Solder lug structure, glass assembly, and vehicle

Abstract

The present application provides a solder lug structure, a glass assembly, and a vehicle. The solder lug structure comprises a soldering portion, solder, and a limiting protrusion. The soldering portion is provided with a soldering surface configured to be proximate to glass and has a first thermal conductivity, and the solder is fixed to the soldering surface. The limiting protrusion is at least partially fixed to the soldering surface, and the limiting protrusion and the soldering portion are separate structures. The limiting protrusion has a second thermal conductivity, the second thermal conductivity being less than the first thermal conductivity. The solder lug structure provided in the present application is additionally provided with the limiting protrusion, thereby ensuring the distance between the soldering surface and the glass during soldering so as to ensure that the soldering portion does not directly contact the glass during soldering, while ensuring the thickness of the solder and improving soldering strength. In addition, by selecting a limiting protrusion having a low thermal conductivity, the impact of sudden temperature changes on the glass is reduced, thereby mitigating the problem of glass cracking caused by soldering.

Description

Welding leg structure, glass assembly, vehicle

[0001] The present disclosure claims priority to the Chinese patent application No. 202411245712.X, filed on September 6, 2024, with the Chinese Patent Office, and entitled "Welding leg structure, glass assembly, vehicle", the entire content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application belongs to the technical field of welding, and particularly relates to a welding leg structure, a glass assembly, and a vehicle. BACKGROUND

[0003] Currently, it is generally necessary to weld a welding leg structure on a conductive circuit in glass, and to pass electricity through the conductive circuit in the glass by the welding leg structure, so as to realize the integration of a series of electronic functions on the glass, such as heating defogging, antenna, breakage alarm, etc. The welding part in the welding leg structure is usually provided with solder, and in the welding process, the solder is melted, the welding part is close to the glass, and after the solder is cooled, it is welded to the glass. However, the current welding leg structure is difficult to ensure the distance between the welding surface and the glass, and thus it is difficult to ensure the thickness of the solder. At the same time, the welding surface is easy to contact the glass in the welding process, and the huge temperature difference in the instant contact causes the destruction of the stress layer of the glass and the generation of surface micro-cracks, thereby leading to the subsequent occurrence of glass cracks. SUMMARY

[0004] In view of this, the first aspect of the present application provides a welding leg structure, which comprises:

[0005] a welding part having a welding surface for being close to the glass, the welding part having a first thermal conductivity coefficient;

[0006] solder fixed to the welding surface;

[0007] a limiting protrusion at least partially fixed to the welding surface, the limiting protrusion being a separate structure from the welding part, the limiting protrusion having a second thermal conductivity coefficient, and the second thermal conductivity coefficient being smaller than the first thermal conductivity coefficient.

[0008] The welding leg structure provided by the first aspect of the present application first adds a limiting protrusion on the welding part of the welding leg structure, thereby avoiding the component of the solder overflow caused by the welding surface being too close to the glass under the action of pressure. The limiting protrusion is arranged on the welding surface, which is the contact surface between the welding part and the glass, so as to ensure the distance between the welding part and the glass in the welding process, so as to ensure that the welding part does not directly contact the glass in the welding process. At the same time, the thickness of the solder is ensured, so that the welding is more firm.

[0009] Secondly, on the basis of setting the limiting protrusion, the limiting protrusion and the welding part are designed in a split type, that is, the welding part and the limiting protrusion can have different thermal conductivities. The limiting protrusion in the application can have a second thermal conductivity, and the second thermal conductivity is less than the first thermal conductivity. Compared with the limiting protrusion in the related art, the limiting protrusion in the application has a lower heat conduction rate and a slower temperature rise, so that the limiting protrusion in the application will not cause the temperature of the contact position of the glass to change suddenly when it contacts the glass during the welding process, thereby reducing the risk of glass cracking during the welding process.

[0010] From another angle, when high temperature is transferred to the welding part with a higher thermal conductivity, because the limiting protrusion has a thermal conductivity less than that of the welding part, the heat transfer from the welding part to the limiting protrusion is reduced, so that the limiting protrusion is heated slowly, and when the limiting protrusion is transferred to the glass, the glass is also heated slowly, so that the temperature of the glass does not change suddenly, thereby reducing the risk of glass cracking during the welding process.

[0011] In summary, the solder leg structure provided by the application adds a limiting protrusion, which ensures the distance between the welding surface and the glass during the welding process to ensure that the welding part does not directly contact the glass during the welding process, and at the same time ensures the thickness of the solder, improves the welding strength, and in addition, the limiting protrusion with low thermal conductivity reduces the influence of temperature change on the glass and reduces the problem of cracking caused by welding.

[0012] The limiting protrusion is sleeved on the welding part.

[0013] The welding part is provided with a limiting groove, and part of the limiting protrusion is arranged in the limiting groove.

[0014] The limiting protrusion satisfies at least one of the following properties:

[0015] The tensile strength of the limiting protrusion is not less than 1 MPa;

[0016] The elongation at break of the limiting protrusion is not less than 50%.

[0017] The limiting protrusion is bonded to the welding surface.

[0018] The welding part is provided with a through hole, and the limiting protrusion penetrates the through hole so that one end of the limiting protrusion is arranged on the welding surface.

[0019] The limiting protrusion comprises a limiting portion, a penetrating portion and a clamping portion in sequence along the axial direction of the limiting protrusion, the penetrating portion is arranged in the through hole, the limiting portion is arranged on the welding surface, and the clamping portion is clamped on the surface of the welding portion away from the welding surface; the outer diameter of the limiting portion and the outer diameter of the clamping portion are both greater than the hole diameter of the through hole.

[0020] The limiting protrusion has elasticity, the welding portion has a first hardness, and the limiting protrusion has a second hardness, the second hardness being less than the first hardness.

[0021] The limiting protrusion satisfies at least one of the following properties:

[0022] The softening temperature of the limiting protrusion is not less than 300 DEG C.

[0023] The hardness of the limiting protrusion is greater than 30 Shore A.

[0024] The friction coefficient between the limiting protrusion and the glass is not less than 0.4.

[0025] The thickness of the limiting protrusion is 0.1 mm-0.8 mm.

[0026] The thickness of the solder is greater than the thickness of the limiting protrusion, so that the surface of the solder close to the glass is closer to the glass than the surface of the limiting protrusion close to the glass.

[0027] Along the arrangement direction of the limiting protrusion and the solder, the width of the limiting protrusion is 1 mm-4 mm.

[0028] Along the arrangement direction of the limiting protrusion and the solder, the width of the limiting protrusion is 2 mm-5 mm.

[0029] Along the arrangement direction of the limiting protrusion and the solder, there is a gap between the limiting protrusion and the solder.

[0030] The surface of the welding portion away from the welding surface is provided with a positioning mark, and the positioning mark is used for positioning and abutting of the welding device.

[0031] Along the arrangement direction of the limiting protrusion and the solder, the limiting protrusion is arranged on one side or opposite sides of the solder.

[0032] The solder leg structure comprises a connecting portion for connecting a lead wire and two welding portions, the two welding portions are connected to opposite sides of the connecting portion, and the two limiting protrusions in the two welding portions are closer to each other or farther away from each other than the two solders.

[0033] The second aspect of the present application provides a glass assembly, which comprises glass and the solder leg structure provided by the first aspect of the present application, and the solder leg structure is welded to the glass.

[0034] The glass assembly provided by the second aspect of the present application ensures the distance between the soldering surface and the glass during the welding process, so as to ensure that the welding part does not directly contact the glass during the welding process, and at the same time, the thickness of the solder is ensured, the welding strength is improved, in addition, the limiting protrusion with low thermal conductivity is selected, the influence of temperature mutation on the glass is reduced, the problem of glass cracking caused by welding is reduced, and the yield is improved.

