Information processing device, wiring pattern forming system, information processing method and control program

Abstract

To provide an information processing device capable of presenting appropriate irradiation conditions of laser beams irradiating a material arranged on a surface of a base material, a wiring pattern formation system, an information processing method, and a control program.SOLUTION: An information processing device comprises: an acquisition unit which acquires physical property value information of a physical property value of a base material in which a wiring pattern is formed by irradiating the material arranged on a surface of the base material with a laser beam; a calculation unit which inputs the physical property value acquired by the acquisition unit to a learning model learned so as to output information on laser beam irradiation to the material arranged on a surface of a prescribed base material when physical property information of a physical property value of the prescribed base material is input, and calculates irradiation conditions of laser beams irradiated onto the material arranged on the surface of the base material on the basis of the information output from the learning model; and an output unit which outputs the irradiation conditions.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to an information processing device, a wiring pattern forming system, an information processing method, and a control program. [Background technology]

[0002] 2. Description of the Related Art A wiring pattern forming system has been developed that forms a wiring pattern on the surface of a substrate by irradiating a laser beam in a pattern onto a substance such as a metal oxide disposed on the surface of the substrate.

[0003] For example, Patent Document 1 describes a method for manufacturing metal wiring in which a desired wiring pattern is formed on a substrate by repeatedly irradiating a surface of a substrate containing metal particles with light to thermally sinter the metal particles. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2019-140284 Summary of the Invention [Problem to be solved by the invention]

[0005] In a wiring pattern forming system, in order to properly form a wiring pattern on the surface of a substrate, it is necessary to obtain appropriate irradiation conditions for the laser light to be irradiated onto a substance placed on the surface of the substrate.

[0006] The present disclosure aims to provide an information processing device, a wiring pattern forming system, an information processing method, and a control program that can present appropriate irradiation conditions for laser light to be irradiated onto a substance placed on the surface of a substrate. [Means for solving the problem]

[0007] An information processing device according to one aspect of the present disclosure is characterized by having an acquisition unit that acquires physical property information relating to the physical properties of a substrate on whose surface a wiring pattern is formed by irradiating a material placed on the surface with laser light, a calculation unit that inputs the physical property information acquired by the acquisition unit into a learning model that is trained to output information relating to the irradiation of laser light on a material placed on the surface of a specified substrate when physical property information of the physical property of a specified substrate is input, and calculates the irradiation conditions of the laser light to be irradiated on the material placed on the surface of the substrate based on the information output from the learning model, and an output unit that outputs the irradiation conditions.

[0008] An information processing device according to one aspect of the present disclosure is characterized by having an acquisition unit that acquires physical property value information regarding the physical property values ​​of a substrate on whose surface a wiring pattern is formed by irradiating a material arranged on the surface with laser light, and information regarding the laser light irradiation of the material arranged on the surface of the substrate; a calculation unit that inputs the physical property value information acquired by the acquisition unit and information regarding the predetermined laser light irradiation into a learning model that is trained to output information regarding the quality of a wiring pattern formed by irradiating a material arranged on the surface of the substrate with laser light based on the information regarding the laser light irradiation when the physical property value information of the predetermined substrate and the information regarding the laser light irradiation of the material arranged on the surface of the substrate are input, and calculates the irradiation conditions of the laser light to be irradiated onto the material arranged on the surface of the substrate based on the information output from the learning model; and an output unit that outputs the irradiation conditions.

[0009] In an information processing device according to one aspect of the present disclosure, it is preferable that the physical property information includes at least one of information regarding the mechanical properties of the substrate, information regarding the optical properties or electrical properties of the substrate, and information regarding the thermal properties of the substrate.

[0010] In an information processing device according to one aspect of the present disclosure, it is preferable that the physical property information includes at least one of information relating to the mechanical properties of the substrate, at least one of information relating to the optical properties or electrical properties of the substrate, and at least one of information relating to the thermal properties of the substrate.

[0011] In the information processing device according to one aspect of the present disclosure, the information about the mechanical properties of the substrate preferably includes material, Izod impact strength, Charpy impact strength, tensile elongation, tensile strength, tensile modulus, tensile strain at break, tensile yield stress, tear strength, flexural stress, flexural strength, flexural modulus, yield strain, mold shrinkage, water absorption, density, surface hardness, Rockwell hardness, or surface roughness; the information about the optical or electrical properties of the substrate preferably includes color, absorbance, haze, total light transmittance, refractive index, volume resistivity, surface resistivity, dielectric loss tangent, dielectric strength, relative dielectric constant, arc resistance, tracking resistance, reflectance, or gloss; and the information about the thermal properties of the substrate preferably includes heat resistance temperature, glass transition temperature, Vicat softening temperature, specific heat, thermal conductivity, flammability, oxygen index, coefficient of linear expansion, deflection temperature under load, melting point, melt mass-flow rate, or melt volume-flow rate.

[0012] In an information processing device according to one aspect of the present disclosure, the acquisition unit further acquires thickness information relating to the thickness of a material placed on the surface of the substrate and wiring pattern information relating to the wiring pattern on the substrate, and the learning model is trained to output information relating to laser light irradiation of the material placed on the surface of the specified substrate when thickness information of the material placed on the surface of the specified substrate and wiring pattern information of the wiring pattern on the specified substrate are input in addition to the physical property value information of the specified substrate, and it is preferable that the calculation unit inputs the physical property value information, thickness information, and wiring pattern information acquired by the acquisition unit into the learning model and calculates the irradiation conditions based on the information output from the learning model.

[0013] In an information processing device relating to one aspect of the present disclosure, it is preferable that the acquisition unit further acquires thickness information regarding the thickness of a material placed on the surface of the substrate and wiring pattern information regarding the wiring pattern on the substrate, and the learning model is trained to output information regarding quality when thickness information of a material placed on the surface of the specified substrate and wiring pattern information of the wiring pattern on the specified substrate are input in addition to physical property value information of the specified substrate and information regarding laser light irradiation, and the calculation unit inputs the physical property value information, thickness information, wiring pattern information, and information regarding laser light irradiation acquired by the acquisition unit into the learning model, and calculates the irradiation conditions based on the information output from the learning model.

[0014] In the information processing device according to the aspect of the present disclosure, the irradiation conditions preferably include the intensity of the laser light or the scanning speed of the laser light.

[0015] In the information processing device according to one aspect of the present disclosure, the substance preferably includes a metal, a metal oxide, graphene, graphite, or a polymer material that becomes conductive when irradiated with laser light.

[0016] A wiring pattern forming system according to one aspect of the present disclosure is a wiring pattern forming system having an information processing device and a laser light irradiation device, wherein the information processing device has an acquisition unit that acquires physical property information regarding the physical property values ​​of a substrate on which a wiring pattern is formed by irradiating a material placed on the surface with laser light, a calculation unit that inputs the physical property information acquired by the acquisition unit into a learning model that is trained to output information regarding laser light irradiation of a material placed on the surface of a specified substrate when physical property information of the physical property values ​​of a specified substrate is input, and calculates the irradiation conditions of the laser light to be irradiated onto the material placed on the surface of the substrate based on the information output from the learning model, and an output unit that outputs the irradiation conditions, and the laser light irradiation device has a formation unit that forms a wiring pattern by irradiating a material placed on the surface of the substrate with laser light based on the irradiation conditions output from the output unit.

