Holding member, cutting table, cutting device, and method for manufacturing semiconductor device

Abstract

To prevent a non-product portion that is generated by cutting a to-be-cut object from adhering to a holding member.SOLUTION: A holding member 10 sucks and holds a to-be-cut object W on a cutting table 4. On a surface of a contact area 10S that comes into contact with a non-product portion Wy that is generated by cutting the to-be-cut object W, multiple recesses 10c are formed. The multiple recesses 10c are connected to the outside of the contact area 10S.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a holding member, a cutting table, a cutting device, and a method for manufacturing a semiconductor device. [Background technology]

[0002] Conventionally, as shown in Patent Document 1, in a cutting device for cutting wafers, a chuck table that holds the wafer by suction has been considered to have a configuration including a disk-shaped holding portion made of porous ceramic and an outer ring portion provided surrounding the outer periphery of the holding portion. The outer ring portion is provided corresponding to the outer peripheral edge of the wafer and is formed by laminating a silica glass layer with a small surface roughness. This configuration prevents cutting debris generated when cutting the wafer from remaining on the surface of the silica glass layer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-084755 Summary of the Invention [Problem to be solved by the invention]

[0004] On the other hand, from the viewpoints of water resistance, ability to follow warping of the workpiece, prevention of displacement of the workpiece, etc., elastic resins such as silicone-based resins and fluorine-based resins are used for the holding member (holding layer) that holds the workpiece. Also, suction holes are formed in the holding member to suck and hold the workpiece.

[0005] However, because the above-mentioned holding member holds the workpiece in close contact with the elastic resin, there is a problem that non-product parts resulting from cutting the workpiece may stick to the holding member. While it has been tried to wash away the non-product parts stuck to the holding member with machining fluid such as cutting water, there are cases where the non-product parts cannot be washed away. Furthermore, if the workpiece remains stuck to the holding member, there is a risk of damage to the rotary blade of the cutting mechanism.

[0006] The present invention has been made to solve the above problems, and its main object is to prevent non-product parts that are produced when cutting an object to be cut from sticking to a holding member. [Means for solving the problem]

[0007] In other words, the holding member of the present invention is a holding member that adsorbs and holds the object to be cut on a cutting table, and is characterized in that a plurality of recesses are formed on the surface of the contact area that comes into contact with the non-product parts that are produced by cutting the object to be cut, and the plurality of recesses are connected to the outside of the contact area. [Effects of the Invention]

[0008] According to the present invention configured in this manner, it is possible to prevent non-product portions that are generated by cutting the object to be cut from sticking to the holding member. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic diagram illustrating a configuration of a cutting device according to an embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view schematically showing the configuration of a cutting table of the embodiment. [Figure 3] 1A is a plan view schematically showing the configuration of a substrate, and FIG. 1B is a plan view schematically showing the configuration of a holding member (particularly the holding area) in the embodiment. [Figure 4] 3 is a plan view schematically showing the configuration (particularly the contact area) of the holding member of the embodiment. FIG. [Figure 5]FIG. 2 is a partially enlarged plan view schematically showing the configuration of the holding member of the embodiment. [Figure 6] FIG. 2 is a partially enlarged cross-sectional view schematically illustrating the configuration of a holding member of the embodiment. [Figure 7] FIG. 10 is a partially enlarged plan view schematically showing the configuration of a holding member according to a modified embodiment. [Figure 8] FIG. 10 is a partially enlarged cross-sectional view schematically showing the configuration of a holding member according to a modified embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Next, the technology according to the present invention will be described in more detail with reference to examples, although the present invention is not limited to the following technology.

[0011] The holding member of Technology 1 according to the present invention is a holding member that adsorbs and holds an object to be cut on a cutting table, and is characterized in that a plurality of recesses are formed on the surface of a contact area that comes into contact with a non-product part that is generated by cutting the object to be cut, and the plurality of recesses are connected to the outside of the contact area.

[0012] With this holding member, multiple recesses are formed on the surface of the contact area that contacts the non-product portion, reducing the contact area between the holding member and the non-product portion and reducing the sticking force, making it easier to remove the non-product portion. Furthermore, since the multiple recesses are connected to the outside of the contact area, processing fluid can easily flow between the holding member and the non-product portion, making it easier to remove the non-product portion. This prevents non-product portions resulting from cutting the workpiece from sticking to the holding member. Furthermore, the amount of processing fluid supplied can be reduced, saving processing fluid.

[0013] Specific embodiments of the holding member include a configuration in which a plurality of recesses are formed in a regular pattern, a configuration in which a plurality of recesses are formed in an irregular pattern, or a configuration in which a plurality of recesses are formed in an irregular shape. Here, a configuration in which a plurality of recesses are formed in a regular pattern makes it easier to process the holding member. Therefore, in addition to the configuration of the above-mentioned technology 1, the holding member of technology 2 according to the present invention preferably has the plurality of recesses in a lattice, stripe, or dot pattern in plan view.

