SUBSTRATE PROCESSING MODULE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

Abstract

A substrate processing module 14 of a substrate processing device 10 comprises: a first bath and a second bath 32, 30 that are arrayed in a first direction and in which substrates can be disposed; and two first transport units 34, 36 that transport the substrates W. One first transport unit 34 comprises a second chuck 34a that can be lifted and lowered and is disposed inside the second bath 30 while holding the substrates W. The other first transport unit 36 comprises a first chuck 36a that can be lifted and lowered and is disposed inside the first bath 32 while holding the substrates W. At least one of the second chuck 34a and the first chuck 36a can be moved between a position above the second bath 30 and a position below the first bath 32. The second chuck 34a and the first chuck 36a are configured to be able to pass the substrates W therebetween.

Description

[Technical Field]

[0001] The present invention relates to a substrate processing module for processing a substrate and a substrate processing apparatus including the same. [Background technology]

[0002] Patent Document 1 discloses a substrate processing apparatus having multiple pairs of chemical tanks and cleaning tanks arranged in the longitudinal direction of the apparatus, as well as a main transport mechanism and an auxiliary transport mechanism. The main transport mechanism moves multiple substrates in the longitudinal direction from one end of the apparatus to the other. The auxiliary transport mechanism moves the multiple substrates in the longitudinal direction and up and down within the range of the pair of chemical tanks and cleaning tanks. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2018-56158 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to improve the throughput of a substrate processing apparatus that processes substrates using a plurality of tanks by increasing the operating rate of each of the plurality of tanks. [Means for solving the problem]

[0005] In order to solve the above-mentioned problems, according to one aspect of the present invention, a first tank and a second tank arranged in a first direction and capable of accommodating a substrate; two first transport units that transport the substrate; one of the first transfer units includes a first chuck that is movable up and down and is disposed in the first tank while holding a substrate; the other first transfer unit includes a second chuck that is movable up and down and is disposed in the second tank while holding a substrate; At least one of the first chuck and the second chuck is movable between a position above the first tank and a position above the second tank, A substrate processing module is provided, in which the first chuck and the second chuck are configured to be able to transfer a substrate therebetween.

[0006] According to another aspect of the present invention, A substrate processing apparatus is provided, comprising the substrate processing module and another module coupled to the substrate processing module in a second direction intersecting the first direction. [Effects of the Invention]

[0007] According to the present invention, in a substrate processing apparatus that processes substrates using a plurality of tanks, the operating rate of each of the plurality of tanks can be increased, thereby improving the throughput of the substrate processing apparatus. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of a substrate processing apparatus according to a first embodiment of the present invention; [Figure 2] 1 is a perspective view of a chemical module in a substrate processing apparatus; [Figure 3A] FIG. 10 is a perspective view showing a state in which a first chuck of one first transfer unit and a second chuck of the other first transfer unit are positioned above a first tank and a second tank, respectively; [Figure 3B] FIG. 10 is a perspective view showing a state in which a first chuck of one first transfer unit and a second chuck of the other first transfer unit are positioned inside the first tank and the second tank, respectively; [Figure 3C] FIG. 10 is a perspective view showing a state in which both a first chuck of one first transfer unit and a second chuck of the other first transfer unit are positioned above the first tank; [Figure 4A] FIG. 10 is a side view showing a state in which a first chuck of one first transfer unit and a second chuck of the other first transfer unit are positioned above a first tank and a second tank, respectively. [Figure 4B]FIG. 10 is a side view showing a state in which a first chuck of one first transfer unit and a second chuck of the other first transfer unit are positioned inside the first tank and the second tank, respectively. [Figure 4C] FIG. 10 is a side view showing a state in which both the first chuck of one first transfer unit and the second chuck of the other first transfer unit are positioned above the first tank. [Figure 5] FIG. 10 is a top view showing a state in which both the first chuck of one first transfer unit and the second chuck of the other first transfer unit are positioned above the first tank. [Figure 6] Diagram showing the transfer of a substrate between the first chuck and the second chuck [Figure 7] FIG. 10 is a perspective view of a second transfer unit holding a substrate in the substrate processing apparatus according to the first embodiment; [Figure 8] FIG. 1 is a perspective view showing a chuck in a second transfer unit of the substrate processing apparatus according to the first embodiment; [Figure 9] Diagram showing the chuck holding and releasing the substrate [Figure 10] FIG. 10 is a diagram illustrating the transfer of a substrate from a chuck of the second transfer unit to a second chuck of the other first transfer unit. [Figure 11] FIG. 10 is a diagram showing the transfer of a substrate from a first chuck of one of the first transfer units to a chuck of the second transfer unit. [Figure 12A] FIG. 10 is a diagram showing an operation in an example of substrate processing performed by the substrate processing apparatus. [Figure 12B] 12B shows the operation following the operation shown in FIG. 12A. [Figure 12C] FIG. 12C shows the operation following the operation shown in FIG. 12B. [Figure 12D] 12D shows the operation following the operation shown in FIG. 12C. [Figure 12E] 12D shows the operation following the operation shown in FIG. 12D. [Figure 12F] 12B shows the operation following the operation shown in FIG. 12E. [Figure 12G] 12F shows the operation following the operation shown in FIG. 12F. [Figure 12H] 12B shows the operation following the operation shown in FIG. 12G. [Figure 12I] 12H shows the operation following the operation shown in FIG. 12H. [Figure 12J] 12A and 12B show operations subsequent to the operations shown in FIG. 12I. [Figure 13] FIG. 10 is a perspective view of a substrate processing apparatus according to a second embodiment. [Figure 14] FIG. 10 is a side view of a chemical module in the substrate processing apparatus according to the second embodiment. [Figure 15] FIG. 10 is a perspective view of a second transfer unit in the substrate processing apparatus according to the second embodiment; [Figure 16] FIG. 10 is a perspective view showing a plurality of first transfer units in the substrate processing apparatus according to the second embodiment; [Figure 17] FIG. 11 is a perspective view of a plurality of second transfer units in the substrate processing apparatus according to the third embodiment; [Figure 18A] FIG. 10 is a side view illustrating the supply of a plurality of substrates from one second transfer unit to the second chuck of the other first transfer unit. [Figure 18B] FIG. 10 is a top view illustrating the feeding of a plurality of substrates from one second transport unit to the second chuck of the other first transport unit. [Figure 19A] FIG. 10 is a side view illustrating collection of a plurality of substrates from a first chuck of one first transfer section to a second transfer section of the other. [Figure 19B] FIG. 10 is a top view illustrating the collection of a plurality of substrates from a first chuck of one first transfer section to a second transfer section of the other. [Figure 20] FIG. 10 is a perspective view of a first chuck of one first transfer unit and a second chuck of the other first transfer unit in a substrate processing apparatus according to another embodiment; [Figure 21] FIG. 10 is a diagram illustrating the transfer of a substrate between a first chuck of one first transfer unit and a second chuck of the other first transfer unit. DETAILED DESCRIPTION OF THE INVENTION

[0009] A substrate processing module according to one embodiment of the present invention comprises a first tank and a second tank arranged in a first direction and capable of placing substrates therein, and two first transport units for transporting the substrates, one of the first transport units having a first chuck that is movable up and down and is positioned within the first tank while holding a substrate, and the other of the first transport units having a second chuck that is movable up and down and is positioned within the second tank while holding a substrate, at least one of the first chuck and the second chuck being movable between a position above the first tank and a position above the second tank, and the first chuck and the second chuck being configured to allow substrates to be transferred between them.

