Substrate processing system and substrate processing method

Abstract

To provide a substrate processing system and a substrate processing method, capable of suppressing variations of a processing in each substrate.SOLUTION: A control part 180 of a substrate processing system 1 controls a lifter LF1 to perform a batch processing at a first time that a plurality of substrates W of a vertical posture is sunk to a chemical liquid in a chemical liquid processing tank BT1. The control part 180 rotates the plurality of substrates W to which the batch processing at the first time is processed by controlling a second posture conversion mechanism 43, and thus, vertically inverts the plurality of substrates W of the vertical posture. The control part 180 controls the lifter LF1 to perform the batch processing at a second time for sinking the plurality of substrates W of which the vertical posture is vertically inverted into the chemical liquid in the chemical liquid processing tank BT1.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate processing system and a substrate processing method for processing substrates, such as semiconductor substrates, substrates for FPDs (Flat Panel Displays), glass substrates for photomasks, substrates for optical disks, substrates for magnetic disks, ceramic substrates, and substrates for solar cells. Examples of FPDs include liquid crystal display devices and organic EL (electroluminescence) display devices. [Background technology]

[0002] A conventional substrate processing apparatus includes a substrate transport mechanism that transports a group of substrates to be processed at once, a processing tank that stores a heated phosphoric acid solution, and a lifter that holds the group of substrates and immerses the group of substrates in the phosphoric acid solution. After the group of substrates is transported to the processing tank by the substrate transport mechanism, the lifter receives the group of substrates from the substrate transport mechanism and immerses the group of substrates in the phosphoric acid solution in the processing tank. This allows the group of substrates to be etched at once (see, for example, Patent Document 1).

[0003] Patent Document 2 discloses a substrate processing system that includes a batch processing section that processes multiple substrates at once, a single-wafer processing section that processes substrates one by one, and an interface section that transfers substrates between the single-wafer processing section and the batch processing section. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-296823 [Patent Document 2] Patent Publication No. 2021-064652 Summary of the Invention [Problem to be solved by the invention]

[0005] A plurality of vertically oriented substrates are immersed in a phosphoric acid solution in a processing tank. The substrates are etched together. To circulate the phosphoric acid solution in the processing tank, for example, at least one of the phosphoric acid solution and air bubbles is introduced from the bottom to the top of the processing tank. This etching process continues for a preset time (e.g., 4 hours). However, the degree of etching may differ between the upper and lower halves of each vertically oriented substrate, possibly due to fresher phosphoric acid solution acting on the substrates at the bottom of the processing tank.

[0006] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate processing system and a substrate processing method that can suppress variations in processing among substrates. [Means for solving the problem]

[0007] In order to achieve the above object, the present invention has the following configuration: That is, a substrate processing system for processing substrates according to the present invention includes a batch processing apparatus for processing a plurality of substrates at once, the batch processing apparatus including a first carrier mounting shelf on which a carrier for storing the plurality of substrates in a horizontal position is mounted, a first position changing mechanism for changing the position of the plurality of substrates between a horizontal position and a vertical position, and No. 1a substrate handling mechanism that transports the plurality of substrates between the carrier placed on a carrier shelf and the first position change mechanism; a processing tank that stores a chemical solution; a lifter that can immerse the plurality of substrates in the chemical solution in the processing tank while holding the plurality of substrates in a vertical position; a second position change mechanism that rotates the plurality of substrates around a horizontal axis that is perpendicular to a central axis passing through the center of each substrate; a first batch transport robot that transports the plurality of substrates between the first position change mechanism, the lifter, and the second position change mechanism while holding the plurality of substrates in a vertical position; and a control unit, wherein the control unit (1) controls the substrate handling mechanism to transport the plurality of substrates in a horizontal position received from a carrier placed on the first carrier shelf to the first position change mechanism, (2) controls the first position change mechanism to change the position of the plurality of substrates from the horizontal position to a vertical position, and (3) (4) controlling the lifter to perform a first batch process in which the plurality of substrates in the vertical position are immersed in the chemical solution in the processing tank; (5) controlling the first batch transport robot to transport the plurality of substrates that have been subjected to the first batch process to the second position conversion mechanism; (6) controlling the second position conversion mechanism to rotate the plurality of substrates that have been subjected to the first batch process around the horizontal axis, thereby inverting the plurality of substrates in the vertical position; (7) controlling the first batch transport robot to transport the plurality of substrates in the vertical position, inverted, to the lifter; and (8) controlling the lifter to perform a second batch process in which the plurality of substrates in the vertical position, inverted, are immersed in the chemical solution in the processing tank.

[0008] According to the substrate processing apparatus of the present invention, a first batch process and a second batch process are performed in which a plurality of substrates are immersed in a chemical solution in a processing tank. Here, the second position conversion mechanism rotates the plurality of substrates that have undergone the first batch process around a horizontal axis, thereby inverting the plurality of substrates that have been in a vertical position. In other words, between the first batch process and the second batch process, an operation of inverting the plurality of substrates that have been in a vertical position is performed. This makes it possible to suppress processing variations that occur between the upper and lower halves of each substrate.

[0009] In the substrate processing system described above, it is preferable that the second position changing mechanism has an inversion chuck that holds the plurality of substrates and rotates the inversion chuck about the horizontal axis. The operation of turning the plurality of vertically oriented substrates upside down is performed by rotating the inversion chuck that holds the plurality of substrates about the horizontal axis.

[0010] Furthermore, in the above-described substrate processing system, it is preferable that the inversion chuck includes two chuck members having multiple pairs of holding grooves, the two chuck members being openable and closable along the horizontal axis, and each of the multiple pairs of holding grooves is perpendicular to the opening and closing direction of the two chuck members and includes a first support portion that stops movement of the single substrate to be accommodated in a predetermined direction of the substrate insertion / removal direction along the device surface of the single substrate to be accommodated, and a second support portion that stops movement of the single substrate to be accommodated in a direction opposite to the predetermined direction.

[0011] In the inversion chuck, the first and second support portions of each pair of holding grooves prevent the movement of a single substrate in both directions of the substrate insertion and removal, making it easy to turn multiple substrates upside down in a vertical position.

[0012] The substrate processing system may further include a first horizontal substrate transport robot having a first hand for holding one substrate in a horizontal position and transporting the one substrate, wherein the control unit controls the second position conversion mechanism to rotate the inversion chuck around the horizontal axis while holding the plurality of substrates by the inversion chuck, thereby converting the plurality of substrates that have undergone the first batch processing from a vertical position to a horizontal position, No. 1 It is preferable to control the horizontal substrate transport robot to perform a rearrangement operation in which the multiple substrates converted to a horizontal position are rearranged within the inversion chuck so as to exchange the positions of the outer substrate and the inner substrate in the direction in which the multiple substrates are arranged, and to control the second position conversion mechanism to convert the multiple substrates that have been subjected to the rearrangement operation from a horizontal position to a vertical position by further rotating the inversion chuck around the horizontal axis while holding the multiple substrates with the inversion chuck, so as to turn upside down the multiple substrates that were in a vertical position when the first batch processing was performed.

[0013] In addition to the operation of turning the multiple vertically oriented substrates upside down, a rearrangement operation is performed. The rearrangement operation is an operation of rearranging the multiple substrates, which have been converted to a horizontal orientation, in the inversion chuck so as to exchange the positions of the outer substrates and the inner substrates in the direction in which the multiple substrates are arranged. This makes it possible to suppress processing variations that occur between the outer substrates and the inner substrates in the direction in which the multiple substrates are arranged.

[0014] Furthermore, the substrate processing system described above includes, in addition to the batch processing device, a single wafer processing device that processes the plurality of substrates one by one, and a relay device that transports the plurality of substrates from the batch processing device to the single wafer processing device, the relay device having a first hand that holds one substrate in a horizontal position and a first horizontal substrate transport robot that transports the one substrate, the single wafer processing device including a single wafer processing chamber that performs single wafer processing on the one horizontally oriented substrate, a second carrier mounting shelf on which the carrier is placed, and a second horizontal substrate transport robot that has a second hand that holds the one substrate in a horizontal position and transports the one substrate between the relay device, the single wafer processing chamber, and the carrier placed on the second carrier mounting shelf, and the control unit controls the first batch transport robot to perform single wafer processing on the one horizontally oriented substrate. It is preferable to transport the plurality of substrates that have undergone the second batch processing to the second attitude conversion mechanism, control the second attitude conversion mechanism to convert the plurality of substrates that have undergone the second batch processing from a vertical attitude to a horizontal attitude, control the first horizontal substrate transport robot to transport the single substrate that has been converted to a horizontal attitude from the second attitude conversion mechanism to the single substrate processing apparatus, control the second horizontal substrate transport robot to transport the single substrate transported by the first horizontal substrate transport robot to the single substrate processing chamber, control the single substrate processing chamber to perform the single substrate processing, and control the second horizontal substrate transport robot to transport the single substrate that has undergone the single substrate processing from the single substrate processing chamber to the carrier placed on the second carrier loading shelf.

[0015] The substrate processing system includes a batch processing device, a single wafer processing device, and a relay device. The substrates that have undergone the second batch processing are sent to the single wafer processing device via the relay device. Here, the second position conversion mechanism not only flips the vertically positioned substrates upside down, but also converts the substrates from the vertical position to a horizontal position. In other words, the second position conversion mechanism not only converts the substrates to a horizontal position, but also flips them upside down. This eliminates the need to separately provide a mechanism for converting the substrates to a horizontal position and a mechanism for flipping them upside down, allowing the substrate processing system to have a compact configuration.

[0016] In the substrate processing system described above, the control unit controls the substrate handling mechanism to transport the plurality of horizontally oriented substrates received from a first carrier placed on the first carrier mounting shelf to the first position conversion mechanism, and also controls the first position conversion mechanism to transport the plurality of horizontally oriented second substrates received from a second carrier placed on the first carrier mounting shelf, and controls the first position conversion mechanism to transport the plurality of horizontally oriented second substrates received from a second carrier placed on the first carrier mounting shelf. The aforementioneda processing substrate group in which a plurality of first and second substrates are alternately arranged; the processing substrate group is converted from a horizontal position to a vertical position; the first batch transport robot is controlled to transport the processing substrate group in the vertical position to the lifter; the lifter is controlled to perform the first batch processing in which the processing substrate group is immersed in the chemical solution in the processing tank; the first batch transport robot is controlled to transport the processing substrate group that has been subjected to the first batch processing to the second position conversion mechanism; and the second position conversion mechanism is controlled to perform the first batch processing. and rotating the plurality of substrates among the group of processed substrates that have been subjected to the first batch processing about the horizontal axis, and rotating the plurality of second substrates among the group of processed substrates that have been subjected to the first batch processing about the horizontal axis, thereby inverting the plurality of substrates and the plurality of second substrates in a vertical position, controlling the first batch transport robot to transport the group of processed substrates that have been inverted in a vertical position to the lifter, and controlling the lifter to perform a second batch processing in which the group of processed substrates that have been inverted in a vertical position are immersed in the chemical solution in the processing tank.

[0017] The substrate processing system can suppress processing variations that occur in the upper and lower halves of each substrate in the processing substrate group by inverting the processing substrate group, in which multiple substrates and multiple second substrates are arranged alternately.

[0018] In the above-described substrate processing system, the second position changing mechanism includes a standby lifter that holds the group of processing substrates in a vertical position; an inversion chuck for holding the plurality of substrates; a second batch transfer robot that transfers the group of substrates to be processed between the standby lifter and the inversion chuck, The second position changing mechanism rotates the inversion chuck around the horizontal axis, The control unit controls the first attitude conversion mechanism to The aforementioned A plurality of second substrates are alternately arranged, and all device surfaces of the plurality of substrates and the plurality of No. 2A group of substrates to be processed is formed in which all device surfaces of the substrates face each other, and the group of substrates to be processed is converted from a horizontal position to a vertical position, and the second batch transport robot is controlled to transfer all device surfaces of the plurality of substrates and the plurality of substrates. No. 2 It is preferable that the plurality of upside-down substrates and the plurality of upside-down second substrates are transported to the standby lifter so that all device surfaces of the substrates face each other.

[0019] The processing substrate group is formed by alternately arranging multiple substrates and multiple second substrates, with all device surfaces of the multiple substrates facing each other. After the processing substrate group is inverted, the two device surfaces of the two end substrates may not face the two device surfaces of the other two substrates in the direction in which the processing substrate group is arranged. In this case, when batch processing is performed, the amount of chemical solution flowing may differ between the substrates whose device surfaces do not face each other and the two substrates whose device surfaces face each other. This may result in processing variations. Therefore, by ensuring that all device surfaces of the multiple substrates face each other even after the processing substrate group is inverted, such processing variations can be prevented.

[0020] Furthermore, in the above-described substrate processing system, it is preferable that the batch processing device further includes a batch drying section that dries the plurality of substrates all at once, the first batch transport robot transports the plurality of substrates between the first posture change mechanism, the lifter, the second posture change mechanism, and the batch drying section while holding the plurality of substrates in a vertical position, and the control section controls the first batch transport robot to transport the plurality of substrates that have undergone the second batch processing to the batch drying section, and controls the batch drying section to dry the plurality of substrates that have undergone the second batch processing all at once.

[0021] The substrate processing system can dry the plurality of substrates that have undergone the second batch processing all at once using the batch drying unit, without sending the plurality of substrates that have undergone the second batch processing to a single wafer processing device.

