Heating bonding device and heating bonding method

Abstract

To provide a heating type joining device and a heating type joining method capable of joining two electronic components in each of which a substrate supports a conductive layer without causing heating damage to the substrates.SOLUTION: The heating type joining device is used to join two electronic components in each of which a substrate supports a conductive layer. The heating type joining device includes a stage for placing the two electronic components in a predetermined state, a pressure tip for holding stacked portions of the two electronic components between the stage and the pressure tip to apply pressure, and a heating chip that is arranged with a predetermined spacing between the pressure tip and the heating chip and holds and heats at least one of the two electronic components between the stage and the heating chip.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a heating bonding apparatus and a heating bonding method. [Background technology]

[0002] A technology for bonding conductive layers formed on two electronic components using a heating bonding device and a heating bonding method is disclosed in the following Patent Document 1. Patent Document 1 describes that the objects to be bonded, that is, a conductor, solder, and terminal, are stacked and sandwiched from above and below using a heater chip and a holder, and pressure is applied, and a pulse current is supplied to the heater chip to generate heat and melt the solder. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-15080 A Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, with the increasing speed of communication, there has been a demand for a lower dielectric constant for the substrate supporting conductive layers such as terminals and wiring in electronic components. However, substrates with low dielectric constants generally have low heat resistance. For this reason, when heating using the heater chip described above, if the substrate is placed close to the heater chip or if the heater chip applies pressure to the laminated portion of the conductor, solder, and terminal via the substrate, damage such as deformation of the substrate or the generation of bubbles inside the substrate can occur.

[0005] Therefore, an object of the present invention is to provide a heating and bonding apparatus and a heating and bonding method that can bond two electronic components having conductive layers supported by a base material without causing damage to the base material due to heat. [Means for solving the problem]

[0006] To solve the above problems, the present invention provides a heating bonding device for bonding two electronic components having conductive layers supported by base materials, the heating bonding device including a stage for placing the two electronic components in a predetermined state, a pressure tip for clamping and pressurizing a stack of the two electronic components between the stage and the pressure tip, and a heating tip disposed at a predetermined distance from the pressure tip for clamping and heating at least one of the two electronic components between the stage and the pressure tip. It also provides a heating bonding method using the heating bonding device. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a thermal bonding apparatus and a thermal bonding method that can bond two electronic components having conductive layers supported by a base material without causing damage to the base material due to heating. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a diagram showing an overall configuration of a heating type bonding apparatus according to an embodiment; [Figure 2] 1 is a cross-sectional view showing an example of two electronic components bonded together using a heating bonding device according to an embodiment. [Figure 3] 3 is a flowchart showing a heating bonding method according to the embodiment. [Figure 4] 1 is a cross-sectional view (part 1) for explaining a heating bonding method according to an embodiment. [Figure 5] FIG. 10 is a cross-sectional view (part 2) for explaining the heating bonding method according to the embodiment. [Figure 6] FIG. 10 is a cross-sectional view (part 3) for explaining the heating bonding method according to the embodiment. [Figure 7] FIG. 10 is a cross-sectional view (part 4) for explaining the heating bonding method according to the embodiment. [Figure 8] FIG. 10 is a cross-sectional view showing another example of two electronic components bonded together using the heating bonding device according to the embodiment. [Figure 9]10 is a cross-sectional view of a case where the heating bonding method according to the embodiment is applied to another example of an electronic component. FIG. [Figure 10] FIG. 10 is a diagram showing a modified example of the heating type bonding device according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0010] ≪Heating type bonding device≫ Fig. 1 is a diagram showing the overall configuration of a heating bonding apparatus 1 according to an embodiment. The heating bonding apparatus 1 shown in Fig. 1 is an apparatus for bonding two electronic components 100, 200. Before describing the configuration of the heating bonding apparatus 1 according to the embodiment, the configurations of the electronic components 100, 200 to be bonded using this heating bonding apparatus 1 will first be described.

[0011] <Electronic Components 100, 200> FIG. 2 is a cross-sectional view showing an example of two electronic components 100, 200 to be bonded using the heating bonding device 1 according to the embodiment.