[0035] The third aspect of the present application provides a vehicle, which comprises a vehicle body panel and the glass assembly provided by the second aspect of the present application, and the glass assembly is arranged on the vehicle body panel.

[0036] The vehicle provided by the third aspect of the present application reduces the risk of glass cracking, reduces customer complaints, increases the service life of the glass, and improves the safety of driving. BRIEF DESCRIPTION OF DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments of the present application will be described below.

[0038] FIG. 1 is a perspective structural schematic view of a solder leg structure in an embodiment of the present application.

[0039] FIG. 2 is a front view of the solder leg structure shown in FIG. 1.

[0040] FIG. 3 is a partially enlarged front view of the solder leg structure shown in FIG. 2.

[0041] FIG. 4 is a front view of the solder leg structure shown in FIG. 1 when it is welded to the glass.

[0042] FIG. 5 is a front view of a solder leg structure in another embodiment of the present application.

[0043] FIG. 6 is a bottom view of the solder leg structure shown in FIG. 1.

[0044] FIG. 7 is a bottom view of the solder leg structure shown in FIG. 1 after the limiting protrusion is removed.

[0045] FIG. 8 is a perspective structural schematic view of a solder leg structure in still another embodiment of the present application.

[0046] FIG. 9 is a front view of the solder leg structure shown in FIG. 8.

[0047] FIG. 10 is a bottom view of the solder leg structure shown in FIG. 8.

[0048] Fig. 11 is a perspective view of a soldering leg structure according to another embodiment of the present application.

[0049] Fig. 12 is a front view of the soldering leg structure shown in Fig. 11.

[0050] Fig. 13 is a bottom view of the soldering leg structure shown in Fig. 11.

[0051] Fig. 14 is a partial cross-sectional view of the soldering leg structure shown in Fig. 11.

[0052] Fig. 15 is a bottom view of another embodiment of the soldering leg structure shown in Fig. 6.

[0053] Fig. 16 is a front view of another embodiment of the soldering leg structure shown in Fig. 2.

[0054] Fig. 17 is a schematic view of a glass assembly according to an embodiment of the present application.

[0055] Fig. 18 is a schematic view of a vehicle according to an embodiment of the present application.

[0056] Reference Signs: Soldering leg structure-1, Glass assembly-2, Vehicle-3, Soldering portion 10, Soldering surface-11, Limiting groove-12, Through hole-13, Gap-14, Positioning mark-15, Solder-20, Limiting protrusion-30, Limiting portion-31, Through portion 32, Clamping portion-33, Connecting portion-40, Glass-50, Vehicle body panel-60. DETAILED DESCRIPTION

[0057] The following is a preferred embodiment of the present application. It should be noted that, for those skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, which are also considered within the scope of protection of the present application.

[0058] Before introducing the technical solutions provided by the present application, the technical problems in the related art will be introduced in detail.

[0059] With the rapid development of the automotive industry, the demand for automotive glass is also increasing, for example, a series of electronic functions need to be integrated into the front windshield, rear windshield, etc. of the vehicle, such as heating and defogging, antenna, breakage alarm, etc. Therefore, in recent years, glass with a series of electronic functions has entered people's lives more and more. However, when the glass needs to realize a series of electronic functions, for example, when the glass needs to realize local or full-surface heating function, it is usually necessary to print conductive silver paste on the surface of the glass body. The conductive silver paste can form a conductive circuit, and then the wires are electrically connected to the conductive circuit. At present, a soldering leg structure is usually first welded to the conductive circuit of the glass, and then the wires are fixedly connected to the soldering leg structure, so that the wires pass through the soldering leg structure to electrify the conductive circuit in the glass.

[0060] In the current welding method, such as the welding leg structure applied to the antenna and the welding leg structure applied to the explosion-proof joint, the bottom of the welding leg structure is usually provided with solder. In the welding process, the welding leg structure is first positioned at the welding position, and then the welding leg structure is heated by the welding needle. At this time, the solder is melted, the welding leg structure is stressed to be close to the glass surface, and after the solder is cooled, the welding leg structure is welded to the glass. Therefore, it is difficult to ensure the distance between the welding surface and the glass when welding such welding leg structure, so it is difficult to ensure the thickness of the solder. At the same time, the welding surface is easy to contact the glass during the welding process. Since the welding leg structure is usually made of a material with good thermal conductivity, the temperature of the welding part is increased to more than 100℃ during the process. Therefore, heat and temperature are also conducted to the glass in direct contact with the welding part during the welding process. The huge temperature difference in the contact moment causes the stress layer of the glass to be damaged and micro cracks to occur on the surface, thereby causing the glass to crack in the subsequent process.

[0061] In addition, other types of welding leg structures, such as bridge-type welding leg structures, usually have a limit protrusion formed by stamping on the contact surface with the glass, i.e. the welding surface, to ensure the distance between the welding surface and the glass, so as to ensure that the welding part does not directly contact the glass during the welding process, thereby ensuring the thickness of the solder and achieving the function of limiting the height of the solder. However, the limit protrusion of the welding part will directly contact the glass during the welding process. At this time, the position of the welding leg structure will not continue to drop. However, heat and temperature at the welding part will also be conducted to the glass through the limit protrusion formed in one piece, thereby causing the internal stress of the glass to change and micro cracks to occur at the bottom of the limit protrusion, thereby reducing the strength of the glass and increasing the risk of cracking.

[0062] Therefore, in order to solve the above problems, the present application provides a welding leg structure. Please refer to FIGS. 1-5, FIG. 1 is a perspective view of the welding leg structure in an embodiment of the present application. FIG. 2 is a front view of the welding leg structure shown in FIG. 1. FIG. 3 is a partial enlarged front view of the welding leg structure shown in FIG. 2. FIG. 4 is a front view of the welding leg structure shown in FIG. 1 when it is welded on the glass. FIG. 5 is a front view of the welding leg structure in another embodiment of the present application.

[0063] The welding leg structure 1 provided by the embodiment includes a welding part 10, solder 20, and a limit protrusion 30. The welding part 10 has a welding surface 11 for being close to the glass 50, the welding part 10 has a first thermal conductivity coefficient, and the solder 20 is fixed to the welding surface 11. The limit protrusion 30 is at least partially fixed to the welding surface 11, and the limit protrusion 30 and the welding part 10 are a split structure, the limit protrusion 30 has a second thermal conductivity coefficient, and the second thermal conductivity coefficient is less than the first thermal conductivity coefficient.

[0064] The solder leg structure 1 provided by the embodiment is mainly applied to electrical connection of a circuit and a glass 50, and the solder leg structure 1 can also be called a solder terminal. The solder leg structure 1 is welded at a conductive circuit position in the glass 50, for example, the conductive circuit is a conductive silver paste printed on the glass 50. Then, the solder leg structure 1 is connected with an external lead wire, so that the glass 50 can realize a series of electronic functions.

[0065] The solder leg structure 1 mainly includes a welding portion 10, solder 20, and a limiting protrusion 30. The welding portion 10 is a part of the solder leg structure 1 that is in contact with a welding needle in a welding machine during a welding process. A surface of the welding portion 10 close to the glass 50 can be called a welding surface 11, that is, a lower surface of the welding portion 10 is the welding surface 11, and the welding portion 10 is welded with the glass 50 by using the welding surface 11 subsequently. Since the solder 20 arranged on the welding surface 11 needs to be heated uniformly, the welding portion 10 is generally made of a material with good heat conduction performance. Specifically, the thermal conductivity coefficient of the welding portion 10 is a first thermal conductivity coefficient. Optionally, the first thermal conductivity coefficient of the welding portion 10 is generally greater than 200 W / mk, and further optionally, the material of the welding portion 10 includes but is not limited to copper, aluminum, and the like. The solder 20 is a commonly used material in the welding process, and the solder 20 in the embodiment is fixed on the welding surface 11 of the welding portion 10 facing the glass 50. During the welding process, the welding needle of the welding machine heats the solder leg structure 1, and the heat is conducted to the solder 20 to melt the solder 20. After the solder 20 solidifies, the solder leg structure 1 can be welded to the conductive circuit in the glass 50.

