Liquid immersion cooling platform with adjustable weir and multi-function computing device handle

Abstract

A submersion cooling system and method of operating the system are described. The system can include a vessel configurable to hold a thermally conductive dielectric fluid, a computer component configurable to be at least partially submerged in the dielectric fluid, and a fluid circulation system configurable to draw the dielectric fluid from a sump region of the vessel, pass the dielectric fluid through a filter, and deliver the dielectric fluid to a bath region of the vessel. In one exemplary embodiment, there can be an adjustable weir between the bath region and the sump region. A multi-function handle is also described.

Description

Technical Field

[0001] [Cross - References to Related Applications] This application claims priority to U.S. Application No. 63 / 327737 ( docket number 121219.0000141), filed on April 5, 2022, and U.S. Application No. 63 / 327729 ( docket number 121219.0000138), filed on April 5, 2022, which are hereby incorporated by reference.

[0002] This application is also related to International Publication No. WO2020 / 102090, titled "Immersion Cooling Platform" owned by TMGCore, filed on November 11, 2019, which is hereby incorporated by reference.

[0003] The present disclosure relates to an immersion cooling system adapted for a home computing device, for example, an immersion cooling system including a control system for optimizing the temperature of the system.

[0004] The present disclosure also relates to a single - phase immersion cooling system and process that may include, for example, a multi - functional computing device handle.

Background Art

[0005] Conventional computing and / or server systems utilize air to cool various components of those systems. Conventional liquid or water-cooled computers use a flowing liquid to extract heat from computer components, but avoid direct contact between the computer components and the liquid itself. The development of electrically non-conductive and / or dielectric fluids has enabled the use of immersion cooling, in which computer components and other electronic devices are immersed in a dielectric or electrically non-conductive liquid to extract heat directly from the components into the liquid. Immersion cooling can reduce the total energy required to cool computer components and can also reduce the amount of space and equipment required for proper cooling. Exemplary prior art two-phase immersion cooling systems and processes are described, for example, in U.S. Patent No. 11013144, which is incorporated herein by reference.

[0006] Immersion cooling systems are being implemented for a variety of computing needs. Therefore, it is beneficial to describe an immersion cooling system that can be easily adapted to a taut transfer mechanism of dielectric fluid between the bath area and the drain reservoir area using an adjustable weir. [Overview of the project]

[0007] Advantageously, the present application relates to an exemplary immersion cooling system and a method for operating the system. In one embodiment, the system may include a container configurable to hold a thermally conductive dielectric fluid, a computer component configurable to be at least partially immersed in the dielectric fluid, and a fluid circulation system configurable to draw the dielectric fluid from a sump region of the container, filter the dielectric fluid, and deliver the dielectric fluid to a bath region of the container. In one exemplary embodiment, there may be an adjustable weir between the bath region and the sump region.

[0008] In one exemplary embodiment, the adjustable weir can be detachably fixed to the wall between the bath area and the sump area. In one exemplary embodiment, the adjustable weir can be fixed to the wall between the bath area and the sump area using screws. In one exemplary embodiment, the system may include an actuator for moving the adjustable weir. In one exemplary embodiment, the system may include a management system that receives sensor data and instructs the actuator to move the adjustable weir. In one exemplary embodiment, the sensor data may be the fluid level in the bath area or the sump area. In one exemplary embodiment, the sensor data may be the temperature of the dielectric fluid in the bath area or the sump area. In one exemplary embodiment, the management system may be configured to instruct the actuator to move the adjustable weir wall asymmetrically.

[0009] Embodiments of the disclosure of the present invention described below describe single-phase immersion cooling using an oil such as mineral oil. Advantageously, in one embodiment, the application relates to a cooling system for computing components comprising a container having a bottom. The container includes a central reservoir comprising a heat exchanger for cooling a dielectric fluid. The container also includes a first tank configured to hold one or more computer components at least partially immersed in the dielectric fluid, the first tank being located on one side of the central reservoir. The container also includes a second tank configured to hold one or more computer components at least partially immersed in the dielectric fluid, the second tank being located on the other side of the central reservoir, opposite the first tank. The container is a perforated plate, which is lifted from the bottom of the container to form a volume between the bottom of the container and the perforated plate, the volume comprising (1) a first volume below the central reservoir, (2) a second volume below the first tank, and (3) a third volume below the second tank. The container is configured such that, while one or more computer components are operating, a dielectric fluid circulates from the first volume below the central reservoir to the second and third volumes, respectively, from the second volume to the first tank, from the third volume to the second tank, from the first tank to the central reservoir, from the second tank to the central reservoir, and from the central reservoir to the first volume below the central reservoir. This is advantageous for providing efficient and effective cooling of the computer components.