[0014] The cutting table of Technique 3 according to the present invention is a cutting table that holds an object by suction, and is characterized by having a holding member having the configuration of Technique 1 or 2 above. With this configuration, it is possible to prevent non-product parts that are generated when the object to be cut is cut from sticking to the holding member, and therefore it is possible to easily remove the non-product parts from the cutting table.

[0015] A cutting device according to Technology 4 of the present invention includes a cutting table that adsorbs and holds an object to be cut, and a cutting mechanism that cuts the object held on the cutting table, and the cutting table has a holding member having the configuration of Technology 1 or 2 above. This configuration prevents non-product parts that are generated when the cutting object is cut from sticking to the holding member, making it easy to remove the non-product parts from the cutting table. Furthermore, preventing non-product parts from sticking also prevents damage to the rotary blade of the cutting mechanism that may result from the non-product parts sticking.

[0016] The manufacturing method of a semiconductor device according to Technology 5 of the present invention is a manufacturing method of a semiconductor device in which a substrate on which a plurality of semiconductor devices are formed is cut using the cutting device of Technology 4 described above to manufacture individual semiconductor devices, and is characterized in that the substrate is held by the cutting table, and the substrate held on the cutting table is cut by the cutting mechanism.

[0017] <One embodiment of the present invention> DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a cutting device according to the present invention will be described below with reference to the drawings. In addition, in all of the drawings shown below, for the sake of clarity, some parts are omitted or exaggerated as appropriate, and the same components are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

[0018] <Overall configuration of cutting device 100> The cutting apparatus 100 of this embodiment cuts a substrate W, which is an object to be cut, into a plurality of cut pieces P. Here, examples of the substrate W include a flip-chip substrate or a sealed substrate. A flip-chip substrate is a substrate to which electronic elements such as semiconductor chips, resistor elements, and capacitor elements are flip-chip connected. A sealed substrate is a substrate to which electronic elements such as semiconductor chips, resistor elements, and capacitor elements are connected, and which is resin-molded to seal at least the electronic elements. Examples of substrates that constitute the sealed substrate include lead frames and printed wiring boards, and other substrates that may also be used, such as semiconductor substrates (including semiconductor wafers such as silicon wafers), metal substrates, ceramic substrates, glass substrates, and resin substrates. Furthermore, the substrates that constitute the sealed substrate may or may not be wired.

[0019] 1, the cutting apparatus 100 includes, as its components, a supply module 100A that supplies a substrate W, a cutting module 100B that cuts the substrate W, and an inspection module 100C that inspects the cut products P that have been cut and separated. Each component is detachable and replaceable with respect to the other components. Note that when the substrate W is a substrate on which a plurality of semiconductor devices are formed, the cutting apparatus 100 can be said to be a semiconductor manufacturing apparatus that manufactures the separated semiconductor devices.

[0020] The operation of the cutting device 100 including the modules 100A to 100C described below is controlled by a control unit CTL provided in the supply module 100A. This control unit CTL may be provided in modules 100B and 100C other than the supply module 100A. Furthermore, the control unit CTL may be divided into multiple units and provided in at least two of the supply module 100A, the cutting module 100B, and the inspection module 100C.

[0021] The supply module 100A receives the substrates W to be cut from the outside and accommodates the substrates W. The supply module 100A is provided with a substrate accommodation section 2 that accommodates the substrates W. The substrates W are transported from the supply module 100A to the cutting module 100B by a transport mechanism (loader) 3. The loader 3 transports the substrates W to the cutting module 100B using guide rails 31. The cutting apparatus 100 of this embodiment is provided with three substrate accommodation sections 2, but the number of substrate accommodation sections 2 is not particularly limited.

[0022] The cutting module 100B cuts the substrate W into a plurality of cut products P. The cutting module 100B has a cutting table 4 that adsorbs and holds the substrate W, and a cutting mechanism 5 that cuts the substrate W held on the cutting table 4.

[0023] The cutting mechanism 5 is configured by attaching a rotary blade 52 to a spindle 51. The cutting table 4 and the cutting mechanism 5 are moved relative to each other, whereby the substrate W is cut by the rotary blade 52 and singulated into cut pieces P. Here, a cutting fluid supply unit 50 supplies cutting water, which is a processing fluid, to the rotary blade 52 and the substrate W to suppress frictional heat generated when cutting the substrate W. Thereafter, the singulated cut pieces P are transported from the cutting module 100B to the inspection module 100C by a transport mechanism (unloader) 6. The unloader 6 has a holder 61 that individually adsorbs and holds the plurality of cut pieces P, and a moving mechanism 62 that moves the holder 61. The cutting device 100 of this embodiment has two cutting mechanisms 5, but may have only one cutting mechanism 5.

