circuit board

Abstract

A substrate according to an embodiment includes an insulating layer having grains formed therein extending in a first direction, and a circuit pattern arranged on the insulating layer, the insulating layer including an upper surface and a plurality of outer surfaces, the plurality of outer surfaces including a first outer surface extending in a first direction that is the same as the first direction of the grains formed in the insulating layer, and a second outer surface extending in a second direction different from the first direction and excluding the first outer surface, the first outer surface having a first surface roughness, and the second outer surface having a second surface roughness different from the first surface roughness.

Description

[Technical Field]

[0001] The embodiments relate to substrates, and in particular to substrates having a three-dimensional shape. [Background technology]

[0002] In general, with the proliferation of mobile devices, the intelligence of everyday products such as automobiles is accelerating, and the need for electronic circuit systems that fit various product shapes is becoming more and more apparent.

[0003] In particular, in order to realize electronic circuit systems that fit a variety of product groups, it is necessary to develop printed circuit boards that fit various product shapes, but to date there has been no development of process technology for flexible printed circuit boards (PCBs) that can be adapted to three-dimensional object shapes to meet this need.

[0004] However, while conventional polyimide-based flexible printed circuit boards (FPCBs) are simply bent to form three-dimensional connections, in order to be wearable and attach to 3D structures that can be attached to the human body, the material and electrodes must be able to bend and stretch, as well as bend freely into different shapes.

[0005] In other words, the development of multi-layer flexible printed circuit boards (FPCBs) that can support complex information processing capabilities is essential in the development of wearable electronic devices, which are being highlighted as a future business. However, the FPCBs used in conventional mobile devices are rigid-flex type, which combine a conventional rigid multi-layer printed circuit board (PCB) with a flexible connecting circuit. However, in order to prepare for next-generation wearable devices that require more natural deformation, there is an urgent need to develop high-performance multi-layer flexible printed circuit boards (FPCBs) that can be deformed into three-dimensional shapes. Summary of the Invention [Problem to be solved by the invention]

[0006] In the embodiment, a substrate is manufactured by using a directional carrier frame to thermoform a substrate in three dimensions, and the manufactured substrate can be easily separated, and a manufacturing method thereof is provided.

[0007] In the proposed embodiments, the technical problems to be solved are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary skill in the art to which the embodiments pertain from the following description. [Means for solving the problem]

[0008] A substrate according to an embodiment includes an insulating layer having grains formed therein extending in a first direction, and a circuit pattern arranged on the insulating layer, the insulating layer including an upper surface and a plurality of outer surfaces, the plurality of outer surfaces including a first outer surface extending in a first direction that is the same as the first direction of the grains formed in the insulating layer, and a second outer surface extending in a second direction different from the first direction and excluding the first outer surface, the first outer surface having a first surface roughness, and the second outer surface having a second surface roughness different from the first surface roughness.

[0009] The insulating layer also includes a polymer having a nematic structure.

[0010] The insulating layer includes a liquid crystal polymer (LCP) or a high density polyethylene (HDPE).

[0011] Furthermore, the shape of the grains exposed through the first outer surface is different from the shape of the grains exposed through the second outer surface.

[0012] The first outer surface includes a first portion having the first surface roughness and a second portion having the second surface roughness.

[0013] Furthermore, carbon is exposed on at least a portion of the second outer surface.

[0014] Also included is at least one element disposed on the circuit pattern.

[0015] The substrate also includes a protective layer disposed on the insulating layer, covering the surface of the insulating layer and the surface of the circuit pattern.

[0016] The insulating layer also includes at least one flat region and at least one bent region that is bent and extends from the flat region.

[0017] The insulating layer also includes a first flat region and a second flat region, and the first flat region and the second flat region are located on different planes.

[0018] The bending region includes a first bending region bent from one end of the flat region and a second bending region bent from the other end of the flat region, and the first bending region and the second bending region have different bending angles.

[0019] Meanwhile, a method for manufacturing a substrate according to an embodiment includes the steps of: preparing a carrier frame having a grain formed therein extending in a first direction; forming a circuit pattern on a substrate region of the carrier frame; forming a protective layer covering the circuit pattern on the substrate region of the carrier frame; removing at least a portion of an outer region of the substrate region of the carrier frame to form an anchor; thermoforming the carrier frame and the circuit pattern arranged on the substrate region; and separating a substrate consisting of the carrier frame and the circuit pattern located on the substrate region from the anchor by applying shear stress to one end of the anchor, wherein the outer region of the substrate region includes a first outer region extending in a first direction identical to the direction of the grain and a second outer region extending in a second direction different from the first direction, and the removing to form an anchor step includes laser processing or cutting the second outer region to form an anchor in the first outer region.

[0020] The carrier frame also includes a polymer having a nematic structure.

[0021] The carrier frame includes a liquid crystal polymer (LCP) or a high density polyethylene (HDPE).

[0022] Further, the outer surface of the carrier frame constituting the separated substrate includes a first outer surface extending in a first direction that is the same as the direction of the grain and corresponding to the first outer region, and a second outer surface extending in a second direction different from the first direction and corresponding to the second outer region, the first outer surface having a first surface roughness, and the second outer surface having a second surface roughness different from the first surface roughness.

[0023] Furthermore, the shape of the grains exposed through the first outer surface is different from the shape of the grains exposed through the second outer surface.

[0024] The first outer surface includes a first portion having the first surface roughness and a second portion having the second surface roughness.

[0025] The method also includes a step of attaching at least one element on the circuit pattern, and the protective layer is disposed to cover the element.

[0026] According to an embodiment, a substrate is manufactured using a carrier frame having a uniform orientation across its entire area, and the carrier frame is laser-machined to form anchors around the substrate. The anchors may be formed to separate only the area where the substrate is formed on the carrier frame. The sides of the anchors contact the outer surfaces of the substrates. After the three-dimensional molding process of the substrates is completed, the interface between the anchors and the outer surfaces of the substrates is cut to separate the substrates.

[0027] In this embodiment, the side of the anchor connected to the outer surface of the substrate extends in a first direction. The first direction, which corresponds to the extension direction of the side of the anchor, may correspond to the orientation of the carrier frame. That is, the carrier frame is a nematic polymer in which molecules are aligned in a specific direction, and thus, grains are formed inside the carrier frame in accordance with the orientation of the molecules. Thus, when forming the anchor, the outer surface of the substrate is laser-processed except for a portion having the same extension direction as the orientation of the carrier frame, so that the anchor is formed only on the outer surface of the substrate having the same extension direction as the orientation of the carrier frame. Therefore, in this embodiment, the substrates can be easily separated by simply applying shear stress to the interface without performing an alignment process or an additional laser or cutting process for separating the substrates.