[0012] 2 include a substrate and a conductive layer supported by the substrate, and for example, one electronic component 100 is a rigid printed circuit board, and the other electronic component 200 is a flexible printed circuit board (FPC: Flexible printed circuits). In the following description, electronic component 100 will also be referred to as rigid printed circuit board 100, and electronic component 200 will also be referred to as FPC 200.

[0013] -Hard printed circuit board 100- The rigid printed circuit board 100 has a base material of a hard substrate 101 made of a hard material, and has a conductive layer 102 formed as, for example, wiring on at least one main surface of the rigid substrate 101. Electronic components are mounted on the rigid printed circuit board 100 while connected to the conductive layer 102, but the rigid printed circuit board 100 used here is typically a printed circuit board (PWB: Printed Wired Board) before electronic components are mounted. The rigid substrate 101 constituting such a rigid printed circuit board 100 is made of, for example, a glass epoxy substrate, a glass polyimide substrate, or other hard material, and has excellent heat resistance.

[0014] The conductive layer 102 is formed by patterning a thin film made of a highly conductive material such as copper into a wiring shape. The conductive layer 102 has a portion extending to the edge of the hard substrate 101, which is formed as a terminal 102a for connection with the FPC 200.

[0015] An adhesive layer 103 is formed on the terminal 102a. The adhesive layer 103 is made of a conductive adhesive material that becomes adhesive when heated and hardens when cooled. An example of such a conductive adhesive material is solder. Most of the conductive layer 102 may be covered with a protective film (not shown) provided on the main surface of the hard substrate 101, leaving the adhesive layer 103 and the terminal 102a exposed.

[0016] -FPC200- The FPC 200 has a base material of a flexibly bendable insulating film substrate 201, and has a conductive layer 202 formed as, for example, wiring on at least one main surface of the film substrate 201. Although electronic components may be mounted on the FPC 200 while connected to the conductive layer 202, the FPC 200 used here is typically an FPC 200 before electronic components are mounted. The film substrate 201 constituting such an FPC 200 is made of, for example, a low-dielectric plastic resin such as a liquid crystal polymer (LCP) or a fluororesin (e.g., PTFE: polytetrafluoroethylene) for high-speed communications, or may be made of polyimide, PET (polyethylene terephthalate), or the like for other uses.

[0017] The conductive layer 202 is formed by patterning a thin film made of a highly conductive material such as copper or silver into a wiring shape. The portion of the conductive layer 202 that extends to the edge of the film substrate 201 is formed as a terminal 202a for connection to the rigid printed circuit board 100. The length [L2] of the terminal 202a in the direction that it extends to the edge of the film substrate 201 may be shorter than the length [L1] of the terminal 102a on the rigid printed circuit board 100 side.

[0018] Next, a heating bonding apparatus 1 for bonding the above-mentioned rigid printed circuit board 100 and FPC 200 will be described with reference to Figures 1 and 2. The heating bonding apparatus 1 includes a stage 10, a pressure unit 20, a heating unit 30, and a control unit 40. These will be described in order below.

[0019] <Stage 10> The rigid printed circuit board 100 and the FPC 200 are placed on the stage 10 in a stacked state. The rigid printed circuit board 100 and the FPC 200 are placed on the stage 10 so that the terminals 102a and 202a are stacked via the adhesive layer 103. Details of the stacked state of the rigid printed circuit board 100 and the FPC 200 will be explained later in the description of the thermal bonding method. In addition, a spacer 10a is placed on the stage 10 to support the rigid printed circuit board 100 and the FPC 200.

[0020] <Pressure unit 20> The pressure unit 20 is for applying pressure to the laminated portion of the rigid printed circuit board 100 and the FPC 200 by sandwiching it between the stage 10 and itself. The pressure unit 20 includes a pressure jig 21 and an elevation drive unit 22.

[0021] [Pressure Jig 21] The pressure jig 21 is provided below the lifting / lowering drive unit 22, which will be described below, and is equipped with a pressure tip 21a at its lower end. The pressure jig 21 and pressure tip 21a are freely raised and lowered in the vertical direction by the drive of the lifting / lowering drive unit 22. The pressure tip 21a is driven by the lifting / lowering drive unit 22 to clamp and pressurize the laminated portion of the rigid printed circuit board 100 and the FPC 200 between itself and the stage 10.