[0017] A wiring pattern forming system according to one aspect of the present disclosure is a wiring pattern forming system having an information processing device and a laser light irradiation device, wherein the information processing device has an acquisition unit that acquires physical property value information regarding the physical property values ​​of a substrate on which a wiring pattern is formed by irradiating a material arranged on the surface with laser light and information regarding laser light irradiation of the material arranged on the surface of the substrate, a calculation unit that inputs the physical property value information acquired by the acquisition unit and information regarding the predetermined laser light irradiation into a learning model that is trained to output information regarding the quality of a wiring pattern formed by irradiating a material arranged on the surface of the substrate with laser light based on the information regarding laser light irradiation when the physical property value information of the predetermined substrate and information regarding laser light irradiation of the material arranged on the surface of the predetermined substrate are input, and calculates the irradiation conditions of the laser light to be irradiated onto the material arranged on the surface of the substrate based on the information output from the learning model, and an output unit that outputs the irradiation conditions, and the laser light irradiation device has a formation unit that forms a wiring pattern by irradiating a material arranged on the surface of the substrate with laser light based on the irradiation conditions output from the output unit.

[0018] An information processing method according to one aspect of the present disclosure is characterized in that a computer acquires physical property information relating to the physical properties of a substrate on whose surface a wiring pattern is formed by irradiating a material placed on the surface with laser light, inputs the acquired physical property information into a learning model that is trained to output information relating to the irradiation of laser light onto a material placed on the surface of a specified substrate when physical property information of the physical property of a specified substrate is input, calculates irradiation conditions for the laser light to be irradiated onto the material placed on the surface of the substrate based on the information output from the learning model, and outputs the irradiation conditions.

[0019] An information processing method according to one aspect of the present disclosure is characterized in that a computer acquires physical property information relating to the physical property values ​​of a substrate on whose surface a wiring pattern is formed by irradiating a material placed on the surface with laser light, and information relating to the laser light irradiation of the material placed on the surface of the substrate; inputs the acquired physical property information and information relating to the predetermined laser light irradiation into a learning model that is trained to output information relating to the quality of a wiring pattern formed by irradiating a material placed on the surface of the substrate with laser light based on the information relating to the laser light irradiation when the physical property information of the predetermined substrate and the information relating to the laser light irradiation of the material placed on the surface of the substrate are input; and calculates irradiation conditions for the laser light to be irradiated onto the material placed on the surface of the substrate based on the information output from the learning model, and outputs the irradiation conditions.

[0020] A control program according to one aspect of the present disclosure is a control program for a computer having an output unit, which causes the computer to acquire physical property information regarding the physical property values ​​of a substrate on whose surface a wiring pattern is formed by irradiating a material placed on the surface with laser light, input the acquired physical property information into a learning model that has been trained to output information regarding the irradiation of laser light onto a material placed on the surface of a specified substrate when physical property information of the physical property values ​​of a specified substrate is input, calculate irradiation conditions for the laser light to be irradiated onto the material placed on the surface of the substrate based on the information output from the learning model, and output the irradiation conditions by the output unit.

[0021] A control program according to one aspect of the present disclosure is a control program for a computer having an output unit, which acquires physical property information regarding the physical property values ​​of a substrate on whose surface a wiring pattern is formed by irradiating a material placed on the surface with laser light, and information regarding the laser light irradiation of the material placed on the surface of the substrate, inputs the acquired physical property information and information regarding the predetermined laser light irradiation into a learning model that has been trained to output information regarding the quality of a wiring pattern formed by irradiating a material placed on the surface of the substrate with laser light based on the information regarding the laser light irradiation when the physical property information of the predetermined substrate and the information regarding the laser light irradiation of the material placed on the surface of the predetermined substrate are input, calculates irradiation conditions for the laser light to be irradiated onto the material placed on the surface of the substrate based on the information output from the learning model, and outputs the irradiation conditions by the output unit. [Effects of the Invention]

[0022] The information processing device, wiring pattern forming system, information processing method, and control program according to the embodiments can present appropriate irradiation conditions for laser light to be irradiated onto a substance disposed on the surface of a substrate.

[0023] The objects and advantages of the present disclosure will be realized and obtained by means of the elements and combinations particularly pointed out in the claims. Both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the present disclosure, as claimed. [Brief explanation of the drawings]

[0024] [Figure 1] FIG. 1 is a diagram illustrating an example of a schematic configuration of a wiring pattern forming system. [Figure 2] 1 is a block diagram showing a schematic configuration of a laser light irradiation device. [Figure 3] FIG. 1 is a block diagram showing a schematic configuration of an information processing device. [Figure 4]10 is a flowchart illustrating an example of a calculation process of the information processing device. [Figure 5] 10(A) to 10(C) are diagrams showing examples of experimental results relating to physical property information, laser light irradiation conditions, and wiring pattern characteristics. [Figure 6] FIG. 10 is a diagram illustrating a schematic configuration of an information processing device according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0025] Various embodiments of the present disclosure will be described below with reference to the drawings. It should be noted that the technical scope of the present disclosure is not limited to these embodiments, but extends to the inventions set forth in the claims and their equivalents.

[0026] FIG. 1 is a diagram showing an example of a schematic configuration of a wiring pattern forming system 1. As shown in FIG.

[0027] As shown in FIG. 1, a wiring pattern forming system 1 forms a conductive wiring pattern 102 by irradiating a laser beam La onto a substance 101 disposed on the surface of a substrate 100 placed on a mounting table 200, thereby manufacturing a substrate such as a circuit board. The substrate 100 is an ABS (Acrylonitrile Butadiene Styrene) substrate, a polycarbonate substrate, a polyimide substrate, or the like. The substance 101 includes a metal, a metal oxide, graphene, graphite, or a polymer material that becomes conductive when irradiated with laser beam La. The substance 101 is disposed on the surface of the substrate 100 by a method such as coating, lamination, or vapor deposition. The wiring pattern forming system 1 includes a laser beam irradiation device 2 and an information processing device 3.

[0028] The laser light irradiation device 2 is connected to an information processing device 3 so as to be able to transmit and receive data and information. The laser light irradiation device 2 irradiates a substance 101 arranged on the surface of a substrate 100 placed on a mounting table 200 with laser light La. The laser light irradiation device 2 has a laser light oscillator 21, a galvano scanner 22, and a controller 23. The laser light oscillator 21, the galvano scanner 22, and / or the controller 23 are an example of a forming unit.

[0029] The laser oscillator 21 is electrically connected to the controller 23. The laser oscillator 21 irradiates the substrate 100 with laser light La in response to a control signal transmitted from the controller 23. The intensity of the laser light La output from the laser oscillator 21, the spot diameter of the laser light La, or the pitch width of the laser light La can be controlled by the controller 23. Known laser light such as YAG (Yttrium Aluminum Garnet), YVO4 (Yttrium Vanadate), Yb (Ytterbium), semiconductors (GaAs, GaAlAs, GaInAs), carbon dioxide gas, or a fiber laser is used as the laser light La. Not only the fundamental wave but also higher harmonics may be extracted and used as the laser light La.

[0030] The galvano scanner 22 includes a first mirror 221 , a first motor 222 , a second mirror 223 , a second motor 224 , and a condenser lens 225 .

[0031] The first mirror 221 is attached to the first motor 222 so as to rotate in accordance with the rotation of the first motor 222. The first mirror 221 is disposed at a predetermined position so as to form a predetermined angle with the laser beam oscillator 21 and the condenser lens 225. The first mirror 221 reflects the laser beam La emitted from the laser beam oscillator 21 towards the second mirror 223.

[0032] The first motor 222 is electrically connected to the controller 23. The first motor 222 rotates in a predetermined direction (the direction of the arrow α in FIG. 1) in response to a control signal transmitted from the controller 23. As a result, the first motor 222 positions the first mirror 221 at a predetermined position so as to form a predetermined angle with respect to the laser light oscillator 21 and / or the condenser lens 225.