[0028] In addition, according to the embodiment, after forming a plurality of modular products that require 3D molding on a carrier frame, the modular products can be separated from each other using anchors, which is suitable for 3D molding mass production and reduces the difficulty of molding by reducing residual stress that may occur due to the carrier frame. [Brief explanation of the drawings]

[0029] [Figure 1] 10A to 10C are diagrams for explaining a manufacturing process for a substrate having a three-dimensional shape according to a comparative example. [Figure 2] 10A to 10C are diagrams for explaining a manufacturing process for a substrate having a three-dimensional shape according to a comparative example. [Figure 3] FIG. 2 is a cross-sectional view showing a substrate according to the first embodiment. [Figure 4] 4 is a plan view of the substrate shown in FIG. 3, in which the grain direction of the carrier frame (insulating layer) in FIG. 3 is the vertical direction. FIG. [Figure 5] 4 is a plan view of the substrate shown in FIG. 3, in which the grain direction of the carrier frame (insulating layer) in FIG. 3 is the horizontal direction. FIG. [Figure 6] FIG. 5 is a perspective view of an insulating layer shown in FIG. [Figure 7] FIG. 5 is a plan view showing a first modified example of the substrate shown in FIG. [Figure 8] FIG. 5 is a plan view showing a second modified example of the substrate shown in FIG. [Figure 9] 1A to 1C are cross-sectional views showing a method for manufacturing a substrate according to an embodiment in the order of steps. [Figure 10] 1A to 1C are cross-sectional views showing a method for manufacturing a substrate according to an embodiment in the order of steps. [Figure 11] 1A to 1C are cross-sectional views showing a method for manufacturing a substrate according to an embodiment in the order of steps. [Figure 12] 1A to 1C are cross-sectional views showing a method for manufacturing a substrate according to an embodiment in the order of steps. [Figure 13] 1A to 1C are cross-sectional views showing a method for manufacturing a substrate according to an embodiment in the order of steps. [Figure 14] 1A to 1C are cross-sectional views showing a method for manufacturing a substrate according to an embodiment in the order of steps. [Figure 15] 1A to 1C are cross-sectional views showing a method for manufacturing a substrate according to an embodiment in the order of steps. [Figure 16] 1A to 1C are cross-sectional views showing a method for manufacturing a substrate according to an embodiment in the order of steps. [Figure 17] 1A to 1C are cross-sectional views showing a method for manufacturing a substrate according to an embodiment in the order of steps. MODE FOR CARRYING OUT THE INVENTION

[0030] Hereinafter, the embodiments disclosed herein will be described in detail with reference to the accompanying drawings. Identical or similar components will be designated by the same reference numerals, regardless of the reference numerals, and redundant descriptions thereof will be omitted. The suffixes "module" and "unit" used in the following description are used or interchangeable for the sole purpose of facilitating the preparation of the specification, and do not have any distinct meanings or functions. Furthermore, in describing the embodiments disclosed herein, if a detailed description of related publicly known technology is deemed to obscure the gist of the embodiments disclosed herein, that detailed description will be omitted. Furthermore, the accompanying drawings are intended to facilitate understanding of the embodiments disclosed herein, and the technical concepts disclosed herein should not be limited by the accompanying drawings. It should be understood that the accompanying drawings include all modifications, equivalents, and alternatives within the concept and technical scope of the present invention.

[0031] Terms including ordinal numbers such as "first" and "second" may be used to describe various components, but the components are not limited by these terms. These terms are used only to distinguish one component from another.

[0032] When an element is referred to as being "coupled" or "connected" to another element, it should be understood that it may be directly coupled or connected to the other element, but that there may be other elements in between. On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

[0033] A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0034] In this application, the terms "comprise" or "have" and the like are intended to specify the presence of any feature, number, step, operation, component, part, or combination thereof described in the specification, and are understood not to preclude the presence or additional possibility of one or more different features, numbers, steps, operations, components, parts, or combinations thereof.

[0035] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0036] 1 and 2 are diagrams for explaining a manufacturing process of a substrate having a three-dimensional shape according to a comparative example.

[0037] Referring to (a) and (b) of FIG. 1, the substrate in the comparative example includes a first region 10 and a second region 20. As shown in FIG.

[0038] The second region 20 of the substrate is the actual product region, and the first region 10 is the remaining region excluding the actual product region.

[0039] Therefore, in the comparative example, a process is required in which the first region 10 is removed from the entire region of the substrate and only the second region 20 is separated.

[0040] Briefly, the manufacturing process of the substrate in the comparative example involves preparing a carrier frame, forming a circuit pattern on the carrier frame, attaching electronic elements, and forming a protective layer, to form a substrate including the first region 10 and the second region 20. After the substrate is formed, a thermoforming process of the second region 20 is carried out to form the second region 20 into a desired three-dimensional shape corresponding to the actual product.

[0041] Once the three-dimensional substrate is manufactured, a process of separating the second region 20 from the three-dimensional substrate is carried out. At this time, the cutting points for separating the second region 20 from the three-dimensional substrate manufactured through thermoforming are not all located on the same plane. Therefore, in the comparative example, a technique is required that can separate the second region 20 by cutting at various heights. Furthermore, since the substrate may move during the cutting process, a precise alignment technique is required that can accurately find the boundary surface between the first region 10 and the second region 20.

[0042] In this case, as shown in Figure 1(a), the cutting process is performed using a laser in the first comparative example. However, as mentioned above, the cutting points are not all located on the same plane, which poses a problem that the laser must be focused according to the height of each cutting point during laser processing.

[0043] 2(b), the second region 20 can be separated using a jig with a blade instead of a laser. Using such a jig can solve the height-related problem that arose in the first comparative example. However, separating only the second region 20 on the substrate requires a jig with a small blade of 200 μm or less, and the alignment accuracy must be within a tolerance of ±50 μm, which reduces productivity.

