Component mounting system, management device, component mounting device, inspection device, and component mounting method

Abstract

To provide a component mounting system, a management device, a component mounting device, an inspection device, and a component mounting method that can appropriately feed back the inspection results of components mounted on a board.SOLUTION: A component mounting method includes: imaging a component mounted on a board and inspecting the state of the component mounted on the board (ST2); calculating the correction value when mounting the component on the board on the basis of the obtained inspection result (ST5); and mounting the component on the board using the correction value (ST1); adjusting an inspection condition after the inspection of a first board (ST9); inspecting the first board according to the adjusted inspection condition to acquire the inspection results after adjustment (ST10); and calculating a correction value for mounting the component on the board on the basis of the post-adjustment inspection result (ST5).SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a component mounting system for mounting components on a board, a management device, a component mounting device, an inspection device, and a component mounting method. [Background technology]

[0002] In a component mounting system that mounts components on a board to produce a mounted board, an inspection device acquires positional deviation information of the components mounted on the board, and the acquired positional deviation information is used to correct the mounting position when the component mounting device mounts the components on a subsequent board (see, for example, Patent Document 1). The mounting line management system described in Patent Document 1 discloses a method in which, when a component mounting defect is detected by the inspection device and the board with the mounting defect repaired is re-introduced into the mounting line, the positional deviation information of the re-introduced board is not used to correct the mounting position. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-134051 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in conventional technologies including Patent Document 1, some of the cases where the inspection device judged the mounting to be defective were erroneous judgments caused by inappropriate imaging conditions of the inspection device's camera or inappropriate conditions for defect judgment, even though the component was properly mounted on the board, and there was room for further improvement in order to properly feed back the inspection results obtained by the inspection device to the component mounting device.

[0005] Therefore, an object of the present invention is to provide a component mounting system, a management device, a component mounting device, an inspection device, and a component mounting method that can appropriately provide feedback on the inspection results of components mounted on a board. [Means for solving the problem]

[0006] The component mounting system of the present invention comprises an inspection device that captures an image of a component mounted on a board and inspects the state of the component mounted on the board, a correction value calculation unit that calculates a correction value for mounting the component on the board based on the inspection results obtained by the inspection device, and a component mounting unit that mounts the component on the board using the correction value, and the inspection results include post-adjustment inspection results obtained by inspecting the first board using the inspection device whose inspection conditions have been adjusted after inspecting the first board.

[0007] The management device of the present invention includes a correction value calculation unit that calculates correction values ​​when a component mounting device mounts a component on a board based on inspection results obtained by an inspection device that takes an image of the component mounted on the board and inspects the state of the component mounted on the board, and the inspection results include post-adjustment inspection results obtained by inspecting the first board using the inspection device whose inspection conditions have been adjusted after inspecting the first board.

[0008] The component mounting device of the present invention includes a component mounting unit that mounts a component on a board using a correction value for mounting the component on the board, the correction value being calculated based on inspection results obtained by an inspection device that images the component mounted on the board and inspects the state of the component mounted on the board, and the inspection results include post-adjustment inspection results obtained by inspecting the first board using the inspection device in which the inspection conditions have been adjusted after inspecting the first board.

[0009] The inspection device of the present invention comprises an inspection unit that captures images of components mounted on a board and inspects the condition of the components mounted on the board, and an output unit that outputs inspection results obtained by the inspection unit, wherein the inspection results include post-adjustment inspection results obtained by inspecting the first board using the inspection unit in which the inspection conditions have been adjusted after inspecting the first board.

[0010] The component mounting method of the present invention includes: capturing an image of a component mounted on a board to inspect the state of the component mounted on the board; calculating a correction value when mounting the component on the board based on the obtained inspection results; and attaching the component to the board using the correction value; adjusting inspection conditions after inspecting a first board; inspecting the first board using the adjusted inspection conditions to obtain post-adjustment inspection results; and calculating a correction value when mounting the component on the board based on the post-adjustment inspection results. [Effects of the Invention]

[0011] According to the present invention, it is possible to appropriately provide feedback on the inspection results of components mounted on a board. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a diagram illustrating the configuration of a component mounting system according to an embodiment of the present invention. [Figure 2] FIG. 1 is a plan view showing a configuration of a main part of a component mounting apparatus according to an embodiment of the present invention; [Figure 3] FIG. 1 is a block diagram showing the configuration of a control system of a component mounting system according to an embodiment of the present invention. [Figure 4] FIG. 10 is an explanatory diagram of the amount of component mounting position deviation acquired by the inspection device according to the embodiment of the present invention. [Figure 5] FIG. 10 is an explanatory diagram of an example of a pass / fail judgment screen displayed on the inspection display unit of the inspection device according to the embodiment of the present invention. [Figure 6] FIG. 10 is an explanatory diagram of an example of an inspection condition adjustment screen displayed on an inspection display unit of an inspection device according to an embodiment of the present invention. [Figure 7] 1 is a flow diagram of a component mounting method according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0013] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanatory purposes and can be modified as appropriate depending on the specifications of the component mounting system, management computer, component mounting device, and inspection device. Corresponding elements in all drawings will be denoted by the same reference numerals below, and duplicated explanations will be omitted. In FIG. 1 and in some sections described below, two axes perpendicular to each other in a horizontal plane are shown: the X-axis (the left-right direction in FIG. 1) in the substrate transport direction, and the Y-axis (the up-down direction in FIG. 1) perpendicular to the substrate transport direction. In FIG. 4 and in some sections described below, the θ-direction, which is the direction of rotation around the Z-axis, is shown.