[0033] The second mirror 223 is attached to the second motor 224 so as to rotate in accordance with the rotation of the second motor 224. The second mirror 223 is disposed at a predetermined position so as to form a predetermined angle with the first mirror 221 and the condenser lens 225. The second mirror 223 reflects the laser light La, which is emitted from the laser light oscillator 21 and reflected by the first mirror 221, towards the condenser lens 225.

[0034] The second motor 224 is electrically connected to the controller 23. The second motor 224 rotates in a predetermined direction (the direction of the arrow β in FIG. 1) in response to a control signal transmitted from the controller 23. As a result, the second motor 224 positions the second mirror 223 at a predetermined position so as to form a predetermined angle with respect to the first mirror 221 and the condenser lens 225.

[0035] The condenser lens 225 condenses the laser light La emitted from the laser light oscillator 21 and reflected by the first mirror 221 and the second mirror 223, and irradiates the laser light La toward the substrate 100 placed on the mounting table 200.

[0036] The first mirror 221, the second mirror 223, and / or the condenser lens 225 may be omitted, and the laser beam La may be irradiated toward the substrate 100 without passing through the first mirror 221, the second mirror 223, and / or the condenser lens 225. The galvanometer scanner 22 may include a mirror and a condenser lens that reflect the laser beam La output from the laser beam oscillator 21 in a fixed direction and at a fixed position, instead of the first mirror 221, the first motor 222, the second mirror 223, the second motor 224, and the condenser lens 225. In this case, the mounting table 200 is provided so as to be movable along at least one of the X direction and the Y direction shown in FIG. 1 . The X direction and the Y direction are parallel to the mounting surface of the mounting table 200 and are perpendicular to each other.

[0037] The controller 23 is a device that comprehensively controls the operation of the laser beam irradiator 2 and includes one or more processors and their peripheral circuits. The controller 23 includes, for example, a central processing unit (CPU). The controller 23 may also include a graphics processing unit (GPU), a digital signal processor (DSP), a large scale integration (LSI), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), etc. The controller 23 controls the operation of each component and executes various processes so that various processes of the laser beam irradiator 2 are executed in an appropriate order based on a program stored in a first storage unit 24 (described later) and inputs from a first communication unit 25 and a first operation unit 27 (described later). For example, the controller 23 controls the intensity of the laser beam La generated by the laser beam oscillator 21, the spot diameter of the laser beam La, or the pitch width of the laser beam La. In addition, the controller 23 controls the rotation angle and rotation speed of the first motor 222 and the second motor 224 to adjust the position and angle of the first mirror 221, and adjust the irradiation direction of the laser light La irradiated from the focusing lens 225, the scanning speed of the laser light La, or the scanning period of the laser light La.

[0038] FIG. 2 is a block diagram showing a schematic configuration of the laser light irradiation device 2. As shown in FIG.

[0039] In addition to the above-described configuration, the laser light irradiation device 2 further includes a first storage unit 24, a first communication unit 25, a first display unit 26, a first operation unit 27, a first interface unit 28, and the like.

[0040] The first storage unit 24 stores programs or data. The first storage unit 24 has, for example, a semiconductor memory device. The first storage unit 24 stores an operating system program, a driver program, an application program, data, etc. used in processing by the controller 23. Programs are installed into the first storage unit 24 from a computer-readable, non-transitory, portable storage medium such as a CD (Compact Disc)-ROM (Read Only Memory) or a DVD (Digital Versatile Disc)-ROM using a known setup program or the like.

[0041] The first communication unit 25 enables the laser light emitting device 2 to communicate with other devices. The first communication unit 25 has a communication interface circuit. The communication interface circuit of the first communication unit 25 is a communication interface circuit such as a wired LAN (Local Area Network) or a wireless LAN. The first communication unit 25 receives data from other devices and supplies the data to the controller 23, and also transmits data supplied from the controller 23 to other devices.

[0042] The first display unit 26 displays an image. The first display unit 26 has, for example, a liquid crystal display or an organic EL (Electro-Luminescence) display. The first display unit 26 displays an image based on display data supplied from the controller 23.

[0043] The first operation unit 27 accepts input operations by the operator to the laser light irradiation device 2. The first operation unit 27 has, for example, buttons or a keypad. The first operation unit 27 may have a touch panel integrated with the first display unit 26. The first operation unit 27 generates a signal according to the input operation by the operator and supplies the signal to the controller 23.

[0044] The first interface unit 28 has an interface circuit conforming to a serial bus such as a USB (Universal Serial Bus). The first interface unit 28 is electrically connected to the information processing device 3 to transmit and receive various information. The first interface unit 28 may be replaced by the first communication unit 25.

[0045] FIG. 3 is a block diagram showing a schematic configuration of the information processing device 3.

[0046] The information processing device 3 is connected to the laser light irradiating device 2 so as to be able to transmit and receive data and information. The information processing device 3 outputs irradiation conditions for the laser light La irradiated from the laser light irradiating device 2. As shown in FIG. 3 , the information processing device 3 has a second storage unit 31, a second communication unit 32, a second display unit 33, a second operation unit 34, a second interface unit 35, a processing unit 36, etc. The second storage unit 31, the second communication unit 32, the second display unit 33, the second operation unit 34, the second interface unit 35, and the processing unit 36 ​​are electrically connected to each other via a bus. The second communication unit 32 and the second display unit 33 are examples of an output unit.

[0047] The second storage unit 31 stores programs or data. The second storage unit 31 has, for example, a semiconductor memory device. The second storage unit 31 stores an operating system program, driver programs, application programs, data, etc., used for processing by the processing unit 36. Programs are installed into the second storage unit 31 from a computer-readable, non-transitory, portable storage medium such as a CD-ROM or DVD-ROM using a known setup program or the like.

[0048] The second communication unit 32 enables the processing unit 36 ​​to communicate with other devices. The second communication unit 32 has a communication interface circuit. The communication interface circuit of the second communication unit 32 is a communication interface circuit such as a wired LAN or a wireless LAN. The second communication unit 32 receives data from other devices and supplies the data to the processing unit 36, and also transmits data supplied from the processing unit 36 ​​to other devices.

[0049] The second display unit 33 displays an image. The second display unit 33 has, for example, a liquid crystal display or an organic EL display. The second display unit 33 displays an image based on the display data supplied from the processing unit .

[0050] The second operation unit 34 accepts input operations by the operator to the information processing device 3. The second operation unit 34 has, for example, a keypad, a keyboard, or a mouse. The second operation unit 34 may have a touch panel integrated with the second display unit 33. The second operation unit 34 generates a signal according to the input operation by the operator and supplies the signal to the processing unit 36.

[0051] The second interface unit 35 has an interface circuit conforming to a serial bus such as USB. The second interface unit 35 is electrically connected to the laser light emitting device 2 to transmit and receive various information. The second interface unit 35 may be replaced by a second communication unit 32.

[0052] The processing unit 36 ​​is a device that comprehensively controls the operation of each component included in the information processing device 3, and includes one or more processors and their peripheral circuits. The processing unit 36 ​​includes, for example, a CPU. The processing unit 36 ​​may also include a GPU, a DSP, an LSI, an ASIC, an FPGA, etc. The processing unit 36 ​​controls the operation of each component and executes various processes so that the various processes of the information processing device 3 are executed in an appropriate order based on the programs stored in the second storage unit 31 and inputs from the second communication unit 32 and the second operation unit 34.

[0053] The processing unit 36 ​​has, as functional blocks, an acquisition unit 361, a calculation unit 362, and an output control unit 363. Each of these units is a functional module realized by a program executed by the processing unit 36. Each of these units may be implemented in the information processing device 3 as firmware.