[0044] 2(a) and 2(b), as in Comparative Example 3, the laser process can be performed first before the thermoforming process, separating the second region 20 with all cutting points aligned on the same plane. In Comparative Example 3, once the second region 20 is separated, a separate thermoforming process is performed only on the second region 20, as in FIG. 2(c). In this case, multiple second regions 20 may be included on the substrate. In other words, when one second region 20 is used as one sample, multiple different samples are typically fabricated simultaneously on a single carrier frame. However, performing the cutting process before thermoforming, as described above, requires an additional process of holding multiple samples during the cutting process, which reduces the mobility of the multiple samples between processes. Furthermore, if the thermoforming process is performed with only the second region 20 separated, the size of the separated second region 20 is very small, making it difficult to thermoform the second region 20 into the desired three-dimensional shape.

[0045] Therefore, in the embodiments, an attempt is made to present a substrate and a manufacturing method thereof that can simplify the manufacturing process and reduce manufacturing costs without causing problems in the manufacturing process of a substrate having a three-dimensional shape.

[0046] Fig. 3 is a cross-sectional view showing a substrate according to a first embodiment, and Fig. 4 and Fig. 5 are plan views of the substrate shown in Fig. 3. Fig. 4 is a plan view of the substrate when the grain direction of the carrier frame (insulating layer) of Fig. 3 is vertical, and Fig. 5 is a plan view of the substrate when the grain direction of the carrier frame (insulating layer) of Fig. 3 is horizontal.

[0047] Referring to FIG. 3, the substrate 100 includes an insulating layer 110, a circuit pattern 120 disposed on the insulating layer 110, elements 130 disposed on the circuit pattern 120, and a protective layer 140 disposed on the insulating layer 110 and covering the circuit pattern 120 and elements 130.

[0048] The insulating layer 110 may be a base material used to manufacture a substrate. Preferably, the insulating layer 110 may be a partial region of a carrier frame used to manufacture the substrate. That is, a carrier frame (described below) may include a first region corresponding to the insulating layer 110 of the substrate 100 and a second region excluding the first region. Then, a substrate may be manufactured by performing a shearing process to separate the first region while the circuit pattern 120, the device 130, and the protective layer 140 are sequentially arranged on the carrier frame.

[0049] Grains may be formed inside the insulating layer 110. Preferably, the insulating layer 110 may have a nematic structure. A nematic structure may refer to a state in which all molecules have the same uniform orientation. Therefore, due to the nematic structure, grains may be formed in the insulating layer 110 in accordance with the orientation of the molecules.

[0050] Preferably, the insulating layer 110 may be a polymer belonging to the category of crystalline aromatic polyesters based on p-hydroxybenzoic acid (benzoic acid with an OH group in the para position) and related monomers.

[0051] Preferably, the insulating layer 110 may include a polymer material such as Vectron (a melt-spun product of Vectra) or Kevlar.

[0052] For example, the insulating layer 110 may be an anisotropic film of at least one of LCP (Liquid Crystal Polymer) and HDPE (High Density Polyethylene), but is not limited thereto. In other words, the insulating layer 110 may be any one of various films containing a polymer material having a nematic structure, in which molecules are aligned in a single direction.

[0053] Therefore, the insulating layer 110 may have a characteristic of being cut along the grains by a shear stress applied in the grain direction.

[0054] A circuit pattern 120 is disposed on the insulating layer 110. The circuit pattern 120 is disposed on the insulating layer 110 and may serve to transmit an electrical signal. However, without being limited thereto, a layer corresponding to the circuit pattern 120 may be formed on the insulating layer 110, and may perform a heat dissipation function or a signal shielding function in addition to the electrical signal transmission function.

[0055] The circuit pattern 120 may be formed of a metal material having high electrical conductivity. To this end, the circuit pattern 120 may be formed of at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). The circuit pattern 120 may also be formed of a paste or solder paste containing at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn), which has excellent bonding strength. Preferably, the circuit pattern 120 may be formed of copper (Cu), which has high electrical conductivity and is relatively inexpensive.

[0056] The circuit pattern 120 can be formed by a conventional printed circuit board manufacturing process such as an additive process, a subtractive process, a modified semi-additive process (MSAP), and a semi-additive process (SAP), and detailed description thereof will be omitted here.

[0057] An element 130 may be attached on the circuit pattern 120. The element 130 may be determined depending on the application to which the substrate 100 is applied.

[0058] The element 130 may be a passive element. For example, the element 130 may be a passive element such as a wire, a resistor, or a chip. The element 130 may be an active element. For example, the element 130 may be an active element such as a multiplexer, an ASIC (Application Specific Integrated Circuit), or a wireless communication module. In addition, the element 130 may include optical elements such as lenses and waveguides, magnetic elements, electrochemical elements such as batteries and enzyme sensors, etc.

[0059] A protective layer 140 is disposed on the insulating layer 110 .

[0060] The protective layer 140 is disposed on the insulating layer 110 and can protect the exposed surface of the insulating layer 110, the circuit pattern 120, and the elements 130. As a result, the protective layer 140 can have a height greater than that of the elements 130, thereby allowing the circuit pattern 120 and the elements 130 to be embedded therein, but is not limited to this.

[0061] For this purpose, the protective layer 140 may include an epoxy acrylate resin. For example, the protective layer 140 may include a resin, a hardener, a photoinitiator, a pigment, a solvent, a filler, an additive, an acrylic monomer, etc. However, the embodiment is not limited thereto, and the protective layer 140 may be any one of a solder resist (SR), a coverlay, and a polymer material.

[0062] Meanwhile, the substrate 100 has a three-dimensional shape. For example, the substrate 100 may include a flat region and a bent region extending from the flat region and bent at a specific curvature. For example, the substrate 100 may include a plurality of flat regions, and the plurality of flat regions may be arranged on different planes. For example, the heights of the plurality of flat regions included in the substrate 100 may be different from each other. Furthermore, the substrate 100 may include a plurality of bent regions, and the curvatures or bend angles of the plurality of bent regions may be different from each other.

[0063] 3, the substrate 100 may include a first flat region FR1, a second flat region FR2, a third flat region FR3, a first bent region BR1, a second bent region BR2, a third bent region BR3, and an open region OR. The first flat region FR1, the second flat region FR2, the third flat region FR3, the first bent region BR1, the second bent region BR2, and the open region OR included in the substrate 100 are described with reference to the protective layer 140 of the substrate 100. However, when the insulating layer 110 of the substrate 100 is used as a reference, the positions of each region may be different from those shown in FIG.

[0064] The first flat region FR1, the second flat region FR2, and the third flat region FR3 may each have the same height at one end and the same height at the other end opposite the one end, i.e., the first flat region FR1, the second flat region FR2, and the third flat region FR3 may have a planar shape.

