Cutting device and method for manufacturing cut products

Abstract

To provide a cutting device that can provide an operator with information contributing to improvement in quality of a cut product to be manufactured, and a method for manufacturing a cut product for allowing the improvement in the quality of a cut product to be manufactured.SOLUTION: A cutting device cuts an object to be cut. The cutting device comprises a table, a cutting mechanism, and an imaging apparatus. The table holds the object to be cut. The cutting mechanism cuts the object to be cut held on the table. The imaging apparatus picks up an image of the object to be cut held on the table. The object to be cut includes a plurality of marks formed in an imaging area of the imaging apparatus. The cutting device further comprises a storage unit and a display unit. The storage unit stores an image and coordinates of each of the plurality of marks to be a reference. The display unit displays, for each of the plurality of marks the images of which are picked up by the imaging apparatus, an amount of deviation in the coordinates compared with a corresponding mark of the plurality of marks to be the reference stored in the storage unit.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a cutting device and a method for producing a cut product. [Background technology]

[0002] Japanese Patent Application Laid-Open Publication No. 2018-142572 (Patent Document 1) discloses a cutting device that divides a package substrate into individual package devices by cutting the package substrate along planned division lines. This cutting device detects multiple alignment marks on the package substrate. Then, the device calculates the distance (maximum amount of warpage) between a reference line, which is a straight line connecting the alignment mark that is the start point of the planned division line and the alignment mark that is the end point of the planned division line, and the alignment mark that is farthest from the reference line among the multiple alignment marks corresponding to the planned division line. The package substrate is cut based on whether the calculated maximum amount of warpage is equal to or less than a tolerance (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2018-142572 Summary of the Invention [Problem to be solved by the invention]

[0004] In the cutting device disclosed in Patent Document 1, the cutting method for the package substrate is determined taking into consideration the maximum amount of warpage of the package substrate, so that the planned dividing lines can be cut with high precision even in a warped substrate. However, Patent Document 1 does not disclose any technology for further improving the quality of package devices (an example of cut products) manufactured by the cutting device (an example of a cutting device).

[0005] The present invention has been made to solve such problems, and its purpose is to provide a cutting device that can provide an operator with information that contributes to improving the quality of the cut products being produced, and a method for manufacturing cut products that can improve the quality of the cut products being produced. [Means for solving the problem]

[0006] A cutting device according to one aspect of the present invention cuts an object to be cut. The cutting device includes a table, a cutting mechanism, and an imaging device. The table holds the object to be cut. The cutting mechanism cuts the object to be cut held on the table. The imaging device images the object to be cut held on the table. The object to be cut includes a plurality of marks formed in an area imaged by the imaging device. The cutting device further includes a memory unit and a display unit. The memory unit stores images and coordinates of each of the plurality of reference marks. The display unit displays the amount of deviation of the coordinates of each of the plurality of marks imaged by the imaging device compared to a corresponding mark among the plurality of reference marks stored in the memory unit.

[0007] According to another aspect of the present invention, there is provided a method for manufacturing a cut product using the above-described cutting device. The cutting mechanism cuts the object according to a preset cutting rule. The method includes the steps of displaying a deviation amount of coordinates for each of a plurality of marks captured by the imaging device, changing the setting of the cutting rule based on the deviation amount of the displayed coordinates, and manufacturing the cut product by cutting the object according to the changed cutting rule. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a cutting device that can provide an operator with information that contributes to improving the quality of the cut products being manufactured, and a method for manufacturing cut products that can improve the quality of the cut products being manufactured. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is a plan view schematically showing the cutting device. [Figure 2] FIG. 2 is a plan view schematically showing a holding member. [Figure 3] FIG. 3 is a diagram schematically showing a cross section taken along line III-III in FIG. 2. [Figure 4] FIG. 2 is a diagram schematically illustrating an example of an alignment mark shown on the ball / lead surface of a package substrate. [Figure 5] FIG. 1 is a diagram schematically illustrating a hardware configuration of a computer. [Figure 6] 10A and 10B are diagrams illustrating an example of alignment marks used for alignment when cutting the package substrate along the longitudinal direction. [Figure 7] FIG. 10 is a diagram schematically showing a data table for managing data used in the first alignment. [Figure 8] 10A and 10B are diagrams illustrating an example of alignment marks used for alignment when cutting the package substrate along the short side direction. [Figure 9] FIG. 10 is a diagram schematically showing a data table for managing data used in the second alignment. [Figure 10] FIG. 10 is a diagram schematically illustrating an example of an image showing the amount of deviation calculated through the first alignment. [Figure 11] 10 is a flowchart showing a procedure for preparing for alignment. [Figure 12] 10 is a flowchart showing a procedure for alignment and cutting. [Figure 13] 10 is a flowchart showing a procedure for displaying the amount of deviation of an alignment mark. [Figure 14] FIG. 14 is a diagram showing an example of an image displayed on the monitor in step S320 of FIG. [Figure 15] 10 is a flowchart showing a procedure for reviewing manufacturing conditions for electronic components. [Figure 16] FIG. 10 is a diagram illustrating a first example of other information that is additionally displayed. [Figure 17] FIG. 10 is a diagram illustrating a second example of other information that is additionally displayed. [Figure 18] 10A and 10B are diagrams schematically showing examples of other images displayed on the monitor. [Figure 19] FIG. 10 is a diagram schematically illustrating a first other example of a mark whose coordinates are stored in advance in a storage unit. [Figure 20] FIG. 10 is a diagram schematically illustrating a second example of a mark whose coordinates are stored in advance in a storage unit. DETAILED DESCRIPTION OF THE INVENTION

[0010] An embodiment according to one aspect of the present invention (hereinafter also referred to as "the present embodiment") will be described in detail below with reference to the drawings. Note that the same or corresponding parts in the drawings are designated by the same reference numerals, and their description will not be repeated. Furthermore, for ease of understanding, each drawing is drawn schematically with objects appropriately omitted or exaggerated.

[0011] [1. Configuration] <1-1. Configuration of cutting device> FIG. 1 is a plan view schematically showing a cutting apparatus 1 according to the present embodiment. The cutting apparatus 1 is configured to cut a package substrate (an example of an object to be cut) to separate the package substrate into a plurality of electronic components (an example of cut products). In the package substrate, a substrate or lead frame to which a semiconductor chip is fixed is sealed with resin. Note that the object to be cut does not necessarily have to be a package substrate, and may be, for example, a substrate (including a wafer) that is not sealed with resin.

[0012] Examples of package substrates include a BGA (Ball Grid Array) package substrate, an LGA (Land Grid Array) package substrate, a CSP (Chip Size Package) package substrate, an LED (Light Emitting Diode) package substrate, and a QFN (Quad Flat No-leaded) package substrate.

