TRANSPORT MODULE AND TRANSPORT METHOD

Abstract

To reduce the footprint of a substrate processing system.SOLUTION: A transfer module has a first transfer chamber, a second transfer chamber, and an opening and closing door. The first transfer chamber has a housing section configured to accommodate the objects to be transferred. A container containing a plurality of objects to be transferred is brought into the second transfer chamber, and the opening and closing door is controlled so that the space in the first transfer chamber and the space in the second transfer chamber are connected after the pressure in the second transfer chamber is switched from atmospheric pressure to low pressure. A plurality of objects to be transferred are transferred from the container to the housing section in the first transfer chamber, and from the housing section to the vacuum transfer module. The objects to be transferred out of the vacuum transfer module are transferred into the container without going through the housing section.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] Various aspects and embodiments of the present disclosure relate to transport modules and transport methods. [Background technology]

[0002] The following Patent Document 1 discloses that "the substrate processing system 1 comprises a main body 10 and a control device 100 that controls the main body 10. The main body 10 comprises a vacuum transfer module 11, a plurality of substrate processing modules 12, a plurality of load lock modules 13, a plurality of storage modules 14, and a substrate aligner module 15. The main body 10 also comprises an ER (edge ​​ring) aligner module 16, an atmospheric transfer module 17, and a plurality of load ports 18." [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-141136 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a transfer module and a transfer method that can reduce the footprint of a substrate processing system. [Means for solving the problem]

[0005] A transfer module according to one aspect of the present disclosure includes a first transfer chamber, a second transfer chamber, and an opening / closing door. The first transfer chamber is connected to a vacuum transfer module and configured to be maintained at a low pressure lower than atmospheric pressure. The second transfer chamber is provided on a second side wall of the first transfer chamber other than the side wall opposite the first side wall to which the vacuum transfer module is connected, or on an upper portion of the first transfer chamber. The second transfer chamber is configured to accommodate a container for accommodating multiple objects to be transferred and to be able to switch its internal pressure between atmospheric pressure and low pressure. The opening / closing door is configured to separate the first transfer chamber from the second transfer chamber. The first transfer chamber has a storage section configured to accommodate the objects to be transferred. A container accommodating multiple objects to be transferred is loaded into the second transfer chamber, and the pressure in the second transfer chamber is switched from atmospheric pressure to low pressure. The opening / closing door is controlled so that the space within the first transfer chamber and the space within the second transfer chamber are connected. The objects are transferred from the container to a storage unit in the first transfer chamber, and then transferred from the storage unit into the vacuum transfer module. The objects removed from the vacuum transfer module are transferred into the container without passing through the storage unit. [Effects of the Invention]

[0006] Various aspects and embodiments of the present disclosure may reduce the footprint of a substrate processing system. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic plan view showing an example of a substrate processing system according to the first embodiment. [Figure 2] FIG. 2 is a schematic cross-sectional view showing an example of the AA cross section of the substrate processing system illustrated in FIG. [Figure 3] FIG. 3 is a schematic cross-sectional view showing an example of the BB cross section of the substrate processing system illustrated in FIG. [Figure 4] FIG. 4 is a flowchart showing an example of a substrate transport method in the first embodiment. [Figure 5] FIG. 5 is a diagram showing an example of a substrate transport process in the first embodiment. [Figure 6] FIG. 6 is an enlarged cross-sectional view showing an example of a connection portion between the stage and the container. [Figure 7] FIG. 7 is an enlarged cross-sectional view showing an example of a connection portion between the stage and the container. [Figure 8] FIG. 8 is a diagram showing an example of a substrate transport process in the first embodiment. [Figure 9] FIG. 9 is a diagram showing an example of a substrate transport process in the first embodiment. [Figure 10] FIG. 10 is an enlarged cross-sectional view showing an example of a connection portion between the stage and the container. [Figure 11] FIG. 11 is an enlarged cross-sectional view showing an example of a connection portion between the stage, the EFEM, and the housing. [Figure 12] FIG. 12 is a diagram showing an example of a substrate transport process in the first embodiment. [Figure 13] FIG. 13 is a diagram showing an example of a substrate transport process in the first embodiment. [Figure 14] FIG. 14 is a diagram showing an example of a substrate transport process in the first embodiment. [Figure 15] FIG. 15 is a diagram showing an example of a substrate transport process in the first embodiment. [Figure 16] FIG. 16 is a schematic plan view showing another example of the substrate processing system according to the first embodiment. [Figure 17] FIG. 17 is a schematic cross-sectional view showing an example of the AA cross section of the substrate processing system illustrated in FIG. [Figure 18] FIG. 18 is a schematic cross-sectional view showing an example of the BB cross section of the substrate processing system illustrated in FIG. [Figure 19] FIG. 19 is a schematic cross-sectional view showing another example of the AA cross section of the substrate processing system illustrated in FIG. [Figure 20] FIG. 20 is a schematic plan view showing an example of a substrate processing system according to the second embodiment. [Figure 21] FIG. 21 is a schematic cross-sectional view showing an example of the AA cross section of the substrate processing system illustrated in FIG. [Figure 22] FIG. 22 is a schematic cross-sectional view showing an example of the BB cross section of the substrate processing system illustrated in FIG. [Figure 23] FIG. 23 is a schematic cross-sectional view showing an example of the CC cross section of the substrate processing system illustrated in FIG. [Figure 24] FIG. 24 is a schematic cross-sectional view showing an example of a DD cross section of the substrate processing system illustrated in FIG. [Figure 25] FIG. 25 is a flowchart showing an example of a substrate transport method in the second embodiment. [Figure 26] FIG. 26 is a diagram showing an example of a substrate transport process in the second embodiment. [Figure 27] FIG. 27 is a diagram showing an example of a substrate transport process in the second embodiment. [Figure 28] FIG. 28 is a diagram showing an example of a substrate transport process in the second embodiment. [Figure 29] FIG. 29 is a diagram showing an example of a substrate transport process in the second embodiment. [Figure 30] FIG. 30 is a diagram showing an example of a substrate transport process in the second embodiment. [Figure 31] FIG. 31 is a diagram showing an example of a substrate transport process in the second embodiment. [Figure 32] FIG. 32 is a diagram showing an example of a substrate transport process in the second embodiment. [Figure 33] FIG. 33 is a diagram showing an example of a substrate transport process in the second embodiment. [Figure 34] FIG. 34 is a diagram showing an example of a substrate transport process in the second embodiment. [Figure 35] FIG. 35 is a diagram showing an example of a substrate transport process in the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of a transfer module and a transfer method will be described in detail with reference to the drawings. Note that the transfer module and the transfer method disclosed below are not limited to the following embodiments.