[0010] According to this aspect, in a substrate processing apparatus that processes substrates using a plurality of tanks, the operating rate of each of the plurality of tanks can be increased, thereby improving the throughput of the substrate processing apparatus.

[0011] For example, the first chuck may be a comb-tooth chuck on which the substrate is placed, and the second chuck may be a comb-tooth chuck on which the substrate is placed, and the first chuck and the second chuck may be capable of passing relative to each other in an up-and-down direction.

[0012] For example, the first tank is a cleaning tank, and the second tank is a tank in which the substrate is immersed. medicine It may also be a chemical tank for storing a liquid.

[0013] For example, the second chuck may be movable between a position above the first tank and a position above the second tank.

[0014] For example, the first chuck may receive the substrate held by the second chuck at a position above the first tank.

[0015] For example, the substrate processing module may further include a second transport unit that transports the substrate in a second direction that intersects with the first direction.

[0016] For example, the second transport part may supply the substrate to the second chuck and retrieve the substrate held by the first chuck.

[0017] The second transfer part may supply the substrate to the second chuck at a position above the first tank and retrieve the substrate supported by the first chuck.

[0018] A substrate processing apparatus according to another aspect of the present invention includes the substrate processing module and another module coupled to the substrate processing module in a second direction intersecting the first direction.

[0019] According to this aspect, in a substrate processing apparatus that processes substrates using a plurality of tanks, the operating rate of each of the plurality of tanks can be increased, thereby improving the throughput of the substrate processing apparatus.

[0020] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0021] (Embodiment 1) 1 is a perspective view of a substrate processing apparatus according to a first embodiment of the present invention. Note that the XYZ Cartesian coordinate system shown in the figure is intended to facilitate understanding of the invention and is not intended to limit the invention. The X-axis direction is the front-rear direction (first direction) of the substrate processing apparatus, the Y-axis direction is the left-right direction (second direction), and the Z-axis direction is the height direction (third direction).

[0022] 1, the substrate processing apparatus 10 according to the first embodiment is an apparatus for processing a substrate W, and is configured by connecting a plurality of modules each having a different function in the Y-axis direction (second direction). The substrate W is a circular thin plate, such as a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a substrate for an optical disk, a MEMS sensor substrate, or a solar cell panel.

[0023] In the first embodiment, the substrate processing apparatus 10 includes a load module 12, a chemical module (substrate processing module) 14, a drying module 16, and an unload module 18. These modules 12, 14, 16, and 18 are connected in the Y-axis direction (second direction). A substrate W is loaded into the load module 12 from outside, and in the chemical module 14, the substrate W loaded into the load module 12 is subjected to chemical processing. In the drying module 16, the substrate W that has been processed in the chemical module 14 is subjected to drying processing. The substrate W that has been dried in the drying module 16 is unloaded from the unload module 18 to the outside. The module configuration may be changed depending on the type of substrate W and the processing content. For example, the substrate processing apparatus 10 may include multiple chemical modules 14 that perform different processes on the substrate W.

[0024] The substrate processing apparatus 10 also has a second transport unit 20 that transports substrates W in the Y-axis direction (second direction) between the multiple modules. The second transport unit 20 includes an actuator 25 and a chuck 26 that is moved in the Y-axis direction by the actuator 25. The actuator 25 is composed of, for example, rails 22 that are provided on and connect the multiple modules 12 to 18, and a moving head 24 (moving body) that moves along the rails 22. The chuck 26 is supported by the moving head 24 to hold the substrate W. The moving head 24 moves along the rails 22 in the Y-axis direction, along which the multiple modules 12 to 18 are arranged, so that the chuck 26 moves so as to pass through each of the multiple modules 12 to 18. The second transport unit 20 will be described in detail later. In this way, the multiple substrates W are transported in the second direction.

[0025] FIG. 2 is a schematic perspective view of a chemical module in the substrate processing apparatus.

[0026] In the chemical module 14 shown in FIG. 2, the substrate W is subjected to a process using, for example, APM (ammonium hydroxide-hydrogen peroxide mixture) cleaning, SPM (sulfuric acid-hydrogen peroxide mixture) cleaning, and HPM (hydrochloric acid-hydrogen peroxide mixture) cleaning. Cleaning Various chemical liquid cleaning such as DHF (diluted hydrofluoric acid) cleaning, and various chemical liquid processing such as etching and resist stripping are performed. These chemical liquid processing can be arbitrarily combined depending on the type of chemical liquid processing to be performed on the substrate W.

[0027] The chemical module 14 of the substrate processing apparatus 10 has a first tank 32 and a second tank 30 arranged in the X-axis direction (first direction) as processing tanks for processing the substrate W, in which the substrate W can be placed. The second tank 30 is located at the rear side of the substrate processing apparatus 10, and the first tank 32 is located at the front side of the substrate processing apparatus 10. In the case of the first embodiment, the second tank 30 is a chemical tank that stores a chemical tank in which the substrate W is immersed, and the first tank 32 is a cleaning tank that stores a cleaning liquid such as pure water in which the substrate W that has been processed with the chemical liquid is immersed.

[0028] The chemical module 14 of the substrate processing apparatus 10 also has a plurality of first transport parts 34, 36 that move the substrate W up and down in the Z-axis direction (third direction).

[0029] Fig. 3A is a perspective view showing a state in which the first chuck of one first transfer unit and the second chuck of the other first transfer unit are positioned above the first tank and the second tank, respectively. Fig. 3B is a perspective view showing a state in which the first chuck of one first transfer unit and the second chuck of the other first transfer unit are positioned inside the first tank and the second tank, respectively. Fig. 3C is a perspective view showing a state in which both the first chuck of one first transfer unit and the second chuck of the other first transfer unit are positioned above the first tank.

