Chip manufacturing method

Abstract

To suppress an increased manufacturing cost of a chip to be manufactured by a cutting device and reduce the time required for manufacturing the chip.SOLUTION: Before dividing a workpiece to manufacture a plurality of chips, a groove is formed in the region of a porous plate which is planned to be overlapped with the planned dividing line of the workpiece, and thereafter, the inner surface of the groove is tightly sealed. In this case, it is possible to easily form the groove on a holding surface according to the arrangement, etc. of the planned dividing line set for the workpiece. As a result, it is possible to suppress an increased manufacturing cost of the chip to be manufactured by a cutting device having a chuck table, which includes the porous plate having the holding surface, and also reduce the time required for manufacturing the chip.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a method for manufacturing chips by dividing a workpiece along a planned dividing line to produce a plurality of chips.

Background Art

[0002] A workpiece such as a package substrate is partitioned into a plurality of regions by, for example, planned dividing lines (streets) arranged in a grid pattern, and semiconductor devices are formed in each of the plurality of regions. Then, when such a workpiece is divided along the planned dividing line, a plurality of chips each including a semiconductor device are manufactured.

[0003] For dividing such a package substrate, for example, a cutting device is used which includes a chuck table that holds the workpiece by applying a suction force to the workpiece placed on a holding surface, and a cutting unit having a spindle to which an annular cutting blade is attached at its tip. In this cutting device, while rotating the cutting blade, the cutting blade is brought into contact with the workpiece along the planned dividing line, thereby dividing the workpiece into a plurality of chips.

[0004] [[ID=1⑨]] However, in order to divide the workpiece into a plurality of chips, it is necessary to cut the cutting blade into the workpiece so that the rotating cutting blade penetrates the workpiece. And in this case, there is a risk that the chuck table holding the workpiece is cut and damaged by the cutting blade.

[0005] Therefore, when dividing the workpiece into a plurality of chips in this way, a dicing tape is often attached to the workpiece, and the workpiece is held on the chuck table via this dicing tape. Thereby, the workpiece can be divided into a plurality of chips with the outer peripheral edge of the cutting blade penetrating the workpiece positioned inside the dicing tape. As a result, damage to the chuck table is prevented.

[0006] Furthermore, in this case, the dicing tape is not divided. Even after the workpiece is divided into multiple chips, the multiple chips remain integrated via the dicing tape. Therefore, the likelihood of some chips scattering when dividing the workpiece into multiple chips is reduced.

[0007] Such dicing tapes are consumables. Therefore, manufacturing chips using this method may increase the cost of chip production. In view of this, it has been proposed to divide a workpiece into multiple chips while the workpiece is held in a chuck table that includes a jig having a holding surface for directly holding the workpiece (see, for example, Patent Document 1).

[0008] Specifically, grooves (cutting blade relief grooves) are formed in the area of ​​the jig's holding surface corresponding to the planned division lines of the workpiece. Furthermore, through holes (eject holes) are formed in each of the multiple areas (chip-compatible areas) partitioned by these grooves to apply suction force to the workpiece and each of the chips.

[0009] Furthermore, when a cutting device is equipped with such a chuck table, the workpiece can be divided into multiple chips while the outer edge of the cutting blade that penetrates the workpiece is positioned within the internal space of the groove. In this case, since the workpiece can be divided into multiple chips while an attractive force is applied to it through the through-hole, the likelihood of some chips scattering during this division can be reduced. [Prior art documents] [Patent Documents]

[0010] [Patent Document 1] Japanese Patent Publication No. 2007-273546 [Overview of the project] [Problems that the invention aims to solve]

[0011] The chuck table, including the aforementioned jig, is a specialized item usable only for specific workpieces. In other words, if the arrangement of the planned division lines set on the workpiece does not correspond to the arrangement of grooves formed on the jig, the chuck table including the jig cannot be used to divide that workpiece.

[0012] Therefore, if the cutting device is equipped with a chuck table that includes jigs, it is necessary to prepare in advance a number of jigs corresponding to different types of workpieces with different arrangements of planned division lines. This may increase the manufacturing cost of chips produced using this cutting device and / or increase the time required to manufacture the chips.

[0013] In view of the above, the object of the present invention is to suppress the increase in manufacturing costs and the lengthening of the time required to manufacture chips produced in cutting equipment. [Means for solving the problem]

[0014] This invention ofIn one aspect, the cutting apparatus comprises a chuck table including a porous plate made of a first synthetic resin and having a holding surface for holding a workpiece, and a frame made of a second synthetic resin that surrounds the porous plate in such a manner that the holding surface of the porous plate is exposed, and a cutting unit having a spindle with an annular cutting blade attached to its tip, wherein the cutting apparatus is a method for manufacturing a chip by dividing the workpiece along a planned division line to produce a plurality of chips, comprising: a groove-forming workpiece holding step of holding a workpiece for groove formation on the holding surface of the porous plate included in the chuck table including the frame, and after the groove-forming workpiece holding step, a groove forming step of rotating the first cutting blade and bringing the first cutting blade into contact with the porous plate along the region of the porous plate that is planned to overlap with the planned division line, thereby forming a groove on the holding surface. The process comprises: a groove-forming step; an application step, after the groove-forming step, applying a resin to the holding surface to seal the inner surface of the groove; a removal step, after the application step, removing the groove-forming workpiece from the holding surface; a workpiece holding step, after the removal step, holding the workpiece on the holding surface; and a splitting step, after the workpiece holding step, rotating a second cutting blade having a narrower cutting width than the first cutting blade and bringing the second cutting blade into contact with the workpiece along the planned splitting line, thereby splitting the workpiece into the plurality of chips, wherein in the groove-forming step, a groove is formed on the holding surface that penetrates the groove-forming workpiece and reaches the porous plate, and in the application step, the groove-forming workpiece functions as a mask to prevent the resin from being applied to areas of the holding surface other than the area where the groove is formed. The frame has multiple through holes, and the cutting unit further comprises a table base having multiple grooves, the frame being fixed by inserting and tightening multiple bolts into the multiple through holes and the multiple grooves. A method for manufacturing chips is provided.

