Resin composition, film, optical filter, solid-state imaging device, image display device, resin, and method for producing resin

Abstract

A resin composition comprising color material A containing a pigment, resin B and solvent C, wherein resin B comprises resin B1 that is a product of a reaction between a resin having a primary or secondary amino group and a macromonomer having an acid anhydride structure at a terminus. A film, an optical filter, a solid-state imaging element, an image display device, a resin, and a method for producing a resin.

Description

[Technical Field]

[0001] The present invention relates to a resin composition, a film, an optical filter, a solid-state imaging device, an image display device, a resin, and a method for producing a resin. [Background technology]

[0002] In recent years, the widespread use of digital cameras and mobile phones with cameras has led to a significant increase in demand for solid-state imaging devices such as charge-coupled device (CCD) image sensors. Films containing pigments, such as color filters, are used in solid-state imaging devices. Films containing color materials, such as color filters, are manufactured using resin compositions containing pigments, resins, and solvents.

[0003] For example, Patent Document 1 describes an invention relating to a resin composition containing a pigment, a dispersant, a binder resin, an epoxy compound, and a solvent, in which the dispersant contains a polyester portion X1' having a carboxy group, which is obtained by reacting an acid anhydride group in one or more acid anhydrides (b) selected from tetracarboxylic anhydrides (b1) and tricarboxylic anhydrides (b2) with a hydroxyl group in a hydroxyl group-containing compound (a), and a vinyl polymer portion X2' obtained by radical polymerization of an ethylenically unsaturated monomer (c) and having a thermally crosslinkable functional group, wherein the thermally crosslinkable functional group is at least one selected from the group consisting of a hydroxyl group, an oxetane group, a t-butyl group, a blocked isocyanate group, and a (meth)acryloyl group. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-170325 Summary of the Invention [Problem to be solved by the invention]

[0005] In a resin composition containing a pigment, a resin, and a solvent, it is preferable that the pigment has good dispersibility. If the pigment has insufficient dispersibility, the pigment tends to aggregate and become coarse in the resin composition, or the viscosity of the resin composition tends to increase. Furthermore, even if the viscosity of the resin composition is low immediately after production, the viscosity may increase over time.

[0006] Furthermore, in recent years, in the manufacturing process of solid-state imaging devices, it has been considered to form a film such as a color filter using a resin composition containing a color material, a resin, and a solvent, and then subject the film to a process requiring a heat treatment at a high temperature (for example, 300° C. or higher). For this reason, in recent years, there has been a demand for further improvement in the heat resistance of films obtained using a resin composition containing a color material, a resin, and a solvent.

[0007] According to the investigations of the present inventors, it has been found that the dispersibility of the pigment is insufficient even in the resin composition described in Patent Document 1, and there is room for further improvement. It has also been found that there is room for improvement in the heat resistance of the film obtained using the resin composition described in Patent Document 1.

[0008] Therefore, an object of the present invention is to provide a resin composition capable of forming a film having excellent pigment dispersibility and excellent heat resistance. Another object of the present invention is to provide a film, an optical filter, a solid-state imaging device, and an image display device using the resin composition. Another object of the present invention is to provide a resin and a method for producing the resin. [Means for solving the problem]

[0009] Examples of typical embodiments of the present invention are given below.

[0010] <1> a colorant A containing a pigment; Resin B, a solvent C; The resin B includes a resin B1 which is a reaction product of a resin having a primary amino group or a secondary amino group and a macromonomer having an acid anhydride structure at the terminal. Resin composition. <2> The resin B1 is a resin containing a structure represented by formula (b1): <1> The resin composition according to claim 1, [ka] In formula (b1), the wavy line represents a bond, and X b1 represents an (n+2)-valent linking group, and X b2 is O or NR x1 represents R x1 represents a hydrogen atom or a substituent, and L b1 represents a single bond or a divalent linking group, and P b1 represents the polymer chain, and R b1 represents a hydrogen atom, a substituent, or a counter ion, and n represents an integer of 1 or more. <3> The resin B1 is a resin containing a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3). <1> or <2> The resin composition according to claim 1, [ka] In the formula, R 1 ~R 9 each independently represents a hydrogen atom or a substituent, L 1 represents a single bond or a divalent linking group, L 2 and L 3 each independently represents a divalent linking group; L 4 represents a single bond or a divalent linking group, and X b11 represents an (n+2)-valent linking group, and X b12 is O or NR x11 represents R x11 represents a hydrogen atom or a substituent, and L b11 represents a single bond or a divalent linking group, and P b11 represents the polymer chain, and R b11 represents a hydrogen atom, a substituent, or a counter ion, and n represents an integer of 1 or more. <4> L in the above formula (1-1) b11 , L in equation (1-2) b11 and L in formula (1-3) b11 is a divalent linking group containing a sulfur atom, <3> The resin composition according to claim 1. <5> P in the above formula (1-1) b11The polymer chain represented by formula (1-2) b11 and the polymer chain represented by formula (1-3) b11 is a polymer chain containing a repeating unit of at least one structure selected from a polyether structure, a polyester structure, a poly(meth)acrylic structure, and a polystyrene structure, <3> or <4> The resin composition according to claim 1. <6> P in the above formula (1-1) b11 The polymer chain represented by formula (1-2) b11 and the polymer chain represented by formula (1-3) b11 The polymer chain represented by the formula (I) contains at least one group selected from an ethylenically unsaturated bond-containing group, an epoxy group, an oxetanyl group, and a t-butyl group. <3> ~ <5> The resin composition according to any one of the above. <7> The resin B1 contains a repeating unit represented by the formula (1-1), and the content of the repeating unit represented by the formula (1-1) in the resin B1 is 30 mol % or more, The resin B1 contains a repeating unit represented by the formula (1-2), and the content of the repeating unit represented by the formula (1-2) in the resin B1 is 30 mol % or more, or The resin B1 contains a repeating unit represented by the formula (1-3), and the content of the repeating unit represented by the formula (1-3) in the resin B1 is 30 mol% or more. <3> ~ <6> The resin composition according to any one of the above. <8> The repeating unit represented by the above formula (1-1) is a repeating unit represented by the following formula (2-1): The repeating unit represented by the above formula (1-2) is a repeating unit represented by the following formula (2-2): The repeating unit represented by the above formula (1-3) is a repeating unit represented by the following formula (2-3): <3> ~ <7> the resin composition according to any one of the above items (1) to (4); [ka] In the formula, L 1 represents a single bond or a divalent linking group, L 2 and L 3each independently represents a divalent linking group; L 4 represents a single bond or a divalent linking group, L b11 represents a single bond or a divalent linking group, and P b11 represents a polymer chain. <9> The colorant A contains at least one pigment selected from a diketopyrrolopyrrole pigment and a phthalocyanine pigment. <1> ~ <8> The resin composition according to any one of the above. <10> Further, the polymerizable monomer <1> ~ <9> The resin composition according to any one of the above. <11> Further containing a photopolymerization initiator, <1> ~ <10> The resin composition according to any one of the above. <12> <1> ~ <11> A film obtained by using the resin composition according to any one of the above items. <13> <12> An optical filter having the film according to claim 1. <14> <12> A solid-state imaging device having the film according to claim 1. <15> <12> An image display device having the film according to claim 1. <16> A resin containing a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3); [ka] In the formula, R 1 ~R 9 each independently represents a hydrogen atom or a substituent, L 1 represents a single bond or a divalent linking group, L 2 and L 3 each independently represents a divalent linking group; L 4 represents a single bond or a divalent linking group, and X b11 represents an (n+2)-valent linking group, and X b12 is O or NR x11 represents R x11 represents a hydrogen atom or a substituent, and L b11 represents a single bond or a divalent linking group, and P b11 represents the polymer chain, and R b11 represents a hydrogen atom, a substituent, or a counter ion, and n represents an integer of 1 or more. <17> A method for producing a resin, comprising a step of reacting a resin having a primary amino group or a secondary amino group with a macromonomer having an acid anhydride structure at the terminal. [Effects of the Invention]

[0011] According to the present invention, a resin composition capable of forming a film having excellent pigment dispersibility and excellent heat resistance can be provided. Furthermore, a film, an optical filter, a solid-state imaging device, and an image display device using the resin composition can be provided. Furthermore, a resin and a method for producing the resin can be provided. DETAILED DESCRIPTION OF THE INVENTION

[0012] The main embodiments of the present invention will be described below, but the present invention is not limited to the embodiments explicitly described. In this specification, the symbol "to" is used to mean that the numerical values ​​before and after it are included as the lower limit and upper limit. In the description of groups (atomic groups) in this specification, when a notation does not specify whether they are substituted or unsubstituted, it encompasses both unsubstituted groups (atomic groups) and substituted groups (atomic groups). For example, the term "alkyl group" encompasses not only alkyl groups without a substituent (unsubstituted alkyl groups) but also alkyl groups with a substituent (substituted alkyl groups). In this specification, unless otherwise specified, "exposure" includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams. Examples of light used for exposure include the bright line spectrum of a mercury lamp, far ultraviolet light typified by excimer lasers, extreme ultraviolet light (EUV light), X-rays, electron beams, and other actinic rays or radiation. In this specification, the term "(meth)allyl group" refers to either or both of allyl and methallyl, "(meth)acrylate" refers to either or both of acrylate and methacrylate, "(meth)acrylic" refers to either or both of acrylic and methacrylic, and "(meth)acryloyl" refers to either or both of acryloyl and methacryloyl. In this specification, the weight average molecular weight and number average molecular weight are values ​​measured by GPC (gel permeation chromatography) in terms of polystyrene. In this specification, near-infrared light refers to light with a wavelength of 700 to 2500 nm. In this specification, the total solid content refers to the total mass of all components of the composition excluding the solvent. In this specification, the term "process" does not only refer to an independent process, but also includes processes that cannot be clearly distinguished from other processes as long as the intended effect of the process is achieved. In this specification, a pigment means a coloring material that is difficult to dissolve in a solvent. In this specification, symbols (e.g., A) added before or after a name are terms used to distinguish components, and do not limit the type, number, or superiority of the components.

[0013] <Resin composition> The resin composition of the present invention comprises: a colorant A containing a pigment; Resin B, a solvent C; Resin B is characterized by containing Resin B1, which is a reaction product of a resin having a primary amino group or a secondary amino group and a macromonomer having an acid anhydride structure at the terminal.

[0014] The resin composition of the present invention has excellent pigment dispersibility. Although the detailed reason for this effect is unknown, it is presumed that Resin B1 has a structure in which an amide bond is formed by the reaction of a resin having a primary amino group or a secondary amino group with a macromonomer having an acid anhydride structure at its terminal, and polymer chains are bonded via the amide bond. Therefore, it is presumed that the amide bond sites in Resin B1 promote adsorption of Resin B1 to the pigment surface, and the polymer chains act as steric repulsive groups, thereby suppressing aggregation of pigments, etc., resulting in a resin composition with excellent pigment dispersibility.

[0015] Furthermore, by using the resin composition of the present invention, it is possible to form a film with excellent heat resistance that is resistant to decomposition even at high temperatures and does not shrink even after heat treatment at high temperatures. The detailed reasons for this effect are unknown, but it is presumed that this is due to the reaction between the resin B1 having a primary or secondary amino group and a macromonomer having an acid anhydride structure at its terminal, resulting in the amide bond site being closed by heating during film formation to form an imide ring. Therefore, even if a film is formed using the resin composition of the present invention and the resulting film is subjected to a high-temperature heat treatment (e.g., 300°C or higher), film shrinkage is suppressed, and even if another film, such as an inorganic film, is formed on the film, cracking of the other film can be suppressed. Therefore, the resin composition of the present invention can widen the process window for processes after film production.

[0016] When the resin composition of the present invention is used to form a film having a thickness of 0.60 μm by heating at 200°C for 30 minutes, the thickness of the film after heat treatment at 300°C for 5 hours in a nitrogen atmosphere is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more of the thickness of the film before heat treatment. Furthermore, the thickness of the film after heat treatment at 350°C for 5 hours in a nitrogen atmosphere is preferably 70% or more of the thickness of the film before heat treatment, more preferably 80% or more, even more preferably 90% or more, and particularly preferably 95% or more. Furthermore, the thickness of the film after heat treatment at 400°C for 5 hours in a nitrogen atmosphere is preferably 70% or more of the thickness of the film before heat treatment, more preferably 80% or more, even more preferably 90% or more, and particularly preferably 95% or more.

[0017] Furthermore, when the resin composition of the present invention is used to form a film having a thickness of 0.60 μm by heating at 200°C for 30 minutes and then heat-treating the film at 300°C for 5 hours in a nitrogen atmosphere, the rate of change ΔA in absorbance of the film after heat treatment, represented by the following formula (A1), is preferably 50% or less, more preferably 45% or less, even more preferably 40% or less, and particularly preferably 35% or less. ΔA(%)=|100-(A2 / A1)×100|...(A1) ΔA is the rate of change in absorbance of the film after heat treatment, A1 is the maximum absorbance of the film before heat treatment in the wavelength range of 400 to 1100 nm, A2 is the absorbance of the film after the heat treatment, and is the absorbance at the wavelength that exhibits the maximum absorbance in the wavelength range of 400 to 1100 nm of the film before the heat treatment. The above physical properties can be achieved by adjusting the type and content of the specific resin used.

[0018] Furthermore, when the resin composition of the present invention is used to form a film having a thickness of 0.60 μm by heating at 200°C for 30 minutes, the absolute value of the difference between the wavelength λ1 at which the film exhibits the maximum absorbance in the wavelength range of 400 to 1100 nm and the wavelength λ2 at which the film exhibits the maximum absorbance after heat treatment at 300°C for 5 hours in a nitrogen atmosphere is preferably 50 nm or less, more preferably 45 nm or less, and even more preferably 40 nm or less. The above physical properties can be achieved by adjusting the type and content of the specific resin used.

[0019] Furthermore, when the resin composition of the present invention is used to form a film having a thickness of 0.60 μm by heating at 200° C. for 30 minutes, and the film is then heat-treated at 300° C. for 5 hours in a nitrogen atmosphere, the rate of change in absorbance of the film after the heat treatment in the wavelength range of 400 to 1100 nm, ΔA λ The maximum value of is preferably 30% or less, more preferably 27% or less, and even more preferably 25% or less. The rate of change in absorbance is a value calculated from the following formula (2). ΔA λ =|100-(A2 λ / A1 λ )×100| ···(2) ΔA λ is the rate of change in absorbance at wavelength λ of the film after heat treatment, A1 λ is the absorbance at wavelength λ of the film before heat treatment, A2 λ is the absorbance of the film at wavelength λ after heat treatment. The above physical properties can be achieved by adjusting the type and content of the specific resin used.

[0020] The resin composition of the present invention is preferably used as a resin composition for an optical filter. Examples of the optical filter include a color filter, a near-infrared transmission filter, and a near-infrared cut filter, and a color filter is preferred. The resin composition of the present invention can also be preferably used as a resin composition for a solid-state imaging device, and more preferably as a resin composition for forming pixels of an optical filter used in a solid-state imaging device.

[0021] The color filter may be a filter having colored pixels that transmit light of a specific wavelength, and is preferably a filter having at least one colored pixel selected from red, blue, green, yellow, cyan, and magenta pixels. The color filter can be formed using a resin composition containing a chromatic colorant.

[0022] Examples of near-infrared cut filters include filters having a maximum absorption wavelength in the wavelength range of 700 to 1800 nm. The maximum absorption wavelength of the near-infrared cut filter is preferably in the wavelength range of 700 to 1300 nm, and more preferably in the wavelength range of 700 to 1100 nm. The transmittance of the near-infrared cut filter over the entire wavelength range of 400 to 650 nm is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. The transmittance at at least one point in the wavelength range of 700 to 1800 nm is preferably 20% or less. The ratio of absorbance Amax at the maximum absorption wavelength of the near-infrared cut filter to absorbance A550 at a wavelength of 550 nm, i.e., absorbance Amax / absorbance A550, is preferably 20 to 500, more preferably 50 to 500, even more preferably 70 to 450, and particularly preferably 100 to 400. The near-infrared cut filter can be formed using a resin composition containing a near-infrared absorbing coloring material.

[0023] The near-infrared transmission filter is a filter that transmits at least a portion of near-infrared light. The near-infrared transmission filter is preferably a filter that blocks at least a portion of visible light and transmits at least a portion of near-infrared light. Preferred examples of the near-infrared transmission filter include filters that satisfy the spectral characteristics of a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 640 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100 to 1300 nm. The near-infrared transmission filter is preferably a filter that satisfies any one of the following spectral characteristics (1) to (5). (1): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 640 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 800 to 1500 nm. (2): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 750 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 900 to 1500 nm. (3): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 830 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1000 to 1500 nm. (4): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 950 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100 to 1500 nm. (5): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 1050 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1200 to 1500 nm.

[0024] A preferred embodiment of the spectral characteristics of the resin composition of the present invention is such that, when a 5 μm-thick film is formed using the resin composition, the maximum light transmittance in the thickness direction of the film in the wavelength range of 360 to 700 nm is 50% or more. Resin compositions satisfying such spectral characteristics are preferably used as resin compositions for forming pixels in color filters. Specifically, they are preferably used as resin compositions for forming colored pixels selected from red, blue, green, yellow, cyan, and magenta pixels.

[0025] A resin composition having the above-described spectral characteristics preferably contains a chromatic colorant. For example, a resin composition containing a red colorant and a yellow colorant can be preferably used as a resin composition for forming a red pixel. A resin composition containing a blue colorant and a purple colorant can be preferably used as a resin composition for forming a blue pixel. A resin composition containing a green colorant can be preferably used as a resin composition for forming a green or cyan pixel. When a resin composition is used as a resin composition for forming a green pixel, it is also preferable that the resin composition further contains a yellow colorant in addition to the green colorant.

[0026] Another preferred embodiment of the spectral characteristics of the resin composition of the present invention is one in which the ratio Amin / B, which is the ratio of the minimum absorbance Amin in the wavelength range of 400 to 640 nm to the absorbance B at a wavelength of 1500 nm, is 5 or more. A resin composition that satisfies such spectral characteristics can be preferably used as a resin composition for forming a near-infrared transmission filter. The value of Amin / B, which is the absorbance ratio, is preferably 7.5 or more, more preferably 15 or more, and even more preferably 30 or more.

[0027] Here, the absorbance Aλ at a wavelength λ is defined by the following formula (λ1): Aλ=-log(Tλ / 100) (λ1) Aλ is the absorbance at wavelength λ, and Tλ is the transmittance (%) at wavelength λ. In the present invention, the absorbance value may be a value measured in the state of a solution, or may be a value of a film formed using the composition. When measuring the absorbance in the state of a film, it is preferable to measure the absorbance using a film obtained by applying the composition to a glass substrate by a method such as spin coating and drying it at 100°C for 120 seconds using a hot plate or the like.

[0028] The resin composition of the present invention preferably satisfies any one of the following spectral characteristics (Ir1) to (Ir5). (Ir1): The value of A1 / B1, which is the ratio of the minimum absorbance A1 in the wavelength range of 400 to 640 nm to the maximum absorbance B1 in the wavelength range of 800 to 1500 nm, is 4.5 or more, preferably 7.5 or more, more preferably 15 or more, and even more preferably 30 or more. According to this embodiment, a film can be formed that blocks light in the wavelength range of 400 to 640 nm and transmits light with a wavelength of more than 750 nm. (Ir2): The value of A2 / B2, which is the ratio of the minimum absorbance A2 in the wavelength range of 400 to 750 nm to the maximum absorbance B2 in the wavelength range of 900 to 1500 nm, is 4.5 or more, preferably 7.5 or more, more preferably 15 or more, and even more preferably 30 or more. According to this embodiment, a film can be formed that blocks light in the wavelength range of 400 to 750 nm and transmits light with a wavelength of more than 850 nm. (Ir3): The value of A3 / B3, which is the ratio of the minimum absorbance A3 in the wavelength range of 400 to 830 nm to the maximum absorbance B3 in the wavelength range of 1000 to 1500 nm, is 4.5 or more, preferably 7.5 or more, more preferably 15 or more, and even more preferably 30 or more. According to this embodiment, a film can be formed that blocks light in the wavelength range of 400 to 830 nm and transmits light with a wavelength of more than 950 nm. (Ir4): The value of A4 / B4, which is the ratio of the minimum absorbance A4 in the wavelength range of 400 to 950 nm to the maximum absorbance B4 in the wavelength range of 1100 to 1500 nm, is 4.5 or more, preferably 7.5 or more, more preferably 15 or more, and even more preferably 30 or more. According to this embodiment, a film can be formed that blocks light in the wavelength range of 400 to 950 nm and transmits light with a wavelength of more than 1050 nm. (Ir5): The value of A5 / B5, which is the ratio of the minimum absorbance A5 in the wavelength range of 400 to 1050 nm to the maximum absorbance B5 in the wavelength range of 1200 to 1500 nm, is 4.5 or more, preferably 7.5 or more, more preferably 15 or more, and even more preferably 30 or more. According to this embodiment, a film can be formed that blocks light in the wavelength range of 400 to 1050 nm and transmits light with a wavelength of more than 1150 nm.

[0029] The resin composition of the present invention is also preferably a resin composition for pattern formation by photolithography. According to this embodiment, finely sized pixels can be easily formed. Therefore, it can be particularly preferably used as a resin composition for pixel formation of an optical filter used in a solid-state imaging device. For example, a resin composition containing a component having an ethylenically unsaturated bond-containing group (e.g., a resin having an ethylenically unsaturated bond-containing group or a monomer having an ethylenically unsaturated bond-containing group) and a photopolymerization initiator can be preferably used as a resin composition for pattern formation by photolithography. It is also preferable that the resin composition for pattern formation by photolithography further contains an alkali-soluble resin.

[0030] The resin composition of the present invention can also be used as a resin composition for forming a black matrix or a resin composition for forming a light-shielding film.

[0031] Each component used in the resin composition of the present invention will be described below.

[0032] <<Colorant A>> The resin composition of the present invention contains a color material A (hereinafter referred to as a color material). Examples of the color material include a white color material, a black color material, a chromatic color material, and a near-infrared absorbing color material. In the present invention, the white color material includes not only pure white color materials but also light gray color materials close to white (e.g., off-white, light gray, etc.).

[0033] The colorant preferably includes at least one selected from the group consisting of a chromatic colorant, a black colorant, and a near-infrared absorbing colorant, more preferably includes at least one selected from the group consisting of a chromatic colorant and a near-infrared absorbing colorant, even more preferably includes a chromatic colorant, and still more preferably includes at least one chromatic colorant selected from the group consisting of a red colorant, a yellow colorant, a blue colorant, and a purple colorant.

[0034] The colorant preferably includes a chromatic colorant and a near-infrared absorbing colorant, and more preferably includes two or more chromatic colorants and a near-infrared absorbing colorant. A black color may be formed by combining two or more chromatic colorants. The colorant preferably includes a black colorant and a near-infrared absorbing colorant. According to these aspects, the resin composition of the present invention can be preferably used as a resin composition for forming a near-infrared transmission filter. For combinations of colorants that form a black color by combining two or more chromatic colorants, see JP 2013-077009 A, JP 2014-130338 A, WO 2015 / 166779, etc.

[0035] The colorant contained in the resin composition of the present invention includes a pigment. The pigment may be either an inorganic pigment or an organic pigment, but is preferably an organic pigment from the viewpoints of a wide range of color variations, ease of dispersion, safety, etc. Furthermore, the pigment preferably includes at least one selected from a chromatic pigment and a near-infrared absorbing pigment, and more preferably includes a chromatic pigment.

[0036] The pigment preferably contains at least one selected from phthalocyanine pigments, dioxazine pigments, quinacridone pigments, anthraquinone pigments, perylene pigments, azo pigments, diketopyrrolopyrrole pigments, pyrrolopyrrole pigments, isoindoline pigments, quinophthalone pigments, and pteridine pigments, more preferably at least one selected from phthalocyanine pigments, diketopyrrolopyrrole pigments, and pyrrolopyrrole pigments, and even more preferably a phthalocyanine pigment or a diketopyrrolopyrrole pigment. Furthermore, the phthalocyanine pigment is preferably a phthalocyanine pigment that does not have a central metal or a phthalocyanine pigment that has copper or zinc as a central metal, because it is easy to form a film whose spectral characteristics are less likely to change even after heating to high temperatures (e.g., 300°C or higher).

