Substrate reversal in vacuum for double-sided PVD sputtering

Abstract

Provided herein is an apparatus and method for flipping a substrate in a vacuum between PVD sputtering of each side to increase throughput. In some embodiments disclosed herein, a processing system module for flipping a substrate in a vacuum is provided. The module includes a clamp assembly for clamping the substrate, a first motor assembly coupled to the clamp assembly for rotating the clamp assembly, and a second motor assembly coupled to the first motor assembly for raising and lowering the first motor assembly and the clamp assembly.

Description

[Technical Field]

[0001] Embodiments of the present disclosure relate generally to double-sided physical vapor deposition (PVD) sputtering of a substrate in an electronic device manufacturing process, and more particularly to an apparatus and method for flipping a substrate in a vacuum between PVD sputtering of each side. [Background technology]

[0002] Substrate processing in electronic device manufacturing often involves performing deposition processes on both sides of the substrate. However, process chambers are typically designed to deposit material on only one surface at a time, such as the top or bottom surface of the substrate. Therefore, it is often necessary to flip or reorient the substrate relative to the chamber between deposition processes.

[0003] This is particularly a challenge when processing some large-area substrates, such as panels. As used herein, the term "panel" may refer to a large-area substrate containing a large surface area of ​​polymer material. For example, a typical panel size may be 600 mm x 600 mm. Common panel materials may include Ajinomoto build-up film (ABF), copper clad laminate (CCL), polymer-coated panels, glass, etc. Due to the large area of ​​polymer material on the panel, the panel absorbs a lot of moisture. Therefore, to achieve good contact resistance, highly efficient degassing is required to remove all outgassing and contamination from the panel.

[0004] To perform PVD sputtering on both sides of a substrate / panel, the substrate / panel is removed from the vacuum chamber of the cluster tool and inverted in air. This requires an additional degassing process to remove moisture absorbed on the substrate / panel. This can take tens of minutes, or even up to 40 minutes, and this additional degassing process has a significant negative impact on throughput.

[0005] Attempts have been made to hold the substrate / panel vertically in the PVD chamber for simultaneous double-sided sputtering, however this approach does not provide active cooling to the substrate / panel and can result in undesirable arcing.

[0006] Therefore, there is a need in the art for an apparatus and method for flipping a substrate in a vacuum between PVD sputtering of each side. Summary of the Invention

[0007] FIELD OF THE INVENTION The embodiments described herein generally relate to double-sided physical vapor deposition (PVD) sputtering of a substrate in an electronic device manufacturing process. More particularly, the embodiments described herein provide an apparatus and method for flipping a substrate in a vacuum between PVD sputtering of each side.

[0008] In one embodiment, the processing system includes a deposition chamber, a transfer chamber coupled to the deposition chamber, and a load lock chamber coupled to the transfer chamber, the load lock chamber having a module for inverting a substrate in a vacuum.

[0009] In another embodiment, a module of a processing system for inverting a substrate in a vacuum includes a clamp assembly for securing the substrate, a first motor assembly coupled to the clamp assembly for rotating the clamp assembly, and a second motor assembly coupled to the first motor assembly for raising and lowering the first motor assembly and the clamp assembly.

[0010] In another embodiment, a method for inverting a substrate includes receiving a substrate in a load lock chamber, the load lock chamber having a module for inverting the substrate, and the method includes inverting the substrate in a vacuum.