[0022] A substrate processing method according to the present invention is also provided for a substrate processing system including a batch processing apparatus for processing a plurality of substrates at once, the batch processing apparatus including: a carrier for storing the plurality of substrates in a horizontal position; No. 1 a carrier mounting shelf; a first position changing mechanism that changes the position of the plurality of substrates between a horizontal position and a vertical position; No. 1a substrate handling mechanism that transports the plurality of substrates between the carrier placed on a carrier mounting shelf and the first position conversion mechanism; a processing tank that stores a chemical solution; a lifter that can immerse the plurality of substrates in the chemical solution in the processing tank while holding the plurality of substrates in a vertical position; and a first batch transfer robot that transports the plurality of substrates while holding the plurality of substrates in a vertical position, the method comprising: a first substrate transport step of causing the substrate handling mechanism to transport the plurality of substrates in a horizontal position received from the carrier placed on the first carrier mounting shelf to the first position conversion mechanism; a vertical position conversion step of converting the plurality of substrates from the horizontal position to a vertical position by the first position conversion mechanism; and a second substrate processing step of causing the first batch transfer robot to transport the plurality of substrates converted to the vertical position to the lifter. The method is characterized by comprising: a substrate transport process; a first batch processing process in which the lifter performs a first batch processing by immersing the multiple substrates in a vertical position in the chemical solution in the processing tank; a third substrate transport process in which the first batch transport robot transports the multiple substrates that have undergone the first batch processing to a second position conversion mechanism; an upside-down inversion process in which the second position conversion mechanism rotates the multiple substrates that have undergone the first batch processing around a horizontal axis that is perpendicular to a central axis passing through the center of each substrate, thereby inverting the multiple substrates in a vertical position; a fourth substrate transport process in which the first batch transport robot transports the multiple substrates that have been inverted upside down in a vertical position to the lifter; and a second batch processing process in which the lifter performs a second batch processing by immersing the multiple substrates that have been inverted upside down in a vertical position in the chemical solution in the processing tank. [Effects of the Invention]

[0023] According to the substrate processing system and substrate processing method of the present invention, variations in processing of each substrate can be suppressed. [Brief explanation of the drawings]

[0024] [Figure 1]1 is a plan view showing a schematic configuration of a substrate processing system according to a first embodiment. [Figure 2] 10(a) to 10(c) are side views illustrating the substrate handling mechanism and the first attitude changing mechanism. [Figure 3] 10(a) and 10(b) are plan views of the standby tank, the standby lifter, and the batch transport robot. [Figure 4] FIG. 2 is a longitudinal cross-sectional view of the posture change tank and posture change unit as viewed from the front. [Figure 5] FIG. 1(a) is a front view showing an inversion chuck in an open state supporting multiple substrates, and FIG. 1(b) is a cross-sectional view showing a pair of holding grooves of the inversion chuck in an open state supporting one substrate in a horizontal position. [Figure 6] 10 is a flowchart illustrating an operation of the substrate processing system. [Figure 7] 10 is a flowchart for explaining the first half of the batch process (chemical liquid process and cleaning process). [Figure 8] 10 is a flowchart illustrating the latter half of the batch processing operation. [Figure 9] 10(a) to 10(c) are side views illustrating the operation of the second attitude changing mechanism. [Figure 10] 10(a) to 10(c) are side views illustrating the operation of the second attitude changing mechanism. [Figure 11] 10(a) to 10(c) are side views illustrating the operation of the second attitude changing mechanism. [Figure 12] 10(a) to 10(c) are side views illustrating the operation of the second attitude changing mechanism. [Figure 13] 10(a) to 10(c) are side views illustrating the operation of the second attitude changing mechanism. [Figure 14] (a) is a side view illustrating the operation of changing the horizontal posture of the first substrate group, and (b) is a side view showing the relay hand of the substrate transport robot accessing the inversion chuck to remove one substrate. [Figure 15]FIG. 10 is a side view for explaining the operation of changing the horizontal attitude of the second substrate group. [Figure 16] 10A and 10B are diagrams for explaining the effects of the substrate processing system; [Figure 17] 10 is a flowchart showing a detailed operation of turning 25 substrates upside down by the inversion chuck according to the second embodiment. [Figure 18] (a) is a longitudinal cross-sectional view showing the state before the multiple substrates are turned upside down, (b) is a longitudinal cross-sectional view showing the state after the multiple substrates have been converted from a vertical position to a horizontal position, and (c) is a longitudinal cross-sectional view showing the state after the multiple substrates have been converted from a horizontal position to a vertical position (the state after being turned upside down). [Figure 19] 10(a) to 10(g) are front views for explaining the rearrangement operation of the substrates in the inversion chuck according to the second embodiment. [Figure 20] FIG. 10 is a plan view showing a schematic configuration of another substrate processing system according to the third embodiment. [Figure 21] 10 is a flowchart illustrating the operation of the substrate processing system according to the third embodiment. Example 1

[0025] A first embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a plan view showing a schematic configuration of a substrate processing system 1 according to the first embodiment.

[0026] For convenience, in this specification, the direction in which the transfer block 19 (described later) and the processing block 21 (described later) are aligned is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, for example, the direction from the processing block 21 toward the transfer block 19 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." For reference, in each figure, front, back, right, left, top, and bottom are indicated as appropriate.

[0027] <1. Overall structure> Referring to Figure 1, the substrate processing system 1 processes substrates W. The substrate processing system 1 performs, for example, chemical processing, cleaning processing, drying processing, etc. on the substrates W. The substrate processing system 1 performs batch processing in which a plurality of substrates W (for example, 50 or 25 substrates W) are processed at once, and single wafer processing in which a plurality of substrates W are processed one by one. For this reason, the substrate processing system 1 is called a hybrid substrate processing system 1.

[0028] The substrate processing system 1 includes a stocker device 2, a batch processing device 3, a relay device 5, and a single-wafer processing device 7. The batch processing device 3 processes a plurality of substrates W collectively. The single-wafer processing device 7 processes a plurality of substrates W one by one. The single-wafer processing device 7 is disposed to the right of the batch processing device 3 and is disposed apart from the batch processing device 3. The relay device 5 connects the batch processing device 3 and the single-wafer processing device 7.

[0029] <2. Stocker equipment> The stocker device 2 accommodates at least one carrier C. The stocker device 2 is adjacent to the front of the batch processing device 3. The carrier C stores a plurality of substrates W (e.g., 25 substrates) in a horizontal position at predetermined intervals (e.g., 10 mm). Within the carrier C, the substrates W are aligned in the vertical direction Z or in the thickness direction of each substrate W. For example, a FOUP (Front Opening Unify Pod) is used as the carrier C, but is not limited to this.

[0030] The stocker apparatus 2 is equipped with a plurality of (for example, two) load ports 9. The two load ports 9 are arranged in the width direction Y. In this embodiment, the two load ports 9 are used to load and unload carriers C. The stocker apparatus 2 is also equipped with at least one storage shelf 11 and a carrier transport robot 13. The storage shelf 11 is a shelf for storing carriers C. The carriers C are placed on the storage shelf 11.

[0031] The carrier transport robot 13 transports the carrier C between the two load ports 9, the storage shelf 11, and the loading shelf 17 described below. The carrier transport robot 13 is equipped with a gripping unit 15 that grips a protrusion provided on the upper surface of the carrier C, for example. The carrier transport robot 13 can move the gripping unit 15 in the horizontal direction (the front-rear direction X and the width direction Y) and the vertical direction Z. The carrier transport robot 13 is driven by one or more electric motors. Note that the carrier transport robot 13 may also be a movable support unit that supports the underside of the carrier C.

[0032] <3. Batch processing equipment> The batch processing apparatus 3 includes a loading shelf 17, a transfer block 19, a processing block 21, and a batch transport area R1. The loading shelf 17 is adjacent to the front of the transfer block 19. The processing block 21 is disposed behind the transfer block 19, with a posture change area R2 (described later) interposed therebetween. The batch transport area R1 extends rearward from the transfer block 19. The batch transport area R1 is adjacent to the left of the transfer block 19, the processing block 21, and the posture change area R2.

[0033] <3-1. Transfer block> The transfer block 19 includes a substrate handling mechanism (robot) HTR and a first position conversion mechanism 23. The substrate handling mechanism HTR is provided behind the mounting shelf 17. The substrate handling mechanism HTR transports a plurality of substrates W (e.g., 25 substrates) in a horizontal position between a carrier C placed on the mounting shelf 17 and the first position conversion mechanism 23.

[0034] See Figures 2(a) to 2(c). The substrate handling mechanism HTR has a plurality of hands 25 (for example, 25). Each hand 25 holds one substrate W. For convenience of illustration, in Figures 2(a) to 2(c), the substrate handling mechanism HTR is shown to have three hands 25. Furthermore, a pair of horizontal holding units 31B and a pair of vertical holding units 31C, which will be described later, are each shown to hold three substrates W. Furthermore, a pusher 33A, which will be described later, is shown to support six substrates W.

[0035] The substrate handling mechanism HTR further includes a hand support section 26, an advancing / retreating section 27, and an elevation / rotation section 29. The hand support section 26 supports a plurality of hands 25. The advancing / retreating section 27 moves the plurality of hands 25 forward and backward via the hand support section 26. The elevation / rotation section 29 rotates the advancing / retreating section 27 about a vertical axis AX1 to change the orientation of the hands 25. The elevation / rotation section 29 is fixed to the floor surface. The advancing / retreating section 27 and the elevation / rotation section 29 each include an electric motor. The substrate handling mechanism HTR may also include a movable hand (not shown) for transporting only one substrate W, separate from the hand 25.

[0036] The first position change mechanism 23 includes a position changer 31 and a pusher mechanism 33. The substrate handling mechanism HTR, the position changer 31, and the pusher mechanism 33 are arranged on the left in this order.

[0037] The position conversion unit 31 converts a plurality of substrates W (e.g., 25 substrates W) between a horizontal position and a vertical position. For example, the position conversion unit 31 converts a plurality of substrates W received from the substrate handling mechanism HTR from a horizontal position to a vertical position. As shown in FIG. 2(a), the position conversion unit 31 includes a support base 31A, a pair of horizontal holders 31B, a pair of vertical holders 31C, and a rotation drive unit 31D. The pair of horizontal holders 31B and the pair of vertical holders 31C are provided on the support base 31A. When the substrates W are in a horizontal position, the pair of horizontal holders 31B support the substrates W from below while contacting the lower surface of each substrate W. When the substrates W are in a vertical position, the pair of vertical holders 31C hold the substrates W. The rotation drive unit 31D rotates the support base 31A around a horizontal axis AX2.

[0038] As shown in FIG. 2(c), the pusher mechanism 33 includes a pusher 33A, a lifting and rotating unit 33B, a horizontal moving unit 33C, and a rail 33D. The pusher 33A holds the bottom of each of a plurality of substrates W (e.g., 25 or 50 substrates W) that have been converted to a vertical position by the position conversion unit 31. The lifting and rotating unit 33B raises and lowers the pusher 33A in the vertical direction Z. The lifting and rotating unit 33B also rotates the pusher 33A around a vertical axis AX3. This allows the orientation of the device surface of the substrate W, indicated by the arrow AR1, to be in any direction.

[0039] The horizontal moving unit 33C moves the pusher 33A and the lifting and rotating unit 33B horizontally along the rails 33D. The rails 33D extend in the width direction Y. Each of the rotary drive unit 31D, the lifting and rotating unit 33B, and the horizontal moving unit 33C includes an electric motor.

[0040] Here, the operation of the first position change mechanism 23 will be described. For example, each of the four batch processing tanks BT1 to BT4 in the processing block 21, which will be described later, processes 50 substrates W corresponding to two carriers C at a time. Therefore, the 50 substrates W (W1, W2) are held by the pusher 33A while the position of each of the 50 substrates W is changed 25 at a time. The 25 substrates W1 are referred to as the first substrate group. The 25 substrates W2 are referred to as the second substrate group. The 50 substrates W (W1, W2) are referred to as the processed substrate group. When the substrates W1 and W2 are not particularly distinguished from each other, the substrates W1 and W2 are referred to as substrates W.

[0041] See FIG. 2(a). The attitude conversion unit 31 receives 25 substrates W1 from the substrate handling mechanism HTR. At this time, the 25 substrates W1 are in a horizontal attitude and aligned at full pitch (for example, 10 mm intervals). Note that full pitch is also called normal pitch. The device surface of each substrate W1 faces upward. Note that the device surface of the substrate W is the surface on which electronic circuits are formed, and includes the surface on which electronic circuits are in the process of being formed. The device surface is also called the "front surface" or "main surface." Note that the back surface of the substrate W refers to the surface on which electronic circuits are not formed. The surface opposite the device surface is the back surface.

[0042] See Figure 2(b). The rotation drive unit 31D of the attitude conversion unit 31 rotates the pair of horizontal holding units 31B, etc. by 90 degrees around the horizontal axis AX2 to convert the 25 substrates W1 from a horizontal position to a vertical position. The pusher mechanism 33 then raises the pusher 33A to receive the 25 substrates W1 from the attitude conversion unit 31. The pusher mechanism 33 then rotates the pusher 33A by 180 degrees around the vertical axis AX3. This changes the orientation of the 25 substrates W1 from left to right.

[0043] Thereafter, the posture conversion unit 31 receives 25 substrates W2 from the substrate handling mechanism HTR and converts the 25 substrates W2 from a horizontal posture to a vertical posture. Thereafter, the pusher mechanism 33 raises the pusher 33A holding the 25 substrates W1. As a result, the pusher 33A receives another 25 substrates W2.

[0044] See FIG. 2(c). The pusher 33A holds 50 substrates W (W1, W2). 25 substrates W1 and 25 substrates W2 are arranged alternately. The 50 substrates W are aligned at a half pitch (e.g., 5 mm intervals). The half pitch is half the full pitch. The 50 substrates W are arranged face-to-face. Therefore, the two device surfaces (or two back surfaces) of two adjacent substrates W1, W2 face each other. The pusher mechanism 33 then moves the pusher 33A holding the 50 substrates W along the rail 33D to a substrate transfer position PP below a chuck 37 (described below) of the batch transfer robot WTR1 (described below).

[0045] The position changing part 31 of the first position changing mechanism 23 cannot turn upside down the multiple substrates W in the vertical position. The mounting shelf 17 corresponds to the first carrier mounting shelf of the present invention.