[0054] 4 is a flowchart showing an example of the calculation process of the information processing device 3. The calculation process is executed mainly by the processing unit 36 ​​in cooperation with each element of the information processing device 3 based on a program stored in advance in the second storage unit 31.

[0055] First, the acquiring unit 361 acquires physical property information (step S101). The physical property information is pre-stored in the second storage unit 31, and the acquiring unit 361 acquires the pre-stored physical property information by reading it from the second storage unit 31. The acquiring unit 361 may acquire the physical property information by receiving it from an external information processing device via the second communication unit 32.

[0056] The physical property information is information about the physical properties of the substrate 100 on whose surface a wiring pattern 102 is formed by irradiating a substance 101 arranged with laser light La, and includes one or more types of physical property values. The physical property information includes at least one of information about the mechanical properties of the substrate 100, information about the optical properties or electrical properties of the substrate 100, and information about the thermal properties of the substrate 100. The physical property information includes at least one of information about the mechanical properties of the substrate 100, at least one of information about the optical properties or electrical properties of the substrate 100, and at least one of information about the thermal properties of the substrate 100. In particular, because the heat generated by irradiation with the laser light La has a significant impact on the substrate 100 itself, such as thermal damage, it is preferable that the physical property information include information about thermal properties.

[0057] The information about the mechanical properties of the substrate 100 includes the material, Izod impact strength, Charpy impact strength, tensile elongation, tensile strength, tensile modulus, tensile strain at break, tensile yield stress, tear strength, flexural stress, flexural strength, flexural modulus, yield strain, mold shrinkage, water absorption, density, surface hardness, Rockwell hardness, or surface roughness. In particular, the material, tensile strength, density, and surface roughness include information about the surface condition of the substrate 100 and the response to stress generated in response to the formation of a wiring pattern on the surface of the substrate 100, and have a significant impact on the quality of the wiring pattern 102. Therefore, it is preferable to include the material, tensile strength, density, and surface roughness as information about the mechanical properties of the substrate 100.

[0058] If the material is soluble in a solvent, its chemical structure is analyzed by solution NMR, GC-MS, and FT-IR. If it is insoluble in a solvent, its chemical structure is analyzed by pyrolysis GC-MS and FT-IR. Based on the type and proportion of the chemical structure of the resin, it is determined to be polypropylene (PP), polyimide (PI), polyester (polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), etc.), polyethersulfone (PES), polycarbonate (PC), polyvinyl alcohol (PVA), polyvinyl butyrate (PBT), etc. Polyvinyl alcohol (PVB), polyacetal (POM), polyarylate (PAR), polyamide (PA) (PA6, PA66, PA612, etc.), polyamide-imide (PAI), polyetherimide (PEI), polyphenylene ether (PPE), modified polyphenylene ether (m-PPE), polyphenylene sulfide (PPS), polyether ketone (PEK), polyether ether ketone (PEEK), polyphthalamide (PPA), polyether nitrile (PENt), polybenzimidazole (PBI), polycarbodiimide, Polymethacrylamide, nitrile rubber, acrylic rubber, polyethylene tetrafluoride, epoxy resin, phenolic resin, melamine resin, urea resin, polymethyl methacrylate resin (PMMA), polybutene, polypentene, ethylene-propylene copolymer, ethylene-butene-diene copolymer, polybutadiene, polyisoprene, ethylene-propylene-diene copolymer, butyl rubber, polymethylpentene (PMP), polystyrene (PS), styrene-butadiene copolymer, polyethylene (PE), polyvinyl chloride (PVC), They are classified into polyvinylidene fluoride (PVDF), phenol novolac, benzocyclobutene, polyvinylphenol, polychloroprene, polyoxymethylene, polysulfone (PSF), polyphenylsulfone resin (PPSU), cycloolefin polymer (COP), acrylonitrile butadiene styrene resin (ABS), acrylonitrile styrene resin (AS), polytetrafluoroethylene resin (PTFE), polychlorotrifluoroethylene (PCTFE), and silicone resin (polysiloxane).

[0059] The Izod impact strength is measured by an Izod impact test in accordance with ASTM D256 using samples prepared in accordance with ISO2818 and JIS K7144.

[0060] The Charpy impact strength is measured by a Charpy impact test in accordance with ISO179-1 for samples prepared in accordance with ISO2818 and JIS K7144.

[0061] The tensile elongation, tensile strength, tensile modulus, tensile strain at break, tensile yield stress, and yield strain are measured by a tensile test in accordance with ISO 527 for a sample prepared in accordance with JIS K7139.

[0062] The tear strength is measured by a tear test in accordance with JIS K7128-3 using a right-angle test piece punched in the MD direction.

[0063] The bending stress, bending strength and bending modulus are measured by a three-point bending test according to JIS K7171 using a sample prepared according to JIS K7139.

[0064] The molding shrinkage is the larger value of the molding shrinkage in MD and TD measured in a molding test in accordance with JIS K7152-4.

[0065] The water absorption rate is measured by the dry weight method in accordance with Method A of JIS K7209 for a sample of the same dimensions as the D1 type of ISO 294-3.

[0066] The density is measured in accordance with Method A of JIS K7112.

[0067] The surface hardness is a Vickers hardness measured in accordance with JIS Z2244 for the surface of a sample on which wiring is to be formed.

[0068] The Rockwell hardness is measured by a Rockwell hardness test in accordance with JIS K7202-2 on a flat plate sample having a thickness of at least 6 mm.

[0069] The surface roughness is the value of the arithmetic mean roughness Ra measured by a surface roughness meter in accordance with JIS B0601 for the sample surface on which wiring is to be formed.

[0070] The information on the optical or electrical properties of the substrate 100 includes color, absorbance, haze, total luminous transmittance, refractive index, volume resistivity, surface resistivity, dielectric loss tangent, dielectric strength, relative dielectric constant, arc resistance, tracking resistance, reflectance, or gloss. In particular, color, absorbance, haze, total luminous transmittance, refractive index, relative dielectric constant, reflectance, and gloss contain information on the response of the substrate to light transmitted through the coating film and have a significant impact on the quality of the wiring pattern 102 formed on the surface of the substrate 100. Therefore, it is preferable that the information on the optical or electrical properties of the substrate 100 include color, absorbance, haze, total luminous transmittance, refractive index, relative dielectric constant, reflectance, and gloss.

[0071] The color is a lab value measured on the surface of a sample on which wiring is to be formed using a colorimeter capable of measuring with a D65 light source, a method in which light is applied at an angle of 45° under optical geometric conditions, and a field of view of 10°.

[0072] The absorbance is measured at a wavelength of 355 nm using a spectrophotometer at a measurement wavelength of 190 to 1100 nm for a sample prepared to a thickness of 100 μm.

[0073] The haze and total light transmittance are measured with a haze meter in accordance with JIS K7136 and JIS K7361-1, and are the haze value and total light transmittance in the wavelength range of 400 to 700 nm.

[0074] The refractive index is measured by a refractometer in accordance with JIS K7142 for a sample prepared to have a width of 8 mm, a length of 20 to 40 mm, and a thickness of 2 μm to 5 mm.

[0075] The volume resistivity and surface resistivity are measured in accordance with JIS C2139 by the voltmeter-current method using a galvanometer.

[0076] The dielectric loss tangent and relative dielectric constant are measured using a sheet or plate sample having a thickness of 1.5 mm or more using an LCR meter in accordance with JIS C2138.

[0077] The dielectric strength is measured by a dielectric strength test in accordance with JIS C2110-1 for samples prepared in accordance with ISO mold type D1 of ISO295, JIS K7154, and JIS K7152-3.

