Flexural strength measuring device

Abstract

To provide a bending strength measuring device capable of suppressing labor required for designating a plurality of chips to be measured.SOLUTION: A bending strength measuring device 1 includes a pickup mechanism for picking up a plurality of chips 14 from a wafer 10, a bending strength measuring mechanism 200 for measuring the bending strength of each of the plurality of chips 14 picked up by the pickup mechanism, and a controller 400, and has at least one of a circular measurement mode in which the plurality of chips 14 on designated points on a concentric line concentric with respect to the outer peripheral edge of the wafer 10 are sequentially picked up from the wafer 10 and the bending strength is measured, and a lattice measurement mode in which the plurality of chips 14 on specified points, which are the intersections of equal dividing lines that equally divide the wafer 10 into a predetermined number of pieces in the Y-axis direction and the X-axis direction, are sequentially picked up from the wafer and the bending strength is measured.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a flexural strength measuring device that includes a pickup mechanism that picks up multiple chips from a wafer that has been singulated into individual chips, a flexural strength measuring mechanism that measures the flexural strength of each of the multiple chips picked up by the pickup mechanism, and a controller that controls at least the pickup mechanism and the flexural strength measuring mechanism. [Background technology]

[0002] In the manufacturing process of semiconductor devices, wafers are thinned by back grinding and polishing, and then divided into individual chips by blade dicing or laser dicing. One way to evaluate whether the processing conditions applied to wafers, such as back grinding, polishing, blade dicing, or laser dicing, are appropriate is to measure the flexural strength of chips formed by processing dummy wafers or device wafers.

[0003] Specifically, multiple chips are picked up at specific positions on a wafer that has been processed and singulated under certain processing conditions, and the flexural strength of each is measured, and chips are picked up at the same specific positions on a wafer that has been processed and singulated under different processing conditions, and the flexural strength of each is measured.The flexural strengths of chips at different positions on a wafer that has been processed and singulated under the same processing conditions are then compared, or the flexural strengths of chips at the same position that have been processed and singulated under different processing conditions are compared.

[0004] Conventionally, an operator would pick up a chip from a wafer and set it in a die strength measuring machine to measure its die strength. To eliminate this hassle and reduce the impact of a drop in die strength due to picking, the present applicant has developed and provided a so-called fully automatic die strength measuring device that picks up chips from a divided wafer and measures their die strength (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2020-094833 Summary of the Invention [Problem to be solved by the invention]

[0006] On the other hand, the die strength measuring device disclosed in Patent Document 1 has a problem in that it is necessary to specify multiple chips on the wafer each time the die strength of which should be measured, and specifying these chips is time-consuming.

[0007] An object of the present invention is to provide a die strength measuring device that can reduce the effort required to specify a plurality of chips to be measured. [Means for solving the problem]

[0008] In order to solve the above-mentioned problems and achieve the object, the die strength measuring device of the present invention is a die strength measuring device comprising a pickup mechanism that picks up a plurality of chips from a wafer that has been singulated into individual chips, a die strength measuring mechanism that measures the die strength of each of the plurality of chips picked up by the pickup mechanism, and a controller that controls at least the pickup mechanism and the die strength measuring mechanism, and is characterized by having at least one of a circular measurement mode in which a plurality of chips located at designated points on concentric circles that are concentric with the outer periphery of the wafer are sequentially picked up from the wafer to measure their die strength, and a grid measurement mode in which a plurality of chips located at intersections of equal divisions that divide the wafer into a predetermined number of equal parts vertically and horizontally are sequentially picked up from the wafer to measure their die strength.

[0009] In the above-mentioned bending strength measuring device, the controller may comprise: a concentric circle position information input unit into which concentric circle position information specifying the position of the concentric circle line is input when measurement is performed in the circular measurement mode; and an equal fraction input unit into which concentric circle equal fraction information specifying the specified point on the concentric circle line is input; and may also comprise a denominator input unit into which denominators for dividing the wafer equally vertically and horizontally are input when measurement is performed in the grid measurement mode.

[0010] The die strength measuring device of the present invention comprises: a pickup mechanism that picks up a plurality of chips from a wafer that has been singulated into individual chips; a die strength measuring mechanism that measures the die strength of each of the plurality of chips picked up by the pickup mechanism; and a controller that controls at least the pickup mechanism and the die strength measuring mechanism. a display unit connected to the controller and displaying wafer data including the entire plan view of the wafer on a display screen; and an input unit connected to the controller and configured with a touch panel overlaid on the display screen; A bending strength measuring device comprising: Any position of the wafer data displayed on the display unit can be input by the input unit. The present invention is characterized by having a designated point measurement mode in which, when designated, a chip on the designated point is picked up from the wafer and its bending strength is measured. [Effects of the Invention]

[0011] The present invention has an effect of reducing the time and effort required to specify a plurality of chips to be measured. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view showing a part of a configuration example of a bending strength measuring device according to the first embodiment. [Figure 2] FIG. 2 is a perspective view of a main part of the bending strength measuring device shown in FIG. [Figure 3] FIG. 3 is a perspective view of a wafer unit including a wafer divided into chips to be measured by the bending strength measuring device shown in FIG. [Figure 4] FIG. 4 is a diagram schematically showing an example of wafer data stored in the storage unit of the controller of the bending strength measuring apparatus shown in FIG. [Figure 5]FIG. 5 is a diagram showing an example of a mode selection screen displayed on the display unit when a measurement mode of the bending strength measuring device shown in FIG. 1 is selected. [Figure 6] FIG. 6 is a diagram showing an example of a circular measurement mode input screen displayed on the display unit after the circular measurement mode of the bending strength measuring device shown in FIG. 1 is selected. [Figure 7] FIG. 7 is a diagram showing an example of a grid-like measurement mode input screen displayed on the display unit after the grid-like measurement mode of the bending strength measuring device shown in FIG. 1 is selected. [Figure 8] FIG. 8 is a diagram showing another example of the grid-pattern measurement mode input screen displayed on the display unit after the grid-pattern measurement mode of the bending strength measuring device shown in FIG. 1 is selected. [Figure 9] FIG. 9 is a diagram showing an example of a grid-like measurement mode input screen displayed on the display unit after the grid-like measurement mode of the bending strength measuring device according to the modified example of the first embodiment is selected. [Figure 10] FIG. 10 is a perspective view showing a part of a configuration example of a bending strength measuring device according to the second embodiment. [Figure 11] FIG. 11 is a perspective view of the essential parts of the bending strength measuring device shown in FIG. [Figure 12] FIG. 12 is a diagram showing an example of a designated point measurement mode input screen displayed on the display unit after the designated point measurement mode of the bending strength measuring device shown in FIG. 10 is selected. [Figure 13] FIG. 13 is a perspective view showing a part of a configuration example of a bending strength measuring device according to the third embodiment. [Figure 14] FIG. 14 is a perspective view of the essential parts of the bending strength measuring device shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0013] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0014] [Embodiment 1] A deflective strength measuring device according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a part of an example of the configuration of the deflective strength measuring device according to the first embodiment. Fig. 2 is a perspective view of a main part of the deflective strength measuring device shown in Fig. 1. Fig. 3 is a perspective view of a wafer unit including a wafer divided into chips to be measured by the deflective strength measuring device shown in Fig. 1.

[0015] The flexural strength measuring device 1 shown in Figures 1 and 2 of embodiment 1 is an apparatus that picks up a test piece, a chip 14, from tape 15 of a wafer unit 17 shown in Figure 3, images the chip 14, and destroys the imaged chip 14 to measure the flexural strength of the chip 14.

[0016] (Wafer unit) 3, wafer unit 17 includes wafer 10 divided into multiple chips 14, tape 15 to which wafer 10 is attached, and annular frame 16 to which the outer periphery of tape 15 is attached, thereby accommodating wafer 10 within an opening. Wafer 10 is a disk-shaped semiconductor wafer, optical device wafer, or the like, with substrate 11 made of silicon, sapphire, gallium, or the like.