[0030] Furthermore, Fig. 4A is a side view showing a state in which the first chuck of one first transfer unit and the second chuck of the other first transfer unit are positioned above the first tank and the second tank, respectively. Furthermore, Fig. 4B is a side view showing a state in which the first chuck of one first transfer unit and the second chuck of the other first transfer unit are positioned inside the first tank and the second tank, respectively. And Fig. 4C is a side view showing a state in which both the first chuck of one first transfer unit and the second chuck of the other first transfer unit are positioned above the first tank. Note that Fig. 3A corresponds to Fig. 4A, Fig. 3B corresponds to Fig. 4B, and Fig. 3C corresponds to Fig. 4C.

[0031] As shown in Figures 3A to 3C and 4A to 4C, in the case of this embodiment 1, the other first transport section 34 includes a second chuck 34a that holds multiple substrates W, an arm 34b that supports the second chuck 34a, an actuator 34c that raises and lowers the arm 34b in the Z-axis direction (third direction), and an actuator 34d that moves the actuator 34c in the X-axis direction (first direction).

[0032] The second chuck 34a can be raised and lowered by the actuator 34c, so that the second chuck 34a can be placed in the second tank 30, as shown in Figures 3B and 4B. The second chuck 34a can be moved between a position above the second tank 30 and a position above the first tank 32 by the actuator 34d, as shown in Figures 3A, 3C, 4A, and 4C.

[0033] In the present embodiment 1, the first transport section 36 includes a first chuck 36a that holds multiple substrates W, an arm 36b that supports the first chuck 36a, and an actuator 36c that raises and lowers the arm 36b in the Z-axis direction (third direction).

[0034] The first chuck 36a can be raised and lowered by the actuator 36c, thereby allowing the first chuck 36a to be placed in the first tank 32, as shown in Figures 3B and 4B. Note that in the case of the present embodiment 1, the first chuck 36a, unlike the second chuck 34a, does not move in the X-axis direction (first direction).

[0035] 3A, the actuators 34c and 34d of the first transfer section 34 are disposed on one side (the right side in the case of the first embodiment) in the Y-axis direction (second direction) relative to the second tank 30. The actuator 36c of the first transfer section 36 is disposed on one side in the X-axis direction (first direction) relative to the first tank 32, i.e., in front of the first tank 32 (the opposite side of the second tank 30 across the first tank 32).

[0036] As shown in FIG. 3A, in the first embodiment, the second chuck 34a of the first transfer part 34 and the first chuck 36a of the first transfer part 36 have corresponding shapes so that the substrate W can be transferred between them.

[0037] For example, in the case of the first embodiment, the second chuck 34a and the first chuck 36a are comb-shaped chucks when viewed from above (when viewed in the Z-axis direction).

[0038] Specifically, the second chuck 34a includes a main body 34e connected to the arm 34b and a plurality of support rods 34f extending forward from the main body 34e in the X-axis direction (first direction) and on which the plurality of substrates W are placed. Similarly, the first chuck 36a includes a main body 36d connected to the arm 36b and a plurality of support rods 36e extending backward from the main body 36d in the X-axis direction and on which the plurality of substrates W are placed. Each of the support rods 34f, 36e has a plurality of grooves (not shown) formed therein that engage with the outer circumferential edges of the plurality of substrates W to maintain the plurality of substrates W at a predetermined interval. As a result, the plurality of substrates W are held by the first and second chucks 36a, 34a in an overlapping state with intervals in the X-axis direction. In the first embodiment, the second chuck 34a and the first chuck 36a each include four support rods 34f, 36e. The number of support rods on which the substrate W is placed may be three or more, and may be different between the second chuck 34a and the first chuck 36a.

[0039] In the first embodiment, the second chuck 34a and the first chuck 36a are configured so that the respective plurality of support rods 34f, 36e can pass through each other in the Z-axis direction (third direction).

[0040] Fig. 5 is a top view showing a state in which both the first chuck of one first transfer unit and the second chuck of the other first transfer unit are positioned above the first tank, and Fig. 6 is a view showing the transfer of the substrate between the first chuck and the second chuck.

[0041] 5, in the first embodiment, the transfer of multiple substrates W between the second chuck 34a and the first chuck 36a is performed above the first tank 32. During the transfer of the substrates W, the multiple support rods 34f of the second chuck 34a and the multiple support rods 36e of the first chuck 36a are positioned between the main body 34e of the second chuck 34a and the main body 36d of the first chuck 36a. This allows the multiple support rods 34f of the second chuck 34a and the multiple support rods 36e of the first chuck 36a to come into contact with the multiple substrates W simultaneously, as shown in FIG.

[0042] 5 and 6, when transferring the substrates W, the support rods 34f of the second chuck 34a and the multiple support rods 36e of the first chuck 36a do not overlap in the Z-axis direction (third direction) of the first and second chucks 36a, 34a. Therefore, the first and second chucks 36a, 34a can pass each other in the Z-axis direction without their support rods coming into contact with each other. For example, when the second chuck 34a is lowered from the state shown in FIG. 6, the multiple substrates W remain on the multiple support rods 36e of the first chuck 36a, and the multiple substrates W are transferred to the first chuck 36a.

[0043] In the present embodiment 1, the plurality of substrates W are supplied by the second transport unit 20 from the loading module 12 to the second chuck 34a of the first transport unit 34, and then transferred from the second chuck 34a to the first chuck 36a of the first transport unit 36. The plurality of substrates W on the first chuck 36a are then collected by the second transport unit 20 and transported to the drying module 16. In the present embodiment 1, the supply of the substrates W to the second chuck 34a of the first transport unit 34 and the collection of the substrates W from the first chuck 36a of the first transport unit 36 ​​are performed by the common second transport unit 20.

[0044] Fig. 7 is a perspective view of a second transport unit holding a substrate in the substrate processing apparatus according to embodiment 1. Fig. 8 is a perspective view showing a chuck in the second transport unit. Fig. 9 is a view showing the chuck holding and releasing the substrate.

[0045] As shown in Fig. 1, in the first embodiment, the moving head 24 of the actuator 25 of the second transfer section 20 is disposed in front of and above the substrate processing apparatus 10 (i.e., each of the modules 12 to 18) and moves on rails 22 extending in the Y-axis direction (second direction). As shown in Figs. 4A to 4C, in the chemical module 14, the actuator 25 is disposed on the first tank 32 side in the X-axis direction (first direction). Furthermore, in the first embodiment, the actuator 25 is positioned above the first tank 32. Therefore, the moving head 24 of the actuator 25 moves above the first tank 32 in the Y-axis direction.