[0013] The cutting device 1 is configured to inspect each of the plurality of individual electronic components. In the cutting device 1, an image of each electronic component is captured and each electronic component is inspected based on the image. Inspection data is generated through the inspection, and each electronic component is classified as either a "good product" or a "defective product."

[0014] In this example, a package substrate P1 is used as the object to be cut, and the package substrate P1 is singulated into a plurality of electronic components S1 by a cutting device 1. Hereinafter, of the two surfaces of the package substrate P1, the resin-sealed surface will be referred to as the mold surface, and the surface opposite the mold surface will be referred to as the ball / lead surface. Note that when the object to be cut is a substrate that is not resin-sealed, the surface facing upward at the time of cutting (cut surface) corresponds to the ball / lead surface in this embodiment, and the surface opposite the cut surface corresponds to the mold surface in this embodiment.

[0015] As shown in FIG. 1, the cutting apparatus 1 includes, as its components, a cutting module A1 and an inspection and storage module B1. The cutting module A1 is configured to manufacture a plurality of electronic components S1 by cutting a package substrate P1. The inspection and storage module B1 is configured to inspect each of the manufactured plurality of electronic components S1 and then store the electronic components S1 in a tray. In the cutting apparatus 1, each component is detachable and replaceable with respect to the other components.

[0016] The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting table 5, a spindle unit 6, and a transport unit .

[0017] The substrate supply unit 3 pushes out the package substrates P1 one by one from a magazine M1 that stores a plurality of package substrates P1, thereby supplying the package substrates P1 one by one to the positioning unit 4. At this time, the package substrate P1 is arranged with the ball / lead surface facing upward.

[0018] The positioning unit 4 positions the package substrate P1 by placing the package substrate P1 pushed out from the substrate supply unit 3 on the rail portion 4a. Thereafter, the positioning unit 4 transports the positioned package substrate P1 to the cutting table 5.

[0019] The cutting table 5 holds the package substrate P to be cut. Here, a cutting device 1 with a twin-cut table configuration having two cutting tables 5 is illustrated. The cutting table 5 includes a holding member 5a, a rotation mechanism 5b, and a movement mechanism 5c. The holding member 5a holds the package substrate P1 transported by the positioning unit 4 by suction from below. The rotation mechanism 5b can rotate the holding member 5a in the θ1 direction in the horizontal plane. The movement mechanism 5c can move the holding member 5a along the Y axis in the figure.

[0020] FIG. 2 is a plan view schematically showing the holding member 5a. FIG. 3 is a view schematically showing the III-III cross section of FIG. 2. Referring to FIGS. 2 and 3, the holding member 5a includes a holding member main body 31 and a jig 32. The holding member main body 31 is a metallic member having a rectangular shape in a plan view. The jig 32 is attached above the holding member main body 31. The package substrate P1 is placed on the jig 32. A space SP1 is formed between the holding member main body 31 and the jig 32 in the Z-axis direction. A suction mechanism (not shown) is connected to the space SP1.

[0021] The jig 32 includes a plate-shaped portion 33 made of metal or resin, and a rubber portion 34. The jig 32 attached to the holding member main body 31 is replaceable. The rubber portion 34 is made of an elastic material such as rubber. The plate-shaped portion 33 and the rubber portion 34 each have a rectangular shape in a plan view. A plurality of protrusions PR1 are formed on the upper surface of the rubber portion 34 so as to be positioned in a matrix. In this example, 18 protrusions PR1 are formed so as to be arranged in 3 rows and 6 columns.

[0022] A hole H1 is formed in each protrusion PR1. Each hole H1 penetrates the rubber portion 34 and the plate-like portion 33. The space outside the holding member 5a is connected to the space SP1 via each hole H1. The package substrate P1 is sucked through each hole H1 by suction using a suction mechanism (not shown) connected to the space SP1. As a result, the package substrate P1 placed on the rubber portion 34 is sucked and held.

[0023] A groove G1 is formed between two adjacent protrusions PR1. As will be described in detail later, the package substrate P1 held by suction on the rubber portion 34 is cut by a blade 6a (described later). When cutting the package substrate P1, the blade 6a is located within the groove G1 and does not come into contact with the rubber portion 34.

[0024] Referring again to FIG. 1, the spindle unit 6 cuts the package substrate P1 to separate the package substrate P1 into a plurality of electronic components S1. Here, a cutting device 1 having a twin-spindle configuration with two spindle units 6 is shown as an example. The spindle units 6 are movable along the X-axis and Z-axis in the figure. However, the cutting device 1 may also have a single-spindle configuration with one spindle unit 6.

[0025] The spindle unit 6 includes a blade 6a and a rotating shaft 6c. The blade 6a cuts the package substrate P1 by rotating at high speed, dividing the package substrate P1 into a plurality of electronic components S1. The blade 6a is attached to the rotating shaft 6c while being sandwiched between first and second flanges (not shown). The first and second flanges are fixed to the rotating shaft 6c by fastening members (not shown), such as nuts.

[0026] The spindle portion 6 is provided with a cutting water nozzle, a cooling water nozzle, a scrap-blowing water nozzle, etc. The cutting water nozzle sprays cutting water toward the blade 6a, which rotates at high speed. The cooling water nozzle sprays cooling water toward the vicinity of the cutting point of the package substrate P1. The scrap-blowing water nozzle sprays scrap-blowing water to blow away cutting chips and the like.

[0027] After the cutting table 5 picks up the package substrate P1, the first position confirmation camera 5d captures an image of the package substrate P1 and confirms the position of the package substrate P1. The confirmation using the first position confirmation camera 5d is, for example, confirmation of the position of an alignment mark AL1 provided on the package substrate P1. The position information of the alignment mark AL1 is used, for example, to determine a cutting line for the package substrate P1.

[0028] FIG. 4 is a diagram schematically illustrating an example of alignment marks AL1 printed on the ball / lead surface of a package substrate P1. As shown in FIG. 4, in this example, multiple alignment marks AL1 are printed on the ball / lead surface of the package substrate P1. In this example, each of the multiple alignment marks AL1 has a cross shape. Note that the alignment marks AL1 do not necessarily have to be cross-shaped, and may have any distinctive (unique) shape. Furthermore, the multiple alignment marks AL1 do not necessarily have to have the same shape.

[0029] 1, once the position of the alignment mark AL1 is confirmed, a cutting line for the package substrate P1 is determined based on the position information of the alignment mark AL1. Based on the determined cutting line, adjustments such as the rotation angle of the rotation mechanism 5b are performed. This series of operations for adjusting the cutting position for the package substrate P1 is also referred to as "alignment." Alignment will be described in detail later.

[0030] The cutting table 5 then moves toward the spindle unit 6 along the Y-axis in the figure. After the cutting table 5 moves below the spindle unit 6, the cutting table 5 and the spindle unit 6 are moved relative to each other to cut the package substrate P1. Thereafter, if necessary, the package substrate P1 is imaged by a second position confirmation camera 6b provided on the spindle unit 6 to confirm the position and other details of the package substrate P1. The confirmation using the second position confirmation camera 6b is, for example, confirmation of the cutting position and cutting width of the package substrate P1.