[0065] The first flat region FR1, the second flat region FR2, and the third flat region FR3 may be arranged on different planes. For example, the first flat region FR1 and the second flat region FR2 may be arranged on the same plane. For example, the top surfaces of the first flat region FR1 and the second flat region FR2 may be on the same plane. For example, the first flat region FR1 and the third flat region FR3 may be arranged on different planes. For example, the top surface of the first flat region FR1 and the top surface of the third flat region FR3 may be arranged on different planes. For example, the top surface of the first flat region FR1 may be located lower than the top surface of the second flat region FR2. For example, the second flat region FR2 and the third flat region FR3 may be arranged on different planes. For example, the top surface of the second flat region FR2 and the top surface of the third flat region FR3 may be located on different planes. For example, the top surface of the second flat region FR2 may be located lower than the top surface of the third flat region FR3. However, the embodiment is not limited to this, and the number of flat areas may be changed depending on the application to which the substrate 100 is applied, and the position at which the upper surface of each flat area is located may also be changed.

[0066] Meanwhile, the substrate 100 may have bent regions between a plurality of flat regions, and the bent regions may allow the substrate 100 to have a three-dimensional shape.

[0067] The first bent region BR1 may extend from one end of the first flat region FR1. The first bent region BR1 may be bent at a certain curvature or angle. For example, the first bent region BR1 may have different heights at one end and the other end. For example, the height of one end of the first bent region BR1 may be lower than the height of the other end.

[0068] The second bent region BR2 may extend from one end of the second flat region FR2. For example, the second bent region BR2 may extend inward from one end of the second flat region FR2. The second bent region BR2 may be bent from one end of the second flat region FR2 at a certain curvature or angle. For example, the second bent region BR2 may have different heights at one end and the other end. For example, the second bent region BR2 may have one end higher than the other end.

[0069] The third folding region BR3 may extend from the other end of the second flat region FR2. Alternatively, the third folding region BR3 may extend from one end of the third flat region FR3. Preferably, the third folding region BR3 may be disposed between the other end of the second flat region FR2 and one end of the third flat region FR3. The third folding region BR3 may be folded with a certain curvature or angle from the other end of the second flat region FR2 and one end of the third flat region FR3. For example, the third folding region BR3 may have different heights at one end and the other end. For example, the height of one end of the third folding region BR3 may be lower than the height of the other end.

[0070] Meanwhile, an open region OR may be formed between the first bending region BR1 and the second bending region BR2. The open region OR may be a through-hole penetrating the upper and lower surfaces of the substrate 100. For example, the protective layer 140, the circuit pattern 120, and the insulating layer 110 may not be disposed in the open region OR. For example, the planar shape of the substrate 100 may be a rectangle with an opening formed in the center, such as the open region OR.

[0071] Meanwhile, the substrate 100 may include an outer surface. The outer surface refers to a surface located outside the substrate 100, and may include, for example, the outer surface of the insulating layer 110 and the outer surface of the protective layer 140 of the substrate 100. In this case, the outer surface of the protective layer 140 may have a uniform surface roughness over the entire area.

[0072] Meanwhile, the outer surface of the insulating layer 110 may include a region having a first surface roughness based on the grain direction of the insulating layer 110 and a region having a second surface roughness different from the first roughness.

[0073] For example, the insulating layer 110 may include a plurality of outer surfaces separated by corners of the substrate 100 to correspond to the shape of the substrate 100 .

[0074] For example, as shown in FIG. 4, the insulating layer 110 may include a first outer surface 111 located on the left side of the top surface, a second outer surface 112 located on the right side, a third outer surface 113 located on the top side, and a fourth outer surface 114 located on the bottom side.

[0075] In this case, the multiple outer surfaces constituting the insulating layer 110 may extend in different directions. For example, the first outer surface 111 may extend in a first direction. For example, the first outer surface 111 may extend in a vertical direction. The second outer surface 112 may extend in the same first direction as the first outer surface 111. For example, the second outer surface 112 may extend in the same vertical direction as the first outer surface 111. The third outer surface 113 may extend in a second direction different from the first outer surface 111 and the second outer surface 112. For example, the third outer surface 113 may extend in a second direction substantially perpendicular to the first direction. For example, the third outer surface 113 may extend in a horizontal direction. The fourth outer surface 114 may extend in the same second direction as the third outer surface 113. For example, the fourth outer surface 114 may extend in a horizontal direction.

[0076] That is, the insulating layer 110 may include a first outer surface 111 and a second outer surface 112 that are disposed opposite each other and extend in a first direction or a vertical direction. The insulating layer 110 may also include a first, second outer surface 113 and a fourth outer surface 114 that are disposed opposite each other between the first outer surface 111 and the second outer surface 112 and extend in a second direction or a horizontal direction perpendicular to the first direction.

[0077] At this time, at least a portion of the outer surface corresponding to the grain direction of the insulating layer 110 among the plurality of outer surfaces may have a surface roughness different from that of the other portions.

[0078] In other words, the outer surface of the insulating layer 110 may be formed by different processes in different regions, and thus the outer surface of the insulating layer 110 may have a surface roughness corresponding to the applied process.

[0079] Preferably, a portion of the outer surface of the insulating layer 110 may be cut by laser processing, and the remaining portion may be cut by shear stress. Although it has been described that a portion of the outer surface of the insulating layer 110 is cut by laser processing, this is merely an example, and the portion of the outer surface may be cut by a cutting stage rather than by a laser. Hereinafter, it will be described that the portion of the outer surface is processed by laser.

[0080] Therefore, the portion formed by the laser processing can have a first surface roughness, and the portion formed by cutting with the shear stress can have a second surface roughness different from the first surface roughness.

[0081] In other words, the portion formed by the laser processing may be formed by burning with the laser. As a result, carbon from the laser process may be exposed on the outer surface formed by the laser. The outer surface formed by the laser may have a first surface roughness corresponding to the laser conditions.

[0082] The portion formed by shear stress is a portion where a tear or break occurs due to shear stress applied by a jig. For example, the portion formed by shear stress is a portion where a tear or break occurs in the grain of the insulating layer 110 due to shear stress being applied in the grain direction of the insulating layer 110. As a result, the portion formed by shear stress may have a second surface roughness different from the portion formed by the laser. Also, the portion formed by shear stress may not have carbon remaining on the surface, unlike the portion formed by the laser. Also, the portion formed by shear stress may expose the grain of the insulating layer 110, unlike the portion formed by the laser. That is, the portion formed by the laser damages the grain of the insulating layer 110, so that the grain of the insulating layer 110 is not exposed or the grain direction cannot be confirmed. However, the portion formed by the shear stress is a portion that is broken by applying shear stress in the grain direction, and the grain of the insulating layer 110 may be exposed in this portion, thereby making it possible to confirm the grain direction of the insulating layer 110.