[0022] The pressure jig 21 and the pressure chip 21a at its lower end are shaped so that the pressure chip 21a applies uniform pressure to the laminated portion of the rigid printed circuit board 100 and the FPC 200. The pressure chip 21a is provided at a position where the rigid substrate 101 of the rigid printed circuit board 100 and the film substrate 201 of the FPC 200 are laminated, and where the edge portion of the film substrate 201 of the FPC 200, which is located at the top of the rigid printed circuit board 100 and the FPC 200, is clamped between the pressure chip 21a and the stage 10.

[0023] Furthermore, the pressure chip 21a is preferably made of a heat-dissipating material with high thermal conductivity, such as a metal material, so that when heat generated by driving the heating unit 30 (described below) is transmitted to the film substrate 201 of the FPC 200, the heat is dissipated from the pressure jig 21 via the pressure chip 21a, preventing damage to the film substrate 201 of the FPC 200 due to heating.

[0024] [Lifting drive unit 22] The lifting / lowering driver 22 is a driver for clamping the laminated portion of the rigid printed circuit board 100 and the FPC 200 between the stage 10 and the pressure chip 21a and applying pressure by raising and lowering the pressure jig 21 and the pressure chip 21a relative to the stage 10. The lifting / lowering driver 22 is equipped with a load detector (not shown) for detecting the load applied to the pressure chip 21a. The lifting / lowering of the pressure chip 21a by the lifting / lowering driver 22 is controlled by the control unit 40, which will be described later, so that a preset load is applied to the laminated portion based on the load applied to the pressure chip 21a.

[0025] <Heating section 30> The heating unit 30 is for heating the laminated portion of the rigid printed circuit board 100, which is made up of the rigid substrate 101, the terminals 102a, and the adhesive layer 103, by sandwiching it between the heating unit 30 and the stage 10. The heating unit 30 includes a heating tip 31, an elevation drive unit 32, a heating power supply 33, a power supply control unit 34, and a temperature sensor 35.

[0026] [Heating Tip 31] The heating tip 31 extends below the lifting / lowering drive unit 32, which will be described below, and is freely raised and lowered in the vertical direction by the drive of the lifting / lowering drive unit 32. The heating tip 31 heats the laminated portion of the hard substrate 101, the terminals 102a, and the adhesive layer 103 while applying pressure at its lower end 31a, which hangs down from the lifting / lowering drive unit 32, at a position away from the film substrate 201 of the FPC 200. The heating tip 31 has a bifurcated base end on the lifting / lowering drive unit 32 side. Each of the divided portions of the heating tip 31 serves as an electrode terminal 31b, and Joule heat is generated at the lower end 31a by passing a current between the electrode terminals 31b. For this reason, at least the lower end 31a of the heating tip 31 is made of a high-resistance material, such as molybdenum.

[0027] The heating tip 31 is provided with a predetermined distance [d] between it and the pressure tip 21a of the pressure unit 20. This distance [d] is set to a size that prevents the heat generated by the heating tip 31 from affecting the film substrate 201 of the FPC 200, but is preferably small enough to allow the heating tip 31 to heat the entire adhesive layer 103 evenly. For this reason, the distance [d] is preferably set to, for example, about 0.5 mm to 1.0 mm.

[0028] [Lifting drive unit 32] The lifting / lowering driver 32 is a driver for bringing the lower end 31a of the heating tip 31 into contact with and applying pressure to the laminated portion of the hard substrate 101, the terminal 102a, and the adhesive layer 103 by lifting / lowering the heating tip 31. The lifting / lowering driver 32 includes a load detector (not shown) for detecting the load applied to the heating tip 31 by the lifting / lowering of the heating tip 31. The lifting / lowering of the heating tip 31 by the lifting / lowering driver 32 is controlled by a control unit 40, which will be described later, so that a preset load is applied to the laminated portion based on the load applied to the heating tip 31.

[0029] [Heating power supply 33] Heating power supply 33 is a power supply for passing a pulse current between electrode terminals 31b-31b of heating tip 31. The on / off of heating power supply 33 is controlled based on a signal from power supply control unit 34, which will be described next.