[0046] In the case of the first embodiment, as shown in FIGS. 4A to 4C, in the chemical module 14, the actuator 25 of the second transfer section 20 is 30 The actuator 25 is disposed in a drive space S2 isolated from the processing space S1 in which the actuator 25 is disposed. The drive space S2 is provided above the processing space S1. The actuator 25 is installed on an inner top plate 14a of the chemical module 14 that separates the processing space S1 and the drive space S2. That is, the inner top plate 14a is present between the first tank 32 and the moving head 24 that moves on the rails 22 of the actuator 25. This inner top plate 14a prevents foreign matter generated by the movement of the moving head 24 on the rails 22 from falling into the first tank 32.

[0047] In the present embodiment, the chemical module 14 has an inner top panel 14a and an outer top panel 14b disposed above the inner top panel 14a. The actuator 25 is disposed in a drive space S2 formed between the inner top panel 14a and the outer top panel 14b.

[0048] 8, in the first embodiment, the chuck 26 in the second transfer section 20 includes a pair of chuck jaws 26a that rotate about a rotation center line C1 extending in the X-axis direction (first direction) of the substrate processing apparatus 10. The chuck jaws 26a are arranged to face each other in the Y-axis direction (second direction) of the substrate processing apparatus 10.

[0049] As shown in FIG. 9, the chuck jaws 26a of the chuck 26 have a non-circular shape when viewed in the direction in which the rotation center line C1 extends (i.e., when viewed in the X-axis direction (first direction)), and in the case of the first embodiment, have an oval shape. In the case of the first embodiment, the rotation center line C1 passes through the geometric center of the chuck jaws 26a when viewed in the first direction. Note that the rotation center line C1 may be off the geometric center as long as the chuck jaws 26a can hold multiple substrates W. Furthermore, the shape of the chuck jaws 26a is not particularly limited as long as the function of the chuck 26 is not impaired, and may be, for example, an elliptical shape, a rectangular shape, a triangular shape, or the like. Each of the chuck jaws 26a has a first support surface 26b and a second support surface 26c that support the outer peripheral edges of multiple substrates W.

[0050] 9, the chuck 26 holds or releases the substrate W by rotating each of the pair of chuck jaws 26a. Specifically, the chuck 26 can hold the substrate W by each of the pair of chuck jaws 26a taking a holding position (position shown by a solid line) in which the shortest distance D1 between the pair of chuck jaws 26a is smaller than the size w1 of the substrate W in the Y-axis direction (second direction) of the substrate processing apparatus 10. Also, the chuck 26 can release the substrate W by each of the pair of chuck jaws 26a taking a release position (position shown by a broken line) in which the shortest distance D1 is larger than the size w1 of the substrate W in the Y-axis direction. In other words, when the pair of chuck jaws 26a takes the release position, the substrate W can pass between the pair of chuck jaws 26a in the Z-axis direction (third direction) of the substrate processing apparatus 10. In addition, the first and second support surfaces 26b, 26c of each pair of chuck claws 26a are formed with a plurality of grooves (not shown) that engage with the outer peripheral edges of each of the plurality of substrates W to maintain the plurality of substrates W at a predetermined distance.

[0051] 4A to 4C, the chuck 26 is disposed above the first tank 32. As the moving head 24 of the actuator 25 moves in the Y-axis direction (second direction), the chuck 26 passes above the first tank 32 in the Y-axis direction. For this purpose, the second transfer unit 20 includes an arm 28 that connects the moving head 24 and the chuck 26.

[0052] In the first embodiment, as shown in Figures 4A to 4C, the moving head 24 is disposed above the chuck 26. Therefore, the arm 28 connecting them extends in the height direction (Z-axis direction) of the substrate processing apparatus 10, and supports the chuck 26 at its lower end. The arm 28 extending in this height direction is less likely to bend than an arm extending in the X-axis direction (first direction).

[0053] More specifically, if the moving head 24 is not located above the chuck 26, the arm 28 will have at least a portion extending in the X-axis direction (first direction). This portion of the arm 28 extending in the first direction is likely to bend significantly due to its own weight and the weight of the chuck 26. In particular, when the moving head 24 stops, the arm 28 is likely to bend significantly due to the inertia of the chuck 26.

[0054] 4A to 4C, the arm 28 extends at a position away from above the first tank 32. Specifically, as shown in FIG. 4B, the arm 28 does not extend within the processing space S1 and within a space S3 above the first tank 32. As a result, the arm 28 does not pass above the first tank 32. This prevents foreign matter adhering to the arm 28 from falling into the first tank 32.

[0055] 4B, in the present embodiment 1, the chemical module 14 has a hanging plate 14c that separates the space S3 above the first tank 32 from the arm 28 when viewed in the Y-axis direction (second direction). The hanging plate 14c extends from the inner top plate portion 14a in the Z-axis direction (third direction). The hanging plate 14c prevents foreign matter adhering to the arm 28 from moving toward the first tank 32.

[0056] In the first embodiment, the chemical module 14 has a hanging plate 14c and an outer wall portion 14d disposed outside the hanging plate 14c. The arm 28 moves between the hanging plate 14c and the outer wall portion 14d.

[0057] As described above, the chuck 26 of the second transfer section 20 passes above the first tank 32 in the Y-axis direction (second direction). Therefore, the transfer of the substrate W from the chuck 26 to the second chuck 34a of the first transfer section 34 (i.e., the supply of the substrate W) is performed above the first tank 32.

[0058] FIG. 10 is a diagram showing the transfer of the substrate from the chuck of the second transfer unit to the second chuck of the other first transfer unit.

[0059] First, the chuck 26 of the second transfer unit 20, which has received the plurality of substrates W from the load module 12, arrives above the first tank 32 of the chemical module 14. Before or after this arrival, the plurality of support rods 34f of the second chuck 34a of the first transfer unit 34 are positioned below the chuck 26. Next, the second chuck 34a rises, and the plurality of support rods 34f come into contact with the outer circumferential edges of the plurality of substrates W held by the chuck 26. When the plurality of support rods 34f come into contact with the plurality of substrates W, the pair of chuck claws 26a of the chuck 26 rotates, releasing the plurality of substrates W. This completes the transfer of the substrates W from the chuck 26 to the second chuck 34a. After receiving the substrates W, the second chuck 34a moves above the second tank 30 in the X-axis direction (first direction), and then moves into the second tank 30. When the movement of the second chuck 34a to the second tank 30 is completed, the chuck 26 becomes movable in the Y-axis direction (second direction).

