the second air pressure P2 or the second load F2 falls within a corresponding range, it may be determined that the second load information is appropriate.

[0112] Although step 21 has been described as being performed after the component holding time T has elapsed, this is not limiting and step 21 may be performed at any timing during the component holding time T (between point D and point E).

[0113] Although the example in which the control unit C stores both the voltages V1 and V2 has been described, the present invention is not limited to this. For example, the control unit C may store only one of the first voltage V1 or the second voltage V2.

[0114] Although the example in which control unit C stores two voltages V1 and V2 has been described, the present invention is not limited to this. In addition to point C or point E, control unit C may store in memory unit 31 a voltage V based on air pressure P measured at any time between points A and F. Control unit C may also store voltage V at predetermined intervals during the placement operation. By continuously storing voltage V in this manner, a relationship diagram between voltage V and time is obtained during the placement operation of component 50, making it clear that first voltage V1 and second voltage V2 are each local maximum voltages V. By more reliably storing the maximum value of voltage V, traceability during the placement operation of component 50 is further improved.

[0115] Although an example in which the pressing head 11 further descends in step 18 (if the contact determination is No) has been described, the present invention is not limited to this. For example, in step 18, the component mounting device 1 may issue a warning or instruction. The component mounting device 1 may issue an instruction ("Please raise the pin") to raise the pin that supports and pushes up the board 3.

[0116] Although an example in which a warning is displayed to the user only in step 24 has been described, the present invention is not limited to this. The warning may be displayed at any timing when the measuring unit 41 measures a sudden change in the load F.

[0117] Although an example of converting the voltage V to the load F has been described, the present invention is not limited to this. For example, the air pressure P may be converted directly into the load F.

[0118] Although the example in which the measuring unit 41 measures the air pressure P has been described, the present invention is not limited to this. For example, the measuring unit 41 may measure the voltage V.

[0119] [Embodiment 2] A component mounting system 100 according to a second embodiment of the present disclosure will be described. In the second embodiment, the same or equivalent configurations as those in the first embodiment will be denoted by the same reference numerals. Also, in the second embodiment, descriptions that overlap with those in the first embodiment will be omitted.

[0120] FIG. 12 is a block diagram of a component mounting system 100 according to the second embodiment of the present disclosure.

[0121] The second embodiment differs from the first embodiment in that the second embodiment is a component mounting system 100 including a component mounting device 101. More specifically, the component mounting system 100 creates and manages traceability data outside of the component mounting device 101. In the second embodiment, the component mounting device 101 is the same as the component mounting device 1 in the first embodiment unless otherwise specified.

[0122] (Overall composition) As shown in FIG. 12, the component mounting system 100 includes a component mounting device 101 and a processing device 150.

[0123] The component mounting device 101 includes a press head 11, an electropneumatic regulator 40, a control unit G, and a first communication unit 110.

[0124] The control unit G includes a component mounting processing unit 32, a load command unit 33, and a storage unit 31.

[0125] The first communication unit 110 transmits information stored in the memory unit 31 in the control unit G via the network. Specifically, the first communication unit 110 transmits load information and information related to the component mounting environment to the processing device 150 via the network. The first communication unit 110 includes a circuit that performs transmission to the second communication unit 151 of the processing device 150 in accordance with a predetermined communication standard (e.g., LAN, Wi-Fi (registered trademark), Bluetooth (registered trademark)).

[0126] The processing device 150 includes a second communication unit 151 and a processing unit 152. The processing device 150 is a computer. For example, the processing device 150 is a server or a cloud.

[0127] The second communication unit 151 receives, via the network, the load information transmitted by the first communication unit 110 and information relating to the mounting environment of the component 50. The second communication unit 151 includes a circuit for receiving information from the first communication unit 110 of the component mounting device 101 in accordance with a predetermined communication standard (e.g., LAN, Wi-Fi (registered trademark), Bluetooth (registered trademark)).

[0128] The processing unit 152 has a contact determination unit 34, a load appropriateness determination unit 35, and a traceability data creation unit 36. The processing unit 152 also has a memory unit 153 that stores information. The processing unit 152 performs a contact determination (S16) or a load appropriateness determination (S22) based on the information received by the second communication unit 151, and creates and stores traceability data. The memory unit 153 of the processing unit 152 may store a threshold value K1 and an appropriate range L of the voltage V.

[0129] (operation) In the component mounting device 101, the control unit G acquires load information based on the air pressures P1 and P2 and stores it in the memory unit 31. The first communication unit 110 transmits the load information and information related to the component mounting environment stored in the memory unit 31 to the second communication unit 151. In the processing device 150, the second communication unit 151 receives the load information and information related to the component mounting environment. The processing unit 152 may compare the received load information with a threshold value K1 to determine whether the component 50 is in contact with the board 3. The processing unit 152 may also compare the received load information with an appropriate range L to determine whether the load information is appropriate. The processing unit 152 associates the load information received by the second communication unit 151 with the information related to the mounting environment of the component 50, creates traceability data for the component 50 together with the determination result, and stores the data in the memory unit 153.

[0130] (effect) The component mounting system 100 according to the second embodiment can provide the following effects.