[0030] [Power supply control unit 34] The power supply control unit 34 controls the on / off of the heating power supply 33 based on instructions from the control unit 40 and the temperature of the lower end 31a of the heating tip 31 measured by a temperature sensor 35, which will be described below, and supplies a pulse current from the heating power supply 33 to the heating tip 31. At this time, the power supply control unit 34 controls the on / off of the heating power supply 33 based on instructions from the control unit 40 so that the temperature of the heating tip 31 matches a preset temperature profile. This power supply control unit 34 may be incorporated into the control unit 40, which will be described below.

[0031] [Temperature Sensor 35] The temperature sensor 35, which is, for example, a thermocouple, detects the temperature of the lower end 31a of the heating tip 31. The temperature sensor 35 is connected to the power supply control unit 34 and transmits the detected temperature of the lower end 31a of the heating tip 31 to the power supply control unit 34.

[0032] <Control unit 40> The control unit 40 controls the driving of the lifting / lowering drive unit 22 in the pressure unit 20 and the lifting / lowering drive unit 32 in the heating unit 30, and instructs the power supply control unit 34 to start controlling the on / off of the heating power supply 33. The control unit 40 is configured by a computer. A computer is hardware used as a so-called computer, and includes a CPU (Central Processing Unit), RAM (Random Access Memory), and a non-volatile storage unit such as a ROM (Read Only Memory). The control unit 40 controls the driving of the lifting / lowering drive units 22 and 32 based on a program stored in the storage unit, and instructs the power supply control unit 34 to start turning the heating power supply 33 on / off. Therefore, the control unit 40 is a main unit that performs overall control using a program for implementing the heating bonding apparatus 1 of this embodiment and the heating bonding method described next.

[0033] <Pressure bonding method> Fig. 3 is a flowchart showing a heating bonding method according to an embodiment. The flowchart in Fig. 3 shows a method for bonding two electronic components 100, 200 using the heating bonding apparatus 1 described with reference to Fig. 1, and shows steps carried out based on a program stored in the control unit 40. Figs. 4 to 7 are cross-sectional views (parts 1) to (part 4) for explaining the heating bonding method according to an embodiment. The heating bonding method according to an embodiment will be explained below in the order shown in the flowchart in Fig. 3, with reference to Figs. 1, 2, and 4 to 7.

[0034] First, before operating the heating bonding apparatus 1, the rigid printed circuit board 100 and the FPC 200 are placed on the stage 10 of the heating bonding apparatus 1 with their edges stacked together (see FIG. 4). At this time, the rigid printed circuit board 100 is placed on the stage 10 with the surfaces on which the conductive layer 102 and adhesive layer 103 are formed facing upward. The FPC 200 is also placed with the surface on which the conductive layer 202 is formed facing downward, with the conductive layer 102 of the rigid printed circuit board 100 and the conductive layer 202 of the FPC 200 facing each other and sandwiching the adhesive layer 103 therebetween.

[0035] When performing this arrangement, it is important to pay attention to the following points. First, the FPC 200 is arranged on the rigid printed circuit board 100 so that a portion of the adhesive layer 103 is exposed from the film substrate 201 of the FPC 200. Second, the rigid printed circuit board 100 and the FPC 200 are arranged so that the exposed portion of the adhesive layer 103 is located below the heating chip 31 and the laminated portion of the rigid printed circuit board 100 and the FPC 200 is located below the pressure chip 21a. Furthermore, it is preferable to place a spacer 10a between the stage 10 and the FPC 200 so that the FPC 200 is supported by the spacer 10a.

[0036] In the above state, when a trigger to start processing is given to the control unit 40 by, for example, an input unit (not shown), the control unit 40 operates the heating type bonding device 1 in the following procedure.

[0037] <Step S101> In step S101, the control unit 40 instructs the lifting / lowering driver 22 of the pressure unit 20 to lower the pressure tip 21a. As a result, the lifting / lowering driver 22 lowers the pressure jig 21 and the pressure tip 21a at its tip, and sandwiches the laminated portion of the rigid printed circuit board 100 and the FPC 200 at the edge of the film substrate 201 between the pressure tip 21a and the stage 10 (see FIG. 5). At this time, the control unit 40 controls the lifting / lowering driver 22 so that the pressure tip 21a applies a preset load to the laminated portion.

