Dough and method for producing dough

Abstract

Provided is woven or knitted fabric that has a pattern expressed through embossing, and that comprises: a fabric layer; and a resin film layer laminated on the fabric layer. The fabric layer and the resin film layer may be embossed. In the fabric, the melting point of the resin film layer may be lower than the melting point of the fabric layer. Also provided is a fabric production method comprising: a step for preparing a woven or knitted fabric layer; a step for laminating a resin film layer on the fabric layer; and a step for embossing the fabric layer and the resin film layer.

Description

[Technical Field]

[0001] The present invention relates to a dough and a method for producing the dough. [Background technology]

[0002] Patent Document 1 discloses an embossed "leather-like nonwoven fabric." [Prior art document] [Patent documents] Patent Document 1 Japanese Patent Application Laid-Open No. 11-241277

[0003] Provides a higher quality leather-like fabric. General Disclosure

[0004] In a first aspect of the present invention, there is provided a woven or knitted fabric having an embossed pattern, the fabric comprising a fabric layer and a resin film layer laminated on the fabric layer, wherein the fabric layer and the resin film layer may be embossed.

[0005] In the fabric, the melting point of the resin film layer may be lower than the melting point of the fabric layer.

[0006] In any of the above fabrics, the melting point of the resin film layer may be 80°C or higher and 160°C or lower.

[0007] In any of the above-mentioned fabrics, the resin film layer may have a thickness of 10 μm or more and 100 μm or less.

[0008] In any of the above fabrics, the material of the resin film layer may include at least one of polyester, polyurethane, olefin-based resin, EVA (ethylene vinyl acetate) resin, and polyamide.

[0009] In any of the above fabrics, the resin film layer may have a first layer laminated in contact with the fabric layer, and a second layer laminated in contact with the first layer.

[0010] In any of the above fabrics, the second layer may have an opening for exposing the first layer.

[0011] In any of the above-described fabrics, the resin film layer may be laminated on the surface side of the fabric layer.

[0012] In any of the above fabrics, the resin film layer may be laminated on the back side of the fabric layer.

[0013] In any of the above fabrics, the fabric layer may have a single yarn having a decitex of 0.05 or more and 0.7 or less.

[0014] In any of the above fabrics, the thread density of the warp threads of the fabric layer may be 200 or more and 300 or less.

[0015] In any of the above fabrics, the thickness of the fabric layer may be 0.3 mm or more and 1.5 mm or less.

[0016] In any of the above-mentioned fabrics, the total thickness of the fabric layer and the resin film layer may be 0.3 mm or more and 1.5 mm or less.

[0017] In any of the above-mentioned fabrics, the embossing depth of the fabric may be 50 μm or more and 400 μm or less.

[0018] In any of the above fabrics, the fabric may meet the evaluation criteria of at least one of JIS L1091, JIS L1092, JIS L1093, JIS L1096, JIS L1076, JIS L0860, JIS L0849, JIS L0844, or JIS L0842.

[0019] In a second aspect of the present invention, there is provided a method for manufacturing a fabric, comprising the steps of preparing a woven or knitted fabric layer, laminating a resin film layer onto the fabric layer, and embossing the fabric layer and the resin film layer.

[0020] In the above-described method for manufacturing fabric, the embossing step may include placing a release paper on the top surface of the resin film layer, and embossing the fabric layer and the resin film layer from above the release paper.

[0021] In any of the above-described methods for manufacturing fabric, the embossing step may include placing a release paper on the underside of the resin film layer, and embossing the fabric layer and the resin film layer from above the fabric layer.

[0022] In any of the above methods for manufacturing a fabric, the release paper may have a film thickness of 30 μm or more and 100 μm or less.

[0023] Any of the above methods for manufacturing a fabric may further include a step of performing a surface treatment on the release paper to impart a release effect.

[0024] Any of the above methods for manufacturing fabric may further include a step of applying a graining process to the release paper.

[0025] In any of the above methods for manufacturing fabric, the material of the release paper may include at least one of paper, polyethylene, polypropylene, or epoxy resin.