[0037] The average primary particle diameter of the pigment is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, more preferably 10 nm or more. The upper limit is preferably 180 nm or less, more preferably 150 nm or less, and even more preferably 100 nm or less. When the average primary particle diameter of the pigment is within the above range, the pigment has good dispersion stability in the resin composition. In the present invention, the primary particle diameter of the pigment can be determined from a photograph obtained by observing the primary particles of the pigment with a transmission electron microscope. Specifically, the projected area of ​​the primary particles of the pigment is determined, and the corresponding circle-equivalent diameter is calculated as the primary particle diameter of the pigment. In the present invention, the average primary particle diameter is the arithmetic mean value of the primary particle diameters of 400 primary particles of the pigment. In addition, primary particles of the pigment refer to independent particles that are not aggregated.

[0038] (Chromatic color materials) Examples of chromatic colorants include colorants having a maximum absorption wavelength in the wavelength range of 400 to 700 nm. Examples include yellow colorants, orange colorants, red colorants, green colorants, purple colorants, and blue colorants. From the viewpoint of heat resistance, the chromatic colorant is preferably a pigment (chromatic pigment), more preferably a red pigment, yellow pigment, or blue pigment, and even more preferably a red pigment or blue pigment. Specific examples of chromatic color pigments include those shown below.

[0039] CI Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 1 25,126,127,128,129,137,138,139,147,148,150,151,152,153,154,155,156,161,162,164,166,167,168,169,170,171,172,173,174,175,176,177,179,180,181,182,185,187,188,193,194,199,213,214,215,228,231,232,233,234,235,236 etc. (Yellow pigments) CI Pigment Orange 2, 5, 13, 16, 17:1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, 73, etc. (orange pigments), CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1, 66, 67, 81:1, 81:2, 81:3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, 150 ,155,166,168,169,170,171,172,175,176,177,178,179,184,185,187,188,190,200,202,206,207,208,209,210,216,220,224,226,242,246,254,255,264,269,270,272,279,291,294,295,296,297 etc. (above, red pigments), CI Pigment Green 7, 10, 36, 37, 58, 59, 62, 63, 64 (phthalocyanine), 65, 66, etc. (all green pigments), CI Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60, 61, etc. (purple pigments) CI Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87, 88, etc. (all blue pigments).

[0040] Among these chromatic pigments, preferred red pigments are CI Pigment Red 254, CI Pigment Red 264, CI Pigment Red 272, CI Pigment Red 122, CI Pigment Red 177, and CI Pigment Red 179, because they are capable of forming films whose spectral characteristics are less likely to change even after heating to high temperatures (for example, 300°C or higher). Also, preferred blue pigments are CI Pigment Blue 15:3, CI Pigment Blue 15:4, CI Pigment Blue 15:6, and CI Pigment Blue 16.

[0041] In addition, a halogenated zinc phthalocyanine pigment having an average of 10 to 14 halogen atoms, an average of 8 to 12 bromine atoms, and an average of 2 to 5 chlorine atoms per molecule can also be used as a green pigment. Specific examples include the compounds described in International Publication No. 2015 / 118720. In addition, compounds described in Chinese Patent Application No. 106909027, phthalocyanine compounds having a phosphate ester as a ligand described in International Publication No. 2012 / 102395, phthalocyanine compounds described in Japanese Patent Application Laid-Open No. 2019-008014, phthalocyanine compounds described in Japanese Patent Application Laid-Open No. 2018-180023, compounds described in Japanese Patent Application Laid-Open No. 2019-038958, aluminum phthalocyanine compounds described in Japanese Patent Application Laid-Open No. 2020-070426, and core-shell pigments described in Japanese Patent Application Laid-Open No. 2020-076995 can also be used as green pigments.

[0042] Furthermore, an aluminum phthalocyanine pigment having a phosphorus atom can also be used as the blue pigment. Specific examples include the compounds described in paragraphs 0022 to 0030 of JP-A No. 2012-247591 and paragraph 0047 of JP-A No. 2011-157478.

[0043] Furthermore, azobarbituric acid nickel complex having the following structure can also be used as a yellow pigment. [ka]

[0044] Further, as yellow pigments, compounds described in JP-A-2017-201003, compounds described in JP-A-2017-197719, compounds described in paragraphs 0011 to 0062 and 0137 to 0276 of JP-A-2017-171912, compounds described in paragraphs 0010 to 0062 and 0138 to 0295 of JP-A-2017-171913, compounds described in paragraphs 0011 to 0062 and 0139 to 0190 of JP-A-2017-171914, and compounds described in paragraphs 0010 to 0065 and 0142 to 0222 of JP-A-2017-171915 can be used. , quinophthalone compounds described in paragraphs 0011 to 0034 of JP 2013-054339 A, quinophthalone compounds described in paragraphs 0013 to 0058 of JP 2014-026228 A, isoindoline compounds described in JP 2018-062644 A, quinophthalone compounds described in JP 2018-203798 A, quinophthalone compounds described in JP 2018-062578 A, quinophthalone compounds described in Japanese Patent No. 6432076 A, quinophthalone compounds described in JP 2018-155881 A, JP 2018-1117 A 57, quinophthalone compounds described in JP 2018-040835 A, quinophthalone compounds described in JP 2017-197640 A, quinophthalone compounds described in JP 2016-145282 A, quinophthalone compounds described in JP 2014-085565 A, quinophthalone compounds described in JP 2014-021139 A, quinophthalone compounds described in JP 2013-209614 A, quinophthalone compounds described in JP 2013-209435 A, quinophthalone compounds described in JP 2013-181015 A Quinophthalone compounds, quinophthalone compounds described in JP 2013-061622 A, quinophthalone compounds described in JP 2013-032486 A, quinophthalone compounds described in JP 2012-226110 A, quinophthalone compounds described in JP 2008-074987 A, quinophthalone compounds described in JP 2008-081565 A, quinophthalone compounds described in JP 2008-074986 A, quinophthalone compounds described in JP 2008-074985 A, quinophthalone compounds described in JP 2008-050420 A,Quinophthalone compounds described in JP 2008-031281 A, JP 48-032765 A, JP 2019-008014 A, quinophthalone compounds described in Japanese Patent No. 6607427 A, compounds described in Korean Patent Publication No. 10-2014-0034963 A, compounds described in Japanese Patent Publication No. 2017-095706 A, compounds described in Taiwan Patent Application Publication No. 201920495 A, compounds described in Japanese Patent No. 6607427 A, compounds described in Japanese Patent Publication No. 2020-033525 A, compounds described in Japanese Patent Publication No. 2020-033524 A, compounds described in Japanese Patent Publication No. 2020-033523 A Compounds described in JP 2020-033522 A, compounds described in JP 2020-033521 A, compounds described in WO 2020 / 045200 A, compounds described in WO 2020 / 045199 A, compounds described in WO 2020 / 045197 A, azo compounds described in JP 2020-093994 A, perylene compounds described in JP 2020-083982 A, perylene compounds described in WO 2020 / 105346 A, quinophthalone compounds described in JP 2020-517791 A, compounds represented by the following formula (QP1), and compounds represented by the following formula (QP2) can also be used. Furthermore, polymerized versions of these compounds are also preferably used from the viewpoint of improving color value. [ka]

[0045] In formula (QP1), X 1 ~X 16 each independently represents a hydrogen atom or a halogen atom; Z 1 represents an alkylene group having 1 to 3 carbon atoms. Specific examples of the compound represented by formula (QP1) include the compounds described in paragraph 0016 of Japanese Patent No. 6443711. [ka]

[0046] In formula (QP2), Y1 ~Y 3 each independently represents a halogen atom. n and m represent integers of 0 to 6, and p represents an integer of 0 to 5. (n+m) is 1 or greater. Specific examples of the compound represented by formula (QP2) include the compounds described in paragraphs 0047 to 0048 of Japanese Patent No. 6432077.

[0047] As red pigments, diketopyrrolopyrrole compounds having at least one bromine atom substituted in the structure described in JP 2017-201384 A, diketopyrrolopyrrole compounds described in paragraphs 0016 to 0022 of Japanese Patent No. 6248838 A, diketopyrrolopyrrole compounds described in WO 2012 / 102399 A, diketopyrrolopyrrole compounds described in WO 2012 / 117965 A, brominated diketopyrrolopyrrole compounds described in JP 2020-085947 A, naphthol azo compounds described in JP 2012-229344 A, and Red pigments described in Japanese Patent Publication No. 119, Japanese Patent No. 6525101, brominated diketopyrrolopyrrole compounds described in paragraph 0229 of JP 2020-090632, anthraquinone compounds described in Korean Patent Publication No. 10-2019-0140741, anthraquinone compounds described in Korean Patent Publication No. 10-2019-0140744, perylene compounds described in JP 2020-079396, diketopyrrolopyrrole compounds described in paragraphs 0025 to 0041 of JP 2020-066702, etc. can also be used. In addition, as a red pigment, a compound having a structure in which an aromatic ring group in which a group in which an oxygen atom, a sulfur atom, or a nitrogen atom is bonded to the aromatic ring is bonded to a diketopyrrolopyrrole skeleton can also be used.

[0048] For the diffraction angles that various pigments preferably have, please refer to the descriptions in Japanese Patent Nos. 6561862, 6413872, 6281345, JP 2020-026503 A, and JP 2020-033526 A, the contents of which are incorporated herein by reference. It is also preferable to use a pyrrolopyrrole pigment in which the crystallite size in the plane direction corresponding to the maximum peak in the X-ray diffraction pattern among the eight (±1±1±1) crystal lattice planes is 140 Å or less. It is also preferable to set the physical properties of the pyrrolopyrrole pigment as described in paragraphs 0028 to 0073 of Japanese Patent No. 2020-097744 A.

[0049] In addition, as chromatic colorants, triarylmethane dye polymers described in Korean Patent Publication No. 10-2020-0028160, xanthene compounds described in Japanese Patent Application Laid-Open No. 2020-117638, phthalocyanine compounds described in International Publication No. 2020 / 174991, and isoindoline compounds described in Japanese Patent Application Laid-Open No. 2020-160279, or salts thereof, can be used.

[0050] Two or more chromatic colorants may be used in combination. When two or more chromatic colorants are used in combination, the combination of two or more chromatic colorants may form a black color. Examples of such combinations include the following embodiments (1) to (7). When the resin composition contains two or more chromatic colorants and exhibits a black color due to the combination of two or more chromatic colorants, the resin composition of the present invention can be preferably used as a resin composition for forming a near-infrared transmission filter. (1) An embodiment containing a red coloring material and a blue coloring material. (2) An embodiment containing a red coloring material, a blue coloring material, and a yellow coloring material. (3) An embodiment containing a red coloring material, a blue coloring material, a yellow coloring material, and a purple coloring material. (4) An embodiment containing a red color material, a blue color material, a yellow color material, a purple color material, and a green color material. (5) An embodiment containing a red coloring material, a blue coloring material, a yellow coloring material, and a green coloring material. (6) An embodiment containing a red coloring material, a blue coloring material, and a green coloring material. (7) An embodiment containing a yellow coloring material and a purple coloring material.

[0051] (white color material) Examples of white coloring materials include inorganic pigments (white pigments) such as titanium oxide, strontium titanate, barium titanate, zinc oxide, magnesium oxide, zirconium oxide, aluminum oxide, barium sulfate, silica, talc, mica, aluminum hydroxide, calcium silicate, aluminum silicate, hollow resin particles, and zinc sulfide. The white pigment is preferably a particle containing titanium atoms, more preferably titanium oxide. Furthermore, the white pigment is preferably a particle having a refractive index of 2.10 or more for light with a wavelength of 589 nm. The refractive index is preferably 2.10 to 3.00, more preferably 2.50 to 2.75.

[0052] Furthermore, the white pigment may be titanium oxide as described in "Titanium Oxide: Physical Properties and Application Technology, by Kiyono Manabu, pages 13-45, published June 25, 1991, by Gihodo Publishing."

[0053] The white pigment may be composed of a single inorganic substance or a composite particle of other materials. For example, it is preferable to use particles having internal voids or other materials, particles with a large number of inorganic particles attached to a core particle, or core-shell composite particles consisting of a core particle made of a polymer particle and a shell layer made of inorganic nanoparticles. For examples of core-shell composite particles consisting of a core particle made of a polymer particle and a shell layer made of inorganic nanoparticles, see, for example, paragraphs 0012 to 0042 of JP 2015-047520 A, the contents of which are incorporated herein by reference.

[0054] The white pigment may also be hollow inorganic particles. Hollow inorganic particles are inorganic particles with a structure having a cavity inside, and refer to inorganic particles having a cavity surrounded by an outer shell. Examples of hollow inorganic particles include those described in JP 2011-075786 A, WO 2013 / 061621 A, JP 2015-164881 A, etc., the contents of which are incorporated herein by reference.

[0055] (black color material) The black colorant is not particularly limited, and known materials can be used. Examples of inorganic black colorants include inorganic pigments (inorganic black pigments) such as carbon black, titanium black, and graphite. Carbon black and titanium black are preferred, with titanium black being more preferred. Titanium black refers to black particles containing titanium atoms, and low-order titanium oxide or titanium oxynitride is preferred. Titanium black can be surface-modified as needed to improve dispersibility and inhibit aggregation. For example, the surface of titanium black can be coated with silicon oxide, titanium oxide, germanium oxide, aluminum oxide, magnesium oxide, or zirconium oxide. It can also be treated with a water-repellent substance, as disclosed in JP-A-2007-302836. It is preferable that both the primary particle size and average primary particle size of individual particles of titanium black are small. Specifically, the average primary particle size is preferably 10 to 45 nm. Titanium black can also be used as a dispersion. For example, a dispersion containing titanium black particles and silica particles, with the Si atom to Ti atom ratio adjusted to a range of 0.20 to 0.50, can be used. Regarding the dispersion, see paragraphs 0020 to 0105 of JP 2012-169556 A, the contents of which are incorporated herein by reference. Examples of commercially available titanium black products include Titanium Black 10S, 12S, 13R, 13M, 13M-C, 13R-N, and 13M-T (trade names: manufactured by Mitsubishi Materials Corporation) and Tilack D (trade name: manufactured by Ako Kasei Co., Ltd.). CI Pigment Black 1,7, etc. can also be used as an inorganic black pigment.

[0056] Examples of organic black colorants include bisbenzofuranone compounds, azomethine compounds, perylene compounds, and azo compounds. Examples of bisbenzofuranone compounds include those described in JP-A-2010-534726, JP-A-2012-515233, and JP-A-2012-515234, and are available, for example, as "Irgaphor Black" manufactured by BASF. Examples of perylene compounds include those described in paragraphs 0016 to 0020 of JP-A-2017-226821, CI Pigment Black 31 and 32, and are available. Examples of azomethine compounds include those described in JP-A-01-170601 and JP-A-02-034664, and are available, for example, as "Chromofine Black A1103" manufactured by Dainichiseika Color & Chemicals Co., Ltd.

[0057] The colorant used in the resin composition of the present invention may be the black colorant alone, or may further contain a chromatic colorant. According to this embodiment, a resin composition capable of forming a film with excellent light-shielding properties in the visible light region is easily obtained. When a black colorant and a chromatic colorant are used in combination as colorants, the mass ratio of the two is preferably black colorant:chromatic colorant=100:10-300, more preferably 100:20-200. Furthermore, it is preferable to use a black pigment as the black colorant, and it is preferable to use a chromatic pigment as the chromatic colorant.

[0058] Preferable combinations of black coloring materials and chromatic coloring materials include, for example, the following. (A-1) An embodiment containing an organic black coloring material and a blue coloring material. (A-2) An embodiment containing an organic black coloring material, a blue coloring material, and a yellow coloring material. (A-3) An embodiment containing an organic black coloring material, a blue coloring material, a yellow coloring material, and a red coloring material. (A-4) An embodiment containing an organic black color material, a blue color material, a yellow color material, and a purple color material.

[0059] In the above embodiment (A-1), the mass ratio of the organic black colorant to the blue colorant is preferably 100:1-70, more preferably 100:5-60, and even more preferably 100:10-50. In the above embodiment (A-2), the mass ratio of the organic black colorant, blue colorant, and yellow colorant is preferably organic black colorant:blue colorant:yellow colorant=100:10 to 90:10 to 90, more preferably 100:15 to 85:15 to 80, and even more preferably 100:20 to 80:20 to 70. In the above embodiment (A-3), the mass ratio of the organic black colorant, blue colorant, yellow colorant, and red colorant is preferably organic black colorant:blue colorant:yellow colorant:red colorant=100:20-150:1-60:10-100, more preferably 100:30-130:5-50:20-90, and even more preferably 100:40-120:10-40:30-80. In the above embodiment (A-4), the mass ratio of the organic black colorant, blue colorant, yellow colorant, and violet colorant is preferably organic black colorant:blue colorant:yellow colorant:violet colorant=100:20-150:1-60:10-100, more preferably 100:30-130:5-50:20-90, and even more preferably 100:40-120:10-40:30-80.

[0060] (Near infrared absorbing colorant) The near-infrared absorbing colorant is preferably a pigment, more preferably an organic pigment. The near-infrared absorbing colorant preferably has a maximum absorption wavelength in the wavelength range of more than 700 nm to 1400 nm. The maximum absorption wavelength of the near-infrared absorbing colorant is preferably 1200 nm or less, more preferably 1000 nm or less, and even more preferably 950 nm or less. The near-infrared absorbing colorant has an absorbance A at a wavelength of 550 nm. 550 and absorbance A at the maximum absorption wavelength max A is the ratio of 550 / A maxis preferably 0.1 or less, more preferably 0.05 or less, even more preferably 0.03 or less, and particularly preferably 0.02 or less. The lower limit is not particularly limited, but can be, for example, 0.0001 or more, or even 0.0005 or more. If the absorbance ratio is within the above range, a near-infrared absorbing colorant having excellent visible light transparency and near-infrared shielding properties can be obtained. In the present invention, the maximum absorption wavelength and absorbance values ​​at each wavelength of the near-infrared absorbing colorant are values ​​determined from the absorption spectrum of a film formed using a resin composition containing the near-infrared absorbing colorant.

[0061] Examples of near-infrared absorbing colorants include pyrrolopyrrole compounds, cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, croconium compounds, oxonol compounds, iminium compounds, dithiol compounds, triarylmethane compounds, pyrromethene compounds, azomethine compounds, anthraquinone compounds, dibenzofuranone compounds, dithiolene metal complexes, metal oxides, metal borides, etc. Examples of pyrrolopyrrole compounds include the compounds described in paragraphs 0016 to 0058 of JP 2009-263614 A, the compounds described in paragraphs 0037 to 0052 of JP 2011-068731 A, and the compounds described in paragraphs 0010 to 0033 of WO 2015 / 166873 A. Examples of squarylium compounds include compounds described in paragraphs 0044 to 0049 of JP 2011-208101 A, compounds described in paragraphs 0060 to 0061 of Japanese Patent No. 6065169 A, compounds described in paragraph 0040 of WO 2016 / 181987 A, compounds described in JP 2015-176046 A, and compounds described in paragraph 0072 of WO 2016 / 190162 A. compounds described in paragraphs 0196 to 0228 of JP 2016-074649 A, compounds described in paragraph 0124 of JP 2017-067963 A, compounds described in WO 2017 / 135359 A, compounds described in JP 2017-114956 A, compounds described in Japanese Patent No. 6197940 A, compounds described in WO 2016 / 120166 A, and the like. Examples of cyanine compounds include those described in paragraphs 0044 to 0045 of JP 2009-108267 A, those described in paragraphs 0026 to 0030 of JP 2002-194040 A, those described in JP 2015-172004 A, those described in JP 2015-172102 A, those described in JP 2008-088426 A, those described in paragraph 0090 of WO 2016 / 190162 A, and those described in JP 2017-031394 A. Examples of croconium compounds include those described in JP 2017-082029 A.Examples of iminium compounds include compounds described in JP-T-2008-528706, JP-A-2012-012399, JP-A-2007-092060, and WO 2018 / 043564, paragraphs 0048 to 0063. Examples of phthalocyanine compounds include the compounds described in paragraph 0093 of JP-A-2012-077153, oxytitanium phthalocyanine described in JP-A-2006-343631, the compounds described in paragraphs 0013 to 0029 of JP-A-2013-195480, vanadium phthalocyanine compounds described in Japanese Patent No. 6081771, vanadium phthalocyanine compounds described in WO 2020 / 071486, and phthalocyanine compounds described in WO 2020 / 071470. Examples of naphthalocyanine compounds include the compounds described in paragraph 0093 of JP-A-2012-077153. Examples of dithiolene metal complexes include the compounds described in Japanese Patent No. 5733804. Examples of metal oxides include indium tin oxide, antimony tin oxide, zinc oxide, Al-doped zinc oxide, fluorine-doped tin dioxide, niobium-doped titanium dioxide, and tungsten oxide. For details about tungsten oxide, see paragraph 0080 of JP 2016-006476 A, the contents of which are incorporated herein by reference. Examples of metal borides include lanthanum boride. Commercially available lanthanum boride products include LaB6-F (manufactured by Nippon Shinkinzoku Co., Ltd.). Compounds described in International Publication No. 2017 / 119394 can also be used as metal borides. Commercially available indium tin oxide products include F-ITO (manufactured by Dowa High-Tech Co., Ltd.).

[0062] Further, examples of near-infrared absorbing colorants include squarylium compounds described in JP 2017-197437 A, squarylium compounds described in JP 2017-025311 A, squarylium compounds described in WO 2016 / 154782 A, squarylium compounds described in Japanese Patent No. 5884953 A, squarylium compounds described in Japanese Patent No. 6036689 A, squarylium compounds described in Japanese Patent No. 58106 A, squarylium compounds described in Japanese Patent No. 58106 B, squarylium compounds described in Japanese Patent No. 58106 C, squarylium compounds described in Japanese Patent No. 58106 D, squarylium compounds described in Japanese Patent No. 58106 E, squarylium compounds described in Japanese Patent No. 58106 F, squarylium compounds described in Japanese Patent No. 58106 G, squarylium compounds described in Japanese Patent No. 58106 H ... squarylium compounds described in WO 2017 / 213047, paragraphs 0090 to 0107; pyrrole ring-containing compounds described in JP 2018-054760, paragraphs 0019 to 0075; pyrrole ring-containing compounds described in JP 2018-040955, paragraphs 0078 to 0082; Pyrrole ring-containing compounds described in Nos. 0043 to 0069, squarylium compounds having an aromatic ring at the amide α-position described in paragraphs 0024 to 0086 of JP 2018-041047, amide-linked squarylium compounds described in JP 2017-179131, compounds having a pyrrole bis-type squarylium skeleton or croconium skeleton described in JP 2017-141215, dihydrocarbazole bis-type squarylium compounds described in JP 2017-082029, asymmetric compounds described in paragraphs 0027 to 0114 of JP 2017-068120, pyrrole ring-containing compounds (carbazole type) described in JP 2017-067963, phthalocyanine compounds described in Japanese Patent No. 6251530, and the like can also be used.

[0063] The content of the colorant in the total solid content of the resin composition is preferably 20 to 90% by mass. The lower limit is preferably 30% by mass or more, more preferably 40% by mass or more, and even more preferably 50% by mass or more. The upper limit is preferably 80% by mass or less, and more preferably 70% by mass or less. The content of the pigment in the total solid content of the resin composition is preferably 20 to 90% by mass. The lower limit is preferably 30% by mass or more, more preferably 40% by mass or more, and even more preferably 50% by mass or more. The upper limit is preferably 80% by mass or less, and more preferably 70% by mass or less. The content of the dye in the coloring material is preferably 50% by mass or less, more preferably 40% by mass or less, and even more preferably 30% by mass or less. Furthermore, it is also preferable that the resin composition of the present invention is substantially free of dyes, since this makes it easier to effectively suppress changes in film thickness when the resulting film is heated to a high temperature. When the resin composition of the present invention is substantially free of dyes, the content of the dye in the total solid content of the resin composition of the present invention is preferably 0.1 mass % or less, more preferably 0.05 mass % or less, and particularly preferably free of dyes.