[0038] <Step S102> In step S102, the control unit 40 instructs the lifting / lowering driver 32 of the heating unit 30 to lower the heating tip 31. As a result, the lifting / lowering driver 32 lowers the heating tip 31, and sandwiches the laminated portion of the rigid substrate 101, terminals 102a, and adhesive layer 103 of the rigid printed circuit board 100 between the lower end 31a of the heating tip 31 and the stage 10 at a position away from the film substrate 201 (see FIG. 6). At this time, the control unit 40 controls the lifting / lowering driver 32 so that a preset load is applied to the laminated portion. Note that steps S101 and S102 may be performed in reverse order or simultaneously.

[0039] <Step S103> In step S103, the control unit 40 causes the power supply control unit 34 of the heating unit 30 to start supplying a pulse current from the heating power supply 33 to the heating tip 31. As a result, the power supply control unit 34 starts on / off control of the heating power supply 33 based on the temperature of the lower end 31a of the heating tip 31 measured by the temperature sensor 35, so that the lower end 31a matches a preset temperature profile.

[0040] Furthermore, supplying a pulse current to the heating chip 31 causes the heating chip 31 to generate heat, heating the adhesive layer 103. The heat applied to the adhesive layer 103 from the heating chip 31 is transferred from the adhesive layer 103 and the conductive layer 102 to the entire area of ​​the adhesive layer 103, melting the entire area of ​​the adhesive layer 103. Note that the conductive layer 102 of the rigid printed circuit board 100 and the conductive layer 202 of the FPC 200 are also heated via the adhesive layer 103. For this reason, the above-mentioned temperature profile is set within a range that does not affect the conductive layers 102 and 202. At this time, the heat transferred to the film substrate 201 is dissipated via the pressure chip 21a made of a heat dissipation material.

[0041] <Step S104> In step S104, the control unit 40 determines whether or not to end heating by the heating tip 31. The control unit 40 makes this determination according to a stored program. For example, the control unit 40 determines that heating has ended (YES) when the time elapsed since the temperature of the lower end 31a of the heating tip 31 measured by the temperature sensor 35 reached a preset temperature reaches a preset time. If the control unit 40 determines that heating has not ended (NO), it repeats the determination of step S4. Then, if the control unit 40 determines that heating has ended (YES), it proceeds to the next step S105.

[0042] However, the determination of heating termination by the control unit 40 is not limited to this. For example, if the pressure unit 20 of this heating type bonding device 1 is equipped with a displacement meter for the pressure tip 21a, the control unit 40 can make this determination based on the amount of downward displacement of the pressure tip 21a. In this case, the control unit 40 determines that heating has terminated (YES) when the time elapsed since the amount of displacement reached a predetermined value reaches a predetermined time.

[0043] <Step S105> In step S105, the control unit 40 causes the power supply control unit 34 of the heating unit 30 to perform a heating termination process. At this time, the control unit 40 causes the power supply control unit 34 to terminate the supply of pulse current from the heating power supply 33 to the heating tip 31. Alternatively, the control unit 40 may gradually reduce the supply of pulse current from the heating power supply 33 to the heating tip 31 so that the temperature of the lower end 31a of the heating tip 31 decreases according to a preset temperature profile.

[0044] <Step S106> In step S106, the control unit 40 instructs the lifting / lowering drive unit 22 of the pressure unit 20 to lift the pressure tip 21a, and instructs the lifting / lowering drive unit 32 of the heating unit 30 to lift the heating tip 31. As a result, the pressure tip 21a and the heating tip 31 are lifted up from the laminated portion of the rigid printed circuit board 100 and the FPC 200 (see FIG. 7). Then, a bonded body 300 is obtained in which the rigid printed circuit board 100 and the FPC 200 are bonded between the terminals 102a-202a via the adhesive layer 103.

[0045] Effect of the embodiment According to the embodiment described above, in bonding the rigid printed circuit board 100 and the FPC 200, by providing the pressure chip 21a in addition to the heating chip 31 used to heat the adhesive layer 103, the adhesive layer 103 is heated at a position of the FPC 200 that is away from the film substrate 201. This prevents the film substrate 201 from being affected by heating by the heating chip 31, and allows for greater flexibility in the heat resistance of the material that constitutes the film substrate 201.