[0066] As can be known from the above, the welding portion 10 of the solder leg structure 1 in the related art does not have the limiting protrusion 30, so that it is difficult to ensure the distance between the welding surface 11 and the glass 50 during the welding process, and thus it is difficult to ensure the thickness of the solder 20. Meanwhile, the welding surface 11 is easy to contact the glass 50 during the welding process, so that the stress layer of the glass 50 is damaged due to a large temperature difference, and surface micro-cracks are generated, and then glass 50 chips are generated subsequently. Based on this, the welding portion 10 of the solder leg structure 1 is additionally provided with the limiting protrusion 30 in the embodiment, and the limiting protrusion 30 is used to ensure the distance between the solder leg and the glass 50 during the welding process, so as to avoid that the welding surface 11 is too close to the glass 50 under the action of pressure, and thus the solder 20 overflows. The limiting protrusion 30 is arranged on the welding surface 11, that is, the contact surface between the welding portion 10 and the glass 50, so as to ensure the distance between the welding portion 10 and the glass 50 during the welding process, so as to ensure that the welding portion 10 does not directly contact the glass 50 during the welding process. Meanwhile, the height of the solder 20 is ensured, that is, the thickness of the solder 20 is ensured, so that the welding is more firm.

[0067] In the related art, some of the solder leg structures 1, such as the bridge solder leg structure, are also provided with a limiting protrusion 30, but whether the soldering surface 11 directly contacts the glass 50 or the limiting protrusion 30 that is integral with the soldering portion 10 directly contacts the glass 50, both will cause the problem of cracking due to a huge temperature difference. Specifically, in the existing solder leg structure 1, the limiting protrusion 30 is designed in an integral manner with the soldering portion 10, and the limiting protrusion 30 and the soldering portion 10 have the same first thermal conductivity coefficient, that is, the limiting protrusion 30 is also made of a material with high thermal conductivity, and the temperature can also be conducted to the glass 50 through the limiting protrusion 30. The huge temperature difference between the high-temperature limiting protrusion 30 and the glass 50 at the moment of contact during the soldering process causes the stress layer of the glass 50 to be damaged and micro-cracks to occur on the surface, thereby causing the glass 50 to crack later.

[0068] On the basis of the limiting protrusion 30, the present embodiment can also make the limiting protrusion 30 and the soldering portion 10 be designed in a split manner, that is, the limiting protrusion 30 and the soldering portion 10 are two separate components, and then at least part of the limiting protrusion 30 is fixed to the soldering surface 11 by various methods, that is, the limiting protrusion 30 can be completely fixed on the soldering surface 11, or only part of it can be arranged on the soldering surface 11, and the rest can be arranged elsewhere. As for the specific fixing method of the limiting protrusion 30, it will be described in detail later.

[0069] Due to the split arrangement of the limiting protrusion 30 and the soldering portion 10, the soldering portion 10 and the limiting protrusion 30 can be made of different materials and manufactured separately, that is, the soldering portion 10 and the limiting protrusion 30 can have different thermal conductivity coefficients. The present embodiment can make the limiting protrusion 30 have a second thermal conductivity coefficient, and the second thermal conductivity coefficient is less than the first thermal conductivity coefficient, that is, the present embodiment adopts a limiting protrusion 30 with a lower thermal conductivity coefficient. Since the second thermal conductivity coefficient is less than the first thermal conductivity coefficient, compared with the limiting protrusion 30 in the related art, the limiting protrusion 30 in the present embodiment has a lower thermal conductivity and a slower temperature rise, so that the limiting protrusion 30 in the present embodiment will not cause the temperature of the glass 50 at the contact position to change suddenly when it contacts the glass 50 during the soldering process, thereby reducing the risk of glass 50 cracking during the soldering process.

[0070] From another angle, when the high temperature is transferred to the soldering portion 10 with a higher thermal conductivity coefficient, since the limiting protrusion 30 has a thermal conductivity coefficient less than that of the soldering portion 10, the heat transfer from the soldering portion 10 to the limiting protrusion 30 is reduced, causing the limiting protrusion 30 to heat up slowly. Therefore, when the limiting protrusion 30 is transferred to the glass 50, it also causes the glass 50 to heat up slowly, and will not cause the temperature of the glass 50 to change suddenly, thereby reducing the risk of glass 50 cracking during the soldering process.

[0071] In summary, the soldering leg structure 1 provided by the embodiment adds the limiting protrusion 30, ensures the distance between the soldering surface 11 and the glass 50 during the soldering process, ensures that the soldering part 10 does not directly contact the glass 50 during the soldering process, ensures the thickness of the solder 20, improves the soldering strength, and further reduces the influence of temperature mutation on the glass 50 and reduces the problem of cracks caused by soldering by selecting the limiting protrusion 30 with a low thermal conductivity.

[0072] Optionally, the second thermal conductivity of the limiting protrusion 30 is not greater than 0.3 W / mK, and further optionally, the material of the limiting protrusion 30 includes but is not limited to rubber, high-temperature-resistant adhesive tape, and the like. Specifically, the embodiment only schematically describes that the soldering part 10 is copper and the limiting protrusion 30 is rubber. The thermal conductivity of copper is about 400 W / mk, and the thermal conductivity of rubber is about 0.01-0.5 W / mk. Adding the rubber limiting protrusion 30 or replacing the limiting protrusion 30 from copper to rubber material greatly reduces the heat and temperature transmission to the glass 50 and reduces the large temperature difference between the positions of the direct contact between the soldering leg structure 1 and the glass 50.

[0073] Further optionally, when the material of the limiting protrusion 30 is a rubber material, the sulfur content of the rubber material is less than 2% by weight fraction, for example, the sulfur content of the rubber material can be less than 2%, 1.8%, 1.6%, 1.4%, 1.2%, 1.0%, 0.8%, 0.6%, 0.4%, 0.2%, and the like. Since the limiting protrusion 30 with the rubber material is in contact with the conductive layer, i.e., the conductive circuit, in the glass 50 in the subsequent soldering process, the embodiment can avoid the limiting protrusion 30 from reacting with the conductive circuit to cause hot spots by controlling the sulfur content in the rubber material to be less than 2%.

[0074] Still further optionally, the sulfur content of the rubber material is less than 0.1% by weight fraction, for example, the sulfur content of the rubber material can be less than 0.1%, 0.09%, 0.08%, 0.07%, 0.06%, 0.05%, 0.04%, 0.03%, 0.02%, 0.01%, and the like.

[0075] Optionally, the soldering leg structure 1 can further include a connecting part 40 in addition to the soldering part 10. The connecting part 40 is used to connect the wires outside the soldering leg structure 1. Further optionally, the connecting part 40 can be in the form of a short rod. In this case, one end of the connecting part 40 is connected to the soldering part 10, and the other end is inclined to extend away from the glass 50 for connecting the wires. The soldering leg structure 1 with one soldering part 10 can be referred to as a single-sided soldering leg structure, and in this case, the soldering leg structure 1 can also be referred to as a single-sided soldering terminal. The soldering leg structure 1 is mainly applied to the soldering leg structure 1 of an antenna and the soldering leg structure 1 of an explosion-proof joint.