[0015] According to another aspect of the present invention, a cutting apparatus comprising a chuck table including a porous plate made of a first synthetic resin and having a holding surface for holding a workpiece, and a frame made of a second synthetic resin and surrounding the porous plate in such a manner that the holding surface of the porous plate is exposed, and a cutting unit having a spindle with an annular cutting blade mounted at its tip, wherein a method for manufacturing a plurality of chips is to be produced by dividing the workpiece along a planned division line, wherein the first cutting blade is rotated and the first cutting blade is brought into contact with the porous plate along the region of the porous plate that is to overlap with the planned division line, thereby creating grooves in the holding surface. A method for manufacturing a chip is provided, comprising: a groove forming step of forming a groove; a coating step of applying a resin to the holding surface after the groove forming step to seal the inner surface of the groove; a removal step of removing the resin applied to areas of the holding surface other than the area where the groove is formed after the coating step; a workpiece holding step of holding the workpiece on the holding surface after the removal step; and a splitting step of splitting the workpiece into a plurality of chips by rotating a second cutting blade having a narrower blade width than the first cutting blade and bringing the second cutting blade into contact with the workpiece along the planned splitting line after the workpiece holding step. Preferably, the frame has a plurality of through holes, and the cutting unit further comprises a table base having a plurality of grooves, the frame being fixed by inserting and tightening a plurality of bolts into the plurality of through holes and the plurality of grooves, respectively. [Effects of the Invention]

[0017] In this invention, prior to dividing a workpiece to produce multiple chips, a groove is formed in the region of the porous plate that is to overlap with the planned division line of the workpiece, and then the inner surface of this groove is sealed. Therefore, in this invention, a chuck table can be formed that includes a porous plate having a holding surface capable of holding both the workpiece and the multiple chips produced by dividing the workpiece.

[0018] Specifically, when the workpiece is divided while being held on this holding surface, a suction force can be applied to the holding surface side through a region other than the region where the grooves of the porous plate are formed. Further, since the inner surface of this groove is sealed, no suction force acts on the holding surface side through the region where the grooves of the porous plate are formed. That is, no leakage occurs when holding the workpiece or a plurality of chips on this holding surface.

[0019] As described above, in the present invention, grooves corresponding to the arrangement of the planned division lines set in the workpiece can be easily formed on the holding surface. As a result, an increase in the manufacturing cost of the chips manufactured in a cutting apparatus including a chuck table including a porous plate having this holding surface and a lengthening of the time required for manufacturing the chips can be suppressed.

Brief Description of the Drawings

[0020] [Figure 1] FIG. 1 is a perspective view schematically showing an example of a cutting apparatus. [Figure 2] FIG. 2 is an exploded perspective view schematically showing an example of a table base and an example of a chuck table. [Figure 3] FIG. 3 is a perspective view schematically showing an example of a workpiece. [Figure 4] FIG. 4 is a flowchart schematically showing an example of a method for manufacturing chips. [Figure 5] FIG. 5(A) is a partial cross-sectional side view schematically showing the state of the workpiece holding step for groove formation, FIG. 5(B) is a partial cross-sectional side view schematically showing the state of the groove formation step, and FIG. 5(C) is a partial cross-sectional side view schematically showing the chuck table and the like after the coating step. [Figure 6] FIG. 6(A) is a partial cross-sectional side view schematically showing the chuck table and the like after the removal step, FIG. 6(B) is a partial cross-sectional side view schematically showing the state of the workpiece holding step, and FIG. 6(C) is a partial cross-sectional side view schematically showing the state of the division step. [Figure 7]FIG. 7 is a flowchart schematically showing a modified example of a method for manufacturing a chip. [Figure 8] FIG. 8(A) is a partial cross-sectional side view schematically showing the state of the groove forming step, and FIG. 8(B) is a partial cross-sectional side view schematically showing a chuck table or the like after the coating step. [Figure 9] FIG. 9 is a partial cross-sectional side view schematically showing the state of the removal step.

Embodiments for Carrying Out the Invention

[0021] Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing an example of a cutting device used when a workpiece is divided to manufacture a plurality of chips. The X-axis direction (front-rear direction) and the Y-axis direction (left-right direction) shown in FIG. 1 are directions perpendicular to each other on a horizontal plane, and the Z-axis direction (up-down direction) is a direction (vertical direction) perpendicular to the X-axis direction and the Y-axis direction.