[0031] After cutting of the package substrate P1 is completed, the cutting table 5 moves away from the spindle unit 6 along the Y axis in the figure while holding the singulated electronic components S1. During this movement, the first cleaner 5e cleans and dries the top surfaces (ball / lead surfaces) of the electronic components S1. This cleaning may be performed, for example, by directly spraying cleaning water onto the top surfaces of the electronic components S1, or by supplying cleaning water to the top surfaces of the electronic components S1 using a brush or the like. Note that, although the cutting device 1 is provided with two first cleaners 5e aligned in the X axis direction in the figure, the number of first cleaners 5e is not limited to this.

[0032] The transport unit 7 picks up the electronic component S1 held on the cutting table 5 from above and transports the electronic component S1 to the inspection table 11 of the inspection and storage module B1. During this transport process, the second cleaner 7a cleans and dries the underside (molded surface) of the electronic component S1. This cleaning may be performed, for example, by directly spraying cleaning water onto the underside of the electronic component S1, or by supplying cleaning water to the underside of the electronic component S1 using a brush or the like.

[0033] The inspection and storage module B1 mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, a placement unit 14, and an extraction unit 15. The first optical inspection camera 12 may be provided in the cutting module A1.

[0034] The inspection table 11 holds the electronic component S1 for optical inspection of the electronic component S1. The inspection table 11 is movable along the X-axis in the figure. The inspection table 11 can also be turned upside down. The inspection table 11 is provided with a holding member that holds the electronic component S1 by suction.

[0035] The first optical inspection camera 12 and the second optical inspection camera 13 capture images of both surfaces (ball / lead surface and mold surface) of the electronic component S1. Various inspections of the electronic component S1 are performed based on the captured images (image data) generated by the first optical inspection camera 12 and the second optical inspection camera 13. The first optical inspection camera 12 and the second optical inspection camera 13 are each positioned near the inspection table 11 so as to capture images above.

[0036] The first optical inspection camera 12 captures an image of the mold surface of the electronic component S1 being transported to the inspection table 11 by the transport unit 7. The transport unit 7 then places the electronic component S1 on a holding member of the inspection table 11. After the holding member picks up the electronic component S1, the inspection table 11 is turned upside down. The inspection table 11 moves above the second optical inspection camera 13, and the ball / lead surface of the electronic component S1 is imaged by the second optical inspection camera 13.

[0037] An inspected electronic component S1 is placed on the placement unit 14. The placement unit 14 is movable along the Y axis in the drawing. The inspection table 11 places the inspected electronic component S1 on the placement unit 14.

[0038] The extraction unit 15 transfers the electronic components S1 placed in the placement unit 14 to a tray. The electronic components S1 are sorted into "good products" or "defective products" based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13. The extraction unit 15 transfers each electronic component S1 to a good product tray 15a or a defective product tray 15b based on the results of the sorting. That is, good products are stored in the good product tray 15a, and defective products are stored in the defective product tray 15b. When the good product tray 15a and the defective product tray 15b are each filled with electronic components S1, they are replaced with new trays.

[0039] The cutting device 1 further includes a computer 50 and a monitor 20. The monitor 20 is configured to display an image. The monitor 20 is configured with a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor, for example.

[0040] The computer 50 controls the operation of each part of the cutting module A1 and the inspection and storage module B1, for example, the board supply unit 3, the positioning unit 4, the cutting table 5, the spindle unit 6, the transport unit 7, the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the placement unit 14, the extraction unit 15, and the monitor 20.

[0041] <1-2. Computer hardware configuration> Fig. 5 is a diagram schematically illustrating the hardware configuration of computer 50. As shown in Fig. 5, computer 50 includes a control unit 70, an input / output I / F (interface) 90, an input unit 95, and a storage unit 80, and each component is electrically connected via a bus.

[0042] The control unit 70 includes a CPU (Central Processing Unit) 72, a RAM (Random Access Memory) 74, and a ROM (Read Only Memory) 76. The control unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 in accordance with information processing.

[0043] The input / output I / F 90 is configured to communicate with each component included in the cutting device 1 via a signal line. The input / output I / F 90 is used to transmit data from the computer 50 to each component in the cutting device 1 and to receive data transmitted from each component in the cutting device 1 to the computer 50. The input unit 95 is configured to receive instructions from a user (operator). The input unit 95 is configured, for example, with some or all of a touch panel, a keyboard, a mouse, and a microphone.

[0044] The storage unit 80 is configured, for example, as an auxiliary storage device such as a hard disk drive or a solid state drive. The storage unit 80 is configured, for example, to store a control program 81. The control program 81 is executed by the control unit 70 to realize various operations in the cutting device 1. When the control unit 70 executes the control program 81, the control program 81 is loaded into the RAM 74. The control unit 70 then controls each component by having the CPU 72 interpret and execute the control program 81 loaded into the RAM 74.

[0045] [2. Alignment Overview] As described above, in the cutting apparatus 1, alignment is performed before the package substrate P1 is cut by the spindle unit 6. Typically, the shapes of the multiple package substrates P1 prepared for manufacturing the electronic components S1 are not completely identical. For example, the degree of warping of each package substrate P1 varies slightly. From the perspective of preventing deterioration in the quality of the manufactured electronic components S1, the cutting line for the package substrate P1 should be adjusted according to the degree of warping of the package substrate P1. Therefore, in the cutting apparatus 1, alignment is performed before the package substrate P1 is cut by the spindle unit 6. Next, an overview of alignment will be described.

[0046] In the cutting apparatus 1, the shape and coordinates of the alignment mark AL1 used for alignment are registered in advance. The pre-registered coordinates of the alignment mark AL1 are used as a reference for alignment. The shape and coordinates of the alignment mark AL1 are registered, for example, by an operator of the cutting apparatus 1 (hereinafter simply referred to as "operator"). Information indicating the shape and coordinates of the alignment mark AL1 is stored in advance in the memory unit 80 of the computer 50.

[0047] 6 is a diagram schematically illustrating an example of alignment marks AL1 used for alignment when cutting the package substrate P1 along the longitudinal direction (hereinafter also referred to as "first alignment"). Referring to FIG. 6, in this example, a plurality of alignment marks AL1 corresponding to three cutting lines CL1 extending in the longitudinal direction are used as a reference for the first alignment.

[0048] FIG. 7 is a diagram schematically illustrating a data table TB1 that manages data used in the first alignment. Referring to FIG. 7, the data table TB1 manages shape information and coordinate information of each alignment mark AL1 that is used as a reference during the first alignment. The shape information and coordinate information of each alignment mark AL1 are generated based on the shape and coordinates of the alignment mark AL1 registered by the operator. In the data table TB1, a unique number (No.) is assigned to each alignment mark AL1, and the shape, X coordinate value, and Y coordinate value of the alignment mark AL1 are associated with each number. The data table TB1 is stored in the storage unit 80 of the computer 50.