[0026] Any of the above methods for manufacturing a fabric may further include a step of heating the resin film layer at a temperature equal to or higher than the melting point of the resin film layer.

[0027] In any of the above-mentioned methods for manufacturing fabric, the step of heating the resin film layer may be carried out after the step of laminating the resin film layer to the fabric layer and before the step of embossing the fabric layer and the resin film layer.

[0028] In any of the above methods for manufacturing a fabric, the step of heating the resin film layer may be carried out when embossing the fabric layer and the resin film layer.

[0029] The above summary of the invention does not list all of the features of the present invention, and subcombinations of these features may also be inventions. [Brief explanation of the drawings]

[0030] [Figure 1] 1 is a photograph of the surface of fabric 100. [Figure 2A] FIG. 1 is a schematic diagram of a cross section of fabric 100 before embossing. [Figure 2B] FIG. 1 is a schematic diagram of a cross section of fabric 100 after embossing. [Figure 2C] 1 shows an example of a flow chart for producing fabric 100. [Figure 3] An example of the configuration of the warp threads 10 is shown. [Figure 4] An example of textured yarn used for warp yarn 510 according to the comparative example is shown. [Figure 5] An example of a method for manufacturing the fabric 100 will be described. [Figure 6A] 1 shows a variation of the fabric 100. [Figure 6B] An example of a method for manufacturing the fabric 100 will be described. [Figure 7A] 1 shows a variation of the fabric 100. [Figure 7B] An example of a method for manufacturing the fabric 100 will be described. DETAILED DESCRIPTION OF THE INVENTION

[0031] The present invention will be described below through embodiments of the invention, but the following embodiments do not limit the scope of the invention as claimed. Furthermore, not all of the combinations of features described in the embodiments are necessarily essential to the solution of the invention.

[0032] Figure 1 is a photograph of the surface of fabric 100. Fabric 100 is a woven or knitted fabric with an embossed pattern. In this example, fabric 100 has a leather-like design achieved by embossing.

[0033] The fabric 100 may be made of at least one of polyester, nylon, acrylic, linen, cotton, silk, rayon, and wool. The fabric 100 may have texture and gloss like genuine leather or synthetic leather. The fabric 100 of this example can achieve a leather-like texture without providing a backing fabric such as nonwoven fabric on the back side. However, a backing fabric such as polyurethane or nonwoven fabric may be provided on the back side of the fabric 100.

[0034] The leather-like fabric 100 made of polyester can reduce the mass by 50% or more compared to fabrics made of genuine leather or polyvinyl chloride (PVC). Furthermore, unlike fabrics made of genuine leather or PVC, the fabric 100 is less likely to become too hot in the summer or too cold in the winter. The finish of the fabric 100 can be improved by using a steam iron. Recyclability is improved if the fabric 100 is made of polyester only.

[0035] The fabric 100 may be used for vehicle seat covers that require high strength, wrinkle resistance, and flame retardancy. The fabric 100 may be water-repellent and flame-retardant. The fabric 100 may meet the evaluation criteria of at least one of JIS L1091, JIS L1092, JIS L1093, JIS L1096, JIS L1076, JIS L0860, JIS L0849, JIS L0844, or JIS L0842. However, the use of the fabric 100 is not particularly limited.

[0036] 2A is a schematic diagram of a cross section of a fabric 100 before embossing. The fabric 100 includes a fabric layer 110 and a resin film layer 120.

[0037] The fabric layer 110 may be a woven fabric composed of warp and weft threads, as described below. The material of the fabric layer 110 may include at least one of polyester, nylon, acrylic, linen, cotton, silk, rayon, and wool. In this example, the material of the fabric layer 110 is polyester. In this example, the fabric layer 110 does not have a lining, but may have a lining. The thickness of the fabric layer 110 may be 0.3 mm or more and 1.5 mm or less. For example, the thickness of the fabric layer 110 is 0.8 mm.