[0064] <<Resin B>> (Specific resin (resin B1)) The resin composition of the present invention contains a resin B (hereinafter also referred to as a resin). The resin contained in the resin composition includes a resin B1 (hereinafter also referred to as a specific resin), which is a reaction product of a resin having a primary amino group or a secondary amino group and a macromonomer having an acid anhydride structure at its terminal.

[0065] First, the resin having a primary amino group or a secondary amino group (hereinafter also referred to as amine polymer M) relating to the specific resin will be described. The amine polymer M may be any resin having a primary amino group or a secondary amino group, and examples thereof include polyalkyleneimine, polyallylamine, polydiallylamine, and aminoethylated acrylic polymer. In this specification, a primary amino group refers to a group represented by -NH2. A secondary amino group refers to a group represented by *-NH-*, where * is the linking moiety to a carbon atom.

[0066] The amine polymer M is preferably a resin having a primary amino group. The amine polymer M is also preferably a resin having three or more amino groups, more preferably a resin having a total of three or more primary amino groups and secondary amino groups, and even more preferably a resin having three or more primary amino groups.

[0067] Here, polyalkyleneimine refers to a polymer obtained by ring-opening polymerization of alkyleneimine, and is a polymer having at least a secondary amino group. The polyalkyleneimine may contain a primary amino group or a tertiary amino group in addition to the secondary amino group. Specific examples of alkyleneimine include ethyleneimine, propyleneimine, 1,2-butyleneimine, and 2,3-butyleneimine, with ethyleneimine or propyleneimine being preferred, and ethyleneimine being more preferred. That is, the polyalkyleneimine is preferably polyethyleneimine.

[0068] The polyalkyleneimine may be a linear polymer or a polymer having a branched structure. Examples of linear polyethyleneimine include polyethyleneimine commercially available from Fujifilm Wako Pure Chemical Industries, Ltd. Examples of commercially available polyethyleneimine having a branched structure include the Epomin series (manufactured by Nippon Shokubai Co., Ltd.).

[0069] Commercially available polyallylamine products include the PAA series (manufactured by Nittobo Medical Co., Ltd.), etc. Commercially available polydiallylamine products include the PAS series (manufactured by Nittobo Medical Co., Ltd.), etc. Commercially available aminoethylated acrylic polymer products include the Polyment series (manufactured by Nippon Shokubai Co., Ltd.), etc.

[0070] The amine polymer M is preferably a compound having a molecular weight distribution. The molecular weight of the amine polymer M is preferably 300 to 100,000, more preferably 300 to 10,000, and even more preferably 300 to 2,000. When the molecular weight of the amine polymer M can be measured by boiling point elevation, the number average molecular weight measured by boiling point elevation is used. When the molecular weight cannot be measured by boiling point elevation or is difficult to measure, the number average molecular weight measured by viscosity is used. When the molecular weight cannot be measured by viscosity or is difficult to measure, the number average molecular weight measured in terms of polystyrene by GPC (gel permeation chromatography) is used.

[0071] The amine value of the amine polymer M is preferably 5 mgKOH / g or more, more preferably 280 mgKOH / g or more, even more preferably 560 mgKOH / g or more, and most preferably 840 mgKOH / g or more. There is no upper limit, but it is generally 1500 mgKOH / g or less.

[0072] Next, the macromonomer having an acid anhydride structure at its terminal (hereinafter also referred to as macromonomer AH) related to the specific resin will be described.

[0073] Here, the macromonomer refers to a polymer compound having a reactive group at the end. The macromonomer AH is preferably a compound having an acid anhydride structure at the end of the polymer chain. Furthermore, the number of acid anhydride structures at the end of the macromonomer AH is preferably one. The macromonomer AH is preferably a compound represented by formula (AH1). R AH1 -(L AH1 -P AH1 ) m ···(AH1) In formula (AH1), R AH1 represents a group having an acid anhydride structure, L AH1 represents a divalent linking group, P AH1 represents the polymer chain, m represents an integer of 1 to 5;

[0074] R in formula (AH1) AH1 The group having an acid anhydride structure represented by is preferably a group having a cyclic acid anhydride structure. Examples of the group containing a cyclic acid anhydride structure include groups containing structures represented by formulas (AH-1) to (AH-6) shown below, with formula (AH-3) being preferred. [ka]

[0075] R AH1 Specific examples of the group having an acid anhydride structure represented by formula (AAH-1) include groups represented by formula (AAH-1) to formula (AAH-10) shown below, and the group represented by formula (AAH-10) is preferred. In the following formulas, * represents L in formula (AAH1). AH1 It is the connection part with. [ka]

[0076] L in formula (AH1) AH1 The divalent linking group represented by is a hydrocarbon group, a heterocyclic group, -NR LH1 -, -SO-, -SO2-, -CO-, -O-, -COO-, -OCO-, -S-, -NR LH1 CO-, -CONR LH1 - and groups formed by combining two or more of these. LH1 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, and is preferably a hydrogen atom. Examples of the hydrocarbon group include an aliphatic hydrocarbon group and an aromatic hydrocarbon group. The aliphatic hydrocarbon group preferably has 1 to 30 carbon atoms, more preferably 1 to 20 carbon atoms, and even more preferably 1 to 15 carbon atoms. The aliphatic hydrocarbon group may be linear, branched, or cyclic. Furthermore, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. Furthermore, the cyclic aliphatic hydrocarbon group may have a crosslinked structure. The aromatic hydrocarbon group preferably has 6 to 30 carbon atoms, more preferably 6 to 20 carbon atoms, and even more preferably 6 to 10 carbon atoms. The heterocyclic group may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclic group is preferably a 5-membered or 6-membered ring. Examples of heteroatoms constituting the heterocyclic group include nitrogen atoms, oxygen atoms, and sulfur atoms. The number of heteroatoms constituting the heterocyclic group is preferably 1 to 3. The heterocyclic group may be a monocyclic group or a condensed ring. The hydrocarbon group and heterocyclic group may have a substituent, such as the substituent T described below.

[0077] P in formula (AH1) AH1 is preferably a polymer chain containing repeating units of at least one structure selected from a polyether structure, a polyester structure, a poly(meth)acrylic structure, and a polystyrene structure, more preferably a polymer chain containing repeating units of at least one structure selected from a poly(meth)acrylic structure and a polystyrene structure, and even more preferably a polymer chain containing repeating units of a poly(meth)acrylic structure from the viewpoint of pigment dispersibility and heat resistance.

[0078] P AH1The polymer chain represented by may have a crosslinkable group. Examples of the crosslinkable group include ethylenically unsaturated bond-containing groups such as vinyl groups, (meth)allyl groups, and (meth)acryloyl groups; cyclic ether groups such as epoxy groups and oxetane groups; and blocked isocyanate groups. In this specification, the term "blocked isocyanate group" refers to a group capable of generating an isocyanate group by heat. For example, a group in which an isocyanate group is protected by reacting a blocking agent with an isocyanate group can be preferably exemplified. Examples of blocking agents include oxime compounds, lactam compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, pyrazole compounds, mercaptan compounds, imidazole compounds, and imide compounds. Examples of blocking agents include the compounds described in paragraphs 0115 to 0117 of JP 2017-067930 A, the contents of which are incorporated herein by reference. The blocked isocyanate group is preferably a group that can generate an isocyanate group when heated at 90 to 260°C.

[0079] P AH1 It is also preferable that the polymer chain represented by has a tertiary alkyl group. Examples of the tertiary alkyl group include a t-butyl group.

[0080] P AH1 It is also preferred that the polymer chain represented by contains an epoxy group or an oxetane group and a t-butyl group, respectively.

[0081] P AH1 The polymer chain represented by formula (P1-1) preferably contains a repeating unit represented by any one of formulas (P1-1) to (P1-6), more preferably contains a repeating unit represented by formula (P1-5) or formula (P1-6), and even more preferably contains a repeating unit represented by formula (P1-5). [ka]

[0082] In the above formula, R G1 and R G2R each represents an alkylene group. G1 and R G2 The alkylene group represented by is preferably a linear or branched alkylene group having 1 to 20 carbon atoms, more preferably a linear or branched alkylene group having 2 to 16 carbon atoms, and even more preferably a linear or branched alkylene group having 3 to 12 carbon atoms.

[0083] In the above formula, R G3 represents a hydrogen atom, a methyl group, a fluorine atom, a chlorine atom or a hydroxymethyl group, and is preferably a hydrogen atom or a methyl group.

[0084] In the above formula, Q G1 is -O- or -NR q - represents R q represents a hydrogen atom, an alkyl group, an aryl group, or a heterocyclic group. G1 is preferably —O—. R q The number of carbon atoms in the alkyl group represented by is preferably 1 to 30, more preferably 1 to 15, still more preferably 1 to 8, still more preferably 1 to 5, and particularly preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, and is preferably linear or branched, and more preferably linear. R q The aryl group represented by the formula (I) preferably has 6 to 30 carbon atoms, more preferably 6 to 20 carbon atoms, and even more preferably 6 to 12 carbon atoms. R q The heterocyclic group represented by may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclic group is preferably a 5-membered or 6-membered ring. Examples of heteroatoms constituting the heterocyclic group include nitrogen atoms, oxygen atoms, and sulfur atoms. The number of heteroatoms constituting the heterocyclic group is preferably 1 to 3. The heterocyclic group may be a monocyclic ring or a condensed ring. The alkyl group, aryl group and heterocyclic group may have a substituent or may be unsubstituted. Examples of the substituent include the substituent T described below.

[0085] In the above formula, L G1represents a single bond or an arylene group, and is preferably a single bond.

[0086] In the above formula, L G2 represents a single bond or a divalent linking group. Examples of the divalent linking group include an alkylene group (preferably an alkylene group having 1 to 12 carbon atoms), an arylene group (preferably an arylene group having 6 to 20 carbon atoms), -NR LG1 -, -SO-, -SO2-, -CO-, -O-, -COO-, -OCO-, -S-, -NR LG1 CO-, -CONR LG1 - and a group formed by combining two or more of these, and a group containing an alkylene group or an arylene group is preferred. LG1 represents a hydrogen atom, an alkyl group, an aryl group, or a heterocyclic group, and is preferably a hydrogen atom. The alkylene group and arylene may have a substituent or may be unsubstituted. Examples of the substituent include the substituent T described below.

[0087] In the above formula, R G4 represents a hydrogen atom or a substituent. Examples of the substituent include a hydroxy group, a carboxy group, an alkyl group, an aryl group, a heterocyclic group, an alkoxy group, an aryloxy group, a heterocyclic oxy group, an alkylthioether group, an arylthioether group, a heterocyclic thioether group, an ethylenically unsaturated bond-containing group, an epoxy group, an oxetanyl group, and a blocked isocyanate group. R G4 is preferably at least one selected from an alkyl group, an aryl group, an ethylenically unsaturated bond-containing group, an epoxy group, and an oxetanyl group, and more preferably at least one selected from an ethylenically unsaturated bond-containing group, an epoxy group, an oxetanyl group, and a t-butyl group.

[0088] In the above formula, R G5 represents a hydrogen atom or a methyl group, and R G6 represents an aryl group. G6 The number of carbon atoms in the aryl group represented by R is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 12. G6The aryl group represented by may have a substituent, such as a hydroxy group, a carboxy group, an alkyl group, an aryl group, a heterocyclic group, an alkoxy group, an aryloxy group, a heterocyclic oxy group, an alkylthioether group, an arylthioether group, a heterocyclic thioether group, an ethylenically unsaturated bond-containing group, an epoxy group, an oxetanyl group, and a blocked isocyanate group.

[0089] P AH1 The polymer chain represented by may contain two or more types of repeating units.

[0090] P AH1 The weight-average molecular weight of the polymer chain represented by is preferably 500 to 100,000, more preferably 1,000 to 50,000, and even more preferably 2,000 to 20,000. When the weight-average molecular weight of the polymer chain is within the above range, better pigment dispersibility is likely to be obtained. The weight-average molecular weight of the polymer chain can be measured by GPC (gel permeation chromatography). More specifically, it can be calculated from the weight-average molecular weight of the raw material monomer used to introduce the polymer chain.

[0091] Examples of the above-mentioned substituent T include the following groups: an alkyl group (preferably an alkyl group having 1 to 30 carbon atoms), an alkenyl group (preferably an alkenyl group having 2 to 30 carbon atoms), an alkynyl group (preferably an alkynyl group having 2 to 30 carbon atoms), an aryl group (preferably an aryl group having 6 to 30 carbon atoms), an amino group (preferably an amino group having 0 to 30 carbon atoms), an alkoxy group (preferably an alkoxy group having 1 to 30 carbon atoms), an aryloxy group (preferably an aryloxy group having 6 to 30 carbon atoms), a heteroaryloxy group (preferably a heteroaryloxy group having 1 to 30 carbon atoms), an acyl group (preferably an aryloxy group having 6 to 30 carbon atoms), an aryloxy group (preferably an aryloxy group having 6 to 30 carbon atoms), an aryloxy group (preferably an aryloxy group having 1 ... an alkoxycarbonyl group (preferably an alkoxycarbonyl group having 2 to 30 carbon atoms), an aryloxycarbonyl group (preferably an aryloxycarbonyl group having 7 to 30 carbon atoms), an acyloxy group (preferably an acyloxy group having 2 to 30 carbon atoms), an acylamino group (preferably an acylamino group having 2 to 30 carbon atoms), an alkoxycarbonylamino group (preferably an alkoxycarbonylamino group having 2 to 30 carbon atoms), an aryloxycarbonylamino group (preferably an aryloxycarbonylamino group having 7 to 30 carbon atoms) , a sulfamoyl group (preferably a sulfamoyl group having 0 to 30 carbon atoms), a carbamoyl group (preferably a carbamoyl group having 1 to 30 carbon atoms), an alkylthio group (preferably an alkylthio group having 1 to 30 carbon atoms), an arylthio group (preferably an arylthio group having 6 to 30 carbon atoms), a heteroarylthio group (preferably a heteroarylthio group having 1 to 30 carbon atoms), an alkylsulfonyl group (preferably an alkylsulfonyl group having 1 to 30 carbon atoms), an arylsulfonyl group (preferably an arylsulfonyl group having 6 to 30 carbon atoms), a heteroarylsulfonyl a group (preferably a heteroarylsulfonyl group having 1 to 30 carbon atoms), an alkylsulfinyl group (preferably an alkylsulfinyl group having 1 to 30 carbon atoms), an arylsulfinyl group (preferably an arylsulfinyl group having 6 to 30 carbon atoms), a heteroarylsulfinyl group (preferably a heteroarylsulfinyl group having 1 to 30 carbon atoms), a ureido group (preferably a ureido group having 1 to 30 carbon atoms), a phosphoric acid amide group (preferably a phosphoric acid amide group having 1 to 30 carbon atoms), a hydroxy group, a mercapto group, a halogen atom (a fluorine atom, a chlorine atom, a bromine atom,iodine atom, etc.), cyano group, sulfo group, carboxy group, nitro group, hydroxamic acid group, sulfino group, hydrazino group, imino group, heterocyclic group. When these groups are further substitutable, they may further have a substituent. Examples of the further substituent include the groups explained above for the substituent T, crosslinkable groups, etc.

[0092] In formula (AH1), m represents an integer of 1 to 5, preferably 1 or 2, and more preferably 1.

[0093] The macromonomer AH is preferably a compound represented by formula (AH2). [ka] In formula (AH2), L AH2 represents a divalent linking group, P AH2 represents a polymer chain.

[0094] L in formula (AH2) AH2 The divalent linking group represented by is a hydrocarbon group, a heterocyclic group, -NR LH2 -, -SO-, -SO2-, -CO-, -O-, -COO-, -OCO-, -S-, -NR LH2 CO-, -CONR LH2 - and groups formed by combining two or more of these. LH2represents a hydrogen atom, an alkyl group, an aryl group, or a heterocyclic group, and is preferably a hydrogen atom. Examples of the hydrocarbon group include an aliphatic hydrocarbon group and an aromatic hydrocarbon group. The aliphatic hydrocarbon group preferably has 1 to 30 carbon atoms, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched, or cyclic. The cyclic aliphatic hydrocarbon group may be a monocyclic ring or a fused ring. The cyclic aliphatic hydrocarbon group may have a crosslinked structure. The aromatic hydrocarbon group preferably has 6 to 30 carbon atoms, more preferably 6 to 20, and even more preferably 6 to 10. The heterocyclic group may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclic group is preferably a 5- or 6-membered ring. Examples of heteroatoms constituting the heterocyclic group include nitrogen atoms, oxygen atoms, and sulfur atoms. The number of heteroatoms constituting the heterocyclic group is preferably 1 to 3. The heterocyclic group may be a monocyclic ring or a fused ring. The hydrocarbon group and heterocyclic group may have a substituent, such as the substituent T described above.

[0095] P in formula (AH2) AH2 is P in formula (AH1) AH1 is synonymous with.

[0096] The weight average molecular weight of the macromonomer AH is preferably 500 to 100,000, more preferably 1,000 to 50,000, and even more preferably 2,000 to 20,000.

[0097] The macromonomer AH can be synthesized, for example, by the following method. [1] A synthesis method in which a polymer obtained by radically polymerizing a radically polymerizable compound using a thiol chain transfer agent having a hydroxyl group or an amino group is reacted with an acid anhydride. [2] A method of synthesizing a polymer with a thiol group at the end by enethiol addition to an unsaturated acid anhydride. [3] A synthesis method in which a radical polymerizable compound is radically polymerized using a thiol chain transfer agent having an acid anhydride group.

[0098] The specific resin is preferably a resin containing a structure represented by formula (b1). [ka] In formula (b1), the wavy line represents a bond, and X b1 represents an (n+2)-valent linking group, and X b2 is O or NR x1 represents R x1 represents a hydrogen atom or a substituent, and L b1 represents a single bond or a divalent linking group, and P b1 represents the polymer chain, and R b1 represents a hydrogen atom, a substituent, or a counter ion, and n represents an integer of 1 or more.

[0099] X in formula (b1) b1 Examples of the n+2-valent linking group represented by include groups containing a hydrocarbon group. The group containing a hydrocarbon group includes a hydrocarbon group; a hydrocarbon group and a heterocyclic group, -C(CF3)2-, -NR Xb1 -, -SO-, -SO2-, -CO-, -O-, -COO-, -OCO-, -S-, -NR Xb1 CO- and -CONR Xb1 and at least one group selected from the group consisting of -, ... R Xb1 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, and is preferably a hydrogen atom. Examples of the hydrocarbon group include an aliphatic hydrocarbon group and an aromatic hydrocarbon group. The aliphatic hydrocarbon group preferably has 1 to 30 carbon atoms, more preferably 1 to 20 carbon atoms, and even more preferably 1 to 15 carbon atoms. The aliphatic hydrocarbon group may be linear, branched, or cyclic. Furthermore, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. Furthermore, the cyclic aliphatic hydrocarbon group may have a crosslinked structure. The aromatic hydrocarbon group preferably has 6 to 30 carbon atoms, more preferably 6 to 20 carbon atoms, and even more preferably 6 to 10 carbon atoms. The heterocyclic group may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclic group is preferably a 5-membered or 6-membered ring. Examples of heteroatoms constituting the heterocyclic group include nitrogen atoms, oxygen atoms, and sulfur atoms. The number of heteroatoms constituting the heterocyclic group is preferably 1 to 3. The heterocyclic group may be a monocyclic group or a condensed ring. The hydrocarbon group and heterocyclic group may have a substituent, such as the substituent T described above. X in formula (b1) b1 The (n+2)-valent linking group represented by is preferably a group containing a cyclic aliphatic hydrocarbon group or a group containing an aromatic hydrocarbon group, more preferably a group containing an aromatic hydrocarbon group, and even more preferably a group containing a benzene ring group.

[0100] X in formula (b1) b2 is O or NR x1 represents R x1 represents a hydrogen atom or a substituent. x1 Examples of the substituent represented by include an alkyl group and an aryl group. The alkyl group and the aryl group may further have a substituent. Examples of the substituent include the groups explained above for the substituent T. X in formula (b1) b2 is preferably O.

[0101] L in formula (b1) b1 represents a single bond or a divalent linking group, and is preferably a divalent linking group. b1 The divalent linking group represented by is a hydrocarbon group, a heterocyclic group, -NR Lb1 -, -SO-, -SO2-, -CO-, -O-, -COO-, -OCO-, -S-, -NR Lb1 CO-, -CONR Lb1 - and groups formed by combining two or more of these. Lb1represents a hydrogen atom, an alkyl group, an aryl group, or a heterocyclic group, and is preferably a hydrogen atom. Examples of the hydrocarbon group include an aliphatic hydrocarbon group and an aromatic hydrocarbon group. The aliphatic hydrocarbon group preferably has 1 to 30 carbon atoms, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched, or cyclic. The cyclic aliphatic hydrocarbon group may be a monocyclic ring or a fused ring. The cyclic aliphatic hydrocarbon group may have a crosslinked structure. The aromatic hydrocarbon group preferably has 6 to 30 carbon atoms, more preferably 6 to 20, and even more preferably 6 to 10. The heterocyclic group may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclic group is preferably a 5- or 6-membered ring. Examples of heteroatoms constituting the heterocyclic group include nitrogen atoms, oxygen atoms, and sulfur atoms. The number of heteroatoms constituting the heterocyclic group is preferably 1 to 3. The heterocyclic group may be a monocyclic ring or a fused ring. The hydrocarbon group and heterocyclic group may have a substituent, such as the substituent T described above.

[0102] L b1 The divalent linking group represented by is preferably a divalent linking group containing a sulfur atom, and more preferably a group represented by formula (L-1). [ka] In formula (L-1), *1 represents X in formula (b1). b2 *2 is the connection part with P in formula (b1). b1 It is the connection part with L b10 represents a hydrocarbon group or a group in which two or more hydrocarbon groups are linked together via a single bond or a linking group.

[0103] L b10 The hydrocarbon group represented by L b1 Examples of the linking group that links two or more hydrocarbon groups include the hydrocarbon groups described above. Lb1 -, -SO-, -SO2-, -CO-, -O-, -COO-, -OCO-, -S-, -NR Lb1 CO- and -CONR Lb1 -RLb1 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, and is preferably a hydrogen atom.

[0104] P in equation (b1) b1 represents a polymer chain. P in formula (b1) b1 The polymer chain represented by P of formula (AH1) AH1 The preferred range is also the same as that of the polymer chain represented by

[0105] R in formula (b1) b1 represents a hydrogen atom, a substituent, or a counter ion. b1 Examples of the substituent represented by R include an alkyl group, an aryl group, and a group containing a crosslinkable group. Examples of the crosslinkable group include an ethylenically unsaturated bond-containing group such as a vinyl group, a (meth)allyl group, or a (meth)acryloyl group, an epoxy group, a cyclic ether group such as an oxetane group, and a blocked isocyanate group. The alkyl group or aryl group may further have a substituent. Examples of the substituent include the groups described above for the substituent T. R b1 The counter ions represented by are alkali metal ions (Li + , Na + , K. + ammonium ion, imidazolium ion, pyridinium ion, phosphonium ion, etc. b1 is preferably a hydrogen atom or a substituent, more preferably a hydrogen atom or a group containing a crosslinkable group, and even more preferably a hydrogen atom.

[0106] In formula (b1), n ​​represents an integer of 1 or more, preferably an integer of 1 to 4, more preferably 1 or 2, and even more preferably 1.

[0107] Resin B1 is preferably a resin containing a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3), more preferably a resin containing a repeating unit represented by formula (1-1) or formula (1-3), and even more preferably a resin containing a repeating unit represented by formula (1-3). Resins containing a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3) are resins of the present invention. [ka] In the formula, R 1 ~R 9 each independently represents a hydrogen atom or a substituent, L 1 represents a single bond or a divalent linking group, L 2 and L 3 each independently represents a divalent linking group; L 4 represents a single bond or a divalent linking group, and X b11 represents an (n+2)-valent linking group, and X b12 is O or NR x11 represents R x11 represents a hydrogen atom or a substituent, and L b11 represents a single bond or a divalent linking group, and P b11 represents the polymer chain, and R b11 represents a hydrogen atom, a substituent, or a counter ion, and n represents an integer of 1 or more.

[0108] R 1 ~R 9 Examples of the substituent represented by R include an alkyl group, an aryl group, and a halogen atom, and an alkyl group is preferred. 1 ~R 9 is preferably a hydrogen atom.