[0049] 8 is a diagram schematically illustrating an example of alignment marks AL1 used for alignment when cutting the package substrate P1 along the short-side direction (hereinafter also referred to as "second alignment"). Referring to FIG. 8, in this example, a plurality of alignment marks AL1 corresponding to three cutting lines CL1 extending in the short-side direction are used as a reference for the second alignment.

[0050] 9 is a diagram schematically illustrating a data table TB2 that manages data used in the second alignment. Referring to FIG. 9, the data table TB2 manages shape information and coordinate information of each alignment mark AL1 that is used as a reference during the second alignment. The shape information and coordinate information of each alignment mark AL1 are generated based on the shape and coordinates of the alignment mark AL1 registered by the operator. In the data table TB2, a unique number (No.) is assigned to each alignment mark AL1, and the shape, X coordinate value, and Y coordinate value of the alignment mark AL1 are associated with each number. The data table TB2 is stored in the memory unit 80 of the computer 50.

[0051] In the cutting apparatus 1, a range for searching for the alignment mark AL1 during the first alignment (hereinafter also referred to as the "first search range") is determined in advance based on the coordinate information managed in the data table TB1. The first search range is, for example, made up of a plurality of search ranges. The first search range is, for example, made up of a plurality of search ranges centered on the coordinates of each alignment mark AL1 managed in the data table TB1.

[0052] Furthermore, in the cutting apparatus 1, a range for searching for the alignment mark AL1 during the second alignment (hereinafter also referred to as the "second search range") is determined in advance based on the coordinate information managed in the data table TB2. The second search range is, for example, made up of a plurality of search ranges. The second search range is, for example, made up of a plurality of search ranges centered on the coordinates of each alignment mark AL1 managed in the data table TB2.

[0053] The first alignment is performed by having the first position confirmation camera 5d capture an image of the package substrate P1 with the longitudinal direction of the package substrate P1 aligned with the Y-axis. Specifically, a search is performed within a first search range for the image captured by the first position confirmation camera 5d, and the coordinates of each alignment mark AL1 are detected and stored. Based on the coordinates of each alignment mark AL1, the amount of deviation is calculated as described below, and a cutting line for the package substrate P1 is determined. Thereafter, the angle of the rotation mechanism 5b and the position of the blade 6a are adjusted so that cutting is performed along the determined cutting line. The first alignment is performed in this manner.

[0054] Furthermore, the first position confirmation camera 5d captures an image of the package substrate P1 with the short side direction of the package substrate P1 aligned with the Y axis, thereby performing second alignment. Specifically, a search is performed within a second search range for the image captured by the first position confirmation camera 5d, and the coordinates of each alignment mark AL1 are detected and stored. Based on the coordinates of each alignment mark AL1, the amount of deviation is calculated as described below, and a cutting line for the package substrate P1 is determined. Thereafter, the angle of the rotation mechanism 5b and the position of the blade 6a are adjusted so that cutting is performed along the determined cutting line. The second alignment is performed in this manner.

[0055] In this way, in the cutting device 1, alignment is performed before the package substrate P1 is cut by the spindle unit 6. Therefore, the cutting device 1 can appropriately cut the package substrate P1 according to the degree of warping of each package substrate P1, etc.

[0056] [3.Alignment mark deviation display function] For example, there are cases where the quality (e.g., cutting quality) of the electronic component S1 manufactured through the above-described alignment is insufficient. Also, there are cases where further improvement in the quality of the manufactured electronic component S1 is desired. In such cases, it is convenient if the cutting device 1 provides the operator with information that contributes to improving the quality of the manufactured electronic component S1.

[0057] In the cutting device 1, during the first alignment, for each alignment mark AL1 detected through imaging by the first position confirmation camera 5d, the amount of deviation of the coordinates compared with the corresponding alignment mark AL1 among the multiple reference alignment marks AL1 managed in the data table TB1 is calculated, and the calculation result is stored in the storage unit 80. Also, during the second alignment, for each alignment mark AL1 detected through imaging by the first position confirmation camera 5d, the amount of deviation of the coordinates compared with the corresponding alignment mark AL1 among the multiple reference alignment marks AL1 managed in the data table TB2 is calculated, and the calculation result is stored in the storage unit 80.

[0058] For example, the misalignment amount calculated through each alignment correlates with the degree of warpage of the package substrate P1. For example, if the quality of the manufactured electronic component S1 is insufficient, checking the misalignment amount related to the package substrate P1 used to manufacture the electronic component S1 may reveal that the cause of the insufficient quality of the electronic component S1 is the degree of warpage of the package substrate P1. Once the cause is identified, it can be eliminated to improve the quality of the electronic component S1. In other words, the misalignment amount calculated through each alignment can be considered information that contributes to improving the quality of the electronic component S1.

[0059] The cutting device 1 is provided with a function for displaying the amount of misalignment of alignment marks. The misalignment amount display function is a function for displaying the amount of misalignment calculated through each alignment on the monitor 20. For example, the amount of misalignment related to a package substrate P1 selected by an operator from among the multiple package substrates P1 cut by the cutting device 1 is displayed on the monitor 20.

[0060] 10 is a diagram schematically illustrating an example of an image IM1 showing the amount of deviation in the X-axis direction calculated through the first alignment (shown as "X-axis offset" in FIG. 14, which will be described later). Referring to FIG. 10, image IM1 includes deviation amount information MA1, MA2, and MA3. Image IM1 is displayed on monitor 20, for example.

[0061] The deviation amount information MA1 indicates the deviation amount of each alignment mark AL1 corresponding to the left cutting line CL1 (FIG. 6). The deviation amount information MA1 is formed by connecting and grouping multiple deviation amounts MP1. The length between each deviation amount MP1 included in the deviation amount information MA1 and the reference line SL1 on the left side of the figure indicates the deviation amount of each alignment mark AL1 in the X-axis direction.

[0062] The deviation amount information MA2 indicates the deviation amount of each alignment mark AL1 corresponding to the central cutting line CL1 (FIG. 6). The deviation amount information MA2 is formed by connecting and grouping multiple deviation amounts MP1. The length between each deviation amount MP1 included in the deviation amount information MA2 and the central reference line SL1 in the figure indicates the deviation amount of each alignment mark AL1 in the X-axis direction.

[0063] The deviation amount information MA3 indicates the deviation amount of each alignment mark AL1 corresponding to the right-side cutting line CL1 (FIG. 6). The deviation amount information MA3 is formed by connecting and grouping multiple deviation amounts MP1. The length between each deviation amount MP1 included in the deviation amount information MA3 and the reference line SL1 on the right side in the drawing indicates the deviation amount of each alignment mark AL1 in the X-axis direction. Note that each reference line SL1 may or may not be displayed on the monitor 20.