[0024] The inspection module 100C inspects the cut products P that have been singulated by the cutting module 100B by capturing images of them. The inspection module 100C includes an inspection table 7 that holds the cut products P by suction, and an inspection camera 8 that captures images of the cut products P held on the inspection table 7. The inspection module 100C then distinguishes the cut products P into good and bad products based on the images obtained by the inspection camera 8. A transport mechanism (not shown) then transports and stores the good products in a tray 9a for good products and the bad products in a tray 9b for bad products (see FIG. 1).

[0025] <Configuration of cutting table 4> 2 to 5, in this embodiment, the cutting table 4 has a holding member 10 that adsorbs and holds the substrate W. A blade avoidance groove 10M is formed in this holding member 10 to avoid the rotary blade 52 during cutting. The holding member 10 is made of an elastic resin (rubber material) such as a silicone-based resin or a fluorine-based resin.

[0026] The holding member 10 is formed with suction holes 10a that suction-hold the substrate W or multiple cut pieces P. In this embodiment, in order to increase the suction force of the suction holes 10a, the opening size of the suction-side opening of the suction holes 10a is enlarged to form pocket portions 10b. Note that, although the pocket portions 10b in FIGS. 2 to 5 are rectangular in plan view, the shape of the pocket portions 10b in plan view is not limited to this.

[0027] Here, as shown in FIG. 3(a), the substrate W has product portions Wx that are used as products after cutting, and non-product portions Wy that are not used as products after cutting. In this embodiment, a plurality of product portions Wx are arranged in the center, for example, in a matrix pattern (overall rectangular), and non-product portions Wy are arranged on the periphery of the plurality of product portions Wx. Note that the arrangement of the product portions Wx and non-product portions Wy is not limited to the above. For example, the non-product portions Wy may be arranged somewhere other than the periphery of the substrate W.

[0028] 3(b) and 4, blade grooves 10M are formed in a grid pattern corresponding to the product portions Wx and non-product portions Wy, and rectangular areas surrounded by blade grooves 10M become holding areas 10R (see FIG. 3(b)) that hold each product portion Wx of the substrate W. Furthermore, contact areas 10S (see FIG. 4) that come into contact with the non-product portions Wy are formed on the four sides of holding member 10 that surround the multiple holding areas 10R.

[0029] 5 and 6, the holding member 10 has a plurality of recesses 10c formed on the surface of the contact region 10S that comes into contact with the non-product portion Wy resulting from cutting the substrate W. The plurality of recesses 10c serves to reduce the contact area between the surface of the contact region 10S and the non-product portion Wy. By forming the plurality of recesses 10c, the contact area is reduced to, for example, 20% to 30%, assuming that the contact area when the recesses 10c are not formed is 100%.

[0030] 5 and 6, the recesses 10c communicate with the outside of the contact area 10S when the non-product portion Wy is in contact with the contact area 10S, so that the machining fluid supplied by the machining fluid supply unit 50 flows between the non-product portion Wy and the contact area 10S (see FIG. 6).

[0031] Here, "communicating with the outside of the contact region 10S" includes (1) that the recess 10c extends outside the non-product portion Wy (contact region 10S) in a plan view and that the recess 10c opens onto the surface of the holding member 10, or (2) that the recess 10c is covered by the non-product portion Wy in a plan view but opens onto the side surface of the holding member 10 or the inner surface of the blade groove 10M. Also, in a plan view, both ends of the recess 10c may be configured to communicate with the outside of the contact region 10S, or one end of the recess 10c may be configured to communicate with the outside of the contact region 10S. Note that when one end of the recess 10c is configured to communicate with the outside of the contact region 10S, it is desirable that, for example, one end on the side where the machining fluid is supplied is configured to communicate with the outside of the contact region 10S so that the machining fluid can easily flow in.

[0032] Specifically, the recesses 10c are formed in a grid, stripe, or dot pattern in plan view, as shown in Figures 5 and 6. Note that Figures 5 and 6 show an example in which the recesses 10c are formed in a grid pattern. By forming the recesses 10c in a grid pattern, the number of inflow points for the processing liquid can be increased, making it easier for the processing liquid to flow in. Note that the recesses 10c can be formed in various shapes, such as a grid pattern, stripe pattern, or dot pattern, depending on the type of substrate W, the material of the holding member 10, or the water flow conditions of the processing liquid (e.g., flow rate, supply direction, etc.).

