Cleaning equipment

Abstract

To provide a washing device that can prevent foreign matter from adhering to a workpiece after washing.SOLUTION: A washing device that washes a workpiece includes a holding unit that holds a workpiece, a washing unit that washes the workpiece, and a transport unit that transports the workpiece between the holding unit and the washing unit. The holding unit includes a mounting table including a mounting area on which the workpiece before being washed by the washing unit is placed, and a pair of support members that support the workpiece after being washed by the washing unit above the mounting area.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a cleaning device for cleaning a workpiece. [Background technology]

[0002] A wafer on which a plurality of devices are formed is divided and singulated to produce a plurality of device chips, each including a device. Furthermore, a package substrate is obtained by mounting a plurality of device chips on a base substrate and covering the mounted device chips with a resin sealing material (mold resin). A plurality of packaged devices, each including a plurality of packaged device chips, is produced by dividing and singulating the package substrate. The device chips and packaged devices are incorporated into various electronic devices such as mobile phones and personal computers.

[0003] Various types of processing equipment are used to divide workpieces (processed objects) such as wafers, package substrates, etc. For example, the workpieces are processed and divided by cutting equipment that cuts the workpiece with an annular cutting blade, laser processing equipment that performs laser processing on the workpiece by irradiating it with a laser beam, plasma processing equipment that performs plasma etching on the workpiece by supplying plasma gas, etc.

[0004] When a workpiece is machined using a processing device, foreign matter such as particles (dust, dust, etc.) present inside the processing device and scraps (machining scraps) generated during the processing of the workpiece may adhere to the workpiece. Therefore, the processing device is equipped with a cleaning device for cleaning the workpiece. For example, Patent Document 1 discloses a cutting device equipped with a cleaning device (cleaning mechanism) that includes a spinner table that holds and rotates the workpiece, and a nozzle that supplies cleaning water to the workpiece. By cleaning the processed workpiece with the cleaning device, foreign matter adhering to the workpiece is washed away, preventing contamination of the workpiece.

[0005] On the other hand, workpieces may also be machined by processing equipment that is not equipped with a cleaning device. In this case, after the workpieces are machined by the processing equipment, they are cleaned by a cleaning device installed independently of the processing equipment (see Patent Document 2). This type of cleaning equipment includes a mounting table on which the workpieces are placed and a cleaning unit that cleans the workpieces. The workpieces placed on the mounting table are then transported by a transport unit to the cleaning unit and cleaned. The workpieces are then transported by the transport unit back to the mounting table and placed there, and are then manually or automatically collected. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-229382 [Patent Document 2] Japanese Patent Application Laid-Open No. 2009-188296 Summary of the Invention [Problem to be solved by the invention]

[0007] When a workpiece is cleaned in a cleaning device, the workpiece is placed on a table with particles, machining debris, and other foreign matter attached to it. At that time, some of the foreign matter remaining on the workpiece may adhere to the table. In this case, when the workpiece is placed back on the table after cleaning, the foreign matter remaining on the table may adhere to the workpiece, potentially contaminating the cleaned workpiece.

[0008] Furthermore, if the cleaning of the workpieces by the cleaning device is interrupted while the workpieces are placed on the platform and the operator leaves the cleaning device to take over the cleaning work or to perform another task, when the cleaning of the workpieces by the cleaning device is resumed, it may become unclear whether the workpieces placed on the platform have not been cleaned or have been cleaned. As a result, the uncleaned workpieces may be mistakenly recognized as cleaned workpieces and carried out of the cleaning device, or the cleaned workpieces may be mistakenly carried back to the cleaning unit.

[0009] The present invention has been made in view of the above problems, and has as its object to provide a cleaning device that can prevent contamination of workpieces by foreign matter and erroneous transport of workpieces. [Means for solving the problem]

[0010] According to one aspect of the present invention, a cleaning device for cleaning a workpiece includes a holding unit for holding the workpiece, a cleaning unit for cleaning the workpiece, and a transport unit for transporting the workpiece between the holding unit and the cleaning unit, and the holding unit includes a mounting table including a mounting area on which the workpiece is placed before being cleaned by the cleaning unit, and a pair of support members for supporting the workpiece above the mounting area after being cleaned by the cleaning unit. The support member includes a support portion that supports the underside of the workpiece, and the support portion can be positioned at a support position that overlaps the placement area and a retracted position that does not overlap the placement area, and the transport unit includes a contact member that comes into contact with the support portion and moves the support portion to the retracted position. A cleaning device is provided. [Effects of the Invention]

[0012] A cleaning device according to one aspect of the present invention includes a mounting table including a mounting area on which a workpiece before cleaning is placed, and a pair of support members that support the cleaned workpiece above the mounting area. This allows the workpiece before cleaning and the workpiece after cleaning to be stored in different locations, preventing foreign matter remaining in the mounting area on which the workpiece before cleaning is placed from adhering to the cleaned workpiece. Furthermore, it is easy to distinguish whether the workpiece is before cleaning or after cleaning based on the workpiece's placement location, preventing the workpiece from being transported incorrectly. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. [Figure 2] FIG. [Figure 3] FIG. 2 is a perspective view showing a part of the holding unit. [Figure 4] FIG. [Figure 5] FIG. 5(A) is a perspective view showing the support member, and FIG. 5(B) is a side view showing the support member. [Figure 6]FIG. 6(A) is a side view showing the support member with the support section disposed in the support position, and FIG. 6(B) is a side view showing the support member with the support section disposed in the retracted position. [Figure 7] FIG. 2 is a perspective view showing a part of the transport unit. [Figure 8] FIG. [Figure 9] FIG. 9(A) is a perspective view showing the contact member, and FIG. 9(B) is a side view showing the contact member. [Figure 10] 10 is a side view showing the contact member with the contact portion housed in the frame body. FIG. [Figure 11] FIG. 2 is a cross-sectional view showing the cleaning device in a state where a workpiece is placed on a placement area. [Figure 12] Figure 12(A) is a partially cross-sectional side view showing the cleaning device when the transport unit is positioned above the workpiece, Figure 12(B) is a partially cross-sectional side view showing the cleaning device when the contact part is housed in the frame body, and Figure 12(C) is a partially cross-sectional side view showing the cleaning device when multiple suction pads are in contact with the workpiece. [Figure 13] Figure 13(A) is a partially cross-sectional side view showing the cleaning device in a state where the support part is lifted by the contact part, and Figure 13(B) is a partially cross-sectional side view showing the cleaning device in a state where the workpiece is lifted up above a pair of support members. [Figure 14] Figure 14(A) is a partially cross-sectional side view showing the cleaning device with the transport unit positioned above the loading area, and Figure 14(B) is a partially cross-sectional side view showing the cleaning device with the workpiece supported by a pair of support members. DETAILED DESCRIPTION OF THE INVENTION