[0046] <3-2. Processing Block> The processing block 21 includes a plurality of (for example, four) batch processing tanks BT1 to BT4 and a batch drying section 35. The four batch processing tanks BT1 to BT4 are arranged side by side in the front-rear direction X along which the batch processing device 3 extends. Each of the four batch processing tanks BT1 to BT4 immerses and processes a plurality of substrates W (for example, 25 or 50 substrates W) at once. Each of the four batch processing tanks BT1 to BT4 stores a processing liquid (for example, a chemical liquid or pure water) in which the plurality of substrates W are immersed.

[0047] The four batch processing tanks BT1 to BT4 are, for example, composed of two chemical processing tanks BT1 and BT3 and two cleaning processing tanks BT2 and BT4. The chemical processing tank BT1 and the cleaning processing tank BT2 form one set, and the chemical processing tank BT3 and the cleaning processing tank BT4 form another set. Note that the combination of chemical processing tanks and cleaning processing tanks is not limited to this example. Furthermore, the number of batch processing tanks is not limited to four, and may be one or more.

[0048] Each of the two chemical treatment tanks BT1 and BT3 performs an etching process using a chemical solution. For example, a phosphoric acid solution is used as the chemical solution. The chemical solution is heated to a preset temperature. A chemical solution jet pipe (not shown) is provided at the inner bottom of each of the chemical treatment tanks BT1 and BT3. Each of the chemical treatment tanks BT1 and BT3 stores the chemical solution supplied from the chemical solution jet pipe. A gas supply pipe (not shown) may also be provided at the inner bottom of each of the chemical treatment tanks BT1 and BT3. The gas supply pipe supplies, for example, inert gas bubbles (e.g., nitrogen gas) into the chemical solution in the chemical treatment tank BT1. For example, when multiple substrates W are immersed in the chemical solution in the chemical treatment tank BT1, at least one of supplying the chemical solution from the chemical solution supply pipe and supplying inert gas bubbles from the gas supply pipe may be performed to circulate the chemical solution.

[0049] Each of the two cleaning processing tanks BT2 and BT4 performs a cleaning process in which chemical solutions adhering to multiple substrates W are washed away with a cleaning liquid (rinse liquid). Pure water such as deionized water (DIW) is used as the cleaning liquid. Each of the cleaning processing tanks BT2 and BT4 stores pure water supplied from a pure water jet pipe (not shown).

[0050] Four lifters LF1 to LF4 are provided for the four batch processing tanks BT1 to BT4, respectively. For example, the lifter LF1 has a plurality of (e.g., 50) holding grooves (not shown) arranged in the width direction Y. The lifter LF1 holds, for example, 50 substrates W in a vertical position aligned at a predetermined half pitch (e.g., 5 mm intervals) in, for example, the 50 holding grooves. Note that the lifter LF1 may have 51 or more holding grooves in order to hold 50 substrates W.

[0051] The lifter LF1 is capable of holding 50 substrates W in a vertical position and immersing the 50 substrates W in the chemical solution in the batch processing tank BT1. The lifter LF1 raises and lowers the substrates W between a processing position inside the batch processing tank BT1 and a transfer position above the batch processing tank BT1. The other three lifters LF2 to LF4 are configured in the same manner as the lifter LF1.

[0052] The batch drying unit 35 dries a plurality of substrates W all at once. The batch drying unit 35 is used, for example, when the single wafer processing apparatus 7 cannot be used. The batch drying unit 35 is provided in front of the four batch processing tanks BT1 to BT4. In other words, the batch drying unit 35 is provided between the transfer block 19 and the four batch processing tanks BT1 to BT4. The batch drying unit 35 includes a lifter LF7.

[0053] <3-3. Batch transport area> The batch transfer region R1 is equipped with a batch transfer robot WTR1. The batch transfer robot WTR1 holds a plurality of substrates W in a vertical position and transfers the plurality of substrates W in a vertical position between a first position conversion mechanism 23 (including a pusher mechanism 33), four lifters LF1 to LF4, a relay device 5 (a second position conversion mechanism 43 described later), and a lifter LF7 of a batch drying section 35.

[0054] The substrate transfer position PP, the four lifters LF1 to LF4, the lifter LF7 of the batch drying section 35, and the standby lifter LF9 (described later) are aligned in a row in the front-rear direction X. Therefore, the batch transport robot WTR1 transports a plurality of substrates W in a vertical position in the front-rear direction X.

[0055] The batch transfer robot WTR1 includes a chuck 37 and a guide rail 39. The chuck 37 includes two chuck members 41 and 42. The two chuck members 41 and 42 each include 50 pairs of holding grooves to hold, for example, 50 substrates W. Therefore, the first chuck member 41 includes 50 holding grooves, and the second chuck member 42 includes 50 holding grooves. Note that the two chuck members 41 and 42 may each include 51 or more pairs of holding grooves to hold, for example, 50 substrates W. The two chuck members 41 and 42 each extend in the width direction Y. The batch transfer robot WTR1 opens and closes the two chuck members 41 and 42. The guide rail 39 extends in the front-rear direction X. The batch transfer robot WTR1 moves the chuck 37 along the guide rail 39. The batch transfer robot WTR1 is driven by an electric motor.

[0056] <4. Relay device (interface device)> An overview of the relay device 5 will be described. The relay device 5 turns upside down multiple substrates W in a vertical position that have been subjected to a first batch process in one of the two chemical liquid treatment tanks BT1, BT3. The relay device 5 also converts multiple substrates W that have been subjected to a second batch process in one of the two chemical liquid treatment tanks BT1, BT3 from a vertical position to a horizontal position. The relay device 5, for example, transports the multiple substrates W that have been converted to a horizontal position to the single wafer processing device 7. In other words, the relay device 5 transports multiple substrates W that have been subjected to a second batch process (chemical liquid treatment and pure water cleaning treatment) from the batch processing device 3 to the single wafer processing device 7.

[0057] The relay device 5 will now be described in detail. As shown in FIG. 1, the relay device 5 includes a position change area R2 and a relay area R3 arranged in the width direction Y. The relay area R3 extends rightward from the position change area R2. In the front-rear direction X, the position change area R2 is arranged between the first position change mechanism 23 of the transfer block 19 and the four batch processing tanks BT1 to BT4 of the processing block 21. In addition, the left side portion of the relay area R3 is arranged between the transfer block 19 and the processing block 21.

[0058] <4-1. Second attitude conversion mechanism> A second position change mechanism 43 is provided in the position change region R2. The second position change mechanism 43 rotates the multiple substrates W around a horizontal axis AX4 that is perpendicular to the central axis CA that passes through the center of each substrate W. In other words, the second position change mechanism 43 rotates the multiple substrates W around the horizontal axis AX4 that extends along the device surface (front surface or main surface) of each of the multiple substrates W. As a result, the second position change mechanism 43 has two functions. The first function is to turn the multiple substrates W in a vertical position upside down. The second function is to convert the multiple substrates W from a vertical position to a horizontal position.

[0059] The second position change mechanism 43 includes a standby tank 45, a standby lifter LF9, a position change tank 47, a position change unit 49, and a second batch transfer robot WTR2. FIGS. 3(a) and 3(b) are plan views of the standby tank 45, the standby lifter LF9, and the batch transfer robot WTR2. In FIGS. 3(a) and 3(b), two chuck members 95 and 96 (described later) of the batch transfer robot WTR2 are shown in cross section. For convenience of illustration, the lifter LF9 holds six substrates W in FIGS. 3(a) and 3(b).

[0060] The standby tank 45 stores an immersion liquid in which a plurality of substrates W are immersed. Pure water (for example, DIW) is used as the immersion liquid. The pure water is supplied from a pure water jet pipe (not shown).

[0061] The standby lifter LF9 receives a plurality of substrates W from the batch transport robot WTR1 and holds the substrates W in a vertical position. The standby lifter LF9 has a plurality of (e.g., three) support members 51 extending in the width direction Y. Each of the support members 51 has a plurality of holding grooves MZ for holding the substrates W. The number of holding grooves MZ is set to be greater than the number of substrates W to be processed collectively in the batch processing tanks BT1 to BT4. In this case, the number of substrates W is the number when there are no missing substrates in the row of substrates W. For example, when 50 substrates W with no missing substrates are to be processed collectively in the batch processing tanks BT1 to BT4, the number of holding grooves MZ is 51 or more.

[0062] Fig. 4 is a longitudinal sectional view of the posture changing tank 47 and the posture changing unit 49 as seen from the front. Fig. 5(a) is a front view showing the inverting chuck 53 in an open state supporting multiple substrates W in a horizontal position. For convenience of illustration, in Fig. 5(a), the inverting chuck 53 supports three substrates W. Fig. 5(b) is a transverse sectional view showing the pair of holding grooves 57, 58 of the inverting chuck 53 in an open state supporting one substrate W in a horizontal position.

[0063] See FIG. 4. The posture change tank 47 stores an immersion liquid in which a plurality of substrates W are immersed. Pure water (e.g., DIW) is used as the immersion liquid. The pure water is supplied from a pure water jet pipe (not shown). The posture change tank 47 may store a different type of immersion liquid from that stored in the standby tank 45.

[0064] The attitude changing unit 49 includes an inverting chuck 53 that holds a plurality of substrates W (e.g., 25 substrates). The attitude changing unit 49 rotates the inverting chuck 53 around a horizontal axis AX4. The inverting chuck 53 includes two chuck members 55, 56. The two chuck members 55, 56 are openable and closable along the horizontal axis AX4. As shown in FIG. 5(a), the two chuck members 55, 56 include a plurality of pairs (e.g., 25 pairs) of holding grooves 57, 58. That is, the first chuck member 55 is provided with a plurality of holding grooves 57 (e.g., 25). The second chuck member 56 is provided with a plurality of holding grooves 58 (e.g., 25). The holding grooves 57, 58 of each pair face each other.

[0065] Each of the holding grooves 57, 58 is formed in a V-shape that narrows toward the back in the thickness direction of the substrate W. Each of the holding grooves 57, 58 is formed in an arc shape in the direction along the device surface of the substrate W. The arc shape is a shape that follows the outer edge of the substrate W.

[0066] The direction DR1 shown in Figure 5(b) is perpendicular to the direction in which the two chuck members 55, 56 open and close, and is a direction along the device surface of one substrate W to be accommodated. The direction DR1 is called the substrate insertion / removal direction. The direction DR1 is the direction in which one substrate W is accommodated in or removed from each pair of holding grooves 57, 58 when the two chuck members 55, 56 are in the open state. Each of the pairs of holding grooves 57, 58 has a first support portion SU1 that stops movement of one substrate W to be accommodated in a predetermined direction in the direction DR1, and a second support portion SU2 that stops movement of one substrate W to be accommodated in the direction opposite to the predetermined direction.

[0067] The attitude changing unit 49 includes a driving mechanism 61 in addition to the inverting chuck 53. The driving mechanism 61 includes rotation units 63A and 63B, opening / closing units 65A and 65B, and lifting units 67A and 67B. The rotation units 63A and 63B rotate the inverting chuck 53 around the horizontal axis AX4. The opening / closing units 65A and 65B open and close the inverting chuck 53 along the horizontal axis AX4. The lifting units 67A and 67B lift the inverting chuck 53 in the vertical direction Z.

[0068] Rotating unit 63A, opening / closing unit 65A, and lifting unit 67A drive first chuck member 55. In contrast, rotating unit 63B, opening / closing unit 65B, and lifting unit 67B drive second chuck member 56. Rotating unit 63A, opening / closing unit 65A, and lifting unit 67A are configured in substantially the same manner as rotating unit 63B, opening / closing unit 65B, and lifting unit 67B. Therefore, rotating unit 63A, opening / closing unit 65A, and lifting unit 67A will be described as representatives.

[0069] The rotating section 63A includes an arm member 69, a rotating shaft 71, a pulley 73, an electric motor 75, a pulley 77, a belt 79, and a case 80.

[0070] The arm member 69 supports the chuck member 55 rotatably around a horizontal axis AX4. The arm member 69 includes a vertical portion 69L extending in the vertical direction Z and a horizontal member 69U extending horizontally (in the front-to-rear direction X) from the upper end of the vertical portion 69L. A pulley 73 is connected to the back surface of the chuck member 55 via a rotating shaft 71. Therefore, the rotating shaft 71 extends in the front-to-rear direction X. The rotating shaft 71 passes through the vertical portion 69L of the arm member 69.

[0071] An electric motor 75 is provided on the upper surface of the horizontal member 69U of the arm member 69. A pulley 77 is connected to the output shaft of the electric motor 75. A belt 79 is hung between the two pulleys 73, 77. When the electric motor 75 rotates the pulley 77 about the horizontal axis AX5, the pulley 73 and the chuck member 55 are rotated about the horizontal axis AX4. The horizontal axis AX5 extends in the front-rear direction X. The case 80 is configured so that when it is immersed in the immersion liquid in the posture change tank 47, the immersion liquid does not seep into the case 80.

[0072] The opening / closing unit 65A includes a guide rail 81, an opening / closing drive unit 83, and a moving piece 85. The guide rail 81 and the opening / closing drive unit 83 are provided on the upper surface of a lifting member 87, which will be described later. The guide rail 81 extends in the front-to-rear direction X, which is the direction in which the two chuck members 55, 56 open and close. The horizontal member 69U of the arm member 69 is connected to the lifting member 87 via the guide rail 81, and is movable in the front-to-rear direction X along the guide rail 81.

[0073] The opening / closing drive unit 83 includes, for example, an air cylinder, but may also include an electric motor. The opening / closing drive unit 83 moves the moving piece 85 in the front-to-rear direction X. The moving piece 85 is fixed to the horizontal member 69U. As a result, when the opening / closing drive unit 83 pushes out the moving piece 85, the chuck member 55 is pushed out toward the substrate W via the arm member 69. Furthermore, when the opening / closing drive unit 83 pulls the moving piece 85, the chuck member 55 moves away from the substrate W via the arm member 69.

[0074] The lifting unit 67A includes a lifting member 87 and a lifting drive unit 89. The lifting drive unit 89 raises and lowers the lifting member 87 in the vertical direction Z. The lifting drive unit 89 includes, for example, an electric motor, a screw shaft, a guide rail, and a slider (none of which are shown). The lifting drive unit 89 may include an air cylinder instead of an electric motor or the like.