[0011] So that the above-enumerated features of the present disclosure may be understood in detail, a more particular description of the present disclosure briefly summarized above may be rendered with reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings illustrate only typical embodiments of the present disclosure and should not be considered as limiting the scope of the present disclosure, which may admit of other equally effective embodiments. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a schematic top view of an exemplary substrate processing system, in accordance with certain embodiments. [Figure 2] 1A-1C illustrate a method for flipping a substrate in a vacuum using a flipper module, according to certain embodiments. [Figure 3] 2 is a schematic top isometric view of a portion of the substrate processing system of FIG. 1 including a flipper module, in accordance with a specific embodiment. [Figure 4A] 2 is a schematic top isometric view of a portion of the substrate processing system of FIG. 1 including a flipper module, in accordance with a specific embodiment. [Figure 4B] FIG. 4B is a partial cross-sectional side view of a flipper module in the position shown in FIG. 4A according to a specific embodiment. [Figure 4C] FIG. 4B is a partial cross-sectional side view of a flipper module in the position shown in FIG. 4A according to a specific embodiment. [Figure 4D] FIG. 4C is an enlarged view of a portion of FIG. 4B in accordance with certain embodiments. [Figure 4E] FIG. 1 is an exploded view of a clamping assembly in accordance with certain embodiments. [Figure 4F] FIG. 4C is a top isometric view of a portion of a clamp assembly in the position shown in FIG. 4B, according to a specific embodiment. [Figure 5A] FIG. 10 is a partial cross-sectional side view of a flipper module in a clamped position, according to certain embodiments. [Figure 5B]FIG. 5B is an enlarged view of a portion of FIG. 5A, according to a specific embodiment. [Figure 5C] FIG. 10 is a top isometric view of a separation portion of a clamping assembly, in accordance with certain embodiments. [Figure 5D] FIG. 5B is a top isometric view of a portion of a clamp assembly in the position shown in FIG. 5A, according to a specific embodiment. [Figure 6] 3 is a partial cross-sectional side view of a flipper module in an inverted position of the method of FIG. 2 in accordance with a specific embodiment. [Figure 7] FIG. 3 is a top isometric view of the flipper module at yet another stage of the method of FIG. 2 in accordance with certain embodiments. [Figure 8] FIG. 3 is a partial cross-sectional side view of the flipper module at yet another stage of the method of FIG. 2 in accordance with certain embodiments. [Figure 9] FIG. 3 is a partial cross-sectional side view of a flipper module at yet another stage of the method of FIG. 2 in accordance with certain embodiments. [Figure 10] FIG. 3 is a partial cross-sectional side view of a flipper module at yet another stage of the method of FIG. 2 in accordance with certain embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0013] For ease of understanding, like reference numerals have been used, where possible, to designate like elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0014] FIELD OF THE INVENTION The embodiments described herein generally relate to double-sided physical vapor deposition (PVD) sputtering of a substrate in an electronic device manufacturing process. More particularly, the embodiments described herein provide an apparatus and method for flipping a substrate in a vacuum between PVD sputtering of each side.

[0015] The embodiments described herein allow for PVD sputtering on both sides of a substrate without removing the substrate from vacuum, as opposed to conventional approaches where the substrate is removed from vacuum and inverted in air. Performing this process in vacuum eliminates additional degassing steps and improves throughput.

[0016] The embodiments described herein allow for PVD sputtering on both sides of a substrate without holding the substrate vertically. Sputtering on a horizontally positioned substrate allows for active cooling and prevents undesirable arcing.

[0017] The embodiments described herein provide an apparatus for inverting substrates in a vacuum within a load lock chamber without increasing the footprint of an existing or new processing system. The embodiments described herein enable inversion of large area substrates in vacuum in addition to conventional substrates.

[0018] Exemplary Substrate Processing System 1 is a schematic top view of an exemplary substrate processing system 100 (also referred to as a "processing platform") in accordance with certain embodiments. In certain embodiments, the substrate processing system 100 is configured to process, among other things, large area substrates such as panels as described above. The substrate processing system 100 generally includes an equipment front end module (EFEM) 102 for loading substrates into the processing system 100, a first load lock chamber 104 coupled to the EFEM 102, a transfer chamber 106 coupled to the first load lock chamber 104, and multiple other chambers coupled to the transfer chamber 106, as described in detail below. Proceeding counterclockwise from the first load lock chamber 104 around the transfer chamber 106, the processing system 100 includes a first dedicated degassing chamber 108, a first pre-cleaning chamber 110, a first deposition chamber 112, a second pre-cleaning chamber 114, a second deposition chamber 116, a second dedicated degassing chamber 118, and a second load lock chamber 120. The second load lock chamber 120 includes a flipper module for flipping substrates in a vacuum, as described in more detail below. In certain embodiments, a turbomolecular pump coupled to the second load lock chamber 120 is used to create the vacuum; however, other types of vacuum pumps are also contemplated. In certain embodiments, the transfer chamber 106 and each chamber coupled to the transfer chamber 106 are under vacuum. As used herein, the term "vacuum" refers to a vacuum of approximately 10 -2 This may refer to pressures below 10 Pa. However, some high vacuum systems -5 It can operate below 100 Pa.