[0064] In this way, the cutting device 1 displays, for each of the alignment marks AL1 captured by the first position confirmation camera 5d, the amount of coordinate deviation (specifically, the amount of deviation in the X-axis direction) compared to the corresponding alignment mark AL1 among the reference alignment marks AL1 stored in the memory unit 80. By checking the amount of deviation for each displayed coordinate, the operator can recognize, for example, the degree of warpage of the package substrate P1. Because the degree of warpage of the package substrate P1 is related to the quality of the electronic component S1, the amount of deviation for each coordinate can be considered information that contributes to improving the quality of the electronic component S1. Therefore, according to the cutting device 1, by displaying the amount of deviation for each alignment mark AL1 on the monitor 20, the operator can be provided with information that contributes to improving the quality of the electronic component S1 to be manufactured.

[0065] Furthermore, in the cutting device 1, the amount of misalignment of the alignment marks AL1 captured by the first position confirmation camera 5d is displayed in groups (specifically, in groups of alignment marks AL1 for each cutting line). By checking the amount of misalignment displayed in groups, the operator can more easily recognize, for example, the degree of warpage of the electronic component S1. Therefore, according to the cutting device 1, by displaying each amount of misalignment in groups on the monitor 20, it is possible to provide the operator with information that contributes to improving the quality of the electronic component S1 to be manufactured.

[0066] [4. Operation] <4-1. Preparatory operations for alignment> 11 is a flowchart showing the alignment preparation procedure. The processing shown in this flowchart is executed, for example, by the control unit 70 of the computer 50. Note that here, a case will be described in which all alignment marks AL1 of one package substrate P1 have the same shape. If some or all of the alignment marks AL1 in one package substrate P1 are different, alignment preparation operations can be performed for each alignment mark AL1. Since the preparation procedures for the first alignment and the second alignment are substantially the same, the preparation procedure for the first alignment will be described here.

[0067] 11, the control unit 70 executes a registration process for each alignment mark AL1 used in the first alignment (step S100). For this registration process, for example, a package substrate P1 selected by an operator is placed on the holding member 5a so that its longitudinal direction is aligned with the Y-axis direction. The package substrate P1 placed on the holding member 5a is imaged by the first position confirmation camera 5d. For example, multiple alignment marks AL1 are detected based on the image captured by the first position confirmation camera 5d, and the operator selects a reference alignment mark AL1 from the detected multiple alignment marks AL1. This selection is performed, for example, via the input unit 95 of the computer 50. The image and coordinates of each selected reference alignment mark AL1 are stored in the storage unit 80. This completes the registration process.

[0068] After the registration process is completed, the control unit 70 sets an area (imaging area) to be imaged by the first position confirmation camera 5d in the first alignment (step S110). In step S110, for example, a plurality of imaging areas are set. The plurality of imaging areas set in step S110 correspond to the plurality of search ranges included in the first search range described above. Information about the set imaging areas is stored in the storage unit 80. This completes preparation for the first alignment.

[0069] <4-2. Alignment and cutting operation> 12 is a flowchart showing the alignment and cutting procedures. The processing shown in this flowchart is executed by the control unit 70 of the computer 50, for example, when the package substrate P1 held by the holding member 5a is positioned below the first position confirmation camera 5d. Note that the procedures for the first alignment and the second alignment are substantially the same, so the procedures for the first alignment and cutting will be described here.

[0070] 12, the control unit 70 controls the first position confirmation camera 5d to capture an image of an unimaged imaging area among the multiple imaging areas set in step S110 of Fig. 11 (step S200). The control unit 70 detects an alignment mark AL1 included in the image captured by the first position confirmation camera 5d and obtains coordinate information of the detected alignment mark AL1 (step S210). The control unit 70 calculates the amount of deviation (sometimes simply referred to as "deviation amount") of the detected alignment mark AL1 in the X-axis direction and stores the calculated amount of deviation in the storage unit 80 (step S220).

[0071] The control unit 70 determines whether or not imaging has been completed for all of the multiple imaging regions set in step S110 of Fig. 11 (step S230). If it is determined that imaging has not been completed (NO in step S230), the control unit 70 executes the process of step S200 again.

[0072] On the other hand, if it is determined in step S230 that the imaging is completed (YES in step S230), the control unit 70 calculates multiple (three in this example) cutting lines based on the coordinate information of each of the detected multiple alignment marks AL1 (step S240).

[0073] The control unit 70 determines whether it is possible to correct the relative positional relationship between the cutting table 5 and the blade 6a so that cutting is performed along the calculated cutting line (step S250). If it is determined that the relative positional relationship cannot be corrected (NO in step S250), cutting of the package substrate P1 is not performed, and the process shown in this flowchart ends. For example, it is determined that the relative positional relationship cannot be corrected if the blade 6a comes into contact with the protrusion PR1 (FIG. 3) of the rubber portion 34 no matter how the rotation angle of the rotation mechanism 5b and the position of the blade 6a are adjusted.

[0074] On the other hand, if it is determined that the positional relationship can be corrected (YES in step S250), the control unit 70 corrects the relative positional relationship between the cutting table 5 and the spindle unit 6 so that cutting is performed along the cutting line calculated in step S240 (step S260). Thereafter, the control unit 70 controls the cutting table 5 and the spindle unit 6 so as to cut the package substrate P1 (step S270).

[0075] <4-3. Display of alignment mark deviation amount> 13 is a flowchart showing a procedure for displaying the amount of deviation of the alignment mark AL1. The process shown in this flowchart is executed by the control unit 70 of the computer 50, for example, when the operator activates the deviation amount display function.

[0076] 13, the control unit 70 determines whether the package substrate P1, which is the target for displaying the amount of deviation of the alignment mark AL1, has been selected by the operator (step S300). If it is determined that the package substrate P1 has not been selected (NO in step S300), the control unit 70 waits until the package substrate P1 is selected.

[0077] On the other hand, if it is determined that the package substrate P1 has been selected (YES in step S300), the control unit 70 reads out the misalignment amounts of the alignment marks AL1 of the selected package substrate P1 from the storage unit 80 (step S310). The control unit 70 controls the monitor 20 to display the read-out misalignment amounts (step S320).

[0078] Fig. 14 is a diagram showing an example of an image displayed on monitor 20 in step S320 of Fig. 13. As shown in Fig. 14, this image includes display areas 21, 22, 23, 24, 25, and 26. Display area 21 displays information identifying package substrate P1 selected by the operator. Display area 22 displays an image showing the coordinates of each alignment mark AL1 that serves as a reference in the first alignment. Display area 23 displays an image showing the coordinates of each alignment mark AL1 that serves as a reference in the second alignment.