[0075] See Figures 3(a) and 3(b). The second batch transport robot WTR2 transports a plurality of substrates W (e.g., 25) between the standby lifter LF9 and the inversion chuck 53 of the posture conversion unit 49. For example, the standby lifter LF9 holds 50 substrates W (W1, W2) in which 25 substrates W1 and 25 substrates W2 are alternately arranged. The second batch transport robot WTR2 can selectively extract either the 25 substrates W1 or the 25 substrates W2 from the 50 substrates W, for example.

[0076] The second batch transfer robot WTR2 includes an extraction chuck 91 and a drive mechanism 93. The extraction chuck 91 is movable in the width direction Y and can be opened and closed. The extraction chuck 91 includes a pair of chuck members 95, 96. The pair of chuck members 95, 96 includes multiple pairs (e.g., 25 pairs) of holding grooves 97, 98 and multiple pairs (e.g., 26 pairs) of passing grooves 101, 102. The 25 pairs of holding grooves 97, 98 and the 26 pairs of passing grooves 101, 102 are arranged alternately.

[0077] That is, the first chuck member 95 is provided with 25 alternatingly arranged retaining grooves 97 and 26 alternatingly arranged passing grooves 101. The second chuck member 96 is provided with 25 alternatingly arranged retaining grooves 98 and 26 alternatingly arranged passing grooves 102. Each pair of retaining grooves 97, 98 faces each other, and each pair of passing grooves 101, 102 faces each other.

[0078] The drive mechanism 93 moves the extraction chuck 91 in the width direction Y. The drive mechanism 93 also moves two chuck members 95, 96 in the front-rear direction X to open and close the extraction chuck 91. FIG. 3(a) shows the extraction chuck 91 in a closed state, and FIG. 3(b) shows the extraction chuck 91 in an open state. When the extraction chuck 91 is in the open state, the two chuck members 95, 96 are opened to a diameter greater than the diameter of each substrate W. The drive mechanism 93 includes, for example, at least one of an electric motor and an air cylinder.

[0079] <4-2. Relay transport robot> See Figure 1. A substrate transfer robot 105 and a substrate placement part PS1 are provided in the relay area R3. The substrate transfer robot 105 uses a relay hand 111 to transfer a plurality of substrates W that have been converted to a horizontal position by the second position conversion mechanism 43. The relay area R3 is isolated from the external atmosphere by a housing 109.

[0080] The substrate transfer robot 105 includes a relay hand 111, a forward / backward moving section 113, a rotating section 115, and a horizontal moving section 117. The substrate transfer robot 105 corresponds to the first horizontal substrate transfer robot of the present invention. The relay hand 111 corresponds to the hand of the present invention.

[0081] The relay hand 111 holds one substrate W in a horizontal position and is also movable. The advancing / retreating unit 113 moves the relay hand 111 forward and backward. The rotating unit 115 rotates the relay hand 111 and the advancing / retreating unit 113 around a vertical axis AX6 set in the rotating unit 115. The horizontal moving unit 117 moves the relay hand 111, the advancing / retreating unit 113, and the rotating unit 115 in the width direction Y. The advancing / retreating unit 113, the rotating unit 115, and the horizontal moving unit 117 are each driven by an electric motor. The substrate placing unit PS1 can place one or more substrates W on it.

[0082] <5. Single wafer processing equipment> 1, the single-substrate processing device 7 performs predetermined single-substrate processing on the multiple substrates W received from the relay device 5, one by one, and transports the multiple substrates W that have undergone the single-substrate processing to a carrier C placed on one of the four loading shelves 125.

[0083] The single wafer processing apparatus 7 includes an indexer block 121 and a processing block 123. The indexer block 121 includes a plurality of (for example, four) placement shelves 125 and an indexer robot IR. The four placement shelves 125 are arranged in the width direction Y. The four placement shelves 125 are arranged in front of the indexer robot IR. A carrier C is placed on each placement shelf 125.

[0084] The indexer robot IR includes a hand 127, an articulated arm 129, and a lifting platform 131. The hand 127 holds one substrate W in a horizontal position. The articulated arm 129 is configured as, for example, a SCARA type robot arm. A base end of the articulated arm 129 is attached to the lifting platform 131. A tip end of the articulated arm 129 is connected to the hand 127.

[0085] The indexer robot IR transports substrates W between the four carriers C placed on each of the four placement shelves 125 and a substrate placement part PS2, which will be described later. For example, the indexer robot IR receives a substrate W from the substrate placement part PS2, which will be described later, and transports the substrate W to a carrier C placed on one of the four placement shelves 125.

[0086] The indexer robot corresponds to the second horizontal substrate transport robot of the present invention. The hand 127 corresponds to the second hand of the present invention. The placement shelf 127 corresponds to the second carrier placement shelf of the present invention.

[0087] The processing block 123 is adjacent to and rearward of the indexer block 121. The processing block 123 includes a substrate transport region R4 and, for example, four towers TW1 to TW4. The substrate transport region R4 extends rearward from the indexer block 121. That is, the substrate transport region R4 extends in the front-to-rear direction X. The four towers TW1 to TW4 are provided along the substrate transport region R4. The two towers TW1 and TW2 are disposed opposite the two towers TW3 and TW4 across the substrate transport region R4. Tower TW2 is provided rearward of tower TW1. Tower TW4 is provided rearward of tower TW3.

[0088] Tower TW1 has three single wafer processing chambers SW1 arranged in the vertical direction Z. Tower TW3 has two single wafer processing chambers SW1 arranged in the vertical direction Z. In tower TW3, a substrate mounting part PS1 of relay device 5 is disposed between the two single wafer processing chambers SW1. Two towers TW2, TW4 each have three single wafer processing chambers SW2 arranged in the vertical direction Z. Each of the eleven single wafer processing chambers SW1, SW2 processes one substrate W in a horizontal position.

[0089] The number of single wafer processing chambers SW1 and SW2 is not limited to 11. The number of single wafer processing chambers SW1 is not limited to 5, but may be 1 or more. The number of single wafer processing chambers SW2 is not limited to 6, but may be 1 or more.

[0090] The single wafer processing chamber SW1 includes, for example, a holding / rotating unit 141 and a nozzle 143. The holding / rotating unit 141 includes a spin chuck that holds one substrate W in a horizontal position, and an electric motor that rotates the spin chuck around a vertical axis that passes through the center of the substrate W. The nozzle 143 supplies a processing liquid onto the substrate W held by the holding / rotating unit 141. For example, pure water (e.g., DIW) and IPA (isopropyl alcohol) are used as the processing liquid. In the single wafer processing chamber SW1, for example, the substrate W is subjected to a cleaning process with pure water, and then a liquid film of IPA is formed on the upper surface of the substrate W.

[0091] Each single wafer processing chamber SW2 performs a drying process using, for example, a supercritical fluid. For example, carbon dioxide is used as the fluid. When the fluid is carbon dioxide, the supercritical state is achieved when the critical temperature is 31°C and the critical pressure is 7.38 MPa. By performing a drying process using a supercritical fluid, pattern collapse on the substrate W can be prevented.

[0092] The second single-wafer processing chamber SW2 includes a chamber body (container) 145, a support tray 147, and a lid. The chamber body 145 includes an internal processing space, an opening for inserting a substrate W into the processing space, a supply port, and an exhaust port. The substrate W is accommodated in the processing space while being supported by the support tray 147. The lid closes the opening of the chamber body 145. For example, each single-wafer processing chamber SW2 brings a fluid to a supercritical state and supplies the supercritical fluid to the processing space in the chamber body 145 from the supply port. A single substrate W is subjected to a drying process using the supercritical fluid supplied to the processing space.

[0093] The substrate transfer region R4 is provided with a center robot CR and a substrate platform PS2. The substrate platform PS2 is disposed between the indexer robot IR and the center robot CR. One or more substrates W are placed on the substrate platform PS2.

[0094] The center robot CR includes, for example, two hands 151, an advancing / retreating unit 153, and an elevating / rotating unit 155. Each of the two hands 151 holds one substrate W in a horizontal position. The advancing / retreating unit 153 moves the two hands 151 forward and backward individually. The elevating / rotating unit 155 raises and lowers the two hands 151 and the advancing / retreating unit 153. Furthermore, the elevating / rotating unit 155 rotates the two hands 151 and the advancing / retreating unit 153 around a vertical axis AX7 to change the orientation of the two hands 151.

[0095] The center robot CR transports one substrate W in a horizontal position, for example, between the substrate mounting parts PS1, PS2 and the eleven single-wafer processing chambers SW1, SW2. For example, the center robot CR receives one substrate transported by the substrate transport robot 105 of the relay device 5, and transports the received substrate W to one of the five single-wafer processing chambers SW1.

[0096] <6. Control Unit> The substrate processing system 1 includes a control unit 180 (see FIG. 1) and a storage unit (not shown). The control unit 180 controls each component of the substrate processing system 1. That is, the control unit 180 controls each component of the batch processing device 3, each component of the relay device 5, and each component of the single wafer processing device 7. The control unit 180 includes one or more processors, such as a central processing unit (CPU). The storage unit includes, for example, at least one of a read-only memory (ROM), a random-access memory (RAM), and a hard disk. The storage unit stores computer programs required to control each component of the substrate processing system 1.

[0097] 7. Operation of the Substrate Processing System Next, the operation of the substrate processing system 1 will be described with reference to the flowchart of FIG.

[0098] [Step S01] Removing the substrate from the carrier Referring to Figure 1, an external transfer robot (not shown) transfers two carriers C to the load port 9. The carrier transfer robot 13 of the stocker device 2 transfers the first carrier C from the load port 9 to the loading shelf 17. At this time, 25 unprocessed substrates W1 are stored in the first carrier C. The external transfer robot transfers the carrier C along the transfer path RT shown in Figure 1.

[0099] Thereafter, the substrate handling mechanism HTR of the batch processing device 3 transports the 25 substrates W1 (first substrate group) in horizontal orientation received from the first carrier C placed on the mounting shelf 17 to the orientation conversion unit 31 of the first orientation conversion mechanism 23. That is, the substrate handling mechanism HTR takes out the 25 substrates W1 from the first carrier C placed on the mounting shelf 17, and transports the taken-out 25 substrates W1 to the orientation conversion unit 31 in horizontal orientation.

[0100] Thereafter, the carrier transport robot 13 transports the first carrier C (empty carrier) from which the 25 substrates W1 have been removed, from the loading shelf 17 to the load port 9. Thereafter, the carrier transport robot 13 transports the second carrier C from the load port 9 to the loading shelf 17. At this time, the second carrier C stores 25 unprocessed substrates W2. Thereafter, the substrate handling mechanism HTR transports the 25 horizontally oriented substrates W2 (second substrate group) received from the second carrier C placed on the loading shelf 17 to the posture conversion unit 31 of the first posture conversion mechanism 23.

[0101] Thereafter, the carrier transport robot 13 transports the second carrier C (empty carrier) from which the 25 substrates W2 have been removed, from the loading shelf 17 to the load port 9. The external transport robot transports the two carriers C (two empty carriers) in turn from the load port 9 to any of the four loading shelves 125 of the single-wafer processing apparatus 7.

[0102] [Step S02] Vertical posture transformation The first position conversion mechanism 23 forms 50 substrates W1, W2 (a group of substrates to be processed) in which 25 substrates W1 and 25 substrates W2 are alternately arranged, with all device surfaces of the 25 substrates W1 facing all device surfaces of the 25 substrates W2. Furthermore, the first position conversion mechanism 23 converts the 50 substrates W1, W2 from a horizontal position to a vertical position. The 50 substrates W1, W2 will be referred to as "50 substrates W" hereinafter as appropriate.

[0103] 2(a) to 2(c), the posture conversion unit 31 converts 25 substrates W1 from a horizontal posture to a vertical posture, and converts 25 substrates W2 from a horizontal posture to a vertical posture. Furthermore, the pusher 33A of the pusher mechanism 33 holds 50 substrates W, consisting of 25 substrates W1 and 25 substrates W2 arranged alternately, in a vertical posture. The pusher mechanism 33 then transports the 50 substrates W to the substrate transfer position PP.

[0104] [Step S03] Batch processing In this embodiment, batch processing (chemical liquid processing) performed on 50 substrates W at once is divided into two parts: the first half and the second half. Furthermore, between the first and second batch processing, the 50 substrates W are turned upside down. This reduces processing variations that appear in the upper and lower halves of each substrate W. The upside-down turning operation is performed separately for 25 substrates W1 and 25 substrates W2.

[0105] Next, specific operations of the batch processing in step S03 will be described with reference to Figures 7 and 8. Steps S13 to S17 shown in Figure 7 describe operations performed on the 25 substrates W1 that make up the first substrate group. Steps S18 to S22 shown in Figure 8 describe operations performed on the 25 substrates W2 that make up the second substrate group. Note that, for example, the black triangular mark shown in Figure 9(a) indicates the device surface (front surface or main surface) of the substrate W and its orientation.

[0106] [Step S11] First batch processing The batch transfer robot WTR1 receives 50 substrates W in a vertical position from the pusher mechanism 33 at the substrate transfer position PP, and transfers the 50 substrates W to one of the two lifters LF1, LF3 of the two chemical liquid processing tanks BT1, BT3.

[0107] For example, the batch transfer robot WTR1 transports 50 substrates W (a group of substrates to be processed) in a vertical position to the lifter LF1. The lifter LF1 receives the 50 substrates W at a position above the chemical treatment bath BT1. The lifter LF1 immerses the 50 substrates W in the phosphoric acid solution, which is the chemical solution in the chemical treatment bath BT1. This completes the first batch process (etching process). The first batch processing is performed for half the normal processing time (for example, 2 hours). After the first batch processing, the lifter LF1 lifts the 50 substrates W from the phosphoric acid solution in the chemical processing tank BT1. When the 50 substrates W are transferred to the lifter LF3 of another chemical processing tank BT3, the same processing as in the chemical processing tank BT1 is performed.