[0019] In one specific embodiment, substrates enter the processing system 100 through a door (also referred to as a "slit valve") in the first load lock chamber 104 and exit the processing system 100 through a door in the second load lock chamber 120. In one specific embodiment, stacked substrates are supported in a cassette located in the first load lock chamber 104. When the first load lock chamber 104 is pumped down, substrates are removed one at a time from the cassette using a robot in the transfer chamber 106. In one embodiment, the second load lock chamber 120 receives a single substrate after processing has been performed on each side and delivers the processed substrate to the EFEM 102. The second load lock chamber 120 may be a dual chamber including an upper chamber portion 125 (FIG. 3) for receiving a substrate after both sides have been processed and delivering the substrate to the EFEM 102, and a lower portion including a flipper module 130 (FIG. 3) for flipping a substrate that has been processed on one side for processing on the other side. However, other loading and unloading configurations are contemplated.

[0020] Pre-cleaning the substrate is important to remove impurities, such as oxides, from the substrate surface so that the metal film deposited in the deposition chamber is not electrically isolated from the substrate. By performing pre-cleaning in the first pre-cleaning chamber 110 and the second pre-cleaning chamber 114, which share the same vacuum environment as the first deposition chamber 112 and the second deposition chamber 116, the substrate can be transferred from the cleaning chamber to the deposition chamber without being exposed to the atmosphere. This prevents the formation of impurities on the substrate during transfer. Furthermore, vacuum is maintained in the substrate processing system 100 during transfer of the cleaned substrate to the deposition chamber, reducing vacuum pump-down cycles.

[0021] In certain embodiments, only one substrate is processed at a time in each of the precleaning chamber and the deposition chamber. Alternatively, multiple substrates, e.g., four to six substrates, can be processed at a time. In such embodiments, the substrates may be disposed on a rotatable pedestal within each chamber. In certain embodiments, the first precleaning chamber 110 and the second precleaning chamber 114 are precleaning etch chambers for etching the substrate surface. However, other types of precleaning chambers are also contemplated. In certain embodiments, one or both of the precleaning chambers are replaced with a deposition chamber for reactive sputtering processes, such as reactive sputtering of silicon nitride, aluminum oxide, or other materials. In an ICP chamber, a coil at the top of the chamber is energized by an external RF source to create an excitation field in the chamber. Argon gas flows through the chamber from an external gas source. Argon atoms in the chamber are ionized (charged) by the RF energy. A bias is applied to the substrate by a DC bias source coupled to the aluminum pedestal on which the substrate rests. The charged atoms are attracted to the substrate, resulting in etching of the substrate surface. Other gases besides argon may be used depending on the desired etch rate and the material being etched. In contrast to processes that etch features on the substrate surface, ionization energy levels can be relatively low when etching as part of a cleaning process. The low energy avoids damaging circuit devices and features already formed on the substrate.

[0022] In certain embodiments, the first deposition chamber 112 and the second deposition chamber 116 are PVD chambers. In such embodiments, the PVD chambers may be configured to deposit copper, titanium, aluminum, gold, nickel, nickel vanadium, silver, and / or tantalum. However, other types of deposition processes and materials are also contemplated. In a PVD chamber, the entire rear surface of the substrate is in electrical and thermal contact with the pedestal. Controlling the temperature of the substrate during the sputtering process is important to obtain predictable and reliable thin films. The coolant system includes an external cooling source that supplies fluid to cooling tubes in the pedestal. The cooling source may be replaced or augmented by a heating source to increase the workpiece temperature independent of the sputtering process.