[0038] The resin film layer 120 is laminated on the fabric layer 110. In this example, the resin film layer 120 is provided on the front side of the fabric layer 110, but it may also be provided on the back side of the fabric layer 110. The resin film layer 120 may be adhered to the fabric layer 110. The resin film layer 120 may be attached to the fabric layer 110 or applied thereto.

[0039] The material of the resin film layer 120 may include at least one of polyester, polyurethane, olefin-based resin, EVA (ethylene vinyl acetate) resin, and polyamide. The material of the resin film layer 120 may include polyester, or may be entirely polyester. The resin film layer 120 in this example is a polyester film.

[0040] The fabric layer 110 and the resin film layer 120 may be made of the same material. Constructing each layer of the fabric 100 from the same material improves recyclability. The fabric layer 110 and the resin film layer 120 may be made of the same material but have different compositions. For example, the fabric layer 110 and the resin film layer 120 are polyesters with different compositions. The fabric layer 110 and the resin film layer 120 may have different melting points due to their different compositions.

[0041] The melting point of the resin film layer 120 may be lower than the melting point of the fabric layer 110. The resin film layer 120 can be adhered onto the fabric layer 110 by heating the fabric 100 to melt the resin film layer 120. The melting point of the resin film layer 120 may be 80°C or higher and 160°C or lower. In one example, the melting point of the fabric layer 110 is 220°C, and the melting point of the resin film layer 120 is 110°C.

[0042] The thickness of the resin film layer 120 may be thinner than the thickness of the fabric layer 110. The thickness of the resin film layer 120 may be 10 μm or more and 100 μm or less.

[0043] The resin film layer 120 may be transparent or may be colored. By coloring the resin film layer 120, it is possible to adjust the color of the fabric 100. The resin film layer 120 may be water-repellent and flame-retardant.

[0044] The provision of the resin film layer 120 gives the fabric 100 a glossy appearance, enabling it to achieve a genuine leather-like design. The resin film layer 120 can coat the dense fibers of the fabric layer 110, improving scratch resistance. The resin film layer 120 fills in the gaps between the fibers of the fabric layer 110, thereby improving the texture of the embossing more than the fabric layer 110 alone.

[0045] 2B is a schematic diagram of a cross section of the embossed fabric 100. In the fabric 100 of this example, the fabric layer 110 and the resin film layer 120 are embossed.

[0046] The fabric layer 110 and the resin film layer 120 have recesses and projections formed by embossing. In this example, the fabric layer 110 and the resin film layer 120 are bonded together, and deep recesses and projections can be achieved by embossing both the fabric layer 110 and the resin film layer 120. The embossing depth De of the fabric 100 may be 50 μm or more and 400 μm or less. The embossing depth De may be the maximum value of the difference between the projections and depressions in the embossed resin film layer 120.

[0047] Here, the fabric layer 110 may have a single yarn with a decitex of 0.05 or more and 0.7 or less. By thinning the single yarn, the rigidity of the single yarn is weakened, allowing for a deeper embossing. Furthermore, by thinning the single yarn, it is possible to eliminate stitches and achieve a high-quality leather-like fabric with improved texture.

[0048] The total thickness T of the fabric layer 110 and the resin film layer 120 may be the thickness between the embossed convex portions and the back surface of the fabric layer 110. The total thickness T of the fabric layer 110 and the resin film layer 120 may be 0.3 mm or more and 1.5 mm or less. As will be described later, the fabric 100 can have a large thickness by including a shrinkage yarn, which gives the yarn swelling.

[0049] The fabric 100 of this example is obtained by laminating a resin film layer 120 on a fabric layer 110 made of woven or knitted fabric and then embossing it, thereby achieving more stable physical properties compared to nonwoven fabrics, which have varying densities. This results in a fabric 100 with uniform tensile strength and stretchability. Achieving uniform embossing results in a higher quality leather-like fabric 100.

[0050] 2C shows an example of a flowchart for manufacturing the fabric 100. The flowchart in this example is an example of a method for manufacturing the fabric 100, and is not limited to this.