[0078] Arc resistance is measured by an arc discharge deterioration test in accordance with JIS C2135.

[0079] The tracking resistance is measured by a tracking test in accordance with JIS C2137 using a circular rod-shaped sample having an outer diameter of 25 mm±1 mm.

[0080] The reflectance is the reflectance at 355 nm measured with a reflectometer on the surface of a sample on which wiring is to be formed.

[0081] The glossiness is measured by a glossmeter in accordance with JIS Z8741 for the surface of a sample on which wiring is to be formed.

[0082] The information on the thermal properties of the substrate 100 includes the heat resistance temperature, glass transition temperature, Vicat softening temperature, specific heat, thermal conductivity, flammability, oxygen index, linear expansion coefficient, deflection temperature under load, melting point, melt mass-flow rate, or melt volume-flow rate. In particular, the heat resistance temperature, glass transition temperature, Vicat softening temperature, specific heat, thermal conductivity, linear expansion coefficient, deflection temperature under load, and melting point include information on the response of the substrate to heat generated during light irradiation, and have a significant impact on the quality of the wiring pattern 102 formed on the surface of the substrate 100. Therefore, it is preferable that the information on the thermal properties of the substrate 100 include the heat resistance temperature, glass transition temperature, Vicat softening temperature, specific heat, thermal conductivity, linear expansion coefficient, deflection temperature under load, and melting point.

[0083] The heat resistance temperature is measured by a heat sag test in accordance with JIS K7195 using a rectangular sample having a width of 9.8 to 12.8 mm, a length of 125±0.5 mm, and a thickness of 3.2±0.2 mm.

[0084] The glass transition temperature and melting point are measured using a differential scanning calorimeter (DSC) according to JIS K7121 at a heating rate of 20°C / min for a sample having a diameter or length of each side of 0.5 mm or less.

[0085] The Vicat softening temperature is measured by a Vicat test in accordance with JIS K7206 for a square plate sample having a thickness of 3 mm or more and 6.5 mm or less, and a side length of 10 mm or more, or a circular plate sample having a diameter of 10 mm or more.

[0086] The specific heat and thermal conductivity are measured by the flash method in accordance with JIS R1611 for a disk or convex polygonal flat plate sample whose inscribed and circumscribed circle diameters are 4 mm or more and 15 mm or less.

[0087] Flammability is measured by a horizontal burning test and a vertical burning test in accordance with JIS C60695-11-20 using samples prepared in accordance with JIS K7151 and JIS K7152.

[0088] The oxygen index is measured using an oxygen index tester in accordance with JIS K7201-3 for a sample prepared in accordance with 7.2 of JIS K7201-2.

[0089] The linear expansion coefficient is measured in compression mode using a thermomechanical analyzer (TMA) in accordance with JIS K7197 for a cylindrical or prismatic sample having a length of 10 mm and a diameter or side length of approximately 5 mm.

[0090] The deflection temperature under load is measured on a sample prepared in accordance with JIS K7191-1 using a deflection temperature under load tester in accordance with Method B of JIS K7191-2.

[0091] The melt mass flow rate and the melt volume flow rate are measured using a melt indexer in accordance with Method A of JIS K7210-1.

[0092] Next, the acquisition unit 361 acquires thickness information regarding the thickness of the substance 101 disposed on the surface of the substrate 100 (step S102). The thickness information is pre-stored in the second storage unit 31, and the acquisition unit 361 acquires the pre-stored thickness information by reading it from the second storage unit 31. The acquisition unit 361 may also acquire the thickness information by receiving it from an external information processing device via the second communication unit 32. The thickness information indicates the thickness (film thickness) of the substance 101 disposed on the surface of the substrate 100. The thickness information may indicate statistical values ​​such as the average, median, minimum, or maximum thickness values ​​at multiple positions of the substance 101 disposed on the surface of the substrate 100.

[0093] Next, the acquisition unit 361 acquires wiring pattern information related to the wiring pattern 102 on the substrate 100 (step S103). The wiring pattern information is pre-stored in the second storage unit 31, and the acquisition unit 361 acquires the wiring pattern information by reading the pre-stored wiring pattern information from the second storage unit 31. The acquisition unit 361 may also acquire the wiring pattern information by receiving it from an external information processing device via the second communication unit 32.

[0094] The wiring pattern information indicates, for example, the distribution positions of the wiring pattern 102 on the mounting surface of the mounting table 200 (or on the surface of the substrate 100) formed by the laser light irradiation device 2. The wiring pattern information is represented by a group of coordinates of the positions where the wiring pattern 102 is formed in an orthogonal coordinate system, for example, with one of the squares on the mounting surface of the mounting table 200 as the origin and straight lines at the ends of the mounting surface of the mounting table 200 as the coordinate axes. The wiring pattern information may be a predetermined feature amount regarding the distribution positions of the wiring pattern 102. In this case, the acquisition unit 361 may acquire the wiring pattern information by calculating the feature amount based on the distribution positions of the wiring pattern 102 stored in advance in the second storage unit 31 or received from an external information processing device. The feature amount is the size of each of one or more blocks formed from connected wires in the wiring pattern 102. The size is, for example, the maximum length of each block in each axis direction of the orthogonal coordinate system. The size may be the length of the wires included in each block, the area of ​​the circumscribing rectangle of each block, or the like. The feature amount may also be the length or area of ​​the entire wiring pattern 102, etc.

[0095] Next, the acquisition unit 361 acquires the learning model (step S104). The learning model is pre-stored in the second storage unit 31, and the acquisition unit 361 acquires the learning model by reading it from the second storage unit 31. The acquisition unit 361 may acquire the learning model by receiving it from an external information processing device via the second communication unit 32.

[0096] The learning model is trained to output information related to laser light irradiation of a material disposed on the surface of a predetermined substrate when physical property information of the predetermined substrate, thickness information of a material disposed on the surface of the predetermined substrate, and wiring pattern information of a wiring pattern on the predetermined substrate are input. The predetermined substrate is a substrate on which a wiring pattern is formed by irradiating a material disposed on its surface with laser light La. The information related to laser light irradiation includes the intensity of the laser light La, the scanning speed of the laser light La, the spot diameter of the laser light La, the pitch width of the laser light La, or the scanning period of the laser light La.

[0097] The learning model is trained by supervised learning such as neural network or deep learning. For various types of substrates, sets of physical property information, thickness information, and wiring pattern information for each substrate, as well as information on ideal laser light irradiation for forming a high-quality wiring pattern on the surface of each substrate (intensity of laser light La, scanning speed of laser light La, spot diameter of laser light La, pitch width of laser light La, and scanning period of laser light La) are used as training data. The learning model is trained so that when the physical property information, thickness information, and wiring pattern information contained in each training data are input, the intensity of laser light La and scanning speed of laser light La contained in each training data are output.

[0098] In particular, the learning model is trained so that the thicker the material placed on the surface of a predetermined base material input into the learning model, the greater the intensity of the laser light La output from the learning model, the slower the scanning speed of the laser light La, the larger the spot diameter of the laser light La, the larger the pitch width of the laser light La, and / or the smaller the scanning period of the laser light La. Furthermore, the learning model is trained so that the thinner the material placed on the surface of a predetermined base material input into the learning model, the lower the intensity of the laser light La output from the learning model, the faster the scanning speed of the laser light La, the smaller the spot diameter of the laser light La, the smaller the pitch width of the laser light La, and / or the larger the scanning period of the laser light La.