[0017] The wafer 10 has devices 13 formed in areas defined by a plurality of planned division lines 12 formed in a grid pattern on the front surface 11-1 of the substrate 11. In the first embodiment, the wafer 10 has a disk-shaped tape 15 with an annular frame 16 attached to its outer periphery attached to the back surface 11-2 behind the front surface 11-1, and is supported by the annular frame 16 to form a wafer unit 17. The wafer 10 also has a notch 19 formed on its outer periphery, which is an irregularly shaped portion indicating a crystal orientation.

[0018] The wafer 10 is also cut along the planned division lines 12 to be singulated into individual chips 14. That is, the wafer 10 has cut grooves 18 formed between the chips 14, which penetrate the wafer 10 itself. Each chip 14 is made up of a part of the substrate 11 and a device 13, and has a front surface 11-1, a back surface 11-2 behind the front surface 11-1, and a plurality of side surfaces extending from the front surface 11-1 to the back surface 11-2.

[0019] In embodiment 1, the wafer 10 has devices 13 formed on the surface 11-1 of the substrate 11, but in the present invention, when the flexural strength measuring device 1 is used to evaluate the validity of the processing conditions for the so-called post-process of dividing the wafer 10 into individual chips 14, the devices 13 do not need to be formed on the surface 11-1.

[0020] (Transverse bending strength measuring device) As shown in FIG. 1, the flexural strength measuring device 1 includes a cassette mounting table 3 provided on an apparatus main body 2 and on which a cassette 4 containing a plurality of wafer units 17 is mounted, a transfer unit 5 for transferring the wafer units 17 into and out of the cassette 4, a pair of temporary placement rails 6 on which the wafer units 17 transferred out of the cassette 4 or the wafer units 17 before being transferred into the cassette 4 are temporarily placed, a frame fixing unit 7, a moving mechanism 30 for moving the frame fixing unit 7 in the Y-axis direction and the X-axis direction, a push-up unit 40, an imaging camera 50, a pickup mechanism 60, a holder moving unit 70 (shown in FIG. 2), an imaging device 100, a flexural strength measuring mechanism 200, and a controller 400.

[0021] The cassette 4 is a storage container that stores a plurality of wafer units 17 at intervals in the Z-axis direction parallel to the vertical direction, and is provided with an opening 8 for inserting and removing the wafer units 17. The cassette mounting table 3 has the cassette 4 placed on its upper surface and moves the cassette 4 up and down in the Z-axis direction.

[0022] The pair of temporary placement rails 6 are provided on both ends of the width direction of the opening 8 of the cassette 4 placed on the cassette placement table 3 on the apparatus main body 2, and extend linearly in the Y-axis direction parallel to the horizontal direction. The pair of temporary placement rails 6 are arranged parallel to each other and spaced apart along the X-axis direction which is perpendicular to the Y-axis direction and parallel to the horizontal direction. The pair of temporary placement rails 6 temporarily place the annular frame 16 of the wafer unit 17.

[0023] The carry-in / out unit 5 is provided so as to be movable in the Y-axis direction by a movement mechanism (not shown). The carry-in / out unit 5 carries the wafer unit 17 out of the cassette 4 and temporarily places it on the temporary placement rails 6, and then carries the wafer unit 17 out to the upper surface of the frame support member 22 to which the frame fixing unit 7 has been lowered, and places it on the upper surface of the frame support member 22. The carry-in / out unit 5 also carries the wafer unit 17 from the upper surface of the frame support member 22 to which the frame fixing unit 7 has been lowered into the cassette 4 via the temporary placement rails 6.

[0024] (frame fixing unit) The frame fixing unit 7 holds and fixes the annular frame 16 arranged around the wafer 10 on the tape 15 of the wafer unit 17, i.e., the annular frame 16 arranged around the chip 14 to be picked up. The frame fixing unit 7 is installed on a moving table 21. The frame fixing unit 7 includes an annular frame support member 22, an annular frame pressing member 23 arranged above and fixed to the frame support member 22, and an elevating mechanism (not shown) that raises and lowers the frame support member 22.

[0025] Before being raised, the upper surface of the frame support member 22 is positioned flush with the upper surface of the temporary placement rail 6, and the annular frame 16 of the wafer unit 17 is placed on it. When the annular frame 16 of the wafer unit 17 is placed on the upper surface of the frame support member 22, the frame fixing unit 7 uses the lifting mechanism to raise the frame support member 22 and sandwich the annular frame 16 between the frame holding member 23 and the frame support member 22. The frame fixing unit 7 sandwiches the annular frame 16 between the frame holding member 23 and the frame support member 22, holds and fixes the annular frame 16 arranged around the wafers 10 on the tape 15, and fixes the wafer unit 17.

[0026] (moving mechanism) The movement mechanism 30 includes an X-axis movement mechanism 31 that is provided on the apparatus main body 2 and moves the movement table 21 in the X-axis direction, and a Y-axis movement mechanism 32 that is provided on the movement table 21 that is moved in the X-axis direction by the X-axis movement mechanism 31 and moves the frame fixing unit 7 in the Y-axis direction. The X-axis movement mechanism 31 moves the movement table 21, i.e., the frame fixing unit 7, in the X-axis direction between a position aligned with the pair of temporary placement rails 6 in the Y-axis direction and a position separated from the pair of temporary placement rails 6. Each movement mechanism 31, 32 includes well-known ball screws 33, 34 that are provided rotatably about their axes, well-known motors 35, 36 that rotate the ball screws 33, 34 about their axes, and well-known guide rails 37, 38 that support the movement table 21 or the frame fixing unit 7 movably in the X-axis or Y-axis direction.

[0027] (Thrust-up unit) The push-up unit 40 is disposed below the frame fixing unit 7, which is positioned by the X-axis movement mechanism 31 at a position away from the pair of temporary placement rails 6. The push-up unit 40 is provided in the recess 9 of the device main body 2, and pushes up one of the chips 14 via the tape 15 of the wafer unit 17 fixed by the frame fixing unit 7, which is positioned by the X-axis movement mechanism 31 at a position away from the pair of temporary placement rails 6.

[0028] The push-up unit 40 is connected as a whole to an elevation mechanism (not shown) formed by a motor or the like, and moves up and down along the Z-axis direction. The push-up unit 40 has a tape holding portion 41 formed in the shape of a hollow cylinder, and a push-up portion 42 in the shape of a rectangular pillar arranged inside the tape holding portion 41. The top surface of the tape holding portion 41 is formed flat and parallel to the horizontal direction, and has a plurality of suction grooves formed concentrically along the circumferential direction of the tape holding portion 41. Each suction groove is connected to a suction source such as an ejector via a suction path and an on-off valve formed inside the push-up unit 40.

[0029] The push-up portion 42 is formed in a rectangular shape with a planar shape of the upper surface that is smaller than the planar shape of the chip 14. The push-up portion 42 is connected to a lifting unit formed of a motor or the like, and moves up and down along the Z-axis direction.

[0030] With the wafer unit 17 including the annular frame 16 held by the frame fixing unit 7 positioned above, the push-up unit 40 sucks the suction grooves on the upper surface of the tape holding section 41 with a suction source, and sucks and holds the tape 15 around the chip 14 to be picked up on the upper surface of the tape holding section 41. The push-up unit 40 sucks and holds the tape 15 around the chip 14 to be picked up on the upper surface of the tape holding section 41, and as the push-up section 42 is raised, the chip 14 is pushed up above the tape 15, and the outer periphery of the chip 14 is peeled off from the tape 15. The dimensions of the push-up unit 40 are adjusted appropriately according to the size of the chip 14.

[0031] (imaging camera) The imaging camera 50 is disposed above the frame fixing unit 7, which is positioned by the X-axis movement mechanism 31 at a position away from the pair of temporary placement rails 6. The imaging camera 50 forms a captured image by capturing an image of the chip 14 and the surroundings of this chip 14 that are pushed up by the push-up portion 42 of the push-up unit 40 of the wafer 10 of the wafer unit 17, which includes the annular frame 16 held by the frame fixing unit 7, which is positioned by the X-axis movement mechanism 31 at a position away from the pair of temporary placement rails 6.