[0022] The cutting device 2 shown in FIG. 1 has a base 4 that supports a plurality of components. An opening 4a extending along the X-axis direction is formed on the upper surface of the base 4. Inside this opening 4a, an X-axis moving table (not shown) and a table moving mechanism 6 for moving this X-axis moving table along the X-axis direction are arranged.

[0023] The table moving mechanism 6 includes, for example, a ball screw or the like. The upper sides of the X-axis moving table and the table moving mechanism 6 are covered by a table cover 8 and a bellows-shaped cover 10. Further, on the X-axis moving table, a table base 12 having a rectangular parallelepiped shape, for example, is arranged in a manner of being exposed upward from the table cover 8.

[0024] This table base 12 is connected to a rotational drive source (not shown), such as a motor, and rotates with a straight line parallel to the Z-axis as its axis of rotation. The table base 12 also moves along the X-axis together with the X-axis moving table described above. Furthermore, a chuck table 14 for holding a rectangular workpiece is detachably mounted on the upper part of the table base 12.

[0025] Figure 2 is an exploded perspective view schematically showing the table base 12 and the chuck table 14. The table base 12 has an upper surface 12a and a lower surface 12b that are parallel to each other, and a rectangular parallelepiped recess 12c is formed on the upper surface 12a. In addition, a cylindrical through hole 12d is formed in the center of the table base 12, and this through hole 12d opens at the bottom surface of the recess 12c and the lower surface 12b.

[0026] Furthermore, this through-hole 12d is connected to a suction source such as an ejector. In addition, the bottom surface of the recess 12c is provided with an inner wall 12e that surrounds the through-hole 12d and whose upper surface is lower than the upper surface 12a. Also, cylindrical grooves 12f that open on the upper surface 12a are formed near each of the four corners of the table base 12. And spiral grooves (screw grooves) are formed on the sides of these grooves 12f.

[0027] The chuck table 14, which is mounted on the table base 12, has a rectangular parallelepiped frame 16. This frame 16 is made of a synthetic resin such as polyurethane (second synthetic resin) and has an upper surface 16a and a lower surface 16b that are parallel to each other. In addition, a rectangular parallelepiped recess is formed on the upper surface 16a side of the frame 16, defined by the bottom wall and side wall of the frame 16.

[0028] A rectangular porous plate 18 is fixed to a recess formed on the upper surface 16a side of the frame 16. That is, the porous plate 18 is surrounded by the side walls of the frame 16, and its lower surface (not shown in Figure 2) faces the bottom wall of the porous plate 18. The upper surface (holding surface) 18a of the porous plate 18 is exposed and located on the same plane as the upper surface 16a of the frame 16.

[0029] Furthermore, the porous plate 18 is made of a porous synthetic resin (first synthetic resin) such as foamed polyurethane. The synthetic resin that constitutes the frame 16 and the porous synthetic resin that constitutes the porous plate 18 may be the same material or different materials.

[0030] Furthermore, a cylindrical through-hole (not shown) is formed in the central part of the frame 16, opening at the bottom surface and lower surface 16b of the recess of the frame 16. Therefore, the recess 12c and through-hole 12d of the table base 12 and the lower surface of the porous plate 18 are in communication with each other through the through-hole formed in the central part of the frame 16.

[0031] Furthermore, the upper surface 16a of the frame 16 has approximately the same shape as the upper surface 12a of the table base 12. Similarly, the lower surface 16b of the frame 16 has approximately the same shape as the lower surface 12b of the table base 12. In addition, cylindrical through holes 16c are formed near each of the four corners of the frame 16, opening on the upper surface 16a and the lower surface 16b.

[0032] Furthermore, a spiral groove (screw groove) may be formed on the side surface of this through hole 16c. In addition, this through hole 16c is provided so as to overlap with the groove 12f formed in the table base 12 when the table base 12 and the chuck table 14 are placed together so that the side surface of the table base 12 and the side surface of the chuck table 14 (the outer surface surface of the frame 16) are flush.

[0033] Then, with the table base 12 and the chuck table 14 stacked in this manner, the bolts 20 are inserted into the through holes 16c and grooves 12f and tightened, thereby fixing the frame 16 to the table base 12. In other words, by tightening the bolts 20 in this manner, the chuck table 14, which has the frame 16, is attached to the table base 12.

[0034] Furthermore, when the suction source communicating with the through hole 12d is activated while the chuck table 14 is mounted on the table base 12, a suction force acts on the holding surface 18a of the porous plate 18 through the through hole 12d, the recess 12c, and the porous plate 18. This allows the workpiece to be held on the holding surface 18a of the porous plate 18. Then, in the cutting device 2, the workpiece held on the holding surface 18a is divided to produce multiple chips.

[0035] Figure 3 is a schematic perspective view showing an example of a workpiece to be divided in the cutting device 2. This workpiece 11 is, for example, a package substrate obtained by encapsulating multiple devices with resin. The workpiece 11 shown in Figure 3 includes a rectangular parallelepiped substrate 13 having a surface 13a that is slightly wider than the holding surface 18a of the porous plate 18.

[0036] The substrate 13 is made of a metallic material such as 42 alloy (an alloy of iron and nickel) or copper, and includes a plurality of device regions 15 (in this case, three device regions 15) and an excess region 17 surrounding each of the plurality of device regions 15. Furthermore, each of the plurality of device regions 15 is divided into a plurality of regions (in this case, 16 regions) by division lines 19 arranged in a grid.

