Support member, wafer holder, and method for manufacturing the support member

Abstract

A support member is provided in which protrusions that support a supported object are less likely to be damaged. [Solution] A support member comprising a resin sheet having a first surface and a second surface, and a plurality of metal bodies dispersedly arranged within the resin sheet in a plane parallel to the second surface, wherein the first surface has a plurality of protrusions at the locations where the plurality of metal bodies are arranged, and the second surface is flat.

Description

[Technical Field]

[0001] The present disclosure relates to a support member, a wafer holder, and a method for manufacturing the support member. [Background technology]

[0002] Patent Document 1 discloses a substrate heat treatment apparatus for performing heat treatment on a substrate. This substrate heat treatment apparatus includes a resin support seal member placed on the upper surface of a heat treatment plate. The support seal member includes a sheet-like base material, multiple convex portions provided on the base material, and ring-shaped ridge portions. The multiple convex portions support the underside of the substrate. The ridge portions have an inner diameter slightly smaller than the outer diameter of the substrate, making the minute space formed between the substrate and the base material airtight. When the gas in the minute space is exhausted, the substrate is sucked toward the heat treatment plate, and warpage of the substrate is corrected. Hereinafter, the substrate will be referred to as the wafer, the support seal member as the support member, and the convex portions as the protrusions. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-158168 Summary of the Invention [Problem to be solved by the invention]

[0004] When the wafer is sucked toward the thermal processing plate, the protrusions are pressed against the wafer, and the protrusions may be damaged if the wafer is repeatedly sucked and released.

[0005] An object of the present disclosure is to provide a support member in which protrusions that support a supported object are less likely to be damaged. Another object of the present disclosure is to provide a wafer holder that includes the support member. Another object of the present disclosure is to provide a method for easily manufacturing the support member. [Means for solving the problem]

[0006] The support member of the present disclosure includes a resin sheet having a first surface and a second surface, and a plurality of metal bodies disposed within the resin sheet and dispersed in a plane parallel to the first surface. The first surface has a plurality of protrusions at the locations where the plurality of metal bodies are disposed. The second surface is flat. [Effects of the Invention]

[0007] In the support member of the present disclosure, the protrusions that support the supported object are less likely to be damaged. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic cross-sectional view showing a support member according to an embodiment. [Figure 2] FIG. 2 is a schematic plan view showing the support member of the embodiment. [Figure 3] FIG. 3 is a schematic view illustrating another example of the second protrusions and the third protrusions provided on the support member of the embodiment. [Figure 4] FIG. 4 is a schematic view illustrating still another example of the second protrusions and the third protrusions provided on the support member of the embodiment. [Figure 5] FIG. 5 is a schematic diagram illustrating a method for manufacturing a support member according to an embodiment. [Figure 6] FIG. 6 is a schematic cross-sectional view showing a wafer holder according to an embodiment. [Figure 7] FIG. 7 is a schematic diagram illustrating the configuration of a heating unit equipped with a wafer holder according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] [Description of the embodiments of the present disclosure] First, embodiments of the present disclosure will be listed and described.

[0010] (1) A support member according to one aspect of the present disclosure includes a resin sheet having a first surface and a second surface, and a plurality of metal bodies disposed within the resin sheet and dispersed in a plane parallel to the second surface. The first surface has a plurality of protrusions at the locations where the plurality of metal bodies are disposed. The second surface is flat.

[0011] The protrusions formed on the first surface of the resin sheet are less likely to be crushed when subjected to the weight of a support object placed on the first surface or a load acting on the support object due to the presence of a metal body below the protrusions. The support object is, for example, a wafer. Because the protrusions are less likely to be crushed when subjected to the weight of the wafer or a load acting on the wafer, the protrusions are less likely to be damaged even when the wafer is repeatedly attracted to and released from the support member. The second surface of the support member is placed on a base plate. If the second surface is flat, the support member can be stably placed on the base plate.

[0012] (2) In the support member of (1) above, the plurality of protrusions may include a plurality of first protrusions arranged in a dot pattern in a plan view of the first surface.

[0013] The plurality of first protrusions arranged in a dotted pattern can uniformly support the supported object.

[0014] (3) In the support member of (2) above, each of the plurality of first protrusions has a flat tip surface, and the area of ​​the tip surface is 0.02 mm 2 Over 4.00mm 2 It may be the following:

[0015] If the tip surface of each first protrusion is flat, it is easy to support the object to be supported. 2 If the area of ​​the tip surface is 4.00 mm or more, it is easy to support the object to be supported. 2 If the area of ​​the tip surface is 4.00 mm or less, when a heater is disposed below the support member to heat the supported object, the heat transfer area for the supported object does not become too large, and local temperature variations are unlikely to occur. 2If the temperature is below this value, a gap is relatively likely to form between the support object and the support member. By discharging the gas in this gap, the support object can be adsorbed onto the support member.

[0016] (4) In the support member of (2) or (3) above, the plurality of protrusions may include a second protrusion arranged linearly so as to surround all of the plurality of first protrusions.

[0017] The second protrusions arranged linearly so as to surround all of the plurality of first protrusions can form a closed space between the supported object and the support member, and when gas is exhausted from this closed space, the supported object can be adsorbed onto the support member.

[0018] (5) In the support member of (4) above, the second protrusion may have a width of 0.2 mm or more and 1.0 mm or less.

[0019] When the width of the second protrusions is 0.2 mm or more, the second protrusions can easily support the vicinity of the peripheral edge of the supported object.When the width of the second protrusions is 1.0 mm or less, the number of first protrusions can be relatively increased.