[0014] An embodiment according to one aspect of the present invention will be described below with reference to the accompanying drawings. First, a configuration example of a cleaning device according to this embodiment will be described. FIG. 1 is a perspective view showing a cleaning device 2 that cleans a workpiece (a workpiece, an object to be cleaned) 11. In FIG. 1, the X-axis direction (first horizontal direction, front-rear direction) and the Y-axis direction (second horizontal direction, left-right direction) are directions perpendicular to each other. Furthermore, the Z-axis direction (vertical direction, up-down direction, height direction) is a direction perpendicular to the X-axis direction and the Y-axis direction.

[0015] The cleaning device 2 includes a holding unit (holding mechanism) 4 that holds the workpiece 11, a cleaning unit (cleaning mechanism) 6 that cleans the workpiece 11, and a transport unit (transport mechanism) 8 that transports the workpiece 11 between the holding unit 4 and the cleaning unit 6.

[0016] For example, the workpiece 11 is processed by various processing devices such as a cutting device, a grinding device, a polishing device, a laser processing device, a plasma processing device, etc., and then transported to the cleaning device 2 and cleaned by the cleaning device 2. In other words, the workpiece 11 is an object to be processed by the processing device and also an object to be cleaned by the cleaning device 2. The workpiece 11 set in the holding unit 4 is transported by the transport unit 8 to the cleaning unit 6 and cleaned by the cleaning unit 6. Then, after cleaning, the workpiece 11 is transported again by the transport unit 8 to the holding unit 4 and then collected manually or automatically.

[0017] 2 is a perspective view showing the workpiece 11. For example, the workpiece 11 includes a disk-shaped wafer 13 made of a semiconductor material such as single crystal silicon. The wafer 13 has a front surface (first surface) 13a and a back surface (second surface) 13b that are generally parallel to each other.

[0018] The wafer 13 is divided into a plurality of rectangular regions by a plurality of streets (planned dividing lines) 15 arranged in a grid pattern so as to intersect with one another. Furthermore, devices 17 such as ICs (Integrated Circuits), LSIs (Large Scale Integration), LEDs (Light Emitting Diodes), MEMS (Micro Electro Mechanical Systems) devices, etc. are formed in each of the plurality of regions divided by the streets 15 on the front surface 13a of the wafer 13.

[0019] By dividing the wafer 13 along the streets 15 and dividing it into individual chips, a plurality of device chips each including a device 17 are manufactured. There are no limitations on the material, shape, structure, size, etc. of the wafer 13. For example, the wafer 13 may be a substrate made of a semiconductor other than silicon (GaAs, InP, GaN, SiC, etc.), glass, ceramics, resin, metal, etc. There are also no limitations on the type, number, shape, structure, size, arrangement, etc. of the devices 17.

[0020] When processing or cleaning the wafer 13, the wafer 13 is supported by an annular frame 19 for ease of handling. The frame 19 is made of a metal such as SUS (stainless steel), and has a circular opening 19a at the center thereof that penetrates the frame 19 in the thickness direction. The diameter of the opening 19a is larger than the diameter of the wafer 13.

[0021] A sheet 21 is fixed to the wafer 13 and the frame 19. For example, the sheet 21 may be a tape including a circular film-like substrate and an adhesive layer (glue layer) provided on the substrate. The substrate is made of a resin such as polyolefin, polyvinyl chloride, or polyethylene terephthalate, and the adhesive layer is made of an epoxy-based, acrylic-based, or rubber-based adhesive. The adhesive layer may be an ultraviolet-curable resin that hardens when exposed to ultraviolet light.

[0022] With the wafer 13 placed inside the opening 19a of the frame 19, the center of the sheet 21 is attached to the back surface 13b of the wafer 13, and the outer periphery of the sheet 21 is attached to the frame 19. As a result, the wafer 13 is supported by the frame 19 via the sheet 21, and a workpiece 11 (wafer unit, frame unit) including the wafer 13, frame 19, and sheet 21 is formed.

[0023] However, the configuration of the workpiece 11 is not limited to the above. For example, instead of the wafer 13, a package substrate such as a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded package) substrate may be supported by the frame 19 via the sheet 21. For example, a package substrate is formed by sealing a plurality of device chips mounted on a base substrate with a resin layer (mold resin). By dividing and singulating the package substrate, a plurality of packaged devices each including a plurality of packaged device chips are manufactured. Furthermore, the wafer 13 and the package substrate do not need to be supported by the frame 19 as long as they are easy to handle. In this case, the wafer 13 and the package substrate themselves correspond to the workpiece 11.

[0024] 1 includes a columnar mounting table 10 that supports a workpiece 11. The top surface of the mounting table 10 is a flat surface that is roughly parallel to the horizontal plane (XY plane), and forms a support surface that supports the workpiece 11.