[0037] Furthermore, multiple stages 21, demarcated by the division lines 19, are exposed on the surface 11a side of the workpiece 11. Multiple metal layers (not shown), insulated from each other by, for example, resin, are arranged around each of the multiple stages 21 (the area overlapping with the division lines 19).

[0038] On the back surface 13b of each of the multiple stages 21, semiconductor devices (not shown) such as ICs (Integrated Circuits), LEDs (Light Emitting Diodes), or MEMS (Micro Electro Mechanical Systems) are mounted.

[0039] Furthermore, the electrodes of this semiconductor device and the metal layer arranged around the stage 21 are connected by metal wires (not shown) or the like. A portion of this metal layer then becomes the electrodes of each of the multiple chips obtained by dividing the workpiece 11.

[0040] Referring again to Figure 1, the remaining components of the cutting device 2 will be described. A gate-shaped support structure 22 is positioned on the upper surface of the base 4 so as to straddle the opening 4a. A pair of cutting unit moving mechanisms 24 are provided on the front side of the support structure 22. The pair of cutting unit moving mechanisms 24 are positioned on the upper front of the support structure 22 and share a pair of Y-axis guide rails 26 that extend along the Y-axis direction.

[0041] A Y-axis guide rail 26 is attached to each of the pair of cutting unit moving mechanisms 24 in such a manner that the Y-axis moving plates 28 can slide along the Y-axis direction. A nut portion (not shown) included in a ball screw is fixed to the back (rear) side of the Y-axis moving plate 28. A screw shaft 30 extending along the Y-axis direction is connected to this nut portion in such a manner that it can rotate.

[0042] Furthermore, a Y-axis pulse motor 32 is connected to one end of the screw shaft 30. When the screw shaft 30 is rotated by this Y-axis pulse motor 32, the Y-axis moving plate 28 moves along the Y-axis direction. In addition, a pair of Z-axis guide rails 34 extending along the Z-axis direction are arranged on the surface (front) of the Y-axis moving plate 28.

[0043] A Z-axis moving plate 36 is mounted on the Z-axis guide rail 34 in such a manner that it can slide along the Z-axis direction. A nut portion (not shown) included in a ball screw is fixed to the back (rear) side of the Z-axis moving plate 36. A screw shaft 38 extending along the Z-axis direction is connected to this nut portion in such a manner that it can rotate.

[0044] Furthermore, a Z-axis pulse motor 40 is connected to one end of the screw shaft 38. When the screw shaft 38 is rotated by this Z-axis pulse motor 40, the Z-axis moving plate 36 moves along the Z-axis direction. A cutting unit 42 is provided at the bottom of the Z-axis moving plate 36.

[0045] This cutting unit 42 has, for example, a cylindrical spindle housing which houses a spindle extending along the Y-axis and a rotational drive source such as a motor connected to the base end of the spindle. The tip of the spindle is exposed to the outside from the spindle housing.

[0046] An annular cutting blade 44 is mounted on the tip of the spindle, which is exposed to the outside from the spindle housing, via a blade mount. When the rotational drive source connected to the base end of the spindle operates, the cutting blade 44 rotates together with the spindle, with a straight line along the Y-axis as the axis of rotation.

[0047] This cutting blade 44 is a hub-type cutting blade, for example, in which an annular base made of metal or the like and an annular cutting edge along the outer edge of the base are integrally formed. The cutting edge of the hub-type cutting blade is obtained by fixing abrasive grains made of diamond or cubic boron nitride (cBN) or the like with a bonding material such as nickel.

[0048] Alternatively, a washer-type cutting blade consisting only of annular cutting edges may be used as the cutting blade 44. A washer-type cutting blade (cutting edge) can be obtained, for example, by fixing abrasive grains made of diamond or cBN with a bonding material such as resin.

[0049] Furthermore, an imaging unit 46 is fixed to the lower part of the Z-axis moving plate 36, positioned adjacent to the cutting unit 42 in the X-axis direction. The imaging unit 46 includes, for example, a two-dimensional optical sensor such as a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor that is sensitive to visible light, and an imaging lens.

[0050] Furthermore, if the Y-axis moving plate 28 of the cutting unit moving mechanism 24 is moved along the Y-axis direction, both the cutting unit 42 and the imaging unit 46 will move along the Y-axis direction. Also, if the Z-axis moving plate 36 of the cutting unit moving mechanism 24 is moved along the Z-axis direction, both the cutting unit 42 and the imaging unit 46 will move along the Z-axis direction.

[0051] Figure 4 is a schematic flowchart illustrating an example of a chip manufacturing method in which a workpiece 11 is divided along a planned division line 19 to produce multiple chips. Figures 5(A), 5(B), and 5(C), as well as Figures 6(A), 6(B), and 6(C), are schematic cross-sectional side views illustrating each step included in this method.

[0052] In this method, first, the workpiece for groove formation is held on the holding surface 18a of the porous plate 18 (workpiece holding step for groove formation: S1). Figure 5(A) is a schematic partial cross-sectional side view showing the workpiece holding step (S1) for groove formation.