[0108] Thereafter, the batch transfer robot WTR1 receives 50 substrates W in a vertical position from, for example, the lifter LF1, and transfers the 50 substrates W to the lifter LF2 in the cleaning processing tank BT2. The lifter LF2 receives the 50 substrates W at a position above the cleaning processing tank BT2. The lifter LF2 then immerses the 50 substrates W in the pure water in the cleaning processing tank BT2. This completes the cleaning processing (batch processing).

[0109] When the batch transfer robot WTR1 receives 50 substrates W in a vertical position from the lifter LF3, the batch transfer robot WTR1 transfers the 50 substrates W to the lifter LF4 of the cleaning processing tank BT4. The lifter LF4 immerses the 50 substrates W in the pure water in the cleaning processing tank BT4.

[0110] [Step S12] Transporting and immersing the group of substrates to the second position change mechanism Thereafter, the batch transfer robot WTR1 receives the 50 substrates W that have been cleaned in one of the two batch processing tanks BT2, BT4. That is, the batch transfer robot WTR1 receives the 50 substrates W that have been cleaned from one of the two lifters LF2, LF4. When transporting the 50 substrates W, for example, the lifter LF2 lifts the 50 substrates W from the pure water in the cleaning processing tank BT2. Thereafter, the batch transfer robot WTR1 transports the 50 substrates W (group of processed substrates) that have been subjected to the first batch processing (etching process, etc.) to the second attitude conversion mechanism 43.

[0111] When the batch transport robot WTR1 moves the 50 substrates W above the standby tank 45 of the second attitude conversion mechanism 43 and the standby lifter LF9, the standby lifter LF9 raises the support member 51 to hold the 50 substrates W held by the batch transport robot WTR1 from below. Thereafter, when the chuck 37 of the batch transport robot WTR1 is opened, the 50 substrates W are handed over to the standby lifter LF9. Thereafter, as shown in FIG. 9(a), the standby lifter LF9 immerses the 50 substrates W in pure water in the standby tank 45 to prevent the substrates W from drying out.

[0112] [Step S13] Extraction of the first group of substrates using the extraction chuck 9(b). Thereafter, the standby lifter LF9 raises the 50 substrates W and lifts them out of the pure water in the standby tank 45. The standby lifter LF9 also raises the 50 substrates W to a position higher than the extraction chuck 91 of the batch transport robot WTR2. At this time, the extraction chuck 91 is in an open state. Therefore, the 50 substrates W rise between the two chuck members 95, 96 of the extraction chuck 91.

[0113] Thereafter, the batch transport robot WTR2 moves the extraction chuck 91 to a preset position in the arrangement direction (width direction Y) of the 50 substrates W in order to extract 25 substrates W1 (first substrate group or odd-numbered substrate group). Thereafter, the batch transport robot WTR2 brings the two chuck members 95, 96 closer to each other to close the extraction chuck 91. In addition, the inversion chuck 53 of the posture conversion unit 49 is raised to the upper position H1.

[0114] 9(c). Thereafter, the standby lifter LF9 lowers the support member 51. As a result, the extraction chuck 91 of the batch transport robot WTR2 extracts 25 substrates W1 from the 50 substrates W (W1, W2). Specifically, the 25 pairs of holding grooves 97, 98 of the extraction chuck 91 hold the 25 substrates W1. Furthermore, the 26 pairs of passing grooves 101, 102 of the extraction chuck 91 allow the 25 substrates W2 to pass through. Therefore, the 25 substrates W1 are held by the extraction chuck 91, and the 25 substrates W2 are left on the standby lifter LF9. Thereafter, the standby lifter LF9 immerses the 25 substrates W2 in pure water in the standby tank 45 to prevent the substrates W2 from drying out.

[0115] [Step S14] Transfer of first substrate group to inversion chuck Thereafter, the batch transfer robot WTR2 advances the 25 substrates W1 held by the extraction chucks 91 to a preset transfer position below the inversion chuck 53 (or above the posture changing tank 47).

[0116] See Figure 10(a). Thereafter, the lifting units 67A and 67B (Figure 4) of the attitude changing unit 49 lower the inverting chuck 53 to the transfer height position H2 while the 25 substrates W1 are accommodated in the 25 pairs of holding grooves 57 and 58, respectively. Thereafter, the opening / closing units 65A and 65B (Figure 4) of the attitude changing unit 49 bring the two chuck members 55 and 56 of the inverting chuck 53 closer to each other, thereby closing the inverting chuck 53. As a result, the inverting chuck 53 holds the 25 substrates W1.

[0117] 10(b), the batch transport robot WTR2 then moves the two chuck members 95, 96 away from each other to open the extraction chuck 91. The batch transport robot WTR2 then moves the extraction chuck 91 back in the width direction Y to a position above the standby tank 45.

[0118] [Step S15] Turn the first group of substrates upside down using the inversion chuck Thereafter, the orientation conversion unit 49 rotates the 25 substrates W1 that have undergone the first batch processing around the horizontal axis AX4. This turns the 25 substrates W1 that are in a vertical orientation upside down. Specifically, by rotating the two electric motors 75 of the rotation units 63A and 63B shown in FIG. 4, the two chuck members 55 and 56 of the inversion chuck 53 are rotated 180 degrees around the horizontal axis AX4. This causes the 25 substrates W1 held by the inversion chuck 53 to rotate 180 degrees. The upside-down turning operation may be performed while the 25 substrates W are immersed in pure water in the orientation conversion tank 47. Furthermore, the orientation conversion unit 49 may immerse the 25 substrates W1 held by the chucks 53 in pure water in the orientation conversion tank 47 at least one of before and after the upside-down turning operation to prevent the substrates W1 from drying out.

[0119] [Step S16] Transferring the first group of substrates to the extraction chuck 10(c). After the 25 substrates W1 (first substrate group) have been turned upside down, the batch transport robot WTR2 advances the extraction chuck 91 to a predetermined transfer position below the inversion chuck 53. At this time, the extraction chuck 91 is in an open state. Note that the extraction chuck 91 in the open state does not interfere with the 25 substrates W1 held by the inversion chuck 53 even when the extraction chuck 91 moves in the width direction Y.

[0120] Thereafter, the batch transport robot WTR2 closes the extraction chuck 91, thereby holding the 25 substrates W1 from below on the extraction chuck 91. Thereafter, the posture conversion unit 49 moves the two chuck members 55, 56 of the inversion chuck 53 away from each other, thereby opening the inversion chuck 53. As a result, the 25 substrates W1 are held by the extraction chuck 91 alone.

[0121] [Step S17] Transporting the first group of substrates to the standby lifter See FIG. 11(a). Thereafter, the attitude conversion unit 49 raises the inversion chuck 53 to an upper position H1 where it does not interfere with the 25 substrates W1. Thereafter, the batch transport robot WTR2 retracts the 25 substrates W1 that have been inverted from the transfer position to a position above the standby lifter LF9. At this time, the batch transport robot WTR2 shifts the standby lifter LF9 by one pitch from its extraction position (original position) so that the device surface of each substrate W1 faces one substrate W2 of the second substrate group after the 50 substrates W1 and W2 have been inverted. In this case, one pitch corresponds to the spacing (e.g., 10 mm) between the 25 substrates W1.

[0122] For example, before performing the upside-down inversion operation, the standby lifter LF9 holds 25 substrates W1 (first substrate group) in holding grooves MZ numbered 1, 3, 5, . . . , 45, 47, and 49. After performing the upside-down inversion operation, the batch transport robot WTR2 adjusts the positions in the width direction Y of the 25 substrates W1 held by the extraction chuck 91 so that the standby lifter LF9 holds the 25 substrates W1 in holding grooves numbered 3, 5, 7, . . . , 47, 49, and 51. Note that holding grooves MZ numbered 1 and 3 are provided on the base end side of the support member 51, and holding grooves MZ numbered 49 and 51 are provided on the tip end side of the support member 51.

[0123] 11(b). After the 25 substrates W1 have been moved to a preset position above the standby lifter LF9, the standby lifter LF9 raises the support members 51 that hold the 25 substrates W2 (second substrate group). As a result, the standby lifter LF9 holds the 25 substrates W1 from below in addition to the 25 substrates W2. The standby lifter LF9 raises the support members 51 to a position higher than the extraction chuck 91.

[0124] In FIG. 11(b), for convenience of illustration, the standby lifter LF9 holds three substrates W1 and three substrates W2, and is provided with holding grooves MZ numbered 1 to 7. In FIG. 9(b), the standby lifter LF9 held the three substrates W1 in holding grooves MZ numbered 1, 3, and 5. After performing the upside-down inversion operation, as shown in FIG. 11(b), the standby lifter LF9 holds the three substrates W1 in holding grooves MZ numbered 3, 5, and 7. In FIGS. 9(b) and 11(b), the holding grooves MZ numbered 1, 3, 5, and 7 are indicated by the symbols MZ1, MZ3, MZ5, and MZ7.

[0125] [Step S18] Extraction of the second group of substrates using the extraction chuck Next, the operation for the second group of substrates, 25 substrates W2, will be described. Note that descriptions that overlap with steps S13 to S17 will be omitted where appropriate.

[0126] See Figure 11(c). The standby lifter LF9 holds 50 substrates W, including 25 substrates W1 that have been turned upside down. The batch transport robot WTR2 moves the extraction chuck 91 to a preset position in the arrangement direction of the 50 substrates W (width direction Y) to extract 25 substrates W2 (second substrate group or even-numbered substrate group). The extraction chuck 91 is in a closed state.

[0127] 12(a), the standby lifter LF9 then lowers the 50 substrates W. As a result, 25 substrates W2 are held by the extraction chucks 91, and 25 substrates W1 are left on the standby lifter LF9. The standby lifter LF9 then immerses the 25 substrates W1 in pure water in the standby tank 45.

[0128] [Step S19] Transporting the second group of substrates to the inverting chuck Thereafter, the batch transfer robot WTR2 advances the 25 substrates W2 held by the extraction chucks 91 to a transfer position below the inverting chuck 53. Thereafter, the attitude changing unit 49 lowers the inverting chuck 53 to the transfer height position H2. Thereafter, the attitude changing unit 49 closes the inverting chuck 53. As a result, the inverting chuck 53 holds the 25 substrates W2.

[0129] 12(b), the batch transport robot WTR2 then opens the extraction chuck 91. Then, the batch transport robot WTR2 moves the extraction chuck 91 back in the width direction Y to a position above the standby lifter LF9.

[0130] [Step S20] Turn the second group of substrates upside down using the inversion chuck Thereafter, the attitude changing unit 49 rotates the 25 substrates W2 that have undergone the first batch processing around the horizontal axis AX4, thereby turning the 25 substrates W2 that were in the vertical attitude upside down.

[0131] [Step S21] Transporting the second group of substrates to the extraction chuck 12(c), after the 25 substrates W2 (second substrate group) have been turned upside down, the batch transport robot WTR2 advances the extraction chuck 91 to the transfer position below the inversion chuck 53. At this time, the extraction chuck 91 is in the open state.

[0132] Thereafter, the batch transfer robot WTR2 closes the extraction chuck 91, thereby holding the 25 substrates W1 from below on the extraction chuck 91. Thereafter, the posture conversion unit 49 opens the inversion chuck 53. As a result, the 25 substrates W1 are held only by the extraction chuck 91.

[0133] [Step S22] Transporting the second group of substrates to the standby lifter 13(a), the posture conversion unit 49 then raises the inversion chuck 53 to the upper position H1, and the batch transport robot WTR2 then moves the 25 substrates W2 that have been turned upside down back from the delivery position to a position above the standby lifter LF9.

[0134] At this time, the batch transport robot WTR2 adjusts the positions of the 25 substrates W2 in the width direction Y (the direction in which the substrates are arranged) so that they return to the holding grooves MZ where they were held before the upside-down turning operation was performed. For example, before the upside-down turning operation was performed, the standby lifter LF9 held 25 substrates W2 (second substrate group) in holding grooves MZ Nos. 2, 4, 6, . . . , 46, 48, and 50. After the upside-down turning operation is performed, the batch transport robot WTR2 adjusts the positions in the width direction Y of the 25 substrates W2 held by the extraction chuck 91 so that the standby lifter LF9 holds the 25 substrates W2 in holding grooves MZ Nos. 2, 4, 6, . . . , 46, 48, and 50.

[0135] See FIG. 13(b). After adjusting the positions of the 25 substrates W2 in the width direction Y, the standby lifter LF9 raises the support members 51 holding the 25 substrates W1, thereby further holding the 25 substrates W2. The extraction chuck 91 is then opened. This operation turns the 50 substrates W upside down, as shown in FIG. 13(c). The upside-down 25 substrates W1 and the upside-down 25 substrates W2 are transported by the batch transport robot WTR2 to the standby lifter LF9 so that all the device surfaces of the 25 substrates W1 and all the device surfaces of the 25 substrates W2 face each other. The standby lifter LF9 then immerses the 50 substrates W in pure water in the standby tank 45, for example, to prevent the substrates W from drying out.

[0136] [Step S23] Transporting the substrate group to the chemical treatment tank The batch transfer robot WTR1 transfers 50 upside-down substrates W in a vertical position from the standby lifter LF9 to one of the two lifters LF1 and LF3. Specifically, the batch transfer robot WTR1 receives the 50 upside-down substrates W in a vertical position from the standby lifter LF9. At this time, the standby lifter LF9 lifts the 50 substrates W from the pure water in the standby tank 45. The batch transfer robot WTR1 then transfers the 50 upside-down substrates W to one of the two lifters LF1 and LF3. The batch transfer robot WTR1 transfers the 50 substrates W in a vertical position to, for example, the lifter LF1. At this time, the lifter LF1 receives the 50 substrates W above the chemical solution treatment tank BT1.

[0137] [Step S24] Second batch processing The lifter LF1 immerses the 50 substrates W in the phosphoric acid solution, which is the chemical liquid in the chemical liquid treatment tank BT1. This completes the second batch process (etching process). Similar to the first batch process, the second batch process is also performed until half the normal processing time (e.g., 2 hours) has elapsed. After the second batch process, the lifter LF1 lifts the 50 substrates W out of the phosphoric acid solution in the chemical liquid treatment tank BT1.