[0051] In step S100, a woven or knitted fabric layer 110 is prepared. A backing fabric such as polyurethane or nonwoven fabric may be attached to the back surface of the fabric layer 110. Even if a backing material is attached to the back surface of the fabric layer 110, the fabric layer 110 and the resin film layer 120 can be easily recycled by peeling off the backing material.

[0052] In step S120, the resin film layer 120 is laminated on the fabric layer 110. The resin film layer 120 may be attached to or applied to the fabric layer 110. The resin film layer 120 may be attached to the front surface or back surface of the fabric layer 110.

[0053] In step S140, the fabric layer 110 and the resin film layer 120 are embossed. Embossing the fabric layer 110 and the resin film layer 120 means that unevenness is formed on both the fabric layer 110 and the resin film layer 120. In this example, the fabric layer 110 and the resin film layer 120 may be embossed in a state in which the fabric layer 110 and the resin film layer 120 are laminated together.

[0054] Here, the resin film layer 120 may be bonded to the fabric layer 110 by heating. The manufacturing method of the fabric 100 may include a step of heating the resin film layer 120 at a temperature equal to or higher than the melting point of the resin film layer 120. The timing of heating the resin film layer 120 may be arbitrary. The step of heating the resin film layer 120 may be performed after the step of laminating the resin film layer 120 on the fabric layer 110 and before the step of embossing the fabric layer 110 and the resin film layer 120. The step of heating the resin film layer 120 may be performed when embossing the fabric layer 110 and the resin film layer 120. The step of embossing the fabric layer 110 and the resin film layer 120 may be performed simultaneously with the embossing.

[0055] The method may include a step of imparting functionality such as water repellency or flame retardancy to the fabric 100. Functionality may be imparted to the fabric layer 110, to the resin film layer 120, or to both the fabric layer 110 and the resin film layer 120. Different functions may be imparted to the fabric layer 110 and the resin film layer 120. For example, the fabric 100 may be dipped in a functional agent such as a water repellent agent to impart functionality such as water repellency. The functional agent may have any function such as flame retardancy. The fabric 100 may be dipped in a combination of multiple functional agents at once.

[0056] FIG. 3 shows an example of the configuration of the warp yarns 10. The warp yarns 10 of this example have a predetermined first shrinkage yarn 11 and a second shrinkage yarn 12 that is different from the first shrinkage yarn 11. In the warp yarns 10 of this example, the first shrinkage yarn 11 and the second shrinkage yarn 12 are mixed. That is, the first shrinkage yarn 11 and the second shrinkage yarn 12 are mixed to form one warp yarn 10. The first shrinkage yarn 11 and the second shrinkage yarn 12 may have different heat shrinkage properties. In this example, a case where the warp yarns 10 include a shrinkage yarn will be described, but they may not include a shrinkage yarn.

[0057] By including shrinkage yarns in the warp yarns 10, the crimps can be spread laterally, making the stitches disappear. In this example, by using different shrinkage yarns, such as the first shrinkage yarn 11 and the second shrinkage yarn 12, for the warp yarns 10, the stitches can be made even less visible. Three or more shrinkage yarns may be used for the warp yarns 10. By including shrinkage yarns in the fabric 100, the yarns can be made to swell, increasing the film thickness. By including shrinkage yarns, the voids in the fabric 100 can be increased, making it easier to press the fabric 100 with a mold and creating the unevenness of the embossing process.

[0058] The surface gloss of the fabric 100 can be adjusted as desired by adjusting the crimp of the first shrinkage yarn 11 and the second shrinkage yarn 12. In this way, warp yarns 10 containing any shrinkage yarn may be selected from the viewpoints of the surface gloss and embossing of the fabric 100. Similarly, a plurality of different shrinkage yarns may be used for the weft yarn.

[0059] By increasing the thread density of the warp threads 10, the gaps in the fabric 100 are reduced, making the weft threads less visible. This makes the fabric layer 110 flatter, making it easier to achieve a high-quality leather-like fabric. Thread density is the number of single threads per inch. The thread density of the warp threads 10 may be 200 or more and 300 or less. For example, by skipping five or more surface threads of the weft threads, shrinkage in the horizontal direction occurs, and the thread density of the warp threads 10 can be increased.