[0023] In a specific embodiment, an RF bias source is electrically coupled to the pedestal to energize the pedestal and thereby energize the substrate for the sputtering process. Substrate bias (RF bias) may be used if the substrate / panel has features that require, for example, good step coverage. Alternatively, the pedestal can be grounded, floating, or biased solely by a DC voltage source.

[0024] During operation, the chamber is evacuated and then refilled with argon gas. The gas is energized by a DC source and couples with an electromagnetic field within the chamber to excite a sustained, high-density plasma near the target surface. The plasma confined near the target surface contains positive ions (e.g., Ar+) and free electrons. The ions in the plasma bombard the target surface, sputtering material from the target. The substrate receives the sputtered material and forms a deposition layer on the substrate surface. In one example, as much as 20 kilowatts of DC power is applied to the target, allowing the target to deposit approximately 1 micron of material per second onto the substrate.

[0025] The sputtering chamber uses a magnetron assembly outside of a vacuum to further control the bombardment of the target by the plasma. In certain embodiments, a fixed permanent magnet is placed behind the target (to act as a deposition source), thereby confining the plasma to the target region. In other cases, the magnet is scanned across the backside of the target to help uniformly distribute the magnetic field on the target for further target erosion. The resulting magnetic field forms a closed-loop circular path that acts as an electron trap, reforming the trajectories of secondary electrons emitted from the target into cycloidal orbits and significantly increasing the probability of ionization of the sputtering gas within the confinement zone. Inert gases such as argon are typically used as sputtering gases because they do not react with the target material, do not combine with any process gases, and have high sputtering and deposition rates due to their large molecular weight. Positively charged argon ions from the plasma are accelerated toward and impact the negatively biased target, causing material to be sputtered from the target surface.

[0026] The chamber walls are typically electrically grounded during processing operations. A bias voltage relative to the substrate can drive a flux of charged species (Ar+ and / or atomic vapor sputtered from the target) to the substrate. This flux can modify the properties, e.g., density, of the sputtered material on the substrate.

[0027] In one particular embodiment, chamber gas is provided by distribution channels at the bottom of the chamber rather than from the top, reducing particle contamination during the sputtering process and allowing for optimization of the magnetron assembly.

[0028] Exemplary Flipper Module and Method of Use Thereof FIG. 2 illustrates a method 200 for flipping a substrate 122 in a vacuum using a flipper module 130 of a second load lock chamber 120, according to a specific embodiment. FIG. 3 is a schematic top isometric view of the substrate processing system 100 of FIG. 1, according to a specific embodiment. Note that in FIG. 3, only the transfer chamber 106 and the second load lock chamber 120 are shown for clarity. As shown, the load lock chamber 120 includes an upper chamber portion 125 configured to receive and remove a substrate after processing on both sides, and a lower chamber or flipper module 130 configured to receive a substrate to be processed on a first side and flip the substrate for processing on a second side. Also, note that the upper portion of the transfer chamber 106 has been omitted to further illustrate the interior of the transfer chamber 106.

[0029] In the position shown in Figure 3, the substrate 122 is positioned in the transfer chamber 106. The edge of the substrate 122 is in contact with the end effector of the transfer robot 124. The substrate 122 and the end effector of the transfer robot 124 are aligned with the door of the flipper module 130 of the load lock chamber 120. In the orientation shown in Figure 3, the front side 122a of the substrate 122 faces upward, and the back side 122b is supported from below by the end effector. In this example, the substrate 122 is a panel. However, the apparatus and methods of the present disclosure may be practiced with many different types of substrates.

[0030] 4A is a schematic top isometric view of the substrate processing system 100 of FIG. 1, in accordance with a specific embodiment. As shown in FIG. 4A, in step 202, the substrate 122 is transferred to the flipper module 130. Note that in FIG. 4A, for clarity, only the transfer chamber 106 and the flipper module 130 of the second load lock chamber 120 of FIG. 3 are shown. Also, note that the upper portions of each chamber have been further omitted to show the interior of each corresponding chamber. As shown in FIG. 4A, the transfer robot 124 operates to move the substrate 122 from the transfer chamber 106 into the housing 131 of the flipper module 130.