[0020] (6) In the support member of (4) or (5) above, the second protrusion may have a slit dividing the second protrusion at a midpoint along its length.

[0021] A linear metal body is disposed below the second protrusion. If the length of the second protrusion is too long, i.e., if the length of the metal body disposed below the second protrusion is too long, wrinkles are likely to form in the resin sheet forming the second protrusion due to the difference in thermal expansion coefficient between the resin sheet and the metal body. By providing a slit in the second protrusion, i.e., by providing a slit in the metal body disposed below the second protrusion, wrinkles are less likely to form in the resin sheet forming the second protrusion. A narrow gap such as a slit can sufficiently exhaust gas between the supported object and the support member, allowing the supported object to be adsorbed to the support member.

[0022] (7) In the support member of (6) above, the plurality of protrusions may include a third protrusion arranged linearly along the slit, the length of the third protrusion being longer than the width of the slit.

[0023] The third protrusions, which are arranged linearly along the slits of the second protrusions, prevent gas from flowing from the gap between the supported object and the support member toward the slits. The third protrusions prevent gas from leaking from the slits, making it easier to exhaust gas between the supported object and the second protrusions and to adsorb the supported object to the support member.

[0024] (8) In the support member according to any one of (1) to (7) above, the plurality of protrusions may all have the same height.

[0025] If the plurality of protrusions all have the same height, the support object can be stably supported by the protrusions.

[0026] (9) In any of the support members (1) to (8) above, each of the plurality of metal bodies may be a metal piece having two planes parallel to the second surface, and the thicknesses of the plurality of metal bodies may all be the same.

[0027] If the thickness of the plurality of metal bodies is the same, the height of the plurality of protrusions is likely to be the same.

[0028] (10) In the support member according to any one of (1) to (9) above, the height of each of the plurality of protrusions and the thickness of each of the plurality of metal bodies may be the same.

[0029] If the height of each protrusion and the thickness of each metal body are the same, it is easy for the heights of the multiple protrusions to all be the same.

[0030] (11) In the support member according to any one of (1) to (10) above, the thickness of each of the plurality of metal bodies may be 30 μm or more and 200 μm or less.

[0031] If the thickness of each metal body is 30 μm or more, the protrusions can easily support the object to be supported. If the thickness of each metal body is 200 μm or less, the height of the protrusions will not be too high. If the height of the protrusions is not too high, the gap between the object to be supported and the support member will not be too large, making it easier to exhaust gas from this gap and to adsorb the object to the support member.

[0032] (12) In any of the support members (1) to (11) above, the resin sheet may have a first resin layer and a second resin layer, and the plurality of metal bodies may be arranged between the first resin layer and the second resin layer.

[0033] If a plurality of metal bodies can be arranged between the first resin layer and the second resin layer, the plurality of metal bodies can be easily arranged at specific locations inside the resin sheet.

[0034] (13) In the support member of (11) above, the first resin layer and the second resin layer may each have a thickness of 20 μm or more and 200 μm or less.

[0035] If the thickness of each of the first resin layer and the second resin layer is 20 μm or more, wrinkles are less likely to form even when subjected to heat cycles.If the thickness of each of the first resin layer and the second resin layer is 200 μm or less, heat response is good when heating the supported object.

[0036] (14) In any of the support members (1) to (13) above, the resin sheet may contain one or more resins selected from the group consisting of polyimide resin, polyether ether ketone resin, polytetrafluoroethylene resin, and perfluoroalkoxyalkane resin.

[0037] The protrusions made of the resins listed above are less likely to be worn down due to contact with the supported object.

[0038] (15) In any of the support members (1) to (14) above, the metal body may include one or more selected from the group consisting of stainless steel, kovar, nickel, nickel alloy, aluminum, and aluminum alloy.

[0039] By arranging a metal body made of the metals listed above below the protrusion, the protrusion is less likely to be crushed even when subjected to the weight of the supported object or a load acting on the supported object.

[0040] (16) A wafer holder according to one aspect of the present disclosure includes a support member according to any one of (1) to (15) above, and a base plate on which the support member is placed.

[0041] A wafer holder equipped with the above-described support member can be used for a long period of time because the protrusions that support the wafer are less likely to be damaged.

[0042] (17) A method for manufacturing a support member according to one aspect of the present disclosure includes the steps of: preparing a first resin film, a second resin film, and a metal film; integrating the metal film onto the second resin film; etching the metal film on the second resin film into a predetermined shape to form a plurality of metal bodies; and heat-pressing the second resin film and the first resin film so as to sandwich the plurality of metal bodies. In the heat-pressing, a surface of the second resin film opposite to a surface overlapping the first resin film is brought into contact with a flat plate, and a surface of the first resin film opposite to a surface overlapping the second resin film is brought into contact with a cushioning material.

[0043] The method for manufacturing a support member described in (17) above makes it possible to easily manufacture the support member described above.

[0044] [Details of the embodiments of the present disclosure] Specific examples of the support member, the method for manufacturing the support member, and the wafer holder of the present disclosure will be described with reference to the drawings. The same reference numerals in the drawings indicate the same or equivalent parts. In the drawings, some components may be exaggerated or simplified for ease of explanation. The dimensional ratios of the various parts in the drawings may also differ from the actual ratios. The present invention is not limited to these examples, but is defined by the claims, and all modifications within the meaning and scope of the claims are intended to be included.

[0045] <Supporting member> Overview 1 to 4, and if necessary, FIG. 6, a description will be given of a support member 1 according to an embodiment. The support member 1 is a part of a wafer holder 8 shown in FIG. 6. The support member 1 is placed on a base plate 80. A wafer 100 shown in FIG. 6 is placed on the support member 1.