[0046] As a result, a material with a low dielectric constant but low heat resistance, such as a liquid crystal polymer or a fluororesin, can be used for the film substrate 201, making it possible to realize an FPC 200 that supports high-speed communication and an assembly of electronic components using the FPC 200. In addition, a material with a low heat resistance but low cost, such as a PET resin, can be used for the film substrate 201, making it possible to reduce the cost of the FPC 200 and an assembly of electronic components using the FPC 200.

[0047] <Application to other electronic components> FIG. 8 is a cross-sectional view showing another example of two electronic components bonded using the heating bonding device according to the embodiment. Two electronic components 100, 200′ shown in FIG. 8 can be exemplified as another example of electronic components bonded using the heating bonding device 1 according to the embodiment shown in FIG. 1. One of these electronic components 100, 200′ is a rigid printed circuit board 100 similar to that described in the previous embodiment, and the other electronic component 200′ is a flexible flat cable (FFC: Flexible Flat Cable). In the following description, electronic component 100 will also be referred to as rigid printed circuit board 100, and electronic component 200′ will also be referred to as FFC 200′.

[0048] -Hard printed circuit board 100- The rigid printed circuit board 100 has the same configuration as the rigid printed circuit board 100 described using Figure 2, and has a conductive layer 102 and an adhesive layer 103 on one main surface of the rigid substrate 101, so detailed description will be omitted here.

[0049] -FFC200'- The FFC 200' has a base material of a flexibly bendable insulating film substrate 201, and has a conductive layer 202 sandwiched between the film substrates 201. The film substrate 201 constituting such an FFC 200' is made of a low-dielectric-constant plastic resin such as liquid crystal polymer (LCP) or fluororesin (e.g., PTFE: polytetrafluoroethylene) for high-speed communications, or may be made of polyimide, PET (polyethylene terephthalate), or the like for other uses.

[0050] The conductive layer 202 is formed as, for example, wiring and is made of copper or silver. The end of the conductive layer 202 is drawn out and extended outward from the edge of the film substrate 201, and is formed as a terminal 202a for connection to the rigid printed circuit board 100.

[0051] The adhesive layer 103 of the rigid printed circuit board 100 may be provided on the terminals 202a of the FFC 200′. In this case, the rigid printed circuit board 100 does not need to have the adhesive layer 103.

[0052] FIG. 9 is a cross-sectional view of the case where the heating bonding method according to the embodiment is applied to another example of electronic components, and shows the case where the electronic components 100, 200′ shown in FIG. 8 are bonded using the heating bonding apparatus 1 according to the embodiment shown in FIG.

[0053] 9, before operating the heating bonding apparatus 1, the rigid printed circuit board 100 and the FFC 200' are placed on the stage 10 of the heating bonding apparatus 1 with their edges stacked together. At this time, the rigid printed circuit board 100 is placed on the stage 10 with the surfaces on which the conductive layer 102 and adhesive layer 103 are formed facing upward. The FFC 200' is also stacked so that the terminal 202a of the conductive layer 202 and the conductive layer 102 of the rigid printed circuit board 100 sandwich the adhesive layer 103 between them.

[0054] What is important here is that the rigid printed circuit board 100 and FFC 200' are positioned so that the laminated portion, with the adhesive layer 103 sandwiched between the conductive layers 102-202, is positioned below the heating chip 31, and the laminated portion of the rigid substrate 101 of the rigid printed circuit board 100 and the film substrate 201 of the FFC 200' is positioned below the pressure chip 21a. It is also preferable to position a spacer 10a between the stage 10 and the FFC 200' so that the FFC 200' is supported by the spacer 10a.

[0055] In the above state, by giving a trigger to start processing to the control unit 40 (see FIG. 1), the control unit 40 operates the heating type bonding device 1 according to the procedure previously explained using the flowchart in FIG. 3. At this time, the control unit 40 determines whether to end heating in step S104 based on the elapsed time since the preset temperature was reached.