[0033] The width and depth of each recess 10c are desirably small enough to prevent foreign matter from being trapped in the recess 10c, and are desirably large enough to avoid wear caused by cutting the substrate W (producing the cut product P) and cleaning. Specifically, the width and depth of each recess 10c may be, for example, several tens to several hundreds of μm. The pitch between the multiple recesses 10c may be, for example, several tens of μm. These multiple recesses 10c may be formed by irradiating them with laser light, by machining such as cutting, by chemical treatment using a chemical solution, or by mold transfer molding.

[0034] <Effects of this embodiment> According to the cutting device 100 of this embodiment, multiple recesses 10c are formed on the surface of the contact region 10S that contacts the non-product portion Wy. This reduces the contact area between the holding member 10 and the non-product portion Wy, reducing the sticking force and making it easier to remove the non-product portion Wy. Furthermore, since the multiple recesses 10c are connected to the outside of the contact region 10S, processing liquid can easily flow between the holding member 10 and the non-product portion Wy, making it easier to remove the non-product portion Wy. Therefore, the non-product portion Wy resulting from cutting the substrate W can be prevented from sticking to the holding member 10. Furthermore, the amount of processing liquid supplied can be reduced, thereby saving processing liquid.

[0035] <Other Modified Embodiments> The present invention is not limited to the above-described embodiment.

[0036] For example, the recess 10c may have a shape that allows the machining fluid to easily flow in by increasing the opening (for example, width or depth) of the end portion that communicates with the contact region 10S.

[0037] 7 and 8, the holding member 10 may have a plurality of second recesses 10e formed on the surface of the holding region 10R that holds the product portion Wx of the substrate W. The plurality of second recesses 10e reduces the contact area between the surface of the holding region 10R and the product portion Wx (cut product P). By forming the plurality of second recesses 10e, the contact area is reduced to, for example, 50% to 60% of the contact area when the second recesses 10e are not formed, which is 100%. Note that FIG. 7 does not show the recesses 10c in the contact region 10S of the above embodiment.

[0038] Furthermore, the second recesses 10e are formed so that the suction holes 10a and the outer space of the holding region 10R are not in communication with each other when the substrate W or the cut pieces P is held therein. Specifically, the second recesses 10e are arranged in a grid, stripe, or dot pattern in a plan view. FIGS. 7 and 8 show an example in which the second recesses 10e are arranged in a dot pattern. The width and depth of each second recess 10e are preferably small enough to prevent foreign matter from being trapped in the second recess 10e and to be sized to be unaffected by wear caused by cutting the substrate W (producing the cut pieces P) and cleaning. Specifically, the width and depth of each second recess 10e may be, for example, several tens to several hundreds of micrometers. The second recesses 10e may be formed by laser irradiation, machining such as cutting, chemical treatment using a chemical solution, or mold transfer molding.

[0039] Furthermore, as shown in Figures 7 and 8, the surface of the holding region 10R of the holding member 10 other than the plurality of second recesses 10e may be roughened as a roughened surface 10d. This roughened surface 10d improves peeling against vacuum adhesion. The roughened surface 10d has irregularities smaller than the width and depth of the second recesses 10e, for example, in a striped pattern with a pitch of several tens of micrometers. The roughened surface 10d may be formed by irradiation with laser light, by machining such as cutting, by blasting, or by mold transfer molding.

[0040] Furthermore, in the above embodiment, the holding member 10 has the pocket portion 10b, but the holding member 10 may have a configuration without the pocket portion 10b.

[0041] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit of the present invention. [Explanation of symbols]

[0042] 100...Cutting device W: Circuit board (object to be cut) P... Cutting products (semiconductor device) 4. Cutting table 5...Cutting mechanism 10. Retaining member 10a...Adsorption hole 10S...Contact area 10c Recess

Claims

1. A holding member that adsorbs and holds an object to be cut on a cutting table, a plurality of groove-like recesses are formed along the surface of a contact area that contacts a non-product portion resulting from cutting the object to be cut, A holding member, wherein the plurality of recesses are formed so as to open to the outside of the contact area when the non-product portion is in contact with the contact area.

2. The holding member according to claim 1 , wherein the plurality of recesses are arranged in a grid or stripe pattern in a plan view.

3. A cutting table that adsorbs and holds an object to be cut, A cutting table comprising the holding member according to claim 1 or 2.

4. a cutting table that adsorbs and holds the workpiece; a cutting mechanism that cuts the object held on the cutting table, 3. A cutting device, wherein the cutting table comprises the holding member according to claim 1 or 2.

5. A method of manufacturing a semiconductor device, comprising: cutting a substrate on which a plurality of semiconductor devices are formed using the cutting device according to claim 4 to manufacture individual semiconductor devices; The substrate is held by the cutting table; The method for manufacturing a semiconductor device includes cutting the substrate held on the cutting table by the cutting mechanism.

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