[0046] As shown in Fig. 1, the support member 1 includes a resin sheet 2 and a plurality of metal bodies 3. The plurality of metal bodies 3 are dispersedly arranged inside the resin sheet 2. The first surface 2A of the resin sheet 2 includes a plurality of protrusions 6 at the locations where the plurality of metal bodies 3 are arranged. The plurality of protrusions 6 support the wafer 100 shown in Fig. 6.

[0047] <Resin sheet> The resin sheet 2 constitutes a main portion of the support member 1. As shown in FIG. 1, the resin sheet 2 has a first surface 2A and a second surface 2B. The first surface 2A is the surface facing the wafer 100 shown in FIG. 6. The second surface 2B is the surface in contact with the base plate 80 shown in FIG. 6. The second surface 2B is a flat surface. If the second surface 2B is a flat surface, the support member 1 can be stably placed on the base plate 80. Hereinafter, the direction from the second surface 2B toward the first surface 2A may be referred to as the first direction D1.

[0048] A plurality of metal bodies 3 are arranged inside the resin sheet 2. When viewed in the first direction D1, the resin sheet 2 has overlapping portions 4 that overlap the metal bodies 3 and non-overlapping portions 5 that do not overlap the metal bodies 3. A plurality of protrusions 6 are formed by these overlapping portions 4. The plurality of protrusions 6 are formed by parts of the resin sheet 2 being raised by the metal bodies 3. Details of the protrusions 6 will be described later.

[0049] The resin sheet 2 of this example includes a first resin layer 21 and a second resin layer 22. The first resin layer 21 and the second resin layer 22 are bonded together with a plurality of metal bodies 3 sandwiched therebetween. If the plurality of metal bodies 3 can be arranged between the first resin layer 21 and the second resin layer 22, the plurality of metal bodies 3 can be easily arranged at specific locations inside the resin sheet 2. The first resin layer 21 has a first surface 2A, and the second resin layer 22 has a second surface 2B. The first resin layer 21 and the second resin layer 22 are, for example, heat-sealed.

[0050] In this example, the multiple protrusions 6 are formed by portions of the first resin layer 21 being raised by the metal body 3. The second resin layer 22 in this example is not deformed by the metal body 3. In this example, the interface between the first resin layer 21 and the second resin layer 22 at the non-overlapping portion 5 and the interface between the metal body 3 and the second resin layer 22 at the overlapping portion 4 are flush with each other.

[0051] The thickness 21T of the first resin layer 21 and the thickness 22T of the second resin layer 22 are, for example, 20 μm or more and 200 μm or less. If the thicknesses 21T and 22T are 20 μm or more, wrinkles are less likely to form even when subjected to a heat cycle. If the thicknesses 21T and 22T are 200 μm or less, the thermal response when heating the wafer 100 is good. The thicknesses 21T and 22T may be 25 μm or more and 100 μm or less, or 30 μm or more and 70 μm or less. The thicknesses 21T and 22T may be the same or different. In this example, the thicknesses 21T and 22T are the same.

[0052] The thickness 21T is a first length along the first direction D1 from the interface between the first resin layer 21 and the second resin layer 22 to the first surface 2A between adjacent protrusions 6. The thickness 21T is an average value obtained by measuring the first length at three or more different locations. The thickness of the first resin layer 21 at the overlapping portion 4 is the same as the thickness 21T, for example. The thickness of the first resin layer 21 at the overlapping portion 4 is a second length along the first direction D1 from the interface between the first resin layer 21 and the metal body 3 to the tip surface 60 of the protrusion 6. The thickness of the first resin layer 21 at the overlapping portion 4 is an average value obtained by measuring the second length at three or more different locations.

[0053] The thickness 22T is a third length along the first direction D1 from the second surface 2B to the interface between the first resin layer 21 and the second resin layer 22. The thickness 22T is an average value obtained by measuring the third length at three or more different locations. In this example, the thickness 22T is uniform in a direction perpendicular to the first direction D1.

[0054] The resin sheet 2 of this example has through holes 25. The through holes 25 penetrate from the first surface 2A to the second surface 2B between adjacent protrusions 6. When the wafer 100 is placed on the support member 1, the through holes 25 communicate with the gap between the wafer 100 and the support member 1.

[0055] The resin sheet 2 contains, for example, one or more resins selected from the group consisting of polyimide resin, polyether ether ketone resin, polytetrafluoroethylene resin, and perfluoroalkoxyalkane resin. The plurality of protrusions 6 are formed from a part of the resin sheet 2. The protrusions 6 made of the resins listed above are less likely to be worn down due to contact with the wafer 100.

[0056] ≪Metal body≫ The metal bodies 3 contribute to maintaining the shape of the protrusions 6. The number of metal bodies 3 is the same as the number of protrusions 6. The metal bodies 3 are arranged in the same locations as the protrusions 6. The multiple metal bodies 3 are arranged dispersedly within the resin sheet 2 in a plane parallel to the second surface 2B. The metal bodies 3 in this example include multiple first metal bodies 31 and second metal bodies 32 shown in FIG. 1, and a third metal body not shown.

[0057] The multiple first metal bodies 31 form multiple first protrusions 61. As shown in FIG. 2, the multiple first metal bodies 31 are arranged in a dotted pattern at the locations where the multiple first protrusions 61 are formed. "Arranged in a dotted pattern" means that the multiple first metal bodies 31 are arranged dispersedly without clumping in a plane parallel to the second surface 2B. For example, adjacent first metal bodies 31 are arranged with a certain amount of space between them. If the multiple first metal bodies 31 are arranged uniformly, the wafer 100 can be stably supported by the multiple first protrusions 61 formed by the multiple first metal bodies 31. If the multiple first metal bodies 31 are arranged uniformly, the wafer 100 can be easily heated uniformly.