[0060] The transfer of the substrate W from the first chuck 36a of the first transfer section 36 to the chuck 26 (ie, the recovery of the substrate W) also takes place above the first tank 32.

[0061] FIG. 11 is a diagram showing the transfer of a substrate from the first chuck of one of the first transfer units to the chuck of the second transfer unit.

[0062] First, the chuck 26 of the second transfer unit 20 arrives above the first tank 32 of the chemical module 14. Then, the pair of chuck jaws 26a of the chuck 26 assumes a release position, which allows the substrates W to pass between them in the Z-axis direction (third direction). Thereafter, the first chuck 36a of the first transfer unit 36 ​​moves upward from within the first tank 32 while holding multiple substrates W. When some of the multiple substrates W pass between the pair of chuck jaws 26a, the pair of chuck jaws 26a rotates and assumes a holding position from the release position. This completes the transfer of the substrates W to the pair of chuck jaws 26a. Once the transfer is complete, the first chuck 36a descends and moves into the first tank 32. Once this movement is complete, the chuck 26 becomes movable in the Y-axis direction (second direction).

[0063] Supplementally, when substrates W are transferred from the first chuck 36a of the first transfer unit 36 ​​to the chuck 26, the arm 36b of the first transfer unit 36 ​​and the chuck claws 26a of the chuck 26 overlap when viewed in the Y-axis direction (second direction), as shown in Fig. 4A. That is, the arm 36b is located between the pair of chuck claws 26a when viewed from above (when viewed in the Z-axis direction). In this state, the chuck 26 cannot move in the Y-axis direction, so the first chuck 36a, which has transferred multiple substrates W to the chuck 26, retreats into the first tank 32. As a result, the chuck 26 can move in the Y-axis direction without being obstructed by the arm 36b, as shown in Fig. 4B.

[0064] In the first embodiment, as described above, the chuck 26 of the second transfer unit 20 transfers the substrate W from the loading module 12 to the second chuck 34a of the first transfer unit 34 in the chemical module 14, and also transfers the substrate W from the first chuck 36a of the first transfer unit 36 ​​to the drying module 16. That is, the chuck 26 transfers the dry unprocessed substrate W and the processed substrate W that is wet with the cleaning liquid in the first tank 32. To this end, the pair of chuck claws 26a of the chuck 26 includes a first support surface 26b for supporting the dry substrate W and a second support surface 26c for supporting the wet substrate W, as shown in FIG. 9 . This prevents the dry substrate W from being supported by the wet support surface. In order to prevent the cleaning liquid on the second support surface 26c from transferring onto the first support surface 26b, a groove 26d extending in the X-axis direction (first direction) along which the rotation center line C1 of the chuck jaws 26a extends is formed between the first support surface 26b and the second support surface 26c. A nozzle (not shown) for sucking and recovering the cleaning liquid accumulated in the groove 26d may be provided on the chuck jaws 26a.

[0065] So far, we have explained the configuration of the substrate processing apparatus 10. From here on, we will explain the operations related to the chemical module 14 of the substrate processing apparatus 10, that is, the operations of the first transfer units 34 and 36 and the second transfer unit 20.

[0066] 12A to 12J show a number of operations in an example of substrate processing performed by the substrate processing apparatus, each of which shows a side view (left) and a front view (right) of a chemical module.

[0067] 12A, first, the second chuck 34a of the first transfer section 34 waits at a position of reference height H0 (initial position) above the first tank 32. Also, the first chuck 36a of the first transfer section 36 waits in the first tank 32. In this state, the chuck 26 of the second transfer section 20 transports a plurality of substrates W (previous substrates W1) to be processed to a position above the first tank 32 at a level higher than the reference height H0.

[0068] 12B, the second chuck 34a of the first transport unit 34 rises, whereby the plurality of substrates W (preceding substrates W1) held by the chuck 26 of the second transport unit 20 via the first support surface 26b are placed on the plurality of support rods 34f of the second chuck 34a. At this time, the plurality of support rods 34f come into contact with the outer circumferential edge of the substrate W (preceding substrate W1) located between the chuck jaws 26a of the chuck 26. Once the plurality of substrates W (preceding substrates W1) have been placed on the plurality of support rods 34f of the second chuck 34a, the chuck 26 of the second transport unit 20 releases the plurality of substrates W.

[0069] 12C, the second chuck 34a of the first transfer unit 34, on which the plurality of substrates W (preceding substrates W1) are placed, moves in the X-axis direction (first direction) toward above the second tank 30, and then descends into the second tank 30. As a result, the plurality of substrates W (preceding substrates W1) are immersed in the chemical solution in the second tank 30 and are processed by the chemical solution. Once the second chuck 34a has completed descending into the second tank 30, the second transfer unit 20 moves to the carry-in module 12 to receive the next substrate to be processed (subsequent substrate).

[0070] 12D, when the chemical treatment of the substrates W (previous substrates W1) is completed, the second chuck 34a rises above the second tank 30 and then moves in the X-axis direction (first direction) above the first tank 32. As a result, the second chuck 34a of the first transporter 34, holding the plurality of chemically treated substrates W (previous substrates W1), is positioned above the first chuck 36a of the first transporter 36.

[0071] 12E, the first chuck 36a of the first transfer section 36 rises, whereby the plurality of substrates W (preceding substrates W1) placed on the plurality of support rods 34f of the second chuck 34a are placed on the plurality of support rods 36e of the first chuck 36a. Then, when the second chuck 34a descends to the initial position of the reference height H0, the transfer of the substrate W (preceding substrate W1) from the second chuck 34a to the first chuck 36a is completed.

[0072] 12F, when the transfer of the substrate W (preceding substrate W1) from the second chuck 34a to the first chuck 36a is completed, the second chuck 34a moves above the second tank 30. This allows the first chuck 36a, which is holding the plurality of substrates W (preceding substrates W1), to descend into the first tank 32. As the first chuck 36a descends into the first tank 32, the plurality of substrates W (preceding substrates W1) are immersed in the cleaning liquid in the first tank 32 and are cleaned.

[0073] 12G, the second chuck 34a moves above the first tank 32. Above the second chuck 34a, the chuck 26 of the second transfer section 20 is positioned, holding, via the first support surface 26b, the plurality of substrates W (the subsequent substrates W2 following the preceding substrate W1) newly received by the loading module 12.