[0009] Increasing the number of processing modules per substrate can be considered as a way to increase the number of substrates that can be processed per unit time. Increasing the number of processing modules increases the size of a substrate processing system that includes multiple processing modules. As the size of a substrate processing system increases, the installation area (footprint) of the substrate processing system in a facility such as a clean room increases, making it difficult to arrange multiple substrate processing systems. Therefore, there is a demand for reducing the installation area of ​​a substrate processing system.

[0010] Therefore, the present disclosure provides a technique that can reduce the installation area of ​​a substrate processing system.

[0011] (First embodiment) [Configuration of substrate processing system 1] Fig. 1 is a plan view showing an example of the configuration of a substrate processing system 1 in a first embodiment. Fig. 2 is a schematic cross-sectional view showing an example of the AA cross section of the substrate processing system 1 shown in Fig. 1. Fig. 3 is a schematic cross-sectional view showing an example of the BB cross section of the substrate processing system 1 shown in Fig. 2. For convenience, Fig. 1 shows internal components of some of the devices in a transparent manner. Furthermore, Fig. 2 omits the internal configuration of a utility unit 14.

[0012] As shown in FIG. 1, the substrate processing system 1 includes a vacuum transfer module (VTM) 11, a plurality of process modules (PMs) 12, and a plurality of equipment front-end modules (EFEMs) 13. The EFEM 13 is an example of a transfer module. In the example of FIG. 1, the VTM 11 extends in the y-axis direction of FIG. 1, and the plurality of PMs 12 are arranged adjacent to the VTM 11 in the x-axis direction of FIG. 1. Also, in the example of FIG. 1, the plurality of EFEMs 13 are arranged adjacent to the VTM 11 in the y-axis direction of FIG. 1. Also, in the example of FIG. 1, a plurality of utility units 14 are arranged adjacent to the EFEM 13 in the x-axis direction of FIG. 1. Electrical wiring, gas piping, etc. are arranged within the utility unit 14. The utility unit 14 is an example of an equipment housing chamber.

[0013] A plurality of PMs 12 are connected to the sidewall of the VTM 11 via gate valves 120. Each PM 12 performs processing such as etching or film formation on a substrate W to be processed. The substrate W is an example of a transport object. In the example of FIG. 1, six PMs 12 are connected to the VTM 11, but the number of PMs 12 connected to the VTM 11 may be more or less than six.

[0014] A transfer robot 110 is disposed inside the VTM 11. The transfer robot 110 transfers the substrate W between the PM 12 and the EFEM 13. The inside of the VTM 11 is maintained in a low-pressure atmosphere that is lower than atmospheric pressure.

[0015] A plurality of EFEMs 13 are connected to the other side wall of the VTM 11. In the example of Fig. 1, two EFEMs 13 are connected to the VTM 11, but the number of EFEMs 13 connected to the VTM 11 may be more or less than two.

[0016] Each EFEM 13 has a first transfer chamber 135 and a second transfer chamber 130, as shown in, for example, FIGS. 2 and 3. The space within the first transfer chamber 135 is connected to the space within the VTM 11 via an opening 136 and is maintained at a low pressure lower than atmospheric pressure. The first transfer chamber 135 is capable of accommodating a container 15 that accommodates multiple substrates W. The container 15 is, for example, a FOUP (Front Opening Unified Pod). A gate valve 131 is provided at the top of the second transfer chamber 130. The second transfer chamber 130 is provided above the first transfer chamber 135 and is capable of accommodating the container 15. The second transfer chamber 130 is configured so that its internal pressure can be switched between atmospheric pressure and a low pressure that is the same as the pressure within the first transfer chamber 135.

[0017] A moving mechanism 16 is provided in the first transfer chamber 135. The moving mechanism 16 has a stage 160, an aligner module 161, a storage section 162, a support section 163, and a drive section 164. The stage 160 separates the second transfer chamber 130 from the first transfer chamber 135. A container 15 can be placed on the upper surface of the stage 160. The stage 160 is an example of an opening / closing door. The aligner module 161 adjusts the orientation of the substrate W.

[0018] 3, a lid attachment / detachment mechanism 137 for attaching and detaching a lid 150 to the container 15 is provided inside the first transfer chamber 135. A sensor 138 is also provided on the side wall of the EFEM 13. The sensor 138 detects the position of the substrate W accommodated in the container 15 when the container 15 with the lid 150 removed passes through the first transfer chamber 135 near the sensor 138.

[0019] An aligner module 161 for adjusting the orientation of the substrate W is provided below the stage 160. A storage unit 162 for temporarily holding a plurality of substrates W is provided below the stage 160. The stage 160, aligner module 161, and storage unit 162 are supported by a support unit 163. A drive unit 164 moves the support unit 163 in the vertical direction (the z-axis direction in FIGS. 1 to 3). When the drive unit 164 moves the support unit 163 in the vertical direction, the stage 160, aligner module 161, and storage unit 162 move vertically as a unit.

[0020] As described above, in this embodiment, the EFEM 13 is connected to the VTM 11, and no load lock module is provided between the VTM 11 and the EFEM 13. Therefore, the installation area of ​​the substrate processing system 1 can be reduced compared to a substrate processing system configured such that a load lock module is provided between the VTM 11 and the EFEM 13.

[0021] The control unit 10 has a memory, a processor, and an input / output interface. Data such as recipes, programs, etc. are stored in the memory. The memory is, for example, a random access memory (RAM), a read-only memory (ROM), a hard disk drive (HDD), or a solid state drive (SSD). The processor executes a program read from the memory to control each part of the substrate processing system 1 via the input / output interface based on data such as recipes stored in the memory. The processor is, for example, a central processing unit (CPU) or a digital signal processor (DSP).

[0022] [Transportation method] Fig. 4 is a flowchart showing an example of a method for transporting a substrate W in the first embodiment. Hereinafter, the example of the method for transporting a substrate W illustrated in Fig. 4 will be described with reference to Figs. 5 to 15. In Figs. 5 to 15, low-pressure spaces are hatched to distinguish between atmospheric pressure spaces and low-pressure spaces.

[0023] First, a container 15 containing a plurality of unprocessed substrates W is loaded into the second transfer chamber 130 (S100). Step S100 is an example of process a). In step S100, as shown in FIG. 5, for example, the gate valve 131 is opened, and the container 15 containing the plurality of unprocessed substrates W is transported by a transport mechanism such as an OHT (Overhead Hoist Transport) 30 and loaded into the second transfer chamber 130. Then, the container 15 is placed on the stage 160, and the gate valve 131 is closed.

[0024] 6 and 7 are enlarged cross-sectional views showing an example of a connection portion between the stage 160 and the container 15. For example, as shown in Fig. 6, a connector 151 for connecting a gas pipe is provided at the bottom of the container 15. A connector 1601 that fits into the connector 151 of the container 15 is provided at the top surface of the stage 160. A connector 1604 is connected to the connector 1601 via a pipe 1605. A connector 174 is fitted into the connector 1604. The connector 174 is connected to the valve 172 and the valve 173 via a pipe 178.