[0058] The second metal body 32 forms a second protrusion 62. As shown in Fig. 2, the second metal body 32 is arranged linearly at the location where the second protrusion 62 is formed. The second metal body 32 is arranged so as to surround a plurality of first metal bodies 31. The second metal body 32 has an inner diameter slightly smaller than the outer diameter of the wafer 100.

[0059] In this example, as shown in FIG. 2 , a slit 625 is provided in the second protrusion 62. Therefore, the second metal body 32 in this example has a slit that divides the second metal body 32 at a midpoint along its length to correspond to the slit 625. The number of slits is one or more. If the second metal body 32 is too long, wrinkles are likely to form in the resin sheet 2 due to the difference in thermal expansion coefficients between the resin sheet 2 and the second metal body 32. By providing a slit in the second metal body 32, wrinkles are less likely to form in the resin sheet 2. The number of slits in the second metal body 32 can be appropriately selected taking into account the difference in thermal expansion coefficients. The second metal body 32 in this example has two slits. Therefore, the second protrusion 62 in this example also has two slits 625.

[0060] The third metal body forms a third protrusion 63. As shown in FIG. 2 , the third metal body is arranged linearly where the third protrusion 63 is formed. The third metal body is arranged along the slits of the second metal body 32, at least on either the inside or outside of the envelope circle of the second metal body 32. The length of the third metal body is longer than the width of the slits of the second metal body 32. When viewed in a radial direction from the center of the envelope circle of the second metal body 32, the third metal body has a portion that overlaps the entire width of the slits of the second metal body 32.

[0061] Each metal body 3 is, for example, a metal piece having two flat surfaces parallel to the second surface 2B of the resin sheet 2. Each metal piece is a part of a single metal film. In other words, each metal body 3 has the same material and thickness.

[0062] The thicknesses 3T of the multiple metal bodies 3 made of the above metal pieces may all be the same. The multiple metal bodies 3 contribute to the formation of multiple protrusions 6. If the thicknesses 3T of the multiple metal bodies 3 are all the same, the heights 6H of the multiple protrusions 6 are likely to all be the same. The fact that the thicknesses 3T of the multiple metal bodies 3 are all the same includes a tolerance that is practically acceptable. The tolerance is, for example, within ±20% or ±10% of the design dimension.

[0063] The thickness 3T of each of the multiple metal bodies 3 may be 30 μm or more and 200 μm or less. If the thickness 3T is 30 μm or more, the wafer 100 can be easily supported by the protrusions 6. If the thickness 3T is 200 μm, the height of the protrusions 6 will not be too high. The thickness 3T may be 40 μm or more and 150 μm or less, or 50 μm or more and 100 μm or less. The thickness 3T is a fourth length along the first direction D1 between the surface of each metal body 3 facing the first surface 2A and the surface facing the second surface 2B. The thickness 3T is an average value obtained by measuring the fourth length at three or more different locations.

[0064] The metal body 3 includes, for example, one or more selected from the group consisting of stainless steel, Kovar, nickel, nickel alloy, aluminum, and aluminum alloy. As described above, the metal body 3 contributes to maintaining the shape of the protrusion 6. By disposing the metal body 3 made of the metals listed above below the protrusion 6, the protrusion 6 is less likely to be crushed even when subjected to the load of the wafer 100 or a load acting on the wafer 100.

[0065] ≪Protrusion≫ The protrusions 6 are formed by part of the resin sheet 2 protruding in the first direction D1. The protrusions 6 are provided to support the lower surface of the wafer 100. As shown in FIGS. 1 and 2 , the protrusions 6 of this example include a plurality of first protrusions 61, second protrusions 62, and third protrusions 63.

[0066] As shown in FIG. 2, the multiple first protrusions 61 are arranged in a dotted pattern on the first surface 2A in a plan view. The multiple first protrusions 61 are arranged dispersedly on the first surface 2A without clumping together. Adjacent first protrusions 61 are arranged with a certain amount of space between them. For example, the distance 61L between adjacent first protrusions 61 is 10 mm or more and 100 mm or less, or 20 mm or more and 50 mm or less. If the multiple first protrusions 61 are arranged uniformly dispersedly, the wafer 100 can be stably supported. The multiple first protrusions 61 are formed by portions of the resin sheet 2 being raised by the multiple first metal bodies 31.

[0067] Each of all the protrusions 6 including the plurality of first protrusions 61 has, for example, a flat tip surface 60. The flat tip surface 60 easily supports the wafer 100. The plurality of protrusions 6 are provided, for example, so that all the tip surfaces 60 are arranged in a plane parallel to the second surface 2B. The corners connecting the tip surface 60 of each protrusion 6 to the side surface are, for example, curved. The curved corners are less likely to damage the wafer 100. The tip surface 60 may be a curved surface.

[0068] In a plan view of the first surface 2A, the shape of the tip surface 60 of each first protrusion 61 may be circular or polygonal. Circles include perfect circles and ellipses. Polygons include shapes with rounded corners. In FIG. 2, the tip surface 60 of each first protrusion 61 is shown as a circle.