[0083] At this time, the portion formed by the laser and the portion formed by the shear stress may be determined depending on the grain direction of the insulating layer 110 .

[0084] For example, the portion formed by the laser may be an outer surface extending in a direction different from the grain direction of the insulating layer 110 .

[0085] 4, the insulating layer 110 has grains formed in a first direction or a vertical direction. A first outer surface 111 and a second outer surface 112 of the insulating layer 110 extend in the first direction, which is the same as the grain direction of the insulating layer 110. A third outer surface 113 and a fourth outer surface 114 of the insulating layer 110 extend in a second direction different from the grain direction of the insulating layer 110.

[0086] Therefore, the third outer surface 113 and the fourth outer surface 114 may be portions formed by the laser processing. As a result, the entire region C of the third outer surface 113 may be formed by the laser, thereby having a first surface roughness. Similarly, the entire region D of the fourth outer surface 114 may be formed by the laser, thereby having a first surface roughness corresponding to the third outer surface 113.

[0087] Meanwhile, the first outer surface 111 and the second outer surface 112 are portions extending in a first direction, which is the same as the grain direction of the insulating layer 110. Therefore, the first outer surface 111 and the second outer surface 112 can be formed by shear stress applied through a jig.

[0088] Therefore, the first outer surface 111 may have a surface roughness different from the third outer surface 113 and the fourth outer surface 114. For example, the first outer surface 111 and the second outer surface 112 may have a second surface roughness that is smaller than a first surface roughness that the third outer surface 113 and the fourth outer surface 114 have.

[0089] In this case, in the first embodiment, the entire region A of the first outer surface 111 may have the second surface roughness. Also, the entire region B of the second outer surface 112 may have the second surface roughness. In other words, in the first embodiment, the entire region A of the first outer surface 111 may be formed by cutting the insulating layer 110 in the grain direction using shear stress applied by a jig. Similarly, the entire region B of the second outer surface 112 may be formed by cutting the insulating layer 110 in the grain direction using shear stress applied by a jig.

[0090] However, as the shear stress increases the area of ​​the insulating layer 110 cut in the grain direction, the process time increases and other portions of the substrate 100 may be damaged during the cutting in the grain direction. Therefore, in the second embodiment, only portions A1 and A2 of the entire area A of the first outer side 111 are formed through shear stress applied by a jig depending on the size of the first outer side 111, and the remaining portions A3, A4, and A5 are formed through laser processing. Also, only portions B1 and B2 of the entire area B of the second outer side 112 are formed through shear stress applied by a jig depending on the size of the second outer side 112, and the remaining portions B3, B4, and B5 are formed through laser processing.

[0091] For example, the portions A1 and A2 of the first outer surface 111 and the portions B1 and B2 of the second outer surface 112 enable the substrate 100 to be fixed on a carrier frame during a thermoforming process of the substrate 100. Therefore, the portions A1 and A2 of the first outer surface 111 and the portions B1 and B2 of the second outer surface 112 can be determined to have a size that allows the substrate 100 to be fixed on the carrier frame.

[0092] Thus, in the embodiment, the first outer surface 111 may include a first portion A1 and a second portion A2 that are broken by shear stress applied by the jig and have the second surface roughness, and may also include a third portion A3, a fourth portion A4, and a fifth portion A5 that are cut by the laser and have a first surface roughness different from the second surface roughness.

[0093] In the embodiment, the second outer surface 112 is a region broken by shear stress applied by a jig and may include a first portion B1 and a second portion B2 having a second surface roughness, and the second outer surface 112 is a region cut by a laser and may include a third portion A3, a fourth portion A4, and a fifth portion A5 having a first surface roughness different from the second surface roughness.

[0094] Meanwhile, the entire region C of the third outer surface 113, the entire region D of the fourth outer surface 114, the third to fifth portions A3, A4, A5 of the first outer surface 111, and the third to fifth portions B3, B4, B5 of the second outer surface 112 are formed before the substrate 100 is thermoformed, in other words, when the entire region of the substrate 100 is flat. The first and second portions A1, A2 of the first outer surface 111 and the first and second portions B1, B2 of the second outer surface 112 are formed after the substrate 100 is thermoformed, in other words, when the substrate 100 has a three-dimensional shape.

[0095] FIG. 6 is a perspective view of the insulating layer shown in FIG.

[0096] 6, in this embodiment, before the thermoforming process is performed, the remaining portions A3, A4, A5, B3, B4, B5, C, and D of the outer surface extending in the same direction as the grain direction, except for at least portions A1, A2, B1, and B2, are cut using a laser according to the grain direction of the insulating layer 110. Then, in this embodiment, after the thermoforming process is performed, at least the portion of the outer surface extending in the same direction as the grain direction that has not been removed by the laser is cut by applying shear stress in the grain direction.

[0097] Meanwhile, in another embodiment, unlike FIG. 4, the grain of the insulating layer 110 may be in a second direction instead of a first direction, as shown in FIG.

[0098] In this case, the third outer surface 113 and the fourth outer surface 114 of the insulating layer 110 extend in a second direction that is the same as the grain direction of the insulating layer 110. The first outer surface 111 and the fourth outer surface 112 of the insulating layer 110 extend in a second direction that is different from the grain direction of the insulating layer 110.

[0099] Therefore, the first outer surface 111 and the second outer surface 112 can be formed by laser processing. As a result, the entire area A of the first outer surface 111 can be formed by laser and can have a first surface roughness. Similarly, the entire area B of the second outer surface 112 can be formed by laser and can have a first surface roughness corresponding to the first outer surface 111.

[0100] Meanwhile, the third outer surface 113 and the fourth outer surface 114 are portions extending in a second direction, which is the same as the grain direction of the insulating layer 110. Therefore, the third outer surface 113 and the fourth outer surface 114 can be formed by shear stress applied through a jig.

[0101] However, as described in FIG. 4, the entire area of ​​the third outer surface 113 and the fourth outer surface 114 may be formed by shear stress, but, unlike this, only a portion of the area may be formed by shear stress.