[0138] Thereafter, the batch transfer robot WTR1 receives 50 substrates W in a vertical position from, for example, the lifter LF1, and transfers the 50 substrates W to the lifter LF2 in the cleaning processing tank BT2. The lifter LF2 receives the 50 substrates W at a position above the cleaning processing tank BT2. The lifter LF2 then immerses the 50 substrates W in the pure water in the cleaning processing tank BT2. This completes the cleaning processing (batch processing).

[0139] Furthermore, when the batch transport robot WTR1 receives 50 substrates W in a vertical position from the lifter LF3, the batch transport robot WTR1 transports the 50 substrates W to the lifter LF4 of the cleaning processing tank BT4. When the 50 substrates W are transported to the lifter LF3, the chemical processing tank BT3 undergoes the same treatment as the chemical processing tank BT1. When the 50 substrates W are transported to the lifter LF4, the cleaning processing tank BT4 undergoes the same treatment as the cleaning processing tank BT2.

[0140] [Step S04] Horizontal posture change Returning to the explanation of the flowchart in Figure 6, the batch transfer robot WTR1 receives 50 substrates W that have undergone the second batch processing (etching processing and cleaning processing) from either the lifter LF2 or LF4. At this time, for example, the lifter LF2 lifts the 50 substrates W from the pure water in the cleaning processing tank BT2. The batch transfer robot WTR1 transports the 50 substrates W that have undergone the second batch processing to the second attitude conversion mechanism 43. The standby lifter LF9 receives the 50 substrates W from the batch transfer robot WTR1 at a position above the standby tank 45, and immerses the 50 substrates W in the pure water in the standby tank 45.

[0141] Thereafter, 25 substrates W1 (first substrate group) are extracted from the 50 substrates W held by the standby lifter LF9, and the extracted 25 substrates W1 are transported to the inverting chuck 53. This operation is performed as shown in steps S13 and S14 in Fig. 7. After the 25 substrates W1 are transported to the inverting chuck 53, the attitude changing unit 49 lowers the inverting chuck 53 holding the 25 substrates W1, thereby immersing the 25 substrates W1 in the pure water in the attitude changing tank 47.

[0142] See Figure 14(a). Thereafter, the attitude conversion unit 49 rotates the inversion chuck 53 about the horizontal axis AX4 to convert the 25 substrates W1 that have undergone the second batch processing from a vertical attitude to a horizontal attitude. At this time, the inversion chuck 53 holding the 25 substrates W1 is rotated so that the device surface of each substrate W1 faces upward. For example, in Figure 14(a), the inversion chuck 53 is rotated 90 degrees clockwise around the horizontal axis AX4.

[0143] 14(b). When transporting the substrate W1 to the single wafer processing apparatus 7, the attitude changing unit 49 raises the inverting chuck 53, so that the highest substrate W1 held in a horizontal position by the inverting chuck 53 is lifted up from the pure water in the attitude changing tank 47. The substrate transport robot 105 provided in the relay area R3 moves the relay hand 111 into the inverting chuck 53 and then lifts up the substrate W that has been lifted up from the pure water. When removing the substrate W from the inverting chuck 53, the inverting chuck 53 is opened. The substrate transport robot 105 then transports the removed substrate W1 to the substrate platform PS1 (FIG. 1). Similarly, the substrate transport robot 105 transports the remaining substrates W1 one by one in a horizontal position from the inverting chuck 53 to the substrate platform PS1.

[0144] After all of the substrates W1 (first substrate group) have been transferred from the inverting chuck 53, the batch transfer robot WTR2 receives the 25 substrates W2 left on the standby lifter LF9 and transfers the 25 substrates W2 to the inverting chuck 53. This operation is performed as shown in steps S18 and S19 in Figure 8. After the 25 substrates W2 have been transferred to the inverting chuck 53, the attitude changing unit 49 immerses the 25 substrates W in pure water in the attitude changing tank 47.

[0145] 15, the attitude conversion unit 49 converts the 25 substrates W2 that have undergone the second batch processing from a vertical attitude to a horizontal attitude so that the device surface of each substrate W2 faces upward. For example, in FIG. 15, the inversion chuck 53 is rotated 90 degrees counterclockwise around the horizontal axis AX4.

[0146] Thereafter, the attitude changing part 49 lifts up the 25 horizontally oriented substrates W2 one by one from the pure water in the attitude changing tank 47. In response to this, the substrate transport robot 105 transports the lifted substrates W2 from the inversion chuck 53 to the substrate mounting part PS1.

[0147] [Step S05] First single wafer processing See Figure 1. The center robot CR uses a first hand 151 of its two hands 151 to pick up a single wet substrate W placed on the substrate platform PS1, and transports the substrate W to one of the five single-wafer processing chambers SW1 of the two towers TW1 and TW3. The holding and rotating unit 141 of each single-wafer processing chamber SW1 holds and rotates the substrate W with its device side facing upward in a horizontal position. Furthermore, each single-wafer processing chamber SW1 supplies pure water from a nozzle 143 to the device side (upper surface) of the rotating substrate W, and then supplies IPA from the nozzle 143 to the device side. As a result, the pure water on the substrate W is replaced with IPA.

[0148] [Step S06] Second Single-Wafer Processing The center robot CR uses the first hand 151 to receive one wet substrate W that has been subjected to IPA replacement processing from one of the five single-wafer processing chambers SW1, and transports the substrate W to one of the six single-wafer processing chambers SW2. Each second single-wafer processing chamber SW2 performs a drying process on one substrate W using carbon dioxide in a supercritical state (supercritical fluid). The drying process using the supercritical fluid prevents pattern collapse on the pattern surface (device surface) of the substrate W.

[0149] [Step S07] Transferring substrates to carriers The center robot CR uses the second hand 151 to receive one substrate W that has been dried from one of the six single-wafer processing chambers SW2, and transports the single substrate W to the substrate platform PS2. The 50 substrates W1 and W2 that have been dried are transported in turn to the substrate platform PS2.

[0150] The indexer robot IR uses the hand 127 to transport the substrates W1 of the first substrate group placed on the substrate mounting part PS2 to the first carrier C placed on the mounting shelf 125. Once the 25 dried substrates W1 have been transported to the first carrier C, an external transport robot (not shown) transports the first carrier C from the mounting shelf 125 to its next destination.

[0151] The indexer robot IR uses the hand 127 to transport the substrates W2 of the second substrate group placed on the substrate mounting part PS2 to the second carrier C placed on the mounting shelf 125. Once the 25 dried substrates W2 have been transported to the second carrier C, the external transport robot transports the second carrier C from the mounting shelf 125 to its next destination.

[0152] According to this embodiment, a first batch process and a second batch process are performed in which a plurality of substrates W are immersed in the chemical solution in the chemical solution processing tank BT1. Here, the second position conversion mechanism 43 rotates the plurality of substrates W that have been subjected to the first batch process about the horizontal axis AX4, thereby turning the plurality of vertically oriented substrates W upside down. In other words, between the first batch process and the second batch process, an operation is performed in which the plurality of vertically oriented substrates W are turned upside down. This makes it possible to suppress processing variations that occur between the upper and lower halves of each substrate W.

[0153] Furthermore, for example, if the second attitude changing mechanism 43 does not turn the substrate W upside down, the following operation is conceivable. That is, the substrate W that has undergone the first batch processing is dried, and then the substrate W is returned to the carrier C. The substrate W is turned upside down by another device in the substrate processing system 1. Then, the second batch processing is performed on the upside-down substrate W in the substrate processing system 1. In this case, the substrate W is dried in preparation for turning it upside down in the other device. Therefore, there is a possibility that the pattern on the substrate W will collapse due to drying. Furthermore, there is a possibility that particles will adhere to the substrate W when the substrate W is transported to the other device, and there is also a possibility that an oxide film will adhere to the substrate W. If an oxide film adheres, a process to remove the oxide film may be necessary. However, according to this embodiment, the substrate W is turned upside down within the substrate processing system 1, so these possibilities can be avoided.

[0154] Furthermore, the operation of turning the plurality of substrates W in the vertical position upside down is performed by rotating the inversion chuck 53 that holds the plurality of substrates W around the horizontal axis AX4.

[0155] In the inversion chuck 53, the first support portion SU1 and the second support portion SU1 of each pair of holding grooves 57, 58 stop the movement of one substrate W in both directions of the substrate insertion / removal direction DR1, as shown in Fig. 5(b), so that multiple substrates W in a vertical position can be easily turned upside down.

[0156] The substrate processing system 1 includes a single wafer processing device 7 and a relay device 5 in addition to the batch processing device 3. The multiple substrates W that have undergone the second batch processing are sent to the single wafer processing device 7 via the relay device 5. Here, the second position conversion mechanism 43 not only performs the operation of turning over the multiple vertically positioned substrates W upside down, but also performs the operation of converting the multiple substrates W from the vertical position to a horizontal position. In other words, the second position conversion mechanism 43 performs the upside-down operation in addition to the operation of converting to a horizontal position. Therefore, it is not necessary to separately provide a mechanism for converting to a horizontal position and a mechanism for performing the upside-down operation, and the configuration of the substrate processing system 1 can be made compact.

[0157] The substrate processing system 1 can suppress processing variations that occur in the upper and lower halves of each substrate W in the processing substrate group by inverting a processing substrate group (50 substrates W1, W2) in which 25 substrates W1 and 25 substrates W2 are arranged alternately.

[0158] The processing substrate group (50 substrates W) is formed by alternately arranging 25 substrates W1 and 25 substrates W2, with all device surfaces of the 25 substrates W1 facing each other. See FIG. 16. After the processing substrate group (50 substrates W) is turned upside down, it may be the case that the two device surfaces of the two outermost substrates W do not face the two device surfaces of the other two substrates W in the direction in which the processing substrate group is arranged. In this case, when batch processing is performed, the amount of chemical solution flowing will differ between the substrates W whose device surfaces do not face each other and the two substrates W whose device surfaces face each other.

[0159] For example, as shown by the symbol FW1 in FIG. 16, a certain space is formed between two substrates W1 and W2 whose device surfaces face each other. In contrast, as shown by the symbol FW2, the certain space shown by the symbol FW1 is not formed between the substrate W2 whose device surfaces do not face each other. As a result, for example, the amount of chemical solution flowing into the spaces shown by the symbols FW1 and FW2 differs. This may cause processing variations. Therefore, such processing variations can be prevented by ensuring that the device surfaces of all 25 substrates W1 and all 25 substrates W2 face each other even after the group of substrates to be processed is turned upside down. Example 2

[0160] Next, a second embodiment of the present invention will be described with reference to the drawings. Note that the description overlapping with the first embodiment will be omitted.

[0161] In the first embodiment, the attitude changing unit 49 turns the 25 substrates W1 upside down in one rotation, for example, by rotating the inversion chuck 53 180 degrees around the horizontal axis AX4. In contrast, in the second embodiment, the attitude changing unit 49 changes the 25 substrates W1 from a vertical position to a horizontal position, and then changes the 25 substrates W1 from a horizontal position to a vertical position. This turns the 25 substrates W1 upside down. Here, the rearrangement operation of the 25 substrates W1 in the inversion chuck 53 is performed between the two rotations.

[0162] To perform the sorting operation, the inverting chuck 53 has a number of pairs (for example, 27 pairs) of holding grooves 57, 58, which is greater than the number of substrates W1 (for example, 25 substrates) that the inverting chuck 53 holds.

[0163] Fig. 17 is a flowchart showing in detail the operation of turning 25 substrates W1 (first substrate group) upside down by the inversion chuck 53 according to Example 2. Fig. 18(a) is a vertical cross-sectional view showing the state before the 25 substrates W1 are turned upside down. Fig. 18(b) is a vertical cross-sectional view showing the state after the 25 substrates W1 have been converted from a vertical position to a horizontal position. Fig. 18(c) is a vertical cross-sectional view showing the state after the 25 substrates W1 have been converted from a horizontal position to a vertical position (state after turning upside down).

[0164] 7 and 8, an upside-down turnover operation is performed on 25 substrates W1, and an upside-down turnover operation is performed on 25 substrates W2. The upside-down turnover operation on 25 substrates W1 is performed in substantially the same manner as the upside-down turnover operation on 25 substrates W2. Therefore, the upside-down turnover operation on 25 substrates W1 will be described as a representative example. Step S15 shown in FIG. 7 includes three steps S15A, S15B, and S15C.

[0165] The batch transfer robot WTR2 transfers the 25 substrates W1 extracted by the extraction chuck 91 in a vertical position to the position changing unit 49. The position changing unit 49 receives the 25 substrates W1 in a vertical position from the batch transfer robot WTR2 using the inverting chuck 53. When the inverting chuck 53 is in a closed state, the inverting chuck 53 holds the 25 substrates W1.

[0166] [Step S15A] Horizontal posture change Thereafter, the attitude changing unit 49 lowers the inverting chuck 53 to immerse the 25 substrates W1 in the pure water in the attitude changing tank 47. Thereafter, while holding the 25 substrates W1 on the inverting chuck 53, the attitude changing unit 49 rotates the inverting chuck 53 about the horizontal axis AX4, thereby changing the attitude of the 25 substrates W1 that have undergone the first batch processing from a vertical attitude to a horizontal attitude. At this time, the 25 substrates W1 are changed to a horizontal attitude so that the device surface of each substrate W1 faces upward. As shown in FIGS. 18(a) and 18(b), the inverting chuck 53 is rotated 90 degrees counterclockwise, but may also be rotated 270 degrees clockwise.