[0060] Here, if the single yarns of the fabric layer 110 are thinned, there is a risk of thread breakage due to the embossing process. In this example, by increasing the thread density of the warp threads 10 and increasing the total number of threads, it is possible to provide a fabric layer 110 that is less susceptible to thread breakage by dispersing the embossing pressure, even when the single yarns of the fabric layer 110 are thinned. By laminating the resin film layer 120 on the fabric layer 110, the resin film layer 120 follows the unevenness after embossing, solidifying the fibers together and improving resistance to damage.

[0061] Fig. 4 shows an example of textured yarn used for the warp yarn 510 according to the comparative example. Unlike the warp yarn 10 of the example, the warp yarn 510 does not contain multiple shrink yarns. The false twist shape of the warp yarn 510 is visible, making it easy to distinguish the stitches. Therefore, when fabric is formed using the warp yarn 510, stitches may remain in the fabric.

[0062] 5 shows an example of a method for manufacturing the fabric 100. In this example, steps S142 to S146 for producing the fabric 100 using the embossing machine 200 will be described. Steps S142 to S146 in this example are an example of step S140 in FIG. 2C. The embossing machine 200 in this example includes a mold 210 and a stand 220.

[0063] The mold 210 may be a roll-shaped or plate-shaped mold having concaves and convexes corresponding to the embossing pattern to be applied to the fabric 100. The mold 210 may be heated in order to emboss the fabric 100. The heating temperature for embossing using the mold 210 may be lower than the glass transition point of the fabric layer 110. The heating temperature for embossing using the mold 210 may be higher than the melting point of the resin film layer 120. However, the heating temperature of the mold 210 is not limited to these.

[0064] The mold 210 may have various shapes or depths depending on the dimensions of the embossed convex and concave portions. When a roll-shaped mold 210 is used, the embossing depth De may be controlled by adjusting conditions such as the temperature, pressure, and conveyor speed of the mold 210. When a plate-shaped mold 210 is used, the embossing depth De may be controlled by adjusting conditions such as the temperature, pressure, and holding time of the mold 210 during processing.

[0065] The base 220 supports the fabric 100 during embossing of the fabric 100. The base 220 may have a low-density material that is lower in density than the fabric 100. The low-density material of the base 220 may be polyurethane. The base 220 may have a material below the low-density material that is higher in density than the low-density material.

[0066] In step S142, release paper 300 is placed on resin film layer 120. In this example, release paper 300 is provided between mold 210 and resin film layer 120. Release paper 300 may be provided between mold 210 and resin film layer 120 in a state where it is adhered to resin film layer 120, or may be provided between mold 210 and resin film layer 120 in a state where it is not adhered to resin film layer 120.

[0067] The release paper 300 prevents the resin film layer 120 from adhering to the embossing machine 200. In this example, the release paper 300 is the same size as the fabric 100, but it may be larger than the fabric 100. The material of the release paper 300 may include at least one of paper, polyethylene, polypropylene, or epoxy resin. The thickness of the release paper 300 may be any thickness that does not interfere with the embossing of the fabric 100. The thickness of the release paper 300 may be 30 μm or more and 100 μm or less.

[0068] The resin film layer 120 may be attached to the fabric layer 110 before embossing. The resin film layer 120 may be attached to the fabric layer 110 with the release paper 300 attached. The resin film layer 120 may be attached to the fabric layer 110 using a laminating machine. The resin film layer 120 may be coated on the fabric layer 110.

[0069] In step S144, the fabric layer 110 and the resin film layer 120 are embossed from above the release paper 300. That is, the fabric 100 is embossed with the release paper 300 sandwiched between the fabric 100 and the mold 210. The fabric 100 may be embossed with a stand 220 placed below the fabric 100. The embossing machine 200 may use the mold 210 to heat the surface of the fabric 100. Here, surface heating refers to heating a wider surface, rather than applying high frequency waves to the fabric to process a portion of the fabric, as in a high-frequency welder. The resin film layer 120 may be adhered to the fabric layer 110 by heating during embossing.