[0053] The groove-forming workpiece 23 has a rectangular parallelepiped shape similar to that of the workpiece 11. Furthermore, the groove-forming workpiece 23 is made of the same synthetic resin (e.g., polyurethane) as the material for the porous plate 18. Alternatively, the groove-forming workpiece 23 may be a protective tape made of polyolefin or the like.

[0054] In this groove-forming workpiece holding step (S1), the groove-forming workpiece 23 is placed on the chuck table 14 so that the center of the holding surface 18a of the porous plate 18 coincides with the center of one surface 23a of the groove-forming workpiece 23. Then, the suction source communicating with the through hole 12d of the table base 12 is activated.

[0055] As a result, an attractive force acts on the holding surface 18a of the porous plate 18 through the through hole 12d and recess 12c of the table base 12 and the porous plate 18. Consequently, the groove-forming workpiece 23 is held on the holding surface 18a of the porous plate 18.

[0056] Furthermore, if the groove-forming workpiece 23 is a protective tape, the groove-forming workpiece 23 can be attached to the holding surface 18a of the porous plate 18. In this case, it is preferable because it does not require operating the suction source as described above. Also, in this case, it is preferable because it does not cause problems such as the groove-forming workpiece 23 not being able to be held due to leakage through the gap between the groove-forming workpiece 23 and the holding surface 18a.

[0057] Next, a groove is formed along the region of the porous plate 18 that is to overlap with the planned division line 19 of the workpiece 11, penetrating the groove-forming workpiece 23 and reaching the porous plate 18 (groove-forming step: S2). Figure 5(B) is a schematic partial cross-sectional side view showing the groove-forming step (S2). Prior to the groove-forming step (S2), a groove-forming cutting blade (first cutting blade) 44a is attached to the tip of the spindle 48 of the cutting unit 42.

[0058] In this groove-forming step (S2), first, the chuck table 14 is rotated so that the linearly extending portion of the porous plate 18 that is to overlap with the planned division line 19 of the workpiece 11 is parallel to the X-axis direction. Then, the chuck table 14 and / or cutting unit 42 are moved so that, in a plan view, this portion is positioned in the X-axis direction from the perspective of the groove-forming cutting blade 44a.

[0059] Next, the cutting unit 42 is lowered so that the lower end of the groove-forming cutting blade 44a is positioned lower than the holding surface 18a of the porous plate 18 and higher than its lower surface 18b. Then, while rotating the groove-forming cutting blade 44a via the spindle 48, the chuck table 14 is moved so that the groove-forming workpiece 23, the frame 16, and the porous plate 18 are in contact with the groove-forming cutting blade 44a from one end to the other in the X-axis direction.

[0060] As a result, the groove-forming workpiece 23 and the porous plate 18 are cut, forming a straight groove 25 that penetrates the groove-forming workpiece 23 and reaches the porous plate 18. Then, the same operation is repeated to form grooves 25 in all areas of the porous plate 18 that are to overlap with the planned division line 19 of the workpiece 11.

[0061] Next, a resin that seals the inner surface of the groove 25 formed on the holding surface 18a of the porous plate 18 is applied to the holding surface 18a (coating step: S3). Figure 5(C) is a schematic partial cross-sectional side view showing the chuck table 14, etc., after the coating step (S3). Examples of resins used in the coating step (S3) include thermosetting resins such as polyurethane, epoxy resin, or melamine resin, or thermoplastic resins such as polypropylene or polyethylene.

[0062] In this coating step (S3), for example, a known spray gun is used to apply resin to the groove 25. At this time, the resin is also applied to the area of ​​the groove-forming workpiece 23 that is located near the groove 25. As a result, a resin film 27 is formed that covers the inner surface of the groove 25 and the area of ​​the groove-forming workpiece 23 that is located near the groove 25.

[0063] This resin film 27 seals the inner surface of the groove 25. The groove-forming workpiece 23 functions as a mask to prevent resin from being applied to areas of the holding surface 18a of the porous plate 18 other than the area where the groove 25 is formed (the area overlapping with the groove-forming workpiece 23). Therefore, the area of ​​the holding surface 18a of the porous plate 18 that overlaps with the groove-forming workpiece 23 is not sealed.

[0064] Next, the groove-forming workpiece 23 is removed from the holding surface 18a of the porous plate 18 (removal step: S4). Figure 6(A) is a schematic partial cross-sectional side view showing the chuck table 14, etc., after the removal step (S4).

[0065] If the groove-forming workpiece 23 is held by suction, in this removal step (S4), the operation of the suction source communicating with the through hole 12d of the table base 12 is stopped, and then the groove-forming workpiece 23 is removed from the chuck table 14. Also, if the groove-forming workpiece 23 is protective tape, in this removal step (S4), an external force is applied to separate the groove-forming workpiece 23 from the holding surface 18a.

[0066] Next, the workpiece 11 is held on the holding surface 18a of the porous plate 18 (workpiece holding step: S5). Figure 6(B) is a schematic partial cross-sectional side view showing the workpiece holding step (S5).

[0067] In this workpiece holding step (S5), the workpiece 11 is placed on the chuck table 14 so that the center of the holding surface 18a of the porous plate 18 coincides with the center of the back surface 11b of the workpiece 11. Then, the suction source communicating with the through hole 12d of the table base 12 is activated.