[0031] 4B-4C are partial cross-sectional side views showing the upper and lower portions, respectively, of the load lock chamber 120 in the position shown in FIG. 4A , according to a specific embodiment. As shown in FIGS. 4B-4C , the flipper module 130 generally includes a clamp assembly 140 for clamping the substrate 122, a first motor assembly 132 coupled to the clamp assembly 140 for rotating the clamp assembly 140, and a second motor assembly 134 coupled to the first motor assembly 132 for raising and lowering the first motor assembly 132 and the clamp assembly 140. A first guide block 156 is coupled between the clamp assembly 140 and the first motor assembly 132. A second guide block 158 is coupled to the clamp assembly 140 on the opposite side of the first motor assembly 132. An actuator 135 of the second motor assembly 134 is coupled to the body 133 of the first motor assembly 132 for raising and lowering the first motor assembly 132. 4B-4C, actuator 135, and thus clamp assembly 140, is in a fully raised position (also referred to as a "loading position"). Actuator 135 and body 133 are each disposed in a vacuum, while second motor assembly 134 is disposed in the atmosphere. To maintain the vacuum in housing 131 of flipper module 130, bellows 137 surrounds actuator 135 and forms a seal between housing 131 and second motor assembly 134.

[0032] The clamp assembly 140 includes a first plate 142 and a second plate parallel to the first plate 142. As shown in FIG. 4B, the clamp assembly 140 is in an open position in which the first plate 142 and the second plate 144 are spaced apart from each other. A pair of lift pins 152 are configured to contact one of the first plate 142 or the second plate 144 to move the clamp assembly 140 to the open position, as described in more detail below. The pair of lift pins 152 are coupled to an upper surface 168 of the housing 131. While only one lift pin is shown in the cross section of FIG. 4B, a second lift pin is located diagonally opposite the housing 131. The pair of lift pins 152 extend downward from the upper surface 168 to lower ends 170 that contact corresponding ears 154a-b (shown in FIG. 4E) located at opposite corners of each of the first plate 142 and second plate 144. In the orientation shown in FIG. 4B, the pair of lift pins 152 contact the second plate 144 to hold the second plate 144 in a fixed position relative to the upper surface 168 as the first plate 142 is moved further upward by the second motor assembly 134, as shown in more detail in FIG. 4D.

[0033] FIG. 4D is an enlarged view of a portion of FIG. 4B in accordance with a specific embodiment. As shown in more detail in FIG. 4D , flipper module 130 includes a slider 136 having a bearing support 138. Slider 136 is coupled to clamp assembly 140 via bearing support 138 and a second guide block 158 on the opposite side of first motor assembly 132. Bearing support 138 supports rotation of clamp assembly 140 by first motor assembly 132 via rotatable bearings 164. Bearing support 138 is movable on slider 136 to support raising and lowering of clamp assembly 140 by second motor assembly 134. When second load lock chamber 120 is in a vacuum state, clamp assembly 140, first motor assembly 132, and slider 136 are each disposed in a vacuum.

[0034] The second guide block 158 is coupled between the clamp assembly 140 and the bearing support 138. The second guide block 158 has a first groove 160a that fits over a corresponding pin 166a on the first plate 142 and a second groove 160b that aligns with a corresponding pin 166b on the second plate 144. The first groove 160a and the second groove 160b are separated by a wall 162. As shown in FIG. 4D , contact between the pin 166a of the first plate 142 and the wall 162 causes the first plate 142 to continue moving upward even after the second plate 144 has stopped after contacting the pair of lift pins 152. In certain embodiments, the first guide block 156 and the second guide block 158 are structurally and functionally equivalent.

[0035] FIG. 4E is an exploded view of a clamp assembly 140 according to a specific embodiment. As shown in FIG. 4E, the first plate 142 and the second plate 144 each include a plurality of L-shaped components 148 (148a-b). The L-shaped components 148 of each corresponding plate generally form a ledge for supporting the edge of the substrate 122. Each of the L-shaped components 148 extends from the corresponding plate in a direction perpendicular to the plane of the first plate 142. The edges of the first plate 142 and the second plate 144 closest to the transfer chamber 106 (e.g., the rear left edges of the respective plates in the view shown in FIG. 4E) do not have L-shaped components 148 to allow the substrate 122 to be loaded from the transfer chamber 106.