[0167] [Step S15B] Rearrangement of substrates in the inverted chuck 19(a) to 19(g) are front views illustrating the rearrangement of substrates W in the inverting chuck 53. For convenience of illustration, in FIGS. 19(a) to 19(g), it is assumed that seven substrates W1 are accommodated in the inverting chuck 53. Furthermore, in order to distinguish between the seven substrates W1, the seven substrates W1 are designated by the reference symbols W1-1, W1-2, W1-3, W1-4, W1-5, W1-6, and W1-7. Furthermore, in FIGS. 19(a) to 19(g), the inverting chuck 53 has, for example, nine pairs of holding grooves 57, 58, which is more than the seven substrates W1. In order to distinguish between the nine pairs of holding grooves 57, 58, the positions of the nine pairs of holding grooves 57, 58 are designated by the reference symbols SL1 to SL9.

[0168] 5(a) and 5(b), the attitude conversion unit 49 opens the inverting chuck 53 in order to load and unload the substrate W1 into and from the inverting chuck 53. Thereafter, the substrate transport robot 105 in the relay area R3 performs a rearrangement operation to rearrange the 25 substrates W1, whose attitudes have been converted to horizontal positions by the attitude conversion unit 49, within the inverting chuck 53 so as to exchange the positions of the outer substrate W1 and the inner substrate W1 in the direction in which the 25 substrates W1 are lined up (vertical direction Z).

[0169] This operation will be described in detail. Figure 19(a) shows the state of the substrates W1 before the rearrangement operation. The rearrangement operation is performed in two separate areas, as indicated by the dashed-dotted line LN in Figure 19(a). The dashed-dotted line LN is set in advance at approximately the center of the 25 substrates W1 in the direction in which the 25 substrates W1 are lined up. See Figure 19(b). The substrate transport robot 105 uses the relay hand 111 to move the third substrate W1-3 from position SL4 to position SL1. The substrate transport robot 105 also uses the relay hand 111 to move the fourth substrate W1-4 from position SL5 to position SL9.

[0170] The rearrangement operation is performed by combining the lifting and lowering operation of the inverting chuck 53 by the posture conversion unit 49 and the forward and backward movement of the relay hand 111 by the substrate transport robot 105. When the inverting chuck 53 is lifted and lowered, the inverting chuck 53 may be in a closed state. The substrate transport robot 105 may also be provided with a lifting unit (having an electric motor) that can lift and lower the relay hand 111 and the advancing and retreating unit 113.

[0171] 19(c), the substrate transfer robot 105 then moves the first substrate W1-1 from position SL2 to position SL4, and the substrate transfer robot 105 moves the seventh substrate W1-7 from position SL8 to position SL5.

[0172] See Figure 19(d). Thereafter, the substrate transfer robot 105 moves the third substrate W1-3 from position SL1 to position SL2. This completes the rearrangement of the three substrates W1 above the dashed-dotted line LN. In the arrangement of seven substrates W1 in Figure 19(a), the second substrate W1-2 at position SL3 is not moved. Also, in Figure 19(d), the substrate transfer robot 105 moves the fifth substrate W1-5 from position SL6 to position SL8.

[0173] See Figure 19(e). Thereafter, the substrate transport robot 105 moves the sixth substrate W1-6 from position SL7 to position SL6. See Figure 19(f). Thereafter, the fifth substrate W1-5 is moved from position SL8 to position SL7. See Figure 19(g). Thereafter, the fourth substrate W1-4 is moved from position SL9 to position SL8. This completes the rearrangement operation of the four substrates W1 below the dashed dotted line LN, and also completes the rearrangement operation of the seven substrates W1. The positions of the outer substrate W1 and the inner substrate W1 shown in Figure 19(g) are swapped with respect to the substrate W1 shown in Figure 19(a).

[0174] Note that the three substrates W1-1, W1-2, and W1-3 may be rearranged first, followed by the four substrates W1-4, W1-5, W1-6, and W1-7, or the four substrates W1-4, W1-5, W1-6, and W1-7 may be rearranged first, followed by the three substrates W1-1, W1-2, and W1-3.

[0175] [Step S15C] Vertical posture transformation Thereafter, the attitude changing unit 49 closes the inverting chuck 53. Thereafter, the attitude changing unit 49 further rotates the inverting chuck 53 about the horizontal axis AX4 while holding the 25 substrates W1 on the inverting chuck 53. For example, in FIG. 18(c), the attitude changing unit 49 rotates the inverting chuck 53 counterclockwise by 90 degrees, but the attitude changing unit 49 may also rotate the inverting chuck 53 clockwise by 270 degrees. In this way, the attitude changing unit 49 changes the attitude of the 25 substrates W1 that have been rearranged from the horizontal attitude to the vertical attitude so as to turn upside down the 25 substrates W1 that were in the vertical attitude when the first batch processing was performed.

[0176] That is, the 25 substrates W1 shown in Fig. 18(a) are turned upside down as shown in Fig. 18(c). The 25 substrates W2 of the second substrate group are also rearranged in the same manner as the 25 substrates W1 of the first substrate group.

[0177] 6, the arrangement of the 25 substrates W1 and the 25 substrates W2 remains the same as when the rearrangement operation was performed. Therefore, for example, after the 25 substrates W1 are converted to a horizontal position by the position conversion unit 49, the arrangement becomes the state shown in FIG. 19(g). The substrate transport robot 105 of the relay device 5 uses the relay hand 111 to transport the substrates W1 one by one from the inversion chuck 53 to the substrate placement part PS1 in the order of substrates W1-1, W1-2, W1-3, W1-4, W1-5, W1-6, and W1-7. The same applies to the 25 substrates W2 that have been rearranged.

[0178] According to this embodiment, in addition to the operation of turning the 25 vertically oriented substrates W upside down, a rearrangement operation is also performed. The rearrangement operation is an operation of rearranging the 25 substrates converted to a horizontal orientation within the inversion chuck 53 so as to exchange the positions of the outer substrates W and the inner substrates W in the direction in which the 25 substrates W are lined up. Therefore, it is possible to suppress processing variations that occur between the outer substrates W and the inner substrates W in the direction in which the 25 substrates W are lined up. Example 3

[0179] Next, a third embodiment of the present invention will be described with reference to the drawings. Note that the description overlapping with the first and second embodiments will be omitted.

[0180] In Examples 1 and 2, the 50 substrates W that have undergone the second batch processing (chemical liquid processing and pure water cleaning processing) are subjected to a drying process in the single wafer processing apparatus 7. In Example 3, the 50 substrates W that have undergone the second batch processing may be subjected to a drying process in the batch processing apparatus 3.

[0181] 1, the substrate processing system 1 of this embodiment may include a stocker apparatus 2, a batch processing apparatus 3, a relay apparatus 5, and a single wafer processing apparatus 7. Alternatively, the substrate processing system 1 of this embodiment may include the stocker apparatus 2 and the batch processing apparatus 3 without including the single wafer processing apparatus 7, as shown in FIG. 20. In this case, the batch processing apparatus 3 may include a second attitude changing mechanism 43 and a substrate transport robot 105 in an area R9 between the transfer block 19 and the processing block 21.

[0182] 20, the standby tank 45, the attitude changing tank 47, and the substrate transfer robot 105 are arranged in this order on the right side. The substrate transfer robot 105 does not necessarily have to include the rotation unit 115 and the horizontal movement unit 117 shown in FIG.

[0183] 1 and 20, the batch processing apparatus 3 includes a batch drying section 35 that collectively dries a plurality of (e.g., 50) substrates W. The batch transport robot WTR1 transports the 50 substrates W between the first position changing mechanism 23, the four lifters LF1 to LF4, the second position changing mechanism 43, and the lifter LF7 of the batch drying section 35 while holding the 50 substrates W in a vertical position.

[0184] The batch drying unit 35 will now be described in detail. The batch drying unit 35 includes a processing tank 35A, a chamber 35B that houses the processing tank 35A, and a lifter LF7. The processing tank 35A stores pure water such as DIW sprayed from a spray pipe (not shown). The lifter LF7 moves up and down. The lifter LF7 has a plurality of holding grooves (e.g., 50 or 51 or more) arranged in the width direction Y, and holds a plurality of substrates W (e.g., 50) in a vertical position. A movable lid is provided on the top of the chamber 35B. A solvent nozzle and a water repellent nozzle are provided inside the chamber 35B. The chamber 35B is configured so that the pressure inside can be reduced by a vacuum pump.

[0185] The operation of the batch drying unit 35 will now be described. A plurality of substrates W that have been subjected to a pure water cleaning process in one of the cleaning processing tanks BT2, BT4 are transported by the batch transport robot WTR1 to above the lifter LF7 of the batch drying unit 35. The lifter LF7 rises to receive the plurality of substrates W from the batch transport robot, and then descends to immerse the plurality of substrates W in the pure water in the processing tank 35A. Thereafter, the movable lid is closed, and the pressure inside the chamber 35B is reduced by the vacuum pump. Thereafter, vapor of a solvent, for example, isopropyl alcohol (IPA), is sprayed from the solvent nozzle. This creates an IPA vapor atmosphere inside the chamber 35B.

[0186] Then, in chamber 35B, lifter LF7 lifts multiple substrates W from the pure water in processing bath 35A. This replaces the pure water adhering to each substrate W with IPA. Then, water-repellent agent vapor is sprayed from the water-repellent agent nozzle. This replaces the IPA adhering to each substrate W with the water-repellent agent. The water-repellent agent modifies the surface of the substrate W to make it water-repellent. Then, IPA vapor is sprayed again from the solvent nozzle. This replaces the water-repellent agent adhering to each substrate with IPA. Then, spraying of IPA vapor from the solvent nozzle is stopped. This causes the IPA adhering to each substrate W to volatilize in chamber 35B, which is under reduced pressure, and the substrates W begin to dry. After the drying process, chamber 35B is returned to atmospheric pressure.

[0187] Next, the operation of the substrate processing system 1 of this embodiment will be described with reference to the flowchart of Fig. 21. Steps S01 to S03 shown in Fig. 21 are almost the same as the steps S01 to S03 shown in Fig. 6, and therefore their description will be omitted. In step S01, two carriers C (empty carriers) are placed on two storage shelves 11.

[0188] [Step S31] Drying process (batch process) The batch transfer robot WTR1 receives the 50 substrates W that have undergone the second batch processing (chemical liquid processing and cleaning processing) from either the lifter LF2 or LF4. The batch transfer robot WTR1 then transports the 50 substrates W that have undergone the second batch processing to the batch drying unit 35. The batch drying unit 35 dries the 50 substrates W all at once.

[0189] [Step S32] Horizontal posture change After the drying process by the batch drying unit 35, the top of chamber 35B is opened by the movable lid. Then, the lifter FL7 raises the 50 dried substrates W above chamber 35B. The batch transport robot WTR1 receives the 50 substrates W from the lifter FL7 and transports the 50 substrates W to the substrate transfer position PP. The pusher mechanism 33 of the first attitude conversion mechanism 23 uses the pusher 33A to receive the 50 dried substrates W from the batch transport robot WTR1.

[0190] For example, the attitude changer 31 of the first attitude change mechanism 23 extracts 25 substrates W1 of the first substrate group from the 50 substrates W held by the pusher 33A. As shown in FIG. 13(c), the 25 substrates W1 are facing left. Therefore, the attitude changer 31 changes the 25 substrates W1 from a vertical attitude to a horizontal attitude without rotating the 25 substrates W1 by 180 degrees around the vertical axis AX3. As a result, the device surfaces of the 25 substrates W1 changed to a horizontal attitude face upward. The substrate handling mechanism HTR receives the 25 substrates W1 from the attitude changer 31.

[0191] The attitude conversion unit 31 then receives from the pusher 33A the 25 substrates W2 of the second substrate group held by the pusher 33A. As shown in FIG. 13(c), the 25 substrates W2 face rightward. Therefore, the attitude conversion unit 31 rotates the 25 substrates W2 by 180 degrees around the vertical axis AX3 so that the device surfaces of the 25 substrates W2 face leftward. The attitude conversion unit 31 then converts the 25 substrates W2 from a vertical attitude to a horizontal attitude.

[0192] [Step S33] Transferring the substrate to the carrier The carrier transport robot 13 transports the first carrier C (empty carrier) from the storage shelf 11 to the loading shelf 17. The substrate handling mechanism HTR transports the received 25 substrates W1 to the first carrier on the loading shelf 17. Thereafter, the carrier transport robot 13 transports the first carrier C storing the 25 substrates W1 that have been dried to the load port 9.

[0193] After the first carrier C storing 25 dried substrates W1 is transported from the loading shelf 17, the carrier transport robot 13 transports the second carrier C (empty carrier) from the storage shelf 11 to the loading shelf 17. The substrate handling mechanism HTR transports the 25 substrates W2, which have been converted to a horizontal position, from the position conversion unit 31 to the second carrier C on the loading shelf 17. Thereafter, the carrier transport robot 13 transports the second carrier C storing 25 dried substrates W2 to the load port 9.

[0194] Thereafter, the external transport mechanism transports the two carriers C in turn from the load port 9 to their next destination.

[0195] According to this embodiment, the substrate processing system 1 can use the batch drying unit 35 to dry, in a lump, the 50 substrates W that have been subjected to the second batch processing, for example, without sending the 50 substrates W to the single wafer processing apparatus 7.

[0196] The drying process in the batch drying unit 35 is performed by supplying IPA vapor and water repellent vapor into the chamber 35, but may be performed by supplying a supercritical fluid into the chamber.

[0197] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0198] (1) In the above-described first and second embodiments, the batch drying section 35 is provided. When the batch drying section 35 is not used, the batch drying section 35 does not need to be provided.

[0199] (2) In the above-described embodiments and modification (1), the center robot CR transports the substrate W to the indexer robot IR via the substrate platform PS2. However, the center robot CR may transport the substrate W directly to the indexer robot IR without via the substrate platform PS2. The center robot CR may also receive the substrate W directly from the substrate transport robot 105 without via the substrate platform PS1.

[0200] (3) In each of the above-described embodiments and modifications, the single wafer processing apparatus 7 includes an indexer robot IR and a center robot CR as second horizontal substrate transport robots. The indexer robot IR and the center robot CR share the task of transporting one substrate W between the substrate platform PS1 of the relay apparatus 5, the eleven single wafer processing chambers SW1 and SW2, and the carriers C placed on each of the placement shelves 125. In this regard, one second horizontal substrate transport robot may transport one substrate W between the substrate platform PS1 of the relay apparatus 5, the eleven single wafer processing chambers SW1 and SW2, and the carriers C placed on each of the placement shelves 125.