[0102] For example, the portions C1 and C2 of the third outer surface 113 and the portions D1 and D2 of the fourth outer surface 114 enable the substrate 100 to be fixed on a carrier frame during a thermoforming process of the substrate 100. Therefore, the portions C1 and C2 of the third outer surface 113 and the portions D1 and D2 of the fourth outer surface 114 can be determined to have a size that allows the substrate 100 to be fixed on the carrier frame.

[0103] Thus, in the embodiment, the third outer surface 113 is a region broken by shear stress applied by the jig and can include a first portion C1 and a second portion C2 having the second surface roughness. Also, the third outer surface 113 is a region cut by the laser and can include a third portion C3, a fourth portion C4, and a fifth portion C5 having a first surface roughness different from the second surface roughness.

[0104] In the embodiment, the fourth outer surface 114 is a region broken by shear stress applied by a jig and may include a first portion D1 and a second portion D2 having a second surface roughness. The fourth outer surface 114 is a region cut by a laser and may include a third portion D3, a fourth portion D4, and a fifth portion D5 having a first surface roughness different from the second surface roughness.

[0105] Meanwhile, the entire region A of the first outer surface 111, the entire region B of the second outer surface 112, the third to fifth portions C3, C4, and C5 of the third outer surface 113, and the third to fifth portions D3, D4, and D5 of the fourth outer surface 114 are formed before the substrate 100 is thermoformed, in other words, when the entire region of the substrate 100 is flat. The first and second portions C1 and C2 of the third outer surface 113 and the first and second portions D1 and D2 of the fourth outer surface 114 are formed after the substrate 100 is thermoformed, in other words, when the substrate 100 has the three-dimensional shape.

[0106] As described above, in this embodiment, before the thermoforming process, the remaining portion except for at least a portion of the outer surface extending in the same direction as the grain direction of the insulating layer 110 is cut by processing with a laser according to the grain direction of the insulating layer 110. Then, in this embodiment, after the thermoforming process, at least a portion of the outer surface extending in the same direction as the grain direction that has not been removed by the laser is cut by applying shear stress in the grain direction.

[0107] According to this embodiment, substrates are fabricated using a carrier frame having a uniform orientation across the entire area, and the carrier frame is laser-machined to form anchors around the substrates. The anchors may be formed to separate only the area on the carrier frame where the fabricated substrates are formed. The sides of the anchors contact the outer surfaces of the substrates. After the three-dimensional molding process of the substrates is completed, the interfaces between the anchors and the outer surfaces of the substrates are cut to separate the substrates.

[0108] In this embodiment, the side of the anchor connected to the outer surface of the substrate extends in a first direction. The first direction, which corresponds to the extension direction of the side of the anchor, may correspond to the orientation of the carrier frame. That is, the carrier frame is a nematic polymer in which molecules are aligned in a specific direction, and thus, grains are formed inside the carrier frame in accordance with the orientation of the molecules. Thus, when forming the anchor, the outer surface of the substrate is laser-processed except for a portion having the same extension direction as the orientation of the carrier frame, so that the anchor is formed only on the outer surface of the substrate having the same extension direction as the orientation of the carrier frame. Therefore, in this embodiment, the substrates can be easily separated by simply applying shear stress to the interface without performing an alignment process or an additional laser or cutting process for separating the substrates.

[0109] In addition, according to the embodiment, after forming a plurality of modular products that require 3D molding on a carrier frame, the modular products can be separated from each other using anchors, which is suitable for 3D molding mass production and reduces the difficulty of molding by reducing residual stress that may occur due to the carrier frame.

[0110] Meanwhile, various modified examples of the substrate according to the embodiment will be described below.

[0111] FIG. 7 is a plan view showing a first modified example of the substrate shown in FIG. 4, and FIG. 8 is a plan view showing a second modified example of the substrate shown in FIG.

[0112] The substrate in FIG. 4 has a rectangular planar shape.

[0113] Alternatively, as shown in Fig. 7, the planar shape of the substrate 200 may be a circle. Preferably, the planar shape of the substrate 200 may be a circle having a constant curvature as a whole, and portions A1' and B1' may have a linear shape extending in a direction corresponding to the grain of the insulating layer. In reality, the planar shape of the substrate 200 may have an elliptical shape with linear portions A1' and B1'.

[0114] The substrate may include an insulating layer 210 and a circuit pattern 220 disposed on the insulating layer 210. Although not shown in the drawings, at least one element may be disposed on the circuit pattern 220.

[0115] Meanwhile, portions A1' and B1' of the outer surface of the insulating layer 210 extending in the same direction as the grain direction of the insulating layer 210 have the second surface roughness as described above, and the remaining portions excluding portions A1' and B1' have the first surface roughness as described above.

[0116] As shown in FIG. 7, in the first variant, the planar shape of the substrate is elliptical, so that the entire areas A1' and B1' of the outer surface extending in the same direction as the grain of the insulating layer can have the second surface roughness.

[0117] Alternatively, as shown in FIG. 8, the planar shape of the substrate 300 may have an L-shape.

[0118] The substrate may include an insulating layer 310 and a circuit pattern 220 disposed on the insulating layer 310. At least one element 330 may be disposed on the circuit pattern 320. Although not shown in the drawings, a protective layer (not shown) may be disposed on the insulating layer 310.

[0119] Meanwhile, the insulating layer 310 may include a top surface 311 and first to sixth outer side surfaces 312 , 313 , 314 , 315 , 316 , and 317 .

[0120] In this case, the first outer surface 312, the second outer surface 313, and the fourth outer surface 314 may extend in a first direction corresponding to the grain direction of the insulating layer 310. The third outer surface 314, the fifth outer surface 315, and the sixth outer surface 316 may extend in a second direction different from the grain direction of the insulating layer 310.

[0121] As a result, the first outer side surface 312, the second outer side surface 313, and the fourth outer side surface 314 may include portions having the second surface roughness as described above. That is, the first portion E1, the second portion E2, the third portion E3, the fourth portion E4, the fifth portion E5, and the sixth portion E6 included in the first outer side surface 312, the second outer side surface 313, and the fourth outer side surface 314 may have the second surface roughness.

[0122] Furthermore, the remaining portions of the first outer surface 312, the second outer surface 313, and the fourth outer surface 314 excluding the first portion E1, the second portion E2, the third portion E3, the fourth portion E4, the fifth portion E5, and the sixth portion E6, as well as the third outer surface 314, the fifth outer surface 315, and the sixth outer surface 316, may have a first surface roughness different from the second surface roughness.