[0099] Furthermore, the learning model is trained so that the thicker the wiring pattern on a predetermined substrate input to the learning model, the faster the scanning speed of the laser light La output from the learning model, the larger the spot diameter of the laser light La, the larger the pitch width of the laser light La, and / or the larger the scanning period of the laser light La. Furthermore, the learning model is trained so that the thinner the wiring pattern on a predetermined substrate input to the learning model, the slower the scanning speed of the laser light La output from the learning model, the smaller the spot diameter of the laser light La, the smaller the pitch width of the laser light La, and / or the smaller the scanning period of the laser light La.

[0100] Furthermore, the learning model is trained so that the longer the length of the wiring pattern on a predetermined substrate input to the learning model, the faster the scanning speed of the laser light La output from the learning model and / or the longer the scanning period of the laser light La. Furthermore, the learning model is trained so that the shorter the length of the wiring pattern on a predetermined substrate input to the learning model, the slower the scanning speed of the laser light La output from the learning model and / or the shorter the scanning period of the laser light La.

[0101] The learning model is generated by the information processing device 3 or an external learning device communicably connected to the information processing device 3 via the second communication unit 32.

[0102] The inventors discovered that the ideal laser beam La irradiation conditions for forming a high-quality wiring pattern on the surface of a substrate depend not only on the material irradiated with the laser beam La but also on the physical properties of the substrate on which the material is disposed. "High quality" refers to, for example, low resistance and high surface smoothness. Specifically, "high quality" refers to "a volume resistivity of 100 μΩcm or less and the formation of a smooth wiring pattern 102 over 50% or more of the irradiated area." The inventors also discovered that there are various physical properties that affect the ideal laser beam La irradiation conditions, and that these properties interact with each other. However, the physical property values ​​of each physical property do not have a simple relationship, such as a linear or monotonically increasing relationship, and the ideal irradiation conditions vary depending on the combination of physical properties. Therefore, it is difficult to create a mathematical formula for deriving the ideal irradiation conditions from each physical property value. The information processing device 3 uses a learning model to calculate the ideal laser beam La irradiation conditions, thereby enabling highly accurate and efficient calculation of the ideal laser beam La irradiation conditions for various types of physical properties with various combinations. Furthermore, by using the learning model, the information processing device 3 can calculate the ideal irradiation conditions of the laser light La for various combinations of various types of physical properties without storing the ideal irradiation conditions themselves of the laser light, thereby reducing the storage capacity of the second storage unit 31. Furthermore, by using the learning model, the information processing device 3 can calculate the ideal irradiation conditions of the laser light La without performing complex determinations according to various combinations of various types of physical properties, thereby reducing the calculation time for the irradiation conditions and the processing load.

[0103] The inventors also discovered that the ideal irradiation conditions of the laser beam La for forming a high-quality wiring pattern on the surface of a substrate depend not only on the physical properties of the substrate on which the substance is disposed but also on the thickness (film thickness) of the substance on the substrate. The information processing device 3 calculates the ideal irradiation conditions of the laser beam La using a learning model, thereby enabling highly accurate and efficient calculation of the ideal irradiation conditions of the laser beam La for various combinations of the physical properties of the substrate and the film thickness of the substance. Furthermore, by using the learning model, the information processing device 3 can calculate the ideal irradiation conditions of the laser beam La for various combinations of the physical properties of the substrate and the film thickness of the substance without storing the ideal irradiation conditions themselves, thereby reducing the storage capacity of the second storage unit 31. Furthermore, by using the learning model, the information processing device 3 can calculate the ideal irradiation conditions of the laser beam La without performing complex judgments according to various combinations of the physical properties of the substrate and the film thickness of the substance, thereby reducing the calculation time for the irradiation conditions and the processing load.

[0104] The inventors also discovered that ideal irradiation conditions of the laser beam La for forming a high-quality wiring pattern on the surface of a substrate depend not only on the physical properties of the substrate on which a substance is disposed but also on the wiring pattern on the substrate. The information processing device 3 calculates ideal irradiation conditions of the laser beam La using a learning model, thereby enabling highly accurate and efficient calculation of ideal irradiation conditions of the laser beam La for various combinations of substrate physical properties and wiring patterns. Furthermore, by using the learning model, the information processing device 3 can calculate ideal irradiation conditions of the laser beam La for various combinations of substrate physical properties and wiring patterns without having to store the ideal irradiation conditions themselves, thereby reducing the storage capacity of the second storage unit 31. Furthermore, by using the learning model, the information processing device 3 can calculate ideal irradiation conditions of the laser beam La without having to perform complex determinations according to various combinations of substrate physical properties and wiring patterns, thereby reducing the calculation time for the irradiation conditions and the processing load.

[0105] Next, the calculation unit 362 inputs the physical property value information, thickness information, and coordinate information acquired by the acquisition unit 361 into the learning model, and acquires information output from the learning model. Based on the information output from the learning model, the calculation unit 362 calculates the irradiation conditions of the laser light La to be irradiated onto the substance 101 arranged on the surface of the substrate 100 (step S105). The irradiation conditions of the laser light La include the intensity of the laser light La, the scanning speed of the laser light La, the spot diameter of the laser light La, the pitch width of the laser light La, or the scanning period of the laser light La.

[0106] For example, the calculation unit 362 calculates the intensity of the laser beam La, the scanning speed of the laser beam La, the spot diameter of the laser beam La, the pitch width of the laser beam La, or the scanning period of the laser beam La itself output from the learning model as the irradiation conditions of the laser beam La. Furthermore, the calculation unit 362 generates control information for controlling the operation of each component of the laser beam irradiator 2 from the intensity of the laser beam La, the scanning speed of the laser beam La, the spot diameter of the laser beam La, the pitch width of the laser beam La, or the scanning period of the laser beam La output from the learning model. The calculation unit 362 may calculate this control information as the irradiation conditions of the laser beam La. The control information includes the intensity of the laser beam La output from the laser beam oscillator 21, and the rotation angles and rotation speeds of the first motor 222 and the second motor 224, etc.

[0107] Finally, the output control unit 363 outputs the irradiation conditions (step S106), and ends the series of calculation processes. The output control unit 363 outputs the irradiation conditions of the laser beam La calculated by the calculation unit 362 by displaying them on the second display unit 33. The output control unit 363 may output the irradiation conditions of the laser beam La calculated by the calculation unit 362 by transmitting them to the laser beam irradiator 2 via the second communication unit 32.

[0108] The laser light irradiation device 2 forms a wiring pattern 102 by irradiating the substance 101 arranged on the surface of the substrate 100 with laser light La based on the irradiation conditions output from the second display unit 33 or the second communication unit 32. The laser light irradiation device 2 controls the operations of the laser light oscillator 21, the first motor 222, and the second motor 224 using the controller 23 in accordance with the irradiation conditions of the laser light La output from the information processing device 3. The laser light irradiation device 2 irradiates the substrate 100 placed on the mounting table 200 with laser light La to thermally bake the substance 101 arranged on the surface of the substrate 100. In this way, the wiring pattern forming system 1 forms the wiring pattern 102 on the surface of the substrate 100.

[0109] The acquisition unit 361 may omit the processing of steps S102 and / or S103. In this case, the calculation unit 362 inputs the physical property value information acquired by the acquisition unit 361 into the learning model, and calculates the irradiation conditions of the laser light La to be irradiated onto the substance 101 arranged on the surface of the substrate 100 based on the information output from the learning model. Furthermore, the learning model is trained to output information regarding laser light irradiation onto the substance arranged on the surface of a predetermined substrate when physical property value information of the predetermined substrate is input.