[0025] 7, for example, the connector 151 of the container 15 is fitted to the connector 1601 of the stage 160. This allows the gas inside the container 15 to be exhausted by opening the valve 172, and allows the inert gas to be supplied into the container 15 by opening the valve 173.

[0026] Furthermore, valves 170 and 171 are connected to the space inside the second transfer chamber 130 via piping 177. By opening the valve 170, the gas inside the second transfer chamber 130 can be exhausted, and by opening the valve 171, an inert gas can be supplied into the second transfer chamber 130. The inert gas in this embodiment is, for example, nitrogen gas, a rare gas, or dry air.

[0027] Furthermore, a thick-tipped protrusion 1602 is provided on the top surface of the stage 160. A drive unit 175 is provided on the side wall of the second transfer chamber 130. A seal member 1603, such as an O-ring, is disposed between the drive unit 175 and the stage 160. The drive unit 175 moves a tapered cylinder 176 laterally. The drive unit 175 locks the stage 160 by inserting the cylinder 176 into the base of the protrusion 1602. When the stage 160 is locked, the space within the first transfer chamber 135 and the space within the second transfer chamber 130 are airtightly separated.

[0028] Returning to FIG. 4, the explanation will be continued. After the container 15 is loaded into the second transfer chamber 130, the second transfer chamber 130 is evacuated to a vacuum while an inert gas is supplied into the container 15 (S101). Step S101 is an example of process b). In step S101, the inert gas is supplied into the container 15 by opening the valve 173, and the gas inside the second transfer chamber 130 is evacuated by opening the valve 170. As a result, as shown in FIG. 8, for example, the pressure inside the second transfer chamber 130 can be set to the same low pressure as the pressure inside the first transfer chamber 135 while maintaining the inside of the container 15 at atmospheric pressure.

[0029] Next, the inside of the container 15 is evacuated (S102). In step S102, the gas inside the container 15 is evacuated by closing the valve 173 and opening the valve 172. As a result, as shown in FIG. 9, for example, the pressure inside the container 15 and the pressure inside the second transfer chamber 130 can be set to the same low pressure as the pressure inside the first transfer chamber 135. In this way, by setting the pressure inside the second transfer chamber 130 to a lower pressure before the pressure inside the container 15, particles and the like inside the second transfer chamber 130 can be prevented from entering the container 15.

[0030] Next, the container 15 is carried into the first transfer chamber 135 (S103). Step S103 is an example of process c). In step S103, for example, as shown in FIG. 10 , the driving unit 175 retracts the cylinder 176 from the base of the protrusion 1602, and the stage 160 is unlocked. Then, the driving unit 164 drives the stage 160, the aligner module 161, and the storage unit 162 to descend, and the container 15 on the stage 160 is carried into the first transfer chamber 135.

[0031] Next, the lid 150 of the container 15 is removed (S104). In step S104, the lid 150 of the container 15 is removed by the lid attaching / detaching mechanism 137, as shown in FIG.

[0032] Next, the position of the substrate W in the container 15 is detected (S105). In step S105, as shown in Fig. 12, for example, when the container 15 passes through the first transfer chamber 135 near the sensor 138, the position of the substrate W accommodated in the container 15 is detected by the sensor 138.

[0033] Next, the unprocessed substrates W in the container 15 are carried into the accommodation unit 162 (S106). Step S106 is an example of process d). In step S106, as shown in FIG. 13, for example, the substrates W in the container 15 are removed by the transfer robot 110 in the VTM 11 through the opening 136. Then, the container 15, the stage 160, the aligner module 161, and the accommodation unit 162 are moved upward by the drive unit 164, and the substrates W removed from the container 15 are carried into the accommodation unit 162 by the transfer robot 110, as shown in FIG. 14, for example. In step S106, all of the unprocessed substrates W in the container 15 are temporarily carried into the accommodation unit 162.

[0034] Next, the unprocessed substrate W is carried into the VTM 11 from the accommodation unit 162 (S107). Step S107 is an example of process e). In step S107, the transfer robot 110 carries the substrate W out of the accommodation unit 162, and the drive unit 164 moves the container 15, the stage 160, the aligner module 161, and the accommodation unit 162 downward. Then, as shown in FIG. 15 , for example, the substrate W taken out of the accommodation unit 162 is placed on the aligner module 161. Then, the substrate W, whose orientation has been adjusted by the aligner module 161, is carried into the VTM 11 by the transfer robot 110 through the opening 136.

[0035] In this way, the transfer of the unprocessed substrate W from the container 15 to the accommodation unit 162, the transfer of the unprocessed substrate W from the accommodation unit 162 to the aligner module 161, and the transfer of the processed substrate W from the VTM 11 to the container 15 are performed by the transfer robot 110 in the VTM 11. This eliminates the need to arrange a separate transfer robot in the first transfer chamber 135 in addition to the transfer robot 110 in the VTM 11, and allows the EFEM 13 to be made smaller.

[0036] Next, processing of the substrate W is performed (S108). In step S108, the substrate W that has been carried into the VTM 11 is carried into one of the PMs 12 by the transfer robot 110, and is processed by the PM 12.

[0037] Next, the processed substrate W is transferred into the container 15 (S109). Step S109 is an example of process f). In step S109, the processed substrate W is transferred out of the PM 12 by the transfer robot 110. Then, the container 15, the stage 160, the aligner module 161, and the accommodation unit 162 are moved downward by the drive unit 164, and the processed substrate W is transferred into the container 15, for example, as shown in FIG. 13 . In this embodiment, the unprocessed substrate W is transferred from the accommodation unit 162 to the PM 12, and the processed substrate W is transferred into the container 15 without passing through the accommodation unit 162. This prevents the unprocessed substrate W and the processed substrate W from coexisting in the container 15. This makes it possible to prevent so-called cross-contamination, in which particles and the like scattered from the processed substrate W adhere to the unprocessed substrate W.

[0038] Next, when a predetermined number of processed substrates W are accommodated in the container 15, the lid 150 is attached to the container 15 (S110). In step S110, the drive unit 164 moves the container 15, the stage 160, the aligner module 161, and the accommodation unit 162 upward, and the lid attaching / detaching mechanism 137 attaches the lid 150 to the container 15.

[0039] Next, the container 15 is loaded into the second transfer chamber 130 (S111). In step S111, the drive unit 164 moves the container 15, the stage 160, the aligner module 161, and the storage unit 162 upward. Then, the drive unit 175 inserts the cylinder 176 into the base of the protrusion 1602, thereby locking the stage 160. As a result, the space within the first transfer chamber 135 and the space within the second transfer chamber 130 are airtightly separated, for example, as shown in FIG. 9 .

[0040] Next, an inert gas is supplied into the container 15 (S112). In step S112, the valve 173 is opened to supply the inert gas into the container 15. As a result, as shown in FIG. 8, for example, the pressure inside the second transfer chamber 130 can be set to atmospheric pressure while the pressure inside the second transfer chamber 130 is maintained at the same low pressure as the pressure inside the first transfer chamber 135.