[0014] First, the configuration of component mounting system 1 will be described with reference to Figure 1. Component mounting system 1 has the function of manufacturing a mounted board by mounting components on a board. Component mounting system 1 has a first conveyor M1, two component mounting devices M2-M3, an inspection device M4, and a second conveyor M5 connected in series from upstream (left side of the page) to downstream (right side of the page) in the board transport direction. Each device is connected to a management computer 3 via a communication network 2. Each device also transmits and receives data to and from each other via the communication network 2. Note that the number of component mounting devices M2-M3 provided in component mounting system 1 is not limited to two, and may be one or three or more.

[0015] The first conveyor M1, two component mounters M2 and M3, inspection device M4, and second conveyor M5 each have board transport sections 4, 5, 6, and 8, and transport boards B in order from the upstream device to the downstream device. The first conveyor M1 receives boards B (arrow a) from production equipment connected upstream, such as a printing device (not shown) that prints solder paste on electrodes E formed on the boards B, and transports them to the component mounter M2. The first conveyor M1 also has a built-in reader (not shown) that reads a board label L, such as a barcode or two-dimensional code, attached to the board B to read a board number (board ID) that identifies the board B. The first conveyor M1 reads the board number from the board label L of the board B and transmits it to the downstream component mounter M2 and management computer 3.

[0016] 1, component mounting device M2 performs a component mounting operation in which a mounting head picks up components D from a component supply unit and mounts them at a mounting position on board B transported from first conveyor M1, and then transports board B to downstream component mounting device M3. Similarly, component mounting device M3 performs a component mounting operation in which components D are mounted at a mounting position on board B transported from upstream component mounting device M2. When transporting board B to a downstream device, component mounting devices M2 to M3 transmit the board number of board B to the downstream device and management computer 3.

[0017] The inspection device M4 uses an inspection camera 7 to capture images of the board B on which components D have been mounted by component mounting devices M2-M3, while illuminating the board B with an illumination unit 7a (see FIG. 3). The inspection device M4 obtains information such as the amount of deviation of the mounting position of the components D from the correct position, and determines whether the mounted board is acceptable. When the inspection device M4 conveys the inspected board B downstream to the second conveyor M5, it transmits the board number of the board B to the second conveyor M5 and the management computer 3. The second conveyor M5 receives the board B after component mounting, conveyed from the inspection device M4, and conveys it downstream to a reflow device (not shown) that heats the board B to melt the solder paste (arrow b). The management computer 3 has the function of overall control of the component mounting system 1, which includes the first conveyor M1, component mounting devices M2-M3, inspection device M4, and second conveyor M5.

[0018] In FIG. 1, the first conveyor M1 and the second conveyor M5 temporarily store (place) boards B received from upstream and transport them downstream, and also allow workers to take boards B in and out of the board transport sections 4 and 8. A board B1 on which inspection device M4 has detected defects in the mounting state of components D, such as missing components, misaligned mounting positions, or upright or floating components, is removed by a worker from the second conveyor M5 (arrow c). After the worker performs repair work (arrow d) by removing or correcting the mounting state of components D, the repaired board B1 is re-inserted from the first conveyor M1 (arrow e). Components D are mounted by component mounting devices M2 and M3 in the previously unmounted mounting positions on the re-inserted board B1.

[0019] Next, the configuration of component mounting devices M2 to M3 will be described with reference to Fig. 2. A board transport unit 4 is installed along the X axis in the center of a base 10. The board transport unit 4 transports a board B carried out from an upstream device, and positions and holds it at a mounting operation position by a mounting head, which will be described below. The board transport unit 4 also carries out the board B, on which component mounting operation (component mounting operation) has been completed, to a downstream device.

[0020] A component supply unit 11 is installed on each side (front and back along the Y axis) of the board transport unit 4. In the component supply unit 11, multiple tape feeders 12 are arranged in parallel along the X axis. The tape feeders 12 feed a component tape, which has pockets for storing components D, at a pitch in a direction (tape feed direction) from the outside of the component supply unit 11 toward the board transport unit 4, thereby supplying components D to the component supply position where the mounting head picks up the components.