[0025] The upper surface of the mounting table 10 is provided with a mounting area 10a on which the workpiece 11 is placed before being cleaned by the cleaning unit 6. The mounting area 10a corresponds to a substantially circular area on the upper surface of the mounting table 10 that overlaps with the workpiece 11 set in the holding unit 4. For example, when the workpiece 11 is placed directly on the mounting table 10, the area on the upper surface of the mounting table 10 that comes into contact with the workpiece 11 corresponds to the mounting area 10a. However, for example, the workpiece 11 may be held away from the upper surface of the mounting table 10 by a pair of guide rails (not shown) provided at both horizontal ends of the mounting area 10a.

[0026] A pair of support members (support mechanisms) 12 are provided on the upper surface of the mounting table 10. The pair of support members 12 are arranged to sandwich the mounting area 10a in the horizontal direction (X-axis direction in FIG. 1), and support the workpiece 11 above the mounting area 10a after it has been cleaned by the cleaning unit 6. That is, the holding unit 4 holds the workpiece 11 before cleaning and the workpiece 11 after cleaning in two areas with different height positions (positions in the Z-axis direction). The configuration and function of the support members 12 will be described in detail later (see FIGS. 3 to 6(B)).

[0027] A cleaning unit 6 is provided to the side of the holding unit 4. The cleaning unit 6 includes a spinner table 20 that holds and rotates the workpiece 11. The upper surface of the spinner table 20 is a flat surface that is roughly parallel to the horizontal plane (XY plane) and constitutes a holding surface 20a that holds the workpiece 11. The holding surface 20a is connected to a suction source (not shown) such as an ejector via a flow path (not shown), a valve (not shown), and the like provided inside the spinner table 20. In addition, a plurality of clamps 22 that grip and fix the outer periphery (frame 19) of the workpiece 11 are provided around the periphery of the spinner table 20.

[0028] A rotary drive source 24 such as a motor that rotates the spinner table 20 is connected to the spinner table 20. The rotary drive source 24 has a cylindrical spindle (output shaft) 26 arranged along the Z-axis direction, and the upper end of the spindle 26 is fixed to the center of the underside of the spinner table 20. When the rotary drive source 24 is driven to rotate the spindle 26, the spinner table 20 rotates around a rotation axis that is approximately parallel to the Z-axis direction.

[0029] An elevation unit (elevating mechanism) 28 is connected to the rotary drive source 24. The elevation unit 28 includes a plurality of air cylinders 30 fixed to the rotary drive source 24. A cylindrical support leg 32 that supports the air cylinder 30 is attached to the lower end of each air cylinder 30. When the plurality of air cylinders 30 are operated simultaneously, the spinner table 20, the clamp 22, and the rotary drive source 24 move up and down along the Z-axis direction.

[0030] The cleaning unit 6 also includes a liquid receiving member 34. The liquid receiving member 34 is formed in a hollow cylindrical shape and is disposed so as to surround the spinner table 20 and the clamp 22. Specifically, the liquid receiving member 34 includes an annular outer wall 34a that surrounds the spinner table 20 and the clamp 22, an annular bottom wall 34b that protrudes from the lower end of the outer wall 34a toward the center of the outer wall 34a, and an annular inner wall 34c that protrudes upward from the center-side end of the bottom wall 34b. The inside of the inner wall 34c corresponds to an insertion hole into which the spindle 26 is inserted.

[0031] A cleaning nozzle 36 that supplies a liquid (cleaning liquid) for cleaning the workpiece 11 and a drying nozzle 38 that supplies a gas for drying the workpiece 11 are provided inside the liquid receiving member 34. The cleaning nozzle 36 and the drying nozzle 38 are each connected to a rotation drive source (not shown) such as a motor, and can be positioned at a position where they overlap with the spinner table 20 (supply position) and a position where they do not overlap with the spinner table 20 (retracted position).

[0032] The cleaning nozzle 36 cleans the workpiece 11 by supplying a cleaning liquid such as a liquid such as pure water or a mixed fluid produced by mixing a liquid (such as pure water) with a gas (such as air) to the workpiece 11. The drying nozzle 38 dries the workpiece 11 by blowing a gas such as air onto the workpiece 11.

[0033] A drain port 34d is provided in the bottom wall 34b of the liquid receiving member 34, connecting the inside and outside of the liquid receiving member 34. A drain path 44 composed of a tube, a duct, etc. is connected to the drain port 34d. After the cleaning liquid supplied from the cleaning nozzle 36 is used to clean the workpiece 11, it is stored in the liquid receiving member 34. Then, the cleaning liquid stored in the liquid receiving member 34 is discharged to the outside of the liquid receiving member 34 via the drain port 34d and the drain path 44.

[0034] In addition, an annular cover 42 is provided inside the liquid receiving member 34. The cover 42 surrounds the upper part of the spindle 26 and is arranged so as to overlap with the inner wall 34c of the liquid receiving member 34. When the cover 42 is lowered by the lifting unit 28, the upper end of the inner wall 34c is covered by the cover 42.

[0035] A transport unit 8 is provided above the holding unit 4 and the cleaning unit 6. The transport unit 8 includes a movement mechanism 50. The movement mechanism 50 includes a pair of guide rails 52 arranged along the Y-axis direction. A rectangular parallelepiped moving block 54 is attached to the pair of guide rails 52 so as to be slidable along the guide rails 52.

[0036] A nut portion (not shown) is provided on the back side of the moving block 54. A ball screw 56 is threadedly engaged with this nut portion, and is disposed along the Y-axis direction between the pair of guide rails 52. A pulse motor 58 that rotates the ball screw 56 is connected to the end of the ball screw 56. When the ball screw 56 is rotated by the pulse motor 58, the moving block 54 moves along the guide rails 52 in the Y-axis direction.