[0041] Next, an inert gas is supplied into the second transfer chamber 130 (S113). In step S113, the valve 171 is opened to supply the inert gas into the second transfer chamber 130, thereby making the inside of the second transfer chamber 130 atmospheric pressure. In this way, by making the inside of the container 15 atmospheric pressure before the inside of the second transfer chamber 130, it is possible to prevent particles and the like in the second transfer chamber 130 from entering the container 15.

[0042] Next, the container 15 is transferred out of the second transfer chamber 130 (S114). In step S114, the gate valve 131 is opened, and the container 15 is transferred out of the second transfer chamber 130 by a transfer mechanism such as the OHT 30, as shown in FIG. 5, for example. Then, the transfer method shown in this flowchart ends.

[0043] The first embodiment has been described above. As described above, the EFEM 13 in this embodiment includes a first transfer chamber 135, a second transfer chamber 130, and a stage 160. The first transfer chamber 135 is connected to the VTM 11 and is configured to be maintained at a pressure lower than atmospheric pressure. The second transfer chamber 130 is provided above the first transfer chamber 135. The second transfer chamber 130 is configured to accommodate a container 15 that accommodates multiple substrates W and to switch the internal pressure between atmospheric pressure and low pressure. The stage 160 is configured to separate the first transfer chamber 135 and the second transfer chamber 130. The first transfer chamber 135 has a storage section 162 configured to store unprocessed substrates W. A container 15 containing a plurality of unprocessed substrates W is loaded into the second transfer chamber 130, and after the pressure in the second transfer chamber 130 is switched from atmospheric pressure to a low pressure, the stage 160 is controlled so that the space in the first transfer chamber 135 and the space in the second transfer chamber 130 are communicated with each other. Then, the plurality of unprocessed substrates W are transferred from the container 15 to an accommodation unit 162 in the first transfer chamber 135, and the plurality of unprocessed substrates W are transferred from the accommodation unit 162 into the VTM 11. Then, the processed substrates W are transferred from the VTM 11 into the container 15 without passing through the accommodation unit 162. This allows the installation area of ​​the substrate processing system 1 to be reduced.

[0044] In the first embodiment described above, the second transfer chamber 130 is provided above the first transfer chamber 135. The second transfer chamber 130 has a drive unit 164 configured to move the container 15 up and down together with the stage 160. The container 15 containing a plurality of unprocessed substrates W is housed in the second transfer chamber 130, and after the pressure in the second transfer chamber 130 is switched from atmospheric pressure to a low pressure, the stage 160 is controlled so that the space in the first transfer chamber 135 communicates with the space in the second transfer chamber 130, and the container 15 together with the stage 160 is transported into the first transfer chamber 135 by the drive unit 164. Then, the plurality of unprocessed substrates W are transported from the container 15 to the accommodation unit 162 in the first transfer chamber 135. This makes it possible to prevent unprocessed substrates W and processed substrates W from coexisting in the container 15, and to prevent particles and the like scattered from the processed substrates W from adhering to the unprocessed substrates W.

[0045] In the first embodiment described above, the container 162 is disposed below the stage 160, and the drive unit 164 is configured to move the container 15, the stage 160, and the container 162 up and down together within the first transfer chamber 135. This allows the drive unit 164 to be shared, thereby reducing the number of parts.

[0046] Furthermore, in the first embodiment described above, the transfer robot 110 in the VTM 11 can be extended into the first transfer chamber 135, and the transfer of a plurality of substrates before processing from the container 15 to the accommodation unit 162 is performed by the transfer robot 110. This eliminates the need to arrange a separate transfer robot in the first transfer chamber 135 in addition to the transfer robot 110 in the VTM 11, and allows the EFEM 13 to be made smaller.

[0047] In the first embodiment described above, a lid attaching / detaching mechanism 137 and a sensor 138 are provided in the first transfer chamber 135. The lid attaching / detaching mechanism 137 is configured to attach and detach the lid 150 of the container 15. The sensor 138 is configured to detect the positions of multiple unprocessed substrates W contained in the container 15 when the container 15, from which the lid 150 has been removed by the lid attaching / detaching mechanism 137, passes in front of the sensor 138. This allows the transfer robot 110 to transfer the unprocessed substrates W in the container 15.

[0048] In the first embodiment described above, the container 15 is accommodated in the second transfer chamber 130, and after the pressure in the second transfer chamber 130 is switched from atmospheric pressure to low pressure, the pressure in the container 15 is switched from atmospheric pressure to low pressure. This makes it possible to prevent particles and the like in the second transfer chamber 130 from entering the container 15.

[0049] Furthermore, in the first embodiment described above, while the container 15 is housed in the second transfer chamber 130, an inert gas is supplied into the container 15 while the pressure in the second transfer chamber 130 is switched from atmospheric pressure to low pressure. This allows the pressure in the container 15 to be maintained at atmospheric pressure until the pressure in the second transfer chamber 130 is switched from atmospheric pressure to low pressure.

[0050] The first embodiment described above is a transfer method in the EFEM 13, and includes steps a), b), c), d), e), and f). The EFEM 13 includes a first transfer chamber 135, a second transfer chamber 130, and a stage 160. The first transfer chamber 135 is connected to the VTM 11 and is configured to be maintained at a pressure lower than atmospheric pressure. The second transfer chamber 130 is provided above the first transfer chamber 135. The second transfer chamber 130 is configured to accommodate a container 15 that accommodates multiple substrates W and to switch the internal pressure between atmospheric pressure and low pressure. The stage 160 is configured to separate the first transfer chamber 135 and the second transfer chamber 130. The first transfer chamber 135 has a storage section 162 configured to store unprocessed substrates W. In step a), the container 15 containing a plurality of unprocessed substrates is loaded into the second transfer chamber 130. In step b), the pressure inside the second transfer chamber 130 is switched from atmospheric pressure to a low pressure. In step c), the stage 160 is controlled so that the space inside the first transfer chamber 135 and the space inside the second transfer chamber 130 are in communication. In step d), the plurality of unprocessed substrates W are transferred from the container 15 to an accommodation unit 162 inside the first transfer chamber 135. In step e), the plurality of unprocessed substrates W are transferred from the accommodation unit 162 into the VTM 11. In step f), the processed substrates W are transferred from the VTM 11 into the container 15 without passing through the accommodation unit 162. This allows the installation area of ​​the substrate processing system 1 to be reduced.