[0076] Further optionally, the connecting portion 40 can also be in the shape of an arch bridge, in which case the two ends of the connecting portion 40 are connected to one welding portion 10 respectively, and the two welding portions 10 are the same in size and arranged on opposite sides of the connecting portion 40. The arch bridge of the connecting portion 40 protrudes away from the glass 50, and a gap 14 is formed between the connecting portion 40 and the glass 50 to avoid the contact between the connecting portion 40 and the conductive circuit of the glass 50, and facilitate the connection of the lead wire to the connecting portion 40. The connecting portion 40 and the two welding portions 10 can be referred to as a bridge solder structure, and the solder structure 1 can also be referred to as a bridge solder terminal, which is mainly applied to the solder structure 1 with heating function. The bridge solder structure can enable both welding surfaces 11 to be welded to the glass 50, so that the glass 50 is heated at two positions, avoiding local heat source. Further optionally, the connecting portion 40 and the welding portion 10 are in an integrated structure.

[0077] Optionally, the glass 50 includes but is not limited to tempered glass 50 or laminated glass 50. The windshield 50 mostly adopts the laminated glass 50 scheme, which is usually composed of two single pieces with a thickness of 1.8 mm or 2.1 mm, and has a lower strength than the tempered glass 50. When the solder structure 1 in the related art is welded to the laminated glass 50, it is more likely to cause the glass 50 to crack, thereby causing a series of problems such as reduced yield, customer complaints, and driving safety. However, whether it is tempered glass 50 or laminated glass 50, the solder structure 1 provided by the present embodiment can directly and effectively reduce the risk of cracking of the tempered glass 50 or even the laminated glass 50 due to welding. It can also be understood that the solder structure 1 provided by the present embodiment is not only suitable for tempered glass 50, but also more suitable for laminated glass 50.

[0078] As can be seen from the above, the limiting protrusion 30 and the welding portion 10 are in a split structure, and the limiting protrusion 30 can be fixed to the welding surface 11 of the welding portion 10. The present application provides three fixing modes of the limiting protrusion 30 and the welding portion 10, which will be introduced one by one.

[0079] Please refer to Figs. 1-3 again. In the present embodiment, the limiting protrusion 30 is sleeved on the welding portion 10.

[0080] In the first embodiment, the limiting protrusion 30 can be directly sleeved on the outside of the welding portion 10 in a sleeving manner, so that part of the limiting protrusion 30 is necessarily arranged on the welding surface 11, i.e., the lower end of the limiting protrusion 30 is arranged on the welding surface 11. The limiting protrusion 30 can avoid the direct contact between the welding portion 10 and the glass 50 during welding, thereby avoiding the cracking of the glass 50 due to the instantaneous high temperature. At the same time, the distance between the welding portion 10 and the glass 50 can be ensured during welding, thereby ensuring the stable thickness of the solder 20.

[0081] Specifically, the limiting protrusion 30 can be ring-shaped, and the limiting protrusion 30 is a rubber sleeve. During installation, the rubber sleeve is stretched to increase its diameter, and then the stretched rubber sleeve is sleeved on the upper and lower front and rear surfaces of the welding portion 10. Then the stretching of the rubber sleeve is stopped, and the rubber sleeve can be tightened on the welding portion 10 by itself, so that the rubber sleeve is fixed on the welding portion 10. The above can be understood as that the limiting protrusion 30 can be in interference fit with the welding portion 10, so as to fix the limiting protrusion 30 on the welding surface 11 of the welding portion 10. Alternatively, the rubber sleeve is a high-temperature-resistant rubber sleeve, that is, a rubber sleeve with poor thermal conductivity. The high-temperature-resistant rubber sleeve is arranged beside the solder 20 of the welding portion 10, and the rubber sleeve is made of a material with poor thermal conductivity, so as to ensure that the heated welding portion 10 does not directly contact the glass 50 during welding, thereby preventing the damage to the stress layer on the surface of the glass 50 and the formation of micro-cracks.

[0082] The present embodiment fixes the lower end of the ring-shaped limiting protrusion 30 on the welding surface 11 of the welding portion 10 by sleeving the limiting protrusion 30 on the welding portion 10, so as to prevent the limiting protrusion 30 from moving randomly, thereby improving the fixing effect of the limiting protrusion 30. In addition, the sleeving manner makes the installation of the limiting protrusion 30 more simple.

[0083] Please refer to FIGS. 6-7 together. FIG. 6 is a bottom view of the solder leg structure shown in FIG. 1. FIG. 7 is a bottom view of the solder leg structure shown in FIG. 1 after removing the limiting protrusion. In the present embodiment, the welding portion 10 is provided with a limiting groove 12, and part of the limiting protrusion 30 is arranged in the limiting groove 12.

[0084] On the basis of sleeving the limiting protrusion 30 on the welding portion 10, the present embodiment can open the limiting groove 12 on the limiting portion 31 and arrange part of the limiting protrusion 30 in the limiting groove 12, that is, a groove can be machined on the limiting portion 31 by various machining methods, so as to arrange a certain face or part of the limiting protrusion 30 in the groove. For example, the limiting groove 12 can be opened on the side surface of the welding portion 10 and penetrate the welding surface 11 and the surface of the welding portion 10 away from the welding surface 11, that is, the limiting groove 12 penetrates the upper and lower surfaces of the welding portion 10. When the limiting protrusion 30 is sleeved on the welding portion 10, the limiting protrusion 30 can be sleeved in the limiting groove 12, that is, the side surface of the limiting protrusion 30 is arranged in the limiting groove 12.

[0085] The present embodiment can fix the limiting protrusion 30 in the horizontal direction by the groove wall of the limiting groove 12, so as to prevent the limiting protrusion 30 from moving left and right randomly and falling off. In addition, the limiting groove 12 can also limit the position of the limiting protrusion 30, so as to ensure the relative distance between the limiting protrusion 30 and the solder 20.

[0086] In the embodiment, the limiting protrusion 30 satisfies at least one of the following properties: the tensile strength of the limiting protrusion 30 is not less than 1 MPa, and the elongation at break of the limiting protrusion 30 is not less than 50%.

[0087] On the basis of the limiting protrusion 30 being sleeved on the welding portion 10, the embodiment can make the tensile strength of the limiting protrusion 30 not less than 1 MPa and the elongation at break not less than 50%, that is, the limiting protrusion 30 has a certain tensile strength or elongation at break, and the comprehensive performance of the limiting protrusion 30 is improved. Specifically, by making the tensile strength of the limiting protrusion 30 not less than 1 MPa and the elongation at break not less than 50% when the limiting protrusion 30 is sleeved and installed, the limiting protrusion 30 is not easy to break when stretched, and meanwhile, the limiting protrusion 30 is prevented from breaking and falling off after being installed for a period of time.

[0088] It is worth noting that the limiting protrusion 30 in the embodiment can only satisfy the tensile strength not less than 1 MPa, or the limiting protrusion 30 only satisfies the elongation at break not less than 50%, or the limiting protrusion 30 simultaneously satisfies the tensile strength not less than 1 MPa and the elongation at break not less than 50%.

[0089] Please refer to FIGS. 8-10 together, FIG. 8 is a perspective view of a welding leg structure in another embodiment of the application. FIG. 9 is a front view of the welding leg structure shown in FIG. 8. FIG. 10 is a bottom view of the welding leg structure shown in FIG. 8. In the embodiment, the limiting protrusion 30 is bonded to the welding surface 11.

[0090] In the second embodiment, the limiting protrusion 30 can be pasted on the welding surface 11, for example, glue can be applied on the rubber cut to a predetermined size, and the rubber is directly pasted on the welding surface 11 of the welding portion 10, so as to ensure that the rubber will not fall off from the welding surface 11. A high-temperature-resistant adhesive tape with glue can also be directly used, the high-temperature-resistant adhesive tape is cut to a suitable size and then directly pasted on the welding surface 11, and the high-temperature-resistant adhesive tape is fixed on the welding surface 11 by the adhesion of itself.