[0037] A holding unit (holding mechanism) 60 that holds the workpiece 11 is attached to the moving mechanism 50. The holding unit 60 has a support arm 62 connected to the moving mechanism 50. The base end of the support arm 62 is fixed to the surface side of the moving block 54. An air cylinder equipped with a piston rod 64 is fixed to the tip of the support arm 62, and a rectangular parallelepiped lifting block 66 is fixed to the lower end of the piston rod 64. When the air cylinder is driven, the piston rod 64 and lifting block 66 move up and down along the Z-axis direction.

[0038] A flat support base 68 is fixed to the underside of the lifting block 66. For example, the support base 68 is formed in an H-shape in a plan view and is disposed approximately parallel to the horizontal plane (XY plane). Also, suction pads 70 that suction-hold the outer periphery (frame 19) of the workpiece 11 are attached to each of the four corners of the support base 68. However, there are no restrictions on the arrangement and number of suction pads 70.

[0039] The lower surface of the suction pad 70 constitutes a suction surface that sucks the upper surface side of the workpiece 11. The suction surface of the suction pad 70 is connected to a suction source (not shown) such as an ejector via a flow path (not shown) formed inside the suction pad 70 and a flow path 72 formed of a tube, a flexible pipe, or the like. With the suction surfaces of the multiple suction pads 70 in contact with the upper surface of the workpiece 11 (frame 19), the suction force (negative pressure) of the suction source is applied to the suction surface, whereby the workpiece 11 is sucked and held by the multiple suction pads 70.

[0040] Furthermore, a pair of contact members (contact mechanisms) 74 are provided at both ends in the X-axis direction of the support base 68. When the workpiece 11 is transported from the placement area 10a, the contact members 74 interfere with the support members 12 to prevent contact between the workpiece 11 and the support members 12. The configuration and function of the contact members 74 will be described in detail later (see FIGS. 7 to 10).

[0041] When cleaning the workpiece 11 with the cleaning device 2, the workpiece 11 is first set in the holding unit 4. Specifically, an operator manually places the workpiece 11 in the placement area 10a of the placement table 10. However, the workpiece 11 may also be automatically placed in the placement area 10a by a transport unit (not shown) or the like.

[0042] Next, the moving mechanism 50 moves the holding unit 60 along the Y-axis direction, and the support base 68 is positioned directly above the placement area 10a. Then, the support base 68 is lowered, and the lower surfaces (suction surfaces) of the multiple suction pads 70 come into contact with the upper surface of the outer periphery (frame 19) of the workpiece 11. Thereafter, with the workpiece 11 being suction-held by the multiple suction pads 70, the support base 68 is raised. This lifts the workpiece 11 from the placement area 10a.

[0043] Next, the moving mechanism 50 moves the holding unit 60 along the Y-axis direction, and the support base 68 is positioned directly above the spinner table 20. Then, the support base 68 is lowered to place the workpiece 11 on the holding surface 20a of the spinner table 20, and then the suction holding of the workpiece 11 by the multiple suction pads 70 is released. This causes the workpiece 11 to be supported by the spinner table 20. Note that when the workpiece 11 is being transported, the spinner table 20 is raised by the lifting unit 28, and the holding surface 20a is exposed from the liquid receiving member 34.

[0044] When the suction force (negative pressure) of the suction source is applied to the holding surface 20a while the workpiece 11 is placed on the spinner table 20, the workpiece 11 is held by the spinner table 20. Specifically, the wafer 13 is held by suction on the spinner table 20 via the sheet 21. In addition, the outer periphery (frame 19) of the workpiece 11 is fixed by a plurality of clamps 22.

[0045] Next, the spinner table 20 is lowered by the lifting unit 28. As a result, the workpiece 11 is placed inside the liquid receiving member 34, and the upper part of the inner wall 34c of the liquid receiving member 34 is covered with the cover 42. Then, while rotating the spinner table 20, cleaning liquid is supplied toward the workpiece 11 from the cleaning nozzle 36 positioned at the supply position. As a result, the workpiece 11 is cleaned with the cleaning liquid, and foreign matter such as particles and machining chips adhering to the workpiece 11 is removed.

[0046] During cleaning of the workpiece 11, the outer wall 34a of the liquid receiving member 34 prevents the cleaning liquid from splashing. In addition, the inner wall 34c of the liquid receiving member 34 is covered with the cover 42, which prevents the cleaning liquid from flowing out of the liquid receiving member 34 through the inside of the inner wall 34c. The used cleaning liquid stored in the liquid receiving member 34 is then discharged through the drain port 34d and the drain path 40.

[0047] When the cleaning of the workpiece 11 is completed, a gas such as air is sprayed from the drying nozzle 38 positioned at the supply position toward the workpiece 11 to dry the workpiece 11. Thereafter, the lifting unit 28 raises the spinner table 20, exposing the workpiece 11 from the liquid receiving member 34.

[0048] Next, the workpiece 11 is held by the holding unit 60 and transported above the mounting table 10. At this time, the support base 68 is positioned so that both ends of the workpiece 11 overlap with the pair of support members 12 in the Z-axis direction. Then, the support base 68 is lowered, and the underside of the outer periphery (frame 19) of the workpiece 11 is placed on the pair of support members 12. In this state, when the suction holding of the workpiece 11 by the multiple suction pads 70 is released, the cleaned workpiece 11 is supported by the pair of support members 12. Thereafter, for example, an operator collects the cleaned workpiece 11 and transports it to a predetermined location.

[0049] When the workpiece 11 is cleaned by the cleaning device 2, the workpiece 11 is placed in the placement area 10a with foreign matter such as particles and machining chips adhering to it. At that time, some of the foreign matter remaining on the workpiece 11 may adhere to the placement area 10a. If the cleaned workpiece 11 is then placed again in the placement area 10a, the foreign matter remaining in the placement area 10a may adhere to the workpiece 11, potentially contaminating the cleaned workpiece 11. Furthermore, if the cleaning of the workpiece 11 by the cleaning device 2 is interrupted and the operator leaves the cleaning device 2, when the cleaning of the workpiece 11 by the cleaning device 2 is resumed, it will be unclear whether the workpiece 11 placed in the placement area 10a is before or after cleaning, which could result in erroneous transport of the workpiece 11.