[0201] In addition, multiple (not limited to two) second horizontal substrate transport robots may share the task of transporting a single substrate W between the substrate placement part PS1 of the relay device 5, the 11 single-wafer processing chambers SW1, SW2, and the carriers C placed on each placement shelf 125.

[0202] (4) In each of the above-described embodiments and modifications, the four batch processing tanks BT1 to BT4 are composed of two chemical processing tanks BT1 and BT3 and two cleaning processing tanks BT2 and BT4. In this regard, each of the four batch processing tanks BT1 to BT4 may be a processing tank that sequentially performs chemical processing and cleaning processing.

[0203] (5) In each of the above-described embodiments and modifications, as shown in FIG. 1, four lifters LF1 to LF4 are provided for each of the four batch processing vessels BT1 to BT4. In this regard, for example, the lifter LF1 may be used for two batch processing vessels BT1 and BT2, and the lifter LF3 may be used for two batch processing vessels BT3 and BT4. In this case, two lifters LF2 and LF4 are not provided. The lifter LF1 may be provided with a forward / backward moving unit including, for example, an electric motor, so that it can move in the forward / backward direction X between the two batch processing vessels BT1 and BT2. Like the lifter LF1, the lifter LF3 is also configured to be able to move in the forward / backward direction X between the two batch processing vessels BT3 and BT4.

[0204] (6) In the above-described embodiments and modifications, the single wafer processing chamber SW2 uses a supercritical fluid to dry the substrate W. In this regard, the single wafer processing chamber SW2 may include a rotation processing unit 141 and a nozzle 143, similar to the single wafer processing chamber SW1. In this case, each of the eleven single wafer processing chambers SW1 and SW2 supplies, for example, pure water and IPA to the substrate W in this order, and then performs a drying process (spin drying) on ​​the substrate W.

[0205] (7) In the above-described embodiments and modifications, each of the chemical liquid processing tanks BT1 and BT3 performs chemical liquid processing on 50 substrates W taken out from two carriers C at once. However, each of the chemical liquid processing tanks BT1 and BT3 may also perform chemical liquid processing on a plurality of substrates W (e.g., 25 substrates) taken out from one carrier C at once.

[0206] (8) In the above-described embodiments and modifications, each chemical processing tank BT1, BT3 collectively chemically processed 50 substrates (a group of substrates to be processed), in which 25 substrates W1 and 25 substrates W2 were alternately arranged. Here, the device surfaces of the 25 substrates W1 were oriented in the opposite direction to the device surfaces of the 25 substrates W2. However, the device surfaces of the 25 substrates W1 may be oriented in the same direction as the device surfaces of the 25 substrates W2.

[0207] (9) In the above-described embodiments and modifications, the attitude changing unit 49 turned over the substrates W upside down and changed their horizontal attitudes 25 at a time out of 50 substrates W. However, the attitude changing unit 49 may turn over the substrates W upside down and changed their horizontal attitudes collectively. [Explanation of symbols]

[0208] 1... Substrate processing system 3...Batch processing equipment 5...Relay device 7... Single wafer processing equipment 17 ... Storage shelf HTR: Substrate handling mechanism 23... First attitude conversion mechanism 35 ... Batch drying section BT1, BT3: Chemical treatment tank (batch treatment tank) LF1,LF3... Lifter WTR1 ... Batch transport robot WTR2... Batch transport robot 43... Second attitude conversion mechanism LF9 ... Standby lifter 53 ... Reversing chuck 55, 56 ... Chuck members 57,58 … Retaining groove 105 ... Substrate transport robot 111 ... relay hand 125 ... Storage shelf IR... Indexer robot 127 … Hand SW1, SW2 ... Single wafer processing chamber CR...Center robot 151 … Hand 180 ... Control section AX4…Horizontal axis C...Career DR1 … Direction SU1 … 1st support part SU2…Second support part

Claims

1. A substrate processing system for processing a substrate, A batch processing device for processing a plurality of substrates at once is included, The batch processing device comprises: a first carrier mounting shelf on which a carrier for storing the plurality of substrates in a horizontal position is mounted; a first position change mechanism that changes the position of the plurality of substrates between a horizontal position and a vertical position; a substrate handling mechanism that transports the plurality of substrates between the carrier placed on the first carrier shelf and the first attitude conversion mechanism; a treatment tank for storing a chemical solution; a lifter that can immerse the plurality of substrates in the chemical solution in the processing tank while holding the plurality of substrates in a vertical position; a second attitude change mechanism that rotates the plurality of substrates around a horizontal axis that is perpendicular to a central axis that passes through the center of each substrate; a first batch transfer robot that transfers the plurality of substrates between the first position change mechanism, the lifter, and the second position change mechanism while holding the plurality of substrates in a vertical position; a control unit, The control unit (1) controlling the substrate handling mechanism to transport the plurality of substrates in horizontal orientation received from a carrier placed on the first carrier mounting shelf to the first orientation conversion mechanism; (2) controlling the first attitude conversion mechanism to convert the plurality of substrates from a horizontal attitude to a vertical attitude; (3) controlling the first batch transport robot to transport the plurality of substrates, which have been converted into a vertical posture, to the lifter; (4) controlling the lifter to perform a first batch process in which the plurality of substrates in a vertical position are immersed in the chemical solution in the process tank; (5) controlling the first batch transport robot to transport the plurality of substrates that have been subjected to the first batch processing to the second attitude conversion mechanism; (6) controlling the second attitude conversion mechanism to rotate the plurality of substrates that have been subjected to the first batch processing around the horizontal axis, thereby turning the plurality of substrates that are in a vertical attitude upside down; (7) controlling the first batch transport robot to transport the plurality of substrates, which are upside down in a vertical position, to the lifter; (8) By controlling the lifter, a second batch process is performed in which the plurality of substrates, which are inverted in a vertical position, are immersed in the chemical solution in the process tank. A substrate processing system comprising:

2. 2. The substrate processing system according to claim 1, a second position change mechanism for changing the position of the substrates; a second position change mechanism for changing the position of the substrates; a second position change mechanism for changing the position of the substrates;

3. 3. The substrate processing system according to claim 2, The inversion chuck includes two chuck members each having a plurality of pairs of holding grooves, The two chuck members are openable and closable along the horizontal axis, A substrate processing system characterized in that each of the multiple pairs of holding grooves is provided with a first support portion that is perpendicular to the direction in which the two chuck members open and close, and that stops movement of the single substrate to be accommodated in a predetermined direction among the substrate insertion and removal directions along the device surface of the single substrate to be accommodated, and a second support portion that stops movement of the single substrate to be accommodated in the direction opposite to the predetermined direction.

4. 3. The substrate processing system according to claim 2, a first horizontal substrate transport robot having a first hand for holding one substrate in a horizontal position and transporting the one substrate; The control unit by controlling the second attitude conversion mechanism, the inversion chuck is rotated around the horizontal axis while holding the plurality of substrates, thereby converting the plurality of substrates that have been subjected to the first batch processing from a vertical attitude to a horizontal attitude; controlling the first horizontal substrate transport robot to perform a rearrangement operation in which the plurality of substrates converted to horizontal postures are rearranged within the inversion chuck so as to exchange positions of an outer substrate and an inner substrate in a direction in which the plurality of substrates are arranged; a second position change mechanism for changing the position of the substrates after the rearrangement operation from a horizontal position to a vertical position by controlling the second position change mechanism to hold the substrates with the inversion chuck and further rotate the inversion chuck around the horizontal axis, thereby inverting the substrates, which were in a vertical position when the first batch processing was performed, upside down.

5. 2. The substrate processing system according to claim 1, In addition to the batch processing device, the system includes a single-wafer processing device that processes the plurality of substrates one by one, and a relay device that transports the plurality of substrates from the batch processing device to the single-wafer processing device, the relay device includes a first horizontal substrate transport robot that has a first hand that holds one substrate in a horizontal position and transports the one substrate; The single wafer processing apparatus includes: a single-wafer processing chamber for performing single-wafer processing on the single substrate in a horizontal position; a second carrier placement shelf on which the carrier is placed; a second horizontal substrate transport robot having a second hand that holds the single substrate in a horizontal position, and that transports the single substrate between the relay device, the single wafer processing chamber, and the carrier placed on the second carrier mounting shelf, The control unit controlling the first batch transport robot to transport the plurality of substrates that have been subjected to the second batch processing to the second attitude conversion mechanism; controlling the second attitude conversion mechanism to convert the plurality of substrates that have been subjected to the second batch processing from a vertical attitude to a horizontal attitude; controlling the first horizontal substrate transport robot to transport the single substrate, which has been converted to a horizontal position, from the second position conversion mechanism to the single substrate processing apparatus; controlling the second horizontal substrate transfer robot to transfer the single substrate transferred by the first horizontal substrate transfer robot to the single wafer processing chamber; controlling the single wafer processing chamber to perform the single wafer processing on the single substrate; A substrate processing system characterized by controlling the second horizontal substrate transport robot to transport the single substrate that has been processed from the single substrate processing chamber to the carrier placed on the second carrier mounting shelf.

6. 2. The substrate processing system according to claim 1, The control unit controlling the substrate handling mechanism to transport the plurality of horizontally oriented substrates received from a first carrier placed on the first carrier mounting shelf to the first position conversion mechanism, and also to transport the plurality of horizontally oriented second substrates received from a second carrier placed on the first carrier mounting shelf to the first position conversion mechanism; By controlling the first attitude conversion mechanism, a group of processing substrates is formed in which the plurality of substrates and the plurality of second substrates are alternately arranged, and the group of processing substrates is converted from a horizontal attitude to a vertical attitude; controlling the first batch transfer robot to transfer the group of substrates to be processed in a vertical position to the lifter; performing the first batch processing by controlling the lifter to immerse the group of substrates to be processed in the chemical solution in the processing tank; controlling the first batch transport robot to transport the group of processed substrates that have undergone the first batch processing to the second attitude conversion mechanism; by controlling the second attitude conversion mechanism, the plurality of substrates among the group of processed substrates on which the first batch processing has been performed are rotated around the horizontal axis, and the plurality of second substrates among the group of processed substrates on which the first batch processing has been performed are rotated around the horizontal axis, thereby inverting the plurality of substrates and the plurality of second substrates that are in a vertical attitude; controlling the first batch transport robot to transport the group of substrates to be processed that are inverted upside down in a vertical position to the lifter; A substrate processing system characterized in that the lifter is controlled to perform a second batch processing in which the group of substrates to be processed, which have been inverted from their vertical position, are immersed in the chemical solution in the processing tank.

7. 7. The substrate processing system according to claim 6, The second attitude conversion mechanism includes: a standby lifter that holds the group of substrates to be processed in a vertical position; an inversion chuck for holding the plurality of substrates; a second batch transfer robot that transfers the group of substrates to be processed between the standby lifter and the inversion chuck, the second position changing mechanism rotates the inversion chuck around the horizontal axis, The control unit By controlling the first attitude conversion mechanism, the plurality of substrates and the plurality of second substrates are alternately arranged, and a processing substrate group is formed in which all device surfaces of the plurality of substrates face all device surfaces of the plurality of second substrates, respectively, and the processing substrate group is converted from a horizontal attitude to a vertical attitude; a second batch transport robot that controls the second batch transport robot to transport the inverted substrates and the inverted second substrates to the waiting lifter so that all device surfaces of the substrates face each other;

8. 2. The substrate processing system according to claim 1, the batch processing apparatus further includes a batch drying unit that collectively dries the plurality of substrates; the first batch transfer robot transfers the plurality of substrates among the first position change mechanism, the lifter, the second position change mechanism, and the batch drying unit while holding the plurality of substrates in a vertical position; The control unit controlling the first batch transport robot to transport the plurality of substrates that have been subjected to the second batch processing to the batch drying section; a substrate processing system for controlling the batch drying unit to simultaneously dry the plurality of substrates that have undergone the second batch processing;

9. A substrate processing system including a batch processing apparatus for processing a plurality of substrates at once, The batch processing device a first carrier mounting shelf on which a carrier for storing a plurality of substrates in a horizontal position is mounted; a first position change mechanism that changes the position of the plurality of substrates between a horizontal position and a vertical position; a substrate handling mechanism that transports the plurality of substrates between the carrier placed on the first carrier shelf and the first attitude conversion mechanism; a treatment tank for storing a chemical solution; a lifter that can immerse the plurality of substrates in the chemical solution in the processing tank while holding the plurality of substrates in a vertical position; a first batch transfer robot that transfers the plurality of substrates while holding the plurality of substrates in a vertical position; A substrate processing method for the substrate processing system, comprising: a first substrate transport step of transporting the plurality of substrates in horizontal orientation received from a carrier placed on the first carrier mounting shelf by the substrate handling mechanism to the first orientation conversion mechanism; a vertical position changing step of changing the position of the plurality of substrates from a horizontal position to a vertical position by the first position changing mechanism; a second substrate transfer step of causing the first batch transfer robot to transfer the plurality of substrates, which have been converted to a vertical position, to the lifter; a first batch processing step of performing a first batch processing by immersing the plurality of substrates in a vertical position in the chemical solution in the processing tank by the lifter; a third substrate transport step of transporting the plurality of substrates that have been subjected to the first batch processing to a second posture conversion mechanism by the first batch transport robot; an upside-down inversion step of rotating the plurality of substrates that have been subjected to the first batch processing by the second attitude conversion mechanism around a horizontal axis that is perpendicular to a central axis that passes through the center of each substrate, thereby inverting the plurality of substrates that are in a vertical attitude upside down; a fourth substrate transfer step of transferring the plurality of substrates, which are upside down in a vertical position, to the lifter by the first batch transfer robot; a second batch processing step of performing a second batch processing by immersing the plurality of substrates, which are inverted in a vertical position, in the chemical solution in the processing tank by the lifter; A substrate processing method comprising:

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