[0068] As a result, an attractive force acts on the holding surface 18a side through the through-hole 12d and recess 12c of the table base 12 and the porous plate 18, via the area of ​​the porous plate 18 other than the area where the groove 25 is formed. Furthermore, since the inner surface of the groove 25 is sealed, no leakage occurs through the groove 25. Consequently, the workpiece 11 is held on the holding surface 18a of the porous plate 18.

[0069] Next, the workpiece 11 is divided into multiple chips (division step: S6). Figure 6(C) is a schematic partial cross-sectional side view showing the division step (S6). Prior to the groove forming step (S2), a workpiece cutting blade (second cutting blade) 44b, which has a narrower cutting width than the groove forming cutting blade 44a, is attached to the tip of the spindle 48 of the cutting unit 42.

[0070] In this splitting step (S6), first, the chuck table 14 is rotated so that the portion of the planned splitting line 19 of the workpiece 11 that extends linearly is parallel to the X-axis direction. Then, the chuck table 14 and / or cutting unit 42 are moved so that, in a plan view, this portion is positioned in the X-axis direction relative to the cutting blade 44b for the workpiece.

[0071] Next, the cutting unit 42 is lowered so that the lower end of the cutting blade 44b for the workpiece is positioned lower than the back surface 11b of the workpiece 11 and higher than the bottom surface of the groove 25. Then, while rotating the cutting blade 44b for the workpiece via the spindle 48, the chuck table 14 is moved so that the cutting blade 44b contacts the workpiece from one end to the other in the X-axis direction of the workpiece 11.

[0072] As a result, the workpiece 11 is cut and divided along the linearly extending portion of the division line 19. At this time, the area where the groove 25 of the porous plate 18 is formed is exposed, but since the inner surface of the groove 25 is sealed, no leakage occurs through the groove 25. Next, the same operation is repeated to divide the workpiece 11 into multiple chips along the division line 19.

[0073] In the method shown in Figure 4, prior to dividing the workpiece 11 to produce multiple chips, a groove 25 is formed in the region of the porous plate 18 that is to overlap with the planned dividing line 19 of the workpiece 11, and then the inner surface of the groove 25 is sealed. Therefore, in this method, a chuck table 14 can be formed that includes a porous plate 18 having a holding surface 18a capable of holding both the workpiece 11 and the multiple chips produced by dividing the workpiece 11.

[0074] Specifically, when the workpiece 11 is held on the holding surface 18a and then divided, an attractive force can be applied to the holding surface 18a through areas other than those where the grooves 25 of the porous plate 18 are formed. Furthermore, since the inner surface of the grooves 25 is sealed, no attractive force is applied to the holding surface 18a through the areas where the grooves 25 of the porous plate 18 are formed. In other words, no leakage occurs when the workpiece 11 or multiple chips are held on the holding surface 18a.

[0075] Thus, in this method, grooves 25 corresponding to the arrangement of planned division lines 19 set in the workpiece 11 can be easily formed on the holding surface 18a. As a result, it is possible to suppress increases in the manufacturing cost of chips produced in a cutting apparatus 2 equipped with a chuck table 14 that includes a porous plate 18 having this holding surface 18a, and prolongs the time required for chip production.

[0076] It should be noted that the method described above is one aspect of the present invention, and the present invention is not limited to the method described above. For example, in the coating step (S3) of the present invention, the resin may be applied so as to fill the portion of the groove 25 located below the groove-forming workpiece 23. In this case, in the splitting step (S6), the resin filling the groove 25 may be cut together with the workpiece 11.

[0077] Furthermore, in this invention, the groove-forming workpiece 23 does not necessarily have to be used. Figure 7 is a schematic flowchart showing an example of such a chip manufacturing method. Figures 8(A), 8(B), and 9 are schematic partial cross-sectional side views showing each step included in this method.

[0078] In this method, first, a groove is formed on the holding surface 18a of the porous plate 18 along the region of the porous plate 18 that is to overlap with the planned division line 19 of the workpiece 11 (groove formation step: S10). Figure 8(A) is a schematic partial cross-sectional side view showing the groove formation step (S10). Prior to the groove formation step (S10), a groove-forming cutting blade (first cutting blade) 44a is attached to the tip of the spindle 48 of the cutting unit 42.

[0079] In this groove-forming step (S10), first, with the entire holding surface 18a of the porous plate 18 exposed, the chuck table 14 is rotated so that the portion of the porous plate 18 that extends linearly and is expected to overlap with the division line 19 of the workpiece 11 is parallel to the X-axis direction. Then, the chuck table 14 and / or cutting unit 42 are moved so that, in a plan view, this portion is positioned in the X-axis direction from the perspective of the groove-forming cutting blade 44a.

[0080] Next, the cutting unit 42 is lowered so that the lower end of the groove-forming cutting blade 44a is positioned lower than the holding surface 18a of the porous plate 18 and higher than its lower surface 18b. Then, while rotating the groove-forming cutting blade 44a via the spindle 48, the chuck table 14 is moved so that the frame 16 and the porous plate 18 are in contact with the groove-forming cutting blade 44a from one end to the other in the X-axis direction.

[0081] This causes the porous plate 18 to be cut, forming a linear groove 29 on the holding surface 18a. Then, the same operation is repeated to form grooves 29 in all areas of the porous plate 18 that are to overlap with the planned division line 19 of the workpiece 11.