[0021] In FIG. 2, Y-axis tables 13 equipped with linear drive mechanisms are disposed at both ends of the X-axis on the top surface of base 10. A beam 14 similarly equipped with a linear mechanism is connected between the two Y-axis tables 13 so as to be freely movable along the Y-axis. A mounting head 15 is attached to beam 14 via plate 14a so as to be freely movable along the X-axis. Mounting head 15 is equipped with multiple nozzle lifting units. A nozzle that sucks and holds component D is attached to the lower end of each nozzle lifting unit. Each nozzle lifting unit raises and lowers the nozzle along the Z-axis and rotates it in the θ direction around the Z-axis as a rotation axis.

[0022] Y-axis table 13 and beam 14 constitute a head movement mechanism that moves mounting head 15 in horizontal directions (X-axis direction, Y-axis direction). The head movement mechanism and mounting head 15 constitute component mounting unit 16 that performs component mounting work by picking up components D from the component supply positions of tape feeder 12 attached to component supply unit 11 and mounting them at the mounting positions on board B held by board transport unit 4. During the component mounting work, mounting head 15 moves above component supply unit 11, picks up predetermined components D with each nozzle, moves above board B, and repeats a series of mounting turns to mount the components D held by each nozzle at their respective mounting positions.

[0023] 2, a head camera 17 is attached to the plate 14a on which the mounting head 15 is attached. As the mounting head 15 moves, the head camera 17 moves above the board B positioned at the mounting work position of the board transport unit 4, and captures an image of a board mark (not shown) provided on the board B and the mounting position of the board B. The head camera 17 also captures an image of the board label L provided on the board B. A board number (board ID) that identifies the board B is read from the image of the board label L.

[0024] A component recognition camera 18 is installed between the component supply unit 11 and the board transport unit 4. When the mounting head 15, which has taken out a component D from the component supply unit 11, is positioned above the component recognition camera 18, the component recognition camera 18 captures an image of the component D held by the nozzle from below. When the mounting head 15 mounts the component D on the board B, the mounting position is corrected taking into account the recognition results of the board B by the head camera 17 and the recognition results of the component by the component recognition camera 18.

[0025] 2, a touch panel 19 operated by the worker is installed in front of the component mounting devices M2 to M3 at a position where the worker works. The touch panel 19 displays various information on its display unit, and the worker inputs data and operates the component mounting devices M2 to M3 using operation buttons and the like displayed on the display unit.

[0026] Next, the configuration of the control system of component mounting system 1 will be described with reference to Fig. 3. Among the functions of component mounting system 1, the following description focuses on the function of feeding back inspection results of components D mounted on board B to component mounting devices M2 to M3. Management computer 3, first conveyor M1, component mounting devices M2 to M3, inspection device M4, and second conveyor M5 are interconnected via communication network 2. Component mounting devices M2 to M3 each include a mounting control device 20, a board transport unit 5, a tape feeder 12, a component mounting unit 16, a head camera 17, a component recognition camera 18, and a touch panel 19. Mounting control device 20 includes a mounting memory unit 21, an acquisition unit 22, a correction value calculation unit 23, a mounting control unit 24, and a mounting communication unit 25.

[0027] Mounting communication unit 25 transmits and receives data to and from inspection device M4, management computer 3, first conveyor M1, and second conveyor M5 via communication network 2. Mounting memory unit 21 is a storage device that stores mounting data 21a, inspection results 21b, correction value information 21c, etc. Mounting data 21a includes information such as the production model name (board name) of the mounted board, the type (component name) of component D to be mounted on board B, the mounting position (XY coordinates), the mounting direction (θ direction), the mounting position of tape feeder 12 that supplies component D, and the mounting position of the nozzle.

[0028] 3, acquisition unit 22 acquires mounting position deviation amounts ΔX, ΔY, and Δθ of component D mounted on board B, which are calculated by inspection device M4 by capturing an image of component D mounted on board B, and stores the amounts as inspection result 21b in mounting storage unit 21. Correction value calculation unit 23 calculates correction values ​​to be used when component mounting devices M2 to M3 mount component D on board B, based on the mounting position deviation amounts ΔX, ΔY, and Δθ of component D included in inspection result 21b. Correction value calculation unit 23 stores the calculated correction values ​​as correction value information 21c in mounting storage unit 21.

[0029] 3, mounting control unit 24 (control unit) controls board transport unit 5, tape feeder 12, component mounting unit 16, head camera 17, and component recognition camera 18 based on the mounting position and mounting direction included in mounting data 21a, the correction value included in correction value information 21c, etc., to mount component D on board B. That is, component mounting unit 16 corrects the position of mounting head 15 based on the position of board B imaged by head camera 17, suction position deviation information, and the correction value included in correction value information 21c, to mount component D on board B.

[0030] In this way, the component mounting unit 16 mounts the component D on the substrate B using a correction value for mounting the component D on the substrate B, which is calculated based on the inspection result 21b obtained by the inspection device M4, which takes an image of the component D mounted on the substrate B and inspects the state of the component D mounted on the substrate B.