[0123] A method for manufacturing a substrate according to an embodiment will be described below.

[0124] 9 to 17 are cross-sectional views showing the steps of a method for manufacturing a substrate according to an embodiment.

[0125] 9, an insulating layer 110 is formed on a substrate 100, and a carrier frame 110 is prepared based on the substrate manufacturing process. At this time, the insulating layer 110 is a part of the carrier frame, and therefore the insulating layer 110 and the carrier frame 110 are given the same reference numerals.

[0126] At this time, grains may be formed inside the carrier frame 110. Preferably, the carrier frame 110 may have a nematic structure. A nematic structure may refer to a state in which all molecules have the same constant direction. Therefore, due to the nematic structure, grains may be formed in the carrier frame 110 in accordance with the direction of the molecules.

[0127] Preferably, the carrier frame 110 may be a polymer belonging to the category of crystalline aromatic polyesters based on p-hydroxybenzoic acid (benzoic acid with an OH in the para position) and related monomers.

[0128] Preferably, the carrier frame 110 may include a polymer material such as Vectron (a melt-spun product of Vectra) or Kevlar.

[0129] For example, the carrier frame 110 may be an anisotropic film made of at least one of liquid crystal polymer (LCP) and high density polyethylene (HDPE), but is not limited thereto. In other words, the carrier frame 110 may be any one of various films containing a polymer material having a nematic structure in which molecules are aligned in one direction.

[0130] Therefore, the carrier frame 110 may have a characteristic of being cut along the grains by a shear stress applied in the grain direction.

[0131] Next, as shown in FIG. 10, a circuit pattern 120 is formed on the carrier frame 110 .

[0132] The circuit pattern 120 may be disposed on the carrier frame 110 and may serve to transmit an electrical signal. However, without being limited thereto, a layer corresponding to the circuit pattern 120 may be formed on the carrier frame 110, and may perform a heat dissipation function or a signal shielding function in addition to the electrical signal transmission function.

[0133] The circuit pattern 120 may be formed of a metal material having high electrical conductivity. To this end, the circuit pattern 120 may be formed of at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). The circuit pattern 120 may also be formed of a paste or solder paste containing at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn), which has excellent bonding strength. Preferably, the circuit pattern 120 may be formed of copper (Cu), which has high electrical conductivity and is relatively inexpensive.

[0134] The circuit pattern 120 can be formed by a conventional printed circuit board manufacturing process such as an additive process, a subtractive process, a modified semi-additive process (MSAP), and a semi-additive process (SAP), and detailed description thereof will be omitted here.

[0135] 11, a device attachment process may be performed to attach a device 130 on the circuit pattern 120. The device 130 may be determined depending on the application to which the substrate 100 is applied.

[0136] The element 130 may be a passive element. For example, the element 130 may be a passive element such as a wire, a resistor, or a chip. The element 130 may be an active element. For example, the element 130 may be an active element such as a multiplexer, an ASIC (Application Specific Integrated Circuit), or a wireless communication module. In addition, the element 130 may include optical elements such as lenses and waveguides, magnetic elements, electrochemical elements such as batteries and enzyme sensors, etc.

[0137] Once the devices are attached, a protective layer 140 is formed on the carrier frame 110 .

[0138] The protective layer 140 is disposed on the carrier frame 110 and can protect the exposed surface of the carrier frame 110 corresponding to the substrate area, the circuit pattern 120, and the device 130. Therefore, the protective layer 140 can have a height higher than the device 130, thereby allowing the circuit pattern 120 and the device 130 to be embedded therein, but is not limited thereto.

[0139] For this purpose, the protective layer 140 may include an epoxy acrylate resin. For example, the protective layer 140 may include a resin, a hardener, a photoinitiator, a pigment, a solvent, a filler, an additive, an acrylic monomer, etc. However, the embodiment is not limited thereto, and the protective layer 140 may be any one of a solder resist (SR), a coverlay, and a polymer material.

[0140] Next, as shown in FIG. 12, an open area OR is formed through the upper and lower surfaces of the carrier frame 110.

[0141] The open area OR may be selectively formed depending on the application to which the substrate is applied, and its shape may also be selectively varied.

[0142] Next, as shown in FIG. 13, a process of dividing the substrate formed on the upper surface of the carrier frame 110 into cells can be carried out.

[0143] That is, as shown in FIG. 14, not only a substrate corresponding to one cell but also a plurality of substrates corresponding to a plurality of different cells can be manufactured simultaneously on one carrier frame 110.

[0144] Accordingly, a process of separating each substrate corresponding to each cell by laser processing the outer region of each cell can be carried out.

[0145] In this embodiment, the laser processing may be performed not on the entire outer periphery of each cell but only on the remaining area excluding a portion of the cell.

[0146] For example, in an embodiment, a portion of the outer region of each cell is removed to form an anchor 100A on the carrier frame 110, which can support each cell. The anchor 100A is a part of the carrier frame 110. In this case, the anchor 100A may have a shape in which the width gradually increases from one end to the other end. For example, the anchor 100A may have a trapezoidal shape. In this case, the anchor 100A includes one end that contacts the outer side of each substrate portion and the other end opposite the one end, and the width gradually increases from one end to the other end.

[0147] In this case, a first substrate unit 100 corresponding to the first cell, a second substrate unit 200 corresponding to the second cell, and a third substrate unit 300 corresponding to the third cell may be included on the carrier frame 110.

[0148] In the embodiment, the anchor 100A can be formed by performing a process of removing the remaining portions except for the anchor 100A in the outer regions of the first substrate part 100, the second substrate part 200, and the third substrate part 300.

[0149] Preferably, a first anchor 110A1, a second anchor 110A2, a third anchor 110A3, and a fourth anchor 110A4 may be formed on the outer side of the first substrate unit 100. A fifth anchor 110A5 and a sixth anchor 110A6 may be formed on the outer side of the second substrate unit 200. A seventh anchor 110A7, an eighth anchor 110A8, a ninth anchor 110A9, a tenth anchor 110A10, an eleventh anchor 110A11, and a twelfth anchor 110A12 may be formed on the outer side of the third substrate unit 300.