[0010] In another embodiment, the present application relates to a multifunctional handle for computer devices. A unique multifunctional handle is advantageous because it allows handling of computer devices without contact with fluids, provides cable management, acts as a heat sink, and acts as a device identifier.

[0011] These and other purposes, features and advantages of the exemplary embodiments of this disclosure will become apparent upon reading the following detailed description of the exemplary embodiments of this disclosure in conjunction with the appended claims.

[0012] This summary of the invention is provided to introduce, in a brief form, the concepts that will be further described in the following detailed description. This summary of the invention is not intended to identify the main or essential features of the subject matter of the claims, nor is it intended to be used as an aid in determining the claims. [Brief explanation of the drawing]

[0013] To illustrate how the above and other advantages and features can be obtained, a more specific description of the subject matter briefly described above will be given with reference to specific embodiments shown in the accompanying drawings. Understanding that these drawings only show typical embodiments and are therefore not intended to limit the scope, embodiments will be described and explained with additional specificity and detail using the accompanying drawings. [Figure 1] Figure 1 shows an immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 2] Figure 2 shows another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 3] Figure 3 shows a top view of an immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 4A] Figure 4A shows a top view of another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 4B] Figure 4B shows a side view of an immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5A] Figure 5A shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5B] Figure 5B shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5C] Figure 5C shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5D] Figure 5D shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5E] Figure 5E shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5F] Figure 5F shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5G] Figure 5G shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5H] Figure 5H shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5I] Figure 5I shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5J] Figure 5J shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5K] Figure 5K shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5L] Figure 5L shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5M] Figure 5M shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5N] Figure 5N shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 6A] Figure 6A shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 6B] Figure 6B shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 6C] Figure 6C shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 6D] Figure 6D shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 6E] Figure 6E shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 6F]Figure 6F shows yet another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 7] Figure 7 shows a typical single-phase immersion cooling tank equipped with a heat exchanger and weir channels. [Figure 8] Figure 8 shows the fluid flow in a weir channel in a typical single-phase immersion cooling tank. [Figure 9] Figure 9 shows the flow pattern for mixing at the bottom of a typical single-phase immersion cooling tank in the area below where the server is located. [Figure 10] Figure 10 shows a typical unique handle configured to be bolted to the location of, for example, an OEM fan. [Figure 11] Figure 11 shows a typical unique handle bolted to the computing device at the OEM fan location. [Modes for carrying out the invention]

[0014] To illustrate the various features of the present invention, exemplary embodiments of the invention are described below. The embodiments described herein are not intended to limit the scope of the invention, but rather to provide examples of its components, uses, and operation.

[0015] Liquid immersion cooling system In one exemplary embodiment, the immersion cooling system or container may include a bath area, a sump area, an adjustable weir (e.g., between the bath area and the sump area), a computing device, a robot, a pressure control system, and a management system. The container may be a pressure-controlled tank maintained at atmospheric pressure (or within its range), which can be cooled using a heat exchanger. The computing device may be immersed in a dielectric fluid in the bath area of ​​the container. The computing device may be network-connected and capable of performing various processing and computing tasks while immersed in the dielectric fluid (or fluid). The container may include a lid for accessing the bath area, the computing device, and the sump area. The container may be fluid-connected to a pressure control system. A robot may lift the computing device from the bath area of ​​the container when the lid is open. The robot may place the lifted computing device in a magazine provided for housing the computing device or on a vehicle. The robot may also lift the computing device from the magazine (or vehicle) and place it in the location where the computing device was lifted from the bath area. The robot may be mounted on the container, the vehicle, or another location. In this exemplary embodiment, the container may be a two-phase cooling system. In other exemplary embodiments, the container may be a single-phase cooling system having one or more of the components described above.