[0070] In step S146, the embossed fabric 100 is removed from the embossing machine 200. The release paper 300 is peeled off the fabric 100 to obtain the embossed fabric 100. The resin film layer 120 is separated from the release paper 300 and can maintain the embossed shape that follows the fabric layer 110. Using the release paper 300 can prevent the resin film layer 120 from adhering to the mold 210. In this way, by devising an embossing method, it is possible to obtain fabric 100 with a high-quality leather-like texture and improved relief expression.

[0071] The manufacturing method of the fabric 100 may include a step of performing a surface treatment to impart a release effect to the release paper 300. For example, a material that imparts a release effect, such as silicone, is applied to the release paper 300. The surface treatment of the release paper 300 may be performed before the release paper 300 is placed on the fabric 100, or may be performed after the release paper 300 is placed on the fabric 100.

[0072] The manufacturing method of the fabric 100 may include a step of applying a graining process to the release paper 300. By applying a graining process to the release paper 300, scratches are created on the surface of the resin film layer 120, causing diffuse reflection and reducing glossiness. The glossiness of the fabric 100 can be adjusted by adjusting the degree of graining of the resin film layer 120.

[0073] Fig. 6A shows a modified example of fabric 100. Fabric 100 of this example differs from fabric 100 of Fig. 2B in that a resin film layer 120 is attached to the back side of fabric layer 110. In this example, differences from fabric 100 of Fig. 2B will be particularly described.

[0074] The resin film layer 120 is laminated on the back side of the fabric layer 110. In this example, both the fabric layer 110 and the resin film layer 120 are embossed. By providing the resin film layer 120 on the back side of the fabric layer 110, the fibers on the back side of the fabric layer 110 are solidified, eliminating the fraying that occurs when cutting woven fabrics. The resin film layer 120 attached to the back side follows the unevenness after embossing, thereby improving resistance to damage from the front side. The embossing depth De and total film thickness T of the fabric 100 may be the same as those of the fabric 100 in FIG. 2C.

[0075] Figure 6B shows an example of a method for manufacturing the fabric 100. This example shows a method for manufacturing the fabric 100 shown in Figure 6A. The method for manufacturing the fabric 100 in this example differs from the manufacturing method in Figure 5 in that a resin film layer 120 is provided on the back surface of the fabric layer 110, and a release paper 300 is provided on the underside of the fabric 100. In this example, differences from the manufacturing method of the fabric 100 shown in Figure 5 will be particularly described.

[0076] In step S142, release paper 300 is placed on the lower surface of resin film layer 120. In this example, release paper 300 is provided between stand 220 and resin film layer 120. Release paper 300 may be provided between stand 220 and resin film layer 120 in a state where it is adhered to resin film layer 120, or may be provided between stand 220 and resin film layer 120 in a state where it is not adhered to resin film layer 120.

[0077] In step S144, the fabric layer 110 and the resin film layer 120 are embossed from above the fabric layer 110. In this example, the fabric 100 is embossed with release paper 300 sandwiched between the fabric 100 and the stand 220. The embossing machine 200 may use a mold 210 to heat the surface of the fabric 100 from the fabric layer 110 side. The resin film layer 120 may be adhered to the fabric layer 110 by heating during the embossing process.

[0078] 7A shows a modified example of the fabric 100. The fabric 100 of this example differs from the fabric 100 of FIG. 2B in that the resin film layer 120 has a laminated structure. In this example, the differences from the fabric 100 of FIG. 2B will be particularly described. The resin film layer 120 of this example has a first layer 121 and a second layer 122.

[0079] The first layer 121 is laminated in contact with the fabric layer 110. In this example, the resin film layer 120 is laminated on the surface side of the fabric layer 110. In this example, the first layer 121 is provided on the entire surface of the fabric layer 110, but may be provided on only a part of the surface side of the fabric layer 110. The first layer 121 has an uneven shape formed by embossing.