[0050] On the other hand, in the cleaning apparatus 2 according to this embodiment, the workpiece 11 before cleaning is placed on the placement area 10a of the placement table 10, and the cleaned workpiece 11 is supported by a pair of support members 12 at a position away from the placement area 10a. This allows the workpiece 11 before cleaning and the workpiece 11 after cleaning to be placed in different locations, preventing foreign matter remaining in the placement area 10a from adhering to the cleaned workpiece 11. Furthermore, by checking the placement location of the workpiece 11, it is easy to tell whether the workpiece 11 is before cleaning or after cleaning, preventing erroneous transport of the workpiece 11.

[0051] Next, a description will be given of the details of the holding unit 4. Fig. 3 is a perspective view showing a part of the holding unit 4. As described above, the holding unit 4 includes a pair of support members 12 arranged so as to sandwich the placement area 10a in the horizontal direction.

[0052] Each support member 12 includes a support portion 80 that contacts the underside of the workpiece 11 to support the workpiece 11. The support portion 80 is a movable member that can be positioned at a position (support position) that overlaps with the placement area 10a and a position (retracted position) that does not overlap with the placement area 10a. When the pair of support portions 80 are positioned at the support position, the outer periphery (frame 19) of the workpiece 11 can be placed on the pair of support portions 80. On the other hand, when the pair of support portions 80 are positioned at the retracted position, the workpiece 11 placed on the placement area 10a and the pair of support portions 80 do not overlap in the Z-axis direction, and the workpiece 11 placed on the placement area 10a can be lifted without coming into contact with the support portions 80.

[0053] 4 is an exploded perspective view showing the support member 12. The support portion 80 of the support member 12 is, for example, a plate-like member formed in a substantially rectangular shape, and includes a tip end portion 80a and a base end portion 80b corresponding to both ends in the width direction (short side direction). For example, the support portion 80 is arranged so that its length direction (longitudinal direction) is along the Y-axis direction and the tip end portion 80a is positioned on the side of the mounting area 10a (see FIG. 3).

[0054] A pair of notches 80c are provided at both ends on the base end 80b side of the support part 80. A cylindrical through-hole 80d is provided at the base end 80b of the support part 80, penetrating the support part 80 in the length direction (Y-axis direction). Both ends of the through-hole 80d are exposed at the pair of notches 80c.

[0055] The support member 12 also includes a pair of support bases 82 that support both ends of the support section 80. The support base 82 includes a rectangular parallelepiped base 82a and a pillar portion 82b that protrudes upward from the end of the upper surface of the base 82a. The pillar portion 82b of the support base 82 is provided with a cylindrical through-hole 82c that penetrates the pillar portion 82b in the length direction (Y-axis direction). Both ends of the through-hole 82c are exposed on both side surfaces of the support base 82.

[0056] A support pin 84 is provided in an area of ​​the base 82a of the support stand 82 where the column 82b is not provided. The support pin 84 is arranged along the height direction (Z-axis direction) of the support stand 82 so that the tip end (upper end) protrudes upward from the upper surface of the base 82a. The base end (lower end) of the support pin 84 is biased upward by a biasing member (not shown) such as a spring. When an external force is applied to the support pin 84, the support pin 84 moves up and down along the Z-axis direction.

[0057] The support part 80 is placed on the pair of support bases 82 so that the pillar parts 82b of the support base 82 fit into the cutout parts 80c. As a result, the support part 80 is supported by the support pins 84, and the through holes 80d of the support part 80 are connected to the through holes 82c of the support base 82. A cylindrical support shaft 86 is inserted into the through holes 80d and 82c. The support shaft 86 is fixed to the support part 80 by a fixing device (not shown) such as a setscrew, and the support part 80 and the support shaft 86 are integrated together.

[0058] FIG. 5(A) is a perspective view showing the support member 12, and FIG. 5(B) is a side view showing the support member 12. When no external force is applied to the support portion 80, the support portion 80 is maintained in a state supported by the support pin 84. The position of the support portion 80 at this time corresponds to the initial position (reference position). When an external force is applied to the support portion 80, the support shaft 86 fixed to the support portion 80 rotates inside the through-hole 82c. In other words, the support portion 80 is supported by the pair of support bases 82 in a state in which it can rotate around the support shaft 86.

[0059] 6(A) is a side view showing the support member 12 with the support portion 80 disposed at the support position. When a downward external force is applied to the tip portion 80a of the support portion 80, the support portion 80 rotates so that the tip portion 80a moves downward. As a result, the support pin 84 (see FIG. 5(B)) is pressed by the support portion 80 and pushed into the base portion 82a of the support stand 82. Then, the lower surface of the support portion 80 comes into contact with the upper surface of the base portion 82a of the support stand 82, and is supported by the base portion 82a.

[0060] At this time, the upper surface of the support part 80 is disposed approximately parallel to the horizontal plane (XY plane). Furthermore, the tip part 80a of the support part 80 is disposed so as to overlap the end part of the placement area 10a (see FIG. 3) in the Z-axis direction. Then, when the application of the external force to the support part 80 is released, the support part 80 moves from the support position to the initial position (see FIG. 5(B)) due to the pressure from the support pin 84.

[0061] 6(B) is a side view showing the support member 12 with the support portion 80 disposed in the retracted position. When an upward external force is applied to the tip portion 80a of the support portion 80, the support portion 80 rotates so that the tip portion 80a moves upward. As a result, the tip portion 80a of the support portion 80 is positioned so that it does not overlap with the placement area 10a (see FIG. 3) in the Z-axis direction. Then, when the application of the external force to the support portion 80 is released, the support portion 80 moves from the retracted position to the initial position (see FIG. 5(B)) due to its own weight.