[0079] Display area 24 displays deviation amount information generated based on the deviation amount calculated in the first alignment. Display area 25 displays deviation amount information generated based on the deviation amount calculated in the second alignment. The scale of the graphs displayed in each of display areas 24 and 25 is adjusted so that each deviation amount can be easily visually recognized. Each of display areas 24 and 25 may also display each reference line SL1 (FIG. 10). Display area 26 displays coordinate information of each alignment mark AL1 displayed in the display area selected by cursor CS1 (display area 22 or display area 23). For ease of understanding, the coordinate information of each alignment mark AL1 in display area 26 may be displayed in a separate table by group (specifically, by group of alignment marks AL1 for each cutting line).

[0080] In this way, the cutting device 1 displays, for each of the plurality of alignment marks AL1 captured by the first position confirmation camera 5d, the amount of coordinate deviation (specifically, the amount of deviation in the X-axis direction) compared with the corresponding alignment mark AL1 among the plurality of reference alignment marks AL1 stored in the storage unit 80. By displaying the amount of deviation of each alignment mark AL1 on the monitor 20, the cutting device 1 can provide the operator with information that contributes to improving the quality of the electronic component S1 to be manufactured.

[0081] <4-4. Review of manufacturing conditions> 15 is a flowchart showing the procedure for reviewing the manufacturing conditions for electronic component S1. The steps shown in this flowchart are performed by an operator.

[0082] 15, the operator checks the misalignment amount information displayed on the monitor 20 (step S400). The operator changes the setting of the cutting rule for the package substrate P1 based on the misalignment amount information displayed on the monitor 20 (step S410). Examples of the cutting rule include the number of alignment marks AL1 used during alignment and a calculation algorithm for the cutting line. The operator again manufactures the electronic component S1 using the cutting apparatus 1 with the changed setting of the cutting rule (step S420).

[0083] In this manner, in the manufacturing method for electronic component S1, the setting of the cutting rule is changed based on the amount of deviation of alignment mark AL1 displayed on monitor 20. Therefore, according to this manufacturing method for electronic component S1, the quality of the manufactured electronic component S1 can be improved by reviewing the cutting rule.

[0084] [5. Features] As described above, in the cutting apparatus 1 according to the present embodiment, for each of the alignment marks AL1 captured by the first position confirmation camera 5d, the amount of deviation of the coordinates compared to the corresponding alignment mark AL1 among the reference alignment marks AL1 stored in the memory unit 80 is displayed. By checking the deviation of each displayed coordinate, the operator can recognize, for example, the degree of warpage of the package substrate P1. Because the degree of warpage of the package substrate P1 is related to the quality of the electronic component S1, the deviation of each coordinate can be considered information that contributes to improving the quality of the electronic component S1. Therefore, according to the cutting apparatus 1, by displaying the deviation of each alignment mark AL1 on the monitor 20, the operator can be provided with information that contributes to improving the quality of the electronic component S1 to be manufactured.

[0085] The cutting device 1 is an example of a "cutting device" in the present invention. The cutting table 5 is an example of a "table" in the present invention. The spindle unit 6 is an example of a "cutting mechanism" in the present invention. The first position confirmation camera 5d is an example of an "imaging device" in the present invention. The memory unit 80 is an example of a "memory unit" in the present invention. The monitor 20 is an example of a "display unit" in the present invention. The input unit 95 is an example of an "input unit" in the present invention. The jig 32 is an example of a "holding tool" in the present invention.

[0086] 6. Other Embodiments The concept of the above embodiment is not limited to the embodiment described above. An example of another embodiment to which the concept of the above embodiment can be applied will be described below.

[0087] <6-1> In the above embodiment, the misalignment amounts of the multiple alignment marks AL1 for the package substrate P1 selected by the operator are displayed on the monitor 20 as misalignment amount information (misalignment amount information MA1, MA2, MA3) in groups corresponding to the respective cutting lines CL1. However, the multiple misalignment amounts do not necessarily have to be displayed in groups. For example, in each of the misalignment amount information MA1, MA2, MA3, multiple misalignment amounts MP1 may be displayed on the monitor 20 without being connected by a line.

[0088] <6-2> For example, only the deviation amount information of the alignment mark AL1 is displayed in each of the display areas 24 and 25 in Fig. 14. However, for example, each of the display areas 24 and 25 may additionally display other information.

[0089] 16 is a diagram illustrating a first example of other information that is additionally displayed. Referring to FIG. 16, for example, in addition to the misalignment amount information MA1, MA2, and MA3, cutting lines CL11, CL12, and CL13 and a reference line SL1 may be displayed on the monitor 20. Each of the cutting lines CL11, CL12, and CL13 indicates a cutting line that was actually used to cut the package substrate P1. By referring to the cutting lines CL11, CL12, and CL13, the operator can examine the relationship between each cutting line and the quality of the electronic component S1.

[0090] FIG. 17 is a diagram illustrating a second example of additional information to be displayed. Referring to FIG. 17, for example, cutting line candidates CL21, CL22, and CL23 may be displayed on the monitor 20 in addition to the example shown in FIG. 16. Each of the cutting line candidates CL21, CL22, and CL23 is calculated using an algorithm different from the algorithm used to calculate each of the cutting lines CL11, CL12, and CL13. Examples of the algorithm include an algorithm that uses an average value of deviation amounts and an algorithm that uses the least squares method. By referring to the cutting line candidates CL21, CL22, and CL23, the operator can consider adopting other cutting line candidates. Note that multiple cutting line candidates may be displayed for each cutting line.

[0091] <6-3> Fig. 18 is a diagram schematically showing an example of another image displayed on monitor 20. Referring to Fig. 18, this image includes display areas 27, 28, and 29. In display area 27, for example, the image of display area 25 in Fig. 14 is displayed. For example, the image shown in Fig. 18 is displayed on monitor 20 when display area 25 is selected with the image of Fig. 14 displayed on monitor 20. For example, when display area 24 is selected with the image of Fig. 14 displayed on monitor 20, the image of display area 24 in Fig. 14 may be displayed in display area 27.

[0092] A plurality of selection items are displayed in the display area 28, and each selection item is associated with one of the plurality of pieces of deviation amount information displayed in the display area 27. In this example, the selection item displayed as "COL1" is associated with the deviation amount information on the left. The selection item displayed as "COL2" is associated with the deviation amount information in the center. The selection item displayed as "COL3" is associated with the deviation amount information on the right. In this example, "COL1" is selected.

[0093] The display area 29 displays deviation amount information corresponding to the item selected in the display area 28. In addition to the deviation amount information MA1, the display area 29 also displays the cutting line CL1, blade position information BL1 (specifically, the blade width is displayed by two straight lines), and rubber position information RA1. The blade position information BL1 is information indicating the position of the blade 6a when cutting along the cutting line CL1. In this example, the blade 6a is positioned within the groove G1. The rubber position information RA1 is information indicating the position of the protrusion PR1 when cutting along the cutting line CL1. Note that the display area 29 displays the positional relationship between the blade 6a and the protrusion PR1 when the inclination of the cutting line CL1 has been corrected. The inclination of the deviation amount information MA1 has also been corrected in accordance with the correction of the inclination of the cutting line CL1.