[0074] 12H, the second chuck 34a rises, and the plurality of substrates W (subsequent substrates W2) held by the chuck 26 of the second transfer unit 20 via the first support surface 26b are placed on the plurality of support rods 34f of the second chuck 34a. Once the plurality of substrates W (subsequent substrates W2) have been placed on the plurality of support rods 34f of the second chuck 34a, the chuck 26 of the second transfer unit 20 releases the plurality of substrates W.

[0075] 12I, the second chuck 34a of the first transfer part 34, which is holding the plurality of substrates W (subsequent substrates W2), moves in the X-axis direction (first direction) toward above the second tank 30, and then descends into the second tank 30. As a result, the plurality of substrates W (subsequent substrates W2) are immersed in the chemical solution in the second tank 30 and treated with the chemical solution. As a result, the chemical module 14 of the substrate processing apparatus 10 reaches a state in which the plurality of substrates W (preceding substrates W1) have been cleaned in the first tank 32, and the plurality of substrates W (subsequent substrates W2) have been chemically treated in the second tank 30.

[0076] When cleaning of the plurality of substrates W (preceding substrates W1) in the first tank 32 is completed, the first chuck 36a rises, as shown in FIG. 12J. The plurality of substrates W (preceding substrates W1) placed on the plurality of support rods 36e of the raised first chuck 36a are held by the chuck 26 of the second transport unit 20 via the second support surface 26c. By holding the plurality of substrates W (preceding substrates W1) wet with the cleaning liquid via the second support surface 26c, the first support surface 26b does not get wet. Thereafter, the first chuck 36a retreats into the first tank 32, and the second transport unit 20 transports the substrates W (preceding substrates W1) to the drying module 16. When the chuck 26 of the second transport unit 20 leaves the chemical module 14, the chemical module 14 returns to the state shown in FIG. 12C. Thereafter, the operations shown in FIGS. 12C to 12J are repeatedly performed, whereby a plurality of substrates W are successively processed by the substrate processing apparatus 10. As shown in FIG.

[0077] According to the above-described first embodiment, in the substrate processing apparatus 10 that processes the substrate W using the first and second tanks 32, 30, the operating rate of each of the first and second tanks 32, 30 can be increased, thereby improving the throughput of the substrate processing apparatus 10.

[0078] Specifically, the two first transport units 34, 36 keep the first and second tanks 32, 30 occupied and maintain a state in which substrates W are present therein, improving the availability of the first and second tanks 32, 30. For example, the availability of the first and second tanks 32, 30 is improved compared to when only the first transport unit 34 is used. As a result, the throughput of the substrate processing apparatus 10 is improved.

[0079] (Embodiment 2) This second embodiment differs from the first embodiment described above in that the first transport unit and the second transport unit are different. Therefore, this second embodiment will be described focusing on the differences from the first embodiment. Note that components that are substantially the same as those in the first embodiment described above are given the same reference numerals.

[0080] Fig. 13 is a perspective view of a substrate processing apparatus according to embodiment 2. Fig. 14 is a side view of a chemical module in the substrate processing apparatus according to embodiment 2. Fig. 15 is a perspective view of a second transport unit in the substrate processing apparatus according to embodiment 2. Fig. 16 is a perspective view showing a plurality of first transport units in the substrate processing apparatus according to embodiment 2.

[0081] 13 and 14, in the substrate processing apparatus 110 according to the second embodiment, the actuator 25 of the second transfer section 120 is disposed on the second tank 30 side in the X-axis direction (first direction) of the substrate processing apparatus 110. The actuator 25 of the second transfer section 120 is disposed in an upper portion of the substrate processing apparatus 110.

[0082] 16, in the chemical module 114 of the substrate processing apparatus 110 according to the second embodiment, one of the first transfer units 136 is different from the first transfer unit 36 ​​according to the first embodiment. Specifically, the first chuck 36a of the first transfer unit 136 according to the second embodiment is substantially the same as the first chuck 36a of the first embodiment. On the other hand, the positions of the arm 136b supporting the first chuck 36a of the first transfer unit 136 and the actuator 136c that raises and lowers the arm 136b are different. In the second embodiment, Mu 1 Similar to the arm 34b and the actuator 34c of the first transfer part 34, the arm 36b and the actuator 136c are arranged not in front of the first tank 32 but on one side in the Y-axis direction (second direction) of the first tank 32. As a result, the size of the substrate processing apparatus in the X-axis direction (first direction) is reduced, and the substrate processing apparatus can be made more compact.

[0083] As shown in Fig. 15, in the second embodiment, the chuck 126 of the second transport section 120 is made up of two rotating shafts 126a extending forward from the moving head 24 in the X-axis direction (first direction) and extending parallel to each other, two support bars 126b extending in the X-axis direction and on which a plurality of substrates W are placed, and a plurality of links 126c connecting the rotating shafts 126a and the support bars 126b. Specifically, each of the support bars 126b has two Nori Link 1 Each of the support bars 126b is supported by being suspended from the corresponding rotation shaft 126a via the corresponding support bars 126b and the corresponding support bars 126c. Each of the rotation shafts 126a is rotated about a rotation center line C2 extending in the first direction by a motor (not shown) mounted on the moving head 24 of the actuator 25 so that the distance D2 between the two support bars 126b can be changed. By changing the distance D2, the chuck 126 can hold or release the substrate W. The support bars 126b are formed with a plurality of grooves (not shown) that engage with the outer peripheral edges of each of the plurality of substrates W to maintain the plurality of substrates W spaced apart at a predetermined interval.

[0084] 14 , in the second embodiment, the chuck 126 of the second transfer section 120 moves in the Y-axis direction (second direction) above the first tank 32. That is, above the first tank 32, the chuck 126 of the second transfer section 120 supplies the substrate W to the second chuck 34a of the first transfer section 34 and recovers the substrate W from the first chuck 136a of the first transfer section 136.

[0085] According to the above-described second embodiment, in a substrate processing apparatus 110 that processes substrates W using first and second tanks 32, 30, as in the above-described first embodiment, the operating rate of each of the first and second tanks 32, 30 can be increased, thereby improving the throughput of the substrate processing apparatus 110. (Embodiment 3) The third embodiment differs from the first embodiment in that the second transport unit is different.

[0086] Specifically, in the case of the first embodiment described above, as shown in FIG. 1 , the substrate processing apparatus 10 has one second transport unit 20. Therefore, in the chemical module 14, the supply of the substrate W to the second chuck 34a of the first transport unit 34 and the collection of the substrate W from the first chuck 36a of the first transport unit 36 ​​are performed by this one second transport unit 20. In contrast, the substrate processing apparatus according to the third embodiment has a second transport unit that supplies the substrate W to the second chuck 34a of the first transport unit 34 and another second transport unit that collects the substrate W from the first chuck 36a of the first transport unit 36. The third embodiment will be described focusing on this difference. Note that components that are substantially the same as those in the first embodiment described above are denoted by the same reference numerals.