[0062] Next, the transport unit 8 will be described in detail. Fig. 7 is a perspective view showing a part of the transport unit 8. Note that some of the components of the transport unit 8 are not shown in Fig. 7. As described above, the transport unit 8 is provided with a pair of contact members 74 that interfere with the support member 12 to prevent contact between the workpiece 11 and the support member 12.

[0063] The pair of contact members 74 are attached to both ends of the support base 68 in the X-axis direction so as to sandwich the support base 68. Each of the contact members 74 has a contact portion 90 that comes into contact with a support portion 80 (see FIG. 3, etc.) of the support member 12 during transport of the workpiece 11, thereby moving the support portion 80 from the initial position to the retracted position. The attachment position of the contact members 74 is adjusted so that the contact portion 90 overlaps with the support portion 80 of the support member 12 in the Z-axis direction when the support base 68 is positioned directly above the placement area 10a (see FIG. 3).

[0064] FIG. 8 is an exploded perspective view showing the contact member 74. The contact portion 90 of the contact member 74 includes a flat lift portion 90a formed in a substantially rectangular shape and a pillar portion 90b protruding upward from the base end of the lift portion 90a. The base end of the lift portion 90a is provided with a cylindrical first through-hole 90c that penetrates the lift portion 90a in the length direction (Y-axis direction). The pillar portion 90b is provided with a cylindrical second through-hole 90d that penetrates the pillar portion 90b in the length direction (Y-axis direction). The first through-hole 90c and the second through-hole 90d are formed spaced apart from each other so as to overlap in the height direction (Z-axis direction) of the pillar portion 90b. Both ends of the first through-hole 90c and the second through-hole 90d are exposed on both side surfaces of the contact portion 90.

[0065] The contact member 74 also includes a frame 92 that supports the contact portion 90. The frame 92 includes a substantially rectangular parallelepiped base portion 92a and a pair of support portions 92b provided at the tip portion of the base portion 92a. The pair of support portions 92b are formed in a columnar shape so as to protrude downward from both ends on the tip side of the base portion 92a, and are arranged so as to be spaced apart from each other in the Y-axis direction.

[0066] A cylindrical first through-hole 92c penetrating the support portion 92b in the width direction (Y-axis direction) is provided at the lower end of the support portion 92b. A second through-hole 92d penetrating the support portion 92b in the width direction (Y-axis direction) is provided near the first through-hole 92c so as to surround the first through-hole 92c. The second through-hole 92d is formed in an arc shape in side view so as to be at a constant distance from the first through-hole 92c. One end (upper end) of the second through-hole 92d overlaps with the first through-hole 92c in the Z-axis direction, and the other end (lower end) of the second through-hole 92d is positioned at approximately the same height as the first through-hole 92c.

[0067] Both ends of the first through hole 92c and the second through hole 92d are exposed on both side surfaces of the support portion 92b. The distance between the first through hole 92c and the second through hole 92d is set to be approximately the same as the distance between the first through hole 90c and the second through hole 90d provided in the contact portion 90.

[0068] A support pin 94 is provided between the pair of support portions 92b. The support pin 94 is arranged along the width direction (X-axis direction) of the base portion 92a so that its tip portion (front end portion) protrudes forward from the front surface of the base portion 92a. The base end portion (rear end portion) of the support pin 94 is biased forward by a biasing member (not shown) such as a spring. When an external force is applied to the support pin 94, the support pin 94 moves along the X-axis direction.

[0069] The contact portion 90 is arranged such that the column portion 90b is fitted between the pair of support portions 92b. This connects the first through hole 90c of the contact portion 90 to the first through hole 92c of the frame body 92, and also connects the second through hole 90d of the contact portion 90 to the second through hole 92d of the frame body 92. A cylindrical first support shaft (first shaft) 96 is inserted into the first through holes 90c, 92c, and a cylindrical second support shaft (second shaft) 98 is inserted into the second through holes 90d, 92d.

[0070] The first support shaft 96 is fixed to the frame body 92 by a fixing device (not shown) such as a setscrew. The second support shaft 98 is fixed to the contact portion 90 by a fixing device (not shown) such as a setscrew. As a result, the frame body 92 and the first support shaft 96 are integrated, and the contact portion 90 and the second support shaft 98 are integrated.

[0071] 9(A) is a perspective view showing the contact member 74, and Fig. 9(B) is a side view showing the contact member 74. When the contact portion 90 is attached to the frame body 92, the weight of the contact portion 90 positions the second support shaft 98 at the upper end of the second through-hole 92d, and the contact portion 90 is supported by the frame body 92 via the first support shaft 96 and the second support shaft 98. At this time, the contact portion 90 is arranged along a horizontal plane (XY plane).

[0072] 10 is a side view showing the contact member 74 with the contact portion 90 housed in the frame body 92. When an upward external force is applied to the contact portion 90, the second support shaft 98 moves from the upper end to the lower end of the second through-hole 92d, and the contact portion 90 rotates around the first support shaft 96 so that its tip moves upward. Then, the support pin 94 (see FIG. 9(A)) is pressed by the contact portion 90 and pushed into the base portion 92a of the frame body 92, and the contact portion 90 comes into contact with and is supported by the front surface of the base portion 92a. As a result, the contact portion 90 is disposed between the pair of support portions 92b and housed in the frame body 92.

[0073] Next, a detailed description will be given of the transport of the workpiece 11 by the transport unit 8. Fig. 11 is a partially cross-sectional side view showing the cleaning device 2 in a state where the workpiece 11 is placed on the placement area 10a.

[0074] When cleaning the workpiece 11 with the cleaning device 2, the workpiece 11 is first placed on the placement area 10a of the placement table 10. For example, an operator manually places the workpiece 11 on the placement area 10a by holding the workpiece 11 in his / her hand and inserting it between the upper surface of the placement table 10 and the pair of supports 80. The workpiece 11 placed on the placement area 10a is positioned so that both ends thereof overlap with the tip ends 80a of the pair of supports 80 in the Z-axis direction.