[0080] The second layer 122 is laminated in contact with the first layer 121. The second layer 122 may be located in the convex portions or the concave portions of the concave and convex shape of the first layer 121. The second layer 122 may be located across the concave and convex portions of the first layer 121.

[0081] The second layer 122 may have an opening 125 for exposing the first layer 121. The second layer 122 has a region that covers the first layer 121 and a region that exposes the first layer 121 through the opening 125. The opening 125 may expose a convex portion of the first layer 121 or a concave portion of the first layer 121. The opening 125 may be provided across the concave and convex portions of the first layer 121. The film thickness of the resin film layer 120 can be changed by selectively providing the second layer 122. The film thickness of the second layer 122 may be the same as or different from that of the first layer 121.

[0082] The fabric 100 of this example can be formed in any color and pattern by including the first layer 121 and the second layer 122. The fabric 100 may be formed with the first layer 121 and the second layer 122 of different colors. Any pattern can be realized by changing the color and shape of the first layer 121 and the second layer 122.

[0083] The resin film layer 120 in this example has a two-layer structure of a first layer 121 and a second layer 122, but may have a laminated structure of three or more layers. The resin film layer 120 in this example can impart thickness differences to the fabric 100 by using a laminated structure. Furthermore, the resin film layer 120 can have further steps in addition to the embossing process by using a laminated structure. The laminated structure of the resin film layer 120 may be formed by heating the first layer 121 and the second layer 122 beyond their melting points to form a single layer. Note that the resin film layer 120 may have steps on its surface by a method other than a laminated structure.

[0084] The fabric 100 of this example can reproduce an antique look by changing the color, shape, and film thickness of the resin film layer 120. The shade of the fabric 100 may be adjusted by varying the film thickness of the resin film layer 120.

[0085] Figure 7B shows an example of a method for manufacturing the fabric 100. In this example, a method for manufacturing the fabric 100 shown in Figure 7A is shown. The method for manufacturing the fabric 100 in this example differs from the manufacturing method in Figure 5 in that the resin film layer 120 has a laminated structure. In this example, differences from the manufacturing method of the fabric 100 shown in Figure 5 will be particularly described.

[0086] In step S142, release paper 300 is provided on the upper surface of resin film layer 120. The upper surface of resin film layer 120 may be the surface of resin film layer 120 facing the front surface of fabric 100. In this example, release paper 300 is provided between mold 210 and resin film layer 120. Note that when resin film layer 120 is provided on the back surface of fabric layer 110, release paper 300 may be provided on the lower surface of resin film layer 120.

[0087] In step S144, the fabric layer 110 and the resin film layer 120 are embossed from above the release paper 300. In this example, both the first layer 121 and the second layer 122 may be embossed. The positions of the first layer 121 and the second layer 122 and the embossing position may be aligned so as to have any positional relationship.

[0088] In step S146, the embossed fabric 100 is removed from the embossing machine 200. In this way, the fabric 100 having a laminated structure on the resin film layer 120 can be manufactured.

[0089] Although the present invention has been described above using embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various modifications and improvements can be made to the above embodiments. It is clear from the claims that such modifications and improvements can also be included within the technical scope of the present invention.

[0090] It should be noted that the order of execution of each process, such as operations, procedures, steps, and stages, in the devices, systems, programs, and methods shown in the claims, specifications, and drawings is not specifically stated as "before," "prior to," etc., and that the processes can be performed in any order unless the output of a previous process is used in a subsequent process. Even if the operational flow in the claims, specifications, and drawings is described using "first," "next," etc. for convenience, this does not mean that the processes must be performed in this order. [Explanation of symbols]

[0091] 10...warp thread, 11...first shrinkage thread, 12...second shrinkage thread, 100...fabric, 110...fabric layer, 120...resin film layer, 121...first layer, 122...second layer, 125...opening, 200...embossing machine, 210...mold, 220...frame, 300...release paper, 510...warp thread

Claims

1. A woven or knitted fabric with an embossed pattern, A fabric layer; a resin film layer laminated on the surface side of the fabric layer; Equipped with the material of the fabric layer and the resin film layer is polyester; At least the surface side of the fabric layer and the resin film layer is embossed. material.