[0087] Fig. 17 is a perspective view of multiple second transport units in a substrate processing apparatus according to embodiment 3. Figs. 18A and 18B are a side view and a top view showing the supply of multiple substrates from one second transport unit to the second chuck of the other first transport unit. Figs. 19A and 19B are a side view and a top view showing the recovery of multiple substrates from the first chuck of one first transport unit to the other second transport unit.

[0088] 17, the substrate processing apparatus according to the third embodiment has two second transport units 50 and 52 as second transport units. One second transport unit 50 supplies a plurality of substrates W to the second chuck 34a of the first transport unit 34, but does not retrieve the plurality of substrates W held by the first chuck 36a of the first transport unit 36. In contrast, the other second transport unit 52 retrieves the plurality of substrates W held by the first chuck 36a of the first transport unit 36, but does not supply the plurality of substrates W to the second chuck 34a of the first transport unit 34.

[0089] Furthermore, the two second transport units 50, 52 hold the plurality of substrates W in a different manner from the second transport unit 20 of the first embodiment described above. The second transport units 50, 52 are equipped with moving heads 50a, 52a of actuators that move in the Y-axis direction (second direction), and a plurality of support rods 50b, 52b that extend from the moving heads 50a, 52a in the X-axis direction (first direction) of the substrate processing apparatus 10 and on which the plurality of substrates W are placed. 2a The rails of the actuator on which the actuator moves are not shown.

[0090] 18A and 18B, the moving head 50a of the second transfer section 50 is located in front of the first tank 32 when viewed from above (when viewed in the Z-axis direction). A plurality of support rods 50b extend from the moving head 50a toward above the second tank 30. Furthermore, the plurality of support rods 50b do not overlap the plurality of support rods 34f when viewed from above so that the plurality of support rods 34f of the second chuck 34a of the first transfer section 34 can pass through the plurality of support rods 50b in the Z-axis direction (third direction).

[0091] In the third embodiment, as shown in FIG. 18A , the supply of multiple substrates W from the second transporter 50 to the second chuck 34a of the first transporter 34 is performed above the second tank 30. After the second chuck 34a is positioned below the support rods 50b of the second transporter 50, which holds the multiple substrates W, the second chuck 34a is raised. As the second chuck 34a is raised, the support rods 34f of the second chuck 34a pass between the support rods 50b, thereby placing the multiple substrates W on the support rods 34f. Thereafter, when the second transporter 50 moves from above the second tank 30, the second chuck 34a holding the multiple substrates W can descend toward the interior of the second tank 30. Note that when the multiple substrates W are supplied from the second transporter 50 to the second chuck 34a, the first chuck 36a of the first transporter 36 is located within the first tank 32 to avoid contact with the support rods 50b of the second transporter 50.

[0092] 19A and 19B, the moving head 52a of the second transfer unit 52 is located behind the second tank 32 when viewed from above (when viewed in the Z-axis direction). A plurality of support rods 52b extend from the moving head 52a toward above the first tank 32. Furthermore, the plurality of support rods 52b do not overlap the plurality of support rods 36e when viewed from above so that the plurality of support rods 36e of the first chuck 36a of the first transfer unit 36 ​​can pass between the plurality of support rods 52b in the Z-axis direction (third direction).

[0093] In the third embodiment, the collection of the plurality of substrates W from the first chuck 36a of the first transfer section 36 to the second transfer section 52 is carried out above the first tank 32. After the first chuck 36a holding the plurality of substrates W is placed above the second transfer section 52, the first chuck 36a is lowered. Due to this lowering, the plurality of support rods 36e of the first chuck 36a pass between the plurality of support rods 52b, and thereby the plurality of substrates W are placed on the plurality of support rods 52b. Note that the first chuck 36a et al. When the plurality of substrates W are returned to the second transporter 52 , the second chuck 34 a of the first transporter 34 is positioned within the second tank 30 to avoid contact with the support rod 52 b of the second transporter 52 .

[0094] 18A and 19A, the second transport units 50, 52 move at different height levels in the Y-axis direction (second direction) of the substrate processing apparatus 10. That is, the second transport units 50, 52 are spaced apart from each other in the Z-axis direction (third direction) so that they do not interfere with each other even when moving while holding multiple substrates W.

[0095] According to the third embodiment as described above, in a substrate processing apparatus that processes substrates W using the first and second tanks 32, 30, as in the first embodiment, the operating rate of each of the first and second tanks 32, 30 can be increased, thereby improving the throughput of the substrate processing apparatus.

[0096] This third embodiment is particularly useful when there are multiple chemical modules in the substrate processing apparatus or when the immersion time of the substrate W in the second tank 30 and the immersion time of the substrate W in the first tank 32 are significantly different.

[0097] Although the present invention has been described above by way of a number of embodiments, the present invention is not limited to these.

[0098] For example, in the case of the first embodiment described above, the second tank 30 located at the rear of the substrate processing apparatus 10 is a chemical tank, and the first tank 32 located at the front of the substrate processing apparatus 10 is a cleaning tank. However, the present invention is not limited to this. For example, the second tank 30 may be used as a cleaning tank, and the first tank 32 may be used as a chemical tank. In this case, since the second chuck 34a and the first chuck 36a of the first embodiment described above are configured to be able to transfer substrates W to each other, multiple substrates W are transferred from the first chuck 36a of the first transfer unit 36 ​​to the second chuck 34a of the first transfer unit 34.

[0099] In the case of the first embodiment described above, the second transfer unit 20 is movable in the Y-axis direction (second direction) but is not movable in the Z-axis direction (third direction). However, the present invention is not limited to this. The second transfer unit of the substrate processing apparatus according to the embodiment of the present invention is configured to transfer the first chuck and the second chuck of the first transfer unit. 1. Conveyor section The second chucks may take any form as long as they can supply and retrieve a plurality of substrates W to and from each of the second chucks.

[0100] Furthermore, in the case of the first embodiment described above, the second chuck 34a of the other first transfer unit 34 is movable between a position above the second tank 30 and a position above the first tank 32 and is also capable of moving up and down. In contrast, the first chuck 36a of one first transfer unit 36 ​​does not move between a position above the second tank 30 and a position above the first tank 32, but only moves up and down. However, the present invention is not limited to this embodiment. The first chuck of one first transfer unit may also move between a position above the first tank and a position above the second tank. This improves the degree of freedom in setting the position where the substrate is transferred from the second chuck to the first chuck and the position where the substrate is recovered from the first chuck to the second transfer unit.