[0110] Furthermore, when information on laser light irradiation of the material arranged on the surface of the predetermined substrate is input in addition to information on the physical property values ​​of the predetermined substrate, information on the thickness of the material arranged on the surface of the predetermined substrate, and information on the wiring pattern on the predetermined substrate, the learning model acquired in the processing of step S104 may be trained to output information on the quality of the wiring pattern formed by irradiating the material arranged on the surface of the predetermined substrate with laser light La based on the information on laser light irradiation. The information on the quality of the wiring pattern includes the volume resistivity and surface smoothness of the wiring pattern.

[0111] The learning model may be trained by supervised learning such as a neural network or deep learning. For various types of substrates, sets of physical property information, thickness information, wiring pattern information, and information on laser light irradiation for each substrate, as well as quality information (volume resistivity and surface smoothness of the wiring pattern) are used as training data. The learning model is trained so that, when the physical property information, thickness information, wiring pattern information, and information on laser light irradiation included in each training data are input, the volume resistivity and surface smoothness of the wiring pattern included in each training data are output. The learning model can determine information on the most ideal laser light irradiation from the quality information output when certain physical property information, thickness information, wiring pattern information, and information on laser light irradiation are input.

[0112] In this case, the acquiring unit 361 acquires information about laser light irradiation in addition to the physical property information, thickness information, and coordinate information. Information about different laser light irradiations is pre-stored in the second storage unit 31, and the acquiring unit 361 acquires the information about laser light irradiation by reading the pre-stored information from the second storage unit 31. Alternatively, the information about laser light irradiation may be stored in, for example, an external information processing device, and the acquiring unit 361 may acquire the information about laser light irradiation by receiving it from the external information processing device via the second communication unit 32.

[0113] In the process of step S105, the calculation unit 362 inputs information about each laser beam irradiation to the learning model while changing the information about the laser beam irradiation, in addition to the physical property value information, thickness information, and coordinate information acquired by the acquisition unit 361, and acquires information about quality output from the learning model. The calculation unit 362 calculates, as the irradiation conditions for the laser beam La, information about the laser beam irradiation that results in the highest quality indicated in the information output from the learning model. For example, the calculation unit 362 calculates, as the irradiation conditions for the laser beam La, information about the laser beam irradiation that results in the lowest volume resistivity of the wiring pattern 102. Alternatively, the calculation unit 362 may calculate, as the irradiation conditions for the laser beam La, information about the laser beam irradiation that results in the largest area occupied by the smooth wiring pattern 102 in the irradiated area. Alternatively, the calculation unit 362 may calculate, as the irradiation conditions for the laser beam La, information about the laser beam irradiation that results in the largest sum or weighted sum of the inverse of the volume resistivity of the wiring pattern 102 and the area occupied by the smooth wiring pattern 102 in the irradiated area. Alternatively, the calculation unit 362 may calculate, as the irradiation conditions for the laser light La, information about a plurality of laser light irradiations that satisfy the above-mentioned "high quality" from among the qualities indicated in the information output from the learning model.

[0114] Furthermore, the calculation unit 362 may calculate control information generated from the information related to the laser light irradiation as the irradiation conditions of the laser light La. In this way, the calculation unit 362 calculates the irradiation conditions of the laser light La to be irradiated onto the substance 101 arranged on the surface of the base material 100, based on the information output from the learning model.

[0115] In this case, the acquisition unit 361 may also omit the processing of steps S102 and / or S103. In this case, the calculation unit 362 inputs the physical property value information and information related to each laser light irradiation acquired by the acquisition unit 361 into the learning model, and calculates the irradiation conditions of the laser light La to be irradiated onto the substance 101 arranged on the surface of the substrate 100 based on the information output from the learning model. Furthermore, the learning model is trained to output information related to quality when predetermined physical property value information of the substrate and predetermined information related to each laser light irradiation are input.

[0116] 5A to 5C are diagrams showing examples of experimental results relating to physical property information, irradiation conditions of the laser light La, and characteristics of the wiring pattern 102. FIG.

[0117] 5(A) to 5(C) show an example of the characteristics of the wiring pattern 102 formed on the surface of the substrate 100 in accordance with the physical property information input to the learning model, the intensity and scanning speed of the laser light La calculated by the calculation unit 362, and the intensity and scanning speed of the laser light La in the calculation process shown in FIG. 4. "Experiment No." indicates the management number. "Physical property value (input)" indicates an example of the physical property information of the substrate 100. "Irradiation conditions (output) of the laser light La" indicates an example of the intensity and scanning speed of the laser light La. "Experiment results" indicate the characteristics of the wiring pattern 102 formed on the surface of the substrate 100. The characteristics are the volume resistivity of the wiring pattern 102 and the characteristics of the wiring pattern 102 when viewed visually or with a microscope image.

[0118] 5A shows the experimental results for a learning model trained using the mechanical properties "material" and "density," the optical or electrical property "dielectric strength," and the thermal properties "load deflection temperature" and "specific heat" as physical property value information of the substrate 100. As shown in FIG. 5A, it was confirmed that a smooth wiring pattern 102 having a low volume resistivity and no irregularities was formed for each substrate 100 having different physical properties. In other words, it was confirmed that the calculation unit 362 calculated ideal laser light irradiation conditions for each substrate 100 having different physical properties.

[0119] 5(B) shows the experimental results for a learning model trained using the mechanical properties "tensile strength" and "flexural modulus," the optical or electrical property "volume resistivity," and the thermal properties "load deflection temperature" and "thermal conductivity" as physical property value information of the substrate 100. As shown in FIG. 5(B), it was confirmed that a smooth wiring pattern 102 having a low volume resistivity and no irregularities was formed for each substrate 100 having different physical properties. In other words, it was confirmed that the calculation unit 362 calculated ideal laser light irradiation conditions for each substrate 100 having different physical properties.

[0120] 5(C) shows the experimental results for a learning model trained using the mechanical properties "water absorption" and "density," the optical or electrical property "dielectric constant," and the thermal properties "linear expansion coefficient" and "thermal conductivity" as physical property value information of the substrate 100. As shown in FIG. 5(C), it was confirmed that a smooth wiring pattern 102 having a low volume resistivity and no irregularities was formed for each substrate 100 having different physical properties. In other words, it was confirmed that the calculation unit 362 calculated ideal laser light irradiation conditions for each substrate 100 having different physical properties.

[0121] 5(A) to 5(C), the inventors have confirmed that ideal irradiation conditions can be derived for combinations of other physical properties. In particular, the inventors have confirmed that ideal irradiation conditions can be derived for combinations of various mechanical properties, optical properties or electrical properties, and thermal properties of the substrate 100.

[0122] As described above in detail, the wiring pattern forming system 1 uses a learning model to calculate the irradiation conditions of the laser light La to be irradiated onto the substance 101 arranged on the surface of the substrate 100, from the physical property value information of the substrate 100. This allows the wiring pattern forming system 1 to present appropriate irradiation conditions of the laser light La to be irradiated onto the substance 101 arranged on the surface of the substrate 100. Furthermore, the wiring pattern forming system 1 irradiates the substrate 100 with the laser light La in accordance with the presented irradiation conditions. This allows the wiring pattern forming system 1 to form a high-quality wiring pattern 102.

[0123] Furthermore, even for unknown substrates, not just known substrates, the wiring pattern formation system 1 can input physical property information of the unknown substrate into the learning model to calculate appropriate irradiation conditions for the laser beam La from physical property information of a substrate that is close to the physical property information of the unknown substrate. Therefore, the wiring pattern formation system 1 can propose appropriate irradiation conditions for the laser beam La for the unknown substrate.

[0124] FIG. 6 is a diagram showing a schematic configuration of an information processing device 300 according to another embodiment.