2. The melting point of the resin film layer is lower than the melting point of the fabric layer. The fabric of claim 1.

3. The melting point of the resin film layer is 80° C. or higher and 160° C. or lower. The fabric of claim 1.

4. The thickness of the resin film layer is 10 μm or more and 100 μm or less. The fabric of claim 1.

5. The resin film layer has a first layer laminated in contact with the fabric layer and a second layer laminated in contact with the first layer. The fabric of claim 1.

6. A woven or knitted fabric having an embossed pattern, A fabric layer; a resin film layer laminated on the fabric layer; Equipped with the resin film layer has a first layer laminated in contact with the fabric layer and a second layer laminated in contact with the first layer, The fabric layer, the first layer, and the second layer are embossed. material.

7. A woven or knitted fabric having an embossed pattern, A fabric layer; a resin film layer laminated on the fabric layer; Equipped with the resin film layer has a first layer laminated in contact with the fabric layer and a second layer laminated in contact with the first layer, the fabric layer and the resin film layer are embossed, The second layer has an opening for exposing the first layer. material.

8. The resin film layer is laminated on the surface side of the fabric layer. The fabric according to claim 6.

9. The resin film layer is laminated on the back side of the fabric layer. The fabric according to claim 6.

10. The fabric layer has a single yarn decitex of 0.05 or more and 0.7 or less.

10. The fabric according to any one of claims 1 to 9.

11. The yarn density of the warp yarns of the fabric layer is 200 or more and 300 or less.

10. The fabric according to any one of claims 1 to 9.

12. The thickness of the fabric layer is 0.3 mm or more and 1.5 mm or less.

10. The fabric according to any one of claims 1 to 9.

13. The total thickness of the fabric layer and the resin film layer is 0.3 mm or more and 1.5 mm or less.

10. The fabric according to any one of claims 1 to 9.

14. The embossing depth of the fabric is 50 μm or more and 400 μm or less.

10. The fabric according to any one of claims 1 to 9.

15. The fabric satisfies at least one of the evaluation standards of JIS L1091, JIS L1092, JIS L1093, JIS L1096, JIS L1076, JIS L0860, JIS L0849, JIS L0844, and JIS L0842.

10. The fabric according to any one of claims 1 to 9.

16. The method of claim 1, comprising the steps of: providing a woven or knitted fabric layer; laminating a resin film layer on the fabric layer; embossing the fabric layer and the resin film layer; Equipped with The embossing step includes: placing a release paper on the upper surface of the resin film layer; Embossing the fabric layer and the resin film layer from above the release paper; A method for producing a dough having the above structure.

17. The method of claim 16, further comprising the steps of: providing a woven or knitted fabric layer; laminating a resin film layer on the fabric layer; embossing the fabric layer and the resin film layer; Equipped with The embossing step includes: placing a release paper on the lower surface of the resin film layer; embossing the fabric layer and the resin film layer from above the fabric layer; A method for producing a dough having the above structure.

18. The thickness of the release paper is 30 μm or more and 100 μm or less. A method for producing the dough according to claim 16 or 17.

19. a step of performing a surface treatment on the release paper to impart a release effect to the release paper. A method for producing the dough according to claim 16 or 17.

20. A step of applying a embossing process to the release paper is provided. A method for producing the dough according to claim 16 or 17.

21. The material of the release paper includes at least one of paper, polyethylene, polypropylene, and epoxy resin. A method for producing the dough according to claim 16 or 17.

22. and heating the resin film layer at a temperature equal to or higher than the melting point of the resin film layer. A method for producing the dough according to claim 16 or 17.

23. The step of heating the resin film layer is performed after the step of laminating the resin film layer to the fabric layer and before the step of embossing the fabric layer and the resin film layer. A method for producing the dough of claim 22.

24. The step of heating the resin film layer is performed when the fabric layer and the resin film layer are embossed. A method for producing the dough of claim 22.

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