[0091] At this time, the limiting protrusion 30 is entirely arranged in the welding surface 11, and the installation and fixation of the limiting protrusion 30 are realized by the limiting protrusion 30 of the welding surface 11. Alternatively, the pasted limiting protrusion 30 is a low-thermal-conductivity sheet body, such as rubber or a high-temperature-resistant adhesive tape. By adopting the pasting mode to install and fix the limiting protrusion 30 on the welding surface 11, the operation is convenient, and the production difficulty is reduced.

[0092] Please refer to Figs. 11-14, Fig. 11 is a perspective view of a soldering leg structure in another embodiment of the present application. Fig. 12 is a front view of the soldering leg structure shown in Fig. 11. Fig. 13 is a bottom view of the soldering leg structure shown in Fig. 11. Fig. 14 is a partial cross-sectional view of the soldering leg structure shown in Fig. 11. In the present embodiment, the soldering portion 10 is provided with a through hole 13, and the limiting protrusion 30 penetrates the through hole 13 so that one end of the limiting protrusion 30 is arranged on the soldering surface 11.

[0093] In the third embodiment, the limiting protrusion 30 can be arranged in the through hole 13 structure, and the limiting protrusion 30 can penetrate the through hole 13. The through hole 13 can be arranged on the soldering surface 11 and penetrate the upper and lower surfaces of the soldering portion 10, so that the limiting protrusion 30 can be fixed on the soldering surface 11 by being inserted into the through hole 13, thereby simplifying the installation steps of the limiting protrusion 30 and facilitating the installation of the limiting protrusion 30.

[0094] Optionally, the limiting protrusion 30 can be made of a low-thermal-conductivity material, such as rubber or some heat-insulating material.

[0095] Optionally, the limiting protrusion 30 can be assembled and fixed with the soldering portion 10 in various ways after penetrating the through hole 13, such as secondary injection molding, post-assembly, etc.

[0096] Optionally, two through holes 13 can be arranged on the soldering portion 10, and two limiting protrusions 30 can penetrate the two through holes 13 respectively and be fixed on the soldering surface 11. The arrangement direction of the two through holes 13 is perpendicular to the arrangement direction of the limiting protrusions 30 and the soldering tin 20, and the two through holes 13 are symmetrically distributed on the soldering surface 11 and arranged equidistantly at two corners of the soldering surface 11.

[0097] Please refer to Fig. 14 again. In the present embodiment, the limiting protrusion 30 sequentially comprises a limiting portion 31, a penetrating portion 32, and a clamping portion 33 along the axial direction of the limiting protrusion 30. The penetrating portion 32 is arranged in the through hole 13, the limiting portion 31 is arranged on the soldering surface 11, and the clamping portion 33 is clamped on the surface of the soldering portion 10 away from the soldering surface 11. The outer diameter of the limiting portion 31 and the outer diameter of the clamping portion 33 are both greater than the hole diameter of the through hole 13.

[0098] On the basis that the limiting protrusion 30 penetrates the through hole 13 of the welding portion 10 and is fixed at one end on the welding surface 11, the limiting protrusion 30 can be divided into three parts along its axial direction, i.e., along the length direction of the limiting protrusion 30: a limiting portion 31, a penetrating portion 32, and a clamping portion 33. When the limiting protrusion 30 penetrates the welding portion 10 through the through hole 13, the part protruding from the welding surface 11 is the limiting portion 31, the part located in the through hole 13 is the penetrating portion 32, and the part not penetrating the through hole 13 and located on the surface of the welding portion 10 away from the welding surface 11 is the clamping portion 33. The limiting portion 31 can be regarded as the limiting protrusion 30 in the related art. The limiting portion 31 can be used to avoid direct contact between the welding portion 10 and the glass 50 during welding, thereby avoiding the cracking of the glass 50 due to the instantaneous high temperature. At the same time, the distance between the welding portion 10 and the glass 50 can be ensured during welding, thereby ensuring the thickness of the solder 20.

[0099] In the embodiment, the outer diameter of the limiting portion 31 and the outer diameter of the clamping portion 33 are both greater than the hole diameter of the through hole 13, in other words, the size of the limiting portion 31 and the size of the clamping portion 33 are both greater than the hole diameter of the through hole 13. During installation, the limiting portion 31 can reduce its size by using its own elasticity when penetrating the through hole 13, and the limiting portion 31 restores its size after penetrating the through hole 13. After installation is completed, the limiting portion 31 and the clamping portion 33 can be clamped on the welding portion 10, the limiting portion 31 is clamped on the welding surface 11, and the clamping portion 33 is clamped on the surface of the welding portion 10 away from the welding surface 11. This avoids the limiting protrusion 30 from falling along its axial direction, i.e., from falling from below or from falling from above, thereby achieving the fixation of the limiting protrusion 30 on the limiting portion 31.

[0100] Optionally, the cross-sectional shape of the limiting portion 31 is arc-shaped. The use of the arc-shaped limiting portion 31 can further reduce the contact area with the glass 50, thereby reducing the heat transferred to the glass 50 and further reducing the risk of cracking. At this time, the limiting protrusion 30 can be referred to as a thumbtack column.

[0101] The above describes three specific fixation modes of the limiting protrusion 30 on the welding portion 10. In addition to their unique structures, the three fixation modes also have some common structures, properties, and other characteristics, which will be described in detail one by one.

[0102] In the embodiment, the limiting protrusion 30 has elasticity, the welding portion 10 has a first hardness, and the limiting protrusion 30 has a second hardness, which is less than the first hardness.

[0103] From the above, in the related art, the limiting protrusion 30 with a high thermal conductivity directly contacts the glass 50. At this time, the limiting protrusion 30 and the glass 50 are both hard materials, and the two are in hard contact with each other. Therefore, the glass 50 bears a large external pressure during the welding process, and in combination with the instantaneous change in temperature, the two together cause the stress at the contact position of the glass 50 and the limiting protrusion 30 to change, thereby damaging the glass 50 and increasing the risk of micro-cracks or even cracks in the glass 50.

[0104] The welding portion 10 still has its original high thermal conductivity and high hardness. At this time, the hardness of the welding portion 10 is the first hardness. However, in the present embodiment, the limiting protrusion 30, which is separate from the welding portion 10, has a small thermal conductivity and is elastic. This means that the limiting protrusion 30 is low and soft in hardness, and can recover after being deformed by extrusion. Therefore, the limiting protrusion 30 of the present embodiment has a second hardness, and the present embodiment makes the second hardness less than the first hardness, that is, the hardness of the limiting protrusion 30 is less than the hardness of the welding portion 10.

[0105] The limiting protrusion 30 and the welding portion 10 in the related art are integrated, so the hardness of the limiting protrusion 30 in the related art is also the first hardness. Therefore, the hardness of the limiting protrusion 30 of the present embodiment is less than the hardness of the limiting protrusion 30 in the related art, for example, the limiting protrusion 30 of the present embodiment is made of rubber, and the limiting protrusion 30 in the related art is made of metal. Compared with the related art, the limiting protrusion 30 in the present embodiment is softer and more elastic. During the welding process, the solder 20 melts, and the limiting protrusion 30 contacts the glass 50. At this time, the limiting protrusion 30 and the glass 50 are in soft contact, so even if external force is applied to the welding portion 10 during welding, the glass 50 will not be damaged, and the stress layer on the surface of the glass 50 will not be damaged. This way of avoiding hard contact directly reduces the risk of micro-cracks or even cracks in the glass 50.

[0106] In the present embodiment, the limiting protrusion 30 satisfies at least one of the following properties: the softening temperature of the limiting protrusion 30 is not less than 300°C, and the hardness of the limiting protrusion 30 is greater than 30 Shore A.