[0125] As shown in Fig. 6, the information processing device 300 has the respective components of the information processing device 3 shown in Fig. 3 and the respective components of the laser light irradiation device 2 shown in Fig. 2. The second storage unit 31, the second communication unit 32, the second display unit 33, and the second operation unit 34 of the information processing device 300 shown in Fig. 6 function as the first storage unit 24, the first communication unit 25, the first display unit 26, and the first operation unit 27 of the laser light irradiation device 2 shown in Fig. 2. The processing unit 36 ​​of the information processing device 300 shown in Fig. 6 has, as functional blocks, an acquisition unit 361, a calculation unit 362, and an output control unit 363, similar to the processing unit 36 ​​of the information processing device 3 shown in Fig. 3.

[0126] In this case as well, the wiring pattern forming system 1 uses the learning model to calculate the irradiation conditions of the laser light La to be irradiated onto the substance 101 arranged on the surface of the substrate 100, from the physical property value information of the substrate 100. This allows the wiring pattern forming system 1 to present appropriate irradiation conditions of the laser light La to be irradiated onto the substance 101 arranged on the surface of the substrate 100. Furthermore, the wiring pattern forming system 1 irradiates the laser light La onto the substrate 100 in accordance with the presented irradiation conditions. This allows the wiring pattern forming system 1 to form a high-quality wiring pattern 102.

[0127] It should be understood by those skilled in the art that various changes, substitutions, and alterations can be made to the present disclosure without departing from the spirit and scope of the present disclosure. For example, the processes of the above-described parts may be executed in a different order as appropriate within the scope of the present disclosure. Furthermore, the above-described embodiments and modifications may be implemented in appropriate combinations as appropriate within the scope of the present disclosure. [Explanation of symbols]

[0128] 1. Wiring pattern formation system 3,300 information processing equipment 361 Acquisition Department 362 Calculation Unit 363 Output Control Unit

Claims

1. an acquisition unit that acquires physical property information relating to physical property values ​​of a substrate on which a wiring pattern is formed by irradiating a substance disposed on a surface with laser light, and information relating to the irradiation of the substance disposed on the surface of the substrate with laser light; a calculation unit that inputs the physical property value information acquired by the acquisition unit and information regarding the predetermined laser light irradiation into a learning model that has been trained to output information regarding the quality of a wiring pattern formed by irradiating a material arranged on the surface of the predetermined substrate with laser light based on the information regarding the laser light irradiation when physical property value information of the physical property value of the predetermined substrate and information regarding laser light irradiation to the material arranged on the surface of the predetermined substrate are input, and calculates irradiation conditions for the laser light to be irradiated to the material arranged on the surface of the substrate based on the information output from the learning model; an output unit that outputs the irradiation conditions; An information processing device comprising:

2. The information processing device according to claim 1 , wherein the physical property value information includes at least one of information on mechanical properties of the substrate, information on optical properties or electrical properties of the substrate, and information on thermal properties of the substrate.

3. The information processing device according to claim 2, wherein the physical property information includes at least one of information relating to mechanical properties of the substrate, at least one of information relating to optical properties or electrical properties of the substrate, and at least one of information relating to thermal properties of the substrate.

4. The information on the mechanical properties of the substrate includes material, Izod impact strength, Charpy impact strength, tensile elongation, tensile strength, tensile modulus, tensile break strain, tensile yield stress, tear strength, flexural stress, flexural strength, flexural modulus, yield strain, molding shrinkage, water absorption, density, surface hardness, Rockwell hardness, or surface roughness; The information regarding the optical or electrical properties of the substrate includes color, absorbance, haze, total light transmittance, refractive index, volume resistivity, surface resistivity, dielectric tangent, dielectric strength, relative dielectric constant, arc resistance, tracking resistance, reflectance, or glossiness; The information on the thermal properties of the substrate includes heat resistance temperature, glass transition temperature, Vicat softening temperature, specific heat, thermal conductivity, flammability, oxygen index, linear expansion coefficient, deflection temperature under load, melting point, melt mass flow rate, or melt volume flow rate. The information processing device according to claim 3 .

5. the acquisition unit further acquires thickness information relating to a thickness of a substance disposed on the surface of the base material and wiring pattern information relating to a wiring pattern on the base material; the learning model is trained to output information about the quality when thickness information of a material disposed on the surface of the predetermined substrate and wiring pattern information of a wiring pattern on the predetermined substrate are input in addition to physical property value information of the predetermined substrate and information about the laser light irradiation, the calculation unit inputs the physical property information, thickness information, wiring pattern information, and information on laser light irradiation acquired by the acquisition unit into the learning model, and calculates the irradiation conditions based on the information output from the learning model. The information processing device according to claim 1 .

6. The information processing apparatus according to claim 1 , wherein the irradiation conditions include an intensity of a laser beam or a scanning speed of the laser beam.

7. The information processing device according to claim 1 , wherein the substance includes a metal, a metal oxide, graphene, graphite, or a polymer material that becomes conductive when irradiated with laser light.

8. A wiring pattern forming system having an information processing device and a laser light irradiation device, The information processing device includes: an acquisition unit that acquires physical property information relating to physical property values ​​of a substrate on which a wiring pattern is formed by irradiating a substance disposed on a surface with laser light, and information relating to the irradiation of the substance disposed on the surface of the substrate with laser light; a calculation unit that inputs the physical property value information acquired by the acquisition unit and information regarding the predetermined laser light irradiation into a learning model that has been trained to output information regarding the quality of a wiring pattern formed by irradiating a material arranged on the surface of the predetermined substrate with laser light based on the information regarding the laser light irradiation when physical property value information of the physical property value of the predetermined substrate and information regarding laser light irradiation to the material arranged on the surface of the predetermined substrate are input, and calculates irradiation conditions for the laser light to be irradiated to the material arranged on the surface of the substrate based on the information output from the learning model; an output unit that outputs the irradiation conditions, the laser light irradiation device has a forming unit that forms a wiring pattern by irradiating a material disposed on the surface of the base material with laser light based on the irradiation conditions output from the output unit; A wiring pattern forming system comprising:

9. By computer, acquiring physical property information relating to the physical property values ​​of a substrate on which a wiring pattern is formed by irradiating a substance disposed on a surface with laser light, and information relating to the irradiation of the substance disposed on the surface of the substrate with laser light; inputting the acquired physical property information and information regarding the predetermined laser light irradiation into a learning model that has been trained to output information regarding the quality of a wiring pattern formed by irradiating a material arranged on the surface of the predetermined substrate with laser light based on the information regarding the laser light irradiation when physical property value information of the physical property values ​​of the predetermined substrate and information regarding laser light irradiation to the material arranged on the surface of the predetermined substrate are input; and calculating irradiation conditions for the laser light to be irradiated to the material arranged on the surface of the substrate based on the information output from the learning model; outputting the irradiation conditions; 1. An information processing method comprising:

10. A control program for a computer having an output unit, acquiring physical property information relating to the physical property values ​​of a substrate on which a wiring pattern is formed by irradiating a substance disposed on a surface with laser light, and information relating to the irradiation of the substance disposed on the surface of the substrate with laser light; inputting the acquired physical property information and information regarding the predetermined laser light irradiation into a learning model that has been trained to output information regarding the quality of a wiring pattern formed by irradiating a material arranged on the surface of the predetermined substrate with laser light based on the information regarding the laser light irradiation when physical property value information of the physical property values ​​of the predetermined substrate and information regarding laser light irradiation to the material arranged on the surface of the predetermined substrate are input; and calculating irradiation conditions for the laser light to be irradiated to the material arranged on the surface of the substrate based on the information output from the learning model; The irradiation conditions are output by the output unit. A control program that causes the computer to execute the above steps.

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