[0051] In the first embodiment described above, the container 15 is loaded into the EFEM 13 by the OHT 30, but the disclosed technology is not limited to this. As another embodiment, for example, as shown in FIGS. 16 to 18 , a stage 140 on which the container 15 is temporarily placed on the utility unit 14 by the OHT 30 may be provided. FIG. 16 is a schematic plan view showing another example of the substrate processing system 1 in the first embodiment. FIG. 17 is a schematic cross-sectional view showing an example of the AA cross section of the substrate processing system 1 illustrated in FIG. 16. FIG. 18 is a schematic cross-sectional view showing an example of the BB cross section of the substrate processing system 1 illustrated in FIG. 17. Except for the points described below, components in FIGS. 16 to 18 that are assigned the same reference numerals as those in FIGS. 1 to 3 have the same or similar functions as those in FIG. 1, and therefore description thereof will be omitted.

[0052] 16 to 18, a plurality of stages 140 for placing the containers 15 on the utility unit 14 are provided. In addition, a transfer mechanism 18 is provided on the side walls of the EFEM 13 and the utility unit 14. The transfer mechanism 18 has a guide rail 180 and a crane 181. The crane 181 moves along the guide rail 180 to move the containers 15 between the stages 140 and the EFEM 13.

[0053] The container 15 containing the unprocessed substrates W is transported by the OHT 30 and placed on the stage 140. The crane 181 transports the container 15 placed on the stage 140 into the EFEM 13. The crane 181 also transports the container 15 containing the processed substrates W out of the EFEM 13 and places it on the stage 140. The container 15 placed on the stage 140 is transported by the OHT 30.

[0054] It should be noted that the transfer mechanism 18 may not be provided, and the container 15 may be moved between the stage 140 and the EFEM 13 by the OHT 30. In the example of FIG. 17, the heights of the multiple stages 140 are approximately the same, but the disclosed technology is not limited to this, and the heights of the multiple stages 140 may be different. For example, a stage 140a among the multiple stages 140 may be located at a lower position than the other stages 140, as illustrated in FIG. 19. This allows the container 15 to be placed on the stage 140a by hand.

[0055] (Second embodiment) [Configuration of substrate processing system 1] FIG. 20 is a schematic plan view showing an example of a substrate processing system 1 according to the second embodiment. FIG. 21 is a schematic cross-sectional view showing an example of an AA cross section of the substrate processing system 1 shown in FIG. 20. FIG. 22 is a schematic cross-sectional view showing an example of a BB cross section of the substrate processing system 1 shown in FIG. 21. FIG. 23 is a schematic cross-sectional view showing an example of a CC cross section of the substrate processing system 1 shown in FIG. 21. FIG. 24 is a schematic cross-sectional view showing an example of a DD cross section of the substrate processing system 1 shown in FIG. 21. Furthermore, the internal configuration of the utility unit 14 is not shown in FIG. 21. Note that, except for the points described below, components in FIGS. 20 to 24 that are assigned the same reference numerals as those in FIGS. 1 to 3 have the same or similar functions as the components in FIGS. 1 to 3, and therefore description thereof will be omitted.

[0056] The substrate processing system 1 of this embodiment includes a VTM 11, a plurality of PMs 12, and an EFEM 19, as shown in Fig. 20, for example. In the example of Fig. 20, the EFEM 19 is disposed adjacent to the VTM 11 in the y-axis direction of Fig. 20. Also, in the example of Fig. 20, the utility unit 14 is disposed adjacent to the EFEM 19 in the x-axis direction of Fig. 20.

[0057] As shown in FIGS. 21 to 24, the EFEM 19 includes a first transfer chamber 195 and a second transfer chamber 190. A gate valve 1901 is provided at the top of the second transfer chamber 190. The second transfer chamber 190 is provided on a second side wall 192 of the first transfer chamber 195 other than the side wall facing the first side wall 191 to which the VTM 11 is connected, and is capable of accommodating a container 15. The second transfer chamber 190 is configured so that its internal pressure can be switched between atmospheric pressure and a low pressure that is the same as the pressure in the first transfer chamber 195. A lid attachment / detachment mechanism 1904 is provided in the second transfer chamber 190 to attach and detach the lid 150 of the container 15. The space inside the first transfer chamber 195 and the space inside the second transfer chamber 190 are separated by a gate valve 1903.

[0058] The space within the first transfer chamber 195 is connected to the space within the VTM 11 via the opening 136 and is maintained at a pressure lower than atmospheric pressure. The first transfer chamber 195 is provided with a transfer robot 1950, guide rails 1951, an aligner module 1952, a storage unit 1953, and a storage unit 1954.

[0059] The transfer robot 1950 moves within the first transfer chamber 195 along guide rails 1951. The transfer robot 1950 has a first arm 1950a having multiple forks and capable of transferring multiple substrates W collectively, and a second arm 1950b having one fork and capable of transferring the substrates W one by one. The aligner module 1952 adjusts the orientation of the substrate W. The storage units 1953 and 1954 hold multiple substrates W before processing.

[0060] [Transportation method] Fig. 25 is a flowchart showing an example of a method for transporting a substrate W in the second embodiment. Hereinafter, the example of the method for transporting a substrate W illustrated in Fig. 25 will be described with reference to Figs. 26 to 35. In Figs. 26 to 35, low-pressure spaces are hatched to distinguish between atmospheric pressure spaces and low-pressure spaces.

[0061] First, the container 15 containing a plurality of unprocessed substrates W is loaded into the second transfer chamber 190 (S200). In step S200, as shown in FIG. 26, for example, the gate valve 1901 is opened, and the container 15 containing the plurality of unprocessed substrates W is loaded into the second transfer chamber 190 by the OHT 30. Thereafter, the OHT 30 rotates the container 15 so that the container 15 faces the lid attaching / detaching mechanism 1904. Then, the container 15 is placed on the stage 1902, and the gate valve 1901 is closed. Note that the stage 1902 of this embodiment is provided with a connector for connecting gas piping, similar to the stage 160 of the first embodiment.

[0062] Next, the second transfer chamber 190 is evacuated to a vacuum while supplying an inert gas into the container 15 (S201). In step S201, the inert gas is supplied into the container 15 by opening a valve provided on a pipe for supplying the inert gas into the container 15. Furthermore, the gas inside the second transfer chamber 190 is evacuated by opening a valve provided on a pipe for evacuating the gas from the second transfer chamber 190. As a result, as shown in FIG. 27, for example, the pressure inside the second transfer chamber 190 can be set to the same low pressure as the pressure inside the first transfer chamber 195 while maintaining the inside of the container 15 at atmospheric pressure. This makes it possible to prevent particles and the like inside the second transfer chamber 190 from entering the container 15.

[0063] Next, the inside of the container 15 is evacuated (S202). In step S202, a valve provided on a pipe for supplying an inert gas into the container 15 is closed, and a valve provided on a pipe for exhausting gas from the container 15 is opened, thereby exhausting the gas inside the container 15. As a result, the pressure inside the container 15 and the pressure inside the second transfer chamber 190 can be set to the same low pressure as the pressure inside the first transfer chamber 195, as shown in FIG.

[0064] Next, the lid 150 of the container 15 is removed (S203). In step S203, for example, as shown in Fig. 29, the lid 150 of the container 15 is removed by the lid attaching / detaching mechanism 1904, and the gate valve 1903 is opened.