[0016] In one exemplary embodiment, a pump can circulate fluid within a container. For example, the pump can draw dielectric fluid from a sump area and transfer the fluid to a bath area. The fluid can then flow over an adjustable weir and return to the sump area. In one exemplary embodiment, the height of the adjustable weir can be changed, for example, using instructions provided by an actuator and / or management system. In one exemplary embodiment, the depth of the dielectric fluid (or fluid) can be changed, for example, as a result of removing a computing device from or adding a computing device to the bath area. The depth of the dielectric fluid can also be changed, for example, when different computing components are used within the bath area. In this exemplary embodiment, it may be beneficial to adjust the height of the adjustable weir to control the flow of dielectric fluid and / or the depth of dielectric fluid within the bath area.

[0017] For example, in one exemplary embodiment, it may be desirable to have less fluid in the bath area. In this example, the adjustable weir can be lowered to reduce the depth of the dielectric fluid. In another example, the arrangement of a group of computing devices performing a specific task may generate more heat compared to the average operation of the vessel. In this example, it may be desirable to have more fluid in the tank to compensate for the rapid evaporation of the fluid. In this example, the height of the adjustable weir can be raised.

[0018] In one example, the management system can be configured with or without software to receive any data generated by any of the sensors included in the immersion cooling system. In one example, the management system can make adjustments, issue warnings, and / or take other appropriate actions based, for example, on sensor readings. For example, the management system can adjust or control adjustable weirs, heating elements, fluid flow or temperature, pressure, fluid level, fluid purity, and / or any number of other system parameters. Such adjustments are often based on one or more sensed parameters of the immersion cooling system. Sensed parameters may include, for example, temperature (inside or outside the container), pressure, fluid level (in the bath or sump area), or power consumption of the system.

[0019] Figure 1 shows an immersion cooling system 100 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the immersion cooling system 100 may include a container 105 and a vehicle 130. The container 105 may include a tank 119 containing a bath area 111, a sump area 112, an adjustable weir 140, fluid 113, a computer component 114, a pump 115, a filter 118, a door 116, a management system 117, a heat exchanger 110, and a pass-through plate 120. The computer component 114 can be submerged in the fluid 113. The vehicle 130 may include a robot 131. The robot 131 can lift the computer component 114 when the door 116 is open and place the computer component 114 in the vehicle 130. The adjustable weir 140 can move up and down according to instructions provided by the management system 117, for example, using an actuator. For example, based on sensor readings of the fluid level in the bath area 111, the management system 117 can instruct the adjustable weir 140 to move up and down to facilitate the transfer of fluid from the bath area 111 to the sump area 112.

[0020] In one exemplary embodiment, the immersion cooling system may be a single-phase immersion cooling system. For example, the immersion cooling system may include a tank that holds a certain amount of dielectric fluid. The tank may also be configured to hold computer components. A pump can draw the dielectric fluid from the sump region and transfer it to the tank. In this exemplary embodiment, the pump may allow the fluid to flow into the sump region across an adjustable weir.

[0021] Figure 2 shows an immersion cooling system 200 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the immersion cooling system 200 may include a tank 210 comprising a bath area 211, a sump area 212, an adjustable weir 240, a fluid 213, a computer component 214, a pump 215, a heat exchanger 219, a door 216, and a control system 217. The computer component 214 can be immersed in the fluid 213. The adjustable weir 240 can be moved up and down by instructions provided by the control system 217, for example, using an actuator 241. For example, based on sensor readings of the fluid level in the bath area 211, the control system 217 may instruct the adjustable weir 240 to move up and down to facilitate the transfer of the fluid 213 from the bath area 211 to the sump area 212. In this exemplary embodiment, the tank 210 may not be pressure-controlled, but in some other exemplary embodiments, the tank may be pressure-controlled. In this exemplary embodiment, the door 216 can be removed, and the computer component 214 can be lifted out of (or returned to) the tank. The management system 217 can adjust the height of the adjustable weir 240 to maintain the level of the fluid 213 in the tank 210.