[0107] In the welding process, the welding needle of the welding machine conducts heat to the welding portion 10, so that the temperature of the welding portion 10 is raised to above 100℃, and then the heat is conducted to the limiting protrusion 30. Although the thermal conductivity of the limiting protrusion 30 is lower than that of the welding portion 10, so that the temperature of the limiting protrusion 30 is lower than that of the welding portion 10, the limiting protrusion 30 is also at a high temperature. Therefore, the softening temperature of the limiting protrusion 30 is not less than 300℃ in the embodiment, and the hardness of the limiting protrusion 30 is greater than 30 Shore A, so that the softening resistance of the limiting protrusion 30 at high temperature is improved, and the hardness of the limiting protrusion 30 is improved.

[0108] Therefore, the limiting protrusion 30 still maintains the original shape when the temperature is raised and the limiting protrusion 30 is extruded, and is not softened to cause deformation, so that the distance between the welding surface 11 and the glass 50 is not reduced to extrude the solder 20 out of the welding surface 11. The welding surface 11 is also prevented from directly contacting the glass 50 to cause the solder 20 to be completely extruded out of the welding surface 11 to cause a virtual weld, and the temperature of the glass 50 is prevented from suddenly changing and the glass 50 is prevented from being cracked due to the direct contact between the high-temperature welding surface 11 and the glass 50.

[0109] It is worth noting that the limiting protrusion 30 in the embodiment can only satisfy that the softening temperature is not less than 300℃, or the limiting protrusion 30 only satisfies that the hardness is greater than 30 Shore A, or the limiting protrusion 30 simultaneously satisfies that the softening temperature is not less than 300℃ and the hardness is greater than 30 Shore A.

[0110] In the embodiment, the friction coefficient between the limiting protrusion 30 and the glass 50 is not less than 0.4.

[0111] The limiting protrusion 30 is abutted against the glass 50 in the welding process, and the friction coefficient between the limiting protrusion 30 and the glass 50 is not less than 0.4 in the embodiment, that is, the limiting protrusion 30 has a large friction coefficient with the glass 50, so that the friction between the limiting protrusion 30 and the glass 50 in the welding process is improved, and the limiting protrusion 30 is not easily slid on the glass 50 to cause the soldering leg structure 1 to be displaced, so that the soldering leg structure 1 can be stably and accurately welded on the conductive circuit to ensure the stability of the welding position in the welding process.

[0112] Referring to FIG. 3 again, the thickness of the limiting protrusion 30 is 0.1mm-0.8mm in the embodiment.

[0113] In the welding process, the welding needle of the welding machine applies pressure to the welding part 10, so that the limiting protrusion 30 abuts against the glass 50, and the limiting protrusion 30 will be deformed to a certain extent. When the thickness of the limiting protrusion 30 is less than 0.1 mm, it is difficult to ensure the distance between the welding surface 11 and the glass 50 after the limiting protrusion 30 is deformed. Even if the thickness of the solder 20 is reduced, the solder 20 will be squeezed out of the welding surface 11, and at the same time, the welding surface 11 can contact the glass 50, which can cause the stress layer of the glass 50 to be damaged and micro-cracks to appear on the surface. When the thickness of the limiting protrusion 30 is greater than 0.8 mm, the thickness of the limiting protrusion 30 is too large, which can cause the solder 20 to be too thin, so that the amount of solder 20 is insufficient and a virtual welding occurs, or the thickness of the solder 20 also needs to be increased, which requires more solder 20 and increases the cost.

[0114] Therefore, in the embodiment, the thickness (T1 in FIG. 3) of the limiting protrusion 30 is 0.1 mm-0.8 mm, that is, the limiting protrusion 30 has a suitable thickness. After being deformed to a certain extent under pressure in the welding process, the limiting protrusion 30 still has sufficient thickness, which can ensure the thickness of the solder 20, and at the same time, the welding surface 11 will not contact the glass 50 in the welding process, and the thickness of the limiting protrusion 30 is not too large, so that more solder 20 is required.

[0115] Specifically, the thickness of the limiting protrusion 30 can be 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, or 0.8 mm.

[0116] Please refer to FIG. 3 again. In the embodiment, the thickness of the solder 20 is greater than the thickness of the limiting protrusion 30, so that the surface of the solder 20 close to the glass 50 is closer to the glass 50 than the surface of the limiting protrusion 30 close to the glass 50.

[0117] In the welding process, the solder 20 is melted, so that the limiting protrusion 30 abuts against the glass 50, and then the solder 20 is cooled and welded to the glass 50. In the embodiment, the thickness (T2 in FIG. 3) of the solder 20 is greater than the thickness (T1 in FIG. 3) of the limiting protrusion 30, that is, the lower surface of the solder 20 close to the glass 50 is closer to the glass 50 than the lower surface of the limiting protrusion 30 close to the glass 50, or in other words, the thickness of the limiting protrusion 30 is less than the thickness of the solder 20 before being melted (T1 in FIG. 3 is less than T2). In this way, the solder 20 can contact the glass 50 before the limiting protrusion 30 contacts the glass 50 in the welding process. When the limiting protrusion 30 abuts against the glass 50 after the solder 20 is melted, the melted solder 20 contacts the welding surface 11 and the glass 50 at the same time, which can ensure that there is sufficient amount of solder 20 so that the solder 20 can firmly fix the welding surface 11 and the glass 50 after being cooled, and the welding is more firm, and the virtual welding in which the solder 20 fails to contact the glass 50 can be avoided.

[0118] Optionally, the height of the solder 20 and the thickness difference (T2-T1) of the limiting protrusion 30 can be controlled within 0.3mm, that is, the thickness of the solder 20 is 0.4mm-1.1mm. Specifically, the thickness of the solder 20 can be 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, 1.1mm.

[0119] In this embodiment, the solder 20 is arranged with a peripheral edge distance from the welding surface 11, that is, the solder 20 does not cover the entire welding surface 11, but leaves a certain distance from the peripheral edge of the welding surface 11, so as to avoid overflow of the solder 20 when it is melted.

[0120] Please refer to Fig. 3 again, in this embodiment, along the arrangement direction of the limiting protrusion 30 and the solder 20, the width of the limiting protrusion 30 is 1mm-4mm.

[0121] When the limiting protrusion 30 is fixed on the welding surface 11 of the welding portion 10 by various ways such as sleeving or through hole, the width (as shown by W1 in Fig. 3) of the limiting protrusion 30 can be 1mm-4mm. It is worth noting that the width direction of the limiting protrusion 30 can be understood as the arrangement direction of the limiting protrusion 30 and the solder 20, that is, the D direction shown in Fig. 3.

[0122] When the width of the limiting protrusion 30 is less than 1mm, the limiting protrusion 30 is too narrow, which will cause the tensile strength of the limiting protrusion 30 to be too small and easy to break. In addition, the limiting protrusion 30 with too small size is difficult to install, which is not convenient for the assembly of the solder leg structure 1. When the width of the limiting protrusion 30 is greater than 4mm, if the width of the solder 20 remains unchanged, it will cause the area of the welding surface 11 to become larger, and further cause the overall size of the solder leg structure 1 to be too large.

[0123] Therefore, in this embodiment, the width of the limiting protrusion 30 can be 1mm-4mm, which not only ensures that the limiting protrusion 30 will not be too narrow and not easy to break, but also facilitates installation, and will not cause the area of the welding surface 11 to become larger and further cause the overall size of the solder leg structure 1 to be too large. Therefore, the limiting protrusion 30 in this embodiment can be applied to the above-mentioned scheme that the limiting protrusion 30 is sleeved on the welding portion 10, and the scheme that the limiting protrusion 30 penetrates through the welding portion 10 through the through hole 13.

[0124] Specifically, the width of the limiting protrusion 30 can be 1mm, 2mm, 3mm, 4mm.

[0125] Please refer to Fig. 9 again, in this embodiment, along the arrangement direction of the limiting protrusion 30 and the solder 20, the width of the limiting protrusion 30 is 2mm-5mm.