[0109] L in formula (1-1) 1 represents a single bond or a divalent linking group. Examples of the divalent linking group include a hydrocarbon group, -NR L11 -, -SO-, -SO2-, -CO-, -O-, -COO-, -OCO-, -S-, -NR L11 CO-, -CONR L11 - and groups formed by combining two or more of these.L11 represents a hydrogen atom, an alkyl group, an aryl group, or a heterocyclic group, and is preferably a hydrogen atom. Examples of the hydrocarbon group include an aliphatic hydrocarbon group and an aromatic hydrocarbon group. The aliphatic hydrocarbon group preferably has 1 to 30 carbon atoms, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched, or cyclic. The cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. The cyclic aliphatic hydrocarbon group may have a crosslinked structure. The aromatic hydrocarbon group preferably has 6 to 30 carbon atoms, more preferably 6 to 20, and even more preferably 6 to 10. The hydrocarbon group may have a substituent. Examples of the substituent include the substituent T described above. L in formula (1-1) 1 is preferably a single bond or a hydrocarbon group, more preferably a single bond or an aliphatic hydrocarbon group, even more preferably a single bond or an alkylene group, and particularly preferably a single bond, -CH2- or -C2H4-.

[0110] L in formula (1-2) 2 and L 3 each independently represents a divalent linking group. Examples of the divalent linking group include L 1 Examples of the groups described above are L 2 and L 3 is preferably a hydrocarbon group, more preferably an aliphatic hydrocarbon group, further preferably an alkylene group, and particularly preferably -CH2-.

[0111] L in formula (1-3) 4 represents a single bond or a divalent linking group. As the divalent linking group, L 1 Examples of the groups described above are L 4 is preferably a hydrocarbon group, more preferably an aliphatic hydrocarbon group, further preferably an alkylene group, and particularly preferably -C2H4-.

[0112] X in formulas (1-1) to (1-3) b11 , X b12 , L b11, P b11 and R b11 is X in equation (b1). b1 , X b2 , L b1 , P b1 and R b1 The same applies to the preferred range.

[0113] The repeating unit represented by the formula (1-1) is preferably a repeating unit represented by the following formula (2-1). The repeating unit represented by the formula (1-2) is preferably a repeating unit represented by the following formula (2-2). The repeating unit represented by the formula (1-3) is preferably a repeating unit represented by the following formula (2-3). [ka] In the formula, L 1 represents a single bond or a divalent linking group, L 2 and L 2 each independently represents a divalent linking group; L 4 represents a single bond or a divalent linking group, L b11 represents a single bond or a divalent linking group, and P b11 represents a polymer chain.

[0114] L in formulas (2-1) to (2-3) 1 ~L 4 , L b11 and P b11 is the L of formula (1-1) to formula (1-3) 1 ~L 4 , L b11 and P b11 is synonymous with.

[0115] When the specific resin is a resin containing a repeating unit represented by the above formula (1-1), the content of the repeating unit represented by formula (1-1) in the specific resin is preferably 5 mol% or more, more preferably 10 mol% or more, even more preferably 20 mol% or more, and particularly preferably 30 mol% or more from the viewpoint of pigment dispersibility and heat resistance of the resulting film. The upper limit can be 100 mol%, or can be 80 mol% or less, or can be 60 mol% or less. Furthermore, when the specific resin is a resin containing a repeating unit represented by the above formula (1-2), the content of the repeating unit represented by formula (1-2) in the specific resin is preferably 5 mol% or more, more preferably 10 mol% or more, even more preferably 20 mol% or more, and particularly preferably 30 mol% or more from the viewpoint of pigment dispersibility and the heat resistance of the resulting film. The upper limit can be 100 mol%, or can be 80 mol% or less, or can be 60 mol% or less. Furthermore, when the specific resin is a resin containing a repeating unit represented by the above formula (1-3), the content of the repeating unit represented by formula (1-3) in the specific resin is preferably 5 mol% or more, more preferably 10 mol% or more, even more preferably 20 mol% or more, and particularly preferably 30 mol% or more from the viewpoint of pigment dispersibility and the heat resistance of the resulting film. The upper limit can be 100 mol%, or can be 80 mol% or less, or can be 60 mol% or less.

[0116] The specific resin may further contain repeating units other than the repeating units represented by formulas (1-1) to (1-3). Examples of the other repeating units include repeating units having an acid group, repeating units having a hydroxy group, repeating units having an amino group, repeating units having an ammonium salt, repeating units having a crosslinkable group, repeating units having a group having a dye moiety, and repeating units having other functional groups. The acid group and amino group may be in the form of a salt.

[0117] Examples of the crosslinkable group include ethylenically unsaturated bond-containing groups such as vinyl groups, (meth)allyl groups and (meth)acryloyl groups, cyclic ether groups such as epoxy groups and oxetane groups, and blocked isocyanate groups. Examples of the acid group include a carboxy group, a sulfo group, and a phosphate group. Examples of the group having a dye partial structure include groups having a partial structure derived from a dye selected from benzimidazolone dyes, benzimidazolinone dyes, quinophthalone dyes, phthalocyanine dyes, anthraquinone dyes, diketopyrrolopyrrole dyes, quinacridone dyes, azo dyes, isoindolinone dyes, isoindoline dyes, dioxazine dyes, perylene dyes, and thioindigo dyes. Specific examples of the group having a dye partial structure include groups having the structures shown below. [ka] Other functional groups include alkyl groups and aryl groups.

[0118] When the specific resin contains other repeating units, the content of the other repeating units in the specific resin is preferably 50 mol% or less, more preferably 40 mol% or less, and even more preferably 30 mol% or less. The lower limit is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more.

[0119] When the specific resin contains a repeating unit having an acid group, the content of the repeating unit having an acid group in the specific resin is preferably 50 mol% or less, more preferably 40 mol% or less, and even more preferably 30 mol% or less, and the lower limit is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more.

[0120] When the specific resin contains a repeating unit having a hydroxy group, the content of the repeating unit having a hydroxy group in the specific resin is preferably 50 mol% or less, more preferably 40 mol% or less, and even more preferably 30 mol% or less. The lower limit is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more.

[0121] When the specific resin contains a repeating unit having an amino group, the content of the repeating unit having an amino group in the specific resin is preferably 50 mol% or less, more preferably 40 mol% or less, and even more preferably 30 mol% or less. The lower limit is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more.

[0122] When the specific resin contains a repeating unit having a crosslinkable group, the content of the repeating unit having a crosslinkable group in the specific resin is preferably 50 mol% or less, more preferably 40 mol% or less, and even more preferably 30 mol% or less. The lower limit is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more.

[0123] When the specific resin contains a repeating unit having a dye partial structure, the content of the repeating unit having the dye partial structure in the specific resin is preferably 50 mol% or less, more preferably 40 mol% or less, and even more preferably 30 mol% or less. The lower limit is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more.

[0124] When the specific resin contains a repeating unit having another functional group, the content of the repeating unit having another functional group in the specific resin is preferably 50 mol% or less, more preferably 40 mol% or less, and even more preferably 30 mol% or less. The lower limit is preferably 1 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more.

[0125] Preferred embodiments of the specific resin include the following embodiments [1] to

[10] . [1] An embodiment in which the specific resin is composed only of repeating units represented by formula (1-1), formula (1-2), or formula (1-3). [2] An embodiment in which the specific resin has a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3) and a repeating unit having an amino group. [3] An embodiment in which the specific resin has a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3) and a repeating unit having an acid group or a hydroxy group. [4] An embodiment in which the specific resin has a repeating unit represented by formula (1-1), formula (1-2), or formula (1-3), a repeating unit having an acid group or a hydroxy group, and a repeating unit having an amino group. [5] An embodiment in which the specific resin has a repeating unit represented by formula (1-1), formula (1-2), or formula (1-3) and a repeating unit having a crosslinkable group. [6] An embodiment in which the specific resin has a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3), a repeating unit having a crosslinkable group, and a repeating unit having an amino group. [7] An embodiment in which the specific resin has a repeating unit represented by formula (1-1), formula (1-2), or formula (1-3), a repeating unit having a crosslinkable group, a repeating unit having an acid group or a hydroxy group, and a repeating unit having an amino group. [8] An embodiment in which the specific resin has a repeating unit represented by formula (1-1), formula (1-2), or formula (1-3) and a repeating unit having a dye moiety structure. [9] In the above [2] to [7], a repeating unit having a dye moiety structure is further included.

[10] In the above [2] to [9], an embodiment further comprising a repeating unit having another functional group.

[0126] The acid value of the specific resin is preferably 1 mgKOH / g or more, more preferably 5 mgKOH / g or more, and even more preferably 10 mgKOH / g or more, and the upper limit is preferably 200 mgKOH / g or less, more preferably 150 mgKOH / g or less, and even more preferably 100 mgKOH / g or less.

[0127] The weight average molecular weight of the specific resin is preferably 1,000 to 200,000. The upper limit is preferably 100,000 or less, and more preferably 50,000 or less. The lower limit is preferably 1,500 or more, more preferably 2,000 or more, and even more preferably 3,000 or more.

[0128] In the specific resin, it is preferred that all of the primary amino groups of the amine polymer M are consumed by reaction with the macromonomer AH, which can further improve the storage stability of the resin composition.

[0129] The amine value of the specific resin is preferably 560 mgKOH / g or less, more preferably 300 mgKOH / g or less, and even more preferably 150 mgKOH / g or less. The lower limit may be 0 mgKOH / g, 5 mgKOH / g or more, 25 mgKOH / g or more, 50 mgKOH / g or more, or 100 mgKOH / g or more. When the amine value of the specific resin is 0 mgKOH / g, the effect of improving the transparency of the resin can be expected. Furthermore, when the amine value of the specific resin is 5 mgKOH / g or more (preferably 25 mgKOH / g or more, more preferably 50 mgKOH / g or more, and even more preferably 100 mgKOH / g or more), the effect of good adsorption to the pigment and improved dispersibility can be expected.

[0130] The specific resin preferably has a 5% mass loss temperature of 280°C or higher, more preferably 300°C or higher, and even more preferably 320°C or higher, as measured by TG / DTA (thermogravimetry / differential thermal analysis) under a nitrogen atmosphere. The upper limit of the 5% mass loss temperature is not particularly limited, and may be, for example, 1,000°C or lower. The 5% mass loss temperature is determined by a known TG / DTA measurement method as the temperature at which the mass loss rate becomes 5% when the resin is left to stand at a specific temperature for 5 hours under a nitrogen atmosphere. Furthermore, the specific resin preferably has a mass loss rate of 10% or less, more preferably 5% or less, and even more preferably 2% or less when left standing in a nitrogen atmosphere at 300°C for 5 hours. There is no particular lower limit to the mass loss rate, and it is sufficient as long as it is 0% or more. The mass loss rate is a value calculated as the ratio of mass loss in a specific resin before and after leaving the resin to stand at 300° C. for 5 hours in a nitrogen atmosphere.

[0131] Specific examples of the specific resin include resins B-1 to B-35 described in the examples below.

[0132] The specific resin can be synthesized by reacting the above-described amine polymer M with the above-described macromonomer AH. By reacting the above-described amine polymer M with the above-described macromonomer AH, the amino group of the amine polymer M undergoes an addition ring-opening reaction with the acid anhydride group of the macromonomer AH, resulting in the formation of an amide bond and a carboxyl group as a result of the ring-opening of the acid anhydride group. This synthesis method allows the reaction to proceed under very mild conditions without the use of a catalyst or the like. Furthermore, because by-products such as halogens and water are not generated, purification processes can be omitted or simplified.

[0133] When the amine polymer M and the macromonomer AH are mixed to react with each other, the ratio of the acid anhydride group of the macromonomer AH to 1 mole of the amino group of the amine polymer M is preferably 0.05 to 1 mole, more preferably 0.1 to 1 mole, and even more preferably 0.2 to 1 mole.

[0134] In the production of specific resins, cyclic acid anhydrides (succinic anhydride, glutaric anhydride, maleic anhydride, phthalic anhydride, itaconic anhydride, cis-4-cyclohexene-1,2-dicarboxylic anhydride, (±)-trans-1,2-cyclohexanedicarboxylic anhydride, cis-1,2-cyclohexanedicarboxylic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, exo-3,6-epoxy-1,2,3,6-tetrahydrophthalic anhydride, 4-methylcyclohexane-1,2-dicarboxylic anhydride, trimellitic anhydride, At least one compound selected from the group consisting of carboxylic acids (e.g., 2,3-naphthalenedicarboxylic anhydride, tetrachlorophthalic anhydride, tetrabromophthalic anhydride, 2-sulfobenzoic anhydride, tetrabromo-o-sulfobenzoic anhydride), acid chloride compounds having an ethylenically unsaturated bond-containing group, acid chloride compounds having an epoxy group, acid chloride compounds having an oxetanyl group, and compounds having a dye moiety and an ethylenically unsaturated bond-containing group may be added during or after the reaction of the amine polymer M with the macromonomer AH. This allows the amino groups of the amine polymer M to react with the compound, thereby adding functional groups such as acid groups, ethylenically unsaturated bond-containing groups, epoxy groups, oxetanyl groups, and groups having a dye moiety to the resin.

[0135] (other resins) The resin composition of the present invention may contain other resins in addition to the specific resins described above, such as (meth)acrylic resins, epoxy resins, (meth)acrylamide resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyphenylene resins, polyarylene ether phosphine oxide resins, polyimide resins, polyamideimide resins, polyolefin resins, cyclic olefin resins, polyester resins, styrene resins, and siloxane resins. Other resins include resins described in the examples of WO 2016 / 088645, resins described in JP 2017-057265 A, resins described in JP 2017-032685 A, resins described in JP 2017-075248 A, resins described in JP 2017-066240 A, resins described in JP 2017-167513 A, resins described in JP 2017-173787 A, and resins described in paragraphs 0041 to 0060 of JP 2017-206689 A. Resins described in paragraphs 0022 to 0071 of JP 2018-010856 A, blocked polyisocyanate resins described in JP 2016-222891 A, resins described in JP 2020-122052 A, resins described in JP 2020-111656 A, resins described in JP 2020-139021 A, resins containing a structural unit having a ring structure in the main chain and a structural unit having a biphenyl group in the side chain described in JP 2017-138503 A can also be used. In addition, other resins may contain by-products produced when synthesizing specific resins.

[0136] The weight average molecular weight (Mw) of the other resin is preferably 3,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, more preferably 500,000 or less. The lower limit is preferably 4,000 or more, more preferably 5,000 or more.

[0137] As the other resin, it is preferable to use a resin having alkali developability or a resin serving as a dispersant.

[0138] [Alkali-developable resin] The weight average molecular weight (Mw) of the alkali-developable resin is preferably 3,000 to 2,000,000. The upper limit is more preferably 1,000,000 or less, and even more preferably 500,000 or less. The lower limit is more preferably 4,000 or more, and even more preferably 5,000 or more.

[0139] Examples of the alkali-developable resin include (meth)acrylic resins, polyimine resins, polyether resins, polyolefin resins, cyclic olefin resins, polyester resins, styrene resins, and polyimide resins. Of these, (meth)acrylic resins and polyimine resins are preferred, and (meth)acrylic resins are more preferred.

[0140] As the alkaline-developable resin, a resin having an acid group is preferably used. Examples of the acid group include a phenolic hydroxy group, a carboxy group, a sulfo group, a phosphate group, a phosphonate group, an active imide group, and a sulfonamide group, with a carboxy group being preferred. Furthermore, as the resin having an acid group, a resin in which an acid group has been introduced by reacting an acid anhydride with a hydroxy group generated by epoxy ring-opening may also be used. Examples of such resins include the resins described in Japanese Patent No. 6349629. The resin having an acid group can be used, for example, as an alkali-soluble resin.

[0141] The alkali-developable resin preferably contains a repeating unit having an acid group, and more preferably contains 1 to 70 mol% of the repeating units having an acid group based on all repeating units of the resin. The upper limit of the content of the repeating units having an acid group is preferably 50 mol% or less, and more preferably 40 mol% or less. The lower limit of the content of the repeating units having an acid group is preferably 2 mol% or more, and more preferably 5 mol% or more.

[0142] The acid value of the alkali-developable resin is preferably 200 mgKOH / g or less, more preferably 150 mgKOH / g or less, even more preferably 120 mgKOH / g or less, and particularly preferably 100 mgKOH / g or less, and is preferably 5 mgKOH / g or more, more preferably 10 mgKOH / g or more, and even more preferably 20 mgKOH / g or more.

[0143] The alkali-developable resin preferably further contains an ethylenically unsaturated bond-containing group, such as a vinyl group, an allyl group, or a (meth)acryloyl group, with the allyl group and the (meth)acryloyl group being preferred, and the (meth)acryloyl group being more preferred.

[0144] The alkali-developable resin also preferably contains a repeating unit derived from a monomer component containing a compound represented by the following formula (ED1) and / or a compound represented by the following formula (ED2) (hereinafter, these compounds may be referred to as "ether dimers").

[0145] [ka]

[0146] In formula (ED1), R 1 and R 2 each independently represents a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent. [ka] In formula (ED2), R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms. For details of formula (ED2), reference can be made to the description in JP-A-2010-168539, the contents of which are incorporated herein by reference.

[0147] Specific examples of ether dimers can be found in, for example, paragraph 0317 of JP-A-2013-029760, the contents of which are incorporated herein by reference.

[0148] The alkali-developable resin also preferably contains a repeating unit derived from a compound represented by the following formula (X). [ka] In formula (X), R1 represents a hydrogen atom or a methyl group, R2 represents an alkylene group having 2 to 10 carbon atoms, R3 represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms which may contain a benzene ring, and n represents an integer of 1 to 15.

[0149] Examples of alkali-developable resins include resins having the following structures: In the following structural formula, Me represents a methyl group. [ka]

[0150] [Dispersant] The resin composition of the present invention may also contain a resin as a dispersant. Examples of dispersants include acidic dispersants (acidic resins) and basic dispersants (basic resins). Here, the term "acidic dispersant (acidic resin)" refers to a resin in which the amount of acid groups is greater than the amount of basic groups. The acidic dispersant (acidic resin) is preferably a resin in which the amount of acid groups is 70 mol % or more when the total amount of acid groups and basic groups is 100 mol %, and more preferably a resin consisting essentially of acid groups. The acid group possessed by the acidic dispersant (acidic resin) is preferably a carboxy group. The acid value of the acidic dispersant (acidic resin) is preferably 40 to 105 mgKOH / g, more preferably 50 to 105 mgKOH / g, and even more preferably 60 to 105 mgKOH / g. The term "basic dispersant (basic resin)" refers to a resin in which the amount of basic groups is greater than the amount of acid groups. The basic dispersant (basic resin) is preferably a resin in which the amount of basic groups exceeds 50 mol % when the total amount of acid groups and basic groups is taken as 100 mol %. The basic groups possessed by the basic dispersant are preferably amino groups.

[0151] The resin used as the dispersant preferably contains a repeating unit having an acid group.

[0152] The resin used as the dispersant is preferably a graft polymer. Examples of the graft polymer include the resins described in paragraphs 0025 to 0094 of JP-A No. 2012-255128, the contents of which are incorporated herein by reference.

[0153] The resin used as the dispersant is preferably a polyimine-based dispersant (polyimine resin) containing a nitrogen atom in at least one of the main chain and the side chain. The polyimine-based dispersant is preferably a resin having a main chain with a partial structure having a functional group with a pKa of 14 or less and a side chain with 40 to 10,000 atoms, and having a basic nitrogen atom in at least one of the main chain and the side chain. There are no particular restrictions on the basic nitrogen atom, as long as it is a nitrogen atom that exhibits basicity. Examples of polyimine-based dispersants include the resins described in paragraphs 0102 to 0166 of JP 2012-255128 A, the contents of which are incorporated herein by reference.

[0154] The resin used as a dispersant is preferably a resin having a structure in which multiple polymer chains are bonded to a core portion. Examples of such resins include dendrimers (including star-shaped polymers). Specific examples of dendrimers include polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of JP 2013-043962 A.

[0155] Further, the dispersant includes the block copolymers (EB-1) to (EB-9) described in paragraphs 0219 to 0221 of Japanese Patent No. 6432077, resins described in JP-A-2018-087939, polyethyleneimine having a polyester side chain described in WO 2016 / 104803, block copolymers described in WO 2019 / 125940, block polymers having an acrylamide structural unit described in JP-A-2020-066687, block polymers having an acrylamide structural unit described in JP-A-2020-066688, dispersants described in WO 2016 / 104803, and resins described in JP-A-2019-095548.

[0156] Dispersants are also commercially available, and specific examples thereof include the DISPERBYK series manufactured by BYK Chemie (e.g., DISPERBYK-111, 161, etc.) and the Solsperse series manufactured by Lubrizol (e.g., Solsperse 36000, etc.). In addition, pigment dispersants described in paragraphs 0041 to 0130 of JP 2014-130338 A can also be used, the contents of which are incorporated herein by reference.

[0157] The resin described above as a dispersant can also be used for purposes other than as a dispersant, for example, as a binder.

[0158] The resin content of the resin composition is preferably 5 to 60% by mass based on the total solid content. The lower limit is preferably 10% by mass or more, more preferably 15% by mass or more. The upper limit is preferably 50% by mass or less, more preferably 40% by mass or less.

[0159] The content of the specific resin in the total solid content of the resin composition is preferably 5 to 60% by mass. The lower limit is preferably 10% by mass or more, more preferably 15% by mass or more. The upper limit is preferably 50% by mass or less, more preferably 40% by mass or less.

[0160] The content of the specific resin is preferably 10 to 80 parts by mass relative to 100 parts by mass of the pigment. The lower limit is preferably 20 parts by mass or more, more preferably 30 parts by mass or more. The upper limit is preferably 70 parts by mass or less, more preferably 50 parts by mass or less.

[0161] Furthermore, the resin composition of the present invention preferably contains 20% by mass or more of the specific resin in the total solid content of the resin composition excluding the colorant, more preferably 30% by mass or more, and even more preferably 40% by mass or more. The upper limit can be 100% by mass, or 90% by mass or less, or even 85% by mass or less. When the content of the specific resin is within the above range, a film with excellent heat resistance can be easily formed, and film shrinkage after heating can be more easily suppressed. Furthermore, when an inorganic film or the like is formed on the surface of a film obtained using the resin composition of the present invention, even if this laminate is exposed to high temperatures, the occurrence of cracks in the inorganic film can be suppressed. The total content of the colorant and the specific resin in the total solid content of the resin composition is preferably 25 to 100% by mass. The lower limit is more preferably 30% by mass or more, and even more preferably 40% by mass or more. The upper limit is more preferably 90% by mass or less, and even more preferably 80% by mass or less.

[0162] In the resin composition, the content of the other resin is preferably 230 parts by mass or less, more preferably 200 parts by mass or less, and even more preferably 150 parts by mass or less, per 100 parts by mass of the specific resin. The lower limit may be 0 parts by mass, or may be 5 parts by mass or more, or may be 10 parts by mass or more. It is also preferable that the resin composition is substantially free of the other resin. According to this embodiment, a film with even better heat resistance is easily formed. The phrase "substantially free of other resins" means that the content of the other resin in the total solid content of the resin composition is 0.1% by mass or less, preferably 0.05% by mass or less, and more preferably zero.

[0163] <<Solvent C>> The resin composition of the present invention contains solvent C (hereinafter referred to as solvent). There are basically no particular limitations on the solvent as long as it satisfies the solubility of each component and the coatability of the resin composition. The solvent is preferably an organic solvent. Examples of organic solvents include ester-based solvents, ketone-based solvents, alcohol-based solvents, amide-based solvents, ether-based solvents, and hydrocarbon-based solvents. For details of these, please refer to paragraph 0223 of WO 2015 / 166779, the contents of which are incorporated herein by reference. Furthermore, ester-based solvents substituted with a cyclic alkyl group and ketone-based solvents substituted with a cyclic alkyl group can also be preferably used. Specific examples of organic solvents include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone, 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether ... Examples of suitable methyl alcohols include ethylene glycol monomethyl ether acetate, 3-methoxy-N,N-dimethylpropanamide, 3-butoxy-N,N-dimethylpropanamide, propylene glycol diacetate, 3-methoxybutanol, methyl ethyl ketone, gamma butyrolactone, sulfolane, anisole, 1,4-diacetoxybutane, diethylene glycol monoethyl ether acetate, butane-1,3-diyl diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as diacetone alcohol or 4-hydroxy-4-methyl-2-pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, and isopropyl alcohol.However, it may be better to reduce the amount of aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) used as organic solvents for environmental reasons (for example, the amount can be reduced to 50 ppm by mass (parts per million) or less, 10 ppm by mass or less, or 1 ppm by mass or less, relative to the total amount of organic solvents).