[0022] Figure 3 shows a top view of an immersion cooling system 200 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the sump area 212 is adjacent to the bath area 211, and the adjustable weir 240 is located between the bath area 211 and the sump area 212.

[0023] Figure 4A shows a top view of an immersion cooling system 400 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the adjustable weir 440 is a channel located in the center of the bath area 411. The adjustable weir 440 or channel can move up and down to facilitate the transfer of fluid to the outside of the tank 410. Figure 4B shows a side view of an immersion cooling system 400 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the adjustable weir 440 is connected to a pump 415, for example, via a flexible pipe. The adjustable weir 440 can move up and down to the appropriate level with the fluid 413.

[0024] In one exemplary embodiment, the adjustable weir can be connected to a motor or actuator that can facilitate the movement of the weir. In another exemplary embodiment, the weir can be detachably fixed to the body or tank of the bath area, for example, using screws, and can be moved up and down by adjusting the height of the weir, for example, by removing the screws.

[0025] In one exemplary embodiment, the management system may include a module for estimating the appropriate position of the weir. For example, the module may receive sensor data such as the fluid level in the bath or sump area, the temperature of the fluid or computing components, ambient temperature, fluid viscosity, or other sensor data, and based on that sensor data, it may determine the appropriate height of the fluid in the bath area. The management system can then instruct a motor or actuator to adjust the weir height accordingly. For example, if the fluid level falls below an acceptable level due to the removal of one or more computing components, the management system may instruct an actuator to lower an adjustable weir. On the other hand, if the fluid level in the sump area increases due to the addition of a computing component, the management system may move the weir to rise so that the bath area can hold the additional fluid.

[0026] In one exemplary implementation, the actuator can move the weir asymmetrically (for example, moving one side more or less than the other). Asymmetric movement of the weir can, for example, tilt the weir. Asymmetric movement of the weir can facilitate asymmetric fluid movement from the bath area. For example, if one side of the weir is lower than the other side, more fluid can move from the lower side out of the bath area. Asymmetric movement of the weir is beneficial, for example, if one side of the tank is warmer than the other side, so it may be desirable for the fluid to move more quickly from the warmer or colder side to the other side.

[0027] Figures 5A to 5L show an immersion cooling system 500 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the immersion cooling system 500 may include a tank 510, a bath area 511, a sump area 512, a pump 515, a heat exchanger 519, and a computer component 514. The bottom of the bath area 511 may be provided with a distribution channel that allows the dielectric fluid to be distributed into the bath area 511. For example, the pump 515 can draw fluid from the sump area and distribute it through the distribution channel 550 in the bath area 511. A grid may be provided above the distribution channel 550. The computer component 514 may be arranged on the grid 560, for example, using a rack system. In this exemplary embodiment, the sump area 512 may be above the pump 515 and the heat exchanger 519. The heat exchanger can receive heated dielectric fluid from the tank and cool the dielectric fluid with another fluid, such as water. The heat exchanger can receive cooling water and discharge heated water. The discharged heated water can be cooled in another facility or location. An adjustable weir 540 may be located between the bath area 511 and the sump area 512. In this example, the adjustable weir can be moved up and down (or even asymmetrically up and down) to facilitate the transfer of fluid from the bath area 511 to the sump area 512.

[0028] Figures 5M and 5N show an exemplary adjustable weir that can be detachably attached to the wall between the bath area and the sump area. In this example, the adjustable weir 551 is fixed to the wall 555 between the bath area 511 and the sump area 512 using screws 558. In Figure 5N, the weir 552 is moved below the weir 551. In this example, the dielectric fluid can exit the bath area 511 from the left side of the bath area.

[0029] Figures 6A to 6F show an immersion cooling system 600 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the immersion cooling system 600 may include a container 605, a tank 610, a bath area 611, a sump area 612, a pump 615, a heat exchanger 619, and a computer component 614. A distribution system may be provided at the bottom of the bath area 611 to allow fluid to be distributed into the bath area 611. A grid 660 may be provided above the distribution system 650. In this exemplary embodiment, an adjustable weir wall 640 may also be provided between the bath area 611 and the sump area 612. In this exemplary embodiment, the adjustable weir wall 640 can be removably fixed (for example, using screws) to the wall between the bath area 611 and the sump area 612. The screws can be removed and the adjustable weir wall can be moved up and down so that a desired amount of fluid is discharged from the bath area 611.