[0126] When the limiting protrusion 30 is fixed to the soldering part 10 by means of adhesion, the width (indicated as W2 in FIG. 9) of the limiting protrusion 30 can be 2-5 mm in the present embodiment. In this case, the width direction of the limiting protrusion 30 can also be understood as the arrangement direction of the limiting protrusion 30 and the soldering tin 20, i.e. the direction D in FIG. 9.

[0127] When the width of the limiting protrusion 30 is less than 2 mm, the limiting protrusion 30 is too narrow, i.e. the adhesion area is too small, which can result in insufficient adhesion force and easy falling off. In addition, the too narrow limiting protrusion 30 is not convenient for installation, and the installation is difficult. When the width of the limiting protrusion 30 is greater than 5 mm, if the width of the soldering tin 20 remains unchanged, the area of the soldering surface 11 will be increased, which can result in the overall size of the soldering leg structure 1 being too large.

[0128] Therefore, the width of the limiting protrusion 30 can be 2-5 mm in the present embodiment, which can ensure that the limiting protrusion 30 is not too narrow, the adhesion is stable and not easy to fall off, and the installation is convenient. In addition, the area of the soldering surface 11 will not be increased, which can prevent the overall size of the soldering leg structure 1 from being too large. Therefore, the limiting protrusion 30 in the present embodiment can be applied to the above-mentioned adhesion soldering part 10. It is worth noting that the width of the limiting protrusion 30 in the present embodiment is slightly wider than that in the previous embodiment. This is because the limiting protrusion 30 needs to be adhered to the soldering surface 11. In order to ensure stable adhesion and prevent falling off, and to ensure the adhesion area, the required width is wider than that in the sleeve and penetration schemes.

[0129] Referring again to FIG. 3, in the present embodiment, a gap 14 is provided between the limiting protrusion 30 and the soldering tin 20 along the arrangement direction of the limiting protrusion 30 and the soldering tin 20.

[0130] When the limiting protrusion 30 is fixed to the soldering part 10, a gap 14 (indicated as H in FIG. 3) can be provided between the limiting protrusion 30 and the soldering tin 20 along the arrangement direction of the limiting protrusion 30 and the soldering tin 20, i.e. the direction D in FIG. 3. During the soldering process, the soldering tin 20 will spread around after melting. Therefore, the gap 14 can prevent the soldering tin 20 from overflowing outside the soldering surface 11, which can affect the electrical connection of the external circuit. In addition, when the soldering leg structure 1 is a bridge soldering leg structure, i.e. including the connecting part 40 and two soldering parts 10 on the opposite sides of the connecting part 40, the gap 14 can ensure that the soldering tin 20 has a planar expansion space after being heated and melted, and the thickness of the soldering tin 20 is reduced. In this case, the soldering tin 20 will not overflow below the limiting protrusion 30, which can prevent the heights of the two soldering points from being inconsistent, which can affect the soldering strength. In addition, the soldering tin 20 will not overflow outside the soldering surface 11, which can affect the electrical connection of the external circuit.

[0131] Optionally, the gap 14 between the limiting protrusion 30 and the solder 20 is 0.3mm-1mm. When the gap 14 between the limiting protrusion 30 and the solder 20 is less than 0.3mm, the solder 20 has no space to spread on the plane after being pressed due to the small gap 14 during the soldering process, and thus overflows to the lower surface of the limiting protrusion 30, resulting in inconsistent height of the limiting protrusions 30 on both sides, and further affecting the soldering strength, and even causing the solder 20 to overflow to the outside of the soldering surface 11, affecting the electrical connection of the external circuit. When the gap 14 between the limiting protrusion 30 and the solder 20 is greater than 1mm, the amount of solder 20 is too small due to the large gap 14 between the solder 20 and the limiting protrusion 30, resulting in insecure soldering.

[0132] Therefore, the gap 14 between the limiting protrusion 30 and the solder 20 in the embodiment can be 0.3mm-1mm, which not only avoids the overflow of the solder 20 to the outside of the soldering surface 11, but also avoids insecure soldering caused by the large gap 14. Specifically, the gap 14 between the limiting protrusion 30 and the solder 20 can be 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm or 1mm.

[0133] Please refer to FIG. 1, FIG. 8 and FIG. 11 again. In the embodiment, the surface of the soldering portion 10 away from the soldering surface 11 is provided with a positioning mark 15, which is used for positioning the welding device.

[0134] During the soldering process, the soldering needle of the welding machine needs to be pressed against the surface of the soldering portion 10 away from the soldering surface 11 to heat the soldering portion 10. The embodiment can provide the positioning mark 15 on the surface of the soldering portion 10 away from the soldering surface 11, i.e. the upper surface of the soldering portion 10. The positioning mark 15 is used for indicating the position of the soldering needle, and is a mark for positioning the welding device during soldering. The positioning mark 15 is used for positioning the soldering needle of the welding machine, so that the soldering process is more accurate, i.e. the soldering needle is accurately positioned on the upper surface of the position where the solder 20 is located, and the difficulty of positioning the soldering needle is reduced.

[0135] Optionally, the positioning mark 15 is a groove formed by shallow stamping. Further optionally, the groove has a small depth, so as to avoid forming obvious convex points on the soldering surface 11, and to avoid the risk of increasing the cracking of the glass 50 caused by the contact between the convex points and the glass 50.

[0136] Please refer to FIG. 2 and FIG. 16 together. FIG. 16 is a front view of another embodiment of the soldering leg structure shown in FIG. 2. In the embodiment, the limiting protrusion 30 is arranged on one side or opposite sides of the solder 20 along the arrangement direction of the limiting protrusion 30 and the solder 20.

[0137] When the limiting protrusions 30 are arranged on the soldering portions 10, the number of the limiting protrusions 30 can be one, two, or more. When the number of the limiting protrusions 30 is one, the limiting protrusion 30 can be arranged on one side of the soldering tin 20. When the number of the limiting protrusions 30 is two or more, the limiting protrusions 30 can be arranged on opposite sides of the soldering tin 20. The present embodiment only schematically illustrates one limiting protrusion 30 and two limiting protrusions 30 on each soldering portion 10. Two limiting protrusions 30 can be arranged on opposite sides of the soldering tin 20.

[0138] In the present embodiment, by arranging the limiting protrusions 30 on one side of the soldering tin 20 or on both sides of the soldering tin 20, the stability of the soldering portion 10 during the welding process with the glass 50 can be further increased on the basis of ensuring that the soldering portion 10 does not contact the glass 50, ensuring the thickness of the soldering tin 20, and reducing the risk of cracking. For example, even in a single-sided soldering leg structure, the soldering leg structure 1 will not tilt by arranging the limiting protrusions 30 on both sides of the soldering tin 20.

[0139] Please refer to FIG. 6 and FIG. 15, which is a bottom view of another embodiment of the soldering leg structure shown in FIG. 6. In the present embodiment, the soldering leg structure 1 includes a connecting portion 40 for connecting a wire and two soldering portions 10 connected to opposite sides of the connecting portion 40. The two limiting protrusions 30 in the two soldering portions 10 are closer to or farther away from each other than the two soldering tins 20.

[0140] When the soldering leg structure 1 includes a connecting portion 40 and two soldering portions 10, the soldering leg structure 1 can be referred to as a bridge soldering leg structure. The specific structure of the bridge soldering leg structure, such as the connecting portion 40 and the two soldering portions 10, has been described in detail above, and the present embodiment will not be described again.

[0141] Because there are two soldering portions 10, and each soldering portion 10 is provided with a limiting protrusion 30 and a soldering tin 20, there are two limiting protrusions 30 and two soldering tins 20 in total. The present embodiment can make the two limiting protrusions 30 closer to or farther away from each other than the two soldering tins 20. In other words, the two limiting protrusions 30 adopt a symmetrical layout and are simultaneously arranged inward or outward. It can also be understood that the two limiting protrusions 30 are not arranged in an inward-outward manner.