[0065] Next, all of the unprocessed substrates W in the container 15 are unloaded and loaded collectively into the storage unit 1953 or the storage unit 1954 (S204). In step S204, as shown in, for example, FIG. 30, a first arm 1950a is inserted into the container 15, and all of the unprocessed substrates W in the container 15 are unloaded by the first arm 1950a. Then, as shown in, for example, FIG. 31, the transport robot 1950 moves along the guide rail 1951, and the plurality of substrates W unloaded from the container 15 are loaded into the storage unit 1953.

[0066] After all the substrates W have been unloaded from the container 15, the lid 150 is attached by the lid attaching / detaching mechanism 1904. Then, the pressure inside the second transfer chamber 190 and the container 15 is returned to atmospheric pressure, and as shown in FIG. 32, for example, the gate valve 1901 is opened and the container 15 is unloaded from the second transfer chamber 190 by the OHT 30. Then, another container 15 containing unprocessed substrates W is loaded into the second transfer chamber 190 by the OHT 30, and all the substrates W in the container 15 are loaded collectively into the accommodation unit 1953 or the accommodation unit 1954, similar to the processing shown in steps S201 to S204. As a result, a plurality of unprocessed substrates W are stored in the accommodation unit 1953 and the accommodation unit 1954, for example, as shown in FIG. 32.

[0067] Next, an unprocessed substrate W is carried into the VTM 11 from the accommodation unit 1953 or 1954 (S205). In step S205, for example, as shown in FIG. 33, one substrate W is carried out from the accommodation unit 1953 or 1954 by the second arm 1950b. Then, for example, as shown in FIG. 34, the unprocessed substrate W is placed on the aligner module 1952 by the second arm 1950b. The aligner module 1952 adjusts the orientation of the substrate W. The substrate W whose orientation has been adjusted is carried into the VTM 11 by the transfer robot 110 of the VTM 11 through the opening 136.

[0068] Next, processing of the substrate W is carried out (S206). In step S206, the substrate W carried into the VTM 11 is carried into one of the PMs 12 by the transfer robot 110, and is processed by the PM 12.

[0069] Next, the processed substrate W is transferred into the container 15 (S207). In step S207, the processed substrate W is transferred out of the PM 12 by the transfer robot 110 and placed on the aligner module 1952 through the opening 136. The substrate W placed on the aligner module 1952 is taken out by the second arm 1950b and transferred into the container 15, for example, as shown in FIG.

[0070] Next, when a predetermined number of processed substrates W are accommodated in the container 15, the lid 150 is attached to the container 15 (S208). In step S208, for example, as shown in Fig. 28, the gate valve 1903 is closed, and the lid 150 is attached to the container 15 by the lid attaching / detaching mechanism 1904.

[0071] Next, an inert gas is supplied into the container 15 (S209). In step S209, a valve provided on a pipe for supplying the inert gas into the container 15 is opened to supply the inert gas into the container 15. As a result, as shown in FIG. 27, for example, the pressure inside the second transfer chamber 190 can be set to atmospheric pressure while the pressure inside the second transfer chamber 190 is maintained at the same low pressure as the pressure inside the first transfer chamber 195. This makes it possible to prevent particles and the like inside the second transfer chamber 190 from entering the container 15.

[0072] Next, an inert gas is supplied into the second transfer chamber 190 (S210). In step S210, a valve provided in a pipe for supplying the inert gas into the second transfer chamber 190 is opened to supply the inert gas into the second transfer chamber 190.

[0073] Next, the container 15 is transferred out of the second transfer chamber 190 (S211). In step S211, the gate valve 1901 is opened, and the container 15 is transferred out of the second transfer chamber 190 by the OHT 30, as shown in Fig. 26, for example. Then, the transfer method shown in this flowchart ends.

[0074] The second embodiment has been described above. As described above, in this embodiment, the second transfer chamber 190 is provided on the second side wall 192 of the first transfer chamber 195 other than the side wall facing the first side wall 191 to which the VTM 11 is connected. A transfer robot 1950 having a first arm 1950a provided with a plurality of forks configured to place a substrate W thereon is provided within the first transfer chamber 195. The transfer robot 1950 transfers a plurality of unprocessed substrates W accommodated in a container 15 all at once to the accommodation unit 1953 or the accommodation unit 1954. This allows the installation area of ​​the substrate processing system 1 to be reduced.

[0075] In the second embodiment described above, the transport robot 1950 further includes a second arm 1950b provided with one fork. The transport robot 1950 transports the unprocessed substrate W accommodated in the accommodation unit 1953 or the accommodation unit 1954 to the VTM 11 using the second arm 1950b.

[0076] [others] The technology disclosed in this application is not limited to the above-described embodiment, and various modifications are possible within the scope of the gist thereof.

[0077] For example, in the first embodiment described above, the aligner module 161 and the housing unit 162 are provided in the moving mechanism 16, but the disclosed technology is not limited to this. In another embodiment, the aligner module 161 and the housing unit 162 may be provided inside the VTM 11.

[0078] Furthermore, in the first embodiment described above, the transfer of the unprocessed substrates W between the container 15 and the accommodation part 162 is performed by the transfer robot 110 in the VTM 11, but the disclosed technology is not limited to this. As another embodiment, a transfer robot having multiple forks and capable of transporting multiple substrates W collectively may be provided in the first transfer chamber 135, and the transfer of the unprocessed substrates W from the container 15 to the accommodation part 162 may be performed collectively by the transfer robot. This makes it possible to reduce the time required to transport the unprocessed substrates W from the container 15 to the accommodation part 162.

[0079] Furthermore, in the first embodiment described above, the container 15 accommodates the substrate W, and the VTM 11 and EFEM 13 transport the substrate W; however, the disclosed technology is not limited to this. In another embodiment, the container 15 may accommodate consumable parts used in the PM 12, and the VTM 11 and EFEM 13 may transport the consumable parts accommodated in the container 15. In this case, the VTM 11 and EFEM 13 may transport unused consumable parts to the storage unit 162, remove used consumable parts from the PM 12 and store them in the container 15, and transport the unused consumable parts into the PM 12. Note that the VTM 11 and EFEM 13 may transport not only unused consumable parts, but also consumable parts that have been used even once into the PM 12 via the storage unit 162. Consumable parts are an example of transported objects.

[0080] Furthermore, in the second embodiment described above, the container 15 accommodates a substrate W, and the VTM 11 and the EFEM 19 transport the substrate W; however, the disclosed technology is not limited to this. As another embodiment, the container 15 may accommodate consumable parts used in the PM 12, and the VTM 11 and the EFEM 19 may transport the consumable parts accommodated in the container 15. In this case, the VTM 11 and the EFEM 19 may transport unused consumable parts to the storage unit 1953 or the storage unit 1954, unload used consumable parts from the PM 12 and store them in the container 15, and transport the unused consumable parts into the PM 12. Note that the VTM 11 and the EFEM 19 may transport not only unused consumable parts, but also consumable parts that have been used even once into the PM 12 via the storage unit 1953 or the storage unit 1954.