[0164] In the present invention, it is preferable to use an organic solvent with a low metal content, and the metal content of the organic solvent is preferably 10 mass ppb (parts per billion) or less. If necessary, organic solvents with mass ppt (parts per trillion) levels may be used, and such organic solvents are provided, for example, by Toyo Gosei Co., Ltd. (The Chemical Daily, November 13, 2015). Methods for removing impurities such as metals from organic solvents include, for example, distillation (molecular distillation, thin-film distillation, etc.) and filtration using a filter. The pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less. The filter material is preferably polytetrafluoroethylene, polyethylene, or nylon.

[0165] The organic solvent may contain isomers (compounds with the same number of atoms but different structures), and may contain only one type of isomer or multiple types of isomers.

[0166] The organic solvent preferably has a peroxide content of 0.8 mmol / L or less, and more preferably contains substantially no peroxide.

[0167] The content of the solvent in the resin composition is preferably 10 to 95% by mass, more preferably 20 to 90% by mass, and even more preferably 30 to 90% by mass.

[0168] <<Pigment derivatives>> The resin composition of the present invention may contain a pigment derivative, such as a compound having a structure in which an acid group or a basic group is bonded to a pigment skeleton.

[0169] Examples of dye skeletons that constitute the pigment derivative include a quinoline dye skeleton, a benzimidazolone dye skeleton, a benzisoindole dye skeleton, a benzothiazole dye skeleton, an iminium dye skeleton, a squarylium dye skeleton, a croconium dye skeleton, an oxonol dye skeleton, a pyrrolopyrrole dye skeleton, a diketopyrrolopyrrole dye skeleton, an azo dye skeleton, an azomethine dye skeleton, a phthalocyanine dye skeleton, a naphthalocyanine dye skeleton, an anthraquinone dye skeleton, a quinacridone dye skeleton, a dioxazine dye skeleton, a perinone dye skeleton, a perylene dye skeleton, a thioindigo dye skeleton, an isoindoline dye skeleton, an isoindolinone dye skeleton, a quinophthalone dye skeleton, an iminium dye skeleton, a dithiol dye skeleton, a triarylmethane dye skeleton, and a pyrromethene dye skeleton.

[0170] Examples of the acid group include a carboxy group, a sulfo group, a phosphoric acid group, a boronic acid group, a carboxylic acid amide group, a sulfonic acid amide group, an imidic acid group, and salts thereof. Examples of the atom or atomic group constituting the salt include an alkali metal ion (Li + , Na + , K. + etc.), alkaline earth metal ions (Ca 2+ , Mg 2+ Examples of the carboxylic acid amide group include -NHCOR X1 As the sulfonamide group, a group represented by -NHSO2R is preferred. X2 As the imide acid group, a group represented by -SO2NHSO2R is preferred. X3 , -CONHSO2R X4 , -CONHCOR X5 or -SO2NHCOR X6 A group represented by the formula: -SO2NHSO2R is preferred. X3 is more preferable. X1 ~R X6R each independently represents an alkyl group or an aryl group. X1 ~R X6 The alkyl group and aryl group represented by may have a substituent. The substituent is preferably a halogen atom, more preferably a fluorine atom.

[0171] Examples of basic groups include amino groups, pyridinyl groups and their salts, ammonium salts, and phthalimidomethyl groups. Examples of atoms or atomic groups that constitute salts include hydroxide ions, halogen ions, carboxylate ions, sulfonate ions, and phenoxide ions.

[0172] Pigment derivatives with excellent visible light transparency (hereinafter referred to as transparent pigment derivatives) can also be used. The maximum molar absorption coefficient (εmax) of transparent pigment derivatives in the wavelength range of 400 to 700 nm is 3000 L·mol -1 ·cm -1 It is preferable that the concentration is less than 1000 L·mol -1 ·cm -1 It is more preferable that it is less than 100 L·mol -1 ·cm -1 The lower limit of εmax is, for example, 1 L mol -1 ·cm -1 is greater than or equal to 10 L mol -1 ·cm -1 More than that is fine.

[0173] Specific examples of the pigment derivative include compounds described in the examples below, JP-A Nos. 56-118462, 63-264674, 01-217077, 03-009961, 03-026767, 03-153780, 03-045662, and JP-A Nos. JP-A-04-285669, JP-A-06-145546, JP-A-06-212088, JP-A-06-240158, JP-A-10-030063, JP-A-10-195326, paragraphs 0086 to 0098 of WO 2011 / 024896, paragraphs 0012 / 102399 Nos. 0063 to 0094, paragraph 0082 of International Publication No. 2017 / 038252, paragraph 0171 of Japanese Patent Application Laid-Open No. 2015-151530, paragraphs 0162 to 0183 of Japanese Patent Application Laid-Open No. 2011-252065, Japanese Patent Application Laid-Open No. 2003-081972, Japanese Patent No. 5299151, Japanese Patent Application Laid-Open No. 2015-172732 , compounds described in JP 2014-199308 A, JP 2014-085562 A, JP 2014-035351 A, JP 2008-081565 A, JP 2019-109512 A, and diketopyrrolopyrrole compounds having a thiol linking group described in WO 2020 / 002106.

[0174] The content of the pigment derivative is preferably 1 to 30 parts by mass, more preferably 3 to 20 parts by mass, relative to 100 parts by mass of the pigment. Only one type of pigment derivative may be used, or two or more types may be used in combination.

[0175] <<Polymerizable monomers>> The resin composition of the present invention preferably contains a polymerizable monomer. For example, known compounds that can be crosslinked by radicals, acids, or heat can be used as the polymerizable monomer. Examples of the polymerizable monomer include compounds having an ethylenically unsaturated bond-containing group and compounds having a cyclic ether group, with compounds having an ethylenically unsaturated bond-containing group being preferred. Examples of the ethylenically unsaturated bond-containing group include vinyl groups, (meth)allyl groups, and (meth)acryloyl groups. Examples of the cyclic ether group include epoxy groups and oxetane groups. Compounds having an ethylenically unsaturated bond-containing group are preferably used as radical polymerizable monomers. Compounds having a cyclic ether group are preferably used as cationically polymerizable monomers. The polymerizable monomer is preferably a polyfunctional polymerizable monomer. That is, the polymerizable monomer is preferably a monomer having two or more polymerizable groups such as an ethylenically unsaturated bond-containing group or a cyclic ether group.

[0176] The molecular weight of the polymerizable monomer is preferably 100 to 3000. The upper limit is more preferably 2000 or less, and even more preferably 1500 or less. The lower limit is more preferably 150 or more, and even more preferably 250 or more.

[0177] (Compound having an ethylenically unsaturated bond-containing group) The compound having an ethylenically unsaturated bond-containing group used as a polymerizable monomer is preferably a polyfunctional compound. That is, it is preferably a compound having two or more ethylenically unsaturated bond-containing groups, more preferably a compound having three or more ethylenically unsaturated bond-containing groups, even more preferably a compound having 3 to 15 ethylenically unsaturated bond-containing groups, and even more preferably a compound having 3 to 6 ethylenically unsaturated bond-containing groups. Furthermore, the compound having an ethylenically unsaturated bond-containing group is preferably a 3- to 15-functional (meth)acrylate compound, more preferably a 3- to 6-functional (meth)acrylate compound. Specific examples of compounds having an ethylenically unsaturated bond-containing group include JP 2009-288705 A, paragraphs 0095 to 0108, JP 2013-029760 A, paragraph 0227, JP 2008-292970 A, paragraphs 0254 to 0257, JP 2013-253224 A, paragraphs 0034 to 0038, JP 2012-208494 A, paragraph 0477, JP 2017-048367 A, Japanese Patent No. 6057891, Japanese Patent No. 6031807, and JP 2017-194662 A. The contents of which are incorporated herein by reference.

[0178] Preferred examples of the compound having an ethylenically unsaturated bond-containing group include dipentaerythritol tri(meth)acrylate (commercially available product: KAYARAD D-330, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol tetra(meth)acrylate (commercially available product: KAYARAD D-320, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol penta(meth)acrylate (commercially available product: KAYARAD D-310, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol hexa(meth)acrylate (commercially available products: KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd., and NK Ester A-DPH-12E, manufactured by Shin-Nakamura Chemical Co., Ltd.), and compounds having a structure in which the (meth)acryloyl groups are bonded via an ethylene glycol and / or propylene glycol residue (e.g., SR454 and SR499, commercially available from Sartomer). Furthermore, examples of compounds having an ethylenically unsaturated bond-containing group that can be used include diglycerin EO (ethylene oxide)-modified (meth)acrylate (commercially available product M-460; manufactured by Toagosei), pentaerythritol tetraacrylate (NK Ester A-TMMT, manufactured by Shin-Nakamura Chemical Co., Ltd.), 1,6-hexanediol diacrylate (KAYARAD HDDA, manufactured by Nippon Kayaku Co., Ltd.), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), Aronix TO-2349 (manufactured by Toagosei Co., Ltd.), NK Oligo UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), 8UH-1006, 8UH-1012 (manufactured by Taisei Fine Chemical Co., Ltd.), and Light Acrylate POB-A0 (manufactured by Kyoeisha Chemical Co., Ltd.).

[0179] Furthermore, it is also preferable to use, as the compound having an ethylenically unsaturated bond-containing group, a trifunctional (meth)acrylate compound such as trimethylolpropane tri(meth)acrylate, trimethylolpropane propylene oxide-modified tri(meth)acrylate, trimethylolpropane ethylene oxide-modified tri(meth)acrylate, isocyanuric acid ethylene oxide-modified tri(meth)acrylate, or pentaerythritol tri(meth)acrylate. Commercially available trifunctional (meth)acrylate compounds include Aronix M-309, M-310, M-321, M-350, M-360, M-313, M-315, M-306, M-305, M-303, M-452, and M-450 (manufactured by Toagosei Co., Ltd.), NK Ester A9300, A-GLY-9E, A-GLY-20E, A-TMM-3, A-TMM-3L, A-TMM-3LM-N, A-TMPT, and TMPT (manufactured by Shin-Nakamura Chemical Co., Ltd.), and KAYARAD GPO-303, TMPTA, THE-330, TPA-330, and PET-30 (manufactured by Nippon Kayaku Co., Ltd.).

[0180] The compound having an ethylenically unsaturated bond-containing group may also be a compound having an acid group. The use of a compound having an acid group can suppress the generation of development residues. Examples of the acid group include a carboxy group, a sulfo group, and a phosphate group, with a carboxy group being preferred. Commercially available polymerizable monomers having an acid group include Aronix M-305, M-510, M-520, and Aronix TO-2349 (manufactured by Toagosei Co., Ltd.). The acid value of the polymerizable monomer having an acid group is preferably 0.1 to 40 mgKOH / g, more preferably 5 to 30 mgKOH / g.

[0181] In a preferred embodiment, the compound having an ethylenically unsaturated bond-containing group is a compound having a caprolactone structure. Compounds having a caprolactone structure are commercially available, for example, as the KAYARAD DPCA series from Nippon Kayaku Co., Ltd., including DPCA-20, DPCA-30, DPCA-60, and DPCA-120.

[0182] The compound having an ethylenically unsaturated bond-containing group can also be a compound having an alkyleneoxy group. The compound having an alkyleneoxy group is preferably a compound having an ethyleneoxy group and / or a propyleneoxy group, more preferably a compound having an ethyleneoxy group, and even more preferably a tri- to hexafunctional (meth)acrylate compound having 4 to 20 ethyleneoxy groups. Commercially available compounds having an alkyleneoxy group include, for example, SR-494, a tetrafunctional (meth)acrylate having four ethyleneoxy groups manufactured by Sartomer, and KAYARAD TPA-330, a trifunctional (meth)acrylate having three isobutyleneoxy groups manufactured by Nippon Kayaku Co., Ltd.

[0183] The compound having an ethylenically unsaturated bond-containing group may also be a compound having a fluorene skeleton. Commercially available compounds having a fluorene skeleton include OGSOL EA-0200 and EA-0300 (manufactured by Osaka Gas Chemicals Co., Ltd., (meth)acrylate monomers having a fluorene skeleton).

[0184] It is also preferable to use a compound having an ethylenically unsaturated bond-containing group that is substantially free of environmentally restricted substances such as toluene. Commercially available products of such compounds include KAYARAD DPHA LT and KAYARAD DPEA-12 LT (manufactured by Nippon Kayaku Co., Ltd.).

[0185] Suitable compounds having an ethylenically unsaturated bond-containing group include urethane acrylates as described in JP-B-48-041708, JP-A-51-037193, JP-B-02-032293, and JP-B-02-016765, and urethane compounds having an ethylene oxide skeleton as described in JP-B-58-049860, JP-B-56-017654, JP-B-62-039417, and JP-B-62-039418. Also suitable are polymerizable monomers having an amino structure or a sulfide structure in the molecule as described in JP-A-63-277653, JP-A-63-260909, and JP-A-01-105238. In addition, commercially available polymerizable monomers such as UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600, T-600, AI-600, and LINC-202UA (manufactured by Kyoeisha Chemical Co., Ltd.) can also be used.

[0186] (Compounds having a cyclic ether group) Compounds having a cyclic ether group that can also be used as polymerizable monomers include compounds having an epoxy group (hereinafter also referred to as epoxy compounds) and compounds having an oxetane group (hereinafter also referred to as oxetane compounds). The epoxy compound is preferably a polyfunctional epoxy compound. That is, the epoxy compound is preferably a compound having two or more epoxy groups. The upper limit of the number of epoxy groups is preferably 20 or less, more preferably 10 or less. Furthermore, the oxetane compound is preferably a polyfunctional oxetane compound. That is, the oxetane compound is preferably a compound having two or more oxetane groups. The upper limit of the number of oxetane groups is preferably 20 or less, more preferably 10 or less.

[0187] Commercially available epoxy compounds include JER828, JER1007, JER157S70 (manufactured by Mitsubishi Chemical Corporation), JER157S65 (manufactured by Mitsubishi Chemical Holdings Corporation), and the like, as described in paragraph 0189 of JP 2011-221494 A. Other commercially available products include ADEKA RESIN EP-4000S, EP-4003S, EP-4010S, EP-4011S (all manufactured by ADEKA Corporation), NC-2000, NC-3000, NC-7300, XD-1000, EPPN-501, EPPN-502 (all manufactured by ADEKA Corporation), Denacol EX-611, EX-612, EX-614, EX-614B, EX-622, EX -512, EX-521, EX-411, EX-421, EX-313, EX-314, EX-321, EX-211, EX-212, EX-810, EX-811, EX- 850, EX-851, EX-821, EX-830, EX-832, EX-841, EX-911, EX-941, EX-920, EX-931, EX-212L, EX-2 14L, EX-216L, EX-321L, EX-850L, DLC-201, DLC-203, DLC-204, DLC-205, DLC-206, DLC-301, DLC-402, EX-111, EX-121, EX-141, EX-145, EX-146, EX-147, EX-171, EX-192 (all manufactured by Nagase Chemtec), YH-3 00, YH-301, YH-302, YH-315, YH-324, YH-325 (all manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd.), Celoxide 2021P, 2081, 2000, 3000, EHPE3150, Epolead GT400, Celvinarce B0134, B0177 (manufactured by Daicel Corporation), and TETRAD-X (manufactured by Mitsubishi Gas Chemical Company, Inc.).

[0188] Commercially available oxetane compounds that can be used include OXT-201, OXT-211, OXT-212, OXT-213, OXT-121, OXT-221, and OX-SQ TX-100 (all manufactured by Toagosei Co., Ltd.).

[0189] The content of the polymerizable monomer in the total solid content of the resin composition is preferably 0.1 to 40% by mass. The lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more. The upper limit is preferably 30% by mass or less, more preferably 20% by mass or less.

[0190] When a compound having an ethylenically unsaturated bond-containing group is used as the polymerizable monomer, the content of the compound having an ethylenically unsaturated bond-containing group as the polymerizable monomer is preferably 1 to 50 parts by mass relative to 100 parts by mass of the specific resin. The lower limit is preferably 3 parts by mass or more, more preferably 5 parts by mass or more. The upper limit is preferably 40 parts by mass or less, more preferably 30 parts by mass or less.

[0191] When a compound having a cyclic ether group is used as the polymerizable monomer, the content of the compound having a cyclic ether group as the polymerizable monomer is preferably 1 to 50 parts by mass relative to 100 parts by mass of the specific resin. The lower limit is preferably 3 parts by mass or more, and more preferably 5 parts by mass or more. The upper limit is preferably 40 parts by mass or less, and more preferably 30 parts by mass or less.

[0192] When a compound having an ethylenically unsaturated bond-containing group and a compound having a cyclic ether group are used as polymerizable monomers, the resin composition preferably contains 10 to 500 parts by mass of the compound having a cyclic ether group per 100 parts by mass of the compound having an ethylenically unsaturated bond-containing group. The lower limit is preferably 20 parts by mass or more, more preferably 30 parts by mass or more. The upper limit is preferably 400 parts by mass or less, more preferably 300 parts by mass or less. When the ratio of the two is within the above range, a film with better heat resistance (suppression of cracking and film shrinkage) can be formed.

[0193] <<Photopolymerization initiator>> The resin composition of the present invention preferably contains a photopolymerization initiator. The photopolymerization initiator is not particularly limited and can be appropriately selected from known photopolymerization initiators. For example, a compound having photosensitivity to light in the ultraviolet to visible region is preferred. The photopolymerization initiator is preferably a photoradical polymerization initiator.

[0194] Examples of the photopolymerization initiator include halogenated hydrocarbon derivatives (e.g., compounds having a triazine skeleton, compounds having an oxadiazole skeleton, etc.), acylphosphine compounds, biimidazole compounds, oxime compounds, organic peroxides, thio compounds, ketone compounds, aromatic onium salts, α-hydroxyketone compounds, α-aminoketone compounds, etc. From the viewpoint of exposure sensitivity, the photopolymerization initiator is preferably a trihalomethyltriazine compound, a benzyl dimethyl ketal compound, an α-hydroxyketone compound, an α-aminoketone compound, an acylphosphine compound, a phosphine oxide compound, a metallocene compound, an oxime compound, a biimidazole compound, an onium compound, a benzothiazole compound, a benzophenone compound, an acetophenone compound, a cyclopentadiene-benzene-iron complex, a halomethyloxadiazole compound, or a 3-aryl-substituted coumarin compound, more preferably a compound selected from an oxime compound, an α-hydroxyketone compound, an α-aminoketone compound, and an acylphosphine compound, and even more preferably an oxime compound. In addition, examples of the photopolymerization initiator include the compounds described in paragraphs 0065 to 0111 of JP-A No. 2014-130173, the compounds described in Japanese Patent No. 6301489, and the MATERIAL STAGE 37 to 60pp, vol. 19, No. 3, 2019, peroxide-based photopolymerization initiators described, photopolymerization initiators described in WO 2018 / 221177, photopolymerization initiators described in WO 2018 / 110179, photopolymerization initiators described in JP 2019-043864 A, photopolymerization initiators described in JP 2019-044030 A, peroxide-based initiators described in JP 2019-167313 A, aminoacetophenone-based initiators having an oxazolidine group described in JP 2020-055992 A, oxime-based photopolymerization initiators described in JP 2013-190459 A, polymers described in JP 2020-172619 A, and the like, the contents of which are incorporated herein by reference.

[0195] Examples of biimidazole compounds include 2,2-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(o-chlorophenyl)-4,4',5,5-tetrakis(3,4,5-trimethoxyphenyl)-1,2'-biimidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, and 2,2'-bis(o-chlorophenyl)-4,4,5,5'-tetraphenyl-1,2'-biimidazole. Commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, and Omnirad 127 (all manufactured by IGM Resins BV), Irgacure 184, Irgacure 1173, Irgacure 2959, and Irgacure 127 (all manufactured by BASF), and the like. Commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, and Omnirad 379EG (manufactured by IGM Resins BV), Irgacure 907, Irgacure 369, Irgacure 369E, and Irgacure 379EG (manufactured by BASF), and Api307 (1-(biphenyl-4-yl)-2-methyl-2-morpholinopropan-1-one) (manufactured by MFCI). Commercially available acylphosphine compounds include Omnirad 819 and Omnirad TPO (manufactured by IGM Resins BV), Irgacure 819, and Irgacure TPO (manufactured by BASF).

[0196] Examples of the oxime compound include compounds described in JP-A-2001-233842, compounds described in JP-A-2000-080068, compounds described in JP-A-2006-342166, compounds described in J.C.S. Perkin II (1979, pp. 1653-1660), compounds described in J.C.S. Perkin II (1979, pp. 156-162), compounds described in Journal of Photopolymer Science and Technology (1995, pp. 202-232) compounds described in, compounds described in JP 2000-066385 A, compounds described in JP-T-2004-534797 A, compounds described in JP-A-2006-342166 A, compounds described in JP-A-2017-019766 A, compounds described in Japanese Patent No. 6065596, compounds described in WO 2015 / 152153, compounds described in WO 2017 / 051680, compounds described in JP 2017-198865, compounds described in paragraphs 0025 to 0038 of WO 2017 / 164127, compounds described in WO 2013 / 167515, and the like. Specific examples of the oxime compound include 3-benzoyloxyiminobutan-2-one, 3-acetoxyiminobutan-2-one, 3-propionyloxyiminobutan-2-one, 2-acetoxyiminopentan-3-one, 2-acetoxyimino-1-phenylpropan-1-one, 2-benzoyloxyimino-1-phenylpropan-1-one, 3-(4-toluenesulfonyloxy)iminobutan-2-one, and 2-ethoxycarbonyloxyimino-1-phenylpropan-1-one. Commercially available products include Irgacure OXE01, Irgacure OXE02, Irgacure OXE03, and Irgacure OXE04 (all manufactured by BASF), TR-PBG-304 (manufactured by Changzhou Strong Electronic New Materials Co., Ltd.), and Adeka Optomer N-1919 (manufactured by ADEKA Corporation; photopolymerization initiator 2 described in JP 2012-014052 A). Furthermore, it is also preferable to use, as the oxime compound, a compound that is not colorable or a compound that is highly transparent and does not easily discolor.Commercially available products include ADEKA Arcles NCI-730, NCI-831, and NCI-930 (all manufactured by ADEKA Corporation).

[0197] An oxime compound having a fluorene ring can also be used as the photopolymerization initiator. Specific examples of the oxime compound having a fluorene ring include the compounds described in JP 2014-137466 A.

[0198] Alternatively, an oxime compound having a skeleton in which at least one benzene ring of a carbazole ring is replaced with a naphthalene ring can be used as the photopolymerization initiator. Specific examples of such an oxime compound include the compounds described in WO 2013 / 083505.

[0199] As the photopolymerization initiator, an oxime compound having a fluorine atom can also be used. Specific examples of the oxime compound having a fluorine atom include the compounds described in JP-A-2010-262028, compounds 24, 36 to 40 described in JP-A-2014-500852, and compound (C-3) described in JP-A-2013-164471.

[0200] An oxime compound having a carbazole skeleton to which a hydroxyl-containing substituent is bonded can also be used as the photopolymerization initiator. Examples of such a photopolymerization initiator include the compounds described in WO 2019 / 088055.

[0201] As the photopolymerization initiator, an oxime compound having a nitro group can be used. The oxime compound having a nitro group is preferably a dimer. Specific examples of the oxime compound having a nitro group include the compounds described in paragraphs 0031 to 0047 of JP 2013-114249 A, paragraphs 0008 to 0012, and 0070 to 0079 of JP 2014-137466 A, the compounds described in paragraphs 0007 to 0025 of Japanese Patent No. 4223071 A, and ADEKA ARCLES NCI-831 (manufactured by ADEKA Corporation).

[0202] An oxime compound having a benzofuran skeleton can also be used as the photopolymerization initiator. Specific examples include OE-01 to OE-75 described in WO 2015 / 036910.