[0031] 3, the inspection device M4 includes an inspection control device 30, a substrate transport unit 6, an inspection camera 7, an illumination unit 7a, an inspection camera moving mechanism 31, an inspection input unit 32, and an inspection display unit 33. The inspection control device 30 includes an inspection memory unit 34, an inspection control unit 35, a recognition processing unit 36, a judgment unit 37, a display processing unit 38, an instruction unit 39, an output unit 40, and an inspection communication unit 41. The inspection input unit 32 is an input device such as a keyboard, touch panel, or mouse, and is used for inputting operation commands and data. The inspection display unit 33 is a display device such as a liquid crystal panel, and displays various information such as various screens, including an operation screen for operation by the inspection input unit 32.

[0032] The inspection communication unit 41 transmits and receives data between the component mounting devices M2 to M3, the management computer 3, and the second conveyor M5 via the communication network 2. The inspection memory unit 34 is a storage device that stores inspection data 34a, inspection conditions 34b, provisional inspection results 34c, etc. The inspection data 34a includes the name of the production model of the mounted board (board name), the type of component mounted on board B (component name), the mounting position (XY coordinates), the mounting direction (θ direction), and the defect judgment value. The inspection conditions 34b include the illumination conditions of the light emitted by the illumination unit 7a when the inspection camera 7 captures an image of the component D mounted on board B, the image filter used by the recognition processing unit 36 ​​to perform recognition processing on the captured image, and recognition conditions such as an algorithm for detecting the center of the component D.

[0033] 3, inspection control unit 35 controls board transport unit 6 to transport mounted board B, which has been carried out from upstream component mounting device M3, to the inspection position, position and hold it there, and then carry out the board B downstream after the inspection work has been completed. In addition, inspection control unit 35 controls inspection camera moving mechanism 31 and lighting unit 7a based on the lighting conditions included in inspection data 34a and inspection conditions 34b to move inspection camera 7 sequentially above the mounting position of board B held at the inspection position, and causes inspection camera 7 to capture images of components D mounted on board B while illuminating with lighting unit 7a.

[0034] The recognition processing unit 36 ​​performs recognition processing on the image captured by the inspection camera 7 based on the inspection data 34a and the recognition conditions included in the inspection conditions 34b, and calculates the mounting position deviation amounts ΔX, ΔY, and Δθ (see FIG. 4) of the component D mounted on the board B from the normal mounting position Q. The recognition processing unit 36 ​​stores the captured image and the mounting position deviation amounts ΔX, ΔY, and Δθ in the inspection memory unit 34 as the provisional inspection result 34c.

[0035] 4, an example of a method by which the recognition processing unit 36 ​​calculates the mounting position deviation amounts ΔX, ΔY, and Δθ of a component D mounted on a board B from its normal mounting position Q will be described. The inspection control unit 35 causes the inspection camera 7 to capture an image of the component D mounted on the board B at a position where the center of the image capture coincides with the normal mounting position Q of the component D. The recognition processing unit 36 ​​detects the center C of the mounted component D by performing recognition processing on the captured image. Then, the recognition processing unit 36 ​​calculates the position deviation amount ΔX in the X-axis direction and the position deviation amount ΔY in the Y-axis direction from the difference between the center C (ΔX, ΔY) and the mounting position Q (0,0). Furthermore, the recognition processing unit 36 ​​calculates the tilt of the component D in the θ direction as the position deviation amount Δθ.

[0036] 3, the judgment unit 37 judges whether or not the component D has been properly mounted on the board B based on the mounting position deviation amounts ΔX, ΔY, and Δθ included in the provisional inspection result 34c and the defect judgment value included in the inspection data 34a. For example, if the mounting position deviation amounts ΔX, ΔY, and Δθ exceed the defect judgment value, the judgment unit 37 judges the component D as defectively mounted (the board B as a defective board). Furthermore, if the component D is not recognized, the judgment unit 37 judges the component D as defectively mounted (missing). In other words, the judgment unit 37 judges whether or not the inspection result (provisional inspection result 34c) is normal. The judgment unit 37 stores the pass / fail judgment result in the provisional inspection result 34c.

[0037] In this way, provisional inspection result 34c stores the captured image, mounting position deviation amounts ΔX, ΔY, Δθ, and pass / fail judgment result in association with the mounting position of component D. Furthermore, inspection camera 7, lighting unit 7a, inspection camera moving mechanism 31, inspection control unit 35, recognition processing unit 36, and judgment unit 37 constitute inspection unit 42 that captures an image of component D mounted on board B and inspects the state of component D mounted on board B (mounting position deviation amounts ΔX, ΔY, Δθ, and pass / fail judgment result).

[0038] In FIG. 3, the display processing unit 38 displays a pass / fail judgment screen, an inspection condition adjustment screen, etc. on the inspection display unit 33 to support the operator in adjusting the inspection conditions 34b.