[0032] The imaging camera 50 includes an imaging element (i.e., pixel) that captures an image of the chip 14 pushed up by the push-up portion 42 of the push-up unit 40 of the wafer 10 of the wafer unit 17 including the annular frame 16 held by the frame fixing unit 7, and the surroundings of the chip 14. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element.

[0033] The imaging camera 50 photographs the chip 14 pushed up by the push-up portion 42 of the push-up unit 40 of the wafer 10 of the wafer unit 17 including the annular frame 16 held by the frame fixing unit 7, and the surroundings of this chip 14, to obtain an image for aligning the chip 14 to be picked up pushed up by the push-up unit 40 of the wafer 10 with the push-up unit 40, and outputs the obtained image to the controller 400.

[0034] (Pickup mechanism) The pickup mechanism 60 picks up the chips 14 pushed up by the push-up unit 40 from the wafer 10 of the wafer unit 17. The pickup mechanism 60 also picks up the multiple chips 14 one by one from the wafer 10. The pickup mechanism 60 includes a moving base 61 that is moved in the Y-axis direction and the Z-axis direction by a holder moving unit 70, an arm 62 that extends in the X-axis direction from the moving base 61 away from the holder moving unit 70, and a holder 63 that is connected to the tip of the arm 62 via an elevator part 64 and that holds the chips 14.

[0035] The holder 63 has a lower surface 65 that faces the push-up portion 42 of the push-up unit 40, sandwiching the wafer unit 17 fixed by the frame fixing unit 7, which is positioned by the X-axis movement mechanism 31 at a position away from the pair of temporary placement rails 6. The planar shape of the lower surface 65 is formed into a rectangle of the same size as the chip 14. The lower surface 65 has a suction groove formed therein that is connected to a suction source 68, such as an ejector, via a suction path 66 and an on-off valve (not shown). A pressure sensor 69 that measures the pressure within the suction path 66 is connected to the suction path 66. The pressure sensor 69 outputs the measurement result to the controller 400.

[0036] With the chip 14 pushed up by the push-up portion 42 in contact with the lower surface 65 of the holder 63, the suction groove is sucked by the suction source 68, and the chip 14 is sucked and held on the lower surface 65. The holder 63 sucks and holds the chip 14 pushed up by the push-up portion 42 of the push-up unit 40 on the lower surface 65, and is raised by the holder moving unit 70, thereby picking up the chip 14 sucked and held on the lower surface 65 from the tape 15.

[0037] Furthermore, in the first embodiment, the flexural strength measuring device 1 may be provided with a load cell, which is a measuring means, on the upper surface side of the push-up unit 40, for measuring the load applied to the chip 14 when it is picked up from the tape 15. The load cell outputs the measurement results to the controller 400. Note that in the present invention, the load cell, which is a measuring means, may be provided on the lower surface 65 side of the holder 63 of the pickup mechanism 60.

[0038] The lifting unit 64 is provided at the tip of the arm 62, has a holder 63 attached to its lower end, and is raised and lowered along the Z-axis direction relative to the arm 62 by a cylinder or the like (not shown). When the lifting unit 64 is lowered, it brings the lower surface of the holder 63 closer to the wafers 10 of the wafer unit 17 including the annular frame 16 held by the frame fixing unit 7, and when the lifting unit 64 is raised, it moves the lower surface of the holder 63 away from the wafers 10 of the wafer unit 17.

[0039] (Holder moving unit) The holder moving unit 70 moves the holder 63 along the Z-axis direction and the Y-axis direction. The holder moving unit 70 moves the holder 63 between a pickup position where the chip 14 is picked up from the tape 15, an imaging position where the side of the chip 14 held by the holder 63 is imaged by the side imaging camera 121 of the imaging device 100, and a measurement position where the chip 14 is placed on a pair of support parts (not shown) of the support unit 210 of the flexural strength measuring mechanism 200 and the flexural strength of the chip 14 is measured by the flexural strength measuring mechanism 200. The holder moving unit 70 moves the holder 63 between the pickup position and the measurement position, thereby transporting the chip 14 picked up by the holder 63 to the support unit 210 of the flexural strength measuring mechanism 200.

[0040] As shown in Figure 2, the holder moving unit 70 comprises a second Y-axis moving mechanism 71 that is provided on the device main body 2 and moves the moving table 73 in the Y-axis direction, and a Z-axis moving mechanism 72 that is provided on the moving table 73 that is moved in the Y-axis direction by the second Y-axis moving mechanism 71 and moves the moving base 61, i.e., the pickup mechanism 60, in the Z-axis direction.

[0041] The second Y-axis movement mechanism 71 moves the moving table 73, i.e., the pickup mechanism 60, along the Y-axis from a pickup position where the upper surface of the tape holding part 41 of the push-up unit 40 and the lower surface 65 of the holder 63 face each other in the Z-axis direction toward the deflective strength measuring mechanism 200. Each of the movement mechanisms 71, 72 includes well-known ball screws 74, 75 that are rotatable about their axes, well-known motors 76, 77 that rotate the ball screws 74, 75 about their axes, and well-known guide rails 78, 79 that support the moving table 73 or the pickup mechanism 60 so that it can move in the Y-axis or Z-axis direction.

[0042] (imaging device) The imaging device 100 captures and observes the front surface 11-1, back surface 11-2, and side surface of the chip 14. As shown in Figures 1 and 2, the imaging device 100 includes a lower imaging unit 101 arranged adjacent to the push-up unit 40 in the Y-axis direction on the device body 2, a chip inversion mechanism 110 that inverts the chip 14 upside down, and a lateral imaging unit 120.

[0043] The lower imaging unit 101 includes a lower imaging camera 102 that captures an image of the chip 14 held by the holder 63 of the pickup mechanism 60 from below. The lower imaging camera 102 is disposed at a position that overlaps with the movement path of the holder 63. In the lower imaging unit 101, the lower imaging camera 102 captures an image of the chip 14 from below, and outputs the captured image to the controller 400.

[0044] The chip inversion mechanism 110 inverts the top and bottom of the front surface 11-1 and back surface 11-2 of the chip 14, i.e., turns the chip 14 upside down. The chip inversion mechanism 110 is arranged alongside the lower imaging unit 101 in the Y-axis direction and at a position farther away from the push-up unit 40 than the lower imaging unit 101. The chip inversion mechanism 110 includes a columnar chip support base 111 that supports the chip 14, and an inversion mechanism 112.

[0045] The chip support base 111 extends upward from the apparatus main body 2 and is disposed in a position aligned with the downward imaging camera 102 in the Y-axis direction (i.e., a position overlapping with the movement path of the holder 63). The chip support base 111 has a flat upper surface formed parallel to the horizontal direction, and supports the chip 14 transported by the holder 63 of the pickup mechanism 60 on its upper surface. The chip support base 111 is also connected to a rotary drive source (not shown), and is rotated by the rotary drive source around an axis parallel to the Z-axis direction.

[0046] The inversion mechanism 112 is disposed above the chip support base 111. The inversion mechanism 112 is configured to be able to rotate the base part 113 by 180° around an axis parallel to the X-axis direction while holding the chip 14 at its tip.

[0047] When flipping the chip 14 upside down, the chip inversion mechanism 110 supports the chip 14 transported by the holder 63 of the pickup mechanism 60 on the upper surface of the chip support base 111, and rotates the base 113 by 180° from the position shown by the solid lines in Figures 1 and 2 relative to the upper surface of the chip support base 111 supporting the chip 14 to the position shown by the dotted lines in Figures 1 and 2. The chip inversion mechanism 110 suction-holds the chip 14 at its tip, and rotates the base 113 by 180° to flip the chip 14 upside down.

[0048] The chip 14 inverted by the chip inverting mechanism 110 is held by suction by the holder 63 of the pickup mechanism 60, and the suction holding of the tip of the chip inverting mechanism 110 is stopped. In this way, the chip inverting mechanism 110 turns the chip 14 upside down.