[0203] An oxime compound having a carbazole skeleton to which a hydroxyl-containing substituent is bonded can also be used as the photopolymerization initiator. Examples of such a photopolymerization initiator include the compounds described in WO 2019 / 088055.

[0204] Specific examples of the oxime compound are shown below, but the present invention is not limited to these.

[0205] [ka] [ka] [ka]

[0206] The oxime compound is preferably a compound having a maximum absorption wavelength in the wavelength range of 350 to 500 nm, more preferably a compound having a maximum absorption wavelength in the wavelength range of 360 to 480 nm. Furthermore, from the viewpoint of sensitivity, the molar absorption coefficient of the oxime compound at a wavelength of 365 nm or 405 nm is preferably high, more preferably 1,000 to 300,000, even more preferably 2,000 to 300,000, and particularly preferably 5,000 to 200,000. The molar absorption coefficient of the compound can be measured using a known method. For example, it is preferably measured using a spectrophotometer (Varian Cary-5 spectrophotometer) at a concentration of 0.01 g / L using ethyl acetate.

[0207] As the photopolymerization initiator, a bifunctional, trifunctional or higher functional photoradical polymerization initiator may be used. By using such a photoradical polymerization initiator, two or more radicals are generated from one molecule of the photoradical polymerization initiator, resulting in good sensitivity. Furthermore, when a compound with an asymmetric structure is used, crystallinity is reduced, improving solubility in solvents and the like, making it less likely to precipitate over time, thereby improving the stability of the resin composition over time. Specific examples of bifunctional or trifunctional or higher functional photoradical polymerization initiators include dimers of oxime compounds described in JP-A-2010-527339, JP-A-2011-524436, WO-A-2015 / 004565, WO-A-2016-532675, paragraphs 0407 to 0412, and WO-A-2017 / 033680, paragraphs 0039 to 0055; Compound (E) and Compound (G) described in JP-A-2013-522445; Examples of the photoinitiator include Cmpd1 to 7 described in International Publication No. 2016 / 034963, the oxime ester photoinitiators described in paragraph 0007 of JP-T-2017-523465, the photoinitiators described in paragraphs 0020 to 0033 of JP-A-2017-167399, the photopolymerization initiator (A) described in paragraphs 0017 to 0026 of JP-A-2017-151342, and the oxime compounds described in Japanese Patent No. 6,469,669.

[0208] The content of the photopolymerization initiator in the total solid content of the resin composition is preferably 0.1 to 30% by mass. The lower limit is preferably 0.5% by mass or more, and more preferably 1% by mass or more. The upper limit is preferably 20% by mass or less, and more preferably 15% by mass or less. Only one type of photopolymerization initiator may be used, or two or more types may be used.

[0209] <<Silane coupling agents>> The resin composition of the present invention may contain a silane coupling agent. In this specification, the term "silane coupling agent" refers to a silane compound having a hydrolyzable group and other functional groups. The term "hydrolyzable group" refers to a substituent directly bonded to a silicon atom that can form a siloxane bond through at least one of a hydrolysis reaction and a condensation reaction. Examples of hydrolyzable groups include halogen atoms, alkoxy groups, and acyloxy groups, with alkoxy groups being preferred. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. Examples of functional groups other than the hydrolyzable group include vinyl groups, (meth)allyl groups, (meth)acryloyl groups, mercapto groups, epoxy groups, amino groups, ureido groups, sulfide groups, isocyanate groups, and phenyl groups, with amino groups, (meth)acryloyl groups, and epoxy groups being preferred. Specific examples of the silane coupling agent include the compounds described in paragraphs 0018 to 0036 of JP-A No. 2009-288703 and the compounds described in paragraphs 0056 to 0066 of JP-A No. 2009-242604, the contents of which are incorporated herein by reference.

[0210] The content of the silane coupling agent in the total solid content of the resin composition is preferably 0.1 to 5% by mass. The upper limit is preferably 3% by mass or less, more preferably 2% by mass or less. The lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more. Only one type of silane coupling agent may be used, or two or more types may be used.

[0211] <<Curing accelerator>> The resin composition of the present invention may further contain a curing accelerator for the purposes of accelerating the reaction of the resin and polymerizable monomers and lowering the curing temperature. Examples of the curing accelerator include methylol compounds (for example, compounds exemplified as crosslinking agents in paragraph 0246 of JP-A-2015-034963), amines, phosphonium salts, amidine salts, and amide compounds (for example, the curing agents described in paragraph 0186 of JP-A-2013-041165), base generators (for example, ionic compounds described in JP-A-2014-055114), cyanate compounds (for example, compounds described in paragraph 0071 of JP-A-2012-150180), alkoxysilane compounds (for example, alkoxysilane compounds having an epoxy group described in JP-A-2011-253054), and onium salt compounds (for example, compounds exemplified as acid generators in paragraph 0216 of JP-A-2015-034963, and compounds described in JP-A-2009-180949).

[0212] When the resin composition of the present invention contains a curing accelerator, the content of the curing accelerator is preferably 0.3 to 8.9 mass %, more preferably 0.8 to 6.4 mass %, based on the total solid content of the resin composition.

[0213] <<Polymerization inhibitor>> The resin composition of the present invention may contain a polymerization inhibitor. Examples of the polymerization inhibitor include hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, tert-butylcatechol, benzoquinone, 4,4'-thiobis(3-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-methyl-6-t-butylphenol), and N-nitrosophenylhydroxyamine salts (ammonium salts, cerous salts, etc.). Among these, p-methoxyphenol is preferred. The content of the polymerization inhibitor in the total solid content of the resin composition is preferably 0.0001 to 5 mass%.

[0214] <<Surfactants>> The resin composition of the present invention may contain a surfactant. Various surfactants such as fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and silicone-based surfactants can be used as the surfactant. The surfactant is preferably a fluorine-based surfactant or a silicone-based surfactant. Examples of the surfactant include those described in paragraphs 0238 to 0245 of WO 2015 / 166779, the contents of which are incorporated herein by reference.

[0215] The fluorine content in the fluorine-containing surfactant is preferably 3 to 40% by mass, more preferably 5 to 30% by mass, and particularly preferably 7 to 25% by mass. A fluorine-containing surfactant having a fluorine content within this range is effective in terms of uniformity of the thickness of the coating film and liquid saving, and also has good solubility in the resin composition.

[0216] Examples of fluorine-based surfactants include those described in paragraphs 0060 to 0064 of JP 2014-041318 A (corresponding to paragraphs 0060 to 0064 of WO 2014 / 017669 A) and those described in paragraphs 0117 to 0132 of JP 2011-132503 A, the contents of which are incorporated herein by reference. Commercially available fluorine-based surfactants include, for example, Megafac F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F-144, R-30, F-437, F-475, F-477, F-479, F-482, F-554, F-555-A, F-556, F-557, F-558, F-559, F-560, F-561, F-565, F-563, F-568, F-575, F-780, EXP, MFS-330, and R-01. , R-40, R-40-LM, R-41, R-41-LM, RS-43, R-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (all manufactured by DIC Corporation), Fluorard FC430, FC431, FC171 (all manufactured by Sumitomo 3M Limited), Surflon S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (all manufactured by AGC Inc.), PolyFox Examples include PF636, PF656, PF6320, PF6520, and PF7002 (all manufactured by OMNOVA), Ftergent 208G, 215M, 245F, 601AD, 601ADH2, 602A, 610FM, 710FL, 710FM, 710FS, and FTX-218 (all manufactured by NEOS Corporation).

[0217] It is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound as the fluorine-containing surfactant. For such a fluorine-containing surfactant, the description in JP 2016-216602 A can be referred to, the contents of which are incorporated herein by reference.

[0218] The fluorosurfactant may also be a block polymer. Examples include the compounds described in JP-A-2011-089090. The fluorosurfactant may also preferably be a fluorine-containing polymer compound containing a repeating unit derived from a (meth)acrylate compound having a fluorine atom and a repeating unit derived from a (meth)acrylate compound having two or more (preferably five or more) alkyleneoxy groups (preferably ethyleneoxy groups or propyleneoxy groups). The following compounds are also exemplified as fluorosurfactants usable in the present invention. [ka] The weight average molecular weight of the above compound is preferably 3000 to 50000, for example, 14000. In the above compound, % indicating the proportion of repeating units is mol %.

[0219] The fluorine-containing surfactant may also be a fluorine-containing polymer having an ethylenically unsaturated bond-containing group in its side chain. Specific examples include the compounds described in paragraphs 0050 to 0090 and 0289 to 0295 of JP 2010-164965 A, and Megafac RS-101, RS-102, RS-718K, and RS-72-K manufactured by DIC Corporation. The fluorine-containing surfactant may also be the compounds described in paragraphs 0015 to 0158 of JP 2015-117327 A.

[0220] In addition, it is also preferable from the viewpoint of environmental regulations to use the surfactants described in WO 2020 / 084854 as a substitute for surfactants having a perfluoroalkyl group having 6 or more carbon atoms.

[0221] It is also preferable to use a fluorine-containing imide salt compound represented by formula (fi-1) as a surfactant. [ka] In formula (fi-1), m represents 1 or 2, n represents an integer of 1 to 4, a represents 1 or 2, and X a+is a valent metal ion, primary ammonium ion, secondary ammonium ion, tertiary ammonium ion, quaternary ammonium ion or NH4 + Represents.

[0222] Nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane, and their ethoxylates and propoxylates (for example, glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, and sorbitan fatty acid. Examples of suitable surfactants include esters, Pluronic L10, L31, L61, L62, 10R5, 17R2, and 25R2 (manufactured by BASF), Tetronic 304, 701, 704, 901, 904, and 150R1 (manufactured by BASF), Solsperse 20000 (manufactured by Lubrizol Japan Co., Ltd.), NCW-101, NCW-1001, and NCW-1002 (manufactured by Fujifilm Wako Pure Chemical Industries Co., Ltd.), Paionin D-6112, D-6112-W, and D-6315 (manufactured by Takemoto Oil & Fat Co., Ltd.), Olfine E1010, and Surfynol 104, 400, and 440 (manufactured by Nissin Chemical Industry Co., Ltd.).

[0223] Examples of cationic surfactants include tetraalkylammonium salts, alkylamine salts, benzalkonium salts, alkylpyridium salts, imidazolium salts, etc. Specific examples include dihydroxyethylstearylamine, 2-heptadecenyl-hydroxyethylimidazoline, lauryldimethylbenzylammonium chloride, cetylpyridinium chloride, and stearamidomethylpyridium chloride.

[0224] Examples of anionic surfactants include dodecylbenzenesulfonic acid, sodium dodecylbenzenesulfonate, sodium lauryl sulfate, sodium alkyldiphenyletherdisulfonate, sodium alkylnaphthalenesulfonate, sodium dialkylsulfosuccinate, sodium stearate, potassium oleate, sodium dioctyl sulfosuccinate, sodium polyoxyethylene alkyl ether sulfate, sodium polyoxyethylene alkyl ether sulfate, sodium polyoxyethylene alkylphenyl ether sulfate, sodium dialkylsulfosuccinate, sodium stearate, sodium oleate, and sodium t-octylphenoxyethoxypolyethoxyethyl sulfate.

[0225] Silicone surfactants include DC3PA, SH7PA, DC11PA, SH21PA, SH28PA, SH29PA, SH30PA, SH8400, SH 8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, and SF 8419. OIL (all manufactured by Dow Toray Industries, Inc.), TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials), KP-341, KF-6000, KF-6001, KF-6002, KF-6003 (all manufactured by Shin-Etsu Chemical Co., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-333, BYK-3760, BYK-UV3510 (all manufactured by BYK-Chemie).

[0226] Furthermore, the silicone surfactant may also be a compound having the following structure: [ka]

[0227] The content of the surfactant in the total solid content of the resin composition is preferably 0.001% by mass to 5.0% by mass, more preferably 0.005% by mass to 3.0% by mass. The surfactant may be one type or two or more types. When two or more types are used, the total amount preferably falls within the above range.

[0228] <<Ultraviolet absorber>> The resin composition of the present invention may contain an ultraviolet absorber. Examples of ultraviolet absorbers that can be used include conjugated diene compounds, aminodiene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyltriazine compounds, indole compounds, and triazine compounds. For details, see paragraphs

[0052] to

[0072] of JP 2012-208374 A, paragraphs

[0317] to

[0334] of JP 2013-068814 A, and paragraphs

[0061] to

[0080] of JP 2016-162946 A, the contents of which are incorporated herein by reference. Commercially available ultraviolet absorbers include, for example, UV-503 (manufactured by Daito Chemical Co., Ltd.), the Tinuvin series and Uvinul series manufactured by BASF, and the Sumisorb series manufactured by Sumika Chemtex Co., Ltd. Benzotriazole compounds include the MYUA series manufactured by Miyoshi Oil & Fats (The Chemical Daily, February 1, 2016). The ultraviolet absorber may also be a compound described in paragraphs 0049-0059 of Japanese Patent No. 6268967, a compound described in paragraphs 0059-0076 of International Publication No. 2016 / 181987, or a thioaryl group-substituted benzotriazole ultraviolet absorber described in International Publication No. 2020 / 137819. The content of the ultraviolet absorber in the total solid content of the resin composition is preferably 0.01 to 10% by mass, more preferably 0.01 to 5% by mass. Only one type of ultraviolet absorber may be used, or two or more types may be used. When two or more types are used, the total amount is preferably within the above range.

[0229] <<Antioxidants>> The resin composition of the present invention may contain an antioxidant. Examples of antioxidants include phenolic compounds, phosphite ester compounds, and thioether compounds. Any phenolic compound known as a phenolic antioxidant can be used as the phenolic compound. A preferred phenolic compound is a hindered phenolic compound. A compound having a substituent at the ortho position adjacent to the phenolic hydroxy group is preferred. The substituent is preferably a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms. A compound having a phenolic group and a phosphite ester group in the same molecule is also preferred. Phosphorus-based antioxidants can also be suitably used as the antioxidant. The compounds described in Korean Patent Publication No. 10-2019-0059371 can also be used as the antioxidant. The content of the antioxidant in the total solid content of the resin composition is preferably 0.01 to 20% by mass, more preferably 0.3 to 15% by mass. Only one antioxidant or two or more antioxidants may be used. When two or more antioxidants are used, the total amount is preferably within the above range.

[0230] <<Other ingredients>> The resin composition of the present invention may optionally contain a sensitizer, filler, thermosetting accelerator, plasticizer, and other auxiliary agents (e.g., conductive particles, antifoaming agents, flame retardants, leveling agents, release accelerators, fragrances, surface tension modifiers, chain transfer agents, etc.). By appropriately incorporating these components, film properties and other characteristics can be adjusted. For details of these components, please refer to, for example, paragraphs 0183 and after of JP 2012-003225 A (corresponding to paragraph 0237 of U.S. Patent Application Publication No. 2013 / 0034812), and paragraphs 0101-0104 and 0107-0109 of JP 2008-250074 A, the contents of which are incorporated herein by reference. The resin composition may also optionally contain a latent antioxidant. Examples of latent antioxidants include compounds in which the moiety functioning as an antioxidant is protected with a protecting group, and the compound functions as an antioxidant when heated at 100 to 250°C or at 80 to 200°C in the presence of an acid / base catalyst, resulting in the elimination of the protecting group. Examples of latent antioxidants include the compounds described in WO 2014 / 021023, WO 2017 / 030005, and JP 2017-008219 A. Commercially available products include ADEKA ARCLES GPA-5001 (manufactured by ADEKA Corporation).

[0231] The resin composition of the present invention may contain a metal oxide to adjust the refractive index of the resulting film. Examples of metal oxides include TiO2, ZrO2, Al2O3, and SiO2. The primary particle size of the metal oxide is preferably 1 to 100 nm, more preferably 3 to 70 nm, and even more preferably 5 to 50 nm. The metal oxide may have a core-shell structure. In this case, the core may be hollow.

[0232] The resin composition of the present invention may contain a light resistance improver. Examples of the light resistance improver include the compounds described in paragraphs 0036 to 0037 of JP-A-2017-198787, the compounds described in paragraphs 0029 to 0034 of JP-A-2017-146350, the compounds described in paragraphs 0036 to 0037 and 0049 to 0052 of JP-A-2017-129774, the compounds described in paragraphs 0031 to 0034 and 0058 to 0059 of JP-A-2017-129674, the compounds described in paragraphs 0036 to 0037 and 0051 to 0054 of JP-A-2017-122803, the compounds described in paragraphs 0025 to 0039 of WO 2017 / 164127, and the compounds described in paragraphs 0026 to 0039 of JP-A-2017-186546. JP-A-2015-025116, paragraphs 0019 to 0041, JP-A-2012-145604, paragraphs 0101 to 0125, JP-A-2012-103475, paragraphs 0018 to 0021, JP-A-2011-257591, paragraphs 0015 to 0018, JP-A-2011-191483, paragraphs 0017 to 0021, JP-A-2011-145668, paragraphs 0108 to 0116, JP-A-2011-253174, paragraphs 0103 to 0153, and the like.

[0233] The resin composition of the present invention preferably contains 100 ppm or less, more preferably 50 ppm or less, even more preferably 10 ppm or less, and particularly preferably substantially no free metal that is not bonded or coordinated to a pigment, etc. This embodiment is expected to have various effects, such as stabilizing pigment dispersibility (preventing aggregation), improving spectral properties due to improved dispersibility, stabilizing curable components, preventing fluctuations in conductivity due to elution of metal atoms and metal ions, and improving display properties. In addition, the effects described in JP 2012-153796 A, JP 2000-345085 A, JP 2005-200560 A, JP 08-043620 A, JP 2004-145078 A, JP 2014-119487 A, JP 2010-083997 A, JP 2017-090930 A, JP 2018-025612 A, JP 2018-025797 A, JP 2017-155228 A, JP 2018-036521 A, etc. can also be obtained. Examples of the free metals include Na, K, Ca, Sc, Ti, Mn, Cu, Zn, Fe, Cr, Co, Mg, Al, Sn, Zr, Ga, Ge, Ag, Au, Pt, Cs, Ni, Cd, Pb, and Bi. Furthermore, the resin composition of the present invention preferably contains 100 ppm or less of free halogens that are not bonded or coordinated to pigments or the like, more preferably 50 ppm or less, even more preferably 10 ppm or less, and particularly preferably substantially free. Examples of halogens include F, Cl, Br, I, and anions thereof. Methods for reducing the amount of free metals and halogens in the resin composition include washing with ion-exchanged water, filtration, ultrafiltration, and purification using ion-exchange resins.

[0234] From the viewpoint of environmental regulations, the use of perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts may be restricted. When the content of the above-mentioned compounds in the resin composition of the present invention is reduced, the content of perfluoroalkyl sulfonic acid (particularly perfluoroalkyl sulfonic acid having a perfluoroalkyl group with 6 to 8 carbon atoms) and its salts, and perfluoroalkyl carboxylic acid (particularly perfluoroalkyl carboxylic acid having a perfluoroalkyl group with 6 to 8 carbon atoms) and its salts is preferably in the range of 0.01 ppb to 1,000 ppb, more preferably in the range of 0.05 ppb to 500 ppb, and even more preferably in the range of 0.1 ppb to 300 ppb, based on the total solid content of the resin composition. The resin composition of the present invention may be substantially free of perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts. For example, by using a compound that can replace perfluoroalkyl sulfonic acid and its salts, and a compound that can replace perfluoroalkyl carboxylic acid and its salts, a resin composition that is substantially free of perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts, may be selected. Examples of compounds that can replace regulated compounds include compounds that are exempt from regulation due to differences in the number of carbon atoms in the perfluoroalkyl group. However, the above content does not preclude the use of perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts. The resin composition of the present invention may contain perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts, within the maximum allowable range.

[0235] It is also preferable that the resin composition of the present invention is substantially free of terephthalic acid esters. Here, "substantially free" means that the content of terephthalic acid esters in the total amount of the resin composition is 1000 ppb by mass or less, more preferably 100 ppb by mass or less, and particularly preferably zero.

[0236] <Containment Container> The container for storing the resin composition is not particularly limited, and known containers can be used. Furthermore, in order to prevent impurities from being mixed into the raw materials or the resin composition, it is also preferable to use a multi-layer bottle whose inner wall is made of six types of six-layer resin or a bottle with a seven-layer structure made of six types of resin. Examples of such containers include the container described in JP 2015-123351 A. Furthermore, it is also preferable to make the inner wall of the container out of glass or stainless steel in order to prevent metal elution from the inner wall, improve the storage stability of the resin composition, and prevent deterioration of the components.

[0237] <Method for preparing resin composition> The resin composition of the present invention can be prepared by mixing the above-mentioned components. When preparing the resin composition, all components may be simultaneously dissolved and / or dispersed in an organic solvent to prepare the resin composition, or, if necessary, each component may be prepared as two or more appropriate solutions or dispersions, which are mixed at the time of use (application) to prepare the resin composition.

[0238] Furthermore, the preparation of the resin composition preferably includes a process for dispersing the pigment. In the process for dispersing the pigment, mechanical forces used to disperse the pigment include compression, squeezing, impact, shear, and cavitation. Specific examples of these processes include a bead mill, a sand mill, a roll mill, a ball mill, a paint shaker, a microfluidizer, a high-speed impeller, a sand grinder, a flow jet mixer, high-pressure wet atomization, and ultrasonic dispersion. When grinding the pigment in a sand mill (bead mill), it is preferable to use small-diameter beads or increase the bead packing ratio to perform the process under conditions that increase grinding efficiency. Furthermore, it is preferable to remove coarse particles after the grinding process by filtration, centrifugation, or the like. In addition, the process and disperser for dispersing pigments can be suitably selected from the processes and dispersers described in "Dispersion Technology Encyclopedia," published by Joho Kiko Co., Ltd., July 15, 2005, and "Dispersion Technology and Industrial Applications Focused on Suspension (Solid / Liquid Dispersion Systems) - Comprehensive Data Collection," published by the Management Development Center Publishing Department, October 10, 1978, and paragraph 0022 of JP 2015-157893 A. In addition, the process for dispersing pigments can be carried out by a salt milling process to refine the particles. The materials, equipment, and processing conditions used in the salt milling process can be found, for example, in JP 2015-194521 A and JP 2012-046629 A.

[0239] When preparing a resin composition, it is preferable to filter the resin composition for the purpose of removing foreign matter and reducing defects. Any filter that has been conventionally used for filtration or the like can be used without any particular limitation. Examples of such filters include filters made of materials such as fluororesins such as polytetrafluoroethylene (PTFE) and polyvinylidene fluoride (PVDF), polyamide resins such as nylon (e.g., nylon-6 and nylon-6,6), and polyolefin resins (including high-density and ultra-high-molecular-weight polyolefin resins) such as polyethylene and polypropylene (PP). Among these materials, polypropylene (including high-density polypropylene) and nylon are preferred.

[0240] The pore size of the filter is preferably 0.01 to 7.0 μm, more preferably 0.01 to 3.0 μm, and even more preferably 0.05 to 0.5 μm. If the pore size of the filter is within the above range, fine foreign matter can be removed more reliably. The nominal value of the filter manufacturer can be referred to for the pore size value of the filter. Various filters provided by Nippon Pall Corporation (DFA4201NXEY, DFA4201NAEY, DFA4201J006P, etc.), Advantech Toyo Co., Ltd., Nippon Integris Co., Ltd. (formerly Nippon Microlith Co., Ltd.), Kitz Microfilter Co., Ltd., etc. can be used.

[0241] It is also preferable to use a fibrous filter medium as the filter. Examples of fibrous filter medium include polypropylene fiber, nylon fiber, and glass fiber. Commercially available products include the SBP type series (SBP008, etc.), TPR type series (TPR002, TPR005, etc.), and SHPX type series (SHPX003, etc.) manufactured by ROKI TECHNO CORPORATION.

[0242] When using filters, different filters (for example, a first filter and a second filter) may be combined. In this case, filtration with each filter may be performed only once or two or more times. Filters with different pore sizes within the above-mentioned range may be combined. Filtration with the first filter may be performed on the dispersion alone, and filtration with the second filter may be performed after mixing with other components. An appropriate filter can be selected depending on the hydrophilicity or hydrophobicity of the resin composition.