[0075] Next, the workpiece 11 is held by the transport unit 8. Specifically, first, the transport unit 8 is positioned directly above the workpiece 11 and the placement area 10a. Fig. 12(A) is a partially cross-sectional side view showing the cleaning device 2 in a state where the transport unit 8 is positioned above the workpiece 11.

[0076] The transport unit 8 is arranged so that the suction pads 70 overlap the outer periphery (frame 19) of the workpiece 11 in the Z-axis direction. At this time, no external force is applied to the pair of contact members 74, and the contact portions 90 protrude from the frame body 92. In addition, the contact portions 90 are arranged so as to overlap the tip portions 80a of the support portions 80 provided on the pair of support members 12 in the Z-axis direction.

[0077] Next, the support base 68 descends toward the placement area 10a and approaches the workpiece 11. When the contact portion 90 of the contact member 74 reaches the support portion 80 of the support member 12, the support portion 80 comes into contact with the underside of the contact portion 90. When the support base 68 descends further in this state, the contact portion 90 is lifted and rotated by the support portion 80 and is housed in the frame body 92. FIG. 12(B) is a partial cross-sectional side view showing the cleaning device 2 in a state in which the contact portion 90 is housed in the frame body 92.

[0078] When the contact portion 90 is housed in the frame 92, the support base 68 and the contact member 74 can pass between the pair of support members 12. Then, when the support base 68 further descends, the lower surfaces (suction surfaces) of the multiple suction pads 70 come into contact with the upper surface of the outer periphery (frame 19) of the workpiece 11. In this state, when the suction force (negative pressure) of the suction source is applied to the suction surfaces of the suction pads 70, the workpiece 11 is sucked and held by the multiple suction pads 70. Figure 12(C) is a partial cross-sectional side view showing the cleaning device 2 in a state where the multiple suction pads 70 are in contact with the workpiece 11.

[0079] When the contact member 74 passes between the pair of support members 12, the support portion 80 releases the support of the contact portion 90. Also, the support pin 94 (see FIG. 9(A)) presses the contact portion 90 in a direction away from the frame body 92. As a result, the contact portion 90 switches from being housed in the frame body 92 to being protruding from the frame body 92, and the pair of contact portions 90 are respectively positioned below the tip portions 80a of the pair of support portions 80.

[0080] Next, the support base 68 rises and moves away from the placement area 10a. As a result, the workpiece 11 is lifted and transported from above the placement area 10a. When the contact portion 90 of the contact member 74 reaches the support portion 80 of the support member 12, the contact portion 90 comes into contact with the underside of the support portion 80 and lifts the tip portion 80a of the support portion 80. FIG. 13(A) is a partial cross-sectional side view showing the cleaning device 2 in a state in which the support portion 80 is lifted by the contact portion 90.

[0081] When the support part 80 is lifted by the contact part 90, the support part 80 rotates so that the tip part 80a moves upward, and is temporarily placed in a position (retracted position) where it does not overlap with the placement area 10a. That is, the pair of contact members 74 function as a moving mechanism that comes into contact with the support part 80 and moves the support part 80 from the initial position to the retracted position. As a result, the pair of support parts 80 are positioned so as not to overlap with the placement area 10a and the workpiece 11 in the Z-axis direction, and contact between the workpiece 11 and the support part 80 is avoided when the workpiece 11 passes between the pair of support members 12.

[0082] Thereafter, the support base 68 rises further, and the workpiece 11 is lifted above the pair of support members 12. Then, the support part 80 rotates by its own weight so that the tip part 80a descends, and returns to its original position. At this time, the support part 80 is received by the support pin 84 (see FIG. 5(B) etc.), and the impact applied to the support part 80 is alleviated. FIG. 13(B) is a partial cross-sectional side view showing the cleaning device 2 in a state in which the workpiece 11 has been lifted above the pair of support members 12.

[0083] Thereafter, the transport unit 8 transports the workpiece 11 to the cleaning unit 6 shown in Fig. 1. Then, after the workpiece 11 is held by the spinner table 20, it is washed with a cleaning liquid supplied from the cleaning nozzle 36 and dried with a gas sprayed from the drying nozzle 38.

[0084] After cleaning and drying, the workpiece 11 is transported again to the holding unit 4 by the transport unit 8. Specifically, first, the transport unit 8 holding the cleaned workpiece 11 is positioned directly above the placement area 10a. Fig. 14(A) is a partial cross-sectional side view showing the cleaning apparatus 2 in a state in which the transport unit 8 is positioned above the placement area 10a.

[0085] The position of the transport unit 8 is adjusted so that the workpiece 11 overlaps the placement area 10a in the Z-axis direction. At this time, the outer periphery (frame 19) of the workpiece 11 is positioned so as to overlap in the Z-axis direction with the tip ends 80a of the pair of support parts 80 positioned at the initial positions.

[0086] Next, the support base 68 descends, and the workpiece 11 approaches the pair of support members 12. Then, when the outer periphery (frame 19) of the workpiece 11 reaches and comes into contact with the support parts 80, the support base 68 descends further, and the support parts 80 are pressed downward by the transport unit 8 and the workpiece 11. As a result, the support parts 80 rotate so that the tip parts 80a move downward, and are positioned at the support position. Note that, when the pair of support parts 80 move to the support position, the support parts 80 reach the upper surface of the base parts 82a (see FIG. 5(B) and other figures) of the support table 82 while being supported by the support pins 84 (see FIG. 5(B) and other figures).

[0087] Thereafter, the suction holding of the workpiece 11 by the plurality of suction pads 70 is released. As a result, the outer periphery of the workpiece 11 is supported by the pair of support members 80. As a result, the workpiece 11 is held above the placement area 10a and spaced apart from the placement area 10a in the Z-axis direction. FIG. 14(B) is a partial cross-sectional side view showing the cleaning device 2 in a state in which the workpiece 11 is supported by the pair of support members 12.