[0131] As described above, the component mounting system 100 of this embodiment includes the component mounting device 101 and the processing device 150 that communicates with the component mounting device 101 via a network. The component mounting device 101 includes a press head 11, an electro-pneumatic regulator 40, a control unit C, and a first communication unit 110. The press head 11 has a nozzle 27 that holds the component 50 and presses it against the board 3, and is movable up and down relative to the board 3. The electro-pneumatic regulator 40 includes an air pressure adjustment unit 42 that adjusts the air pressure P applied to the nozzle 27 and a measurement unit 41 that measures the air pressure P during component mounting. The control unit C is connected to the electro-pneumatic regulator 40 and acquires load information based on the air pressure P measured by the measurement unit 41. The first communication unit 110 transmits the load information and information related to the component mounting environment via the network. The processing device 150 has a second communication unit 151 that receives the load information and the information about the wearing environment via the network, and a processing unit 152 that associates the load information with the information about the wearing environment and stores them.

[0132] With this configuration, load information regarding the load F actually applied to component 50 during the mounting operation can be managed in association with information regarding the mounting environment of component 50. This improves traceability during the mounting operation of component 50.

[0133] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various changes and modifications will be apparent to those skilled in the art, and such changes and modifications are to be understood as included within the scope of the present invention as defined by the appended claims unless they depart therefrom. [Industrial Applicability]

[0134] The component mounting device of the present disclosure is useful in a component mounting device that presses a component against a board, in order to improve the traceability of information on the load applied to the component. [Explanation of symbols]

[0135] 1. Component placement device 3. Circuit Board 10 Head Unit 11 Pressing head 22 Balloon 23 Piston 24 cylinders 27 nozzles 31 Storage section 33 Load command section 34 Contact determination section 35 Load suitability determination section 36 Traceability Data Creation Department 37 Traceability data output section 40 Electro-pneumatic regulator 41 Measurement section 42 Air pressure adjustment section 50 parts 100 Component Placement System 101 Component placement device 110 First Communications Department 150 processing equipment 151 Second Communications Department 152 Processing section C control section

Claims

1. a press head having a nozzle for holding a component and pressing the component against a substrate, the press head being movable up and down relative to the substrate; an electro-pneumatic regulator having an air pressure adjusting unit that adjusts the air pressure applied to the nozzle before pressing the component, and a measuring unit that measures the air pressure; a control unit connected to the electro-pneumatic regulator, which raises and lowers the press head based on the air pressure measured by the measurement unit, and which acquires load information based on the air pressure measured by the measurement unit while the component is being pressed.

2. 2. The component mounting device according to claim 1, wherein the control unit, when determining that the component is in contact with the board, acquires first load information based on a first air pressure, and, when determining that the component is not in contact with the board, lowers the pressure head.

3. 3. The component mounting device according to claim 2, wherein the control unit determines that the component is in contact with the board when the air pressure or the load information is greater than a threshold value.

4. 4. The component mounting device according to claim 1, wherein the control unit, after determining that contact has occurred, acquires second load information based on the second air pressure after a predetermined component holding time has elapsed or during the component holding time.

5. The component mounting device according to claim 4 , wherein the control unit acquires second load information based on the second air pressure and determines whether the second load information is appropriate.

6. A pressing head having a nozzle for pressing a component against a substrate while holding the component, the pressing head being capable of moving up and down relative to the substrate; an electro-pneumatic regulator having an air pressure adjusting unit that adjusts the air pressure applied to the nozzle and a measuring unit that measures the air pressure during component mounting; a control unit connected to the electro-pneumatic regulator and acquiring load information based on the air pressure measured by the measurement unit, The control unit outputs the load information and the information regarding the component mounting environment in association with each other.

7. 7. The component mounting device according to claim 6, wherein the information relating to the component mounting environment includes at least one of information relating to the component, information relating to the board, information relating to the nozzle, and a command load input to the electro-pneumatic regulator.

8. The component mounting device according to claim 1 , wherein the load information includes a load that presses the component against the board.

9. holding the component by a nozzle provided on a press head that can be raised and lowered relative to the substrate; a step of adjusting the air pressure applied to the nozzle by an air pressure adjusting unit of an electro-pneumatic regulator before pressing the component; lowering the nozzle a predetermined distance relative to the substrate and pressing the component against the substrate; a step of measuring the air pressure by a measuring unit in the electro-pneumatic regulator; raising and lowering the pressing head based on the air pressure measured by the measuring unit; a control unit connected to the electro-pneumatic regulator acquiring load information based on the pneumatic pressure measured by the measuring unit; A component mounting method including:

10. a component mounting device; a processing device that communicates with the component mounting device via a network; Equipped with The component mounting device a press head having a nozzle for holding a component and pressing the component against a substrate, the press head being movable up and down relative to the substrate; an electro-pneumatic regulator having an air pressure adjusting unit that adjusts the air pressure applied to the nozzle and a measuring unit that measures the air pressure during component mounting; a control unit connected to the electro-pneumatic regulator and configured to acquire load information based on the air pressure measured by the measurement unit; a first communication unit that transmits the load information and information related to the component mounting environment via the network; and The processing device includes: a second communication unit that receives the load information and the information related to the mounting environment via the network; a processing unit that associates and stores the load information with information about the mounting environment; A component mounting system having:

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