[0081] Furthermore, in the first embodiment described above, only unprocessed substrates W are stored in the storage unit 162, but the disclosed technology is not limited to this. As another embodiment, two airtightly separated spaces may be provided in the storage unit 162, with unprocessed substrates W stored in one space and processed substrates W stored in the other space. This makes it possible to unload unprocessed substrates W from one space in the storage unit 162 and load processed substrates W into the other space in the storage unit 162, even during the waiting time until the container 15 is transported by the OHT 30.

[0082] Furthermore, in the second embodiment described above, only unprocessed substrates W are stored in the storage units 1953 and 1954, but the disclosed technology is not limited to this. As another embodiment, the storage units 1953 and 1954 may be airtightly partitioned, with unprocessed substrates W stored in one of the storage units 1953 and 1954 and processed substrates W stored in the other. This allows the unprocessed substrates W to be unloaded from one of the storage units 1953 and 1954 and the processed substrates W to be loaded into the other of the storage units 1953 and 1954, even during the waiting time until the container 15 is transported by the OHT 30.

[0083] 16 to 18, the second embodiment described above may also be provided with a plurality of stages 140 and a transfer mechanism 18 for placing the container 15 on the utility unit 14 and the EFEM 19. Furthermore, the height of at least one stage 140 among the plurality of stages 140 above the utility unit 14 may be lower than the other stages 140, for example, as in FIG.

[0084] Furthermore, in the second embodiment described above, the unprocessed substrate W is transported to the VTM 11 via the aligner module 1952, and the processed substrate W is unloaded into the container 15 via the aligner module 1952; however, the disclosed technology is not limited to this. In another embodiment, the aligner module 1952 may be provided at a position away from the opening 136. The unprocessed substrate W, whose orientation has been adjusted by the aligner module 1952, may be taken out of the aligner module 1952 by the second arm 1950b and transferred to the transfer robot 110 via the opening 136. The processed substrate W transported by the transfer robot 110 may be transferred to the second arm 1950b and transferred into the container 15 by the second arm 1950b without passing through the aligner module 1952.

[0085] It should be noted that the disclosed embodiments are illustrative in all respects and should not be considered limiting. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims.

[0086] Furthermore, the following supplementary notes are disclosed regarding the above-described embodiment.

[0087] (Appendix 1) a first transfer chamber connected to the vacuum transfer module and configured to be maintained at a low pressure lower than atmospheric pressure; a second transfer chamber provided on a second side wall of the first transfer chamber other than the side wall facing the first side wall to which the vacuum transfer module is connected or on an upper portion of the first transfer chamber, the second transfer chamber being capable of accommodating a container for accommodating a plurality of objects to be transferred, and configured such that an internal pressure can be switched between atmospheric pressure and the low pressure; an opening / closing door configured to separate the first transfer chamber and the second transfer chamber; Equipped with the first transfer chamber has a storage section configured to store the object to be transferred, a container containing a plurality of the transported objects is loaded into the second transfer chamber, the pressure in the second transfer chamber is switched from atmospheric pressure to the low pressure, and then the opening / closing door is controlled so that the space in the first transfer chamber and the space in the second transfer chamber are connected; the plurality of transported objects are transported from the container to the storage section in the first transfer chamber; the transported objects are transported from the storage section into the vacuum transfer module; and the transported objects removed from the vacuum transfer module are transported into the container without passing through the storage section. (Appendix 2) the second transfer chamber is provided above the first transfer chamber, the first transfer chamber has a drive unit configured to move the container up and down together with the opening and closing door, A transport module as described in Appendix 1, in which the container containing the plurality of transported objects is accommodated in the second transport chamber, the pressure in the second transport chamber is switched between atmospheric pressure and the low pressure, the opening and closing door is opened, the container is transported into the first transport chamber together with the opening and closing door by the drive unit, and the plurality of transported objects are transported from the container to the storage unit within the first transport chamber. (Appendix 3) The storage section is disposed below the opening and closing door, The transport module according to claim 2, wherein the drive unit is configured to move the container, the opening / closing door, and the storage unit up and down together within the first transport chamber. (Appendix 4) a transfer robot in the vacuum transfer module that can extend into the first transfer chamber; 4. The transfer module according to claim 2, wherein the transfer of the plurality of objects from the container to the storage unit is performed by the transfer robot. (Appendix 5) In the first transfer chamber, a detachment mechanism configured to attach and detach the lid of the container; a sensor configured to detect the position of the transported object contained in the container when the container from which the lid has been removed by the attachment / detachment mechanism passes in front of the sensor; 5. The transfer module of claim 2, further comprising: (Appendix 6) a plurality of stages disposed adjacent to the second side wall of the first transport chamber, provided above an equipment housing chamber that houses electrical equipment used in the transport module, and configured to place the container thereon; a transfer mechanism configured to transfer the container between the stage and the second transfer chamber; 6. The transfer module of any one of claims 1 to 5, comprising: (Appendix 7) 7. The transfer module according to claim 6, wherein some of the stages are positioned lower than the other stages. (Appendix 8) the second transfer chamber is provided on the second side wall of the first transfer chamber, a transport robot having a first arm provided with a plurality of forks configured to place the object to be transported is provided in the first transport chamber; The transport module according to claim 1, wherein the transport robot transports the plurality of transport objects contained in the container to the storage unit all at once. (Appendix 9) the transport robot further includes a second arm provided with one of the forks; The transfer module according to claim 8, wherein the transfer robot transfers the object housed in the housing section to the vacuum transfer module using the second arm. (Appendix 10) a plurality of stages provided above the first transfer chamber and configured to place the container thereon; a transfer mechanism configured to transfer the container between the stage and the second transfer chamber; 10. The transfer module of claim 8 or 9, comprising: (Appendix 11) In the second transfer chamber, A transfer module described in any one of Appendixes 1 to 10, wherein the container is accommodated in the second transfer chamber, and the pressure in the second transfer chamber is switched from atmospheric pressure to the low pressure, after which the pressure in the container is switched from atmospheric pressure to the low pressure. (Appendix 12) A transfer module as described in Appendix 11, wherein an inert gas is supplied into the container while the container is housed in the second transfer chamber and the pressure in the second transfer chamber is switched from atmospheric pressure to the low pressure. (Appendix 13) a first transfer chamber connected to the vacuum transfer module and configured to be maintained at a low pressure lower than atmospheric pressure; a second transfer chamber provided on a second side wall of the first transfer chamber other than the side wall facing the first side wall to which the vacuum transfer module is connected or on an upper portion of the first transfer chamber, the second transfer chamber being capable of accommodating a container for accommodating a plurality of objects to be transferred, and configured such that an internal pressure can be switched between atmospheric pressure and the low pressure; an opening / closing door configured to separate the first transfer chamber and the second transfer chamber; Equipped with a transfer method in a transfer module, wherein the first transfer chamber has a storage section configured to store the object to be transferred, a) carrying the container containing the plurality of objects into the second transfer chamber; b) switching the pressure in the second transfer chamber from atmospheric pressure to the low pressure; c) controlling the door so that a space in the first transfer chamber communicates with a space in the second transfer chamber; d) transporting the plurality of objects from the container to the storage unit in the first transport chamber; e) transferring the object from the storage unit into the vacuum transfer module; f) transferring the object transferred from the vacuum transfer module into the container without passing through the storage unit; A transport method comprising: [Explanation of symbols]