[0036] FIG. 4F is a top isometric view of a portion of clamp assembly 140 in the position shown in FIG. 4B , according to a specific embodiment. As shown in FIG. 4F , second plate 144 is movably coupled to first plate 142 in a direction perpendicular to the plane of first plate 142. In the orientation shown in FIG. 4F , first plate 142 is disposed above second plate 144. First plate 142 and second plate 144 are coupled together with a pair of spring-loaded links 146. The pair of spring-loaded links 146 bias first plate 142 and second plate 144 toward each other, transitioning first plate 142 and second plate 144 from the open position (shown in FIG. 4F ) to the clamped position (shown in FIG. 5D ). Each spring-loaded link 146 includes a pin 172 disposed through corresponding openings in the first plate 142 and the second plate 144 and a pair of springs 174 disposed on opposite ends of the pin 172 .

[0037] In the open position (shown in FIG. 4F), each of the plurality of L-shaped pieces 148 is disposed in the space between the first plate 142 and the second plate 144 to load the substrate 122 onto the ledge of one of the plates. In the orientation shown in FIG. 4F, the backside 122b of the substrate 122 contacts and is supported from below by the L-shaped piece 148a of the first plate 142.

[0038] FIG. 5A is a partial cross-sectional side view of the flipper module 130 of the second load lock chamber 120 in a clamped position, according to a specific embodiment. As shown in FIG. 5A, in step 204, the substrate 122 is secured in the clamp assembly 140. To move the first plate 142 and the second plate 144 from the open position (shown in FIG. 4B) to the clamped position (shown in FIG. 5A), the actuator 135 of the second motor assembly 134 is retracted, thereby lowering the first motor assembly 132 and the first plate 142 relative to the second plate 144. A pair of spring-loaded links 146 bias the first plate 142 toward the second plate 144. As shown in FIG. 5A, the clamp assembly 140 is in a partially raised position. In the clamped position, the substrate 122 is in direct contact with the first plate 142 and the second plate 144, securing the substrate 122 therebetween. 5A, the front side 122a is in contact with the first plate 142, and the back side 122b is in contact with the second plate 144. Furthermore, the front side 122a faces upward, and the back side 122b faces downward.

[0039] 5B is an enlarged view of a portion of FIG. 5A according to one particular embodiment. As shown in FIG. 5B, in the clamped position, the pair of spring-loaded links 146 bias each of the first plate 142 and the second plate 144 into contact with the wall 162 so as to center the clamp assembly 140 relative to the second guide block 158.

[0040] 5C is a top isometric view of a separated portion of the clamping assembly 140, according to one particular embodiment. As shown in FIG. 5C, the first plate 142 and the second plate 144 each have a "+" shaped backing 176 that contacts the substrate. However, other shapes are contemplated. Thus, contact between the substrate 122 and each corresponding plate is limited to only a relatively small cross-sectional area of ​​the backing, rather than contacting the entire area of ​​the substrate 122.

[0041] 5D is a top isometric view of a portion of the clamping assembly 140 in the position shown in FIG. 5A, according to one particular embodiment. As shown in FIG. 5D, in the clamping position, each of the plurality of L-shaped pieces 148 is positioned through a corresponding opening in the opposing plate such that the first plate 142 and the second plate 144 can be moved closely together into contact with the substrate 122.

[0042] In step 206, the clamp assembly 140 is lowered to the inverted position (shown in FIG. 6). To move the clamp assembly 140 to the inverted position, the actuator 135 of the second motor assembly 134 is further retracted below the partially raised position, at which point the second plate 144 is released from contact with the pair of spring-loaded links 146. Continuing to retract the actuator 135 lowers the first motor assembly 132 and the coupled clamp assembly 140. In certain embodiments, the second motor assembly 134 includes an electric or air motor programmed to stop at the fully raised position (shown in FIG. 4B) and the inverted position (shown in FIG. 6). In certain embodiments, the motor includes a gear drive and a belt drive. In certain embodiments, the second motor assembly 134 includes an electric or pneumatic linear actuator. However, other types of actuators are contemplated.