[0056] In addition, in step S104, if another determination method is applied, a determination is made based on the displacement of the heating tip 31. In this case, the heating unit 30 of the heating type bonding device 1 is equipped with a displacement meter for the heating tip 31, and the control unit 40 can make this determination based on the amount of downward displacement of the heating tip 31. In this case, the control unit 40 determines that heating has ended (YES) when the elapsed time from the point in time when the amount of displacement reached a predetermined value reaches a predetermined time.

[0057] In joining the rigid printed circuit board 100 and the FFC 200', the laminated portion of the rigid substrate 101 of the rigid printed circuit board 100 and the film substrate 201 of the FFC 200' is pressed by a pressure chip 21a provided separately from the heating chip 31. This allows heat transferred from the conductive layer 202 to the film substrate 201 to be dissipated via the pressure chip 21a. This prevents the film substrate 201 from being affected by heating by the heating chip 31, and allows for greater flexibility in the heat resistance of the material that makes up the film substrate 201.

[0058] As a result, it is possible to realize FFC200' and an assembly of electronic components using FFC200' that are compatible with high-speed communications, since a material with a low dielectric constant but low heat resistance, such as a liquid crystal polymer or a fluororesin, can be used for film substrate 201. In addition, it is possible to use a material with a low cost but low heat resistance, such as a PET resin, for film substrate 201, which makes it possible to reduce the cost of FFC200' and an assembly of electronic components using FFC200'.

[0059] <<Variations>> Fig. 10 is a diagram showing a modified example of the heating bonding apparatus according to the embodiment. The heating bonding apparatus 1' shown in Fig. 10 differs from the heating bonding apparatus 1 according to the embodiment described with reference to Fig. 1 in that the lifting / lowering drive unit 32 of the heating unit 30 also serves as the lifting / lowering drive unit for the pressure unit 20', but the other configurations are the same.

[0060] That is, the pressure applying unit 20' includes a pressure applying jig 21 having a pressure applying tip 21a at its lower end, and a fixing unit 22' for fixing the pressure applying jig 21 to the lifting / lowering drive unit 32 of the heating unit 30 while holding the pressure applying jig 21. The fixing unit 22' holds the pressure applying jig 21 so that the pressure applying jig 21 moves up and down together with the heating tip 31 when driven by the lifting / lowering drive unit 32 of the heating unit 30. In this case, the downward extension lengths of the pressure applying jig 21 and the heating tip 31 are freely set and fixed in accordance with the thickness of each of the electronic components 100, 200.

[0061] The bonding of electronic components 100 and 200 using the heating bonding device 1' configured as described above is performed in the same manner as in the first embodiment. However, steps S101 and S102 shown in the flowchart of Fig. 3 are performed simultaneously. Furthermore, the lifting and lowering control of heating tip 31 and pressure jig 21 by lifting and lowering drive unit 32 is performed based on the load applied to either pressure tip 21a or heating tip 31.

[0062] The heating bonding apparatus 1' described above also provides the same effect as bonding using the heating bonding apparatus 1 of the embodiment by providing the pressure tip 21a in addition to the heating tip 31 used to heat the adhesive layer 103. This heating bonding apparatus 1' can also be used to bond the electronic components 100, 200' shown in Figure 8 in the same way, and provides the same effect. [Explanation of symbols]

[0063] 1,1'...Heating type joining device 10...Stage 10a...Spacer 20,20'...Pressure section 21...Pressure jig 21a...Pressure tip 22, 32...Lifting drive unit 22'…Fixed part 30...Heating part 31...Heating tip 31a...lower end 31b...electrode terminal 33…Heating power supply 34...Power supply control unit 35...Temperature sensor 40...Control unit 100...Hard printed circuit board (electronic parts) 101…Hard substrate (base material) 102, 202...Conductive layer 102a, 202a...terminal (conductive layer) 103...adhesive layer 200...FPC (electronic components) 200'...FFC (electronic components) 201...Film substrate (base material) 300…zygote