[0049] In addition, since the die strength measuring device 1 is provided with the chip support base 111 at a position overlapping with the movement path of the holder 63 , the holder 63 can place the die 14 on the upper surface of the chip support base 111 .

[0050] The lateral imaging unit 120 captures an image of the chip 14 from the side, i.e., the side surface of the chip 14. The lateral imaging unit 120 is disposed adjacent to the lower imaging unit 101 in the Y-axis direction, and in the first embodiment, is disposed between the lower imaging unit 101 and the chip inverting mechanism 110.

[0051] The lateral imaging unit 120 has a side imaging camera 121, which is a camera that images the side surface 11-3 of the chip 14. The side imaging camera 121 is disposed at a position where it can image the side surface of the chip 14 held by suction in the holder 63 of the pickup mechanism 60, and in the first embodiment, it is disposed at a position facing the side surface of the chip 14 held by suction in the holder 63 of the pickup mechanism 60 in the X-axis direction. The side imaging camera 121 has an imaging element that images the side surface of the chip 14. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element.

[0052] The side image capturing camera 121 focuses on the side of the chip 14 held by suction on the holder 63 of the pickup mechanism 60 , captures an image of the side, and outputs the captured image to the controller 400 .

[0053] The lateral imaging unit 120 images one side of the chip 14 held by suction on the holder 63 of the pickup mechanism 60 using the side imaging camera 121. Thereafter, the holder 63 causes the chip 14 to be supported on the chip support base 111, and after the chip support base 111 rotates around its axis, the chip 14 on the chip support base 111 is again held by suction on the holder 63, and the other side of the chip 14 held by suction on the holder 63 is imaged by the side imaging camera 121.

[0054] In this way, the lateral imaging unit 120 images all sides of the chip 14 (for example, the sides of the four sides of the chip 14) using the side imaging camera 121, obtains an image including the thickness of the chip 14 and the size of any chips formed in the chip 14, and outputs the obtained image to the controller 400.

[0055] Using the above-described lower imaging unit 101 and side imaging unit 120, the imaging device 100 images the front surface 11-1, back surface 11-2, and side surface of the chip 14 picked up by the holder 63. Note that in the present invention, the side imaging camera 121 that images the side surface of the chip 14 may be provided at a position where it can image the side surface of the chip 14 supported on the upper surface of the chip support base 111, and may image the side surface of the chip 14 supported on the upper surface of the chip support base 111.

[0056] (Transverse bending strength measurement mechanism) The flexural strength measuring mechanism 200 measures the flexural strength of each of the plurality of chips 14 picked up by the pickup mechanism 60. The flexural strength measuring mechanism 200 is disposed adjacent to the imaging device 100 in the Y-axis direction, and in the first embodiment, is disposed on the side farther from the push-up unit 40 than the chip inverting mechanism 110. In the first embodiment, the flexural strength measuring mechanism 200 is disposed at a position overlapping with the movement path of the holder 63.

[0057] The flexural strength measuring mechanism 200 includes a support unit 210 and a pressing unit 220. The support unit 210 supports the chip 14 that has been picked up by the holder 63 of the pickup mechanism 60 and whose front surface 11-1, back surface 11-2, and side surfaces have been imaged by the imaging device 100. The support unit 210 is disposed at a position overlapping with the movement path of the holder 63. For this purpose, the holder moving unit 70 moves the holder 63 from a position facing the push-up unit 40 in the Z-axis direction to a position facing the support unit 210 in the Z-axis direction.

[0058] The support unit 210 includes a pair of support parts (not shown) that are arranged at a predetermined interval and support the rear surface 11-2 of the chip 14. The pair of support parts are arranged at a predetermined interval from each other in the X-axis direction.

[0059] The pressing unit 220 presses the chip 14 supported by the support unit 210 with an indenter 221, measures the load acting on the pressing unit 220 when pressing the chip 14, and presses and destroys the chip 14 supported by the support unit 210. The pressing unit 220 is provided above the support unit 210.

[0060] As shown in FIGS. 1 and 2, the pressing unit 220 includes an indenter 221, an indenter moving unit 222, and a load measuring device 223.

[0061] The indenter 221 is disposed above the support unit 210 and between a pair of support parts that support the back surface 11-2 of the chip 14. The indenter movement unit 222 moves the indenter 221 along the Z-axis direction relatively closer to the chip 14 supported by the pair of support parts. The indenter movement unit 222 supports the indenter 221 at its lower end, positions the indenter 221 opposite the space between the pair of support parts of the support unit 210 along the Z-axis direction, and moves the indenter 221 up and down along the Z-axis direction.

[0062] The load measuring device 223 measures the load with which the indenter 221 presses the chip 14 supported by the support parts. In the first embodiment, the load measuring device 223 is moved up and down along the Z-axis direction together with the indenter 221 by the indenter moving unit 222. The load measuring device 223 is configured with a well-known load cell or the like, and measures the load with which the indenter 221 presses the chip 14 supported by a pair of support parts, and outputs the measurement result to the controller 400.

[0063] When measuring the flexural strength of the chip 14, the flexural strength measuring mechanism 200 places the chip 14 on a pair of supports using a holder 63 or the like. At this time, both ends of the chip 14 are supported by the pair of supports, and the center overlaps between the pair of supports.

[0064] The flexural strength measuring mechanism 200 lowers the indenter 221 using the indenter moving unit 222, presses the chip 14 with the indenter 221, measures the load (force in the Z-axis direction) applied to the indenter 221 pressing the chip 14 with a load measuring instrument 223, and destroys the chip 14 with the indenter 221 while appropriately outputting the measurement results to the controller 400. The flexural strength measuring mechanism 200 performs a three-point bending test using the pair of support parts of the chip 14 and the indenter 221, measures the bending strength (flexural strength) of the chip 14 through this three-point bending test, and outputs the measurement results to the controller 400.

[0065] (controller) Next, the controller 400 will be described with reference to the drawings. Fig. 4 is a diagram schematically showing an example of wafer data stored in the memory unit of the controller of the die strength measuring apparatus shown in Fig. 1. The controller 400 controls each of the above-mentioned components of the die strength measuring apparatus 1 to cause the die strength measuring apparatus 1 to perform an imaging operation for imaging the front surface 11-1, back surface 11-2, and side surface of the chip 14, and a measurement operation for each chip 14 for measuring the die strength of the chip 14. In other words, the controller 400 also controls at least the pickup mechanism 60 and the die strength measuring mechanism 200.

[0066] The controller 400 is a computer having an arithmetic processing device with a microprocessor such as a CPU (central processing unit), a storage device with memory such as a ROM (read only memory) or RAM (random access memory), and an input / output interface device. The arithmetic processing device of the controller 400 performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs control signals for controlling the bending strength measuring device 1 to each of the above-mentioned units of the bending strength measuring device 1 via the input / output interface device.

[0067] The controller 400 is also connected to a display unit 300 (shown in FIG. 1) which is a display means having a display screen 301 for displaying the status of the measurement operation, images, etc., and an input unit 302 (shown in FIG. 1) which an operator uses to input information, etc., into the controller 400 of the bending strength measuring device 1. The display unit 300 is configured with a liquid crystal display device or the like. The input unit 302 is configured with a touch panel or the like which is placed on the display screen 301 of the display unit 300.

[0068] 1 and 2, the controller 400 includes a memory unit 401, a circular measurement mode execution unit 410, and a grid measurement mode execution unit 420. The memory unit 401 stores wafer data 500, an example of which is shown in FIG. 4, input by the input unit 302. The wafer data 500 stored in the memory unit 401 includes the position of each chip 14 on the wafer 10.