[0039] 5, an example of the pass / fail determination screen 60 displayed by the display processing unit 38 on the inspection display unit 33 will be described. The pass / fail determination screen 60 is displayed on the inspection display unit 33 when, as a result of inspection of the state of the board B (hereinafter referred to as the "first board Ba") by the inspection unit 42, it is determined that there is a component D (hereinafter referred to as the "unconfirmed component D1") whose mounting cannot be confirmed. The pass / fail determination screen 60 has a recognition processing result display area 61, a captured image display area 62, a defective button 63, and an inspection condition adjustment button 64.

[0040] The recognition processing result display area 61 displays the recognition processing result (in this example, "No component present") for the unconfirmed component D1 included in the provisional inspection result 34c. The captured image display area 62 displays the captured image of the unconfirmed component D1 included in the provisional inspection result 34c. The captured image display area 62 also displays a center line 62x in the X-axis direction and a center line 62y in the Y-axis direction superimposed on the captured image. The intersection of the center line 62x in the X-axis direction and the center line 62y in the Y-axis direction is the mounting position (mounting coordinates) of the unconfirmed component D1. The worker looks at the captured image displayed in the captured image display area 62 and determines whether the unconfirmed component D1 has been mounted at the mounting position.

[0041] 5, when an operator determines that board repair is necessary, for example, because unconfirmed component D1 is not mounted in the mounting position or is mounted far away from the mounting position (has fallen), the operator operates inspection input unit 32 to press defective button 63. When defective button 63 is pressed, instruction unit 39 causes first board Ba to be removed from inspection device M4 and instructs second conveyor M5 that first board Ba is to be repaired. Upon receiving the instruction, second conveyor M5 holds first board Ba without carrying it downstream, and waits for the operator to remove it.

[0042] In this way, if the inspection result by the worker is not normal, the instruction unit 39 instructs the repair of the first board Ba. Furthermore, the inspection display unit 33 is a display unit that displays an image of the mounting position of the component D (unconfirmed component D1) acquired by the inspection unit 42 of the inspection device M4 if the inspection result by the inspection unit 42 is not normal.

[0043] 5, if the worker can confirm from the captured image that unconfirmed component D1 has been mounted at the mounting position, or if the inspection conditions 34b are inappropriate and the presence or absence of unconfirmed component D1 cannot be determined from the current captured image, the worker determines that the inspection conditions 34b need to be adjusted. In this case, the worker operates the inspection input unit 32 to press the inspection condition adjustment button 64. When the inspection condition adjustment button 64 is pressed, the display processing unit 38 causes the inspection display unit 33 to display an inspection condition adjustment screen.

[0044] 6, an example of an inspection condition adjustment screen 70 that is displayed on the inspection display unit 33 by the display processing unit 38 when the inspection condition adjustment button 64 is pressed on the pass / fail judgment screen 60 will be described. The inspection condition adjustment screen 70 has a recognition processing result display area 71, a captured image display area 72, an illumination condition change area 73, a recognition condition change area 74, an automatic adjustment button 75, a re-recognition button 76, a decision button 77, and a defective button 78.

[0045] The lighting condition change area 73 displays buttons for setting (adjusting) the lighting conditions under which the lighting unit 7a illuminates when the inspection camera 7 captures an image of the unconfirmed part D1. In this example, a lighting 1 button 73a and a lighting 2 button 73b for changing the lighting conditions are provided. The lighting conditions are changed by the worker operating the increase button and decrease button of the lighting 1 button 73a and the lighting 2 button 73b.

[0046] 6, the recognition condition change area 74 displays buttons for setting (adjusting) the recognition conditions when the recognition processing unit 36 ​​recognizes the image captured by the inspection camera 7. In this example, a filter setting button 74a and an advanced setting button 74b are arranged. When the operator operates the filter setting button 74a, the image filter when the captured image is recognized is changed. When the advanced setting button 74b is pressed, a recognition condition advanced setting screen (not shown) is displayed in which the recognition conditions such as the reference value for binarization (black and white) and color (RGB) are set in detail.

[0047] When the re-recognition button 76 is pressed, the mounting position of the unconfirmed component D1 on the first board Ba is re-imaged by the inspection camera 7 using the lighting conditions set in the lighting condition change area 73. The re-imaged image is then re-recognized by the recognition processing unit 36 ​​using the recognition conditions set in the recognition condition change area 74. The recognition processing result display area 71 displays the re-recognition processing result by the recognition processing unit 36 ​​(in this example, "normal installation"). The re-imaged image is displayed in the captured image display area 72. Note that re-imaging by the inspection camera 7 and re-recognition processing by the recognition processing unit 36 ​​can be performed by pressing the re-recognition button 76, or may be performed each time the buttons in the lighting condition change area 73 and the recognition condition change area 74 are operated to change the conditions.