[0094] Thus, in this cutting device 1, in addition to the cutting line, the blade position information BL1 and the rubber position information RA1 are also displayed on the monitor 20. Therefore, this cutting device 1 can provide the operator with information indicating the positional relationship between the cutting line, the protrusion PR1 of the rubber portion 34, and the blade 6a. For example, if the production of the electronic component S1 has been stopped and the blade position information BL1 and the rubber position information RA1 overlap, the operator can recognize that the production of the electronic component S1 has been stopped because continuing the production of the electronic component S1 would cause the blade 6a to come into contact with the protrusion PR1.

[0095] <6-4> In the above embodiment, the coordinates of the reference alignment mark AL1 are stored in advance in the storage unit 80, and the amount of deviation between the coordinates of the alignment mark AL1 captured by the first position confirmation camera 5d and the coordinates of the reference alignment mark AL1 is calculated. The calculated amount of deviation is displayed on the monitor 20, allowing the extent to which the package substrate P1 captured by the first position confirmation camera 5d is deviated from the reference package substrate P1 to be determined. However, the reference for checking the deviation between the package substrates P1 is not limited to the alignment mark AL1. Below, the information used as the reference will be described in order.

[0096] (6-4-1) FIG. 19 is a diagram schematically illustrating another example of a mark whose coordinates are pre-stored in the storage unit 80. Referring to FIG. 19, the mark MK1 indicates a portion of the cut package substrate P1 where two vertical and horizontal cut grooves CG1 intersect (an example of a characteristic portion of the cut package substrate P1). For example, the coordinates of the reference mark MK1 may be pre-stored in the storage unit 80, and the amount of deviation between the coordinates of the mark MK1 detected in an image captured by the second position confirmation camera 6b and the coordinates of the reference mark MK1 may be displayed on the monitor 20. This allows the operator to recognize the amount of deviation caused by cutting the package substrate P1. Furthermore, for example, by checking how the amount of deviation changes for each cutting rule, a cutting rule that minimizes the amount of deviation can be found.

[0097] (6-4-2) 20 is a diagram schematically illustrating a second example of a mark whose coordinates are stored in advance in the memory unit 80. Referring to FIG. 20, the inner mark IN1 is printed, for example, on the mold surface of the electronic component S1. For example, the coordinates of the reference inner mark IN1 may be stored in advance in the memory unit 80, and the amount of deviation between the coordinates of the inner mark IN1 detected in an image captured by the second position confirmation camera 6b and the coordinates of the reference inner mark IN1 may be displayed on the monitor 20. This allows the operator to recognize the amount of deviation of the inner mark IN1 for each electronic component S1.

[0098] The above describes exemplary embodiments of the present invention. That is, the detailed description and the accompanying drawings are disclosed for the purpose of illustrative explanation. Therefore, some of the components described in the detailed description and the accompanying drawings may be non-essential components for solving the problems. Therefore, just because these non-essential components are described in the detailed description and the accompanying drawings, it should not be immediately recognized that these non-essential components are essential.

[0099] Furthermore, the above-described embodiment is merely an example of the present invention in all respects. Various improvements and modifications can be made to the above-described embodiment within the scope of the present invention. In other words, when implementing the present invention, specific configurations can be appropriately adopted depending on the embodiment.

[0100] [6. Notes] This specification discloses various technical ideas including at least the following techniques.

[0101] <Technology 1> (composition) A cutting device for cutting an object to be cut, a table for holding the object to be cut; a cutting mechanism that cuts the object held on the table; an imaging device that images the object to be cut held on the table, the object to be cut includes a plurality of marks formed in an image capture area of ​​the image capture device, The cutting device is a storage unit that stores images and coordinates of each of the plurality of reference marks; a display unit that displays, for each of the plurality of marks captured by the imaging device, the amount of deviation in coordinates compared to a corresponding mark among the plurality of reference marks stored in the memory unit.

[0102] (Effects, etc.) In this cutting device, for each of a plurality of marks captured by the imaging device, the amount of deviation of the coordinates compared to a corresponding mark among a plurality of reference marks stored in a memory unit is displayed. By checking the amount of deviation of each displayed coordinate, an operator of the cutting device can recognize, for example, the degree of warping of the object to be cut. Because the degree of warping of the object to be cut is related to the quality of the cut product, the amount of deviation of each coordinate can be said to be information that contributes to improving the quality of the cut product. Therefore, according to this cutting device, by displaying the amount of deviation of each coordinate on the display unit, it is possible to provide the operator with information that contributes to improving the quality of the cut products to be manufactured.

[0103] <Technology 2> (composition) the plurality of marks are configured by a plurality of groups, each of the plurality of groups is associated with a cutting line of the object to be cut by the cutting mechanism; The cutting device according to Technology 1, wherein the display unit displays the amount of deviation of the coordinates for each of the plurality of groups.

[0104] (Effects, etc.) In this cutting device, the deviation amount of the coordinates of each mark captured by the imaging device is displayed in groups. By checking the deviation amount of the coordinates displayed in groups, the operator can more easily recognize, for example, the degree of warping of the object to be cut. Therefore, according to this cutting device, by displaying the deviation amount of each coordinate on the display unit in groups, it is possible to provide the operator with information that contributes to improving the quality of the cut products to be manufactured.

[0105] <Technology 3> (composition) a control unit that determines the cutting line for each of the plurality of groups based on coordinates of each of the plurality of marks captured by the imaging device, The cutting device according to technology 2, wherein the display unit further displays the cutting line determined by the control unit.

[0106] (Effects, etc.) In this cutting device, the cutting line determined by the control unit is further displayed. The operator can check the cutting line of the object to be cut by visually checking the display unit. The cutting line of the object to be cut can be said to be information that contributes to improving the quality of the cut product. Therefore, according to this cutting device, by further displaying the cutting line on the display unit, it is possible to provide the operator with information that contributes to improving the quality of the cut products to be manufactured.

[0107] <Technology 4> (composition) the control unit determines one or more cutting line candidates corresponding to the cutting line based on coordinates of each of the plurality of marks captured by the imaging device; The cutting device according to technique 3, wherein the display unit further displays the one or more candidate cutting lines determined by the control unit.

[0108] (Effects, etc.) In this cutting device, one or more candidate cutting lines determined by the control unit are further displayed. The operator can check the one or more candidate cutting lines by visually checking the display unit. The candidate cutting lines can be said to be information that contributes to improving the quality of the cut products. Therefore, according to this cutting device, by further displaying the candidate cutting lines on the display unit, it is possible to provide the operator with information that contributes to improving the quality of the cut products to be manufactured.