[0069] The area of ​​the tip surface 60 of each first protrusion 61 is, for example, 0.02 mm 2 Over 4.00mm 2 The area of ​​the tip surface 60 of each first protrusion 61 is 0.02 mm 2 If the area of ​​the tip surface 60 of each first protrusion 61 is 4.00 mm 2 If the area of ​​the tip surface 60 of each first protrusion 61 is 4.00 mm or less, when a heater (not shown) is disposed below the support member 1 to heat the wafer 100, the heat transfer area for the wafer 100 does not become too large, and local temperature variations are unlikely to occur. 2 If the gap is less than this, a gap is relatively likely to be formed between the wafer 100 and the support member 1. As will be described later, by discharging the gas in this gap, the wafer 100 can be adsorbed to the support member 1. The area of ​​the tip surface 60 of each first protrusion 61 is 0.07 mm 2 Over 1.75mm 2 Less than or equal to 0.20 mm 2 Over 0.80mm 2 The following is also acceptable.

[0070] In this example, the height 6H of each first protrusion 61 is the same as the thickness 3T of the first metal body 31 below that first protrusion 61. The height 6H of each first protrusion 61 is the distance from the extension plane of the first surface 2A between adjacent first protrusions 61 to the highest point of the tip surface 60.

[0071] As shown in FIG. 2 , the second protrusions 62 are arranged linearly so as to surround all of the multiple first protrusions 61. The second protrusions 62 can enhance the airtightness between the wafer 100 and the support member 1. The inner space surrounded by the second protrusions 62 can be made at a sufficiently lower pressure than the outer space. When the gas between the wafer 100 and the support member 1 is exhausted, the wafer 100 can be adsorbed to the support member 1. In addition to the function of supporting the wafer 100, the second protrusions 62 also have the function of enhancing the airtightness between the wafer 100 and the support member 1. The second protrusions 62 are formed by a portion of the resin sheet 2 being raised by the second metal body 32.

[0072] The second protrusion 62 has a slit 625 that divides it midway along its length. The provision of the slit 625 in the second protrusion 62 makes it difficult for wrinkles to form in the resin sheet 2. A narrow gap such as the slit 625 can sufficiently exhaust gas between the wafer 100 and the support member 1, allowing the wafer 100 to be adsorbed to the support member 1. The second protrusion 62 in this example is arranged in an arcuate shape because the slit 625 is formed therein.

[0073] The tip surface 60 of the second protrusion 62 is, for example, flat. If the tip surface 60 of the second protrusion 62 is flat, the wafer 100 can be easily supported and the space between the wafer 100 and the support member 1 can be easily sealed.

[0074] The width 62W of the second protrusion 62 is, for example, 0.2 mm or more and 1.0 mm or less. When the width 62W is 0.2 mm or more, the second protrusion 62 can easily support the vicinity of the peripheral edge of the wafer 100, and the airtightness between the wafer 100 and the support member 1 can be easily improved. When the width 62W is 1.0 mm or less, the number of first protrusions 61 can be relatively increased. The width 62W is the maximum distance in a direction perpendicular to the length of the second protrusion 62. The width 62W may be 0.3 mm or more and 0.6 mm or less, or 0.4 mm or more and 0.5 mm or less.

[0075] In this example, the height 6H of the second protrusion 62 is the same as the thickness 3T of the second metal body 32 below the second protrusion 62. The height 6H of the second protrusion 62 is the distance from the extension plane of the first surface 2A, which is the reference for the height 6H of each first protrusion 61, to the highest point of the tip surface 60.

[0076] The third protrusion 63 is arranged linearly along the slit 625 on at least one of the inside and outside of an envelope circle 627 of the second protrusion 62. For ease of understanding, in FIG. 2 , the envelope circle 627 is shown by a two-dot chain line slightly outside the outer edge of the second protrusion 62. The actual envelope circle 627 overlaps with the outer edge of the second protrusion 62. At least a portion of the third protrusion 63 is arranged at a distance from the second protrusion 62.

[0077] The length of the third protrusion 63 is longer than the width of the slit 625. The width of the slit 625 is the length of the gap along a circle concentric with the envelope circle 627. When viewed in a radial direction from the center of the envelope circle 627 of the second protrusion 62, the third protrusion 63 has an overlapping portion across the entire width of the slit 625. The number of third protrusions 63 can be appropriately selected depending on the number of slits 625. In this example, one third protrusion 63 is arranged in each of the two slits 625. In this example, the number of third protrusions 63 is two. The third protrusion 63 is formed by a third metal body raising a portion of the resin sheet 2.

[0078] A gap 63G is provided between the second protrusion 62 and the third protrusion 63. The gap 63G communicates with the gap between the wafer 100 and the support member 1 inside the second protrusion 62 and with the slit 625. The third protrusion 63 prevents gas from flowing from the gap between the wafer 100 and the support member 1 toward the slit 625. The third protrusion 63 prevents gas from leaking from the slit 625, making it easier to exhaust gas from the gap between the wafer 100 and the support member 1 and to adsorb the wafer 100 to the support member 1. The length and width of the gas flow path formed between the third protrusion 63 and the second protrusion 62 can be easily adjusted by changing at least one of the size and shape of the third protrusion 63 and the spacing between the third protrusion 63 and the second protrusion 62. This adjustment allows the flow resistance of the gap 63G to be greater than the flow resistance of the through-hole 25, thereby maintaining an appropriate degree of vacuum in the space inside the second protrusion 62.