[0048] 6, when the automatic adjustment button 75 is pressed, the lighting conditions and recognition conditions are automatically changed in a predetermined procedure, re-imaging is performed by the inspection camera 7 and re-recognition processing is performed by the recognition processing unit 36, and the displays in the recognition processing result display area 71 and the captured image display area 72 are updated. When the decision button 77 is pressed, the inspection conditions 34b are changed to the conditions set in the lighting condition change area 73 and the recognition condition change area 74, and the inspection result is changed to the inspection result after the re-recognition processing (hereinafter referred to as the "adjusted inspection result").

[0049] Specifically, the output unit 40 replaces the inspection result of the unconfirmed component D1 included in the provisional inspection result 34c with the post-adjustment inspection result, and outputs the result to the component mounters M2-M3 as the inspection result 21b for the first board Ba. The output unit 40 also replaces the pass / fail judgment result of the unconfirmed component D1 included in the provisional inspection result 34c with the result of the re-recognition process, and outputs the result to the management computer 3 as the pass / fail judgment result 51b for the first board Ba. Note that instead of replacing only the re-inspection result of the unconfirmed component D1 with the provisional inspection result 34c, the inspection unit 42 may re-inspect the entire first board Ba under the adjusted inspection conditions 34b and use the post-adjustment inspection result as the inspection result 21b.

[0050] In this way, output unit 40, which outputs inspection result 21b obtained by inspection unit 42, outputs inspection result 21b to component mounting devices M2-M4, including the post-adjustment inspection result of the first board Ba inspected by inspection unit 42 of inspection device M4, whose inspection conditions 34b have been adjusted after the inspection of the first board Ba. That is, inspection result 21b does not include at least the inspection result of unconfirmed component D1 on the first board Ba before the adjustment of inspection conditions 34b. Then, correction value calculation unit 23 of component mounting devices M2-M3 calculates the correction value when mounting component D on board B, based on inspection result 21b including the post-adjustment inspection result of unconfirmed component D1 mounted on the first board Ba, which was obtained by inspection device M4, whose inspection conditions 34b have been adjusted after the inspection of the first board Ba.

[0051] 6, when the worker looks at the captured image in which the inspection conditions 34b have been adjusted and determines that the unconfirmed component D1 is not mounted on the first board Ba, the worker presses the "fail" button 78. The processing after pressing the "fail" button 78 is the same as when the "fail" button 63 on the pass / fail determination screen 60 is pressed, and a detailed description thereof will be omitted. In this manner, the inspection input unit 32 is an input unit that accepts input of the worker's confirmation results of the captured image. Note that when the "adjust inspection conditions" button 64 on the pass / fail determination screen 60 is pressed, the adjustment of the inspection conditions 34b and the acquisition of the post-adjustment inspection results may be automatically performed. In other words, when the worker's confirmation results with reference to the pass / fail determination screen 60 are normal (the "adjust inspection conditions" button 64 is pressed), the instruction unit 39 may instruct the worker to adjust the inspection conditions 34b.

[0052] 3, the management processing device 50 of the management computer 3 includes a management storage unit 51, a repair processing unit 52, a management input unit 53, a management display unit 54, and a management communication unit 55. The management input unit 53 is an input device such as a keyboard, touch panel, or mouse, and is used for inputting operation commands and data. The management display unit 54 is a display device such as an LCD panel, and displays various information such as various screens, including an operation screen for operation by the management input unit 53. The management communication unit 55 is a communication interface, and sends and receives signals and data between the first conveyor M1, component mounting devices M2 to M3, inspection device M4, and second conveyor M5 via the communication network 2.

[0053] Management memory unit 51 is a storage device that stores production data 51a, pass / fail judgment results 51b, etc. Production data 51a includes information such as the production model name of the mounted board (board name), the type (component name) of component D to be mounted on board B, the size of component D, the mounting position (XY coordinates), the mounting direction (θ direction), component mounting devices M2 to M3 (component mounting unit 16) that mount component D, the mounting position of tape feeder 12 that supplies component D, information identifying mounting head 15, and the mounting position of the nozzle. Pass / fail judgment results 51b store the pass / fail judgment results for each board B sent (output) from inspection device M4.

[0054] 3, based on the pass / fail determination result 51b, the repair processing unit 52 supports the repair processing of the defective board in the component mounting system 1. Specifically, when the defective board is transported from the inspection device M4 to the second conveyor M5, the repair processing unit 52 displays an instruction on an information terminal (not shown) carried by the worker to remove the defective board B1 (see FIG. 1) from the second conveyor M5 and to carry out the repair work.

[0055] Furthermore, when the board B1 after the repair work is reloaded from the first conveyor M1, the component mounting devices M2 to M3 are instructed to mount components D in the mounting positions where components D have not been mounted, and the inspection device M4 is instructed to inspect the state of the mounted components D. Note that the state of the components D mounted on the reloaded board B1 inspected by the inspection device M4 is used to determine whether the board B1 is acceptable or not, but is not fed back to the component mounting devices M2 to M3 as the inspection result 21b.