[0243] <Resin manufacturing method> Next, a method for producing the resin of the present invention will be described. The method for producing the resin of the present invention includes a step of reacting a resin having a primary amino group or a secondary amino group with a macromonomer having an acid anhydride structure at its terminal. Examples of the resin having a primary amino group or a secondary amino group include the amine polymer M described in the section on specific resins. Examples of the macromonomer having an acid anhydride structure at its terminal include the macromonomer AH described in the section on specific resins.

[0244] By reacting a resin having a primary or secondary amino group with a macromonomer having an acid anhydride structure at its terminal, the amino group of the resin having a primary or secondary amino group (amine polymer M) undergoes an addition ring-opening reaction with the acid anhydride group of the macromonomer having an acid anhydride structure at its terminal (macromonomer AH), and a carboxyl group is formed along with an amide bond as the acid anhydride group opens.

[0245] When the amine polymer M and the macromonomer AH are mixed to react with each other, the ratio of the acid anhydride group of the macromonomer AH to 1 mole of the amino group of the amine polymer M is preferably 0.05 to 1 mole, more preferably 0.1 to 1 mole, and even more preferably 0.2 to 1 mole.

[0246] In the method for producing a resin of the present invention, a cyclic acid anhydride (succinic anhydride, glutaric anhydride, maleic anhydride, phthalic anhydride, itaconic anhydride, cis-4-cyclohexene-1,2-dicarboxylic anhydride, (±)-trans-1,2-cyclohexanedicarboxylic anhydride, cis-1,2-cyclohexanedicarboxylic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, exo-3,6-epoxy-1,2,3,6-tetrahydrophthalic anhydride, 4-methylcyclohexane-1,2-dicarboxylic anhydride, trimellitic anhydride, At least one compound selected from the group consisting of phthalic anhydride, 2,3-naphthalenedicarboxylic anhydride, tetrachlorophthalic anhydride, tetrabromophthalic anhydride, 2-sulfobenzoic anhydride, tetrabromo-o-sulfobenzoic anhydride, etc., acid chloride compounds having an ethylenically unsaturated bond-containing group, acid chloride compounds having an epoxy group, acid chloride compounds having an oxetanyl group, and compounds having a dye moiety and an ethylenically unsaturated bond-containing group may be added during or after the reaction of the amine polymer M with the macromonomer AH. This allows the amino groups of the amine polymer M to react with the compound, thereby adding functional groups such as acid groups, ethylenically unsaturated bond-containing groups, epoxy groups, oxetanyl groups, and groups having a dye moiety to the resin.

[0247] <Membrane> The film of the present invention is a film obtained from the resin composition of the present invention described above. The film of the present invention can be used for optical filters such as color filters, near-infrared transmission filters, and near-infrared cut filters. The film of the present invention can also be used for black matrices, light-shielding films, etc.

[0248] The thickness of the film of the present invention can be adjusted appropriately depending on the purpose. For example, the thickness is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less. The lower limit of the thickness is preferably 0.1 μm or more, more preferably 0.2 μm or more, and even more preferably 0.3 μm or more.

[0249] When the film of the present invention is used as a color filter, the film of the present invention preferably has a green, red, blue, cyan, magenta, or yellow hue. The film of the present invention can also be preferably used as a color pixel of a color filter. Examples of the color pixel include a red pixel, a green pixel, a blue pixel, a magenta pixel, a cyan pixel, and a yellow pixel.

[0250] When the film of the present invention is used as a near-infrared cut filter, the maximum absorption wavelength of the film of the present invention is preferably in the wavelength range of 700 to 1800 nm, more preferably in the wavelength range of 700 to 1300 nm, and even more preferably in the wavelength range of 700 to 1100 nm. The transmittance of the film over the entire wavelength range of 400 to 650 nm is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. The transmittance of the film at at least one point in the wavelength range of 700 to 1800 nm is preferably 20% or less. The ratio of absorbance Amax at the maximum absorption wavelength to absorbance A550 at a wavelength of 550 nm, i.e., absorbance Amax / absorbance A550, is preferably 20 to 500, more preferably 50 to 500, even more preferably 70 to 450, and particularly preferably 100 to 400.

[0251] When the film of the present invention is used as a near-infrared transmission filter, the film of the present invention preferably has, for example, any one of the following spectral characteristics (i1) to (i5). (i1): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 640 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 800 to 1500 nm. A film with such spectral characteristics can block light in the wavelength range of 400 to 640 nm and transmit light with a wavelength of over 750 nm. (i2): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 750 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 900 to 1500 nm. A film with such spectral characteristics can block light in the wavelength range of 400 to 750 nm and transmit light with a wavelength of over 850 nm. (i3): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 830 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1000 to 1500 nm. A film with such spectral characteristics can block light in the wavelength range of 400 to 830 nm and transmit light with a wavelength of over 950 nm. (i4): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 950 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100 to 1500 nm. A film with such spectral characteristics can block light in the wavelength range of 400 to 950 nm and transmit light with a wavelength of over 1050 nm. (i5): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 1050 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1200 to 1500 nm. A film with such spectral characteristics can block light in the wavelength range of 400 to 1050 nm and transmit light with a wavelength of over 1150 nm.

[0252] The thickness of the film of the present invention after heat treatment at 300°C for 5 hours in a nitrogen atmosphere is preferably 70% or more, more preferably 80% or more, even more preferably 90% or more, even more preferably 95% or more, and particularly preferably 99% or more of the thickness of the film before heat treatment. Furthermore, the thickness of the film after heat treatment at 350°C for 5 hours in a nitrogen atmosphere is preferably 70% or more of the thickness of the film before heat treatment, more preferably 80% or more, even more preferably 90% or more, even more preferably 95% or more, and particularly preferably 99% or more. Furthermore, the thickness of the film after heat treatment at 400°C for 5 hours in a nitrogen atmosphere is preferably 70% or more of the thickness of the film before heat treatment, more preferably 80% or more, even more preferably 90% or more, even more preferably 95% or more, and particularly preferably 99% or more.

[0253] <Membrane manufacturing method> The film of the present invention can be produced by applying the above-mentioned resin composition of the present invention to a support. The film production method of the present invention preferably further includes a step of forming a pattern (pixel). Methods for forming the pattern (pixel) include photolithography and dry etching, and photolithography is preferred.

[0254] (Photolithography method) First, a case where a film is produced by forming a pattern by photolithography will be described. Pattern formation by photolithography preferably includes the steps of forming a resin composition layer on a support using the resin composition of the present invention, exposing the resin composition layer to light in a pattern, and developing and removing the unexposed portions of the resin composition layer to form a pattern (pixels). If necessary, a step of baking the resin composition layer (pre-baking step) and a step of baking the developed pattern (pixels) (post-baking step) may be provided.

[0255] In the step of forming a resin composition layer, a resin composition layer is formed on a support using the resin composition of the present invention. The support is not particularly limited and can be appropriately selected depending on the application. Examples include a glass substrate and a silicon substrate, with a silicon substrate being preferred. The silicon substrate may also be formed with a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS), a transparent conductive film, or the like. A black matrix is ​​sometimes formed on the silicon substrate to isolate each pixel. The silicon substrate may also be provided with an underlayer to improve adhesion to the upper layer, prevent material diffusion, or flatten the substrate surface. The surface contact angle of the underlayer is preferably 20 to 70° when measured with diiodomethane, and preferably 30 to 80° when measured with water. A surface contact angle of the underlayer within the above range ensures good wettability of the resin composition. The surface contact angle of the underlayer can be adjusted, for example, by adding a surfactant.

[0256] The resin composition can be applied by any known method, including, for example, a dropping method (drop casting), a slit coating method, a spray method, a roll coating method, a spin coating method, a casting method, a slit-and-spin method, a pre-wetting method (such as the method described in JP-A-2009-145395), various printing methods such as ejection printing (e.g., inkjet printing (e.g., on-demand printing, piezo printing, thermal printing) and nozzle jet printing), flexographic printing, screen printing, gravure printing, reverse offset printing, and metal mask printing, a transfer method using a mold, and a nanoimprint method. The inkjet application method is not particularly limited, and examples include the method described in "Expanding and Usable Inkjet - Infinite Possibilities Seen in Patents -," published February 2005 by Sumibe Techno Research (particularly pages 115 to 133), and the methods described in JP 2003-262716 A, JP 2003-185831 A, JP 2003-261827 A, JP 2012-126830 A, and JP 2006-169325 A. Furthermore, the resin composition can also be applied using the methods described in WO 2017 / 030174 and WO 2017 / 018419 A, the contents of which are incorporated herein by reference.

[0257] The resin composition layer formed on the support may be dried (prebaked). When a film is produced by a low-temperature process, prebaking may not be performed. When prebaking is performed, the prebaking temperature is preferably 150°C or lower, more preferably 120°C or lower, and even more preferably 110°C or lower. The lower limit can be, for example, 50°C or higher, or can also be 80°C or higher. The prebaking time is preferably 10 to 300 seconds, more preferably 40 to 250 seconds, and even more preferably 80 to 220 seconds. Prebaking can be performed using a hot plate, an oven, or the like.

[0258] Next, the resin composition layer is exposed to light in a pattern (exposure step). For example, the resin composition layer can be exposed to light in a pattern by using a stepper exposure machine, a scanner exposure machine, or the like, through a mask having a predetermined mask pattern. This allows the exposed portions to be cured.

[0259] Examples of radiation (light) that can be used for exposure include g-rays and i-rays. Light with a wavelength of 300 nm or less (preferably light with a wavelength of 180 to 300 nm) can also be used. Examples of light with a wavelength of 300 nm or less include KrF rays (wavelength 248 nm) and ArF rays (wavelength 193 nm), with KrF rays (wavelength 248 nm) being preferred. Long-wave light sources with wavelengths of 300 nm or more can also be used.

[0260] Furthermore, during exposure, light may be irradiated continuously or in pulses (pulse exposure). Pulse exposure is an exposure method in which light irradiation and pauses are repeated in short cycles (for example, milliseconds or less). In the case of pulse exposure, the pulse width is preferably 100 nanoseconds (ns) or less, more preferably 50 nanoseconds or less, and even more preferably 30 nanoseconds or less. There is no particular limitation on the lower limit of the pulse width, but it can be 1 femtosecond (fs) or more, and can also be 10 femtoseconds or more. The frequency is preferably 1 kHz or more, more preferably 2 kHz or more, and even more preferably 4 kHz or more. The upper limit of the frequency is preferably 50 kHz or less, more preferably 20 kHz or less, and even more preferably 10 kHz or less. The maximum instantaneous irradiance is 50,000,000 W / m 2 Preferably, it is 100,000,000 W / m or more. 2 More preferably, it is 200,000,000 W / m or more. 2 It is more preferable that the upper limit of the maximum instantaneous illuminance is 1,000,000,000 W / m 2 Preferably, it is 800,000,000 W / m or less. 2 More preferably, it is 500,000,000 W / m or less.2 It is more preferable that the pulse width is equal to or less than 1 / 2 s. The pulse width refers to the time during which light is irradiated in a pulse period. The frequency refers to the number of pulse periods per second. The maximum instantaneous irradiance refers to the average irradiance during the time during which light is irradiated in a pulse period. The pulse period refers to the period during which light irradiation and pauses occur in pulse exposure.

[0261] The irradiation amount (exposure amount) is, for example, 0.03 to 2.5 J / cm 2 is preferable, and 0.05 to 1.0 J / cm 2 The oxygen concentration during exposure can be appropriately selected. In addition to exposure in the atmosphere, exposure may be performed in a low-oxygen atmosphere with an oxygen concentration of 19% by volume or less (e.g., 15% by volume, 5% by volume, or substantially oxygen-free), or in a high-oxygen atmosphere with an oxygen concentration of more than 21% by volume (e.g., 22% by volume, 30% by volume, or 50% by volume). The exposure illuminance can be appropriately set, and is usually 1000 W / m 2 ~100,000W / m 2 (e.g., 5000W / m 2 , 15000W / m 2 , or 35,000 W / m 2 The oxygen concentration and exposure illuminance may be appropriately combined. For example, an oxygen concentration of 10% by volume and an illuminance of 10,000 W / m 2 , oxygen concentration 35% by volume, illuminance 20000W / m 2 etc.

[0262] Next, the unexposed portions of the resin composition layer are developed and removed to form a pattern (pixels). The unexposed portions of the resin composition layer can be developed and removed using a developer. As a result, the unexposed portions of the resin composition layer in the exposure step are dissolved into the developer, leaving only the photocured portions. The temperature of the developer is preferably, for example, 20 to 30°C. The development time is preferably 20 to 180 seconds. In addition, to improve residue removal, the process of shaking off the developer every 60 seconds and then supplying fresh developer may be repeated several times.

[0263] Examples of the developer include organic solvents and alkaline developers, with alkaline developers being preferred. The alkaline developer is preferably an alkaline aqueous solution (alkaline developer) prepared by diluting an alkaline agent with pure water. Examples of the alkaline agent include organic alkaline compounds such as ammonia, ethylamine, diethylamine, dimethylethanolamine, diglycolamine, diethanolamine, hydroxyamine, ethylenediamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, ethyltrimethylammonium hydroxide, benzyltrimethylammonium hydroxide, dimethylbis(2-hydroxyethyl)ammonium hydroxide, choline, pyrrole, piperidine, and 1,8-diazabicyclo[5.4.0]-7-undecene, as well as inorganic alkaline compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, sodium silicate, and sodium metasilicate. Alkaline agents with high molecular weights are preferred from an environmental and safety perspective. The concentration of the alkaline agent in the alkaline aqueous solution is preferably 0.001 to 10% by mass, more preferably 0.01 to 1% by mass. The developer may further contain a surfactant. Examples of the surfactant include those described above, with nonionic surfactants being preferred. The developer may be prepared as a concentrated solution and then diluted to the required concentration for use, for ease of transportation and storage. The dilution ratio is not particularly limited, but can be set, for example, in the range of 1.5 to 100 times. It is also preferable to wash (rinse) the developed layer with pure water. Rinsing is preferably performed by supplying a rinse solution to the developed resin composition layer while rotating the support on which the developed resin composition layer is formed. It is also preferable to perform this by moving a nozzle ejecting the rinse solution from the center of the support to the periphery of the support. In this case, the nozzle may be moved gradually slower as it moves from the center to the periphery of the support. Rinsing in this manner can suppress in-plane variations in rinsing. The same effect can also be obtained by gradually decreasing the rotation speed of the support while moving the nozzle from the center to the periphery of the support.

[0264] After development and drying, it is preferable to perform additional exposure treatment or heating treatment (post-baking). The additional exposure treatment or post-baking is a post-development curing treatment to ensure complete curing. The heating temperature in post-baking is, for example, preferably 100 to 240°C, more preferably 200 to 240°C. The heating temperature in post-baking can also be 240 to 400°C, 250 to 350°C, or 300 to 350°C. The heating time in post-baking is, for example, preferably 5 minutes to 5 hours, more preferably 1 to 4 hours, and even more preferably 2 to 4 hours. Post-baking can be performed continuously or batchwise using a heating means such as a hot plate, a convection oven (hot air circulation dryer), or a high-frequency heater to meet the above conditions for the developed film. When additional exposure treatment is performed, the light used for exposure is preferably light with a wavelength of 400 nm or less. The additional exposure process may be performed by the method described in Korean Patent Publication No. 10-2017-0122130.

[0265] (Dry etching method) Pattern formation by dry etching preferably includes the steps of forming a resin composition layer on a support using the resin composition of the present invention and curing the entire resin composition layer to form a cured layer; forming a photoresist layer on the cured layer; exposing the photoresist layer to light in a pattern and developing it to form a resist pattern; and dry etching the cured layer using an etching gas as a mask. In forming the photoresist layer, it is preferable to further perform a pre-baking treatment. In particular, the photoresist layer formation process preferably includes a post-exposure heat treatment and a post-development heat treatment (post-baking treatment). For details on pattern formation by dry etching, please refer to the description in paragraphs 0010 to 0067 of JP 2013-064993 A, the contents of which are incorporated herein by reference.

[0266] <Optical filters> The optical filter of the present invention has the above-described film of the present invention. The types of optical filters include color filters, near-infrared transmission filters, and near-infrared cut filters, with color filters being preferred. The color filter preferably has the film of the present invention as a colored pixel of the color filter. The optical filter of the present invention can be used in solid-state imaging devices such as CCDs (charge-coupled devices) and CMOSs ​​(complementary metal-oxide semiconductors), image display devices, and the like.

[0267] The thickness of the film of the present invention in the optical filter can be adjusted appropriately depending on the purpose. The thickness is preferably 5 μm or less, more preferably 1 μm or less, and even more preferably 0.6 μm or less. The lower limit of the thickness is preferably 0.1 μm or more, more preferably 0.2 μm or more, and even more preferably 0.3 μm or more.

[0268] The width of the pixels included in the optical filter is preferably 0.4 to 10.0 μm. The lower limit is preferably 0.4 μm or more, more preferably 0.5 μm or more, and even more preferably 0.6 μm or more. The upper limit is preferably 5.0 μm or less, more preferably 2.0 μm or less, even more preferably 1.0 μm or less, and even more preferably 0.8 μm or less. The Young's modulus of the pixels is preferably 0.5 to 20 GPa, and more preferably 2.5 to 15 GPa.

[0269] It is preferable that each pixel included in the optical filter has high flatness. Specifically, the surface roughness Ra of the pixel is preferably 100 nm or less, more preferably 40 nm or less, and even more preferably 15 nm or less. There is no specified lower limit, but it is preferably 0.1 nm or more, for example. The surface roughness of the pixel can be measured using, for example, an AFM (atomic force microscope) Dimension3100 manufactured by Veeco. Furthermore, the contact angle of water on the pixel can be set to an appropriate preferred value, but is typically in the range of 50 to 110°. The contact angle can be measured using, for example, a contact angle meter CV-DT·A (manufactured by Kyowa Interface Science Co., Ltd.). It is also preferable that the volume resistance of the pixel is high. Specifically, the volume resistance of the pixel is 10 9 It is preferable that the resistance is Ω·cm or more, and 10 11 It is more preferable that the resistivity is Ω·cm or more. There is no upper limit, but for example, 10 14 It is preferably Ω·cm or less. The volume resistance of the pixel can be measured using an Ultra High Resistance Meter 5410 (manufactured by Advantest Corporation).

[0270] In the optical filter, a protective layer may be provided on the surface of the film of the present invention. By providing a protective layer, various functions can be imparted, such as oxygen blocking, low reflectivity, hydrophilicity / hydrophobicity, and blocking of light of specific wavelengths (ultraviolet rays, near-infrared rays, etc.). The thickness of the protective layer is preferably 0.01 to 10 μm, more preferably 0.1 to 5 μm. Methods for forming the protective layer include a method of applying a resin composition for forming a protective layer dissolved in an organic solvent, a chemical vapor deposition method, and a method of attaching a molded resin with an adhesive. Components constituting the protective layer include (meth)acrylic resins, enethiol resins, polycarbonate resins, polyether resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyphenylene resins, polyarylene ether phosphine oxide resins, polyimide resins, polyamideimide resins, polyolefin resins, cyclic olefin resins, polyester resins, styrene resins, polyol resins, polyvinylidene chloride resins, melamine resins, urethane resins, aramid resins, polyamide resins, alkyd resins, epoxy resins, modified silicone resins, fluororesins, polycarbonate resins, polyacrylonitrile resins, cellulose resins, Si, C, W, Al2O3, Mo, SiO2, and Si2N4, and may contain two or more of these components. For example, in the case of a protective layer intended to block oxygen, the protective layer preferably contains a polyol resin, SiO2, and Si2N4. Furthermore, in the case of a protective layer intended to reduce reflectivity, the protective layer preferably contains a (meth)acrylic resin and a fluororesin.

[0271] When forming a protective layer by applying a resin composition for forming a protective layer, known methods such as spin coating, casting, screen printing, and inkjet printing can be used as the method for applying the resin composition for forming a protective layer. Known organic solvents (e.g., propylene glycol 1-monomethyl ether 2-acetate, cyclopentanone, ethyl lactate, etc.) can be used as the organic solvent contained in the resin composition for forming a protective layer. When forming the protective layer by chemical vapor deposition, known chemical vapor deposition methods (thermal chemical vapor deposition, plasma chemical vapor deposition, photochemical vapor deposition) can be used as the chemical vapor deposition method.

[0272] The protective layer may optionally contain additives such as organic or inorganic fine particles, absorbers of specific wavelengths of light (e.g., ultraviolet light, near-infrared light, etc.), refractive index adjusters, antioxidants, adhesives, and surfactants. Examples of organic or inorganic fine particles include polymeric fine particles (e.g., silicone resin fine particles, polystyrene fine particles, melamine resin fine particles), titanium oxide, zinc oxide, zirconium oxide, indium oxide, aluminum oxide, titanium nitride, titanium oxynitride, magnesium fluoride, hollow silica, silica, calcium carbonate, and barium sulfate. Known absorbers of specific wavelengths of light can be used. The content of these additives can be adjusted as appropriate, but is preferably 0.1 to 70% by weight, more preferably 1 to 60% by weight, of the total weight of the protective layer. The protective layer may also be the protective layer described in paragraphs 0073 to 0092 of JP 2017-151176 A.

[0273] The optical filter may have a structure in which each pixel is embedded in a space partitioned by partitions, for example, in a lattice pattern. The resin composition of the present invention can also be suitably used for the pixel configuration described in WO 2019 / 102887.

[0274] <Solid-state imaging element> The solid-state imaging device of the present invention has the above-described film of the present invention. The configuration of the solid-state imaging device of the present invention is not particularly limited as long as it has the film of the present invention and functions as a solid-state imaging device, but examples thereof include the following configurations.

[0275] The substrate includes a plurality of photodiodes constituting a light receiving area of ​​a solid-state imaging device (such as a CCD (charge-coupled device) image sensor or a CMOS (complementary metal-oxide semiconductor) image sensor) and transfer electrodes made of polysilicon or the like. A light-shielding film is formed on the photodiodes and transfer electrodes, with only the light-receiving portions of the photodiodes exposed. A device protection film made of silicon nitride or the like is formed on the light-shielding film so as to cover the entire light-shielding film and the light-receiving portions of the photodiodes. A color filter is also provided on the device protection film. The device protection film may further include a light-collecting means (e.g., a microlens, etc.; the same applies hereinafter) below the color filter (on the side closer to the substrate), or a light-collecting means on the color filter. The color filter may have a structure in which each color pixel is embedded in a space partitioned by partition walls, for example, in a lattice pattern. In this case, the partition walls preferably have a lower refractive index than the color pixels. Examples of imaging devices having such a structure include those described in JP 2012-227478 A, JP 2014-179577 A, WO 2018 / 043654 A, and U.S. Patent Application Publication No. 2018 / 0040656 A. Furthermore, as in JP 2019-211559 A, an ultraviolet absorbing layer may be provided within the structure of the solid-state imaging element to improve light resistance. An imaging device equipped with the solid-state imaging element of the present invention can be used for digital cameras, electronic devices with imaging functions (such as mobile phones), as well as in-vehicle cameras and surveillance cameras. Furthermore, a solid-state imaging element incorporating the color filter of the present invention may incorporate, in addition to the color filter of the present invention, another color filter, a near-infrared cut filter, an organic photoelectric conversion film, and the like.

[0276] <Image display device> The image display device of the present invention has the above-described film of the present invention. Examples of image display devices include liquid crystal display devices and organic electroluminescence display devices. Definitions of image display devices and details of each image display device are described, for example, in "Electronic Display Devices" (written by Akio Sasaki, published by Kogyo Chosakai Co., Ltd. in 1990) and "Display Devices" (written by Nobuaki Ibuki, published by Sangyo Tosho Co., Ltd. in 1989). Liquid crystal display devices are described, for example, in "Next Generation Liquid Crystal Display Technology" (edited by Tatsuo Uchida, published by Kogyo Chosakai Co., Ltd. in 1994). There are no particular limitations on the liquid crystal display device to which the present invention can be applied, and the present invention can be applied to various types of liquid crystal display devices described in the above-mentioned "Next Generation Liquid Crystal Display Technology." [Example]

[0277] The present invention will be explained in more detail below with reference to examples. The materials, amounts used, ratios, processing details, processing procedures, etc. shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.