[0030] Single-phase system and method In one embodiment, the present application relates to a single-phase immersion system which may include a container configured to contain a thermally conductive dielectric fluid, such as mineral oil, in a liquid phase. A rack may be configured to hold one or more computer components such that one or more computer components are at least partially immersed in the liquid of the dielectric fluid. A heat exchanger may be used for cooling.

[0031] In another embodiment of single-phase immersion, the system has two separate tanks for server placement with a central reservoir. Weir channels surrounding each tank force the fluid to collect in the central reservoir. The fluid collected in the central reservoir is pumped into two side heat exchangers, one side for the fluid and the other side for the house cooling water. The house water and plate exchangers work together to remove heat from the fluid. From the heat exchangers, the fluid is forced to the bottom of each tank, mixed in the area below the server, and then forced to flow from the bottom to the top of each tank, resulting in flowing into the weir channels.

[0032] Figures 7 and 8 show a typical single-phase immersion cooling tank including a heat exchanger and multiple weirs. As shown in Figures 7 and 8, there are two separate tanks for server placement with a central reservoir. Weir channels surrounding each tank force the fluid into the central reservoir. The fluid is collected in the central reservoir and pumped into two side heat exchangers, one side for the fluid and the other side for the house cooling water. The house water and plate exchangers work together to remove heat from the fluid. From the heat exchangers, the fluid is forced into the bottom of each tank, as shown in Figure 9, and mixed in the area below the server. From the area below the server, the fluid flows from the bottom of each tank to the top of the tank, and consequently into the weir channels.

[0033] In this configuration, a perforated plate is lifted from the bottom of the container, creating a volume between the bottom of the container and the perforated plate. This volume includes (1) a first volume below the central reservoir, (2) a second volume below the first tank, and (3) a third volume below the second tank. The container is configured such that, while one or more computer components are operating, the dielectric fluid circulates from the first volume below the central reservoir to the second and third volumes respectively, from the second volume to the first tank and from the third volume to the second tank, from the first tank to the central reservoir and from the second tank to the central reservoir, and from the central reservoir to the first volume below the central reservoir. Because the pump is typically located in the center, the upward flow rate through the perforated plate is not uniform and decreases with distance from the pump. Distributing the fluid unevenly through multiple holes favorably promotes cooling efficiency.

[0034] The vessel can be configured so that, while one or more computer components are operating, a dielectric fluid circulates from a first volume below the central reservoir to the second and third volumes, respectively, from the second volume to the first tank, from the third volume to the second tank, from the first tank to the central reservoir, from the second tank to the central reservoir, and from the central reservoir to the first volume below the central reservoir. Such flow patterns are shown in Figures 8 and 9.

[0035] In some embodiments, a multi-function handle is used with the computing device to be cooled. The handle is advantageous because it allows handling of the computing device without contact with fluids, provides cable management, functions as a heatsink, and / or serves as a device identifier.

[0036] Multifunctional handle for computing devices Figure 10 shows a typical custom handle configured to be bolted to, for example, the location of an OEM fan. Figure 11 shows a typical custom handle bolted to a computing device at the OEM fan location. Such handles may be useful in single-phase or two-phase immersion cooling systems used, for example, in cryptocurrency mining or cooling servers. By configuring the handle to be bolted to, for example, the location of the OEM fan by bolts or screws, the handle can be advantageously secured without the drilling or time required to create a new mounting point.

[0037] The handle generally includes a bar or other gripping mechanism with opposing brackets configured to be attached to a computing device to be cooled. The height of the handle from the mounting point to the bar or other gripping mechanism may vary depending on the application. Generally, the height is sufficient to prevent the user from having to touch the immersion fluid when removing the device. In some embodiments, the handle may be made height-adjustable, for example, by adding an additional bracket and / or having a telescopic assembly with a locking mechanism.