[0056] Next, a component mounting method for mounting components D on the first board Ba in the component mounting system 1 will be described with reference to the flow in Fig. 7. First, the component mounting units 16 of the component mounting devices M2 to M3 of the component mounting system 1 mount the components D on the first board Ba using the correction values ​​included in the correction value information 21c (ST1: component mounting process). The first board Ba on which the components D have been mounted is transported to the inspection device M4. The inspection unit 42 of the inspection device M4 captures an image of the components D mounted on the first board Ba and inspects the state of the components D mounted on the first board Ba (ST2: inspection process). The inspection results are stored in the inspection storage unit 34 as provisional inspection results 34c.

[0057] Next, the determination unit 37 determines whether the inspection result is normal or not based on the provisional inspection result 34c (ST3: determination step). If the inspection result is determined to be normal (Yes in ST3), the output unit 40 outputs (transmits) the mounting position deviation amounts ΔX, ΔY, and Δθ included in the provisional inspection result 34c as the inspection result 21b to the component mounting devices M2 to M3 (ST4: inspection result output step). Next, the correction value calculation unit 23 of the component mounting devices M2 to M3 calculates a correction value for mounting the component D on the board B based on the inspection result 21b obtained by the inspection device M4 (ST5: correction value calculation step). Next, if there is an unmounted board B in the component mounting devices M2 to M3 (No in ST6), the process returns to the component mounting step (ST1), and the component D is mounted on the board B using the calculated correction value.

[0058] In FIG. 7, when the inspection result is judged to be abnormal in the judgment process (ST3) (No in ST3), the display processing unit 38 causes the inspection display unit 33 to display a pass / fail judgment screen 60, and causes the captured image of the mounting position of the unconfirmed component D1 on the first board Ba to be displayed in the captured image display area 62 (ST7: captured image display process) (FIG. 5).

[0059] When the worker checks the captured image, determines that the inspection conditions 34b need to be adjusted, and presses the inspection condition adjustment button 64 on the pass / fail judgment screen 60 (Yes in ST8), the display processing unit 38 causes the inspection display unit 33 to display the inspection condition adjustment screen 70 (FIG. 6). The worker uses the inspection condition adjustment screen 70 to adjust the inspection conditions 34b (ST9: inspection condition adjustment step), and causes the inspection camera 7 to re-image the mounting position of the unconfirmed component D1 under the adjusted inspection conditions 34b, causing the recognition processing unit 36 ​​to re-recognize the unconfirmed component D1 (ST10: re-inspection step).

[0060] 7, when the operator determines that the reinspection results are normal and presses the decision button 77 (Yes in ST11), the output unit 40 outputs (transmits) the post-adjustment inspection results to the component mounting devices M2 to M3 (ST12: post-adjustment inspection result output step). Next, a correction value calculation step (ST5) is executed, and the correction value calculation units 23 of the component mounting devices M2 to M3 calculate correction values ​​based on the post-adjustment inspection results (inspection results 21b) obtained by the inspection device M4. Thereafter, if there is a board B on which components are not mounted (No in ST6), the process returns to the component mounting step (ST1), and components D are mounted on the board B using the calculated correction values.

[0061] As described above, in the component mounting method of this embodiment, after inspecting the first board Ba (after ST2), the inspection conditions 34b of the inspection device M4 are adjusted (ST9), the first board Ba is inspected using the inspection device M4 for which the inspection conditions 34b have been adjusted, and post-adjustment inspection results are obtained (ST10), and based on the post-adjustment inspection results, a correction value for when mounting the component D on the board B is calculated (ST5). This allows the inspection results 21b of the component D mounted on the board B to be appropriately fed back.

[0062] 7, if the confirmation result is abnormal and the defective button 63 is pressed on the pass / fail judgment screen 60 (No in ST8), or if the reinspection result is abnormal and the defective button 78 is pressed on the inspection condition adjustment screen 70 (No in ST11), the instruction unit 39 instructs repair of the first board Ba (ST13: repair instruction step). Thereafter, if there is an unmounted board B (No in ST6), the process returns to the component mounting step (ST1), and components D are mounted on board B using the correction value. In this way, in the component mounting method of this embodiment, after the inspection condition 34b is adjusted (after ST9), the post-adjustment inspection result of the first board Ba is acquired (ST10) before the first board Ba is removed from the inspection device M4.

[0063] As described above, the component mounting system 1 of this embodiment includes an inspection device M4 that captures an image of the component D mounted on the board B to inspect the state of the component D mounted on the board B, a correction value calculation unit 23 that calculates a correction value for mounting the component D on the board B based on the inspection result 21b obtained by the inspection device M4, and a component mounting unit 16 that mounts the component D on the board B using the correction value. The inspection result 21b includes a post-adjustment inspection result obtained by inspecting the first board Ba by the inspection device M4 in which the inspection conditions 34b have been adjusted after the inspection of the first board Ba. This allows the inspection result 21b of the component D mounted on the board B to be appropriately fed back.