[0278] <Method for measuring weight average molecular weight (Mw)> The weight average molecular weight of the sample was measured by gel permeation chromatography (GPC) under the following conditions. Column type: TOSOH TSKgel Super HZM-H, TOSOH TSKgel Super HZ4000, and TOSOH TSKgel Super HZ2000 columns connected together Developing solvent: tetrahydrofuran Column temperature: 40℃ Flow rate (sample injection volume): 1.0 μL (sample concentration: 0.1% by mass) Device name: Tosoh HLC-8220GPC Detector: RI (refractive index) detector Calibration curve base resin: polystyrene resin

[0279] <Method for measuring acid value> The acid value of the sample was measured as follows: The sample was dissolved in a tetrahydrofuran / water (mass ratio: 9 / 1) mixed solvent, and the resulting solution was neutralized with a 0.1 mol / L potassium hydroxide aqueous solution at 25°C using a potentiometric titrator (product name: AT-510, manufactured by Kyoto Electronics Manufacturing Co., Ltd.). The inflection point of the titration pH curve was used as the titration endpoint, and the acid value was calculated according to the following formula. A=56.11×Vs×0.5×f / w A: Acid value (mgKOH / g) Vs: Amount (mL) of 0.1 mol / L potassium hydroxide solution required for titration f: Potency of 0.1 mol / L potassium hydroxide aqueous solution w: mass of sample (g) (solid content equivalent)

[0280] <Method for measuring amine value> The amine value of the sample was measured as follows: The sample was dissolved in acetic acid, and the resulting solution was neutralized with a 0.1 mol / L perchloric acid / acetic acid solution at 25°C using a potentiometric titrator (product name: AT-510, manufactured by Kyoto Electronics Manufacturing Co., Ltd.). The inflection point of the titration pH curve was used as the titration endpoint, and the amine value was calculated using the following formula. B=56.11×Vs×0.1×f / w B: Amine value (mgKOH / g) Vs: Amount (mL) of 0.1 mol / L perchloric acid / acetic acid solution required for titration f: Potency of 0.1 mol / L perchloric acid / acetic acid solution w: mass of sample (g) (solid content equivalent)

[0281] <Resin synthesis method> (Synthesis Example 1) Synthesis of Resin B-1 A nitrogen-purged three-neck flask was charged with 100.1 g of methyl methacrylate and 128.2 g of butyl acrylate, and diluted with 350 g of propylene glycol monomethyl ether acetate. This mixture was heated to 75°C under a nitrogen atmosphere. Next, 20.9 g of mercaptoethanol and 2.0 g of a polymerization initiator (V-601, Fujifilm Wako Pure Chemical Industries, Ltd.) were added, and the mixture was heated and stirred at 75°C under a nitrogen atmosphere for 8 hours, yielding a solution of a hydroxy-terminated polymer with the following structure. The weight-average molecular weight of the resulting hydroxy-terminated polymer was 2,300. [ka]

[0282] Next, the resulting solution of the hydroxy-terminated polymer was cooled to 5°C, 32.1 g of trimellitic anhydride chloride was added, and 15.3 g of pyridine was added dropwise over 6 hours. The mixture was further stirred at room temperature for 24 hours, and insoluble matter was removed by filtration to obtain a solution of a macromonomer having an acid anhydride structure at its terminal, as shown below. The weight-average molecular weight of the resulting macromonomer having an acid anhydride structure at its terminal was 2,500. [ka]

[0283] Next, the resulting solution of macromonomer having an acid anhydride structure at its end was heated to 50°C, and 7.1 g of polyethyleneimine (Epomin SP-003, manufactured by Nippon Shokubai Co., Ltd.) was added. The mixture was then heated and stirred at 50°C for an additional 5 hours. 280 g of propylene glycol monomethyl ether acetate was added to adjust the solids concentration, yielding a propylene glycol monomethyl ether acetate solution with a solids concentration of 30 mass% of Resin B-1, which has the following structure. The resulting Resin B-1 had a weight-average molecular weight of 6,600, an acid value of 21 mgKOH / g, and an amine value of 33 mgKOH / g.

[0284] (Synthesis Examples 2 to 35) Synthesis of Resins B-2 to B-35 Resins B-2 to B-35 were each synthesized in the same manner as for Resin B-1.

[0285] The structures, weight-average molecular weights (Mw), acid values, and amine values ​​of Resins B-1 to B-35 are shown below. The numbers attached to the main chain indicate molar ratios. In addition, in the case of "Polym," the numbers attached to the repeating units indicate the number of repeating units. [ka] [ka] [ka] [ka] [ka] [ka] [ka] [ka]

[0286] [Table 1]

[0287] <Production of dispersion liquid> A mixture of the raw materials listed in the table below was mixed and dispersed for 3 hours using a bead mill (using zirconia beads with a diameter of 0.3 mm), and then further dispersed using a high-pressure disperser equipped with a pressure reducing mechanism, NANO-3000-10 (manufactured by Nippon BEE Co., Ltd.), at a pressure of 2000 MPa and a flow rate of 500 g / min. This dispersion process was repeated 10 times to obtain each dispersion.

[0288] [Table 2] [Table 3] [Table 4] [Table 5] [Table 6]

[0289] The units of the values ​​indicating the blending amounts of each raw material listed in the above table are parts by mass. Details of the raw materials listed in the above table, indicated by abbreviations, are as follows: [Colorant] PR122: CI Pigment Red 122 (red pigment, quinacridone pigment) PR179: CI Pigment Red 179 (red pigment, perylene pigment) PR254: CI Pigment Red 254 (red pigment, diketopyrrolopyrrole pigment) PR264: CI Pigment Red 264 (red pigment, diketopyrrolopyrrole pigment) PR291: CI Pigment Red 291 (red pigment, diketopyrrolopyrrole pigment) PO71: CI Pigment Orange 71 (orange pigment, diketopyrrolopyrrole pigment) PB15:6: CI Pigment Blue 15:6 (blue pigment, phthalocyanine pigment) PB16: CI Pigment Blue 16 (blue pigment, phthalocyanine pigment) PG7: CI Pigment Green 7 (green pigment, phthalocyanine pigment) PG36: CI Pigment Green 36 (green pigment, phthalocyanine pigment) PG58: CI Pigment Green 58 (green pigment, phthalocyanine pigment) PY185: CI Pigment Yellow 185 (yellow pigment, isoindoline pigment) PY215: CI Pigment Yellow 215 (yellow pigment, pteridine pigment) PV23: CI Pigment Violet 23 (purple pigment, dioxazine pigment) IR dye: Compound with the following structure (near infrared absorbing pigment, in the structural formula, Me represents a methyl group and Ph represents a phenyl group) [ka] IRGAPHORE: Irgaphor Black S 0100 CF (manufactured by BASF, compound with the following structure, lactam pigment) [ka] PBk32: CI Pigment Black 32 (compound with the following structure, perylene pigment) [ka]

[0290] [Pigment Derivatives] Derivative 1: Compound of the following structure [ka] Derivative 2: Compound of the following structure [ka] Derivative 3: Compound of the following structure [ka]

[0291] [Resin (dispersant)] (Specific resin) B-1 to B-32: the above-mentioned resins

[0292] (Comparative resin) cB-1: Resin with the following structure (weight average molecular weight is 10885, acid value is 74 mgKOH / g. The notation "Polym" indicates that the polymer chain, in which the repeating units of the structure shown in "Polym" are bonded by the number indicated by the subscript, is bonded to a sulfur atom (S).) [ka]

[0293] 〔solvent〕 S-1: Propylene glycol monomethyl ether acetate S-2: Propylene glycol monomethyl ether S-3: Cyclohexanone

[0294] <Production of Resin Composition> The resin compositions of the examples and comparative examples were prepared by mixing the raw materials listed in the table below.

[0295] [Table 7] [Table 8]

[0296] [Table 9]

[0297] Among the raw materials listed in the table above, the details of the raw materials indicated by abbreviations are as follows:

[0298] [Dispersion] Dispersions R1 to R14, B1 to B14, G1 to G14, I1 to I7, Bk1 to Bk21, CR1, CR2, CB1, CB2, CG1, CG2, CI1, CI2, and CBk1 to CBk4: the above-mentioned dispersions

[0299] 〔resin〕 Ba-1: Resin with the following structure (the number attached to the main chain is the molar ratio. Weight average molecular weight: 11,000) [ka] Ba-2: Resin with the following structure (the number attached to the main chain is the molar ratio. Weight average molecular weight: 15,000) [ka] Ba-3: Resin with the following structure (the numbers attached to the main chain are molar ratios. The total value of x, y, and z is 50. Mw=15,000) [ka] Bb-1: Resin with the following structure (the number attached to the main chain is the molar ratio. Weight average molecular weight: 13,000) [ka] Bb-2: Resin cB-1 described above B-1, B-6, B-11, B-14, B-24, B-26, B-29, B-30: Resins B-1, B-6, B-11, B-14, B-24, B-26, B-29, B-30 having the above-mentioned structures

[0300] [Polymerizable Monomer] D-1: Acrylate compound (KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd., a mixture of dipentaerythritol hexaacrylate and dipentaerythritol pentaacrylate) D-2: Epoxy compound (TETRAD-X, manufactured by Mitsubishi Gas Chemical Company, Inc., N,N,N',N'-tetraglycidyl-m-xylylenediamine) D-3: Oxetane compound (OXT-221, manufactured by Toagosei Co., Ltd., 3-ethyl-3{[(3-ethyloxetan-3-yl)methoxy]methyl}oxetane) D-4: Oxetane compound (OX-SQ TX-100, manufactured by Toagosei Co., Ltd.)

[0301] [Photopolymerization initiator] E-1: Omnirad 379EG (IGM Resins BV, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one) E-2: Irgacure OXE01 (BASF, oxime compound) E-3: Compound of the following structure [ka]

[0302] 〔solvent〕 S-1: Propylene glycol monomethyl ether acetate S-2: Propylene glycol monomethyl ether S-3: Cyclohexanone

[0303] <Evaluation> [Evaluation of dispersibility] (Storage stability) The viscosity (mPa·s) of the resin compositions of each example and comparative example was measured using an "RE-85L" manufactured by Toki Sangyo Co., Ltd. After the measurement, the resin compositions were left to stand at 45°C, protected from light, for three days, and the viscosity (mPa·s) was measured again. The storage stability was evaluated based on the difference in viscosity (ΔVis) before and after the standing, according to the following evaluation criteria. The smaller the viscosity difference (ΔVis), the better the storage stability of the resin composition and the better the pigment dispersibility. All of the viscosity measurements were performed in a laboratory where the temperature and humidity were controlled at 22±5°C and 60±20%, with the temperature of the resin composition adjusted to 25°C.

[0304] -Evaluation criteria- A: ΔVis was 0.5 mPa·s or less. B: ΔVis was greater than 0.5 mPa·s and less than 1.0 mPa·s. C: ΔVis was greater than 1.0 mPa·s and less than 2.0 mPa·s. D: ΔVis was greater than 2.0 mPa·s and less than 2.5 mPa·s. E: ΔVis exceeded 2.5 mPa·s.

[0305] (particle size) Using a dynamic light scattering particle size distribution analyzer (LB-500, manufactured by Horiba, Ltd.) conforming to JIS8826:2005, the resin composition obtained above was dispensed into a 20 ml sample bottle and diluted with propylene glycol monomethyl ether acetate to a solids concentration of 0.2 mass%. Using a 2 ml quartz measuring cell at 25°C, data was collected 50 times for the diluted solution, and the arithmetic mean pigment particle size (number average particle size) based on the number of particles obtained was determined. The smaller the number average particle size of the pigment, the better the pigment's dispersibility. -Evaluation criteria- A: The number average particle size of the pigment was 0.05 μm or less. B: The number average particle size of the pigment was more than 0.05 μm and 0.10 μm or less. C: The number average particle size of the pigment was greater than 0.10 μm and not greater than 0.20 μm. D: The number average particle size of the pigment was greater than 0.20 μm and not greater than 0.50 μm. E: The number average particle size of the pigment exceeded 0.50 μm.

[0306] [Evaluation of film shrinkage rate] The resin compositions of each example and comparative example were spin-coated onto a glass substrate, dried at 100°C for 120 seconds using a hot plate (pre-baking), and then heated at 200°C for 30 minutes using an oven (post-baking) to produce a 0.60 μm thick film. The film thickness was measured by scraping a portion of the film to expose the glass substrate surface, and the step between the glass substrate surface and the coated film (the coated film thickness) was measured using a stylus-type step height gauge (DektakXT, manufactured by BRUKER). The resulting film was then heat-treated at 300°C for 5 hours in a nitrogen atmosphere. The film thickness after heat treatment was measured in the same manner, and the film shrinkage rate was calculated using the following formula and evaluated according to the following evaluation criteria. The following T0 and T1 were both measured in a laboratory where the temperature and humidity were controlled at 22±5°C and 60±20%, with the substrate temperature adjusted to 25°C. The smaller the film shrinkage rate, the more suppressed the film shrinkage, which can be considered a favorable result. Membrane shrinkage rate (%) = (1-(T1 / T0)) x 100 T0: Film thickness immediately after production (= 0.60 μm) T1: Film thickness after heat treatment at 300°C for 5 hours in a nitrogen atmosphere -Evaluation criteria- A: The membrane shrinkage rate was 1% or less. B: The membrane shrinkage rate was more than 1% and 5% or less. C: The membrane shrinkage rate was more than 5% and 10% or less. D: The membrane shrinkage rate was more than 10% and 30% or less. E: The membrane shrinkage rate exceeded 30%.

[0307] [Crack evaluation] The resin composition of each example and comparative example was applied by spin coating onto a glass substrate, dried (pre-baked) at 100°C for 120 seconds using a hot plate, and then heated (post-baked) at 200°C for 30 minutes using an oven to produce a film with a thickness of 0.60 μm. Next, 200 nm of SiO2 was laminated on the surface of the obtained film by a sputtering method to form an inorganic film. This film with the inorganic film formed on its surface was heat-treated at 300°C for 5 hours in a nitrogen atmosphere. The surface of the inorganic film after the heat treatment was observed with an optical microscope, and the film was measured by a 1 cm 2 The number of cracks per hit was counted and the presence or absence of cracks was evaluated according to the following evaluation criteria. -Evaluation criteria- A: 1cm 2 The number of hit cracks was 0. B: 1cm 2 The number of cracks per hit ranged from 1 to 10. C:1cm 2 The number of cracks per hit ranged from 11 to 50. D:1cm 2 The number of cracks per hit was 51 to 100. E:1cm 2 The number of cracks per hit was 101 or more.

[0308] [Evaluation method for precipitation defects] The resin compositions of each example and comparative example were spin-coated onto a silicon wafer and dried (pre-baked) at 100°C for 120 seconds using a hot plate to produce a film with a thickness of 0.60 μm. The silicon wafers on which these films were formed were counted for the number of foreign particles (number of foreign particles 1) with a size of 1.0 μm or larger. The silicon wafers on which these films were formed were then heated at 250°C for 10 minutes, after which the number of foreign particles (number of foreign particles 2) with a size of 1.0 μm or larger were counted. The foreign particle increase rate was calculated using the following formula, and the degree of precipitation of defects (precipitation defects) was evaluated according to the following criteria. Criterion C or higher is practically desirable. The foreign matter increase rate was calculated as (number of foreign matters 2 / number of foreign matters 1). A: Foreign matter increase rate <1.1 B: 1.1≦Foreign matter increase rate<1.3 C: 1.3≦Foreign matter increase rate<1.5 D: 1.5≦Foreign matter increase rate<3.0 E: 3.0≦Foreign matter increase rate

[0309] [Table 10]

[0310] [Table 11]

[0311] [Table 12]

[0312] When the resin compositions of the Examples were used, the evaluations of storage stability and particle size were superior, and the pigment dispersibility was excellent, compared with when the resin compositions of the Comparative Examples were used. Furthermore, when the resin compositions of the Examples were used, the film shrinkage rate was smaller, and the occurrence of cracks and deposition defects was suppressed, compared with when the resin compositions of the Comparative Examples were used. Therefore, it can be said that the resin compositions of the Examples can expand the process window in the process after film production, compared with when the resin compositions of the Comparative Examples were used.

[0313] (Example 1000: Pattern formation by photolithography) The resin composition of Example 1 was applied to a silicon wafer by spin coating, dried on a hot plate at 100°C for 120 seconds (pre-baked), and then heated in an oven at 200°C for 30 minutes (post-baked) to form a resin composition layer with a thickness of 0.60 μm. Next, this resin composition layer was irradiated with 500 mJ / cm of light with a wavelength of 365 nm using an i-line stepper exposure system FPA-3000i5+ (manufactured by Canon Corporation) through a mask pattern in which square unmasked areas with sides of 1.1 μm were arranged in a 4 mm × 3 mm area. 2 The silicon wafer on which the exposed resin composition layer had been formed was then placed on the horizontal rotating table of a spin-shower developer (Model DW-30, manufactured by Chemitronics Corporation) and puddle-developed at 23°C for 60 seconds using a developer (CD-2000, manufactured by Fujifilm Electronic Materials Co., Ltd.). The silicon wafer was then rotated at 50 rpm, and pure water was supplied from a spray nozzle above the center of rotation in a shower-like manner to rinse the wafer, followed by spray drying to form a pattern (pixels).

[0314] The pixelated silicon wafer was divided into two, and one half was heat-treated at 300°C for 5 hours in a nitrogen atmosphere (hereinafter, one half is referred to as the substrate before the 300°C heat treatment, and the other half is referred to as the substrate after the 300°C heat treatment). When the cross sections of the pixels formed on the substrate before the 300°C heat treatment and the substrate after the 300°C heat treatment were evaluated with a scanning electron microscope (SEM), the height (thickness) of the pixels formed on the substrate after the 300°C heat treatment was 96% of the height (thickness) of the pixels formed on the substrate before the 300°C heat treatment.

Claims

1. a color material A containing a pigment; Resin B, a solvent C; The resin B includes a resin B1 which is a reaction product of a resin having a primary amino group or a secondary amino group and a macromonomer having an acid anhydride structure at the terminal, a resin composition, wherein the resin B1 is a resin containing a repeating unit represented by formula (1-1), formula (1-2), or formula (1-3); 【Chemistry 1】 In the formula, R 1 to R 9 each independently represent a hydrogen atom or a substituent; L 1 represents a single bond or a divalent linking group; L 2 and L 3 each independently represent a divalent linking group; L 4 represents a single bond or a divalent linking group; X b11 represents an (n+2)-valent linking group; X b12 represents O or NR x11 ; R x11 represents a hydrogen atom or a substituent; L b11 represents a divalent linking group containing a sulfur atom; P b11 represents a polymer chain; R b11 represents a hydrogen atom, a substituent or a counter ion; n represents an integer of 1 or more.

2. a color material A containing a pigment; Resin B, a solvent C; The resin B includes a resin B1 which is a reaction product of a resin having a primary amino group or a secondary amino group and a macromonomer having an acid anhydride structure at the terminal, a resin composition, wherein the resin B1 is a resin containing a repeating unit represented by formula (1-1), formula (1-2), or formula (1-3); 【Chemistry 2】 In the formula, R 1 to R 9 each independently represent a hydrogen atom or a substituent; L 1 represents a single bond or a divalent linking group; L 2 and L 3 each independently represent a divalent linking group; L 4 represents a single bond or a divalent linking group; X b11 represents an (n+2)-valent linking group; X b12 represents O or NR x11 ; R x11 represents a hydrogen atom or a substituent; L b11 represents a single bond or a divalent linking group; P b11 represents a polymer chain containing at least one selected from an ethylenically unsaturated bond-containing group, an epoxy group, an oxetanyl group, and a t-butyl group; R b11 represents a hydrogen atom, a substituent or a counter ion; n represents an integer of 1 or more.

3. a color material A containing a pigment; Resin B, a solvent C; The resin B includes a resin B1 which is a reaction product of a resin having a primary amino group or a secondary amino group and a macromonomer having an acid anhydride structure at the terminal, a resin composition, wherein the resin B1 is a resin containing a repeating unit represented by formula (1-1), formula (1-2), or formula (1-3); 【Transformation 3】 In the formula, R 1 to R 9 each independently represent a hydrogen atom or a substituent; L 1 represents a single bond or a divalent linking group; L 2 and L 3 each independently represent a divalent linking group; L 4 represents a single bond or a divalent linking group; X b11 represents an (n+2)-valent linking group; X b12 represents O or NR x11 ; R x11 represents a hydrogen atom or a substituent; L b11 represents a single bond or a divalent linking group; P b11 represents a polymer chain containing a repeating unit of a polyether structure; R b11 represents a hydrogen atom, a substituent or a counter ion; n represents an integer of 1 or more.

4. P in the formula (1-1) ｂ１１ a polymer chain represented by the formula (1-2) ｂ１１ and the polymer chain represented by formula (1-3) ｂ１１ The resin composition according to claim 1 or 2, wherein the polymer chain represented by is a polymer chain containing repeating units of at least one structure selected from the group consisting of a polyether structure, a polyester structure, a poly(meth)acrylic structure, and a polystyrene structure.

5. The resin B1 contains a repeating unit represented by the formula (1-1), and the content of the repeating unit represented by the formula (1-1) in the resin B1 is 30 mol% or more, The resin B1 contains a repeating unit represented by the formula (1-2), and the content of the repeating unit represented by the formula (1-2) in the resin B1 is 30 mol% or more, or The resin B1 contains a repeating unit represented by the formula (1-3), and the content of the repeating unit represented by the formula (1-3) in the resin B1 is 30 mol% or more. The resin composition according to any one of claims 1 to 4.

6. 6. The resin composition according to claim 1, wherein the colorant A contains at least one selected from the group consisting of a diketopyrrolopyrrole pigment and a phthalocyanine pigment.

7. The resin composition according to any one of claims 1 to 6, further comprising a polymerizable monomer.

8. The resin composition according to any one of claims 1 to 7, further comprising a photopolymerization initiator.

9. A film obtained by using the resin composition according to any one of claims 1 to 8.

10. An optical filter comprising the film according to claim 9.

11. A solid-state imaging device comprising the film according to claim 9.

12. An image display device comprising the film according to claim 9.

13. A resin containing a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3); 【Chemistry 4】 In the formula, R １ ~R ９ each independently represents a hydrogen atom or a substituent, L １ represents a single bond or a divalent linking group, L ２ and L ３ each independently represents a divalent linking group, L ４ represents a single bond or a divalent linking group, X ｂ１１ represents an (n+2)-valent linking group, and X ｂ１２ is O or NR ｘ１１ represents R ｘ１１ represents a hydrogen atom or a substituent, L ｂ１１ represents a divalent linking group containing a sulfur atom, P ｂ１１ represents the polymer chain, R ｂ１１ represents a hydrogen atom, a substituent, or a counter ion; n represents an integer of 1 or more.

14. A resin containing a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3); 【Transformation 5】 In the formula, R １ ~R ９ each independently represents a hydrogen atom or a substituent, L １ represents a single bond or a divalent linking group, L ２ and L ３ each independently represents a divalent linking group, L ４ represents a single bond or a divalent linking group, X ｂ１１ represents an (n+2)-valent linking group, and X ｂ１２ is O or NR ｘ１１ represents R ｘ１１ represents a hydrogen atom or a substituent, L ｂ１１ represents a single bond or a divalent linking group, P ｂ１１ represents a polymer chain containing at least one group selected from an ethylenically unsaturated bond-containing group, an epoxy group, an oxetanyl group, and a t-butyl group, R ｂ１１ represents a hydrogen atom, a substituent, or a counter ion; n represents an integer of 1 or more.

15. A resin containing a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3); 【Transformation 6】 In the formula, R １ ~R ９ each independently represents a hydrogen atom or a substituent, L １ represents a single bond or a divalent linking group, L ２ and L ３ each independently represents a divalent linking group, L ４ represents a single bond or a divalent linking group, X ｂ１１ represents an (n+2)-valent linking group, and X ｂ１２ is O or NR ｘ１１ represents R ｘ１１ represents a hydrogen atom or a substituent, L ｂ１１ represents a single bond or a divalent linking group, P ｂ１１ represents a polymer chain containing repeating units of a polyether structure, R ｂ１１ represents a hydrogen atom, a substituent, or a counter ion; n represents an integer of 1 or more.

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