[0043] In step 208, the clamp assembly 140 is rotated approximately 180 degrees. FIG. 7 is a top isometric view of the flipper module 130 of the second load lock chamber 120, showing the orientation of the clamp assembly 140 rotated 90 degrees. FIG. 8 is a partial side cross-sectional view of the flipper module 130 rotated 180 degrees. The clamp assembly 140 is rotated by actuating the first motor assembly 132. In a specific embodiment, the first motor assembly 132 includes an electric or air motor programmed to stop every 180 degrees. In a specific embodiment, the first motor assembly 132 includes a 180-degree electric or pneumatic actuator. However, other types of actuators are also contemplated. The orientation of the clamp assembly 140 and the substrate 122 secured thereto is reversed (as shown in FIG. 8) after the clamp assembly 140 has rotated approximately 180 degrees. In the orientation shown in FIG. 8, the front side 122a faces downward and the back side 122b faces upward. The front side 122 a remains in contact with the first plate 142 and the back side 122 b remains in contact with the second plate 144 .

[0044] In step 210, the clamp assembly 140 is raised to a partially raised position (shown in FIG. 9). To move the clamp assembly 140 to the partially raised position, the actuator 135 of the second motor assembly 134 is extended, thereby raising the first motor assembly 132 and the coupled clamp assembly 140. In the orientation shown in FIG. 9, the pair of lift pins 152 contact the first plate 142 to hold the first plate 142 in a fixed position relative to the upper surface 168 while the second plate 144 is subsequently raised.

[0045] In step 212, the substrate 122 is released from the clamp assembly 140 (shown in FIG. 10 ). To move the first plate 142 and the second plate 144 from the clamped position (shown in FIG. 9 ) to the open position (shown in FIG. 10 ), the actuator 135 of the second motor assembly 134 is further extended, causing the first motor assembly 132 and the second plate 144 to rise relative to the first plate 142. The second plate 144 overcomes the bias force applied by the pair of spring-loaded links 146. In the orientation shown in FIG. 10 , the front side 122 a of the substrate 122 contacts and is supported from below by the L-shaped piece 148 b of the second plate 144.

[0046] In step 214, the substrate 122 is transferred out of the flipper module 130. When the substrate 122 is transferred back into the transfer chamber 106 after flipping in the flipper module 130, the backside 122b faces upward, thereby allowing pre-cleaning and deposition processes to occur on the backside 122b. As described above, the substrate 122 is maintained in a vacuum during each step of the method 200. Therefore, when the substrate 122 is transferred back into the transfer chamber 106, it is not necessary to degas the substrate 122 before performing subsequent pre-cleaning and deposition processes on the backside 122b. This significantly reduces the time for double-sided processing and increases throughput.

[0047] While the forgoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, the scope of which is determined by the claims that follow.

Claims

1. 1. A module of a processing system for inverting a substrate in a vacuum, comprising: a clamping assembly for securing a substrate disposed on the first plane; a first motor assembly coupled to the clamp assembly for rotating the clamp assembly about a first direction parallel to the first plane; a second motor assembly for raising and lowering the first motor assembly and the clamp assembly in a second direction perpendicular to the first plane; a slider coupled to the clamp assembly opposite the first motor assembly in the first direction, the slider including a bearing support that supports rotation of the clamp assembly by the first motor assembly about the first direction through a rotatable bearing.

2. A module of a processing system for inverting a substrate in a vacuum, comprising: a clamping assembly for securing a substrate disposed on the first plane; a first motor assembly coupled to the clamp assembly for rotating the clamp assembly about a first direction parallel to the first plane; a slider coupled to the clamp assembly opposite the first motor assembly in the first direction, the slider including a bearing support that supports rotation of the clamp assembly by the first motor assembly about the first direction through a rotatable bearing; Equipped with The clamp assembly, the first motor assembly, and the slider are each disposed in a vacuum.