[0064] Although the component mounting system 1 described above has been described as an example in which the inspection result 21b of the inspection device M4 is transmitted to the component mounting devices M2 to M3, and the component mounting devices M2 to M3 calculate the correction values, the present invention is not limited to this configuration. For example, the management computer 3 (management device) may be configured to include a correction value calculation unit 23, transmit the inspection result 21b of the inspection device M4 to the management computer 3, and the management computer 3 calculates and transmits the correction values ​​to the component mounting devices M2 to M3. That is, the management computer 3 (management device) includes a correction value calculation unit 23 that calculates a correction value for when the component mounting devices M2 to M3 mount the component D on the board B, based on the inspection result 21b obtained by the inspection device M4, and the inspection result 21b includes the adjusted inspection result.

[0065] In the above example, the pass / fail judgment screen 60 and the inspection condition adjustment screen 70 are displayed on the inspection display unit 33 (display unit) of the inspection device M4, and the operator operates the inspection input unit 32 (input unit) to input the confirmation results, judge the reinspection results, and adjust the inspection conditions 34b. However, the present invention is not limited to this configuration. For example, the display processing unit 38 may be configured to display the pass / fail judgment screen 60 and the inspection condition adjustment screen 70 on the management display unit 54 of the management computer 3 (management device) and accept operations from the management input unit 53 (input unit). In this configuration, the operator can adjust the inspection conditions 34b remotely from the management computer 3 installed away from the inspection device M4. [Industrial Applicability]

[0066] The component mounting system, management device, component mounting device, inspection device, and component mounting method of the present invention have the effect of being able to appropriately feed back inspection results of components mounted on a board, and are useful in the field of mounting components on a board. [Explanation of symbols]

[0067] 1. Component mounting system 3. Management computer (management device) 16 Component mounting section 42 Inspection Department B, B1 board Ba 1st board (board) D parts D1 Unidentified parts (parts) M2~M3 component mounting equipment M4 Inspection Device

Claims

1. an inspection device that takes an image of a component mounted on a board and inspects the state of the component mounted on the board; a correction value calculation unit that calculates a correction value when mounting the component on the board based on the inspection result obtained by the inspection device; a component mounting unit that mounts components on a board using the correction value, A component mounting system, wherein the inspection results include post-adjustment inspection results obtained by inspecting the first board using the inspection device whose inspection conditions have been adjusted after the inspection of the first board.

2. The component mounting system according to claim 1 , wherein the inspection results do not include the inspection results of the first board before the inspection conditions were adjusted.

3. 3. The component mounting system according to claim 1, wherein after the inspection conditions are adjusted, the post-adjustment inspection result of the first board is acquired before the first board is removed from the inspection device.

4. a determination unit that determines whether the test result is normal; The component mounting system according to claim 1 , further comprising: a display unit that displays an image of the component acquired by the inspection device if the inspection result is not normal.

5. an input unit that receives an input of a confirmation result of the image by an operator; The component mounting system according to claim 4 , further comprising: an instruction unit that instructs adjustment of the inspection conditions when the confirmation result is normal.

6. The component mounting system according to claim 5 , wherein, when the check result is not normal, the instruction unit instructs that the first board be repaired.

7. a correction value calculation unit that calculates a correction value when a component mounting device mounts a component on a board based on an inspection result obtained by an inspection device that takes an image of the component mounted on the board and inspects the state of the component mounted on the board, The inspection results include post-adjustment inspection results obtained by inspecting the first substrate using the inspection device whose inspection conditions have been adjusted after the inspection of the first substrate.

8. a component mounting unit that mounts the component on the board using a correction value for mounting the component on the board, the correction value being calculated based on an inspection result obtained by an inspection device that takes an image of the component mounted on the board and inspects the state of the component mounted on the board; The component mounting device, wherein the inspection results include post-adjustment inspection results obtained by inspecting the first board using the inspection device whose inspection conditions have been adjusted after the inspection of the first board.

9. an inspection unit that takes an image of a component mounted on a board and inspects the state of the component mounted on the board; an output unit that outputs the inspection result obtained by the inspection unit, The inspection device, wherein the inspection results include post-adjustment inspection results obtained by inspecting the first substrate by the inspection unit whose inspection conditions have been adjusted after the inspection of the first substrate.

10. taking an image of the components mounted on the board to inspect the state of the components mounted on the board; calculating a correction value for mounting the component on the board based on the inspection results obtained; Mounting the component on the board using the correction value; After inspecting the first substrate, adjust the inspection conditions; Inspecting the first substrate under the adjusted inspection conditions to obtain an adjusted inspection result; a component mounting method for calculating a correction value to be used when mounting the component on the board based on the post-adjustment inspection result.

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