[0069] In the first embodiment, the wafer data 500 uses the notch 19 as a reference and a predetermined position on a square plane 503 including the entire wafer 10 in a planar view as an origin 501. The position of each chip 14 is determined based on the number of regions 502 on the square plane 503 in the X-axis direction from the origin 501 in which each chip 14 is located and the number of regions 502 on the square plane 503 in the Y-axis direction in which each chip 14 is located. Note that in the first embodiment, the square plane 503 of the wafer data 500 has the notch 19 positioned at the center in the X-axis direction and the planned dividing lines 12 of the wafer 10 parallel to the X-axis direction and the Y-axis direction. The square plane 503 of the wafer data 500 includes a plurality of regions 502 partitioned in a grid pattern by the centers of the planned dividing lines 12 in the width direction and extensions of the centers of the planned dividing lines 12 in the width direction.

[0070] In the first embodiment, the origin 501 is one corner of the square plane 503. As such, in the wafer data 500 illustrated in Fig. 4, chips 14 are not arranged in all of the regions 502. That is, the multiple regions 502 of the square plane 503 include regions 502 where chips 14 are actually arranged, regions 502 where chips 14 are not arranged, regions 502 on the outer periphery of the wafer 10, and regions 502 that straddle both on the wafer 10 and the outer periphery of the wafer 10.

[0071] The circular measurement mode execution unit 410 executes a circular measurement mode in which a plurality of chips 14 on designated points 600 (shown in FIG. 6) on a concentric line 321 (shown in FIG. 6) concentric with the outer periphery of the wafer 10 are sequentially picked up from the wafer 10 and their transverse strengths are measured. The designated points 600 are information for identifying the chips 14 to be measured. In the first embodiment, if the designated point 600 is included in a chip 14, the chip 14 including the designated point 600 is set as the chip 14 to be measured. If the designated point 600 is located on a boundary between the plurality of chips 14, the chip 14 whose center is closest to the designated point 600 among the plurality of chips 14 whose centers are located on the boundary is set as the chip 14 to be measured. If the distances between the centers of the plurality of chips 14 and the designated point 600 are equal, the chip 14 closest to the origin 501 among the plurality of chips 14 whose centers are equal in distance to the designated point 600 is set as the chip 14 to be measured.

[0072] The circular measurement mode execution unit 410 includes a concentric circle position information input unit 411 into which concentric circle position information specifying the position of the concentric circle line 321 when measuring in the circular measurement mode is input, and an equal fraction input unit 412 into which an equal fraction of the concentric circle specifying a specified point 600 on the concentric circle line 321 is input.

[0073] The grid measurement mode execution unit 420 executes a grid measurement mode in which a plurality of chips 14 are sequentially picked up from the wafer 10 at designated points 600 (shown in FIGS. 7 and 8) that are the intersections of equal dividing lines 335 (shown in FIGS. 7 and 8) that divide the wafer 10 equally into a predetermined number of parts in each of the vertical (Y-axis) and horizontal (X-axis) directions, and their die strengths are measured. The grid measurement mode execution unit 420 includes a denominator input unit 421 into which denominators that equally divide the wafer 10 vertically and horizontally are input when performing measurement in the grid measurement mode.

[0074] In the circular measurement mode and grid measurement mode, a designated point 600 is set to image at least one of the front surface 11-1, back surface 11-2, and side surface of the plurality of chips 14, thereby setting the chip 14 to be measured for its bending strength, and the front surface 11-1, back surface 11-2, and side surface of the set chip 14 to be measured are sequentially imaged to measure the bending strength. Thus, in the present invention, sequentially picking up a plurality of chips 14 on the designated point 600 and measuring their bending strength means sequentially picking up a chip 14 that includes the set designated point 600, a chip 14 whose center is closest to the designated point 600, or a chip 14 that is closest to the origin 501, and measuring their bending strength.

[0075] The functions of the circular measurement mode execution unit 410, the concentric circle position information input unit 411, the equal fraction input unit 412, the grid measurement mode execution unit 420, and the denominator input unit 421 are realized by the arithmetic processing unit performing arithmetic processing in accordance with a computer program stored in the storage device. The function of the storage unit 401 is realized by the storage device.

[0076] (Measurement operation) Next, a measurement operation for picking up a chip 14 of the above-mentioned flexural strength measuring device 1 and measuring the flexural strength of the picked-up chip 14 will be described. FIG. 5 is a diagram showing an example of a mode selection screen displayed on the display unit when a measurement mode is selected for the flexural strength measuring device shown in FIG. 1. FIG. 6 is a diagram showing an example of a circular measurement mode input screen displayed on the display unit after selecting the circular measurement mode for the flexural strength measuring device shown in FIG. 1. FIG. 7 is a diagram showing an example of a grid measurement mode input screen displayed on the display unit after selecting the grid measurement mode for the flexural strength measuring device shown in FIG. 1. FIG. 8 is a diagram showing another example of a grid measurement mode input screen displayed on the display unit after selecting the grid measurement mode for the flexural strength measuring device shown in FIG. 1.

[0077] In the deflective strength measuring apparatus 1, an operator places a cassette 4 containing a plurality of wafer units 17 on the cassette mounting table 3, operates the input unit 302 to input measurement conditions into the controller 400, and the input measurement conditions are accepted by the controller 400. Furthermore, when the controller 400 accepts the measurement conditions, the deflective strength measuring apparatus 1 displays a mode selection screen 310, an example of which is shown in FIG. 5, on the display screen 301 of the display unit 300.

[0078] The mode selection screen 310 is a screen displayed on the display unit 300 when a measurement mode is selected in the bending strength measuring device 1, and is a screen for selecting a mode during measurement. In the first embodiment, the mode selection screen 310 is a screen for selecting whether to set the chip 14 to be measured in the circular measurement mode or the grid measurement mode.

[0079] In the first embodiment, the mode selection screen 310 displays, in the central main area 303, wafer data 500 stored in the storage unit 401, i.e., the above-mentioned square plane 503, the outer periphery of the wafer 10 within the square plane 503, and a plurality of regions 502 within the square plane 503. The mode selection screen 310 displays, outside the square plane 503 in the central main area 303, coordinates 504 of each region 502 indicating the position of each region 502 in the Y-axis direction and the X-axis direction from the origin 501. In the first embodiment, the mode selection screen 310 has a measurement mode input field 311 set in the input area 304 on the right side of the main area 303 in FIG. 5.

[0080] The measurement mode input field 311 is an area for inputting the measurement mode, and in the first embodiment, is an area for inputting whether the measurement mode is the circular measurement mode or the grid measurement mode by operating the input unit 302. In the first embodiment, when the circular measurement mode is input into the measurement mode input field 311 of the mode selection screen 310 and the controller 400 accepts that the measurement mode is the circular measurement mode, the circular measurement mode execution unit 410 displays a circular measurement mode input screen 320, an example of which is shown in FIG. 6, on the display screen 301 of the display unit 300.

[0081] The circular measurement mode input screen 320 is a screen on which concentric circle position information for specifying the position of the concentric circle line 321 and concentric circle equal division information for specifying a specified point 600 on the concentric circle line 321 are input. The circular measurement mode input screen 320 displays wafer data 500 stored in the memory unit 401 in the central main area 303. The circular measurement mode input screen 320 has a measurement mode display field 322, a radius division number input field 323, a circumference division number input field 324, and a center measurement input field 325 for specifying whether or not to perform center measurement set in the input area 304 on the right side of the main area 303 in FIG. 6.

[0082] The measurement mode display field 322 is an area for displaying the measurement mode selected on the mode selection screen 310, and in the first embodiment, is an area for displaying whether the measurement mode is the circular measurement mode or the grid measurement mode. The radius division number input field 323 is an area for inputting the number by which the radius of the wafer 10 is divided by operating the input unit 302. In the first embodiment, the number by which the radius of the wafer 10 is divided is the number by which the radius of the wafer 10 is equally divided, and is concentric circle position information that specifies the position of the concentric circle line 321.