[0101] In the case of the above-described first embodiment, the position where the substrate W is transferred from the second chuck 34a of the first transport unit 34 to the first chuck 36a of the first transport unit 36, the position where the substrate W is supplied from the second transport unit 20 to the second chuck 34a, and the position where the substrate W is recovered from the first chuck 36a to the second transport unit 20 are set above the first tank 32. This simplifies the structures of the second transport unit 20 and the first transport unit 36. That is, the chuck 26 of the second transport unit 20 and the first chuck 36a of the first transport unit 36 ​​can fulfill their respective roles as long as they are movable in one direction (the former moves only in the Y-axis direction (second direction) of the substrate processing apparatus 10, and the latter moves only in the Z-axis direction (third direction)).

[0102] Furthermore, in the case of the above-described first embodiment, the second chuck 34a of the first transfer unit 34 and the first chuck 36a of the first transfer unit 36 ​​are comb-shaped chucks when viewed from above (as viewed in the Z-axis direction), as shown in Figures 3A and 5. However, the present invention is not limited to this embodiment.

[0103] Fig. 20 is a perspective view of a first chuck of one first transfer unit and a second chuck of the other first transfer unit in a substrate processing apparatus according to another embodiment, and Fig. 21 is a view showing the transfer of a substrate between the first chuck of one first transfer unit and the second chuck of the other first transfer unit.

[0104] 20 and 21 , in a substrate processing apparatus according to another embodiment, a second chuck 234a of a first transfer unit 234 includes a main body 234b, a plate-shaped cantilever 234c extending forward in the X-axis direction (first direction) from the main body 234b, and a plurality of protrusions 234d extending in the X-axis direction while protruding in the Z-axis direction (third direction) from the cantilever 234c. A first chuck 236a of a first transfer unit 236 includes a main body 236b, two plate-shaped cantilever 236c extending rearward in the X-axis direction from the main body 236b, and a plurality of protrusions 236d extending in the X-axis direction while protruding in the Z-axis direction from each of the two cantilever 236c. The plurality of substrates W are placed on the plurality of protrusions 234d of the second chuck 234a and the plurality of protrusions 236d of the first chuck 236a.

[0105] When transferring the plurality of substrates W from the second chuck 234a to the first chuck 236a, the second chuck 234a moves in the X-axis direction (first direction) toward the first chuck 236a. 21 As shown in Fig. 1, the two cantilever beam portions 236c of the first chuck 236a enter the gap between the plurality of substrates W and the cantilever beam portion 234c of the second chuck 234a. After the entry, when the first chuck 236a is raised, the plurality of substrates W are placed on the plurality of protrusion portions 236d of the first chuck 236a.

[0106] 20 and 21, unlike the first and second chucks 36a and 34a of the above-described first embodiment, the first and second chucks 236a and 234a cannot pass each other in the Z-axis direction (third direction). However, similar to the first and second chucks 36a and 34a of the above-described first embodiment, the first and second chucks 236a and 234a can transfer the substrate W to each other.

[0107] In other words, a substrate processing module according to one embodiment of the present invention is, in a broad sense, a substrate processing module comprising: a first tank and a second tank arranged in a first direction and capable of placing substrates; and two first transport units for transporting the substrates, wherein one of the first transport units comprises a first chuck that is movable up and down and is positioned within the first tank while holding a substrate; and the other first transport unit comprises a second chuck that is movable up and down and is positioned within the second tank while holding a substrate; at least one of the first chuck and the second chuck is movable between a position above the first tank and a position above the second tank; and the first chuck and the second chuck are configured to be able to transfer substrates between them.

[0108] Furthermore, a substrate processing apparatus according to another embodiment of the present invention is a substrate processing apparatus comprising the above-mentioned substrate processing module and another module connected to the substrate processing module in a second direction intersecting the first direction.

[0109] As described above, the above-described embodiments have been described as examples of the technology of the present invention. For this purpose, drawings and detailed descriptions are provided. Therefore, the components described in the drawings and detailed descriptions may include not only components essential for solving the problem, but also components that are not essential for solving the problem in order to exemplify the above-described technology. Therefore, the fact that these non-essential components are described in the drawings or detailed descriptions should not be interpreted as immediately indicating that these non-essential components are essential.

[0110] Furthermore, since the above-described embodiments are intended to illustrate the technology of the present invention, various modifications, substitutions, additions, omissions, etc. can be made within the scope of the claims or their equivalents. [Industrial Applicability]

[0111] The present invention is applicable to a substrate processing apparatus that processes substrates using a plurality of tanks. [Explanation of symbols]

[0112] 10. Substrate processing equipment 14 Substrate processing module (chemical module) 30 2nd tank 32 Tank 1 34 First conveying section 34a Second zipper 36 First conveying section 36a First chuck W substrate

Claims

1. a first tank and a second tank arranged in a first direction and capable of accommodating a substrate; two first transport units that transport the substrate; one of the first transfer units includes a first chuck that is movable up and down and is disposed in the first tank while holding a substrate; the other first transfer unit includes a second chuck that is movable up and down and is disposed in the second tank while holding a substrate; At least one of the first chuck and the second chuck is movable between a position above the first tank and a position above the second tank, The substrate processing module is configured so that the first chuck and the second chuck can transfer a substrate therebetween.

2. the first chuck is a comb-shaped chuck on which the substrate is placed, the second chuck is a comb-shaped chuck on which the substrate is placed, The substrate processing module of claim 1 , wherein the first chuck and the second chuck are vertically passable relative to each other.

3. The first tank is a cleaning tank, The substrate processing module according to claim 1 , wherein the second tank is a chemical tank.

4. The substrate processing module of claim 1 , wherein the second chuck is movable between a position above the first tank and a position above the second tank.

5. The substrate processing module according to claim 1 , wherein the first chuck receives the substrate held by the second chuck at a position above the first tank.

6. The substrate processing module according to claim 1 , further comprising a second transport unit configured to transport the substrate in a second direction intersecting the first direction.

7. The substrate processing module according to claim 6 , wherein the second transport part supplies the substrate to the second chuck and retrieves the substrate held by the first chuck.

8. The substrate processing module according to claim 7 , wherein the second transfer part supplies the substrate to the second chuck and retrieves the substrate supported by the first chuck at a position above the first tank.

9. A substrate processing apparatus comprising: the substrate processing module according to claim 1 ; and another module coupled to the substrate processing module in a second direction intersecting the first direction.

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