[0088] When the workpiece 11 is placed on the pair of support members 80, the weight of the workpiece 11 keeps the support members 80 in the support position. This keeps the workpiece 11 roughly horizontal. Then, the support base 68 rises, and the suction pad 70 moves away from the workpiece 11. In this way, the cleaned workpiece 11 is supported by the pair of support members 12.

[0089] As described above, the cleaning apparatus 2 according to this embodiment includes the mounting table 10 including the mounting area 10a on which the workpiece 11 before cleaning is placed, and a pair of support members 12 that support the cleaned workpiece 11 above the mounting area 10a. This makes it possible to store the workpiece 11 before cleaning and the workpiece 11 after cleaning in different locations, preventing foreign matter remaining in the mounting area 10a on which the workpiece 11 before cleaning is placed from adhering to the cleaned workpiece 11. Furthermore, it is easy to tell whether the workpiece 11 is before cleaning or after cleaning based on the placement location of the workpiece 11, preventing erroneous transport of the workpiece 11.

[0090] The configuration of the cleaning apparatus 2 can be changed as appropriate as long as the workpiece 11 before cleaning and the workpiece 11 after cleaning can be stored in different locations. For example, the cleaning apparatus 2 may be equipped with two pairs of transport units 8. In this case, one transport unit 8 can transport the workpiece 11 from the placement area 10a to the cleaning unit 6, and the other transport unit 8 can transport the workpiece 11 from the cleaning unit 6 onto the pair of support members 12.

[0091] The cleaning device 2 according to this embodiment can also be mounted on a processing device that processes the workpiece 11. In this case, the workpiece 11 processed by the processing device is cleaned by the cleaning device 2 within the processing device. For example, the cleaning device 2 can be mounted on a cutting device that includes a processing unit (cutting unit) that cuts the workpiece 11, a grinding device that includes a processing unit (grinding unit) that grinds the workpiece 11, a polishing device that includes a processing unit (polishing unit) that polishes the workpiece 11, a laser processing device that includes a processing unit (laser irradiation unit) that irradiates the workpiece 11 with a laser beam, or the like.

[0092] The cutting unit of the cutting device has a spindle, and an annular cutting blade is attached to the tip of the spindle. The cutting unit cuts the workpiece 11 by rotating the cutting blade and cutting into the workpiece 11.

[0093] The grinding unit of the grinding device has a spindle, and an annular grinding wheel with multiple grinding stones is attached to the tip of the spindle. The grinding unit grinds the workpiece 11 by rotating the grinding wheel and bringing the grinding stones into contact with the workpiece 11. The polishing unit of the polishing device has a spindle, and a disk-shaped polishing pad is attached to the tip of the spindle. The polishing unit polishes the workpiece 11 by rotating the polishing pad and bringing it into contact with the workpiece 11.

[0094] The laser irradiation unit of the laser processing device includes a laser oscillator that emits a laser of a predetermined wavelength, and an optical system that guides the laser beam emitted from the laser oscillator to the workpiece 11. By irradiating the workpiece 11 with the laser beam from the laser irradiation unit, laser processing is performed on the workpiece 11.

[0095] Furthermore, the cleaning device 2 can be mounted on a plasma processing device that performs plasma etching on the workpiece 11. The plasma processing device etches the workpiece 11 by supplying an etching gas to the workpiece 11 in a plasma state.

[0096] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the object of the present invention. [Explanation of symbols]

[0097] 11 Workpiece (workpiece, object to be cleaned) 13 wafers 13a Surface (first side) 13b Back side (2nd side) 15th Street (Planned division line) 17 devices 19 frames 19a aperture 21 seats 2. Cleaning equipment 4. Holding unit (holding mechanism) 6 Cleaning unit (cleaning mechanism) 8. Transport unit (transport mechanism) 10. Mounting table 10a Loading area 12 Support member (support mechanism) 20 Spinner Table 20a Holding surface 22 Clamp 24 Rotational drive source 26 Spindle (output shaft) 28 Lifting unit (lifting mechanism) 30 Air Cylinder 32 Support legs 34 Liquid receiving member 34a Exterior wall 34b Bottom wall 34c inner wall 34d Drainage port 36 Cleaning nozzle 38 Drying nozzle 40 Drainage channel 42 Cover 50 Moving mechanism 52 guide rail 54 Moving Blocks 56 Ball screw 58 Pulse motor 60 Retention unit (retention mechanism) 62 Support arm 64 Piston rod 66 Lifting Block 68 Support base 70 suction pads 72 Flow path 74 Contact member (contact mechanism) 80 Support part 80a tip 80b Proximal end 80c cutout 80d through hole 82 Support stand 82a base 82b Column 82c through hole 84 Support pin 86 Support shaft (shaft) 90 Contact part (movable part) 90a lift section 90b Pillar part 90c 1st through hole 90d Second through hole 92 Frame 92a base 92b Support part 92c 1st through hole 92d 2nd through hole 94 Support pin 96 First support shaft (first shaft) 98 Second support shaft (second shaft)

Claims

[Claim 1] A cleaning device for cleaning a workpiece, a holding unit that holds the workpiece; a cleaning unit for cleaning the workpiece; a transport unit that transports the workpiece between the holding unit and the cleaning unit, the holding unit includes a mounting table including a mounting area on which the workpiece is placed before being cleaned by the cleaning unit, and a pair of support members that support the workpiece above the mounting area after being cleaned by the cleaning unit; The support member includes a support portion that supports the lower surface side of the workpiece, the support portion is disposable at a support position overlapping the placement area and a retracted position not overlapping the placement area; The transport unit includes a contact member that comes into contact with the support portion to move the support portion to the retracted position.

Images