[0083] The circumference division number input field 324 is an area for inputting the number by which the circumference of the concentric circle line 321 is divided by operating the input unit 302. In the first embodiment, the number by which the circumference of the concentric circle line 321 is divided is the number by which the circumference of the concentric circle line 321 is equally divided, and is information on the number of equal divisions of the concentric circle that specifies the specified point 600 on the concentric circle line 321. The center measurement input field 325 is an area for inputting, by operating the input unit 302, whether or not to set the center of the wafer 10 as the specified point 600.

[0084] For example, as shown in FIG. 6, the circular measurement mode execution unit 410 displays "Circular" in the measurement mode display field 322 of the circular measurement mode input screen 320, indicating that the measurement mode is the circular measurement mode.

[0085] The concentric circle position information input unit 411 generates concentric circle lines 321 at positions that equally divide the radius of the wafer 10 by the number input in the radius division number input field 323 of the circular measurement mode input screen 320, and displays the generated concentric circle lines 321 superimposed on the wafer data 500 displayed in the main area 303. For example, when "2" is input in the radius division number input field 323 as shown in Fig. 6, the concentric circle position information input unit 411 generates concentric circle lines 321 that equally divide the radius of the wafer 10, as shown by the dashed lines, and displays the generated concentric circle lines 321 superimposed on the wafer data 500. Note that in the present invention, a plurality of concentric circle lines 321 can be freely set.

[0086] The equal fraction input unit 412 sets designated points 600 on the concentric circle line 321 that equally divide the circumference of the concentric circle line 321 by the number input in the circumference division number input field 324 on the circular measurement mode input screen 320. When setting the designated points 600, the equal fraction input unit 412 sets the position closest to the notch 19 on the concentric circle line 321 as one designated point 600, and sets the other designated points 600 based on this one designated point 600. For example, as shown in FIG. 6 , when "4" is input in the circumference division number input field 324, the equal fraction input unit 412 sets the position closest to the notch 19 on the concentric circle line 321 as one designated point 600, and sets the other designated points 600 based on this one designated point 600, thereby setting a total of "4" designated points 600 on the concentric circle line 321.

[0087] For example, as shown in FIG. 6, when "Yes" is entered in the center measurement input field 325 of the circular measurement mode input screen 320 to set the center of the wafer 10 as the designated point 600, the circular measurement mode execution unit 410 sets the center of the wafer 10 as the designated point 600, and when "No" is entered in the center measurement input field 325 to not set the center of the wafer 10 as the designated point 600, the circular measurement mode execution unit 410 does not set the center of the wafer 10 as the designated point 600.

[0088] Thus, when performing measurement in the circular measurement mode, the controller 400 is provided with a concentric circle position information input unit 411 and an equal fraction input unit 412. Furthermore, the circular measurement mode execution unit 410 is provided with the concentric circle position information input unit 411 and the equal fraction input unit 412, thereby setting a specified point 600 on the concentric circle line 321, as shown in FIG.

[0089] In addition, in embodiment 1, when the grid measurement mode is input into the measurement mode input field 311 of the mode selection screen 310 shown in Figure 5 and the controller 400 accepts that the measurement mode is the grid measurement mode, the grid measurement mode execution unit 420 displays the grid measurement mode input screen 330 shown in Figures 7 and 8 on the display screen 301 of the display unit 300.

[0090] The grid measurement mode input screen 330 is a screen on which denominators for equally dividing the wafer 10 in the Y-axis direction and the X-axis direction are input. The grid measurement mode input screen 330 displays wafer data 500 stored in the memory unit 401 in the main area 303. The grid measurement mode input screen 330 has a measurement mode display field 332, a vertical equal fraction input field 333, and a horizontal equal fraction input field 334 set in the input area 304 on the right side of the main area 303 in FIGS. 7 and 8.

[0091] The measurement mode display field 332 is an area for displaying the measurement mode selected on the mode selection screen 310, and in the first embodiment, is an area for displaying whether the measurement mode is the circular measurement mode or the grid measurement mode. The vertical division number input field 333 is an area for inputting the number by which the wafer 10 is equally divided in the Y-axis direction by operating the input unit 302. In the first embodiment, the number by which the wafer 10 is equally divided in the Y-axis direction is the denominator for equally dividing the wafer 10 vertically.

[0092] The horizontal division number input field 334 is an area for inputting the number by which the wafer 10 is equally divided in the X-axis direction by operating the input unit 302. In the first embodiment, the number by which the wafer 10 is equally divided in the X-axis direction is the denominator by which the wafer 10 is equally divided horizontally.

[0093] 7 and 8, the grid measurement mode execution unit 420 displays "Grid" in the measurement mode display field 332 of the grid measurement mode input screen 330 to indicate that the measurement mode is the grid measurement mode. The grid measurement mode execution unit 420 generates a perimeter line 331 that is parallel to the Y-axis direction and the X-axis direction and that contacts the outer periphery of the wafer 10, and displays the generated perimeter line 331 superimposed on the wafer data 500, as shown by the dashed line in FIGS.

[0094] The denominator input unit 421 divides the wafer 10 equally in the Y-axis direction by the number input in the vertical division input field 333, generates a division line 335 parallel to the X-axis direction, and displays the generated division line 335 superimposed on the wafer data 500, as shown by the dashed lines in Figures 7 and 8. For example, when "4" is input in the vertical division input field 333 as shown in Figure 7, the denominator input unit 421 divides the wafer 10 equally in the Y-axis direction, as shown by the dashed lines, and generates a division line 335 parallel to the X-axis direction, as shown by the dashed lines, and displays the generated division line 335 superimposed on the wafer data 500. For example, as shown in FIG. 8, when "3" is entered in the vertical fraction input field 333, the denominator input unit 421 generates a dividing line 335 that divides the wafer 10 into thirds in the Y-axis direction and is parallel to the X-axis direction, as shown by the dashed lines, and displays the generated dividing line 335 superimposed on the wafer data 500.

[0095] The denominator input unit 421 divides the wafer 10 equally in the X-axis direction by the number input in the horizontal fraction input field 334, generates a dividing line 335 parallel to the Y-axis direction, and displays the generated dividing line 335 superimposed on the wafer data 500, as shown by the dashed lines in Figures 7 and 8. For example, when "4" is input in the horizontal fraction input field 334 as shown in Figure 7, the denominator input unit 421 divides the wafer 10 equally in the X-axis direction, generates a dividing line 335 parallel to the Y-axis direction, as shown by the dashed lines, and displays the generated dividing line 335 superimposed on the wafer data 500. For example, as shown in FIG. 8, when "3" is entered in the horizontal fraction input field 334, the denominator input unit 421 generates a dividing line 335 that divides the wafer 10 into thirds in the X-axis direction and is parallel to the Y-axis direction, as shown by the dashed lines, and displays the generated dividing line 335 superimposed on the wafer data 500.

[0096] The grid measurement mode execution unit 420 sets the intersection of the equalizing lines 335 as the designated point 600 .

[0097] Thus, when performing measurement in the grid measurement mode, the controller 400 is provided with a denominator input unit 421. Furthermore, by providing the denominator input unit 421, the grid measurement mode execution unit 420 sets the intersection of the equalizing lines 335 as the designated point 600, as shown in FIG.

[0098] When either the circular measurement mode or the grid measurement mode is selected, the designated point 600 is set, and an instruction to start the measurement operation from the operator is received, the controller 400 starts the measurement operation.

[0099] In the measurement operation, the controller 400 of the deflective strength measuring device 1 controls the carry-in / out unit 5 to remove the wafer unit 17 from the cassette 4 and temporarily place it on the pair of temporary placement rails 6, and controls the carry-in / out unit 5 to place the annular frame 16 of the wafer unit 17 temporarily placed on the temporary placement rails 6 on the lowered frame support member 22 of the frame fixing unit 7. The controller 400 of the deflective strength measuring device 1 controls the frame fixing unit 7 to raise the frame support member 22, and sandwiches the periphery of the annular frame 16, i.e., the next chip 14 to be measured on the tape 15, between the frame holding member 23 and the frame support member 22, and fixes the wafer unit 17 with the frame fixing unit 7.