[0038] In some embodiments, the side mounting bracket may have one or more openings to facilitate the flow of dielectric fluid and enhance cooling. Such openings may vary in size and shape depending on the application. As shown in Figures 10 and 11, the openings are slits, but several other shapes may also be used. Slits or other openings may also be used for cable management within the immersion tank. That is, system power and / or network cables may be secured to the handle using ties, wires, Velcro®, or other suitable fasteners that extend through the openings and around the cables.

[0039] The handle can also be used as a heat sink to assist in cooling the computing device. That is, heat from the dielectric fluid can be transferred via conduction to the side mounting bracket, then to the bar or other gripping device, and then to the air to which the bar or other gripping device is exposed.

[0040] The bar or other gripping device and mounting bracket may be made of the same or different materials, and the material may vary depending on the application. Suitable materials include metals such as aluminum, copper, steel, and mixtures thereof.

[0041] The portion of the handle that is not exposed to the fluid, such as a bar or other gripping device, may include etching, stickers, or other identifying features to identify the computer device to which it is attached. In this way, adhesive stickers or other materials do not have the potential to contaminate dielectric fluids.

[0042] Embodiment 1. A cooling system for computing components, A container having a bottom, the container is A central reservoir including a heat exchanger for cooling the dielectric fluid, A first tank configured to hold one or more computer components at least partially immersed in a dielectric fluid, the first tank being located on one side of the central reservoir, A second tank configured to hold one or more computer components at least partially immersed in a dielectric fluid, the second tank being located on the other side of the central reservoir, opposite the first tank, A perforated plate, the perforated plate being lifted from the bottom of the container, forming a volume between the bottom of the container and the perforated plate, the volume including (1) a first volume below the central reservoir, (2) a second volume below the first tank, and (3) a third volume below the second tank, containers, Includes, A cooling system in which the container is configured such that, while one or more computer components are operating, the dielectric fluid is circulated from the first volume below the central reservoir to the second and third volumes, respectively, from the second volume to the first tank, from the third volume to the second tank, from the first tank to the central reservoir, from the second tank to the central reservoir, and from the central reservoir to the first volume below the central reservoir.

[0043] 2. The cooling system of Embodiment 1, wherein the container includes a weir channel for circulating the dielectric fluid.

[0044] 3. The cooling system of Embodiment 1, further comprising a rack for one or more computer components.

[0045] 4. The cooling system of Embodiment 1, wherein the rack includes a handle configured to remove the rack from the system without handling dielectric fluid.

[0046] 5. The cooling system of Embodiment 1, wherein the rack includes a handle configured as a heat sink for removing heat from the system.

[0047] 6. The cooling system of Embodiment 1, wherein the rack includes a handle configured to assist in managing one or more cables within the system.

[0048] The above specification has described various embodiments with reference to the accompanying drawings. However, it is clear that various modifications and changes may be made, and additional embodiments may be implemented, without departing from the broader scope of the invention as described in the following claims. Therefore, the specification and drawings should be considered illustrative rather than restrictive.

Claims

1. A container configured to hold a thermally conductive dielectric fluid, A computer component configured to be at least partially immersed in the dielectric fluid, A fluid circulation system configured to draw the dielectric fluid from the sump region of the container, pass the dielectric fluid through a filter, and supply the dielectric fluid to the bath region of the container, A system including, A system comprising an adjustable weir between the bath area and the sump area.

2. The system according to claim 1, wherein the adjustable weir is detachably fixed to the wall between the bath area and the sump area.

3. The system according to claim 1, wherein the adjustable weir is fixed to the wall between the bath area and the sump area using screws.

4. The system according to claim 1, further comprising an actuator for moving the adjustable weir.

5. The system according to claim 4, further comprising a management system that receives sensor data and instructs the actuator to move the adjustable weir.

6. The system according to claim 5, wherein the sensor data is the fluid level in the bath area or the sump area.

7. The system according to claim 5, wherein the sensor data is the temperature of the dielectric fluid in the bath region or the sump region.

8. The system according to claim 5, wherein the management system is configured to instruct the actuator to move the adjustable dam wall asymmetrically.

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