[0109] <Technology 5> (composition) the storage unit stores, for each of a plurality of cutting objects, the amount of deviation of the coordinates for each of the plurality of marks; the cutting device further includes an input unit that receives an input for selecting one of the plurality of objects to be cut, The cutting device according to any one of Techniques 1 to 4, wherein the display unit displays the amount of deviation of the coordinates related to the object to be cut selected via the input unit.

[0110] (Effects, etc.) In this cutting device, the amount of deviation of the coordinates of each mark related to the object to be cut selected by the operator is displayed, and therefore, this cutting device can provide the operator with information indicating the amount of deviation of the coordinates of each mark related to the object to be cut selected by the operator.

[0111] <Technology 6> (composition) the object to be cut is a package substrate, The cutting device according to any one of Technology 1 to Technology 5, wherein each of the plurality of marks is an alignment mark provided on the package substrate, a characteristic part in appearance of the package substrate after cutting, or an inner mark provided on an electronic component that is separated by cutting the package substrate.

[0112] <Technology 7> (composition) the table includes a holder for holding the object to be cut, the cutting mechanism cuts the object to be cut by a blade, The cutting device according to any one of techniques 3 to 6, wherein the display unit further displays the holder and the blade.

[0113] (Effects, etc.) In this cutting device, in addition to the cutting line, the holder and the blade are also displayed, so that the cutting device can provide the operator with information indicating the positional relationship between the cutting line, the holder, and the blade.

[0114] <Technology 8> (composition) A method for manufacturing a cut product using the cutting device according to any one of techniques 1 to 7, the cutting mechanism cuts the object in accordance with a preset cutting rule; displaying the amount of deviation of the coordinates for each of the plurality of marks captured by the imaging device; changing the setting of the cutting rule based on the deviation amount of the displayed coordinates; and manufacturing the cut product by cutting the object in accordance with the changed cutting rule.

[0115] (Effects, etc.) In this method for manufacturing cut products, the setting of the cutting rule is changed based on the deviation amount of the displayed coordinates. Therefore, according to this method for manufacturing cut products, the quality of the manufactured cut products can be improved by reviewing the cutting rule. [Explanation of symbols]

[0116] 1 Cutting device, 3 Substrate supply unit, 4 Positioning unit, 4a Rail unit, 5 Cutting table, 5a Holding member, 5b Rotation mechanism, 5c Moving mechanism, 5d First position confirmation camera, 5e First cleaner, 6 Spindle unit, 6a Blade, 6b Second position confirmation camera, 6c Rotation axis, 7 Conveying unit, 7a Second cleaner, 11 Inspection table, 12 First optical inspection camera, 13 Second optical inspection camera, 14 Placement unit, 15 Extraction unit, 15a Tray for good products, 15b Tray for defective products, 20 Monitor, 21, 22, 23, 24, 25, 26, 27, 28, 29 Display area, 31 Holding member body, 32 Jig, 33 Plate-shaped unit, 34 Rubber unit, 50 Computer, 70 Control unit, 72 CPU, 74 RAM, 76 ROM, 80 Memory unit, 81 Control program, 90 input / output I / F, 95 input section, A1 cutting module, AL1 alignment mark, B1 inspection and storage module, BL1 blade position information, CG1 cut groove, CL1, CL11, CL12, CL13 cutting line, CL21, CL22, CL23 cutting line candidate, CS1 cursor, G1 groove, H1 hole, IM1 image, IN1 inner mark, M1 magazine, MA1, MA2, MA3 deviation amount information, MK1 mark, MP1 deviation amount, P1 package board, PR1 protrusion, RA1 rubber position information, S1 electronic component, SL1 reference line, SP1 space, TB1, TB2 data table.

Claims

1. A cutting device for cutting an object to be cut, a table for holding the object to be cut; a cutting mechanism that cuts the object held on the table; an imaging device that images the object to be cut held on the table, the object to be cut includes a plurality of marks formed in an image capture area of ​​the image capture device, The cutting device is a storage unit that stores coordinates of each of the plurality of reference marks; a display unit that displays, for each of the plurality of marks captured by the imaging device, a deviation amount of coordinates compared with a corresponding mark among the plurality of reference marks stored in the storage unit, the plurality of marks are configured by a plurality of groups, each of the plurality of groups is associated with a cutting line of the object to be cut by the cutting mechanism; The display unit displays the amount of deviation of the coordinates for each of the plurality of groups.

2. A cutting device for cutting an object to be cut, a table for holding the object to be cut; a cutting mechanism that cuts the object held on the table; an imaging device that images the object to be cut held on the table, the object to be cut includes a plurality of marks formed in an image capture area of ​​the image capture device, The cutting device is a storage unit that stores coordinates of each of the plurality of reference marks; a display unit that displays, for each of the plurality of marks captured by the imaging device, a deviation amount of coordinates compared with a corresponding mark among the plurality of reference marks stored in the storage unit, the storage unit stores, for each of a plurality of cutting objects, the amount of deviation of the coordinates for each of the plurality of marks; the cutting device further includes an input unit that receives an input for selecting one of the plurality of objects to be cut, The display unit displays the amount of deviation of the coordinates related to the object to be cut selected via the input unit.

3. a control unit that determines the cutting line based on the coordinates of each of the plurality of marks captured by the imaging device, The cutting device according to claim 1 , wherein the display unit further displays the cutting line determined by the control unit.

4. the control unit determines one or more cutting line candidates corresponding to the cutting line based on coordinates of each of the plurality of marks captured by the imaging device; The cutting device according to claim 3 , wherein the display unit further displays the one or more candidates for the cutting line determined by the control unit.

5. the object to be cut is a package substrate, 5. The cutting device according to claim 1, wherein each of the plurality of marks is an alignment mark provided on the package substrate, a distinctive external part of the package substrate after cutting, or an inner mark provided on an electronic component that has been separated by cutting the package substrate.

6. the table includes a holder for holding the object to be cut, the cutting mechanism cuts the object to be cut with a blade; The cutting device according to claim 3 or 4, wherein the display unit further displays the holder and the blade.

7. A method for manufacturing a cut product using a cutting device that cuts an object to be cut, The cutting device is a table for holding the object to be cut; a cutting mechanism that cuts the object held on the table; an imaging device that images the object to be cut held on the table, the object to be cut includes a plurality of marks formed in an image capture area of ​​the image capture device, The cutting device is a storage unit that stores coordinates of each of the plurality of reference marks; a display unit that displays, for each of the plurality of marks captured by the imaging device, a deviation amount of coordinates compared with a corresponding mark among the plurality of reference marks stored in the storage unit, the cutting mechanism cuts the object in accordance with a preset cutting rule; displaying the amount of deviation of the coordinates for each of the plurality of marks captured by the imaging device; changing the setting of the cutting rule based on the deviation amount of the displayed coordinates; and manufacturing the cut product by cutting the object in accordance with the changed cutting rule.

Images