[0100] During the measurement operation, the controller 400 of the flexural strength measuring device 1 controls the moving mechanism 30 based on the measurement conditions to move the frame fixing unit 7, and positions the chip 14 on the designated point 600 of the next measurement target on the wafer unit 17 held by the frame fixing unit 7 above the push-up unit 40 and below the imaging camera 50.

[0101] In the die strength measuring device 1, the controller 400 causes the push-up unit 40 to push up the chip 14 to be measured on the wafer 10 of the wafer unit 17 fixed to the frame fixing unit 7, and the pickup mechanism 60 peels it off from the tape 15, i.e., picks it up.

[0102] In the flexural strength measuring device 1, the controller 400 causes the imaging device 100 to capture an image of at least one of the front surface 11-1, the back surface 11-2, and a plurality of side surfaces of the picked-up chip 14 based on the measurement conditions. In the flexural strength measuring device 1, the controller 400 controls the holder moving unit 70 to move the holder 63 to the measurement position and place the back surface 11-2 of the chip 14 on a pair of support parts of the support unit 210 of the flexural strength measuring mechanism 200.

[0103] In the flexural strength measuring device 1, the controller 400 controls the flexural strength measuring mechanism 200 to lower the indenter 221 using the indenter moving unit 222, bring the tip of the indenter 221 into contact with the surface 11-1 side at the center of the tip 14, and press the tip 14 with the indenter 221. Then, the load (force in the Z-axis direction) applied to the indenter 221 by the pressing of the tip 14 is measured by the load measuring device 223, and the measurement result is output to the controller 400 as appropriate.

[0104] In the deflective strength measuring device 1, the controller 400 controls the deflective strength measuring mechanism 200 to further lower the indenter 221, destroy the chip 14, and calculate the value of the deflective strength of the chip 14 based on the maximum value of the load measured by the load measuring device 223. In the deflective strength measuring device 1, the controller 400 stores the captured images captured by the imaging device 100, the deflective strength measured by the deflective strength measuring mechanism 200, and the position of the chip 14 on the wafer 10, in association with each other.

[0105] In the first embodiment, the flexural strength measuring device 1 sequentially picks up the chips 14 to be measured on the designated point 600 of the wafer unit 17 one by one, causes the imaging device 100 to capture an image of at least one of the front surface 11-1, back surface 11-2, and multiple side surfaces of the picked-up chip 14, and causes the flexural strength measuring mechanism 200 to measure the flexural strength. After the flexural strength measuring device 1 picks up all of the chips 14 on the designated point 600 from the wafer unit 17, captures the images with the imaging device 100, and measures the flexural strength, it loads the wafer unit 17 fixed by the frame fixing unit 7 into the cassette 4, and completes the measurement operation.

[0106] As described above, the deflective strength measuring apparatus 1 according to the first embodiment is equipped with a circular measurement mode in which a plurality of chips 14 on a concentric circle 321 concentric with the outer periphery of the wafer 10 are picked up and measured, and a grid measurement mode in which chips 14 on designated points 600 that are intersections of equal dividing lines 335 that divide the wafer 10 into equal grid-like sections in the Y-axis and X-axis directions are picked up and measured. This eliminates the need for the deflective strength measuring apparatus 1 to individually designate a plurality of chips 14 to be picked up and have their deflective strength measured.

[0107] As a result, the bending strength measuring device 1 has the effect of reducing the time and effort required to specify a plurality of chips 14 to be measured.

[0108] [Modification] A deflective strength measuring device according to a modified example of the first embodiment of the present invention will be described with reference to the drawings. Fig. 9 is a diagram showing an example of a grid-like measurement mode input screen displayed on the display unit after selecting the grid-like measurement mode of the deflective strength measuring device according to a modified example of the first embodiment. In Fig. 9, the same parts as those in the first embodiment are designated by the same reference numerals, and their description will be omitted. The deflective strength measuring device 1 according to the modified example is the same as that of the first embodiment, except that the operation of the grid-like measurement mode execution unit 420 is different.

[0109] After the grid measurement mode execution unit 420 of the deflective strength measuring apparatus 1 according to the modified example displays the grid measurement mode input screen 330 on the display screen 301 of the display unit 300, the grid measurement mode execution unit 420 generates four sides 336 of a square that is parallel to the Y-axis direction and the X-axis direction and inscribed in the wafer 10, and displays the generated four sides 336 superimposed on the wafer data 500, as shown by the dashed-dotted lines in Fig. 9. The area surrounded by the four sides 336 of the wafer 10 is called an effective measurement area 337. The effective measurement area 337 is an area in which the accuracy of the pattern of the device 13 within the effective measurement area 337 is higher than the accuracy of the pattern of the device 13 outside the effective measurement area 337.

[0110] In the modified example, the denominator input unit 421 divides the effective measurement area 337 of the wafer 10 equally in the Y-axis direction by the number input in the vertical division input field 333, generates a division line 335 parallel to the X-axis direction, and displays the generated division line 335 superimposed on the wafer data 500, as shown by the dashed lines in Fig. 9. For example, when "4" is input in the vertical division input field 333 as shown in Fig. 9, the denominator input unit 421 divides the effective measurement area 337 of the wafer 10 into four equal parts in the Y-axis direction and generates a division line 335 parallel to the X-axis direction, as shown by the dashed lines, and displays the generated division line 335 superimposed on the wafer data 500.

[0111] In this modification, the denominator input unit 421 divides the effective measurement area 337 of the wafer 10 equally in the X-axis direction by the number input in the horizontal fraction input field 334, generates a dividing line 335 parallel to the Y-axis direction, and displays the generated dividing line 335 superimposed on the wafer data 500, as shown by the dashed lines in Fig. 9. For example, when "4" is input in the horizontal fraction input field 334 as shown in Fig. 9, the denominator input unit 421 divides the effective measurement area 337 of the wafer 10 into four equal parts in the X-axis direction and generates a dividing line 335 parallel to the Y-axis direction, as shown by the dashed lines, and displays the generated dividing line 335 superimposed on the wafer data 500.

[0112] In the modified example, the grid measurement mode execution unit 420 sets the intersection of the equalizing lines 335 as the designated point 600. In the modified example, when the designated point 600 is set and an instruction to start the measurement operation from the operator is received, the controller 400 executes the measurement operation in the same manner as in the first embodiment.

[0113] Similar to the first embodiment, the deflective strength measuring apparatus 1 according to the modified example has a circular measurement mode in which a plurality of chips 14 on a concentric circle 321 concentric with the outer periphery of the wafer 10 are picked up and measured, and a grid measurement mode in which chips 14 on designated points 600 that are intersections of equal dividing lines 335 that divide the wafer 10 into equal parts in a grid pattern in the Y-axis and X-axis directions are picked up and measured. As a result, similar to the first embodiment, the deflective strength measuring apparatus 1 does not need to pick up and specify each of the plurality of chips 14 whose deflective strength is to be measured, thereby achieving the effect of reducing the effort required to specify the plurality of chips 14 to be measured.

[0114] [Embodiment 2] A deflective strength measuring device according to embodiment 2 will be described with reference to the drawings. Fig. 10 is a perspective view showing a part of an example configuration of the deflective strength measuring device according to embodiment 2. Fig. 11 is a perspective view of the main parts of the deflective strength measuring device shown in Fig. 10. Fig. 12 is a diagram showing an example of a designated point measurement mode input screen displayed on the display unit after selecting the designated point measurement mode of the deflective strength measuring device shown in Fig. 10. In Figs. 10, 11 and 12, the same parts as those in embodiment 1 are designated by the same reference numerals, and their description will be omitted.

[0115] The flexural strength measuring device 1 according to the second embodiment is the same as that according to the first embodiment, except that the controller 400 does not include the circular measurement mode execution unit 410 and the grid measurement mode execution unit 420, but includes a designated point measurement mode execution unit 430. The controller 400 of the flexural strength measuring device 1 according to the second embodiment includes the designated point measurement mode execution unit 430, as shown in Figs.