[0088] W substrate 1. Substrate Processing System 10 Control Unit 11 VTM 110 Transport Robot 12 PM 120 Gate Valve 13 EFEM 130 Second Transport Room 131 Gate valve 135 First Transport Room 136 Opening 137 Lid attachment / detachment mechanism 138 Sensors 14 Utility Unit 140 stages 15 Container 150 Lid 151 Connector 16 Moving mechanism 160 stages 1601 Connector 1602 Protrusion 1603 Sealing material 1604 Connector 1605 Piping 161 Aligner Module 162 Storage unit 163 Support part 164 Drive Unit 170 Valve 171 Valve 172 Valve 173 Valve 174 Connector 175 Drive unit 176 cylinders 177 Piping 178 Piping 18 Transfer mechanism 180 guide rail 181 Crane 19 EFEM 190 Second Transport Room 1901 Gate Valve 1902 Stage 1903 Gate valve 1904 Lid attachment / detachment mechanism 191 First Side Wall 192 Second Side Wall 195 First Transport Room 1950 Transport robot 1950a First Arm 1950b Second Arm 1951 Guide Rail 1952 Aligner Module 1953 Storage Unit 1954 Storage Unit 30 OHT

Claims

1. a first transfer chamber connected to the vacuum transfer module and configured to be maintained at a low pressure below atmospheric pressure; a second transfer chamber provided on a second side wall other than the side wall facing the first side wall connected to the vacuum transfer module in the first transfer chamber or on an upper portion of the first transfer chamber, the second transfer chamber being capable of accommodating a container for accommodating a plurality of objects to be transferred, and configured such that an internal pressure can be switched between atmospheric pressure and the low pressure; an opening / closing door configured to separate the first transfer chamber and the second transfer chamber; Equipped with the first transfer chamber has a storage section configured to store the object to be transferred, A transport module in which the container containing the plurality of transported objects is transported into the second transport chamber, the pressure in the second transport chamber is switched from atmospheric pressure to the low pressure, and then the opening and closing door is controlled so that the space in the first transport chamber and the space in the second transport chamber are connected, the plurality of transported objects are transported from the container to the storage section in the first transport chamber, the transported objects are transported from the storage section into the vacuum transport module, and the transported objects transported out of the vacuum transport module are transported into the container without passing through the storage section.

2. the second transfer chamber is provided above the first transfer chamber, the first transfer chamber has a drive unit configured to move the container up and down together with the opening and closing door, The transport module described in claim 1, wherein the container containing the plurality of transported objects is accommodated in the second transport chamber, the pressure in the second transport chamber is switched between atmospheric pressure and the low pressure, the opening and closing door is opened, the container is transported into the first transport chamber together with the opening and closing door by the drive unit, and the plurality of transported objects are transported from the container to the storage unit within the first transport chamber.

3. The storage section is disposed below the opening and closing door, The transfer module according to claim 2 , wherein the drive unit is configured to move the container, the opening / closing door, and the storage unit up and down together within the first transfer chamber.

4. a transfer robot in the vacuum transfer module that is extendable into the first transfer chamber; The transfer module according to claim 2 or 3, wherein the transfer of the plurality of objects from the container to the storage unit is performed by the transfer robot.

5. In the first transfer chamber, a detachment mechanism configured to attach and detach the lid of the container; a sensor configured to detect the position of the transported object contained in the container when the container from which the lid has been removed by the attachment / detachment mechanism passes in front of the sensor; 3. The transfer module of claim 2, further comprising:

6. a plurality of stages disposed adjacent to the second side wall of the first transport chamber, provided above an equipment accommodation chamber that accommodates electrical equipment used in the transport module, and configured to place the container thereon; a transfer mechanism configured to transfer the container between the stage and the second transfer chamber; The transfer module of claim 1 , comprising:

7. 7. The transfer module according to claim 6, wherein some of the plurality of stages are positioned lower than the other stages.

8. the second transfer chamber is provided on the second side wall of the first transfer chamber, a transport robot having a first arm provided with a plurality of forks configured to place the object to be transported is provided in the first transport chamber; The transfer module according to claim 1 , wherein the transfer robot transfers the plurality of objects housed in the container to the storage unit all at once.

9. the transport robot further includes a second arm provided with one of the forks; The transfer module according to claim 8 , wherein the transfer robot transfers the object housed in the housing section to the vacuum transfer module using the second arm.

10. a plurality of stages provided above the first transfer chamber and configured to place the container thereon; a transfer mechanism configured to transfer the container between the stage and the second transfer chamber; 10. The transfer module according to claim 8 or 9, comprising:

11. In the second transfer chamber, The transport module according to claim 1 , wherein the container is accommodated in the second transport chamber, and the pressure in the second transport chamber is switched from atmospheric pressure to the low pressure, after which the pressure in the container is switched from atmospheric pressure to the low pressure.

12. The transfer module according to claim 11 , wherein an inert gas is supplied into the container while the pressure in the second transfer chamber is switched from atmospheric pressure to the low pressure while the container is housed in the second transfer chamber.

13. a first transfer chamber connected to the vacuum transfer module and configured to be maintained at a low pressure below atmospheric pressure; a second transfer chamber provided on a second side wall other than the side wall facing the first side wall connected to the vacuum transfer module in the first transfer chamber or on an upper portion of the first transfer chamber, the second transfer chamber being capable of accommodating a container for accommodating a plurality of objects to be transferred, and configured such that an internal pressure can be switched between atmospheric pressure and the low pressure; an opening / closing door configured to separate the first transfer chamber and the second transfer chamber; Equipped with a transfer method in a transfer module, wherein the first transfer chamber has a storage section configured to store the object to be transferred, a) carrying the container containing the plurality of objects into the second transfer chamber; b) switching the pressure in the second transfer chamber from atmospheric pressure to the low pressure; c) controlling the door so that a space in the first transfer chamber communicates with a space in the second transfer chamber; d) transferring the plurality of objects from the container to the storage unit in the first transfer chamber; e) transferring the object from the storage unit into the vacuum transfer module; f) transferring the object transferred from the vacuum transfer module into the container without passing through the storage unit; A transport method comprising:

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