[0082] Next, a resin that seals the inner surface of the groove 29 formed on the holding surface 18a of the porous plate 18 is applied to the holding surface 18a (coating step: S20). Figure 8(B) is a schematic partial cross-sectional side view showing the chuck table 14, etc., after the coating step (S20). Examples of resins used in the coating step (S20) include thermosetting resins such as polyurethane, epoxy resin, or melamine resin, or thermoplastic resins such as polypropylene or polyethylene.

[0083] In this coating step (S20), for example, a known spray gun is used to apply resin to the groove 29. At this time, the resin is also applied to the area of ​​the holding surface 18a of the porous plate 18 located around the groove 29 (peripheral area). This forms a resin film 31 that covers the inner surface of the groove 29 and the peripheral area. This resin film 31 seals the inner surface of the groove 29 and the peripheral area.

[0084] Next, the resin applied to the area of ​​the holding surface 18a of the porous plate 18 other than the area where the groove 29 is formed (in this case, the area surrounding the groove 29) is removed (removal step: S30). This removal step (S30) is carried out, for example, by grinding the holding surface 18a side of the porous plate 18 using a known grinding apparatus.

[0085] Figure 9 is a schematic partial cross-sectional side view showing the removal step (S30) performed in a known grinding apparatus. Specifically, in this removal step (S30), first, the chuck table 14 is removed from the table base 12 of the cutting apparatus 2. Next, a backgrind tape (BG tape) 33 is attached to the lower surface of the chuck table 14 (the lower surface 16b of the frame 16).

[0086] Next, the chuck table 14 is placed on the holding surface 52a of the chuck table 52 of the grinding device 50 via the BG tape 33. This chuck table 52 has a structure similar to that of the chuck table 14, for example. The chuck table 52 is also connected to a suction source (not shown) that applies suction force to the holding surface 52a side, and a horizontal movement mechanism that moves the chuck table 52 along the horizontal direction.

[0087] Furthermore, a grinding unit 54 is provided above the chuck table 52. This grinding unit 54 is connected to a vertical movement mechanism that moves the grinding unit 54 along the vertical direction. The grinding unit 54 also has a cylindrical spindle 56 that extends along the vertical direction.

[0088] A disc-shaped mount 58 made of metal or the like is fixed to the tip (lower end) of the spindle 56. A rotational drive source (not shown), such as a motor, is connected to the base (upper end) of the spindle 56 to rotate it. When the rotational drive source connected to the base of the spindle 56 operates, the spindle 56 rotates around a straight line that is roughly parallel to the vertical as its axis of rotation.

[0089] Furthermore, an annular grinding wheel 60 is mounted on the lower surface of the mount 58. This grinding wheel 60 is fixed to the mount 58 using fasteners such as bolts (not shown). As a result, the grinding wheel 60 is mounted on the tip of the spindle 56 via the mount 58. When the spindle 56 rotates, the grinding wheel 60 mounted on its tip also rotates around a straight line that is roughly parallel to the vertical as its axis of rotation.

[0090] Furthermore, the grinding wheel 60 includes a wheel base 62 and a plurality of grinding wheels 64 fixed to the lower surface of the wheel base 62. The wheel base 62 has an annular shape with an outer diameter approximately equal to the diameter of the mount 58, and is made of a metal such as stainless steel or aluminum, or a resin, for example.

[0091] Furthermore, the multiple grinding wheels 64 are arranged discretely along the circumferential direction of the grinding wheel 60 (wheel base 62). Each of the multiple grinding wheels 64 has a rectangular parallelepiped shape and contains abrasive grains made of, for example, diamond or cBN (cubic boron nitride), and a binder (bonding material) that fixes these abrasive grains. As this binder, for example, metal bond, resin bond, or vitrified bond can be used.

[0092] Once the chuck table 14 is placed on the holding surface 52a of the chuck table 52 via the BG tape 33, the suction source connected to the chuck table 52 is activated. This holds the chuck table 14 on the holding surface 52a. Next, the chuck table 52 is moved so that the trajectories of the multiple grinding wheels 64, when the spindle 56 is rotated, are positioned directly above the center of the chuck table 14.

[0093] Next, while rotating both the chuck table 52 and the grinding wheel 60, the grinding unit 54 is lowered until the lower surface of each of the multiple grinding wheels 64 contacts the resin film 31 provided on the chuck table 14. This grinds away and removes a portion of the resin film 31. Furthermore, while keeping both the chuck table 52 and the grinding wheel 60 rotating, the grinding unit 54 is lowered until all of the portion of the resin film 31 covering the area around the groove 29 is removed.

[0094] Once the entire portion of the resin film 31 covering the area around the groove 29 is removed, the chuck table 52 and the grinding wheel 60 are separated, and the operation of the suction source connected to the chuck table 52 is stopped. Next, the chuck table 14 is removed from the chuck table 52 of the grinding device 50 together with the BG tape 33. Then, the BG tape 33 is peeled off the underside of the chuck table 14 (the underside 16b of the frame 16).