[0116] When an arbitrary position on the wafer is specified, the designated point measurement mode execution unit 430 sets this arbitrary position as a designated point 600, picks up the chip 14 on the designated point 600 from the wafer 10, and executes the designated point measurement mode to measure the die strength.

[0117] The designated point measurement mode execution unit 430 includes a designated point input unit 431 that accepts an arbitrary position on the wafer 10 as a designated point 600 when measurement is performed in the designated point measurement mode.

[0118] In addition, the designated point measurement mode, like the circular measurement mode and the grid measurement mode, is a mode in which a designated point 600 is set, and images of the front surface 11-1, back surface 11-2 and side surface of a plurality of chips 14 are taken to set the chip 14 to be measured for measuring its flexural strength, and images of the front surface 11-1, back surface 11-2 and side surface of the set chip 14 to be measured are taken in order to measure its flexural strength in that order.

[0119] The functions of the designated point measurement mode execution unit 430 and the designated point input unit 431 are realized by the arithmetic processing unit performing arithmetic processing in accordance with a computer program stored in the storage device.

[0120] In the flexural strength measuring device 1 of embodiment 2, when the designated point measurement mode is input into the measurement mode input field 311 of the mode selection screen 310 displayed on the display screen 301 of the display unit 300 and the controller 400 accepts that the measurement mode is the designated point measurement mode, the designated point measurement mode execution unit 430 displays the designated point measurement mode input screen 340 on the display screen 301 of the display unit 300 as illustrated in FIG. 12.

[0121] The designated point measurement mode input screen 340 is a screen on which the position of the designated point 600 is input. The designated point measurement mode input screen 340 displays the wafer data 500 stored in the memory unit 401 in the main area 303. The designated point measurement mode input screen 340 has a measurement mode display field 342 set in the input area 304 on the right side of the main area 303 in FIG.

[0122] The measurement mode display field 342 is an area for displaying the measurement mode selected on the mode selection screen 310, and in the first embodiment, is an area for displaying that the measurement mode is the designated point measurement mode. For example, as shown in Fig. 12, the designated point measurement mode execution unit 430 displays "designated" in the measurement mode display field 342 of the designated point measurement mode input screen 340, indicating that the measurement mode is the designated point measurement mode.

[0123] 12, when an arbitrary position on the wafer data 500 is selected from the input unit 302 or the like, the designated point input unit 431 displays this arbitrary position as a designated point 600 superimposed on the wafer data 500. Thus, the controller 400 is provided with the designated point input unit 431 when performing measurement in the designated point measurement mode. Furthermore, by providing the designated point input unit 431, the designated point measurement mode execution unit 430 sets the designated point 600 at an arbitrary position on the wafer 10, as shown in FIG.

[0124] In the second embodiment, when the specified point 600 is set and an instruction to start the measurement operation from the operator is received, the controller 400 executes the measurement operation in the same manner as in the first embodiment.

[0125] The deflective strength measuring apparatus 1 according to the second embodiment has a designated point measurement mode for picking up and measuring a chip 14 on a designated point 600, which is an arbitrary designated position on the wafer 10. As a result, the deflective strength measuring apparatus 1, like the first embodiment, has the effect of reducing the effort required to designate a plurality of chips 14 to be measured.

[0126] [Embodiment 3] A flexural strength measuring device according to embodiment 3 will be described with reference to the drawings. Fig. 13 is a perspective view showing a part of an example of the configuration of the flexural strength measuring device according to embodiment 3. Fig. 14 is a perspective view of the main part of the flexural strength measuring device shown in Fig. 13. In Figs. 13 and 14, the same parts as those in embodiments 1 and 2 are designated by the same reference numerals, and their description will be omitted.

[0127] The flexural strength measuring device 1 of embodiment 3 is the same as embodiment 1, except that the controller 400 is equipped with a circular measurement mode execution unit 410, a grid measurement mode execution unit 420, and a designated point measurement mode execution unit 430, and one of the circular measurement mode, grid measurement mode, and designated point measurement mode is selected to set the designated point 600.

[0128] The flexural strength measuring device 1 of embodiment 3 has a circular measurement mode, a grid measurement mode, and a designated point measurement mode, and therefore, similar to embodiment 1, etc., it has the effect of reducing the effort required to specify multiple chips 14 to be measured.

[0129] The present invention is not limited to the above-described embodiments, etc. In other words, various modifications can be made without departing from the gist of the present invention.

[0130] For example, in the present invention, the flexural strength measuring device 1 may have a controller 400 that includes at least one of a circular measurement mode execution unit 410 and a grid measurement mode execution unit 420, and execute at least one of the circular measurement mode and the grid measurement mode.

[0131] In addition, in the present invention, the controller 400 of the die strength measuring device 1 may execute a full measurement mode, a skip measurement mode, a chip-designated measurement mode, and a coordinate-designated mode as measurement modes in addition to the circular measurement mode and the grid measurement mode.

[0132] The full measurement mode is a measurement mode in which all chips 14 at positions having a predetermined size are measured, and all chips 14 without chips are measured. The skip measurement mode is a measurement mode in which the number of chips 14 to skip is set when picking up chips 14 in a certain direction (for example, in order of proximity to the origin). The chip designation measurement mode is a measurement mode in which the chip 14 whose center of gravity is closest to the position touched by the operator on the wafer data 500 is measured. The coordinate designation measurement mode is a measurement mode in which the coordinates of the chip 14 on the wafer data 500 are input and the chip 14 at the input coordinates is measured.

[0133] Furthermore, in the present invention, the concentric circle position information input unit 411 of the circular measurement mode execution unit 410 of the controller 400 may be configured to input the ratio of the radius of the concentric circle 321 to the radius of the wafer 10 (corresponding to concentric circle position information), thereby specifying the position of the concentric circle 321. In this case, when 70% is input into the concentric circle position information input unit 411, the concentric circle 321 of 70% of the radius of the wafer 10 is displayed superimposed on the wafer data 500. [Explanation of symbols]

[0134] 1 Transverse bending strength measuring device 10 wafers 14 chips 60 Pickup mechanism 200 Bending strength measurement mechanism (Bending strength measuring mechanism) 321 Concentric Lines 335 Equisector line 400 Controller 411 Concentric circle position information input section 412 Equal fraction input section 421 Denominator input section 600 Specified point (intersection)

Claims

1. A die strength measuring device comprising: a pickup mechanism that picks up a plurality of chips from a wafer that has been singulated into individual chips; a die strength measuring mechanism that measures the die strength of each of the plurality of chips picked up by the pickup mechanism; and a controller that controls at least the pickup mechanism and the die strength measuring mechanism, a circular measurement mode in which a plurality of chips on designated points on a concentric circle concentric with the outer periphery of the wafer are sequentially picked up from the wafer and their flexural strengths are measured; and a grid measurement mode in which a plurality of chips located at the intersections of equal divisions that divide the wafer into a predetermined number of equal parts vertically and horizontally are picked up from the wafer in sequence and their bending strengths are measured.

2. The controller a concentric circle position information input unit to which concentric circle position information specifying the position of the concentric circle line when measuring in the circular measurement mode is input, and an equal fraction input unit to which concentric circle equal fraction information specifying the specified point on the concentric circle line is input, 2. The die strength measuring device according to claim 1, further comprising a denominator input unit for inputting denominators for dividing the wafer equally vertically and horizontally when measuring in the grid measurement mode.

3. A die strength measuring device comprising: a pickup mechanism that picks up a plurality of chips from a wafer that has been singulated into individual chips; a die strength measuring mechanism that measures the die strength of each of the plurality of chips picked up by the pickup mechanism; a controller that controls at least the pickup mechanism and the die strength measuring mechanism; a display unit that is connected to the controller and displays wafer data including an entire planar view of the wafer on a display screen; and an input unit that is connected to the controller and is composed of a touch panel that is overlaid on the display screen, The controller is provided with a designated point measurement mode in which, when an arbitrary position of the wafer data displayed on the display unit is designated by the input unit, a chip on the designated point is picked up from the wafer and its flexural strength is measured.

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