[0079] For example, as shown in FIG. 2, one third protrusion 63 may be arranged inside the enveloping circle 627. The third protrusion 63 shown in FIG. 2 does not contact the second protrusion 62 at all. The third protrusion 63 may have a portion that contacts the second protrusion 62 as shown in FIG. 3. Even if the second protrusion 62 and the third protrusion 63 are in contact, the third protrusion 63 is arranged to form a gap 63G, so that the second protrusion 62 is divided along its length. As shown in FIG. 4, one third protrusion 63 may be arranged outside the enveloping circle 627. The third protrusion 63 may be curved along its length so that it approaches the slit 625 as shown in FIG. 4. The third protrusion 63 may be bent along its length. Although not shown, the third protrusion 63 may be arranged both inside and outside the enveloping circle 627.

[0080] In this example, the height of the third protrusion 63 is the same as the thickness of the third metal body below the third protrusion 63. The height of the third protrusion 63 is the distance from the extension plane of the first surface 2A between the second protrusion 62 and the third protrusion 63 to the highest point on the tip surface of the third protrusion 63.

[0081] The support member 1 may be provided with holes for lift pins (not shown). The holes for lift pins are provided so as to penetrate the first surface 2A and the second surface 2B between adjacent protrusions 6. The lift pins are provided so as to be movable up and down within the holes for lift pins. The lift pins can lift the wafer 100 relative to the support member 1. When the support member 1 is provided with holes for lift pins, a fourth protrusion (not shown) may be provided to surround the holes for lift pins. The provision of the fourth protrusion prevents the flow of gas from the gap between the wafer 100 and the support member 1 toward the gap between the holes for lift pins and the lift pins, thereby increasing the airtightness of the space between the wafer 100 and the support member 1.

[0082] In this example, the heights 6H of all the protrusions 6, including the multiple first protrusions 61, second protrusions 62, and third protrusions 63, are all the same. If the heights 6H of the multiple protrusions 6 are all the same, the wafer 100 can be stably supported by the protrusions 6. The fact that the heights 6H of the multiple protrusions 6 are all the same includes a tolerance that is practically acceptable. The tolerance is, for example, within ±20% or ±10% of the design dimension.

[0083] In this example, the height 6H of each protrusion 6 is the same as the thickness 3T of each metal body 3. The height 6H of each protrusion 6 is, for example, 30 μm or more and 200 μm or less. If the height 6H is 30 μm or more, the wafer 100 is easily supported. If the height 6H is 200 μm, the gap between the wafer 100 and the support member 1 is not too large, making it easy to exhaust gas from this gap and to adsorb the wafer 100 to the support member 1. The height 6H may also be 40 μm or more and 150 μm or less, or 50 μm or more and 100 μm or less.

[0084] <Method for manufacturing support member> A method for manufacturing a support member according to an embodiment will be described with reference to Fig. 5. The method for manufacturing a support member includes a first step of preparing a first resin film 210, a second resin film 220, and a metal film 300, a second step of integrating the metal film 300 onto the second resin film 220, a third step of forming a plurality of metal bodies 3 on the second resin film 220, and a fourth step of overlapping and heat-pressing the first resin film 210 and the second resin film 220.

[0085] In the first step, as shown in the upper diagram of FIG. 5 , a first resin film 210, a second resin film 220, and a metal film 300 are prepared. The first resin film 210 is the material of the first resin layer 21 of the support member 1 described above. The material and thickness of the first resin film 210 are the same as those of the first resin layer 21. The second resin film 220 is the material of the second resin layer 22 of the support member 1 described above. The material and thickness of the second resin film 220 are the same as those of the second resin layer 22. The metal film 300 is the material of the metal body 3 of the support member 1 described above. The material and thickness of the metal film 300 are the same as those of the metal body 3.

[0086] In the second step, the metal film 300 is integrated onto the first surface of the second resin film 220 as indicated by the arrow in the upper diagram of FIG.

[0087] In the third step, as shown in the center diagram of Figure 5, the metal film 300 on the second resin film 220 is etched into a predetermined shape to form a plurality of metal bodies 3. In this example, a plurality of first metal bodies 31, second metal bodies 32, and third metal bodies are formed from the metal film 300. The plurality of first metal bodies 31, second metal bodies 32, and third metal bodies are part of a single metal film 300. For ease of explanation, three metal bodies 3 are shown in Figure 5.

[0088] In the fourth step, as shown in the lower diagram of Fig. 5, the first resin film 210 and the second resin film 220 are overlapped with a plurality of metal bodies 3 sandwiched therebetween and then heat-pressed. The heat-pressing may be performed at a temperature and pressure such that the first resin film 210 and the second resin film 220 are thermally fused to each other at their joining surfaces. By the heat-pressing, a resin sheet 2 having a first resin layer 21 and a second resin layer 22 as shown in Fig. 1 is formed.

[0089] During the heat pressing, the surface of the second resin film 220 opposite to the surface overlapping with the first resin film 210 is brought into contact with the flat plate 400. The surface in contact with the flat plate 400 becomes flat without being deformed by the heat pressing. This flat surface is the second surface 2B shown in FIG. 1. During the heat pressing, a release film (not shown) may be placed between the second resin film 220 and the flat plate 400.

[0090] During the heat pressing, the surface of the first resin film 210 opposite to the surface overlapping the second resin film 220 is brought into contact with the cushion material 500. The surface in contact with the cushion material 500 is deformed by the heat pressing. Specifically, the heat pressing causes the overlapping portion of the first resin film 210 that overlaps the metal body 3 to bulge due to the metal body 3. This bulged portion is the protrusion 6 shown in FIG. 1. During the heat pressing, a release film (not shown) may be placed between the first resin film 210 and the cushion material 500.