[0095] Next, the chuck table 14 is mounted again on the table base 12 of the cutting device 2. Then, the workpiece 11 is held on the holding surface 18a of the porous plate 18 (workpiece holding step: S40), and then the workpiece 11 is divided into multiple chips (dividing step: S50). Note that the workpiece holding step (S40) and the dividing step (S50) correspond to the workpiece holding step (S5) and the dividing step (S6) shown in Figure 4, respectively, so a detailed explanation of these steps will be omitted.

[0096] In the chip manufacturing method shown in Figure 7, after applying resin to the entire surface 18a of the porous plate 18 in the coating step (S20), the resin applied to areas other than those where grooves 29 are formed on the surface 18a may be removed in the removal step (S30).

[0097] Furthermore, the structures and methods of the embodiments described above can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0098] 2:Cutting device 4: Base (4a: opening) 6: Table movement mechanism 8: Table cover 10: Accordion-style cover 11: Workpiece (11a: front side, 11b: back side) 12: Table base (12a: top surface, 12b: bottom surface, 12c: recess) (12d: through hole, 12e: inner wall, 12f: groove) 13: Circuit board 14: Chuck Table 15: Device Area 16: Frame (16a: top surface, 16b: bottom surface, 16c: through hole) 17: Surplus space 18: Porous plate (18a: top surface (holding surface), 18b: bottom surface) 19: Planned division line 20: Bolt 21: Stage 22:Support structure 23: Workpiece for groove formation 24: Cutting unit movement mechanism 25: Groove 26: Y-axis guide rail 27: Resin film 28: Y-axis movement plate 29: Groove 30: Screw shaft 31: Resin film 32: Y-axis pulse motor 33: Backgrind tape (BG tape) 34: Z-axis guide rail 36: Z-axis movement plate 38: Screw shaft 40: Z-axis pulse motor 42: Cutting Unit 44: Cutting blade 46: Imaging Unit 48: Spindle 50: Grinding equipment 52: Chuck table (52a: Holding surface) 54: Grinding Unit 56: Spindle 58: Mount 60: Grinding Wheel 62: Wheel base 64: Grinding Wheel

Claims

1. A cutting apparatus comprising a chuck table including a porous plate made of a first synthetic resin and having a holding surface for holding a workpiece, and a frame made of a second synthetic resin and surrounding the porous plate in such a manner that the holding surface of the porous plate is exposed, and a cutting unit having a spindle with an annular cutting blade mounted at its tip, wherein a method for manufacturing a chip is to divide the workpiece along a planned division line to produce a plurality of chips, A groove-forming workpiece holding step, which involves holding a groove-forming workpiece on the holding surface of the porous plate included in the chuck table including the frame, A groove-forming step is performed after the groove-forming workpiece holding step, by rotating the first cutting blade and bringing the first cutting blade into contact with the porous plate along the region of the porous plate that is to overlap with the planned division line, thereby forming a groove on the holding surface. Following the groove forming step, a coating step is performed in which a resin that seals the inner surface of the groove is applied to the retaining surface. Following the coating step, a removal step is performed to remove the groove-forming workpiece from the holding surface, Following the removal step, a workpiece holding step is performed, in which the workpiece is held on the holding surface. The process includes a workpiece holding step followed by a splitting step in which a second cutting blade, having a narrower cutting width than the first cutting blade, is rotated and brought into contact with the workpiece along the planned splitting line, thereby splitting the workpiece into the plurality of chips. In the groove forming step, a groove is formed on the holding surface that penetrates the workpiece for groove formation and extends to the porous plate. In the coating step, the groove-forming workpiece functions as a mask to prevent the resin from being applied to areas of the holding surface other than the area where the groove is formed. Multiple through holes are formed in the frame. A method for manufacturing a chip, characterized in that the cutting unit further comprises a table base having a plurality of grooves formed therein, and the frame is fixed by inserting and tightening a plurality of bolts into the plurality of through holes and the plurality of grooves, respectively.

2. A cutting apparatus comprising a chuck table including a porous plate made of a first synthetic resin and having a holding surface for holding a workpiece, and a frame made of a second synthetic resin and surrounding the porous plate in such a manner that the holding surface of the porous plate is exposed, and a cutting unit having a spindle with an annular cutting blade mounted at its tip, wherein a method for manufacturing a chip is to divide the workpiece along a planned division line to produce a plurality of chips, A groove forming step in which a groove is formed on the holding surface by rotating the first cutting blade and bringing the first cutting blade into contact with the porous plate along the region of the porous plate that is to overlap with the planned division line, Following the groove forming step, a coating step is performed in which a resin that seals the inner surface of the groove is applied to the retaining surface. Following the coating step, a removal step is performed to remove the resin applied to areas of the retaining surface other than the area where the groove is formed. Following the removal step, a workpiece holding step is performed, in which the workpiece is held on the holding surface. A splitting step is performed after the workpiece holding step, by rotating a second cutting blade, which has a narrower cutting width than the first cutting blade, and bringing the second cutting blade into contact with the workpiece along the planned splitting line, thereby splitting the workpiece into the plurality of chips. A method for manufacturing chips, characterized by comprising the following features.

3. Multiple through holes are formed in the frame. The method for manufacturing a chip according to claim 2, characterized in that the cutting unit further comprises a table base having a plurality of grooves formed therein, and the frame is fixed by inserting and tightening a plurality of bolts into the plurality of through holes and the plurality of grooves, respectively.

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