3. A module of a processing system for inverting a substrate in a vacuum, comprising: a clamping assembly for securing a substrate disposed on the first plane; a first motor assembly coupled to the clamp assembly for rotating the clamp assembly about a first direction parallel to the first plane; a slider coupled to the clamp assembly opposite the first motor assembly in the first direction, the slider including a bearing support that supports rotation of the clamp assembly by the first motor assembly about the first direction through a rotatable bearing; Equipped with The clamp assembly includes: a first plate; a second plate parallel to the first plate and movably coupled to the first plate in a second direction perpendicular to the first plane; a pair of spring-loaded links coupled to each of the first plate and the second plate, the pair of spring-loaded links biasing the first plate and the second plate toward each other into a clamped position.

4. the first plate and the second plate each include a plurality of L-shaped members collectively forming a ledge for supporting an edge of the substrate; each of the plurality of L-shaped components extends from a corresponding one of the plates in the second direction; In the clamped position, each of the plurality of L-shaped components is disposed through a corresponding opening in the opposing plate; 4. The module of claim 3, wherein in an open position, each of the plurality of L-shaped components is disposed in a space between the first plate and the second plate to load the substrate onto the ledge of one of the first plate and the second plate.

5. The module of claim 4 , wherein the first plate and the second plate each include an edge that is free of L-shaped components to allow for loading of the substrate.

6. The module of claim 3 , further comprising a pair of lift pins configured to contact one of the first plate or the second plate to move the clamp assembly to an open position.

7. a deposition chamber; and a transfer chamber coupled to the deposition chamber; an inversion chamber coupled to the transfer chamber, the module including: a module for inverting a substrate in a vacuum; a clamping assembly for securing a substrate disposed on the first plane; a first motor assembly coupled to the clamp assembly for rotating the clamp assembly about a first direction parallel to the first plane; and an inversion chamber including a slider coupled to the clamp assembly opposite the first motor assembly in the first direction, the slider including a bearing support that supports rotation of the clamp assembly by the first motor assembly around the first direction through a rotatable bearing.

8. 8. The processing system of claim 7, further comprising a second motor assembly for raising and lowering said first motor assembly and said clamp assembly in a second direction that is perpendicular to said first plane.

9. 8. The processing system of claim 7, wherein the deposition chamber, the transfer chamber, and the inversion chamber are under vacuum.

10. 8. The processing system of claim 7, wherein said deposition chamber comprises a physical vapor deposition (PVD) chamber.

11. The processing system of claim 7 , further comprising a pre-clean chamber coupled to said transfer chamber.

12. 8. The processing system of claim 7, wherein the inversion chamber comprises a door for removing the substrate from the processing system, the processing system further comprising a load lock chamber for removing another substrate from the processing system.

13. 1. A method of inverting a substrate, comprising: receiving the substrate in an inversion chamber, the inversion chamber comprising a module for inverting the substrate, the module comprising: a clamping assembly for securing a substrate disposed on the first plane; a first motor assembly coupled to the clamp assembly for rotating the clamp assembly about a first direction parallel to the first plane; and receiving the substrate, the slider being coupled to the clamp assembly on the opposite side of the first motor assembly in the first direction, the slider including a bearing support that supports rotation of the clamp assembly by the first motor assembly about the first direction through a rotatable bearing; and inverting the substrate in a vacuum.

14. 14. The method of claim 13, wherein the module further comprises a second motor assembly for raising and lowering the first motor assembly and the clamp assembly in a second direction that is perpendicular to the first plane.

15. The processing system of claim 7 , further comprising a load lock chamber coupled to the transfer chamber.

16. positioning the clamp assembly in a first position, the clamp assembly having a first plate disposed above a second plate; receiving the substrate on the first plate with the clamp assembly open and the substrate facing front side up; 15. The method of claim 14, further comprising: rotating the clamp assembly 180 degrees using the first motor assembly, wherein the substrate is disposed on the second plate with the front side facing down.

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