[0091] With this manufacturing method, multiple metal bodies 3 are formed from a single metal film 300, so the thickness of the multiple metal bodies 3 can all be the same. During the heat press, the surface in contact with the flat plate 400 becomes flat, and the surface in contact with the cushioning material 500 rises in accordance with the thickness 3T of the metal body 3, thereby forming a protrusion 6 having a height 6H that is the same as the thickness 3T of the metal body 3. Because the thickness of the multiple metal bodies 3 is the same, the height 6H of the multiple protrusions 6 that are formed can all be the same.

[0092] <Wafer holder> Wafer holder 8 of this embodiment will be described with reference to Figure 6. Wafer holder 8 includes support member 1 and base plate 80. Wafer holder 8 is used in, for example, a coater developer or a vapor deposition device.

[0093] The base plate 80 is made of a material with high thermal conductivity. The material of the base plate 80 is a metal such as copper (Cu) or aluminum (Al). The material of the base plate 80 may also be a highly rigid ceramic such as silicon carbide (SiC), aluminum nitride, Si—SiC, or Al—SiC.

[0094] The base plate 80 of this example includes a recess 82 and a first through hole 83. The recess 82 is provided on the mounting surface of the base plate 80 on which the support member 1 is mounted. The mounting surface is the surface facing the second surface 2B of the support member 1. The recess 82 is a single continuous notch that opens onto the mounting surface. The recess 82 is formed, for example, by multiple annular grooves concentrically arranged around the central axis of the base plate 80 and connecting grooves that connect the multiple annular grooves. A closed space is formed between the recess 82 and the second surface 2B. The first through hole 83 is provided to connect the recess 82 to the outside of the base plate 80. The first through hole 83 is provided to exhaust gas from the closed space formed between the recess 82 and the second surface 2B. By exhausting gas from the closed space through the first through hole 83, the support member 1 can be adsorbed to the base plate 80. The support member 1 is fixed to the base plate 80 by adsorption. The support member 1 in this example is not fixed to the base plate 80 by adhesive or the like. The support member 1 may be fixed to the base plate 80 by adhesive.

[0095] The base plate 80 of this example has a second through hole 85. The second through hole 85 is provided to connect the mounting surface of the base plate 80 to the outside of the base plate 80. The second through hole 85 is connected to the through hole 25 provided in the support member 1. The second through hole 85 is provided to exhaust gas from within the space between the wafer 100 and the support member 1. By exhausting gas from within the space through the second through hole 85, the wafer 100 can be adsorbed to the support member 1. By adsorbing the wafer 100 to the support member 1, any warpage of the wafer 100 is corrected.

[0096] <Heating unit> Heating unit 9 according to an embodiment will be described with reference to Fig. 7. Heating unit 9 includes wafer holder 8, heater plate 91, and ceramic plate 92. For ease of explanation, through-hole 25, recess 82, first through-hole 83, and second through-hole 85 shown in Fig. 6 are omitted in Fig. 7.

[0097] The heater plate 91 includes a heating element 910 therein. The heater plate 91 is formed, for example, by sandwiching the heating element 910 between two resin layers.

[0098] The ceramic plate 92 is disposed so as to support the lower surface of the heater plate 91. The material of the ceramic plate 92 is a ceramic such as aluminum nitride, silicon carbide, aluminum oxide, or silicon nitride.

[0099] The base plate 80, heater plate 91, and ceramic plate 92 are joined together, for example, by screws (not shown). By providing the highly rigid ceramic plate 92, the wafer holder 8, and therefore the wafer 100, can be stably supported. The ceramic plate 92 is not essential. If the ceramic plate 92 is not provided, the base plate 80 and heater plate 91 can be adhesively fixed to each other, for example.

[0100] The heat generated by the heating element 910 is transferred from the heater plate 91 to the base plate 80, the support member 1, and the wafer 100 in this order.

[0101] [Test example] In the test examples, a support member having multiple metal bodies inside a resin sheet and a support member having no metal bodies were fabricated, and the degree of wear of the protrusions was examined when a wafer was repeatedly adsorbed and released from the support member.

[0102] <Test specimen description> For specimen A, the support member was made using a first resin film, a second resin film, and a metal film. The first resin film and the second resin film were made of the same material and had the same thickness. The first resin film and the second resin film were made of polyimide resin. The first resin film and the second resin film were 0.05 mm thick. The metal film was made of stainless steel. The metal film was 0.05 mm thick. The first resin film, the second resin film, and the metal film were circular with a diameter of 320 mm.

[0103] First, a metal film was integrated onto the second resin film, and the metal film was then etched into a predetermined shape to form multiple metal bodies. As shown in FIG. 2, the multiple metal bodies were formed as follows: multiple first metal bodies arranged in a dotted pattern; a second metal body arranged linearly so as to surround the multiple first metal bodies; and a third metal body formed linearly along a slit formed in the second metal body. The first resin film and the second resin film were then overlapped to sandwich the multiple metal bodies and heat-pressed. The heat-pressing was performed at a temperature and pressure such that the first resin film and the second resin film were thermally bonded to each other at their joining surfaces. During the heat-pressing, the surface of the second resin film opposite the surface overlapping the first resin film was contacted with a flat plate, and the surface of the first resin film opposite the surface overlapping the second resin film was contacted with a cushioning material. The surface in contact with the flat plate remained flat and was not deformed by the heat-pressing, while the surface in contact with the cushioning material was deformed by the heat-pressing. Specifically, the overlapping portions of the first resin film where they overlapped the metal bodies were raised by the metal bodies. These raised portions are called protrusions.

[0104] The support member of specimen A is circular and has a diameter of 320 mm. The thickness of the support member is 0.10 mm. The height of the protrusion is 0.05 mm. In other words, the thickness of the support member excluding the protrusion is 0.10 mm, and the thickness of the support member including the protrusion is 0.15 mm. All of the multiple protrusions have the same height.