Claims

1. A heating bonding apparatus for bonding two electronic components each having a conductive layer supported by a substrate, comprising: a stage for placing the two electronic components in a predetermined state; a pressure tip for clamping and applying pressure to the stack of the two electronic components between the stage and the pressure tip; a heating tip disposed at a predetermined distance from the pressure tip, for clamping and heating one of the two electronic components between the pressure tip and the stage; an elevation drive unit that raises and lowers the heating tip and the pressure tip relative to the stage; a heating power supply that supplies a pulse current to the heating tip; a control unit that controls the elevation of the heating tip and the pressure tip by the elevation drive unit and controls the on / off of the heating power source; the two electronic components are placed on top of each other on the stage such that the conductive layers of the two electronic components are laminated via a conductive adhesive layer and portions of the base materials of the two electronic components are laminated together; the pressure chip is made of a heat dissipation material and is provided at a position where the positions where the base materials of the two electronic components are stacked are sandwiched between the pressure chip and the stage; the heating tip is provided at a position separated from a substrate of the upper one of the two electronic components and at a position where the heating tip sandwiches, between the heating tip and the stage, a laminated portion in which the adhesive layer is laminated on a conductive layer of the lower one of the two electronic components; The control unit controls the lifting and lowering drive unit to sandwich the positions where the base materials of the two electronic components are stacked between the pressure tip and the stage, and sandwiches a stacked portion in which the adhesive layer is stacked on the conductive layer of the electronic component arranged at the bottom of the two electronic components between the heating tip and the stage, and heats the electronic component sandwiched between the heating tip and the stage by controlling the heating power source. Heating type bonding equipment.

2. an elevation drive unit that raises and lowers the pressure tip relative to the stage; and a lifting drive unit that lifts and lowers the heating tip relative to the stage. The heating type bonding apparatus according to claim 1 .

3. The lifting / lowering drive unit lifts and lowers the pressure tip and the heating tip so that a predetermined load is applied to the pressure tip and the heating tip.

3. The heating type bonding apparatus according to claim 1 or 2.

4. The heating power supply supplies a pulse current to the heating tip so that the heating tip is heated to a predetermined temperature. The heating type bonding apparatus according to claim 1 .

5. 1. A thermal bonding method for bonding two electronic components each having a conductive layer supported by a substrate, comprising: placing the two electronic components on a stage so that the conductive layers of the two electronic components are stacked via a conductive adhesive layer and so that portions of the base materials of the two electronic components are stacked together; Next, the positions where the base materials of the two electronic components are stacked are sandwiched and pressed between the stage and a pressure chip made of a heat dissipation material, thereby leaving the heat at the positions where the base materials are stacked in a state where it is dissipated from the pressure chip; Next, a laminated portion in which the adhesive layer is laminated on the conductive layer of the lower electronic component of the two electronic components at a position away from the substrate of the upper electronic component of the two electronic components is sandwiched between the stage and a heating chip and heated by the heating chip, while dissipating heat from the position where the substrate is laminated from the pressure chip. Heated joining method.

6. one of the two electronic components has the conductive layer and the adhesive layer provided thereon on at least one main surface of the base material; the other of the two electronic components has the conductive layer provided on at least one main surface of the base material, When the two electronic components are placed on the stage, the other electronic component is placed on top of one electronic component in a state where the conductive layers of the two electronic components face each other via the adhesive layer, and a part of the adhesive layer is exposed from the base material of the other electronic component. The heating bonding method according to claim 5 .

7. one of the two electronic components has the conductive layer provided on at least one main surface of the base material; the other of the two electronic components is an extension of the conductive layer sandwiched between the base materials, When the two electronic components are placed on the stage, one electronic component is placed on top of the other electronic component, and the conductive layers of the two electronic components are laminated via the adhesive layer at a position where the conductive layer of the other electronic component extends from the base material. The heating bonding method according to claim 5 .

8. When heating by the heating tip, the pressure tip and the heating tip are raised and lowered relative to the stage by an elevation drive unit so that a predetermined load is applied to the pressure tip and the heating tip. The heating bonding method according to any one of claims 5 to 7.

9. A heating power source supplies a pulse current to the heating tip to heat the heating tip, thereby heating the laminated portion in which the conductive layer is laminated via the adhesive layer. The heating bonding method according to any one of claims 5 to 8.

10. The heating power supply supplies a pulse current to the heating tip so that the heating tip is heated to a predetermined temperature. The heating bonding method according to claim 9 .

11. The substrate of the upper electronic component of the two electronic components is a film substrate. The heating bonding method according to any one of claims 5 to 10.

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