[0142] Such a symmetrical layout can maintain the balance of the soldering leg structure 1, so that the soldering leg structure 1 will not tilt to one side, causing the soldering surface 11 of the soldering portion 10 to directly contact the glass 50, or causing one side of the soldering leg to be raised, so that one side of the soldering leg is not welded or is not firmly welded, causing the soldering tin 20 to overflow or be loose, affecting the connection performance.

[0143] Referring to FIG. 17, FIG. 17 is a schematic view of a glass assembly according to an embodiment of the present application. The embodiment provides a glass assembly 2, which comprises a glass 50 and a soldering leg structure 1 as provided in the above embodiments of the present application, and the soldering leg structure 1 is soldered to the glass 50.

[0144] The glass assembly 2 provided in the embodiment includes, but is not limited to, an electrically heated glass 50, an antenna glass 50, a breakage alarm glass 50, and the like. As long as the glass assembly 2 can integrate electronic functions on the glass 50, the glass assembly 2 is referred to as the glass assembly 2 in the embodiment.

[0145] The glass assembly 2 comprises the glass 50 and the soldering leg structure 1, and the soldering leg structure 1 is soldered to the conductive circuit in the glass 50, so that the external lead can be electrically connected to the conductive circuit in the glass 50, and thus the glass assembly 2 can realize a series of electronic functions. By using the soldering leg structure 1 in the embodiment, the distance between the soldering surface 11 and the glass 50 in the soldering process is ensured, so as to ensure that the soldering portion 10 does not directly contact the glass 50 in the soldering process, and at the same time, the thickness of the solder 20 is ensured, the soldering strength is improved, in addition, the limiting protrusion 30 with low thermal conductivity is selected, the influence of temperature mutation on the glass 50 is reduced, the problem of cracking caused by soldering is reduced, and the yield is improved.

[0146] Referring to FIG. 18, FIG. 18 is a schematic view of a vehicle according to an embodiment of the present application. The embodiment provides a vehicle 3, which comprises a vehicle body panel 60 and a glass assembly 2 as provided in the above embodiments of the present application, and the glass assembly 2 is arranged on the vehicle body panel 60.

[0147] The vehicle 3 referred to in the embodiment is a vehicle 3 integrating electronic functions on the vehicle glass 50, and the specific type of the vehicle 3 is not limited in the embodiment, for example, the vehicle 3 can be a car, an SUV, a jeep, a truck, and the like. In assembly, the glass assembly 2 is arranged on the vehicle body panel 60 and is fixed, and then the glass assembly 2 is electrically connected to the lead inside the vehicle 3, so that the vehicle 3 can realize a series of electronic functions on the vehicle glass 50, such as heating and defogging, antenna, breakage alarm, and the like. By using the glass assembly 2 in the embodiment, the risk of cracking of the glass 50 is reduced, the customer complaints are reduced, the service life of the glass 50 is increased, and the driving safety is improved.

[0148] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0149] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion.

[0150] In the present application, unless otherwise explicitly specified and limited, the terms "mount", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be connected, or it can be detachable, or it can be integrated. It can be mechanical connection, or electrical connection. It can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0151] The above provides the content provided by the embodiments of the present application, and the principles and embodiments of the present application are described and explained. These explanations are only used to help understand the method of the present application and its core idea. The content of the specification should not be understood as limiting the present application, and those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. These modifications and variations of the present application are within the scope of the claims of the present application and its equivalent technologies.

Claims

1. A weld leg structure, characterized by, The soldering leg structure comprises: a soldering portion having a soldering surface for being close to the glass, the soldering portion having a first thermal conductivity coefficient; soldering tin fixed to the soldering surface; a limiting protrusion at least partially fixed to the soldering surface, the limiting protrusion being in a split structure with the soldering portion, the limiting protrusion having a second thermal conductivity coefficient, and the second thermal conductivity coefficient being less than the first thermal conductivity coefficient.

2. The leg structure of claim 1 wherein, The limiting protrusion is sleeved on the soldering portion.

3. The leg structure according to claim 2, wherein The soldering portion is provided with a limiting groove, and a part of the limiting protrusion is arranged in the limiting groove.

4. The leg structure of claim 2 wherein, The limiting protrusion satisfies at least one of the following performances: The tensile strength of the limiting protrusion is not less than 1 MPa. The elongation at break of the limiting protrusion is not less than 50%.

5. The leg structure of claim 1 wherein, The limiting protrusion is bonded to the soldering surface.

6. The leg structure of claim 1 wherein, The soldering portion is provided with a through hole, and the limiting protrusion penetrates through the through hole so that one end of the limiting protrusion is arranged on the soldering surface.

7. The leg structure according to claim 6, wherein The limiting protrusion sequentially comprises a limiting portion, a penetrating portion and a clamping portion along the axial direction of the limiting protrusion, the penetrating portion is arranged in the through hole, the limiting portion is arranged on the soldering surface, and the clamping portion is clamped on the surface of the soldering portion away from the soldering surface; the outer diameter of the limiting portion and the outer diameter of the clamping portion are both greater than the hole diameter of the through hole.

8. A leg structure according to any one of claims 1-7, c h a r a c t e r i z e d in that The limiting protrusion has elasticity, the soldering portion has a first hardness, the limiting protrusion has a second hardness, and the second hardness is less than the first hardness.

9. A leg structure according to any one of claims 1-7, c h a r a c t e r i z e d in that The limiting protrusion satisfies at least one of the following performances: The softening temperature of the limiting protrusion is not less than 300 DEG C. The hardness of the limiting protrusion is greater than 30 Shore A.

10. A leg structure according to any one of claims 1-7, c h a r a c t e r i z e d in that The friction coefficient between the limiting protrusion and the glass is not less than 0.

4.

11. A leg structure according to any one of claims 1-7, c h a r a c t e r i z e d in that The thickness of the limiting protrusion is 0.1 mm-0.8 mm.

12. The leg structure of claim 11 wherein, The thickness of the soldering tin is greater than the thickness of the limiting protrusion, so that the soldering tin is used for the surface close to the glass more than the limiting protrusion.

13. The leg structure according to claim 2 or 6, wherein Along the arrangement direction of the limiting protrusion and the soldering tin, the width of the limiting protrusion is 1 mm-4 mm.

14. The leg structure of claim 5 wherein, Along the arrangement direction of the limiting protrusion and the soldering tin, the width of the limiting protrusion is 2 mm-5 mm.

15. A leg structure according to any one of claims 1-7, c h a r a c t e r i z e d i n that Along the arrangement direction of the limiting protrusion and the soldering tin, there is a gap between the limiting protrusion and the soldering tin.

16. A leg structure according to any one of claims 1-7, characterized in that The surface of the soldering portion away from the soldering surface is provided with a positioning mark, and the positioning mark is used for positioning the welding device.

17. A leg structure according to any one of claims 1-7, c h a r a c t e r i z e d i n that Along the arrangement direction of the limiting protrusion and the soldering tin, the limiting protrusion is arranged on one side or opposite sides of the soldering tin.

18. A leg structure according to any one of claims 1-7, characterized in that The soldering leg structure comprises a connecting portion for connecting wires, and two soldering portions connected to opposite sides of the connecting portion, and two limiting protrusions in the two soldering portions are closer to each other or farther away from each other than two soldering tins.

19. A glass assembly, characterized by The glass assembly comprises glass and the soldering leg structure according to any one of claims 1-18, and the soldering leg structure is welded to the glass.

20. A vehicle characterized by comprising: The vehicle comprises a vehicle body panel and the glass assembly according to claim 19, and the glass assembly is arranged on the vehicle body panel.

Images