[0105] The support member of specimen B comprises a base material made of polyimide resin and protrusions. The base material and protrusions are molded as a single unit. For specimen B, a resin film with a thickness of 0.15 mm was prepared, and one side of the resin film was etched by 0.05 mm to form a predetermined shape, forming multiple protrusions with a height of 0.05 mm. The support member of specimen B is the same as that of specimen A in terms of the arrangement, shape, and height of the protrusions, except that it does not have multiple metal bodies.

[0106] <Suction and release of wafer from support member> The support member of each test specimen was fixed by suction onto a base plate. The base plate was fixed to a heater plate. The heater plate was set to heat the wafer to 200°C. The wafer was repeatedly sucked onto the support member and released from it 10,000 times, after which the shape and area of ​​the protrusions were examined.

[0107] The shape and area of ​​the protrusions on the support member of specimen A were maintained compared to the initial state. It is believed that the metal body located below the protrusions on the support member of specimen A prevented the protrusions from being crushed even when the wafer was repeatedly attached and released from the support member.

[0108] Compared to the initial state, the support member of specimen B had wear on the protrusions and the height of the protrusions had decreased. Because the support member of specimen B did not have a metal body, it is believed that the protrusions were crushed by the repeated attachment and release of the wafer to the support member. [Explanation of symbols]

[0109] 1 Support member 2 Resin sheet 2A first page, 2B second page 21 first resin layer, 22 second resin layer 21T, 22T thickness 25 through holes 3 Metal body 31 first metal body, 32 second metal body 3T Thickness 4. Duplicate parts 5 Non-overlapping areas 6 Protrusion 6H height 60 Tip surface 61 First protrusion, 61L distance 62 second protrusion, 625 slit, 627 envelope circle, 62W width 63 Third protrusion, 63G Gap 8 Wafer holder 80 base plate, 82 recess 83 First through hole, 85 Second through hole 9 Heating Unit 91 heater plate, 910 heating element 92 Ceramic Plate 100 wafers 210 first resin film, 220 second resin film 300 Metallic Film 400 flat plate 500 cushioning material D1 First direction

Claims

1. A support member having a plurality of protrusions for supporting an object to be supported, a resin sheet having a first surface and a second surface; a plurality of metal bodies disposed inside the resin sheet and dispersed within a plane parallel to the second surface; the first surface has the plurality of protrusions at locations where the plurality of metal bodies are arranged, the second surface is a plane; Support member.

2. The support member according to claim 1 , wherein the plurality of protrusions include a plurality of first protrusions arranged in a dot pattern in a plan view of the first surface.

3. Each of the plurality of first protrusions has a flat tip surface, The area of ​​the tip surface is 0.02 mm ２ Over 4.00 mm ２ 3. The support member of claim 2, wherein:

4. The support member according to claim 2 , wherein the plurality of protrusions includes a second protrusion arranged linearly so as to surround all of the plurality of first protrusions.

5. The support member according to claim 4 , wherein the width of the second protrusion is 0.2 mm or more and 1.0 mm or less.

6. The support member according to claim 4 , wherein the second protrusion has a slit that divides the second protrusion at an intermediate point along its length.

7. the plurality of protrusions include a third protrusion that is linearly arranged along the slit, The support member according to claim 6 , wherein the third protrusion has a length greater than a width of the slit.

8. The support member according to claim 1 , wherein the plurality of protrusions all have the same height.

9. each of the plurality of metal bodies is a metal piece having two flat surfaces parallel to the second surface; The support member according to claim 8 , wherein the thicknesses of the plurality of metal bodies are all the same.

10. The support member according to claim 9 , wherein the height of each of the plurality of protrusions is the same as the thickness of each of the plurality of metal bodies.

11. The support member according to claim 10 , wherein each of the plurality of metal bodies has a thickness of 30 μm or more and 200 μm or less.

12. the resin sheet has a first resin layer and a second resin layer, The support member according to claim 1 , wherein the plurality of metal bodies are disposed between the first resin layer and the second resin layer.

13. The support member according to claim 12 , wherein the first resin layer and the second resin layer each have a thickness of 20 μm or more and 200 μm or less.

14. The support member according to claim 1 , wherein the resin sheet contains at least one resin selected from the group consisting of polyimide resin, polyether ether ketone resin, polytetrafluoroethylene resin, and perfluoroalkoxyalkane resin.

15. The support member according to claim 1 , wherein the metal body comprises at least one selected from the group consisting of stainless steel, Kovar, nickel, nickel alloy, aluminum, and aluminum alloy.

16. A support member according to any one of claims 1 to 15; a base plate on which the support member is placed, Wafer holder.

17. A method for manufacturing a support member having a plurality of protrusions for supporting an object to be supported, comprising: preparing a first resin film, a second resin film, and a metal film; a step of integrating the metal film onto the second resin film; a step of processing the metal film on the second resin film into a predetermined shape by etching to form a plurality of metal bodies; and a step of overlapping the second resin film and the first resin film so as to sandwich the plurality of metal bodies therebetween and hot pressing the second resin film and the first resin film together, In the heat-pressing step, the second resin film is heat-pressed while a surface thereof opposite to a surface thereof overlapping with the first resin film is in contact with a flat plate and a surface thereof opposite to a surface thereof overlapping with the second resin film is in contact with a cushioning material, thereby forming the plurality of protrusions at locations of the first resin film that overlap with the plurality of metal bodies. A method for manufacturing a support member.

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