[0150] In this case, the first to twelfth anchors 110A1 to 110A12 may be disposed in an outer region of each substrate unit that corresponds to the grain direction of the carrier frame 110. In other words, the outer region of the substrate unit may include a first region extending in the same direction as the grain direction of the carrier frame 110, and a second region excluding the first region. The first to twelfth anchors 110A1 to 110A12 may be formed only in the first region excluding the second region. The first to twelfth anchors 110A1 to 110A12 may be formed in the entire first region, or alternatively, may be formed only in a partial region of the first region.

[0151] Next, as shown in FIG. 15, in a state where the first to twelfth anchors 110A1 to 110A12 are formed, each substrate portion is thermoformed to have a three-dimensional shape corresponding to the application.

[0152] Next, as shown in FIG. 16, a jig 400 can be used to apply shear stress to the anchors of each substrate portion, causing each substrate portion to separate from the carrier frame 110.

[0153] 17, the jig 400 does not apply a uniform shear stress in a height direction H at a 90-degree angle to the bottom of the anchor, but rather rises in a diagonal line with the height direction to apply shear stress F. Each anchor 100A includes one end 110A' and the other end 110A'. The jig 400 does not simultaneously apply shear stress to the entire area of ​​the bottom surface of the anchor 100A, but instead preferentially contacts one end 110A' and applies shear stress F to the one end 110A', thereby sequentially providing the shear stress in the direction of the other end 110A''.

[0154] The substrate portion thus manufactured may include an outer surface. The outer surface refers to a surface located outside the substrate 100, and may include, for example, the outer surface of the insulating layer 110 and the outer surface of the protective layer 140 of the substrate 100. In this case, the outer surface of the protective layer 140 may have a uniform surface roughness over the entire area. Here, the insulating layer 110 is a part of the carrier frame 110, and may refer to a partial area of ​​the entire area of ​​the carrier frame 110 that constitutes each substrate portion.

[0155] Meanwhile, the outer surface of the insulating layer 110 may include a region having a first surface roughness based on the grain direction of the insulating layer 110 and a region having a second surface roughness different from the first roughness. Here, the portion having the first surface roughness is the portion removed by the laser processing, and the portion having the second surface roughness is the portion where the anchor was located.

[0156] According to an embodiment, a substrate is manufactured using a carrier frame having a uniform orientation across its entire area, and the carrier frame is laser-machined to form anchors around the substrate. The anchors may be formed to separate only the area where the substrate is formed on the carrier frame. The sides of the anchors contact the outer surfaces of the substrates. After the three-dimensional molding process of the substrates is completed, the interface between the anchors and the outer surfaces of the substrates is cut to separate the substrates.

[0157] In this embodiment, the side of the anchor connected to the outer surface of the substrate extends in a first direction. The first direction, which corresponds to the extension direction of the side of the anchor, may correspond to the orientation of the carrier frame. That is, the carrier frame is a nematic polymer in which molecules are aligned in a specific direction, and thus, grains are formed inside the carrier frame in accordance with the orientation of the molecules. Thus, when forming the anchor, the outer surface of the substrate is laser-processed except for a portion having the same extension direction as the orientation of the carrier frame, so that the anchor is formed only on the outer surface of the substrate having the same extension direction as the orientation of the carrier frame. Therefore, in this embodiment, the substrates can be easily separated by simply applying shear stress to the interface without performing an alignment process or an additional laser or cutting process for separating the substrates.

[0158] In addition, according to the embodiment, after forming a plurality of modular products that require 3D molding on a carrier frame, the modular products can be separated from each other using anchors, which is suitable for 3D molding mass production and reduces the difficulty of molding by reducing residual stress that may occur due to the carrier frame.

[0159] The features, structures, effects, etc. described in the above-described embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment can be combined or modified in other embodiments by a person skilled in the art to which the embodiment belongs. Therefore, content related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

[0160] Furthermore, although the above description has focused on the embodiments, these are merely examples and are not intended to limit the scope of the embodiments. Those skilled in the art will understand that various modifications and applications not exemplified above are possible within the scope of the essential characteristics of the embodiments. For example, each component specifically illustrated in the embodiments can be modified and implemented. Differences related to such modifications and applications should be construed as being included within the scope of the embodiments defined in the appended claims.

Claims

1. an insulating layer having grains formed therein extending in a first horizontal direction; a circuit pattern disposed on the insulating layer; The insulating layer is a first outer surface and a second outer surface facing each other in a second horizontal direction perpendicular to the first horizontal direction; a third outer surface and a fourth outer surface connected to the first outer surface and facing each other in the first horizontal direction, each of the first outer surface and the second outer surface includes a first portion having a first surface roughness and a second portion having a second surface roughness different from the first surface roughness; A substrate, wherein a first portion of the first outer surface and a first portion of the second outer surface overlap each other in the second horizontal direction.

2. The substrate of claim 1 , wherein the insulating layer comprises a polymeric material having the grains arranged in the first horizontal direction.

3. The insulating layer is The substrate of claim 2 comprising a polymer having a nematic structure.

4. The insulating layer is 4. The substrate of claim 2 or 3, comprising LCP (Liquid Crystal Polymer) or HDPE (High Density Polyethylene).

5. The substrate of claim 1 , wherein the grains are exposed through the first to fourth outer surfaces of the insulating layer.

6. The shape of the grains exposed through the first outer surface and the second outer surface is The substrate of claim 5 , wherein the shapes of the grains exposed through the third outer surface and the fourth outer surface are different.

7. The direction of the grains exposed through the first outer surface and the second outer surface is The substrate according to claim 5 or 6, wherein the directions of the grains exposed through the third outer surface and the fourth outer surface are different.

8. The substrate of claim 1 , wherein each of the third outer surface and the fourth outer surface has the second surface roughness overall.

9. 9. The substrate of claim 1, wherein at least a portion of each of the second portion of the first outer surface, the second portion of the second outer surface, the third outer surface, and the fourth outer surface is provided with carbon.

10. The substrate of claim 1 , further comprising at least one element disposed on the circuit pattern.

11. The substrate according to claim 1 , further comprising a protective layer disposed on the insulating layer and covering a surface of the insulating layer and a surface of the circuit pattern.

12. The insulating layer is A flat area and 12. The substrate according to claim 1, comprising at least one bent region bent at an angle from the flat region.

13. The flat region includes a first flat region and a second flat region disposed on either side of the bent region, The substrate of claim 12 , wherein the first flat area and the second flat area are located on different planes.

14. The bending region is a first folding region that is folded from one end of the flat region; a second folding region folded from the other end of the flat region; The substrate of claim 12 , wherein the first bent region and the second bent region have different bent angles.

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